Semiconductor manufacturing equipment, wafer mounting equipment, dicing equipment, semiconductor manufacturing methods

Abstract

To provide a technology capable of suppressing non-uniformity in the force applied to a dicing blade when cutting an orientation flat.SOLUTION: A semiconductor manufacturing device includes a stage and a transport machine. On the stage, a semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used for cutting the orientation flat with a dicing blade are fixed together with a dicing tape. The transport machine transports the jig such that the jig faces the orientation flat on the stage.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a semiconductor manufacturing apparatus, a wafer mounting apparatus, a dicing apparatus, and a semiconductor manufacturing method.

Background Art

[0002] In the manufacture of semiconductor devices, generally, semiconductor chips cut out from a semiconductor wafer by a dicing apparatus are mounted on a semiconductor module. Also, generally, when cutting a semiconductor wafer by a dicing apparatus, the semiconductor wafer is attached to a dicing tape so that the semiconductor chips do not move (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Semiconductor wafers often have an orientation flat, which is a notch for adjusting the position and rotation angle of the semiconductor wafer. Depending on the design of the semiconductor chip, the dicing apparatus may cut the orientation flat along the linear orientation flat. However, in this case, one surface of the plate-shaped dicing blade that cuts the orientation flat receives force from the semiconductor wafer, while the other surface is adjacent to space and does not receive force, so a non-uniform force is applied to the dicing blade. As a result, there is a problem that the dicing blade is likely to be damaged and the life of the dicing blade is shortened.

[0005] Therefore, the present disclosure has been made in view of the above problems, and an object thereof is to provide a technology capable of suppressing the non-uniformity of the force applied to the dicing blade during cutting of the orientation flat. [Means for solving the problem]

[0006] The semiconductor manufacturing apparatus according to this disclosure comprises a stage on which a semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used for cutting the orientation flat with a dicing blade are fixed to each other with dicing tape, and a conveyor that transports the jig on the stage so that the jig faces the orientation flat. [Effects of the Invention]

[0007] According to this disclosure, the jig is transported on the stage so as to face the orientation flat. With this configuration, the non-uniformity of the force applied to the dicing blade during cutting of the orientation flat can be suppressed. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic cross-sectional view showing the configuration of a wafer mounting apparatus according to Embodiment 1. [Figure 2] This is a plan view showing an example of a structure to be cut. [Figure 3] This is a schematic cross-sectional view showing the configuration of a dicing apparatus according to Embodiment 1. [Modes for carrying out the invention]

[0009] The embodiments will be described below with reference to the attached drawings. The features described in each of the embodiments below are illustrative, and not all features are necessarily required. In addition, in the descriptions below, the same or similar reference numerals are used for similar components in multiple embodiments, and the different components are mainly described. Also, in the descriptions below, specific positions and directions such as "top," "bottom," "left," "right," "front," or "back" do not necessarily have to coincide with the positions and directions in actual implementation.

[0010] <Embodiment 1> Figure 1 is a schematic cross-sectional view showing the configuration of a wafer mounting apparatus equipped with a semiconductor manufacturing apparatus according to this first embodiment. The semiconductor manufacturing apparatus of the wafer mounting apparatus in Figure 1 comprises a wafer table 1, which is a stage, and a transporter 2. In addition to the semiconductor manufacturing apparatus, the wafer mounting apparatus in Figure 1 also comprises an adhesive roller 3, which is a tape application section.

[0011] The wafer table 1 is a stage on which a semiconductor wafer 21 and a jig 22 are fixed to each other with a dicing tape 26. In this embodiment 1, the semiconductor wafer 21, the jig 22, and the wafer ring 23 are mounted on the wafer table 1 and then attached to the dicing tape 26. Figure 2 is a plan view showing an example of a structure to be cut with the semiconductor wafer 21, the jig 22, and the wafer ring 23 attached to the dicing tape 26. The semiconductor wafer 21 of the structure to be cut is cut by a dicing device, as will be described later.

[0012] The semiconductor wafer 21 has an orientation flat 21a. The semiconductor wafer 21 is provided with a semiconductor chip that includes at least one of the following: MOSFET (Metal Oxide Semiconductor Field Effect Transistor), IGBT (Insulated Gate Bipolar Transistor), RC-IGBT (Reverse Conducting - IGBT), SBD (Schottky Barrier Diode), and PND (PN junction diode). In this specification, for example, at least one of A, B, C, ..., and Z means any one of all combinations obtained by selecting one or more from the groups A, B, C, ..., and Z.

[0013] The semiconductor wafer 21 may be made of ordinary silicon (Si), or it may be made of a wide-bandgap semiconductor such as silicon carbide (SiC), gallium nitride (GaN), or diamond. When the semiconductor wafer 21 is made of a wide-bandgap semiconductor, stable operation of the semiconductor device at high temperatures and high voltages, and faster switching speeds become possible.

[0014] The wafer table 1 in Figure 1 is provided with a recess 1a, and the semiconductor wafer 21 is placed on the wafer table 1 by manual means, a transporter 2, or other transporter such that only the outer periphery of the semiconductor wafer 21 is supported by the wafer table 1. The recess 1a suppresses contact between the surface structure of the semiconductor chips provided on the semiconductor wafer 21 and the wafer table 1.

[0015] The jig 22 in Figure 2 has a shape corresponding to the orientation flat 21a and is used for cutting the orientation flat 21a with a dicing blade. In the example in Figure 2, the right portion of the jig 22 has a linear shape corresponding to the linear shape of the orientation flat 21a. Also in the example in Figure 2, the entire jig 22 has an arch shape that complements the circle of the semiconductor wafer 21. However, the shape of the jig 22 is not limited to the shape in Figure 2, as long as it has a shape corresponding to the orientation flat 21a.

[0016] The transporter 2 transports the jig 22 on the wafer table 1 so that the linear shape of the jig 22 faces the linear shape of the orientation flat 21a. This places the jig 22 on the wafer table 1.

[0017] The wafer ring 23 is mounted on the wafer table 1 by manual means, a transfer machine 2, or other transfer machine, so as to surround the semiconductor wafer 21 and the jig 22 in a plan view. The material of the wafer ring 23 is, for example, stainless steel.

[0018] The sticking roller 3 sticks the semiconductor wafer 21, the jig 22 facing the orifice 21a, and the wafer ring 23 surrounding the semiconductor wafer 21 and the jig 22, which are mounted on the wafer table 1, to the dicing tape 26. Specifically, the sticking roller 3 sticks the dicing tape 26 by pressing the dicing tape 26 fed out by a feeding machine (not shown) against the semiconductor wafer 21, the jig 22, and the wafer ring 23. Thereby, the cut structure of FIG. 2 is formed. Note that the material of the sticking roller 3 is, for example, Si rubber, and the material of the dicing tape 26 is, for example, a UV-curable polyolefin.

[0019] The semiconductor wafer 21 of the cut structure of FIG. 2 is cut by a dicing blade similar to the dicing blade 8 of FIG. 3 described later, whereby semiconductor chips are cut out from the semiconductor wafer 21. When cutting the orifice 21a, the dicing blade cuts the orifice 21a along the linear shape of the orifice 21a while contacting the jig 22.

[0020] <Summary of Embodiment 1> According to the semiconductor manufacturing apparatus according to the first embodiment as described above, the transfer machine 2 transfers the jig 22 on the wafer table 1 so that the linear shape of the jig 22 faces the linear shape of the orifice 21a. According to such a configuration, a cut structure in which the semiconductor wafer 21 and the jig 22 are fixed to each other with the jig 22 facing the orifice 21a as shown in FIG. 2 can be formed. Thereby, when cutting the orifice 21a, one surface of the dicing blade that cuts the orifice 21a receives force from the semiconductor wafer 21, and the other surface receives force from the jig 22, so that the non-uniformity of the force applied to the dicing blade can be suppressed. As a result, breakage of the dicing blade can be suppressed.

[0021] <Embodiment 2> FIG. 3 is a schematic cross-sectional view showing the configuration of a dicing apparatus including the semiconductor manufacturing apparatus according to the second embodiment. The semiconductor manufacturing apparatus of the dicing apparatus in FIG. 3 includes a dicing table 6 as a stage and a transporter 2. Further, the dicing apparatus in FIG. 3 includes not only a semiconductor manufacturing apparatus but also a ring holder 7 and a dicing blade 8.

[0022] The dicing table 6 is a stage where the semiconductor wafer 21 and the jig 22 are fixed to each other with a dicing tape 26. In the second embodiment, the dicing tape 26 to which the semiconductor wafer 21 and the wafer ring 23 surrounding the semiconductor wafer 21 are attached is mounted on the dicing table 6 manually, by the transporter 2, or by other transporters. Note that a porous portion capable of air-adsorbing the semiconductor wafer 21 via the dicing tape 26 may be provided at the portion of the dicing table 6 where the semiconductor wafer 21 is mounted.

[0023] After the dicing tape 26 is mounted on the dicing table 6, the transporter 2 transports the jig 22 on the dicing table 6 so that the linear shape of the jig 22 faces the linear shape of the orifice 21a, thereby attaching the jig 22 to the dicing tape 26. Thereby, the cut structure in FIG. 2 is formed.

[0024] The semiconductor wafer 21 of the cut structure in FIG. 2 is cut by the dicing blade 8, and semiconductor chips are cut out from the semiconductor wafer 21. When cutting the orifice 21a, the dicing blade 8 cuts the orifice 21a along the linear shape of the orifice 21a while contacting the jig 22. The dicing blade 8 is, for example, a blade in which abrasive grains are hardened with a bonding material. The ring holder 7 fixes the semiconductor wafer 21 by holding the wafer ring 23 while the dicing blade 8 is performing cutting.

[0025] <Summary of the Second Embodiment> According to the semiconductor manufacturing apparatus of this second embodiment described above, the transporter 2 transports the jig 22 on the wafer table 1 so that the linear shape of the jig 22 faces the linear shape of the orientation flat 21a. With this configuration, a cut-to-be-cut structure can be formed in which the semiconductor wafer 21 and the jig 22 are fixed to each other, as shown in Figure 2, with the jig 22 facing the orientation flat 21a. As a result, when cutting the orientation flat 21a, one side of the dicing blade that cuts the orientation flat 21a receives force from the semiconductor wafer 21, and the other side receives force from the jig 22, thus suppressing the non-uniformity of the force applied to the dicing blade. As a result, damage to the dicing blade can be suppressed.

[0026] <Variation> In the descriptions of Embodiments 1 and 2, the jig 22 was transported by the conveyor 2. However, the jig 22 may also be transported manually so that the linear shape of the jig 22 faces the linear shape of the orientation flat 21a.

[0027] Furthermore, in Embodiment 1, the semiconductor wafer 21 and the like were mounted on the wafer table 1 before being attached to the dicing tape 26, while in Embodiment 2, the dicing tape 26 and the like were mounted on the dicing table 6 before the jig 22 was attached to the dicing tape 26. However, the operations of Embodiment 1 and Embodiment 2 may be interchangeable. That is, in Embodiment 1, the dicing tape 26 and the like were mounted on the wafer table 1 before the jig 22 was attached to the dicing tape 26, while in Embodiment 2, the semiconductor wafer 21 and the like were mounted on the dicing table 6 before being attached to the dicing tape 26.

[0028] <Embodiment 3> In this third embodiment, the material of the jig 22 and the material of the semiconductor wafer 21 are the same as in embodiments 1 and 2. With this configuration, the non-uniformity of the force applied to the dicing blade when the dicing blade 8 comes into contact with the orientation flat 21a can be further suppressed compared to a configuration in which the materials of the semiconductor wafer 21 and the jig 22 are different.

[0029] <Embodiment 4> In this fourth embodiment, the thickness of the jig 22 and the thickness of the semiconductor wafer 21 are the same as in embodiments 1 and 2. The same thickness of the jig 22 and the semiconductor wafer 21 means that the difference between the thickness of the jig 22 and the thickness of the semiconductor wafer 21 is within 5% of the larger of the two thicknesses. This configuration further suppresses the non-uniformity of the force applied to the dicing blade when the dicing blade 8 contacts the orientation flat 21a, compared to configurations where the thicknesses of the semiconductor wafer 21 and the jig 22 are different.

[0030] <Variation> The configuration of Embodiment 3 and the configuration of Embodiment 4 may be combined. In other words, in Embodiments 1 and 2, the material of the jig 22 and the material of the semiconductor wafer 21 may be the same, and the thickness of the jig 22 and the thickness of the semiconductor wafer 21 may be the same. With such a configuration, the non-uniformity of the force applied to the dicing blade when the dicing blade 8 comes into contact with the orientation flat 21a can be further suppressed compared to a configuration in which the thicknesses of both the semiconductor wafer 21 and the jig 22 are different.

[0031] <Embodiment 5> In this embodiment 5, the conveyor 2 transports the jig 22 such that there is a gap between the jig 22 and the orientation flat 21a, as in embodiments 1 and 2. With this configuration, wear of the dicing blade 8 can be suppressed, and thus the lifespan of the dicing blade 8 can be expected to be extended. Note that this embodiment 5 may be combined with at least one of the configurations of embodiment 3 and embodiment 4.

[0032] Furthermore, it is possible to freely combine each embodiment and each variation, and to modify or omit each embodiment and each variation as appropriate.

[0033] The various aspects of this disclosure are summarized below as an appendix.

[0034] (Note 1) A stage in which a semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used for cutting the orientation flat with a dicing blade are fixed to each other with dicing tape, A conveyor that transports the jig so that the jig faces the orientation flat on the stage. A semiconductor manufacturing device equipped with the following features.

[0035] (Note 2) The semiconductor manufacturing equipment described in Appendix 1, The stage is equipped with a tape attachment section for attaching the semiconductor wafer, the jig facing the orientation flat, and the wafer ring surrounding the semiconductor wafer and the jig to the dicing tape. A wafer mounting apparatus equipped with the following features.

[0036] (Note 3) The semiconductor manufacturing equipment described in Appendix 1, The dicing blade and Equipped with, The aforementioned conveying machine is The semiconductor wafer and the wafer ring surrounding the semiconductor wafer are attached to the dicing tape mounted on the stage, and the jig is transported and attached to the tape. The dicing blade is, A dicing device that cuts the orientation flat along the orientation flat while in contact with the jig.

[0037] (Note 4) A semiconductor manufacturing apparatus described in any one of the items from Appendix 1 to Appendix 3, A semiconductor manufacturing apparatus in which the material of the jig and the material of the semiconductor wafer are the same.

[0038] (Note 5) A semiconductor manufacturing apparatus described in any one of the items from Appendix 1 to Appendix 4, A semiconductor manufacturing apparatus in which the thickness of the jig and the thickness of the semiconductor wafer are the same.

[0039] (Note 6) A semiconductor manufacturing apparatus described in any one of the items from Appendix 1 to Appendix 5, The conveying machine is a semiconductor manufacturing apparatus that conveys the jig such that there is a gap between the jig and the orientation flat.

[0040] (Note 7) A semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used for cutting the orientation flat with a dicing blade are prepared. A semiconductor manufacturing method comprising transporting the jig on a stage in which the semiconductor wafer and the jig are fixed to each other with dicing tape, such that the jig faces the orientation flat. [Explanation of Symbols]

[0041] 1 wafer table, 2 transporter, 3 adhesive roller, 6 dicing table, 8 dicing blade, 21 semiconductor wafer, 21a orientation flat, 22 jig, 23 wafer ring, 26 dicing tape.

Claims

1. A stage in which a semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used for cutting the orientation flat with a dicing blade are fixed to each other with dicing tape, A conveyor that transports the jig so that the jig faces the orientation flat on the stage. A semiconductor manufacturing device equipped with the following features.

2. The semiconductor manufacturing apparatus according to claim 1, The stage is equipped with a tape attachment section for attaching the semiconductor wafer, the jig facing the orientation flat, and the wafer ring surrounding the semiconductor wafer and the jig to the dicing tape. A wafer mounting apparatus equipped with the following features.

3. The semiconductor manufacturing apparatus according to claim 1, The dicing blade and Equipped with, The aforementioned conveying machine is The semiconductor wafer and the wafer ring surrounding the semiconductor wafer are attached to the dicing tape mounted on the stage, and the jig is transported and attached to the tape. The dicing blade is, A dicing device that cuts the orientation flat along the orientation flat while in contact with the jig.

4. A semiconductor manufacturing apparatus according to claim 1, A semiconductor manufacturing apparatus in which the material of the jig and the material of the semiconductor wafer are the same.

5. A semiconductor manufacturing apparatus according to claim 1 or claim 4, A semiconductor manufacturing apparatus in which the thickness of the jig and the thickness of the semiconductor wafer are the same.

6. A semiconductor manufacturing apparatus according to claim 1, The conveying machine is a semiconductor manufacturing apparatus that conveys the jig such that there is a gap between the jig and the orientation flat.

7. A semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used for cutting the orientation flat with a dicing blade are prepared. A semiconductor manufacturing method comprising transporting the jig on a stage in which the semiconductor wafer and the jig are fixed to each other with dicing tape, such that the jig faces the orientation flat.

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