Method and apparatus for separating semiconductor components from carriers

Abstract

The invention relates to a method for separating a semiconductor component (21) from a carrier (22), the semiconductor component (21) being held in a material-bonded manner in a connection surface (24) on the carrier (22) by a metal bonding agent (23), the method comprising the steps of: a. liquefying the bonding agent (23) and holding the semiconductor component (21) by the holding tool (11); b. vibrating the holding tool (11); c. displacing the holding tool (11) to separate the semiconductor component (21) from the carrier (22); Includes. Furthermore, the present invention relates to an apparatus (10) for separating a semiconductor component (21) held in a material-bonding manner on a carrier (22) by a bonding agent (23), the apparatus comprising a holding tool (11) and at least one drive device.

Description

Technical Field

[0001] The present invention relates to a method for separating semiconductor components from a carrier according to claim 1, and an apparatus for separating semiconductor components from a carrier according to claim 10.

Background Art

[0002] Semiconductor components are typically applied in a material bonding manner onto a carrier via a metal bonding agent in order to obtain semiconductor devices. On the one hand, the metal bonding agent holds the semiconductor component on the carrier, and on the other hand, conducts the current necessary to operate the semiconductor component. In particular, the waste generated during the manufacture of semiconductor components is a problem from an ecological perspective. Due to the progress of digitization in all areas of life, the demand for semiconductor devices, the resulting shortage of resources, and the increasing awareness of the impact of humanity on the environment, the diversion, recycling and / or repair of installed semiconductor components, in particular semiconductor chips, and semiconductor devices, is attracting more and more attention. For this purpose, it is necessary to remove defective semiconductor components from the carrier in order to replace them with functional components and to enable the continued use of the devices formed from the semiconductor components. Furthermore, when old semiconductor devices are defective and / or worn out, semiconductor components that are still functional can be separated from the old semiconductor devices to find new uses in new semiconductor devices. However, this is only possible if the removal is carried out so as to prevent damage to other elements of the semiconductor device and / or to the semiconductor component itself.

[0003] However, the problem is that semiconductor components and / or carriers are sensitive and break particularly when excessive mechanical force is applied. Nevertheless, in order to overcome the binding force and adhesive force of the bonding agent, a certain amount of force is required even after the fusion of the bonding agent, and the binding force and adhesive force are higher than the mechanical load threshold of the semiconductor component and / or carrier. For this reason, simple separation by lifting the semiconductor component involves the risk of destroying the semiconductor component, the carrier, or in the worst case, the entire semiconductor device. [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] As a result, there is a great need for methods and apparatus that enable the separation of semiconductor components connected to carriers in a carrier-material bonding manner from carriers without destroying any of the objects. This objective is achieved in a remarkably simple yet effective manner by the method taught in claim 1 and the apparatus taught in claim 10. [Means for solving the problem]

[0005] According to the present invention, a method is proposed for separating a semiconductor component from a carrier, wherein the semiconductor component is held on the connection surface on the carrier by a metal binder in a material bonding manner, and the method is as follows: a. A process of liquefying a binder and holding semiconductor components with a holding tool, b. A process of vibrating the holding tool, c. A step of displacing a holding tool to separate the semiconductor chip from the carrier, Includes.

[0006] Within the scope of the present invention, it has been found that semiconductor components are held on a carrier in a material bonding manner, primarily obtained by the targeted insertion of multiple spheres made of a metallic binder. In this regard, the placement is carried out within the plane that forms the connection surface. When this binder is liquefied, the bonding and adhesive forces increase, and the targeted connections formed by the spheres become larger. These bonding and adhesive forces must be overcome to enable the separation of the semiconductor component from the carrier. Furthermore, it has been found that because the bonding and adhesive forces are so large, the tensile forces required to overcome them become very large during general lifting, and the guaranteed non-destructive separation of the semiconductor component from the carrier cannot be guaranteed. Due to adhesion, the liquefied binder takes on a flattened spherical morphology in the boundary region with the carrier and the semiconductor component. Bonding causes molecules to bond in the liquefied binder. Here, when the semiconductor component vibrates with the holding tool, inertia causes vibrations of the liquefied binder that exceed the vibrational motion, while adhesion keeps the liquefied binder in the boundary region with the carrier and the semiconductor component. This forces the binder from its natural spherical morphology to a slimmer shape, thereby reducing the bonding force. Particularly preferably, shrinkage occurs in the liquefied binder, and this shrinkage is optimally reduced by vibration, insofar as the liquefied binder is divided into two parts. Part of the liquefied binder adheres to the semiconductor component, and the other adheres to the carrier. In this state, there is no longer any bonding force between the two parts of the liquefied binder. The semiconductor component can be easily displaced with the holding tool, and the semiconductor component can be separated from the carrier. Since slimming caused by vibration and inertia can reduce bonding and adhesive forces, insofar as the displacement of the holding tool and the separation of the semiconductor component are already nondestructive, complete separation of the binder into two parts is not strictly necessary for the function of this method. The liquefied binder is divided into two parts at the latest when displacing the semiconductor tool and separating the semiconductor component. Theoretically, separation can also be performed by completely removing the entire liquefied binder from the carrier or semiconductor component. This occurs when the bonding force is greater than the adhesive force to one of the interfaces.However, in practice, it has been proven that this is generally not true.

[0007] In step a, the binder is liquefied to allow separation. As long as the binder is solid, the material bonding connection between the binder and the carrier, or between the binder and the semiconductor component, persists. Similarly, the bonding force in solids is significantly greater than the bonding force in liquids. Therefore, liquefaction is the first significant reduction in bonding force. The semiconductor component can be moved by holding it via a holding tool, which also occurs in step a. In this process, it is necessary that mechanical force can be transmitted from the holding tool to the semiconductor component. For this purpose, the holding tool contacts and holds the semiconductor component.

[0008] In step b, the holding tool vibrates. This means that the holding tool performs periodic motion, particularly linear or circular motion. Since the holding tool holds the semiconductor component, the motion is transmitted to the semiconductor component, and as a result, the semiconductor also preferably performs the same periodic motion. Furthermore, the periodic motion of the semiconductor component is transmitted to the liquefied binder, at least partially, via bonding and adhesive forces. In this process, the bonding and adhesive forces are reduced by the above mechanism, and preferably, the binder is divided into two parts.

[0009] In step c, the holding tool is displaced. This means that its position changes due to motion. Preferably, it is displaced away from the carrier. At the same time, the semiconductor component that remains held by the holding tool is also displaced. If the connection formed by the binder still exists between the semiconductor component and the binder, the bonding and adhesive forces are reduced insofar as they can be overcome by displacing the semiconductor component without the risk of placing excessive mechanical stress on the semiconductor component and / or carrier. Finally, the semiconductor component and the carrier are separated.

[0010] The term "semiconductor component" refers to a component that contains at least one semiconductor material layer. In particular, a semiconductor chip is a semiconductor component.

[0011] The term "carrier" refers to a component that is in contact with at least one semiconductor component through a material bonding method, by passing an electric current through it. Printed circuit boards, in particular, are carriers.

[0012] The term "metallic binder" refers to a metal-containing substance used to form a conductive connection between semiconductor components and carriers. Possible binders include solder, metal-containing adhesives, sintered pastes, and / or metal-containing inks. The process of liquefying the binder must be adapted to the specific binder as needed.

[0013] The method according to the present invention makes it possible to non-destructively remove semiconductor components from carriers. Non-destructive means include the removal of semiconductor components and carriers, as well as any other elements on the carriers. This makes it possible to reuse the semiconductor components and / or carriers in different devices or, possibly, devices serving different purposes after they have been separated. In particular, carriers can be repaired by removing and replacing defective semiconductor components. Upgrading is also possible by removing old semiconductor components and replacing them with faster and / or more powerful ones. Furthermore, separation can help reuse the materials that form the semiconductor components and / or carriers. In this way, the need to manufacture new semiconductor components and / or carriers is reduced, thereby ultimately protecting the environment and resources.

[0014] Advantageous embodiments of the present invention, which can be realized individually or in combination with each other, are presented in the dependent claims.

[0015] Retention in step a may be achieved via suction, adhesion, and / or clamping.

[0016] The term "suction" refers to the generation of locally limited negative pressure on the surface of a semiconductor component. This technique is easily controllable and can be applied to large surfaces of semiconductor components using a correspondingly designed tool, which is preferably sized to or adaptable to the size of the semiconductor component. This results in a uniform force effect on a large surface of the semiconductor component, and therefore a uniform mechanical load on the large surface of the semiconductor component. This prevents high locally limited excessive stress due to mechanical tension.

[0017] The term "adhesion" refers to the effect of adhesive force without the use of a binder, or supported by a weak adhesive binder, which acts on the surface of a semiconductor component via a correspondingly designed element such as a film. Even when bonded, a uniform force effect occurs over a large surface of the semiconductor component, meaning that mechanical tension is uniformly distributed. Another advantage of adhesion is that retention does not depend on an external power source.

[0018] If the bonding and adhesive forces are too strong, both the attractive and adhesive forces can allow for compensatory lateral movement of the semiconductor component, which carries the risk of placing excessive stress on the semiconductor component.

[0019] The term "clamping" refers to the gripping of a semiconductor component by a two-legged or multi-legged tool whose legs act fixedly on the semiconductor component in the opposite direction. The advantage of clamping is that vibrations can be safely and completely transmitted to the semiconductor component. Movement or displacement of the semiconductor component relative to the receiving tool is effectively prevented by clamping. In this way, most, preferably all, of the vibratory motion can be transmitted to the binder.

[0020] In another embodiment of the present invention, liquefaction in step a may be carried out by heating. Within the scope of the present invention, most binders have been found to become liquid under the influence of heat, and this is carried out at a sufficiently low temperature so as not to damage the semiconductor components or carriers. In this regard, the binder may be heated indirectly by heating the semiconductor components and / or carriers and conducting heat to the binder through the semiconductor components and / or carriers. To prevent damage to the semiconductor components and / or carriers, for example, due to the generation of toxic substances by oxidation of the binder, the heating temperature must be adapted to the binder used in that case, as necessary.

[0021] In another embodiment, heating can be performed by directly or indirectly providing the binder with laser radiation. Because laser radiation is characterized in particular by the sharp focus of the beam, it can be used in an easy and targeted manner. This allows for targeted and therefore particularly efficient heating of the binder, while adjacent areas of the semiconductor device, particularly adjacent semiconductor components, their binders, and / or other elements placed on the carriers, receive little to no heat.

[0022] The term "laser radiation" refers to electromagnetic radiation that is narrowband, particularly single-mode, and characterized by sharp beam focusing and a large coherence length. Wavelengths range from 100 nm to 30 μm.

[0023] Furthermore, the vibration in process b is thought to occur parallel to the connection surface. In this way, the bonding force is reduced and the effect of contraction that causes separation can be particularly effectively obtained, as a particularly high inertial force acts on the contraction of the binder. Similarly, the risk of the semiconductor component colliding perpendicularly with the carrier is reduced due to the vibration and / or mechanical tension of the bonding and adhesive forces that would place excessively strong stress on the semiconductor component if the semiconductor component were removed too far perpendicularly from the carrier.

[0024] It is further contemplated that the vibration in step b is performed at a frequency of 10 kHz to 1 MHz. Within the scope of the present invention, it has been found that the vibration of the liquefied binder by a neighboring frequency, particularly preferably by the natural frequency of the binder, causes the binder to vibrate at the maximum amplitude. In this way, the desired effect of the shrinkage of the binder can be obtained particularly highly. The natural frequency, which depends on the material used and the size of the substantially spherical binder, appears to be in the range of 10 kHz to 1 MHz, and it has been proven that the best results are achieved within this frequency range.

[0025] Furthermore, it is contemplated that the vibration in step b is generated by rotating an imbalance and / or by changing the voltage of a vibrating crystal and / or a coil. These methods are easily controllable methods for generating vibrations that enable vibrations at an appropriate level and at an appropriate frequency. In particular, the frequency of the vibration can be freely set at least in part. A change in the voltage in the coil causes a magnetic field, and the magnetic field acts on a corresponding agent that is attracted and / or repelled by the magnetic field. The change in voltage is preferably periodic, and in particular, an alternating voltage with a sinusoidal waveform or a pulsed direct voltage.

[0026] In one embodiment of the present invention, it is contemplated that the vibration of the holding tool continues particularly during displacement in step c. If the liquefied binder is not further divided in step b. In step c, the reduction of the bonding force is maintained particularly through shrinkage. Therefore, it is possible to displace the holding tool without risk without applying excessive stress to the carrier and / or the semiconductor component.

[0027] Furthermore, it is contemplated that the displacement in step c is performed perpendicular to the connection surface. In this way, semiconductor components that are arranged at the center of the carrier and that are laterally blocked within the connection surface by other elements of the carrier, particularly other semiconductor components in some cases, can also be removed without hitting each other.

[0028] The definitions and / or explanations of the terms above are presumed to apply to all aspects described in this description below, unless otherwise stated.

[0029] The present invention further proposes an apparatus for separating a semiconductor component held on a carrier in a material bonding manner by a binder, comprising a holding tool and at least one drive device, wherein the holding tool has a holding surface. The apparatus is characterized by comprising an oscillator. This apparatus makes it possible to carry out the method according to the present invention and achieve the advantages of the method. This means that the apparatus is suitable for non-destructively separating a semiconductor component from a carrier after the binder has been liquefied for the above-mentioned physical process to reduce bonding and adhesion forces. This makes it possible to repair, upgrade, reuse and / or recycle the carrier and / or semiconductor component. Thus, although the binder is generally optional, it is preferable that the apparatus has an element for liquefaction, as will be described elsewhere as an example. To carry out the method according to the present invention, the binder is liquefied, and the holding tool holds the semiconductor component within the holding surface, preferably via a drive device that establishes contact between the holding tool and the semiconductor component. Subsequently, the oscillator vibrates the holding tool. The drive device displaces the holding tool together with the semiconductor component, and thus separates the semiconductor component from the carrier. In this regard, the holding surface is parallel to the connecting surface of the method according to the present invention.

[0030] The holding tools of the apparatus may comprise a suction head, an adhesive film, and / or a gripper. These tools are suitable for providing the type of holding described in relation to the method, namely suction, bonding, and / or clamping, including advantages related to the method. The suction head is particularly preferably an opening connected to a vacuum pump using a suitable element such as a hose, the vacuum pump generating negative pressure at the suction head. The adhesive film is a film that establishes adhesion on a smooth surface as a result of adhesive force. The adhesive film can be manufactured without adhesive, or by adding and / or coating with a suitable weak adhesive. Those skilled in the art will be familiar with suitable materials. The gripper is a two-legged or multi-legged tool whose legs act fixedly on the semiconductor component in opposite directions.

[0031] The gripper and / or suction head have the advantage of being able to mechanically release the holding effect of the holding tool. The suction head and adhesive film have the advantage of being able to adhere to a wide surface and adjust the holding force so that the semiconductor component moves in the holding tool when the vibration exceeds a mechanical load threshold. This prevents excessive mechanical stress on the semiconductor component. The gripper can fully transmit the movement of the holding tool to the semiconductor component.

[0032] In another embodiment of the present invention, the apparatus may be equipped with a heat source. The heat source may cause the binder to be liquefied as intended by the present invention. In this case, the heat source may directly affect the binder or indirectly affect the semiconductor components and / or carriers, and the heat is conducted to the binder via the semiconductor components and / or carriers.

[0033] In another embodiment of the present invention, the heat source is a laser. The laser emits focused coherent electromagnetic radiation, which means that a locally limited area can be heated in a targeted manner. Because semiconductor components are minute, this allows for targeted direct or indirect heating of the binder, adjacent elements, and especially adjacent semiconductor components placed on carriers, with little to no effect.

[0034] The term "laser" refers to a device that emits narrowband, particularly single-mode, electromagnetic radiation with sharp focus and beam coherence in the wavelength range of 100 nm to 30 μm. This term specifically includes masers.

[0035] In another embodiment, the device may include a beam channel, which begins with a laser and ends with a holding tool. The beam channel is a suitable component for conducting electromagnetic radiation over longer distances. Particularly preferably, the beam channel is an optical waveguide. The arrangement of the beam channel allows the laser to be mounted in a fixed position and the radiation emitted by the beam channel to be conducted to the holding tool. This allows the laser to be adequately cooled, for example, and ensures that the laser power supply is maintained. In another embodiment, the beam channel may be hollow, and the laser radiation may be conducted within the hollow region of the laser channel and / or within the jacket of the beam channel. The beam channel is preferably shaped like a hose. The hollow region allows for the formation of negative pressure and / or a vacuum, which means that the holding tool can be designed as a suction head. This makes it possible to design the device, and in particular the holding tool, to be small, narrow, and compact.

[0036] Furthermore, it is conceivable that the oscillator has a vibration direction parallel to the holding surface. In this way, the semiconductor component vibrates in a plane parallel to the connection surface, achieving the associated advantages. In particular, the bonding and adhesive forces are reduced particularly efficiently, minimizing the risk of the semiconductor component colliding perpendicularly with the carrier due to vibrations and / or mechanical tensions of the bonding and adhesive forces that place excessive stress on the semiconductor component.

[0037] In another embodiment of the present invention, the oscillator may have an oscillation range of 100 kHz to 1 MHz. The binder has a natural frequency, which is expected to be within this range. Oscillation in this frequency range results in particularly effective and reliable splitting of the binder, which minimizes, and especially eliminates, the adhesive and bonding forces acting between the carrier and the semiconductor component via the binder. Thus, the retaining tool can be displaced together with the semiconductor component without risk.

[0038] Furthermore, the oscillator may comprise an unbalanced motor, a crystal oscillator, and / or an oscillating magnet, particularly an oscillating coil. In an unbalanced motor, the unbalance rotates, generating periodic deflection. In a crystal oscillator, a varying voltage is applied to an oscillating crystal. The oscillating crystal is a crystal that deforms due to the piezoelectric effect when the voltage changes. An oscillating magnet is a component comprising a magnetically deflectable mass, an electric coil, and a damping element. To generate vibration, a varying voltage is applied to the electric coil, which generates a varying magnetic field. The magnetic field deflects the magnetically deflectable mass against damping. The deflection is time-variable due to the change in the magnetic field, thereby causing the deflectable mass to oscillate. Preferably, the varying voltage is a sinusoidal AC voltage or a pulsed DC voltage.

[0039] Furthermore, the device's drive mechanism may be a linear drive mechanism, and the holding tool may be displaced perpendicularly to the holding surface by the drive mechanism. The advantage of perpendicular displaceability is that the semiconductor component can be removed from the carrier without risking collision with other elements placed on the carrier. The device may also include a second and / or third drive mechanism for perpendicular displaceability, in particular a second linear drive mechanism and / or a third linear drive mechanism, separate from the first drive mechanism, which displaces the holding tool in space, parallel to the holding surface. As a result, the holding tool can be positioned above the semiconductor component by the second and / or third drive mechanism and then lowered onto the semiconductor component for holding by the first drive mechanism. After the semiconductor component is separated from the carrier by the first drive mechanism, the lifted semiconductor component can be moved laterally to the deposition position by the second and / or third drive mechanism. Particularly preferably, the device comprises a two-axis robotic arm, with a holding tool and an oscillator positioned at its freely movable end.

[0040] Furthermore, it is conceivable to space the oscillator away from the holding tool. Particularly preferred is a distance of 5 mm to 20 mm from the holding tool. In principle, the oscillator is located outside the apparatus and is therefore wider than the holding tool itself. The wider dimensions of the oscillator carry the risk of the oscillator colliding with other elements located on the carrier when displacing and / or vibrating the holding tool, and therefore damaging them. The distance from the holding tool prevents the oscillator from colliding with other elements. Nevertheless, the oscillator should be positioned as close to the holding tool as possible so that the holding tool vibrates as intended by the invention.

[0041] Further details, features, and advantages of the present invention can be derived from the following description of preferred exemplary embodiments relating to the dependent claims. In this regard, each feature can be realized individually or in combination with one another. The present invention is not limited to exemplary embodiments. Exemplary embodiments are schematically shown in the drawings. The same reference numerals in the individual figures refer to the same elements, or elements having the same function or corresponding to each other with respect to their functions. [Brief explanation of the drawing]

[0042] [Figure 1] An embodiment of the apparatus according to the present invention is shown. [Figure 2A] An embodiment of the method according to the present invention using the apparatus according to the present invention is shown. [Figure 2B] An embodiment of the method according to the present invention using the apparatus according to the present invention is shown. [Figure 2C] An embodiment of the method according to the present invention using the apparatus according to the present invention is shown. [Modes for carrying out the invention]

[0043] Figure 1 shows one embodiment of the apparatus 10 according to the present invention. In the illustrated embodiment, the apparatus 10 comprises a holding tool 11, which is a suction head. An oscillator 12 is spaced apart from the holding tool 11. The oscillator 12 is positioned around a hollow beam path 13. The beam path 13 conducts the laser radiation of a laser (not shown) to the holding tool 11. The hollow design allows for the generation of negative pressure on the holding tool 11 to produce the suction effect of the suction head. The beam path 13 is further surrounded by a casing 14. As can be further identified in Figure 1, the holding tool 11 holds a semiconductor component 21. The semiconductor component 21 held by the holding tool 11 is already separated from the carrier 22. As can be further clearly identified, the oscillator 12 is wider than the space provided on the carrier 22 for the semiconductor component 21 held by the holding tool 11. By separating the oscillator 12 from the holding tool 11, collision of the oscillator 12 with the semiconductor components 21 remaining on the carrier 22 is prevented, and both remaining semiconductor components 21 are connected to the carrier 22 via a spherical binder 23 applied in a targeted manner. Here, the binder 23 is located within the connection surface 24. As can be further identified in Figure 1, the binder 23 applied in a targeted manner and holding the semiconductor components 21 held on the carrier 22 by the holding tool 11 is divided into two parts, one part adhering to the semiconductor components 21 held by the holding tool 11, and the other part remaining on the carrier 22. The carrier 22 is placed on a work surface 30 for better handling. In order to divide the binder 23 and overcome the bonding and adhesive forces holding the semiconductor components 21 connected to the carrier 22, the oscillator 12 thus vibrates the apparatus 10, and therefore the holding tool 11 and the semiconductor components 21 held by the holding tool 11.

[0044] Figures 2A to 2C show one embodiment of the method according to the present invention using the apparatus 10 shown in Figure 1.

[0045] In Figure 2A, a semiconductor component 21, connected to a carrier 22 in a material bonding manner via spherical binders 23 positioned in a targeted manner on the connection surface 24, is held by a holding tool 11. This is done by displacing the apparatus 10 perpendicular to the semiconductor component 21 and by applying negative pressure to the holding tool 11, which is configured as a suction head. In other words, the semiconductor component 21 is attracted by the holding tool 11. Simultaneously, the binder 23 is heated by conducting laser radiation to the semiconductor component 21 through the beam channel 13. The laser radiation heats the semiconductor component 21, which conducts heat to the binder 23. The heat liquefies the binder 23.

[0046] Figure 2B shows the vibration of the holding tool 11 caused by the oscillator 12. The vibration occurs parallel to the connection surface 24. In relation to this, the semiconductor component 21 also vibrates. In Figure 2B, it can be seen that the binder 23 undergoes contraction due to inertia. This contraction reduces the bonding and adhesive forces acting within the binder 23, between the binder 23 and the carrier 22, and / or between the binder 23 and the semiconductor component 21.

[0047] In Figure 2C, it can be seen that the binder 23 is split into two parts via vibration and contraction, with one part remaining on the carrier 22 and the other part adhering to the semiconductor component 21. This splitting of the binder 23 overcomes the bonding and adhesive forces that held the semiconductor component 21 to the carrier 22 via the binder 23. The semiconductor component 21 is separated from the carrier 22 and can be completely removed by displacing the holding tool 11 vertically.

Claims

1. A method for separating a semiconductor component (21) from a carrier (22), wherein the semiconductor component (21) is held by a metal binder (23) within a connection surface (24) on the carrier (22) in a material bonding manner, and the method is a. A step of liquefying the metal binder (23) and holding the semiconductor component (21) with a holding tool (11), wherein the liquefaction is performed by heating, and the heating is performed by directly or indirectly exposing the metal binder (23) to laser radiation, and the laser radiation is conducted through a beam channel (13), and a holding step, b. A step of vibrating the holding tool (11), c. A step of displacing the retaining tool (11) to separate the semiconductor component (21) from the carrier (22), wherein the vibration in step b is performed parallel to the connection surface (24), the displacement in step c is performed perpendicular to the connection surface (24), and the vibration of the retaining tool (11) from step b continues in a direction parallel to the connection surface (24) during the displacement in step c, Includes, The vibration in step b is generated by rotating the unbalance and / or by changing the voltage of the vibrating crystal and / or coil, in a method.

2. The method according to claim 1, wherein the holding in step a is performed by suction, adhesion and / or clamping.

3. The method according to claim 1 or 2, wherein the vibration in step b is performed at a frequency of 10 kHz to 1 MHz.

4. An apparatus (10) for separating a semiconductor component (21) held on a carrier (22) by a material bonding method with a metal binder (23), comprising a holding tool (11) and at least one drive device, wherein the holding tool (11) has a holding surface, The device (10) includes an oscillator (12), The oscillator (12) has a direction of vibration, The vibration direction is directed parallel to the holding surface. The aforementioned drive device is a linear drive device, The holding tool (11) is displaceable in the vertical direction by the drive device, The vibration of the oscillator (12) continues in a direction parallel to the holding surface during the vertical displacement of the holding tool (11). The aforementioned device (10) is equipped with a heat source, The heat source has a laser, The apparatus (10) includes a beam channel (13) that conducts the radiation emitted by the laser, The apparatus (10) is characterized in that the oscillator (12) comprises an unbalanced motor, a crystal oscillator, and / or a vibrating magnet.

5. The apparatus (10) according to claim 4, wherein the holding tool (11) comprises a suction head, an adhesive film and / or a gripper.

6. The apparatus (10) according to claim 4, characterized in that the beam channel (13) begins with the laser and ends with the holding tool.

7. The apparatus (10) according to claim 4 or 5, characterized in that the oscillator (12) has an oscillation range of 10 kHz to 1 MHz.

8. The apparatus (10) according to claim 4 or 5, characterized in that the oscillator (12) is spaced apart from the holding tool (11).

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