A planted flat brush or planted roll brush, a developing solution processing system, and a method for manufacturing a printing plate.

A planted flat or roll brush with optimized bristle arrangement and debris adhesion coefficient addresses debris accumulation issues, enhancing cleaning efficiency and reducing environmental impact.

JP7885461B2Active Publication Date: 2026-07-06ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
ASAHI KASEI KOGYO KABUSHIKI KAISHA
Filing Date
2024-09-06
Publication Date
2026-07-06

AI Technical Summary

Technical Problem

Existing roll brushes used in the development process of printing plates suffer from debris adhesion and accumulation, which is not adequately addressed by resin-based brushes, leading to poor work efficiency and difficulty in removing uncured resin.

Method used

The development of a planted flat brush or roll brush with bristle bundles implanted at equal intervals in the brush base, where the debris adhesion coefficient S/L is between 6.00 and 12.00, and specific parameters such as bristle length, hole density, and material are optimized to reduce debris adhesion and facilitate removal.

Benefits of technology

The solution effectively reduces debris adhesion, enhances debris removal, maintains cleaning performance, and prevents chipping, while improving work efficiency and reducing environmental impact.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The present invention enables the reduction of debris adhesion, facilitates the removal of adhered debris, and sufficiently removes an uncured resin or the like. To this end, an transplanted flat brush (50) or an transplanted roll brush according to the present disclosure is used in a development step for a printing plate that is produced through an exposure step and a development step, wherein bristle bundles (53) are transplanted at equal intervals in a plurality of bristle planting holes (52) of a brush base (51), and when the smallest among the bottom areas between the four adjacent bristle bundles (53) is S [mm2] and the bristle length of the bristle bundles (53) is L [mm], the debris adhesion coefficient S / L is 6.00 to 12.00.
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Description

[Technical Field]

[0001] The present invention relates to a planted flat brush or planted roll brush used in the development process of a printing plate, a developing solution processing system, and a method for manufacturing a printing plate. [Background technology]

[0002] In the development process of printing plates, which are made using photosensitive resin plates and undergoing various processes such as exposure, development, and rinsing, a roll brush is used to wash away unexposed areas, such as uncured resin, while applying an aqueous developer (see, for example, Patent Document 1). Brushes include rotating roll brushes as well as flat brushes, which are flat in shape.

[0003] One type of roll brush used is the so-called channel roll brush, in which bristle bundles are crimped onto a channel made of galvanized steel or similar material and arranged in a spiral. Another type is the flat brush with bristle bundles embedded in a flat brush base (embedded flat brush). However, when these types of brushes are used repeatedly in the developing process, developing residue called "debris" adheres to the brush and accumulates along the bristle bundles, eventually growing outwards in an icicle-like shape. This problem can be particularly pronounced in brushes with a narrow bristle spacing and densely packed bristle bundles.

[0004] One type of roll brush that can address this problem is one in which the brush base, which is the main body of the brush, is made of resin, thereby reducing the phenomenon of debris adhering to the channel brush as described above. [Prior art documents] [Patent Documents]

[0005] [Patent Document 1] International Publication No. 2020 / 158380 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] However, even with embedded roll brushes that have a resin brush base, the amount of debris that adheres to them may not be sufficiently reduced. Furthermore, if the attached debris is difficult to remove, the work efficiency is poor. Such problems can also occur with embedded flat brushes that have a flat brush base.

[0007] Therefore, the present invention aims to provide a planted flat brush or planted roll brush, a developing solution treatment system, and a method for manufacturing a printing plate that reduces the adhesion of debris, facilitates the removal of attached debris, and allows for the thorough removal of uncured resin and the like. [Means for solving the problem]

[0008] The inventors have conducted various studies and tests and have obtained insights that lead to the solution of these problems. The present invention is based on these insights, and one aspect thereof is a planted flat brush or planted roll brush used in the development process of a printing plate that is produced after an exposure process and a development process, This is a bristle-embedded flat brush or bristle-embedded roll brush in which bristle bundles are planted at equal intervals in multiple bristle-planting holes of the brush base, and when the smallest base area between four adjacent bristle bundles is S [mm2] and the bristle length of the bristle bundle is L [mm], the debris adhesion coefficient S / L is between 6.00 and 12.00.

[0009] As a result of repeated various studies and tests as described above, it was found that even with implanted flat brushes or implanted roll brushes with a resin brush base, various factors such as the pitch density of the bristle holes, bristle length, bristle thickness, and the diameter and depth of the bristle holes, particularly the pitch density of the bristle holes, affect debris adhesion, debris removal, and chipping. Focusing on these factors, the findings obtained indicate that by first setting the bristle bundle arrangement density within the predetermined range described above, and by setting the debris adhesion coefficient S / L within the range described above, it is possible to improve or maintain satisfactory performance in terms of debris adhesion and debris removal.

[0010] In the above-described embedded flat brush or embedded roll brush, the bottom area between four adjacent bristle bundles is 110.00 [mm2] or more and 200.00 [mm2] or less. The distance between a hair bundle and the nearest hair bundle is between 4.00 mm and 16.00 mm. In the region between four adjacent hair bundles, the ratio of the hair length L of the hair bundle to the distance between two adjacent hair follicles is between 0.70 and 1.30. The hair bundle length L is between 8.00 [mm] and 20.00 [mm]. The number of hair follicles is between 4000 and 15000 / m2. The depth of the hair transplant hole is between 5mm and 20mm. The ratio of hair follicle depth to hair length may be between 5.0 and 13.0 and between 30.0 and 13.0.

[0011] Another aspect of the present invention is a planted flat brush or planted roll brush used in the development process of a printing plate that is produced through exposure and development processes, The brush base has multiple bristle holes into which bundles of bristles are planted. The length of the hair bundle is between 8mm and 20mm. The depth of the hair transplant hole is between 5mm and 20mm. The ratio of hair follicle depth to hair length is between 5.0 and 13.0 and between 30.0 and 13.0. It is an implanted flat brush or an implanted roll brush with the number of hair implantation holes being 4000 or more and 15000 or less per m2.

[0012] In the implanted flat brush or the implanted roll brush as described above, the printing plate may be further produced through a rinsing process.

[0013] In the implanted flat brush or the implanted roll brush as described above, cleaning holes which are outlets for cleaning liquid are formed in a flat brush pedestal, the cleaning holes are arranged in a staggered pattern, the distance between adjacent cleaning holes is 65.00 [mm] or more and 80.00 [mm] or less, and the number of hair bundles between adjacent cleaning holes may be 3 or more and 7 or less.

[0014] In the implanted flat brush or the implanted roll brush as described above, In a row of hair bundles arranged linearly and at equal intervals, the distance between adjacent hair bundle intervals sandwiching a cleaning hole may be 3.00 times or less the distance between adjacent hair bundle intervals not sandwiching a cleaning hole.

[0015] In the implanted flat brush or the implanted roll brush as described above, The hair diameter of each hair in the hair bundle is 80 μm or more and 400 μm or less, The hair amount of the hair bundle is 500 g / m2 or more and 4000 g / m2 or less, The hole diameter of the hair implantation hole is 1.0 mm or more and 6.0 mm or less, The number of hairs is 100 or more and 500 or less per hole, The ratio of the hole depth to the hole diameter is 5.0 to 4.2 or more and 30 to 4.2 or less, The brush pedestal is made of resin, the material of the brush pedestal is any one of or two or more of PVC, PP or ABS, and the material of the hair may be any one of 66NY, 612NY, 610NY, or PP.

[0016] In the implanted flat brush as described above, the brush pedestal is rectangular, and the ratio of the short side to the long side may be 1 to 6.00 or more and 1 to 10.00 or less.

[0017] Yet another aspect of the present invention is a method for manufacturing a printing plate, comprising an exposure step and a development step, A printing plate manufacturing method wherein a bristle flat brush or bristle roll brush used in the developing process has bristle bundles planted at equal intervals in multiple bristle holes of the brush base, and when the smallest of the bottom areas between four adjacent bristle bundles is S [mm2] and the length of the bristle bundles is L [mm], the debris adhesion coefficient S / L is 6.00 or more and 12.00 or less.

[0018] Yet another aspect of the present invention is a method for manufacturing a printing plate, comprising an exposure step and a development step, A flat brush or roll brush with embedded bristles used in the developing process has bundles of bristles embedded in multiple bristle holes in the brush base. The length of the hair bundle is between 8mm and 20mm. The depth of the hair transplant hole is between 5mm and 20mm. The ratio of hair follicle depth to hair length is between 5.0 and 13.0 and between 30.0 and 13.0. This is a method for manufacturing a printing plate in which the number of hair follicle holes is between 4,000 and 15,000 per square meter.

[0019] In the printing plate manufacturing method described above, the rotation speed of the brush in the developing process is 3 rpm or more and 25 rpm or less, and the oscillation speed during oscillating rotation may be 20 rpm or more and 150 rpm or less.

[0020] In the printing plate manufacturing method described above, the contact pressure of the brush with the printing plate during the developing process may be 50 g / cm² or more and 800 g / cm² or less, and the amount of brush penetration into the printing plate may be 1 mm or more and 5 mm or less.

[0021] The above-described method for manufacturing a printing plate may include a step of selecting a brush suitable for the design and / or quality of the plate, and a step of adjusting the brush contact pressure by installing a spacer at the base of the brush base.

[0022] In the printing plate manufacturing method described above, the flat brush may include at least two or more areas with different bristle thickness, length, and material.

[0023] In the printing plate manufacturing method described above, a developing solution may be used in the developing step, and the developing solution may contain a surfactant in an amount of 0.00 wt% to 4.20 wt%.

[0024] A further aspect of the present invention is a system used in the development process of a printing plate that is produced through an exposure process and a development process, comprising a planted flat brush or planted roll brush as described above, a developer tank, and a developer filtration device, wherein the developer filtration device has at least one filter, The system is characterized in that, when unexposed resin is introduced into the system, the mass balance of unexposed resin is configured such that the total amount of resin present in the developer filtration device and resin floating in the developer tank relative to the introduced unexposed resin is between 70.0 wt% and 95.0 wt%.

[0025] In the developer processing system described above, the developer tank has a developer suction device, and the developer filtration device filters the developer sucked up by the developer suction device, and may have a dispersion filter that aggregates the dispersions dispersed in the developer, and an aggregate filter that removes the aggregates aggregated by the dispersion filter. [Effects of the Invention]

[0026] According to the present invention, the adhesion of debris is reduced, the attached debris is easier to remove, and uncured resin and the like can be sufficiently removed. [Brief explanation of the drawing]

[0027] [Figure 1]This diagram shows the configurations of each type of embedded roll brush: (A) "Channel dense", (B) "Dense embedded", (C) "10mm pitch embedded (horizontal)", (D) "12mm pitch embedded (horizontal)", (E) "12mm 612 pitch embedded (horizontal)", (F) "13mm embedded bristle length", and (G) "10mm embedded bristle length" (the meaning of the above designations for each type of embedded roll brush will be explained later). [Figure 2] This table shows the bristle weight, bristle material, bristle length, thickness, hole diameter, number of holes, hole pitch, and base material for each type of bristle-embedded roll brush: (A) "Channel density", (B) "Bed density", (C) "Bed pitch 10mm (horizontal)", (D) "Bed pitch 12mm (horizontal)", (E) "Bed pitch 12mm (horizontal)", (F) "Bed length 13mm", and (G) "Bed length 10mm". [Figure 3] These images show the appearance of each type of embedded roll brush after cleaning: (A) "Channel dense", (B) "Dense embedded", (C) "Embedded 10mm pitch (horizontal)", (D) "Embedded 12mm pitch (horizontal)", (F) "Embedded bristle length 13mm", and (G) "Embedded bristle length 10mm". [Figure 4] (a) is a graph showing the amount of resin developed by each type of brush with a brush density of (A) "Channel density", (B) "Piercing density", (C) "Piercing 10mm pitch (horizontal)", (D) "Piercing 12mm pitch (horizontal)", (F) "Piercing length 13mm", and (G) "Piercing length 10mm" for each development time. (b) is a diagram explaining the thickness RD of uncured resin etc. after a photosensitive resin plate is exposed to ultraviolet light. [Figure 5] This graph shows the depth of the recesses (white lines, 500 μm wide) in the photosensitive resin plate after cleaning with each type of brush with a densely packed bristle (A) "Channel density", (B) "Pile density", (C) "Pile pitch of 10 mm (horizontal)", (D) "Pile pitch of 12 mm (horizontal)", (F) "Pile length of 13 mm", and (G) "Pile length of 10 mm". [Figure 6] This graph shows the depth of recesses (white lines, 100 μm wide) in a photosensitive resin plate after cleaning with each type of brush with a densely packed bristle (roll brush): (A) "Channel density", (B) "Pile density", (C) "Pile pitch 10 mm (horizontal)", (D) "Pile pitch 12 mm (horizontal)", (F) "Pile length 13 mm", and (G) "Pile length 10 mm". [Figure 7] This image shows the photosensitive resin plates before development, positioned in the center and near the sides of the washing device. [Figure 8] This diagram illustrates the amount of brush penetration into the printing plate, and includes: (A) a top view of the cleaning device, (B) a side view of the cleaning device, (C) a magnified image of the actual plate after development, (D) a side view of the plate, and (E) a graph showing the correlation between the amount of brush penetration and the width of the brush contact surface (the width of the mark left by a single brush on an unexposed photosensitive resin plate). [Figure 9] These are magnified images of photosensitive resin plates after cleaning with various roll brushes of different sizes: (A) "Channel density", (B) "Pile density", (C) "Pile pitch of 10mm (horizontal)", (D) "Pile pitch of 12mm (horizontal)", (F) "Pile length of 13mm", and (G) "Pile length of 10mm", for evaluation of whether chipping has occurred. [Figure 10] These are magnified images of photosensitive resin plates after cleaning with various roll brushes of different sizes: (A) "Channel density", (B) "Pile density", (C) "Pile pitch of 10mm (horizontal)", (D) "Pile pitch of 12mm (horizontal)", (F) "Pile length of 13mm", and (G) "Pile length of 10mm", for evaluation of whether chipping has occurred. [Figure 11] These are magnified images of photosensitive resin plates after cleaning with various roll brushes of different sizes: (A) "Channel density", (B) "Pile density", (C) "Pile pitch of 10mm (horizontal)", (D) "Pile pitch of 12mm (horizontal)", (F) "Pile length of 13mm", and (G) "Pile length of 10mm", for evaluation of whether chipping has occurred. [Figure 12] These are magnified images of a photosensitive resin plate to confirm the depth of the recesses (white lines, 100 μm wide) of the photosensitive resin plate after cleaning with each of the following roll brushes: (A) "Channel density", (B) "Pile density", (C) "Pile pitch 10 mm horizontally", (D) "Pile pitch 12 mm horizontally", (F) "Pile length 13 mm", and (G) "Pile length 10 mm". [Figure 13]These are magnified images of a photosensitive resin plate to confirm the depth of the recesses (white lines, 500 μm wide) of the photosensitive resin plate after cleaning with each type of embedded roll brush: (A) "Channel density", (B) "Embedding density", (C) "Embedding 10 mm pitch (horizontal)", (D) "Embedding 12 mm pitch (horizontal)", (F) "Embedding bristle length 13 mm", and (G) "Embedding bristle length 10 mm". [Figure 14] These are magnified images of photosensitive resin plates under 150 lpi and 5% humidity conditions, after cleaning with roll brushes with the following brush configurations: (A) "Channel density", (B) "Piercing density", (C) "Piercing 10mm pitch (horizontal)", (D) "Piercing 12mm pitch (horizontal)", (F) "Piercing length 13mm", and (G) "Piercing length 10mm". [Figure 15] These are magnified images of photosensitive resin plates at 150 lpi and 75% humidity after cleaning with roll brushes with the following brush configurations: (A) "Channel density", (B) "Piercing density", (C) "Piercing 10mm pitch (horizontal)", (D) "Piercing 12mm pitch (horizontal)", (F) "Piercing length 13mm", and (G) "Piercing length 10mm". [Figure 16] The diagram shows examples of arrangement patterns for the bristle holes of a bristle-planted roll brush: (A) parallel type, (B) staggered type, (C) V-shape, and (D) spiral type. [Figure 17] The diagrams illustrate the pointed tip shape of the bristles of a re-tipped roll brush, showing (A) a slanted tip and (B) a tapered tip. [Figure 18] This table summarizes the parameter values ​​for five types of implanted flat brushes (Brush 1 to Brush 5) with varying parameters (debris adhesion coefficient, bristle length [mm], brush arrangement, shortest distance between bristle bundles [mm], base area [mm2], cleaning time [sec], bristle bundle diameter [mm], bristle bundle density [hairs / m2], bristle volume [kg / m2]). [Figure 19] This is a perspective view showing the configuration of brush 5. [Figure 20] This is a plan view showing the configuration of brush 5. [Figure 21] This is a plan view showing an enlarged view of the configuration of brush 1. [Figure 22] This is a plan view showing an enlarged view of the configuration of brush 2. [Figure 23] This is a plan view showing an enlarged view of the configuration of brush 3. [Figure 24] This is a plan view showing an enlarged view of the configuration of brushes 4 and 5. [Figure 25] (A) is a graph showing the time it takes for each of the brushes 1 to 5 to clean a 0.55 mm layer of the printing plate. (B) is a table showing the depth of the microcells after cleaning for brushes 1 and 5. [Figure 26] This graph shows the amount of debris adhering to each brush (1-5) after 100 plates of printing. [Figure 27] This graph shows the mass balance of unexposed resin removed during the development process for each of brushes 1 and 5. [Figure 28] This is a diagram illustrating parallel arrangement. [Figure 29] This is a diagram explaining the staggered arrangement. [Figure 30] This diagram shows an example of a printing plate development process system. [Modes for carrying out the invention]

[0028] The configuration of the present invention will be described in detail below based on an example of an embodiment shown in the drawings (see Figure 1, etc.).

[0029] ≪First Embodiment of the Present Invention≫ The roll brushes 10, excluding (A), are used in the cleaning process during the plate-making process, in which unexposed areas, such as uncured resin, are washed away and removed while applying an aqueous developer. The embedded roll brushes 10 of this embodiment, excluding (A), are constructed by embedding bundles of bristles 40 in multiple bristle holes 30 of a resin brush base 20.

[0030] The brush base 20 is cylindrical and is formed to rotate around a rotation axis 20A (see Figure 1, etc.). Multiple bristle holes 30 are formed on the surface of the brush base 20 in predetermined patterns such as parallel, staggered (with each hole offset by half a pitch, or with holes arranged at each vertex of an equilateral triangle), V-shape, and spiral (see Figure 16). A bundle of bristles 40, consisting of multiple bristles, is implanted in each bristle hole 30. Multiple bristle-implanted roll brushes 10 with this configuration are arranged side by side in a printing plate cleaning device 100 (see Figure 7). ≪Example 1≫

[0031] The inventors manufactured various types of embedded roll brushes 10 with the aim of reducing the amount of debris adhering to the embedded roll brush 10 during the cleaning process, making it easier to remove the adhering debris, and ensuring that uncured resin and the like are sufficiently removed without causing chipping. They then conducted tests to confirm the performance and effectiveness of these brushes by actually performing cleaning tests. In this test, seven types of roll brushes 10, shown below as (A) to (G), were manufactured and used for testing (see Figures 1 and 2). "Brief weight" refers to the total weight of the bristle bundle 40, "bristle length" refers to the length from the surface of the brush base 20 to the tip of the bristle bundle 40, "thickness" refers to the diameter of the bristle, "hole diameter" refers to the inner diameter of the bristle hole 30, "number of holes" refers to the total number of bristle holes 30, and "hole pitch" refers to the distance between the centers of adjacent bristle holes 30. Furthermore, the outer diameter of all brushes 10, including the bristle length, was standardized to 90mm, and any differences in bristle length were adjusted by changing the outer diameter of the brush base 20.

[0032] [Specifications of 7 types of planted roll brushes] (A) "Channel close" ·Hair weight: 3680(g) ·Bristles material: 66NY ·Hair length: 15.7(mm) Thickness: 200 (μm) • Hole diameter: (none) • Number of holes: (none) • Hole pitch: (none) ·m 2 Number of holes per ball: (none) ·m2 Hair weight per unit: 15600g • Maximum hole depth: (none) • Ratio of maximum depth to pile length: (None) • Ratio of maximum depth to hair follicle diameter: (None) • Number of hairs per hole: (none) • Base material: Zinc-plated steel • Note: This "dense channel" roll brush 10 is a so-called channel roll brush in which the bristle bundle 40 is fixed by crimping a spiral-shaped metal (zinc) channel (see Figures 1(A) and 3(A)). In such channel roll brushes, the phenomenon of debris adhering to the metal channel and gradually accumulating is likely to occur. In this example, as a comparison, this "dense channel" roll brush 10, one of the current products, was also tested. As described above, due to the configuration in which the bristle bundle 40 is fixed to a spiral-shaped metal (zinc) channel, there are no multiple bristle holes 30 in the first place, and therefore items such as the inner diameter and number of bristle holes 30 are not included.

[0033] (B) “Dense implantation” ·Hair weight: 1510(g) ·Bristles material: 66NY ·Hair length: 15.7(mm) Thickness: 200 (μm) • Hole diameter: 4.00 (mm) • Number of holes: 7190 (pieces) • Hole pitch: The axial pitch along the rotating shaft 20A (hereinafter also referred to as "horizontal hole pitch") is 8.5 mm, and the pitch in the rotational direction of the rotating shaft 20A (hereinafter also referred to as "rotational hole pitch") is 7.67 mm. • Arrangement: Staggered pattern. ·m 2 Number of holes per unit: 30677 (pieces) ·m 2 Hair weight per unit: 6401g • Maximum hole depth: 10 mm • Ratio of maximum depth to pile length: 10 to 15.7 • Ratio of maximum depth to hair follicle diameter: 10 to 4.0 • Number of hairs per hole: 280 (hairs) • Base material: PP and PVC

[0034] (C) "Planting at 10mm intervals (horizontal)" ·Hair weight: 762(g) ·Bristles material: 66NY ·Hair length: 15.7(mm) Thickness: 200 (μm) • Hole diameter: 4.2 (mm) • Number of holes: 3044 Hole pitch (horizontal): 10 (mm) • Hole pitch rotation direction: 7.67 (mm) ·Arrangement: Parallel type ·m 2 Number of holes per unit: 13038 (pieces) ·m 2 Hair weight per unit: 2092g • Maximum hole depth: 10 mm • Ratio of maximum depth to pile length: 10 to 15.7 • Ratio of maximum depth to bristle hole diameter: 10 to 4.2 • Number of hairs per hole: 340 (hairs) • Base material: PVC

[0035] (D) "Planting at 12mm intervals (horizontal)" ·Hair weight: 642(g) ·Bristles material: 66NY ·Hair length: 15.7(mm) Thickness: 200 (μm) • Hole diameter: 4.2 (mm) • Number of holes: 2564 Hole pitch (horizontal): 12 (mm) • Hole pitch rotation direction: 7.67 (mm) ·Arrangement: Parallel type ·m 2 Number of holes per unit: 10865 ·m 2 Hair weight per unit: 1762g • Maximum hole depth: 10 mm • Ratio of maximum depth to pile length: 10 to 15.7 · Ratio of maximum depth to diameter of the hair bundle hole: 10 to 4.2 · Number of hairs per hole: 340 (hairs) · Material of the pedestal: PVC

[0036] (E) "Insertion 12mm 612 pitch (horizontal)" · Hair weight: 762 (g) · Hair material: 612NY · Hair length: 15.7 (mm) · Thickness: 200 (μm) · Hole diameter: 4.2 (mm) · Number of holes: 3044 (holes) · Horizontal hole pitch: 12 (mm) · Hole pitch in the rotational direction: 7.67 (mm) · Arrangement: Parallel type · m 2 Number of holes per m: 10865 (holes) · m 2 Hair weight per m: 1762 (g) · Maximum depth of the hole: 10 (mm) · Ratio of maximum depth to hair length: 10 to 15.7 · Ratio of maximum depth to diameter of the hair bundle hole: 10 to 4.2 · Number of hairs per hole: 340 (hairs) · Material of the pedestal: PVC

[0037] (F) "Inserted hair length 13mm" · Hair weight: 409 (g) · Hair material: 66NY · Hair length: 13 (mm) · Thickness: 200 (μm) · Hole diameter: 4.2 (mm) · Number of holes: 1819 (holes) · Horizontal hole pitch: 12 (mm) · Hole pitch in the rotational direction: 11.82 (mm) · Arrangement: Parallel type · m 2 Number of holes per m: 7062 (holes) · m 2 Hair weight per m: 948 (g) · Maximum depth of the hole: 10 (mm) · Ratio of maximum depth to hair length: 10 to 13.0 • Ratio of maximum depth to bristle hole diameter: 10 to 4.2 • Number of hairs per hole: 340 (hairs) • Base material: PVC

[0038] (G) "Pile height 10mm" ·Hair weight: 429(g) ·Bristles material: 66NY ·Hair length: 10(mm) Thickness: 150 (μm) • Hole diameter: 4.2 (mm) • Number of holes: 1926 Hole pitch (horizontal): 12 (mm) • Hole pitch rotation direction: 12 (mm) ·Arrangement: Parallel type ·m 2 Number of holes per unit: 6836 ·m 2 Hair weight per unit: 706g • Maximum hole depth: 10 mm • Ratio of maximum depth to pile length: 10:10 • Ratio of maximum depth to bristle hole diameter: 10 to 4.2 • Number of hairs per hole: 506 (hairs) • Base material: PVC

[0039] [Roll brush after cleaning test] For reference, images of each of the roll brushes 10 (A) to (G) after the cleaning test are shown in Figure 3 (see Figure 3(A) to (G)).

[0040] [Developable data] The change in the amount of resin developed (g) by the roll brushes 10 (A) to (G) during a washing time of 9 to 11 minutes was observed (see Figure 4). Here, the washing test was conducted under normal conditions: washing solution temperature of 38°C, rotation speed of 10.2 rpm, oscillation speed of 48 rpm (wherein "oscillating rotation" in this specification means that the camshaft rotates once for one reciprocating motion in the oscillating line), contact pressure of the brush on the printing plate of a maximum of 180 g / cm2 for (C) and a maximum of 600 g / cm2 for (F), and surfactant concentration in the washing solution of 2.1 wt%. Furthermore, for (E) the "12mm 612 pitch (horizontal)" embedded roll brush 10, the bristle bundles 40 showed significant bristle spreading, making it impossible to obtain results for verification.

[0041] [Verification 1: Depth of the white outline] As one of the evaluation indicators for cleaning performance when washing out uncured resin etc. after exposure of a photosensitive resin plate with ultraviolet light, the depth after cleaning was checked when the recesses (also called "white lines" in this specification) of the photosensitive resin plate were 100 μm wide and 500 μm wide (see Figures 5 and 6). The depth was 35 μm or more for the 100 μm width and 120 μm or more for the 500 μm width, and since there were no quality problems in actual printing tests, the cleaning performance was judged to be good. In this test, the central part of the cleaning device 100 and the part closer to the side (right side in Figure 7) were checked separately. As a result, (A) "Channel density", (B) "Pile density", (C) "Pile pitch 10 mm (horizontal)", (D) "Pile pitch 12 mm (horizontal)", (F) "Pile height 13 mm", and (G) "Pile height 10 mm" were all good (see Figures 12 and 13). In the figure, the symbol P indicates a good result.

[0042] [Verification 2: Chipping (Part 1)] We evaluated whether chipping occurred in the photosensitive resin plates after cleaning. As a result, (B) "Densely packed fibers" showed chipping and was not good, but (C) "10mm horizontal fiber pitch", (D) "12mm horizontal fiber pitch", (F) "13mm fiber length", and (G) "10mm fiber length" were all good (see Figures 9, 10, and 11).

[0043] [Verification 3: Chipping (Part 2)] Under the Dot Fail condition, we evaluated whether chipping occurred on the photosensitive resin plate after cleaning (see Figures 9-11). Here, predetermined locations on the photosensitive resin plate were used as evaluation points (in the figures, the symbol P indicates a good result).

[0044] [Verification 4: Cleanability of printing plates (Part 3)] Under conditions of 150 lpi and 5% humidity, we evaluated whether the uncured resin in fine areas of the photosensitive resin plate had been removed after cleaning. Here, the side of the photosensitive resin plate was used as the evaluation point. As a result, (A) "Channel density", (B) "Pile density", (C) "Pile pitch of 10 mm (horizontal)", (D) "Pile pitch of 12 mm (horizontal)", (F) "Pile length of 13 mm", and (G) "Pile length of 10 mm" were all good (see Figure 14). In the figure, the symbol P indicates a good result.

[0045] [Verification 5: Cleanability of printing plates (Part 4)] Under conditions of 150 lpi and 75% humidity, we evaluated whether the uncured resin in fine areas of the photosensitive resin plate had been removed after cleaning. Here, the side of the photosensitive resin plate was used as the evaluation point. As a result, (A) "Channel density", (B) "Pile density", (C) "Pile pitch of 10 mm (horizontal)", (D) "Pile pitch of 12 mm (horizontal)", (F) "Pile height of 13 mm", and (G) "Pile height of 10 mm" were all good (see Figure 15). In the figure, the symbol P indicates a good result.

[0046] [Verification Results] As a result of repeated various studies, tests, and verifications as described above, it was found that in a resin-based implanted roll brush 10 with a brush base 20, various factors such as implantation density, bristle length, bristle thickness, and bristle holes, particularly factors such as the density of the bristle bundles 40, affect debris adhesion, debris removal, and chipping. It was also found that by setting the bristle length of the bristle bundles 40 within a predetermined range, and the density of bristles implanted in the bristle holes 30 within a predetermined range, it is possible to improve or maintain favorable performance in terms of debris adhesion, debris removal, and chipping. The preferred range for the bristle length of the bristle bundles 40 obtained from these findings is described below.

[0047] [Suitable range (part 1)] It is preferable that the hair length of the hair bundle 40 is 8 mm or more and 20 mm or less, and the number of hair implantation holes 30 is 4000 pores / m2 or more and 15000 pores / m2 or less. It is more preferable that the hair length of the hair bundle 40 is 10 mm or more and 18 mm or less, and even more preferable that it is 12 mm or more and 15 mm or less. The optimal value for the hair length of the hair bundle 40 is 13 mm.

[0048] [Suitable range (part 2)] The number of hair implantation holes 30 is preferably 6,000 or more and 9,000 or less per m2, and more preferably 6,500 or more and 8,000 or less per m2. The optimal number of hair implantation holes 30 is 7,062 or less per m2.

[0049] [Suitable range (part 3)] The diameter of each hair in the hair bundle 40 is preferably 80 μm or more and 400 μm or less, more preferably 100 μm or more and 300 μm or less, and even more preferably 170 μm or more and 230 μm or less.

[0050] [Suitable range (part 4)] The amount of hair in the bristle bundle 40 is preferably 500 g / m2 or more and 4000 g / m2 or less, more preferably 700 g / m2 or more and 2000 g / m2 or less, and even more preferably 800 g / m2 or more and 1200 g / m2 or less. The optimal value for the amount of hair in the bristle bundle 40 is 948 g / m2. In this specification, the amount of hair (weight of hair) refers to the weight of all the hair in the bristle bundle 40, including the portion that is inside the bristle holes 30. However, the metal fittings that fix the bristle bundle 40 are not included in this weight. It was concluded that a bristle-embedded roll brush 10 with a bristle amount in the above-mentioned preferred range results in less debris adhering to the bristle-embedded roll brush 10, and allows for easier removal of any attached debris, thus improving the cleaning power of the printing plate. Compared to general developing brushes, such a bristle-embedded roll brush 10 has a lower density of bristles and a structure that allows the developing solution to pass through easily.

[0051] [Suitable range (part 5)] It is preferable that the diameter of the hair implantation hole 30 is 1.0 mm or more and 6.0 mm or less, and the number of hairs per hole is 100 to 500. It is more preferable that the diameter of the hair implantation hole 30 is 3.0 mm or more and 5.0 mm or less, and even more preferable that it is 4.0 mm or more and 4.5 mm or less. It is also more preferable that the number of hairs per hole is 200 to 400, and even more preferable that it is 310 to 370. It is particularly preferable that it is 320 to 360 hairs per hole, and most preferably 330 to 350 hairs per hole. The optimal number of hairs is 340. The number of hairs refers to the number of hairs coming out of the hair implantation hole 30; for example, if there are 340 hairs per hole, when the hair is extended at the bent portion, the total number of hairs is 170. It was concluded that a roll brush 10 with a bristle hole diameter 30 or a number of bristles within the preferred range described above is less likely to lose bristles during cleaning, and that high cleaning power for printing plates can be maintained over a long period of time. In the roll brush 10, it was concluded that a ratio of bristle length to hole depth 30 of 10:13 and a ratio of hole depth to hole diameter of 10:4.2 are preferable. The holes were drilled with a drill with a tip angle of 140 degrees, and a Mitutoyo CD-10APX digital caliper (tip diameter 1.9 mm) was used for measurement. Furthermore, the maximum depth of the bristle holes is preferably 5 mm to 20 mm, more preferably 8 mm to 15 mm, and even more preferably 9 mm to 13 mm. When the maximum depth of the bristle holes is within these preferred ranges, bristle spreading is less likely to occur, and the cross-section of the bristle bundle tip becomes closer to a perfect circle, thus enabling stable cleaning to be sustained.

[0052] [Suitable materials] It has been found that the material of the brush base 20, excluding (A), is preferably PVC or PP, and the material of the bristles is preferably 66NY, 612NY, 610NY, PP, or ABS. In particular, in this case, the processing during the manufacture of the implanted roll brush 10 is easier.

[0053] With a planted roll brush 10 like the one in this example, it was confirmed that (1) debris adhesion is drastically reduced, (2) the removal of attached debris is made easier, improving work efficiency, (3) the developability (performance during cleaning) is equivalent to that of conventional products, (4) chipping performance is improved, (5) the load on the developing equipment is reduced, and (6) when the planted roll brush 10 is constructed with a resin brush base 20 and a stainless steel shaft, it can be separated, resulting in low cost (reduced environmental impact).

[0054] [Shape of the hair tip] The tips of the bristles of the embedded roll brush 10 (indicated by reference numeral 41 in Figure 17) are pointed, and it is preferable that the width at a position 10 μm from the tip toward the base is 10% to 50% of the width of the base of the bristles, more preferably 20% or more and 50% or less, and even more preferably 30% to 50%. This allows the bristles to penetrate into fine irregularities (e.g., grooves of 50 μm), improving cleaning performance, removing uncured resin, and enabling gentler development of gaps such as those between narrow dot pitches (see Figure 17).

[0055] [Plate making method] In a plate-making method for printing plates comprising exposure, development, and rinsing steps, the development step involves brushing the plate surface with a bristle-embedded roll brush 10. The bristle-embedded roll brush 10 has a bristle length of 8 mm to 20 mm, and the number of bristle holes 30 is preferably 4,000 to 15,000 per m2, with a bristle length of 10 to 18 mm being preferable, and more preferably 12 mm to 15 mm. The optimal value is 13 mm. The number of bristle holes 30 is preferably 6,000 to 9,000 per m2, and more preferably 6,500 to 8,000 per m2.

[0056] It goes without saying that the various embedded roll brushes 10 described in each embodiment can be used in combination with a printing plate making method comprising exposure, development, and rinsing steps. A water-draining step may also be included after the rinsing step.

[0057] The above-described embodiments are merely examples of preferred implementations of the present invention, and are not limited thereto. Various modifications are possible without departing from the spirit of the invention. For example, the arrangement of the bristle holes 30 of the bristle-planted roll brush 10 can be in parallel, staggered, V-shaped, spiral, or other configurations, and can be adopted as appropriate (see Figure 16).

[0058] Furthermore, the rotational speed of the embedded roll brush 10 during cleaning is preferably 3 rpm to 25 rpm, or the oscillation speed when oscillating (oscillating rotation means that the camshaft rotates once for each reciprocating motion) is preferably 20 rpm to 150 rpm. More preferably, the rotational speed is 7 to 18 rpm, and even more preferably 9 to 15 rpm. This speed improves the retention of the cleaning solution on the embedded roll brush 10, making it less likely for the embedded roll brush 10 to become dirty. The rotational direction, oscillation timing, and speed of each embedded roll brush 10 may be the same or different. Also, the speed may always be the same or it may fluctuate. For example, the initial stage may be set to high speed to improve productivity, the speed may be slightly reduced in the middle stage to reduce the load on the raised parts of the printing plate, and the speed may be further reduced in the final stage to allow the bristles to penetrate into the recesses of the printing plate and thoroughly scrape out the unexposed resin.

[0059] Furthermore, in the development process, the contact pressure of the implanted roll brush 10 on the printing plate is preferably between 50 g / cm² and 800 g / cm², more preferably between 300 and 800 g / cm², and even more preferably between 500 and 800 g / cm². By setting it within this range, the development time can be shortened without affecting the quality of the printing plate. The contact pressure of the implanted roll brush 10 can be adjusted by the bristle length, the number of holes in the implanted bristle holes 30, the bristle diameter, the amount of bristle, the hole diameter of the implanted bristle holes 30, the bristle density, the rotation speed of the implanted roll brush 10, the oscillation speed, etc. Nitta Corporation's I-SCAN (pressure distribution measurement system) was used to measure the contact pressure.

[0060] Furthermore, the tips of the bristles of the embedded roll brush 10 are spherical, and preferably have a radius of R of 50 μm or more and 230 μm or less, more preferably 70 to 200 μm, and even more preferably 100 to 180 μm. This makes it possible to avoid damaging the hardened photosensitive resin (the part that should not be scraped).

[0061] It is preferable to use a bristle roll brush 10 with the bristle tip shape as described above. Specifically, the tip of the bristle of the bristle roll brush 10 (indicated by reference numeral 41 in Figure 17) is pointed, and the width at a position 10 μm from the tip toward the base is preferably 10% to 50% of the width relative to the base of the bristle, more preferably 20% or more and 50% or less, and even more preferably 30% to 50%. This allows the bristle tip to penetrate into fine irregularities (e.g., grooves of 50 μm), improving cleaning performance, removing uncured resin, and enabling gentler development of gaps such as between narrow dot pitches (see Figure 17).

[0062] The amount of brush penetration into the printing plate is preferably 1 to 5 mm, more preferably 2 mm to 5 mm, and even more preferably 2 mm to 4 mm. This applies load to the brush, delaying the deterioration of the brush bristles while maintaining high cleaning performance (see Figure 8). Furthermore, by doing so, the contact area with the printing plate is reduced, making it less likely for problems such as the plate being detached from the transport table to occur.

[0063] Furthermore, the developer used in the development process preferably contains a surfactant in an amount of 0.2 wt% to 9.0 wt%. In this case, both high developability and suppression of foaming can be achieved, and the planted roll brush 10 can be cleaned while developing. In particular, increasing the flow rate of the cleaning solution to supply more developer to the planted roll brush 10 makes the planted roll brush 10 less prone to soiling. This reduces the number of times the planted roll brush 10 needs to be cleaned.

[0064] In this configuration, the embedded roll brush 10 has a wider spacing between bristle bundles and a smaller amount of bristles compared to a "channel density" brush, which improves the fluidity of the cleaning solution on the table (inclined at an angle of 1.2 degrees), allowing for a more uniform thickness of the printing plate, shorter cleaning times, and easier quality control. The channel brush has a narrow bristle pitch and a high bristle density, resulting in poor fluidity of the cleaning solution and low cleaning performance on the upper (higher) side of the table's incline. However, it was confirmed that when the hole pitch is 12 mm, the cleaning time is not delayed compared to conventional brushes, and the fluidity of the cleaning solution is particularly good. On the other hand, conventional brushes have a high bristle density and poor fluidity of the cleaning solution, resulting in large variations in thickness within the printing plate (the plate tends to be thicker on the upstream side of the table incline and thinner on the downstream side).

[0065] This planting brush can also be used with drum-type, batch-type, and in-line systems.

[0066] Example 2 The inventor used the aforementioned roll brush (D) (with a 12mm pitch (horizontal)) to investigate the relationship between (i) roll rotation speed, (ii) brush contact pressure, and (iii) brush penetration amount, and to determine a suitable range for improving the quality of the printing plate.

[0067] In this study, the cleaning test was conducted under normal conditions: a cleaning solution temperature of 38°C, an agitation speed of 48 rpm, and a surfactant concentration of 2.1 wt% in the cleaning solution. A photosensitive resin plate with a thickness of 1.14 mm and dimensions of 900 mm x 1200 mm was used.

[0068] Scoring was performed based on the evaluation criteria outlined in Table 1 below. [Table 1] The cleanability of the 1.14mm plate used in the test was defined as 100% when an average of 0.9mm of surface area could be cleaned across 25 points. Example: If the average cleaning of 25 points was 0.5 mm, the success rate would be 55.6%, or 3 points. If the average cleaning of 25 points was 0.3 mm, the success rate would be 33.3%, resulting in 2 points. Chipping properties were evaluated at 15% of 150 lpi, and the evaluation was performed by observing a 10 mm x 10 mm area. Example: 10mm x 10mm = 100mm 2 Of these, 2 points were awarded for chipping with a 35% area ratio. 10mm x 10mm = 100mm 2 Of these, 1 point was awarded for chipping with an area ratio of 55%.

[0069] (i) Roll rotation speed The brush rotation speed conditions are shown in the table below, and points were assigned to cleaning performance and chipping performance based on the information in Table 2. [Table 2] The test results confirmed that 3 to 25 rpm is the optimal range.

[0070] (ii) Brush contact pressure The test conditions for brush contact pressure are as shown in Table 3, and scores and points were assigned to cleaning performance and chipping performance based on the information in Table 3. [Table 3] The test results showed 50-800 kg / cm³ 2 We confirmed that it was within a suitable range.

[0071] (iii) Brush penetration amount The test conditions for brush penetration were as shown in Table 4, and scores and points were assigned to cleaning performance and chipping performance based on the information in Table 4. [Table 4] The test results confirmed that a brush penetration depth of 1-5 mm is within a suitable range.

[0072] ≪Second Embodiment of the Present Invention≫ The configuration of the present invention will be described in detail based on an example of a second embodiment shown in the drawings (see Figure 18, etc.). First, the implanted flat brush 50 and the method for manufacturing a printing plate using it will be described, and then the printing plate development process system 300 will be described.

[0073] [Planted Flat Brush] The embedded flat brush 50 is used in the cleaning process during the plate-making process, in which unexposed areas, such as uncured resin, are washed away while applying an aqueous developer. The plate-making process may include only the exposure and development steps, or it may also include a rinsing step.

[0074] The bristle-embedded flat brush 50 of this embodiment is constructed by embedding bristle bundles 53 in a plurality of bristle-embedded holes 52 of a resin brush base 51 (see Figure 19). The brush base 51 is flat and has a plurality of bristle-embedded holes 52 on one side. The bristle bundles 53 are embedded in these plurality of bristle-embedded holes 52 at equal intervals. Here, "equal intervals" includes not only cases where the intervals are exactly equal, but also cases where they are substantially equal (approximately equal). Specific examples of substantially equal (approximately equal) intervals include cases where two patterns of spacing are alternated for reasons such as adjusting the bristle bundle density in consideration of cleaning performance and debris adhesion, but the overall spacing is approximately equal, or cases where the spacing is slightly off in some areas due to various reasons such as the arrangement of cleaning holes 54 or the attachment of brush fixing screws, but the overall spacing is approximately equal. As a specific example of an arrangement in which hair bundles 53 are implanted at equal intervals in multiple hair implantation holes 52, for example, hair bundles 53 are arranged at equal intervals in a certain straight line, and hair bundles 53 are also arranged at equal intervals along a straight line parallel to that line.

[0075] Multiple hair bundles 53 can be arranged in predetermined patterns such as parallel arrangement, staggered arrangement, V-shaped arrangement, and spiral arrangement (see Figures 19, 20, etc.). "Parallel arrangement" refers to a arrangement where hair bundles 53 are arranged at equal intervals in a certain straight line, and hair bundles 53 are arranged at equal intervals perpendicular to the hair bundles 53 on that straight line (see Figure 28). "Staggered arrangement" refers to a arrangement where hair bundles 53 are arranged at equal intervals in a certain straight line, and hair bundles 53 are arranged at equal intervals on a straight line parallel to that straight line (excluding parallel arrangement). Examples of staggered arrangements include arrangements where the positions are alternately shifted in each row, arrangements where the positions are alternately shifted by half a pitch in each row, and arrangements where holes are made at each vertex of an equilateral triangle. Alternatively, the arrangement may be such that the area formed by connecting the center of a certain hair bundle 53 with the centers of three adjacent hair bundles 53 (a total of 4 points) is constant (see Figure 29). In this specification, the smallest base area between four adjacent bristle bundles 53 is defined as S [mm²] (hereinafter also referred to as the "minimum base area"), and the length of the bristle bundles 53 is defined as L [mm] (see Figure 19), with S / L being defined as the "debris adhesion coefficient". The shape of the minimum base area S varies; for example, if the bristle bundles 53 are arranged in parallel, it will be rectangular (see Figure 28), and if the bristle bundles 53 are arranged in a staggered pattern, it will be a parallelogram (see Figure 29). The sides of each area (shape) expressed here are defined as connecting the center points of the bristle implantation holes 52.

[0076] [Printing plate development process system] The printing plate development process system 300 is a system used in the development process of a printing plate that has been produced through various processes in the plate-making process. In addition to the embedded flat brush 50 described above, it includes a developer tank 310, a developer filter 320, and the like (see Figure 30). The various processes in the plate-making process may include only the exposure process and the development process, or they may also include a rinsing process. The developer filter 320 has at least one filter, for example, a dispersion filter 340 that aggregates the dispersion dispersed in the developer, and an aggregate filter 350 that removes the aggregate that has been aggregated by the dispersion filter 340. The developer tank 310 has a developer suction device 330. The developer filter 320 filters the developer that has been sucked up by the developer suction device 330. A more specific configuration of the printing plate development process system 300 is described in detail in the specification and drawings of, for example, Japanese Patent Application No. 2009-17963 (Japanese Patent No. 5503214). In Figure 30, the symbols 10A represent the developer supply device, 11 the developer processing device, 20 the mounting base, 22 the drain pan, 30A the developer supply pipe, 31 the pump, 32 the developer discharge pipe, 40 the rinse nozzle, 41 the rinse brush, 42 the developer supply source, 43 the developer supply pipe, 44 the pump, 45 the water supply source, 46 the water supply pipe, 47 the pump, 60 the float member, 61 the developer suction member, 70 the developer suction pipe, 71 the pump, 72 the liquid delivery pipe, 80 the first filter device, 81 the second filter device, 90 the housing, 91 the basket, 92 the dispersion filter, 101 the liquid delivery pipe, 120 the filter tank, 121 the coagulation filter, 122 the liquid delivery pipe, 123 the pump, and 130 and 131 the valves.

[0077] In this embodiment, the printing plate development process system 300 is configured such that, when unexposed resin is introduced into the printing plate development process system 300, the total unexposed resin mass balance, including the resin present in the developer filter 320 and the resin suspended in the developer tank 310, is between 70.0 wt% and 95.0 wt% (see Figure 27). Example 3

[0078] The inventors manufactured various types of embedded flat brushes 50 with the aim of reducing the amount of debris adhering to the embedded flat brush 50 during the developing process, making it easier to remove the adhering debris, and ensuring sufficient removal of uncured resin, etc. They then conducted tests to confirm the performance and effectiveness of these brushes by actually performing cleaning (see Figures 18 to 27). In this test, five types of embedded flat brushes 50, referred to as "Brush 1," "Brush 2," ..., and "Brush 5," were manufactured and used in the test (see Figure 18). These five types of embedded flat brushes 50 differed in various parameters (debris adhesion coefficient (S / L), bristle length [mm], brush arrangement, shortest distance between bristle bundles [mm], cleaning time [sec], bristle bundle diameter [mm], bristle bundle density [hairs / m2], and bristle volume [kg / m2]). "Bristle length" refers to the length from the surface of the brush base 51 to the tip of the bristle bundle 53. "Cleaning time" represents the time required to clean 0.55 mm of unexposed resin. In these five types of implanted flat brushes 50, referred to as Brush 1 to Brush 5, the bristle diameter was 200 μm, the brush material was 66NY, the base material was PVC, and the number of bristles per bristle bundle was 340 (see Figure 18).

[0079] In this embodiment, a printing plate was manufactured using a printing plate development process system 300 that includes the aforementioned embedded flat brush 50. The embedded flat brush 50 used in the manufacturing process included at least two areas with at least one difference in bristle thickness, length, and material, and an embedded flat brush 50 suitable for the design and / or quality of the printing plate was selected. In the development process, the brush contact pressure was adjusted by inserting a spacer at the base of the brush base 51 of the embedded flat brush 50, and the cleaning solution contained a surfactant of 4.20 wt% or less.

[0080] The preferred range for the debris adhesion coefficient S / L was 6.00 to 12.00. While the bristle density of the embedded flat brush 50 with a debris adhesion coefficient S / L within this range decreased compared to brushes 1-3 (where the coefficient was outside this range), the shorter bristle length resulted in a significant reduction in debris adhesion to the brush without changing the cleaning time (printing plate productivity). The amount of debris adhering to the brush was measured for a brush size of 107 mm × 860 mm (see Figure 26). Furthermore, it was found that within this debris adhesion coefficient S / L range, when cleaning fine areas with a recess distance of 30 μm or less, called microcells, the faster flow of the cleaning solution between the bristle bundles improved the removal of unexposed resin. A VK-X1000 laser microscope manufactured by Keyence Corporation was used to measure the depth of the microcells (see Figure 25(B)).

[0081] Furthermore, for brushes 1-3, where the debris adhesion coefficient is outside the preferred range, the space retention and even distribution of the cleaning solution resulted in no change in cleaning time (printing plate productivity) and a drastic reduction in debris adhesion to the brushes. From these points, the embedded flat brush 50 was preferably configured as follows. For example, it was preferable that the bottom area L between four adjacent bristle bundles 53 was 110.00 [mm2] or more and 200.00 [mm2] or less, and the bristle length L of the bristle bundles 53 was 8.00 [mm] or more and less than 20.00 [mm]. In addition, in the region between four adjacent bristle bundles 53, it was preferable that the ratio of the bristle length L of the bristle bundles 53 to the distance between two adjacent bristle holes was 0.70 or more and 1.30 or less. For example, if the bristle length L is 13 mm and the bristle bundle spacing in two directions is 10 mm and 12 mm, the ratio becomes 1:0.76:0.92 (see Figure 19). Furthermore, when cleaning holes 54, which are outlets for cleaning fluid, are formed in the flat brush base 51, it was preferable that these cleaning holes 54 be arranged in a staggered pattern, for example (see Figure 20). It was preferable that the distance between adjacent cleaning holes 54 be 65.00 [mm] to 80.00 [mm], and that the number of bristle bundles 53 between adjacent cleaning holes 54 be 3 to 7 (see Figure 20).

[0082] In a flat brush 50 with bristle bundles 53 arranged in a straight line at equal intervals, it was preferable that the distance between adjacent bristle bundles 53 across a cleaning hole 54 be 3.00 times or less the distance between adjacent bristle bundles 53 without a cleaning hole 54. More specifically, this is based on the idea that, for example, in a parallel arrangement (see Figure 28), if the cleaning hole 54 is to replace the position of a bristle bundle 53, replacing all three consecutive bristle bundles 53 with cleaning holes 54 would cause the bristle bundles 53 to separate, reducing the performance of removing unexposed resin, and therefore such an arrangement should be avoided. In other words, since bristle bundles 53 that could have been placed may not be able to be placed due to the cleaning hole 54, it is preferable to adjust the spacing between the bristle bundles 53 appropriately to limit the number of bristle bundles 53 that are skipped by the cleaning hole 54 to at least two. Furthermore, in a parallel arrangement (see Figure 28), if the cleaning holes 54 are to be replaced in the position of the hair bundles 53, it is preferable to avoid an arrangement in which both of the two consecutive hair bundles 53 are replaced with cleaning holes 54.

[0083] In the embedded flat brush 50, it was preferable that the distance between one bristle bundle 53 and the nearest bristle bundle 53 was between 4.00 mm and 16.00 mm (see Figures 20 to 26). In this case, cleaning performance is ensured, debris adhesion to the brush is prevented, and brush maintainability is improved, thereby ensuring plate quality. When the brush base 51 of the planted flat brush 50 is rectangular, it is preferable that the ratio of the short side to the long side is between 1.00 and 6.00 or more and between 1.00 and 10.00 or less. In such cases, the planted flat brush 50 can be easily attached and detached, and maintenance is easy. • The number of bristle holes 52 in the implanted flat brush 50 was preferably 4,000 to 15,000 per m², more preferably 7,000 to 9,000 per m² (see Figures 18, 25, and 26). It was preferable that the diameter of each bristle in the bristle bundle 53 of the implanted flat brush 50 was 80.00 μm or more and 400.00 μm or less, preferably 100.00 μm or more and 300.00 μm or less (see Figures 18, 25, and 26). It was preferable that the amount of bristles in the bristle bundles 53 of the implanted flat brush 50 was 0.50 kg / m2 or more and 1.20 kg / m2 or less, preferably 0.70 kg / m2 or more and 1.00 kg / m2 or less (see Figures 18, 25, and 26). It was preferable that the number of bristles in the bristle bundle 53 of the implanted flat brush 50 be 250 bristles / hole or more and 400 bristles / hole or less, preferably 300 bristles / hole or more and 350 bristles / hole or less (see Figures 18, 25, and 26). It was preferable that the diameter of the bristle holes 52 of the implanted flat brush 50 be between 4.00 mm and 5.00 mm (see Figures 18, 25, and 26). For the implanted flat brush 50, it was preferable that the ratio of the depth of the bristle holes 52 to the bristle length L was 5.0 to 13.0 or more and 30.0 to 13.0 or less, and the ratio of the depth of the bristle holes 52 to the hole diameter was 5.0 to 4.2 or more and 30.0 to 4.2 or less (see Figures 25 and 26). The maximum depth of the bristle holes 52 of the implanted flat brush 50 was preferably 5.00 mm to 20.00 mm, more preferably 5.00 mm to 15.00 mm (see Figures 25 and 26). It was preferable that the material of the brush base 51 of the implanted flat brush 50 be PVC, PP, or ABS, or two or more of these, and that the material of the bristles be 66NY, 612NY, 610NY, or PP. [Industrial applicability]

[0084] This invention is particularly suitable for application to embedded flat brushes or embedded roll brushes used in the development process of printing plates. [Explanation of symbols]

[0085] 10…Planting Roll Brush 20... Brush base 20A... Rotating shaft 30…Hair transplant pores 40…hair bundles 41... Hair 50… Planted flat brush 51... Brush base 52…Hair transplant holes 53…Hair bundles 54…Cleaning hole (outlet for cleaning solution) 100... Washing device 300…Printing plate development process system 310... Developer tank 320…Developer filtration device 330…Developer suction device 340... Dispersion filter 350... Aggregate filter L...Hair length of the hair bundle [mm] S...Minimum base area (the smallest base area among four adjacent hair strands) S / L...Debris adhesion coefficient

Claims

1. A planted flat brush or planted roll brush used in the development process of a printing plate that is produced after an exposure process and a development process, Multiple bristle bundles are planted at equal intervals in the bristle holes of the brush base, and when the smallest bottom area between four adjacent bristle bundles is S [mm²] and the length of the bristle bundle is L [mm], the debris adhesion coefficient S / L is 6.00 [mm] or more and 12.00 [mm] or less. The bottom area between four adjacent hair bundles is 110.00 [mm²] or more and 200.00 [mm²] or less. The distance between the aforementioned hair bundle and the nearest hair bundle is 4.00 mm or more and 16.00 mm or less. In the region between four adjacent hair bundles, the ratio of the hair length L of the hair bundle to the distance between two adjacent hair implantation holes is 0.70 or more and 1.30 or less. The hair length L of the aforementioned hair bundle is 8.00 [mm] or more and 20.00 [mm] or less. The number of hair implantation holes is 4,000 or more / m2 and 15,000 or less / m2. The depth of the aforementioned hair implantation hole is 5 mm or more and 20 mm or less. A bristle-planted flat brush or bristle-planted roll brush, wherein the ratio of the depth of the bristle-planting holes to the length of the bristles is 5.0 to 13.0 or more and 30.0 to 13.0 or less.

2. The embedded flat brush or embedded roll brush according to claim 1, wherein a cleaning hole, which is a cleaning solution outlet, is formed in a flat brush base, the cleaning holes are arranged in a staggered pattern, the distance between adjacent cleaning holes is 65.00 mm or more and 80.00 mm or less, and the number of bristle bundles between adjacent cleaning holes is 3 or more and 7 or less.

3. The implanted flat brush or implanted roll brush according to claim 2, wherein in a line of hair bundles arranged at equal intervals, the distance between adjacent hair bundles across the cleaning hole is 3.00 times or less the distance between adjacent hair bundles without the cleaning hole.

4. The diameter of each hair in the aforementioned hair bundle is 80 μm or more and 400 μm or less. The amount of hair in the aforementioned hair bundle is 500 g / m² or more and 4000 g / m² or less. The diameter of the aforementioned hair implantation hole is 1.0 mm or more and 6.0 mm or less. The number of hairs is between 100 and 500 per hole. The ratio of hole depth to hole diameter is 5.0 to 4.2 or more and 30 to 4.2 or less. The brush base is made of resin, the material of the brush base is PVC, PP, or ABS, or two or more of these, and the material of the bristles is 66NY, 612NY, 610NY, or PP. A planted flat brush or planted roll brush according to any one of claims 1 to 3.

5. The brush base is rectangular, and the ratio of the short side to the long side is 1:6.00 or more and 1:10.00 or less, according to any one of claims 1 to 3.

6. A planted flat brush or planted roll brush used in the developing process of a printing plate that is produced after an exposure process and a developing process, Multiple bristle bundles are planted at equal intervals in the bristle holes of the brush base, and when the smallest bottom area between four adjacent bristle bundles is S [mm²] and the length of the bristle bundle is L [mm], the debris adhesion coefficient S / L is 6.00 [mm] or more and 12.00 [mm] or less. A flat brush or roll brush with embedded bristles, wherein a flat brush base has cleaning holes formed therein, which are outlets for cleaning liquid, and the cleaning holes are arranged in a staggered pattern, the distance between adjacent cleaning holes is 65.00 mm or more and 80.00 mm or less, and the number of bristle bundles between adjacent cleaning holes is 3 or more and 7 or less.

7. A planted flat brush or planted roll brush used in the development process of a printing plate that is produced after an exposure process and a development process, Multiple bristle bundles are planted at equal intervals in the bristle holes of the brush base, and when the smallest bottom area between four adjacent bristle bundles is S [mm²] and the length of the bristle bundle is L [mm], the debris adhesion coefficient S / L is 6.00 [mm] or more and 12.00 [mm] or less. The diameter of each hair in the aforementioned hair bundle is 80 μm or more and 400 μm or less. The amount of hair in the aforementioned hair bundle is 500 g / m² or more and 4000 g / m² or less. The diameter of the aforementioned hair implantation hole is 1.0 mm or more and 6.0 mm or less. The number of hairs is between 100 and 500 per hole. The ratio of hole depth to hole diameter is 5.0 to 4.2 or more and 30 to 4.2 or less. The brush base is made of resin, the material of the brush base is PVC, PP, or ABS, or two or more of these, and the material of the bristles is 66NY, 612NY, 610NY, or PP. A flat brush or roll brush for planted areas.

8. A planted flat brush or planted roll brush used in the developing process of a printing plate that is produced after an exposure process and a developing process, Multiple bristle bundles are planted at equal intervals in the bristle holes of the brush base, and when the smallest bottom area between four adjacent bristle bundles is S [mm²] and the length of the bristle bundle is L [mm], the debris adhesion coefficient S / L is 6.00 [mm] or more and 12.00 [mm] or less. The aforementioned brush base is rectangular, and the ratio of the short side to the long side is 1:6.00 or more and 1:10.00 or less, and is a built-in flat brush.

9. A method for manufacturing a printing plate, including an exposure step and a development step, The implanted flat brush or implanted roll brush used in the aforementioned developing process has bundles of bristles implanted at equal intervals in multiple bristle holes of the brush base, and when the smallest of the bottom areas between four adjacent bundles of bristles is S [mm²] and the length of the bristles of the bundles is L [mm], the debris adhesion coefficient S / L is 6.00 [mm] or more and 12.00 [mm] or less. The bottom area between four adjacent hair bundles is 110.00 [mm²] or more and 200.00 [mm²] or less. The distance between the aforementioned hair bundle and the nearest hair bundle is 4.00 mm or more and 16.00 mm or less. In the region between four adjacent hair bundles, the ratio of the hair length L of the hair bundle to the distance between two adjacent hair implantation holes is 0.70 or more and 1.30 or less. The hair length L of the aforementioned hair bundle is 8.00 [mm] or more and 20.00 [mm] or less. The number of hair implantation holes is 4,000 or more / m2 and 15,000 or less / m2. The depth of the aforementioned hair implantation hole is 5 mm or more and 20 mm or less. A method for manufacturing a printing plate, wherein the ratio of the depth of the hair implantation holes to the length of the hairs is 5.0 to 13.0 or more and 30.0 to 13.0 or less.

10. The method for manufacturing a printing plate according to claim 9, wherein the rotation speed of the brush in the developing step is 3 rpm or more and 25 rpm or less, and the oscillation speed when oscillating is 20 rpm or more and 150 rpm or less.

11. The method for manufacturing a printing plate according to claim 9 or 10, wherein the contact pressure of the brush with the printing plate in the developing step is 50 g / cm² or more and 800 g / cm² or less, and the amount of penetration of the brush into the printing plate is 1 mm or more and 5 mm or less.

12. The process of selecting a brush suitable for the design and / or quality of the plate, A method for manufacturing a printing plate according to claim 9 or 10, comprising the step of adjusting the brush contact pressure by installing a spacer at the base of the brush base.

13. The method for manufacturing a printing plate according to claim 9 or 10, characterized in that the flat brush includes at least two or more areas with different bristle thickness, length, and material.

14. A method for manufacturing a printing plate according to claim 9 or 10, wherein a developing solution is used in the developing step, and the developing solution contains a surfactant in an amount of 0.00 wt% or more and 4.20 wt% or less.

15. A printing plate development system used in the development process of a printing plate that is produced through an exposure process and a development process, comprising a planted flat brush or planted roll brush according to any one of claims 1 to 3, a developer tank, and a developer filtration device, wherein the developer filtration device has at least one filter, A printing plate developing process system characterized in that, when unexposed resin is introduced into the system, the mass balance of unexposed resin is configured such that the total amount of resin present in the developer filtration device and resin floating in the developer tank relative to the introduced unexposed resin is between 70.0 wt% and 95.0 wt%.

16. The printing plate developing process system according to claim 15, wherein the developing tank has a developing suction device, and the developing filtration device filters the developing solution sucked up by the developing suction device, and comprises a dispersion filter for agglomerating dispersed matter in the developing solution, and an agglomeration filter for removing the agglomerated matter agglomerated by the dispersion filter.