Cover tapes and packaging materials for electronic component packaging

Abstract

To provide an electronic component packaging cover tape having high antistatic performance, and capable of suppressing blocking.SOLUTION: An electronic component packaging cover tape has a substrate layer 2, a heat seal layer 3 arranged on one surface side of the substrate layer, and an antistatic layer 4 arranged on the surface side opposite to the surface on the heat seal layer of the substrate layer, wherein the antistatic layer contains a conductive polymer, and the electronic component packaging cover tape has a tack force T1 [gf] of the first surface 1A that is a surface on the side where the antistatic layer is arranged, the tack force T2 [gf] of the second surface 1B, which is the surface on which the heat seal layer is arranged, and a static friction coefficient S[-] between the first surface and the second surface satisfies T1×T2×S≤10, and the surface resistivity of the first surface satisfies less than 1×1010 Ω / square.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] This disclosure relates to cover tapes for packaging electronic components and packaging using the same. [Background technology]

[0002] In recent years, electronic components such as ICs, resistors, transistors, diodes, capacitors, and piezoelectric resistors are packaged using tape and then surface mounted. In tape packaging, electronic components are placed in a carrier tape having multiple compartments for storing the components. The carrier tape is then heat-sealed with a cover tape to obtain a package for storing and transporting the electronic components. When mounting the electronic components, the cover tape is peeled off from the carrier tape, and the electronic components are automatically removed and surface mounted onto the substrate. The cover tape is also called a top tape.

[0003] Furthermore, in taping packaging, static electricity can be generated not only through friction and contact between electronic components and carrier tape or cover tape, but also when the cover tape is peeled off the carrier tape during mounting. Therefore, various antistatic cover tapes have been proposed to suppress the generation of static electricity (see, for example, Patent Documents 1-3).

[0004] Furthermore, cover tapes are usually stored and transported in a rolled state before being heat-sealed to the carrier tape, in order to save space and reduce replacement work. In this process, sticking (blocking) may occur between the tapes. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2020-121727 [Patent Document 2] Japanese Patent Publication No. 2019-59210 [Patent Document 3] Japanese Patent Publication No. 2019-199013 [Overview of the project] [Problems that the invention aims to solve]

[0006] The antistatic layer may contain, for example, a binder resin to ensure adhesion to the substrate layer. Antistatic layers containing binder resin have poor slipperiness and, due to their low surface roughness and good flatness, are prone to blocking. Adding a lubricant to the antistatic layer can be considered to suppress blocking, but depending on the type and amount of lubricant, the antistatic performance of the antistatic layer may deteriorate. Therefore, it has been difficult to obtain a cover tape with high antistatic performance while suppressing blocking.

[0007] This disclosure is made in view of the above circumstances and aims to provide a cover tape for packaging electronic components that has high antistatic performance and can suppress blocking. [Means for solving the problem]

[0008] One embodiment of the present disclosure is a cover tape for packaging electronic components, comprising a base layer, a heat seal layer disposed on one side of the base layer, and an antistatic layer disposed on the side of the base layer opposite to the side of the heat seal layer, wherein the antistatic layer contains a conductive polymer, and the cover tape for packaging electronic components satisfies T1 × T2 × S ≤ 10 for the tack force T1 [gf] of the first surface, which is the surface on which the antistatic layer is disposed, the tack force T2 [gf] of the second surface, which is the surface on which the heat seal layer is disposed, and the static friction coefficient S [-] between the first surface and the second surface, and the surface resistivity of the first surface is 1 × 10 10 This is a cover tape for packaging electronic components that satisfies the requirement of less than Ω / □.

[0009] One embodiment of the present disclosure is a packaging body comprising a carrier tape having a plurality of storage compartments for storing electronic components, electronic components stored in the storage compartments, and the above-mentioned cover tape for packaging electronic components, which is arranged to cover the storage compartments. [Effects of the Invention]

[0010] This disclosure offers the advantage of providing a cover tape for packaging electronic components that has high antistatic performance and can suppress blocking. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic cross-sectional view illustrating an example of a cover tape for packaging electronic components according to the present disclosure. [Figure 2] These are schematic plan views and cross-sectional views illustrating the packaging of the present disclosure. [Figure 3] This is a schematic cross-sectional view illustrating an example of a cover tape for packaging electronic components according to the present disclosure. [Figure 4] This is a diagram illustrating the blocking evaluation method in the embodiment. [Modes for carrying out the invention]

[0012] Embodiments of this disclosure will be described below with reference to drawings and other figures. However, this disclosure can be implemented in many different ways and should not be interpreted as being limited to the embodiments described below. In addition, in order to make the explanation clearer, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual form, but these are merely examples and should not limit the interpretation of this disclosure. Furthermore, in this specification and each figure, elements similar to those described above with respect to previously shown figures will be denoted by the same reference numerals, and detailed explanations may be omitted as appropriate.

[0013] In this specification, when expressing the manner of arranging one member above another member, if simply denoted as "above" or "below", unless otherwise specified, it includes both the case where another member is arranged directly above or below so as to contact the one member, and the case where another member is arranged above or below the one member via yet another member. Further, in this specification, when expressing the manner of arranging one member on the surface of another member, if simply denoted as "on the surface side" or "on the surface", unless otherwise specified, it includes both the case where another member is arranged directly above or below so as to contact the one member, and the case where another member is arranged above or below the one member via yet another member.

[0014] Hereinafter, the cover tape for packaging electronic components and the package of the present disclosure will be described in detail. In this specification, the "cover tape for packaging electronic components" may sometimes be simply referred to as the "cover tape".

[0015] As a result of intensive studies by the present inventors, it has been found that blocking is likely to occur when the tack force of each of the surface on the antistatic layer side and the surface on the heat-sealing layer side is high. Further, in addition to the tack force of the surface on the antistatic layer side and the tack force of the surface on the heat-sealing layer side, it has been found that the coefficient of static friction between the surface on the antistatic layer side and the surface on the heat-sealing layer side affects blocking.

[0016] Then, through further repeated studies, it has been found that blocking can be suppressed by making the value obtained by multiplying the tack force of the surface on the antistatic layer side of the cover tape, the tack force of the surface on the heat-sealing layer side, and the coefficient of static friction between the surface on the antistatic layer side and the surface on the heat-sealing layer side be less than a predetermined value, and the present invention has been completed.

[0017] A. Cover Tape for Packaging Electronic Components Hereinafter, the cover tape of the present disclosure will be described with reference to the drawings. Figure 1 is a schematic cross-sectional view showing an example of the cover tape of the present disclosure. As shown in Figure 1, the cover tape 1 of the present disclosure has a base layer 2, a heat seal layer 3 disposed on one side of the base layer 2, and an antistatic layer 4 disposed on the side of the base layer 2 opposite to the side of the heat seal layer 3. Furthermore, as shown in Figure 3, the cover tape of the present disclosure may have an intermediate layer 5 between the base layer 2 and the heat seal layer 3.

[0018] The cover tape 1 of this disclosure satisfies the following condition: the tack force T1 of the first surface 1A, which is the surface on which the antistatic layer 4 is placed, the tack force T2 of the second surface 1B, which is the surface on which the heat seal layer 3 is placed, and the static friction coefficient S between the first surface 1A and the second surface 1B, are T1 × T2 × S ≤ 10, and the surface resistivity of the first surface 1A is 1 × 10 10 It is characterized by satisfying the condition less than Ω / □.

[0019] In this disclosure, the first surface is, but is not limited to, the surface of an antistatic layer. The second surface is, but is not limited to, the surface of a heat seal layer.

[0020] Figures 2(a) and (b) are schematic plan and cross-sectional views showing an example of a package using the cover tape for packaging electronic components of this disclosure, and Figure 2(b) is a cross-sectional view taken along line AA of Figure 2(a). As shown in Figures 2(a) and (b), the package 10 comprises a carrier tape 11 having a plurality of storage compartments 12 for storing electronic components 13, electronic components 13 stored in the storage compartments 12, and a cover tape 1 arranged to cover the storage compartments 12. The cover tape 1 is heat-sealed to the carrier tape 11, and heat-sealed portions 3h are provided in a linear shape with a predetermined width at both ends of the heat-seal layer 3 of the cover tape 1. In addition, the carrier tape 11 in the package 10 may have feed holes 14.

[0021] With such a cover tape as disclosed herein, blocking can be suppressed by adjusting each parameter so that T1 × T2 × S ≤ 10. Furthermore, since the first surface of the cover tape disclosed herein has a surface resistivity of less than a predetermined value, it has high antistatic performance.

[0022] I. T1×T2×S The cover tape of this disclosure satisfies T1 × T2 × S ≤ 10, where T1 is the tack force of the first surface 1A, T2 is the tack force of the second surface 1B, and S is the static friction coefficient between the first surface 1A and the second surface 1B. By using the value of T1 × T2 × S as an indicator, it is possible to consider both the tack force T1 of the first surface and the tack force T2 of the second surface acting in the vertical direction, as well as the static friction coefficient S acting in the planar direction, thereby suppressing blocking.

[0023] Furthermore, even if the parameters T1, T2, and S are not each below a predetermined value, they can be adjusted so that their product is 10 or less. For example, if the tack force T1 of the first surface is a specific value, and the tack force T2 of the second surface is large, then the static friction coefficient S between the first and second surfaces should be reduced. If the static friction coefficient S is large, then the tack force T2 of the second surface should be reduced. Also, if the tack force T2 of the second surface is a specific value, and the tack force T1 of the first surface is large, then the static friction coefficient S between the first and second surfaces should be reduced. If the static friction coefficient S is large, then the tack force T1 of the first surface should be reduced. As a result, the selection of compositions for the antistatic layer and heat seal layer is broadened, and it becomes easier to adjust other parameters to the desired range.

[0024] The above T1 × T2 × S is preferably 9.95 or less. On the other hand, for example, it may be 3.00 or more.

[0025] (1) Tack force T1 of the first surface The tack force T1 of the first surface, which is the surface on which the antistatic layer of the cover tape of this disclosure is located, is preferably small, specifically 2.0 gf or less, preferably 1.5 gf or less, and more preferably 1.1 gf or less.

[0026] (2) Tack force T2 of the second surface The tack force T2 of the second surface, which is the surface on which the heat seal layer of the cover tape of this disclosure is located, is preferably small, specifically 30 gf or less, preferably 27 gf or less, and more preferably 20 gf or less.

[0027] The tack force of the first and second surfaces is the adhesive force per unit area of ​​the surface at 80°C. Measuring at 80°C makes the differences in tack force between materials more pronounced. The tack force is measured using a tacking tester (TAC-2, RHESCA) under the following measurement conditions and procedure.

[0028] (Measurement conditions) Pressurization (compression) speed: 30 mm / min Pressure applied: 200gf Pressurization time: 10s Measurement (detachment) speed: 30 mm / min Measurement contact part (probe): Cylindrical diameter 5 mm, SUS304 Temperature conditions: Probe temperature 80°C, sample stage temperature 80°C (sample temperature 80°C) Sample storage before measurement: Store for at least 24 hours in a 25°C, 40% RH environment. Measurement environment: 25±2℃, 40±5%RH environment

[0029] (Measurement procedure) • Tack force T1 of the first surface Cut the cover tape to 50mm x 20mm to obtain a sample. With the antistatic layer side (first surface) of the sample facing upwards, use 3M™ heat-resistant polyimide tape 7414 to attach the tape flatly to the four corners or four sides of the sample, ensuring that the polyimide tape does not extend beyond the edge of the slide glass. Place the sample on the stage of the measuring device using the device's mounting brackets, bring the probe into contact with the sample from above under the above measurement conditions, and then remove the probe from the sample under the above measurement conditions. The load value received by the probe at this time is obtained.

[0030] • Tack force T2 on the second surface Cut the cover tape to 50mm x 20mm to obtain a sample. With the heat-sealed side of the sample (second surface) facing upwards, apply 3M™ heat-resistant polyimide tape 7414 to the four corners or four sides of the sample, ensuring that the polyimide tape does not extend beyond the edge of the slide glass, using 76 x 26mm, 0.8~1.0mmt to ensure that the tape is flat. Place the sample on the stage of the measuring device using the device's mounting brackets, bring the probe into contact with the sample from above under the above measurement conditions, and then remove the probe from the sample under the above measurement conditions. The load value received by the probe at this time is obtained.

[0031] (3) Static friction coefficient S The static friction coefficient S between the first surface 1A and the second surface 1B of the cover tape of this disclosure is the value obtained by preparing two flat test pieces for each sample of the cover tape and measuring the static friction coefficient between the first surface and the second surface of each test piece using the following measurement method.

[0032] (Measurement method) The measurement will be performed using a measuring instrument manufactured by Toyo Seiki Seisakusho (model number: Friction Measuring Machine TR) under the following measurement conditions, in accordance with the method specified in JIS K7125:1999. In this case, the weight placed on top of two test specimens, with the first surface 1A of one test specimen facing the second surface 1B of the other test specimen, will be 200g. The pulling speed of the upper of the two stacked test specimens will be 100mm / min. (Measurement conditions) Measurement speed: 100mm / min Measurement weight: 200gf Scanning distance: 50mm Measurement environment: 24±2℃, 50±10%RH environment

[0033] The method for achieving T1 × T2 × S ≤ 10 requires reducing each of T1, T2, and S as long as the surface resistivity of the first surface is less than a predetermined value.

[0034] The above T1 can be adjusted by the composition and surface shape of the antistatic layer. Methods to reduce T1 include, for example, adding an antiblocking agent or lubricant, or raising the glass transition temperature (Tg) above 80°C. Additionally, T1 can be reduced by creating irregularities on the surface of the antistatic layer.

[0035] Furthermore, T2 can be adjusted by the composition and surface shape of the heat seal layer. Methods for reducing T2 include, for example, adding an antiblocking agent or slip agent, raising the glass transition temperature (Tg) of the heat seal layer to above 80°C, or adding a material with a softening point of 50°C or higher. In addition, when using a thermoplastic resin having bulky functional groups such as vinyl acetate monomer units as the heat seal layer material, T2 can be reduced by reducing the amount of vinyl acetate and making it less elastically deformable. For example, it is preferable to have a vinyl acetate monomer unit content of 15% by mass or less in the thermoplastic resin. Furthermore, T2 can be reduced by creating irregularities on the surface of the heat seal layer.

[0036] The above S can be adjusted by the composition of the antistatic layer and the combination of the antistatic layer and the heat seal layer. For example, methods to reduce S include adding an antiblocking agent or slip agent to the antistatic layer, and creating irregularities on the surface of the antistatic layer. Furthermore, when using a thermoplastic resin containing vinyl acetate monomer units as the heat seal layer material, S can be reduced by reducing the content of vinyl acetate monomer units in the thermoplastic resin to 15% by mass or less, adding a material with a softening point of 50°C or higher to the heat seal layer to create a material system that is less prone to elastic deformation, adding an antiblocking agent or slip agent to the heat seal layer, or creating irregularities on the surface of the heat seal layer.

[0037] Examples of the antiblocking agent mentioned above include metal oxides such as tin oxide, inorganic compounds such as silica particles, and organic compounds. The particles may be hollow.

[0038] II. Surface resistivity The cover tape for packaging electronic components in this disclosure has a surface resistivity of 1 × 10⁻¹⁰ 10 It is less than Ω / □. Preferably, 8 × 0 9 The value is less than Ω / □. If the value is less than the above, the cover tape will have sufficient antistatic performance.

[0039] The surface resistivity was measured using a Highresta UP MCP-HT450 manufactured by Mitsubishi Chemical Analytec Co., Ltd., under the following test conditions. (Test conditions) • Probe: UA probe • Applied voltage: 10 10 Ω / □ less than 10V 10 10 ~10 12 Ω / □ 500V 10 13 Ω / □ or more 1000V Sample size: 50cm x 40cm • Measurement point: Center of the sample • Measurement values: Five measurements are taken, ensuring that the measurement points do not overlap, and the average value is used. • Measurement time per session: Display after 10 seconds. • Sample storage before measurement: Store for at least 24 hours in a 25°C, 40% RH environment. ·Measurement environment: 25±2℃, 40±5%RH environment

[0040] III. Layer configuration The cover tape of this disclosure comprises, at least, an antistatic layer, a base layer, and a heat-seal layer, in that order. The cover tape of this disclosure may also have an intermediate layer between the base layer and the heat-seal layer. The layer structure of the cover tape of this disclosure will be described in detail below.

[0041] 1. Antistatic layer The antistatic layer in this disclosure contains a conductive polymer. The antistatic layer is a layer that prevents the cover tape from becoming charged. By having an antistatic layer, it is possible to suppress chip damage and mounting defects caused by static electricity due to peeling charge when peeling the cover tape from the carrier tape, prevent the generation of static electricity due to contact with other surfaces, and prevent dust and dirt from adhering to the surface of the cover tape due to static electricity buildup.

[0042] (a) Conductive polymer The antistatic layer in this disclosure contains a conductive polymer as an antistatic agent. In this specification, "conductive polymer" includes not only polymers that exhibit conductivity themselves, such as polythiophene described later, but also polymers that impart conductivity by reacting with water vapor in the air and forming a moisture film (conductive layer) on the surface of the antistatic layer, such as cationic polymer surfactants described later. Examples of such conductive polymers include polythiophene, polyaniline, polypyrrole, polyacetylene, poly(p-phenylene), polyphenylenevinylene, and polyvinylcarbazole. Cationic polymer surfactants can also be used.

[0043] In the present disclosure, among others, it is preferably at least one selected from the group consisting of polythiophene, polyaniline, and polypyrrole. This is because the polymer itself exhibits conductivity, so sufficient antistatic properties and transparency that are independent of humidity can be obtained. As the polythiophene, for example, PEDOT / PSS (poly(3,4-ethylenedioxythiophene) / polystyrene sulfonic acid) is preferably used. As the polyaniline, for example, sulfonated polyaniline is preferably used. For an antistatic layer containing the above conductive polymer, it is preferable because a low surface resistivity can be obtained even if the thickness is thin. By making the thickness of the antistatic layer thin, the light transmittance of the cover tape can be improved. Also, by making the thickness of the antistatic layer thin, the light absorption rate of the cover tape can be lowered. Therefore, the visibility of the cover tape can be improved.

[0044] The content in the antistatic layer of the conductive polymer described above only needs to be an amount that makes the surface resistivity less than 1×10 10 Ω / □, preferably 5 mass% or more and 15 mass% or less, and more preferably 7 mass% or more and 12 mass% or less. If it is less than the above range, the antistatic effect tends to be difficult to manifest, and if it is more than the above range, the dispersibility is poor, and the adhesion, optical properties, and mechanical properties tend to be inferior.

[0045] On the other hand, examples of the cationic polymer surfactant include quaternary ammonium salt polymers. A quaternary ammonium salt polymer is a polymer having a quaternary ammonium base, and the type of the main skeleton of the polymer is not particularly limited. It may be a polymer of a single type of monomer or a copolymer of a plurality of types of monomers, and may be saturated or unsaturated. Also, it may have other functional groups. The counter anion of the quaternary ammonium salt is not particularly limited. For example, halogen ions, sulfide ions, etc. are used. Up to the 1st to 3rd positions of ammonium, aryl groups and alkyl groups are included and are not particularly limited, but from the viewpoint of solubility, those having 6 or less carbon atoms are preferable. An acrylic main chain is preferable for the main chain of the polymeric quaternary ammonium salt from the viewpoints of transparency and substrate adhesion.

[0046] The content of quaternary ammonium salt polymer in the antistatic layer is such that the surface resistivity is 1 × 10 10 Any amount less than Ω / □ is acceptable, preferably 10% by mass or more and 30% by mass or less, and more preferably 15% by mass or more and 20% by mass or less. If the amount is less than the above range, the antistatic effect tends to be difficult to exhibit, and if it is more than the above range, the adhesion, optical properties, and mechanical properties tend to be inferior.

[0047] The antistatic agent in this disclosure may further include a low molecular weight surfactant, a metal oxide, etc. Such low molecular weight surfactants may be cationic, anionic, or nonionic types.

[0048] Examples of metal oxides include antimond-doped tin oxide (ATO), fluorine-doped tin oxide, phosphorus-doped tin oxide (PTO), aluminum-doped tin oxide, niobium-doped tin oxide, tantalum-doped tin oxide, tungsten-doped tin oxide, indium-doped tin oxide, tin oxide, tin-doped indium oxide (ITO), fluorine-doped indium oxide, cadmium-doped indium oxide, indium-doped zinc oxide, fluorine-doped zinc oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, magnesium-doped zinc oxide, silicon-doped zinc oxide, tin-doped zinc oxide, boron-doped zinc oxide, zinc oxide, zinc antimonate (AZO), and niobium-doped titanium oxide, and two or more may be used in combination. From the viewpoint of stable surface resistivity, antimond-doped tin oxide, tin-doped indium oxide, phosphorus-doped tin oxide, tin oxide, aluminum-doped zinc oxide, gallium-doped zinc oxide, and zinc antimonate are preferred.

[0049] The average particle size of the metal oxide can be, for example, 0.01 μm or more and 1 μm or less, and from the viewpoint of transparency, 0.01 μm or more and 0.5 μm or less is preferred. The content of the metal oxide in the antistatic layer is such that the surface resistivity is 1 × 10⁻⁶ 10The amount should be less than Ω / □, for example, 10% by mass or more and 70% by mass or less. The shape of the metal oxide can be spherical, needle-shaped, or layered, but spherical and needle-shaped are preferred from the viewpoint of transparency, surface resistivity, and dispersibility.

[0050] (b) lubricant In this disclosure, the antistatic layer preferably contains a lubricant in terms of reducing the static friction coefficient S and the tack force of the first surface. The lubricant can be used without particular limitations and may or may not have antistatic properties.

[0051] Commonly known lubricants can be used. Examples include ethylene oxide-based, hydrocarbon-based, fatty acid-based, higher alcohol-based, aliphatic amide-based, metal soap-based, and ester-based lubricants.

[0052] Specific examples include hydrocarbon lubricants such as liquid paraffin, paraffin wax, and synthetic polyethylene wax; fatty acid lubricants such as stearic acid and montanic acid; higher alcohol lubricants such as stearyl alcohol; aliphatic amide lubricants such as stearic acid amide, oleic acid amide, erucic acid amide (fatty acid amides), methylenebisstearic acid amide, and ethylenebisstearic acid amide (alkylene fatty acid amides); metal soap lubricants such as lead stearate / zinc stearate and calcium stearate / magnesium stearate; and ester lubricants such as monoglyceride stearate, stearyl stearate, and polyoxyethylene tridecyl ether phosphate ester.

[0053] In this disclosure, from the viewpoint of reducing the static friction coefficient S while lowering the surface resistivity, the lubricant is preferably an ethylene oxide-based nonionic surfactant. In particular, it is preferable that the HLB value (Hydrophilic-Lipophilic Balance) is 2 or more and 11 or less and ethylene oxide-based nonionic surfactant. More preferably it is 3 or more and 8 or less and particularly preferably 3.5 or more and 7 or less.

[0054] By using an ethylene oxide-based nonionic surfactant with an HLB value greater than the above value, the compatibility with the binder resin does not become too good, and the lubricant is more likely to localize on the surface of the antistatic layer. Generally, it is assumed that compatibility with the binder resin is better as the HLB value decreases. Here, if the compatibility with the binder resin is too good, the lubricant will dissolve (disperse) well in the binder resin in the antistatic layer, and the amount that bleeds to the surface of the antistatic layer will become extremely small. Furthermore, by using an ethylene oxide-based nonionic surfactant with an HLB value below a certain value, it is less likely to attract moisture, and therefore it is presumed that blocking between tapes via water can be suppressed.

[0055] In this specification, the HLB value is a value calculated by the Griffin method (i.e., HLB value = 20 × sum of the formula weights of the hydrophilic parts / molecular weight), and represents the degree of affinity of a surfactant to water and oil. It takes a value from 0 to 20, with a value closer to 0 indicating higher lipophilicity and a value closer to 20 indicating higher hydrophilicity.

[0056] In this specification, an ethylene oxide-based nonionic surfactant is a nonionic surfactant having a (poly)oxyethylene group as its hydrophilic portion. A (poly)oxyethylene group means at least one of an oxyethylene group (-C2H4-O-) or a polyoxyethylene group in which two or more ethylene groups are linked by an ether bond.

[0057] Examples of ethylene oxide-based nonionic surfactants with an HLB value of 2 to 11 include (poly)oxyethylene alkylamines such as (poly)oxyethylene laurylamine, (poly)oxyethylene-beef tallow alkylamine, (poly)oxyethylene stearylamine, (poly)oxyethylene-oleylamine, and (poly)oxyethylene alkylpropylenediamine; (poly)oxyethylene alkyl ethers such as (poly)oxyethylene lauryl ether, (poly)oxyethylene oleyl ether, (poly)oxyethylene-stearyl ether, (poly)oxyethylene-isodecyl ether, and (poly)oxyethylene-(poly)oxypropylene-alkyl ether; and (poly)oxyethylene fatty acid esters such as (poly)oxyethylene-monolaurate, (poly)oxyethylene-monostearate, (poly)oxyethylene-monooleate, and (poly)ethylene glycol-diolate, and which have an HLB value of 2 to 11. Among these, (poly)oxyethylene alkylamines are preferred from the viewpoint of solubility in aqueous organic solvents and water resistance of the coating film. These may be used individually or in combination of two or more types.

[0058] The lubricant content in the antistatic layer (as a percentage of the total solid content of the antistatic layer) is, for example, 1% by mass or more and 9% by mass or less, preferably 1.5% by mass or more and 8% by mass or less, and particularly preferably 2% by mass or more and 7.5% by mass or less. If the content is less than the above range, the lubricant addition effect will not be easily exhibited. On the other hand, if it is more than the above range, the surface resistivity of the first surface will be high.

[0059] (c) Binder resin The antistatic layer preferably contains a binder resin. The antistatic layer containing a binder resin has poor slipperiness, low surface roughness, and good flatness, making it easy to block. Therefore, the effects of this disclosure can be significantly obtained. In addition, the inclusion of a binder resin imparts adhesion to the substrate, optical properties, mechanical properties, etc., to the coating film. The binder resin in this disclosure is not particularly limited as long as it is a resin, but it is preferably an acrylic binder resin, an epoxy binder resin, or a polyester binder resin.

[0060] In this disclosure, the acrylic binder resins include acrylic resins obtained by polymerizing one type of monomer containing a hydroxyl group, such as 2-hydroxyethyl methacrylate, hydroxyethyl acrylate, hydroxypropyl acrylate, and hydroxybutyl acrylate; monomers containing an amide group, such as acrylamide and N-methylolacrylamide; monomers containing a carboxyl group, such as acrylic acid, methacrylic acid, itaconic acid, and maleic anhydride; and monomers such as methyl acrylate, ethyl acrylate, N-butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, ethyl methacrylate, isobutyl methacrylate, and 2-ethylhexyl methacrylate, or by copolymerizing two or more types of monomers; and crosslinked acrylic resins obtained by crosslinking these resins with a crosslinking agent. Examples of crosslinking agents include melamine-based, urea-based, epoxy-based, isocyanate-based, aziridine-based, ethyleneimine-based, carbodiimide-based, oxazoline-based, or silane coupling agent-based compounds. In particular, acrylic resins having carboxyl groups, or crosslinked acrylic resins obtained by crosslinking acrylic resins having carboxyl groups with an aziridine-based crosslinking agent, are preferred in terms of mechanical properties, water resistance, and adhesion. The acrylic binder resin may be used alone or in combination of two or more types.

[0061] Examples of epoxy binder resins include bixylenol-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, bisphenol AF-type epoxy resin, dicyclopentadiene-type epoxy resin, trisphenol-type epoxy resin, naphthol novolac-type epoxy resin, phenol novolac-type epoxy resin, tert-butyl-catechol-type epoxy resin, naphthalene-type epoxy resin, naphthol-type epoxy resin, anthracene-type epoxy resin, glycidylamine-type epoxy resin, glycidyl ester-type epoxy resin, cresol novolac-type epoxy resin, biphenyl-type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro-ring-containing epoxy resin, cyclohexanedimethanol-type epoxy resin, naphthylene ether-type epoxy resin, trimethylol-type epoxy resin, and tetraphenylethane-type epoxy resin. Epoxy binder resins may be used individually or in combination of two or more types.

[0062] The polyester binder resin consists of a polycarboxylic acid component and a polyol component. The polycarboxylic acid component includes at least one of aromatic dicarboxylic acids and aliphatic dicarboxylic acids. The aromatic dicarboxylic acid includes at least one component selected from the group consisting of, for example, terephthalic acid, isophthalic acid, phthalic acid, diphenic acid, naphthalic acid, 1,2-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, and 2,6-naphthalenedicarboxylic acid. The aliphatic dicarboxylic acid may be linear, branched, or alicyclic. Aliphatic dicarboxylic acids include, for example, at least one component selected from the group consisting of oxalic acid, malonic acid, succinic acid, maleic acid, itaconic acid, glutaric acid, adipic acid, pimelic acid, 2,2-dimethylglutaric acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, 1,3-cyclopentanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, diglycolic acid, and thiodipropionic acid. Polyol components include, for example, ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 2,2-dimethyl-1,3-propanediol, 2-ethyl-2-butyl-1,3-propanediol, 2-ethyl-2-isobutyl-1,3-propanediol, 2,2,4-trimethyl-1,6-hexanediol, It contains at least one component selected from the group consisting of 1,2-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, 2,2,4,4-tetramethyl-1,3-cyclobutanediol, 4,4'-dihydroxybiphenol, 4,4'-methylenediphenol, 1,5-dihydroxynaphthalene, 2,5-dihydroxynaphthalene, 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), and bisphenol S.Polyethylene glycol contains, for example, at least one component selected from the group consisting of diethylene glycol, triethylene glycol, tetraethylene glycol, pentaethylene glycol, hexaethylene glycol, heptaethylene glycol, and octaethylene glycol. Polypropylene glycol contains, for example, at least one component selected from the group consisting of dipropylene glycol, tripylene glycol, and tetrapropylene glycol.

[0063] The binder resin content in the antistatic layer is preferably 50% by mass or more and 98% by mass or less, and more preferably 70% by mass or more and 95% by mass or less. If the content is less than the above range, the applied antistatic layer is prone to peeling off, and if it is more than the above range, it becomes difficult for the antistatic agent and lubricant to exert sufficient effects.

[0064] (d) Formation method One method for forming an antistatic layer is to use an antistatic layer composition in which an antistatic agent, lubricant, and binder resin are dispersed or dissolved in a solvent, apply the antistatic layer composition to the side of the substrate layer opposite to the heat seal layer side, and dry it. Examples of known application methods for the antistatic layer composition include air doctor, blade coat, knife coat, rod coat, bar coat, direct roll coat, reverse roll coat, gravure coat, and slide coat.

[0065] The thickness of the antistatic layer can be, for example, 0.02 μm to 3 μm. By using an antistatic layer of this thickness, the cover tape can be given antistatic properties.

[0066] II. Base material layer The base layer in this disclosure is a layer that supports the heat seal layer and the antistatic layer. Various materials can be used as the base layer, as long as they have mechanical strength to withstand external forces during storage and transport, and heat resistance to withstand manufacturing and taping packaging. Examples include polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate-isophthalate copolymer, and terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer; polyamides such as nylon 6, nylon 66, and nylon 610; and polyolefins such as polyethylene, polypropylene, and polymethylpentene. Among these, polyesters such as polyethylene terephthalate and polyethylene naphthalate are preferred because they offer good cost and mechanical strength.

[0067] Furthermore, the base layer may contain additives such as fillers, plasticizers, colorants, and antistatic agents as needed. The base layer may be a single layer or a laminate of multiple layers of the same or different types. The base layer may also be a stretched film or an unstretched film. In particular, the base layer may be a film stretched in one or two axes to improve its strength.

[0068] The thickness of the base layer can be, for example, 2.5 μm to 300 μm, 6 μm to 100 μm, or 12 μm to 50 μm. If the base layer is too thick, the rigidity during taping packaging becomes too high, which is disadvantageous in terms of handling and cost. Conversely, if the base layer is too thin, the water vapor barrier properties decrease, and the mechanical strength may be insufficient.

[0069] III. Heat seal layer The heat-seal layer in this disclosure is a layer disposed on one side of the base layer. When manufacturing a package using the cover tape of this disclosure, the heat-seal layer is heat-sealed to the carrier tape, thereby bonding the cover tape and the carrier tape together.

[0070] The heat seal layer has a thermoplastic resin, and the thermoplastic resin is preferably an ethylene polymer, an acrylic resin, a polyester resin, a polyurethane resin, a vinyl chloride-vinyl acetate copolymer, or a resin mainly composed of these. In particular, from the viewpoint of reducing the tack force T2 of the second surface, it is preferable that the thermoplastic resin contains an ethylene polymer.

[0071] Ethylene-based polymers are polymers that contain ethylene units (constituent units derived from ethylene), and examples include ethylene homopolymers (polyethylene) and copolymers of ethylene with other monomers (ethylene copolymers).

[0072] Examples of ethylene homopolymers include low-density polyethylene (LDPE), linear low-density polyethylene (L-LDPE), medium-density polyethylene (MDPE), and high-density polyethylene (HDPE).

[0073] Other monomers that make up ethylene copolymers include olefin monomers (propylene, butene, pentene, hexene, octene, etc.), unsaturated carboxylic acids (acrylic acid, methacrylic acid, etc.), unsaturated carboxylic acid esters (methyl acrylate, ethyl acrylate, butyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, dimethyl maleate, diethyl maleate, etc.), vinyl esters (vinyl acetate, vinyl propionate, fumaric acid, maleic anhydride, maleic acid monoester, etc.), and styrene. These can be used individually or in combination of two or more.

[0074] The ethylene content in the ethylene copolymer is not particularly limited, but can be 60% by mass or more and 98% by mass or less, and may be 70% by mass or more and 97% by mass or less. The content of other monomers in the ethylene copolymer is not particularly limited, but can be 2% by mass or more and 40% by mass or less, and may be 3% by mass or more and 30% by mass or less.

[0075] In particular, ethylene copolymers such as ethylene-vinyl acetate copolymers (EVA resin) and acrylic-styrene copolymers are preferred. It is especially preferable that the heat seal layer contains EVA resin. The inclusion of EVA resin in the heat seal layer improves the heat sealability to the carrier tape. Therefore, unintended peeling during transport, storage, etc., can be suppressed.

[0076] In this disclosure, EVA resin is a copolymer containing at least ethylene monomer units and vinyl acetate monomer units. Ethylene monomer units refer to constituent units derived from ethylene monomer, and vinyl acetate monomer units refer to constituent units derived from vinyl acetate monomer. The ethylene content in the EVA resin is not particularly limited, but can be 60% by mass or more and 98% by mass or less, and may be 70% by mass or more and 97% by mass or less. The vinyl acetate content in the EVA resin is not particularly limited, but can be 2% by mass or more and 40% by mass or less, and may be 3% by mass or more and 30% by mass or less.

[0077] In addition to ethylene monomer units and vinyl acetate monomer units, the EVA resin may also contain a third monomer unit. The third monomer unit may contain a functional group having antistatic properties.

[0078] The EVA resin content in the heat seal layer is not particularly limited, but can be between 50% and 100% by mass, and between 60% and 80% by mass. Increasing the EVA resin content improves the heat seal performance.

[0079] In the heat seal layer of this disclosure, if it contains EVA resin, the heat seal layer may further contain polyethylene resin. By incorporating polyethylene resin, it is possible to maintain good heat sealability while lowering surface tackiness and suppressing deterioration after being placed in a high-humidity, high-temperature environment.

[0080] Various types of polyethylene can be used as polyethylene resins, including low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, and high-density polyethylene. However, low-density polyethylene (LDPE, density less than 0.910 to 0.930) and linear low-density polyethylene (LLDPE, density 0.910 to 0.925) are preferred due to their superior dispersibility.

[0081] Furthermore, in this disclosure, the classification of various polyethylenes refers to those defined in the former JIS K6748:1995 and JIS K6899-1:2000. The polyethylene resin content in the heat seal layer may be, for example, 0% by mass or more and 50% by mass or less, or 20% by mass or more and 40% by mass or less. Increasing the polyethylene resin content reduces the heat seal performance, but tends to lower the surface tack strength.

[0082] The heat seal layer may contain additives as needed, such as tackifiers, antistatic agents, dispersants, fillers, plasticizers, colorants, and antiblocking agents.

[0083] The thickness of the heat seal layer is not particularly limited and can be, for example, 1 μm to 30 μm, preferably 10 μm to 20 μm. If the heat seal layer is too thin, the sealing performance may be poor, and a uniform film may not be obtained. If the heat seal layer is too thick, the transparency of the cover tape may decrease, and the tack force may worsen (increase) due to increased stress in the single layer of the heat seal layer.

[0084] The method for forming the heat-seal layer is not particularly limited, and known methods can be used. For example, one method is to extrude the heat-melted film raw material onto a base layer or intermediate layer using a T-die or the like, and then press it against the base layer or intermediate layer with a cooling roll (extrusion lamination method). Another method is to bond a pre-made film to the base layer or intermediate layer with an adhesive. As adhesives, for example, polyester adhesives, polyurethane adhesives, acrylic adhesives, etc. can be used.

[0085] Furthermore, other methods for forming a heat seal layer include, for example, using a heat seal layer composition obtained by dispersing or dissolving a thermoplastic resin and additives in a solvent, applying the heat seal layer composition onto a substrate layer (described later), and drying it. Examples of known application methods for the heat seal layer composition include roll coating, reverse roll coating, gravure coating, gravure reverse coating, comma coating, bar coating, wire bar coating, rod coating, kiss coating, knife coating, die coating, flow coating, dip coating, and spray coating.

[0086] IV. Middle class The cover tape in this disclosure may have an intermediate layer between the base layer and the heat seal layer. The intermediate layer can improve the adhesion between the base layer and the heat seal layer. Furthermore, the intermediate layer can improve cushioning when heat sealing the cover tape in this disclosure to the carrier tape, thereby allowing heat to be applied more uniformly to the heat seal layer.

[0087] The resin material used in the intermediate layer can be appropriately selected depending on the materials of the base layer and the heat seal layer, and examples include polyethylene, polyolefins such as polypropylene, polyurethane, and polyester.

[0088] The thickness of the intermediate layer can be, for example, 5 μm to 50 μm. A film can be used as the intermediate layer. In this case, the method of laminating the base layer and the intermediate layer is not particularly limited, and known methods can be used. For example, one method is to extrude the heat-melted raw material of the film onto the base layer using a T-die or the like, rapidly cool and solidify it with the cooling roll, and press it against the base layer (extrusion lamination method). This forms the intermediate layer on one side of the base layer. It is preferable to form an anchor coat layer in advance on the side of the base layer where the intermediate layer is placed. Another method is to bond a pre-manufactured film to the base layer with an adhesive.

[0089] V.Adhesive layer Furthermore, an adhesive layer may be provided between the base layer and the intermediate layer, or between the intermediate layer and the heat seal layer. By forming an adhesive layer, the adhesion between the base layer and the intermediate layer, or between the intermediate layer and the heat seal layer, can be improved even if the base layer, intermediate layer, or heat seal layer has poor adhesive strength. The adhesive layer can be appropriately selected according to the materials used for the base layer, intermediate layer, and heat seal layer, and is not particularly limited. The adhesive layer can be formed from a resin with good adhesion, such as an olefin-based, acrylic-based, isocyanate-based, urethane-based, or ester-based adhesive.

[0090] Furthermore, the application of the adhesive is not particularly limited, but can be done by gravure coating, roll coating, etc.

[0091] The thickness of the adhesive layer can be adjusted as needed, for example, 1 to 10 g / m² to give the cover tape adequate rigidity. 2 Preferably, 2-5 g / m 2 It is 1 g / m 2 If the above conditions are met, the adhesive strength can be made uniform.

[0092] VI.Physical properties (1) haze value The haze value of the cover tape in this disclosure is preferably 55% or less, and more preferably 50% or less. The haze value is measured using a haze meter NDH 7000 (manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS-K-7136. A cover tape with such optical properties will have good visibility.

[0093] (2) Total light transmittance The cover tape in this disclosure preferably has a total light transmittance of 80% or more, and more preferably 85% or more, in the cover tape formed by laminating the above-described layers. The total light transmittance is a value measured with a haze meter NDH 7000 (manufactured by Nippon Denshoku Industries Co., Ltd.) in accordance with JIS-K-7361 and JIS-K-7136. A cover tape having such optical properties will have better visibility.

[0094] (3) Width and length The width and length of the cover tape in this disclosure can be appropriately set according to the width and length of the carrier tape. For example, the width of the cover tape is approximately 1 to 100 mm, and may be 5.25 mm to 5.5 mm. The length is approximately 100 to 10,000 m. The cover tape in this disclosure is usually stored in a traverse winding before use (before heat sealing to the carrier tape).

[0095] B. Packaging The packaging of this disclosure comprises a carrier tape having a plurality of storage compartments for storing electronic components, electronic components stored in the storage compartments, and the cover tape described above, which is arranged to cover the storage compartments.

[0096] The packaging using the cover tape of this disclosure improves the visibility of electronic components when they are visually or mechanically inspected through the cover tape.

[0097] Figures 2(a) and 2(b) are schematic plan and cross-sectional views, respectively, showing an example of the packaging of this disclosure. Note that Figures 2(a) and 2(b) are described in section A. Cover Tape for Electronic Component Packaging above, so their explanation is omitted here.

[0098] The following describes the various components of the packaging described herein.

[0099] 1. Cover tape The cover tape described in this disclosure is as described in section "A. Cover Tape for Electronic Component Packaging" above, so a further explanation is omitted here.

[0100] In the packaging of this disclosure, the heat-seal layer of the cover tape and the carrier tape are bonded at a heat-seal portion. The heat-seal portion can be located, for example, in a part of the area where the heat-seal layer of the cover tape contacts the carrier tape. That is, the heat-seal layer may have a heat-seal portion and a non-heat-seal portion. This improves the peelability of the cover tape from the carrier tape.

[0101] 2. Carrier Tape The carrier tape in this disclosure is a component having a plurality of storage compartments for housing electronic components.

[0102] Any carrier tape having multiple storage compartments can be used, such as embossed carrier tape (also called embossed tape), punched carrier tape (also called punched tape), or press carrier tape (also called press tape). Among these, embossed carrier tape is preferred from the viewpoint of cost, moldability, and dimensional accuracy.

[0103] Examples of materials for the carrier tape include plastics such as polyvinyl chloride, polystyrene, polyester, polypropylene, polycarbonate, polyacrylonitrile, and ABS resin, as well as paper. In this disclosure, paper refers to a material mainly composed of cellulose, and may also contain resin components.

[0104] The thickness of the carrier tape is appropriately selected depending on the material of the carrier tape and the thickness of the electronic components. For example, the thickness of the carrier tape can be between 30 μm and 1500 μm. If the carrier tape is too thick, the moldability will be poor, and if it is too thin, the strength may be insufficient.

[0105] The carrier tape has multiple storage compartments. These compartments are typically arranged at predetermined intervals along the longitudinal direction of the carrier tape. The size, depth, and pitch of the compartments are adjusted as appropriate according to the size and thickness of the electronic components.

[0106] As a method for forming a carrier tape having a storage compartment, general carrier tape forming methods can be applied and appropriately selected depending on the type and material of the carrier tape. Examples include press forming, vacuum forming, pressure forming, punching, and compression forming.

[0107] 3. Electronic components The electronic components used in the packaging of this disclosure are not particularly limited and include, for example, ICs, resistors, capacitors, inductors, transistors, diodes, LEDs (light-emitting diodes), liquid crystals, piezoelectric resistors, filters, crystal oscillators, crystal resonators, connectors, switches, potentiometers, relays, etc. The type of IC is also not particularly limited.

[0108] 4. Others The packaging of this disclosure is used for the storage and transport of electronic components. The electronic components are stored and transported in the packaging and then used for mounting. During mounting, the cover tape is peeled off, the electronic components stored in the carrier tape are removed and mounted onto a circuit board or the like.

[0109] This disclosure is not limited to the embodiments described above. The embodiments described above are illustrative, and any configuration that is substantially identical to the technical idea described in the claims of this disclosure and achieves similar effects is included within the technical scope of this disclosure. [Examples]

[0110] Examples and comparative examples are shown below to further illustrate this disclosure.

[0111] [Heat seal layer: EVA resin] (Example 1) As a base layer, a 25 μm thick biaxially oriented polyethylene terephthalate film (FE2002, manufactured by Futamura Chemical Co., Ltd., hereinafter referred to as PET film) was prepared, which had been corona-treated on both sides. An antistatic layer approximately 50 nm thick was formed by applying an antistatic composition 1 containing lubricant 1 (Naimine L 201 (polyoxyethylene laurylamine), manufactured by NOF Corporation, HLB 3.8) to one side of the PET film. The lubricant content in the antistatic layer (ratio to the total solid content of the antistatic layer) was approximately 3% by mass. The antistatic layer also contained PEDOT / PSS as a conductive polymer and a crosslinked acrylic resin, in which an acrylic resin having carboxyl groups was crosslinked with an aziridine-based crosslinking agent, as a binder. An anchor layer was formed on the side of the PET film opposite to the side where the antistatic layer was formed by applying a urethane-based anchor coating agent (Takenate A-3075 / Takelac A-3210 (mass ratio) = 3 / 1, diluted 5% with ethyl acetate).

[0112] Next, an intermediate layer with a thickness of 15 μm was formed on the surface side of the PET film where the anchor layer was formed, using polyethylene resin (Novatec LC600A, manufactured by Nippon Polyethylene Co., Ltd.) by melt extrusion lamination. Then, on the side of the intermediate layer opposite to the anchor layer side, a heat seal layer with a thickness of 15 μm was formed using heat seal composition 1 by melt extrusion lamination to produce a cover tape. The cover tape consists of an antistatic layer (approximately 50 nm), a base layer (25 μm), an anchor layer, an intermediate layer (15 μm), and a heat seal layer (15 μm).

[0113] • Antistatic composition 1 Lubricant: Naimine L 201 (Polyoxyethylene Laurylamine, manufactured by NOF Corporation, 100% solids) 0.12 wt% Main component: Aracoat AS601D (manufactured by Arakawa Chemical Industries, Ltd., solids content 3.5%) 88.16 wt% Crosslinking agent: Aracoat CL910 (manufactured by Arakawa Chemical Industries, Ltd., solids content 10%) 8.82 wt% Additive: Ethylene glycol 2.91 wt% A mixture was prepared and diluted with IPA / water in a solvent of 7 / 3 to a solid content concentration of 1.3%.

[0114] • Heat seal composition 1 EVA: EV450, manufactured by Mitsui Dow Polychemicals, 55 wt% LDPE:L813, manufactured by Sumitomo Chemical Co., Ltd., 28wt% Tackifier: Alcon P-115 13wt% Antistatic agent: Elestmaster LL-10 4wt%

[0115] (Examples 2-7, Comparative Examples 1-7) A cover tape was prepared in the same manner as in Example 1, except that the lubricants in Tables 1 and 2 were used to form the antistatic layer, and an antistatic composition was prepared so that the lubricant content matched the values ​​in Tables 1 and 2. The types of lubricants and HLB values ​​in Tables 1 and 2 are shown below.

[0116] • Lubricant 2: Naimine T2 202 (Polyoxyethylene Beef Tallow Alkylamine, manufactured by NOF Corporation, HLB5) • Lubricant 3: Naimine S 204 (Polyoxyethylene stearylamine, manufactured by NOF Corporation, HLB8) Lubricant 4: S-656 (nonionic fluorine-based surfactant) Lubricant 5: Nonionic OP-85R (sorbitan triolate, manufactured by NOF Corporation, HLB 1.8) Lubricant 6: Dispanol LS-100 (NOF Co., Ltd., HLB 9.7) Lubricant 7: Nonionic P-208 (Polyoxyethylene cetyl ether, manufactured by NOF Corporation, HLB 11.9)

[0117] (Example 8) As an antistatic agent, the following main component and curing agent were mixed in a dry solids ratio of 9:1:1, and an antistatic composition with a total solids content of 1.5% by mass was prepared using a diluting solvent (methanol / ethyl acetate = 1 / 1). • Main component: Quaternary ammonium base and an acrylic polymer compound having a carboxyl group and a (meth)acrylic acid ester group in its side chain (Acrit 1SX-1123 (manufactured by Taisei Fine Chemical Co., Ltd.)) Acrylic binder resin: AW-36H (manufactured by Seikou PMC Co., Ltd.) • Hardener: Polyfunctional hardener, HDI-type polyisocyanate (Duranate 24A-100 (manufactured by Asahi Kasei Corporation)) A cover tape was prepared in the same manner as in Example 1, except that an antistatic layer with a thickness of 800 nm was formed using the obtained antistatic composition.

[0118] [Heat seal layer: Acrylic-styrene resin] (Example 9) A cover tape was prepared in the same manner as in Example 1, except that the lubricant in Table 3 was used to form the antistatic layer, and an antistatic composition prepared so that the lubricant content was as shown in Table 3 was used, and the heat seal composition 2 described below was used to form the heat seal layer.

[0119] • Heat seal composition 2 MK Polymer ECS-70 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), a styrene-acrylic resin component, and MK Polymer EC-24 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), an acrylic resin component, were blended in an 80 / 20 ratio and coated to a thickness of 2 μm.

[0120] (Examples 10-14, Comparative Examples 8-11) A cover tape was prepared in the same manner as in Example 9, except that the lubricants in Tables 3 and 4 were used to form the antistatic layer, and an antistatic composition was used that was prepared so that the lubricant content was as shown in Tables 3 and 4.

[0121] (Example 15) A cover tape was prepared in the same manner as in Example 9, except that the antistatic composition used in Example 8 was used as the antistatic composition.

[0122] [Measurement of surface resistivity] The surface resistivity of the first surface (antistatic layer surface) of the cover tape manufactured as described above was measured using the method described in "A. Cover Tape for Electronic Component Packaging II. Surface Resistivity" above. The results are shown in Tables 1 to 4.

[0123] [Measurement of tack force] The tack force of the first surface (antistatic layer surface) of the cover tape manufactured as described above was measured using the method described in "A. Cover tape for electronic component packaging I. T1×T2×S" above. The results are shown in Tables 1 to 4. The tack force of the second surface (heat seal layer surface) was also measured using the same method, and the results were 16.4 gf when the heat seal layer contained EVA resin (Examples 1 to 8, Comparative Examples 1 to 7) and 8.9 gf when it contained acrylic-styrene resin (Examples 9 to 15, Comparative Examples 8 to 11).

[0124] [Measurement of static friction coefficient] The static friction coefficient between the first and second surfaces of the cover tape manufactured as described above was measured using the method described in "A. Cover tape for electronic component packaging I. T1×T2×S" above.

[0125] [Measurement of haze] The haze of the cover tapes manufactured in Examples 1-8 and Comparative Examples 1-7 was measured using the method described in "A. Cover Tapes for Electronic Component Packaging VI. Physical Properties (1) Haze Value" above. The results are shown in Tables 1 and 2.

[0126] [Blocking evaluation] The cover tape manufactured as described above was cut to a width of 5.25 mm. The cut cover tape was then wound up to obtain a rolled material. The presence or absence of blocking resistance was evaluated using the following evaluation method and criteria. The results are shown in Tables 1 to 4.

[0127] • Evaluation method The cover tape film of a 6000m traverse roll (3-inch core, 180mm width, paper tube) slit to a width of 5.25mm was secured at the film end with cellophane tape (registered trademark) to prevent winding misalignment, and then placed in a New Poly Bag (standard bag) LDPE, transparent, 0.025mm thick, No. 12, 230 x 340mm (Fukusuke Kogyo), with the opening of the bag placed into the paper tube. The traverse roll was then placed vertically in a 40°C, 90%RH environment for 3 hours. After that, it was removed to a room temperature environment (20-25°C, 40±10%RH), and without opening the bag, was placed vertically in a 7°C refrigerated environment for 3 hours within 60 seconds. After being removed from the refrigerated environment, the traverse roll was left standing vertically in the bag at room temperature (20-25°C, 40±10%RH) for 12 hours. The film end of the above sample was discarded at a rate of 5-8 m, and as shown in Figure 4, (1) the film end was pulled out at a rate of 150 mm, and (2) the roll was rotated at a rate of 2-3 seconds per revolution. The blocking resistance was evaluated according to the following criteria.

[0128] • Evaluation criteria A: When the film core is positioned horizontally to the ground and the film end is unwound 150mm and rotated in the winding direction, it unwinds under its own weight without sticking or getting caught. When rotated in the same way as B:A, there is some sticking and snagging, but the film unwinds under its own weight during one rotation of the roll in the film winding direction. C: The film remains attached even after one full rotation of the roll and does not fall off due to its own weight.

[0129] [Table 1]

[0130] [Table 2]

[0131] [Table 3]

[0132] [Table 4]

[0133] As shown in Tables 1 to 4, it was confirmed that blocking was suppressed in the cover tapes of this disclosure that satisfy T1 × T2 × S ≤ 10 (Examples 1 to 15). On the other hand, it was confirmed that blocking occurred in the cover tapes where T1 × T2 × S > 10 (Comparative Examples 1 to 6 and 8 to 10). Furthermore, when a large amount of lubricant was included to suppress blocking (Comparative Examples 7 and 11), or depending on the type of lubricant (Comparative Examples 2 and 9), the surface resistivity was 1 × 10⁻⁶. 10 It was confirmed that the antistatic performance deteriorated when the value exceeded Ω / □. Furthermore, it was confirmed that blocking was suppressed even if the tack force T1 and static friction coefficient S of the antistatic layer surface were larger because the tack force of the heat seal layer (acrylic-styrene) surface (8.9 gf) was smaller than that of the heat seal layer (EVA) surface (16.4 gf) (Example 14). [Explanation of Symbols]

[0134] 1… Cover tape 2...Base material layer 3… Heat seal layer 4. Antistatic layer 5… Middle class 10 … Packaging 11… Carrier tape 12… Storage compartment 13… Electronic components

Claims

1. A base layer and A heat seal layer disposed on one side of the base material layer, A cover tape for packaging electronic components, comprising: an antistatic layer disposed on the side of the base layer opposite to the side facing the heat seal layer; The antistatic layer contains a conductive polymer, The cover tape for packaging electronic components has a tack force T1 [gf] on the first surface, which is the surface on which the antistatic layer is placed, a tack force T2 [gf] on the second surface, which is the surface on which the heat seal layer is placed, and a static friction coefficient S [-] between the first surface and the second surface. Satisfying T1 × T2 × S ≤ 10, The values ​​T1 and T2 above were measured under the following measurement conditions: The surface resistivity of the first surface is 1 × 10 １０ Satisfying the condition Ω / □ less than, The antistatic layer contains a lubricant, A cover tape for packaging electronic components, wherein the lubricant is an ethylene oxide-based nonionic surfactant. (Measurement conditions for T1 and T2) Pressurization (compression) speed: 30 mm / min Pressure applied: 200 gf Pressurization time: 10 seconds Measurement (detachment) speed: 30 mm / min Measurement contact part (probe): Cylindrical diameter 5 mm, SUS304 Temperature conditions: Probe temperature 80°C, sample stage temperature 80°C (sample temperature 80°C) Pre-measurement sample storage: Store for at least 24 hours in a 25°C, 40% RH environment. Measurement environment: 25±2℃, 40±5%RH environment

2. The cover tape for packaging electronic components according to claim 1, wherein the tack force T1 of the first surface is 2.0 gf or less.

3. The cover tape for packaging electronic components according to claim 1 or claim 2, wherein the tack force T2 of the second surface is 30 gf or less.

4. The cover tape for packaging electronic components according to any one of claims 1 to 3, wherein the static friction coefficient S between the first surface and the second surface is 0.8 or less.

5. The cover tape for packaging electronic components according to any one of claims 1 to 4, wherein the conductive polymer is PEDOT / PSS ((poly(3,4-ethylenedioxythiophene)) / polystyrene sulfonic acid).

6. A carrier tape having multiple storage compartments for storing electronic components, The electronic components housed in the aforementioned storage compartment, A cover tape for packaging electronic components according to any one of claims 1 to 5, which is arranged to cover the storage compartment, A packaging body equipped with the following features.

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