A control device arrangement having a heat transfer material arranged in the channel system of a circuit board unit, and a method for manufacturing the control device arrangement.

Abstract

The present invention relates to a control device arrangement (10) having a housing (22) in which at least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged. The at least one cooling device (26, 28) is configured to receive a cooling fluid during a cooling operation and to dissipate heat from the at least one circuit board unit (12, 14, 16, 18). The at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34). The circuit board unit (12, 14, 16, 18) has an outer wall (36) facing the cooling device (26, 28), the outer wall (36) having at least one recess formed therein. The heat transfer material (34) is arranged in the at least one recess. Furthermore, the present invention relates to a method for manufacturing such a control device arrangement (10).

Description

Technical Field

[0001] The present invention relates to a control device arrangement having a housing in which at least one circuit board unit and at least one cooling device are arranged. The at least one cooling device is formed such that a cooling fluid is supplied during a cooling operation and heat is dissipated from the at least one circuit board unit. The at least one circuit board unit is thermally coupled to the at least one cooling device via a heat transfer material. Further, the present invention relates to a method for manufacturing such a control device arrangement.

Background Art

[0002] The use of a heat transfer material between a circuit board and respective heat sinks arranged on opposite side surfaces of the circuit board is disclosed in U.S. Patent No. 7,609,523 B1.

[0003] Furthermore, U.S. Patent Application Publication No. 2014 / 0084449 describes a semiconductor package having a structured back surface facing a heat sink. This structuring is for better dispersing a heat conduction paste applied to the heat sink when the semiconductor package is screwed to the heat sink.

Summary of the Invention

[0004] It is an object of the present invention to provide a control device arrangement of the type described at the beginning that improves heat dissipation from a circuit board and to specify a method for manufacturing such a control board arrangement.

[0005] This object is achieved by a control device arrangement having the features of claim 1 and by a method having the features of claim 15. Advantageous configurations with useful developments of the present invention are specified in the dependent claims and the following description.

[0006] The control device arrangement according to the present invention includes a housing in which at least one circuit board unit and at least one cooling device are arranged. The at least one cooling device is supplied with a cooling fluid during cooling operation and is configured to dissipate heat from at least one circuit board unit. The at least one circuit board unit is thermally coupled to the at least one cooling device via a heat transfer material. The circuit board unit has an outer wall facing the cooling device, and at least one recess is formed in the outer wall. The heat transfer material is arranged in at least one recess.

[0007] By providing a heat transfer material, particularly efficient heat dissipation from the circuit board unit to the cooling device is achieved. During the cooling operation of the cooling device, heat is dissipated from the cooling device by the cooling fluid. This is based on the understanding that, in particular, if the outer wall of the circuit board unit and the outer wall of the cooling device are made of metal, the presence of a heat transfer material may reduce the efficiency of heat transfer from the circuit board unit to the cooling device compared to that case.

[0008] Furthermore, by providing at least one recess on the outer wall of the circuit board unit, the heat transfer material can be precisely positioned in a location particularly advantageous for heat dissipation during the operation of the circuit board unit. Since the heat transfer material fills at least a large portion of at least one recess, the precise positioning of the heat transfer material relative to the circuit board unit is further ensured. This can particularly prevent the formation of undesirable hot spots during the operation of the circuit board. This contributes to the permanent high performance of the circuit board unit.

[0009] Efficient heat dissipation from at least one circuit board unit is particularly advantageous when the control device configuration is used, for example, in a vehicle. In this case, at least one or more circuit board units are components of one or more electronic control devices or electronic control units in the vehicle.

[0010] Therefore, a situation can be considered in which multiple electronic control devices or electronic control units are typically installed in vehicles such as autonomous vehicles and / or electric vehicles, especially those driven solely by electricity. Here, the control devices may perform the tasks of at least one driver assistance function of the vehicle. Preferably, it is advantageous to arrange the circuit board units formed as components of such control devices for a vehicle in the housing of the control device assembly. This is because the circuit board units can be housed in the housing in a very compact, space-saving, and well-accessible manner. This is very advantageous when the control device assembly is used in a vehicle. Therefore, the present invention preferably relates to vehicles having a control device assembly, particularly automobiles.

[0011] In particular, the outer wall may be part of the shell of the circuit board unit, or at least one side cover, preferably at least the top and bottom covers. At least one circuit board of the circuit board unit is received in this shell. In particular, by making the shell or cover of the circuit board unit from a thin sheet of metal, good heat transfer from the circuit board unit to the cooling device is ensured by the heat transfer material. This is especially true if the corresponding wall of the cooling device is also made of metal.

[0012] Preferably, the heat transfer material is introduced into at least one recess through an inlet opening accessible from the narrow side of the circuit board unit at the installation location of the circuit board unit in the housing. Thus, at least a large portion of at least one recess can be filled with the heat transfer material in a simple procedure, even in space-constrained situations. Furthermore, introducing the heat transfer material into at least one recess through the inlet opening is possible even when both the circuit board unit and the cooling device are already in place in the housing. This can be achieved very easily in terms of fabrication, especially if the heat transfer material is formed as a thermal conductive paste, because such a thermal conductive paste has sufficient fluidity to be introduced into at least one recess through the inlet opening from the narrow side of the circuit board unit.

[0013] Preferably, at least one recess is formed as a channel system, the channel system includes at least one channel portion connected to at least one reservoir region of the channel system, the at least one reservoir region having a width greater than at least one channel portion of the channel system. By forming at least one recess as such a channel system, heat dissipation from the circuit board unit, which is advantageous for preventing the occurrence of hot spots during the operation of the circuit board unit and the cooling device, is very productively compensated for. Thus, operation of the control device arrangement is guaranteed in which overheating of the circuit board unit is permanently avoided.

[0014] Preferably, the channel system includes multiple reservoir regions, which are connected to each other via their respective channel sections. Therefore, for example, when manufacturing a control unit assembly, it becomes possible to intentionally position the heat transfer material within the reservoir regions. This is advantageous in terms of improving heat dissipation from the circuit board unit.

[0015] The reservoir region may have a depth greater than at least one channel. In this way, a very large amount of heat transfer material can be utilized in the reservoir region for heat dissipation toward the cooling device.

[0016] Additionally or alternatively, each reservoir region may have a different depth from the others. The depth of each reservoir region ensures that very good thermal coupling to the cooling device via the heat transfer material is achieved, in particular, at a given location on the circuit board unit. This contributes to improved heat dissipation from the circuit board unit.

[0017] Preferably, the heat accumulation region is formed in a section of the circuit board unit, where more heat is released during the operation of the circuit board unit than in the adjacent area. In this way, undesirable overheating is reliably prevented in these sections of the circuit board unit where a large amount of heat is released during operation. This is advantageous for the robust operation of the circuit board unit.

[0018] Preferably, the channel system includes at least one air outlet opening. Here, with at least one circuit board unit and at least one cooling device arranged in the housing of the control unit, air can be discharged from the channel system through at least one air outlet opening by introducing heat transfer material into the channel system. In this way, a large portion of the channel system can be filled with heat transfer material.

[0019] Preferably, at least one air outlet opening is located on a narrow side of the circuit board unit. This is because, while introducing the heat transfer material into the channel system, the air that has moved or been expelled from the channel system can be particularly easily discharged from the narrow side of the circuit board unit into the surrounding environment of the circuit board unit.

[0020] The circuit board unit may comprise a first region having a first thickness and a second region having a second thickness, wherein the second thickness is greater than the first thickness. Here, at least one recess is formed in the first region. Because the circuit board unit is thinner in the first region, the heat released during the operation of the circuit board unit can be directed particularly quickly and smoothly toward the outer wall where at least one recess is formed. In particular, if components of the circuit board unit that release a relatively large amount of heat during operation are located in the first region of the circuit board unit, providing at least one recess in the first region can ensure very good heat dissipation from these components toward the cooling device via heat transfer material. This is also advantageous for the permanently robust operation of the circuit board unit.

[0021] In particular, it is conceivable to form at least one recess only in the first region, and to ensure that there are no such recesses in the second region. Here, in particular, it is conceivable to not place any components of the circuit board unit that release a relatively large amount of heat during operation in the second region, which has a greater thickness than the first region, or to place only a small number of such components there.

[0022] In contrast, the second region ensures very good access, particularly to the connection elements of the circuit board unit. Specifically for this purpose, the side end face of the second region facing the opposite side of the cooling device can be accessed through an access opening formed in the housing of the control device assembly.

[0023] Preferably, the side end face of the second region adjacent to the first region faces the narrow side of the cooling device. Therefore, the circuit board unit with an L-shaped cross-section surrounds the cooling device over a very wide area. This is advantageous with respect to efficient heat dissipation from the circuit board unit by the cooling device.

[0024] Preferably, the control device arrangement comprises at least two circuit board units arranged mirror-image symmetrically with respect to each other in the housing. Here, the outer wall of each of the mirror-image symmetrically arranged circuit board units, each having at least one recess, faces the same cooling device. Therefore, heat can be dissipated very efficiently from both circuit board units by the cooling device positioned between the outer walls of the circuit board units. This contributes to the compact configuration of the control device arrangement.

[0025] Preferably, at least two cooling devices, formed as cooling plates, are arranged in the housing. Here, each cooling plate is received in a sandwich-like structure between two circuit boards. In this way, at least three, preferably four, circuit board units of the control unit assembly can be cooled very efficiently by the two cooling plates.

[0026] Preferably, during the cooling operation of the cooling device, the cooling fluid passes through at least one cooling device. Thus, the cooling fluid can ensure very efficient heat dissipation from the cooling device. For example, the cooling device may comprise a coolant inlet and a coolant outlet. Preferably, a cooling fluid, preferably in the form of a liquid coolant, is introduced into the cooling device via the coolant inlet, and the cooling fluid, i.e., the coolant, is discharged from the cooling device via the coolant outlet, so that at least one circuit board unit can be cooled during the cooling operation. By the cooling fluid, especially the liquid coolant, passing through the cooling device, very good heat absorption by at least one cooling device can be achieved.

[0027] In the housing, a plurality of circuit board units can be arranged one above the other in the vertical direction of the housing. Here, the circuit boards arranged one above the other in the vertical direction are connected to a further circuit board via their respective connecting elements. The further circuit board is arranged at the rear side of the housing, and the rear side is opposite to the front side access opening of the housing. In this way, by introducing the circuit board units into the housing, the connection of the circuit board units to the further circuit board can be realized simultaneously. This is advantageous with respect to the simple assembly of the control device arrangement. In particular, the further circuit board can be formed as the main circuit board of the control device arrangement.

[0028] Preferably, a pressure directed towards the cooling device is applied to the circuit board unit by at least one spring element. Thus, a particularly close contact between the circuit board unit and the heat transfer material can be realized.

[0029] In particular, this applies when the pressure acts on the region of the heat transfer material. Because by intentionally applying pressure to the circuit board unit in the region of the heat transfer material, very good thermal coupling of the circuit board unit to the cooling device via the heat transfer material can be achieved. Furthermore, irregularities such as flatness of the support surface and surface roughness, and further irregularities due to manufacturing tolerances can be well compensated by applying pressure to the circuit board unit in the region of the heat transfer material.

[0030] The heat transfer material to which pressure is applied by the spring element can be particularly formed as a heat conduction pad. At this time, especially when fabricating or manufacturing the control device arrangement, the heat transfer material can be handled very well. When manufacturing the control device arrangement, by arranging such a heat conduction pad in the region of at least one recess, intentional heat dissipation can be performed from a predetermined region of the circuit board unit.

[0031] Preferably, the circuit board unit includes at least one stud element that cooperates with a guide rail provided on the side of the housing. Here, when introducing the circuit board unit into the housing, the at least one stud element is guided along the guide rail. Therefore, mounting, and thus introducing, the circuit board unit into the housing becomes very simple and highly process-reliable.

[0032] The stud element can be placed on the guide rail on the bar or cooperate with the guide rail by engaging with a guide rail formed with a groove-shaped cross-section. Therefore, when the stud element engages with the guide rail, the introduction of the control device arrangement of at least one circuit board unit into the housing can be guided particularly accurately.

[0033] Preferably, pressure is applied to the stud element by the spring element. Therefore, the pressure can be very intentionally exerted on the circuit board unit.

[0034] Preferably, the guide rail includes a recess formed towards the cooling device in the region of the target position of the stud element. Here, the stud element is received in the recess. By providing a recess formed in the form of a locking depression in the guide rail, for example, by applying pressure to the stud element, very large movement or displacement of the circuit board unit towards the cooling device can be caused. This is advantageous for good heat transfer from the circuit board unit implemented by the heat transfer material to the cooling device.

[0035] Preferably, at least one spring element is fixed to the housing. At least one spring element includes legs. By introducing the circuit board unit into the housing along guide rails, the legs apply pressure to the stud elements acting toward the cooling device. Thus, pressure can be accurately applied to the stud elements while the spring elements have a simple configuration and arrangement.

[0036] Preferably, the circuit board unit comprises multiple stud elements, and a spring element acts on each stud element to apply pressure toward the cooling device. Therefore, a favorable distribution of contact pressure can be achieved, ensuring close contact between the circuit board unit and the cooling device by the heat transfer material.

[0037] In a method according to the present invention for manufacturing a control device arrangement, at least one circuit board unit and at least one cooling device are arranged in a housing of the control device arrangement. The at least one cooling device is supplied with a cooling fluid during cooling operation and is configured to dissipate heat from at least one circuit board unit. The at least one circuit board unit is thermally coupled to the at least one cooling device via a heat transfer material. The circuit board unit has an outer wall facing the cooling device. At least one recess is formed in the outer wall. The heat transfer material that thermally couples the circuit board unit to the cooling device can improve heat dissipation from the circuit board unit.

[0038] In particular, the heat transfer material can be placed in at least one recess with at least one circuit board unit and at least one cooling device already positioned in the housing. This is advantageous with respect to the simple and labor-free manufacturing of the control unit assembly. In this way, it can be ensured that at least a large portion of the heat transfer material remains in at least one recess and does not move from its position due to the movement of the circuit board unit toward the cooling device.

[0039] The advantages and preferred embodiments described with respect to the control device arrangement according to the present invention are similarly provided to the method according to the present invention, and vice versa.

[0040] The features and combinations of features described above, as well as the features and combinations of features described below in the description of the drawings and / or shown only in the drawings, may be used in other combinations without departing from the scope of the invention, not just the combinations specified. Therefore, examples derived from and achievable from the described examples, even if not explicitly shown or described in the drawings, are also considered to be included and disclosed by the invention. Since combinations of examples and functions are also considered disclosed, they do not necessarily include all the functions of the initially defined independent claims. Furthermore, combinations of examples and features are considered to be disclosed by the above-described examples, particularly those that go beyond or deviate from the combinations of features shown in relation to the claims.

[0041] Further features of the present invention are evident from the claims, drawings, and description of the drawings. [Brief explanation of the drawing]

[0042] [Figure 1] A schematic perspective view shows a control unit assembly with a housing. The housing houses two cooling devices, which are formed as cooling plates through which coolant flows during cooling operations. Four circuit board units before installation in the housing are also shown. [Figure 2] A schematic diagram shows one of the L-shaped circuit boards with an outer wall facing the cooling device. The outer wall is a component of the circuit board unit's shell, or circuit board housing. [Figure 3] The arrangement of two of the L-shaped circuit boards in cross-section shown in Figure 2, and one of the two cooling devices formed as a cooling plate for the control device assembly, is shown in a highly simplified manner. [Figure 4]This diagram schematically illustrates how a spring force is applied to one of the stud elements of a circuit board unit. The spring force securely presses the circuit board unit against the heat transfer element positioned between the circuit board unit and the cooling plate. [Figure 5] A schematic diagram shows possible configurations of a compression spring that applies spring force to a stud element. [Figure 6] One of the compression springs in Figure 2 is shown in a perspective view. [Modes for carrying out the invention]

[0043] In drawings, identical or functionally identical elements should be denoted by the same reference letter.

[0044] The components of the unassembled control device assembly 10 are schematically shown. The control device assembly 10 includes a plurality of circuit board units 12, 14, 16, and 18. Each of the circuit board units 12, 14, 16, and 18 can be introduced or installed within the housing 22 of the control device assembly 10 in the mounting direction 20 indicated by the arrow in Figure 1.

[0045] A cooling system 24, including a first cooling device 26 and a second cooling device 28 in this example, is arranged within the housing. The first cooling device 26 and the second cooling device 28 are formed, for example, as cooling plates, particularly made of metal. During the cooling operation, a cooling fluid, preferably in the form of a liquid coolant, passes through the first cooling device 26 and the second cooling device 28. For this purpose, the cooling system 24 is provided with a coolant inlet 30 and a coolant outlet 32.

[0046] Each of the circuit board units 12, 14, 16, and 18 in this example includes a metal sheet shell, i.e., a circuit board housing. The outer wall of each of the circuit board units 12, 14, 16, and 18 is formed by this shell, i.e., the circuit board housing.

[0047] Figure 2 shows an illustrative and schematic representation of the circuit board unit 12, which is located at the top according to Figure 1. However, the description of the circuit board unit 12 shown in Figure 2 also applies to the other circuit board units 14, 16, and 18.

[0048] Within the shell, the circuit board unit 12 comprises at least one circuit board (not shown in this example for simplicity). The circuit board may provide a control device, or the circuit board may be part of a control device. Since multiple circuit board units 12, 14, 16, and 18 are housed in the housing 22, the control device arrangement 10 may provide multiple control devices. Each control device, or electronic control unit, may be configured to perform, for example, a control function of a vehicle's driver assistance system.

[0049] It is important to dissipate the heat generated during the operation of circuit board units 12, 14, 16, and 18 from these units. For this purpose, each circuit board unit 12, 14, 16, and 18 is thermally coupled to one of two cooling devices 26 and 28 via a heat transfer material 34 (see Figure 4). Figure 2 schematically shows the heat transfer material 34 before it is placed in its intended single or multiple locations.

[0050] In particular, the procedure for positioning the heat transfer material 34, which is formed as a heat conductive paste, at the intended position between each circuit board unit 12, 14, 16, 18 and one of the two cooling devices 26, 28 will be explained with reference to Figure 2.

[0051] In Figure 2, the outer wall 36 of the shell, i.e., the circuit board housing, is shown as belonging to the circuit board unit 12 shown in Figure 2. The outer wall 36 faces one of the cooling devices 26, 28, for example, the cooling device 28 which is above the housing 22 in the vertical z direction according to Figure 1. The vertical z direction, horizontal y direction, and depth x direction of the housing 22 are shown in the coordinate system of Figure 1. The arrangement of the circuit board unit 12 relative to the cooling device 26 in the housing 22 is also schematically shown in Figure 3.

[0052] In particular, Figure 3 clearly shows how the outer wall 36, as seen in Figure 2, faces the upper surface 38 of the cooling device 26. At least one recess is formed in this outer wall 36 of the circuit board unit 12 that faces the cooling device 26. When the circuit board unit 12 and the cooling device 26 associated with this circuit board unit 12 are placed in the housing 22, the heat transfer material 34 is placed in this recess.

[0053] According to Figure 2, at least one recess is formed as a channel system 40. The channel system 40 includes a plurality of channel sections 42 and a plurality of accumulation regions 44. The accumulation regions 44 of the channel system 40 are connected to each other via the channel sections 42. Here, each accumulation region 44 has a width greater than that of the channel sections 42.

[0054] The arrangement of the reservoir areas 44 and channel sections 42 shown in Figure 2 is purely schematic and illustrative. Therefore, the network of channel sections 42 and reservoir areas 44 may be formed in the outer wall 36 facing the cooling device 26 in a manner other than that illustrated in Figure 2. In modified versions of the circuit board unit 12, the shape of the reservoir areas 44 may deviate from the substantially square or rectangular shape illustrated in this example. Preferably, the reservoir areas 44 are formed in locations where a particularly large amount of heat is released from electronic components or other similar components placed on the circuit board during the operation of the circuit board unit 12.

[0055] In the modified versions of each circuit board unit 12, 14, 16, and 18, the depth of the channel portion 42 and / or the reservoir region 44 may deviate from the depths of these components of the channel system 40 illustrated in Figure 2. Furthermore, different channel portions 42 and / or different reservoir regions 44 may each have different depths.

[0056] As shown in Figure 2, the inlet opening 48 is formed on the narrow side 46 of the circuit board unit 12. When the circuit board unit 12 is installed in the housing 22 of the control device assembly 10, the inlet opening 48 can be accessed. The outer wall 36 faces the upper surface 38 of the cooling device 26 in this installation position of the circuit board unit 12 (see Figure 3). Thus, in this configuration of the control device assembly 10, with at least one circuit board unit 12, 14, 16, 18 and at least one cooling device 26, 28 both installed in the housing 22 of the control device assembly 10, the heat transfer material 34 can be introduced through the inlet opening 48 into at least one recess in the shape of the channel system 40 in this example.

[0057] For this purpose, the heat transfer material 34 is preferably formed as a flowable heat conductive paste. Such heat transfer material 34 moves along the channel portion 42 and fills or fills at least a large portion of the channel portion 42 and the accumulation region 44 up to the air outlet opening 50. While the heat transfer material 34 is introduced into the channel system 40, air can be discharged from the channel system 40 through the air outlet opening 50.

[0058] In a modified example of the circuit board unit 12 shown exemplified in Figure 2, the circuit board unit 12 has an L-shape in cross-section. This is also clear from the schematic diagram in Figure 3. Here, the circuit board unit 12 includes a first region 52 having a first thickness 54 and a second region 56 having a second thickness 58. Here, the second thickness 58 is greater than the first thickness 54. According to Figure 2, the channel system 40 is formed only in the first region 52 having the smaller thickness 54.

[0059] Due to the stepped configuration of the circuit board unit 12, the second region 56 includes a side end face 60 formed in the stepped region, or a side end face 60 formed in the transition to the first region 52 (see Figure 3). When the circuit board unit 12 is installed in the housing 22 of the control device arrangement 10 (see Figure 3), the side end face 60 faces the narrow side 62 of the cooling device 26. Therefore, heat can be effectively dissipated toward the cooling device 26 even through this side end face 60 of the circuit board unit 12.

[0060] Preferably, components of the circuit board that dissipate a large amount of heat during operation are not placed at all, or only in small numbers, in the second region 56 having the larger second thickness 58. Furthermore, it is particularly sufficient to provide at least one recess, provided by the channel system 40, in the outer wall 36 only in the first region 52 of the circuit board unit 12.

[0061] Figure 3 schematically shows how one more of the circuit board units 12, 14, 16, and 18, for example, a second circuit board unit 14, can be cooled by the same cooling device 26. For example, in a housing 22 which is not shown in detail for clarity in Figure 3, the second circuit board unit 14 may be arranged mirror-symmetrically with respect to the first circuit board unit 12. The second circuit board unit 14 also has an L-shape in cross-section and thus has a first region 64 having a smaller thickness 54 and a second region 66 having a larger thickness 58. Here, the outer wall 36 of the second circuit board unit 14 faces the bottom surface 68 of the cooling device 26.

[0062] In an embodiment similar to that described for the first circuit board unit 12, with the circuit board units 12 and 14 arranged in a mirror-image symmetrical manner in the housing 22, the side end face 70 of the second region 66 of the second circuit board unit 14, which is adjacent to the first region 64 of the second circuit board unit 14, faces the narrow side surface 62 of the cooling device 26.

[0063] In an embodiment similar to that described for the circuit board units 12 and 14 shown in Figure 3, two further circuit board units 16 and 18 may be arranged in the housing 22 such that a cooling device 28, which is shown at the bottom in Figure 1, is received between the two further circuit board units 16 and 18 in a sandwich-like structure.

[0064] The outer end faces 96 and 98 of the second regions 56 and 66 of the circuit board units 12 and 14, which are separated from the respective first regions 52 and 64, can be easily accessed from the front access opening 72 of the housing 22 (see Figure 1). The same applies to the side end faces of further circuit board units 16 and 18, which are accessible through this access opening 72. This is advantageous, for example, when accessing the connecting elements (not shown in detail in this example) of each of the circuit board units 12, 14, 16, and 18.

[0065] Figures 1 and 4 schematically illustrate how each circuit board unit 12 can be introduced into the housing 22 in a mounting direction 20 that may correspond to the depth direction x of the housing 22. In the rear region of the housing 22 facing the front access opening 72, each circuit board unit 12, 14, 16, and 18 may be connected to a further circuit board 74 schematically shown in Figure 4. To connect to this further circuit board 74, each circuit board unit 12, 14, 16, and 18 may also be provided with a rear connection element 76, similarly shown only in Figure 4.

[0066] Guide rails 78 can be provided on the side walls of the housing 22 to facilitate the introduction of each circuit board unit 12, 14, 16, and 18 into the housing 11 (not shown in Figure 4) (see Figure 2). For example, guide rails 78 facing each other in the lateral direction y of the housing 22 can be formed on the side walls of the housing 22 (see Figure 1).

[0067] As shown in Figure 4, each stud element 80 may protrude laterally in the lateral direction y from each circuit board unit 12. The stud elements 80 are formed in the form of guide studs and move along the guide rails 78 in the mounting direction 20 to guide the circuit board unit 12 to its installation or mounting position in the housing 22. As is clear from Figure 4, these stud elements 80 engage with their respective guide rails 78 in this example.

[0068] When the circuit board unit 12, along with the stud elements 80, reaches their target or intended installation position within the housing 22, the stud elements 80 are located within the area of ​​the recess 82 formed in the guide rail 78. Furthermore, each portion of the heat transfer material 34 that ensures the thermal coupling of the circuit board unit 12 to the cooling device 26 is schematically shown in Figure 4. According to Figure 4, each region of the heat transfer material 34 can be formed as a thermal conductive pad, particularly a thermal conductive pad that is spaced apart from each other or connected to each other.

[0069] Preferably, the spring element 84, shown only in relation to its position in the housing 22 in Figure 4, applies pressure toward the cooling device 26, and the pressures indicated by the respective arrows 86 in Figure 4, to each stud element 80. Therefore, preferably, the pressure acting particularly on the region of each heat transfer material 34, i.e., the heat conduction pad, is applied to the stud element 80.

[0070] Due to the recesses 82 provided in each guide rail 78, when the spring element 84 applies pressure to the stud element 80 indicated by the arrow 86, the stud element 80 can move relatively far toward the cooling device 26 together with the entire circuit board unit 12.

[0071] Therefore, when the stud elements 80 are received in the recesses 82 formed in the manner of locking grooves, the coupling of each circuit board unit 12, 14, 16, and 18 to the rear circuit board 74 via their respective connecting elements 76 is preferably similarly established. In this mounting or installation position in the housing 22 (not shown in Figure 4), the circuit board unit 12 can be cooled by a cooling device 26 through which a cooling fluid, preferably formed as a liquid coolant, passes. Here, the heat transfer material 34 ensures good thermal coupling of each circuit board unit 12 to the cooling device 26.

[0072] Figure 5 shows how a spring element 84, preferably fixed to the housing 22, applies pressure to the stud elements 80, as indicated by arrow 86. Thus, each spring element 84 may have a leg 88 that is inclined and oriented at the installation position of each spring element 84. As the circuit board unit 12 is introduced into the housing 22 along the guide rail 78 in the mounting direction 20, each stud element 80 comes into contact with a leg 88. By introducing the circuit board unit 12 into the housing 22 along the guide rail 78, this first leg 88 applies pressure to each stud element 80 that acts toward the cooling device 26.

[0073] In particular, the pressure can compress the heat transfer material 34, which is positioned between the upper surface 28 of the cooling device 26 and the outer wall 36 of the circuit board unit 12, as shown in Figures 4 and 5. Preferably, the heat transfer material 34 is so compressible that it allows for good thermal bonding of the circuit board unit 12 to the cooling device 26.

[0074] In the arrangement shown schematically and illustratively in Figure 5, each stud element 80 is subjected to pressure acting toward the cooling device 26 by a spring element 84 acting toward the stud element 80. Therefore, the number of spring elements corresponds in particular to the number of stud elements 80 provided in each circuit board unit 12.

[0075] As shown in Figure 6, each spring element 84 may include, for example, an additional leg 92 that forms a step 90. This additional, or second, leg 92 allows each spring element 84 to be fixed to the housing 22 in a manner not shown in detail here.

[0076] For example, a leg portion 92 having a step 90 may extend substantially parallel to the vertical z direction of the housing 22 in its arrangement in the housing 22. In the lower end region of the second leg portion 92 in the vertical z direction of the spring element 84, the second leg portion 92 may transition to the first leg portion 88 in the region of the bent portion 94 which is U-shaped in the cross-section of the spring element 84. The first leg portion 88 then applies pressure to the stud element 80.

[0077] However, each spring element 84 may have a shape other than those exemplified in Figures 5 and 6.

Claims

1. A control device arrangement (10) having a housing (22) in which at least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged, The at least one cooling device (26, 28) is configured to be supplied with cooling fluid during cooling operation and to dissipate heat from the at least one circuit board unit (12, 14, 16, 18), The at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34). In the control device arrangement (10), The circuit board units (12, 14, 16, 18) are provided with an outer wall (36) facing the cooling devices (26, 28), At least one recess is formed in the outer wall (36), The heat transfer material (34) is placed in the at least one recess, In particular, the two cooling devices (26, 28) through which the cooling fluid, which is in the form of a liquid coolant, passes during the cooling operation, wherein the cooling devices (26, 28) formed as cooling plates are arranged in the housing (22), Each cooling device (26, 28) is received in a sandwich-like structure between two circuit board units (12, 14, 16, 18). The inlet (30) and outlet (32) of the liquid coolant passing through the two cooling devices (26, 28) are located between the two cooling devices (26, 28). A control device arrangement (10) characterized by the above.

2. In particular, the heat transfer material (34), which is formed as a heat conductive paste, is introduced into the at least one recess through an inlet opening (48) accessible from the narrow side (46) of the circuit board unit (12) at the installation position of the circuit board unit (12) in the housing (22). The control device arrangement (10) according to feature 1.

3. A control device arrangement (10) having a housing (22) in which at least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged, The at least one cooling device (26, 28) is configured to be supplied with cooling fluid during cooling operation and to dissipate heat from the at least one circuit board unit (12, 14, 16, 18), The at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34). In the control device arrangement (10), The circuit board units (12, 14, 16, 18) are provided with an outer wall (36) facing the cooling devices (26, 28), At least one recess is formed in the outer wall (36), The heat transfer material (34) is placed in the at least one recess, The at least one recess is formed as a channel system (40), The channel system (40) includes at least one channel section (42) connected to at least one storage area (44) of the channel system (40), The at least one accumulation region (44) has a width greater than the at least one channel portion (42) of the channel system (40). A control device arrangement (10) characterized by the above.

4. The channel system (40) includes a plurality of accumulation regions (44) having a greater depth than the at least one channel portion (42) and / or different depths from each other. The accumulation regions (44) are connected to each other via their respective channel sections (42). The control device arrangement (10) according to feature 3.

5. The accumulation region (44) is formed in a section of the circuit board unit (12), In the aforementioned section, when the circuit board unit (12) is in operation, more heat is released than in the area adjacent to that section. The control device arrangement (10) according to feature 4.

6. The channel system (40) includes at least one air outlet opening (50) that opens particularly to the narrow side of the circuit board unit (12), With the at least one circuit board unit (12, 14, 16, 18) and the at least one cooling device (26, 28) arranged in the housing (22) of the control device assembly (10), by introducing the heat transfer material (34) into the channel system (40), air can be discharged from the channel system (40) through the at least one air outlet opening (50). The control device arrangement (10) according to feature 3.

7. A control device arrangement (10) having a housing (22) in which at least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged, The at least one cooling device (26, 28) is configured to be supplied with cooling fluid during cooling operation and to dissipate heat from the at least one circuit board unit (12, 14, 16, 18), The at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34). In the control device arrangement (10), The circuit board units (12, 14, 16, 18) are provided with an outer wall (36) facing the cooling devices (26, 28), At least one recess is formed in the outer wall (36), The heat transfer material (34) is placed in the at least one recess, The circuit board unit (12) comprises a first region (52) having a first thickness (54) and a second region (56) having a second thickness (58). The second thickness (58) is greater than the first thickness (54), The at least one recess is formed in the first region (52), The side end face (60) of the second region (56) adjacent to the first region (52) faces the narrow side face (62) of the cooling device (26). A control device arrangement (10) characterized by the above.

8. The control device arrangement (10) comprises at least two circuit board units (12, 14) arranged in the housing (22) in a mirror-image symmetrical manner with respect to each other. Each outer wall (36) of the circuit board units (12, 14) arranged in mirror image symmetry, having at least one recess, faces the same cooling device (26). The control device arrangement (10) according to feature 1.

9. The circuit board units (12, 14, 16, 18) arranged vertically (z) of the housing (22) are connected to a further circuit board (74) located on the rear side of the housing (22) via their respective connecting elements (76). The aforementioned rear side is opposite to the front access opening (72) of the housing (22). The control device arrangement (10) according to feature 1.

10. A control device arrangement (10) having a housing (22) in which at least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged, The at least one cooling device (26, 28) is configured to be supplied with cooling fluid during cooling operation and to dissipate heat from the at least one circuit board unit (12, 14, 16, 18), The at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34). In the control device arrangement (10), The circuit board units (12, 14, 16, 18) are provided with an outer wall (36) facing the cooling devices (26, 28), At least one recess is formed in the outer wall (36), The heat transfer material (34) is placed in the at least one recess, Pressure directed toward the cooling device (26) is applied to the circuit board unit (12) by at least one spring element (84), The pressure acts particularly on the region of the heat transfer material (34) formed as a heat conduction pad. A control device arrangement (10) characterized by the above.

11. A control device arrangement (10) having a housing (22) in which at least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged, The at least one cooling device (26, 28) is configured to be supplied with cooling fluid during cooling operation and to dissipate heat from the at least one circuit board unit (12, 14, 16, 18), The at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34). In the control device arrangement (10), The circuit board units (12, 14, 16, 18) are provided with an outer wall (36) facing the cooling devices (26, 28), At least one recess is formed in the outer wall (36), The heat transfer material (34) is placed in the at least one recess, The circuit board unit (12) includes at least one stud element (80) that cooperates with a guide rail (78) provided on the side surface of the housing (22), The at least one stud element (80) is guided along the guide rail (78) when the circuit board unit (12) is introduced into the housing (22). A control device arrangement (10) characterized by the above.

12. The circuit board unit (12) includes at least one stud element (80) that cooperates with a guide rail (78) provided on the side surface of the housing (22), The at least one stud element (80) is guided along the guide rail (78) when the circuit board unit (12) is introduced into the housing (22), The stud element (80) is subjected to the pressure by the spring element (84), The guide rail (78) is provided with a recess (82) formed toward the cooling device (26) in the region of the target position of the stud element (80), The stud element (80) is received in the recess (82), The control device arrangement (10) according to the characteristic feature of 10.

13. The at least one spring element (84) is fixed to the housing (22) and includes a leg portion (88), and by introducing the circuit board unit (12) into the housing (22) along the guide rail (78), the leg portion (88) applies the pressure acting toward the cooling device (26) to the stud element (80), and / or the circuit board unit (12) comprises a plurality of stud elements (80), The pressure acting toward the cooling device (26) is applied to each of the stud elements (80) by a spring element (84) acting thereon. The control device arrangement (10) according to characteristic 12.

14. A control device arrangement (10) wherein at least one circuit board unit (12, 14, 16, 18) and at least one cooling device (26, 28) are arranged in the housing (22) of the control device arrangement (10), The at least one cooling device (26, 28) is configured to be supplied with cooling fluid during cooling operation and to dissipate heat from the at least one circuit board unit (12, 14, 16, 18), The at least one circuit board unit (12, 14, 16, 18) is thermally coupled to the at least one cooling device (26, 28) via a heat transfer material (34). In a method for manufacturing a control device arrangement (10), The circuit board units (12, 14, 16, 18) are provided with an outer wall (36) facing the cooling devices (26, 28), At least one recess is formed in the outer wall (36), In particular, when the at least one circuit board unit (12, 14, 16, 18) and the at least one cooling device (26, 28) are arranged in the housing (22), the heat transfer material (34) is arranged in the at least one recess, In particular, the two cooling devices (26, 28) through which the cooling fluid, which is in the form of a liquid coolant, passes during the cooling operation, wherein the cooling devices (26, 28) formed as cooling plates are arranged in the housing (22), Each cooling device (26, 28) is received in a sandwich-like structure between two circuit board units (12, 14, 16, 18). The inlet (30) and outlet (32) of the liquid coolant passing through the two cooling devices (26, 28) are located between the two cooling devices (26, 28). A method characterized by the following:

Images