Electroplating application system, application condition determination device, and method for manufacturing plated structures

Abstract

To provide an electroplating execution system which makes it possible to easily determine execution conditions.SOLUTION: An execution system 100 comprises an execution device 20 for performing electroplating using a gel containing a plating component, and a determination device 10 determining execution conditions for electroplating using the execution device 20. The determination device 10 comprises a reception part 11 for receiving information on desired plating, a database 12 in which the information on desired plating and the execution conditions are recorded in association with each other, a determination part 13 for determining the execution conditions from both of the information on desired plating received by the reception part 11 and the database 12, and an output part 14 for outputting the execution conditions determined by the determination part 13 to the output device.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This disclosure relates to an electroplating system, a device for determining the application conditions, and a method for manufacturing a plated structure. [Background technology]

[0002] To improve the efficiency of the plating process, gel plating using semi-solid gels has been proposed. By selecting the gel shape, it becomes possible to eliminate the need for masking the surrounding area when plating specific parts, and it is also possible to reduce the amount of waste liquid used compared to wet plating performed in a liquid, making it a promising technology.

[0003] Claim 1 of Patent Document 1 describes a structure comprising "a sheet-like support, a gel-like plating composition laminated on the support, and a protective film that covers the surface of the plating composition and is peelable from the plating composition, wherein the plating composition comprises a gelling agent, metal ions that can be deposited by an electroless plating reaction, and a solvent." [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2015-113494 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] The electroplating described herein is a technology that performs plating using a gel containing plating components, electrodes for conducting electric current, a power supply for conducting electric current, and a heater and temperature control device for heating the member to be plated.

[0006] Incidentally, when performing electroplating using gel plating, the plating conditions (current density, time, temperature, etc.) differ significantly from those used when performing electroplating with conventional wet plating solutions. The problem that this disclosure aims to solve is to provide an electroplating system, a device for determining the application conditions, and a method for manufacturing a plated structure that can easily determine the application conditions for electroplating using gel plating. [Means for solving the problem]

[0007] The electroplating system of this disclosure comprises an application device for performing electroplating using a gel containing plating components, and a determination device for determining the application conditions for electroplating using the application device, wherein the determination device comprises a receiving unit for receiving desired plating information, a database for recording the plating information and the application conditions in association, a determination unit for determining the application conditions from the plating information received by the receiving unit and the database, and an output unit for outputting the application conditions determined by the determination unit to an output device. The plating information includes required characteristics for the plating film, the application conditions include the type of the plating component, and the determination unit determines the type of the plating component in the gel as an application condition by reading the type of the plating component associated with the required characteristics received by the reception unit from the database, and determines the type of gelling agent as an application condition by reading the type of gelling agent associated with the type of plating component from the database. Other solutions will be described later in the descriptions of embodiments for carrying out the invention. [Effects of the Invention]

[0008] This disclosure provides an electroplating system that allows for easy determination of the application conditions for electroplating using gel plating, an application condition determination device, and a method for manufacturing a plated structure. [Brief explanation of the drawing]

[0009] [Figure 1] Block diagram of the electroplating system of this disclosure. [Figure 2] Block diagram showing the hardware configuration of the decision device in this disclosure. [Figure 3] This is a diagram illustrating the information contained in the database. [Figure 4] This figure illustrates the structure of a construction device according to one embodiment. [Figure 5] This diagram illustrates the structure of a construction device according to yet another embodiment. [Figure 6] This flowchart shows the method for manufacturing the plated product of this disclosure. [Figure 7]This is a photograph used as a substitute for a diagram to show the experimental results in Comparative Example 2. [Figure 8] This is a photograph used as a substitute for a drawing, showing a different location in Comparative Example 2 than in Figure 7. [Modes for carrying out the invention]

[0010] Hereinafter, embodiments (referred to as "models") for implementing this disclosure will be described with reference to the drawings. Within the description of one embodiment below, other embodiments applicable to that embodiment will also be described as appropriate. This disclosure is not limited to the following embodiment, and different embodiments can be combined or modified as appropriate without significantly impairing the effects of this disclosure. In addition, the same reference numerals will be used for the same components, and redundant descriptions will be omitted. Furthermore, components having the same function will be given the same name. The illustrations are for illustrative purposes only, and for illustrative purposes, the actual configuration may be changed or some components may be omitted or modified between drawings without significantly impairing the effects of this disclosure. Also, the same embodiment does not necessarily need to have all the components.

[0011] Figure 1 is a block diagram showing the electroplating application system 100 of this disclosure. The application system 100 determines the electroplating application conditions (e.g., type of plating solution, type of gelling agent, gel shape, gel thickness, plating current density, plating time, plating temperature, etc.) from the plating information desired by the designer (e.g., required characteristics such as type of plating film and plating thickness, location of electroplating, etc.). The electroplating application conditions are the application conditions using the application apparatus 20 that performs electroplating using a gel containing plating components. The plating components are components involved in electroplating and are usually metals that constitute the plating film.

[0012] The construction system 100 comprises a determination device 10 (construction condition determination device) as disclosed herein, a construction apparatus 20 (electroplating construction apparatus) as disclosed herein, an input device 30, and an output device 40. The determination device 10 determines the construction conditions for electroplating using the construction apparatus 20.

[0013] FIG. 2 is a block diagram showing the hardware configuration of the determination device 10 of the present disclosure. The determination device 10 is configured to include, for example, a CPU (Central Processing Unit) 1001, a RAM (Random Access Memory) 1002, a ROM (Read Only Memory) 1003, and the like. The determination device 10 is embodied by a predetermined control program (for example, a method for determining construction conditions) stored in the ROM 1003 being expanded in the RAM 1002 and executed by the CPU 1001.

[0014] Returning to FIG. 1, for the convenience of explanation, the construction device 20, the input device 30, and the output device 40 will be described first, and finally the determination device 10 will be described. As described above, the construction device 20 performs electroplating using a gel containing a plating component. The electroplating may be performed, for example, for forming a functional film on the surface of a metal member or for repairing a metal member where wear or the like has occurred. The structure of the construction device 20 will be described later while referring to FIG. 4 and the like.

[0015] The input device 30 is for inputting desired plating information to the determination device 10. The plating information can include, for example, at least one of the electroplating construction location (the location where the plating film is formed) or the required characteristics for the plating film. The required characteristics can include at least one of the matters described below, for example, performance such as wear resistance, conductivity, corrosion resistance, the type of plating film (plating film type), and the thickness of the plating film (plating thickness). However, the plating information is not limited to these. The input device 30 can be configured by any input device such as a keyboard, a mouse, or the like.

[0016] The output device 40 outputs the construction conditions determined by the determination device 10. The construction conditions may include, for example, at least one of the following: type of plating component, type of gelling agent, gel shape, gel thickness, current density used in electroplating (current density applied to the gel; plating current density), electroplating time (plating time), and electroplating temperature (gel temperature; plating temperature). However, the construction conditions are not limited to these. The output device 40 can be configured with any output device, such as a display or monitor. The output device 40 may also function as the construction device 20, for example. In this case, for example, the power supply 23 (Figure 4) that constitutes the construction device 20 as the output device 40 can be operated according to the determined construction conditions (e.g., current density, time, temperature).

[0017] The determination device 10 comprises a reception unit 11, a database 12, a determination unit 13, and an output unit 14. The reception unit 11 receives plating information input through the input device 30. The database 12 records the plating information and the electroplating application conditions in association. The determination unit 13 determines the application conditions from the plating information received by the reception unit 11 and the database 12. The output unit 14 outputs the application conditions determined by the determination unit 13 to the output device 40.

[0018] Figure 3 is a diagram illustrating the information contained in database 12. In the example of this disclosure, database 12 includes databases 121, 122, and 123. However, database 12 may consist of a single database or two or four or more databases. Database 12 is created in advance before the determination of construction conditions by the decision device 10, for example, by experimentation, simulation, etc. Database 12 is not limited to a tabular format as shown in Figure 3.

[0019] Database 121 associates, at a minimum, the type of plating film and the type of plating solution (an example of the type of plating component) according to the required characteristics (performance, etc.) of the plated film entered. By adding the gelling agent described below to the plating solution and causing gelation, the gel provided in the application apparatus 20 (Figure 1) can be produced. The plating solution also contains plating components.

[0020] For example, if the required characteristic is wear resistance, the hardness of the plating film is considered as an indicator for selection. That is, film hardness is selected as an indicator of the degree of wear resistance. For example, when excellent wear resistance is required, nickel, chromium, etc., which have high film hardness, are preferred. Therefore, the type of plating solution used (plating solution A, B, C, etc.) is associated with the degree of wear resistance (degree of film hardness).

[0021] For example, if particularly excellent wear resistance is required, the determination unit 13 (Figure 1) selects a plating film (metal contained in the plating film and plating solution; the same applies hereinafter) and a plating solution with particularly high film hardness. On the other hand, if, for example, a less high level of wear resistance is required, the determination unit 13 (Figure 1) selects a plating film and a plating solution with less high film hardness. In the example in Figure 3, the determination unit 13 can select, for example, one of the plating solutions A, B, or C depending on the degree of the required characteristics.

[0022] The plating solution can be a commercially available one, depending on the type of plating film. However, a homemade plating solution is also acceptable, as long as it satisfies the input requirements. Furthermore, the plating film can be selected appropriately according to the required characteristics, in addition to the examples above.

[0023] If conductivity is another required characteristic, the electrical resistance of the plating film (film resistance) is also considered as an indicator for selection. In other words, the electrical resistance of the film is selected as an indicator of the degree of conductivity. For example, when excellent conductivity is required, silver, copper, gold, etc., which have low electrical resistance of the film, are preferred. Therefore, the type of plating solution (plating solution D, E, F, etc.) used is associated with the degree of conductivity (degree of electrical resistance of the film).

[0024] For example, if particularly excellent conductivity is required, the determination unit 13 (Figure 1) selects a plating film and plating solution with particularly low electrical resistance. On the other hand, if, for example, a film resistance that is not so high is required, the determination unit 13 (Figure 1) selects a plating film and plating solution with an electrical resistance that is not so low. In the example in Figure 3, the determination unit 13 can select, for example, one of the plating solutions D, E, or F depending on the degree of the required characteristics.

[0025] If corrosion resistance is another required characteristic, the corrosion rate of the plating film is considered as an indicator for selection. In other words, the corrosion rate is selected as an indicator of the degree of corrosion resistance. For example, if excellent corrosion resistance is required, gold, nickel, etc., which have low corrosion rates, are preferred. Therefore, the type of plating solution (plating solution G, H, I, etc.) used is associated with the degree of corrosion resistance (degree of corrosion rate).

[0026] For example, if particularly excellent corrosion resistance is required, the determination unit 13 (Figure 1) selects a plating film and plating solution with a particularly low corrosion rate. On the other hand, if, for example, a less high level of corrosion resistance is required, the determination unit 13 (Figure 1) selects a plating film and plating solution with a corrosion rate that is not so low. In the example in Figure 3, the determination unit 13 can select, for example, one of the plating solutions G, H, or I depending on the degree of the required characteristics.

[0027] The required characteristics (performance, etc.) are not limited to the examples above.

[0028] Database 122 correlates the hardness of the gel, the types of plating solutions that can be used, the redissolution temperature of the gel (an example of a temperature), and the optimal current density range, depending on the type of gelling agent contained in the gel. The gelling agent is not particularly limited as long as it can gel the plating solution, but examples include at least one of gelatin, xanthan gum, locust bean gum, HM pectin, LM pectin, agar, carrageenan, LA gellan gum, HA gellan gum, sodium alginate, etc. However, it is preferable that the gelling agent has a redissolution temperature.

[0029] The hardness of the gel varies depending on the type and concentration of the gelling agent. In the illustrated example, the gel made with a combination of xanthan gum and locust bean gum is the softest (lowest hardness), followed by HM pectin, and then gelatin, in increasing order of hardness. The softer the gel, the better the adhesion when the gel is brought into contact with the object to be plated, and the less likely it is to cause pinholes (localized areas of undeposited material), which are defects in the plated film. However, as will be described in detail later, the type of gelling agent that can be used may differ depending on the type of plating solution. Therefore, the gelling agent should be determined according to the type of plating solution.

[0030] The types of plating solutions that can be used indicate those capable of gelling. Depending on the combination of plating solution and gelling agent, some gelling agents may be unsuitable for use, such as not gelling at all, requiring an extremely long gelling time, or requiring an extremely large amount for gelling. Therefore, each gelling agent is associated with a type of plating solution that can be used (an example of the type of plating component). In the example in Figure 3, plating solutions A, D, and G can be used with gelatin, plating solutions B, E, and H can be used with xanthan gum and locust bean gum, and plating solutions C, F, and I can be used with HM pectin.

[0031] The redissolution temperature of a gel is the temperature at which a solidified gel begins to melt again, and it may differ depending on the gelling agent. Furthermore, the redissolution temperature of a gel may vary depending on the concentration of the gelling agent. Therefore, in addition to the redissolution temperature for each gelling agent, the database 122 may also include the redissolution temperature for each concentration of the gelling agent. However, as shown in Figure 2, the redissolution temperature may be shown as a numerical range rather than a unique value to accommodate a range of usable concentrations.

[0032] In the example shown in Figure 2, the redissolution temperature of the gel when using gelatin is between 25°C and 35°C, the redissolution temperature of the gel when using xanthan gum and locust bean gum in combination is between 50°C and 70°C, and the redissolution temperature of the gel when using HM pectin is between 70°C and 90°C. The redissolution temperature of the gel can be measured, for example, by mixing a predetermined amount of gelling agent with heated water, cooling and solidifying it, and then heating it in a constant temperature bath, for example, at the temperature at which the gel begins to melt (begin to lose its shape).

[0033] Note that the type of gelling agent is not limited to the example in Figure 2.

[0034] An optimal current density range exists depending on the plating solution and gelling agent used. In particular, with gel plating, hydrogen gas generated as a side reaction can accumulate at the interface between the plated material and the gel, potentially causing the gel to peel off. Therefore, a current density range that minimizes hydrogen generation and achieves high current efficiency is preferable. In the example shown in Figure 2, the current density when using gelatin is 1 mA / cm². 2 More than 10mA / cm 2 The current density when xanthan gum and locust bean gum are used together is 10 mA / cm². 2 More than 20mA / cm 2 The current density when using HM pectin is 1 mA / cm². 2 More than 40mA / cm 2The following applies: Database 122 associates a range of current densities (which may be uniquely determined values) that can achieve high current efficiency, depending on the type of plating solution (an example of plating components) and gelling agent. Therefore, the gel thickness, current density, and plating time corresponding to the input plating thickness are output.

[0035] Database 123 associates the input plating information with the output application conditions. For example, if the input information is a design drawing showing the plating application location, the gel shape is associated as an application condition. Therefore, the gel shape corresponding to the input plating application location is output. The gel shape can be determined based on the design drawing, usually by the length in the direction horizontal to the application surface. Furthermore, the association is made for each length (dimension) on the design drawing. For example, if the width dimension of the rectangular area to be plated on the design drawing is L1, the width dimension of the gel is determined to be L11.

[0036] If the input plating information is a plated film (for example, metal contained in the plating), the type of plating solution, the type of gelling agent, and the plating temperature derived from the gel's redissolution temperature are determined from databases 121 and 122. During plating, the higher the gel temperature, the softer the gel becomes, and the easier it is for metal ions to move within the gel. This makes it possible to increase the plating speed (increase the current density), and furthermore, the adhesion between the plated material and the gel improves, reducing defects in the plated film (pinholes, etc.). Therefore, it is preferable that the plating temperature is high, at least near the interface between the plated material and the gel. However, if the plating temperature exceeds the gel's redissolution temperature, the gel's shape will collapse. Therefore, it is preferable that the plating temperature is below the gel's redissolution temperature and as high as possible. Accordingly, the plating temperature is associated with the gel's redissolution temperature in database 123. Therefore, as described above, the type of plating solution, the type of gelling agent, and the plating temperature corresponding to the input plated film are output. The associated temperature may be a uniquely identifiable numerical value or a range.

[0037] If the input plating information is plating thickness, the gel thickness and current density (the range in which high current efficiency can be obtained as described above) are associated with the application conditions based on the type of plating solution (which may also be plating components) and the type of gelling agent determined by databases 121 and 122. Next, the plating time is calculated (determined) from the determined current density based on Faraday's law.

[0038] Although not shown in Figure 3, and details will be described later, the plating information and the concentration of plating components in the gel are also related to the gel thickness as a construction condition. Therefore, even if the plating information such as the plating thickness is the same, the gel thickness may differ if the concentration of plating components in the gel is different.

[0039] Note that the plating information and construction conditions are not limited to the example in Figure 2. Therefore, the construction conditions corresponding to the input plating information should be determined as appropriate.

[0040] Returning to Figure 1, as described above, the plating information includes the required characteristics for the plating film. The determination unit 13 then reads the type of plating component (plating film) associated with the required characteristics received by the reception unit 11 from the database 121 (Figure 3; an example of database 12) to determine the type of plating component as a construction condition. In this example, the plating component is also recorded as a usable plating solution. Furthermore, in this example, the determined plating component is also used to determine the current density and plating temperature as construction conditions, as explained with reference to database 123 (Figure 3).

[0041] As described above, the application conditions include the type of plating component. The determination unit 13 then reads the type of gelling agent associated with the type of plating component from database 122 (Figure 3; an example of database 12) to determine the type of gelling agent as an application condition. In this example, the determined type of gelling agent is also used to determine the plating temperature and current density as application conditions, as explained with reference to database 123 (Figure 3). It is preferable that the concentration of the gelling agent used is low. This suppresses the increase in electrical resistance due to the gelling agent and improves the diffusivity and deposition of metal ions.

[0042] As described above, the application conditions include the plating temperature (electroplating application temperature). At a minimum, it is preferable that the temperature of the interface between the workpiece to be plated and the gel is the said plating temperature. The determination unit 13 then determines the plating temperature (application temperature) as an application condition by reading the redissolution temperature of the gel (an example of a temperature) associated with the type of gelling agent contained in the gel from the database 122 (Figure 3, an example of database 12).

[0043] In this case, it is preferable that the determination unit 13 further determines the plating temperature (working temperature) such that T0(°C)-5(°C)≦T(°C), where T(°C) is the plating temperature (working temperature) and T0(°C) is the gel redissolution temperature. By determining the temperature in this way, the shape of the gel can be maintained while metal ions in the gel can be easily diffused.

[0044] Furthermore, the application conditions include the current density used in electroplating, as described above. The determination unit 13 then reads the current density associated with the type of plating component and gelling agent from the database 122 to determine the current density used in electroplating as an application condition. This allows the current density during plating to be determined from the type of plating solution or gelling agent determined according to the required characteristics.

[0045] Furthermore, the application conditions include the gel thickness (gel thickness) as described above. The determination unit 13 then reads the gel thickness associated with the plating thickness (this is an example of plating information, but is not limited to this) and the concentration of the plating component in the gel from the database 123 to determine the gel thickness as an application condition. It is preferable to increase the gel thickness because a larger plating thickness consumes more of the plating component in the gel.

[0046] Furthermore, the plating information includes the plating thickness (thickness of the plating film) as described above. The determination unit 13 then reads the gel thickness, electroplating current density, and plating time (electroplating application time) associated with the plating thickness received by the reception unit 11 from the database 123 (Figure 3, an example of database 12), thereby determining the gel thickness, electroplating current density, and plating time (application time) as application conditions. This allows the gel thickness, current density, and plating time to be determined from the input plating thickness.

[0047] Figure 4 is a diagram illustrating the structure of a coating apparatus 20 according to one embodiment. The coating apparatus 20 comprises a gel 21, an electrode 22, a power supply 23, a heating device 24, and a temperature control device 25. As described above, the plating components contained in the gel 21 and the physical properties of the gel 21 may differ depending on the plating conditions. Therefore, different gels are used as the gel 21 depending on the plating conditions.

[0048] The gel 21 is placed on the surface 61 (metal surface) of the metal, conductive plated member 60, for example, by bonding. This bonding is done using the adhesive properties of the gel 21, and typically no adhesive is used. Preferably, the gel 21 is positioned to adhere as closely as possible to the surface 61. The gel is preferably soft and highly elastic.

[0049] The electrode 22 is positioned so as to sandwich the gel 21 between it and the member 60 to be plated. Preferably, the electrode 22 and the gel 21 are positioned so as close together as possible. The electrode 22 can preferably be made of the same metal as the plating film. However, the electrode 22 may be made of a metal that is insoluble in the plating solution (for example, platinum, titanium, etc.).

[0050] The electrode 22 has at least one (or both) of the following conditions: a flat plate with a thickness of 50 μm or less, or a mesh structure. By giving the electrode 22 flexibility in this way, for example, if the surface 61 of the member to be plated 60 is curved, the electrode 22 can be easily fitted.

[0051] The power supply 23 applies current between the metal member 60 (which is the member to be plated) and the electrode 22, with the gel 21 sandwiched between them. The power supply 23 is a DC power supply that applies, for example, a DC voltage between the member 60 and the electrode 22. However, the power supply 23 may also be a pulse power supply that applies, for example, a pulse voltage.

[0052] The heating device 24 heats at least the interface 62 between the member to be plated 60 and the gel 21. In the example of this disclosure, the heating device 24 is positioned on the surface of the member to be plated 60 opposite to the gel 21, and heats the entire member to be plated 60. This allows the surface 211 of the gel 21 on the interface 62 side to be heated. Heating the surface 211 promotes the diffusion (movement) of plating components in the gel present near the surface 211, thereby increasing the plating speed. It also softens the gel 21, improving the adhesion between the member to be plated 60 and the gel 21. This reduces defects (pinholes, pits, etc.) at the interface.

[0053] Any heating device can be used as the heating device 24, such as a silicone rubber heater, a ribbon heater (flexible surface type), or an infrared heater.

[0054] The temperature control device 25 is connected to the member to be plated 60 and the heating device 24. The temperature control device 25 includes a measuring unit (not shown) for measuring the temperature of the member to be plated 60, and drives the heating device 24 based on the temperature of the measuring unit. The measuring unit may be a gel 21, but it is particularly preferable to measure the temperature of the interface 62. The drive is controlled, for example, by feedback control, such as on / off control or output control, so that the temperature of the member to be plated 60 becomes the plating temperature (electroplating application temperature).

[0055] The plating film is formed on the surface 61 of the member to be plated 60 at interface 62. Therefore, as the plating thickness increases with the formation of the plating film, the gel 21 usually moves away from the member to be plated 60.

[0056] In another embodiment, the redissolution temperature of the gel 21 is preferably 40°C or higher and 80°C or lower. Setting the redissolution temperature to 40°C or higher allows the gel to maintain its shape, improving its storage and workability. On the other hand, setting it to 80°C or lower makes it easier to raise the gel's temperature to the desired temperature. Note that the redissolution temperature of the gel 21 is not limited to this temperature range and can be determined, for example, in accordance with the explanation given with reference to Figures 1 and 3 above.

[0057] Figure 5 illustrates the structure of a coating apparatus 20 according to yet another embodiment. In the embodiment shown in Figure 5, the electrode 22 is provided within the gel 21. That is, the coating apparatus 20 shown in Figure 5 is an electrode-integrated gel. The electrode 22 may be provided entirely within the gel 21, or only a portion of it may be provided within the gel 21. This structure improves the adhesion between the electrode 22 and the gel 21. Furthermore, the fact that the electrode 22 is not exposed on the outermost surface improves safety during operation. As for the method of forming an electrode-integrated gel, for example, when a gelling agent is dissolved in a heated plating solution and then cooled, the electrode 22 is placed in the liquid immediately before cooling and then cooled and gelled, thereby achieving this.

[0058] Figure 6 is a flowchart showing the method for manufacturing plated products according to the present disclosure (hereinafter referred to as "the manufacturing method of the present disclosure"). The manufacturing method of the present disclosure corresponds to an electroplating application method. The manufacturing method of the present disclosure can be performed, for example, using the application system 100 shown in Figure 1 above.

[0059] The manufacturing method of the present disclosure includes a determination step S1 and a construction step S2. The determination step S1 determines the construction conditions for electroplating in the construction step S2. The determination can be performed, for example, by the determination device 10 (Figure 1). The construction step S2 involves performing electroplating using a gel containing plating components. The construction can be performed, for example, by the construction device 20 (Figure 1).

[0060] The decision step S1 includes a reception step S11, a condition determination step S12, and an output step S13. The reception step S11 receives the desired plating information. The condition determination step S12 determines the construction conditions from the plating information received in the reception step S11 and from a database 12 (Figure 2) which records the plating information and construction conditions in association. The output step S13 outputs the construction conditions determined in the condition determination step S12 to an output device 40 (Figure 1).

[0061] According to the construction system 100 (Figure 1), determination device 10 (Figure 1), and manufacturing method of the present disclosure, the construction conditions are determined using the database 12 (Figure 2), so that the construction conditions for electroplating using gel plating can be easily determined according to the input plating conditions. As a result, the user can determine the construction conditions using the construction device 20 without trial and error, and electroplating can be easily performed. [Examples]

[0062] The present disclosure will be described in more detail below with reference to examples.

[0063] A plated structure was manufactured by forming a plated film having the following plating information on the surface of the object to be plated. Plating information Nickel plating Required properties: Wear resistance (Vickers hardness 400HV) Plating thickness: 10 μm Plating location: Designated location

[0064] In Example 1, the plating system 100 (Figure 1) used the plating conditions determined from the above plating conditions. Specifically, a nickel bright Watt bath was used as the plating solution corresponding to a Vickers hardness of 400 HV. Xanthan gum and locust bean gum (re-dissolution temperature of the gel is 60°C), which are soluble in the nickel bright Watt bath, were used as gelling agents. The concentration of xanthan gum and locust bean gum was 10 g each per 1 L of plating solution.

[0065] Furthermore, the gel thickness was set to 5 mm, which allows for plating to a thickness of 10 μm, based on the concentration of the plating components in the gel. The plating temperature was set to 55°C, which is 5°C lower than the gel's redissolution temperature. The current density was set to 20 mA / cm², which provides high current efficiency under conditions where the plating solution is a nickel bright Watt bath and the gelling agents are xanthan gum and locust bean gum. 2 The plating time was set to 25 minutes, based on Faraday's law, using the already determined plating thickness and current density. All of this information is recorded in the database 12 (Figure 3) mentioned above.

[0066] The application device 20 used an electrode-integrated gel as shown in Figure 5. The electrode 22 used a mesh material made of nickel wire with a diameter of Φ50 μm. The heating device 24 used a silicone rubber heater. The material to be plated was SS400 steel plate.

[0067] Comparative Example 1 assumed conditions in which the processing apparatus 20 was not equipped with a heating device 24 and a temperature control device 25. Specifically, the plated structure was manufactured in the same manner as in Example 1, except that the plating temperature was changed to 25°C. Note that in the database 12 (Figure 1) mentioned above, 55°C is recorded as the plating temperature corresponding to the above plating information, as in Example 1, and 25°C is not recorded.

[0068] In Comparative Example 2, the plating device 20 was not provided with the heating device 24 and the temperature control device 25, and the condition was assumed where the current density was not optimal. Specifically, except that the plating temperature was changed to 25°C, the current density was changed to 5 mA / cm 2 , and the plating time was changed to 100 minutes, a plating structure was manufactured in the same manner as in Example 1. In addition, in the database 12 (Fig. 1), further, as the current density and plating time corresponding to the above plating information, 20 mA / cm 2 and 25 minutes were recorded as in Example 1, and neither the value of 5 mA / cm 2 nor 100 minutes was recorded.

[0069] The above construction conditions were summarized in Table 1 as test conditions.

[0070]

Table 1

[0071] Regarding the plating structures obtained in each of Example 1, Comparative Example 1, and Comparative Example 2, the plating thickness, the presence or absence of film defects, and the plating rate were evaluated and summarized in Table 2 below as test results.

[0072]

Table 2

[0073] In Example 1, the plating thickness was 10 μm as targeted. Also, there were no defects in the plated film by visual inspection. The plating rate was 0.4 μm / min.

[0074] On the other hand, in Comparative Example 1, although electroplating was performed over 25 minutes as described above, the electroplating reaction stopped halfway, and the plating thickness obtained was only 4 μm. The reason for this is considered to be that since the plating temperature was lower than 55°C recorded in the database 12, the diffusion of metal ions in the gel could not be promoted, and the plating reaction stopped.

[0075] In Comparative Example 2, the plating thickness was 8 μm, slightly thinner than the target of 10 μm. The plating speed was slower than in Example 1, at 0.08 μm / min. Pinholes and pits were observed as film defects. The reason for the slightly thinner plating thickness is thought to be that the current density was not optimal, resulting in reduced current efficiency. The cause of the pinholes is thought to be that the plating temperature was considerably lower than the gel's re-dissolution temperature, so the gel's hardness did not decrease, and the adhesion between the plated material and the gel decreased. The cause of the pits is thought to be that the current density was not optimal, resulting in reduced current efficiency and increased hydrogen generation.

[0076] Figure 7 is a photograph used as a substitute for a drawing, showing the experimental results in Comparative Example 2. As shown in Figure 7, in addition to the continuously formed plating film 51, pinholes 52 are formed, exposing the surface 61 (Figure 4; base) of the material to be plated 60 (Figure 4). Therefore, it can be seen that the plating was not formed properly in the areas of the pinholes 52. This is thought to be due to the lack of close contact between the material to be plated and the gel.

[0077] Figure 8 is a photograph used as a substitute for a drawing, showing a different location in Comparative Example 2 than in Figure 7. As shown in Figure 8, pits 54 were formed in the continuously formed plating film 51, where the plating was locally thinner. Therefore, it can be seen that the plating was not formed properly even in the pits 54. This is thought to be due to the local accumulation of hydrogen gas.

[0078] Database 12 (Figure 1) contains pre-recorded construction conditions that can suppress the formation defects such as pinholes and pits. Therefore, according to the construction system 100 (Figure 1), determination device 10 (Figure 1), and manufacturing method of this disclosure, electroplating with suppressed construction defects can be performed. [Explanation of symbols]

[0079] 10 Determination device 100 Construction Systems 11 Reception Department 12 Databases 121 Databases 122 Databases 123 Databases 13. Decision-making section 14 Output section 20 Construction equipment 21 Gel 211 Surface 22 electrodes 23 Power supply 24 Heating device 25 Temperature control device 30 Input devices 40 Output device 51 Plating film 52 pinholes 54 Pit 60 Plating material 61 Surface of the member to be plated 62 Interface S1 Decision Step S11 Reception Step S12 Condition Determination Step S13 Output Step S2 Construction Steps

Claims

1. The system comprises a plating apparatus for performing electroplating using a gel containing plating components, and a determination apparatus for determining the conditions for performing electroplating using the plating apparatus. The determination device is, A reception desk that accepts the requested plating information, A database recording the aforementioned plating information and the aforementioned construction conditions in association, A determination unit determines the construction conditions from the plating information received at the reception unit and the database, An output unit that outputs the construction conditions determined by the determination unit to an output device, Equipped with, The aforementioned plating information includes the required characteristics for the plated film, The aforementioned construction conditions include the type of plating component, The determination unit determines the type of plating component in the gel as a construction condition by reading the type of plating component associated with the required characteristics received by the reception unit from the database, and also determines the type of gelling agent as a construction condition by reading the type of gelling agent associated with the type of plating component from the database. An electroplating application system characterized by the following.

2. The aforementioned construction conditions further include the construction temperature for the electroplating, The determination unit determines the construction temperature as the construction condition by reading the temperature associated with the type of gelling agent contained in the gel from the database. The electroplating application system according to feature 1.

3. The determination unit further determines the construction temperature such that T0 (°C) - 5 (°C) ≤ T (°C), where T (°C) is the construction temperature and T0 (°C) is the re-dissolution temperature of the gel. The electroplating application system according to feature 2.

4. A device for performing electroplating using a gel containing a plating component, and a determination device for determining the conditions for performing electroplating using the device, The determination device is, A reception desk that accepts the requested plating information, A database recording the aforementioned plating information and the aforementioned construction conditions in association, A determination unit determines the construction conditions from the plating information received at the reception unit and the database, An output unit that outputs the construction conditions determined by the determination unit to an output device, Equipped with, The aforementioned plating information includes the required characteristics for the plated film, The aforementioned construction conditions include the current density used in the electroplating process. The determination unit determines the type of plating component in the gel as the construction condition by reading the type of plating component associated with the required characteristics received by the reception unit from the database, and determines the current density used in the electroplating as the construction condition by reading the current density associated with the type of plating component and gelling agent from the database. An electroplating application system characterized by the following.

5. The aforementioned construction conditions further include the thickness of the gel, The determination unit reads the thickness of the gel associated with the plating information and the concentration of the plating component in the gel from the database, thereby determining the thickness of the gel as the construction condition. The electroplating application system according to feature 4.

6. A device for performing electroplating using a gel containing a plating component, and a determination device for determining the conditions for performing electroplating using the device, The determination device is, A reception desk that accepts the requested plating information, A database recording the aforementioned plating information and the aforementioned construction conditions in association, A determination unit determines the construction conditions from the plating information received at the reception unit and the database, An output unit that outputs the construction conditions determined by the determination unit to an output device, Equipped with, The aforementioned plating information includes the thickness of the plating film, The determination unit reads the gel thickness, the electroplating current density, and the work time, which are associated with the thickness of the plating film received by the reception unit, from the database, thereby determining the work conditions by the gel thickness, the electroplating current density, and the work time. An electroplating application system characterized by the following.

7. The aforementioned construction device is, Electrodes and, With the gel sandwiched between the metal to be plated and the electrode, a power supply is provided to supply current between the metal to be plated and the electrode. A heating device for heating the interface between the plated member and the gel, Equipped with The electroplating application system according to feature 1.

8. The aforementioned construction device is, The electrode provided within the gel, With the gel sandwiched between the metal to be plated and the electrode, a power supply is provided to supply current between the metal to be plated and the electrode. A heating device for heating the interface between the plated member and the gel, Equipped with The electroplating application system according to feature 1.

9. The aforementioned construction device is, Electrodes and, With the gel sandwiched between the metal to be plated and the electrode, a power supply is provided to supply current between the metal to be plated and the electrode. Equipped with, The electrode is A flat plate with a thickness of 50 μm or less, Mesh structure, Having at least one of the following conditions The electroplating application system according to feature 1.

10. The aforementioned construction device is, Electrodes and, With the gel sandwiched between the metal to be plated and the electrode, a power supply is provided to supply current between the metal to be plated and the electrode. Equipped with, The redissolution temperature of the gel is between 40°C and 80°C. The electroplating application system according to feature 1.

11. A reception desk that accepts the requested plating information, A database is recorded that associates the aforementioned plating information with the electroplating conditions using an electroplating apparatus that performs electroplating using a gel containing plating components. A determination unit determines the construction conditions from the plating information received at the reception unit and the database, An output unit that outputs the construction conditions determined by the determination unit to an output device, Equipped with, The aforementioned plating information includes the required characteristics for the plated film, The aforementioned construction conditions include the type of plating component, The determination unit determines the type of plating component in the gel as a construction condition by reading the type of plating component associated with the required characteristics received by the reception unit from the database, and also determines the type of gelling agent as a construction condition by reading the type of gelling agent associated with the type of plating component from the database. A device for determining construction conditions, characterized by the following features.

12. A receiving unit for receiving desired plating information, A database is recorded that associates the aforementioned plating information with the electroplating conditions using an electroplating apparatus that performs electroplating using a gel containing plating components. A determination unit determines the construction conditions from the plating information received at the reception unit and the database, An output unit that outputs the construction conditions determined by the determination unit to an output device, Equipped with, The aforementioned plating information includes the required characteristics for the plated film, The aforementioned construction conditions include the current density used in the electroplating process. The determination unit determines the type of plating component in the gel as the construction condition by reading the type of plating component associated with the required characteristics received by the reception unit from the database, and determines the current density used in the electroplating as the construction condition by reading the current density associated with the type of plating component and gelling agent from the database. A device for determining construction conditions, characterized by the following features.

13. A receiving unit that receives desired plating information, A database is recorded that associates the aforementioned plating information with the electroplating conditions using an electroplating apparatus that performs electroplating using a gel containing plating components. A determination unit determines the construction conditions from the plating information received at the reception unit and the database, An output unit that outputs the construction conditions determined by the determination unit to an output device, Equipped with, The aforementioned plating information includes the thickness of the plating film, The determination unit reads the gel thickness, the electroplating current density, and the work time, which are associated with the thickness of the plating film received by the reception unit, from the database, thereby determining the work conditions by the gel thickness, the electroplating current density, and the work time. A device for determining construction conditions, characterized by the following features.

14. The process includes a step of performing electroplating using a gel containing plating components, and a step of determining the conditions for performing electroplating in the said step. The aforementioned decision step is, A reception step for receiving the desired plating information, A condition determination step for determining the construction conditions from the plating information received in the reception step and a database that records the plating information and the construction conditions in association, An output step which outputs the construction conditions determined in the condition determination step to an output device, Includes, The aforementioned plating information includes the required characteristics for the plated film, The aforementioned construction conditions include the type of plating component, In the determination step, the type of plating component in the gel is determined as the construction condition by reading the type of plating component associated with the required characteristics received in the reception step from the database, and the type of gelling agent associated with the type of plating component is determined as the construction condition by reading the type of gelling agent associated with the type of plating component from the database. A method for manufacturing a plated structure, characterized by the above.

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