Laminated adhesive film used in modified benzocyclobutene-containing FC-BGA mounting carrier boards, its manufacturing method and application

Abstract

To provide a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA-mounted carrier board, a method for manufacturing the same and application.SOLUTION: A laminated adhesive film contains 45 to 100 pts.wt. of an epoxy resin, 40 to 100 pts.wt. of an inorganic filler, 25 to 45 pts.wt. of cyanate ester, 40 to 60 pts.wt. of modified benzocyclobutene, 5 to 10 pts.wt. of an acrylic resin, 5 to 10 pts.wt. of a phenoxide resin, 0.1 to 1 pts.wt. of a solidification accelerator, and 200 to 300 pts.wt. of an organic solvent. The modified benzocyclobutene is one or two of phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene. The performance of the laminated adhesive film is adjusted by further adding modified benzocyclobutene in addition to the epoxy resin, the phenoxide resin, the cyanate ester, and the solidification accelerator. The laminated adhesive film has excellent dielectric characteristics and can reduce dielectric loss, by adding various modified benzocyclobutene and other raw material components. The laminated adhesive film has excellent flame retardant performance, thereby the laminated adhesive film is used in an FC-BGA-mounted carrier board, and can satisfy needs of high-speed and high integration of the electronic component.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention belongs to the technical field of resin composite materials, and particularly relates to a laminated adhesive film used for a modified benzocyclobutene-containing FC-BGA mounting carrier board, a manufacturing method thereof, and an application thereof.

Background Art

[0002] A flip-chip ball grid array (abbreviated as FC-BGA) substrate is a high-density packaging carrier board that can achieve high speed and multi-function of chips. With the increase in the wiring density of very large scale integration circuits, there is a possibility that RC delay (resistance-capacitance delay) may easily occur in the resistance of metal interconnection lines and the capacitance of interlayer dielectrics within electronic components. As a result, there may be problems such as signal transmission delay and power loss.

[0003] The laminated adhesive film is the most important material in the SAP (semi-additive process) manufacturing process of FC-BGA carrier boards. When the laminated adhesive film has the drawback of poor dielectric properties, it has a great impact on the application of using the laminated adhesive film in integrated circuits. In addition, the main component of the laminated adhesive film is a polymer material, and the polymer material is a combustible substance. When the polymer material burns, a large amount of thick smoke and toxic gases are released. Therefore, improving the flame retardant performance of polymer materials has become an important issue for laminated adhesive films.

[0004] Therefore, it is necessary to improve or change the conventional technology.

Summary of the Invention

Problems to be Solved by the Invention

[0005] To overcome the shortcomings of conventional technologies, the present invention aims to solve the problem that conventional laminated adhesive films cannot meet the needs for dielectric properties and flame retardancy by providing a laminated adhesive film used in modified benzocyclobutene-containing FC-BGA mounting carrier boards, a method for manufacturing the same, and its applications. [Means for solving the problem]

[0006] This invention employs the following technical principles to solve the technical problems of the prior art. In a first example of the present invention, a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following components by weight: 45 to 100 grams by weight of epoxy resin, 40 to 100 grams by weight of inorganic filler, 25 to 45 grams by weight of cyanate ester, 40 to 60 grams by weight of modified benzocyclobutene, 5 to 10 grams by weight of acrylic resin, 5 to 10 grams by weight of phenoxide resin, 0.1 to 1 gram by weight of solidification accelerator, and 200 to 300 grams by weight of organic solvent. The modified benzocyclobutene is one or two of phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene.

[0007] Preferably, as the phosphorus-containing benzocyclobutene, one or at least two combinations of phosphorus-containing benzocyclobutene I, phosphorus-containing benzocyclobutene II, and phosphorus-containing benzocyclobutene III are selected. The chemical structure of the phosphorus-containing benzocyclobutene I is, The filename is JPEG0007846185000001.jpg67170. The chemical structure of the phosphorus-containing benzocyclobutene II is, The filename is JPEG0007846185000002.jpg56170. The chemical structure of the phosphorus-containing benzocyclobutene III is, The filename is JPEG0007846185000003.jpg66170.

[0008] Preferably, as the nitrogen-containing benzocyclobutene, one or at least two combinations of nitrogen-containing benzocyclobutene I, nitrogen-containing benzocyclobutene II, and nitrogen-containing benzocyclobutene III are selected. The chemical structure of the nitrogen-containing benzocyclobutene I is, The filename is JPEG0007846185000004.jpg62170. The chemical structure of the nitrogen-containing benzocyclobutene II is, The filename is JPEG0007846185000005.jpg48170. The chemical structure of the nitrogen-containing benzocyclobutene III is, The filename is JPEG0007846185000006.jpg45170.

[0009] Preferably, the epoxy resin is selected from one or at least two of the following: bisphenol-type epoxy resin, biphenyl-type epoxy resin, naphthalene-type epoxy resin, naphthalene-type epoxy resin, linear phenol-type epoxy resin, dicyclopentadiene-type epoxy resin, arylalkyl-type phenol-type epoxy resin, arylalkylbiphenyl-type phenol-type epoxy resin, and naphthol-type phenol-type epoxy resin.

[0010] Preferably, the inorganic filler is selected from one or at least two of the following: silicon dioxide, aluminum oxide, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium dioxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, and zirconium phosphate.

[0011] Preferably, as the solidification accelerator, one or at least two of the following are selected: 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole.

[0012] Preferably, the organic solvent is selected from one or at least two of the following: toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide.

[0013] Preferably, the laminated adhesive film further contains 3 to 9 units by weight of other additives, the other additives being selected from one or at least two of the following: thickeners, defoamers, homogenizers, leveling agents, adhesion enhancers, and colorants.

[0014] In a second example of the present invention, a method for producing a laminated adhesive film used in the modified benzocyclobutene-containing FC-BGA mounting carrier board is provided. The production method includes the step of obtaining a laminated adhesive film by uniformly mixing each component of the laminated adhesive film, then applying the mixture onto a substrate and drying it. The drying temperature is 80 to 130°C, and the drying time is 3 to 10 minutes.

[0015] In a third example of the present invention, an application is provided in which the laminated adhesive film used in the modified benzocyclobutene-containing FC-BGA mounting carrier board is used in the FC-BGA mounting carrier board. [Effects of the Invention]

[0016] This invention provides a laminated adhesive film used in FC-BGA mounting carrier boards containing modified benzocyclobutene, a method for producing the same, and its applications. This invention adjusts the performance of the laminated adhesive film by adding modified benzocyclobutene in addition to epoxy resin, phenoxide resin, cyanate ester, solidification accelerator, etc. By adding various modified benzocyclobutenes and other raw material components, the laminated adhesive film of this invention possesses excellent dielectric properties and can reduce dielectric loss. Furthermore, because the laminated adhesive film possesses excellent flame retardancy, it can be used in FC-BGA mounting carrier boards to meet the needs for high-speed and high-integration electronic components.

[0017] In the embodiments of the present invention, a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board, a method for producing the same, and its applications are provided. In order to provide a more detailed and clear understanding of the object, technical matters, and effects of the present invention, the matters of the present invention will be described in more detail below. The specific embodiments described below are illustrative of the present invention and do not limit it. [Modes for carrying out the invention]

[0018] In an embodiment of the present invention, a layered adhesive film is provided for use in an FC-BGA packaging carrier board containing modified benzocyclobutene. The layered adhesive film contains the following components by weight: 45 to 100 grams by weight of epoxy resin, 40 to 100 grams by weight of inorganic filler, 25 to 45 grams by weight of cyanate ester, 40 to 60 grams by weight of modified benzocyclobutene, 5 to 10 grams by weight of acrylic resin, 5 to 10 grams by weight of phenoxide resin, 0.1 to 1 gram by weight of curing accelerator, and 200 to 300 grams by weight of organic solvent. The modified benzocyclobutene can be one or two of the following: phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene.

[0019] In the embodiments of the present invention, the dielectric properties can be improved by using modified benzocyclobutene. Specifically, when phosphorus-containing benzocyclobutene undergoes ring cleavage, it does not release any small molecules and has low intramolecular polarity, so the resin formed by the solidification of this phosphorus-containing benzocyclobutene has low dielectric properties. Nitrogen-containing benzocyclobutene has low polarizability of the chemical bond of functional groups such as benzene rings and heterocyclic rings, and the functional groups contain large-volume structures, which can increase the free volume of the polymer. By using nitrogen-containing benzocyclobutene, low-polarity, large-volume rigid functional groups can be introduced into the laminated adhesive film, thereby reducing the dielectric constant and dielectric loss.

[0020] In the embodiments of the present invention, by using modified benzocyclobutene (phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene) together, the dielectric constant and dielectric loss tangent of the laminated adhesive film can be reduced. During the high-temperature solidification process, the four-membered rings of phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene undergo a cross-linking reaction, forming a cyclic compound and creating a network interconnection structure between them. This reduces molecular polarization and improves dielectric properties.

[0021] In the process of high-temperature curing, phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene undergo a ring-opening cross-linking reaction to form a phosphorus-nitrogen flame retardant system. The phosphorus element forms a phosphorus-containing carbon layer with good stability in the condensed phase flame retardant, and the nitrogen element can dilute the concentration of combustible gas by forming non-toxic flame retardant gas at high temperature. In addition, the phosphorus element and the nitrogen element form a foamy porous expanded carbon layer. By preventing the intrusion of combustible gas into the gas phase, the porous expanded carbon layer can achieve heat insulation and oxygen isolation, and improve the flame retardant performance of the laminated adhesive film.

[0022] In an embodiment of the present invention, the thickness of the laminated adhesive film is 10 - 100 μm.

[0023] In an embodiment of the present invention, the weight fraction of the epoxy resin is 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 or 100; the weight fraction of the inorganic filler is 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 or 100; the weight fraction of the cyanate ester is 25, 30, 35, 40 or 45; the weight fraction of the modified benzocyclobutene is 40, 45, 50, 55 or 60; the weight fraction of the acrylic resin is 5, 6, 7, 8, 9 or 10; the weight fraction of the phenoxide resin is 5, 6, 7, 8, 9 or 10; the weight fraction of the curing accelerator is 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9 or 1; and the weight fraction of the organic solvent can be 200, 210, 220, 230, 240, 250, 260, 270, 280, 290 or 300.

[0024] In the embodiments of the present invention, the phosphorus-containing benzocyclobutene can be selected from one or at least two combinations of phosphorus-containing benzocyclobutene I, phosphorus-containing benzocyclobutene II, and phosphorus-containing benzocyclobutene III. The chemical structure of the phosphorus-containing benzocyclobutene I is, The filename is JPEG0007846185000007.jpg66170. The chemical structure of the phosphorus-containing benzocyclobutene II is, The filename is JPEG0007846185000008.jpg54170. The chemical structure of the phosphorus-containing benzocyclobutene III is, The filename is JPEG0007846185000009.jpg65170.

[0025] When phosphorus-containing benzocyclobutene undergoes ring cleavage, it does not release any small molecules and has low intramolecular polarity; therefore, the resin formed by the solidification of this phosphorus-containing benzocyclobutene has low dielectric properties.

[0026] In the embodiments of the present invention, the nitrogen-containing benzocyclobutene can be selected from one or at least two combinations of nitrogen-containing benzocyclobutene I, nitrogen-containing benzocyclobutene II, and nitrogen-containing benzocyclobutene III. The chemical structure of the nitrogen-containing benzocyclobutene I is, The filename is JPEG0007846185000010.jpg62170. The chemical structure of the nitrogen-containing benzocyclobutene II is, The filename is JPEG0007846185000011.jpg47170. The chemical structure of the nitrogen-containing benzocyclobutene III is, The filename is JPEG0007846185000012.jpg45170.

[0027] The low polarity of the chemical bonds of functional groups such as benzene rings and heterocycles in nitrogen-containing benzocyclobutene, and the presence of large-volume structures in the functional groups, can increase the free volume of the polymer. By using nitrogen-containing benzocyclobutene, low-polarity, large-volume, rigid functional groups can be introduced into laminated adhesive films, thereby reducing the dielectric constant and dielectric loss.

[0028] In the embodiments of the present invention, the epoxy resin can be selected from any one or at least two of the following: bisphenol type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, linear phenolic type epoxy resin, dicyclopentadiene type epoxy resin, arylalkyl type phenolic type epoxy resin, arylalkyl biphenyl type phenolic type epoxy resin, and naphthol type phenolic type epoxy resin.

[0029] In embodiments of the present invention, one or at least two of the following can be selected as the inorganic filler: silicon dioxide, aluminum oxide, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium dioxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, and zirconium phosphate.

[0030] In the embodiments of the present invention, "XX-5598Z" from Sekisui Chemical Co., Ltd. can be used as the acrylic resin.

[0031] In embodiments of the present invention, the phenoxide resin can be any one or a combination of at least two of the following: FX280 (product of Nippon Steel Corporation), FX293 (product of Nippon Steel Corporation), YX8100 (product of Mitsubishi Chemical Corporation), YX7553BH30 (product of Mitsubishi Chemical Corporation), YX7200B35 (product of Mitsubishi Chemical Corporation), or TER240C30 (product of Tongyu Advanced Materials (Guangdong) Co., LTD. of China).

[0032] In the embodiments of the present invention, one or at least two of the following can be selected as the solidification accelerator: 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole.

[0033] In the embodiments of the present invention, the organic solvent can be selected from one or at least two of the following: toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide.

[0034] In embodiments of the present invention, the laminated adhesive film may further contain 3 to 9 units by weight of other auxiliary agents. The other auxiliary agents may be selected from one or at least two combinations of a thickener, a defoamer, a homogenizer, a leveling agent, an adhesion enhancer, and a coloring agent.

[0035] In an embodiment of the present invention, a method for producing a laminated adhesive film used in the modified benzocyclobutene-containing FC-BGA mounting carrier board is further provided. The production method includes the step of obtaining a laminated adhesive film by uniformly mixing each component of the laminated adhesive film, then applying the mixture onto a substrate and drying it. The drying temperature is 80 to 130°C, and the drying time is 3 to 10 minutes.

[0036] In the embodiments of the present invention, the thickness of the substrate can be 10 to 150 μm. Specifically, the thickness of the substrate can be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, or 150 μm.

[0037] It should be noted that this embodiment does not specifically limit the substrate, and commonly used substrates in this art can be used directly. Exemplary substrates of the present invention may be, but are not limited to, PET release film, polyethylene film, polypropylene film, or polyvinyl chloride film. Corona treatment can be performed beforehand on polyethylene film, polypropylene film, or polyvinyl chloride film to facilitate later removal of the substrate.

[0038] In embodiments of the present invention, the drying temperature may be 80°C, 90°C, 100°C, 110°C, 120°C, or 130°C, and the drying time may be 3 min, 4 min, 5 min, 6 min, 7 min, 8 min, 9 min, or 10 min.

[0039] In embodiments of the present invention, the method for manufacturing the laminated adhesive film used in the modified benzocyclobutene-containing FC-BGA mounting carrier board may further include other steps. These other steps involve removing the substrate.

[0040] In the embodiments of the present invention, the laminated adhesive film used in the modified benzocyclobutene-containing FC-BGA mounting carrier board is further provided as an application for use in the FC-BGA mounting carrier board.

[0041] Although the technical aspects of the embodiments of the present invention have been described in detail and completely above, these embodiments represent only a portion of the present invention and do not represent all embodiments of the present invention. In other words, these embodiments illustrate the aspects of the present invention but do not limit it. A person skilled in the art can conceive of other embodiments of the present invention by referring to these embodiments without having to make a creative invention, and it is natural that such embodiments are also included in the present invention.

[0042] The following materials can be selected as some of the components in the embodiments of the present invention. Specifically, epoxy resin, inorganic filler, cyanate ester, acrylic resin, and phenoxide resin can be selected. For epoxy resin, biphenyl type epoxy resin ("NC-3000-L" manufactured by Nippon Kayaku Co., Ltd.), phenol type epoxy resin ("WHR-991S" manufactured by Nippon Kayaku Co., Ltd.), bisphenol A type epoxy resin ("jER828EL" manufactured by Mitsubishi Chemical Corporation), and naphthalene type epoxy resin ("HP-6000" manufactured by DIC Corporation) can be selected. For inorganic filler, spherical silica ("SOC2" manufactured by ADMA Corporation) can be selected. For cyanate ester, "BA230S75" manufactured by Lonza Japan Corporation can be selected. For acrylic resin, "XX-5598Z" manufactured by Sekisui Chemical Co., Ltd. can be selected. For phenoxide resin, "YX7553BH30" manufactured by Mitsubishi Chemical Corporation can be selected.

[0043] <Example 1> In this embodiment, a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following raw materials in units of weight. That is, It may contain 30 wts of biphenyl-type epoxy resin (NC-3000-L), 5 wts of phenol-type epoxy resin (WHR-991S), 10 wts of bisphenol A-type epoxy resin (jER828EL), 100 wts of spherical silica (SOC2), 45 wts of cyanate ester (BA230S75), 60 wts of phosphorus-containing benzocyclobutene, 10 wts of acrylic resin (XX-5598Z), 5 wts of phenoxide resin (YX7553BH30), 0.1 wts of 4-dimethylaminopyridine (DMAP), and 300 wts of cyclohexanone.

[0044] The method for manufacturing the laminated adhesive film includes the steps of taking each raw material of the laminated adhesive film in the proportions described above, mixing them evenly, applying the mixture onto a PET release film, and drying it at a temperature of 80°C for 10 minutes, and then removing the PET release film to obtain a laminated adhesive film with a thickness of 100 μm.

[0045] <Example 2> In this embodiment, a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following raw materials in units of weight. That is, It may contain 30 wts of biphenyl-type epoxy resin (NC-3000-L), 5 wts of phenol-type epoxy resin (WHR-991S), 10 wts of bisphenol A-type epoxy resin (jER828EL), 100 wts of spherical silica (SOC2), 45 wts of cyanate ester (BA230S75), 60 wts of nitrogen-containing benzocyclobutene, 10 wts of acrylic resin (XX-5598Z), 5 wts of phenoxide resin (YX7553BH30), 0.1 wts of 4-dimethylaminopyridine (DMAP), and 300 wts of cyclohexanone.

[0046] The method for manufacturing the laminated adhesive film includes the steps of taking each raw material of the laminated adhesive film in the proportions described above, mixing them evenly, applying the mixture onto a PET release film, and drying it at a temperature of 130°C for 3 minutes, and then removing the PET release film to obtain a laminated adhesive film with a thickness of 100 μm.

[0047] <Example 3> In this embodiment, a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following raw materials in units of weight. That is, It may contain 30 wts of biphenyl-type epoxy resin (NC-3000-L), 5 wts of phenol-type epoxy resin (WHR-991S), 10 wts of bisphenol A-type epoxy resin (jER828EL), 100 wts of spherical silica (SOC2), 25 wts of cyanate ester (BA230S75), 30 wts of phosphorus-containing benzocyclobutene, 30 wts of nitrogen-containing benzocyclobutene, 10 wts of acrylic resin (XX-5598Z), 5 wts of phenoxide resin (YX7553BH30), 0.1 wts of 4-dimethylaminopyridine (DMAP), and 300 wts of cyclohexanone.

[0048] The method for manufacturing the laminated adhesive film includes the steps of taking each raw material of the laminated adhesive film in the proportions described above, mixing them evenly, applying the mixture onto a PET release film, and drying it at a temperature of 110°C for 5 minutes, and then removing the PET release film to obtain a laminated adhesive film with a thickness of 40 μm.

[0049] <Example 4> In this embodiment, a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following raw materials in units of weight. That is, It may contain 100 wts of naphthalene-type epoxy resin (HP-6000), 40 wts of spherical silica (SOC2), 45 wts of cyanate ester (BA230S75), 40 wts of phosphorus-containing benzocyclobutene, 5 wts of acrylic resin (XX-5598Z), 5 wts of phenoxide resin (YX7553BH30), 1 wt of 2-ethyl-4-methylimidazole (2E4MI), and 200 wts of butanone.

[0050] The method for manufacturing the laminated adhesive film includes the steps of taking each raw material of the laminated adhesive film in the proportions described above, mixing them evenly, applying the mixture onto a PET release film, and drying it at a temperature of 80°C for 10 minutes, and then removing the PET release film to obtain a laminated adhesive film with a thickness of 100 μm.

[0051] <Example 5> In this embodiment, a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following raw materials in units of weight. That is, It may contain 80 wts of naphthalene-type epoxy resin (HP-6000), 60 wts of spherical silica (SOC2), 30 wts of cyanate ester (BA230S75), 50 wts of nitrogen-containing benzocyclobutene, 5 wts of acrylic resin (XX-5598Z), 5 wts of phenoxide resin (YX7553BH30), 0.5 wts of 2-ethyl-4-methylimidazole (2E4MI), and 250 wts of butanone.

[0052] The method for manufacturing the laminated adhesive film includes the steps of taking each raw material of the laminated adhesive film in the proportions described above, mixing them evenly, applying the mixture onto a PET release film, and drying it at a temperature of 80°C for 10 minutes, and then removing the PET release film to obtain a laminated adhesive film with a thickness of 100 μm.

[0053] <Example 6> In this embodiment, a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board is provided. The laminated adhesive film contains the following raw materials in units of weight. That is, It may contain 100 wts of naphthalene-type epoxy resin (HP-6000), 40 wts of spherical silica (SOC2), 45 wts of cyanate ester (BA230S75), 25 wts of phosphorus-containing benzocyclobutene, 25 wts of nitrogen-containing benzocyclobutene, 5 wts of acrylic resin (XX-5598Z), 5 wts of phenoxide resin (YX7553BH30), 1 wt of 2-ethyl-4-methylimidazole (2E4MI), and 200 wts of butanone.

[0054] The method for manufacturing the laminated adhesive film includes the steps of taking each raw material of the laminated adhesive film in the proportions described above, mixing them evenly, applying the mixture onto a PET release film, and drying it at a temperature of 80°C for 10 minutes, and then removing the PET release film to obtain a laminated adhesive film with a thickness of 100 μm.

[0055] <Contrastive Proportionality 1> This invention provides a laminated adhesive film. The laminated adhesive film contains the following raw materials, measured by weight. That is, It may contain 30 wts of biphenyl-type epoxy resin (NC-3000-L), 5 wts of phenol-type epoxy resin (WHR-991S), 10 wts of bisphenol A-type epoxy resin (jER828EL), 100 wts of spherical silica (SOC2), 25 wts of cyanate ester (BA230S75), 10 wts of acrylic resin (XX-5598Z), 5 wts of phenoxide resin (YX7553BH30), 0.1 wts of 4-dimethylaminopyridine (DMAP), and 300 wts of cyclohexanone.

[0056] The method for manufacturing the laminated adhesive film includes the steps of taking each raw material of the laminated adhesive film in the proportions described above, mixing them evenly, applying the mixture onto a PET release film, and drying it at a temperature of 80°C for 10 minutes, and then removing the PET release film to obtain a laminated adhesive film with a thickness of 100 μm.

[0057] The performance of the laminated adhesive film provided is measured in proportion to that of the above-described embodiment. The measurement method is as follows.

[0058] Dielectric constant and dielectric loss tangent: First, the laminated adhesive film with a PET release film, provided in proportion to the above embodiment, is solidified at a temperature of 180°C for 30 minutes, and then the release film is removed to obtain a pre-solidified laminated adhesive film. Next, three test strips measuring 2 mm x 80 mm are obtained by cutting the pre-solidified laminated adhesive film. Then, the dielectric constant and dielectric loss tangent of each test strip are measured using Agilent Technologies Inc.'s "HP8362B" and the cavity resonance perturbation method, in an environment with a measurement frequency of 5.8 GHz and a measurement temperature of 23°C. Finally, the dielectric constant and dielectric loss tangent are obtained by calculating the average value of the dielectric constant and dielectric loss tangent of the three test strips.

[0059] Flame retardancy: A laminate is obtained by pressing a laminated adhesive film with a PET release film in proportion to that of the above example onto a substrate (MCL-E-705G from Hitachi Chemical Co., Ltd.) using a laminator, and pressing the laminated adhesive film (one side of the laminated adhesive film without the PET release film) onto both sides of the substrate. After the pressing process is complete, the PET release film is removed from the laminate and the laminated adhesive film is solidified (solidification is carried out at a temperature of 190°C for 90 minutes) to form a solidified material on both sides of the substrate. Finally, the laminate (thickness of approximately 380 μm) is cut into a sample with dimensions of 12.7 mm × 127 mm and a margin size of 1.27 mm, and the sample is measured according to the UL-94V standard and the measurement results are recorded.

[0060] The results obtained by measuring the performance of the laminated adhesive film in proportion to the examples are shown in Table 1. JPEG0007846185000013.jpg74170

[0061] Although embodiments of the present invention have been described in detail above, these embodiments are merely illustrative examples of the present invention, and therefore the present invention is not limited to the configurations of these embodiments. Persons of the art can make improvements or modifications to the design, etc., without departing from the spirit of the present invention, and such improvements or modifications will naturally still be included within the scope of the claims of the present invention.

Claims

1. A laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board, The laminated adhesive film contains the following components by weight: 45 to 100 grams by weight of epoxy resin, 40 to 100 grams by weight of inorganic filler, 25 to 45 grams by weight of cyanate ester, 40 to 60 grams by weight of modified benzocyclobutene, 5 to 10 grams by weight of acrylic resin, 5 to 10 grams by weight of phenoxide resin, 0.1 to 1 gram by weight of solidification accelerator, and 200 to 300 grams by weight of organic solvent. The modified benzocyclobutene is one or two of the following: phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene. The phosphorus-containing benzocyclobutene is one or at least two of the following: phosphorus-containing benzocyclobutene I, phosphorus-containing benzocyclobutene II, and phosphorus-containing benzocyclobutene III. The chemical structure of the phosphorus-containing benzocyclobutene I is, And, The chemical structure of the phosphorus-containing benzocyclobutene II is, And, The chemical structure of the phosphorus-containing benzocyclobutene III is, And, The nitrogen-containing benzocyclobutene is one or at least two of nitrogen-containing benzocyclobutene I, nitrogen-containing benzocyclobutene II, and nitrogen-containing benzocyclobutene III. The chemical structure of the nitrogen-containing benzocyclobutene I is, And, The chemical structure of the nitrogen-containing benzocyclobutene II is, And, The chemical structure of the nitrogen-containing benzocyclobutene III is, A laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board, characterized by the above.

2. The laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board according to claim 1, characterized in that the epoxy resin is selected from one or at least two of the following: bisphenol-type epoxy resin, biphenyl-type epoxy resin, naphthalene-type epoxy resin, naphthalene-type epoxy resin, linear phenol-type epoxy resin, dicyclopentadiene-type epoxy resin, arylalkyl-type phenol-type epoxy resin, arylalkylbiphenyl-type phenol-type epoxy resin, and naphthol-type phenol-type epoxy resin.

3. The laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board according to claim 1, characterized in that one or at least two of the following are selected as the inorganic filler: silicon dioxide, aluminum oxide, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium dioxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, and zirconium phosphate.

4. The laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board according to claim 1, characterized in that one or at least two of the following are selected as the solidification accelerator: 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole.

5. The laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board according to claim 1, characterized in that one or at least two of the following are selected as the organic solvent: toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide.

6. The laminated adhesive film further comprises 3 to 9 weights of other auxiliary agents, wherein the other auxiliary agents are selected from one or at least two combinations of a thickener, a defoaming agent, a homogenizer, a leveling agent, an adhesion enhancer, and a colorant, as described in claim 1, and is used for a modified benzocyclobutene-containing FC-BGA mounting carrier board.

7. A method for producing a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board according to any one of claims 1 to 6, The above manufacturing method is characterized by comprising the step of obtaining a laminated adhesive film by uniformly mixing each component of the laminated adhesive film, then applying the mixture onto a substrate and drying it.

8. An application of using a laminated adhesive film used in a modified benzocyclobutene-containing FC-BGA mounting carrier board according to any one of claims 1 to 6 above, in an FC-BGA mounting carrier board.

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