Template, method for manufacturing a template, method for manufacturing a patterned substrate using a template

Abstract

To provide a template that can prevent film defects from occurring during demolding, a method for manufacturing the template, and a method for manufacturing a patterned substrate using the template.SOLUTION: A template 30 includes a base material 300 in which a convex portion 310 corresponding to the pattern is formed in a transfer area PA pressed against a transfer target material 60, a base film 330 that covers only the tip surface 311 of the convex portion 310 in the transfer area PA, and a monomolecular film 340 covering the base film 330.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] Embodiments of the present invention relate to a template, a method for manufacturing the template, and a method for manufacturing a patterned substrate using the template.

Background Art

[0002] As a method for forming a pattern, a method called imprint has been proposed. In imprinting, a template having a concavo-convex pattern is pressed against a transfer material on a substrate, and then the transfer material is cured. Thereby, a film having the concavo-convex pattern transferred thereto can be formed on the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] According to the disclosed embodiments, there are provided a template capable of preventing the occurrence of film defects during脱模, a method for manufacturing the template, and a method for manufacturing a patterned substrate using the template.

Means for Solving the Problems

[0005] The template according to the embodiment is an imprint template for transferring a pattern to a transfer material on a substrate, and includes a base material having convex portions corresponding to the pattern formed in a transfer region pressed against the transfer material, a base film covering only the tip surfaces of the convex portions in the transfer region, and a monomolecular film covering the base film.

Brief Description of the Drawings

[0006] [Figure 1]This figure schematically shows the configuration of an imprint device, including a template according to this embodiment. [Figure 2] This diagram illustrates each step of the imprinting process. [Figure 3] This diagram illustrates potential problems that may occur during demolding. [Figure 4] This figure shows the specific configuration of the template according to this embodiment. [Figure 5] This figure illustrates the manufacturing method of the template according to this embodiment. [Figure 6] This figure illustrates the manufacturing method of the template according to this embodiment. [Figure 7] This figure illustrates the manufacturing method of the template according to this embodiment. [Figure 8] This figure illustrates the manufacturing method of the template according to this embodiment. [Figure 9] This figure illustrates the manufacturing method of the template according to this embodiment. [Figure 10] This figure illustrates the manufacturing method of the template according to this embodiment. [Figure 11] This figure illustrates the manufacturing method of the template according to this embodiment. [Figure 12] This diagram shows the specific configuration of the template related to the modified form. [Modes for carrying out the invention]

[0007] This embodiment will now be described with reference to the attached drawings. To facilitate understanding of the explanation, the same reference numerals are used for identical components in each drawing whenever possible, and redundant explanations are omitted.

[0008] The template 30 according to this embodiment is mounted on the imprint device 10 and is used as the master plate for imprinting. Before describing the template 30, the configuration of the imprint device 10 will be described first.

[0009] The imprint apparatus 10 is a device used in the manufacture of semiconductor devices, and is a device that transfers a raised and recessed pattern to a transfer material coated on a substrate 20. The semiconductor device to be manufactured is, for example, a NAND flash memory. The configuration of the template 30, which will be described later, can also be used for the manufacture of products other than semiconductor devices.

[0010] As shown in Figure 1, the imprint apparatus 10 comprises a substrate chuck 21, a substrate stage 22, a template 30, a master plate chuck 31, a base 32, an alignment sensor 33, a light source 40, and a control device 50.

[0011] The substrate chuck 21 is a device for holding the substrate 20, and is, for example, a vacuum chuck. The substrate 20, which is the target of pattern transfer, is held from below by the substrate chuck 21 with its surface 20S facing upward. The surface 20S of the substrate 20 has a film to be processed formed on the substrate 20, and a liquid transfer material is pre-applied onto the film to be processed by a coating device (not shown). The substrate 20 in this embodiment is, for example, a semiconductor substrate such as a silicon wafer. The transfer material applied to the substrate 20 is cured by light from a light source 40, which will be described later, and functions as a resist when etching the film to be processed in a process after imprinting.

[0012] Furthermore, the imprint apparatus 10 is fitted with a sealed container, not shown, called a hoop. The hoop contains multiple substrates 20 that have been pre-treated, such as by film deposition, in a previous process. The substrates 20 held in the substrate chuck 21 in Figure 1 have been removed from the hoop and transported by a transport mechanism not shown.

[0013] The substrate stage 22 is a device that supports the substrate chuck 21. The substrate stage 22 can move the substrate chuck 21 and the substrate 20 held thereon along the X direction and the Y direction that are parallel to the surface 20S and perpendicular to each other. The substrate stage 22 may be configured as an "XYθ stage" that can further rotate the substrate 20 and the like within the XY plane. The operation of the substrate stage 22 is controlled by the control device 50 described later.

[0014] The template 30 is a master plate having a concavo-convex pattern formed on its surface. This concavo-convex pattern corresponds to the concavo-convex pattern to be transferred to the transfer material on the substrate 20. The concavo-convex pattern is formed only in a partial region marked with the symbol "PA" on the surface of the template 30 (the lower surface in FIG. 1). This region is the region that is pressed against the transfer material on the substrate 20. This region is also referred to as the "transfer region PA" hereinafter. The entire template 30 including the concavo-convex pattern in the transfer region PA is formed of a material that is transparent to the wavelength of the light irradiated from the light source 40. The specific configuration of the template 30 will be described later.

[0015] The master plate chuck 31 is a device that holds the template 30, and is, for example, a mechanical clamping device. The template 30 is held by the master plate chuck 31 with the surface having the transfer region PA facing downward, that is, toward the substrate 20 side. An opening OP for allowing the light from the light source 40 to pass through is formed in the portion directly above the transfer region PA between the master plate chuck 31 and the base 32.

[0016] The master plate drive unit 34 is a mechanism that can change the position of the master plate chuck 31 in the direction perpendicular to the substrate 20. The master plate drive unit 34 is attached to the base 32 located above it.

[0017] The alignment sensor 33 is a sensor for detecting the relative positional relationship between the template 30 and the substrate 20. In order to enable such detection, alignment marks (not shown) are provided in advance on each of the template 30 and the substrate 20. The alignment sensor 33 images each alignment mark through the opening OP from the upper side and measures the degree of misalignment between the two. The "degree of misalignment" refers to, for example, the distance between the alignment mark provided on the template 30 and the alignment mark provided on the substrate 20. The formation of the uneven pattern on the transfer material on the substrate 20 is performed in a state where the relative positional relationship between the template 30 and the substrate 20 is adjusted in advance so that the distance approaches 0 as much as possible.

[0018] The light source 40 is a device that irradiates light (e.g., ultraviolet light) for curing the transfer material. The light source 40 is, for example, a mercury lamp. The light source 40 can change the intensity of the emitted light. It may be configured to be able to change the wavelength of the emitted light. By changing the intensity, wavelength, etc. of the emitted light, the light source 40 can also stop short of completely curing the transfer material and only increase the viscosity of the transfer material. The intensity, etc. of the light emitted from the light source 40 are adjusted by the control device 50.

[0019] An irradiation amount adjustment mechanism 41 may be disposed between the light source 40 and the substrate 20, that is, at a position in the middle of the path through which the light reaches the substrate 20. The irradiation amount adjustment mechanism 41 adjusts the irradiation amount of the light reaching the substrate 20 by mechanical operation. The irradiation amount adjustment mechanism 41 is, for example, a shutter device or a mirror device. When the irradiation amount adjustment mechanism 41 is disposed, the control device 50 adjusts the irradiation amount of the light reaching the substrate 20 from the light source 40 by controlling the operation of the irradiation amount adjustment mechanism 41.

[0020] The control device 50 is a device that provides overall control over the operation of the imprint device 10. The control device 50 is configured as a computer system having a CPU, RAM, ROM, etc. The control device 50 may be built into the imprint device 10, or it may be installed at a location separate from the imprint device 10.

[0021] The pattern transfer process using the imprint device 10 will be explained with reference to Figure 2. Figure 2 schematically shows the state of the substrate 20 and other components at each stage of the imprint process. In the figure, the material to be transferred is labeled "60," and the film to be processed is labeled "70." Hereafter, these will also be referred to as the "material to be transferred 60" and the "film to be processed 70," respectively.

[0022] First, as shown in Figure 2(A), the transfer material 60 is placed on the surface of the substrate 20 (specifically, on the surface of the film to be processed 70). The transfer material 60 may be placed, for example, by dropping the transfer material 60 at multiple locations on the film to be processed 70, or by forming a film of the transfer material 60 over the entire film to be processed 70 using spin coating or the like.

[0023] Subsequently, as shown in Figure 2(B), the process is performed to press the portion of the template 30 in which the uneven pattern is formed (i.e., the transfer area PA) onto the transfer material 60 on the substrate 20 by lowering the original plate chuck 31 (not shown).

[0024] The transfer region PA has multiple protrusions 310 that project toward the substrate 20, and multiple recesses 301 that are located between the protrusions 310, forming an uneven pattern. This uneven pattern corresponds to the pattern formed on the material to be transferred 60. In the state shown in Figure 2(B), the material to be transferred 60 is filled into the gap between the template 30 and the substrate 20. Specifically, the material to be transferred 60 is uniformly filled into the spaces inside the recesses 301 and the gaps between the tips of the protrusions 310 and the film to be processed 70. As a result, at this point, the shape of the fluid material to be transferred 60 corresponds to the uneven pattern described above.

[0025] With the state shown in Figure 2(B), light is emitted from the light source 40. This light passes through the aperture OP and the template 30 before reaching the transfer material 60. As a result, the transfer material 60 hardens while maintaining the shape corresponding to the uneven pattern.

[0026] Once the curing of the transfer material 60 is complete, the template 30 is removed from the transfer material 60. Specifically, as shown in Figure 2(C), a master plate chuck 31 (not shown) is pulled upward. This separates the substrate 20 from the template 30, and the transfer material 60 is released from the uneven pattern of the template 30. The surface of the processed film 70 is now covered with the transfer material 60 on which the pattern has been formed.

[0027] Furthermore, the pattern formation on the transfer material 60 described above is carried out by dividing the surface 20S into multiple regions and performing the process sequentially on each region. This makes it possible to form a pattern over a wide area.

[0028] The substrate 20 having the transfer material 60 on which the pattern is formed (i.e., the patterned substrate) is moved to another etching apparatus in a later process, for example, and an etching process is performed on the film to be processed 70 using the transfer material 60 as a mask. As a result, a raised and recessed pattern is formed on the film to be processed 70, and a semiconductor device having a wiring pattern in which metal is embedded in the recesses of the raised and recessed pattern is manufactured. Figure 2(D) schematically shows the state immediately after the etching process of the film to be processed 70 using the transfer material 60 as a mask has been performed. Figure 2(E) schematically shows the state after the transfer material 60 has been removed by ashing from the state in Figure 2(D). In this way, a predetermined pattern corresponding to the raised and recessed pattern of the template 30 is formed on the film to be processed 70.

[0029] By the way, when removing the template 30 from the transfer material 60 as described above, the release properties of the template 30 become an issue. It is known that when quartz is used as the material for the template 30, the release properties of the transfer material 60 tend to be low. If the release properties of the transfer material 60 are low, for example, as shown in Figure 3(A), during demolding, some of the transfer material 60 may be lifted while still attached to the template 30 and separated from the rest.

[0030] To prevent such defects in the transfer material 60, one possible measure is to cover the entire surface of the transfer region PA of the template 30 with a layer of material that has low wettability to the transfer material 60.

[0031] However, in that case, as shown in Figure 2(B), when the template 30 is pressed onto the material to be transferred 60, there is a possibility that some of the gap between the template 30 and the substrate 20 will remain unfilled with the material to be transferred 60. For example, as shown in Figure 3(B), there is a possibility that an empty space will remain inside the recess 301 that is not filled with the material to be transferred 60. Both the conditions in Figure 3(A) and Figure 3(B) are undesirable because they prevent the formation of a proper pattern on the material to be transferred 60.

[0032] Thus, improving the release properties of the transfer material 60 can lead to the problem of reduced packing properties of the transfer material 60 as a trade-off. Therefore, in the template 30 according to this embodiment, both release properties and packing properties are achieved by devising the configuration of the transfer region PA.

[0033] The specific configuration of template 30 will be explained with reference to Figure 4. Figure 4 shows the configuration of the transfer region PA of template 30 as a partial cross-sectional view. As shown in the figure, template 30 comprises a substrate 300, a base film 330, and a monolayer 340.

[0034] The base material 300 is a component that occupies almost the entirety of the template 30. The base material 300 is made of quartz. As for the material of the base material 300, any material that is transparent to the wavelength of light irradiated from the light source 40 may be used, such as a material containing some additives to quartz, or a material other than quartz may be used. The convex portions 310 and concave portions 301, which are the uneven pattern of the transfer region PA, are both formed on the base material 300.

[0035] The base film 330 is a film that covers the tip surface 311 of the protrusion 310. In this embodiment, the base film 330 is formed as a metal film mainly composed of Ti. The material of the base film 330 may be Ti alone, as in this embodiment, but it may also contain components other than Ti. The base film 330 is formed as a base for forming the monomolecular film 340 described below. Of the transfer region PA of the template 30, the base film 330 and the monomolecular film 340 are formed only on the tip surface 311 of the protrusion 310. In this embodiment, the base film 330, etc., are not provided on parts of the transfer region PA of the template 30 other than the tip surface 311. However, the base film 330, etc., may be provided on parts of the template 30 other than the transfer region PA.

[0036] The monolayer 340 is a film that further covers the base film 330 on the tip surface 311 of the protrusion 310. The base film 330 is a film formed as a so-called "self-assembled monolayer". When the base film 330 is a metal film as in this embodiment, it is preferable to use a film made of organic sulfur molecules such as thiols such as 1-decanethiol or disulfides such as di-n-hexyl disulfide as the monolayer 340. The monolayer 340 may also contain materials other than organic sulfur molecules.

[0037] The advantages of configuring the template 30 as described above will now be explained. The monolayer 340 exposed at the tip of the protrusion 310 has lower wettability to the material to be transferred 60 compared to the material (quartz in this embodiment) exposed around it. In other words, the contact angle of the material to be transferred 60 with respect to the monolayer 340 is larger than the contact angle of the material to be transferred 60 with respect to the portion of the transfer region PA other than the monolayer 340.

[0038] As a result, as shown in Figure 2(B), immediately after the transfer material 60 has hardened, the adhesion strength of the transfer material 60 to the tip surface 311 of the protrusion 310 is smaller than the adhesion strength to other parts (for example, the inner surface and inner bottom surface of the recess 301). Here, "adhesion strength" refers to the force required to separate the two.

[0039] When removing the template 30 from the material to be transferred 60 to the state shown in Figure 2(C), the stress applied to the material to be transferred 60 is greatest near the tip of the protrusion 310, and the material to be transferred 60 separates from the template 30 starting from that point. The force required for release is greatest just before the material to be transferred 60 peels off from the tip of the protrusion 310, and after that part has peeled off, the force required for release becomes a generally constant small force.

[0040] Therefore, as in this embodiment, by forming a monomolecular film 340 on the tip surface of the protrusion 310 and reducing the force required to peel the transfer material 60 from that portion, the force required for demolding can be suppressed. This makes it possible to prevent film defects during demolding, as shown in Figure 3(A).

[0041] Furthermore, since the adhesion strength of the transfer material 60 is reduced only at the tip surface of the protrusion 310, the reduction in the filling ability of the transfer material 60 can be minimized. Therefore, it is possible to prevent film defects during demolding while also preventing the retention of voids as shown in Figure 3(B).

[0042] Since the thickness of the monolayer 340 is approximately that of one molecule, even if the monolayer 340 is formed on the tip of the protrusion 310, the shape of the uneven pattern in the transfer region PA hardly changes. For this reason, the influence on the pattern shape of the material to be transferred 60 after transfer can be kept to a negligible level.

[0043] This section describes how to manufacture template 30.

[0044] <Substrate Preparation Process> As part of the substrate preparation process, the substrate 300 is first prepared. At this point, the substrate 300 does not yet have patterns such as protrusions 310 formed on it, and the entire transfer area PA is a flat surface. Figure 5 schematically shows a cross-section of the prepared substrate 300. The upper surface of the substrate 300 in Figure 5 is the surface on which the protrusions 310 and the like will later be formed.

[0045] <Undercoat Formation Process> Following the substrate preparation process, the undercoat formation process is carried out. In the undercoat formation process, an undercoat 330 is formed so as to cover at least the entire portion of the surface of the substrate 300 that will become the transfer region PA. Subsequently, a metal film 331 is formed so as to cover the entire undercoat 330. As mentioned earlier, in this embodiment, Ti is used as the material for the undercoat 330. For example, Cr is used as the material for the metal film 331. Both of these can be formed by methods such as sputtering or CVD. Figure 6 shows the state after the undercoat formation process is completed. Note that in this embodiment, the metal film 331 is not necessarily required if it is possible to suitably process the undercoat 330.

[0046] <Mask Formation Process> Following the undercoat formation process, a mask formation process is performed. In the mask formation process, as shown in Figure 7, a resist 350 is applied to cover the surface of the metal film 331. The resist 350 is a film that functions as a mask in the subsequent etching process. Subsequently, as shown in Figure 8, recesses 351 are formed in a part of the resist 350 by imprinting. The recesses 351 are formed in the parts corresponding to the recesses 301. However, instead of imprinting as in this embodiment, the recesses 351 may be formed using, for example, electron beam lithography or photolithography. In this case, the recesses 351 are open, and the metal film 331 is exposed.

[0047] <Etching Process> Following the mask formation process, an etching process is performed. In the etching process, the resist 350 is subjected to, for example, dry etching. At this time, the recessed area 351 becomes an opening, and thereafter the metal film 331 is etched through this opening. Figure 9 shows the state after the etching of the metal film 331 is completed. The etching of the metal film 331 can be carried out using, for example, a chlorine-based gas.

[0048] Subsequently, etching is continued on the undercoat 330 and a portion of the substrate 300 through the above-mentioned openings in the resist 350. In this embodiment, if the undercoat 330 is a Ti film, the undercoat 330 and the substrate 300 can be etched using a CF-based gas. Of the transfer region PA of the substrate 300, the etched portion becomes the recess 301 described above, and the remaining portion remains as a protrusion 310. Once the etching process is complete, the resist 350 covering the surface of the metal film 331 is removed, as shown in Figure 10. The resist 350 can be removed, for example, by using a stripping solution or by ashing. Subsequently, as shown in Figure 11, the metal film 331 is removed by etching, and the undercoat 330 is exposed.

[0049] <Monolayer Formation Process> Following the etching process, a monolayer formation process is performed. In the monolayer formation process, a monolayer 340 is formed on the surface of the base film 330. As mentioned earlier, the monolayer 340 is formed as a so-called "self-assembled monolayer". For example, by immersing the entire substrate 300, including the base film 330, in a solution containing organic sulfur molecules, which are the raw materials, for a predetermined time, the monolayer 340 is selectively formed only on the surface of the base film 330. The base film 330 may be formed by such a solution method, but it may also be formed by a gas-phase method. By the method described above, the template 30 with the configuration shown in Figure 4 is completed.

[0050] Materials other than those used in this embodiment may be used for the base film 330 and the monolayer 340. The base film 330 is provided to ensure adhesion to the substrate 300, which is quartz, and to form a self-assembled monolayer thereon. The material of the base film 330 is preferably selected appropriately, taking into consideration the adhesion to the substrate 300, the material of the monolayer 340 to be formed, and the transmittance of light generated from the light source 40.

[0051] The undercoat 330 may be a single-layer metal film as in this embodiment, but it may also be a two-layer metal film as in the modified example shown in Figure 12. In the example in Figure 12, the first undercoat 330A covers the tip surface 311, and the second undercoat 330B further covers the first undercoat 330A. The first undercoat 330A is, for example, a film mainly composed of Cr, and the second undercoat 330B is, for example, a film mainly composed of Au or Ti. The material of the first undercoat 330A may be pure Cr as in this modified example, but it may also contain components other than Cr. Similarly, the material of the second undercoat 330B may be pure Au or Ti as in this modified example, but it may also contain components other than Au or Ti.

[0052] As described above, when organic sulfur molecules are used as the material for the monolayer 340, the base layer 330 only needs to contain at least one of Ti, Cr, and Au. Furthermore, the number of layers of the base layer 330 may be two, as in this modified example, but it may also be three or more.

[0053] Furthermore, if the undercoat 330 is a film containing Ti, the undercoat 330 can be removed in the etching process by dry etching using a CF-based gas, as in this embodiment. Also, if the undercoat 330 has a layer made of Cr and Au, the layer can be removed in the etching process by dry etching using a chlorine-based gas.

[0054] The monolayer 340 containing organic sulfur molecules may further contain fluorine. Specifically, the monolayer 340 may be formed with fluorinated organic sulfur molecules such as 1H,1H,2H,2H-perfluorodecanethiol. By using such a material, the contact angle of the material to be transferred 60 to the monolayer 340 can be further increased.

[0055] The base film 330 may be formed from a metal oxide instead of a metal as in this embodiment. As the metal oxide, for example, one containing at least one of Al2O3, TiO2, ZrO2, ZnO, and ITO, which is a mixed oxide of In2O3 and SnO2, can be used. Furthermore, the base film 330 may be the metal oxide itself as described above, but it may also contain components other than metal oxides.

[0056] When the base film 330 is a metal oxide as described above, it is preferable to use a film made of phosphonic acid as the monolayer 340. The monolayer 340 may also contain materials other than phosphonic acid.

[0057] The monolayer 340 containing phosphonic acid may further contain fluorine. Specifically, the monolayer 340 may be formed with alkylphosphonic acids such as n-octadecylphosphonic acid, or fluorinated phosphonic acids such as 1H,1H,2H,2H-perfluorooctanphosphonic acid. By using such materials, the contact angle of the transfer material 60 to the monolayer 340 can be further increased.

[0058] Regardless of which of the above materials is used as the undercoat 330, it is preferable to keep the thickness of the undercoat 330 as thin as possible, within the range of 10 nm or less.

[0059] As the pattern is repeatedly transferred using the template 30, the monolayer 340 at the tip of the protrusion 310 gradually wears down. However, since the monolayer 340, being a "self-assembled monolayer," can be formed relatively quickly and easily, the monolayer 340 can be replaced as needed depending on the degree of wear.

[0060] Furthermore, when transferring a pattern using the imprint device 10, if the material to be transferred 60 contains the material of the monolayer 340, the monolayer 340 is repaired each time the pattern is transferred by contact with the material to be transferred 60, as shown in Figure 2(B). This makes it possible to maintain the release properties of the template 30 for a long period of time without frequently reapplying the monolayer 340.

[0061] The embodiments have been described above with reference to specific examples. However, this disclosure is not limited to these specific examples. Modifications made to these specific examples by those skilled in the art are also included within the scope of this disclosure, as long as they retain the features of this disclosure. The elements, their arrangement, conditions, shapes, etc., of each of the aforementioned specific examples are not limited to those illustrated and can be modified as appropriate. The elements of each of the aforementioned specific examples can be combined in different ways as appropriate, as long as no technical inconsistencies arise. [Explanation of Symbols]

[0062] 20: Substrate, 30: Template, 310: Protrusion, 311: Tip surface, 330: Undercoat, 340: Monolayer, PA: Transfer region.

Claims

1. An imprint template for pressing a protrusion onto a material to be transferred on a substrate, thereby transferring a pattern with the shape of the protrusion reversed, A base material having the protrusions corresponding to the pattern formed in the transfer region that is pressed against the material to be transferred, A base film covering only the tip surface of the protrusion in the transfer region, It comprises a monolayer film that covers only the aforementioned underlayer film, A template in which the contact angle of the material to be transferred to the monolayer is greater than the contact angle of the material to be transferred to the portion of the transfer region other than the monolayer.

2. The template according to claim 1, wherein the substrate contains quartz.

3. The template according to claim 1, wherein the underlayer film contains metal.

4. The template according to claim 3, wherein the undercoat comprises at least one of titanium, chromium, and gold.

5. The template according to claim 4, wherein the monolayer contains an organic sulfur molecule.

6. The template according to claim 5, wherein the monolayer contains fluorine.

7. The template according to claim 1, wherein the undercoat contains a metal oxide.

8. The template according to claim 7, wherein the undercoat comprises at least one oxide selected from aluminum, titanium, zirconium, tin, and indium.

9. The template according to claim 8, wherein the monolayer contains phosphonic acid.

10. The template according to claim 9, wherein the monolayer contains fluorine.

11. The template according to claim 1, wherein the thickness of the underlayer film is 10 nm or less.

12. A method for manufacturing an imprint template for transferring a pattern onto a transfer material on a substrate, A base film is formed on the surface of the substrate. Cover the aforementioned undercoat with a mask, The undercoat and the substrate are etched through the opening of the mask. A monolayer is formed only on the surface of the remaining underlayer film. The contact angle of the material to be transferred with respect to the monolayer is greater than the contact angle of the material to be transferred with respect to the portion of the transfer region of the template that is pressed against the material to be transferred, other than the monolayer. A method for manufacturing templates.

13. The method for manufacturing a template according to claim 12, wherein the monolayer is a self-assembled monolayer.

14. A method for manufacturing a patterned substrate using a template having a protrusion, A step of placing the material to be transferred on the surface of the substrate, The steps include pressing the template onto the material to be transferred, A step of curing the transfer material by irradiating it with light, The process includes removing the template from the material to be transferred and forming a pattern on the material with the convex portion reversed, As the aforementioned template, A base material having the protrusions corresponding to the pattern formed in the transfer region that is pressed against the material to be transferred, A base film covering only the tip surface of the protrusion in the transfer region, This includes using a device that comprises a monolayer film covering only the aforementioned underlayer film, The contact angle of the material to be transferred with respect to the monolayer is greater than the contact angle of the material to be transferred with respect to the portion of the transfer region other than the monolayer. A method for manufacturing a patterned substrate.

15. The method for manufacturing a patterned substrate according to claim 14, wherein the material to be transferred includes the material of the monolayer.

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