Ejector cooling system

Abstract

To provide an ejector cooling system with improved seismic resistance. [Solution] The ejector cooling device comprises a housing, a refrigerant pump for pressurizing the refrigerant, a heat recovery unit for heating the refrigerant with hot water and generating a drive flow, an expansion valve for reducing the pressure of the refrigerant, an evaporator for cooling the medium to be cooled with the refrigerant reduced in pressure by the expansion valve, an ejector for drawing in the refrigerant evaporated by the evaporator by the drive flow of the refrigerant from the heat recovery unit as a suction flow, and discharging a mixture of the drive flow and the suction flow, and a condenser for cooling the refrigerant discharged from the ejector, wherein the heat recovery unit is located at the bottom of the housing.

Description

Technical Field

[0001] The present invention relates to an ejector cooling device with improved seismic performance.

Background Art

[0002] An ejector cooling device is a cooling cycle device using an ejector. It uses hot water from a heat source such as the discharged warm water from a factory as a heating source, evaporates the high-pressure refrigerant pressurized by a refrigerant pump by a waste heat recovery device, and generates a driving flow for the ejector. The driving flow is sent to the ejector, and the suction flow from the evaporator is pressurized by the action of the ejector. The pressurized refrigerant is sent to the condenser and cooled and liquefied by cooling water. The liquefied refrigerant is depressurized to a low-temperature two-phase refrigerant by passing through an expansion valve and sent to the evaporator. In the evaporator, heat can be absorbed from the outside during evaporation to generate cold heat such as cold water.

[0003] Here, Patent Document 1 describes an ejector cooling device including an ejector arranged horizontally, a waste heat recovery device connected to the inlet side of the ejector, and a condenser connected to the outlet side of the ejector.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Here, in an ejector cooling device, in order to smoothly send the refrigerant liquefied in the condenser to the refrigerant tank, the refrigerant tank is arranged below the condenser. Further, in order to prevent cavitation of the refrigerant pump, the refrigerant pump is arranged below the refrigerant tank. That is, it is necessary to arrange the condenser, the refrigerant tank, and the refrigerant pump in this order from above.

[0006] Furthermore, in ejector cooling systems, it is preferable to shorten the length of the piping between the heat recovery unit and the ejector, and between the ejector and the condenser, in order to reduce pressure loss. For this reason, in ejector cooling systems, the condenser and the heat recovery unit are positioned close to the ejector.

[0007] In the configuration of Patent Document 1, if the condenser is placed above the refrigerant tank and refrigerant pump, and the condenser and waste heat recovery unit are placed close to the ejector, the heavy condenser and waste heat recovery unit are placed on top of the ejector cooling system housing. As a result, the center of gravity is raised, which leads to the problem of low seismic resistance.

[0008] The present invention has been made in view of the above, and aims to provide an ejector cooling device with improved seismic resistance. [Means for solving the problem]

[0009] To solve the above-mentioned problems and achieve the objective, the ejector cooling device according to the present invention comprises a housing, a refrigerant pump for pressurizing a refrigerant, a heat recovery unit for heating the refrigerant with hot water as a heat source to generate a drive flow, an expansion valve for reducing the pressure of the refrigerant, an evaporator for cooling a medium to be cooled with the refrigerant reduced in pressure by the expansion valve, an ejector for drawing in the refrigerant evaporated by the evaporator as a suction flow by the drive flow of the refrigerant from the heat recovery unit and discharging a mixture of the drive flow and the suction flow, and a condenser for cooling the refrigerant discharged from the ejector, wherein the heat recovery unit is located at the bottom of the housing.

[0010] Furthermore, the ejector cooling device according to the present invention is characterized in that the ejector is arranged vertically.

[0011] Furthermore, the ejector cooling device according to the present invention is characterized in that the heat recovery unit is located below the condenser.

[0012] Furthermore, the ejector cooling device according to the present invention is characterized in that the heat recovery unit is located on the bottom surface of the housing.

[0013] Furthermore, the ejector cooling device according to the present invention is characterized by comprising a refrigerant tank located below the condenser and for storing the refrigerant condensed by the condenser.

[0014] Furthermore, the ejector cooling device according to the present invention is characterized in that the refrigerant pump is located below the refrigerant tank.

[0015] Furthermore, the ejector cooling device according to the present invention is characterized in that the heat recovery unit is positioned at the same height as the refrigerant pump, or below the refrigerant pump.

[0016] Furthermore, the ejector cooling device according to the present invention is characterized in that the evaporator is located near the suction inlet through which the ejector draws in the refrigerant.

[0017] Furthermore, the ejector cooling device according to the present invention is characterized in that the evaporator is arranged in a straight line with the suction inlet.

[0018] Furthermore, the ejector cooling device according to the present invention is characterized in that the evaporator is stacked on top of the waste heat recovery unit, and the condenser is stacked on top of the evaporator.

[0019] Furthermore, the ejector cooling device according to the present invention is characterized in that the area of ​​the upper surface of the evaporator is larger than the area of ​​the lower surface of the condenser, and the area of ​​the upper surface of the exhaust heat recovery unit is larger than the area of ​​the lower surface of the evaporator.

[0020] Furthermore, the ejector cooling device according to the present invention is characterized in that a thermal insulation material made of a slippery material is placed between the condenser and the evaporator, and between the evaporator and the waste heat recovery unit.

[0021] Further, in the ejector cooling device according to the present invention, the condenser, the evaporator, and the exhaust heat recovery device are fixed to a column via a washer.

[0022] Further, in the ejector cooling device according to the present invention, wedges are driven between the condenser and the evaporator, and between the evaporator and the exhaust heat recovery device.

[0023] Further, in the ejector cooling device according to the present invention, a tension bar is disposed between the upper surface of the condenser and the housing.

[0024] Further, in the ejector cooling device according to the present invention, anchors are provided at the four corners of the housing and at positions corresponding directly above the four corners of the exhaust heat recovery device on the upper surface of the housing.

Advantages of the Invention

[0025] According to the present invention, an ejector cooling device with improved earthquake resistance performance can be realized.

Brief Description of the Drawings

[0026] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of an ejector cooling device according to Embodiment 1 of the present invention. [Figure 2] FIG. 2 is a front view showing a schematic configuration of the ejector cooling device. [Figure 3] FIG. 3 is an arrangement diagram of the main components of the ejector cooling device according to Example 1. [Figure 4] FIG. 4 is an arrangement diagram of the main components of the ejector cooling device according to Example 1. [Figure 5] FIG. 5 is an arrangement diagram of the main components of the ejector cooling device according to Example 2. [Figure 6] FIG. 6 is an arrangement diagram of the main components of the ejector cooling device according to Example 2. [Figure 7] FIG. 7 is an arrangement diagram of the main components of the ejector cooling device according to Example 3. [Figure 8] Figure 8 is a diagram showing the arrangement of the main components of the ejector cooling device according to Example 3. [Modes for carrying out the invention]

[0027] Hereinafter, embodiments for carrying out this invention will be described with reference to the attached drawings.

[0028] <Embodiment 1> [Configuration of the ejector cooling system] Figure 1 is a schematic diagram showing the configuration of an ejector cooling device according to Embodiment 1 of the present invention. The ejector cooling device 1 illustrated here recovers waste heat from waste hot water (heat source hot water) such as factory wastewater or used cooling water as a heat source, and cools the heat-recovered heat source hot water as the water to be cooled (cooling medium) to produce chilled water.

[0029] As shown in Figure 1, the ejector cooling system 1 has an ejector 10, a condenser 11, a refrigerant tank 12, a refrigerant pump 13, and a heat recovery unit 14 connected sequentially on the circulation path LA. The ejector cooling system 1 is also provided with a branch path LB. The branch path LB branches off from the portion upstream of the refrigerant pump 13 at the branching point LS between the condenser 11 (refrigerant tank 12) and the heat recovery unit 14 of the circulation path LA, and supplies a portion of the refrigerant flowing through the circulation path LA to the ejector 10 as a suction flow.

[0030] The refrigerant pump 13 circulates and supplies the refrigerant in the circulation path LA. More specifically, the refrigerant pump 13 is, for example, a liquid-phase variable displacement pump that pressurizes the refrigerant and supplies it to the ejector 10. The heat recovery unit 14 performs heat exchange by heating the refrigerant flowing in from the refrigerant pump 13 with cooling hot water supplied from an external source, and supplies the refrigerant supplied from the refrigerant pump 13 to the ejector 10 as an evaporated drive flow.

[0031] The ejector 10 receives refrigerant from the heat recovery unit 14 as a driving flow, sucks in the refrigerant evaporated by the evaporator 16 as a suction flow, and discharges the refrigerant mixture of the driving flow and the suction flow to the condenser 11.

[0032] The condenser 11 receives the refrigerant discharged from the ejector 10, exchanges heat with the heat-dissipating water supplied from the outside, and condenses the refrigerant. The heat-dissipating water supplied from the outside is heated in the condenser 11 through heat exchange with the refrigerant, and then sent to a cooling device (such as a cooling tower) installed outside the system. After being cooled by the cooling device, it is sent back to the condenser 11 as heat-dissipating water. In addition, a portion of the heat-dissipating water supplied from the outside is branched to an intermediate heat exchanger 17, and a portion is sent directly to the outside without passing through the condenser 11. The refrigerant condensed in the condenser 11 is stored in the downstream refrigerant tank 12 by gravity, and the stored refrigerant is then sucked up by the refrigerant pump 13 and supplied to the branched path LB side.

[0033] The branch path LB is equipped with an electronic expansion valve 15 and an evaporator 16. The electronic expansion valve 15 expands and depressurizes the refrigerant that has passed through the condenser 11 and been supplied via the branch point LS. The evaporator 16 evaporates the refrigerant by exchanging heat between the liquid phase refrigerant that has flowed in through the electronic expansion valve 15 and the water to be cooled supplied to the evaporator 16. This evaporates the refrigerant and flows out as a suction flow toward the ejector 10, while also generating chilled water by cooling the supplied water to be cooled and then flowing out.

[0034] The intermediate heat exchanger 17 performs heat exchange between the cooling hot water cooled by the waste heat recovery unit 14 and the heat dissipation water supplied from the outside, further cooling the cooling hot water before supplying it to the evaporator 16. The heat dissipation water supplied to the intermediate heat exchanger 17 from the outside is discharged as heated water and joins with the heated water from the condenser 11. Therefore, the cooling hot water is sequentially cooled by the waste heat recovery unit 14 and the intermediate heat exchanger 17, and finally becomes chilled water cooled by the evaporator 16.

[0035] Furthermore, the condenser 11, waste heat recovery unit 14, evaporator 16, and intermediate heat exchanger 17 are plate heat exchangers. Plate heat exchangers have high heat transfer performance, are compact, and have self-cleaning capabilities by stacking heat transfer plates, which are thin sheets with complex pressed shapes, in the heat transfer section. In the case of plate heat exchangers, when the fluid is a liquid, it is necessary to ensure that it flows from the lower inlet to the upper outlet in order to make effective use of the heat transfer area.

[0036] [Arrangement of each component in the ejector cooling system] Figure 2 is a front view showing a schematic configuration of the ejector cooling system. As shown in Figure 2, the ejector cooling system 1 comprises a housing 1a, a vertically positioned ejector 10, a condenser 11 located at the top of the housing 1a, a refrigerant tank 12 located below the condenser 11, a refrigerant pump 13 located below the refrigerant tank 12, a heat recovery unit 14 located at the bottom of the housing 1a, an evaporator 16 located near the suction inlet through which the ejector 10 draws in refrigerant, an electronic expansion valve 15 located between the branching point LS and the evaporator 16, and an intermediate heat exchanger 17 located between the condenser 11 and the heat recovery unit 14.

[0037] The ejector 10 is positioned vertically such that the drive flow enters downwards and the refrigerant is discharged upwards. However, the ejector 10 is not limited to a vertical position. By positioning the ejector 10 so as to intersect with the horizontal direction, the heat recovery unit 14 can be positioned lower than the condenser 11, thereby lowering the center of gravity.

[0038] The heat recovery unit 14 is positioned below the condenser 11 because the ejector 10 is vertically positioned. As a result, the length of the piping between the heat recovery unit 14 and the ejector 10 is increased, which suppresses the increase in pressure loss, while lowering the center of gravity and improving seismic performance.

[0039] Furthermore, in the ejector cooling system 1, by arranging the condenser 11 and the heat recovery unit 14 vertically, the width can be reduced compared to when the condenser 11 and the heat recovery unit 14 are arranged horizontally.

[0040] Furthermore, in the ejector cooling system 1, the heat recovery unit 14 is located at the bottom of the housing 1a, which reduces the required head of the refrigerant pump 13. In addition, the heat recovery unit 14 may be located at the same height as the refrigerant pump 13, or below the refrigerant pump 13, in order to further reduce the required head of the refrigerant pump 13.

[0041] Furthermore, in the ejector cooling device 1, the evaporator 16 is positioned near the suction inlet of the vertically positioned ejector 10, which allows for a low center of gravity while reducing the pressure loss of the suction flow of the ejector 10. In contrast, if the ejector is positioned horizontally, positioning the evaporator near the ejector's suction inlet raises the center of gravity. Also, to reduce pressure loss, it is preferable that the evaporator 16 be positioned in a straight line with the suction inlet of the ejector 10.

[0042] Furthermore, it is preferable that the heat recovery unit 14 is located on the bottom surface of the housing 1a. If the condenser 11 and the heat recovery unit 14 are located on the top of the housing 1a, beams are required to support them, but if the heat recovery unit 14 is located on the bottom surface of the housing 1a, beams are not required. As a result, manufacturing costs can be reduced and assembly can be improved.

[0043] [Examples of arrangement for each configuration] The following describes an example of the arrangement of the condenser 11, the waste heat recovery unit 14, and the evaporator 16, which are the main components with large volumes, in the ejector cooling system 1.

[0044] (Example 1) Figures 3 and 4 are layout diagrams of the main components of the ejector cooling system according to Embodiment 1. Figure 3 is a side view of the ejector cooling system, and Figure 4 is a top view of the ejector cooling system. As shown in Figures 3 and 4, the condenser 11 is stacked on top of the evaporator 16, and the evaporator 16 is stacked on top of the heat recovery unit 14. Furthermore, the upper surface area of ​​the evaporator 16 is larger than the lower surface area of ​​the condenser 11, and the upper surface area of ​​the heat recovery unit 14 is larger than the lower surface area of ​​the evaporator 16.

[0045] An insulating material 21 made of a slippery material is placed between the condenser 11 and the evaporator 16, and between the evaporator 16 and the waste heat recovery unit 14.

[0046] According to Example 1, the condenser 11, evaporator 16, and heat recovery unit 14 are directly stacked and arranged, resulting in good assembly. Furthermore, the upper surface area of ​​the evaporator 16 is larger than the lower surface area of ​​the condenser 11, and the upper surface area of ​​the heat recovery unit 14 is larger than the lower surface area of ​​the evaporator 16, making them easy to stack and resulting in good assembly.

[0047] Furthermore, according to Example 1, since slippery insulating material 21 is placed between the condenser 11 and the evaporator 16, and between the evaporator 16 and the heat recovery unit 14, it is easy to correct any misalignment in the piping connecting the condenser 11, the evaporator 16, and the heat recovery unit 14, resulting in good assembly.

[0048] (Example 2) Figures 5 and 6 are layout diagrams of the main components of the ejector cooling system according to Embodiment 2. Figure 5 is a side view of the ejector cooling system, and Figure 6 is a top view of the ejector cooling system. As shown in Figures 5 and 6, the condenser 11 is stacked on top of the evaporator 16, and the evaporator 16 is stacked on top of the heat recovery unit 14. Furthermore, the upper surface area of ​​the evaporator 16 is larger than the lower surface area of ​​the condenser 11, and the upper surface area of ​​the heat recovery unit 14 is larger than the lower surface area of ​​the evaporator 16.

[0049] The condenser 11, evaporator 16, and waste heat recovery unit 14 are fixed to the column 31 with their positions finely adjusted via washers 34, thus preventing them from shifting position and improving seismic resistance.

[0050] Furthermore, wedges 32 are driven between the condenser 11 and the evaporator 16, and between the evaporator 16 and the waste heat recovery unit 14, preventing these positions from shifting and improving seismic resistance.

[0051] Furthermore, since a bracing rod 33 is positioned between the condenser 11 and the top surface of the ejector cooling device housing, displacement of these components is prevented, thereby improving seismic resistance.

[0052] In Example 2, seismic performance is improved by fixing the column 31, driving in the wedge 32, and further arranging the bracing rod 33, but seismic performance may be improved by employing one or more of these methods.

[0053] (Example 3) Figures 7 and 8 are layout diagrams of the main components of the ejector cooling system according to Embodiment 3. Figure 7 is a view of the ejector cooling system from above, and Figure 8 is a view of the ejector cooling system from the side. As shown in Figures 7 and 8, the condenser 11 is stacked on top of the evaporator 16, and the evaporator 16 is stacked on top of the heat recovery unit 14. Furthermore, the upper surface area of ​​the evaporator 16 is larger than the lower surface area of ​​the condenser 11, and the upper surface area of ​​the heat recovery unit 14 is larger than the lower surface area of ​​the evaporator 16.

[0054] As shown in Figure 7, anchors 41 are provided on the top surface of the housing 1a at the four corners of the housing 1a and at positions directly above the four corners of the heat recovery unit 14. When the housing 1a is empty, attaching wires to the anchors 41 at the four corners of the housing 1a allows the housing 1a to be suspended so as not to tilt. On the other hand, when the condenser 11, evaporator 16, and heat recovery unit 14 are placed inside the housing 1a, as shown in Figure 8, attaching wires 42 to the anchors 41 at positions directly above the four corners of the heat recovery unit 14 allows the housing 1a to be suspended so as not to tilt.

[0055] Furthermore, the configurations illustrated in the above embodiments are functionally schematic and do not necessarily have to be physically represented as shown. In other words, the forms of distribution and integration of each device and component are not limited to those shown, and all or part of them can be functionally or physically distributed and integrated in any unit according to various usage situations. [Explanation of Symbols]

[0056] 1. Ejector cooling system 1a Enclosure 10 Ejectors 11 Condenser 12 Refrigerant Tanks 13 Refrigerant pump 14. Heat recovery unit 15 Electronic expansion valve 16 Evaporator 17 Intermediate heat exchanger 21 Insulation 31 pillars 32 Wedge 33 Tension rods 34 Washers 41 Anchor 42 wires

Claims

1. An ejector cooling device comprising: a housing; a refrigerant pump for pressurizing the refrigerant; a heat recovery unit for heating the refrigerant with hot water and generating a drive flow; an expansion valve for reducing the pressure of the refrigerant; an evaporator for cooling a medium to be cooled with the refrigerant reduced in pressure by the expansion valve; an ejector for drawing in the refrigerant evaporated by the evaporator as a suction flow using the drive flow of the refrigerant from the heat recovery unit, and for discharging a mixture of the drive flow and the suction flow; and a condenser for cooling the refrigerant discharged from the ejector, wherein The heat recovery unit is located at the bottom of the housing, The evaporator is stacked on top of the heat recovery unit. The ejector cooling system is characterized in that the condenser is stacked on top of the evaporator.

2. The ejector cooling device according to Claim 1, characterized in that the ejector is arranged vertically such that the direction in which the drive flow flows in is downward and the direction in which the refrigerant is discharged is upward.

3. The ejector cooling device according to claim 1, characterized in that the heat recovery unit is located below the condenser.

4. The ejector cooling device according to claim 1, characterized in that the heat recovery unit is located on the bottom surface of the housing.

5. The ejector cooling device according to claim 1, further comprising a refrigerant tank located below the condenser for storing the refrigerant condensed by the condenser.

6. The ejector cooling device according to claim 5, characterized in that the refrigerant pump is located below the refrigerant tank.

7. The ejector cooling device according to claim 1, characterized in that the heat recovery unit is positioned at the same height as the refrigerant pump, or below the refrigerant pump.

8. The ejector cooling device according to claim 1, characterized in that the evaporator is located near the suction inlet through which the ejector draws in the refrigerant.

9. The ejector cooling device according to claim 8, characterized in that the evaporator is arranged in a straight line with the suction inlet.

10. The area of ​​the upper surface of the evaporator is larger than the area of ​​the lower surface of the condenser. The ejector cooling device according to claim 1, characterized in that the area of ​​the upper surface of the heat recovery unit is larger than the area of ​​the lower surface of the evaporator.

11. The ejector cooling device according to claim 1, characterized in that an insulating material made of a slippery material is placed between the condenser and the evaporator, and between the evaporator and the waste heat recovery unit.

12. The ejector cooling device according to claim 1, characterized in that the condenser, the evaporator, and the waste heat recovery unit are fixed to the column via washers.

13. The ejector cooling device according to claim 1, characterized in that wedges are driven between the condenser and the evaporator, and between the evaporator and the waste heat recovery unit.

14. The ejector cooling device according to claim 1, characterized in that a support rod is placed between the upper surface of the condenser and the housing.

15. The ejector cooling device according to claim 1, characterized in that anchors are provided on the upper surface of the housing at the four corners of the housing and at positions directly above the four corners of the heat recovery unit.

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