Cooling system for heterogeneous integrated semiconductor packaging structures

Abstract

To provide a cooling system for a heterogeneous integrated semiconductor packaging structure with a high heat release efficiency.SOLUTION: The present invention relates to a cooling system for a heterogeneous integrated semiconductor packaging structure. A heterogeneous integrated semiconductor packaging structure is arranged on a circuit board, and a cooling system for the heterogeneous integrated semiconductor packaging structure includes a cooling component. The cooling component is provided on the heterogeneous integrated semiconductor packaging structure.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a cooling system for a heterogeneous integrated semiconductor packaging structure, and more particularly, to a cooling system for a heterogeneous integrated semiconductor packaging structure for cooling chips having a plurality of heat sources in the packaging structure.

Background Art

[0002] With the advent of the era of high computing power of artificial intelligence (AI), the demand for high-performance computing (HPC) and high-frequency high-speed transmission is increasing day by day. And heterogeneous integrated packaging structures and silicon photonics packaging structures are gradually becoming the forefront technologies.

Summary of the Invention

Problems to be Solved by the Invention

[0003] However, as the demand for people's computing power and transmission speed increases rapidly, the power consumption of servers also continues to increase, so it is necessary to improve cooling technology.

[0004] However, since the advent of an era with even higher computing power is predicted in the future, it is expected that the current air-cooling heat dissipation capacity will be insufficient, and in recent years, direct liquid cooling technology for the future has emerged.

[0005] In addition, existing liquid cooling technologies include immersion, cold plate, microchannel, jet impingement, etc.

[0006] On the other hand, liquid cooling technology has relatively high heat dissipation capabilities, and related technologies have been developed from an early stage. However, large-scale mass production has not been achieved, mainly because the heat dissipation capabilities of air cooling technology are still (barely) sufficient to meet the heat consumption of conventional computing systems.

[0007] In view of these circumstances, the present invention provides a cooling system for heterogeneous integrated semiconductor packaging structures that uses a cooling fluid to dissipate heat from the semiconductor packaging structure, thereby improving the shortcomings of the prior art and further addressing the need for improved heat dissipation capabilities that may arise from high computing power and high transmission speeds. [Means for solving the problem]

[0008] The cooling system for heterogeneous integrated semiconductor packaging structures further comprises thermally conductive fasteners and heat sinks, the heat sinks being positioned on the circuit board opposite the heterogeneous integrated semiconductor packaging structure, and the thermally conductive fasteners can be used to connect the cooling components and the heat sinks.

[0009] In this embodiment, the cooling system for a heterogeneous integrated semiconductor packaging structure further includes a reinforcing plate, which can be mounted on a circuit board, and thermally conductive fasteners can be used to connect the cooling components, the reinforcing plate, and the heat sink.

[0010] In this embodiment, the cooling system for the heterogeneous integrated semiconductor packaging structure further includes a reinforcing support, which can be mounted on a circuit board and in contact with the cooling component.

[0011] In this embodiment, the cooling component includes a vapor chamber.

[0012] Furthermore, in this embodiment, the cooling system for the heterogeneous integrated semiconductor packaging structure may include a cooling fluid drive module. The reinforced support also includes cooling fluid passages. These cooling fluid passages can be connected to the cooling fluid drive module. Moreover, the cooling fluid drive module is suitable for supplying cooling fluid to the cooling fluid passages.

[0013] In this embodiment, the cooling system for a heterogeneous integrated semiconductor packaging structure further includes a plurality of oxygen-free copper seal components, which are provided at the connection points between the flow path component and the cooling component.

[0014] In this embodiment, the cooling component further includes a main fluid chamber, a fluid supply chamber, a fluid recovery chamber, and a plurality of fluid recovery holes, wherein the plurality of fluid supply holes can connect the main fluid chamber and the fluid supply chamber, and the plurality of fluid recovery holes can connect the main fluid chamber and the fluid recovery chamber. The arrangement density of the plurality of fluid supply holes in the first heat-generating section is higher than that of the plurality of fluid supply holes in the second heat-generating section.

[0015] In this embodiment, the fluid supply module may include a fluid supply pump, a fluid distribution valve, a first inlet pipe, and a second inlet pipe.

[0016] Both ends of the first inlet pipe can be connected to a fluid distribution valve and a first fluid chamber, respectively, and both ends of the second inlet pipe can be connected to a fluid distribution valve and a second fluid chamber, respectively.

[0017] A fluid supply pump is suitable for supplying cooling fluid to a fluid distribution valve, and the fluid distribution valve supplies a greater flow rate of cooling fluid to the first inlet pipe than to the second inlet pipe.

[0018] In this embodiment, the liquid supply module may include a first fluid supply pump and a second fluid supply pump. The first fluid supply pump is suitable for supplying cooling fluid to a first fluid chamber. The second fluid supply pump is suitable for supplying cooling fluid to a second fluid chamber.

[0019] Here, the flow rate of the cooling fluid supplied by the first fluid supply pump to the first fluid chamber is greater than the flow rate of the cooling fluid supplied by the second fluid supply pump to the second fluid chamber.

[0020] In this embodiment, the fluid supply module includes a fluid supply pump, a first inlet pipe, and a second inlet pipe.

[0021] The ends of the first inlet pipe can be connected to a fluid supply pump and a first fluid chamber, respectively, and the ends of the second inlet pipe can be connected to a fluid supply pump and a second fluid chamber, respectively.

[0022] The fluid supply pump supplies cooling fluid to the first and second fluid chambers, respectively, through a first inlet pipe and a second inlet pipe. Here, the diameter of the first inlet pipe is larger than the diameter of the second inlet pipe.

[0023] In this embodiment, the fluid supply module includes a fluid supply pump, a first inlet pipe, and a second inlet pipe.

[0024] The ends of the first inlet pipe can be connected to the inlet holes of the fluid supply pump and the first fluid chamber, respectively, and the ends of the second inlet pipe can be connected to the inlet holes of the fluid supply pump and the second fluid chamber, respectively.

[0025] The fluid supply pump is suitable for supplying cooling fluid to the first fluid chamber and the second fluid chamber, respectively, via the first and second inlet pipes.

[0026] The aperture diameter of the inlet hole of the first fluid chamber can be wider than that of the inlet hole of the second fluid chamber.

[0027] In this embodiment, the cooling system of the heterogeneous integrated semiconductor packaging structure can further include a fluid supply module and a fluid recovery module. The fluid supply module includes a cooling chamber and a recovery chamber, and the cooling chamber and the recovery chamber can be in communication with each other.

[0028] The fluid supply module can be connected to the cooling chamber and is suitable for supplying a cooling fluid thereto. The fluid recovery module can be connected to the recovery chamber, and the fluid recovery module can include a gas recovery pump, and the gas recovery pump is suitable for sucking the evaporated cooling fluid into the recovery chamber.

[0029] In this embodiment, the cooling system of the heterogeneous integrated semiconductor packaging structure can further include a fluid storage unit, a fluid supply pipeline, a fluid recovery pipeline, a first fluid pump, and a second fluid pump.

[0030] The cooling component can include a hollow chamber. A cooling fluid is stored in the fluid storage unit. Both ends of the fluid supply pipeline and the fluid recovery pipeline can be connected to the fluid storage unit and the hollow chamber of the cooling component respectively.

[0031] The first fluid pump can be arranged in the fluid supply pipeline. The second fluid pump can be arranged in the fluid recovery pipeline.

[0032] Supply the cooling fluid to the cooling component from the fluid supply pipeline through the first fluid pump, or supply the cooling fluid to the cooling component from the fluid recovery pipeline through the second fluid pump.

[0033] In this embodiment, the cooling system for the heterogeneous integrated semiconductor packaging structure comprises a controller, a sensor, and a fluid drive unit.

[0034] The fluid drive unit is suitable for supplying cooling fluid to cooling components. The controller can be mounted on a circuit board and can be electrically connected to the sensor and the fluid drive unit.

[0035] Here, the controller controls the fluid drive unit based on the sensing (detection) results from the sensor, and the fluid drive unit supplies cooling fluid to the cooling components.

[0036] In this embodiment, the cooling component includes a plurality of first fluid passages and a plurality of second fluid passages.

[0037] The plurality of first fluid passages and the plurality of second fluid passages may be arranged in a staggered pattern within the cooling component so as to be substantially parallel. Furthermore, the flow directions of the cooling fluid in adjacent plurality of first fluid passages and plurality of second fluid passages can be opposite to each other.

[0038] In this embodiment, the cooling component may include a channel, and the inner wall surface of the channel can be covered with a diamond-like film.

[0039] Furthermore, a cooling system for heterogeneous integrated semiconductor packaging structures, The heterogeneous integrated semiconductor packaging structure is arranged on a circuit board. The cooling system for the heterogeneous integrated semiconductor packaging structure includes cooling components. The cooling component is provided on the heterogeneous integrated semiconductor packaging structure.

[0040] Furthermore, it includes reinforced support and cooling fluid drive modules, The reinforced support is provided on the circuit board and in contact with the cooling component, the cooling component includes a vapor chamber, The reinforced support includes a cooling fluid passage, which is connected to the cooling fluid drive module, and the cooling fluid drive module is suitable for supplying cooling fluid to the cooling fluid passage.

[0041] Furthermore, it further includes a flow channel component, the flow channel component being located on the opposite side of the heterogeneous integrated semiconductor packaging structure on the circuit board. The flow channel component is coupled to the cooling component, the flow channel component includes a plurality of fluid passages, the cooling component includes an internal chamber, and the plurality of fluid passages are connected to the internal chamber.

[0042] Furthermore, the heterogeneous integrated semiconductor packaging structure includes a first heat-generating section and a second heat-generating section. The heat dissipation design efficiency of the first heat-generating section is higher than the heat dissipation design efficiency of the second heat-generating section. The cooling component includes a plurality of fluid supply holes, and the plurality of fluid supply holes correspond to the heterogeneous integrated semiconductor packaging structure. The flow rate of the cooling fluid ejected from the fluid supply hole to the first heat-generating section is greater than the flow rate of the cooling fluid ejected to the second heat-generating section.

[0043] Furthermore, the heterogeneous integrated semiconductor packaging structure further includes a fluid supply module, and includes a first heat-generating section and a second heat-generating section. The heat dissipation design efficiency of the first heat-generating section is higher than that of the second heat-generating section, and the cooling component includes a first fluid chamber and a second fluid chamber. The first fluid chamber corresponds to the first heat-generating section, and the second fluid chamber corresponds to the second heat-generating section. The fluid supply module is suitable for supplying cooling fluid to the first fluid chamber and the second fluid chamber. The flow rate of the cooling fluid supplied by the fluid supply module to the first fluid chamber is greater than the flow rate of the cooling fluid supplied to the second fluid chamber. [Effects of the Invention]

[0044] As described above, the cooling system for heterogeneous integrated semiconductor packaging structures provided by the present invention can significantly enhance heat dissipation capacity and meet the heat dissipation requirements that often arise when realizing high computing power and high-speed transmission. [Brief explanation of the drawing]

[0045] [Figure 1A] This is a cross-sectional view showing a first embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 1B] This is a cross-sectional view showing a second embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 2] This is a cross-sectional view showing a third embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 3] This is a cross-sectional view showing a fourth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 4] This is a cross-sectional view showing a fifth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 5A] This is a cross-sectional view showing a sixth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 5B] This is a cross-sectional view showing a seventh embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 5C] This is a cross-sectional view showing an eighth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 5D] This is a cross-sectional view showing a ninth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 6A] This is a perspective view showing a tenth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 6B] This is a cross-sectional view showing a tenth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 7]This is a perspective view showing an eleventh embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Figure 8] This is a block diagram showing the eleventh embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the invention. [Figure 9A] This is a cross-sectional view of a cooling component showing a thirteenth embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 9B] This is a cross-sectional view of a cooling component showing a 14th embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention. [Figure 10] This is a cross-sectional view illustrating a coating process showing a 15th embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. [Modes for carrying out the invention]

[0046] The following describes various embodiments to illustrate the invention in detail, but these embodiments are merely illustrative and are not intended to limit the scope of the present invention to those described in the embodiments. Furthermore, in these embodiments, some components have been omitted from the drawings in order to clearly illustrate the technical features of the present invention. In addition, the same reference numerals are used for identical components, and related reference numerals are used for components with a high degree of technical relevance, for example, by changing the last digit. Moreover, the drawings of the present invention are intended to provide a general explanation and are not necessarily drawn to a fixed scale, and not all components are shown in the drawings.

[0047] In the following description, a heterogeneous integrated semiconductor packaging structure is used as an example of a cooling component. However, the present invention is not limited thereto, and other technically similar semiconductor packaging structures, such as silicon photonics packaging structures or other advanced packaging structures, can also be applied to the present invention.

[0048] First, let's explain with reference to Figure 1A. Figure 1A is a cross-sectional view showing a first embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention. The heterogeneous integrated semiconductor packaging structure I is formed in a substantially plate shape and is positioned approximately in the center in the horizontal direction on a circuit board B which is also formed in a plate shape that extends horizontally. The circuit board B is formed as a plate-like body that extends horizontally, and through holes B1 are formed at both ends in the horizontal direction.

[0049] The cooling system for the heterogeneous integrated semiconductor packaging structure includes a cooling component 2, a thermally conductive fastener 31, and a heat sink 32. The cooling component 2 is positioned on the upper side of the heterogeneous integrated semiconductor packaging structure I in Figure 1A. As will be described later, the main body is formed in a tank shape to store cooling fluid, and in addition, wing portions (not indicated) with perforations 201 defined for inserting and fixing the thermally conductive fastener 31 protrude from both ends in the horizontal direction.

[0050] In this embodiment, the cooling component 2 may be a cooling plate or air-cooled plate filled with cooling fluid, a vapor chamber, or any other cooling plate with heat conduction or heat dissipation functions.

[0051] The cooling fluid may be a refrigerant, pure water, ethylene glycol, propylene glycol, or a combination thereof. If the cooling fluid is non-conductive, deionized water, electron fluorinating solution, or other electron process solutions can be used.

[0052] However, the cooling fluid is not limited to a liquid; it may also be a low-temperature gas such as nitrogen, carbon dioxide, helium, or hydrogen.

[0053] The thermally conductive fastener 31 is a so-called fastener formed in a roughly rod shape extending in a vertical direction perpendicular to the horizontal direction described above. It penetrates the perforation 201 of the cooling component 2, the through-hole B1 of the circuit board B, and the opening 34 of the reinforcing plate 33, which will be described later, along the vertical direction, and can be made of a metal material having a superior thermal conductivity coefficient. The thermally conductive fastener 31 is made of copper, for example, and a compression spring 6 is placed over one end of the thermally conductive fastener 31, and a barb 7, which is a so-called return, is provided at the other end. As will be described later, the force that the compression spring 6 tries to expand is stopped by the barb 7 that engages with the heat sink 32, so that the cooling component 2 and the heat sink 32 can be fixed so that they are in close contact with each other through the through-hole B1 of the circuit board B, the heterogeneous integrated semiconductor packaging structure I, and the perforation 201 of the cooling component 2. In this way, by using the compression spring 6 to bring the cooling component 2, the heterogeneous integrated semiconductor packaging structure I, the circuit board B, and the heat sink 32 into close contact, it is less likely that gaps with low thermal conductivity will form between them, resulting in the excellent effect of achieving high heat dissipation efficiency.

[0054] The heat sink 32 is formed as a plate-like body oriented horizontally and is positioned on the side of the circuit board B opposite to the heterogeneous integrated semiconductor packaging structure I. A pair of through holes (not indicated) are formed at both ends in the horizontal direction. In this embodiment, the heat sink 32 is positioned on the back surface of the circuit board B (the lower side in Figure 1A in the vertical direction). Furthermore, the material of the heat sink 32 can be made of a metal material with a better thermal conductivity, such as copper, to aid in heat dissipation.

[0055] In this embodiment, additional insulating pads (not shown) may be added between the circuit board B and the heat sink 32 to prevent the heat sink 32 from causing a short circuit between the circuit board B and the circuits or electronic components on the circuit board B.

[0056] Furthermore, Figure 1A also shows reinforcing plates 33 positioned at both horizontal ends on the same side as the heterogeneous integrated semiconductor packaging structure I on circuit board B. Although not visible in Figure 1A as it is a cross-sectional view, in a plan view, the reinforcing plates 33 surround the four sides of the heterogeneous integrated semiconductor packaging structure I.

[0057] In this embodiment, the reinforcing plate 33 may be a commonly used stiffener for reinforcing the strength of the circuit board B, or another metal component. Furthermore, the reinforcing plate 33 may be made of a metal material with a better thermal conductivity to aid in heat dissipation.

[0058] Here, the cooling component 2 includes a plurality of perforations 201, preferably four perforations 201, as described above, and can be arranged at the four corners of the cooling component 2. That is, although only the pair of perforations 201 on the front side are visible in Figure 1A due to the angle, a pair of perforations 201 are also defined on the back side, resulting in a total of four perforations 201.

[0059] The circuit board B is provided with multiple through holes B1, and the reinforcing plate 33 is also provided with multiple openings 34. The number and position of the through holes B1 and openings 34 must correspond to the perforations 201 in the cooling member 2.

[0060] Furthermore, the number of thermally conductive fasteners 31 matches the number of perforations 201 in the cooling component 2.

[0061] Then, as described above, each thermal conductive fastener 31 penetrates the perforation 201 in the cooling component 2, the opening 34 in the reinforcing plate 33, the through hole B1 in the circuit board B, and the through hole (not indicated) in the heat sink 32. The barb 7, which is a return barb formed on the other end of the thermal conductive fastener 31, is pulled upward by the force of the compression spring 6 stretching and engages with the lower surface of the heat sink 32.

[0062] Of these, the compression spring 6 is sandwiched between the lower end of the large-diameter portion (not indicated) formed on one end of the thermal conductive fastener 31 and the aforementioned wing portion (not indicated) of the cooling component 2, applying a downward force to the cooling component 2, thereby ensuring that the lower surface of the cooling component 2 is securely attached to the upper surface of the heterogeneous integrated semiconductor packaging structure I.

[0063] As described above, the thermal conductive fastener 31 of this embodiment employs a barb 7 to facilitate attachment and detachment. Furthermore, the pressing force applied to the cooling component 2 can be adjusted by replacing the compression spring 6 with one of a different pressing force, allowing for flexible adjustment of the pressing force.

[0064] Furthermore, the thermally conductive fastener 31 has excellent thermal conductivity and can conduct heat from the cooling component 2 to the reinforcing plate 33 and the heat sink 32. Since the reinforcing plate 33 and the heat sink 32 can assist in heat dissipation, the heat dissipation efficiency can be improved.

[0065] Next, we will explain with reference to Figure 1B. This is a cross-sectional view showing a second embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention. The main difference between the second embodiment and the embodiment described above is that a chip socket S is provided on the circuit board B, and in this embodiment, the chip socket S is used instead of the reinforcing plate 33 in the embodiment described above.

[0066] In this embodiment as well, the thermally conductive fastener 31 similarly penetrates the cooling component 2, the chip socket S, the circuit board B, and the heat sink 32, and the barb 7, which is the return of the thermally conductive fastener 31, engages with the lower surface of the heat sink 32. Note that, unlike the reinforcing plate 33 in Figure 1A, the chip socket S in Figure 1B, which was previously provided as a horizontally divided unit, is now integrally formed. As a result, the chip socket S extends so as to be in close contact with the heterogeneous integrated semiconductor packaging structure I.

[0067] Therefore, the heat sink 32 can assist in heat dissipation, thereby improving heat dissipation efficiency.

[0068] Next, we will explain with reference to Figure 2. Here, Figure 2 is a cross-sectional view showing a third embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention.

[0069] In this embodiment, the cooling component 2 is a vapor chamber. The vapor chamber is in contact with the reinforced support 3. The vapor chamber has excellent thermal conductivity and rapidly dissipates heat around the heterogeneous integrated semiconductor packaging structure I, where the heat density is very concentrated, preventing the heterogeneous integrated semiconductor packaging structure I from becoming overheated.

[0070] In this embodiment, the reinforcing support 3 may be a stiffener or other metal component commonly used to reinforce the strength of the circuit board B. The material of the reinforcing support 3 may also be a metal with excellent thermal conductivity, such as copper.

[0071] Furthermore, Figure 2 shows a cooling fluid drive module 4, which includes a pump (not indicated) and a fluid delivery pipe (not indicated).

[0072] Within the reinforced support 3, there is a cooling fluid passage 41 connected to the cooling fluid drive module 4. The cooling fluid drive module 4 is suitable for supplying cooling fluid to the cooling fluid passage 41.

[0073] In this embodiment, the reinforcement support 3 is utilized to its fullest extent, and a cooling fluid passage 41 is excavated in the reinforcement support 3 and combined with the cooling fluid drive module 4. Due to the excellent thermal conductivity of the vapor chamber, heat is transferred to the surrounding reinforcement support 3, and then this heat is quickly removed by the cooling fluid, resulting in a rapid heat dissipation effect. Furthermore, unlike the embodiment shown in Figure 1B, there is no need to use heat dissipation components across the entire underside of the heterogeneous integrated semiconductor packaging structure I, and by using the vapor chamber, the cooling component 2 can be made even thinner due to its excellent heat dissipation effect, thus achieving the advantage of space saving.

[0074] In this embodiment, the cooling fluid drive module 4 may further include a liquid storage tank (not shown) and a heat exchanger (not shown). The liquid storage tank can store an appropriate amount of cooling fluid so that the cooling fluid drive module 4 can continuously supply cooling fluid to the reinforced support 3.

[0075] The heat exchanger may be a finned heat exchanger equipped with a fan, which can further dissipate heat from the circulating cooling fluid. In other embodiments, the heat exchanger may be a chiller that can further adjust the temperature of the cooling fluid to a lower temperature.

[0076] Next, with reference to Figure 3, which is a cross-sectional view showing a fourth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention.

[0077] In the embodiment shown in Figure 3, the cooling system for the heterogeneous integrated semiconductor packaging structure includes a cooling component 2 and a flow channel component 5. The cooling component 2 is positioned to cover the heterogeneous integrated semiconductor packaging structure I from above, and the flow channel component 5 is positioned on the side of the circuit board B opposite to the heterogeneous integrated semiconductor packaging structure I, i.e., on the lower side of the circuit board B.

[0078] In this embodiment, the cooling component 2 may be a cooling plate that includes an internal chamber 20 and a plurality of openings 21, each formed in a plurality of rectangular shapes in cross-sectional view as shown in Figure 3, arranged in a straight line horizontally, and communicating with each other in a flow path on the inner side (not shown). The flow path component 5 may be a flow guide back plate that includes a plurality of fluid passages 51 extending horizontally inside the horizontally extending fluid component 5, and a plurality of protrusions 52 projecting further upward from the upper surface of the fluid passages 5. Here, in the fluid passages 51 shown in light gray in Figure 3, fluid flows in the direction of the arrows, and although it is not shown in Figure 3 because it is interrupted, at the return section the fluid passage 51 on the lower side of the flow path component 5 communicates with the fluid passage 51 formed on the upper side of the fluid component 5, and as a whole a single fluid passage 51 communicates with the cooling component 2.

[0079] The circuit board B has multiple through holes B2, and the protrusions 52 of the flow channel component 5 are each joined to the cooling component 2 via the through holes B2.

[0080] In this embodiment, as shown in Figure 3, the connection between the cooling component 2 and the flow path component 5 can be made by screw fastening. More specifically, the set screw 70 can penetrate vertically through the cooling component 2 and the circuit board B and be fixed to the flow path component 5. In addition, the fluid flow paths 51 of the flow path member 5 each extend horizontally, then change direction to a roughly "V" shape and extend to the projection 52, which is connected to the internal chamber 20 of the cooling component 2 via the opening 21.

[0081] In other embodiments, the projection 52 of the flow channel component 5 is not limited to being joined to the cooling component 2 via a through hole B2 in the circuit board B. That is, if the circuit board B does not have a through hole B2, although this embodiment is not shown, the projection 52 may be extended upward along the side edge of the circuit board B and joined to the cooling component 2.

[0082] In other embodiments, the joint position between the cooling component 2 and the flow path component 5 can be adjusted based on actual requirements, such as the side edge of the circuit board B or other suitable locations.

[0083] Furthermore, in this embodiment, oxygen-free copper sealing components 55 can be provided at each connection point between the flow channel component 5 and the cooling component 2.

[0084] The reason for using oxygen-free copper as a sealing component is that copper is soft, tough, highly ductile, and has a long lifespan.

[0085] On the other hand, each projection 52 includes a first projection sealing unit 53 which can be arranged in accordance with the shape of the oxygen-free copper sealing component 55, such as an annular structure, as shown in the enlarged view of the main part shown in the lower left of Figure 3.

[0086] Similarly, the cooling component 2 may include a plurality of second projection sealing units 54. Each of these may surround the opening 21, and the position, size, and shape of the second projection sealing units 54 may be consistent with those of the first projection sealing unit 53.

[0087] As a result, the first projection sealing unit 53 and the second projection sealing unit 54 penetrate both sides of the oxygen-free copper sealing component 55, and the projections 52 engage with the cooling component 2 to seal it.

[0088] Thus, in this embodiment, the cooling fluid is supplied to the cooling component 2 via the fluid passage 51 of the flow channel component 5, and forced circulation of the cooling fluid can be further performed, resulting in a higher heat dissipation effect.

[0089] On the other hand, in this embodiment, a flow path is also arranged below the circuit board B, allowing simultaneous cooling of the heterogeneous integrated semiconductor package I from above and below, increasing the heat dissipation area. As a result, there is no need to provide a large cooling component 2 as shown in Figures 1A and 1B, which leads to significant space savings. Furthermore, the configuration of related components on the circuit board B can be simplified, which is advantageous for disassembly, assembly, and maintenance of electronic components on the circuit board B.

[0090] Furthermore, since the connection of the fluid passage 51 is completed simultaneously when assembling the cooling component 2, fully automated assembly is possible.

[0091] Next, we will explain with reference to Figure 4. Here, Figure 4 is a cross-sectional view showing a fifth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention.

[0092] As shown in Figure 4, the heterogeneous integrated semiconductor packaging structure I includes a first heat-generating section Ia and a second heat-generating section Ib, which may each be a chiplet.

[0093] In this embodiment, the thermal design power (TDP, meaning heat dissipation capacity) of the first heat-generating element Ia is preset to be higher than the thermal design power of the second heat-generating element Ib.

[0094] In other words, during the operation of the two chiplets, the temperature of the first heat-generating part Ia is higher than the temperature of the second heat-generating part Ib.

[0095] In such cases, even with a typical semiconductor packaging structure, an overall non-uniform temperature distribution, particularly thermal crosstalk, can occur, affecting the reliability of the semiconductor packaging structure.

[0096] As shown in Figure 4, the cooling component 2 may have a plurality of fluid supply holes 22 extending vertically inside, corresponding to the first heat-generating section Ia and the second heat-generating section Ib, respectively.

[0097] However, in this embodiment, jet impingement technology can be used to solve the above-mentioned problem of non-uniform temperature of the semiconductor packaging structure. This can be achieved by means such as making the flow rate of the cooling fluid sprayed from the fluid supply hole 22 to the first heat-generating part Ia greater than the flow rate of the cooling fluid sprayed to the second heat-generating part Ib.

[0098] Here, supplying a larger flow rate of cooling fluid removes more heat than supplying a smaller flow rate. This significantly reduces the temperature of the first heat-generating section Ia, and keeps the temperatures of the first heat-generating section Ia and the second heat-generating section Ib as constant as possible.

[0099] Specifically, as shown in Figure 4, the cooling component 2 comprises a main fluid chamber 23, a fluid supply chamber 24, a fluid recovery chamber 25, a plurality of fluid supply holes 22, and a plurality of fluid recovery holes 26.

[0100] The aforementioned multiple fluid supply holes 22 are connected to the main fluid chamber 23 and the fluid supply chamber 24, and the fluid recovery holes 26 are connected to the main fluid chamber 23 and the fluid recovery chamber 25.

[0101] In other words, taking the fluid supply chamber 24 as an example, the area depicted in dark gray in Figure 4 is the fluid supply chamber 24. Specifically, fluid is supplied from the horizontally extending pipeline (unsigned) shown in the upper left of Figure 4, and through the fluid supply chamber 24, passing through multiple fluid supply holes 22, also depicted in dark gray, to the main fluid chamber 23. This cools the heterogeneous integrated semiconductor packaging structure I, which includes the first heat-generating section Ia and the second heat-generating section Ib.

[0102] On the other hand, taking the fluid recovery chamber 25 as an example, the liquid to be used for heat dissipation is recovered from the main chamber 23 through multiple fluid recovery holes 26, which are depicted in light gray, and temporarily stored in the liquid recovery chamber 25. After that, the heat-containing liquid is recovered via a recovery pipeline (not indicated) which is depicted extending horizontally in the upper right of Figure 4.

[0103] Thus, although the liquid supply chamber 24 is connected to the liquid recovery chamber 25 via the main fluid chamber 23, the fluid supply system and the recovery system have separate flow paths. As a result, the fluid before being used for heat dissipation does not mix with the fluid after it has been used for heat dissipation, and a high heat dissipation effect can be obtained.

[0104] Here, the arrangement density of the plurality of fluid supply holes 22 corresponding to the first heat-generating section Ia is higher than the arrangement density of the plurality of fluid supply holes 22 corresponding to the second heat-generating section Ib.

[0105] In other words, compared to the second heat-generating element Ib, the first heat-generating element Ia, which has a higher heat dissipation design efficiency, can have its heat dissipation efficiency improved by providing more and more densely packed fluid supply holes 22, which are jet impingement holes.

[0106] The specific arrangement of the fluid supply holes 22 can be determined by the heat flux (HF). Here, the relationship with heat flux is as follows: Heat Flux (HF) = Thermal Design Power (TDP) / Surface area of ​​the heat-generating part.

[0107] For example, the heat flux (HF1) of the first heat-generating element Ia = the heat dissipation design efficiency (TDP1) of the first heat-generating element Ia / the surface area of ​​the upper surface of the first heat-generating element Ia.

[0108] Similarly, the heat flux (HF2) of the second heat-generating element Ib = the heat dissipation design efficiency (TDP2) of the second heat-generating element Ib / the surface area of ​​the upper surface of the second heat-generating element Ib.

[0109] If the heat flux (HF1) of the first heat-generating element Ia is greater than the heat flux (HF2) of the second heat-generating element Ib, then the arrangement density (ρ1) of the plurality of fluid supply holes Ps corresponding to the first heat-generating element Ia is greater than the arrangement density (ρ2) of the plurality of fluid supply holes Ps corresponding to the second heat-generating element Ib.

[0110] In other embodiments using a closed cooling plate, thermal control can also be performed for multiple chiplets having different heat dissipation design efficiencies.

[0111] First, let's refer to Figure 5A for explanation. Here, Figure 5A is a cross-sectional view showing a sixth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention.

[0112] The cooling system for the heterogeneous integrated semiconductor packaging structure shown in Figure 5A further includes a fluid supply module 8. The heterogeneous integrated semiconductor packaging structure I similarly includes a first heat-generating section Ia and a second heat-generating section Ib, wherein the heat dissipation design efficiency of the first heat-generating section Ia is greater than the heat dissipation design capability of the second heat-generating section Ib.

[0113] Furthermore, the cooling component 2 has a first fluid chamber C1 and a second fluid chamber C2, where the first fluid chamber C1 corresponds to the first heat-generating section Ia and the second fluid chamber C2 corresponds to the second heat-generating section Ib.

[0114] However, in this embodiment, the first heat-generating section Ia and the second heat-generating section Ib can be thermally controlled by adjusting the flow rates of the cooling fluids in the first fluid chamber C1 and the second fluid chamber C2, respectively.

[0115] In other words, this can be achieved by controlling the flow rate of the cooling fluid supplied to the first fluid chamber C1 by the fluid supply module 8 to be greater than the flow rate of the cooling fluid supplied to the second fluid chamber C2.

[0116] In the embodiment shown in Figure 5A, the fluid supply module 8 includes a fluid supply pump 81, a fluid distribution valve 82, a first inlet pipe 83, a second inlet pipe 84, a first outlet pipe 87, and a second outlet pipe 88.

[0117] Both ends of the first inlet pipe 83 are connected to the fluid distribution valve 82 and the furthest upstream side of the first fluid chamber C1 (that is, the leftmost side, as in the embodiment of Figure 5A, where the fluid flows from left to right as indicated by the arrow). Both ends of the second inlet pipe 84 are connected to the fluid distribution valve 82 and the furthest upstream side of the second fluid chamber C2.

[0118] One end of the first outlet pipe 87 is connected to the downstream side of the first fluid chamber C1, and the other end is connected to a liquid storage tank (not shown). Similarly, one end of the second outlet pipe 88 is connected to the downstream side of the second fluid chamber C2, and the other end is connected to a fluid storage tank (not shown).

[0119] Here, the fluid distribution valve 82 may be a proportional flow control valve, which is a device that controls the flow of fluids (liquid and gas) by electronic signals.

[0120] The specific operation of this embodiment is as follows: Cooling fluid is supplied from the fluid supply pump 81 to the fluid distribution valve 82, and then the fluid distribution valve 82 distributes the cooling fluid to the furthest upstream side of the first fluid chamber C1 and the furthest upstream side of the second fluid chamber C2 based on a predetermined ratio.

[0121] Here, a "partition wall" (not shown) is provided between the first fluid chamber C1 and the second fluid chamber C2, so the cooling fluid that has undergone heat exchange in the first fluid chamber C1 flows out through the first outlet pipe 87. Similarly, the cooling fluid that has undergone heat exchange in the second fluid chamber C2 flows out through the second outlet pipe 88.

[0122] However, in this embodiment, since the heat dissipation design efficiency of the first heat-generating section Ia needs to be higher than that of the second heat-generating section Ib, the fluid distribution valve 82 needs to distribute the cooling fluid at a ratio such that the flow rate of the cooling fluid supplied to the first inlet pipe 83 is greater than the flow rate of the cooling fluid supplied to the second inlet pipe 84.

[0123] Next, we will explain with reference to Figure 5B. Here, Figure 5B is a cross-sectional view showing a seventh embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. The main difference between this embodiment and the embodiment in Figure 5A is that the fluid supply pump 81 and fluid distribution valve 82 in the embodiment in Figure 5A are replaced by a first fluid supply pump 85 and a second fluid supply pump 86.

[0124] Here, the first fluid supply pump 85 is dedicated to supplying cooling fluid to the first fluid chamber C1, and the second fluid supply pump 86 is dedicated to supplying cooling fluid to the second fluid chamber C2.

[0125] Similarly, the flow rate of the cooling fluid supplied to the first fluid chamber C1 by the first fluid supply pump 85 is greater than the flow rate of the cooling fluid supplied to the second fluid chamber C2 by the second fluid supply pump 86.

[0126] In this embodiment, the first fluid supply pump 85 and the second fluid supply pump 86 may be configured as pumps that supply flow rates of different volumes, or pumps capable of switching the supplied flow rate may be used.

[0127] Next, we will explain with reference to Figure 5C. Figure 5C is a cross-sectional view showing an eighth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention.

[0128] The main difference between this embodiment and the embodiments shown in Figures 5A and 5B is that the diameters of the first inlet pipe 83 and the second inlet pipe 84 are different in this embodiment. The flow rate of the cooling fluid flowing into the first fluid chamber C1 and the second fluid chamber C2 is controlled by the difference in pipe diameters.

[0129] More specifically, as shown in Figure 5C, the fluid supply module 8 includes a fluid supply pump 81, a first inlet pipe 83, a second inlet pipe 84, a first outlet pipe 87, and a second outlet pipe 88.

[0130] Both ends of the first inlet pipe 83 are connected to the fluid supply pump 81 and the upstream side of the first fluid chamber C1, respectively. Both ends of the second inlet pipe 84 are connected to the fluid supply pump 81 and the upstream side of the second fluid chamber C2, respectively.

[0131] One end of the first outlet pipe 87 is connected to the downstream side of the first fluid chamber C1, and the other end is connected to a fluid storage tank (not shown). Similarly, one end of the second outlet pipe 88 is connected to the downstream side of the second fluid chamber C2, and the other end is connected to a fluid storage tank (not shown).

[0132] In this way, the fluid supply pump 81 can supply cooling fluid to the upstream side of the first fluid chamber C1 and the upstream side of the second fluid chamber C2, respectively, via the first inlet pipe 83 and the second inlet pipe 84.

[0133] Furthermore, the cooling fluid in the first fluid chamber C1 and the second fluid chamber C2 can also be discharged through the first outlet pipe 87 and the second outlet pipe 88.

[0134] In this embodiment, the diameters of the first inlet pipe 83 and the first outlet pipe 87 are larger than the diameters of the second inlet pipe 84 and the second outlet pipe 88. Furthermore, a "partition wall" (not shown) is provided between the first fluid chamber C1 and the second fluid chamber C2, preventing the cooling fluid that flows into the first fluid chamber C1 from moving into the second fluid chamber C2.

[0135] Therefore, the flow rate of the cooling fluid flowing into the first fluid chamber C1 is greater than the flow rate of the cooling fluid flowing into the second fluid chamber C2.

[0136] Next, we will explain with reference to Figure 5D. Figure 5D is a cross-sectional view showing a ninth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention.

[0137] The main difference between this embodiment and the embodiments shown in Figures 5A to 5C is that the opening size of the inlet hole 831 of the first fluid chamber C1 in this embodiment is different from the opening size of the inlet hole 841 of the second fluid chamber C2. These different opening sizes control the flow rate of the cooling fluid flowing into the first fluid chamber C1 and the second fluid chamber C2.

[0138] To further explain, the fluid supply module 8 includes a fluid supply pump 81, a first inlet pipe 83, a second inlet pipe 84, a first outlet pipe 87, and a second outlet pipe 88.

[0139] Both ends of the first inlet pipe 83 are connected to the fluid supply pump 81 and the upstream side of the first fluid chamber C1, respectively. Both ends of the second inlet pipe 84 are connected to the fluid supply pump 81 and the upstream side of the second fluid chamber C2, respectively.

[0140] One end of the first outlet pipe 87 is connected to the downstream side of the first fluid chamber C1, and the other end is connected to a fluid storage tank (not shown).

[0141] Similarly, one end of the second outlet pipe 88 is connected to the downstream side of the second fluid chamber C2, and the other end is connected to a fluid storage tank (not shown).

[0142] Therefore, the fluid supply pump 81 can supply cooling fluid to the first fluid chamber C1 and the second fluid chamber C2, respectively, via the first inlet pipe 83 and the second inlet pipe 84.

[0143] The cooling fluid in the first fluid chamber C1 and the second fluid chamber C2 can also flow out through the first outlet pipe 87 and the second outlet pipe 88.

[0144] In this embodiment, the diameter of the inlet hole 831 of the first fluid chamber C1 is wider than the diameter of the inlet hole 841 of the second fluid chamber C2.

[0145] Therefore, the flow rate of the cooling fluid flowing into the first fluid chamber C1 is greater than the flow rate of the cooling fluid flowing into the second fluid chamber C2.

[0146] As described above, in the embodiments shown in Figures 5A to 5D, the cooling component 2 can be configured to include a first fluid chamber C1 and a second fluid chamber C2 for each of the first heat-generating parts Ia and second heat-generating parts Ib on the heterogeneous integrated semiconductor packaging structure I. The cooling system for the heterogeneous integrated semiconductor packaging structure can supply cooling fluid at different flow rates to each of the first fluid chamber C1 and second fluid chamber C2, and the flow rates can be set based on the heat dissipation design efficiency for each of the first heat-generating parts Ia and second heat-generating parts Ib.

[0147] A high heat dissipation design efficiency means that the heat-generating parts generate higher temperatures. Therefore, by supplying a larger flow rate of cooling fluid to the fluid chamber corresponding to the heating parts, the temperature of the heterogeneous integrated semiconductor packaging structure I can be kept as constant as possible, thus avoiding the thermal crosstalk phenomenon.

[0148] Next, we will explain with reference to Figures 6A and 6B. Figure 6A is a perspective view showing a tenth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention. Figure 6B is a cross-sectional view showing a tenth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention.

[0149] As shown in Figures 6A and 6B, this embodiment includes a fluid storage unit 60, a fluid supply module 61, and a fluid recovery module 62.

[0150] Cooling fluid is stored in the fluid storage unit 60. The fluid supply module 61 includes a liquid supply pump 610 and a fluid supply pipeline 63.

[0151] The fluid recovery module 62 includes a gas recovery pump 620 and a fluid recovery pipeline 64. The ends of the fluid supply pipeline 63 and the fluid recovery pipeline 64 are connected to the fluid storage unit 60 and the cooling component 2, respectively.

[0152] Furthermore, a liquid supply pump 610 is provided to connect a pair of fluid supply pipelines 63, and a gas recovery pump 620 is provided to connect a pair of fluid recovery pipelines 64.

[0153] In this configuration, the cooling system for the heterogeneous integrated semiconductor packaging structure supplies cooling fluid to the cooling component 2 via a liquid supply pump 610 and a fluid supply pipeline 63. The evaporated cooling fluid is then drawn out of the cooling component 2 via a gas recovery pump 620 and a fluid recovery pipeline 64.

[0154] Furthermore, as shown in Figure 6(B), the cooling member 2 comprises a cooling chamber 27 and a recovery chamber 28. The two are connected via a plurality of through holes 270.

[0155] Based on the above configuration, when faced with the requirements of High Performance Computing (HPC), the temperature of the heterogeneous integrated semiconductor packaging structure I may rise to a temperature sufficient to cause the cooling fluid to evaporate. Therefore, a method such as two-phase immersion cooling, which uses both gaseous and liquid cooling fluids, is employed.

[0156] At this time, when the liquid cooling fluid in the cooling chamber 27 located on the lower side is heated and evaporates, this evaporated gas rises. As a result, the gaseous cooling fluid flows through the multiple through holes 270 into the recovery chamber 28 located on the upper side of the cooling chamber 27. The gas recovery pump 620 in this embodiment can pump the gaseous cooling fluid out of the recovery chamber 28.

[0157] As described above, this embodiment allows for the continuous supply of cooling fluid to the cooling component 2 via the liquid supply pump 610 and the fluid supply pipeline 63. Furthermore, the evaporated cooling fluid can be recovered from the cooling component 2 via the gas recovery pump 620 and the fluid recovery pipeline 64.

[0158] This forces the circulation of liquid and gaseous cooling fluids, maintaining an excellent heat dissipation effect. Furthermore, in other embodiments, a condenser or other heat exchanger (not shown) may be added on the fluid recovery pipeline 64, which may be a finned heat exchanger with a fan, and which may condense into the liquid cooling fluid by dissipating heat from the circulating gaseous cooling fluid.

[0159] On the other hand, due to the following factors, prolonged operation of cooling component 2 can cause the channels and internal holes of cooling component 2 to gradually narrow, and in severe cases, become completely blocked.

[0160] For example, this could include metal shavings generated during the manufacturing process of cooling component 2 not being cleaned up, impurities leaking from the body of cooling component 2, impurities being present in the coolant itself, or microorganisms growing in the microchannels or coolant.

[0161] When these symptoms occur, it can affect the heat dissipation effect of cooling component 2, or the cooled semiconductor packaging structure may become too hot, malfunction, or even burn out.

[0162] To solve the above problems, the following embodiments are provided. They will be described with reference to Figure 7. Here, Figure 7 is a perspective view showing an eleventh embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention.

[0163] The embodiment shown in Figure 7 comprises a cooling component 2, a fluid storage unit 71, a fluid supply pipeline 72, a fluid recovery pipeline 73, a first fluid pump 74, and a second fluid pump 75.

[0164] Furthermore, the cooling component 2 may include a hollow chamber C. Cooling fluid is stored in the fluid storage unit 71. Both ends of the fluid supply pipeline 72 are connected to the fluid storage unit 71 and the hollow chamber C of the cooling component 2, respectively. Both ends of the fluid recovery pipeline 73 are connected to the fluid storage unit 71 and the hollow chamber C of the cooling component 2, respectively.

[0165] A first fluid pump 74 is provided to connect a pair of fluid supply pipelines 72, and a second fluid pump 75 is provided to connect a pair of fluid recovery pipelines 73.

[0166] Here, the cooling system for the heterogeneous integrated semiconductor packaging structure can supply cooling fluid to the hollow chamber C of the cooling component 2 via a first fluid pump 74 and a fluid supply pipeline 72, along the direction of the black-filled arrow. Alternatively, the cooling fluid can also be supplied to the hollow chamber C of the cooling component 2 via a second fluid pump 75 from a fluid recovery pipeline 73, along the direction indicated by the white-outlined arrow.

[0167] Specifically, when the system is operating normally, the second fluid pump 75 is stopped, and cooling fluid is supplied to the cooling component 2 by the first fluid pump 74 via the fluid supply pipeline 72. The cooling fluid is also forcibly circulated by the first fluid pump to dissipate heat. The cooling fluid is returned to the fluid storage unit 71 through the fluid recovery pipeline 73.

[0168] On the other hand, if you want to thoroughly wash the inside of the cooling component 2 by forcefully injecting fluid into the internal passages and holes, stop the first fluid pump 74.

[0169] Then, when the second fluid pump 75 is driven, the cooling fluid is supplied to the cooling component 2 via the second fluid pump 75 and the fluid recovery pipeline 73, and returns to the fluid storage unit 71 via the fluid supply pipeline 72.

[0170] Therefore, the second fluid pump 75 generates a flow in the opposite direction to the normal flow of the cooling fluid.

[0171] Therefore, by flowing fluid from a different direction, solid debris in blind spots that would remain if fluid were flowing from only one side, as well as solid debris adhering to the inside or walls of the fluid supply pipeline 72 and the fluid recovery pipeline 73, can be effectively washed away. In other embodiments, filter members (not shown) may be placed in the fluid supply pipeline 72 and the fluid recovery pipeline 73 to filter out foreign matter and impurities that have been flowed through. In this way, according to this embodiment, foreign matter and impurities that adhere to the cooling component 2, the fluid supply pipeline 72, and the fluid recovery pipeline 73 can be removed, so that the fluid flow rate can be kept high, and a high heat dissipation effect can be obtained over a long period of time.

[0172] Furthermore, in other embodiments, the first fluid pump 74 and the second fluid pump 75 may be bidirectional pumps, allowing the direction of flow to be switched.

[0173] In other words, by using bidirectional pumps, both the first fluid pump 74 and the second fluid pump 75 can operate during normal operation, driving the fluid in the same direction, for example, in the counterclockwise direction indicated by the black arrows in Figure 7.

[0174] On the other hand, if it is necessary to flush out the inside of the cooling component 2, the second fluid pump 75 is also activated in addition to the first fluid pump 74. However, after switching the direction of flow, these two pumps will flow the cooling fluid in opposite directions, such as clockwise as indicated by the white arrows in Figure 7. In this embodiment using bidirectional pumps, the system may be configured with only one bidirectional pump.

[0175] Incidentally, most conventional liquid cooling systems employ a separate method for operational monitoring, meaning they are independent systems from the computing systems being cooled, such as servers, and there is no exchange of information between them.

[0176] In other words, the detection of liquid temperature, monitoring and distribution of flow rate in the liquid cooling system, detection of pressure drop in the cooling fluid, and real-time control of the fluid-driven pump are all performed solely by the cooling system, without any real-time communication with a server system (not shown).

[0177] Therefore, even if an anomaly occurs in the server system, the cooling system cannot immediately detect it and respond in time. Similarly, even if an anomaly occurs in the cooling system, the server system cannot immediately detect it and respond in time.

[0178] Furthermore, conventional liquid cooling systems have an independent relationship with the computer systems they cool, such as servers. In other words, because the sensors associated with conventional cooling systems cannot be integrated into the computing system, the wiring of the related sensors tends to be complex and cumbersome, resulting in problems such as increased maintenance effort and costs.

[0179] To solve the above-mentioned problems, embodiments of the present invention will be described with reference to Figure 8. Here, Figure 8 is a block diagram showing a twelfth embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention.

[0180] The cooling system of this embodiment further includes a controller 11, a plurality of sensors 12, a fluid drive unit 13, and a cooling liquid distribution unit (CDU) 14.

[0181] The controller 11 may be a microprocessor, system-on-a-chip (SOC), microcontroller, field-programmable gate array (FPGA), application-specific integrated circuit (ASIC) on a server mainboard, or another controller or processor on a motherboard.

[0182] In a specific embodiment, a baseboard management controller (BMC) can be used.

[0183] In this embodiment, the sensor 12 may include, but is not limited to, other sensors that monitor the state of the cooling fluid, such as leakage sensors, flow meters, pressure sensors, and temperature sensors.

[0184] In this embodiment, the fluid drive unit 13 is suitable for supplying cooling fluid to the cooling component 2. The fluid drive unit 13 may include a drive circuit 131 and a pump 132. The drive circuit 131 is used to control the on / off state and operating state of the pump 132.

[0185] Furthermore, the cooling liquid distribution device 14 includes, but is not limited to, a fluid storage tank, radiator, heat exchanger, filter, etc., and in any case, it plays the role of evenly distributing the cooling fluid throughout the entire system.

[0186] As shown in Figure 8, the controller 11 is electrically connected to the sensor 12 and the fluid drive unit 13.

[0187] In other words, the control unit 11 can control the fluid drive unit 13 to supply cooling fluid to the cooling component 2 according to the detection result of the sensor 12.

[0188] For example, if the sensor 12 detects an abnormality such as a leak of cooling fluid, the controller 11 can not only control the fluid drive unit 13 to stop the supply of cooling fluid, but also take necessary protective measures such as synchronously controlling and shutting down the server system.

[0189] On the other hand, if an abnormality occurs in the server system, such as the processor temperature being too high, the controller 11 can also control the fluid drive unit 13 to increase the flow rate of the cooling fluid supplied or to lower the temperature of the cooling fluid. In another embodiment, when the server system is shut down, the controller 11 can also control the entire cooling system itself and stop its operation.

[0190] In short, the controller 11 on the motherboard coordinates the operation between the cooling system of the heterogeneous integrated semiconductor packaging structure and the server system, enabling real-time monitoring of conditions such as temperature, flow rate, pressure, and leaks at each board step. In this way, the temperature, flow rate, and pressure of the cooling fluid can be controlled in a timely manner according to the sensing results, thus maintaining the system at optimal performance and avoiding serious system failures.

[0191] Furthermore, the controller 11 on the motherboard can also control the cooling system of the heterogeneous integrated semiconductor packaging structure to perform corresponding operations depending on the operating status of the server system. For example, this could include starting operation, stopping operation, increasing the flow rate of the cooling fluid, increasing the temperature of the cooling fluid, decreasing the flow rate of the cooling fluid, or decreasing the temperature of the cooling fluid.

[0192] Furthermore, since each sensor 12 is placed on the same circuit board as the server's electronic components, the cost of sensor wiring can be reduced, and the complexity of sensor wiring can be alleviated.

[0193] Furthermore, the cooling system for the heterogeneous integrated semiconductor packaging structure of this embodiment can also be remotely controlled. For example, the controller 11 and the cooling liquid distribution device 14 are connected to a remote device 15.

[0194] The cooling system and server system for heterogeneous integrated semiconductor packaging structures can be managed and monitored remotely via a remote device 15.

[0195] In the cooling system for heterogeneous integrated semiconductor packaging structures, if an abnormality occurs in the server system, the controller 11 immediately notifies the remote device 15 and takes immediate action.

[0196] Embodiments of the present invention will be described with reference to Figures 9A and 9B. Here, Figure 9A is a cross-sectional view of a cooling component showing a thirteenth embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention. Figure 9B is a cross-sectional view of a cooling component showing a fourteenth embodiment of the cooling system for a heterogeneous integrated semiconductor packaging structure of the present invention.

[0197] Conventional liquid cooling systems use a cold plate to cool electronic components, and by creating a flow path inside the cold plate, the contact area between the coolant and the cold plate is increased, thereby improving cooling efficiency.

[0198] However, conventional flow path designs typically employ a parallel flow path arrangement, meaning that the direction of coolant flow in adjacent flow paths is the same.

[0199] This channel design improves heat dissipation efficiency. However, the temperature distribution in typical semiconductor packaging structures is often non-uniform. For example, the region near the water inlet is cooler, while the region near the water outlet is cooler.

[0200] To solve the above problems, the embodiments shown in Figures 9A and 9B provide a novel flow path design to the cooling component 2, which not only significantly improves heat exchange efficiency but also makes the temperature distribution of the cooling component 2 uniform.

[0201] Referring to Figure 9A, the cooling component 2 includes a first inlet Pi1, a first outlet Po1, a second inlet Pi2, a second outlet Po2, a plurality of first fluid passages CH1, and a plurality of second fluid passages CH2.

[0202] The first inlet Pi and the first outlet Po1 are located on the corresponding sides of the cooling component 2. In Figure 9, these are located on the lower right and left sides, respectively. The second inlet Pi2 and the first outlet Po1 are both located on the left side of the cooling component. The second outlet Po2 and the first inlet Pi1 are both located on the right side of the cooling component.

[0203] Furthermore, both ends of the first fluid passage CH1 are connected to the first inlet Pi1 and the first outlet Po1, respectively, and both ends of the second fluid passage CH2 are connected to the second inlet Pi2 and the second outlet Po2, respectively.

[0204] Furthermore, the first fluid passage CH1 and the second fluid passage CH2 are arranged substantially parallel to each other and in a staggered pattern within the cooling component 2. Here, the first fluid passage CH1 and the second fluid passage CH2 are separated into layers, or are formed as a single layer but are offset in the height direction. In this embodiment, the second fluid passage CH2 flows on the lower side and the first fluid passage CH1 flows on the upper side, so that the fluids flowing inside each other do not mix. It is sufficient that the liquids in the first fluid passage CH1 and the second fluid passage CH2 do not mix by separating them into two layers or by offsetting them in the height direction, so it is also acceptable to have the first fluid passage CH1 on the lower side and the second fluid passage CH2 flowing above it.

[0205] Generally, the longer the first fluid passage CH1 and other flow paths become, the lower the heat dissipation effect. However, in this embodiment, the fluid flows between the first inlet Pi1 and the first outlet Po1 without folding back. Therefore, although there are differences between the cooling component 2 and the fluid component 5, which is also used for cooling, the heat dissipation efficiency is higher than that of the flow path component 5 in Figure 3, which is formed by folding back a single flow path in the opposite direction, because the flow path can be shorter.

[0206] This configuration allows the cooling fluids in the adjacent first fluid passage CH1 and second fluid passage CH2 to flow in opposite directions, resulting in a relatively uniform temperature distribution for the cooling component 2. This makes it less likely for extremely hot areas to form, thus reducing the likelihood of the heterogeneous integrated semiconductor packaging structure I overheating, malfunctioning, and burning.

[0207] Here, since the temperature of the cooling fluid at the first inlet Pi1 and the second inlet Pi2 is relatively low, the cooling fluid continuously exchanges heat with the main body of the cooling component 2 as it flows along the first flow path CH1 and the second flow path CH2. As a result, the cooling fluid flows to the first outlet Po1 and the second outlet Po2, where it reaches its highest temperature.

[0208] However, since the first outlet Po1 and the second outlet Po2 are directly adjacent to the first inlet Pi1 and the second inlet Pi2 into which a lower-temperature fluid flows, the temperatures cancel each other out, making it difficult for extremely hot areas to form, and thus making it less likely for the heterogeneous integrated semiconductor packaging structure I to overheat, malfunction, and burn.

[0209] Therefore, according to the configuration of the above embodiment, the temperature at various points within the cooling component 2 can be made nearly uniform. This improves the uniformity of the temperature distribution on the surface of the heterogeneous integrated semiconductor packaging structure I.

[0210] Furthermore, in the embodiment shown in Figure 9B, the cooling unit 2 includes a first inlet Pi1, a first outlet Po1, a second inlet Pi2, a second outlet Po2, a first helical flow path CS1, and a second helical flow path CS2.

[0211] Of these, the first inlet Pi1 and the first outlet Po1 are located at opposite ends of the first helical channel CS1, respectively, while the second inlet Pi2 and the second outlet Po2 are located at opposite ends of the second helical channel CS2.

[0212] Here, the first inlet Pi1 and the second outlet Po2 are positioned approximately in the center of the cooling component 2, while the first outlet Po1 and the second inlet Pi2 are positioned at two corners of the cooling component 2 that are diagonally opposite each other, and these are located at the furthest distance from each other.

[0213] Furthermore, the second helical channel CS2 spirally surrounds the first helical channel CS1, and the direction of cooling fluid flow is opposite between adjacent first and second helical channels CS1 and CS2. In short, the first and second helical channels CS1 and CS2 are formed alternately from the center outwards.

[0214] Therefore, in this embodiment, the cooling component 2 is not limited to a parallel flow path configuration, and a nearly uniform temperature distribution can be achieved, similar to Figure 9A. Furthermore, unlike the configuration in Figure 9A, there is no need for a two-layer configuration or to form a single layer while shifting it in the height direction, making the formation method simpler. Moreover, there is no height difference caused by having two layers or by shifting a single layer in the height direction, so both the first helical flow path CS1 and the second helical flow path CS2 can be cooled while in direct contact.

[0215] Furthermore, in other embodiments, the flow path design can employ other geometric shapes. Also, the number of inlets and outlets for the cooling fluid is not limited to two; generally, the more inlets and outlets there are, the higher the heat dissipation efficiency, as the cooled liquid can be released before it warms up completely.

[0216] The following will be explained with reference to Figure 10. Here, Figure 10 is a cross-sectional view illustrating a coating process in a 15th embodiment of the cooling system for heterogeneous integrated semiconductor packaging structures of the present invention.

[0217] Because copper has high thermal conductivity, most conventional liquid cooling plates (cooling components 2) are made of copper.

[0218] However, conventional copper liquid cooling plates typically have flow paths manufactured using machining methods such as die casting, shoveling, and milling. As a result, the surface tends to be rough, leading to a high coefficient of friction and significant pressure loss when the cooling fluid flows through it.

[0219] To solve these problems, conventional technology increased fluid pressure by operating pumps at high speeds. However, this increased power consumption and thus cost, and also increased the risk of cooling fluid leakage.

[0220] On the other hand, since copper is easily oxidized, it is common practice to prevent copper oxidation by adding a nickel plating layer to the surface of the flow channel using electroplating. However, since the thermal conductivity of nickel (97.5 W / mK) is much lower than that of copper (398 W / mK), adding a nickel plating layer reduces the efficiency of the liquid cooling plate (cooling component 2).

[0221] To solve the above problems, the embodiment shown in Figure 10 provides a novel coating method for the cooling fluid flow path within the cooling component 2. The coating in this embodiment has high thermal conductivity (approximately 400-1000 W / mk).

[0222] In fact, this value is even higher than that of cooling component 2, which is made of copper, so it does not affect the heat exchange or heat dissipation effect.

[0223] Furthermore, this coating can significantly reduce the roughness of the flow path surface and effectively suppress pressure drop in the cooling fluid.

[0224] Furthermore, because the coating on the flow channel surface is extremely fine, it suppresses the growth of microorganisms, prevents foreign matter from adhering, and makes it less likely for the flow channel to become blocked, significantly improving its lifespan and allowing for excellent heat dissipation over a long period of time.

[0225] The following describes the hardware configuration and related procedures required for the coating process in the 15th embodiment of the present invention. As shown in Figure 10, the cooling component 2 includes a flow path 29, a fluid inlet 91, and a fluid outlet 92 inside. Both ends of the flow path 29 are connected to the fluid inlet 91 and the fluid outlet 92, respectively.

[0226] Furthermore, the fluid inlet 91 is connected to a precursor gas supply device 93.

[0227] The fluid outlet 92 is connected to the negative pressure generator 94. The cooling component 2 is electrically connected to the power supply unit 95, with the negative terminal of the power supply unit 95 connected to the cooling component 2 and the positive terminal grounded.

[0228] In this embodiment, the cooling component 2 is first exhausted by the negative pressure generating device 94.

[0229] Next, the precursor gas is supplied from the precursor gas supply device 93 into the cooling component 2, and the flow rate of the precursor gas is controlled. The vacuum level inside the cooling component 2 is 10 -1 ~10 -4 It is maintained during torr.

[0230] Here, the precursor gas includes, but is not limited to, alkanes, alkynes, silanes, and TEOS (tetraethoxysilane). Next, when the power supply device 95 is started, plasma is generated on the inner wall surface of the flow path 29 of the cooling component 2, and a diamond-like film 90 is deposited.

[0231] The following provides the process parameters for this embodiment, where the power supply device 95 supplies pulsed DC with a voltage between 350 volts and 1000 volts.

[0232] The pulse period is between 5 μs and 35 μs, and the pulse frequency is 21 kHz. The flow rate supplied by the precursor gas supply device 93 may also be between 2 sccm and 7 sccm.

[0233] In other embodiments, argon gas (Ar) may be introduced first before the precursor gas is introduced into the channel 29 of the cooling component 2. The plasma cleaning step is performed first to remove organic contaminants from the surface of the channel 29.

[0234] Furthermore, after the plasma cleaning step, silane gas can be introduced first before the precursor gas is introduced into the flow path 29 of the cooling component 2. The amorphous silicon film layer is pre-coated to improve the adhesion of the subsequent diamond-like film 90.

[0235] As described above, the diamond-like film 90 in the above embodiment has at least the following advantages. The diamond-like film 90 is dense, has a smooth surface and a low coefficient of friction, and can effectively suppress pressure drop.

[0236] Here, the diamond-like film 90 has high thermal conductivity, which improves heat dissipation efficiency. Furthermore, the diamond-like film 90 has high hardness, so even when using nanofluidic cooling technology that adds nanoparticles to the coolant, it can withstand high-speed collisions of nanoparticles, thereby reducing wear on the inner wall.

[0237] Furthermore, the Diamond-Like Film 90 is corrosion-resistant, and its surface roughness is smaller than that of bacteria, thus suppressing the attachment and proliferation of microorganisms. In addition, the Diamond-Like Film 90 employs a vacuum deposition method, eliminating the problem of waste liquid discharge and disposal, and thus minimizing its adverse impact on the environment.

[0238] Although the present invention has been described above through these embodiments, these embodiments are not intended to limit the scope of the present invention to those described in the embodiments. Furthermore, those skilled in the art can make minor modifications and embellishments without departing from the spirit and scope of the present invention, and such modifications are also included within the technical scope of the present invention. Moreover, the technical scope of the present invention is determined based on the claims. [Explanation of Symbols]

[0239] 2 Cooling components 3. Enhanced Support 4. Cooling fluid drive module 5. Flow channel components 6. Compression spring 7 Barbs 8. Fluid supply module 11 Controllers 12 sensors 13 Fluid drive unit 14 Cooling liquid distribution device 15 Remote device 20 Internal Chambers 21 Aperture 22 Fluid supply hole 23 Main Fluid Chamber 24 Fluid supply chamber 25 Fluid recovery chamber 26 Fluid recovery holes 27 Cooling Chamber 28 Recovery Chamber 29 Flow channels 31 Thermally conductive fasteners 32 Heat sink 33 Reinforcement plate 34 Aperture 41 Cooling fluid passage 51 Fluid passage 52 Protrusion 53 First projection sealing unit 54 Second protruding sealing unit 55 Oxygen-free copper sealing parts 60 Fluid Storage Units 61 Fluid supply module 62 Fluid Recovery Module 63 Fluid supply pipeline 64 Fluid Recovery Pipeline 70 Set screws 71 Fluid storage unit 72 Fluid supply pipeline 73 Fluid Recovery Pipeline 74. First fluid pump 75. Second fluid pump 81 Fluid supply pump 82 Fluid distribution valve 83 First inlet pipe 84 Second inlet pipe 85 First fluid supply pump 86 Second fluid supply pump 87 First outlet pipe 88 Second outlet pipe 90 Diamond-like film 91 Fluid inlet 92 Fluid outlet 93 Precursor gas supply device 94. Negative pressure generator 95 Power supply device 131 Drive Circuit 132 pumps 201 Perforation 270 Through hole 610 Liquid supply pump 620 Gas recovery pump 831 Entrance hole 841 Entrance hole Circuit board B B1 through hole B2 through hole C Hollow Chamber C1 First fluid chamber C2 Second fluid chamber CH1 First fluid passage CH2 Second fluid passage CS1 First spiral channel CS2 Second spiral channel I. Heterogeneous Integrated Semiconductor Packaging Structure Ia First heating element Ib Second heat-generating part S-type chip socket Pi1 First Entrance Pi2 Second Entrance Po1 First Exit Po2 Second Exit

Claims

[Claim 1] A cooling system for heterogeneous integrated semiconductor packaging structures, The heterogeneous integrated semiconductor packaging structure is arranged on a circuit board. The cooling system for the heterogeneous integrated semiconductor packaging structure includes cooling components. The cooling component is provided on the heterogeneous integrated semiconductor packaging structure. It further includes reinforced support and cooling fluid drive modules, The reinforced support is provided on the circuit board and in contact with the cooling component, the cooling component includes a vapor chamber, The reinforced support includes a cooling fluid passage, which is connected to the cooling fluid drive module, and the cooling fluid drive module is suitable for supplying cooling fluid to the cooling fluid passage. The aforementioned reinforcing support is a reinforcing plate used to reinforce the strength of the circuit board. A cooling system for heterogeneous integrated semiconductor packaging structures, characterized by the following features.

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