Method and system for thermal control of electronic testing equipment.

Abstract

To provide a tester device.SOLUTION: Slot assemblies are removably mounted on a frame. Each slot assembly enables individual heating and temperature control of a respective cartridge inserted into the slot assembly. A closed loop air path is defined by the frame, and a heater and a cooler are located in the closed loop air path to cool or heat the cartridges with air. Individual cartridges can be inserted or removed while other cartridges are in various stages of being tested or in various stages of temperature ramps.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001]

[0001] The present invention relates to a test apparatus used for testing ultra-small electronic circuits.

Background Art

[0002]

[0002] Ultra-small electronic circuits are typically manufactured within and on semiconductor wafers. Such wafers are then "singulated" or "diced" into individual dies. Such dies are generally mounted on a support substrate, which provides rigidity to the support substrate and communicates with the integrated or ultra-small electronic circuits of the die. Final packaging can include encapsulation of the die, and the resulting package can then be shipped to customers.

[0003]

[0003] Dies or packages need to be tested before being shipped to customers. Ideally, dies need to be tested during the processing stage, the purpose of which is to identify defects that occur during the initial stages of manufacturing. Wafer-level testing can be achieved by preparing a handling device and a contactor having contacts, and then using the handling device to move the wafer to bring the contacts on the wafer into contact with the contacts on the contactor. Then, power signals and electronic signals are exchanged between the ultra-small electronic circuits formed on the wafer and the contactor.

[0004]

[0004] According to various embodiments, a wafer includes a substrate such as a silicon substrate or a printed circuit board, and one or more devices manufactured within or attached to the substrate.

[0005]

[0005] Instead, the wafer can be located within a portable cartridge having an electrical interface and a thermal chuck. Power and signals are supplied to and from the wafer via the electrical interface while the temperature of the wafer is thermally controlled by heating or cooling the thermal chuck.

Summary of the Invention

[0006]

[0006] The present invention provides a test apparatus comprising a frame and a plurality of slot assemblies, each slot assembly comprising a slot assembly body attached to the frame, a holder attached to the slot assembly body forming a test location for setting each wafer having at least one microelectronic device, a plurality of conductors, and a temperature detector positioned in close proximity to each wafer for detecting the temperature of each wafer, the test apparatus comprising at least one temperature correction device for transferring heat to or from the wafer during operation, at least one thermal controller for controlling the transfer of heat based on the wafer temperature detected by the temperature detector, a power supply connected to the wafers in the test location through the conductors and supplying at least power to each microelectronic device, and a test machine connected to the wafer through the conductors and measuring the performance of the microelectronic device.

[0007]

[0007] The present invention further provides a method for testing miniature electronic devices, the method comprising: placing each wafer of a plurality of wafers, each wafer having at least one miniature electronic device, in a test location provided by a holder of a slot assembly mounted on a frame; detecting the temperature of each wafer with a temperature detector located close to each wafer; transferring heat to or from the wafer; controlling the heat transfer based on the wafer temperature detected by the temperature detector; and testing the miniature electronic devices by supplying at least power to each miniature electronic device and measuring the performance of the miniature electronic device.

[0008]

[0008] The present invention further provides a test apparatus comprising a frame defining at least a first closed-loop air path, at least a first fan located within the first closed-loop air path and recirculating air through the first closed-loop air path, and a plurality of slot assemblies, each slot assembly comprising a slot assembly body attached to the frame, a holder attached to the slot assembly body and forming a test location for setting each wafer having at least one microelectronic device and held in the first closed-loop air path, and a plurality of conductors, the test apparatus comprising a temperature correction device, the temperature correction device being attached to the frame within the first closed-loop air path and, when in operation, causing heat transfer between the air within the first closed-loop air path and the temperature correction device within the first closed-loop air path, at least one temperature detector for detecting temperature, a thermal controller for controlling heat transfer based on temperature, a power supply connected to the wafers in the test location via conductors and supplying at least power to each microelectronic device, and a test machine connected to the wafers via conductors and measuring the performance of the microelectronic devices.

[0009]

[0009] The present invention further provides a method for testing miniature electronic devices, the method comprising: placing each wafer of a plurality of wafers, each wafer having at least one miniature electronic device, in a test location provided by each holder of each slot assembly mounted on a frame, the wafer being held in a first closed-loop air path defined by the frame; operating at least a first fan located in the first closed-loop air path to recirculate air through the first closed-loop air path; transferring heat between at least one temperature correction device mounted on the frame in the first closed-loop air path and the air in the first closed-loop air path; detecting the temperature; controlling the heat transfer based on the temperature; and testing the miniature electronic devices by supplying at least power to each miniature electronic device to measure the performance of the miniature electronic device.

[0010]

[0010] The present invention further provides a test apparatus comprising a frame and a plurality of slot assemblies, each slot assembly comprising a slot assembly body mounted on the frame, a holder mounted on the slot assembly body forming a test location for setting each wafer having at least one microelectronic device, a plurality of conductors, and a temperature detector positioned in close proximity to each wafer to detect the temperature of each wafer, the test apparatus comprising at least one temperature correction device that causes heat transfer to or from the wafer when in operation, and a test machine connected to the wafers in the test location through the conductors and testing the microelectronic devices by supplying at least power to each microelectronic device to measure the performance of the microelectronic device, the test machine comprising at least one conductor of the first slot assembly of the slot assembly that is connectable between the first wafer of the wafer and the power supply while transferring heat to or from the second wafer of the wafer connected to the power supply, the test machine comprising

[0011]

[0011] The present invention further provides a method for testing a miniature electronic device, the method comprising: placing each wafer of a plurality of wafers, each wafer having at least one miniature electronic device, in a test location provided by each holder of each slot assembly mounted on a frame; detecting the temperature of each wafer with each temperature detector located in close proximity to each wafer; transferring heat to or from the wafer; testing the miniature electronic device by supplying at least power to each miniature electronic device to measure its performance; and connecting at least one conductor of the first slot assembly of the slot assembly between the first wafer and the power supply while transferring heat to or from a second wafer connected to the power supply.

[0012]

[0012] The present invention will be further described by reference to the accompanying drawings. [Brief explanation of the drawing]

[0013] [Figure 1] This is a side cross-sectional view of a test apparatus having a slot assembly according to one embodiment of the present invention. [Figure 2] This is a side cross-sectional view of the test apparatus at 2-2 in Figure 1. [Figure 3] This is a side cross-sectional view of the test apparatus at 3-3 in Figure 1. [Figure 4] This is a side cross-sectional view of the test apparatus at 4-4 in Figures 2 and 3. [Figure 5A] This is a cross-sectional side view of a test apparatus having a slot assembly according to another embodiment of the present invention. [Figure 5B] This is a cross-sectional side view of a test apparatus having a slot assembly according to a further embodiment of the present invention. [Figure 5C] This is a cross-sectional side view of a test apparatus having a slot assembly according to a further embodiment of the present invention. [Figure 6A] This is a perspective view showing a test apparatus, illustrating an example of inserting or removing a portable cartridge into or from an oven defined by a frame. [Figure 6B] This is a perspective view showing a test apparatus, illustrating an example of inserting or removing a portable cartridge into or from an oven defined by a frame. [Figure 6C] This is a perspective view showing a test apparatus, illustrating an example of inserting or removing a portable cartridge into or from an oven defined by a frame. [Figure 7] This is a time chart showing how one cartridge is inserted and used to test the electronic components of a wafer, and then another cartridge is inserted afterward. [Figure 8] This is a perspective view of a test apparatus illustrating the insertion or removal of a single slot assembly. [Modes for carrying out the invention]

[0014]

[0022] In FIG. 1 of the accompanying drawings, a test apparatus 10 according to an embodiment of the present invention is illustrated, which includes a testing machine 12, a frame 14, a power bus 16, first and second slot assemblies 18A and 18B, first and second testing machines interface 20A and 20B, first and second power interface 22A and 22B, first and second pressurized air interface 24A and 24B, first and second vacuum interface 26A, 26B, first and second cartridges 28A and 28B, and first and second wafers 30A and 30B.

[0015]

[0023] The slot assembly 18A includes a slot assembly body 32, a thermal chuck 34, a temperature detector 36, a temperature corrector in the form of a heating element 38, a cooling element 39, a first slot assembly interface 40, and a control interface 44, a power interface 46, and a vacuum interface 48, and a plurality of second slot assemblies interface thereof.

[0016]

[0024] The first slot assembly interface 40 is located within the slot assembly body 32 and is attached to the slot assembly body 32. The control interface 44, the power interface 46, and the vacuum interface 48 in the form of a second interface is attached to the left side wall of the slot assembly body 32 attached to the frame 14.

[0017]

[0025] The slot assembly 18A is insertable into and removable from the frame 14. When the slot assembly 18A is inserted into the frame 14, the testing machine interface 20A, the power interface 2A, and the first vacuum interface 26A are respectively connected to the control interface 44, the power interface 46, and the vacuum interface 48. When the slot assembly 18A is removed from the frame 14, the testing machine interface 20A, Power interface 22A and the first vacuum interface 26A is control interface 44, electric power interface 46 and vacuum interface It will be separated from the 48.

[0018]

[0026] The slot assembly 18A includes a motherboard 60 having test electronic equipment, a plurality of channel module boards 62 having test electronic equipment, a flexible connector 64, and a connecting board 66. interface 44 and Power interface 46 is connected to the motherboard 60, and the thermal controller 50 is mounted on the motherboard 60. The channel module board 62 is electrically connected to the motherboard 60. The flexible connector 64 connects the channel module board 62 to the connection board 66. The control function is controlled interface Power is supplied via a conductor that connects 44 to the motherboard 60. interface Power is supplied to the motherboard 60 via 46. Both power and control are supplied from the motherboard 60 to the channel module board 62 via conductors. The flexible connector 64 has conductors that connect the channel module board 62 to the connection board 66. The connection board 66 connects the flexible connector 64 to the first slot assembly interface Includes a conductor to connect to 40. This first slot assembly interface 40 is thus controlled via various conductors. interface 44 and Power interface 46 is connected, and power and control are controlled interface 44 and Power interface First slot assembly via 46 interface It is now available for supply to 40.

[0019]

[0027] The second slot assembly 18B includes the same components as the first slot assembly 18A, and the same reference numerals represent the same components. The second slot assembly 18B is inserted into the frame 14 and controls the second slot assembly 18B. interface 44, electric power interface 46 and vacuum interface 48 are, respectively, test machines interface 20B, power interface 22B and the second vacuum interface It is designed to connect to 26B.

[0020]

[0028] Cartridge 28A includes a cartridge body 70 formed by a thin chuck 72 and a back plate 74. A temperature detector 36 is located inside the thin chuck 72. Multiple miniature electronic devices are formed inside the wafer 30A. The wafer 30A is inserted into the cartridge body 70 between the thin chuck 72 and the back plate 74. Multiple cartridge contacts 76 contact each contact (not shown) on the wafer 30A. Cartridge 28A has cartridges on the back plate 74. interface 78 further includes. The conductor in the back plate 74 is the cartridge interface Connect 78 to cartridge contact 76.

[0021]

[0029] The cartridge 28A has a seal 77 connected between the back plate 74 and the thin chuck 72. Vacuum is applied to the area defined by the seal 77, the back plate 74 and the thin chuck 72. The vacuum holds the cartridge 28A together and ensures proper contact between the cartridge contact 76 and the contact on the wafer 30A. The temperature detector 36 is close to the wafer 30A and therefore close enough to detect the temperature of the wafer 30A within 5 degrees Celsius, preferably within 2 degrees Celsius.

[0022]

[0030] The slot assembly 18A further has a door 82 connected to the slot assembly body 32 by a hinge 84. When the door 82 is rotated to the open position, the cartridge 28A can be inserted into the slot assembly body 32 through the door opening 86. The cartridge 28A is then lowered onto the thermal chuck 34, and the door 82 closes. The slot assembly 18A further has a seal 88 located between the thermal chuck 34 and the thin chuck 72. Vacuum interfaceVacuum is applied through 48 and the vacuum line 90 to the area defined by the seal 88, the thermal chuck 34, and the thin chuck 72. The thermal chuck 34 then essentially forms a holder having a test location for the wafer. The thermal chuck 34 is mounted on the slot assembly body 32. This provides a good thermal connection between the thermal chuck 34 and the thin chuck 72. When the heating element 38 generates heat, the heat is transferred through the thermal chuck 34 and the thin chuck 72 to the wafer 30A.

[0023]

[0031] cartridge interface 78 is the first slot assembly interface Engage with 40. First slot assembly interface 40, cartridge interface Power and signals are supplied to the wafer 30A via 78 and cartridge contact 76. The performance of the devices within the wafer 30A is determined by the cartridge contact 76, cartridge interface 78 and 1st slot assembly interface It is measured via 40.

[0024]

[0032] The door 82 of slot assembly 18B is shown in the closed position. A front seal 100 is attached to the upper surface of slot assembly 18A and seals the lower surface of slot assembly 18B. A front seal 102 is attached to the upper surface of slot assembly 18 and seals the lower surface of frame 14. The doors 82 and front seals 100 and 102 of slot assemblies 18A and 18B provide a continuous, sealed front wall 104.

[0025]

[0033] The slot assembly 18A further includes a thermal controller 50. A temperature sensor 36 is connected to the thermal controller 50 via a temperature feedback line 52. Power is supplied to the power interfaceA heat source is supplied to the heating element 38 via the 46 and power lines 54, causing the heating element 38 to heat up. The heating element 38 then heats the heat chuck 34 and the wafer 30A on the heat chuck 34. The cooling element 39 is located opposite the heating element 38 and can be, for example, a cooling element body through which a fluid flows at a controllable speed to control the amount of heat transferred away from the wafer and the heat chuck 34. The heating element 38 and the cooling element 39 are configured to be controlled by a thermal controller 50 based on the temperature detected by the temperature detector 36.

[0026]

[0034] Slot assembly 18A includes a separation seal 108 attached to the upper surface of the slot assembly body 32 above its inner wall 106. The separation seal 108 seals the lower surface of slot assembly 18B. Slot assembly 18B has a separation seal 110 attached to the upper surface of its slot assembly body 32. The separation seal 108 seals the lower surface of the frame 14. A continuous sealed separation wall 112 is provided by the inner walls 106 of slot assemblies 18A and 18B and the separation seals 108 and 110.

[0027]

[0035] Figure 2 shows the test apparatus 10 of Figure 1 in section 2-2. The frame 14 defines the first closed-loop air path 120. The air inlet and outlet openings (not shown) can be opened to change the first closed-loop air path 120 into an open air path, where room temperature air flows without recirculating the frame 14. The closed-loop path is particularly useful in a cleanroom environment because, as a result, the cleanroom environment does not release much particulate matter into the air.

[0028]

[0036] The test apparatus 10 includes a first fan 122, a first fan motor 124, a temperature correction device in the form of a water cooler 126, a temperature correction device in the form of an electric heater 128, a damper 130, a damper actuator 132, and a thermal controller 134.

[0029]

[0037] The first fan 122 and the first fan motor 124 are mounted on the upper part of the first closed-loop air path 120. The damper 130 is mounted on the frame 14 so as to be able to pivot between an elevated position and a lowered position. The water cooler 126 and the electric heater 128 are mounted on the frame 14 within the upper part of the first closed-loop air path 120.

[0030]

[0038] The damper actuator 132 is connected to the damper 130 and rotates the damper between an up position and a down position. The thermal controller 134 controls the operation of the damper actuator 132 and the current supplied to the electric heater 128. The thermal controller 134 receives input from the air temperature measuring device 140 located in the first closed-loop air path 120. As shown by block 142, the air temperature setpoints set by the thermal controller 134 are all of the following: 1) Wafer temperature setpoint (programmed by the user), 2) Dynamic feedback from the slot temperature measurement by the temperature detector 36 in Figure 1, 3) A constant deviation from wafer temperature to sensed wafer temperature, which may be a function of wafer wattage, mainly of the fluctuations and temperature drop of calibrable thermocouples, and 4) Wafer wattage It is a function of .

[0031]

[0039] Cartridges 28A and 28B are positioned in slot assemblies 18A and 18B and are located within the lower half of the first closed-loop air path 120.

[0032]

[0040] When in use, current is supplied to the first fan motor 124. The first fan motor 124 rotates the first fan 122. The first fan 122 recirculates the air clockwise through the first closed-loop air path 120.

[0033]

[0041] The temperature control device 134 receives temperature from the temperature measuring device 140. The thermal controller 134 is configured to maintain the temperature of the air in the first closed-loop air path 120 at a predetermined setpoint. When it is necessary to heat the air, the temperature control device 134 activates the damper actuator 132 to rotate the damper 130 to the raised position. The air is then diverted from the water cooler 126 towards the electric heater 128, which then heats the air.

[0034]

[0042] If it is necessary to cool the air in the first closed-loop air path 120, the heat controller 134 reduces the current to the electric heater 128 and operates the damper actuator 132 to rotate the damper 130 to the lowered position. In the lowered position, the damper 130 diverts the air away from the electric heater 128 so that most of the air flows over the heat exchanger of the water cooler 126. The water cooler 126 then cools the air. The air then flows over the cartridge 28A or 28B through the slot assemblies 18A and 18B. The cartridge 28A or 28B is then heated or cooled by the convection of the air.

[0035]

[0043] Figure 3 shows the test apparatus 10 of Figure 1 in section 3-3. The frame 14 defines a second closed-loop air path 150. The test apparatus 10 further includes a second fan 152, a second fan motor 154, and a temperature correction device in the form of a water cooler 156. There are no electric heaters or dampers as shown in Figure 2. The air inlet and outlet openings (not shown) can be opened to change the first closed-loop air path 150 into an open air path, where room temperature air passes through the frame 14 without recirculation.

[0036]

[0044] Closed-loop airflow paths are particularly useful in cleanroom environments because, as a result, less particulate matter is released into the air. The second fan 152 and the second fan motor 154 are located in the upper part of the second closed-loop airflow path 150. The water cooler 156 is located slightly downstream of the second fan 152 in the second closed-loop airflow path 150. The motherboard 60 and channel module board 62, which form part of the slot assemblies 18A and 18B, are located in the lower half of the second closed-loop airflow path 150.

[0037]

[0045] During use, current is supplied to the second fan motor 154, causing the second fan 152 to rotate. The second fan 152 then recirculates the air clockwise through the second closed-loop air path 150. The air is cooled by the water cooler 156. The cooled air passes over the motherboard 60 and channel module board 62, and heat is transferred from the motherboard 60 and channel module board 62 to the air by convection.

[0038]

[0046] The air recirculating through the first closed-loop air path 120 in Figure 1 is kept separated from the air in the second closed-loop air path 150 in Figure 3 by the continuously sealed separation wall 112 shown in Figure 1. The continuously sealed front wall 104 shown in Figure 1 prevents the air from escaping from the first closed-loop air path 120.

[0039]

[0047] As shown in Figure 4, in all areas except those provided by the continuously sealed separator wall 112, the plenum 160 separates the first closed-loop air path 120 from the second closed-loop air path 150. The frame 14 has a left wall 162 and a right wall 164, which further define the closed-loop air paths 120 and 150.

[0040]

[0048] Figure 5A shows a test apparatus 210 having a slot assembly 218 according to an alternative embodiment of the present invention. The slot assembly 218 includes a heating resistor 220 that operates similarly to the heating element 38 shown in Figure 1. The heating resistor 220 is located within a thermal chuck 222. The thermal chuck 222 has a thermal fluid passage 224 formed inside it. The thermal fluid passage 224 holds a thermal fluid. The thermal fluid is preferably a liquid, as opposed to a gas, because liquids are not compressible and heat convects more quickly into and out of the liquid. Different thermal fluids are used for different applications, and oil is used for applications involving the highest temperatures.

[0041]

[0049] The opposite end of the thermal fluid passage 224 is connected to the first and second cylindrical bodies 226 and 228. The slot assembly 218 is pneumatic interface Includes 230 and pneumatic switch 232. interface 230 is pressurized air on the frame 14 of the test apparatus 10. interface It's connected to 24A.

[0042]

[0050] A pressure higher than atmospheric pressure is supplied to either the first cylindrical body 226 or the second cylindrical body 228 via the pneumatic switch 232. When pressurized air is supplied to the first cylindrical body 226, the first cylindrical body 226 acts as a thermal fluid actuator, pushing the thermal fluid in one direction through the thermal fluid passage 224. The second cylindrical body 228 then receives the thermal fluid. When pneumatic pressure is supplied to the second cylindrical body 228 via the pneumatic switch 232, the second cylindrical body 228 pushes the thermal fluid in the opposite direction through the thermal fluid passage 224, and the first cylindrical body 226 receives the thermal fluid. The pneumatic switch 232 constantly alternates its position so that the direction of movement of the thermal fluid through the thermal fluid passage 224 constantly alternates. The heating resistor 220 functions as a heater mounted in a position to heat the thermal chuck 222, heating the thermal fluid. By recirculating the thermal fluid through the thermal fluid passage 224, the thermal chuck 222 supplies uniformly distributed heat to the thermal chuck 34 and ultimately to the wafer 300A.

[0043]

[0051] Figure 5B shows a test apparatus 240 having a slot assembly 242 according to a further embodiment of the present invention. The slot assembly 242, similar to the embodiment in Figure 5A, includes a thermal fluid passage 224, cylindrical bodies 226 and 228, a pneumatic switch 232, and pneumatic interface It has 230. In the embodiment of Figure 5A, the heating resistor 220 is replaced by a heating resistor 244, which is located outside the heat chuck 222 near or around the line 246 connecting the first cylindrical body 226 to the thermal fluid passage 224. The heating resistor 244 is used to continuously heat the thermal fluid in the line 246. In the embodiment of Figure 5B, the thermal fluid is heated more directly than in the embodiment of Figure 5A.

[0044]

[0052] Figure 5C illustrates a test apparatus 340 having a slot assembly 318, which is similar to the slot assembly 218 in Figure 5A except that it includes a cooling element 320. The cooling element is aligned with the thermal fluid passage 224. During use, heat is transferred to the thermal fluid in the thermal fluid passage 224. The heated thermal fluid then flows to the cooling element 320. The cooling element is located within the first closed-loop air passage 120 in Figure 2, so that heat is transferred through the cooling element 320 and then convects into the air in the first closed-loop air passage 120. The cooled thermal fluid then flows through the first and second cylindrical bodies 226 and 228 to the thermal fluid passage 224.

[0045]

[0053] Figures 6A, 6B, and 6C show when and how cartridges 30C, 30D, and 30E are inserted or removed, but all other cartridges are used to test wafer devices and can be subjected to various temperature gradients. The concept is shown in more detail in Figure 7. At time T1, the first cartridge is inserted into frame 14, and the second cartridge is outside frame 14. At T1, heating of the first cartridge begins. Between T1 and T2, the temperature of the first cartridge rises from room temperature, i.e., about 22°C, to a test temperature 50°C to 150°C higher than room temperature at T2. At T2, power is applied to the first cartridge and the device inside the first cartridge is tested. At T3, the second cartridge is inserted into frame 14 and heating of the second cartridge begins. At T4, testing of the first cartridge is completed. Cooling of the first cartridge also begins at T4. At T5, the second cartridge reaches the test temperature, power is supplied to the second cartridge, and the wafer inside the second cartridge is tested. At T6, the second cartridge reaches a temperature close to room temperature and is removed from the frame 14. The third cartridge is then inserted in place of the first cartridge. At T7, the testing of the second cartridge is completed and its cooling begins. At T8, the second cartridge has cooled to or near room temperature and is removed from the frame 14.

[0046]

[0054] Different tests can be performed at different temperatures. For example, a cartridge can be inserted and tested at room temperature. Other tests can be performed over a rising temperature gradient. Further tests can be conducted at rising temperatures. Further tests can be conducted during a decreasing temperature gradient. Two of these tests can be a single test progressing from one temperature stage to the next.

[0047]

[0055] As shown in Figure 8, one slot assembly 18A can be removed from or inserted into the frame 14. Slot assembly 18A can be inserted or removed while other slot assemblies within the frame 14 are being used in wafer testing equipment, as described with reference to Figure 7.

[0048]

[0056] Although certain exemplary embodiments have been described and illustrated in the accompanying drawings, it should be understood that such embodiments are merely illustrative and do not limit the present invention, and that the present invention is not limited to the specific structures and arrangements shown and described, as modifications can be conceived by those skilled in the art. [Explanation of Symbols]

[0049] 10 Test equipment 12 Testing machine 14 frames 18A, 18B Slot Assembly 28A, 28B cartridges 32-slot assembly body 50 Temperature detectors 126 Water cooler 128 Heater 134 Thermal Controllers

Claims

1. A test apparatus, Frame and, A plurality of slot assemblies within the frame, each of which comprises a slot assembly body, A plurality of doors, each attached to a slot assembly body, wherein each door is movable between a closed position that prohibits the movement of each circuit board, which has a miniature electronic circuit and a circuit board terminal connected to the respective miniature electronic circuit, in or out of the frame, and an open position that allows the movement of each circuit board in or out of the frame. Electrical testing machine, Portable cartridge and Equipped with, The aforementioned portable cartridge is A portable cartridge body including first and second components for holding the aforementioned substrate between them, Multiple portable cartridge contacts on the second component, which are aligned with the terminals of the substrate connected to the miniature electronic circuit, A first electrical interface located on the portable cartridge body and connected to the portable cartridge contacts, wherein the portable cartridge body is receivable when the first door of the doors is in the open position held by the frame, and is detachable from the frame when the first door is in the open position, Equipped with, The aforementioned test apparatus further A second electrical interface on each of the aforementioned slot assembly bodies, wherein the second electrical interface is connected to the first electrical interface when the portable cartridge is held by each of the aforementioned slot assembly bodies, and is disconnected from the first electrical interface when the portable cartridge body is removed from each of the aforementioned slot assembly bodies. Equipped with, The electrical tester is connected to the circuit board terminals via the second electrical interface, the first electrical interface, and the portable cartridge contacts, and a signal is transmitted between the electrical tester and the miniature electronic circuit to test the miniature electronic circuit.

2. Each of the aforementioned slot assemblies is A first slot assembly interface is placed on the main body of the slot assembly and connected to the electrical test machine, A hinge attached to the main body of the aforementioned slot assembly, Includes, The test apparatus according to claim 1, wherein one of the doors is attached to the slot assembly body by the hinge, and each door is movable between the respective open position in which the respective substrate can be inserted into the respective slot assembly and the respective closed position in which the door forms part of a sealing wall.

3. The test apparatus according to claim 2, wherein each of the slot assemblies is separately inserted into the frame.

4. The test apparatus according to claim 3, further comprising a front seal between a first slot assembly and a second slot assembly among the plurality of slot assemblies, wherein the front seal forms part of the sealing wall.

5. The test apparatus according to claim 2, wherein each of the slot assemblies includes a temperature correction device, the temperature of which changes when the temperature correction device is activated, creating a temperature difference between the temperature correction device and the substrate, and thereby causing heat transfer between the temperature correction device and the substrate to change the temperature of the substrate.

6. The test apparatus according to claim 5, wherein the temperature correction device is a resistance heating pad.

7. The test apparatus according to claim 5, wherein the temperature correction device includes a thermal chuck having an oil passage through which oil can move.

8. The test apparatus according to claim 7, further comprising an oil actuator for moving the oil through an oil passage.

9. The test apparatus according to claim 7, further comprising a heater installed at a position for heating the oil.

10. The aforementioned portable cartridge is a first portable cartridge, further comprising a second portable cartridge, the second portable cartridge being A portable cartridge body including first and second components for holding each circuit board between them, Multiple portable cartridge contacts on the second component, which are aligned with the terminals of the substrate connected to the miniature electronic circuit, A third electrical interface located on the portable cartridge body and connected to the portable cartridge contacts, wherein the portable cartridge body is receivable when the second door of the doors is in its respective open position, held by the frame, and detachable from the frame when the second door is in its respective open position, Equipped with, The aforementioned test apparatus further A fourth electrical interface on the slot assembly body, which is connected to the third electrical interface when the portable cartridge is held by the frame and disconnected from the third electrical interface when the portable cartridge body is removed from the frame, Equipped with, The test apparatus according to claim 1, wherein the electrical tester is connected to the circuit board terminals via the fourth electrical interface, the third electrical interface, and the portable cartridge contacts, and a signal is transmitted between the electrical tester and the miniature electronic circuit to test the miniature electronic circuit.

11. A method for testing a miniature electronic circuit held on a substrate, The steps include moving each of the multiple doors attached to the body of each of the multiple slot assemblies inserted into the frame between a closed position that prohibits the movement of each circuit board, which has a miniature electronic circuit and a circuit board terminal connected to the miniature electronic circuit, in or out of the frame, and an open position that allows the movement of each circuit board in or out of the frame, The steps include: holding the substrate between first and second components of a portable cartridge body that form part of a portable cartridge, wherein the second component has cartridge contacts that contact the substrate terminals of the substrate; A step of inserting each of the aforementioned circuit boards into the frame, the step of receiving the portable cartridge by the frame with the first door of the plurality of doors in the respective open position, and the first electrical interface on the portable cartridge body connected to the second electrical interface on the slot assembly body; The steps include moving each of the doors between their respective open position and their respective closed position, The steps include connecting an electrical tester to each of the aforementioned circuit board terminals, The steps include: testing the miniature electronic circuit by transmitting signals between the electrical tester and the miniature electronic circuit via the circuit board terminals, cartridge contacts, and first and second electrical interfaces; The steps include moving each of the doors between their respective closed position and their respective open position, A step of removing each of the aforementioned circuit boards from the frame, the step of removing the portable cartridge from the frame with the first door in the respective open position and the first electrical interface of the portable cartridge body disconnected from the second electrical interface of the slot assembly body, The method that includes.

12. The steps include electrically connecting a first slot assembly interface, which is located in each of the multiple slot assembly bodies, to the electrical test machine, A step of moving each of the doors attached to the respective slot assembly body by hinges to the respective open position, wherein each of the circuit boards is inserted into the slot assembly, A step of moving each of the aforementioned doors to their respective closed positions, wherein the doors form part of a sealed wall, The method according to claim 11, further comprising:

13. The method according to claim 12, further comprising the step of inserting the slot assembly into the frame.

14. The method according to claim 13, further comprising the step of arranging a front seal between a first slot assembly and a second slot assembly among the plurality of slot assemblies, wherein the front seal forms part of the sealing wall.

15. The method according to claim 12, further comprising the step of changing the temperature of each of the temperature correction devices of each of the slot assemblies to create a temperature difference between the temperature correction device and the substrate, and heat transfer between the temperature correction device and the substrate, thereby changing the temperature of the substrate.

16. The method according to claim 15, wherein the temperature correction device is a resistance heating pad.

17. The temperature correction device is a thermal chuck. The method according to claim 15, further comprising the step of moving oil through an oil passage in the heat chuck and transferring heat between the oil and the heat chuck.

18. The method according to claim 17, further comprising the step of operating an oil actuator to move the oil.

19. The method according to claim 17, further comprising the step of heating the oil with a heater.

20. The aforementioned portable cartridge is the first portable cartridge, A step of holding a substrate between first and second components of a portable cartridge body that form part of a second portable cartridge, wherein the second component has cartridge contacts that contact the substrate terminals of each substrate, The steps include receiving the portable cartridge by the frame, with the second door of the aforementioned doors in the respective open position, and the third electrical interface on the portable cartridge body connected to the fourth electrical interface on the slot assembly body; The steps include: testing the miniature electronic circuit by transmitting signals between the electrical tester and the miniature electronic circuit via the circuit board terminals, cartridge contacts, and first and second electrical interfaces; The steps include removing the second portable cartridge from the frame while the second door is in the respective open position and the third electrical interface of the portable cartridge body is disconnected from the fourth electrical interface of the slot assembly body, The method according to claim 11, further comprising:

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