A system for processing circuit boards, and a method for maintaining the same.

Abstract

To provide a technique capable of maintaining a vacuum transfer chamber while suppressing an increase in occupied area of a system.SOLUTION: A system for processing a substrate comprises: an atmospheric air transfer room; a vacuum transfer chamber; processing modules in each of which a vacuum processing chamber is provided; and a load lock chamber. The vacuum transfer chamber and the load lock chamber are disposed at a height position that a worker can enter, and a space at a lower side of the vacuum transfer chamber is closed from an outer side by the plurality of processing modules except for a surface to which the load lock chamber is connected. A space at a lower side of the load lock chamber is a maintenance passage that the worker enters from a direction except for a surface to which the atmospheric air transfer room is connected, the passage extending to the space at the lower side of the transfer chamber.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a system for processing a substrate and a method for maintaining the same.

Background Art

[0002] In an apparatus for processing a semiconductor wafer (hereinafter referred to as "wafer"), which is a substrate, in a semiconductor device manufacturing process, there is an apparatus that accommodates the wafer in a vacuum processing chamber and supplies a processing gas to perform film formation, etching, etc. In addition, in order to perform efficient processing, a processing system in which a plurality of vacuum processing chambers are connected to a common vacuum transfer chamber is also known.

[0003] As described above, in a processing system including a plurality of vacuum processing chambers, the number of devices provided in the system also increases. On the other hand, when arranging the processing system in a factory with limited floor area, reducing the occupied area (footprint) becomes a major issue. Therefore, when trying to reduce the occupied area by intensively arranging a large number of devices provided in the processing system in a limited space, ensuring a maintenance space for performing maintenance on each device becomes a problem.

[0004] Patent Document 1 describes a substrate processing apparatus in which one side surface of a vacuum transfer chamber having a planar shape configured as a polygon with five or more sides is set as a maintenance area, and a processing chamber for a glass substrate is connected to the other side surface.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] This disclosure provides a technology that enables maintenance of a vacuum transfer chamber while minimizing the increase in the system's footprint. [Means for solving the problem]

[0007] This disclosure relates to a system for processing substrates using a plurality of vacuum processing chambers, An atmospheric transport chamber in which the substrate is transported under an atmospheric atmosphere, A vacuum transport chamber in which the substrate is transported under a vacuum atmosphere, A plurality of processing modules are configured by arranging the vacuum processing chamber and the adjacent equipment attached to the vacuum processing chamber in the vertical direction, The system includes a load lock chamber provided between the atmospheric transport chamber and the vacuum transport chamber, configured to allow switching between an atmospheric atmosphere and a vacuum atmosphere while the substrate is housed inside, The vacuum transfer chamber and the load lock chamber have space on the lower side, The load lock chamber and a plurality of the vacuum processing chambers are connected to the side of the vacuum transfer chamber, and the space below the vacuum transfer chamber is blocked from the outside by a plurality of the processing modules, except for the side to which the load lock chamber is connected. The space below the load lock chamber is accessible from directions other than the surface to which the atmospheric transport chamber is connected. worker It enters and serves as a maintenance passage leading to the space below the vacuum transfer chamber, The vacuum transfer chamber includes a multi-joint arm for transporting substrates provided inside the vacuum transfer chamber, and is connected to the multi-joint arm. The aforementioned A substrate transfer robot is provided having a drive mechanism that is provided to protrude toward the space below the vacuum transfer chamber, and the maintenance passage has width and height dimensions that allow the drive mechanism removed from the vacuum transfer chamber to pass through. The present invention relates to a system in which the drive mechanism is transported while housed in a transport container, and the width and height of the maintenance passage are configured to allow the transport container containing the drive mechanism to pass through. Alternatively, this disclosure relates to a system for processing substrates using a plurality of vacuum processing chambers, An atmospheric transport chamber in which the substrate is transported under an atmospheric atmosphere, A vacuum transport chamber in which the substrate is transported under a vacuum atmosphere, A plurality of processing modules are configured by arranging the vacuum processing chamber and the adjacent equipment attached to the vacuum processing chamber in the vertical direction, The system includes a load lock chamber provided between the atmospheric transport chamber and the vacuum transport chamber, configured to allow switching between an atmospheric atmosphere and a vacuum atmosphere while the substrate is housed inside, The vacuum transfer chamber and the load lock chamber have space on the lower side, The load lock chamber and a plurality of the vacuum processing chambers are connected to the side of the vacuum transfer chamber, and the space below the vacuum transfer chamber is blocked from the outside by a plurality of the processing modules, except for the side to which the load lock chamber is connected. The space below the load lock chamber is accessible from directions other than the surface to which the atmospheric transport chamber is connected. worker It enters and serves as a maintenance passage leading to the space below the vacuum transfer chamber, The aforementioned maintenance passage is provided so as to open to either the left or right side of the load lock chamber when viewed from the atmospheric transport chamber side, and the other side, which extends downward from the load lock chamber, is blocked by the placement of equipment constituting the system. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to perform maintenance of the vacuum transfer chamber while suppressing an increase in the exclusive area of the system.

Brief Description of the Drawings

[0009] [Figure 1] It is a plan view of the substrate processing system of the present disclosure. [Figure 2] It is an external perspective view of the substrate processing system of the present disclosure. [Figure 3] It is a perspective view showing a drive mechanism of an articulated arm and a configuration example of its transfer container. [Figure 4] It is a perspective view showing a configuration example of a slide plate. [Figure 5] It is a plan view showing an arrangement example of the slide plate. [Figure 6A] It is a first explanatory view relating to an example of the carry-out operation of the drive mechanism through a maintenance passage. [Figure 6B] It is a second explanatory view relating to an example of the carry-out operation of the drive mechanism.

Embodiments for Carrying Out the Invention

[0010] <Overall Configuration> The overall configuration of the substrate processing system 1 according to an embodiment of the present disclosure will be described while referring to the plan view of FIG. 1. In FIG. 1, as an example of vacuum processing, a substrate processing system 1 that performs a film forming process on a wafer W as a substrate is illustrated. The substrate processing system 1 includes a carry-in / out port 11, a carry-in / out module 12, a vacuum transfer module 13, and a processing module 3.

[0011] The processing module 3 includes two vacuum processing chambers 31A and 31B that store the wafer W respectively. These vacuum processing chambers 31A and 31B are provided side by side in the lateral direction with a gap between their side walls. In the substrate processing system 1 of this example, the wafers W are collectively transferred into these vacuum processing chambers 31A and 31B by a substrate transfer robot having an articulated arm 24A. And in these vacuum processing chambers 31A and 31B, a film forming process is collectively performed on each wafer W under the same processing conditions.

[0012] Hereinafter, each part constituting the substrate processing system 1 will be described. In FIG. 1, the X-axis direction is the front-rear direction (the base end side of the X-axis is the front), and the Y-axis direction orthogonal to the X-axis is the lateral direction (the same in FIGS. 2, 5, 6A, and 6B). Four loading / unloading ports 11 are connected to the loading / unloading module 12, and a wafer transfer container 10 for accommodating the wafer W is placed on each loading / unloading port 11. In the substrate processing system 1, the loading / unloading port 11, the loading / unloading module 12, and the vacuum transfer module 13 are provided in this order along the front-rear direction. And the processing module 3 is connected to the left and right side surfaces and the rear side surface of the vacuum transfer module 13 when viewed from the front side. That is, three processing modules 3 are connected to the vacuum transfer module 13 of this example so as to surround its side surface from three sides.

[0013] The loading / unloading module 12 includes an atmospheric transfer chamber 12A and a load lock chamber 12B. The atmospheric transfer chamber 12A is in an atmospheric atmosphere and includes an articulated arm 21 for transferring the wafer W between the wafer transfer container 10 and the load lock chamber 12B. The articulated arm 21 is configured to be able to move up and down, swing, and extend and contract. Also, the articulated arm 21 is supported by a base portion 211, and the base portion 211 is configured to be movable in the left-right direction when viewed from the front side along a traveling track 212.

[0014] The load lock chamber 12B is located between the atmospheric transport chamber 12A and the vacuum transport chamber 13. The load lock chamber 12B is configured to allow switching between an atmospheric atmosphere and a vacuum atmosphere while containing wafers W. In this example, the load lock chamber 12B has two mounting sections 22 that are aligned left to right when viewed from the front. The articulated arm 21 of the atmospheric transport chamber 12A transports wafers W between the two mounting sections 22 and the wafer transport container 10, and is configured to transfer one wafer W at a time to the two mounting sections 22. The mounting section 22 includes a substrate support section (not shown) which is composed of support pins that support multiple positions that are offset from the center of the wafer W and separated in the circumferential direction of the wafer W.

[0015] The vacuum transport module 13 includes a vacuum transport chamber 23 in which a vacuum atmosphere is formed, and the vacuum transport chamber 23 is equipped with a multi-joint arm 24A. The multi-joint arm 24A is configured to be able to move up and down, rotate, and extend and retract. The end effector 25 that forms the tip of the multi-joint arm 24A is equipped with two holding parts 26 that are formed apart from each other. By holding one wafer W in each holding part 26, the multi-joint arm 24A can transport two wafers W at once with a predetermined distance between them. For example, two end effectors 25 are provided separated vertically, and one end effector 25 is capable of receiving wafers W from the chambers (load lock chamber 12B, vacuum processing chambers 31A, 31B), while the other end effector 25 is capable of sending wafers W to the chambers.

[0016] As described above, the articulated arm 24A transports the two wafers W together. Therefore, the two wafers W are transported together between the vacuum processing chambers 31A and 31B and the vacuum transport module 13. Similarly, the two wafers W are transported together between the load lock chamber 12B and the vacuum transport module 13. The articulated arm 24A, together with the drive unit 24B described later, constitutes the substrate transport robot in this example.

[0017] Each vacuum processing chamber 31A and 31B is depressurized by a vacuum evacuation mechanism (not shown) to create a vacuum atmosphere. Inside each vacuum processing chamber 31A and 31B, a stage 32 is provided, and the wafer W is placed on this stage 32 while the film deposition process is carried out. For example, when the film deposition process is carried out while heating the wafer W, a heater is provided on the stage 32. In addition, each vacuum processing chamber 31A and 31B is provided with a gas supply unit, which consists of a shower head or the like, to supply film deposition gas to the wafer W placed on the stage 32. Note that these heaters and gas supply units are not shown. Furthermore, the stage 32 is provided with support pins (not shown) for the transfer of wafers W when they are being loaded and unloaded. Here, the vacuum processing chambers 31A and 31B are not limited to being configured to perform film deposition, but may also be configured to perform other processes such as etching, cleaning, and ashing.

[0018] Gate valves G are provided between the atmospheric transport chamber 12A and the load lock chamber 12B, between the load lock chamber 12B and the vacuum transport module 13, and between each of the vacuum processing chambers 31A and 31B in the processing module 3 and the vacuum transport module 13. The gate valves G open and close the transport opening for the wafer W and allow for independent adjustment of the atmosphere inside the atmospheric transport chamber 12A and each of the chambers 12B, 23, 31A, and 31B.

[0019] In the substrate processing system 1 described above, the wafer W is transported from the wafer transport container 10 to the vacuum processing chambers 31A and 31B connected to the vacuum transport module 13, processed, and then returned to the wafer transport container 10.

[0020] <Layout of vacuum transport module 13> The substrate processing system 1, which has the above-described configuration, will now be explained in more detail, with reference to the external perspective view in Figure 2 and other figures. As shown in Figure 1, the vacuum transport module 13 in this example has a configuration in which one load lock chamber 12B and three processing modules 3 are connected to each of the four sides of a vacuum transport chamber 23 that is configured as a square in plan view.

[0021] As shown in the schematic configuration in Figure 6A, the vacuum transfer chamber 23 is configured as a housing that is flattened in the vertical direction, and the load lock chamber 12B and processing module 3 described above are connected to its side walls. As explained using Figure 1, a multi-joint arm 24A is provided inside the vacuum transfer chamber 23, while the drive unit 24B that drives this multi-joint arm 24A is provided outside the vacuum transfer chamber 23.

[0022] As shown in Figure 6A, the vacuum transfer chamber 23 is supported from below by a frame structure 231 and is positioned above the floor F of the semiconductor factory building where the substrate processing system 1 is installed. A space of approximately 1000 to 1600 mm in height is formed between the lower surface of the vacuum transfer chamber 23 supported by the frame structure 231 and the factory floor F.

[0023] Within this space, a cable box 232 containing power supply cables that share power with power-consuming equipment, as well as instrumentation cables, is placed in the area approximately 150 to 300 mm from the floor. Furthermore, the space between the top surface of the cable box 232 and the bottom surface of the vacuum transfer chamber 23 is a maintenance space 230 into which a worker P can enter and perform maintenance work.

[0024] In this example, the vacuum transfer chamber 23 is configured to transfer wafers W using a multi-joint arm 24A at a transfer height of 1500 mm or more from the floor surface F. In conventional vacuum transfer chambers 23, the transfer height was set within a range of approximately 1100 to 1350 mm. In this example, by setting the transfer height of wafers W to a higher position than in conventional systems, a maintenance space 230 that facilitates work for the worker P is secured.

[0025] Furthermore, a drive unit 24B for driving the articulated arm 24A is located in this maintenance space 230. As shown in Figure 3, the drive unit 24B is configured as a vertically elongated columnar body, such as a cylinder, with a height dimension in the range of approximately 550 to 850 mm and a maximum diameter in the range of approximately 350 to 550 mm.

[0026] The drive unit 24B houses a drive mechanism for performing the lifting, lowering, rotating, and extending / retracting movements of the articulated arm 24A. The drive unit 24B is mounted on the center of the lower surface of the vacuum transport chamber 23 with its long axis oriented vertically. The drive unit 24B is suspended and supported so as to protrude downward from the lower surface of the vacuum transport chamber 23 towards the maintenance space 230 (the state in which the drive unit 24B is mounted on the vacuum transport chamber 23 is not shown). The drive unit 24B, together with the articulated arm 24A, constitutes the substrate transport robot of this example.

[0027] <Layout of Processing Module 3> Next, the layout configuration of the processing module 3 connected to the side of the vacuum transfer chamber 23 will be described. As explained using Figure 1, in the substrate processing system 1 of this example, two vacuum processing chambers 31A and 31B are connected to the three sides of the vacuum transfer chamber 23, respectively. Each vacuum processing chamber 31A and 31B is equipped with numerous pieces of equipment, including equipment related to the gas supply unit that supplies the film deposition gas, equipment related to the exhaust system that evacuates the vacuum from the vacuum processing chambers 31A and 31B, a power supply system that supplies power to heaters and the like, and control equipment for various types of control. In the following description, these pieces of equipment will also be referred to as "attached equipment".

[0028] On the other hand, as explained in the background technology section, the substrate processing system 1 requires minimizing the increase in the area occupied by the substrate processing system 1 installed on the factory floor F. In particular, when the two vacuum processing chambers 31A and 31B are arranged next to each other, additional equipment is provided for each of the vacuum processing chambers 31A and 31B, so it is necessary to efficiently arrange these numerous pieces of equipment.

[0029] Therefore, in the substrate processing system 1 of this example, the processing module 3 is constructed by arranging the vacuum processing chambers 31A and 31B and their adjoining equipment in the vertical direction, thereby suppressing the increase in the area occupied by each processing module 3. For example, the processing module 3 is configured by incorporating the aforementioned vacuum processing chambers 31A and 31B and their adjoining equipment into a rack with a frame structure and arranging them in the vertical direction. The processing module 3 may also be configured by covering the outer surface of the rack, which houses a large number of pieces of equipment, with a casing 30. As shown by the dashed lines in Figure 2, within the processing module 3, the vacuum processing chambers 31A and 31B are positioned at a height that allows them to be connected to the vacuum transfer chamber 23.

[0030] The processing modules 3 connected to each of the three sides of the vacuum transfer chamber 23 have a common configuration. By using processing modules 3 with a common configuration, design costs can be reduced compared to providing processing modules 3 with different configurations depending on their placement. Furthermore, it is possible to suppress the occurrence of inconsistencies in the processing conditions of wafers W caused by differences in the placement of vacuum processing chambers 31A, 31B and co-located equipment, and the resulting differences in piping length, thereby enabling uniform film deposition processing between different processing modules 3.

[0031] As illustrated in Figure 1, when viewed from the vacuum transfer chamber 23 side, the width of the processing module 3 is configured to match the width of the side wall of the vacuum transfer chamber 23. Also, when viewed from the same direction, the depth of the processing module 3 is configured to match the depth of the vacuum processing chambers 31A and 31B. In this way, each processing module 3 has a large number of devices arranged in a relatively narrow area.

[0032] As a result of consolidating and arranging numerous devices in each processing module 3 in this way, the upper end of the processing module 3 extends to a position higher than the upper surface of the vacuum transfer chamber 23 supported by the frame 231, as illustrated in Figure 2. The height dimension of the processing module 3 can be exemplified to be in the range of approximately 2500 to 3500 mm.

[0033] Furthermore, as shown in Figure 2, the processing module 3 is configured to extend from the floor surface F of the factory where the substrate processing system 1 is located to a height above the upper surface of the vacuum transfer chamber 23. Because the processing module 3 is provided along the three sides of the vacuum transfer chamber 23 in this configuration, the maintenance space 230 below the vacuum transfer chamber 23, as explained using Figure 6A, is blocked from three sides by these processing modules 3.

[0034] <Layout of atmospheric transport chamber 12A and load lock chamber 12B> Next, the layout configuration of the atmospheric transport chamber 12A and the load lock chamber 12B will be described. As shown in the schematic external configuration in Figure 6A, the load lock chamber 12B is configured as a housing that is flattened in the front-to-back direction. The mounting section 22 inside the load lock chamber 12B is provided such that the wafer W transfer height between the support pin (not shown) and the articulated arm 24A on the vacuum transfer chamber 23 side is the same as the wafer W transfer height (1500 mm or more from the floor surface F) described above. Furthermore, gate valves G are provided on the front and rear sides of the load lock chamber 12B.

[0035] As shown in Figure 6A, the load lock chamber 12B is supported from below by the frame structure 122 and positioned above the floor surface F. A space of approximately 800 to 1400 mm in height is formed between the lower surface of the load lock chamber 12B supported by the frame structure 122 and the floor surface F.

[0036] Within this space, the area approximately 150-300 mm from the floor is where the aforementioned cable box 232 and the like are placed. Furthermore, the space between the top surface of the cable box 232 and the bottom surface of the load lock chamber 12B is connected to the aforementioned maintenance space 230 on the vacuum transfer chamber 23 side, and serves as a maintenance passage 16 through which worker P passes when entering the maintenance space 230.

[0037] As shown in Figure 2, the atmospheric transport chamber 12A comprises a housing that houses a multi-joint arm 21, and the wafer W is transported by the multi-joint arm 21. An input / output port 11 is connected to the front of this housing. The atmospheric transport chamber 12A has a height dimension that extends from the floor surface F to a height position above the top surface of the vacuum transport chamber 23. Furthermore, the width dimension of the atmospheric transport chamber 12A, as viewed from the front, is wider than the width dimensions of the load lock chamber 12B and the vacuum transport chamber 23.

[0038] As shown in the plan view of Figure 1, a recess is formed on the back of the atmospheric transport chamber 12A, and the front half of the load lock chamber 12B is fitted into this recess. This configuration allows for the placement of components of the substrate processing system 1, such as the touch panel display 101 and the control computer (not shown), in the areas on either side of the load lock chamber 12B, while avoiding an unnecessarily large increase in the area occupied by the substrate processing system 1.

[0039] <Maintenance passage> In the substrate processing system 1 having the layout configuration described above, the maintenance space 230 formed on the lower side of the vacuum transfer chamber 23 is blocked from the outside by the processing module 3, except for the side to which the load lock chamber 12B is connected. Here, "blocked" is not limited to cases where adjacent processing modules 3 are densely arranged without gaps. Even if gaps are formed between these processing modules 3, if a worker P cannot enter through those gaps, then these sides can be said to be blocked from the outside by the processing module 3 for the worker P.

[0040] Furthermore, since the atmospheric transport chamber 12A is located in front of the load lock chamber 12B, it is not possible to enter the maintenance space 230 from the front. Therefore, in this example, the substrate processing system 1 is configured so that, when viewed from the front, the worker P enters the maintenance space 230 via the maintenance passage 16 from the side, which is a direction other than the side to which the atmospheric transport chamber 12A is connected (the front of the load lock chamber 12B).

[0041] On the other hand, as previously described, in the substrate processing system 1 of this example, the front half of the load lock chamber 12B is fitted into a recess formed on the back of the air transport chamber 12A. Therefore, in its current state, it may be difficult for worker P to enter the maintenance passage 16 through the gap between the load lock chamber 12B and the processing module 3.

[0042] As shown in Figure 2, a notch 121 is formed in the lower rear right side of the atmospheric transport chamber 12A when viewed from the front. Furthermore, a notch 31 is formed on the processing module 3 side in the area opposite the notch 121 of the atmospheric transport chamber 12A. The tunnel-shaped spaces formed by these notches 121 and 31, together with the space below the load lock chamber 12B, constitute part of the maintenance passage 16. The maintenance passage 16 formed by the notches 121 and 31 opens toward the side of the atmospheric transport chamber 12A, forming an opening 16a, which allows the worker P to enter the maintenance passage 16. An example of the opening dimensions of the opening 16a will be explained later in accordance with the configuration of the transport container 5 of the drive unit 24B. Furthermore, if there is sufficient space between the air transport chamber 12A and the processing module 3, and if worker P can enter, then providing the aforementioned notches 121 and 31 is not a mandatory requirement.

[0043] On the other hand, as previously mentioned, the areas on both sides of the load lock chamber 12B are also used as areas for arranging the components of the substrate processing system 1. In this respect, forming a notch 121 in the atmospheric transport chamber 12A would reduce the space available for arranging the equipment. From this perspective, in the substrate processing system 1 of this example, there is no opening 16a on the left side of the atmospheric transport chamber 12A when viewed from the front (no notch 121 is formed).

[0044] As previously mentioned, in the substrate processing system 1 of this example, the processing modules 3 share a common configuration. Therefore, although not visible in Figure 2, the other processing modules 3 located on the rear and left sides of the vacuum transfer chamber 23 also have notches 31 in common positions. These notches 31 are not sized to allow worker P to enter the maintenance space 230. On the other hand, these notches 31 can be used as windows for letting in light when worker P works in the maintenance space 230, as passages for passing small parts, or as space for power cables for jigs used during maintenance work.

[0045] <Conveying jig for drive unit 24B> Next, an example of the configuration of a jig (transport container 5, slide plate 6) for loading and unloading the drive unit 24B, one of the largest pieces of equipment installed in the vacuum transport chamber 23, via the aforementioned maintenance passage 16 will be described. In the substrate processing system 1 of this example, the drive unit 24B is housed in the transport container 5 and transported by sliding it along the transport path on a detachable slide plate 6 laid out along the transport route.

[0046] <Conveyor Container 5> Figure 3 shows an external perspective view of the drive unit 24B and its transport container 5. As previously described, the drive unit 24B, which is a cylindrical body with a height of approximately 550 to 850 mm, is suspended and supported so as to protrude downward from the bottom surface of the vacuum transport chamber 23, with its long axis oriented vertically. The drive unit 24B also weighs approximately 60 to 100 kg. Therefore, it is difficult to lay the drive unit 24B on its side without using equipment such as a trolley crane or hoisting machine. However, there is little room to place such equipment in the narrow maintenance space 230.

[0047] Therefore, in the substrate processing system 1 of this example, the transport container 5 is configured as a cage-like container capable of housing the drive unit 24B in a vertical position. If the lower end of the drive unit 24B, which is suspended and held from the lower surface of the vacuum transport chamber 23, interferes with the upper end of the transport container 5, a part of the upper side of the transport container 5 may be made into a detachable part 52 that can be attached to and detached from the main body 51, as illustrated in Figure 3. The bottom of the transport container 5 is fitted with a resin plate 53, which reduces friction between it and the slide plate 6, making it easier to slide and move. Furthermore, by not providing casters for movement, the height of the transport container 5 has been reduced.

[0048] When the drive unit 24B is housed in the transport container 5, the overall height dimension is in the range of approximately 600 to 950 mm, and the width dimension is in the range of approximately 400 to 600 mm. Therefore, the height and width of the maintenance passage 16 and opening 16a formed by the air transport chamber 12A and the cutouts 121 and 31 of the processing module 3 are configured to allow the transport container 5, when the drive unit 24B is housed in it, to pass through.

[0049] <Slide Plate 6> The slide plate 6 is installed on the floor of the space below the load lock chamber 12B and the vacuum transfer chamber 23 (maintenance passage 16, maintenance space 230), from the opening 16a of the maintenance passage 16 to the mounting position of the drive unit 24B. In Figure 5, the area where the slide plate 6 is placed is shown by a dashed line. For the sake of illustration, the articulated arm 24A and the mounting part 22 inside the load lock chamber 12B have been omitted in Figure 5 as appropriate.

[0050] In the example shown in Figure 5, the slide plate 6 is provided to extend along the transport path of the drive unit 24B. As shown in Figure 4, protruding wall-like guide sections 62, approximately a few millimeters to a few centimeters in height, are provided at both ends of the transport path formed by the slide plate 6.

[0051] For example, the slide plate 6 is constructed by combining multiple plate members 61 made of polished stainless steel metal plates. By combining multiple plate members 61, the slide plate 6 is configured to be detachably attached to the floor surface of the maintenance passage 16 and the maintenance space 230.

[0052] Here, the resin material that constitutes the resin plate 53 at the bottom of the plate transport container 5 shown in Figure 3 is selected to have a coefficient of friction with the stainless steel plate that constitutes the slide plate 6 in the range of, for example, 0.03 to 0.3. Examples of such resins include polyacetal, polyester, and fluororesin.

[0053] As described above, the slide plate 6 is composed of multiple plate members 61, while the transport container 5 housing the drive unit 24B moves on the slide plate 6 by sliding. Therefore, if there is a step between adjacent plate members 61, the transport container 5, which is sliding, may get caught on the step, hindering its movement.

[0054] Therefore, as shown in the enlarged view in Figure 4, the upper corners of each plate member 61 at the abutment are chamfered. Figure 4 shows an example in which the chamfered portion 611 is formed by chamfering in a curved shape. The shape of the chamfered portion 611 is not limited to a curved shape, and a chamfered inclined shape may also be performed. As for the processing method for forming the chamfered portion 611, a surface pressing process may be performed to crush the upper corners of the abutment, or the corners may be ground off with a grinder.

[0055] <Maintenance work> In the substrate processing system 1 having the configuration described above, an example of maintenance work, including the removal of the drive unit 24B, will be explained with reference to Figures 6A and 6B. For the sake of illustration, the processing module 3 and atmospheric transport chamber 12A are omitted from these figures, but in reality, as shown in Figures 1 and 2, the processing module 3 and atmospheric transport chamber 12A are arranged around the vacuum transport chamber 23 and load lock chamber 12B.

[0056] To begin maintenance work, the processing of wafers W in the substrate processing system 1 is completed, and the vacuum transfer chamber 23 is made into an atmospheric environment. Then, the lid (not shown) on the top side of the vacuum transfer chamber 23 is opened, and the articulated arm 24A is removed using a trolley crane or hoisting machine positioned above the vacuum transfer chamber 23.

[0057] Meanwhile, below the vacuum transport chamber 23 and the load lock chamber 12B, worker P enters the maintenance space 230 via the maintenance passage 16 and installs the slide plate 6. Next, the transport container 5 is brought into the maintenance space 230, the attachment / detachment part 52 is removed, and the lower end portion of the drive unit 24B is inserted into the opening of the main body 51.

[0058] Afterward, the drive unit 24B is removed from the vacuum transport chamber 23, and then the drive unit 24B is gradually lowered and housed in the transport container 5 (main body 51). At this time, the drive unit 24B may be suspended using the aforementioned hoisting machine provided on the upper side of the vacuum transport chamber 23 through the opening in the bottom of the vacuum transport chamber 23, which is provided to connect the articulated arm 24A and the drive unit 24B, and then the drive unit 24B may be gradually lowered. Alternatively, the drive unit 24B may be gradually lowered while supporting the flange portion of the drive unit 24B from below using a jack placed on a stand or the like.

[0059] Once the drive unit 24B is housed inside the transport container 5, the attachment part 52 is attached to the main body 51 to secure the drive unit 24B. Then, worker P pushes the transport container 5 in the direction of travel, causing it to slide (Figure 6A). After passing through the maintenance passage 16 and reaching the position where the opening 16a is formed, the entire transport container 5 is placed on a trolley or the like and transported to the shop where the drive unit 24B will be maintained.

[0060] One possible method for transporting the drive unit 24B is to lift it up to the top of the vacuum transport chamber 23 using a trolley crane or hoisting machine. However, as mentioned above, the drive unit 24B has a height dimension in the range of approximately 550 to 850 mm. In order to remove the entire drive unit 24B by passing it through the area above the processing module 3 and the atmospheric transport chamber 12A shown in Figure 2, it would be necessary to install a large frame around the substrate processing system 1 and then install a trolley crane or hoisting machine. Therefore, compared to transporting only the flat, articulated arm 24A from above, a much larger transport facility would have to be prepared. In this respect, the drive unit 24B can be transported below the vacuum transport chamber 23 using a transport container 5 and a slide plate 6 with a simple configuration.

[0061] When installing the drive unit 24B, transport the drive unit 24B in the reverse order of the above procedure and attach it to the lower surface of the vacuum transport chamber 23. Furthermore, not only is the removal of the drive unit 24B possible, but various maintenance tasks that can be performed from the underside of the load lock chamber 12B and the vacuum transfer chamber 23 are also carried out by the worker P entering the maintenance passage 16 or the maintenance space 230.

[0062] According to the substrate processing system 1 described above, a maintenance passage 16 for worker P to enter the maintenance space 230 below the vacuum transfer chamber 23 is provided below the load lock chamber 12B. By adopting this configuration, it is not necessary to create large gaps between processing modules 3 arranged along the side of the vacuum transfer chamber 23, or to omit the installation of one processing module 3, in order to secure a passage for worker P to enter. Therefore, maintenance of the vacuum transfer chamber 23 can be made possible while keeping the occupied area of ​​the substrate processing system 1 to a minimum.

[0063] Here, the configuration of the substrate processing system 1 is not limited to the example described with reference to Figures 1 and 2. For example, the planar shape of the vacuum transfer chamber 23 may be a long, narrow rectangle in the front-to-back direction, and multiple sets of processing modules 3 may be arranged on the left and right sides when viewed from the front. Alternatively, the planar shape of the vacuum transfer chamber 23 may be pentagonal or more, and processing modules 3 may be connected to each of the sides other than the side to which the load lock chamber 12B is connected.

[0064] Furthermore, it is not a mandatory requirement to provide two vacuum processing chambers 31A and 31B side by side in the horizontal direction for the processing module 3; one vacuum processing chamber may be provided for each, or three or more for each.

[0065] In addition, it is not essential to provide the slide plate 6 along the transport path of the drive unit 24B. The transport container 5 may be directly slid along the floor surface of the maintenance space 230 or the maintenance passage 16.

[0066] Furthermore, various variations in the configuration of the transport container 5 may be adopted. For example, the drive unit 24B may be placed on a caster-equipped base in an upright position or in a position where it has been turned over using a hoisting machine or the like, and then the base may be moved to transport the drive unit 24B.

[0067] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0068] P worker 1. Substrate Processing System 12A Atmospheric Convection Chamber 12B Load Lock Chamber 16 Maintenance Passage 23 Vacuum transfer chamber 3 Processing Modules

Claims

1. A system for processing substrates using multiple vacuum processing chambers, An atmospheric transport chamber in which the substrate is transported under an atmospheric atmosphere, A vacuum transport chamber in which the substrate is transported under a vacuum atmosphere, A plurality of processing modules are configured by arranging the vacuum processing chamber and the adjacent equipment attached to the vacuum processing chamber in the vertical direction, The system includes a load lock chamber provided between the atmospheric transport chamber and the vacuum transport chamber, configured to allow switching between an atmospheric atmosphere and a vacuum atmosphere while the substrate is housed inside, The vacuum transfer chamber and the load lock chamber have space on the lower side, The load lock chamber and a plurality of the vacuum processing chambers are connected to the side of the vacuum transfer chamber, and the space below the vacuum transfer chamber is blocked from the outside by a plurality of the processing modules, except for the side to which the load lock chamber is connected. The space below the load lock chamber serves as a maintenance passage through which an operator can enter from a direction other than the side to which the atmospheric conveying chamber is connected, and to access the space below the vacuum conveying chamber. The vacuum transfer chamber comprises a substrate transfer robot having a multi-joint arm for transporting substrates provided within the vacuum transfer chamber, and a drive mechanism connected to the multi-joint arm and provided to protrude toward the space below the vacuum transfer chamber, and the maintenance passage has width and height dimensions that allow the drive mechanism removed from the vacuum transfer chamber to pass through. The drive mechanism is transported while housed in a transport container, and the width and height of the maintenance passage are configured to allow the transport container containing the drive mechanism to pass through.

2. The system according to claim 1, wherein a sliding plate for sliding the transport container is provided on the floor surface of the space below the vacuum transport chamber and the load lock chamber, from the maintenance passage to the mounting position of the drive mechanism.

3. The system according to claim 2, wherein the slide plate is provided so as to extend along the transport path of the drive mechanism, and protruding wall-shaped guide portions are provided at both ends of the transport path.

4. The system according to claim 2 or 3, wherein the slide plate is configured to be detachable by combining a plurality of plate members, and the corners on the upper side of the abutting portions between adjacent plate members are chamfered to avoid snagging on the sliding transport container.

5. A system for processing substrates using multiple vacuum processing chambers, An atmospheric transport chamber in which the substrate is transported under an atmospheric atmosphere, A vacuum transport chamber in which the substrate is transported under a vacuum atmosphere, A plurality of processing modules are configured by arranging the vacuum processing chamber and the adjacent equipment attached to the vacuum processing chamber in the vertical direction, The system includes a load lock chamber provided between the atmospheric transport chamber and the vacuum transport chamber, configured to allow switching between an atmospheric atmosphere and a vacuum atmosphere while the substrate is housed inside, The vacuum transfer chamber and the load lock chamber have space on the lower side, The load lock chamber and a plurality of the vacuum processing chambers are connected to the side of the vacuum transfer chamber, and the space below the vacuum transfer chamber is blocked from the outside by a plurality of the processing modules, except for the side to which the load lock chamber is connected. The space below the load lock chamber serves as a maintenance passage through which an operator can enter from a direction other than the side to which the atmospheric conveying chamber is connected, and to access the space below the vacuum conveying chamber. The maintenance passage is provided to open to either the left or right side of the load lock chamber when viewed from the atmospheric transport chamber side, and the other side, which extends downward from the load lock chamber, is blocked by the placement of equipment constituting the system.

6. The system according to claim 5, wherein the vacuum transport chamber comprises a substrate transport robot having a multi-joint arm for transporting substrates provided within the vacuum transport chamber and a drive mechanism connected to the multi-joint arm and provided to protrude toward the space below the vacuum transport chamber, and the maintenance passage has width and height dimensions that allow the drive mechanism removed from the vacuum transport chamber to pass through.

7. The system according to claim 1 or 6, wherein the drive mechanism is configured as a vertically elongated columnar body, and the columnar body passes through the maintenance passage with its long axis oriented vertically.

8. The system according to any one of claims 1 to 7, wherein the load lock chamber and the vacuum transport chamber are positioned at a height of 1,500 mm or more from the floor of the building in which the system is installed, for transporting the substrate.

9. A maintenance method for a system that processes substrates using multiple vacuum processing chambers in a vacuum atmosphere, The aforementioned system, The system comprises an atmospheric transport chamber in which the substrate is transported under an atmospheric atmosphere, a vacuum transport chamber in which the substrate is transported under a vacuum atmosphere, a vacuum processing chamber, and a plurality of processing modules arranged vertically with the vacuum processing chamber and the attached equipment, and a load lock chamber provided between the atmospheric transport chamber and the vacuum transport chamber, configured to allow switching between an atmospheric atmosphere and a vacuum atmosphere while containing the substrate. The vacuum transfer chamber and the load lock chamber are positioned at a height that allows an operator to enter from below, The load lock chamber and a plurality of the vacuum processing chambers are connected to the side of the vacuum transfer chamber, and the space below the vacuum transfer chamber is blocked from the outside by a plurality of the processing modules, except for the side to which the load lock chamber is connected. The space below the load lock chamber is accessible from directions other than the surface to which the atmospheric transport chamber is connected, and serves as a maintenance passage leading to the space below the vacuum transport chamber. The vacuum transfer chamber comprises a substrate transfer robot having a multi-joint arm for transporting substrates provided within the vacuum transfer chamber, and a drive mechanism connected to the multi-joint arm and provided to protrude toward the space below the vacuum transfer chamber, and the maintenance passage has width and height dimensions that allow the drive mechanism removed from the vacuum transfer chamber to pass through. The method involves transporting the drive mechanism while housed in a transport container, and performing maintenance by entering the maintenance passage, which is configured such that its width and height allow the transport container containing the drive mechanism to pass through.

10. A maintenance method for a system that processes substrates using multiple vacuum processing chambers in a vacuum atmosphere, The aforementioned system, The system comprises an atmospheric transport chamber in which the substrate is transported under an atmospheric atmosphere, a vacuum transport chamber in which the substrate is transported under a vacuum atmosphere, a vacuum processing chamber, and a plurality of processing modules arranged vertically with the vacuum processing chamber and the attached equipment, and a load lock chamber provided between the atmospheric transport chamber and the vacuum transport chamber, configured to allow switching between an atmospheric atmosphere and a vacuum atmosphere while containing the substrate. The vacuum transfer chamber and the load lock chamber are positioned at a height that allows an operator to enter from below, The load lock chamber and a plurality of the vacuum processing chambers are connected to the side of the vacuum transfer chamber, and the space below the vacuum transfer chamber is blocked from the outside by a plurality of the processing modules, except for the side to which the load lock chamber is connected. The space below the load lock chamber is accessible from directions other than the surface to which the atmospheric transport chamber is connected, and serves as a maintenance passage leading to the space below the vacuum transport chamber. A method of performing maintenance by having a worker enter the maintenance passage, which is provided to open to either the left or right side of the load lock chamber when viewed from the atmospheric transport chamber side, and whose other side, which extends to the lower side of the load lock chamber, is blocked by the placement of equipment constituting the system.

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