Camera module

Abstract

A camera module according to an embodiment includes a circuit board including a cavity, a reinforcing plate including a first region corresponding to the cavity and a second region in which the circuit board is arranged, a wire portion arranged in the first region of the reinforcing plate, and an image sensor arranged on the wire portion, wherein a lower surface of the image sensor is in direct contact with the wire portion, and the wire portion and the image sensor are electrically insulated from each other.

Description

Technical Field

[0001] The embodiments relate to a camera module and an optical device including the same.

Background Art

[0002] Recently, ultra-small camera modules have been developed and are widely used in small electronic products such as smartphones, notebooks, and game machines.

[0003] That is, most mobile electronic devices such as smartphones are equipped with a camera device for obtaining an image from an object, and mobile electronic devices tend to be gradually miniaturized for easy portability.

[0004] Such a camera device generally includes a lens through which light is incident, an image sensor that images the light incident through the lens, and a plurality of components for transmitting and receiving an electrical signal for an image obtained from the image sensor to and from an electronic device to which the camera device is attached. Further, such an image sensor and components are generally mounted on a printed circuit board and connected to an external electronic device.

[0005] On the other hand, a conventional camera device uses a printed circuit board to raise the position of an image sensor. However, when the image sensor is directly mounted on the printed circuit board in this way, there is a problem that heat generated from the image sensor is not released, and there is a reliability problem due to heat generation. Recently, due to high resolution, the pixels and size of the image sensor have increased, and the heat generation problem of the image sensor further affects the performance of the camera device.

[0006] Furthermore, conventional camera devices place a printed circuit board on a reinforcing plate such as a stiffener, and after placing an image sensor on the reinforcing plate, connect it to the printed circuit board via wire bonding. In this case, a cavity is formed in the printed circuit board that exposes the surface of the reinforcing plate. When using a printed circuit board and reinforcing plate with a cavity as described above, the heat dissipation problem can be solved while increasing the height of the image sensor. In such a camera device, epoxy for bonding the image sensor is applied to the reinforcing plate, and the image sensor is placed on the applied epoxy. However, such a camera device has a problem in that warping occurs due to the difference between the thermal expansion coefficient of the image sensor, the thermal expansion coefficient of the printed circuit board, and the thermal expansion coefficient of the epoxy. For example, when heat curing is performed with the image sensor placed on the epoxy, after the heat curing is performed, the structure including the reinforcing plate, epoxy, and image sensor shrinks after being heated and expanding, resulting in a problem in which severe warpage occurs in the shape of "∩". Furthermore, when the image sensor warps, the resolution performance of the camera device deteriorates, leading to a problem of reduced yield of the camera device.

[0007] Therefore, there is a need for measures that can minimize the warping phenomenon of the image sensor. [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] The embodiment aims to provide a camera module and optical equipment including the same that can minimize the warping of the image sensor.

[0009] Furthermore, the embodiment aims to provide a camera module including an image sensor supported by wires, and an optical device including the same.

[0010] The technical problems to be solved in the embodiments are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those with ordinary skill in the art to which the present invention pertains from the following description. [Means for solving the problem]

[0011] The camera module according to the embodiment includes a circuit board including a cavity, a reinforcing plate including a first region corresponding to the cavity and a second region on which the circuit board is arranged, a wire portion arranged in the first region of the reinforcing plate, and an image sensor arranged in the wire portion, wherein the lower surface of the image sensor is in direct contact with the wire portion, and the wire portion and the image sensor are electrically insulated from each other.

[0012] Furthermore, the uppermost end of the wire section is positioned lower than the upper surface of the circuit board.

[0013] Furthermore, the first region of the reinforcing plate includes a 1-1 region where a first adhesive member for attaching the image sensor is arranged, and a 1-2 region where the wire portion is arranged.

[0014] Furthermore, the area of ​​the lower surface of the image sensor is larger than the area of ​​the first adhesive member.

[0015] Furthermore, the area of ​​the first adhesive member is 50% or less of the area of ​​the lower surface of the image sensor.

[0016] Furthermore, the wire portion includes a plurality of sub-wire portions that are spaced apart from each other, and the first adhesive member is positioned in the space between the plurality of sub-wire portions.

[0017] Furthermore, the multiple sub-wire sections overlap with the corner region of the lower surface of the image sensor in the direction of the optical axis.

[0018] Furthermore, the first adhesive member is separated from the wire portion.

[0019] Also, the wire portion is separated from the inner wall of the cavity of the circuit board.

[0020] Also, the image sensor includes a pixel region and a passivation region around the pixel region, and the wire portion contacts the lower surface of the pixel region of the image sensor.

[0021] Also, the pixel region of the image sensor includes an active pixel region and a dummy pixel region between the active pixel region and the passivation region, and the wire portion contacts the lower surface of the corner region of the active pixel region.

[0022] Also, the wire portion includes a bump portion bonded on the reinforcing plate, a first extension portion extending in the optical axis direction from the bump portion, a second extension portion extending in a direction perpendicular to the optical axis direction from the first extension portion and directly contacting the lower surface of the image sensor, and a third extension portion extending from the second extension portion to the upper surface of the reinforcing plate and bonded to the upper surface of the reinforcing plate.

[0023] Also, the width of the bump portion has a range of 80 μm to 100 μm, and the height of the bump portion has a range of 10 μm to 30 μm.

[0024] The height from the lower surface of the bump portion to the uppermost end portion of the second extension portion has a range of 30 μm to 50 μm.

[0025] Also, the length of the second extension portion has a range of 10 μm to 30 μm.

[0026] Also, it includes a second adhesive member disposed between the second region of the reinforcing plate and the circuit board, and the second adhesive member includes an opening corresponding to the cavity of the circuit board.

[0027] Further, the circuit board includes a first terminal, the image sensor includes a second terminal, and includes a connection wire that electrically connects the first terminal and the second terminal.

Advantages of the Invention

[0028] The embodiment includes a wire portion disposed on the reinforcing plate. The wire portion may be a wire bonded onto the reinforcing plate. At this time, an area of the upper surface of the reinforcing plate that overlaps with the image sensor in the optical axis direction includes an area where the wire portion is disposed and an area where an adhesive member for attaching the image sensor is disposed. That is, the adhesive member may be selectively disposed on an area of the upper surface of the reinforcing plate where no wire portion is formed. And in the embodiment, at least a part of the lower surface of the image sensor may be attached or fixed onto the reinforcing plate by the adhesive member in a state of being directly contacted and supported by the wire portion. Thereby, in the embodiment, at least a part of the image sensor is directly contacted and supported by the wire portion, so that the warping phenomenon of the image sensor can be minimized. Also, in the embodiment, at least a part of the image sensor is directly contacted with the wire portion, so that heat generated from the image sensor can be efficiently transferred to the outside.

[0029] Also, in the embodiment, the area of the adhesive member disposed on the lower surface of the image sensor is made smaller than the area of the lower surface of the image sensor. Thereby, in the embodiment, the area where the adhesive member is disposed is reduced compared to the area of the image sensor, and thereby, the warping of the image sensor that increases in proportion to the area of the adhesive member can be minimized.

[0030] Also, in the embodiment, the corner region of the lower surface of the active pixel region of the image sensor and the wire portion are directly contacted with each other. Thereby, in the embodiment, the problem of warping of the active pixel region of the image sensor can be solved. [Brief explanation of the drawing]

[0031] [Figure 1] This diagram illustrates the warping phenomenon of the camera module in the comparative example. [Figure 2] This is a separated perspective view of the camera module according to the embodiment. [Figure 3] Figure 1 is a cross-sectional view of one embodiment of the camera module. [Figure 4] This is an enlarged view of the dotted line area in Figure 3. [Figure 5] This is an enlarged view of the wire section according to the first embodiment. [Figure 6] This is an enlarged view of the wire section according to the second embodiment. [Figure 7] This is a plan view showing the circuit board, reinforcing plate, wire section, and first adhesive member in the state with the image sensor according to the first embodiment removed. [Figure 8] This figure shows various examples of the arrangement shape of the first adhesive member. [Figure 9] This figure shows the degree of warping caused by the placement area of ​​the first adhesive member. [Figure 10] This diagram illustrates the arrangement relationship between the wire section and the image sensor according to the first embodiment. [Figure 11] This diagram illustrates the arrangement relationship between the wire section and the image sensor according to the first embodiment. [Figure 12] This is a plan view showing the circuit board, reinforcing plate, wire section, and first adhesive member in the state with the image sensor according to the second embodiment removed. [Figure 13] This is a diagram illustrating the arrangement relationship between the wire section and the image sensor according to the second embodiment. [Figure 14] This graph shows the degree of warping of the image sensor in the comparative example. [Figure 15] This graph shows the degree of warping of the image sensor, including the wire portion, according to the embodiment. [Figure 16] This is a perspective view of a portable terminal device according to an embodiment. [Figure 17] Figure 16 shows the configuration diagram of the portable terminal unit. [Modes for carrying out the invention]

[0032] Preferred embodiments of the present invention will be described in detail below with reference to the attached drawings.

[0033] However, the technical concept of the present invention is not limited to the several embodiments described, but can be realized in a variety of different forms, and within the scope of the technical concept of the present invention, one or more of its components can be selectively combined or substituted between embodiments.

[0034] Furthermore, terms used in embodiments of the present invention (including technical and scientific terms) shall be interpreted as having meanings generally understood by those skilled in the art to which the present invention pertains, unless otherwise clearly defined and described. Terms that are commonly used, such as predefined terms, may be interpreted in consideration of their meaning in the context of the relevant art.

[0035] Furthermore, the terminology used in the embodiments of the present invention is for illustrative purposes only and is not intended to limit the invention. In this specification, singular nouns may also include plural nouns unless otherwise specified in the wording, and when it is written as "A and / or at least one of B and C," it may include one or more of all combinations of A, B and C.

[0036] Furthermore, in describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used. Such terms are used solely to distinguish a component from other components, and do not limit the nature, order, or procedure of the component in question. When it is stated that a component is “connected,” “joined,” or “linked” to another component, this may include not only cases where the component is directly connected to or linked to the other component, but also cases where it is “connected,” “joined,” or “linked” by another component that lies between it and the other component.

[0037] Furthermore, when it is stated that a component is formed or positioned "above (upper part) or below (lower part)" of a component, "above (upper part)" or "below (lower part)" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or positioned between the two components. Also, when expressed as "above (upper part) or below (lower part)," it can include not only the upward direction but also the downward direction relative to one component.

[0038] The optical axis direction used below can be defined as the optical axis direction of the lens coupled to the camera actuator and camera module, and the perpendicular direction can be defined as the direction perpendicular to the optical axis.

[0039] The autofocus function used below can be defined as a function that automatically focuses on a subject by adjusting the distance to the image sensor by moving the lens along the optical axis according to the distance to the subject, so that a clear image of the subject is obtained on the image sensor.

[0040] On the other hand, autofocus can be referred to as AF (Auto Focus). Furthermore, CLAF (closed-loop auto focus) control can be defined as sensing the distance between the image sensor and the lens and providing real-time feedback control of the lens position to improve the accuracy of focus adjustment.

[0041] Before describing embodiments of the present invention, the first direction may mean the x-axis direction as shown in the drawings, and the second direction may be a different direction from the first direction. For example, the second direction may mean the y-axis direction as shown in the drawings, perpendicular to the first direction. The third direction may also be a different direction from the first and second directions. For example, the third direction may mean the z-axis direction as shown in the drawings, perpendicular to the first and second directions. Here, the third direction may mean the optical axis direction.

[0042] Before describing the embodiments of this application, we will examine in detail the structure and problems of the comparative examples below.

[0043] Figure 1 is a diagram illustrating the warping phenomenon of the camera module in the comparative example.

[0044] Referring to Figure 1, the comparative example camera module has a structure including a reinforcing plate 10, an adhesive member 20, and an image sensor 30. The image sensor 30 is a sensor die that constitutes a sensor chip, and is generally a silicon (Si) die.

[0045] In this case, the reinforcing plate 10, the adhesive member 20, and the image sensor 30 (specifically the silicon die) have different coefficients of thermal expansion (CTE). Here, the coefficient of thermal expansion refers to the change in length due to a change in temperature of a unit of length.

[0046] In the comparative example camera module described above, an adhesive member 20 is placed on the reinforcing plate 10, and the image sensor 30 is placed on the adhesive member 20 while the heat curing process is performed. The image sensor 30 is then attached to the reinforcing plate 10 by the heat curing process.

[0047] At this time, as shown in the top diagram of Figure 1, it can be confirmed that no warping occurs when the reinforcing plate 10, the adhesive member 20, and the image sensor 30 are sequentially stacked before the heat is applied (before heating).

[0048] Then, as shown in the center diagram of Figure 1, when heat is applied to perform the heat curing, both ends of the reinforcing plate 10, the adhesive member 20, and the image sensor 30 expand in the longitudinal direction, moving away from each other.

[0049] Then, as shown in the bottom diagram of Figure 1, once the heat curing process is completed and the cooling process is performed (after cool down), the expanded reinforcing plate 10, adhesive member 20, and image sensor 30 each shrink back to their pre-expansion state.

[0050] In this case, the reinforcing plate 0, the adhesive member 20, and the image sensor 30 each have different coefficients of thermal expansion. The coefficients of thermal expansion of each of the above components are as shown in Table 1 below.

[0051] [Table 1]

[0052] As described above, the reinforcing plate 10, the adhesive member 20, and the image sensor 30 have different coefficients of thermal expansion. As a result, when expansion and contraction due to thermal curing proceed, a difference in the degree of contraction occurs due to the difference in the coefficients of thermal expansion, which causes warpage in the shape of "∩".

[0053] Furthermore, if the image sensor warps, the resolution performance of the camera device decreases, which leads to a problem of reduced yield of the camera device.

[0054] As a result, in this embodiment, the warping phenomenon caused by the difference in thermal expansion coefficients between the reinforcing plate 10, the image sensor 30, and the adhesive member 20 can be minimized, thereby improving the performance of the camera device.

[0055] Figure 2 is a separated perspective view of the camera module according to an embodiment, Figure 3 is a cross-sectional view of one embodiment of the camera module in Figure 1, Figure 4 is an enlarged view of the dotted line portion in Figure 3, Figure 5 is an enlarged view of the wire portion according to the first embodiment, and Figure 6 is an enlarged view of the wire portion according to the second embodiment.

[0056] Referring to Figures 2 to 6, the camera module 200 may include a lens or lens barrel 400, a lens drive unit 100, a filter 610, a holder 600, a circuit board 800, a reinforcing plate 900, and an image sensor 810. Here, "camera module" can be replaced with "imaging device" or "photographer," and the holder 600 can be replaced with a sensor base.

[0057] Furthermore, the camera module 200 may further include a blocking member 1500 that is placed on the filter 610.

[0058] Furthermore, the camera module 200 may further include a third adhesive member 612.

[0059] The camera module 200 may further include a motion sensor 820, a control unit 830, and a connector 840.

[0060] The lens or lens barrel 400 can be mounted on the bobbin 110 of the lens drive unit 100.

[0061] The lens drive device 100 can drive the lens or the lens barrel 400.

[0062] Camera module 200 may be either an AF (Auto Focus) camera module or an OIS (Optical Image Stabilizer) camera module. An AF camera module is one that can perform only the autofocus function, while an OIS camera module is one that can perform both the autofocus function and the OIS (Optical Image Stabilizer) function.

[0063] For example, the lens drive unit 100 may be an AF lens drive unit or an OIS lens drive unit, where the meanings of "for AF" and "for OIS" may be the same as those explained for the AF camera module and the OIS camera module.

[0064] For example, the lens drive unit 100 of the camera module 200 may be a lens drive unit for OIS (Optical Image Stabilization).

[0065] The lens drive unit 100 may include a housing 140, a bobbin 110 located inside the housing 140 for mounting a lens or lens barrel 400, a first coil 120 located on the bobbin 110, a magnet 130 located in the housing 140 and facing the first coil 120, at least one upper elastic member (not shown) coupled to the top of the bobbin 110 and the top of the housing 140, at least one lower elastic member (not shown) coupled to the bottom of the bobbin 110 and the bottom of the housing 140, a second coil 230 located below the bobbin 110 (or / and the housing 140), a circuit board 250 located below the second coil 230, and a base 210 located below the circuit board 250.

[0066] Furthermore, the lens drive unit 100 may further include a cover member 300 that is coupled to the base 210 and provides space for housing the components of the lens drive unit 100 together with the base 210.

[0067] The lens drive device 100 may further include a support member (not shown) that electrically connects the circuit board 250 and the upper elastic member and supports the housing 140 relative to the base 210. The first coil 120 and the second coil 230 may each be electrically connected to the circuit board 250 and can receive a drive signal (drive current) from the circuit board 250.

[0068] For example, the upper elastic member may include a plurality of upper springs, and the support member may include support members connected to the upper springs, and the first coil 120 may be electrically connected to the circuit board 250 through the upper springs and support members. The circuit board 250 may include a plurality of terminals, some of which may be electrically connected to the first coil 120 and / or the second coil 230, respectively.

[0069] The electromagnetic force resulting from the interaction between the first coil 120 and the magnet 130 can cause the bobbin 110 and the lens or lens barrel 400 coupled thereto to move in the optical axis direction. By controlling the displacement of the bobbin 110 in the optical axis direction, AF drive can be realized.

[0070] Furthermore, the electromagnetic force resulting from the interaction between the second coil 230 and the magnet 130 may cause the housing 140 to move in a direction perpendicular to the optical axis, thereby enabling image stabilization or OIS drive.

[0071] Furthermore, for AF feedback drive, the lens drive unit 100 of the camera module 200 may further include a sensing magnet (not shown) located on the bobbin 110 and an AF position sensor (e.g., a Hall sensor (not shown)) located on the housing 140. The lens drive unit 100 may further include a circuit board (not shown) located on the housing and / or base on which the AF position sensor is located or mounted. In other embodiments, the AF position sensor may be located on the bobbin and the sensing magnet on the housing. The lens drive unit 100 may further include a balancing magnet located on the bobbin 110 in correspondence with the sensing magnet.

[0072] The AF position sensor can output an output signal based on the strength of the magnetic field of the sensing magnet as a result of the movement of the bobbin 100. The AF position sensor can be electrically connected to the circuit board 250 through an upper elastic member (or a lower elastic member) and / or a support member. The circuit board 250 can provide a drive signal to the AF position sensor, and the output of the AF position sensor can be transmitted to the circuit board 250.

[0073] In other embodiments, the lens drive device 100 may be an AF lens drive device, which may include a housing, a bobbin located inside the housing, a coil located on the bobbin, a magnet located in the housing, at least one elastic member coupled to the bobbin and the housing, and a base located below the bobbin (or / and the housing).

[0074] For example, the elastic member may include the upper elastic member and the lower elastic member described above.

[0075] A drive signal (e.g., drive current) may be supplied to the coil, and the bobbin may be moved in the optical axis direction by the electromagnetic force resulting from the interaction between the coil and the magnet.

[0076] In other embodiments, the coil may be located in the housing, and the magnet may be located in the bobbin.

[0077] Furthermore, for AF feedback drive, the AF lens drive device may further include a sensing magnet located on the bobbin, an AF position sensor (e.g., a Hall sensor) located on the housing, and a circuit board on which the AF position sensor is located and which is located or mounted on the housing and / or base. In other embodiments, the AF position sensor may be located on the bobbin and the sensing magnet on the housing.

[0078] Other camera modules may include a housing that is coupled to and fixed to a lens or lens barrel 400 instead of the lens drive unit 100 in Figure 2, and the housing may be coupled to or attached to the upper surface of the holder 600. The housing attached to or fixed to the holder 600 may not be movable, and the position of the housing may be fixed while attached to the holder 600.

[0079] The circuit board may be electrically connected to the coil and the AF position sensor, drive signals may be supplied to the coil and the AF position sensor respectively through the circuit board, and the output of the AF position sensor may be transferred to the circuit board.

[0080] The holder 600 may be positioned below the base 210 of the lens drive unit 100.

[0081] The filter 610 is mounted on the holder 600, and the holder 600 may be equipped with a mounting portion 500 to which the filter 610 is securely attached.

[0082] The adhesive member 612 can connect or attach the base 210 of the lens drive device 100 to the holder 600. For example, the third adhesive member 612 can be positioned between the lower surface of the base 210 and the upper surface of the holder 600, and can bond the two together.

[0083] In addition to the bonding role described above, the third adhesive member 612 can also serve to prevent foreign matter from entering the lens drive device 100. For example, the third adhesive member 612 may be epoxy, a thermosetting adhesive, or an ultraviolet curing adhesive.

[0084] The filter 610 may be placed within the attachment portion 500 of the holder 600.

[0085] The attachment portion 500 of the holder 600 may include, but is not limited to, a projection (not shown) protruding from the upper surface of the holder 600. In other embodiments, the attachment portion may be in the form of a recess, cavity, or hole recessed from the upper surface of the holder 600.

[0086] The protruding portion of the mounting portion 500 can serve to prevent the lower end of the lens or lens barrel 400 from contacting or colliding with the filter 610 (and / or the blocking member 1500).

[0087] The protrusions of the mounting portion 500 may be formed to protrude in the optical axis direction along the side surface of the filter 610. For example, the protrusions may be arranged around the side surface of the filter 610 so as to surround the side surface of the filter 610.

[0088] The inner surface of the protrusion may be positioned to face the side of the filter 610, and the two may be spaced apart from each other. This is to ensure machining tolerances that allow the filter 610 to be easily mounted inside the mounting portion 500 of the holder 600.

[0089] Furthermore, the upper surface of the protruding portion of the mounting portion 500 can be positioned above the upper surface of the filter 610 in the optical axis direction. This is to prevent the lower end of the lens or lens barrel 400 from directly colliding with the filter 610 when the lens or lens barrel 400 is mounted on the lens drive device 100 and moves in the optical axis direction, or when it moves toward the filter 610 due to an external impact.

[0090] The shape of the protruding portion of the attachment portion 500, as viewed from above, may, but is not limited to, the shape of the filter 610. In other embodiments, the shape of the protruding portion of the attachment portion 500 may be similar to or different from the shape of the filter 610.

[0091] The holder 600 may have an aperture 501 formed in the area where the filter 610 is mounted or positioned, so that light passing through the filter 610 can enter the image sensor 810.

[0092] For example, the aperture 501 can penetrate the holder 600 in the direction of the optical axis, and can also be described as a "through hole".

[0093] For example, the opening 501 may pass through the center of the holder 600 and may be located within the mounting portion 500, and the area of ​​the opening 501 may be smaller than the area of ​​the filter 610.

[0094] The holder 600 is positioned on the circuit board 800 and can house the filter 610 inside. The holder 600 can support the lens drive unit 100 located above it. The lower surface of the base 210 of the lens drive unit 100 may be positioned on the upper surface of the holder 600.

[0095] For example, the lower surface of the base 210 of the lens drive device 100 can contact the upper surface of the holder 600 and be supported by the upper surface of the holder 600.

[0096] For example, the filter 610 may be placed within the attachment portion 500 of the holder 600.

[0097] The filter 610 can serve to block light of a specific frequency band in the light passing through the lens barrel 400 from being incident on the image sensor 810.

[0098] For example, filter 610 may be, but is not limited to, an infrared blocking filter. For example, filter 610 may be positioned parallel to the xy plane perpendicular to the optical axis OA.

[0099] The filter 610 can be attached to the fixing portion 500 of the holder 600 by an adhesive material (not shown), such as UV epoxy.

[0100] The circuit board 800 may be positioned below the holder 600, and the holder 600 may be positioned above the circuit board 800.

[0101] The holder 600 can be attached to or fixed to the upper surface of the circuit board 800 by an adhesive material such as epoxy, thermosetting adhesive, or UV-curing adhesive. In this case, the adhesive material may be placed between the lower surface of the holder 600 and the upper surface of the circuit board 800.

[0102] The circuit board 800 may have a cavity 801 corresponding to the opening 501 of the holder 600. The cavity 801 of the circuit board 800 may be in the shape of a through-hole that penetrates the circuit board 800 in the direction of the optical axis.

[0103] An image sensor 810 may be placed inside the cavity 801 of the circuit board 800.

[0104] The reinforcing plate 900 is placed beneath the circuit board 800.

[0105] In this case, the reinforcing plate 900 may include a wire portion 910 positioned in a region corresponding to the cavity 801 of the circuit board 800. The wire portion 910 may be positioned on the upper surface of the reinforcing plate 900 in a region exposed through the cavity 801 of the circuit board 800. The wire portion 910 may be attached to the reinforcing plate 900 by methods such as thermocompression bonding or ultrasonic bonding. Specifically, the wire portion 910 may be a wire bonded to the upper surface of the reinforcing plate 900.

[0106] In this embodiment, a wire portion 910 is formed by bonding a wire to the reinforcing plate 900, and the image sensor 810 is positioned on the formed wire portion 910 while the image sensor 810 is attached. During the attachment process of the image sensor 810, a specific area on the lower surface of the image sensor 810 can be supported by the wire portion 910. As a result, in this embodiment, the occurrence of warping of the image sensor 810 can be minimized, thereby improving reliability.

[0107] The wire portion 910 may protrude in the optical axis direction from a region on the upper surface of the reinforcing plate 900. The image sensor 810 may be exposed through the cavity 801 of the circuit board 800 while being supported by the wire portion 910.

[0108] The image sensor 810, supported and attached by the wire portion 910, can be electrically connected to the circuit board 800 via a connecting wire 21. For example, the connecting wire 21 can connect the terminal 813 of the image sensor 810 to the terminal 1830 of the circuit board 800.

[0109] That is, in the embodiment, the lower surface of the image sensor 810 is in contact with the wire portion 910, and the terminal 813 on the upper surface is connected to the connecting wire 21. In this case, the wire portion 910 and the connecting wire 21 may be formed using wires of the same material. Alternatively, the wire portion 910 and the connecting wire 21 may be formed using wires of different materials. That is, the wire portion 910 does not have an electrical signal transmission function, but is used simply to support the image sensor 810. Therefore, the wire portion 910 may include a metallic substance that can be attached to the reinforcing plate 900 through bonding, regardless of signal transmission performance. For example, the wire portion 910 may include a wire of at least one metallic substance from gold (Au), copper (Cu), aluminum (Al), and silver (Ag). On the other hand, the connecting wire 21 serves as wiring that electrically connects the circuit board 800 and the image sensor 810. As a result, the connecting wire 21 may include a metallic wire that is capable of signal transmission and has optimal transmission performance.

[0110] The reinforcing plate 900 is a plate-shaped member having a predetermined thickness and hardness, which can stably support the image sensor 810 and prevent damage to the image sensor from external impacts or contact.

[0111] Furthermore, the reinforcing plate 900 can improve the heat dissipation effect, which releases heat generated from the image sensor to the outside.

[0112] For example, the reinforcing plate 900 can be made of a metal material with high thermal conductivity, such as SUS or aluminum, but is not limited to this. In other embodiments, the reinforcing plate 900 may be made of glass epoxy, plastic, or synthetic resin.

[0113] Furthermore, the reinforcing plate 900 can also function as a ground to protect the camera module from ESD (Electrostatic Discharge Protection) by being electrically connected to the ground terminal of the circuit board 800.

[0114] The reinforcing plate 900 may include a surface treatment layer (not shown) on its upper surface. For example, the reinforcing plate 900 may include a surface treatment layer containing nickel (Ni) on its surface. In this case, the wire portion 910 is directly bonded onto the reinforcing plate 900. This allows the surface treatment layer of the reinforcing plate 900 to include a metal layer with good bonding properties with the wire portion 910. For example, if the wire portion 910 is a copper wire, the surface treatment layer of the reinforcing plate 900 may include a nickel layer. For example, if the wire portion 910 is a gold (Au) wire, the surface treatment layer of the reinforcing plate 900 may include a first surface treatment layer containing nickel (Ni) and a second surface treatment layer containing palladium (Pd). The surface treatment layer of the reinforcing plate 900 may be a metal layer that improves bonding properties with the wire portion 910 while providing an oxidation prevention function for the reinforcing plate 900.

[0115] The image sensor 810 may be the part where light that has passed through the filter 610 enters and the image contained in the light is formed.

[0116] The circuit board 800 may be equipped with various circuits, elements, and control units for converting the image formed on the image sensor 810 into an electrical signal and transmitting it to an external device. Circuit patterns that are electrically connected to the image sensor and various elements may be formed on the circuit board 800.

[0117] The holder 600 may be replaced with the first holder, and the circuit board 800 may be replaced with the second holder.

[0118] The image sensor 810 can receive an image contained in the incident light via the lens drive device 100 and convert the received image into an electrical signal.

[0119] The filter 610 and the image sensor 810 may be arranged at a distance from each other so as to face each other in the direction of the optical axis OA or in a first direction.

[0120] Furthermore, the protruding portion 500a of the holder 600 may be positioned to face the filter 610 in the direction of the optical axis.

[0121] The blocking member 1500 may be positioned on the upper surface of the filter 610. The blocking member 1500 may be replaced with the term "masking portion".

[0122] For example, the blocking member 1500 may be positioned in the edge region of the upper surface of the filter 610 and can serve to block at least a portion of the light that passes through the lens or lens barrel 400 and is incident toward the edge region of the filter 610 from passing through the filter 610. For example, the blocking member 1500 may be coupled to or attached to the upper surface of the filter 1610.

[0123] For example, the filter 610 may be formed in a rectangular shape when viewed from the optical axis direction, and the blocking member 1500 may be formed symmetrically with respect to the filter 610 along each side of the upper surface of the filter 610.

[0124] In this case, the blocking member 1500 may be formed to have a constant width on each side of the upper surface of the filter 1610.

[0125] The blocking member 1500 may be formed of an opaque material. For example, the blocking member 1500 may be provided as an opaque adhesive substance applied to the filter 610, or as a film attached to the filter 610.

[0126] The filter 610 and the image sensor 810 may be arranged to face each other in the optical axis direction, and the blocking member 1500 may overlap at least partially with the terminals 1830 and / or connecting wires 21 located on the circuit board 800 in the optical axis direction.

[0127] The connecting wire 21 and terminal 1830 may be made of a conductive material, such as gold (Au), silver (Ag), copper (Cu), or a copper alloy, and such conductive materials may have the property of reflecting light. Light that has passed through the filter 610 may be reflected by the terminal 1830 and connecting wire 21 of the circuit board 800, and such reflected light may cause a momentary flash, i.e., a flare phenomenon, which may distort the image formed on the image sensor 810 or degrade the image quality.

[0128] Since the blocking member 1500 is positioned so that at least a portion of it overlaps with the terminal 1830 and / or the connecting wire 21 in the optical axis direction, it can block the light that has passed through the lens or lens barrel 400 and is directed toward the terminal 1830 of the circuit board 800 and / or the connecting wire 21, thereby preventing the occurrence of the flare phenomenon described above, and thereby preventing distortion of the image formed on the image sensor 810 or a decrease in image quality.

[0129] The motion sensor 820 may be mounted or arranged on the circuit board 800 and electrically connected to the control unit 830 via a circuit pattern provided on the circuit board 800.

[0130] The motion sensor 820 outputs rotational angular velocity information due to the movement of the camera module 200. The motion sensor 820 can be implemented as a 2-axis or 3-axis gyro sensor, or as an angular velocity sensor.

[0131] The control unit 830 is mounted or positioned on the circuit board 800.

[0132] The circuit board 800 can be electrically connected to the lens drive device 100. For example, the circuit board 800 can be electrically connected to the circuit board 250 of the lens drive device 100.

[0133] For example, drive signals may be provided to the first coil 120 and the second coil 230 of the lens drive device 100 via the circuit board 800, and drive signals may also be provided to the AF position sensor (or OIS position sensor). In addition, the output of the AF position sensor (or OIS position sensor) may be transmitted to the circuit board 800.

[0134] The connector 840 is electrically connected to the circuit board 800 and may have ports for electrically connecting to external devices.

[0135] A first adhesive member 1750 may be placed between the lower surface of the image sensor 810 and the reinforcing plate 900, and the image sensor 810 may be attached to or fixed onto the reinforcing plate 10 by the first adhesive member 1750.

[0136] In this case, the reinforcing plate 900 can be divided into multiple regions. For example, the upper surface of the reinforcing plate 900 may include a first region S1 and a second region S2. The first region S1 may be a region that overlaps with the image sensor 810 in the optical axis direction OA. The first region S1 may be a region that overlaps with the cavity 801 of the circuit board 800 in the optical axis direction OA. The first region S1 may be a region to which the image sensor 810 is attached. The second region S2 may be a region to which the second adhesive member 1700 is placed. The second region S2 may be a region that overlaps with the circuit board 800 in the optical axis direction OA.

[0137] Furthermore, the wire portion 910 may be formed on the first region S1 of the upper surface of the reinforcing plate 900.

[0138] The image sensor 810 can be supported or fixed to the wire portion 910. For example, at least a portion of the lower surface of the image sensor 810 can be in direct contact with the wire portion 910. That is, the first adhesive member 1750 in the embodiment can be selectively formed in a region of the first region S1 in which the wire portion 910 is not located. As a result, at least a first portion of the image sensor 810 can be in direct contact with the wire portion 910, and at least a second portion can be in direct contact with the first adhesive member 1750. That is, the image sensor 810 can be attached to or fixed to the first adhesive member 1750 with the first portion supported by the wire portion 910. As a result, in the embodiment, the warping phenomenon of the image sensor 810 can be minimized by ensuring that at least a portion of the image sensor 810 is in direct contact with the wire portion 910. Furthermore, in this embodiment, at least a portion of the image sensor 810 is in direct contact with the wire portion 910, thereby efficiently transferring the heat generated from the image sensor 810 to the outside.

[0139] Therefore, the area of ​​the image sensor 810 in the embodiment may be larger than the area of ​​the first adhesive member 1750. That is, only a portion of the area of ​​the image sensor 810 can come into contact with the first adhesive member 1750. For example, a first portion of the lower surface of the image sensor 810 can come into contact with the wire portion 910, while a second portion other than the first portion can come into contact with the first adhesive member 1750. As a result, the wire portion 910 and the first adhesive member 1750 can be separated from each other on the reinforcing plate 900.

[0140] The first adhesive member 1750 may be, but is not limited to, epoxy, thermosetting adhesive, UV-curing adhesive, or adhesive film.

[0141] Furthermore, a second adhesive member 1700 may be placed between the lower surface of the circuit board 800 and the upper surface 900a of the second region S2 of the reinforcing plate 900, and the circuit board 800 can be attached to or fixed to the reinforcing plate 900 by the second adhesive member 1700. For example, the second adhesive member 1700 may be epoxy, thermosetting adhesive, UV-curing adhesive, or adhesive film, but is not limited thereto.

[0142] On the other hand, the ratio H1:H2 between the first height H1 from the upper surface 900a of the second region S2 of the reinforcing plate 900 to the uppermost end of the wire portion 910 and the second height H2 from the lower surface 900b of the reinforcing plate 900 to the upper surface 900a of the second region S2 of the reinforcing plate 900 can be 1:0.67 to 1:2.1. Also, if the value obtained by dividing the second height by the first height (H2 / H1) is less than 0.67, the reinforcing plate 900 will bend or deform to such an extent that it cannot support the circuit board 800.

[0143] Furthermore, if the value obtained by dividing the second height by the first height (H2 / H1) exceeds 2.1, the protruding height of the wire portion is negligible, making it impossible to improve the flatness of the reinforcing plate 900. This reduces the effect of reducing the step difference in the optical axis direction between the upper surface of the image sensor 810 and the upper surface of the circuit board 800, and thus the reliability of the wire bonding between the two cannot be ensured. For example, H1 may be between 30 μm and 50 μm.

[0144] On the other hand, the height from the lower surface 900b of the reinforcing plate 900 to the uppermost end of the wire portion 910 may be lower than the height of the upper surface of the circuit board 800 placed on the reinforcing plate 900. For example, the reinforcing plate 900 may include a first region S1 and a second region S2, where the first region S1 may be the region to which the image sensor 810 is attached, and the second region S2 may be the region to which the circuit board 800 is attached.

[0145] Furthermore, the first region S1 may include a 1-1 region S1-1 where the first adhesive member 1750 is located, and a 1-2 region S1-2 where the wire portion 910 is located. The 1-1 region S1-1 may have the same height as the second region S2.

[0146] The first region S1 of the reinforcing plate 900 may include a wire portion 910 that protrudes in the optical axis direction with respect to the first-first region S1-1, and the image sensor 810 may be positioned on the upper surface of the wire portion 910.

[0147] For example, of the first region S1 of the reinforcing plate 900, the first-second region S1-2 may include a wire portion 910 that is located higher than the first-first region S1-1 and the second region S2 of the reinforcing plate 900.

[0148] Since the reinforcing plate 900 has a constant thickness throughout its entire area, the embodiment can be made unaffected by the overall height of the camera module. Furthermore, since the image sensor 810 is positioned in direct contact with the wire portion 910, the height difference between the top surface of the circuit board 800 and the top surface of the image sensor 810 is reduced, shortening the length of the connecting wire 21 that electrically connects the circuit board 800 and the image sensor 810, thereby improving the wire bonding reliability of the connecting wire 21.

[0149] The separation distance D1 between the side surface of the wire portion 910 and the side surface of the cavity of the circuit board 800 can be between 100 [μm] and 250 [μm]. If D1 is less than 100 [μm], the adhesion tolerance for attaching the circuit board 800 to the reinforcing plate 900 becomes small, which may cause misalignment between the cavity 801 of the circuit board 800 and the wire portion 910, and the circuit board 800 may be damaged by collision between the circuit board 800 and the wire portion 910.

[0150] If D1 exceeds 250 [μm], the separation distance between the image sensor and the circuit board increases, which may worsen the reliability of wire bonding to the connecting wire 21.

[0151] On the other hand, the wire portion 910 in the embodiment may include a plurality of sub-wire portions that are spaced apart from each other with respect to the 1-1 region S1-1 in the first region S1 of the reinforcing plate 900. For example, the wire portion 910 may include a first sub-wire portion 911, a second sub-wire portion 912, a third sub-wire portion 913, and a fourth sub-wire portion 914. That is, the first region S1 of the reinforcing plate 900 may include the 1-2 region S1-2 where the first sub-wire portion 911, the second sub-wire portion 912, the third sub-wire portion 913, and the fourth sub-wire portion 914 are located, and the 1-1 region S1-1 excluding this region. The first adhesive member 1750 may be located in the 1-1 region S1-1.

[0152] Therefore, in this embodiment, the first sub-wire section 911, the second sub-wire section 912, the third sub-wire section 913, and the fourth sub-wire section 914, which are spaced apart from each other, can support different areas on the lower surface of the image sensor 810. As a result, in this embodiment, the image sensor 810 can be supported more stably, and the resulting warping phenomenon can be minimized. Furthermore, in this embodiment, the heat generated from the image sensor 810 can be branched and distributed to different paths via the multiple sub-wire sections which are separated from each other, thereby improving heat dissipation performance.

[0153] The structure of the wire section 910 will be described in detail below.

[0154] Referring to Figure 5, the wire portion 910 may include a bump portion 910-1, a first extension portion 910-2, a second extension portion 910-3, a third extension portion 910-4, and a fourth extension portion 910-5. The wire portion 910 can be formed using a metal wire having a specific thickness.

[0155] The bump portion 910-1 can be joined to the upper surface of the reinforcing plate 900. The bump portion 910-1 may be the first part formed in the process of forming the wire portion 910 on the upper surface of the reinforcing plate 900. That is, the bump portion 910-1 may be a part formed to have a constant width W1 and a constant height H3 by pressing the wire while it is positioned on the upper surface of the reinforcing plate 900 and bonding the wire under pressure. The bump portion 910-1 can also be said to be the main body portion of the wire portion 910. Specifically, the bump portion 910-1 may be a part in which the metal wire has hardened by bonding it to the reinforcing plate 900 while the metal wire is being held down.

[0156] In the first embodiment, the bump portion 910-1 may have a rectangular vertical cross-section. The bump portion 910-1 may have a first width W1. The first width W1 of the bump portion 910-1 may be 80 μm to 100 μm. If the first width of the bump portion 910-1 is less than 80 μm, the contact area between the wire portion 910 and the reinforcing plate 900 decreases, which may reduce the bonding strength between the wire portion 910 and the reinforcing plate 900. Also, if the first width W1 of the bump portion 910-1 is greater than 100 μm, the overall volume of the wire portion 910 increases, which may increase the manufacturing cost due to the increased length of wire used.

[0157] The bump portion 910-1 may have a third height H3. For example, the bump portion 910-1 may have a third height H3 between 10 μm and 30 μm. If the height of the bump portion 910-1 is less than 10 μm, the height of the first extension portion 910-2 must be increased in order for the wire portion 910 to have a certain height, which may reduce the overall strength of the wire portion 910. This may reduce the support force of the wire portion 910 on the image sensor 810. Also, if the height of the bump portion 910-1 is greater than 30 μm, the overall height of the wire portion 910 increases, which may increase the overall height of the camera module. Furthermore, if the length of the first extension portion 910-2 is reduced while the bump portion 910-1 is greater than 30 μm, the pressable height during the attachment process of the image sensor 810 decreases, which may reduce the bonding force of the image sensor 810.

[0158] The first extension 910-2 may extend in the optical axis direction from the upper surface of the bump portion 910-1. The first extension 910-2 may have a thickness and shape corresponding to the metal wire forming the wire portion 910. However, the portion of the first extension 910-2 that contacts the bump portion 910-1 may have a certain width. The width W2 of the contact portion between the first extension 910-2 and the bump portion 910-1 may be 25 μm to 45 μm. The width W2 may refer to the width of one end of the first extension 910-2 that contacts the bump portion 910-1.

[0159] Furthermore, the width of the upper end of the first extension 910-2 can correspond to the thickness of the metal wire. This allows the first extension 910-2 to have a trapezoidal shape in which the width gradually decreases from one end to the other.

[0160] The second extension 910-3 may be bent at the other end of the first extension 910-2 and extend in a direction different from the extension direction of the first extension 910-2. For example, the second extension 910-3 may extend in a direction perpendicular to the optical axis direction. For example, the second extension 910-3 may extend in a direction corresponding to the arrangement direction of the image sensor 810. The second extension 910-3 may be planar. For example, the second extension 910-3 may be pressurized by the pressure provided in the attachment process of the image sensor 810 and have a shape that extends horizontally with respect to the lower surface of the image sensor 810. The second extension 910-3 may have a first length L1. The first length L1 of the second extension 910-3 may be in the range of 10 μm to 30 μm. If the length of the second extension 910-3 is less than 10 μm, the contact area with the image sensor will decrease, which may result in insufficient reduction of the degree of warping of the image sensor. Furthermore, if the length of the second extension 910-3 exceeds 30 μm, the strength of the wire portion may not be ensured.

[0161] In this case, the height H1 of the wire portion 910 can mean the height from the lowest end of the bump portion 910-1 to the highest end of the second extension portion 910-3. In this case, the height H1 of the wire portion 910 can be 30 μm to 50 μm. If the height H1 of the wire portion 910 is less than 30 μm, the support force of the wire portion 910 on the image sensor 810 may decrease. Also, if the height H1 of the wire portion 910 is less than 30 μm, the distance between the terminals between the image sensor 810 and the circuit board 800 increases, which increases the length of the connecting wire 21 and may reduce reliability. Also, if the height H1 of the wire portion 910 is greater than 50 μm, the overall height of the camera module may increase.

[0162] The third extension 910-4 may extend in the direction of the optical axis from the other end of the second extension 910-3. For example, the third extension 910-4 may have a certain inclination angle with respect to the direction of the optical axis and may extend from the other end of the second extension 910-3 to the upper surface of the reinforcing plate 900.

[0163] The fourth extension 910-5 may extend from the other end of the third extension 910-4 and be joined to the upper surface of the reinforcing plate 900. The fourth extension 910-5 may be the end portion of the wire portion 910 formed during the process of completing the bonding of the metal wire. On the other hand, the third extension 910-4 and the fourth extension 910-5 can be viewed as a single component, and thus can be said to be the other end of the metal wire that extends from the second extension 910-3 toward the reinforcing plate and is joined to the reinforcing plate.

[0164] That is, the bump portion 910-1 may be the starting portion where bonding of the metal wire to form the wire portion 910 begins, and the fourth extension portion 910-5 may be the ending portion where bonding of the metal wire ends.

[0165] On the other hand, referring to Figure 6, the wire portion 910 can include a bump portion 910-1a, a first extension portion 910-2, a second extension portion 910-3, a third extension portion 910-4, and a fourth extension portion 910-5. In this case, the wire portion 910 of the second embodiment in Figure 6 differs from that of Figure 5 in the shape of the bump portion 910-1a. That is, in the wire portion of the second embodiment, the first extension portion 910-2, the second extension portion 910-3, the third extension portion 910-4, and the fourth extension portion 910-5 may be substantially the same as the wire portion 910 of the first embodiment. However, the bump portion 910-1a in the second embodiment may have a convex shape on its upper surface. That is, the upper surface of the portion that hardens at the beginning of bonding of the metal wire may have a convex circular shape, and thus the upper surface of the bump portion 910-1a may be a curved surface with a constant curvature. However, the embodiments are not limited thereto, and the shape of the bump portion may change depending on the bonding method of the metal wire.

[0166] The following describes in detail the structure of the reinforcing plate 900, wire section 910, first adhesive member 1750, and image sensor 810 according to the embodiment, as well as their arrangement.

[0167] Figure 7 is a plan view showing the circuit board, reinforcing plate, wire section, and first adhesive member in the state with the image sensor according to the first embodiment removed; Figure 8 is a diagram showing various embodiments of the arrangement shape of the first adhesive member; Figure 9 is a diagram showing the degree of warping caused by the arrangement area of ​​the first adhesive member; and Figures 10 and 11 are diagrams for explaining the arrangement relationship between the wire section and the image sensor according to the first embodiment.

[0168] Referring to Figures 7 to 11, the reinforcing plate 900 includes a first region S1 and a second region S2.

[0169] Furthermore, the upper surface of the first region S1 of the reinforcing plate 900 may be exposed through the cavity 801 of the circuit board 800. The first region S1 is the region in the cavity 801 of the circuit board 800 where the image sensor 810 is located, and the second region S2 may be the region where the circuit board 800 is located.

[0170] Specifically, the first region S1 of the reinforcing plate 900 may include a first-first region S1-1 where the first adhesive member 1750 is placed, and a first-second region S1-2 where the wire portion 910 is placed. The first region S1 can correspond to the shape of the image sensor 810. For example, the first region S1 may have a rectangular shape corresponding to the shape of the image sensor 810, but is not limited thereto.

[0171] In the first-to-second region S1-2, a first sub-wire portion 911, a second sub-wire portion 912, a third sub-wire portion 913, and a fourth sub-wire portion 914 constituting the wire portion 910 may be formed. In this case, the first sub-wire portion 911, the second sub-wire portion 912, the third sub-wire portion 913, and the fourth sub-wire portion 914 can be positioned spaced apart from each other on the first region S1 of the reinforcing plate 900. For example, the first sub-wire portion 911, the second sub-wire portion 912, the third sub-wire portion 913, and the fourth sub-wire portion 914 can be located in the region of the first region S1 that overlaps with the corner region of the lower surface of the image sensor 810 in the direction of the optical axis. Thus, the first-to-second region S1-2 can be a region that overlaps with the corner region of the lower surface of the image sensor 810 in the direction of the optical axis.

[0172] The first adhesive member 1750 may be placed in the 1-1 region S1-1. For example, the first sub-wire portion 911, the second sub-wire portion 912, the third sub-wire portion 913, and the fourth sub-wire portion 914 may not be placed in the 1-1 region S1, and the first adhesive member 1750 may be placed at a distance from them.

[0173] In the embodiment, as described above, the corner region of the lower surface of the image sensor 810 is supported via the first sub-wire portion 911, the second sub-wire portion 912, the third sub-wire portion 913, and the fourth sub-wire portion 914, and the image sensor 810 is attached or fixed onto the reinforcing plate 900 via the first adhesive member 1750.

[0174] For example, in the comparative example, a first adhesive member was formed on a reinforcing plate, and the image sensor was attached to the first adhesive member. Specifically, in the comparative example, the first adhesive member was applied to the entire area overlapping the image sensor in the direction of the optical axis.

[0175] In contrast, in this embodiment, the first adhesive member 1750 may be formed only on a portion of the lower surface of the image sensor 810. Therefore, the area of ​​the lower surface of the image sensor 810 in this embodiment may be larger than the area of ​​the upper surface of the first adhesive member 1750. For example, the area of ​​the upper surface of the first adhesive member 1750 may be less than 80% of the area of ​​the lower surface of the image sensor 810. For example, the area of ​​the upper surface of the first adhesive member 1750 may be 70% or less of the area of ​​the lower surface of the image sensor 810. For example, the area of ​​the upper surface of the first adhesive member 1750 may be 60% or less of the area of ​​the lower surface of the image sensor 810. For example, the area of ​​the upper surface of the first adhesive member 1750 may be 50% or less of the area of ​​the lower surface of the image sensor 810.

[0176] Preferably, the area of ​​the upper surface of the first adhesive member 1750 is 50% or less of the area of ​​the lower surface of the image sensor 810. In this embodiment, the area of ​​the first adhesive member 1750 is reduced compared to the area of ​​the image sensor 810, thereby minimizing the warping phenomenon that increases in proportion to the area of ​​the first adhesive member 1750.

[0177] Referring to Figure 8, as shown in (a), (b), and (c), the first adhesive member 1750 can have various shapes and be applied to the reinforcing plate 900. However, in this embodiment, the first adhesive member 1750 has a snowflake shape as shown in Figure 8(c). That is, it was confirmed that the degree of warping also changes depending on the application shape of the first adhesive member 1750, and it was confirmed that the degree of warping is lowest when the first adhesive member 1750 is applied in the shape shown in Figure 8(c).

[0178] Furthermore, referring to Figure 9, if the degree of warping of the image sensor 810 is taken as 100% when the area of ​​the first adhesive member 1750 is 75% or more of the area of ​​the lower surface of the image sensor 810, then the degree of warping of the image sensor 810 was 88% when the area of ​​the first adhesive member 1750 is 50% of the area of ​​the lower surface of the image sensor 810.

[0179] In other words, it can be confirmed that the smaller the area of ​​the first adhesive member 1750 that contacts the image sensor 810, the less the effect of the coefficient of thermal expansion, and the smaller the degree of warping. As a result, in this embodiment, the area of ​​the part that contacts the first adhesive member 1750 is 50% or less of the total area of ​​the lower surface of the image sensor 810, thereby minimizing the occurrence of warping of the image sensor 810.

[0180] As described above, in this embodiment, the first adhesive member 1750 is made to contact only a portion of the lower surface of the image sensor 810, thereby minimizing the occurrence of warping of the image sensor 810 and improving the performance of the image sensor.

[0181] On the other hand, the first adhesive member 1750 may be formed on the 1-1 region S1-1 of the first region S1 of the reinforcing plate 900. For example, the first adhesive member 1750 may be formed in the remaining region of the first region S1 of the reinforcing plate 900, excluding the corner region. For example, the first adhesive member 1750 may be formed on the 1-1 region S1-1 of the reinforcing plate 900 in various shapes (preferably a snowflake shape).

[0182] The wire portion 910 may be formed on the first-second region S1-2 of the first region S1 of the reinforcing plate 900. For example, the wire portion 910 may be formed in the corner region of the first region S1 of the reinforcing plate 900.

[0183] The wire portion 910 may include a first sub-wire portion 911 formed in the first corner region of the first region S1 of the reinforcing plate 900. The wire portion 910 may include a second sub-wire portion 912 formed in the second corner region of the first region S1 of the reinforcing plate 900. The wire portion 910 may include a third sub-wire portion 913 formed in the third corner region of the first region S1 of the reinforcing plate 900. The wire portion may include a fourth sub-wire portion 911 formed in the fourth corner region of the first region S1 of the reinforcing plate 900.

[0184] Each sub-wire portion constituting the wire portion 910 can be separated from the first adhesive member 1750 on the first region S1 of the reinforcing plate 900. For example, the first adhesive member 1750 may not be in contact with the wire portion 910. As a result, in this embodiment, the heat generated via the image sensor 810 can be released to the outside through multiple branched paths, thereby improving heat dissipation performance.

[0185] On the other hand, although it was explained above that the number of sub-wire portions constituting the wire portion 910 is four, it is not limited to this. For example, the wire portion 910 may further include sub-wire portions formed between adjacent corner regions among the four corner regions.

[0186] The wire portion 910 can be spaced at a certain distance from the inner wall of the cavity 801 of the circuit board 800. For example, the wire portion 910 can be spaced 100 μm to 250 μm from the inner wall of the cavity 801 of the circuit board 800. If the spacing is less than 100 μm, the adhesion tolerance for attaching the circuit board 800 to the reinforcing plate 900 becomes small, which may cause misalignment between the cavity 801 of the circuit board 800 and the wire portion 910. The circuit board 800 may be damaged by collision between the circuit board 800 and the wire portion 910. Also, if the spacing exceeds 250 μm, the distance between the image sensor and the circuit board increases, which may worsen the reliability of wire bonding to the connecting wire 21.

[0187] The wire portion 910 may overlap with a specific area of ​​the image sensor 810 in the optical axis direction. Preferably, the second extension portion 910-3 of the wire portion 910, which substantially supports the image sensor 810, may overlap with a specific area of ​​the image sensor 810 in the optical axis direction.

[0188] For example, the image sensor 810 may include a pixel region 811 consisting of multiple pixels that sense a light image (image information) incident through a lens, and a passivation region 812 other than the pixel region.

[0189] In this case, the wire portion 910 may be formed such that at least a portion of it overlaps with the pixel area 810 in the corner region of the image sensor 810. For example, the wire portion 910 may be formed in the first region S1 of the reinforcing plate 900 in the region that overlaps with the pixel area 811 of the image sensor 810 in the optical axis direction OA.

[0190] Specifically, the pixel area of ​​the image sensor 810 may include an active pixel area 811-1 used to sense actual image information and a dummy pixel area 811-2 other than the active pixel area 811-1. The active pixel area 811-1 may be used to generate image information using incident light. The dummy pixel area 811-2 is not used to generate image information but may have the same structure as the active pixel area 811-1. That is, the image sensor 810 includes a dummy pixel area 811-2 between the active pixel area 811-1 that generates actual image information and a passivation area 812 that protects it, in order to increase reliability in generating image information.

[0191] Furthermore, in the embodiment, the wire portion 910 may overlap with the corner region of the active pixel region 811-1 of the image sensor in the optical axis direction. That is, the most important region of the image sensor 810 is the active pixel region 811-1, and the flatness of the active pixel region 811-1 substantially determines the performance and operational reliability of the image sensor 810. As a result, in the embodiment, the wire portion 910 supports at least a portion of the active pixel region 811-1.

[0192] Furthermore, in the above embodiment, the wire portion 910 is positioned to overlap with at least a portion of the corner region of the active pixel region 811-1 in the optical axis direction. This allows the lower surface of the image sensor 810 corresponding to the active pixel region 811-1 to be supported by the wire portion 910, thereby minimizing the occurrence of warping of the active pixel region 811-1 of the image sensor 810.

[0193] In other words, when the wire portion 910 overlaps with the active pixel region 811-1 in the optical axis direction, the overall flatness of the active pixel region 811-1 can be maintained, and the resulting warping phenomenon of the image sensor 810 can be minimized.

[0194] The second extension 910-3 of the wire portion 910 may extend in a direction that crosses the corner portions of different regions of the image sensor 810. For example, the second extension 910-3 of the wire portion 910 may extend in a direction that connects the corner of the active pixel region 811-1 of the image sensor 810 with the corner of the adjacent passivation region 812. In this embodiment, the support force of the image sensor 810 by the wire portion 910 can be optimized, and the occurrence of warping can be minimized.

[0195] Figure 12 is a plan view showing the circuit board, reinforcing plate, wire section, and first adhesive member in the state with the image sensor removed according to the second embodiment, and Figure 13 is a diagram for explaining the arrangement relationship between the wire section and the image sensor according to the second embodiment.

[0196] In the first embodiment, the second extension 910-3 of the wire portion 910 is arranged in a direction that connects diagonally opposite corner regions of the image sensor 810.

[0197] Referring to Figures 12 and 13, the multiple sub-wire sections 911a, 911b, 911c, and 911d constituting the wire section 910 may be arranged in a direction that connects adjacent corner regions among the multiple corner regions of the image sensor 810. In this case, the second extensions of each of the sub-wire sections 911a, 911b, 911c, and 911d may extend in different directions. For example, the first sub-wire section 911a may extend in a direction that connects the first and fourth corner regions of the image sensor 810. For example, the second sub-wire section 911b may extend in a direction that connects the first and second corner regions of the image sensor 810. For example, the third sub-wire section 911c may extend in a direction that connects the second and third corner regions of the image sensor 810. For example, the fourth subwire portion 911d may extend in a direction that connects the third and fourth corner regions of the image sensor 810.

[0198] Figure 14 is a graph showing the degree of warping of the image sensor in the comparative example, and Figure 15 is a graph showing the degree of warping of the image sensor including the wire portion in the embodiment.

[0199] Figure 14(a) shows the numerical values ​​of the degree of warping at each position of the image sensor in the comparative example, and (b) shows the degree of warping at each position of the image sensor in the comparative example as a pattern. Referring to Figure 14, it can be confirmed that the image sensor in the comparative example warped by an average of about 7.04 μm.

[0200] Figure 15(a) shows the numerical values ​​of the degree of warping at each position of the image sensor in the embodiment, and (b) shows the degree of warping at each position of the image sensor in the embodiment as a pattern. Referring to Figure 15, it was confirmed that when the wire portion 910 was applied while minimizing the coating area of ​​the first adhesive member according to the embodiment, an average image sensor warping of approximately 4.42 μm occurred, which was improved compared to the comparative example.

[0201] Thus, the embodiment includes a wire portion disposed on a reinforcing plate. The wire portion may be a wire bonded to the reinforcing plate. In this case, the region of the upper surface of the reinforcing plate that overlaps with the image sensor in the optical axis direction includes the region where the wire portion is disposed and the region where an adhesive member for attaching the image sensor is disposed. That is, the adhesive member may be selectively disposed on the region of the upper surface of the reinforcing plate where the wire portion is not formed. In the embodiment, the image sensor can be attached or fixed to the reinforcing plate by the adhesive member with at least a portion of the lower surface of the image sensor in direct contact with and supported by the wire portion. As a result, in the embodiment, the warping phenomenon of the image sensor can be minimized by ensuring that at least a portion of the image sensor is in direct contact with and supported by the wire portion. Furthermore, in the embodiment, the heat generated from the image sensor can be efficiently transferred to the outside by ensuring that at least a portion of the image sensor is in direct contact with the wire portion.

[0202] Furthermore, in the embodiment, the area of ​​the adhesive member placed on the lower surface of the image sensor is made smaller than the area of ​​the lower surface of the image sensor. As a result, in the embodiment, the area of ​​the adhesive member is reduced compared to the area of ​​the image sensor, thereby minimizing the warping of the image sensor, which increases in proportion to the area of ​​the adhesive member.

[0203] Furthermore, in this embodiment, the corner region of the lower surface of the active pixel region of the image sensor and the wire portion are made to be in direct contact with each other. This solves the problem of warping of the active pixel region of the image sensor in this embodiment.

[0204] Figure 16 shows a perspective view of the portable terminal 200A according to the embodiment, and Figure 17 shows a configuration diagram of the portable terminal shown in Figure 16.

[0205] Referring to Figures 16 and 17, the portable terminal 200A (hereinafter referred to as "terminal") may include a body 850, a wireless communication unit 710, an A / V input unit 720, a sensing unit 740, an input / output unit 750, a memory unit 760, an interface unit 770, a control unit 780, and a power supply unit 790.

[0206] The body 850 shown in Figure 16 is in the form of a bar, but is not limited to this, and can have various structures such as a slide type, folder type, swing type, or swirl type in which two or more sub-bodies are connected in a way that allows for relative movement.

[0207] The body 850 may include an external case (casing, housing, cover, etc.). For example, the body 850 may be divided into a front case 851 and a rear case 852. Various electronic components of the terminal device may be incorporated into the space formed between the front case 851 and the rear case 852.

[0208] The wireless communication unit 710 may be configured to include one or more modules that enable wireless communication between the terminal 200A and the wireless communication system, or between the terminal 200A and the network on which the terminal 200A is located. For example, the wireless communication unit 710 may be configured to include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a short-range communication module 714, and a location information module 715.

[0209] The A / V (Audio / Video) input section 720 is for inputting audio or video signals and may include a camera 721 and a microphone 722, etc.

[0210] The camera 721 may include a camera module according to the embodiment shown in Figure 2.

[0211] The sensing unit 740 can sense the current state of the terminal 200A, such as its open / closed state, position, presence or absence of user contact, orientation, and acceleration / deceleration, and generate sensing signals to control the operation of the terminal 200A. For example, if the terminal 200A is in the form of a slide phone, it can sense whether the slide phone can be opened or closed. It also handles sensing functions related to the presence or absence of power supply from the power supply unit 790 and the possibility of connecting external devices to the interface unit 770.

[0212] The input / output unit 750 is for generating inputs or outputs related to vision, hearing, or touch. The input / output unit 750 can generate input data for controlling the operation of the terminal 200A and can also display information processed by the terminal 200A.

[0213] The input / output unit 750 may include a keypad unit 730, a display module 751, an audio output module 752, and a touchscreen panel 753. The keypad unit 730 can generate input data through keypad input.

[0214] The display module 751 may include multiple pixels whose color changes in response to an electrical signal. For example, the display module 751 may include at least one of the following: a liquid crystal display, a thin-film transistor-liquid crystal display, an organic light-emitting diode, a flexible display, or a 3D display.

[0215] The audio output module 752 can output audio data received from the wireless communication unit 710 in call signal reception, communication mode, recording mode, voice recognition mode, or broadcast reception mode, or it can output audio data stored in the memory unit 760.

[0216] The touchscreen panel 753 can convert changes in capacitance caused by a user touching a specific area of ​​the touchscreen into an electrical input signal.

[0217] The memory unit 760 may store programs for processing and controlling the control unit 780, and can temporarily store input / output data (e.g., phone book, messages, audio, still images, photographs, videos, etc.). For example, the memory unit 760 can store images captured by the camera 721, such as photographs or videos.

[0218] The interface unit 770 acts as a passage connecting to external devices connected to the terminal unit 200A. The interface unit 770 receives data transmission from external devices, receives power supply and transmits it to various components inside the terminal unit 200A, and transmits data inside the terminal unit 200A to external devices. For example, the interface unit 770 may include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device equipped with an identification module, an audio I / O (input / output) port, a video I / O (input / output) port, and an earphone port.

[0219] The control unit (controller) 780 can control the overall operation of the terminal device 200A. For example, the control unit 780 can perform related controls and processing for voice calls, data communications, video calls, etc.

[0220] The control unit 780 may include a multimedia module 781 for multimedia playback. The multimedia module 781 may be implemented within the control unit 180 or separately from the control unit 780.

[0221] The control unit 780 can perform pattern recognition processing that recognizes handwritten input or drawing input performed on the touchscreen as characters and images, respectively.

[0222] The power supply unit 790 can receive an external or internal power supply under the control of the control unit 780, and can supply the power necessary for the operation of each component.

[0223] The features, structures, and effects described in the examples above are included in at least one example and are not necessarily limited to just one example. Furthermore, the features, structures, and effects exemplified in each example can be combined or modified and implemented in other examples by a person with ordinary skill in the art to which the example belongs. Therefore, content related to such combinations and modifications should be interpreted as being included within the scope of the examples.

Claims

1. A reinforcing plate made of metal, A circuit board including a cavity is placed on the aforementioned reinforcing plate, A wire portion arranged on the reinforcing plate within the cavity, A first adhesive member is placed on the reinforcing plate within the cavity, An image sensor is disposed on the wire portion and the first adhesive member, and includes a lower surface that is in direct contact with the wire portion. A camera module including a circuit board and a connecting wire that electrically connects the image sensor.

2. The camera module according to claim 1, wherein the uppermost end of the wire portion is located lower than the upper surface of the circuit board.

3. The camera module according to claim 1 or claim 2, wherein the wire portion includes a bump portion bonded to the reinforcing plate and an extension portion extending from the bump portion.

4. The camera module according to any one of claims 1 to 3, wherein the image sensor is a sensor chip including a silicon die.

5. The first adhesive member overlaps with the wire portion in the horizontal direction, The camera module according to any one of claims 1 to 4, wherein the first adhesive member and the wire portion have the same thickness.

6. The wire portion includes a plurality of sub-wire portions that are spaced apart from each other. The camera module according to claim 3, wherein the first adhesive member is arranged in the space between the plurality of subwire portions.

7. The aforementioned plurality of sub-wire sections are The camera module according to claim 6, wherein the optical axis direction of the image sensor overlaps with the corner region of the lower surface of the image sensor.

8. The camera module according to claim 4, wherein the image sensor is electrically connected to the circuit board via the connecting wire while being supported on the reinforcing plate by the wire portion.

9. The camera module according to any one of claims 1 to 8, wherein the wire portion is separated from the inner wall of the cavity of the circuit board.

10. The camera module according to claim 4, wherein the metal of the reinforcing plate includes one of SUS, aluminum, and copper.

11. The camera module according to claim 10, wherein the first adhesive member comprises one of epoxy, a thermosetting adhesive, and an ultraviolet curing adhesive.

12. The extension portion of the wire portion is A first extension portion extending in the optical axis direction from the bump portion, A second extension extends from the first extension in a direction perpendicular to the optical axis and directly contacts the lower surface of the image sensor, The camera module according to claim 3, further comprising: a third extension extending from the second extension to the upper surface of the reinforcing plate and bonded to the upper surface of the reinforcing plate.

13. The width of the bump portion is in the range of 80 μm to 100 μm. The camera module according to claim 12, wherein the height of the bump portion is in the range of 10 μm to 30 μm.

14. The camera module according to claim 12 or claim 13, wherein the height from the lower surface of the bump portion to the uppermost end of the second extension portion is in the range of 30 μm to 50 μm.

15. The camera module according to any one of claims 12 to 14, wherein the length of the second extension is in the range of 10 μm to 30 μm.

16. The present invention further includes a second adhesive member disposed between the reinforcing plate and the circuit board, The camera module according to any one of claims 1 to 15, wherein the second adhesive member includes an opening corresponding to the cavity of the circuit board.

17. The thermal expansion coefficient of the first adhesive member is greater than the thermal expansion coefficient of the reinforcing plate and the thermal expansion coefficient of the image sensor. The camera module according to any one of claims 1 to 16, wherein the thermal expansion coefficient of the image sensor is smaller than the thermal expansion coefficient of the reinforcing plate.

18. The camera module according to any one of claims 1 to 17, wherein the wire portion and the connecting wire contain the same metallic substance.

19. A device comprising: a main body; a camera module disposed on the main body for capturing images of a subject; and a display unit disposed on the main body for outputting images captured by the camera module, The aforementioned camera module is Circuit board including cavity, A reinforcing plate including a first region corresponding to the cavity and a second region on which the circuit board is arranged, A wire portion bonded to the first region of the reinforcing plate, The image sensor is positioned on the wire portion, The lower surface of the image sensor is in direct contact with the wire portion. The wire portion and the image sensor are electrically insulated from each other. The aforementioned wire section is The bump portion bonded onto the reinforcing plate, A first extension portion extending in the optical axis direction from the bump portion, A second extension extends from the first extension in a direction perpendicular to the optical axis and directly contacts the lower surface of the image sensor, It includes a third extension that extends from the second extension to the upper surface of the reinforcing plate and is bonded to the upper surface of the reinforcing plate, The width of the bump portion is in the range of 80 μm to 100 μm. The height of the bump portion is in the range of 10 μm to 30 μm. The height from the lower surface of the bump portion to the uppermost end of the second extension portion is in the range of 30 μm to 50 μm. An optical instrument having a second extension whose length is in the range of 10 μm to 30 μm.

20. The pixel area of ​​the aforementioned image sensor is Includes an active pixel region and a dummy pixel region surrounding the active pixel region, The optical device according to claim 19, wherein the wire portion is in contact with the lower surface of the corner region of the active pixel area.

Images