A carrier plate plating apparatus

Abstract

This invention relates to the field of electroplating technology and discloses a substrate electroplating device, including an electroplating module, an electroplating solution storage tank, a power module, a power supply module, and a loading / unloading module. The electroplating module includes an electroplating chamber and an electroplating assembly. The electroplating chamber consists of a first cavity and a second cavity arranged correspondingly. The electroplating assembly includes a first anode and a second anode arranged correspondingly in the vertical direction. A first spray element and a second spray element, a first cathode and a second cathode are arranged correspondingly between the first anode and the second anode. A return pipe is provided between the electroplating solution storage tank and the first cavity, and an overflow pipe is provided between the electroplating solution storage tank and the second cavity. The power module transports the electrolyte from the electroplating solution storage tank to the electroplating chamber. It can be seen that the substrate electroplating device of this solution has a reasonable overall design and adopts a horizontal electroplating method, which can avoid the problem of substrate breakage during clamping and subsequent operation. At the same time, the double-sided electroplating method has a more uniform plating effect.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, and more particularly to a carrier plate electroplating device. Background Technology

[0002] Carrier plate electroplating is a copper plating process that involves creating a seed layer on the surface of the substrate. Currently, most equipment on the market that involves carrier plate electroplating is a vertical insertion type, with multiple tanks operating continuously. This results in high investment costs, long turnaround distances, and the substrate is clamped on one side of the top, leading to structural instability that affects the uniformity of copper plating and is prone to breakage, ultimately reducing production efficiency. Summary of the Invention

[0003] The present invention aims to solve at least one problem in the prior art. To this end, the present invention proposes a carrier plate electroplating apparatus that can avoid the problem of carrier plate breakage during clamping and subsequent operation, while the double-sided electroplating method has a more uniform plating effect.

[0004] According to a first aspect of the present invention, a carrier plate electroplating apparatus includes an electroplating module, an electroplating solution storage tank, a power module, a power supply module, and a loading / unloading module. The electroplating module includes an electroplating chamber and an electroplating assembly. The electroplating chamber is composed of a first cavity and a second cavity arranged vertically, and the first cavity and the second cavity have a communication structure. The electroplating assembly includes a first anode and a second anode arranged vertically, and a first spray element and a second spray element, a first cathode and a second cathode are correspondingly arranged between the first anode and the second anode. The first spray element is disposed on the... Between the first anode and the first cathode, the second spray element is disposed between the second anode and the second cathode. The electroplating solution storage tank is used to provide electrolyte to the first cavity and the second cavity. A return pipe is provided between the electroplating solution storage tank and the first cavity, and an overflow pipe is provided between the electroplating solution storage tank and the second cavity. The power module is used to transport the electrolyte from the electroplating solution storage tank to the first cavity and the second cavity. The power supply module is used to connect the electroplating module and the power module. The loading and unloading module is used to provide the parts to be electroplated to the electroplating module.

[0005] Therefore, it can be seen that the carrier plate electroplating equipment of this solution has a more reasonable overall design compared with conventional carrier plate electroplating equipment. It adopts a horizontal electroplating method, which can avoid the problem of carrier plate breakage during clamping and subsequent operation. At the same time, the double-sided electroplating method has a more uniform plating effect.

[0006] According to another embodiment of the present invention, the first cavity includes a first body, the first body includes a detachable top cover and a plurality of side plates, and an overflow port is provided on one of the side plates of the first body, the overflow port being connected to the electroplating solution storage tank through the overflow pipe.

[0007] According to another embodiment of the present invention, the top cover plate has a plurality of hollow portions, which are used to allow the electroplating component to pass through the top cover plate.

[0008] According to another embodiment of the present invention, the second cavity includes a second main body, the first main body includes a bottom cover plate and a plurality of side plates, the bottom cover plate and the plurality of side plates together define an electroplating area, the bottom cover plate is provided with a reflux port, and the reflux port is connected to the electroplating solution storage tank through the reflux pipe.

[0009] According to another embodiment of the present invention, a connector is provided between the first body and the second body, the connector being used to realize the opening and closing between the first body and the second body.

[0010] According to another embodiment of the present invention, the electroplating assembly further includes a cathode fixing conductive rod, a cathode linkage plate, a cathode lifting plate, and a cathode adjusting component. The cathode fixing conductive rod is arranged in a vertical direction, and the top of the cathode fixing conductive rod is sequentially connected and fixed to the cathode linkage plate and the cathode lifting plate arranged in a horizontal direction.

[0011] According to another embodiment of the present invention, the cathode adjustment component includes a vertical connector and a horizontal connector. The vertical connector is connected and fixed to the cathode linkage plate in the vertical direction, and the horizontal connector is connected to the vertical connector in the horizontal direction. The horizontal connector is provided with a plurality of limiting components.

[0012] According to another embodiment of the present invention, the electroplating assembly further includes a first anode conductive element and a second anode conductive element, wherein the first anode conductive element is connected to the first anode and the power module, and the second anode conductive element is connected to the second anode and the power module.

[0013] According to another embodiment of the present invention, an opening and closing cylinder is further included, the opening and closing cylinder being disposed at the bottom of the second cavity.

[0014] According to another embodiment of the present invention, the power module includes a power pump and a delivery pipe, the delivery pipe being connected to the first spray element and the second spray element.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] This invention discloses a carrier plate electroplating device, including an electroplating module, an electroplating solution storage tank, a power module, a power supply module, and a loading / unloading module. The electroplating module includes an electroplating chamber and an electroplating assembly. The electroplating chamber consists of a first cavity and a second cavity arranged vertically, with a communication structure between them. The electroplating assembly includes a first anode and a second anode arranged vertically, with a first spray element and a second spray element, a first cathode and a second cathode arranged between them. The first spray element is located between the first anode and the first cathode, and the second spray element is located between the second anode and the second cathode. The electroplating solution storage tank is used to provide electrolyte to the first cavity and the second cavity. A return pipe is provided between the electroplating solution storage tank and the first cavity, and an overflow pipe is provided between the electroplating solution storage tank and the second cavity. The power module is used to transport the electrolyte from the electroplating solution storage tank to the first cavity and the second cavity. The power supply module is used to connect the electroplating module and the power module. The loading / unloading module is used to provide the workpiece to be electroplated to the electroplating module. Therefore, it can be seen that the carrier plate electroplating equipment of this solution has a more reasonable overall design compared with conventional carrier plate electroplating equipment. It adopts a horizontal electroplating method, which can avoid the problem of carrier plate breakage during clamping and subsequent operation. At the same time, the double-sided electroplating method has a more uniform plating effect.

[0017] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0019] Figure 1 A schematic diagram of an embodiment of the carrier plate electroplating equipment provided in this application;

[0020] Figure 2 A schematic diagram of an embodiment of the electroplating module and electroplating solution storage tank of the carrier plate electroplating equipment provided in this application;

[0021] Figure 3 Another schematic diagram of an embodiment of the electroplating module and electroplating solution storage tank of the carrier plate electroplating equipment provided in this application;

[0022] Figure 4 A schematic diagram of an embodiment of the electroplating component of the carrier plate electroplating equipment provided in this application;

[0023] Figure 5 Another schematic diagram of an embodiment of the electroplating assembly of the carrier plate electroplating equipment provided in this application;

[0024] Figure 6A schematic diagram of an embodiment of the electroplating components and the first cavity of the carrier plate electroplating equipment provided in this application;

[0025] Figure 7 Another schematic diagram of an embodiment of the electroplating components and the first cavity of the carrier plate electroplating apparatus provided in this application;

[0026] Figure 8 Another schematic diagram of an embodiment of the electroplating assembly of the carrier plate electroplating equipment provided in this application;

[0027] Figure 9 This is a schematic diagram of an embodiment of the cathode adjustment component of the carrier plate electroplating equipment provided in this application; the meanings of the markings in the figure are as follows:

[0028] 10. Carrier plate electroplating equipment;

[0029] 100. Electroplating module;

[0030] 110. Electroplating chamber; 111. First cavity; 1111. First main body; 1112. Top cover plate;

[0031] 1113. Side panel; 1114. Overflow outlet; 1115. Hollowed-out section; 112. Second cavity;

[0032] 1121. Second main body; 1122. Bottom cover plate; 1123. Side plate; 1124. Return port;

[0033] 113. Connectors;

[0034] 120. Electroplating assembly; 1201. First anode; 1202. Second anode; 1203. First spray component;

[0035] 1204, Second spray element; 1205, First cathode; 1206, Second cathode;

[0036] 1207. Cathode fixed conductive rod; 1208. Cathode linkage plate; 1209. Cathode lifting plate;

[0037] 1210. Cathode adjustment component; 1211. Vertical connecting component; 1212. Horizontal connecting plate;

[0038] 1213. Limiting component; 1214. First anode conductive component; 1215. Second anode conductive component;

[0039] 200. Electroplating solution storage tank; 210. Overflow pipe; 220. Return pipe;

[0040] 300. Power module; 310. Opening / closing cylinder; 320. Power pump; 330. Delivery pipe;

[0041] 400. Power supply module;

[0042] 500. Loading and unloading module. Detailed Implementation

[0043] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0044] In the description of this invention, it should be understood that features specified as "first" or "second" may explicitly or implicitly include one or more of those features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0045] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0046] To illustrate the carrier plate electroplating equipment provided in this application, the following detailed description is provided in conjunction with the accompanying drawings and textual descriptions of the embodiments.

[0047] The following is for reference. Figures 1-9 The carrier plate electroplating apparatus 10 according to an embodiment of the present invention is described as follows: Figures 1-9As shown, the carrier plate electroplating equipment 10 includes an electroplating module 100, an electroplating solution storage tank 200, a power module 300, a power supply module 400, and a loading / unloading module 500. Specifically, the electroplating module 100 includes an electroplating chamber 110 and an electroplating assembly 120. The electroplating chamber 110 consists of a first cavity 111 and a second cavity 112 arranged vertically, with a communication structure between them. The electroplating chamber 110 is used to complete the electroplating process of the carrier plate awaiting electroplating. Further, the electroplating assembly 120 includes a first anode 1201 and a second anode 1202 arranged vertically. A first spray element 1203 and a second spray element 1204, a first cathode 1205 and a second cathode 1206 are correspondingly arranged between 1202. The first spray element 1203 is disposed between the first anode 1201 and the first cathode 1205, and the second spray element 1204 is disposed between the second anode 1202 and the second cathode 1206. It can be understood that an oxidation reaction occurs on the first anode 1201 and the second anode 1202, such as metal losing electrons to generate metal ions, which enter the electrolyte solution. At the same time, a reduction reaction occurs on the first cathode 1205 and the second cathode 1206, where the metal ions gain electrons and are reduced to metal, which is then deposited on the carrier plate awaiting electroplating. On the workpiece, by setting a first anode 1201, a first cathode 1205, a second anode 1202, and a second cathode 1206 on both sides of the workpiece to be electroplated, the electroplating process can be carried out simultaneously on both sides of the workpiece, thereby improving the electroplating efficiency. Furthermore, the electroplating solution storage tank 200 is filled with electrolyte, thus providing the first cavity 111 and the second cavity 112 with the electrolyte used in the electroplating process. Specifically, a return pipe 220 is provided between the electroplating solution storage tank 200 and the first cavity 111, which is used to return the electrolyte used after electroplating to the electroplating solution storage tank 200. The electroplating solution storage tank 200 and the second cavity... An overflow pipe 210 is provided between 112, which is used to return the electrolyte used after electroplating to the electroplating solution storage tank 200; further, a power module 300 is also included, which is used to transport the electrolyte in the electroplating solution storage tank 200 to the first chamber 111 and the second chamber 112; further, a power module 400 is also included, which is used to connect the electroplating module 100 and the power module 300 and to control the operation of the electroplating module 100 and the power module 300; further, a loading and unloading module 500 is also included, which is used to load and unload the parts to be electroplated to the electroplating module 100.

[0048] Therefore, it can be seen that the carrier plate electroplating equipment 10 of this solution has a more reasonable overall design compared with the conventional carrier plate electroplating equipment 10. It adopts a horizontal electroplating method, which can avoid the problem of carrier plate breaking during clamping and subsequent operation. At the same time, the double-sided electroplating method has a more uniform plating effect.

[0049] It should be noted that the loading and unloading module 500 simultaneously functions as both a loading and unloading component, meaning that the loading and unloading processes are performed in the same component, thereby improving the overall utilization rate and further reducing the size and weight of the equipment; alternatively, the loading and unloading module 500 may include separate loading and unloading components, meaning that the loading and unloading processes are performed separately, making it easier to replace and repair the loading and unloading components individually.

[0050] It should be noted that the power module 400 may include a power supply (not shown in the figure) and a control unit (not shown in the figure), wherein both the power supply and the control unit are connected to the electroplating module 100 and the power module 300, thereby controlling the operation of the electroplating module 100 and the power module 300 and providing power for their movement.

[0051] It should be noted that during electroplating, the part to be electroplated is placed between the first anode 1201 and the second anode 1202, so that both sides of the part to be electroplated can be electroplated, thereby improving the electroplating efficiency.

[0052] It should be noted that the electroplating process flow and steps of the carrier plate electroplating equipment 10 in this embodiment are as follows:

[0053] Step S101: The power module 300 injects an appropriate amount of electroplating solution into the second cavity 112. By reducing the injection time of the electroplating solution before electroplating, production efficiency can be improved.

[0054] Step S102: Open the first cavity 111 to provide sufficient loading space for the workpiece to be electroplated.

[0055] Step S103: The loading and unloading module 500 places the part to be electroplated onto the second cathode 1206.

[0056] Step S104: The first cathode 1205 and the second cathode 1206 are brought together, so that the workpiece to be electroplated is in a clamped state, thereby ensuring that the workpiece to be electroplated is in a horizontal state and has electrical conductivity.

[0057] Step S105: The first cavity 111 and the second cavity 112 are closed to realize a closed circulation space for the electroplating solution.

[0058] Step S106: The power module 300 injects electroplating solution into the first cavity 111 and the second cavity 112 until the electroplating solution overflows the top of the first anode 1201.

[0059] Step S107: The first spraying component 1203 and the second spraying component 1204 are activated. By spraying the upper and lower surfaces of the workpiece to be electroplated simultaneously, the uniformity of the electroplating solution can be ensured, and the coating thickness control effect on the surface of the workpiece to be electroplated can be improved.

[0060] Step S108: The first anode 1201, the second anode 1202, the first cathode 1205, and the second cathode 1206 are energized and connected. Specifically, the power lines of the first anode 1201 and the second anode 1202 can be fixed, while the power lines of the first cathode 1205 and the second cathode 1206 can be flexibly connected, thereby expanding the swing space.

[0061] Step S109: The first cathode 1205 and the second cathode 1206 clamp the workpiece to be electroplated and swing it at a uniform speed to ensure the horizontal state and good conductivity of the workpiece, thereby improving the control effect of the coating thickness on the surface of the workpiece.

[0062] Step S110: Electroplating is complete, and the first anode 1201, the second anode 1202, the first cathode 1205, and the second cathode 1206 are de-energized.

[0063] Step S111: The electroplated electrolyte is returned to the electroplating solution storage tank 200 through the return pipe 220.

[0064] Step S112: The first cavity 111 and the second cavity 112 are opened, the first cathode 1205 and the second cathode 1206 are opened, and the loading and unloading module 500 takes out the part to be electroplated.

[0065] It should be noted that in some other embodiments, the first cavity 111 and the second cavity 112 together form a closed circulation space, thereby increasing the volume of the electroplating area and making the overall size of the equipment smaller, which is beneficial for loading and unloading the parts to be electroplated.

[0066] It should be noted that in some other embodiments, only the first anode 1201, the first cathode 1205 and the first spray element 1203 are provided. In this case, the structure of the electroplating chamber 110 can be simplified, the volume of the electroplating chamber 110 can be reduced, and thus the overall volume of the equipment can be reduced.

[0067] According to one embodiment of the present invention, such as Figure 2 and Figure 3As shown, the first cavity 111 includes a first body 1111, which includes a detachable top cover 1112 and multiple side plates 1113. One side plate 1113 of the first body 1111 is provided with an overflow port 1114. The overflow port is connected to the electroplating solution storage tank 200 through an overflow pipe 210, so that excess electroplating solution is returned to the electroplating solution storage tank 200. It can be understood that the bottom of the first cavity 111 is provided with an opening. By placing the top of the electroplating component 120 inside the first body 1111, the electroplating component 120 is prevented from being exposed to the outside, thus playing a protective role.

[0068] According to one embodiment of the present invention, such as Figure 2 and Figure 6 As shown, the top cover plate 1112 has multiple cutouts 1115. The cutouts 1115 are used to allow the electroplating assembly 120 to pass through the top cover plate 1112. It can be understood that the tops of some components of the electroplating module 100 need to pass through the first body 1111. Therefore, the multiple cutouts 1115 on the top cover plate 1112 can allow these components to pass through normally, while also ensuring the sealing performance of the top of the first body 1111 as much as possible.

[0069] According to one embodiment of the present invention, such as Figures 3-5 As shown, the second cavity 112 includes a second main body 1121, and the first main body 1111 includes a bottom cover plate 1122 and multiple side plates 1113. The bottom cover plate 1122 and multiple side plates 1123 together define the electroplating area. A return port 1124 is provided on the bottom cover plate 1122. The return port 1124 is connected to the electroplating solution storage tank 200 through a return pipe 220. It can be understood that the top of the second cavity 112 is provided with an opening, so that the interior of the first cavity 111 and the second cavity 112 can be sealed, so that the internal enclosed space of the electroplating chamber 110 is sufficient for electroplating operation. At the same time, after the electroplating is completed, the electrolyte is sent back to the electroplating solution storage tank 200 through the return port 1124 and the return pipe 220.

[0070] According to one embodiment of the present invention, such as Figure 2 and Figure 3 As shown, a connector 113 is provided between the first main body 1111 and the second main body 1121. The connector 113 is used to realize the opening and closing between the first main body 1111 and the second main body 1121. Specifically, the two ends of the connector 113 are respectively connected to the sides of the first main body 1111 and the second main body 1121, thereby realizing the combination or separation between the first main body 1111 and the second main body 1121.

[0071] It should be noted that the number of connectors 113 can be two or more, as long as they can complete the opening and closing between the first main body 1111 and the second main body 1121. The number of connectors 113 can be adjusted according to the specific application scenario.

[0072] According to one embodiment of the present invention, such as Figures 6-8 As shown, the electroplating assembly 120 also includes a cathode fixing conductive rod 1207, a cathode linkage plate 1208, a cathode lifting plate 1209, and a cathode adjusting component 1210. The cathode fixing conductive rod 1207 is arranged vertically, and its top is sequentially connected and fixed to the cathode linkage plate 1208 and the cathode lifting plate 1209 arranged horizontally. It can be understood that the cathode fixing conductive rod 1207 serves to fix the first cathode 1205 and the second cathode 1206, while enabling the first cathode 1205 and the second cathode 1206 to conduct electricity. The cathode linkage plate 1208 can drive the first cathode 1205 and the second cathode 1206 to swing horizontally, thereby improving the electroplating effect. The cathode lifting plate 1209 can drive the first cathode 1205 and the second cathode 1206 to move vertically, thereby realizing the loading and unloading of the workpiece to be electroplated. The cathode adjusting component 1210 can be used to adjust the opening and closing balance to ensure a horizontal effect.

[0073] According to one embodiment of the present invention, such as Figure 7 and Figure 9 As shown, the cathode adjustment component 1210 includes a vertical connector 1211 and a horizontal connector 1212. Specifically, the vertical connector 1211 is connected and fixed to the cathode linkage plate 1208 in the vertical direction, and the horizontal connector 1212 is connected to the vertical connector 1211 in the horizontal direction. The horizontal connector 1212 is provided with multiple limiting components 1213. It can be understood that there can be multiple limiting components 1213 to ensure the accuracy of the horizontal effect.

[0074] According to one embodiment of the present invention, such as Figure 4 and Figure 5 As shown, the electroplating assembly 120 also includes a first anode conductive element 1214 and a second anode conductive element 1215. The first anode conductive element 1214 is connected to the first anode 1201 and the power module 400, and the second anode conductive element 1215 is connected to the second anode 1202 and the power module 400. It can be understood that the first anode 1201 and the second anode 1202 are made conductive by connecting the first anode conductive element 1214 and the second anode conductive element 1215 to the power supply.

[0075] According to one embodiment of the present invention, such as Figure 1 and Figure 3As shown, the power module 300 includes an opening and closing cylinder 310, which is located at the bottom of the second cavity 112. It can be understood that the opening and closing cylinder 310 can drive the movement of the connecting piece 113, thereby realizing the merging and separation of the first cavity 111 and the second cavity 112.

[0076] According to one embodiment of the present invention, such as Figure 1 and Figure 3 As shown, the power module 300 includes a power pump 320 and a delivery pipe 330. The delivery pipe 330 is connected to the first spray element 1203 and the second spray element 1204. It can be understood that the power pump 320 is used to provide power to deliver the electrolyte to the electroplating chamber 110, and the delivery pipe 330 is used to deliver the electrolyte to the first spray element 1203 and the second spray element 1204.

[0077] The above-described carrier plate electroplating equipment provided in this application is a preferred embodiment and should not be construed as a limitation on the scope of protection of this application. Those skilled in the art should know that various improvements or substitutions can be made without departing from the concept of this application, and all improvements or substitutions should be within the scope of protection of this application, that is, the scope of protection of this application should be determined by the claims.

[0078] Where there is no conflict, the above embodiments and features described herein can be combined with each other.

Claims

1. A substrate electroplating device, characterized in that, include: An electroplating module includes an electroplating chamber and an electroplating assembly. The electroplating chamber consists of a first cavity and a second cavity arranged vertically and connected to each other. The electroplating assembly includes a first anode and a second anode arranged vertically. A first spray element and a second spray element, a first cathode and a second cathode are disposed between the first anode and the second anode, respectively. The first spray element is disposed between the first anode and the first cathode, and the second spray element is disposed between the second anode and the second cathode. An electroplating solution storage tank is provided for supplying electrolyte to the first cavity and the second cavity. A return pipe is provided between the electroplating solution storage tank and the first cavity, and an overflow pipe is provided between the electroplating solution storage tank and the second cavity. A power module is used to transport the electrolyte from the electroplating solution storage tank to the first cavity and the second cavity; A power module, which is used to connect the electroplating module and the power module; The loading and unloading module is used to provide the parts to be electroplated to the electroplating module.

2. The carrier plate electroplating equipment as described in claim 1, characterized in that, The first cavity includes a first body, which includes a detachable top cover and multiple side plates. One of the side plates of the first body is provided with an overflow port, which is connected to the electroplating solution storage tank through the overflow pipe.

3. The carrier plate electroplating equipment as described in claim 2, characterized in that, The top cover plate has multiple cutouts, which are used to allow the electroplating component to pass through the top cover plate.

4. The carrier plate electroplating equipment as described in claim 2, characterized in that, The second cavity includes a second main body. The first main body includes a bottom cover plate and multiple side plates. The bottom cover plate and multiple side plates together define an electroplating area. A reflux port is provided on the bottom cover plate. The reflux port is connected to the electroplating solution storage tank through the reflux pipe.

5. The carrier plate electroplating equipment as described in claim 4, characterized in that, A connector is provided between the first body and the second body, and the connector is used to realize the opening and closing of the first body and the second body.

6. The carrier plate electroplating equipment as described in claim 1, characterized in that, The electroplating assembly further includes a cathode fixing conductive rod, a cathode linkage plate, a cathode lifting plate, and a cathode adjustment component. The cathode fixing conductive rod is arranged vertically, and the top of the cathode fixing conductive rod is sequentially connected and fixed to the cathode linkage plate and the cathode lifting plate arranged horizontally.

7. The carrier plate electroplating equipment as described in claim 6, characterized in that, The cathode adjustment component includes a vertical connector and a horizontal connector. The vertical connector is connected and fixed to the cathode linkage plate in the vertical direction. The horizontal connector is connected to the vertical connector in the horizontal direction, and the horizontal connector is provided with multiple limiting components.

8. The carrier plate electroplating equipment as described in claim 1, characterized in that, The electroplating assembly further includes a first anode conductive element and a second anode conductive element, wherein the first anode conductive element is connected to the first anode and the power module, and the second anode conductive element is connected to the second anode and the power module.

9. The carrier plate electroplating equipment as described in claim 1, characterized in that, It also includes an opening and closing cylinder, which is located at the bottom of the second cavity.

10. The carrier plate electroplating equipment as described in claim 1, characterized in that, The power module includes a power pump and a delivery pipe, and the delivery pipe is connected to the first spray element and the second spray element.

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