A circuit board arrangement having a circuit board that can rotate from the mounting position to an intermediate position.

Abstract

The present invention relates to a circuit board arrangement (10) having at least one housing (12) in which a plurality of circuit boards (14) are arranged, and at least one cooling device (16) through which a cooling fluid can pass, the cooling device (16) being configured to dissipate heat from at least one of the circuit boards (14). The circuit boards are thermally coupled to the at least one cooling device (16) via at least one heat transfer element (30). Each of the circuit boards (14) is pivotable about a pivot axis (44) from a mounted position in which the heat transfer element abuts both the cooling device (16) and the circuit board (14) to an intermediate position. In the intermediate position, an edge region (50) of the circuit board (14) remote from the pivot axis (44) is spaced farther from the cooling device (16) than in the mounted position. The housing (12) includes at least one guide element (38), and when the circuit boards (14) are introduced into the housing (12), each of the circuit boards (14) is displaceable to the intermediate position along the at least one guide element (38).

Description

Technical Field

[0001] The present invention relates to a circuit board arrangement having at least one housing in which a plurality of circuit boards are arranged, and at least one cooling device through which a cooling fluid can flow, the cooling device being formed to dissipate heat from at least one of the circuit boards. At least one of the circuit boards is thermally coupled to at least one cooling device by at least one heat transfer element.

Background Art

[0002] Particularly, when a plurality of powerful electronic control devices or electronic control units are present in a vehicle, it can be assumed that these control devices are stacked and arranged in a housing or a rack with respect to each other. During operation, heat is released from the circuit boards of the control devices or electronic control units, and it is necessary to dissipate this heat. For heat dissipation, it can be assumed that the circuit boards are thermally coupled to at least one cooling device to which a cooling fluid is supplied during the cooling operation via respective heat transfer elements.

[0003] For example, U.S. Patent No. 10,085,364 describes an arrangement having a housing and circuit boards stacked on each other within this housing. The circuit boards are coupled to heat dissipation elements via respective heat interface materials. A gap is formed between two heat dissipation elements connected to each other, and air or other fluid passes through this gap.

[0004] In this configuration, it is considered disadvantageous that it is relatively difficult and expensive to replace individual ones of the circuit boards, for example, within the scope of repair or renewal.

[0005] Electronic control devices that employ cooling with a coolant are also described in, for example, DE 10 2020 105 683 A1 and US 2021 / 0222608 A1.

Summary of the Invention

[0006] The object of the present invention is to provide a circuit board configuration of the type described above, in which the replacement of individual circuit boards can be particularly easily achieved.

[0007] This problem is solved by a circuit board arrangement having the features of claim 1. Similar configurations resulting from advantageous developments of the present invention are specified in the dependent claims and the following description.

[0008] The circuit board arrangement according to the present invention includes at least one housing through which a plurality of circuit boards are arranged, and at least one cooling device through which a cooling fluid can pass. The at least one cooling device is formed to dissipate heat from at least one of the circuit boards. The at least one of the circuit boards is thermally coupled to the at least one cooling device via at least one heat transfer element. Each of the circuit boards is pivotable about a pivot axis from a mounting position in which the heat transfer element contacts both the at least one cooling device and the circuit board to an intermediate position. At the intermediate position, the edge region of the circuit board away from the pivot axis is further away from the at least one cooling device than at the mounting position. The housing includes at least one guide element, and when the circuit boards are introduced into the housing, each of the circuit boards is displaceable along the at least one guide element to the intermediate position.

[0009] In such a circuit board arrangement, the replacement of individual circuit boards can be made very easy. This is because, for replacement, the circuit board can be pivoted from its mounting position to an intermediate position around a pivot axis. When the circuit board is in this intermediate position, the heat transfer elements do not come into contact with either the cooling device or the circuit board. More precisely, when the circuit board is pivoted to the intermediate position, the heat transfer elements remain in contact with the circuit board, at least largely. Therefore, the heat transfer elements are also separated from the cooling device at the intermediate position. As a result, the heat transfer elements do not hinder or impede the removal of the circuit board from the housing, starting from the intermediate position of the circuit board.

[0010] Furthermore, a replacement circuit board, intended to replace the circuit board originally located in the housing, can be displaced to an intermediate position along at least one guide element without the heat transfer elements on the replacement circuit board coming into contact with the cooling device. This makes it very easy to move the replacement or updated circuit board to an intermediate position.

[0011] In particular, when the circuit board is installed in the housing, no unwanted shear stress is generated in the heat transfer elements. This is because the heat transfer elements applied to the replacement circuit board only come into contact with the cooling device when the circuit board pivots from the intermediate position to the mounting position around the pivot axis.

[0012] When replacing or swapping circuit boards, especially if the circuit board to be replaced is already in an intermediate position, it may also be conceivable to apply a heat transfer element to the circuit board to be replaced. However, even if the heat transfer element is already on the circuit board, the heat transfer element will not interfere with or obstruct the installation step at all or very little while the circuit board is being introduced into the housing, in which case it will be displaced to an intermediate position along at least one guide element.

[0013] However, since the heat transfer element contacts both at least one cooling device and the circuit board at the mounting position, the heat transfer element ensures very efficient heat dissipation from the circuit board to the cooling device, through which a cooling fluid, preferably formed as a coolant during operation or cooling, passes. Therefore, very efficient heat dissipation from the circuit boards can be achieved even when multiple circuit boards are arranged in the housing.

[0014] In particular, very rapid replacement of individual circuit boards can be achieved within the scope of updates and / or repairs. Nevertheless, the circuit boards of the circuit board assembly are advantageously housed in their respective mounting positions within the housing. This achieves a very compact arrangement of circuit boards within the housing. This is particularly advantageous when the circuit board assembly is used, for example, in a vehicle, where the circuit boards are components of one or more electronic control devices or electronic control units of the vehicle.

[0015] Therefore, it is possible to consider a situation in which multiple electronic control devices or electronic control units are typically installed in vehicles such as autonomous vehicles and / or electric vehicles, particularly fully electric vehicles. Here, the control devices play a role in at least one driver assistance function of the vehicle. Therefore, it is advantageous to arrange circuit boards in a housing of a circuit board arrangement that is suitably formed as components of such control devices for vehicles.

[0016] This is especially true when the circuit boards of these electronic control devices or units are high-performance and therefore release a relatively large amount of heat during operation. Since the circuit boards can be stacked within the housing, they are easily accessible. This is advantageous in that individual circuit boards can be easily replaced. Nevertheless, at least one cooling device is necessary to ensure efficient heat dissipation of the circuit boards in their mounting positions.

[0017] Preferably, when removing the circuit board from the housing, each circuit board is displaceable out of the housing starting from the intermediate position along the at least one guide element. This makes it very easy to remove or pull out the circuit board from the housing, in the context of replacing the circuit board that needs replacing, because at least one guide element provided on the side of the housing can be used for this pulling out. Furthermore, this ensures clearly defined movement of the circuit board both when introducing it into the housing and when removing it from the housing.

[0018] The heat transfer element can be formed as a thermally conductive paste. This is highly advantageous in that the heat transfer element can be easily applied to the circuit board when mounting the circuit board assembly and / or when replacing or swapping at least one of the circuit boards with a new one. Furthermore, the thermally conductive paste ensures very good thermal coupling with the cooling device associated with the circuit board.

[0019] Preferably, the thermal conductive paste is spaced apart from at least one cooling device at an intermediate position on the circuit board, where it is in contact with the circuit board. In this way, it is ensured that the thermal conductive paste is not subjected to undesirable shear forces, and in particular, does not become contaminated, when the circuit board is introduced into the housing until it reaches at least an intermediate position on the circuit board. This is advantageous on the one hand in that it correctly positions the thermal conductive paste on the circuit board. On the other hand, this ensures that the introduction of the circuit board into the housing is not hindered or impaired by undesirable contamination or diffusion of the thermal conductive paste when the circuit board is displaced along at least one guide element.

[0020] Preferably, each of the circuit boards is positioned on a support plate that is displaceable along at least one guide element. On the other hand, such a support plate formed in a retractable manner ensures that the circuit boards can be handled very easily when introducing them into and removing them from the housing. In addition, the support plate improves the stability of the assembly including the support plate and the circuit boards positioned on the support plate.

[0021] In particular, the support plate can be formed as a sheet metal component. The circuit board is held on this component by means of screws and / or clips and / or similar types of fasteners that secure the circuit board to the support plate. Because the support plate is formed as a sheet metal component, it is very robust while being advantageously lightweight. Also, by fixing the circuit board to the support plate, it is prevented from sliding on the support plate.

[0022] Preferably, the support plate comprises at least one locking element that engages with a mating part provided on the side surface of the housing at the mounting position of the circuit board. The engagement of the locking element with the mating part can easily enable clearly defined and process-reliable access to the mounting position.

[0023] Furthermore, by providing the locking element on the support plate, the locking element can be made particularly robust. This is advantageous in that it increases the durability of the locking mechanism provided by the engagement between the locking element and the mating part.

[0024] For example, the locking element may be formed as a locking projection that engages with a recess formed in the housing. However, it is equally possible to form the locking element as a recess that engages with a mating part formed as a projection at the mounting position of the circuit board.

[0025] Preferably, the support plate comprises at least one stud element forming the pivot axis. In this way, the pivot axis can be provided locally accurately, simply and functionally reliably.

[0026] Preferably, the at least one stud element is received in locking recesses provided on the side surface of the housing at both the mounting position and the intermediate position of the circuit board. Thus, when inserting the support plate into the housing, the circuit board can be very easily brought to the intermediate position, and preferably the person involved in inserting the circuit board into the housing can preferably confirm tactilely and / or audibly that it has reached the position. Also, by providing the locking recesses, it is made particularly certain that the circuit board does not slide along at least one guide element at the intermediate position.

[0027] Preferably, the locking recesses are formed in the end regions of at least one guide element. Thereby, the circuit board arrangement has a very compact configuration.

[0028] Preferably, the circuit board arrangement comprises holding means formed to hold the at least one cooling device in a state where the circuit board is pivoted to the intermediate position. By providing the holding means, it can be ensured that the cooling device remains stationary even when the circuit board is pivoted to the intermediate position and especially when it is subsequently removed from the housing. Also, the at least one cooling device can be installed or arranged in the housing independently of at least one circuit board that can be cooled by the cooling device with a heat transfer element interposed therebetween. This is advantageous in terms of high flexibility when mounting the circuit board arrangement.

[0029] In particular, the housing is provided with holding means formed so as to hold the at least one cooling device in a state where the circuit board is pivoted to the intermediate position. As such holding means, for example, a holding bar or web on which the cooling device is mounted can be formed on the housing. Additionally or alternatively, the circuit board assembly can be fixed to the housing by screwing and / or latching or the like. Thus, the holding means can be provided, additionally or alternatively, by corresponding locking elements and / or screws and / or fixing means that securely fix the cooling device to the housing while the circuit board is being pivoted to the intermediate position or when the circuit board is in the intermediate position.

[0030] Preferably, the at least one guide element is provided by respective guide rails formed on opposite side walls of the housing. Thus, when being displaced along the guide rails, the circuit board and the support plate holding the circuit board are particularly securely guided respectively. Also, by providing the guide rails, the handling of the circuit board and the support plate during displacement becomes easier respectively.

[0031] Preferably, the guide rails are inclined with respect to the bottom wall of the housing. By arranging at least one cooling device at least substantially parallel to the bottom wall of the housing, it is very easily realized to displace the circuit board to the intermediate position or outside the intermediate position along these inclined guide rails.

[0032] Preferably, the circuit boards arranged one above the other in the vertical direction of the housing at the mounting position are connected to a further circuit board by connecting elements, and the further circuit board is arranged on the rear side of the housing. The rear side faces the front access opening of the housing. In this way, the connection of the circuit board to the further circuit board is simultaneously realized by moving the circuit board to the mounting position. This is advantageous in terms of simplifying the mounting of the circuit board assembly.

[0033] Preferably, the circuit board arrangement comprises a plurality of assemblies, each assembly including a cooling device and at least one circuit board that can be cooled by the cooling device. Here, gaps are formed between adjacent assemblies. On the one hand, gaps exist between assemblies to pivot the circuit board from the mounting position to an intermediate position. On the other hand, the gaps allow easy access to each assembly and ensure improved heat dissipation.

[0034] It may be assumed that the assemblies can be installed into and / or removed from the housing independently of each other. In this way, pre-installed assemblies can be installed into the housing, particularly to the extent that the cooling unit and circuit board are initially installed in the housing. This enables efficient and rapid installation. If the assembly including the cooling unit is removable from the housing together with the circuit board, the cooling unit can be replaced together with the circuit board as needed. This is advantageous, for example, in the case of maintenance or repair.

[0035] Preferably, the at least one cooling device includes a first side facing a first circuit board and a second side facing a second circuit board. Here, the first and second circuit boards are thermally coupled to the same cooling device via a heat transfer element. By arranging the two circuit boards on the sides of at least one cooling device facing each other in this way, the cooling performance of the cooling device can be utilized very efficiently for cooling multiple circuit boards.

[0036] Preferably, each structural element is positioned on a side wall of the housing that faces each other laterally, and each structural element has at least a support area for at least one cooling device. Here, the support areas that are lower in the vertical direction of the housing are less far apart laterally than the support areas that are higher in the vertical direction of the housing. Thus, it is ensured that only cooling devices that fit precisely, or whose size is relative to the distance of the support areas from each other, can be positioned at each height position of the housing. In particular, the installation order of cooling devices in the housing can be predetermined very easily in this way.

[0037] Thus, in accordance with the poka-yoke principle, it can be further ensured that each cooling device is positioned only in its intended location within the housing. This is advantageous in that the components of the circuit board assembly are mounted in the correct order, and the entire circuit board assembly is mounted correctly.

[0038] The support region may include a screw-in opening and / or a receiving portion such as a retaining pin, allowing at least one of the cooling devices to be fixed to the support region of the structural element. Thus, a robust and simple fixation of the cooling device in the housing can be achieved.

[0039] Similar to the cooling devices described, structural elements may have lateral distances from each other at each height position that allow for the placement of only one circuit board precisely corresponding to each distance at that height position. In this way, it can be ensured that the circuit boards associated with each cooling device are placed in the housing only in a predetermined mounting order and / or in predetermined positions. This is also advantageous in terms of mounting accuracy and process reliability in the manufacturing of the circuit board assembly.

[0040] There are further advantages to installing the cooling devices and / or circuit boards in the housing in a predetermined order by the structural elements from above in the vertical direction of the housing. This installation order, in which these components are introduced into the housing from above, allows for easy and intended placement of each heat transfer element between each cooling device and at least one circuit board associated with that cooling device.

[0041] A circuit board layout can include multiple housings. Therefore, scaling of the circuit board layout can be made very easy. In particular, the housings of the circuit board layout can be fixed to one another. Thus, a modular structure of the circuit board layout can be realized very easily. Furthermore, the stationary positioning of each housing is achieved in this way.

[0042] The housings may be arranged such that the side walls of adjacent housings abut each other. Additionally or alternatively, at least one side wall of a first housing abuts the bottom wall and / or top wall of at least a second housing. In this way, the installation space requirements to be considered for housing the housings can be easily and very broadly considered.

[0043] When a circuit board arrangement includes multiple housings that are fixed to each other, it may be conceivable that the housings be stacked vertically on top of each other such that the side walls of adjacent housings are aligned with each other. This improves access to the circuit boards and the assemblies containing the circuit boards, and makes replacement of the circuit boards and / or assemblies particularly easy.

[0044] Such a modular structure of a circuit board arrangement including multiple housings allows for the arrangement of circuit boards within housings and assemblies containing circuit boards within housings in a simple and flexible manner.

[0045] In the housing described above, at least two circuit boards, positioned vertically relative to each other, are arranged in a sandwich-like structure between two cooling devices. Therefore, very good heat dissipation from the circuit boards via the two cooling devices is possible. Additionally or alternatively, two cooling devices, positioned vertically relative to each other, are arranged in a sandwich-like structure between two circuit boards. This is also advantageous in that heat is efficiently dissipated from the circuit boards.

[0046] The features and combinations of features described in the above description, as well as the features and combinations of features described in the description of the drawings, and / or the features and combinations of features shown only in the drawings, can be used not only in the specified combinations but also in other combinations without departing from the scope of the invention. Accordingly, embodiments that are not explicitly shown or described in the drawings but can be derived from and generated from the described embodiments are also considered to be included and disclosed by the present invention. Furthermore, combinations of embodiments and functions are also considered to be disclosed. Accordingly, they do not include all the functions of the independent claims that were initially formulated. Moreover, combinations of embodiments and functions that exceed or deviate from the scope of the combinations of functions formulated in relation to the claims are considered to be disclosed in particular by the embodiments described above.

[0047] Further features of the present invention will become apparent from the claims, drawings, and description of the drawings. [Brief explanation of the drawing]

[0048] [Figure 1] A schematic perspective view of a circuit board in a mounting assembly, wherein an inclined guide rail is formed on the side wall of the housing of the circuit board assembly. [Figure 2] Side view of the circuit board layout shown in Figure 1. [Figure 3]Figure 1 schematically shows a circuit board arrangement, in which the cooling device is positioned in its intended installation or mounting position within the housing, and the circuit board, placed on a support plate, is displaced along a guide rail. [Figure 4] Figure 1 shows an exploded view of the circuit board layout. [Figure 5] Figure 1 shows a perspective view of the housing of the circuit board layout. [Figure 6] Figure 1 is a cross-sectional view of a circuit board arrangement, showing individual circuit boards and cooling devices in their respective mounting positions. [Figure 7] Figure 6 shows a perspective view of the circuit board layout. [Figure 8] This is an exploded view of a modified circuit board layout, in which the structural elements are arranged on the side wall of the housing. [Figure 9] Figure 8 shows a perspective view of the housing of the circuit board layout. [Figure 10] The assembled circuit board layout as shown in Figure 8. [Figure 11] A circuit board arrangement in which two housings formed according to Figure 8 are arranged side by side, with the side walls of the housings in contact with each other. [Figure 12] A modified example of a two-housing arrangement formed according to Figure 8 of the circuit board arrangement, in which the side wall of the first housing abuts against the ceiling of the second housing. [Figure 13] A further modification of the housing of a circuit board arrangement, in which an assembly including a circuit board is arranged in a different orientation within each housing. [Figure 14] Figure 13 shows a diagram of the housings in a connected state, where the side walls of adjacent housings of the circuit board arrangement are aligned with each other. [Modes for carrying out the invention]

[0049] In drawings, identical or functionally identical elements are given the same reference numeral.

[0050] Figure 1 shows a schematic and perspective view of a circuit board arrangement 10 having a housing 12 on which a plurality of circuit boards 14 are arranged. When viewed in the vertical z direction of the housing 12, the circuit boards 14 are arranged vertically relative to each other within the housing 12. The circuit boards 14 may, in particular, be components of one or more electronic control devices or electronic control units of a vehicle in which the circuit board arrangement 10 is provided.

[0051] Two of the circuit boards 14 shown illustratively and schematically in Figure 1 are shown in their mounting or installation positions within the housing 12. That is, they are the two circuit boards 14 that are located downwards when viewed in the vertical z direction. In contrast, the third of the three circuit boards 14 shown illustratively in Figure 1 is pushed into the housing 12, that is, substantially in the depth direction x of the housing 12. The depth direction x, as well as the vertical z and transverse y directions of the housing 12, are schematically shown in the coordinate system of Figure 1.

[0052] In the structure of the circuit board arrangement 10 shown in Figure 1, a cooling device 16 through which a cooling fluid, particularly in the form of a liquid coolant or coolant liquid, can pass is associated with each of the circuit boards 14. For this purpose, each cooling device 16, formed in the form of a cooling plate, is provided with a coolant inlet 18 and a coolant outlet 20. For clarity in Figure 1, each of the coolant inlets 18 and each of the coolant outlets 20 are not denoted by a reference numeral.

[0053] As is particularly clear from the cross-sectional views of the circuit board arrangement 10 in Figures 3, 7, and 6, when the cooling devices 16 are in their mounting positions and are arranged vertically in the housing 12 in the vertical direction z, each coolant inlet 18 and each coolant outlet 20 can be accessed through the front access opening 22 of the housing 12. Here, each coolant inlet and each coolant outlet 20 protrudes beyond the front edges of the side walls 24 and 26 of the housing 12. The side walls 24 and 26 of the housing 12 face each other in the lateral direction y of the housing 12.

[0054] As is particularly clear from Figures 2 and 6, each circuit board 14 does not directly and extensively contact the bottom surface of the respective cooling device 16 associated with each circuit board 14. More precisely, each circuit board 14 is thermally coupled to the respective cooling device 16 via at least one heat transfer element 30. In the present example, the at least one heat transfer element 30 is formed as a thermally conductive paste.

[0055] As is clear from the exploded view of the circuit board arrangement 10 in Figure 4, each heat transfer element 30 is formed in the form of a portion of thermally conductive paste between the bottom surface 28 of each cooling device 16 and the top surface 32 of each circuit board 14 facing these bottom surfaces 28. In this example, the heat transfer elements 30 in the form of thermally conductive paste ensure good thermal coupling of the circuit board 14 to each cooling device 16. This allows the heat released during the operation of the circuit board 14 to be effectively dissipated through the coolant flowing through the cooling device 16 during the operation or cooling operation of the cooling device 16.

[0056] In the manufacture of the circuit board assembly 10, as is clear from Figures 1 and 2, the circuit boards 14 and each cooling device 16 associated with at least one of the circuit boards 14 can be provided in the housing 12. Thus, each circuit board 14 can be placed on a support plate 34 formed in a pull-out manner. The cooling device 16 is placed on each circuit board 14 with a heat transfer element 30 interposed therebetween. Preferably, each circuit board 14 is fixed to the support plate 34 by means of, for example, screws and / or locks.

[0057] Each support plate 34 is provided with its own stud element 36. The stud elements 36 function as guide studs or guide pins on the narrow side facing the side walls 24, 26 of the housing 12 in the lateral direction y of the housing 12 (see Figures 2 and 3 in particular). These stud elements 36 can be displaced individually along guide elements of the housing 12 provided by guide rails 38, which are formed on the side walls 24, 26 of the housing 12 facing each other in the lateral direction y of the housing 12 (see Figure 5). As is particularly clear from Figure 5, these guide rails 38 are inclined with respect to the bottom wall 40 of the housing 12.

[0058] The stud elements 36 are displaceable along these guide rails 38 until each stud element 36 is received in a locking recess 42 formed in the end region of each guide rail 38. The locking recess 42 formed in the rear end region of the guide rail 38 is particularly clear from the perspective view of the housing 12 in Figure 5.

[0059] When the support plate 34 is introduced into the housing 12, the circuit board 14 is also displaced along the guide elements, which in the current example are formed as guide rails 38. When the stud elements 36 are received in the locking recesses 42, each support plate 34 and, consequently, each circuit board 14 is in an intermediate position. At this intermediate position of the circuit board 14, each circuit board 14—and in the current example, the support plate 34—is inclined with respect to the bottom wall 40 of the housing 12.

[0060] In contrast, at the mounting position of each circuit board 14, the circuit board 14 is substantially parallel to the bottom plate or bottom wall 40 (see Figures 2 and 6). To move each circuit board 14 from the intermediate position to the mounting position, the support plate 34, and consequently each circuit board 14, can pivot simultaneously around a pivot axis 44. The pivot axis 44 is formed by a stud element 35, and its approximate position is schematically shown in Figure 1 in the region of two locking recesses 42 that face each other in the lateral direction of the housing.

[0061] When the support plate 34 is pivoted together with the circuit board 14 from an intermediate position to a mounting position, the locking element, which in this example is formed as a locking pin 46, engages with the mating object, which is formed as a locking opening 48. The locking openings 48 corresponding to the locking pins 46 of each support plate are formed in the respective side walls 24, 26 of the housing 12. In Figure 5, the locking opening 48 formed in the left side wall 24 is particularly clearly shown in Figure 5.

[0062] Each circuit board 14 is positioned in its mounting location as the locking pins 46 of each support plate 34 are received in the associated or corresponding locking openings 38. Once each circuit board 14 is in its mounting location, at least one heat transfer element 30 located on each circuit board 14 contacts the bottom surface 28 of each cooling device 16. From this mounting position, the cooling device 16 remains stationary, while the support plates 34 and the circuit boards 15 located on the support plates 34 can pivot around the pivot axis 44 to reach an intermediate position. This is shown in Figure 3.

[0063] At the intermediate position of the support plate 34 and thus the circuit board 14, the edge region 50 of the circuit board 14 away from the pivot shaft 44 is further away from the cooling device 16 than at the mounting position. Therefore, at the intermediate position, the circuit board 14 pivots slightly downward around the pivot shaft 44 together with the support plate 34 in the current example. As a result, a gap exists between the top surface 32 of the circuit board 14 and the bottom surface 28 of the cooling device 16. This gap gradually increases from the pivot shaft 44 toward the access opening 22 of the housing 12.

[0064] This gap between the top surface 32 of the circuit board 14 and the bottom surface 28 of the cooling device 16 allows the heat transfer element 30, which is in the form of a thermally conductive paste in the current example, to be placed on the top surface 32 of the circuit board 14 without the heat transfer element 30 coming into contact with the bottom surface 28 of the cooling device 16, and also allows the circuit board 14 to be displaced to an intermediate position when replacing the circuit board 14. This is particularly clear from Figure 3.

[0065] Specifically, Figure 3 shows the step of installing the replaced or updated circuit board 14 into the housing 12. In this installation step, the cooling device 16 may remain in its installation position, i.e., in a position where the bottom surface 28 of the cooling device 16 is substantially parallel to the bottom wall 40. The stud elements 36 are displaced in the installation direction along the guide elements, which in the form of guide rails 38 in the current example. This is indicated by arrow 52 in Figure 4. In the current example, the installation direction extends parallel to the guide rails 38.

[0066] As the circuit board 14 moves along the rail 38 toward the intermediate position in the mounting direction, the heat transfer element 30, which in this current example is in the form of a thermally conductive paste, does not come into contact with the bottom surface 28 of the cooling device 16 until both the support plate 34 and the circuit board 14 reach the intermediate position.

[0067] Next, when the support plate 34 is pivoted from the intermediate position to the mounting position together with the circuit board 14 placed on the support plate 34, the heat transfer element 30 comes into contact with the bottom surface 28 of the cooling device 16 (see Figure 3). Therefore, at the mounting position of the circuit board 14, the heat transfer element 30 comes into contact with both the cooling device 16 and the circuit board 14 (see Figure 6).

[0068] Therefore, if at least one of the circuit boards 14 needs to be replaced, the circuit board 14 can first be pivoted around the pivot shaft 44 to each intermediate position where the heat transfer element 30 is spaced apart from the bottom surface 28 of the cooling device 16.

[0069] However, when the circuit board 14 is pulled out or removed from the housing 12, and when a replacement, for example, updated circuit board 14 is subsequently introduced into the housing, the heat transfer elements 30, which are formed as a thermally conductive paste in the current example and are placed on the top surface 32 of the circuit board 14, do not become contaminated or diffused. This makes it very easy to replace individual circuit boards 14.

[0070] When moving the support plate 34, and therefore similarly moving the circuit board 14 from the mounting position to an intermediate position, even if some or the remainder of the thermal conductive paste remains on the bottom surface 28 of the cooling device 16, this thermal conductive paste remaining on the housing 12 will not prevent the circuit board 14 from being removed from the housing 12, nor will it prevent the housing 12 from being fitted with a new, and / or updated, and / or repaired circuit board 14, preferably a circuit board 14 with a new portion or amount of thermal conductive paste applied to it.

[0071] In particular, when the cooling device 16 and circuit board 14 are initially installed in the housing 12, the process can proceed as shown in Figures 1 and 2. In this example, the assembly 54, which includes the circuit board 14 and the cooling device 16 associated with the circuit board 14, can be pushed into the housing 12. Here, the circuit board 14 is already thermally coupled to the cooling device 16 associated with it by the heat transfer element 30 as shown in Figure 2.

[0072] As shown in Figures 1 and 2, the assembly 54 may also include a support plate 34 formed in a retractable manner, particularly from sheet metal. Therefore, when replacing the circuit board 14 for maintenance and / or replacement, for example, the entire assembly 54 can be removed or pulled out from the housing 12.

[0073] However, when replacing at least one of the circuit boards 14, it is particularly possible to proceed as shown in Figure 3. Thus, the cooling device 16 associated with the circuit board 14 can remain stationary in the housing 12, and only the circuit board 14, which is positioned on the support plate 34, can be removed or pulled out of the housing 12 together with the support plate 34.

[0074] When the circuit board 14 is pulled out of the housing 12 in this manner, the support plate 34 and the circuit board 14 are displaced together with the support plate 34 along the guide element provided by the guide rail 38 in the present example, that is, in the opposite direction to the direction indicated by arrow 52 in Figure 4, to the outside of the housing 12.

[0075] When introducing the replaced circuit board 14 into the housing 12, the circuit board 14 can be displaced to an intermediate position along the guide elements, which in the form of a guide rail 38 in the current example, so that the stud elements 36 slide along the guide rail 38 until they reach the locking recesses 42 formed in the end region of the guide rail 38.

[0076] By simply pivoting the support plate 34 and, consequently the circuit board 14, to the mounting position, contact is established between the heat transfer element 30, positioned on the top surface 32 of the circuit board 14, and the bottom surface 28 of the cooling device 16, which is already positioned in the housing 12.

[0077] In particular, mounting of updated and / or new and / or repaired circuit boards 14 of this type can be achieved very easily by the inclination of the guide rails 38 of the circuit board holder 10. The orientation of the guide rails 38 inclined toward the bottom wall 40 or bottom plate of the housing 12 is particularly clear from Figure 5.

[0078] If the support plate 34 is displaced in the housing 12 along the inclined guide rail 38, but rather displaced parallel to or perpendicular to the bottom surface 28 of the cooling device 16, undesirable contamination of the thermal conductive paste may occur, but this is advantageously prevented in current examples.

[0079] Nevertheless, the circuit boards 14 are stacked on top of each other and arranged in a well-accessible manner within a housing 12 that is formed in a rack-like manner at the mounting position. Furthermore, good heat dissipation of the circuit boards 14 during operation can be achieved by providing a cooling device 16. The circuit boards 14 can be associated with their respective control entities or control devices. By arranging such multiple electronic control devices or electronic control units in the housing 12, a compact configuration of the circuit board arrangement 10 including such multiple control devices is advantageously achieved.

[0080] It is clear from both Figure 2 and Figure 3 that the stud elements 36 are received by the locking recesses 42 formed in the end region of the guide rail 38 at both the mounting position of the circuit board 14 and the intermediate position of the circuit board 14.

[0081] In the current example, it is particularly clear from Figures 1 and 5 that the circuit board holder 10, which is the housing 12, is equipped with a holding means formed to hold the cooling device 16 when the circuit board 14 is pivoted to an intermediate position. According to Figure 5, the holding means includes a holding bar 56 on which the cooling device 16 can be placed when the cooling device 16 is pushed into the housing 12 in the depth direction x. In particular, in Figure 5, the holding bar 56 located on the left side wall 24 is clearly visible.

[0082] In addition to, or in place of, the retaining bars 56, other and / or further retaining means may secure the cooling devices 16 in their predetermined positions within the housing 12. For example, by connecting the cooling devices 16 to the side walls 24, 26 by screws and / or locking, the circuit board 14 can remain in the housing 12 when pivoting together with the support plate 34 in the present example from its mounting position (see Figure 6) to an intermediate position. The corresponding locking elements and / or screw bolts forming the retaining means are not shown in detail in the present example for clarity.

[0083] It is further clear from Figure 1 that in the current example, an additional circuit board 58 substantially parallel to a plane spanning the vertical z and lateral y directions may be located on the rear side of the housing 12 opposite the front access opening 22. The arrangement of the additional circuit board 58, preferably functioning as a main circuit board, on the rear side of the housing opposite the front access opening 22 in the depth direction x of the housing 12 is also clear from the exploded view of the circuit board arrangement 10 in Figure 4.

[0084] At the rear end of each circuit board 14, the circuit board 14 in this example is provided with connecting elements 60. When the circuit board 14 is in its mounting position (see Figures 6 and 7), the circuit board 14 is connected to further circuit boards 58 via these rear connecting elements 60.

[0085] In contrast, further connection elements 62 of the circuit board 14 are accessible from the front access opening 22 of the housing 12. Through these further connection elements 62, data and / or electrical energy may be supplied to and from each component of the circuit board (not shown in detail in this example). These front connection elements 62 or connections are particularly clear in the perspective view of the circuit board arrangement 10 shown in Figure 7.

[0086] From the cross-sectional view in Figure 6 and the perspective view in Figure 7, it is clear that a gap is formed between each individual assembly 54, which includes each cooling device 16 and at least one circuit board 14 that can be cooled by the cooling device 16. The size of the gap makes it very easy, in the current example, to pivot the circuit board 14 around the pivot axis 44 from its mounting position (see Figure 7) to an intermediate position where the edge region 50 of the circuit board 14 is further away from the cooling device 16 than it is at the mounting position.

[0087] In modified versions of the circuit board arrangement 10 not shown in detail in the current example, not only the bottom surface 28 of the cooling device 16, and therefore the first side surface, but also the second side surface, which is in the form of the top surface 64 in each cooling device 16 or at least one of the cooling devices 16 in the current example, is used to cool each circuit board 14.

[0088] Such use of the cooling device 16 for cooling two circuit boards 14 will be described with reference to Figure 8. Here again, an additional circuit board 58, which functions as the main circuit board, is located on the rear side of the housing 12. However, one of the circuit boards 14 is thermally coupled to the cooling device 16 by a heat transfer element 30 not only on the bottom surface 28 of the cooling device 16. More precisely, at least one heat transfer element 30, preferably in the form of a thermally conductive paste, is similarly positioned between the top circuit board 14 and the top surface 64 of the cooling device 16.

[0089] As shown in Figure 8, the circuit board 14 and the cooling device 16 can be introduced together with the heat transfer elements 30 positioned opposite each other in the vertical z direction of the housing 12. The corresponding mounting direction is indicated by arrow 68 in Figure 8. Here again, it can be seen that it is very easy to position the heat transfer elements 30 between the respective surfaces of the circuit board 14 and the bottom surface 28 and top surface 64 of the cooling device 16. The circuit board 14, the heat transfer elements 30, and the cooling device 16 can be introduced into the housing 12 in a continuous manner from above, corresponding to the direction indicated by arrow 66.

[0090] In the modified circuit board arrangement 10 shown in Figure 8, the cooling device 16 is also provided with a coolant inlet 18 and a coolant outlet 20, respectively, through which a coolant, especially in the form of a coolant liquid, can pass through the cooling device 16.

[0091] Figure 8 further shows the cover 68, which has an L-shaped cross-section in the current example. The cover 68 forms the rear wall 70 and the top wall 72 of the housing 12 when the circuit board assembly 10 is mounted (see Figure 10).

[0092] It is clear from Figure 9 that the structural element 74 can be positioned on the opposing side walls 24 and 26 of the housing 12 in the lateral direction y. The structural element 74 pre-sets the installation sequence for introducing the circuit board 14 and the cooling device 16 into the housing 12 from above, and therefore in the direction of arrow 66 (see Figure 8).

[0093] The columnar structural elements 74 ensure the poka-yoke principle for the correct placement of the circuit board 14 and cooling device 16 in the housing 12. For this purpose, the structural elements 74 have, on the one hand, support areas 76 for each circuit board 14 formed on the top surface of each step of the structural elements 74. Similarly, the columnar structural elements 74 have further support areas 78. When the circuit board 14 and cooling device 16 are placed in the housing 12, the bottom surface 28 of each cooling device 16 rests on the support areas 78.

[0094] In the vertical z direction of the housing 12, the lower support areas 78 of each cooling device 16 are closer together than the upper support areas 78 of the housing 12 in the vertical z direction. Here, the distance is measured in the lateral y direction of the housing 12. Therefore, the lower cooling device 16 in Figure 8 can only be placed in the lower support area 78. Conversely, the upper cooling device 16 in Figure 8 can only be placed in the upper support area 78. For this reason, the installation position and installation order of each cooling device 16 in the housing 12 are predetermined by the distance between the support areas 78 in the lateral y direction.

[0095] Similarly, the support areas 76 for each circuit board 14 can be progressively closer to each other in the z-direction of the housing 12. The distance is measured in the y-direction of the housing 12. Thus, it is ensured that each circuit board 14 can only be positioned in a predetermined location within the housing 12.

[0096] In the current example, to fix the components, which are in the form of a circuit board 14 and a cooling device 16, to the respective heights of the housing 12 or structural element 74, screw-in openings and / or insert-in openings may be provided in the support areas 76 and 78. By introducing screws into the screw-in openings or screw holes, or pins into the insert-in openings, the circuit board 14 and the cooling device 16 can be easily and detachably fixed to the housing 12.

[0097] Since the installation order for the circuit board 14 and the cooling device 16 is predetermined by the structural element 74 when they are introduced into the housing 12, it is easy to replace the circuit board 14 and to introduce the heat transfer element 30 between the circuit board 14 and each cooling device 16.

[0098] The sandwich-like structure in which the cooling devices 16 are positioned between each lower circuit board 14 and each upper circuit board 14 in the housing 12 is clearly visible in Figure 10.

[0099] It is clear from Figure 11 that the circuit board arrangement 10 may consist of a plurality of housings 12, and in particular may include housings 12 that are fixed to each other. Here, according to Figure 11, the side walls 24 and 26 of adjacent housings 12 may come into contact with each other. For example, the side wall 26 of the housing 12 on the left in Figure 11, which is on the right in Figure 11, may come into contact with the side wall 24 of the housing on the right in Figure 11, which is on the left in Figure 11.

[0100] However, other types of housings 12 can also be arranged and / or fixed to each other. This will be explained with reference to Figure 12. In the arrangement shown in Figure 12, the side wall 26 of the first housing 12, which is on the right in Figure 12, abuts against the top wall 72 of the second housing 12. Additionally or alternatively, one of the side walls 24, 26 of the first housing 12, i.e., the housing 12 on the left in Figure 12, may abut against the bottom wall 40 of the housing 12, which is on the right in Figure 12.

[0101] In such a circuit board arrangement 10, the horizontal arrangement of the cooling device 16 and the circuit board 14 (see Figure 11), and / or the vertical arrangement of the cooling device 16 and / or the circuit board 14 (see Figure 12) can be provided in particularly preferred combinations.

[0102] Additionally or alternatively, the circuit board arrangement 10 may include a two-stage or multi-stage housing in which the housings 12 shown in Figure 11 or Figure 12 are integrally formed with each other.

[0103] In each of the housings 12 shown in Figures 11 and 12, a sandwich-like structure is realized in which the cooling device 16 is arranged between the respective circuit boards 14, as described for one of the housings 12 with reference to Figures 8 to 10.

[0104] Further possibilities for arranging interconnectable circuit boards 14 in the housing 12, particularly together with at least one cooling device 16, will be described with reference to Figures 13 and 14.

[0105] The circuit board arrangement 10 shown in Figure 13 includes a first housing 12, which is the upper one in Figure 24; a second housing 12, which is the middle one in Figure 13; and a third housing 12, which is the lower one in Figure 13. Here, the housings 12 are stacked vertically on top of each other so that the side walls 24 and 26 of adjacent housings 12 are aligned with each other. In Figure 13, the individual housings 12 are shown not yet connected to each other, but in Figure 14, the housings 12 are fixed to each other.

[0106] In this circuit board arrangement 10, guide elements in the form of guide bars 80 are arranged on side walls 24 and 26 that face each other in the lateral direction y. For clarity, only some of these are given reference numerals. Here, it can be assumed that the entire assembly 54 is movable or displaceable along the guide bars 80 in the depth direction of the housing 12 in order to introduce the assembly 54 into the housing 12.

[0107] In the configuration of the assembly 54 shown in the upper part of Figure 13, the cooling device 16 (not shown in detail in Figure 13) may be positioned between the upper circuit board 14 and the lower circuit board 14. None of these circuit boards 14 are clearly shown in Figure 13. In Figure 13, only the assembly housing 82 in which the two circuit boards 14 are arranged is shown. Here, the assembly housing 82 is equipped with a coolant inlet 18 and a coolant outlet 20. This arrangement allows for efficient cooling of both circuit boards 14 by the centrally located cooling device 16. At the same time, the entire assembly 54 can be easily removed from the housing 12 and replaced.

[0108] In Figure 13, in the housing 12 positioned in the middle section, two assembly housings 82 are positioned vertically relative to each other. Here, the two assembly housings 82 can be positioned vertically relative to each other, or they can be in contact with each other. Only the lower of the two assembly housings 82 rests on guide bars 80 formed on the opposing side walls 24, 26 of the housing 12. Furthermore, the upper assembly housing 82 is equipped with a dedicated coolant inlet 18 and a dedicated coolant outlet 20, and the lower assembly housing 82 is also equipped with a dedicated coolant inlet 18 and a dedicated coolant outlet 20.

[0109] In this arrangement, the circuit boards 14 (not clearly shown in Figure 13) present in each assembly housing 82 may be arranged adjacent to each other or facing each other. The two circuit boards 14 of the two assembly housings 82 placed one above the other are positioned between an upper cooling device 16 and a lower cooling device 16 (not clearly shown in Figure 13) in a sandwich-like structure. Here, the upper cooling device 16 is associated with the upper assembly housing 82, and the lower cooling device 16 is associated with the lower assembly housing 82.

[0110] Therefore, the two assembly housings 82 can be arranged so as to be mirror images of each other with respect to a plane parallel to the planes extending in the depth direction x and the transverse direction y. However, it is also possible to arrange two separate assembly housings 82 such that the circuit board 14 and the cooling device 16 are arranged alternately in the stacking direction. Here again, the two assembly housings 82 can be in contact with each other.

[0111] In the arrangement of the assembly housings 82 shown in the lower part of Figure 13, a gap 84 (see Figure 14) is formed between each assembly housing 82 in the housing 12 of the circuit board arrangement body 10. Here, the circuit board 14 (not shown) and the cooling device 16 (also not shown) are arranged in each of the assembly housings 82. Even in the arrangement of the assemblies 54 shown in the lower part of Figure 13, which are arranged vertically, each of the assembly housings 82 is equipped with a dedicated coolant inlet 18 and a dedicated coolant outlet 20.

[0112] In Figure 13, the lower assembly 54 can be pushed into the housing 12 along the bottom wall 40. In contrast, the upper assembly 54 can be pushed into the housing 12 along the guide bar 80.

[0113] In Figure 14, the assemblies 54 arranged in each housing 12 are shown in a front view of the circuit board assembly 10, in which the individual housings 12 are connected to one another. Here, in the lower region of the circuit board assembly 10, the individual assemblies 54 are arranged vertically to one another, forming a gap 84 between them. Also, two individual assemblies 54 are arranged vertically to one another in the aforementioned housing 12. In contrast, in the upper housing 12 in Figure 14, the opposite arrangement is shown, with a cooling device 16 (not shown) positioned between the circuit boards 14 (similarly not shown) in the vertical z direction.

[0114] The modular configuration of the housing 12, as shown in Figures 13 and 14, allows for particularly flexible configuration of the circuit board layout 10, and enables easy replacement of the circuit board layout 10 assembly 54 and the corresponding control unit or electronic control unit, respectively.

Claims

1. A circuit board arrangement (10) having at least one housing (12) on which a plurality of circuit boards (14) are arranged, and at least one cooling device (16) through which a cooling fluid can pass, and which is formed to dissipate heat from at least one of the circuit boards (14), wherein at least one of the circuit boards (14) is thermally coupled to the at least one cooling device (16) via at least one heat transfer element (30), Each of the circuit boards (14) is pivotable around a pivot shaft (44) from a mounting position in which the heat transfer element (30) contacts both the at least one cooling device (16) and the circuit board (14) to an intermediate position. At the aforementioned intermediate position, the edge region (50) of the circuit board (14) away from the pivot axis (44) is further away from the at least one cooling device (16) than it is at the mounting position. The housing (12) includes at least one guide element (38), When introducing the circuit board (14) into the housing (12), each of the circuit boards (14) is displaceable to the intermediate position along the at least one guide element (38). When introducing the cooling device (16) into the housing (12), the cooling device (16) is displaceable along the at least one guide element (38) while being associated with at least one of the circuit boards (14) via the heat transfer element (30). A circuit board arrangement (10) characterized by the above.

2. When removing the circuit board (14) from the housing (12), each of the circuit boards (14) is displaceable to the outside of the housing (12) along the at least one guide element (38), starting from the intermediate position. The circuit board arrangement (10) according to feature 1.

3. A circuit board arrangement (10) having at least one housing (12) on which a plurality of circuit boards (14) are arranged, and at least one cooling device (16) through which a cooling fluid can pass, the cooling device (16) being formed to dissipate heat from at least one of the circuit boards (14), wherein at least one of the circuit boards (14) is thermally coupled to the at least one cooling device (16) via at least one heat transfer element (30), Each of the circuit boards (14) is pivotable around a pivot shaft (44) from a mounting position in which the heat transfer element (30) contacts both the at least one cooling device (16) and the circuit board (14) to an intermediate position. At the aforementioned intermediate position, the edge region (50) of the circuit board (14) away from the pivot axis (44) is further away from the at least one cooling device (16) than it is at the mounting position. The housing (12) includes at least one guide element (38), When introducing the circuit board (14) into the housing (12), each of the circuit boards (14) is displaceable to the intermediate position along the at least one guide element (38). The heat transfer element (30) is formed as a thermally conductive paste that is spaced apart from the at least one cooling device (16) at the intermediate position of the circuit board (14) and in contact with the circuit board (14). A circuit board arrangement (10) characterized by the above.

4. A circuit board arrangement (10) having at least one housing (12) on which a plurality of circuit boards (14) are arranged, and at least one cooling device (16) through which a cooling fluid can pass, the cooling device (16) being formed to dissipate heat from at least one of the circuit boards (14), wherein at least one of the circuit boards (14) is thermally coupled to the at least one cooling device (16) via at least one heat transfer element (30), Each of the circuit boards (14) is pivotable around a pivot shaft (44) from a mounting position in which the heat transfer element (30) contacts both the at least one cooling device (16) and the circuit board (14) to an intermediate position. At the aforementioned intermediate position, the edge region (50) of the circuit board (14) away from the pivot axis (44) is further away from the at least one cooling device (16) than it is at the mounting position. The housing (12) includes at least one guide element (38), When introducing the circuit board (14) into the housing (12), each of the circuit boards (14) is displaceable to the intermediate position along the at least one guide element (38). Each of the circuit boards (14) is placed on a support plate (34) that is displaceable along at least one guide element (38). A circuit board arrangement (10) characterized by the above.

5. The support plate (34) is provided with at least one locking element (46) that engages with a mating part (48) provided on the side surface of the housing (12) at the mounting position of the circuit board (14). The circuit board arrangement (10) according to feature 4.

6. The support plate (34) comprises at least one stud element (36) that forms the pivot axis (44), The at least one stud element (36) is a locking recess (42) provided on the side surface of the housing (12), and is particularly received in the locking recess (42) formed in the end region of the at least one guide element (38) at both the mounting position and the intermediate position of the circuit board (14). The circuit board arrangement (10) according to feature 4 or 5.

7. The circuit board arrangement (10), in particular the housing (12), includes a holding means (56) formed to hold the at least one cooling device (16) while the circuit board (14) is pivotally positioned in the intermediate location. A circuit board arrangement (10) according to any one of claims 1, 3, or 4.

8. A circuit board arrangement (10) having at least one housing (12) on which a plurality of circuit boards (14) are arranged, and at least one cooling device (16) through which a cooling fluid can pass, the cooling device (16) being formed to dissipate heat from at least one of the circuit boards (14), wherein at least one of the circuit boards (14) is thermally coupled to the at least one cooling device (16) via at least one heat transfer element (30), Each of the circuit boards (14) is pivotable around a pivot shaft (44) from a mounting position in which the heat transfer element (30) contacts both the at least one cooling device (16) and the circuit board (14) to an intermediate position. At the aforementioned intermediate position, the edge region (50) of the circuit board (14) away from the pivot axis (44) is further away from the at least one cooling device (16) than it is at the mounting position. The housing (12) includes at least one guide element (38), When introducing the circuit board (14) into the housing (12), each of the circuit boards (14) is displaceable to the intermediate position along the at least one guide element (38). The at least one guide element is provided by guide rails (38) formed on the opposing side walls (24, 26) of the housing (12) and inclined in particular with respect to the bottom wall (40) of the housing (12), A circuit board arrangement (10) characterized by the above.

9. At the aforementioned mounting position, the circuit boards (14) arranged vertically (z) relative to each other in the vertical direction (z) of the housing (12) are connected to a further circuit board (58) located on the rear side of the housing (12) by connecting elements (60). The aforementioned rear side faces the front access opening (22) of the housing (12), The circuit board arrangement (10) according to any one of claims 1, 3, 4, or 8.

10. A circuit board arrangement (10) having at least one housing (12) on which a plurality of circuit boards (14) are arranged, and at least one cooling device (16) through which a cooling fluid can pass, the cooling device (16) being formed to dissipate heat from at least one of the circuit boards (14), wherein at least one of the circuit boards (14) is thermally coupled to the at least one cooling device (16) via at least one heat transfer element (30), Each of the circuit boards (14) is pivotable around a pivot shaft (44) from a mounting position in which the heat transfer element (30) contacts both the at least one cooling device (16) and the circuit board (14) to an intermediate position. At the aforementioned intermediate position, the edge region (50) of the circuit board (14) away from the pivot axis (44) is further away from the at least one cooling device (16) than it is at the mounting position. The housing (12) includes at least one guide element (38), When introducing the circuit board (14) into the housing (12), each of the circuit boards (14) is displaceable to the intermediate position along the at least one guide element (38). The circuit board arrangement (10) comprises a plurality of assemblies (54) that can be independently installed into and / or removed from the housing (12), Each assembly (54) includes a cooling device (16) and at least one circuit board (14) that can be cooled by the cooling device (16), A gap is formed between adjacent assemblies (54), A circuit board arrangement (10) characterized by the above.

11. A circuit board arrangement (10) having at least one housing (12) on which a plurality of circuit boards (14) are arranged, and at least one cooling device (16) through which a cooling fluid can pass, the cooling device (16) being formed to dissipate heat from at least one of the circuit boards (14), wherein at least one of the circuit boards (14) is thermally coupled to the at least one cooling device (16) via at least one heat transfer element (30), Each of the circuit boards (14) is pivotable around a pivot shaft (44) from a mounting position in which the heat transfer element (30) contacts both the at least one cooling device (16) and the circuit board (14) to an intermediate position. At the aforementioned intermediate position, the edge region (50) of the circuit board (14) away from the pivot axis (44) is further away from the at least one cooling device (16) than it is at the mounting position. The housing (12) includes at least one guide element (38), When introducing the circuit board (14) into the housing (12), each of the circuit boards (14) is displaceable to the intermediate position along the at least one guide element (38). The circuit board arrangement (10) includes, in particular, a plurality of housings (12) fixed to each other. The side walls (24, 26) of adjacent housings (12) abut against each other, and / or at least one side wall (24, 26) of the first housing (12) abuts against at least the bottom wall (40) and / or the top wall (72) of the second housing (12). A circuit board arrangement (10) characterized by the above.

12. The circuit board arrangement (10) includes, in particular, a plurality of housings (12) fixed to each other. The housings (12) are stacked one above the other so that the side walls (24, 26) of adjacent housings (12) are aligned with each other. A circuit board arrangement (10) according to any one of claims 1, 3, 4, 8, 10, or 11.

Images