Relay movable spring and relay capable of reducing temperature rise

Abstract

To provide a relay with multiple contact structures for reducing the temperature rise.SOLUTION: A relay movable spring capable of reducing temperature rise comprises movable contacts, a movable spring plate, and a movable spring lead-out plate. The movable spring plate has opposite first and second ends. The first end is connected to the movable spring lead-out plate; the movable spring plate comprises at least two current-carrying conductors; at least two movable contacts are provided, which are fixed to the at least two current-carrying conductors respectively, and which are close to the second end of the movable spring plate, so that the movable spring plate forms at least two parallel connection structures; and a connecting sheet is also mounted on the movable spring plate, the connecting sheet connecting to the at least two movable contacts.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to the field of relay technology, and particularly to the movable spring and relay of the relay.

Background Art

[0002] A relay is an electronic control device that has a control system (also called an input circuit) and a controlled system (also called an output circuit), and is generally applied to an automatic control circuit. In fact, a relay is an automatic switch that controls a large current with a small current, and thus plays roles such as automatic adjustment, safety protection, and conversion circuit in a circuit. A relay belongs to an element that is vulnerable to heat. When the allowable temperature is exceeded, the deterioration of the plastic and insulating materials inside the relay accelerates, the contacts are oxidized and corroded, making arc extinction difficult, the technical parameters of the electrical element decay, and the reliability decreases, etc.

[0003] The movable spring in a relay is a member where temperature rise is likely to occur. Many movable springs are all composed of a movable contact, a movable spring plate, and a movable spring lead-out plate. The movable contact is fixed to one end of the movable spring plate, and the other end of the movable spring plate is fixed to the movable spring lead-out plate. In the process of the relay operating, the fixed end of the movable contact of the movable spring plate swings around the other end of the movable spring plate (the fixed end with the movable spring lead-out plate). The movable spring plate is both an operating member and a current carrier body. Therefore, the movable spring plate is the member in the movable spring where temperature rise is most likely to occur. The prior art generally adjusts the rated current within an appropriate range to make the product meet the temperature requirements. With the expansion of the application range of the relay, the relay is also developing in the direction of high load and miniaturization. The improvement of the rated current will inevitably increase the temperature of the movable spring plate. How to effectively reduce the temperature rise of the movable spring plate has become an urgent problem to be solved.

Summary of the Invention

[0004] The object of the present invention is to provide a movable spring for a relay that can reduce temperature rise by solving the shortcomings of the prior art and improving the structure, thereby reducing the effect of temperature rise due to an increase in rated current, meeting the temperature rise requirements, and eliminating the problems such as accelerated deterioration of the plastic and insulating materials inside the relay due to the relay's temperature rise exceeding the requirements, oxidative corrosion of the contacts making arc extinguishing difficult, attenuation of the technical parameters of the electrical element, and decreased reliability. The technical solution used by the present invention to solve its technical problems is as follows: A movable spring for a relay capable of reducing temperature rise, comprising a movable contact, a movable spring plate, and a movable spring lead plate, wherein the movable spring plate has opposing first and second ends, the first end being connected to the movable spring lead plate, the movable spring plate includes at least two current carrier conductors, the movable contacts are at least two and are fixed to the at least two current carrier conductors respectively and are close to the second end of the movable spring plate, thereby the movable spring plate forming at least two parallel connection structures, and a connecting sheet is further attached to the movable spring plate, the connecting sheet being connected to the at least two movable contacts.

[0005] According to one embodiment of the present invention, at least one linear slit extends along the direction from the second end to the first end of the movable spring plate, and the at least one linear slit divides the movable spring plate into at least two current carrier conductors.

[0006] According to one embodiment of the present invention, at least one of the two current carrier conductors of the movable spring plate has a larger width dimension.

[0007] According to one embodiment of the present invention, at least one of the at least two movable contacts has a larger thickness dimension.

[0008] According to one embodiment of the present invention, the movable contact with a large thickness is fixed to the current carrier conductor with a large width.

[0009] According to one embodiment of the present invention, the movable spring plate includes a plurality of stacked sub-spring plates.

[0010] According to one embodiment of the present invention, a U-shaped bend is provided in the middle portion of the movable spring plate.

[0011] According to one embodiment of the present invention, the movable spring plate includes a first sub-spring plate, a second sub-spring plate, a third sub-spring plate, and a fourth sub-spring plate stacked in order, each of the first, second, third, and fourth sub-spring plates being provided with two straight slits, thereby forming three current carrier conductors, and there being two or three movable contacts, each fixed to the corresponding current carrier conductor, thereby forming the movable spring plate as a three-parallel connection structure, the current carrier conductors of the first, second, and third sub-spring plates being provided with U-shaped bends, while the current carrier conductor of the fourth sub-spring plate is not provided with a U-shaped bend.

[0012] According to one embodiment of the present invention, the current carrier conductor of the fourth sub-spring plate is provided with an arc-shaped slit, the arc-shaped slit is located on one side of the movable contact away from the movable spring lead plate, and thereby the end of the current carrier conductor of the fourth sub-spring plate away from the movable spring lead plate can swing elastically.

[0013] Compared to the conventional technology, the beneficial effects of the present invention are as follows:

[0014] In the present invention, the movable spring plate includes at least two current carrier conductors, and the movable contacts are at least two and are fixed to the corresponding current carrier conductors, thereby forming at least two parallel connection structures in the movable spring plate, which reduces the current passing through each current carrier conductor and thereby reduces the temperature rise. Furthermore, a striped connecting sheet is attached to the surface of the movable spring plate that matches the fixed contacts of the relay, and the striped connecting sheet is connected to each movable contact, which ensures that the gap between the contacts matches when the movable contacts and fixed contacts are separated, thereby reducing the problem of the gap between the contacts not matching due to distortion when the push part is pushed. Furthermore, in the movable spring plate of the present invention, the width dimension of at least one of the at least two current carrier conductors is designed to be relatively large, and the thickness dimension of at least one of the at least two movable contacts is designed to be relatively large, and the movable contact with the larger thickness dimension is fixed to the current carrier conductor with the larger width dimension. Such a structure of the present invention can maintain the total resistance of the movable spring plate in a state of low contact resistance, thereby reducing the temperature rise.

[0015] The movable spring of the relay capable of reducing temperature rise according to the present invention, by improving its structure, can reduce the effect of temperature rise on the movable spring plate due to the increase in rated current when the rated current is increased, thereby eliminating problems such as accelerated deterioration of the internal plastic and insulating materials of the relay due to the relay temperature rise exceeding the requirements, oxidative corrosion of the contacts making arc extinguishing difficult, attenuation of the technical parameters of the electrical element, and decreased reliability. According to another aspect of the present invention, a relay comprising a movable spring of the relay capable of reducing the temperature rise of the present invention.

[0016] According to another aspect of the present invention, a relay having a multi-contact structure comprises a base, a magnetic circuit structure, and at least two contact structures, wherein the magnetic circuit structure includes an armature, and each contact structure includes a movable spring. Here, the base is provided with at least two grooves, the same number as the number of contact structures. The at least two grooves are located on opposite sides of the base, and the at least two grooves are arranged alternately in a row. The at least two contact structures are mounted in the at least two grooves, respectively. The magnetic circuit structure is mounted within the base and is interlocked with the movable springs in the at least two contact structures, thereby driving the operation of the corresponding movable springs when the magnetic circuit structure operates.

[0017] According to one embodiment of the present invention, the magnetic path structure and one of the at least two contact structures are mounted in the same groove, a through hole is provided between two adjacent grooves, and the armature is connected to the movable spring by passing through the through hole.

[0018] According to one embodiment of the present invention, a baffle is provided in the groove to which the magnetic circuit structure and the contact structure are mounted, in order to further separate high current and low current, and the baffle is located between the contact structure and the magnetic circuit structure.

[0019] According to one embodiment of the present invention, there are two contact structures, and one contact structure, which is mounted in the same groove as the magnetic path structure, is mounted in the groove closer to the other contact structure than the magnetic path structure.

[0020] According to one embodiment of the present invention, the armature further includes a push portion, the armature is H-shaped, and both ends of the armature are connected to the push portion and to the movable spring via the push portion.

[0021] According to an embodiment of the present invention, the movable spring includes a movable contact, a movable spring plate, and a movable spring lead-out plate. The movable spring plate has opposing first and second ends. The first end is connected to the movable spring lead-out plate. The movable spring plate includes at least two current carrier conductors. There are at least two movable contacts, and they are respectively fixed to the at least two current carrier conductors and are close to the second end of the movable spring plate. Thus, the movable spring plate forms at least two parallel connection structures.

[0022] According to an embodiment of the present invention, at least one linear slit extends along the direction from the second end to the first end of the movable spring plate, and the at least one linear slit divides the movable spring plate into the at least two current carrier conductors.

[0023] According to an embodiment of the present invention, among the at least two current carrier conductors of the movable spring plate, the width dimension of at least one current carrier conductor is large.

[0024] According to an embodiment of the present invention, among the at least two movable contacts, the thickness dimension of at least one movable contact is large.

[0025] According to an embodiment of the present invention, the movable contact with a large thickness dimension is fixed to the current carrier conductor with a large width dimension.

[0026] According to an embodiment of the present invention, a connection sheet is further attached to the movable spring plate, and the connection sheet is connected to the at least two movable contacts.

[0027] According to an embodiment of the present invention, the movable spring plate includes a plurality of laminated sub-spring plates.

[0028] According to an embodiment of the present invention, a U-shaped bending portion is provided in the middle part of the movable spring plate.

[0029] According to an embodiment of the present invention, the movable spring plate includes a first sub-spring plate, a second sub-spring plate, a third sub-spring plate, and a fourth sub-spring plate that are stacked in order. Two linear slits are respectively provided in the first sub-spring plate, the second sub-spring plate, the third sub-spring plate, and the fourth sub-spring plate, thereby forming three current carrier conductors. The movable contacts are two or three, and are respectively fixed to the current carrier conductors of the first sub-spring plate, forming three parallel connection structures in the movable spring plate. Bending portions are respectively provided in the current carrier conductors of the first sub-spring plate, the second sub-spring plate, and the third sub-spring plate, and no bending portion is provided in the current carrier conductor of the fourth sub-spring plate.

[0030] According to an embodiment of the present invention, an arc-shaped slit is provided in the current carrier conductor of the fourth sub-spring plate. The arc-shaped slit is located on a side away from the movable spring lead-out plate of the movable contact, whereby the end of the current carrier conductor of the fourth sub-spring plate away from the movable spring lead-out plate can swing elastically. Compared with the prior art, the beneficial effects of the relay having the multiple contact structure of the present invention are as follows.

[0031] In the present invention, at least two concave grooves that are the same in number as the contact structures are provided in the base, and the at least two concave grooves are respectively provided on opposite sides of the base and are arranged alternately in a row. Each contact structure is respectively mounted in the corresponding concave groove. The magnetic circuit structure is mounted in the base and is respectively interlocked with the movable springs in each contact structure. Such a structure of the present invention spatially separates between each contact structure, and when improving the rated current, reduces the influence of the temperature rise caused by the increase of the rated current, meets the requirements of the temperature rise, accelerates the deterioration of the plastic and insulating materials inside the relay, makes it difficult to extinguish the arc due to the oxidation and corrosion of the contacts, attenuates the technical parameters of the electrical elements, and can eliminate the disadvantages such as the reduction of reliability.

[0032] Furthermore, the movable spring plate in the present invention is divided into at least two current carrier conductors by a slit, and one movable contact is fixed to each current carrier conductor, thereby forming at least two parallel connection structures in the movable spring plate. This structure of the present invention reduces the current passing through each current carrier conductor by designing the contact structure as a parallel connection structure of multiple sets of contacts, thereby reducing the temperature rise.

[0033] Furthermore, the width dimension of one current carrier conductor in the movable spring plate is designed to be larger than the width dimension of the other current carrier conductor, and the thickness dimension of one movable contact is designed to be larger than the thickness dimension of the other movable contact, and the movable contact with the relatively larger thickness dimension is fixed to the current carrier conductor with the relatively larger width dimension. This structure of the present invention can maintain the total resistance of the movable spring plate in a state of low contact resistance, thereby reducing the temperature rise.

[0034] Furthermore, a connecting sheet is attached to the side of the movable spring plate facing the fixed contact, and the connecting sheet is connected between each movable contact. Such a structure of the present invention can ensure that the contact gaps match when separated, and reduces differences in the contact gaps due to distortion during the pushing process of the push part.

[0035] According to another aspect of the present invention, a movable spring for a relay capable of reducing temperature rise includes a movable contact, a movable spring plate, and a movable spring lead plate, one end of the movable spring plate being connected to the movable spring lead plate, the movable spring plate including at least two current carrier conductors, the movable contact being at least two and fixed to each of the at least two current carrier conductors, and a connecting sheet further attached to the movable spring plate, the connecting sheet being connected to the at least two movable contacts.

[0036] According to one embodiment of the present invention, at least one straight slit extends from one end of the movable spring plate toward the end connected to the movable spring pull-out plate, thereby dividing the movable spring plate into at least two current carrier conductors, and thereby the movable spring plate forms at least two parallel connection structures.

[0037] According to one embodiment of the present invention, at least one of the two current carrier conductors of the movable spring plate has a larger width dimension.

[0038] According to one embodiment of the present invention, at least one of the at least two movable contacts has a larger thickness dimension.

[0039] According to one embodiment of the present invention, the movable contact with a large thickness is fixed to the current carrier conductor with a large width.

[0040] According to one embodiment of the present invention, the movable spring plate includes a plurality of stacked sub-spring plates.

[0041] According to one embodiment of the present invention, a U-shaped bend is provided in the middle portion of the movable spring plate.

[0042] According to one embodiment of the present invention, the movable spring plate includes a first sub-spring plate, a second sub-spring plate, a third sub-spring plate, and a fourth sub-spring plate stacked in order, each of the first, second, third, and fourth sub-spring plates having two straight slits, thereby forming three current carrier conductors, the movable contacts being two or three and fixed to the current carrier conductor of the first sub-spring plate, forming three parallel connection structures on the movable spring plate, the current carrier conductors of the first, second, and third sub-spring plates each having a bent portion, while the current carrier conductor of the fourth sub-spring plate does not have a bent portion.

[0043] According to one embodiment of the present invention, the current carrier conductor of the fourth sub-spring plate is provided with an arc-shaped slit, the arc-shaped slit is located on one side of the movable contact away from the movable spring lead plate, and thereby the end of the current carrier conductor of the fourth sub-spring plate away from the movable spring lead plate can swing elastically.

[0044] Compared to conventional technology, the beneficial effects of the relay's movable spring, which can reduce temperature rise, are as follows:

[0045] The movable spring plate in the present invention includes at least two current carrier conductors, and the movable contacts are at least two and fixed to the corresponding current carrier conductors, thereby the movable spring plate forms at least two parallel connection structures to reduce the current passing through each current carrier conductor, and thereby reduce the temperature rise.

[0046] Furthermore, in the movable spring plate, a striped connecting sheet is attached to the surface for engaging with the fixed contacts of the relay. The striped connecting sheet is connected to each movable contact, ensuring that the gap between the movable contact and the fixed contact matches when separated, thereby reducing differences in the contact gap due to distortion during the pushing process of the push section. Furthermore, in the movable spring plate of the present invention, the width dimension of at least one of the at least two current carrier conductors is designed to be relatively large, and the thickness dimension of at least one of the at least two movable contacts is designed to be relatively large. Such a structure of the present invention can maintain the total resistance of the movable spring plate at all times in a state of low contact resistance, thereby reducing the temperature rise.

[0047] The present invention will be described in more detail below with reference to the attached drawings and embodiments. However, the relay having the multi-contact structure of the present invention is not limited to the embodiments. [Brief explanation of the drawing]

[0048] The above and other features and advantages of the present invention will become more apparent by describing in detail exemplary embodiments thereof with reference to the accompanying drawings. [Figure 1] Figure 1 is a schematic diagram of the assembly structure of one embodiment of the movable spring for a relay capable of reducing temperature rise according to the present invention. [Figure 2] Figure 2 is an exploded schematic diagram of the three-dimensional structure of one embodiment of the movable spring for a relay capable of reducing temperature rise according to the present invention. [Figure 3] Figure 3 is a schematic exploded view of one embodiment of the relay of the present invention. [Figure 4] Figure 4 is a schematic exploded view (180-degree inverted) of one embodiment of the relay of the present invention. [Figure 5] Figure 5 is a schematic diagram of the three-dimensional structure of the base of one embodiment of the relay of the present invention. [Figure 6] Figure 6 is a schematic diagram (180-degree inverted) of the three-dimensional structure of the base of one embodiment of the relay of the present invention. [Modes for carrying out the invention]

[0049] The exemplary embodiments will be described in more detail below with reference to the attached drawings. However, the exemplary embodiments can be carried out in many forms and should not be construed as being limited to the embodiments described herein. In this specification, relative terms such as “top” and “bottom” are used to describe the relative relationship between one component of an icon and another, but it should be understood that these terms are used herein simply for convenience, for example, according to the orientation of the example shown in the figures. It can be understood that if the device of the icon is inverted so that it is upside down, the component described as “top” becomes the component that is “bottom.” Other relative terms, such as “top” and “bottom,” have similar meanings. When one structure is “top” another structure, it may mean that one structure is integrally formed with the other structure, or that one structure is “directly” installed on the other structure, or that one structure is “indirectly” installed on the other structure via the other structure.

[0050] The terms “one,” “the one,” “the said,” and “the said” are used to indicate the existence of one or more elements / components / etc., the terms “includes” and “have” are used to indicate a non-restrictive, comprehensive meaning, meaning that in addition to the listed elements / components / etc., there may be additional elements / components / etc., the same as “first,” “second,” etc. are used simply as notation and do not imply a quantitative limitation on their subject.

[0051] The relay having a multi-contact structure of the present invention includes a base, a magnetic circuit structure, and at least two contact structures. The base is provided with at least two grooves, the same number as the number of contact structures. The at least two grooves are located on opposite sides of the base, and the at least two grooves are arranged alternately in a row. The at least two contact structures are each mounted in at least two grooves. The magnetic circuit structure is mounted on the base and is interlocked with the movable springs in the at least two contact structures, thereby driving the operation of the corresponding movable springs when the magnetic circuit structure operates. The following description will use a relay having two contact structures as an example.

[0052] As shown in Figures 1 and 2, the movable spring of the relay capable of reducing temperature rise according to the present invention includes a movable contact 51, a movable spring plate 52, and a movable spring lead plate 53, etc. The movable spring plate 52 has opposing first and second ends, the first end of which is connected to the movable spring lead plate 53, and the other second end of the movable spring plate 52 is fixedly connected to the movable contact 51.

[0053] The movable spring plate is divided into at least two current carrier conductors by at least one straight slit extending from the second end toward the first end connected to the movable spring lead plate. There are at least two movable contacts, each fixed to a corresponding current carrier conductor, thereby dividing the movable spring plate into two parallel connection structures. Of the at least two current carrier conductors, at least one has a larger width dimension, and of the at least two movable contacts, at least one has a larger thickness dimension, with the movable contact having a relatively larger thickness being fixed to the current carrier conductor having a relatively larger width dimension.

[0054] In one embodiment, as shown in Figure 1, the movable spring plate 52 is provided with two slits 521 extending from the second end toward the first end connected to the movable spring lead plate 53, thereby dividing the movable spring plate 52 into three current carrier conductors 522. There are three movable contacts, each fixed to a corresponding current carrier conductor 522, thereby dividing the movable spring plate 52 into three parallel connection structures.

[0055] In one embodiment, of the three current carrier conductors of the movable spring plate 52, the width dimension of one current carrier conductor is designed to be larger than the width dimensions of the other two current carrier conductors 522. Of the three movable contacts 51, the thickness dimension of one movable contact is designed to be larger than the thickness dimensions of the other two movable contacts, and the movable contact with the relatively larger thickness dimension is fixed to the current carrier conductor with the relatively larger width dimension.

[0056] In one embodiment, a connecting sheet 54 is further attached to the side of the movable spring plate 52 facing the fixed contact, and the connecting sheet 54 is connected between each movable contact 51. This structure ensures contact between multiple sets of contacts, and when the movable contacts and fixed contacts are separated, the connecting sheet 54 connects each movable contact integrally, ensuring that each movable contact acts together and maintains a consistent gap between the movable contacts and fixed contacts, and that when closed, the contacts in a single path do not interfere with each other.

[0057] In one embodiment, the movable spring plate 52 is constructed by stacking four sub-spring plates.

[0058] In one embodiment, a U-shaped bent portion 56 is further provided in the middle part of the movable spring plate 52.

[0059] In one embodiment, the movable spring plate 52 includes a first sub-spring plate 551, a second sub-spring plate 552, a third sub-spring plate 553, and a fourth sub-spring plate 554, which are stacked in order. Here, the first sub-spring plate 551, the second sub-spring plate 552, the third sub-spring plate 553, and the fourth sub-spring plate 554 are each provided with two straight slits 521, thereby forming three current carrier conductors in each sub-spring plate, and there are three movable contacts 51, each fixed to the corresponding current carrier conductor, thereby forming the movable spring plate 52 as three parallel connection structures. The current carrier conductors of the first sub-spring plate 551, the second sub-spring plate 552, and the third sub-spring plate 553 are each provided with a U-shaped bend 56, while the current carrier conductor of the fourth sub-spring plate 554 is not provided with a U-shaped bend.

[0060] The current carrier conductor of the fourth sub-spring plate 554 is provided with an arc-shaped slit 541, which is located on one side of the movable contact 51 away from the movable spring lead plate 53, thereby allowing the end of the current carrier conductor of the fourth sub-spring plate 554 that is away from the movable spring lead plate 53 to swing elastically.

[0061] This invention reduces the current passing through each current carrier conductor by designing the movable spring plate 52 in a parallel connection structure of multiple sets of contacts, thereby reducing the temperature rise. By connecting the striped connection sheet 54 between each movable contact 51, it is possible to ensure that the contact gaps match when the movable contacts and fixed contacts are separated, thereby reducing the problem of mismatch in contact gaps due to distortion during the pushing process of the push part.

[0062] The movable spring of the relay capable of reducing temperature rise according to the present invention is designed such that the width dimension of at least one of the at least two current carrier conductors 522 of the movable spring plate 52 is relatively large, and the thickness dimension of at least one of the at least two movable contacts 51 is relatively large. By designing the width dimension of at least one current carrier conductor 522 to be relatively large and the thickness dimension of at least one movable contact 51 to be relatively large, the total resistance of the movable spring plate 52 can be maintained in a state of low contact resistance, thereby reducing the temperature rise.

[0063] Conventional relays use a single magnetic circuit mechanism to simultaneously operate two contact structures in conjunction. These relays mount the magnetic circuit mechanism and the two contact structures in grooves on the same side of the base, with baffles between the magnetic circuit mechanism and the contact structures, and between the two contact structures themselves. However, because the magnetic circuit mechanism and the two contact structures are located on the same side of the base, when the relay operates, the electronic components generate heat due to the passage of current. Thus, the temperature rise caused by the magnetic circuit mechanism and the two contact structures is superimposed on the same side of the base. Conventional technology generally meets temperature rise requirements by adjusting the rated current within an appropriate range. As the range of relay applications expands, relays are also developing towards higher load capacity and miniaturization. The increase in rated current inevitably causes a temperature rise inside the relay. Therefore, how to reduce the temperature rise while keeping the overall volume of the relay unchanged is an urgent issue that needs to be addressed.

[0064] The present invention further provides a relay with a multi-contact structure, and by improving the structure, it is possible to reduce the effect of temperature rise due to an increase in rated current, meet the temperature rise requirements, and eliminate problems such as accelerated deterioration of the plastic and insulating materials inside the relay due to the relay temperature rise exceeding the requirements, oxidative corrosion of the contacts making arc extinguishing difficult, attenuation of the technical parameters of the electrical element, and decreased reliability.

[0065] As shown in Figures 3 to 6, the relay structure of the present invention has two contact structures, and the relay includes a base 1, a magnetic path structure 2, a first contact structure 3, and a second contact structure 4. The base 1 has two opposing sides, for example, a front and a back. A first groove 11 is provided on the front of the base 1, and a second groove 12 is provided on the back of the base 1, with a through hole 13 provided between the first groove 11 and the second groove 12. The first groove 11 and the second groove 12 are arranged alternately in a row, that is, the projections of the first groove 11 and the second groove 12 onto one side of the base 1, for example, the front, are arranged in a row and do not overlap each other. In some other embodiments, for example, when there are multiple first grooves 11 and multiple second grooves 12, one second groove 12 is interposed between two adjacent first grooves 11, and one first groove 11 is interposed between two adjacent second grooves 12. The second contact structure 4 is mounted in the second groove 12.

[0066] The first contact structure 3 is mounted in the first groove 11. The magnetic path structure 2 is mounted in the first groove 11. In some other embodiments, the magnetic path structure 2 may be mounted in other locations on the base 1. The armature in the magnetic path structure is connected to the movable spring 31 in the first contact structure 3. The armature in the magnetic path structure 2 passes through the through hole 13 and is connected to the movable spring 41 in the second contact structure 4. When the magnetic path structure 2 is operated, it can drive the operation of the movable springs 41 in the two contact structures. In this invention, the two contact structures are mounted in different spatial locations on the base 1 to achieve isolation from each other and reduce the temperature rise due to the increase in rated current.

[0067] In one embodiment, the magnetic path structure 2 further includes a push portion, and the armature in the magnetic path structure 2 is H-shaped, with both ends of the armature 2 connected to one push portion each, and connected to movable springs in two contact structures via the corresponding push portions. The through hole 13 is provided at the end position of one end of the armature.

[0068] In one embodiment, as shown in Figures 3 and 4, the first contact structure 3 includes a movable spring 31 and a fixed spring 32. The second contact structure 4 includes a movable spring 41 and a fixed spring 42. The movable springs 31 and 41 in the two contact members each include a movable contact, a movable spring plate, and a movable spring extension plate. Taking the movable spring 31 as an example, the movable spring 31 includes a movable contact 51, a movable spring plate 52, and a movable spring extension plate 53. The movable spring plate 52 has opposing first and second ends, the first end being connected to the movable spring extension plate 53, and the second end of the movable spring plate 52 being fixedly connected to the movable contact 51. The fixed springs 32 and 42 in the two contact structures each include a fixed contact and a fixed spring extension plate. Taking the fixed spring 32 as an example, the fixed spring 32 includes a fixed contact 61 and a fixed spring extension plate 62.

[0069] The movable spring 31 and the fixed spring 32 are respectively inserted into one side of the base 1 in the first groove 11, and the movable contact 51 and the fixed contact 61 are aligned (i.e., positioned relative to each other), with the movable spring pull-out plate 53 of the movable spring 31 and the fixed spring pull-out plate 62 of the fixed spring 32 extending outside the base 1. The movable spring 41 and the fixed spring 42 are respectively inserted into the other side of the base 1 in the second groove 12, with the movable contact and the fixed contact aligned in a similar manner, with the pull-out plates of the movable spring 41 and the fixed spring 42 extending outside the base 1.

[0070] In one embodiment, as shown in Figures 3 and 5, a baffle 14 is provided in the first groove 11 to further separate high and low currents, the baffle 14 is separated between the first contact structure 3 and the magnetic path structure 2, and the mounting position of the first contact structure 3 in the first groove 11 is close to the second contact structure 4 relative to the magnetic path structure 2.

[0071] In one embodiment, as shown in Figures 2 and 3, taking the movable spring 31 as an example, the movable spring plate 52 is provided with two slits 521 extending from the second end toward the first end connected to the movable spring lead plate 53, thereby dividing the movable spring plate 52 into three current carrier conductors 522. There are three movable contacts, each fixed to a corresponding current carrier conductor 522, thereby dividing the movable spring plate 52 into three parallel connection structures.

[0072] In one embodiment, the width dimension of one of the three current carrier conductors of the movable spring plate 52 is designed to be larger than the width dimension of the other two current carrier conductors 522.

[0073] In one embodiment, the thickness of one of the three movable contacts 51 is designed to be larger than the thickness of the other two movable contacts.

[0074] In one embodiment, a movable contact with a relatively large thickness is fixed to a current carrier conductor with a relatively large width.

[0075] In one embodiment, a connecting sheet 54 is further attached to the side of the movable spring plate 52 facing the fixed contact, and the connecting sheet 54 is connected between each movable contact 51. This structure ensures contact between multiple sets of contacts, and when the movable contacts and fixed contacts are separated, the connecting sheet 54 connects each movable contact integrally, ensuring that each movable contact acts together and maintains a consistent gap between the movable contacts and fixed contacts, and that when closed, the contacts in a single path do not interfere with each other.

[0076] In one embodiment, the movable spring plate 52 is constructed by stacking four sub-spring plates.

[0077] In one embodiment, a U-shaped bent portion 56 is further provided in the middle part of the movable spring plate 52.

[0078] In one embodiment, the movable spring plate 52 includes a first sub-spring plate 551, a second sub-spring plate 552, a third sub-spring plate 553, and a fourth sub-spring plate 554, which are stacked in order. Here, the first sub-spring plate 551, the second sub-spring plate 552, the third sub-spring plate 553, and the fourth sub-spring plate 554 are each provided with two straight slits 521, thereby forming three current carrier conductors in each sub-spring plate, and there are three movable contacts 51, each fixed to the corresponding current carrier conductor, thereby forming three parallel connection structures in the movable spring plate 52. The current carrier conductors of the first sub-spring plate 551, the second sub-spring plate 552, and the third sub-spring plate 553 are each provided with a U-shaped bend 56, while the current carrier conductor of the fourth sub-spring plate 554 is not provided with a U-shaped bend.

[0079] The current carrier conductor of the fourth sub-spring plate 554 is provided with an arc-shaped slit 541, which is located on one side of the movable contact 51 away from the movable spring lead plate 53, thereby allowing the end of the current carrier conductor of the fourth sub-spring plate 554 that is away from the movable spring lead plate 53 to swing elastically.

[0080] The relay having a multi-contact structure of the present invention has a first groove 11 and a second groove 12 installed on a base 1, and the first groove 11 and the second groove 12 are alternately distributed on two opposing sides of the base and arranged in a row. Of the two contact structures, the first contact structure 3 and the magnetic path structure 2 are both attached to the first groove 11, and the armature in the magnetic path structure 2 is connected to a movable spring in one of the contact structures 3, and the second contact structure 4 of the two contact structures is attached to the second groove 12, and a through hole 13 is provided between the first groove 11 and the second groove 12, and the armature in the magnetic path structure 2 passes through the through hole 13 and is connected to a movable spring in the other contact structure 4. Such a structure of the present invention spatially separates the two contact structures, and when the rated current is increased, it reduces the effect of temperature rise due to the increase in rated current, satisfies the temperature rise requirement, and eliminates problems such as accelerating the deterioration of the internal plastic and insulating materials of the relay due to the relay's temperature rise exceeding the requirement, causing the contacts to oxidize and corrode, making arc extinguishing difficult, attenuating the technical parameters of the electrical element, and reducing reliability.

[0081] The relay having a multi-contact structure of the present invention has at least one slit 521 extending from the movable spring plate 52, thereby dividing the movable spring plate 52 into at least two current carrier conductors 522. There are at least two movable contacts 51, each fixed to a corresponding current carrier conductor 522, thereby dividing the movable spring plate into at least two parallel connection structures. Such a structure of the present invention reduces the current flowing through each current carrier conductor by designing the contact structure as a multiple set of parallel contact structures, thereby reducing the temperature rise.

[0082] The relay having a multi-contact structure of the present invention is designed such that, in each current carrier conductor 522 of the movable spring plate 52, the width dimension of one current carrier conductor is designed to be larger than the width dimension of the other current carrier conductors, and in each movable contact 51, the thickness dimension of one movable contact is designed to be larger than the thickness dimension of the other movable contacts, and the movable contact with a relatively larger thickness dimension is fixed to the current carrier conductor with a relatively larger width dimension. Such a structure of the present invention can always maintain the total resistance of the movable spring plate in a state of low contact resistance, thereby reducing the temperature rise.

[0083] In the relay having a multi-contact structure of the present invention, a connecting sheet 54 is further attached to the surface of the movable spring plate 52 facing the fixed contacts, and the connecting sheet 54 is connected between each movable contact 51. Such a structure of the present invention can ensure that the contact gaps match when separated, and reduces variations in the contact gap difference due to the push of the push part not being horizontal. When a relay with a multi-contact structure has three contact structures, the base is provided with three grooves, which are alternately distributed along opposing surfaces (i.e., front and back) of the base, and the three grooves are positioned in the same row on the base. The first contact structure of the three contact structures is attached to the first groove on the front of the base, the second contact structure is attached to one groove on the back of the base, and the third contact structure is attached to the second groove on the front of the base. For two adjacent contact structures, for example, the first and second contact structures are located on the back of the base and are spatially separated. For two spaced-apart contact structures, for example, the first and third contact structures are spatially separated by the first and second grooves on the front of the base and one groove on the back of the base, and therefore the first and third contact structures are also spatially separated.

[0084] When a relay has four contact structures, four grooves are provided in the base, and the four grooves are distributed alternately along opposing surfaces (i.e., the front and back) of the base, and the four grooves are located in the same row on the base. The first contact structure of the four contact structures is attached to the first groove on the front of the base, the second contact structure is attached to the first groove on the back of the base, the third contact structure is attached to the second groove on the front of the base, and the fourth contact structure is attached to the second groove on the back of the base. As described above, two adjacent contact structures and two spaced-apart contact structures are all spatially separated.

[0085] The same applies if the relay has five or more contact structures.

[0086] Furthermore, the present invention is not limited to the detailed structure and arrangement of the components described herein. The present invention may have other embodiments and can be carried out and implemented in various ways. The aforementioned variations and modifications are intended to be within the scope of the present invention. It should be understood that the present invention disclosed and defined herein may have any two or more individual features described or revealed herein and / or in the drawings that are interchangeable combinations. All of these different combinations constitute multiple interchangeable aspects of the present invention. The embodiments described herein represent the best known modes for carrying out the present invention and enable those skilled in the art to utilize the present invention.

Claims

1. A relay having a multi-contact structure, comprising a base, a magnetic circuit structure and at least two contact structures, The base is provided with at least two grooves, the same number as the number of contact structures, and these at least two grooves are alternately arranged on opposing surfaces of the base, with each groove located in the same row of the base. Each contact structure is mounted in its corresponding groove, and the magnetic circuit structure is mounted within the base and operates in conjunction with a movable spring in each contact structure, thereby driving the operation of the corresponding movable spring when the magnetic circuit structure operates, spatially separating the mounting positions of each contact structure, and reducing the temperature rise due to an increase in rated current. A relay having a multi-contact structure characterized by the above.

2. The magnetic circuit structure and one of the at least two contact structures are mounted in the same groove, and the armature in the magnetic circuit structure is connected to a movable spring in one of the contact structures to actuate the corresponding movable spring when the magnetic circuit structure operates, and in each groove, through holes are provided between adjacent grooves, and the armature in the magnetic circuit structure passes through the corresponding through holes and is connected to the movable spring in the contact structure in the corresponding groove to actuate the corresponding movable spring when the magnetic circuit structure operates. A relay having a multi-contact structure as described in feature 1.

3. In the groove into which the magnetic circuit structure and one contact structure are attached, a baffle is provided to further separate high and low currents, and the baffle is located between the one contact structure and the magnetic circuit structure. A relay having a multi-contact structure as described in feature 2.

4. The aforementioned contact structure consists of two contact structures, and the mounting position of one contact structure in the groove is closer to the other contact structure than the magnetic path structure. A relay having a multi-contact structure as described in feature 3.

5. The armature in the magnetic circuit structure is H-shaped, and both ends of the armature are connected to push portions, and via the corresponding push portions to a movable spring in the corresponding contact structure, and the through hole is provided at a position corresponding to the armature. A relay having a multi-contact structure as described in feature 4.

6. The movable spring in the at least two contact structures includes a movable contact, a movable spring plate, and a movable spring extension plate, one end of the movable spring plate is connected to the movable spring extension plate, the other end of the movable spring plate fixes the movable contact, and at least one straight slit extends from the end of the movable spring plate toward the connection point with the movable spring extension plate, dividing the movable spring plate into at least two current carrier conductors, and there are at least two movable contacts, each fixed to a corresponding current carrier conductor, thereby forming at least two parallel connection structures in the movable spring plate. A relay having a multi-contact structure as described in feature 1.

7. Of the at least two current carrier conductors of the movable spring plate, at least one current carrier conductor has a larger width dimension. A relay having a multi-contact structure as described in feature 6.

8. Of the at least two movable contacts, at least one of the movable contacts has a larger thickness dimension. A relay having a multi-contact structure as described in feature 7.

9. The aforementioned movable contact with a large thickness is fixed to the aforementioned current carrier conductor with a large width. A relay having a multi-contact structure as described in feature 8.

10. A connecting sheet is further attached to the surface of the movable spring plate facing the fixed contact, and the connecting sheet is connected between each movable contact. A relay having a multi-contact structure as described in feature 6.

11. The aforementioned movable spring plate is formed by stacking multiple spring plates. A relay having a multi-contact structure according to any one of claims 6 to 10.

12. A U-shaped bend is provided in the middle portion of the aforementioned movable spring plate. A relay having a multi-contact structure as described in feature 11.

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