Electrolytic plating apparatus and electrolytic plating method

Abstract

In one embodiment of the present invention, an electrolytic plating apparatus and an electrolytic plating method are disclosed. The electrolytic plating apparatus includes a plurality of paddles arranged in parallel. The paddles move in a direction parallel to the substrate and are used to stir the electrolytic plating solution. In one cycle, the paddles perform a reciprocating motion with a set stroke, and the reversal point of the reciprocating motion is related to the width of the paddle and the narrowest width of the gap between the adjacent paddles. According to the present invention, by designing the size and operation mode of the paddles, the cumulative time that each corresponding point on the substrate is blocked by the paddle is equal, and the amount of electricity received is equal. This further improves the uniformity of the electrolytic plating height.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor devices, and more particularly to an electrolytic plating apparatus and an electrolytic plating method.

Background Art

[0002] Electrolytic plating is a major process for completing copper interconnects. Currently, there are two types of electrolytic plating apparatuses in the market: horizontal jet cup plating and vertical rack plating. Vertical rack plating involves immersing the substrate vertically in the plating solution, and multiple substrates can be plated simultaneously in one plating tank. Cup plating involves covering the substrate with a cup-shaped plating tank and plating one cup at a time for each substrate. Compared with rack plating, the cup plating process is easier to control and can meet more complex and diverse product requirements.

[0003] With the development of technology, the chip area has increased, and the number of bumps in the chip has also increased rapidly. There may be tens of thousands, and in some cases, more than 100,000 bumps in a single chip. In the electrolytic plating process, higher plating speed and output are required, and in the field of advanced packaging, higher uniformity within the chip is also required. However, with weak agitation, it is difficult to achieve uniformity within the chip, that is, the coplanarity of the bumps. At the same time, in the case of advanced packaging technology for inter-chip interconnects, the height of the copper pillars can reach 250 μm, imposing higher requirements on mass transfer during the electrolytic plating process. Normal agitation results in weak mass transfer and cannot meet the requirements of production capacity and quality.

[0004] [[ID=第十九]] To enhance the agitation of the electroplating solution, a paddle assembly containing multiple paddles parallel to the substrate surface can be attached to the electroplating apparatus. The paddles reciprocate to agitate the electroplating solution, ensuring sufficient supply of metal ions and electroplating additives to the substrate surface. However, in practice, conventional paddle agitation does not allow for control over the time the substrate surface is blocked by the paddles. As a result, the problem of uneven electrostatic charge distribution at each point on the substrate surface and uneven electroplating height still persists. [Overview of the project]

[0005] In view of the above technical problems, the present invention aims to provide an electrolytic plating apparatus and an electrolytic plating method that improve the uniformity of the height of electrolytic plating on a substrate.

[0006] To achieve this objective, one embodiment of the present invention proposes an electroplating apparatus comprising a plurality of parallel paddles positioned parallel to a substrate for stirring an electroplating solution. The electroplating apparatus further comprises a controller and a drive mechanism. The drive mechanism is connected to the controller and the paddles, respectively, and the controller controls the drive mechanism to periodically move the paddles such that the cumulative time for each corresponding point on the substrate blocked by the paddles is equal.

[0007] When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move to the right from the origin of the coordinate system to coordinate Δ, Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ... Move to the right at coordinate Δ+(N-1)*c, Move left to coordinate N*c, Move to the right at coordinate Δ+N*c, This includes moving to the left and returning to the origin coordinates. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ≧a+b.

number

[0008] Another embodiment of the present invention proposes an electroplating apparatus comprising a plurality of parallel paddles positioned parallel to a substrate for stirring an electroplating solution. The electroplating apparatus further comprises a controller and a drive mechanism. The drive mechanism is connected to the controller and the paddles, respectively, and the controller controls the drive mechanism to periodically move the paddles such that the cumulative time for each corresponding point on the substrate blocked by the paddles is equal. When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ... Move to the right at coordinate Δ+(N-1)*c, Move left to coordinate N*c, Move to the right at coordinate Δ+N*c, Move left to coordinate N*c, Move to the right at coordinate Δ+(N-1)*c, ... Move left to coordinate 2c, Move to the right at coordinate Δ+c, Move left to coordinate c, Move to the right in coordinate Δ, Move to the left and return to the origin. Move to the right at coordinate Δ+N*c, Move to the left and return to the origin. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ≧a+b.

number

[0009] Another embodiment of the present invention proposes an electroplating apparatus comprising a plurality of parallel paddles arranged parallel to a substrate for stirring an electroplating solution. The electroplating apparatus further comprises a controller and a drive mechanism. The drive mechanism is connected to the controller and the paddle respectively, and the controller controls the drive mechanism to periodically move the paddle so that the cumulative time of each corresponding point on the substrate blocked by the paddle is equal. When the arrangement direction of the paddles is taken as the coordinate axis direction, the movement steps of the paddles within one cycle are as follows: Move right from the origin to coordinate Δ, Move left to coordinate c, Move right to coordinate Δ + c, Move left to coordinate 2c, ··· Move right to coordinate Δ+(y - 2)*c, Move left to coordinate (y - 1)*c, Move right to coordinate Δ+(y - 1)*c, Move left to return to the origin, Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, then Δ≧a + b,

Number

[0010] Another embodiment of the present invention proposes an electroplating apparatus comprising a plurality of parallel paddles arranged parallel to a substrate for stirring an electroplating solution. The electroplating apparatus further comprises a controller and a drive mechanism. The drive mechanism is connected to the controller and the paddle respectively, and the controller controls the drive mechanism to periodically move the paddle so that the cumulative time of each corresponding point on the substrate blocked by the paddle is equal. When the arrangement direction of the paddles is taken as the coordinate axis direction, the movement steps of the paddles within one cycle are as follows: Move right from the origin to coordinate Δ, Move left to coordinate c, Move right to coordinate Δ + c, Move left to coordinate 2c, ··· Move right to coordinate Δ+(y - 2)*c, Move left to coordinate (y - 1)*c, Move right to coordinate Δ+(y - 1)*c, Move left to coordinate (y - 1)*c, Move right to coordinate Δ+(y - 2)*c, ··· Move left to coordinate 2c, Move right to coordinate Δ + c, Move left to coordinate c, Move right to coordinate Δ, Move left to return to the origin, Move right to coordinate Δ+(y - 1)*c, Move left to return to the origin, Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, then Δ≥a + b,

Number

[0011] One embodiment of the present invention proposes an electroplating method in which a plurality of parallel paddles are arranged parallel to a substrate and move to stir an electroplating solution, and the paddles are controlled to move periodically so that the cumulative time blocked by the paddles at each corresponding point on the substrate is equal. When the arrangement direction of the paddles is taken as the coordinate axis direction, the movement steps of the paddles within one cycle are Move right from the coordinate origin to coordinate Δ, Move left to coordinate c, Move right to coordinate Δ + c, Move left to coordinate 2c, ··· Move right to coordinate Δ+(N - 1)*c, Move left to coordinate N*c, Move to the right at coordinate Δ+N*c, This includes moving to the left and returning to the origin coordinates. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ≧a+b.

number

[0012] Another embodiment of the present invention proposes an electroplating method in which a plurality of parallel paddles are arranged parallel to a substrate and moved to agitate an electroplating solution, and the paddles are controlled so that the cumulative time blocked by each corresponding point on the substrate is equal. When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ... Move to the right at coordinate Δ+(N-1)*c, Move left to coordinate N*c, Move to the right at coordinate Δ+N*c, Move left to coordinate N*c, Move to the right at coordinate Δ+(N-1)*c, ... Move left to coordinate 2c, Move to the right at coordinate Δ+c, Move left to coordinate c, Move to the right in coordinate Δ, Move to the left and return to the origin. Move to the right at coordinate Δ+N*c, Move to the left and return to the origin. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ≧a+b.

number

[0013] Another embodiment of the present invention proposes an electroplating method in which a plurality of parallel paddles are arranged parallel to a substrate and moved to agitate an electroplating solution, and the paddles are controlled so that the cumulative time blocked by each corresponding point on the substrate is equal. When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move to the right from the origin to coordinate Δ, Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ... Move to the right at coordinate Δ+(y-2)*c, Move left to coordinate (y-1)*c, Move to the right at coordinate Δ+(y-1)*c, Move to the left and return to the origin. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ≧a+b.

number

[0014] Another embodiment of the present invention proposes an electroplating method in which a plurality of parallel paddles are arranged parallel to a substrate and moved to agitate an electroplating solution, and the paddles are controlled so that the cumulative time blocked by each corresponding point on the substrate is equal. When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move to the right from the origin to coordinate Δ, Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ... Move to the right at coordinate Δ+(y-2)*c, Move left to coordinate (y-1)*c, Move to the right at coordinate Δ+(y-1)*c, Move left to coordinate (y-1)*c, Move to the right at coordinate Δ+(y-2)*c, ... Move left to coordinate 2c, Move to the right at coordinate Δ+c, Move left to coordinate c, Move to the right in coordinate Δ, Move to the left and return to the origin. Move to the right at coordinate Δ+(y-1)*c, Move to the left and return to the origin. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ≧a+b.

number

[0015] The present invention improves the uniformity of electroplating height by designing a mode of movement for the paddles so that each corresponding point on the substrate blocks an equal amount of time and receives an equal amount of electricity. [Brief explanation of the drawing]

[0016] [Figure 1] Figure 1 shows a schematic diagram of an electrolytic plating apparatus according to the first embodiment of the present invention. [Figure 2] Figure 2 shows a top view of a paddleboard according to the first embodiment of the present invention. [Figure 3A] Figure 3A is a cross-sectional view of a paddleboard according to a first embodiment of the present invention. [Figure 3B] Figure 3B is an enlarged view of section D in Figure 3A. [Figure 4] Figure 4 shows the dimensions of a paddle according to the first embodiment of the present invention. [Figure 5] Figure 5 shows the change in paddle position within one cycle according to the first embodiment of the present invention. [Figure 6] Figure 6 shows the dimensions of a paddle according to a second embodiment of the present invention. [Figure 7] Figure 7 shows the change in paddle position within one cycle according to a second embodiment of the present invention. [Figure 8] Figure 8 shows the dimensions of a paddle according to a third embodiment of the present invention. [Figure 9] Figure 9 shows the change in paddle position within one cycle according to the third embodiment of the present invention. [Figure 10] Figure 10 shows one aspect of the change in paddle position within one cycle according to the fourth embodiment of the present invention. [Figure 11] Figure 11 shows the dimensions of a paddle according to the fifth embodiment of the present invention. [Figure 12] Figure 12 shows the change in the position of the paddle within one cycle according to the fifth embodiment of the present invention. [Figure 13] Figure 13 is a schematic diagram of an electroplating apparatus according to the seventh embodiment of the present invention. [Figure 14] Figure 14 shows a comparison of the electroplating result curves between an electroplating apparatus equipped with a diffuser plate and an electroplating apparatus without a diffuser plate, according to the seventh embodiment of the present invention. [Figure 15] Figure 15 shows the coordinate position of the paddle according to the eighth embodiment of the present invention. [Figure 16] Figure 16 shows a connection structure between a paddle board and a guide rail according to the ninth embodiment of the present invention. [Figure 17] Figure 17 shows a nitrogen protection box used to enclose an eccentric bearing and guide rail according to the ninth embodiment of the present invention. [Figure 18] Figure 18 is a schematic diagram of a paddleboard according to the tenth embodiment of the present invention. [Figure 19A] Figure 19A shows the effect of electroplating using an existing electroplating apparatus. [Figure 19B]Figure 19B shows the effect of electroplating using the electroplating apparatus of the present invention. [Figure 19C] Figure 19C shows a comparison of electroplating height data of test points on a substrate using an existing electroplating apparatus and the electroplating apparatus of the present invention. [Modes for carrying out the invention]

[0017] To further explain the technical content, constituent features, objectives, and effects of the present invention, embodiments and accompanying drawings will be described in detail below.

[0018] In electroplating equipment, paddles can be placed opposite the substrate to promote agitation of the electroplating solution. During electroplating, the paddles reciprocate along a direction parallel to the substrate, promoting agitation of the electroplating solution. Since the paddles themselves block the electric field, only the gaps between the paddles allow the electric field to pass through. Therefore, a "shadow" is created in the area of ​​the substrate facing the paddle, and the amount of electricity received there is less than in the "unshadowed" area. If the degree of "shadowing" differs at different points on the substrate, the amount of electricity received becomes uneven, resulting in an uneven plating height across the entire substrate.

[0019] As shown in Figure 19A, during electroplating, the substrate rotates, and the resulting "shadowing" manifests as concentric rings on the substrate surface, i.e., large fluctuations in the height of the electroplating along the radial direction of the substrate. The present invention aims to eliminate the effects of "shadowing" and ensure a uniform electroplating height at all points on the substrate.

[0020] First Embodiment As shown in Figure 1, this embodiment discloses an electroplating apparatus comprising an electroplating tank 101, a substrate holder 102, and a plurality of parallel-arranged paddles 103. The substrate holder 102 is used to clamp a substrate 104, and the paddles 103 are positioned parallel to the substrate 104 between the substrate 104 and the electrodes. During electroplating, the substrate 104 and the paddles 103 are immersed in the electroplating solution in the electroplating tank 101. The paddles 103 reciprocate along a direction parallel to the substrate 104, driven by a drive mechanism 105, which may be a motor, to agitate the electroplating solution. The direction of movement of the paddles 103 may be further restricted by guide rails 109 connected to the paddles 103. The drive mechanism 105 is connected to a controller 106, which controls the movement of the paddles 103 by programming the drive mechanism 105.

[0021] As shown in Figure 2, the paddle 103 is formed by creating rectangular through-holes in the paddle board 108. The material of the paddle board 108 is an insulator such as PVC, PC, CPVC, PPS, PEEK, PTFE, and other plastic materials. Specifically, parallel rectangular through-holes are machined in the central circular region of the paddle board 108, through which liquid and electric fields can pass. The solid portions between adjacent through-holes form the paddle 103. The size of the circular region matches the size of the substrate 104.

[0022] As shown in Figures 3A and 3B, the cross-section of the paddle 103 may be a roughly trapezoidal shape, with its bases aligned in the same straight line as the direction of the paddle arrangement. The two legs of the trapezoid are slightly curved.

[0023] The cross-section of the paddle 103 may be triangular or rectangular. Compared to a paddle board with a rectangular paddle, a paddle board with a triangular or trapezoidal paddle has a larger opening area, so the side of the paddle board 108 with the larger opening area faces the substrate 104, and the electroplating solution is more thoroughly agitated on this side. This further improves the uniformity of the plating height. On the other hand, during high-speed agitation, bubbles tend to form on the side of the paddle 103, causing them to adhere to the side of the paddle 103. If the side of the paddle 103 is made inclined, bubbles can be more easily discharged from the paddle board 108.

[0024] As shown in Figure 4, taking the shape of an isosceles triangle as an example, the width of paddle 103 is a. In other words, the projected width of paddle 103 onto the coordinate axis in the direction of arrangement of paddles 103 is a, which is the length of the base of the isosceles triangle. The narrowest gap between adjacent paddles 103 is b. In other words, the distance between the two nearest points of contact on adjacent paddles 103 is b, which is the distance between adjacent vertices of two adjacent isosceles triangles.

[0025] In this embodiment, a=b, that is, the opening ratio of the opening area at the bottom of the paddle board 108 is 50%.

[0026] As shown by the arrows in Figure 4, the direction of movement of the paddles 103 is the same as the direction of arrangement of the paddles 103, and is also perpendicular to the length direction of the paddles 103. Due to the interference of the electric field induced between the electrode and the substrate 104 by the paddles 103 themselves, the region on the substrate 104 corresponding to the paddle 103 cannot receive electricity. However, the region on the substrate 104 corresponding to the gap between adjacent paddles 103 can receive electricity because there is nothing to obstruct the electric field between them. In electroplating, if each point on the substrate 104 can receive the same amount of electricity, the height of the electroplating at each point on the substrate 104 can be made uniform. The applicant found that this requires an optimized design of the size and operating mode of the paddles 103.

[0027] As shown in Figure 5, the triangles represent the cross-section of the paddle 103. For ease of understanding, one of the paddles 103 is depicted as a black triangle. Since the relative positions of the multiple paddles 103 remain constant, the movement of all paddles 103 coincides with the movement of the selected black triangle paddle 103. The direction of the arrangement of the paddles 103 is defined as the direction of the one-dimensional coordinate axes, and the starting position of the selected black triangle paddle 103 is defined as the origin of the coordinate system. Specifically, the leftmost point of the selected black triangle is defined as the origin of the coordinate system. The paddle 103 then reciprocates along the coordinate axes, passing through the four coordinate points Δ, a, Δ+a, and 0.

[0028] In Figure 5, multiple dashed lines perpendicular to the coordinate axes are drawn to make the coordinate position of paddle 103 easier to see. Omissions indicate some paddles 103 that are not shown. Framed arrows indicate the displacement of paddle 103. As can be seen from Figure 5, the movement of paddle 103 within one cycle can be divided into the following four steps. Step 501: Move to the right from the origin to coordinate Δ. Step 502, move left to coordinate a. Step 503, move to the right at coordinate Δ+a. Step 504: Move to the left and return to the origin.

[0029] Within one cycle, the paddle 103 moves alternately from left to right. Each point on the substrate 104 corresponding to the paddle 103 is blocked by the paddle 103 for the same amount of time. Therefore, if the electric field is uniformly distributed, each point on the substrate 104 corresponding to the paddle 103 will receive the same amount of charge. Consequently, the height of the electroplating at each point will be the same.

[0030] In order for the coordinate ranges covered by the paddle 103 to not overlap at each reversal position within one cycle, Δ≧a+b, i.e., Δ≧2a, is required. This allows for a better balance of the degree of agitation at each point during electroplating. The width a of the paddle 103 can be in the range of 5mm to 15mm and can be set according to the size of the substrate 104 and the size of the components of the electroplating apparatus. Taking the case a=5mm and Δ=15mm as an example, the paddle 103 reverses at four coordinate points: 15mm, 5mm, 20mm, and 0mm.

[0031] In electroplating, after one cycle of movement is completed, the paddle 103 immediately enters the next movement cycle.

[0032] Second Embodiment This embodiment discloses an electroplating apparatus that has all the components of the electroplating apparatus of the first embodiment shown in Figure 1. Repeated explanations will not be provided here.

[0033] Unlike the first embodiment, as shown in Figure 6, a is the width of the paddle 103 and b is the narrowest width between adjacent paddles 103, where b = 2a. The opening ratio at the bottom of the paddle plate 108 in this embodiment is approximately 66.7%, which is larger than the opening ratio of 50%. The paddle itself blocks the electric field less. Therefore, the movement of the paddle 103 is different. As shown in Figure 7, within one cycle, the paddle 103 reverses at six coordinate points: Δ, a, Δ+a, 2a, Δ+2a, and 0. The movement of the paddle 103 consists of the following six steps. Step 701: Move to the right from the origin to coordinate Δ. Step 702, move left to coordinate a. Step 703, move to the right at coordinate Δ+a. Step 704, move left to coordinate 2a. Step 705, move to the right at coordinate Δ+2a. Step 706: Move to the left and return to the origin.

[0034] Within one cycle, the paddle 103 moves alternately from left to right. Each point on the substrate 104 corresponding to the paddle 103 is blocked by the paddle 103 for the same amount of time. Therefore, if the electric field is uniformly distributed, each point on the substrate 104 corresponding to the paddle 103 will receive the same amount of charge. Consequently, the height of the electroplating at each point will be the same.

[0035] In order for the coordinate ranges covered by paddle 103 to not overlap at each reversal position within one cycle, Δ≧a+b, that is, Δ≧3a. Taking the case where a=6mm and Δ=20mm as an example, paddle 103 will reverse at six coordinate points: 20mm, 6mm, 26mm, 12mm, 32mm, and 0mm.

[0036] Third Embodiment This embodiment discloses an electroplating apparatus that has all the components of the electroplating apparatus of the first embodiment shown in Figure 1. Repeated explanations will not be provided here.

[0037] Unlike the first embodiment, as shown in Figure 8, a = 2b, where a is the width of the paddle 103 and b is the narrowest width between adjacent paddles 103. The opening ratio at the bottom of the paddle plate 108 in this embodiment is smaller, at approximately 33.3%. This dimensional design can be considered as swapping the dimensions of the paddle 103 and the gap between adjacent paddles 103 in the second embodiment. Therefore, the movement of the paddle 103 can be similar to that described in the second embodiment, and the paddle 103 reverses at six coordinate points: Δ, b, Δ+b, 2b, Δ+2b, and 0.

[0038] As shown in Figure 9, the movement of paddle 103 within one cycle consists of the following six steps. Step 901: Move to the right from the origin to coordinate Δ. Step 902, move left to coordinate b. Step 903, move to the right at coordinate Δ+b. Step 904, move left to coordinate 2b. Step 905, move to the right at coordinate Δ+2b. Step 906: Move to the left and return to the origin.

[0039] Within one cycle, the paddle 103 moves alternately from left to right. Each point on the substrate 104 corresponding to the paddle 103 is blocked by the paddle 103 for the same amount of time. Therefore, if the electric field is uniformly distributed, each point on the substrate 104 corresponding to the paddle 103 will receive the same amount of charge. Consequently, the height of the electroplating at each point will be the same.

[0040] Similarly, in order to distribute the coordinates at which paddle 103 reverses as much as possible within one cycle, Δ≧a+b, or Δ≧3b, is required. Taking the case where b=10mm and Δ=35mm as an example, the coordinates at which paddle 103 stops are 35mm, 10mm, 45mm, 20mm, 55mm, and 0mm.

[0041] Fourth Embodiment In the first to third embodiments, the width a of the paddle 103 and the narrowest width b of the gap between adjacent paddles 103 are integer multiples. For an electroplating apparatus in which the width a of the paddle 103 and the narrowest width b of the gap between adjacent paddles 103 are integer multiples, this embodiment discloses the following electroplating method.

[0042] The controller executes the program to move paddle 103 as follows: The number of movement steps of paddle 103 within one cycle is: Move the paddle 103 from the origin to coordinate Δ in the direction of its arrangement. Move to coordinate c in the opposite direction, Move to coordinate Δ+c in the direction of the arrangement of paddle 103. Move in the opposite direction to coordinate 2c, ... Move to coordinate Δ+(N-1)*c in the direction of the arrangement of paddle 103. Move in the reverse direction to coordinate N*c, Move to coordinate Δ+N*c in the direction of the arrangement of paddle 103. It means moving in the opposite direction and returning to the origin. Here, Δ≧a+b,

number

[0043] On the one hand, the alternating movement of the paddle 103 makes it possible to make the distribution of metal ions and electroplating additives in the electroplating solution uniform. On the other hand, since each point on the substrate 104 corresponding to the paddle 103 is blocked by the paddle 103 for the same amount of time, the height of the electroplating at each point on the substrate 104 corresponding to the paddle 103 can be made the same.

[0044] Alternatively, within one cycle, paddle 103 may move as follows:

[0045] Move the paddle 103 from the origin to coordinate Δ in the direction of its arrangement. Move to coordinate c in the opposite direction, Move to coordinate Δ+c in the direction of the arrangement of paddle 103. Move in the opposite direction to coordinate 2c, ... Move to coordinate Δ+(N-1)*c in the direction of the arrangement of paddle 103. Move in the reverse direction to coordinate N*c, Move to coordinate Δ+N*c in the direction of the arrangement of paddle 103. Move in the reverse direction to coordinate N*c, Move to coordinate Δ+(N-1)*c in the direction of the arrangement of paddle 103. ... Move in the opposite direction to coordinate 2c, Move to coordinate Δ+c in the direction of the arrangement of paddle 103. Move to coordinate c in the opposite direction, Move to coordinate Δ in the direction of the arrangement of paddle 103. Move in the opposite direction and return to the origin. Move to coordinate Δ+N*c in the direction of the arrangement of paddle 103. Move in the opposite direction and return to the origin.

[0046] To more intuitively represent the position of paddle 103 at each reversal point, taking the case b=2a as an example, the movement of paddle 103 within one cycle is divided into the following 12 steps, as shown in Figure 10.

[0047] Step 1001: Move from the origin to coordinate Δ in the direction of the arrangement of paddles 103. Step 1002: Move to coordinate a in the opposite direction. Step 1003: Move to coordinate Δ+a in the direction of the arrangement of paddle 103. Step 1004: Move to coordinate 2a in the opposite direction. Step 1005: Move to coordinate Δ+2a in the direction of the arrangement of paddle 103. Step 1006: Move to coordinate 2a in the opposite direction. Step 1007: Move to coordinate Δ+a in the direction of the arrangement of paddle 103. Step 1008: Move to coordinate a in the opposite direction. Step 1009: Move to coordinate Δ in the direction of the arrangement of paddle 103. Step 1010: Move in the opposite direction and return to the origin. Step 1011: Move to coordinate Δ+2a in the direction of the arrangement of paddle 103. Step 1012: Move in the opposite direction and return to the origin.

[0048] Similarly, since each point on the substrate 104 corresponding to the paddle 103 is blocked for the same amount of time, the amount of electricity received is equal, and the electroplating height is constant.

[0049] Fifth Embodiment This embodiment discloses an electroplating apparatus that has all the components of the electroplating apparatus of the first embodiment shown in Figure 1. Repeated explanations will not be provided here.

[0050] Unlike the first embodiment, as shown in Figure 11, b = 1.5a. Here, a is the width of the paddle 103, and b is the narrowest width of the gap between adjacent paddles 103.

[0051] As shown in Figure 12, the paddle 103 is inverted at 10 coordinates: Δ, a, Δ+a, 2a, Δ+2a, 3a, Δ+3a, 4a, Δ+4a, and 0.

[0052] Within one cycle, the movement of paddle 103 includes the following 10 steps:

[0053] Step 1201: Move from the origin to coordinate Δ in the direction of the arrangement of paddles 103. Step 1202: Move towards the original point a in the opposite direction. Step 1203: Move to coordinate Δ+a in the direction of the arrangement of paddle 103. Step 1204: Move to coordinate 2a in the opposite direction. Step 1205: Move to coordinate Δ+2a in the direction of the arrangement of paddle 103. Step 1206: Move to coordinate 3a in the opposite direction. Step 1207: Move to coordinate Δ+3a in the direction of the arrangement of paddle 103. Step 1208: Move to coordinate 4a in the opposite direction. Step 1209: Move to coordinate Δ+4a in the direction of the arrangement of paddle 103. Step 1210: Move in the opposite direction and return to the origin.

[0054] Within one cycle, each point on the substrate 104 corresponding to the paddle 103 is blocked for the same amount of time. If the electric field is uniformly distributed, each point on the substrate 104 corresponding to the paddle 103 receives the same amount of charge, so the height of the electroplating at each point is the same.

[0055] Sixth Embodiment In the fifth embodiment, the ratio of the narrowest gap b between adjacent paddles 103 to the width a of the paddles 103 is a non-integer greater than 1. In an electroplating apparatus where the ratio of b to a is a non-integer greater than 1, this example discloses the following electroplating method.

[0056] The controller executes the program to move paddle 103 as follows. The steps of paddle movement within one cycle are as follows: Move to the right from the origin to coordinate Δ, Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ... Move to the right at coordinate Δ+(y-2)*c, Move left to coordinate (y-1)*c Move to the right at coordinate Δ+(y-1)*c, Move to the left towards the origin. Here, let a be the width of the paddle and b be the narrowest distance between adjacent paddles, such that Δ≧a+b.

number

[0057] To understand this method, assume that c is the smaller of a and b, and x is an integer, and use multiple smaller grids of width c to fill a larger grid of width x*(a+b). Each smaller grid is positioned along the width direction, and the covered positions do not overlap, so that the larger grid is filled without gaps. By choosing an appropriate value for x, we can make x*(a+b) a multiple of c, thus satisfying the requirement. x*(a+b) being a multiple of c is equivalent to x*(N+1), which means x*N is an integer.

[0058] A small grid with width c is considered a paddle 103 of width c, x*(N+1) is considered the number of inversion positions within a group, and a large grid with width x+(a+b) is considered the coordinate range covered by the paddle 103 at the inversion positions within a group. The explanation that a large grid is filled with a small grid can be considered to realize the effect described in the fifth embodiment, that "each point on the substrate 104 corresponding to the paddle 103 is blocked for the same amount of time." Since there are two groups of inversion points in one cycle, the number of inversion points in one cycle is 2x*(N+1). To simplify the equation, if we set y=x*(N+1), the coordinates of the inversion points in the first group are 0, c, 2c, ..., (y-2)*c, (y-1)*c, and the coordinates of the inversion points in the second group are Δ, Δ+c, Δ+2c, ..., Δ+(y-2)*c, Δ+(y-1)*c.

[0059] Within one cycle, the steps for moving the paddle 103 may be as follows: Move to the right from the origin to coordinate Δ, Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ... Move to the right at coordinate Δ+(y-2)*c, Move left to coordinate (y-1)*c, Move to the right at coordinate Δ+(y-1)*c, Move left to coordinate (y-1)*c, Move to the right at coordinate Δ+(y-2)*c, ... Move left to coordinate 2c, Move to the right at coordinate Δ+c, Move left to coordinate c, Move to the right in coordinate Δ, Move left to the origin, Move to the right at coordinate Δ+(y-1)*c, Move to the left towards the origin.

[0060] Similarly, each point on the substrate 104 corresponding to the paddle 103 is covered for the same amount of time and receives the same amount of electricity, resulting in a uniform electroplating height.

[0061] Seventh Embodiment This example discloses an electroplating apparatus that includes all the structures of the electroplating apparatus of the first embodiment, but will not repeat itself here.

[0062] Furthermore, as shown in Figure 13, the electroplating apparatus in this example further includes a diffuser plate 107 placed between the paddle 103 and the substrate 104. The diffuser plate 107 has multiple through holes, and by setting the density and aperture ratio of the through holes, the uniformity of the electroplating height at each point on the substrate can be further improved.

[0063] To compare the electroplating results of an electroplating apparatus without the diffuser plate 107 with an electroplating apparatus equipped with the diffuser plate 107 of the present invention, Figure 14 shows the curves of the electroplating results for the two electroplating apparatuses. The horizontal axis represents the distance between the test point on the substrate and the center point of the substrate, and the vertical axis represents the electroplating height at the test point. It can be seen that the electroplating apparatus equipped with the diffuser plate can achieve a more uniform electroplating height.

[0064] Eighth Embodiment This embodiment discloses an electroplating apparatus that has all the components of the electroplating apparatus of the first embodiment shown in Figure 1. Repeated explanations will not be provided here.

[0065] Unlike the first embodiment, the paddle 103 has an angle α less than 90° with respect to the coordinate axis in the direction of paddle placement. Therefore, the coordinates of the paddle 103 are the actual position of the paddle 103 projected onto the coordinate axis. As shown in Figure 15, if the actual position of a point on the paddle 103 is point A, then the coordinate position of that point is point B, which is point A projected onto the coordinate axis. This can be understood as follows: Since only the component of movement of the paddle 103 in the direction of the coordinate axis causes a change in the amount of electricity received by the corresponding area on the substrate 104, only the coordinate change of the paddle 103 on the coordinate axis is considered.

[0066] Clearly, the presence of angle α increases the actual distance traveled by the paddle 103, so the magnitude of angle α can be set according to the actual situation.

[0067] Ninth Embodiment This embodiment discloses an electroplating apparatus that has all the components of the electroplating apparatus of the first embodiment shown in Figure 1. Repeated explanations will not be provided here.

[0068] Furthermore, as shown in Figure 16, one side of the paddle plate 108 is connected to an eccentric bearing 1010 via a connecting member 1011, and the eccentric bearing 1010 is slidably connected to the guide rail 109. The paddle plate 108 is driven and moved by the drive mechanism 105. Without the eccentric bearing 1010, the movement of the paddle plate 108 would be along the direction of the guide rail 109. If the drive mechanism moves the paddle plate 108 in any other direction, the paddle plate 108 would get caught on the guide rail 109. The function of the eccentric bearing 1010 is to allow for a slight deviation between the direction of movement of the paddle plate 108 and the direction of the guide rail, preventing the movement of the paddle plate 108 from being hindered by mounting errors.

[0069] To prevent corrosion of precision parts by corrosive gases, the drive mechanism 105, eccentric bearing 1010, and guide rail 109 are enclosed in a nitrogen protection box 1012. Figure 17 shows the eccentric bearing 1010 and guide rail 109 enclosed in a nitrogen protection box 1012 having a nitrogen inlet and a nitrogen outlet. The nitrogen protection box 1012 is kept filled with nitrogen, preventing external gases from entering the nitrogen protection box 1012 and corroding the internal precision parts. Similarly, the drive mechanism 105 may be enclosed in a separate nitrogen protection box.

[0070] Tenth Embodiment This embodiment discloses an electroplating apparatus that has all the components of the electroplating apparatus of the first embodiment shown in Figure 1. Repeated explanations will not be provided here.

[0071] Unlike the first embodiment, as shown in Figure 18, the paddle plate 108 has a square shape, making it suitable for electroplating square substrates. Accordingly, the paddles 103 are formed by creating strip-shaped through holes in the central square area of ​​the paddle plate 108.

[0072] The coordinate constraints of the paddle 103 in each embodiment of the present invention reflect the distance the paddle 103 moves. In electroplating, the origin position of the coordinate axes can be arbitrarily specified.

[0073] To demonstrate the effects achieved by the present invention, Figures 19A, 19B, and 19C show the electroplating effect of a substrate using an existing electroplating apparatus, the electroplating effect of a substrate using the electroplating apparatus of the present invention, and data on the electroplating height at test points on the substrate, respectively. Compared to Figure 19B, the concentric circles on the substrate in Figure 19A are more pronounced, and the electroplating height is non-uniform. In Figure 19C, the horizontal axis represents the distance between the test point and the center point of the substrate, and the vertical axis represents the electroplating height at the test point. From Figure 19C, it can be seen that when using an existing electroplating apparatus, there is a large variation in the electroplating height along the radial direction of the substrate, and this is more pronounced in the region closer to the center of the substrate. When using the electroplating apparatus of the present invention, the electroplating height at each point on the substrate becomes more uniform, and small differences in the electroplating height between different points are related to other factors and are within an acceptable range.

[0074] In summary, the present invention is disclosed concretely and comprehensively through the embodiments and related drawings described above, enabling those skilled in the art to implement the invention. The embodiments described above are used solely to illustrate the invention and are not intended to limit the scope of the invention. The scope of the invention should be defined by the claims of the invention. Modifications to the number of components described in this document or substitutions of equivalent components are also within the scope of the invention.

Claims

1. An electroplating apparatus comprising a plurality of parallel paddles arranged parallel to a substrate and moving to agitate an electroplating solution, further comprising a controller and a drive mechanism, the drive mechanism being connected to the controller and the plurality of paddles, and the controller controlling the drive mechanism to periodically move the paddles such that the cumulative time blocked by each corresponding point on the substrate is equal. When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move to the right from the origin of the coordinate system to coordinate Δ, Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ・・・ Move to the right at coordinate Δ+(N-1)*c, Move left to coordinate N*c, Move to the right at coordinate Δ+N*c, This includes moving to the left and returning to the origin coordinates. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ ≥ a + b. [Math 1] An electroplating apparatus characterized in that, for N to be an integer, b = N * a or a = N * b.

2. The electroplating apparatus according to claim 1, wherein a diffusion plate having a plurality of through holes is provided between the paddle and the substrate, and the diffusion plate has a plurality of through holes.

3. The electrolytic plating apparatus according to claim 1, wherein the apparatus is equipped with a guide rail, and the paddle is formed by cutting a strip-shaped through hole into a paddle plate, one side of which is connected to a drive mechanism and the other side of which is slidably connected to the guide rail via an eccentric bearing.

4. The electroplating apparatus according to claim 3, characterized in that the drive mechanism, eccentric bearing and guide rail are enclosed in a nitrogen protection box, and the nitrogen protection box is provided with a nitrogen inlet and a nitrogen outlet.

5. An electroplating apparatus comprising a plurality of parallel paddles arranged parallel to a substrate and moving to agitate an electroplating solution, further comprising a controller and a drive mechanism, the drive mechanism being connected to the controller and the plurality of paddles, and the controller controlling the drive mechanism to periodically move the paddles such that the cumulative time blocked by each corresponding point on the substrate is equal. When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ・・・ Move to the right at coordinate Δ+(N-1)*c, Move left to coordinate N*c, Move to the right at coordinate Δ+N*c, Move left to coordinate N*c, Move to the right at coordinate Δ+(N-1)*c, ・・・ Move left to coordinate 2c, Move to the right at coordinate Δ+c, Move left to coordinate c, Move to the right in coordinate Δ, Move to the left and return to the origin. Move to the right at coordinate Δ+N*c, Move to the left and return to the origin. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ ≥ a + b. [Math 2] An electroplating apparatus characterized in that, for N to be an integer, b = N * a or a = N * b.

6. The electroplating apparatus according to claim 5, wherein a diffusion plate having a plurality of through holes is provided between the paddle and the substrate, and the diffusion plate has a plurality of through holes.

7. The electrolytic plating apparatus according to claim 5, wherein the apparatus is equipped with a guide rail, and the paddle is formed by cutting strip-shaped through holes into a paddle plate, one side of which is connected to a drive mechanism and the other side of which is slidably connected to the guide rail via an eccentric bearing.

8. The electroplating apparatus according to claim 7, characterized in that the drive mechanism, eccentric bearing and guide rail are enclosed in a nitrogen protection box, and the nitrogen protection box is provided with a nitrogen inlet and a nitrogen outlet.

9. An electroplating apparatus comprising a plurality of parallel paddles arranged parallel to a substrate and moving to agitate an electroplating solution, further comprising a controller and a drive mechanism, the drive mechanism being connected to the controller and the plurality of paddles, and the controller controlling the drive mechanism to periodically move the paddles such that the cumulative time blocked by each corresponding point on the substrate is equal. When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move to the right from the origin to coordinate Δ, Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ・・・ Move to the right at coordinate Δ+(y-2)*c, Move left to coordinate (y-1) * c, Move to the right at coordinate Δ+(y-1)*c, Move to the left and return to the origin. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ ≥ a + b. [Math 3] An electroplating apparatus characterized in that, N is a non-integer greater than 1, x is a value such that x * N is an integer, y = x * (N + 1), and b = N * a or a = N * b.

10. An electroplating apparatus comprising a plurality of parallel paddles arranged parallel to a substrate and moving to agitate an electroplating solution, further comprising a controller and a drive mechanism, the drive mechanism being connected to the controller and the plurality of paddles, and the controller controlling the drive mechanism to periodically move the paddles such that the cumulative time blocked by each corresponding point on the substrate is equal. When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move to the right from the origin to coordinate Δ, Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ・・・ Move to the right at coordinate Δ+(y-2)*c, Move left to coordinate (y-1) * c, Move to the right at coordinate Δ+(y-1)*c, Move left to coordinate (y-1) * c, Move to the right at coordinate Δ+(y-2)*c, ・・・ Move left to coordinate 2c, Move to the right at coordinate Δ+c, Move left to coordinate c, Move to the right in coordinate Δ, Move to the left and return to the origin. Move to the right at coordinate Δ+(y-1)*c, Move to the left and return to the origin. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ ≥ a + b. [Math 4] An electroplating apparatus characterized in that, N is a non-integer greater than 1, x is a value such that x * N is an integer, y = x * (N + 1), and b = N * a or a = N * b.

11. An electroplating method comprising: a plurality of parallel paddles arranged parallel to a substrate and moving to agitate an electroplating solution; and control of the movement of the paddles such that the cumulative time blocked by each corresponding point on the substrate is equal, When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move to the right from the origin of the coordinate system to coordinate Δ, Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ・・・ Move to the right at coordinate Δ+(N-1)*c, Move left to coordinate N*c, Move to the right at coordinate Δ+N*c, This includes moving to the left and returning to the origin coordinates. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ ≥ a + b. [Math 5] An electrolytic plating method characterized in that, where N is an integer, b = N * a or a = N * b.

12. An electroplating method comprising: a plurality of parallel paddles arranged parallel to a substrate and moving to agitate an electroplating solution; and controlling the movement of the paddles so that the cumulative time blocked by each corresponding point on the substrate is equal; When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ・・・ Move to the right at coordinate Δ+(N-1)*c, Move left to coordinate N*c, Move to the right at coordinate Δ+N*c, Move left to coordinate N*c, Move to the right at coordinate Δ+(N-1)*c, ・・・ Move left to coordinate 2c, Move to the right at coordinate Δ+c, Move left to coordinate c, Move to the right in coordinate Δ, Move to the left and return to the origin. Move to the right at coordinate Δ+N*c, Move to the left and return to the origin. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ ≥ a + b. [Math 6] An electrolytic plating method characterized in that, where N is an integer, b = N * a or a = N * b.

13. An electroplating method comprising: a plurality of parallel paddles arranged parallel to a substrate and moving to agitate an electroplating solution, and controlling the movement of the paddles so that the cumulative time blocked by each corresponding point on the substrate is equal. When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move to the right from the origin to coordinate Δ, Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ・・・ Move to the right at coordinate Δ+(y-2)*c, Move left to coordinate (y-1) * c, Move to the right at coordinate Δ+(y-1)*c, Move to the left and return to the origin. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ ≥ a + b. [Number 7] An electrolytic plating method characterized in that, N is a non-integer greater than 1, and x is a value such that x * N is an integer, then y = x * (N + 1) and b = N * a or a = N * b.

14. An electroplating method comprising: a plurality of parallel paddles arranged parallel to a substrate and moving to agitate an electroplating solution; and controlling the movement of the paddles so that the cumulative time blocked by each corresponding point on the substrate is equal; When the direction of the paddle arrangement is the coordinate axis, the number of paddle movement steps within one cycle is: Move to the right from the origin to coordinate Δ, Move left to coordinate c, Move to the right at coordinate Δ+c, Move left to coordinate 2c, ・・・ Move to the right at coordinate Δ+(y-2)*c, Move left to coordinate (y-1) * c, Move to the right at coordinate Δ+(y-1)*c, Move left to coordinate (y-1) * c, Move to the right at coordinate Δ+(y-2)*c, ・・・ Move left to coordinate 2c, Move to the right at coordinate Δ+c, Move left to coordinate c, Move to the right in coordinate Δ, Move to the left and return to the origin. Move to the right at coordinate Δ+(y-1)*c, Move to the left and return to the origin. Let a be the width of the paddle and b be the minimum width of the gap between adjacent paddles, such that Δ ≥ a + b. [Number 8] An electrolytic plating method characterized in that, N is a non-integer greater than 1, and x is a value such that x * N is an integer, then y = x * (N + 1) and b = N * a or a = N * b.

Images