Etching equipment

Abstract

To provide an etching device which can suppress the occurrence of side etching even when etching is performed on a workpiece having a large thickness, as well as minimize the tact time.SOLUTION: An etching device 1A includes: transportation means for transporting a workpiece W; a spray tube 3 that extends along a transportation direction in which the workpiece W is transported by the transportation means and that feeds an etching solution; a plurality of spray nozzles 2 capable of spraying the etching solution at the workpiece W, the plurality of spray nozzles 2 being provided on the spray tube 3 so as to be lined up in the transportation direction; and movement means capable of moving the spray tube 3 in a transportation orthogonal direction that is orthogonal to the transportation direction, the movement means moving the spray tube 3 so that the etching solution sprayed from the spray nozzles 2 is blown onto the workpiece W across the entirety, with respect to the transportation orthogonal direction, of a prescribed region.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an etching apparatus.

Background Art

[0002] Various circuit boards have been used conventionally. In recent years, there has been an increasing opportunity to use circuit boards through which a large current flows for high-brightness LEDs and power modules. In order to make the circuit board compatible with a large current, it is effective to increase the thickness of the circuit pattern while reducing the resistance value and ensuring sufficient heat dissipation when a large current flows.

[0003] As a technique for manufacturing a circuit board with a thick circuit pattern, Patent Document 1 is known. This manufacturing method includes a process of forming a circuit pattern by half etching on one surface of a copper plate, laminating a prepreg on the formed circuit pattern, and further forming the remainder of the circuit pattern on the surface (unprocessed side) opposite to this prepreg.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, when manufacturing circuit boards using the technology described in Patent Document 1, half-etching is performed from both one and the other side of the copper plate, which complicates the process, lengthens the cycle time, and consequently increases manufacturing costs. On the other hand, when attempting to form a circuit pattern by etching from one side of the copper plate, conventional etching equipment (see Patent Document 2 and Figure 6 in the attached drawings) cannot secure a sufficient circuit width because the edging (side etching) increases as the thickness of the copper plate increases.

[0006] In view of these conventional problems, the present invention aims to provide an etching apparatus that can suppress side etching even when etching thick workpieces such as circuit patterns on high-current circuit boards, and can also reduce cycle time. In addition, the present invention also provides a method for manufacturing a circuit board and circuit patterns using technology related to this etching apparatus. [Means for solving the problem]

[0007] The present invention relates to an etching apparatus that sprays an etching solution onto a workpiece to etch a predetermined area of ​​the workpiece, comprising a transport means for transporting the workpiece, and extending along the transport direction of the workpiece by the transport means. It is shaped into a long, rectangular form. The etching apparatus comprises: a spray pipe for supplying the etching solution; a plurality of spray nozzles capable of spraying the etching solution onto the workpiece and arranged in a row on the spray pipe in the transport direction; and a moving means that allows the spray pipe to be moved in a transport orthogonal direction perpendicular to the transport direction, so that the etching solution sprayed from the spray nozzles is sprayed onto the workpiece over the entire transport orthogonal direction of a predetermined area.

[0008] In the etching apparatus described above, it is preferable that the spray nozzle produces an elongated spray pattern, and that the spray nozzle is provided in the spray tube such that the longitudinal direction of the spray pattern is aligned with the direction perpendicular to the transport direction.

[0009] Furthermore, in the etching apparatus described above, it is preferable that the transport means includes a posture changing means that changes the posture of the workpiece in the middle of the transport path so that the side located in the transport direction is the side located in the direction perpendicular to the transport direction.

[0010] In the etching apparatus described above, it is preferable that the spray nozzle produces an elongated spray pattern, and that the spray tube has a first portion on which the spray nozzle is provided such that the longitudinal direction of the spray pattern is aligned with the transport direction, and a second portion on which the spray nozzle is provided such that the longitudinal direction of the spray pattern is aligned with the transport direction perpendicular to the transport direction.

[0011] An example of a manufacturing method using the etching apparatus described above is a method for manufacturing a circuit pattern on a circuit board by etching a predetermined area of ​​a workpiece using an etching apparatus that sprays an etching solution onto the workpiece, wherein the etching apparatus comprises a transport means for transporting the workpiece, a spray pipe extending along the transport direction of the workpiece by the transport means and supplying the etching solution, a plurality of spray nozzles capable of spraying the etching solution onto the workpiece and arranged in a row on the spray pipe in the transport direction, and a moving means for moving the spray pipe in a direction perpendicular to the transport direction, wherein the etching solution is sprayed from the spray nozzles, the workpiece is transported by the transport means, and the spray pipe is moved by the moving means so that the etching solution sprayed from the spray nozzles is sprayed onto the workpiece over the entire area perpendicular to the transport direction of the predetermined area, thereby manufacturing the circuit pattern.

[0012] An example of a product manufactured by the etching apparatus described above is a circuit board having a circuit pattern formed by etching, wherein the etching depth of the circuit pattern is 0.5 to 2.0 mm and the etch factor of the circuit pattern is 5 or more. [Effects of the Invention]

[0013] According to the etching apparatus of the present invention, side etching can be suppressed even when etching thick workpieces, and the cycle time can also be reduced. [Brief explanation of the drawing]

[0014] [Figure 1] This figure shows a first embodiment of the etching apparatus according to the present invention, where (a) is a front view, (b) is a top view, and (c) is a side view. [Figure 2] This figure shows a plan view of a second embodiment of the etching apparatus according to the present invention. [Figure 3] This figure shows a plan view of a third embodiment of the etching apparatus according to the present invention. [Figure 4] This figure shows one embodiment of a circuit board. [Figure 5] This diagram illustrates the principle by which the amount of side etching can be further suppressed. [Figure 6] This diagram shows a conventional etching apparatus, where (a) is a front view, (b) is a top view, and (c) is a side view. [Modes for carrying out the invention]

[0015] An embodiment of the etching apparatus according to the present invention will be described below with reference to the attached drawings. Note that the figures shown in the attached drawings are schematic, and the thickness and width of each part, the ratios between each part, etc., may differ from those of the actual implementation.

[0016] First, a circuit board, which is an example of a product manufactured by the etching apparatus according to the present invention, will be described with reference to Figure 4(a). The circuit board 41 of this embodiment is formed by stacking a circuit pattern 42, an insulating layer 43, and a base substrate 44 in this order.

[0017] The circuit pattern 42 is processed into a predetermined pattern by etching a plate-shaped metal with an etching device described later. The circuit pattern 42 of this embodiment is formed of thick copper (rolled copper). Further, the thickness T (thickness of the thick copper) of the circuit pattern 42 is 0.5 to 2.0 mm.

[0018] The insulating layer 43 is formed of a material having insulating properties and serves to electrically insulate the circuit pattern 42 and the base substrate 44 and also serves to bond them to each other. The insulating layer 43 may cover the entire surface of the base substrate 44 or may cover a part of the surface.

[0019] As an example of the material of the insulating layer 43, a resin composition containing a thermosetting resin can be mentioned. Examples of the thermosetting resin include epoxy resin, phenol resin, melamine resin, urea resin, unsaturated polyester resin, alkyd resin, cyanate resin, etc. One kind of thermosetting resin may be used alone, or two or more kinds may be used in combination. Examples of what is contained in the resin composition other than the thermosetting resin include a curing agent. The curing agent is selected according to the type of the thermosetting resin and is not particularly limited as long as it reacts with this. For example, as the curing agent in the case of using an epoxy resin, an amine-based curing agent, an imidazole-based curing agent, a phenol-based curing agent, etc. can be mentioned. Further, the resin composition may contain a filler (inorganic filler). As the filler, those having excellent insulating properties and high thermal conductivity are preferable, and examples thereof include aluminum oxide, silica, aluminum nitride, boron nitride, silicon nitride, magnesium oxide, etc. Further, the resin composition may contain a curing accelerator, a stabilizer, an ion scavenger, a solvent, etc. Further, the resin composition may contain a flexibility-imparting material.

[0020] The base substrate 44 can be formed of various materials, but it is particularly preferable to be formed of a material having a high thermal conductivity. For example, it is preferably formed of a metal such as copper, aluminum, iron (either a single metal or an alloy). The base substrate 44 of the present embodiment is plate-shaped, but it may be provided with fins or the like in order to enhance the effect of releasing heat to the outside. Further, the base substrate 44 may have a single-layer structure or a multilayer structure.

[0021] Next, a conventional etching apparatus that was confirmed in the process of completing the present invention will be described with reference to FIG. 6.

[0022] The conventional etching apparatus 51 shown in FIG. 6 has been widely used, for example, when forming a thin circuit pattern by etching. This etching apparatus 51 includes a spray nozzle 52 that sprays an etching solution (for example, a ferric chloride solution) toward a workpiece W. The spray nozzle 52 uses a so-called full circular cone nozzle in which the spray pattern when sprayed on a plane is circular, and is attached to a spray pipe 53 that supplies the etching solution. The spray pipe 53 extends along the Y direction in FIG. 6, and a plurality of spray nozzles 52 are attached in series in the Y direction to one spray pipe 53. The spray pipe 53 is configured to be able to swing around its respective central axis by a swinging means (not shown). Further, as shown in FIG. 6(b), a plurality of spray pipes 53 are provided at intervals in the X direction. That is, the spray nozzles 52 are arranged at intervals in the X direction and the Y direction in a plan view. The intervals in the X direction and the Y direction of the spray nozzles 52 are relatively densely packed so that there is no gap between the individual spray liquids sprayed on the workpiece W (so that the spray patterns overlap) when the spray pipe 53 is swung while spraying the spray liquid from the spray nozzles 52.

[0023] Furthermore, the etching apparatus 51 is equipped with a plurality of rollers 54 that extend in the Y direction and are spaced apart in the X direction above the spray nozzle 52. The workpiece W to be etched is placed on the rollers 54. As the rollers 54 rotate, the workpiece W placed on the rollers 54 is transported in the X direction shown in Figure 6. The X direction corresponds to the "transport direction" as described herein, and the Y direction corresponds to the "direction perpendicular to transport".

[0024] For the etching apparatus 51 configured as described above, an unprocessed circuit board 410 was prepared as the workpiece W, as shown in Figure 4(b), in which thick copper 420, before being processed into a circuit pattern 42, was laminated on an insulating layer 43. An etching test was conducted to form a circuit pattern 42 by transporting the workpiece W with rollers 54 and spraying etching solution from a spray nozzle 52. Although not shown in the figure, a resist material (dry film resist in this embodiment) is laminated on the surface of the thick copper 420. The size and shape of the circuit pattern 42 vary depending on the circuit configuration and the type of electronic components mounted on it, and it may be provided in the entire area in the X and Y directions of the thick copper 420 or in only a part of the area. However, in this test, it is assumed that it is provided in the entire area in the X and Y directions of the thick copper 420. That is, the etching solution is sprayed over the entire area in the X and Y directions of the thick copper 420. The thickness of the thick copper 420 in the workpiece W used in the test is 1.5 mm.

[0025] However, when the workpiece W was etched using the conventional etching apparatus 51, the time required to etch the thick copper 420 to a predetermined depth (in the test, the time required to etch until the insulating layer 43 was exposed) was excessive. Furthermore, upon examining the circuit pattern 42 after etching, it was found that the amount of side etching (length D shown in Figure 4(a)) was excessive, resulting in the failure to obtain the intended etching factor (the T / D value shown in Figure 4(a)), and the variation in the etching factor was also large.

[0026] On the other hand, after the inventors of this invention conducted further investigations into these problems, they found that the temperature and pressure of the etching solution sprayed from the spray nozzle 52, the distance from the spray nozzle 52 to the workpiece W, individual differences in the spray nozzle 52, and differences in the degree of overlap of the etching solution sprayed onto the workpiece W were contributing to the malfunctions. Further investigations led to the discovery that the above problems could be solved, and thus the present invention was completed.

[0027] The etching apparatus 1A, which is a first embodiment of the etching apparatus according to the present invention, will be described below with reference to Figure 1. The etching apparatus 1A is equipped with a spray nozzle 2 that sprays an etching solution, such as a ferric chloride solution, upward onto a workpiece W. The workpiece W shown in Figure 1 is the same as the workpiece W shown in Figures 4(b) and 6 described above. The spray nozzle 2 in this embodiment uses a so-called fan-shaped nozzle that produces an elongated spray pattern. The spray nozzle 2 is attached to a single spray pipe 3 that supplies the etching solution. In this embodiment, the spray pipe 3 extends along the X direction in Figure 1, and multiple spray nozzles 2 are attached to the spray pipe 3 in a series configuration along the X direction. The spray nozzles 2 are attached to the spray pipe 3 such that the longitudinal direction of the spray pattern is aligned with the Y direction.

[0028] The etching apparatus 1A also includes a moving mechanism (not shown) for moving the spray tube 3 along the Y direction. The moving mechanism can consist of, for example, a guide shaft extending along the Y direction, a slider slidably held on the guide shaft and attached to the spray tube 3, a drive belt connected to the slider and extending along the Y direction, and a motor for rotating the drive belt. The range over which the spray tube 3 moves in the Y direction by the moving mechanism is at least the range over which the etching solution is sprayed over the entire Y direction of the area on the workpiece W where the circuit pattern 42 is provided. That is, since the circuit pattern 42 in this embodiment is provided over the entire Y direction of the thick copper 420 of the workpiece W, in the state shown in Figure 1(b), the spray tube 3 is moved at least between a position where the left end SL of the spray pattern overlaps with the left end WL of the workpiece W and a position where the right end SR of the spray pattern overlaps with the right end WR of the workpiece W.

[0029] Furthermore, the etching apparatus 1A is equipped with a plurality of rollers 4 located above the spray nozzle 2, extending in the Y direction and spaced apart in the X direction. The rollers 4 are arranged so as not to overlap with the spray nozzle 2 in a plan view. The rollers 4 are rod-shaped with a circular outer shape and can rotate around their central axis. As a rotation mechanism for rotating the rollers 4, for example, a pulley is attached to each roller 4, a drive belt is wrapped around these pulleys, and this drive belt is rotated by a motor. The rollers 4 and rotation mechanism in this embodiment correspond to the "conveying means" in this specification and so on.

[0030] In this configuration, the etching apparatus 1A can etch the workpiece W by rotating the roller 4 to transport the workpiece W in the X direction, while simultaneously spraying etching solution from the spray nozzle 2 and moving the spray tube 3 in the Y direction.

[0031] As described above, the problems that occurred with the conventional etching apparatus 51 were caused by factors such as individual differences in the spray nozzles 52 and differences in the degree of overlap of the etching solution sprayed onto the workpiece W. In contrast, the etching apparatus 1A is configured to spray the etching solution onto the workpiece W by arranging multiple spray nozzles 2 in series in the X direction on a single spray tube 3 and moving this spray tube 3 in the Y direction. This suppresses the effects of individual differences in the spray nozzles 2 and differences in the degree of overlap of the etching solution sprayed onto the workpiece W, thereby suppressing side etching and increasing the etching factor. Furthermore, the time required for etching could be shortened by adopting the new configuration of the spray nozzles 2 and spray tube 3 as described above (in particular, the spray pattern of the spray nozzles 2 is elongated, and the spray solution is sprayed locally onto the workpiece W, increasing the impact force of the spray solution), and by appropriately adjusting the temperature and pressure of the etching solution sprayed from the spray nozzles 2, the distance from the spray nozzles 2 to the workpiece W, etc. A detailed explanation of the tests using the etching apparatus 1A will be given later.

[0032] Incidentally, after further investigation using etching apparatus 1A, it was found that although the side etching amount D was suppressed compared to etching with the conventional etching apparatus 51, the value in the X direction tended to be larger than the value in the Y direction, as will be described later. To improve this point, further investigation was conducted, and it was found that with a configuration like etching apparatus 1B shown in Figure 2, the side etching amount D could be kept equal to the value in the Y direction in both the X and X directions.

[0033] Here, we will describe the etching apparatus 1B shown in Figure 2. The etching apparatus 1B of this embodiment has the same basic configuration as the etching apparatus 1A described above, but differs in that it is equipped with a posture changing means 5 in the middle of the transport path composed of multiple rollers 4 to change the posture of the workpiece W. The posture changing means 5 changes the posture of the workpiece W so that the side located in the X direction becomes the side located in the Y direction. Examples of the posture changing means 5 include a transfer machine provided above the workpiece W (which is movable in the vertical direction and rotatable around a vertical axis, and is configured to raise the workpiece W with a workpiece suction part provided at the tip, then rotate the workpiece W 90 degrees around the vertical axis, and then lower the workpiece W back to its original height), and a rotary table on which the workpiece W transported by the rollers 4 is placed (which is rotatable around a vertical axis, and is configured to rotate 90 degrees with the workpiece W placed on it when the workpiece W is transported by the rollers 4).

[0034] In the etching apparatus 1B shown in Figure 2, the spray pipe 3 is separated from the attitude changing means 5 on the upstream and downstream sides in the transport direction, but it may also be connected integrally.

[0035] In etching apparatus 1B with this configuration, the workpiece W etched upstream of the transport direction relative to the attitude changing means 5 is etched downstream of the transport direction after its attitude is changed by 90 degrees by the attitude changing means 5. That is, even if the amount of side etching D is increasing in the X direction more than in the Y direction when etching the workpiece W upstream of the transport direction, the amount of side etching D in the original X direction area can be suppressed when etching is continued downstream of the transport direction after the attitude change. Therefore, the amount of side etching D when etching is finally performed to a predetermined depth can be kept equal to the value of the area that was initially located in the X direction, even in the area that was initially located in the Y direction. In etching apparatus 1B of this embodiment, the transport distance of the workpiece W upstream of the transport direction is longer than the transport distance of the workpiece W downstream of the transport direction (i.e., the time spent etching the workpiece W upstream of the transport direction is longer than the time spent etching the workpiece W downstream of the transport direction), and the apparatus is configured to perform the main etching upstream of the transport direction and the etching that suppresses the amount of side etching D in the original X direction area downstream of the transport direction.

[0036] To make the value in the X direction of the side etching amount D equal to the value in the Y direction, this can also be achieved with the etching apparatus 1C shown in Figure 3. In this embodiment, the etching apparatus 1C changes the orientation of the spray nozzles 2 in the middle of the transport path, which is composed of multiple rollers 4. Specifically, on the upstream side in the transport direction, the spray nozzles 2 are attached to the spray pipe 3 with the longitudinal direction of the spray pattern aligned with the Y direction, but on the downstream side in the transport direction, the spray nozzles 2 are attached with the longitudinal direction of the spray pattern aligned with the X direction. In this embodiment, in order to prevent the spray patterns of adjacent spray nozzles 2 from overlapping in the X direction, when arranging the spray nozzles 2 to align with the X direction, they are attached to the spray pipe 3 with every other nozzle shifted in the Y direction so that they form a staggered pattern overall.

[0037] In Figure 3, the portion of the spray pipe 3 in which the spray nozzle 2 is attached with the longitudinal direction of the spray pattern aligned with the Y direction (the upstream portion in the transport direction) corresponds to the "second portion" in this specification, and the portion in which the spray nozzle 2 is attached with the longitudinal direction of the spray pattern aligned with the X direction (the downstream portion in the transport direction) corresponds to the "first portion" in this specification. In addition, although the spray pipe 3 in Figure 3 is separated into the upstream and downstream portions in the transport direction, they may be connected as a single unit.

[0038] In etching apparatus 1C with this configuration, etching is performed on the upstream side in the transport direction by etching solution sprayed from the spray nozzle 2 with the longitudinal direction of the spray pattern aligned with the Y direction, and etching is performed on the downstream side in the transport direction by etching solution sprayed from the spray nozzle 2 with the longitudinal direction of the spray pattern aligned with the X direction. In other words, even if the amount of side etching D becomes larger in the X direction than in the Y direction when etching the workpiece W on the upstream side in the transport direction, the amount of side etching D in the original X direction can be suppressed when etching is performed on the downstream side in the transport direction. Therefore, similar to etching apparatus 1B, in etching apparatus 1C as well, the amount of side etching D when etching is finally performed to a predetermined depth can be kept equal in the X direction to the value in the Y direction.

[0039] Incidentally, after further investigation by the inventors of this application, it was found that the amount of side etching D can be further suppressed by the spray angle of the spray nozzle 2. This point will be explained with reference to Figure 5.

[0040] Figure 5(a) shows the etching process using the circuit board 410 shown in Figure 4 as the workpiece W, with the etching apparatus 1B shown in Figure 2. In Figure 5(a), the symbol R indicates the resist material (dry film resist in this embodiment), and the symbol H indicates the opening of the resist material R. In the etching apparatus 1B shown in Figure 2, the spray nozzle 2 sprays the etching solution directly upwards (Z direction). When etching was completed in this state, as shown in Figure 5(b), the amount of side etching D of the circuit pattern 42 at the leading end portion 42F in the direction of travel was greater than the amount of side etching D of the trailing end portion 42R in the direction of travel. Further investigation into the cause revealed that the etching solution entering from the opening H forms a liquid pool inside the opening H, and as the workpiece W is transported in this state, etching proceeds more easily at the trailing end portion 42R in the direction of travel, which is more likely to come into contact with the liquid pool, than at the leading end portion 42F in the direction of travel.

[0041] On the other hand, after performing a certain amount of etching with the spray nozzle 2 pointed straight up, when the etching solution was sprayed with the spray nozzle 2 tilted at an angle toward the transport direction of the workpiece W, as shown in Figure 5(c), it was found that the amount of side etching D on the leading portion 42F in the direction of travel could be suppressed to the same level as the amount of side etching D on the trailing portion 42R in the direction of travel, as shown in Figure 5(d). In other words, as shown in the figure, because the spray angle of the spray nozzle 2 is tilted, the etching solution is more likely to come into contact with the leading portion 42F in the direction of travel, and the liquid reservoir is also more likely to come into contact with the leading portion 42F in the direction of travel.

[0042] Therefore, to further suppress the amount of side etching D, it is preferable to perform etching in the latter half of the etching process using a spray nozzle 2 with an inclined spray angle toward the transport direction of the workpiece W. After further investigation of the spray angle of the spray nozzle 2, it was found that the preferred range of the spray angle θ relative to the vertical direction, as shown in Figure 5(c), was 10°≦θ≦45°.

[0043] The following describes the test results when etching thick copper 420 on a workpiece W using the conventional etching apparatus 51 described above, etching apparatuses 1A, 1B, and 1C according to one embodiment of the present invention, and etching apparatus 1B in which the spray angle of the spray nozzle 2 is tilted in the latter half of the etching process. The workpiece W used was the same in all tests, with a thickness of 1.5 mm for the thick copper 420, and etching was performed until the insulating layer 43 was exposed. In all tests, the etching solution was a ferric chloride solution. The temperature, flow rate (spray volume), pressure (spray speed), etc. of the etching solution sprayed from the spray nozzles 2 and 52, as well as the distance from the spray nozzles 2 and 52 to the workpiece W, the transport speed of the workpiece W, the movement speed of the spray tube 3, etc., were set to conditions optimized to shorten the etching time and to suppress the amount of side etching D and improve the etching factor T / D. As an example of the conditions, in the comparative example shown in Table 1 below, the flow rate to the spray nozzle 52 was set to 3-4 L / min and the pressure to 0.2-0.3 MPa, while in Examples 1-4, the flow rate to the spray nozzle 2 was set to 5-6 L / min and the pressure to 0.4-0.5 MPa. When tests were conducted under these conditions, the results shown in Table 1 below were obtained.

[0044] [Table 1]

[0045] As shown in the comparative examples in Table 1, the circuit pattern 42 obtained by etching the workpiece W with etching apparatus 51 had a large side etching amount D. The etching time was also long. On the other hand, as shown in Examples 1 to 3, it was found that the side etching amount D could be suppressed when etching was performed with etching apparatuses 1A to 1C. It was also confirmed that the etching time could be shortened to several tens of minutes, which was shorter than the time taken with etching apparatus 51. When etching was performed with etching apparatus 1A, the side etching amount D tended to be larger in the X direction than in the Y direction. However, as shown in Examples 2 and 3, when etching was performed with etching apparatuses 1B and 1C, the side etching amount D could be kept to 0.2 to 0.3 mm in both the X and Y directions, and the etching factor T / D could be made to 5 or more. Furthermore, when etching was performed with etching apparatus 1B, in which the spray angle of the spray nozzle 2 was tilted in the latter half of the etching process, the side etching amount D could be kept to 0.15 to 0.25 mm in both the X and Y directions, and the etching factor T / D could be made to 6 or more. Furthermore, when we prepared thick copper 420 with a thickness in the range of 0.5 to 2.0 mm as the workpiece W and performed an etching test using etching apparatus 1A to 1C until the insulating layer 43 was exposed, we confirmed the same results as in Examples 1 to 4.

[0046] Although one embodiment of the present invention has been described above, the present invention is not limited to these specific embodiments, and unless otherwise specifically limited in the above description, various modifications and changes are possible within the scope of the spirit of the present invention as described in the claims. Furthermore, the effects described in the above embodiments are merely illustrative of the effects that may arise from the present invention, and do not mean that the effects of the present invention are limited to those described above.

[0047] For example, in etching apparatuses 1A to 1C, the spray nozzle 2 produced an elongated spray pattern, but it is not limited to this. For example, a so-called pyramidal nozzle that produces a square spray pattern when sprayed on a flat surface may be used. When using a pyramidal nozzle as the spray nozzle 2, it should be attached to the spray tube 3 so that two orthogonal sides of the square spray pattern are oriented in the X and Y directions. Such a pyramidal nozzle can improve the phenomenon in which the amount of side etching D is larger in the X direction than in the Y direction, which occurred with the spray nozzle 2 that produced the elongated spray pattern described above.

[0048] Furthermore, the configuration of etching apparatuses 1A to 1C can be changed as appropriate; for example, the spray liquid may be sprayed onto the workpiece W from above. Also, in etching apparatus 1C shown in Figure 3, the arrangement of the spray nozzles 2 may be swapped between the upstream and downstream sides in the transport direction, so that the longitudinal direction of the spray pattern is aligned with the X direction on the upstream side in the transport direction, and the longitudinal direction of the spray pattern is aligned with the Y direction on the downstream side in the transport direction. In addition, although the arrangement of the spray nozzles 2 was changed at two locations, the upstream and downstream sides in the transport direction, this may be increased further.

[0049] Furthermore, the circuit board 41 shown in Figure 4(a) is not formed solely by etching a pre-laid thick copper 420 onto the insulating layer 43 as shown in Figure 4(b). Instead, a single piece of thick copper 420 may be used as a workpiece W and etched to form a circuit pattern 42, which may then be laminated onto the insulating layer 43.

[0050] When the spray nozzle 2 is tilted toward the transport direction of the workpiece W as shown in Figure 5(c), depending on the shape of the circuit pattern 42, etching may progress at the leading portion 42F in the direction of travel more than at the trailing portion 42R in the direction of travel. In this case, the spray nozzle 2 may be tilted in the opposite direction to the transport direction of the workpiece W so that etching at the trailing portion 42R in the direction of travel is performed preferentially over etching at the leading portion 42F in the direction of travel. When the spray nozzle 2 is tilted in the opposite direction to the transport direction of the workpiece W, it is preferable to set the spray angle θ, which is based on the vertical direction as shown in Figure 5(c), within the range of -10°≦θ≦-45°. [Explanation of Symbols]

[0051] 1A, 1B, 1C: Etching equipment 2: Spray nozzle 3: Spray pipe 4: Rollers (conveying means) 5: Means of changing posture 41: Circuit board 42: Circuit Pattern W: Work

Claims

1. An etching apparatus that sprays an etching solution onto a workpiece to etch a predetermined area of ​​the workpiece, A conveying means for transporting the aforementioned workpiece, A spray pipe, which is shaped into an elongated form extending along the direction of transport of the workpiece by the transport means, and which supplies the etching solution, A plurality of spray nozzles are provided on the spray tube in a row in the transport direction, capable of spraying the etching solution onto the workpiece, An etching apparatus comprising: a means for moving the spray tube so as to be movable in a direction perpendicular to the transport direction, and such that the etching solution ejected from the spray nozzle is sprayed onto the workpiece over the entire area perpendicular to the transport direction in a predetermined region.

2. The etching apparatus according to claim 1, wherein the spray nozzle has an elongated spray pattern and is provided on the spray tube such that the longitudinal direction of the spray pattern is aligned with the direction perpendicular to the transport.

3. The etching apparatus according to claim 2, wherein the transport means includes a posture changing means for changing the posture of the workpiece in the middle of the transport path so that the side located in the transport direction is the side located in the direction perpendicular to the transport.

4. The aforementioned spray nozzle produces a spray pattern that is elongated, The etching apparatus according to claim 1, wherein the spray tube has a first portion on which the spray nozzle is provided such that the longitudinal direction of the spray pattern is aligned with the transport direction, and a second portion on which the spray nozzle is provided such that the longitudinal direction of the spray pattern is aligned with the transport direction perpendicular to the transport direction.

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