Wave solder nozzle with automated exit blades

Abstract

The wave soldering machine includes a housing and a conveyor configured to transport printed circuit boards through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material and a wave solder nozzle assembly 36 that generates a solder wave. The wave solder nozzle assembly 36 has a nozzle core frame 40 and exit wings 52, which are rotatable about hinges 54 relative to the nozzle core frame 40 to adjust the flow of the solder wave. A linear actuator 56 is coupled to the exit wings 52 via couplers 58, 62, 64, 70, and 74, allowing the linear actuator 56 to adjust the orientation of the exit wings 52 relative to the nozzle core frame 40.

Description

Technical Field

[0001] The present disclosure generally relates to an apparatus and method for assisting in the process of manufacturing printed circuit boards and soldering metal to integrated circuit boards, and more particularly to a wave soldering machine having a wave soldering nozzle assembly with an automated adjustable exit wing for optimizing the flow of solder on the back surface of the nozzle, and related methods.

Background Art

[0002] In the manufacture of printed circuit boards, electronic components can be mounted on the printed circuit boards by a process known as "wave soldering". In a conventional wave soldering machine, a conveyor moves a printed circuit board (sometimes called a "PCB") through a flux application station, a preheating station, and finally a wave soldering station on an inclined path. In the wave soldering station, a wave of solder is ejected upward (by a pump) through a wave soldering nozzle and contacts the portion of the printed circuit board to be soldered.

[0003] A typical wave soldering nozzle has an exit wing that is manually tilted to increase or decrease the height of the back surface of the nozzle that controls the flow of solder generated by the wave soldering machine. The process of adjusting the solder flow can be difficult and poses a risk to the operator tasked with performing such adjustments within a solder pot filled with molten solder.

Summary of the Invention

[0004] One aspect of the present disclosure relates to a wave soldering machine for performing wave soldering operations on a printed circuit board. In one embodiment, the wave soldering machine includes a housing, a conveyor coupled to the housing, and a wave soldering station coupled to the housing. The conveyor is configured to transport the printed circuit board through the housing. The wave soldering station includes a solder material reservoir and a wave soldering nozzle assembly for generating solder waves. The wave soldering nozzle assembly has a nozzle core frame and an outlet vane. The outlet vane is rotatable around a hinge relative to the nozzle core frame to regulate the flow of solder waves. The wave soldering nozzle assembly further includes a linear actuator coupled to the outlet vane and configured to regulate the orientation of the outlet vane relative to the nozzle core frame.

[0005] In some embodiments, the linear actuator is connected to the outlet blade by a coupler.

[0006] In some embodiments, the outlet wing includes a first end and a second end connected to the nozzle core frame by the hinge, and the coupler includes at least one rotating link having a first end rotatably coupled to the second end of the outlet wing and a second end rotatably coupled to the actuator arm of the actuator.

[0007] In some embodiments, the coupler further includes a crossbar extending perpendicularly to and rotatably coupled to the at least one rotating link, and at least one connecting link connecting the crossbar to the actuator arm and extending perpendicularly to the crossbar.

[0008] In some embodiments, the at least one connecting link is connected to the actuator arm by an actuator block.

[0009] In some embodiments, the at least one rotating link is two rotating links, and the at least one connecting link is two connecting links.

[0010] In some embodiments, the wave soldering machine further includes a controller that communicates with the actuator and causes the actuator to adjust the orientation of the outlet blades during the operation of the wave soldering machine.

[0011] In some embodiments, the wave soldering machine further includes a controller that communicates with the actuator and causes the actuator to adjust the orientation of the outlet blades during the operation of the wave soldering machine.

[0012] In some embodiments, the wave soldering machine further includes a substantially gas-impermeable shroud surrounding the wave soldering station and including at least one sealed opening through which the at least one connecting link extends, each sealed opening having an inner surface substantially sealed-engaged with one outer surface of the connecting link.

[0013] Another aspect of the present invention relates to a wave solder nozzle assembly for a wave soldering station configured to perform wave soldering operations on a printed circuit board. In one embodiment, the wave solder nozzle assembly includes a nozzle core frame, an exit vane coupled to the nozzle core frame, the exit vane being rotatable around a hinge relative to the nozzle core frame to regulate the flow of solder waves, and a linear actuator coupled to the exit vane and configured to regulate the orientation of the exit vane relative to the nozzle core frame.

[0014] In some embodiments, the linear actuator is connected to the outlet blade by a coupler.

[0015] In some embodiments, the outlet wing includes a first end and a second end connected to the nozzle core frame by the hinge, and the coupler includes at least one rotating link having a first end rotatably coupled to the second end of the outlet wing and a second end rotatably coupled to the actuator arm of the actuator.

[0016] In some embodiments, the coupler further includes a crossbar extending perpendicularly to and rotatably coupled to the at least one rotating link, and at least one connecting link connecting the crossbar to the actuator arm and extending perpendicularly to the crossbar.

[0017] In some embodiments, the at least one connecting link is connected to the actuator arm by an actuator block.

[0018] In some embodiments, the at least one rotating link is two rotating links, and the at least one connecting link is two connecting links.

[0019] In some embodiments, the actuator receives a command from the controller during the operation of the wave soldering machine to adjust the orientation of the outlet blade.

[0020] In some embodiments, the actuator receives a command from the controller during the operation of the wave soldering machine to adjust the orientation of the outlet blade.

[0021] In some embodiments, the wave solder nozzle assembly further includes a substantially gas-impermeable shroud surrounding the wave soldering station and including at least one sealed opening through which the at least one connecting link extends, each sealed opening having an inner surface substantially sealed-engaged with one outer surface of the connecting link.

[0022] Another aspect of the present disclosure relates to a method for regulating the flow of a solder wave in a wave solder nozzle assembly of a wave soldering machine. In one embodiment, the method includes transporting solder material to a wave solder nozzle assembly including a nozzle core frame and an outlet vane hinged to the nozzle core frame; regulating the flow of the solder wave by a linear actuator coupled to the outlet vane and adjusting the orientation of the outlet vane relative to the nozzle core frame; and performing a wave soldering operation on a printed circuit board.

[0023] In some embodiments, the flow of the solder wave is controlled by rotating the outlet blade relative to the nozzle core frame using a coupler coupled to the linear actuator and the outlet blade.

[0024] In some embodiments, the method further comprises generating a substantially gas-impermeable atmosphere over the solder wave by a shroud surrounding the wave soldering station, which includes the wave solder nozzle assembly, the shroud including at least one sealed opening through which the at least one connecting link of the coupler passes, each sealed opening having an inner surface substantially sealed-engaged with one of the outer surfaces of the respective connecting link.

[0025] In some embodiments, the actuator is coupled to a controller that controls the movement of the linear actuator.

[0026] The accompanying drawings are not intended to be drawn to an exact scale. In the drawings, each identical or substantially identical component shown in each figure is represented by a similar reference numeral. For the purpose of clarity, not all components are labeled in all of the drawings.

Brief Description of the Drawings

[0027] [Figure 1] It is a perspective view of a wave soldering machine. [Figure 2] It is a side elevation view of a wave soldering machine with the external package removed to reveal the internal components. [Figure 3] It is a perspective view of a wave soldering station. [Figure 4] It is an exploded cross-sectional view of a wave soldering station. [Figure 5] It is an enlarged perspective cross-sectional view of the components of a wave soldering station. [Figure 6] It is an elevation cross-sectional view of the wave soldering station of FIG. 5 showing a part of the shroud. [Figure 7] It is an elevation cross-sectional view of the wave soldering station and shroud portion of FIG. 6 with the exit wing in a different orientation from that of FIG. 6. [Figure 8] It is an elevation cross-sectional view of the flow through the wave soldering nozzle assembly of FIG. 6 when the printed circuit board (PCB) is not passing over the wave soldering nozzle assembly. [Figure 9] It is an elevation cross-sectional view of the flow through the wave soldering nozzle assembly of FIG. 7 when the PCB is not passing over the wave soldering nozzle assembly.

Modes for Carrying Out the Invention

[0028] This disclosure is not limited to the structural and arrangement details of the components shown in the following description or drawings, which may be used for applications. Other embodiments of this disclosure are possible and can be implemented or performed in various ways. The terms and technical terms used herein are for illustrative purposes only and should not be considered limiting. The use of “including,” “comprising,” “having,” “containing,” “involving,” and their variations herein is intended to include additional items, along with the items listed above and their equivalents. This disclosure provides a wave soldering machine including a wave soldering nozzle assembly.

[0029] This disclosure also provides a wave solder nozzle assembly for a wave soldering machine. The wave solder nozzle assembly includes an actuator configured for real-time control of the angle of an adjustable outlet vane of the wave solder nozzle assembly. The angle of the outlet vane affects the flow of solder waves exiting the wave solder nozzle assembly.

[0030] In some embodiments, the actuator is a linear actuator coupled to the outlet blade to adjust the angle of the outlet blade. In some embodiments, the linear actuator includes one or more longitudinally movable actuator arms. Since the actuator arms move along a linear path, the linear actuator may be used in combination with a substantially gas-impermeable shroud surrounding the wave solder nozzle assembly. In some embodiments, the shroud is substantially nitrogen-impermeable. In some embodiments, the shroud includes one or more sealed openings, each of which seals with one outer surface of a connecting link. In such embodiments, the outer surface of each connecting link has a substantially constant cross-section along the length of each actuator arm that will pass through its respective sealed opening during use. Thus, the outer surface of each connecting link can maintain a seal with its respective sealed opening as the actuator arm is extended and retracted to rotate the outlet blade. Such a sealed engagement of the shroud is not possible with a rotating actuator arm that sweeps across the plane of the shroud.

[0031] In addition, compared to other means of moving the exit wing, linear actuators allow for a more compact connection between the actuator arm and the exit wing.

[0032] In addition, compared to other means of moving the exit blades, the controller can be automated to have a linear actuator adjust the orientation of the exit blades, thereby eliminating the need for manual intervention to change the orientation of the exit blades. The linear actuator can be controlled to precisely adjust the orientation of the exit blades during the operation of the wave solder nozzle assembly.

[0033] For illustrative purposes, with reference to Figure 1, embodiments of the present disclosure are described below with respect to a wave soldering machine, shown collectively as 10, used for applying solder to printed circuit boards 12. The wave soldering machine 10 is one of several machines in a printed circuit board manufacturing / assembly line. As shown, the wave soldering machine 10 includes a housing or frame 14 adapted to accommodate the machine's components. A conveyor 16 is configured to feed the printed circuit boards to be processed by the wave soldering machine 10. Upon entering the wave soldering machine 10, each printed circuit board 12 passes through a tunnel 18, which includes a flux application station, shown collectively as 20, and a preheating station, shown collectively as 22, along an inclined path (e.g., 6 degrees relative to the horizontal) along the conveyor 16, to prepare the printed circuit board for wave soldering. Once prepared (i.e., heated), the printed circuit board 12 moves to a wave soldering station, shown collectively as 24, which applies solder material to the printed circuit board. A controller 26 is provided to automate the operation of several stations of the wave soldering machine 10, including, but not limited to, a flux application station 20, a preheating station 22, and a wave soldering station 24, in a known manner.

[0034] Referring to Figure 2, the flux application station 20 applies flux to the printed circuit board as it moves along the conveyor 16, passing through the wave soldering machine 10. The preheating station includes several preheaters (e.g., preheaters 22a, 22b, and 22c) which are designed to gradually raise the temperature of the printed circuit board as it moves along the conveyor 16 through the tunnel 18 to prepare it for the wave soldering process. As shown in the figure and as will be described in more detail later, the wave soldering station 24 includes a wave soldering nozzle assembly that is in fluid communication with a solder material reservoir. A pump is provided in the reservoir to transport the molten solder material from the reservoir to the wave soldering nozzle assembly. Once soldered, the printed circuit board exits the wave soldering machine 10 via the conveyor 16 to another station on the production line, such as a pick-and-place machine.

[0035] In some embodiments, the wave soldering machine 10 further includes a flux management system, shown collectively as 28, which removes volatile contaminants from the tunnel 18 of the wave soldering machine. As shown in Figure 2, the flux management system 28 is located below the preheating station 22. In one embodiment, the flux management system is supported by a housing 14 within the wave soldering machine and is in fluid communication with the tunnel 18, which is schematically shown in Figure 2. The flux management system 28 is configured to receive contaminated gas from the tunnel 18, process the gas, and return clean gas to the tunnel. The flux management system 28 is particularly configured to remove volatile contaminants from the gas, especially in an inert atmosphere.

[0036] Referring further to Figures 3 and 4, in one embodiment, the wave soldering station 24 comprises a solder pot 30 defining a reservoir 32 configured to contain molten solder. In one embodiment, the solder pot 30 is a box-shaped structure supporting the components of the wave soldering station 24, including a flow conduit 34 having two chambers within the reservoir 32. The flow conduit 34 is designed to transport pressurized molten solder to the opening or nozzle of a wave soldering nozzle assembly, shown 36 as a whole. As will be described in more detail later, the wave soldering nozzle assembly 36 is configured to transport the molten solder to the bottom of the printed circuit board 12, enabling a smooth flow of solder back to the reservoir 32. Specifically, the wave soldering nozzle assembly 36 is capable of regulating the flow of solder waves when performing wave soldering operations.

[0037] The wave soldering station 24 further comprises a pump impeller 38 positioned within the reservoir 32 of the solder pot 30, adjacent to an inlet provided within the flow conduit 34. The pump impeller 38 pressurizes the molten solder in the reservoir 32 and pumps the molten solder vertically through the flow conduit 34 in the reservoir 32 to the wave solder nozzle assembly 36. In one embodiment, the pump impeller 38 is a centrifugal pump of a suitable size for pumping the molten solder to the nozzle of the wave solder nozzle assembly 36. The wave solder nozzle assembly 36 is configured to generate solder waves that are provided for mounting components onto the circuit board 12 in a manner described later, and to optimize the residence time during processing.

[0038] Referring to Figures 3 to 7, the wave solder nozzle assembly 36 includes a nozzle core frame 40 having two side walls 42, 44 and a first longitudinal support element 46 and a second longitudinal support element 48 extending between the side walls 42 and 44. As shown, the nozzle core frame 40 may further include several transverse support elements, each indicated by 50, extending between the first longitudinal support element 46 and the second longitudinal support element 48. The nozzle core frame 40 also directs the flow of solder through a nozzle throat defined between the first longitudinal support element 46 and the second longitudinal support element 48.

[0039] The nozzle assembly 36 further includes an outlet vane 52 for controlling the flow of solder over the back of the nozzle of the solder wave generated by the wave soldering machine 10. To allow adjustment of the flow of solder waves exiting the nozzle throat of the nozzle core frame 48, the outlet vane 52 is fixed to the nozzle core frame 40 by a hinge 54. The outlet vane 52 is rotatable around the hinge 54 by an actuator 56 via a coupler. As will be described in more detail below, the angle of the outlet vane 52 relative to the nozzle core frame 40 can be controlled in real time by controlling the longitudinal displacement of the actuator arm 58 of the actuator 56, thus increasing or decreasing the flow of solder waves over the back of the nozzle.

[0040] The actuator 56 is fixed to the solder pot 30 by an actuator support frame 60, which is fixed to the side wall of the solder pot 30 by appropriate fasteners such as bolts. The actuator support frame 60 may be alternately fixed to the solder pot 30 by welding or by other means such as rivets. As shown in the figure, the actuator 56 is fixed to the actuator support frame 60, which is configured to firmly support the actuator against the solder pot 30. The actuator 56 is positioned next to the wave solder nozzle assembly 36 and forms part of the assembly that adjusts the orientation of the outlet wing 52 of the wave solder nozzle assembly relative to the nozzle core frame 40 via a coupler coupled to the outlet wing 52 and the actuator 56. The actuator includes an actuator arm 58 coupled to the coupler by an actuator block 62. The coupler is described in more detail below.

[0041] In one embodiment, the actuator 56 is a linear actuator, and therefore the actuator arm 58 moves longitudinally. The actuator block 62 connects the actuator arm 58 to a coupling link 64 of a coupler, transmitting movement from the actuator arm 58 to the coupling link 64. Thus, the longitudinal movement of the actuator arm 58 moves the actuator block 62 and the coupling link 64 in the same longitudinal direction as the actuator arm 58. In some embodiments, the actuator 56 and the coupling link 64 are oriented such that the actuator arm 58 moves the coupling link 64 horizontally. In a particular embodiment, the actuator 56 includes an electromechanical actuator that provides movement for adjusting the orientation of the exit wing. The actuator 56 is driven by computer-controlled mechanical software (supported by the controller 26) and incorporates an encoder that can relay position indicators to the mechanical software. Via the controller 26, the actuator 56 can be controlled in real time to achieve the desired orientation of the exit wing 52. The controller communicates with the actuator and is configured to cause the actuator to adjust the direction of the exit blade 52 while the wave soldering machine is in operation. The actuator 56 then receives a command from the controller 26 to adjust the direction of the exit blade 52 while the wave soldering machine is in operation.

[0042] In one embodiment, the outlet wing 52 includes a first end 66 coupled to the nozzle core frame 40 by a hinge 54 and a second end 68 coupled to an actuator via two rotating links 70 of a coupler, thereby allowing the actuator 56 to rotate the second end of the outlet wing 52 around the hinge 54 at the first end 66 of the outlet wing 52. Rotating the outlet wing 52 around the hinge 54 alters the flow of solder waves passing over the outlet wing 52. In particular, rotating the outlet wing 52 so that the second end 68 of the outlet wing 52 moves upward reduces the flow of solder waves passing over the outlet wing, while rotating the outlet wing 52 so that the second end 68 of the outlet wing 52 moves downward increases the flow of solder waves passing over the outlet wing.

[0043] As described above, the coupler allows the actuator to adjust the orientation of the outlet blade 52 relative to the nozzle core frame. In particular, the coupler allows longitudinal movement of the actuator arm 58 of the actuator 56 to adjust the angle of the upper surface 72 of the outlet blade 52 with respect to the horizontal. The coupler includes two rotating links 70, a crossbar 74, and two connecting links 64. The two rotating links 70 connect the second ends 68 of the outlet blade 52 to the crossbar 74, which is then connected to the actuator block 62 by the two connecting links 64.

[0044] Each rotating link 70 has a first end rotatably coupled to the second end of the exit wing 52 and a second end rotatably coupled to the crossbar 74. The crossbar 74 extends perpendicularly to the rotating links 70. Each connecting link 64 has a first end coupled to the crossbar 74 and a second end coupled to the actuator block 62. The connecting link 64 extends perpendicularly to the crossbar 74 and parallel to the actuator arm 58. As shown in Figure 6, when the upper surface 72 of the exit wing 52 extends substantially horizontally, the crossbar 74 is located below the exit wing 52 and longitudinally between the first end 66 and the second end 68 of the exit wing 52.

[0045] The longitudinal displacement of the actuator arm 58 allows the exit blade 52 to rotate around the hinge 54. The axial direction of the actuator arm 58 is parallel to the axial direction of each of the connecting links 64. Thus, the actuator arm 58 is configured to move the connecting links 64 horizontally along the axis of direction of the actuator arm 58. Since the crossbar 74 is coupled to the connecting links 64, the extension or retraction of the actuator arm 58 results in the translation of the crossbar 74. Since the rotation link 70 is rotatably coupled to the crossbar 70, and since both the actuator 56 and the wave solder assembly 36 are fixed to the solder pot 30, this translation of the crossbar 74 results in the rotation of the exit blade 52.

[0046] Referring particularly to Figures 6 and 7, the actuator arm 58 is shown in a protruding position in Figure 6 compared to a retracted position in Figure 7. The second end 68 of the outlet wing 52 is shown higher in Figure 7 than in Figure 6. The back gate 76 is fixed to the second end 68 of the outlet wing 52. The controller 26 adjusts the orientation of the outlet wing 52 to change the solder flow over the back gate 76 of the outlet wing. The controller 26 achieves the optimal soldering characteristics of the wave nozzle assembly 36. Optimal soldering characteristics are achieved when there is no flow over the back gate 76 when the conveyor 16 is not transporting components to be soldered, such as PCBs, over the wave solder assembly 36, but when a PCB being transported by the conveyor 16 enters the solder wave, solder begins to flow over the back gate 76 at the same speed as the PCB along the conveyor 16. When the PCB leaves the wave, the solder flow over the back gate 76 stops again.

[0047] The position of the actuator arm 58 in Figure 6 causes the upper surface 72 of the outlet vane 52 to extend substantially horizontally, resulting in a solder wave with a first flow on the outlet vane. The dashed arrow in Figure 8 indicates the direction of the solder flow through the wave solder assembly 36 when the component to be soldered, such as a PCB, is not passing along the conveyor 16 and the actuator arm 58 is in the protruding position shown in Figure 6. The height of the solder wave in Figure 8 is indicated by the dashed line A. In some embodiments, this solder wave height A is the lowest solder wave height of the wave solder assembly 36. The position of the actuator arm 58 in Figure 7 causes the upper surface 72 of the outlet vane to form an angle with the horizontal, resulting in a solder wave with a second flow on the outlet vane, which is smaller than the first flow. The dashed arrow in Figure 9 indicates the direction of the solder flow through the wave solder assembly 36 when the PCB is not passing along the conveyor 16 and the actuator arm 58 is in the retracted position shown in Figure 7. In Figure 9, the height of the solder wave is indicated by the dashed line B. In some embodiments, this solder wave height B is the highest solder wave height of the wave solder assembly 36.

[0048] The above description of solder flow relates to PCBs transported by the conveyor 16, but similar solder flow can occur for other components to be soldered that are transported by the conveyor 16 over the wave solder nozzle assembly 36.

[0049] The orientations of the exit vane 52 shown in Figures 6 and 7 are just two examples of possible orientations for the exit vane 52. The rotation range of the exit vane 52 may be selected according to desired performance parameters of the system, such as a desired range of wave height. In various embodiments, the rotation range of the exit vane 52 may extend beyond the orientations shown in Figures 6 and 7.

[0050] In some embodiments, the wave soldering nozzle assembly 36 further includes a dross damper fixed to the nozzle frame and configured to reduce solder balls that may form in the reservoir by reducing disturbances as the solder returns to the reservoir 32. One or more nitrogen tubes can be provided to create an inert atmosphere during the wave soldering process.

[0051] In some embodiments, a shroud 80, partially shown in Figures 6 and 7, extends around a wave solder nozzle assembly 36. In some embodiments, the shroud 80 surrounds the wave solder nozzle assembly, creating a substantially gas-impermeable, inert atmosphere that encloses the solder waves. In some embodiments, the shroud 80 is substantially nitrogen-impermeable. The shroud 80 includes two sealing openings 82 through which a connecting link 64 extends. Each sealing opening 82 has an inner surface 84 that substantially seals with one of the outer surfaces 86 of the connecting link 64. Since each connecting link 64 has a substantially constant cross-section over the portion of the connecting link 64 that passes through the sealing openings 82, the connecting link 64 is able to form a substantially gas-impermeable seal with the inner surface 84 of each sealing opening. In some embodiments, the inner surface 84 of each sealing opening 82 is annular, and the outer surface 86 of each connecting link 64 has a circular profile that matches so that the inner surface 84 substantially seals with the outer surface 86 as each connecting link 64 moves along the axial direction of the connecting link 64 through the sealing opening 82.

[0052] This disclosure also provides a method for regulating the flow of solder waves in a wave solder nozzle assembly of a wave soldering machine. In some embodiments, the method may be performed using a wave soldering station 24, or a wave soldering machine 10 including the wave soldering station 24 described above.

[0053] In some embodiments, the method includes transporting solder material to a wave soldering nozzle assembly 36 which includes a nozzle core frame 40 and an outlet vane 52 hinged to the nozzle core frame 40; adjusting the flow of the solder wave by causing a linear actuator 56 connected to the outlet vane 52 to adjust the orientation of the outlet vane 52 relative to the nozzle core frame 40; and performing a wave soldering operation on a printed circuit board.

[0054] In some embodiments, the flow of the solder wave is regulated by rotating the outlet blade 52 relative to the nozzle core frame 40 by a coupler coupled to a linear actuator 56 and the outlet blade 52. In some embodiments, the coupler includes a coupling link 64 and a rotating link 70, and the method includes causing translational motion of the coupling link 64 along the operating axis of the linear actuator 56 to cause rotation of the rotating link 70.

[0055] In some embodiments, the method includes generating a substantially gas-impermeable atmosphere over the solder wave. In some embodiments, this is achieved by a shroud 80 surrounding the wave soldering station 24. The shroud 80 includes at least one sealed opening 82 through which each connecting link 64 of the coupler extends. In some embodiments, the shroud 80 includes two sealed openings 82. A first of the connecting links 64 extends through a first of the sealed openings 82, and a second of the connecting links 64 extends through a second of the sealed openings 82. The inner surface 84 of each sealed opening 82 is substantially sealed-engaged with the outer surface 86 of the respective connecting link 64.

[0056] In some embodiments of this method, the actuator 56 is coupled to a controller 26 that controls the movement of the linear actuator 56.

[0057] As used herein, "solder wave height" refers to the vertical dimension of the solder wave.

[0058] While several aspects of at least one embodiment of this disclosure have been described, it should be understood that various modifications, changes, and improvements will readily come to mind for those skilled in the art. Such modifications, changes, and improvements are intended to be part of this disclosure and to be within the spirit and scope of this disclosure. Accordingly, the above descriptions and drawings are merely illustrative. Some aspects of the present invention are described below. [Aspect 1] In a wave soldering machine that performs wave soldering operations on a printed circuit board, Housing and A conveyor coupled to the housing, wherein the conveyor transports printed circuit boards through the housing, The system comprises a wave soldering station coupled to the aforementioned housing, A wave soldering machine comprising a wave soldering station, the wave soldering station comprising a solder material reservoir and a wave soldering nozzle assembly for generating solder waves, the wave soldering nozzle assembly having a nozzle core frame and an outlet vane, the outlet vane being rotatable around a hinge relative to the nozzle core frame to regulate the flow of solder waves, the wave soldering nozzle assembly further comprising a linear actuator coupled to the outlet vane, the linear actuator being configured to regulate the orientation of the outlet vane relative to the nozzle core frame. [Aspect 2] The wave soldering machine according to embodiment 1, wherein the linear actuator is connected to the outlet blade by a coupler. [Aspect 3] Wave soldering machine according to embodiment 2, wherein the outlet wing includes a first end and a second end connected to the nozzle core frame by the hinge, and the coupler includes at least one rotating link having a first end rotatably coupled to the second end of the outlet wing and a second end rotatably coupled to the actuator arm of the actuator. [Aspect 4] The wave soldering machine according to embodiment 3, further comprising a crossbar extending perpendicularly to and rotatably coupled to the at least one rotating link, and at least one connecting link connecting the crossbar to the actuator arm and extending perpendicularly to the crossbar. [Aspect 5] The wave soldering machine according to embodiment 4, wherein the at least one connecting link is connected to the actuator arm by an actuator block. [Aspect 6] The wave soldering machine according to embodiment 4, wherein the at least one rotating link is two rotating links and the at least one connecting link is two connecting links. [Aspect 7] The wave soldering machine according to embodiment 4, further comprising a controller that communicates with the actuator and causes the actuator to adjust the orientation of the outlet blade during operation of the wave soldering machine. [Aspect 8] The wave soldering machine according to embodiment 1, further comprising a controller that communicates with the actuator and causes the actuator to adjust the orientation of the outlet blade during operation of the wave soldering machine. [Aspect 9] Wave soldering machine according to embodiment 6, further comprising a substantially gas-impermeable shroud surrounding the wave soldering station and including at least one sealed opening through which the at least one connecting link extends, wherein each sealed opening has an inner surface substantially sealed-engaged with one outer surface of each of the connecting links. [Aspect 10] In a wave soldering nozzle assembly of a wave soldering station configured to perform wave soldering operations on a printed circuit board, Nozzle core frame and An outlet vane coupled to the nozzle core frame, wherein the outlet vane is rotatable around a hinge relative to the nozzle core frame to regulate the flow of solder waves, A wave soldering nozzle assembly comprising a linear actuator connected to the outlet wing and configured to adjust the orientation of the outlet wing relative to the nozzle core frame. [Aspect 11] The wave solder nozzle assembly according to embodiment 10, wherein the linear actuator is connected to the outlet blade by a coupler. [Aspect 12] The wave solder nozzle assembly according to embodiment 11, wherein the outlet wing includes a first end and a second end connected to the nozzle core frame by the hinge, and the coupler includes at least one rotating link having a first end rotatably coupled to the second end of the outlet wing and a second end rotatably coupled to the actuator arm of the actuator. [Aspect 13] The wave solder nozzle assembly according to embodiment 12 further includes a crossbar that extends perpendicularly to and is rotatably coupled to the at least one rotating link, and at least one connecting link that connects the crossbar to the actuator arm and extends perpendicularly to the crossbar. [Aspect 14] The wave solder nozzle assembly according to embodiment 13, wherein the at least one connecting link is connected to the actuator arm by an actuator block. [Aspect 15] The wave solder nozzle assembly according to embodiment 13, wherein the at least one rotating link is two rotating links and the at least one connecting link is two connecting links. [Aspect 16] The wave soldering nozzle assembly according to embodiment 13, wherein the actuator receives a command from a controller to adjust the orientation of the outlet blades during the operation of the wave soldering machine. [Aspect 17] The wave soldering nozzle assembly according to embodiment 10, wherein the actuator receives a command from a controller to adjust the orientation of the outlet blades during the operation of the wave soldering machine. [Aspect 18] The wave soldering nozzle assembly according to embodiment 15, further comprising a substantially gas-impermeable shroud surrounding the wave soldering station and including at least one sealed opening, wherein at least one connecting link extends through the at least one sealed opening, and each sealed opening has an inner surface substantially sealed-engaged with one outer surface of the connecting link. [Aspect 19] In a method for adjusting the solder wave flow of a wave solder nozzle assembly of a wave soldering machine, Transporting solder material to a wave solder nozzle assembly including a nozzle core frame and an outlet wing attached to the nozzle core frame by a hinge, The flow of the solder wave is adjusted by a linear actuator connected to the outlet blade, which adjusts the orientation of the outlet blade relative to the nozzle core frame, A method comprising performing a wave soldering operation on a printed circuit board. [Aspect 20] The method according to embodiment 19, wherein the flow of the solder wave is adjusted by rotating the outlet blade relative to the nozzle core frame by a coupler coupled to the linear actuator and the outlet blade. [Aspect 21] The method according to embodiment 20, further comprising generating a substantially gas-impermeable atmosphere over the solder waves by a shroud surrounding a wave soldering station including the wave solder nozzle assembly, wherein the shroud includes at least one sealed opening through which the at least one connecting link of the coupler extends, and each sealed opening has an inner surface that substantially seals with one of the outer surfaces of the connecting link. [Aspect 22] The method according to embodiment 19, wherein the actuator is coupled to a controller that controls the movement of the linear actuator. [Explanation of Symbols]

[0059] 10-wave soldering machine 12 Circuit boards 14 Housing 16 Conveyor 18 Tunnel 20 Flux application stations 22 Preheating Station 22a Preheater 22b Preheater 22°C preheater 24 stations 26 controllers 28 Flux Management System 30 pots 32 Reservoirs 34 Conduit 36 Nozzle Assembly 36 Wave Nozzle Assembly 38 Pump Impeller 40 Nozzle Core Frame 42 Side wall 44 Side wall 46 First longitudinal support element 48 Second longitudinal support element 52 Exit wing 54 Hinge 56 Linear Actuator 58 Actuator Arm 60 Actuator support frame 62 Actuator Block 64 Linking Links 66 First end 68 Second end 70 rotational link 72 Top surface 74 Crossbar 76 Back gate 80 Shroud 82 Sealed opening 84 Inner surface 86 External surface

Claims

1. In a wave soldering machine that performs wave soldering operations on a printed circuit board, Housing and A conveyor coupled to the housing, wherein the conveyor transports printed circuit boards through the housing, A wave soldering station coupled to a housing comprises a solder material reservoir and a wave soldering nozzle assembly for generating solder waves, wherein the wave soldering nozzle assembly has a nozzle core frame and an outlet vane, the outlet vane being rotatable around a hinge relative to the nozzle core frame to regulate the flow of solder waves, and the wave soldering nozzle assembly further has a linear actuator coupled to the outlet vane, the linear actuator being configured to regulate the orientation of the outlet vane relative to the nozzle core frame. The linear actuator is connected to the outlet blade by a coupler, The outlet wing includes a first end and a second end connected to the nozzle core frame by the hinge, and the coupler includes at least one rotating link having a first end rotatably connected to the second end of the outlet wing and a second end rotatably connected to the actuator arm of the linear actuator. Wave soldering machine, wherein the coupling further includes a crossbar extending perpendicularly to and rotatably coupled to the at least one rotating link, and at least one connecting link connecting the crossbar to the actuator arm and extending perpendicularly to the crossbar.

2. The wave soldering machine according to claim 1, wherein at least one connecting link is connected to the actuator arm by an actuator block.

3. The wave soldering machine according to claim 1, wherein the at least one rotating link is two rotating links, and the at least one connecting link is two connecting links.

4. The wave soldering machine according to claim 1, further comprising a controller that communicates with the linear actuator and causes the linear actuator to adjust the orientation of the outlet blades during operation of the wave soldering machine.

5. In a wave soldering machine that performs wave soldering operations on a printed circuit board, Housing and A conveyor coupled to the housing, wherein the conveyor transports printed circuit boards through the housing, A wave soldering station comprising a solder material reservoir and a wave soldering nozzle assembly for generating solder waves, coupled to the housing, wherein the wave soldering nozzle assembly has a nozzle core frame and an outlet vane, the outlet vane being rotatable around a hinge relative to the nozzle core frame to regulate the flow of solder waves, the wave soldering nozzle assembly further having a linear actuator coupled to the outlet vane, the linear actuator being configured to regulate the orientation of the outlet vane relative to the nozzle core frame, The wave soldering station is surrounded by a substantially gas-impermeable shroud including at least one sealed opening, A wave soldering machine through which at least one connecting link extends, each of which a connecting link has an inner surface that is substantially sealed and engaged with one outer surface of the connecting link.

6. In a wave soldering nozzle assembly of a wave soldering station configured to perform wave soldering operations on a printed circuit board, Nozzle core frame and An outlet vane coupled to the nozzle core frame, wherein the outlet vane is rotatable around a hinge relative to the nozzle core frame to regulate the flow of solder waves, The system comprises a linear actuator connected to the outlet blade and configured to adjust the orientation of the outlet blade relative to the nozzle core frame, The linear actuator is connected to the outlet blade by a coupler, The outlet wing includes a first end and a second end connected to the nozzle core frame by the hinge, and the coupler includes at least one rotating link having a first end rotatably connected to the second end of the outlet wing and a second end rotatably connected to the actuator arm of the linear actuator. The coupling is a wave solder nozzle assembly further comprising a crossbar extending perpendicularly to and rotatably coupled to the at least one rotating link, and at least one connecting link connecting the crossbar to the actuator arm and extending perpendicularly to the crossbar.

7. The wave solder nozzle assembly according to claim 6, wherein the at least one connecting link is connected to the actuator arm by an actuator block.

8. The wave solder nozzle assembly according to claim 6, wherein the at least one rotating link is two rotating links, and the at least one connecting link is two connecting links.

9. The wave soldering nozzle assembly according to claim 6, wherein the linear actuator receives a command from a controller to adjust the orientation of the outlet blades during the operation of the wave soldering machine.

10. In a wave soldering nozzle assembly of a wave soldering station configured to perform wave soldering operations on a printed circuit board, Nozzle core frame and An outlet vane coupled to the nozzle core frame, wherein the outlet vane is rotatable around a hinge relative to the nozzle core frame to regulate the flow of solder waves, A linear actuator connected to the outlet blade and configured to adjust the orientation of the outlet blade relative to the nozzle core frame, The wave soldering station is surrounded by a substantially gas-impermeable shroud including at least one sealed opening, The linear actuator is connected to the outlet blade by a coupler, The outlet wing includes a first end and a second end connected to the nozzle core frame by the hinge, and the coupler includes at least one rotating link having a first end rotatably connected to the second end of the outlet wing and a second end rotatably connected to the actuator arm of the linear actuator. The coupling further includes a crossbar extending perpendicularly to and rotatably coupled to the at least one rotating link, and at least one connecting link connecting the crossbar to the actuator arm and extending perpendicularly to the crossbar, A wave solder nozzle assembly through which at least one connecting link extends, each sealing opening having an inner surface substantially sealed-engaged with one outer surface of the connecting link.

11. In a method for adjusting the solder wave flow of a wave solder nozzle assembly of a wave soldering machine, Transporting solder material to a wave solder nozzle assembly including a nozzle core frame and an outlet wing attached to the nozzle core frame by a hinge, The flow of the solder wave is adjusted by a linear actuator connected to the outlet blade, which adjusts the orientation of the outlet blade relative to the nozzle core frame, Performing wave soldering operations on a printed circuit board, The method includes generating a substantially gas-impermeable atmosphere over the solder wave by a shroud surrounding the wave soldering station, which includes the wave solder nozzle assembly, The flow of the solder wave is controlled by rotating the outlet blade relative to the nozzle core frame using a coupler connected to the linear actuator and the outlet blade. The method involves the shroud including at least one sealed opening through which at least one connecting link of the coupler extends, and each sealed opening having an inner surface that substantially seals with one of the outer surfaces of the connecting link.

Images