Load lock chamber and cleaning method thereof, and semiconductor device.

Abstract

The present application relates to a load lock chamber, a cleaning method thereof, and a semiconductor device. The load lock chamber includes a chamber body. At least one load lock chamber is configured therein, and the chamber body has an intake section and an exhaust section communicating with each load lock chamber. The chamber body has at least one dispersion section, each of which is arranged corresponding to one load lock chamber, and each dispersion section includes a plurality of independently provided dispersion holes, each of which communicates between the intake section and the corresponding load lock chamber and is configured to distribute an airflow entering the corresponding load lock chamber.

Description

Cross-reference to Related Applications

[0001] This application claims the priority of a Chinese patent application with application number 2022117304102, filed on December 30, 2022, and incorporates the full text thereof herein by reference for all purposes.

Technical Field

[0002] This application relates to the technical field of semiconductors, and particularly to a load lock chamber, a cleaning method thereof, and a semiconductor device.

Background Art

[0003] Semiconductor devices for substrate (e.g., wafer) processing generally include an equipment front-end module (EFEM), a load lock chamber, a transfer chamber, a process module, etc. During substrate processing, the substrate needs to enter and exit the load lock chamber through the equipment front-end module in an atmospheric pressure environment and enter and exit the reaction chamber through the transfer chamber in a vacuum environment.

[0004] In actual production situations, due to the pressure difference between the reaction chamber, the transfer chamber, the load lock chamber, and the equipment front-end module, a large amount of fine particles remaining from chemical reactions, atmospheric dust, and fine particles inevitably enter the load lock chamber, thereby contaminating the inner wall of the load lock chamber and the substrate in the load lock chamber, and affecting the yield rate of the substrate.

[0005] Typically, manufacturers create product maintenance cycles tailored to equipment usage, including periodic disassembly and cleaning of the load lock chamber. However, this cleaning method is time-consuming and labor-intensive, as it often requires significant disassembly and reassembly. Furthermore, there is still a risk of circuit board contamination during the maintenance cycle, which is detrimental to improving the yield rate of good circuit boards. [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] Various embodiments of the present application provide a load lock chamber, a method for cleaning the same, and a semiconductor device. [Means for solving the problem]

[0007] The load lock chamber is The chamber body includes at least one load lock chamber formed internally, and an intake section and an exhaust section communicating with each of the load lock chambers, The chamber body has at least one dispersion section, each of which is arranged in correspondence with one of the load lock chambers, and each of which dispersion sections includes a plurality of independently provided dispersion holes, each of which is configured to communicate the intake section with the corresponding load lock chamber and to disperse the airflow that enters the corresponding load lock chamber.

[0008] In one embodiment, the load lock chamber is for loading a substrate, In the height direction of the chamber body, at least one of the dispersion units is located above the substrate in the corresponding load lock chamber, and the outlets of the dispersion holes of at least one of the dispersion units are all formed toward the side where the substrate is located.

[0009] In one embodiment, in a plane perpendicular to the height direction of the chamber body, the orthographic projection of at least one of the dispersion portions covers the orthographic projection of the substrate in the corresponding load lock chamber.

[0010] In one embodiment, at least two layers of the dispersion portion corresponding to at least one load lock chamber are arranged. The at least two layers of dispersion are spaced apart along the airflow path, and the projections of the at least two layers of dispersion onto a plane perpendicular to the spacing direction of the dispersion holes are offset from each other.

[0011] In one embodiment, the chamber body is configured with a return air chamber and return air holes, the return air chamber is in communication with the exhaust section, and each load lock chamber is provided with a plurality of corresponding return air holes, and the spaces between the return air holes in the same load lock chamber are provided independently and communicate with the return air chamber and the load lock chamber, respectively.

[0012] In one embodiment, the dispersion section and the return air vent corresponding to each load lock chamber are arranged on opposite sides of the load lock chamber.

[0013] In one embodiment, the chamber body includes a top lid and a side plate, the top lid is placed over the side plate and both partition at least one load lock chamber, the top lid is provided with an intake section and at least one dispersion section is provided on the top lid.

[0014] In one embodiment, the chamber body has an intake chamber that communicates with the intake section, at least one of the dispersion sections separates the intake chamber from the corresponding load lock chamber, and the dispersion holes in at least one of the dispersion sections communicate the intake chamber and the load lock chamber.

[0015] In one embodiment, the chamber body includes at least one partition, and the at least one partition divides the internal space of the chamber body to form a plurality of independent load lock chambers. At least one of the partitions comprises an intake chamber and a dispersion section that communicate with at least one load lock chamber formed by being partitioned by itself.

[0016] In one embodiment, the multiple load lock chambers are arranged sequentially along the height direction of the chamber body, and the intake section communicating with the intake chamber is located on the side of the chamber body.

[0017] In one embodiment, each of the at least one load lock chamber is connected to one intake section and one exhaust section.

[0018] In one embodiment, a gas homogenization space is formed between the at least one dispersion section and the upper lid, and the gas entering from the intake section flows and diffuses through the gas homogenization space.

[0019] In one embodiment, a plurality of load lock chambers are provided, and the plurality of load lock chambers are independent of each other and share one intake chamber and one intake section.

[0020] In one embodiment, a plurality of load lock chambers are provided, the plurality of load lock chambers are independent of each other, and each of the plurality of load lock chambers is provided with one intake chamber and one intake section.

[0021] The semiconductor device includes a load lock chamber as described in any of the above embodiments.

[0022] The method for cleaning the load lock chamber is: A step of opening the intake and exhaust portions of the chamber body of the load lock chamber, wherein the chamber body has a load lock chamber and a dispersion portion, the intake portion and the exhaust portion both communicate with the load lock chamber, each dispersion portion is arranged corresponding to one load lock chamber, and each dispersion portion includes a plurality of independently provided dispersion holes, each dispersion hole communicates with the intake portion and the corresponding load lock chamber, The procedure includes the step of introducing a cleaning gas into the intake until a predetermined condition is met.

Brief Description of the Drawings

[0023] To more clearly explain the technical means in the embodiments of the present application or the prior art, the drawings necessary for the description of the embodiments or the prior art will be briefly described below. As is clear, the drawings in the following description are only the embodiments of the present application, and those skilled in the art can obtain other drawings based on the disclosed drawings without creative labor. [Figure 1] It is a perspective view of a load lock chamber according to some embodiments of the present application. [Figure 2] It is another perspective view of the load lock chamber shown in FIG. 1. [Figure 3] It is a side view of the load lock chamber shown in FIG. 1. [Figure 4] It is a cross-sectional view taken along the line A-A of FIG. 3. [Figure 5] It is a cross-sectional view taken along the line B-B of FIG. 3. [Figure 6] It is a schematic configuration diagram of a semiconductor device according to some embodiments of the present application.

Modes for Carrying Out the Invention

[0024] To make the above objects, features, and advantages of the present application clearer and easier to understand, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0025] In the description of this application, directions or positional relationships indicated by terms such as "center," "vertical direction," "horizontal direction," "length," "width," "thickness," "top," "bottom," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," "counterclockwise," "axial direction," "radial direction," and "circumferential direction" are the directions or positional relationships shown in the drawings and are used only to facilitate or simplify the explanation of this application. It should be understood that these terms do not necessarily indicate or imply that the shown device or component has a specific direction, or a specific directional structure and operation, and therefore should not be interpreted as limiting this application.

[0026] Furthermore, the terms “first” and “second” are used solely to describe the purpose and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features shown. Thus, features limited to “first” and “second” may explicitly or implicitly include at least one such feature. In the description of this application, unless otherwise clearly and specifically defined, “plural” means at least two, for example, two, three, etc.

[0027] In this application, unless otherwise specifically defined and limited, terms such as “attachment,” “connection,” and “connection” should be understood in a broad sense. For example, these may be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, direct connections, indirect connections via an intermediate medium, internal communication between two elements, or interaction relationships between two elements. A person skilled in the art will be able to understand the specific meaning of these terms in this application depending on the specific circumstances.

[0028] In this application, unless otherwise explicitly stated or limited, the presence of a first feature "above" or "below" a second feature may include direct contact between the first and second features, or indirect contact between them via an intermediate medium. Furthermore, the presence of a first feature "above," "above," and "on the top surface" of a second feature may include the first feature being directly above or diagonally above the second feature, or simply indicate that the horizontal height of the first feature is greater than that of the second feature. The presence of a first feature "below," "below," and "on the bottom surface" of a second feature may include the first feature being directly below or diagonally below the second feature, or simply indicate that the horizontal height of the first feature is lower than that of the second feature.

[0029] When an element is referred to as "fixed" or "installed" to another element, it may exist directly on the other element or there may be an intervening element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intervening element simultaneously. The terms “vertical,” “horizontal,” “up,” “down,” “left,” “right,” and similar expressions used herein are for illustrative purposes only and do not represent only one embodiment.

[0030] As described in the background information, conventional methods often involve disassembling and cleaning the load lock chamber, but this method is time-consuming and detrimental to improving the yield rate of good circuit boards.

[0031] The load lock chamber, as a relay point for substrate transport, has the capability to frequently switch between a vacuum state and an atmospheric pressure state. When the equipment front-end module moves a substrate into or out of the load lock chamber, the load lock chamber needs to be switched to an atmospheric pressure state. When the transfer chamber moves a substrate into or out of the load lock chamber, the load lock chamber needs to be switched to a vacuum state. In other words, the load lock chamber is equipped with intake and exhaust ports to support switching between a vacuum state and an atmospheric pressure state.

[0032] In related technologies, the intake and exhaust ports of a load lock chamber are mainly used to change the atmospheric pressure environment inside the load lock chamber, and have little cleaning effect on the inside of the load lock chamber. The inventors of the present invention thoroughly investigated the cause and found that in related technologies, both the intake and exhaust ports of the load lock chamber are located on two opposing sides of the load lock chamber, and there are only one or two of them. When a large amount of gas is introduced into the load lock chamber because the intake port of the load lock chamber communicates directly with the inside of the load lock chamber, a vortex airflow is easily formed inside the load lock chamber. When the vortex airflow flows to the exhaust port, the airflow distribution is locally concentrated and cannot effectively contact the inner walls of each part of the load lock chamber. As a result, the removal effect on fine particles and dust adhering to some parts of the inner wall of the load lock chamber is limited, and it becomes necessary to periodically disassemble and clean the load lock chamber, which leads to the above technical problem.

[0033] To address the above technical challenges, the inventors of this invention provide a load lock chamber that improves the uniformity of the airflow distribution within the load lock chamber by changing the airflow state within the load lock chamber, further improves the uniform contact effect between the airflow and the inner wall of the load lock chamber, enhances the cleaning effect of the airflow on the inner wall of the load lock chamber, effectively reduces the frequency of disassembly and cleaning of the load lock chamber, saves time and effort, and improves the cleanliness of the inner wall of the load lock chamber during maintenance periods, thereby providing an advantage in improving the yield rate of substrates. The load lock chamber according to the embodiment of this application will be described in detail below.

[0034] Figures 1 to 5 are schematic diagrams of load lock chambers according to several embodiments of the present application.

[0035] As shown in Figures 1, 2, 3, and 4, a load lock chamber 100 according to some embodiments of the present application includes a chamber body 10. The chamber body 10 has at least one load lock chamber Q1 inside, and the chamber body 10 has an intake section I and an exhaust section O communicating with each load lock chamber Q1. The chamber body 10 has at least one dispersion section 10a. Each dispersion section 10a is arranged corresponding to one load lock chamber Q1. Each dispersion section 10a includes a plurality of independently provided dispersion holes k1. Each dispersion hole k1 communicates with the intake section I and the corresponding load lock chamber Q1, and disperses the airflow that enters the corresponding load lock chamber Q1.

[0036] The number of load lock chambers Q1 may be one or more. If multiple load lock chambers Q1 are provided, one intake section I and one exhaust section O may be provided for each load lock chamber Q1, that is, all load lock chambers Q1 may share one intake section I and one exhaust section O, or one intake section I and one exhaust section O may be provided independently for each load lock chamber Q1, that is, one intake section I and one exhaust section O may be provided for each load lock chamber Q1, with multiple intake sections I being independent of each other and multiple exhaust sections O being independent of each other. Each intake section I may include one or more intake holes, and each exhaust section O may include one or more exhaust holes. An air supply device is connected to the intake section I, and an exhaust device is connected to the exhaust section O. The air supply device may supply nitrogen gas, an inert gas, etc. The exhaust device may include a vacuum pump. In practical applications, to reduce the amount of air supply and exhaust equipment, each intake section I and each exhaust section O includes one intake port and one exhaust port, respectively.

[0037] The dispersion section 10a may be integrally molded with the chamber body 10 as part of the chamber body 10, or it may be fixed to the chamber body 10. The fixing method may be the usual installation method in this art (e.g., clamping connection, welding, etc.), which will not be explained here.

[0038] Each load lock chamber Q1 is provided with a corresponding dispersion section 10a to disperse the airflow entering the load lock chamber Q1. Specifically, the dispersion section 10a includes a plurality of dispersion holes k1. Each dispersion hole k1 is provided independently of the others, meaning that the gas can pass through each dispersion hole k1 of the same dispersion section 10a at the same time during its flow before entering the same load lock chamber Q1. The cross-sectional shape of each dispersion hole k1 may be circular, square, polygonal, or other, and this invention is not limited thereto.

[0039] In each load lock chamber Q1, the airflow enters the intake section I, passes through its corresponding dispersion section 10a, and is dispersed by the dispersion holes k1 of the dispersion section 10a, flowing as multiple small airflows. During the dispersion process, the kinetic energy of the airflow is lost, the airflow velocity decreases, and finally it enters the load lock chamber Q1 uniformly.

[0040] Compared to conventional technology, the dispersion holes k1 in each dispersion section 10a of each load lock chamber Q1 disperse the airflow and reduce its velocity, effectively preventing the airflow from concentrating and becoming a vortex. This makes the gas distribution within the load lock chamber Q1 more uniform, significantly increasing the probability of contact between the airflow and the inner wall of the load lock chamber Q1. This improves the effectiveness of removing fine particles and dust adhering to the inner wall of the load lock chamber Q1 by airflow, extending the maintenance cycle of the load lock chamber 100, reducing maintenance costs, and contributing to an improved yield rate of substrates 500. By providing the dispersion section 10a, the actual weight of the load lock chamber 100 can be reduced, contributing to a reduction in the overall weight of the chamber, which is more advantageous for manual transport and assembly.

[0041] In some embodiments, as shown in Figure 4, the load lock chamber 100 is for loading the substrate 500. In the height direction of the chamber body 10, at least one dispersion section 10a is located above the substrate 500 in the corresponding load lock chamber Q1, and the outlets of its dispersion holes k1 are all formed toward the side where the substrate 500 is located.

[0042] Each load lock chamber Q1 may be provided with a support seat 20. The support seat 20 supports the substrate 500 loaded into the load lock chamber Q1. The structural form of the support seat 20 is not limited and may consist of, for example, multiple support columns provided within the load lock chamber Q1.

[0043] In the operating state of the load lock chamber 100, the height direction of the chamber body 10 is parallel to the direction of gravity. When the substrate 500 is supported by the support seat 20, in the height direction, the substrate 500 is located between the dispersion section 10a and the support seat 20.

[0044] In the embodiments shown in Figures 1, 2, and 3, the load lock chamber 100 has a substantially rectangular parallelepiped structure, the first direction X is the width direction of the load lock chamber 100, the second direction Y is the length direction of the load lock chamber 100, and the third direction Z is the height direction of the load lock chamber 100.

[0045] The outlet of the dispersion hole k1 is formed facing the side where the substrate 500 is located, indicating that the gas flowing out from the outlet of the dispersion hole k1 flows toward the side where the substrate 500 is located. At this time, because the velocity of the airflow is low, as the airflow passes over the substrate 500 below the dispersion section 10a, it removes fine particles and dust that have fallen onto the substrate 500, improving the cleanliness of the substrate 500, reducing the probability of the substrate 500 being corroded by fine particles and dust, and further improving the yield rate of good substrates 500.

[0046] Furthermore, the dispersion unit 10a is positioned above the substrate 500 in the load lock chamber 100 and can face the substrate 500 on the support seat 20. As a result, the airflow dispersed by the dispersion unit 10a can effectively cover most of the substrate 500, resulting in a better cleaning effect on the substrate 500.

[0047] In other embodiments, each dispersion unit 10a may be positioned at a different location in each load lock chamber Q1. For example, the dispersion unit 10a may be positioned on the inner wall of the load lock chamber Q1 in the width or length direction. Since the dispersion unit 10a has a plurality of dispersion holes k1, and the dispersion holes k1 can disperse the airflow concentrated from the intake unit I and reduce its velocity, regardless of where the dispersion unit 10a is positioned on the support seat 20, the uniformity of the airflow distribution within the load lock chamber Q1 can be improved, and the probability of contact between the airflow and the inner wall of the load lock chamber Q1 can be improved, thereby improving the degree of cleaning of the inside of the load lock chamber Q1. The arrangement of the dispersion unit 10a is not specifically limited in the embodiments of the present application.

[0048] In a specific embodiment, as shown in Figure 4, in the height direction of the chamber body 10, the orthogonal projection of at least one dispersion portion 10a onto the XY plane covers the orthogonal projection of the substrate 500 in the corresponding load lock chamber Q1 onto the XY plane. When the dispersion portion 10a is located above the support seat 20 and its orthogonal projection onto the substrate 500 covers the substrate 500, the area of ​​the dispersion portion 10a in the plane perpendicular to the height direction (i.e., the XY plane) is large, allowing the airflow to be sent to most of the space in the load lock chamber Q1, increasing the probability of contact between the airflow and the inner wall of the load lock chamber Q1, and contributing to an improved cleaning effect on the inner wall of the load lock chamber Q1.

[0049] In some embodiments, as shown in Figure 4, at least two layers of dispersion sections 10a corresponding to at least one load lock chamber Q1 are arranged, all dispersion sections 10a are spaced apart along the airflow path, and the projections of the dispersion holes k1 of at least two dispersion sections 10a onto a plane perpendicular to the spacing direction are offset from each other. As can be seen from Figure 4, at least two dispersion sections 10a are spaced apart in the Z direction, and the projections of the dispersion holes k1 of two adjacent dispersion sections 10a onto the XY plane do not overlap.

[0050] The airflow path is the path through which gas flows from the intake section I to the load lock chamber Q1. When each dispersion section 10a is arranged at intervals along the airflow path, the gas can flow through each dispersion section 10a in sequence.

[0051] The spacing direction refers to the spacing direction of each dispersion section 10a. In a plane perpendicular to the spacing direction (defined as a reference plane), the dispersion holes k1 of at least two dispersion sections 10a (specifically, the first dispersion section a1) are offset from each other, that is, the projections of the dispersion holes k1 of at least two dispersion sections 10a onto the reference plane do not intersect each other. Specifically, the dispersion holes k1 of two adjacent dispersion sections 10a may be offset from each other on the reference plane perpendicular to the spacing direction, and the dispersion holes k1 of two dispersion sections 10a separated in the spacing direction by a certain dispersion section 10a may be offset from each other on the reference plane perpendicular to the spacing direction.

[0052] When the airflow passes through the staggered dispersion holes k1 in the multilayer dispersion section 10a, it can be dispersed multiple times, dissipating its kinetic energy. In this way, the airflow flowing into the load lock chamber Q1 can be more dispersed and made uniform, and the flow velocity can be slower, preventing the airflow from colliding with the substrate 500 and damaging it due to excessively high velocity, thus contributing to an improvement in the yield rate of the substrate 500.

[0053] In some embodiments, as shown in Figure 5, the chamber body 10 is configured with a return air chamber Q3 and return air vents k2. The return air chamber Q3 communicates with the exhaust section O. Each load lock chamber Q1 is provided with a corresponding number of return air vents k2. Each return air vent k2 in the same load lock chamber Q1 is independently provided and communicates with the return air chamber Q3 and the load lock chamber Q1.

[0054] The return air vents k2 are provided on the inner wall of each load lock chamber Q1, and each load lock chamber Q1 is provided with multiple return air vents k2. Each return air vent k2 communicates with the return air chamber Q3, and the gas in the load lock chamber Q1 enters the return air chamber Q3 through each return air vent k2 before being discharged outside the chamber body 10 via the return air chamber Q3 and the exhaust section O.

[0055] A return air chamber Q3 may be arranged corresponding to one load lock chamber Q1, and the gas in each load lock chamber Q1 enters the corresponding return air chamber Q3 via a return air vent k2 above it, and is then discharged outside the chamber body 10 via an exhaust section O. A return air chamber Q3 may be arranged corresponding to multiple load lock chambers Q1, and the gas in multiple load lock chambers Q1 enters the same return air chamber Q3 via their respective return air vents k2, and is then discharged outside the chamber body 10 via an exhaust section O.

[0056] In this case, the gas in each load lock chamber Q1 can be dispersed through each return air vent k2 into the return air chamber Q3 before flowing to the exhaust section O. Compared to the conventional method of discharge through a single exhaust vent, in this invention, when gas flows out of the load lock chamber Q1, it does not concentrate in one place but is dispersed and flows out from multiple locations in the load lock chamber Q1, improving the effect of uniform distribution of airflow within the load lock chamber Q1 and further improving the cleaning effect of the inner wall of the load lock chamber Q1. At the same time, the provision of the return air chamber Q3 also contributes to reducing the weight of the load lock chamber 100.

[0057] In a specific embodiment, the dispersion section 10a and return air vent k2 corresponding to each load lock chamber Q1 are arranged on opposite sides of the load lock chamber Q1. Specifically, the dispersion section 10a and return air vent k2 may be arranged on both sides in the height direction of the load lock chamber Q1, or on both sides in the width direction (or length direction) of the load lock chamber Q1, and are not particularly limited.

[0058] The dispersion section 10a and the return vents k2 are arranged opposite each other. When gas flows out from each dispersion vent k1 of the dispersion section 10a, it basically flows along a straight path to each return vent k2. The airflow bends minimally within the load lock chamber Q1 and can pass through most of the area located within the spatial range on both sides, resulting in a large cleaning range and improved cleaning effect on the load lock chamber Q1.

[0059] In some embodiments, as shown in Figure 4, the chamber body 10 includes a top lid 11 and side plates 12. The top lid 11 is placed over the side plates 12, and both partition at least one load lock chamber Q1. The top lid 11 is provided with an intake section I, and a dispersion section 10a is provided on the top lid 11.

[0060] The top cover 11 is placed over the side plates 12 in the height direction of the chamber body 10. The top cover 11 and the side plates 12 define at least one load lock chamber Q1. When the top cover 11 and the side plates 12 partition multiple load lock chambers Q1, the multiple load lock chambers Q1 are arranged adjacent to each other in the width direction and / or length direction of the chamber body 10. When the top cover 11 and the side plates 12 define a load lock chamber Q1, it means that the top cover 11 and the side plates 12 form at least a portion of the inner wall of the load lock chamber Q1.

[0061] The intake section I provided on the top cover 11 is the first intake section I1, and the first intake section I1 is located above the connected load lock chamber Q1, meaning that the load lock chamber Q1 draws in air from above, in which case the intake path is short and the intake velocity is fast.

[0062] Furthermore, a gas homogenization space W is formed between the dispersion section 10a and the upper lid 11. The gas entering from the intake section I first enters the gas homogenization space W, flows and diffuses within the gas homogenization space W, and then flows to the load lock chamber Q1 through each dispersion hole k1 in the dispersion section 10a that communicates with the gas homogenization space W.

[0063] In this case, the airflow that enters the load lock chamber Q1 through the intake I in the top cover 11 flows from top to bottom (i.e., flows along the direction indicated by the arrow inside the chamber body 10 shown in Figure 4), effectively cleaning the substrate 500 on the support seat 20.

[0064] In further embodiments, as shown in Figures 3 and 4, the chamber body 10 further includes a base 13. The base 13 is provided below the side plates 12, and the top lid 11, side plates 12, and base 13 together form the internal space of the chamber body 10. The base 13 and side plates 12 may be integrally molded or may be provided separately and fixedly connected. The top lid 11, base 13, and side plates 12 are sealed together.

[0065] In some embodiments, as shown in Figure 4, the chamber body 10 has an intake chamber Q2 that communicates with the intake section I, and at least one dispersion section 10a separates the intake chamber Q2 from the corresponding load lock chamber Q1, and the dispersion holes k1 above it connect the intake chamber Q2 and the load lock chamber Q1.

[0066] The intake chamber Q2 is a space formed within the chamber body 10, and communicates with at least one intake section I, and communicates with the corresponding load lock chamber Q1 via at least one distribution section 10a. One intake chamber Q2 and one intake section I may be provided for one load lock chamber Q1, or one intake chamber Q2 and one intake section I may be provided for multiple load lock chambers Q1, that is, multiple load lock chambers Q1 share one intake chamber Q2 and one intake section I. The installation method of the intake chamber Q2, intake section I and load lock chamber Q1 is not limited in the embodiments of this application.

[0067] The partition portion 14 separates the intake chamber Q2 from the corresponding load lock chamber Q1. In this case, the partition portion 14 may be a part integrally molded with the chamber body 10, and together with the other parts of the chamber body 10, it surrounds and forms the intake chamber Q2.

[0068] In this case, the gas entering from the intake section I first passes through the intake chamber Q2, then disperses through the dispersion holes k1 on the partition section 14 before entering the load lock chamber Q1. The position of the intake section I can be flexibly set.

[0069] In some embodiments, as shown in Figures 4 and 5, the chamber body 10 includes at least one partition 14. All partitions 14 divide the internal space of the chamber body 10 into a plurality of independent load lock chambers Q1. At least one partition 14 comprises an intake chamber Q2 and a dispersion section 10a that communicate with at least one load lock chamber Q1 formed by partitioning itself.

[0070] The partition 14 may be integrally molded with the chamber body 10, or it may be fixedly connected to the chamber body 10, as long as it is possible to ensure that the load lock chambers Q1 are independent of each other. The multiple partitions 14 may be spaced apart along the height direction of the chamber body 10, or spaced apart along the width direction or length direction of the chamber body 10, and are not particularly limited.

[0071] At least one partition section 14 has an intake chamber Q2 and a distribution section 10a (specifically, a second distribution section a2), meaning that the partition section 14 acts as a gas flow intermediary, transporting gas to the load lock chamber Q1 that it separates and forms. The distribution section 10a provided in the partition section 14 may be integrally molded with other parts of the partition section 14, or it may be provided separately and fixedly, and is not specifically limited.

[0072] In this case, the partition 14 divides the internal space of the chamber body 10 into multiple load lock chambers Q1, improving the relay capability of the load lock chamber 100 and contributing to improved production efficiency of the semiconductor device 1000 in which the load lock chamber 100 is located. At the same time, the intake chamber Q2 contributes to reducing the overall weight of the load lock chamber 100.

[0073] In a further embodiment, as shown in Figure 4, all load lock chambers Q1 are arranged sequentially along the height direction of the chamber body 10, and the intake section I, which communicates with the intake chamber Q2, is located on the side of the chamber body 10.

[0074] This indicates that the load lock chamber Q1 is provided adjacent to the chamber body 10 along the height direction, and the partition 14 extends along the length or width direction of the chamber body 10. If the partition 14 has an intake chamber Q2 and the intake section I is located on the side of the chamber body 10, the distance between the intake section I and the intake chamber Q2 is short, which shortens the gas inflow distance from the intake section I to the intake chamber Q2 and speeds up the transport of gas to the load lock chamber Q1.

[0075] In some embodiments, each load lock chamber Q1 is connected to an intake section I and an exhaust section O in a one-to-one correspondence. That is, one load lock chamber Q1 is connected to one intake section I and one exhaust section O. This allows each corresponding load lock chamber Q1 to independently perform intake and exhaust, providing different pressure conditions. In practical use, a portion of the load lock chamber Q1 is under vacuum for the transfer chamber 300 to load and unload the substrate 500, while another portion of the load lock chamber Q1 is under atmospheric pressure for the equipment front-end module 200 to load and unload the substrate 500, thereby improving the transport efficiency of the substrate 500 and the processing efficiency of the substrate 500.

[0076] Furthermore, if both an intake chamber Q2 and a return chamber Q3 are present within a single partition 14, the two chambers are independent. The intake chamber Q2 and return chamber Q3 of the same partition 14 may be arranged hierarchically vertically, the return chamber Q3 may be arranged around the intake chamber Q2, the intake chamber Q2 may be provided around the return chamber Q3, or the intake chamber Q2 and return chamber Q3 may be arranged with a gap between them horizontally; the arrangement is not specifically limited.

[0077] The chamber body 10 is configured with a first inlet / outlet and a second inlet / outlet that communicate with the load lock chamber Q1. The first inlet / outlet is used by the equipment front-end module 200 to load and unload the substrate 500 into the load lock chamber Q1, and the second inlet / outlet is used by the transfer chamber 300 to load and unload the substrate 500 into the load lock chamber Q1. Both the transfer chamber 300 and the equipment front-end module 200 are equipped with a mechanism for transporting the corresponding substrate 500, such as a manipulator. The specific structure of the transfer chamber 300 and the equipment front-end module 200 is not limited in the embodiment of this application and can be provided by referring to conventional equipment structures. If there are multiple load lock chambers Q1, each load lock chamber Q1 is provided with a first inlet / outlet and a second inlet / outlet. When the equipment front-end module 200 and the transfer chamber 300 have finished transporting the substrate 500, the first and second loading / unloading ports are closed, facilitating the formation of a vacuum in the load lock chamber Q1 for filling, and preventing foreign matter such as fine particles and dust from entering the load lock chamber Q1.

[0078] To help those skilled in the art to better understand the technical concept of the present invention, a load lock chamber 100 according to one embodiment of the present invention will be described below.

[0079] In one embodiment, as shown in Figures 4 and 5, the load lock chamber 100 includes a chamber body 10 and a support seat 20. The chamber body 10 includes a top cover 11, side plates 12, a base 13, and a partition 14. The top cover 11, side plates 12, and base 13 are connected in order along the height direction of the chamber body 10 and together enclose the internal space of the chamber body 10. The partition 14 is provided inside the chamber body 10 and divides the internal space of the chamber body 10 into a plurality of load lock chambers Q1 that are arranged in order along the height direction and are independent of each other, with a support seat 20 provided inside each load lock chamber Q1. The top cover 11 has a first intake section I1 that communicates with the uppermost load lock chamber Q1. The side plates 12 have a plurality of second intake sections I2, and each second intake section I2 communicates with a load lock chamber Q1 other than the uppermost load lock chamber Q1 in a one-to-one correspondence. The exhaust section O that communicates with the uppermost load lock chamber Q1 is the first exhaust section O1, and the exhaust section O that communicates with the other load lock chambers Q1 in a one-to-one correspondence is the second exhaust section O2. Both the first exhaust section O1 and the second exhaust section O2 are located on the side plate 12.

[0080] The dispersion section 10a includes a first dispersion section a1 and a second dispersion section a2. The first dispersion section a1 is located in the uppermost load lock chamber Q1 and is connected to the upper cover 11. Multiple dispersion holes k1 provided on it disperse the airflow in the first intake section I1 to various locations in the load lock chamber Q1 and discharge it. The second dispersion section a2 is formed into a partition section 14 that defines the upper inner wall of the other load lock chamber Q1. An intake chamber Q2 is formed within the partition section 14. The intake chamber Q2 of each partition section 14 communicates with the load lock chamber Q1 and the second intake section I2, respectively, via the dispersion holes k1 of the dispersion section 10a of each partition section 14.

[0081] Simultaneously, multiple return air holes k2 are formed at the bottom of each load lock chamber Q1, and a return air chamber Q3 is formed in the portion defining the inner wall of the bottom of each load lock chamber Q1 (for example, a partition 14 or bottom plate), and the return air chamber Q3 is connected to each exhaust section O in a one-to-one correspondence.

[0082] In this embodiment, the airflow entering each load lock chamber Q1 from each intake section I can flow from top to bottom, providing a good cleaning effect on both the inner wall of each load lock chamber Q1 and the substrate 500. At the same time, the provision of a return air chamber Q3, an intake air chamber Q2, and a dispersion section 10a contributes to reducing the weight of the load lock chamber 100, further streamlining the transportation and attachment / detachment of the load lock chamber 100.

[0083] Furthermore, embodiments of the present application further provide a semiconductor device 1000 including the load lock chamber 100 described in any of the above embodiments. Since the semiconductor device 1000 has all the beneficial effects of the load lock chamber 100, a detailed explanation is omitted here.

[0084] Furthermore, as shown in Figure 6, the semiconductor device 1000 may further include an equipment front-end module 200, a transfer chamber 300, and a reaction chamber 400. The load lock chamber 100 is located between the equipment front-end module 200 and the transfer chamber 300. The transfer chamber 300 is located between the reaction chamber 400 and the load lock chamber 100. The reaction chamber 400 is used to process the substrate 500 (e.g., coating, etching). The transfer chamber 300 is for transporting the substrate 500 between the load lock chamber 100 and the reaction chamber 400. The equipment front-end module 200 is for removing the substrate 500 from the load lock chamber 100. The specific structures of the equipment front-end module 200, the transfer chamber 300, and the reaction chamber 400 are not limited in the embodiments of this application and can be understood by referring to conventional structures.

[0085] Furthermore, the embodiments of this application further include: Step S10 is a step of opening the intake section I and exhaust section O of the chamber body 10 of the load lock chamber 100, wherein the chamber body 10 has a load lock chamber Q1 and a dispersion section 10a, the intake section I and the exhaust section O are both in communication with the load lock chamber Q1, each dispersion section 10a is arranged corresponding to one load lock chamber Q1, and each dispersion section 10a includes a plurality of independently provided dispersion holes k1, each dispersion hole k1 is in communication with the intake section I and the corresponding load lock chamber Q1. The present invention provides a method for cleaning a load lock chamber 100, which includes step S20 of introducing a cleaning gas into the intake section I until a predetermined condition is met.

[0086] The structure of the load lock chamber 100 can be described in the above embodiment, and will not be explained here. In step S10, if it is necessary to clean the load lock chamber 100, the intake section I and the exhaust section O are opened. Specifically, on-off valves are provided at the inlet of the intake section I and the outlet of the exhaust section O, and the intake section and exhaust section can be opened and closed by controlling the opening and closing of the on-off valves. Alternatively, an intake pump is provided in the intake section I and an exhaust pump is provided in the exhaust section O, and the intake section I is opened by starting the intake pump, and the exhaust section O is opened by starting the exhaust pump.

[0087] In step S20, the intake section I may be connected to a gas storage tank via an intake pump, and cleaning gas may be stored in the gas storage tank, which may be nitrogen gas, an inert gas, or the like. When it is necessary to introduce cleaning gas into the intake section I, the intake pump is started, and the cleaning gas is transported by the intake pump from the gas storage tank through the intake section to the dispersion section, then dispersed in the dispersion section into the load lock chamber Q1, and finally flows out of the load lock chamber Q1 via the exhaust section O.

[0088] The pre-set conditions may include the time required to introduce the cleaning gas reaching a set value, and cleaning is completed by default once the set cleaning time is reached. Of course, a gas sampling device may also be installed in the exhaust section O, and the cleanliness of the gas flowing out of the exhaust section may be detected by the gas sampling device to determine whether the cleaning is complete or not based on whether the cleanliness of the gas has reached a pre-set condition.

[0089] Specifically, step S10 may be performed before or after the equipment front-end module 200 places the substrate 500 into the load lock chamber Q1, or after the equipment front-end module 200 removes the substrate 500 from the load lock chamber Q1, and is not specifically limited; step S10 can be performed if cleaning is necessary.

[0090] The load lock chamber, its cleaning method, and semiconductor device according to the present invention can effectively solve the problem in conventional load lock chamber cleaning methods, which is time-consuming and unfavorable to improving the yield rate of good substrates.

[0091] The load lock chamber, its cleaning method, and semiconductor device according to the present invention allow for the dispersion of airflow through the dispersion holes in each dispersion section of each load lock chamber, thereby reducing the airflow velocity and effectively preventing the airflow from concentrating into vortices. This results in a more uniform gas distribution within the load lock chamber, significantly increasing the probability of contact between the airflow and the inner wall of the load lock chamber. This improves the effectiveness of removing fine particles and dust adhering to the inner wall of the load lock chamber by airflow, extending the maintenance cycle of the load lock chamber, reducing maintenance costs, and contributing to an improved yield rate of substrates. Simultaneously, the provision of dispersion sections reduces the actual weight of the load lock chamber, contributing to a reduction in the overall weight of the chamber, which is advantageous for manual transport and assembly.

[0092] Furthermore, the load lock chamber and cleaning method thereof, as well as the semiconductor device, configured as described above, also have a rapid cooling function.

[0093] The technical features of the embodiments described above can be combined in any way, and for the sake of brevity, not all possible combinations of the technical features of the embodiments described above have been described. However, all such combinations should be considered to fall within the scope described herein, provided they are consistent.

[0094] The above examples describe only a few embodiments of the present application, and although these descriptions are specific and detailed, they should not be interpreted as limiting the scope of the patent of this application. Furthermore, a person skilled in the art can make various modifications and improvements as long as they do not deviate from the spirit of this application, and these modifications and improvements fall within the scope of protection of this application. Therefore, the scope of protection of the patent of this application should be based on the attached claims. [Explanation of Symbols]

[0095] 1000 Semiconductor device, 100 Load lock chamber, 10 Chamber body, 11 Top cover, 12 Side plate, Q1 Load lock chamber, Q2 Intake chamber, Q3 Return chamber, I Intake section, I1 First intake section, I2 Second intake section, O Exhaust section, O1 First exhaust section, O2 Second exhaust section, k2 Return vent, 10a Dispersion section, a1 First dispersion section, a2 Second dispersion section, k1 Dispersion vent, W Gas homogenization space, 13 Base, 14 Partition section, 20 Support seat, X First direction, Y Second direction, Z Third direction, 200 Equipment front-end module, 300 Transfer chamber, 400 Reaction chamber, 500 Substrate.

Claims

1. The chamber body includes a plurality of load lock chambers, and each load lock chamber has an intake section and an exhaust section communicating with it. The chamber body has a plurality of dispersion sections, each of which is arranged in accordance with one of the load lock chambers, and each of which includes a plurality of independently provided dispersion holes, each of which communicates the intake section with the corresponding load lock chamber and is configured to disperse the airflow that enters the corresponding load lock chamber. The chamber body has an intake chamber that communicates with the intake section, The chamber body includes at least one partition, and the at least one partition divides the internal space of the chamber body to form a plurality of load lock chambers that are independent of each other. A load lock chamber characterized in that the at least one partition portion comprises an intake chamber communicating with at least one load lock chamber formed by partitioning itself, and a dispersion portion corresponding to the load lock chamber, the dispersion portion partitioning the intake chamber and the corresponding load lock chamber, and the dispersion holes in the dispersion portion communicating the intake chamber and the load lock chamber.

2. The aforementioned load lock chamber is for loading a substrate, The load lock chamber according to claim 1, characterized in that, in the height direction of the chamber body, at least one of the dispersion portions is located above the substrate in the corresponding load lock chamber, and the outlets of the dispersion holes of at least one of the dispersion portions are all formed toward the side where the substrate is located.

3. The load lock chamber according to claim 2, characterized in that, in a plane perpendicular to the height direction of the chamber body, the orthogonal projection of at least one of the dispersion portions covers the orthogonal projection of the substrate in the corresponding load lock chamber.

4. At least two layers of the distribution section corresponding to at least one of the load lock chambers are arranged. The load lock chamber according to claim 1, characterized in that the at least two layers of dispersion are arranged at intervals along the airflow path, and the projections of the at least two layers of dispersion onto a plane perpendicular to the spacing direction of the dispersion holes are offset from each other.

5. The load lock chamber according to claim 1, wherein the chamber body is configured with a return air chamber and return air holes, the return air chamber is in communication with the exhaust section, each load lock chamber is provided with a plurality of corresponding return air holes, and the spaces between the return air holes in the same load lock chamber are independently provided and communicate with the return air chamber and the load lock chamber, respectively.

6. The load lock chamber according to claim 5, characterized in that the dispersion section and the return air vent corresponding to each load lock chamber are arranged on opposite sides of the load lock chamber.

7. The load lock chamber according to claim 1, wherein the chamber body further includes a top lid and a side plate, the top lid is placed over the side plate and both partition at least one load lock chamber, the top lid is provided with an intake portion, and the at least one dispersion portion is provided on the top lid.

8. The load lock chamber according to claim 1, wherein the plurality of load lock chambers are arranged sequentially along the height direction of the chamber body, and the intake section communicating with the intake chamber is located on the side of the chamber body.

9. The load lock chamber according to claim 1, characterized in that one intake section and one exhaust section are in communication with each of the plurality of load lock chambers.

10. The load lock chamber according to claim 7, characterized in that a gas homogenization space is formed between at least one of the dispersion sections and the upper lid, and the gas entering from the intake section flows and diffuses through the gas homogenization space.

11. The load lock chamber according to claim 1, characterized in that the plurality of load lock chambers are independent of each other and share one intake chamber and one intake section.

12. The load lock chamber according to claim 1, characterized in that the plurality of load lock chambers are independent of each other, and each of the plurality of load lock chambers is provided with one intake chamber and one intake section.

13. A semiconductor device comprising a load lock chamber as described in any one of claims 1 to 12.

14. A step of opening the intake and exhaust portions of the chamber body of a load lock chamber, wherein the chamber body has a load lock chamber and a dispersion portion, the intake portion and the exhaust portion both communicate with the load lock chamber, each dispersion portion is arranged corresponding to one load lock chamber, and each dispersion portion includes a plurality of independently provided dispersion holes, each dispersion hole communicates with the intake portion and the corresponding load lock chamber, the chamber body has an intake chamber communicating with the intake portion, and the chamber body is It includes at least one partition, the at least one partition partitions the internal space of the chamber body to form a plurality of independent load lock chambers, the at least one partition comprises an intake chamber communicating with at least one load lock chamber formed by being partitioned by itself, and a dispersion section corresponding to the load lock chamber, the dispersion section partitions the intake chamber and the corresponding load lock chamber, the dispersion holes in the dispersion section are steps that connect the intake chamber and the load lock chamber, A method for cleaning a load lock chamber, comprising the step of introducing a cleaning gas into the intake section until a predetermined condition is met.

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