Display device

Abstract

Provided is a display device having both an individual authentication function and high definition. The display device has a display unit and a sensor unit, the display unit having a first light-emitting element and a second light-emitting element, the first light-emitting element having a first EL layer, the second light-emitting element having a second EL layer, the sensor unit having a light-receiving element, the first light-emitting element having the function of emitting infrared light, the light-receiving element having the function of detecting infrared light, and the distance between the first EL layer and the second EL layer being 6 µm or less.

Description

display device

[0001] FIELD OF THE INVENTION One embodiment of the present invention relates to a display device and a manufacturing method of the display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the technical field of one embodiment of the present invention disclosed in this specification and the like include semiconductor devices, display devices, light-emitting devices, power storage devices, memory devices, electronic devices, lighting devices, input devices, input / output devices, driving methods thereof, and manufacturing methods thereof. A semiconductor device refers to any device that can function by utilizing semiconductor characteristics.

[0003] In recent years, there has been a demand for higher definition display panels. Devices requiring high-definition display panels include, for example, smartphones, tablet terminals, and notebook computers. Furthermore, with the trend toward higher resolution, stationary display devices such as televisions and monitors also require higher definition. Furthermore, devices requiring the highest definition include, for example, devices for virtual reality (VR) or augmented reality (AR).

[0004] Representative examples of display devices applicable to the display panel include liquid crystal display devices, organic EL (Electro Luminescence) elements, light-emitting devices equipped with light-emitting elements such as light-emitting diodes (LEDs: Light Emitting Diodes), and electronic paper that displays using an electrophoresis method.

[0005] For example, the basic structure of an organic EL element is a layer containing a light-emitting organic compound sandwiched between a pair of electrodes. By applying a voltage to this element, light can be emitted from the light-emitting organic compound. A display device using such an organic EL element does not require a backlight, which is necessary in liquid crystal display devices and the like, and therefore can realize a thin, lightweight, high-contrast, and low-power display device. For example, an example of a display device using an organic EL element is described in Patent Document 1.

[0006] Furthermore, information terminals such as the above-mentioned smartphones, tablet terminals, and notebook computers often contain personal information, and various authentication technologies have been developed to prevent unauthorized use.

[0007] For example, Patent Document 2 discloses an electronic device that includes a fingerprint sensor in a push button switch section.

[0008] Patent Document 1: Japanese Patent Application Publication No. 2002-324673 Patent Document 2: U.S. Patent Application Publication No. 2014 / 0056493

[0009] An object of one embodiment of the present invention is to provide a display device that combines a personal authentication function with high definition.An object of one embodiment of the present invention is to provide a display device that can easily achieve high definition and a manufacturing method thereof.An object of one embodiment of the present invention is to provide a display device with high contrast.An object of one embodiment of the present invention is to provide a highly reliable display device.

[0010] An object of one embodiment of the present invention is to provide a display device having a novel structure or a manufacturing method of the display device.An object of one embodiment of the present invention is to provide a method for manufacturing the above-described display device with high yield.An object of one embodiment of the present invention is to alleviate at least one of the problems of the prior art.

[0011] Note that the description of these problems does not preclude the existence of other problems. Note that one embodiment of the present invention does not necessarily solve all of these problems. Note that problems other than these can be extracted from the description of the specification, drawings, claims, etc.

[0012] One embodiment of the present invention is a display device that includes a display portion and a sensor portion, in which the display portion includes a first light-emitting element and a second light-emitting element, the first light-emitting element has a first EL layer, and the second light-emitting element has a second EL layer. The sensor portion includes a light-receiving element, in which the first light-emitting element has a function of emitting infrared light and the light-receiving element has a function of detecting infrared light. The distance between the first EL layer and the second EL layer is 6 μm or less.

[0013] In the above, the display device may have a protective member and a housing, the display unit and the sensor unit are arranged in an area surrounded by the protective member and the housing, and the display unit and the sensor unit are arranged side by side on the housing.Furthermore, in the above, it is preferable that the display unit has a first substrate and a second substrate, the first substrate is arranged between the first light-emitting element and the second light-emitting element and the housing, the second substrate is arranged between the first light-emitting element and the second light-emitting element and the protective member, and the second substrate and the protective member are light-transmitting.

[0014] In the above, the display device may have a protective member and a housing, the display unit and the sensor unit are disposed in an area surrounded by the protective member and the housing, the sensor unit is disposed on the housing, and the display unit is disposed on the sensor unit.Furthermore, in the above, it is preferable that the display unit has a first substrate and a second substrate, the first substrate is disposed between the first light-emitting element and the second light-emitting element and the sensor unit, the second substrate is disposed between the first light-emitting element and the second light-emitting element and the protective member, and the first substrate, the second substrate, and the protective member are translucent.

[0015] In the above, it is preferable that the second light-emitting element has a function of emitting red, green, or blue light. In the above, it is preferable that organic films are used as the first EL layer and the second EL layer. In the above, it is also preferable that the distance between the first EL layer and the second EL layer is 3 μm or less. In the above, it is preferable that the light-receiving element is formed on a silicon substrate.

[0016] According to one embodiment of the present invention, a display device having both a personal authentication function and high resolution can be provided. Alternatively, according to one embodiment of the present invention, a display device that can easily achieve high resolution and a manufacturing method thereof can be provided. Alternatively, according to one embodiment of the present invention, a display device with high contrast can be provided. Alternatively, according to one embodiment of the present invention, a display device with high reliability can be provided.

[0017] According to one embodiment of the present invention, a display device having a novel structure or a manufacturing method of the display device can be provided. Alternatively, a method for manufacturing the display device with high yield can be provided. According to one embodiment of the present invention, at least one of the problems of the prior art can be alleviated.

[0018] Note that the description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Note that effects other than these can be extracted from the description in the specification, drawings, claims, etc.

[0019] FIGS. 1A to 1C are diagrams showing a structural example of a display device. FIGS. 2A to 2D are diagrams showing a structural example of a display device. FIGS. 3A to 3F are diagrams showing a manufacturing method example of a display device. FIGS. 4A to 4F are diagrams showing a manufacturing method example of a display device. FIGS. 5A to 5C are diagrams showing a manufacturing method example of a display device. FIGS. 6A to 6D are diagrams showing a structural example of a display device. FIGS. 7A to 7E are diagrams showing a manufacturing method example of a display device. FIGS. 8A to 8C are diagrams showing a structural example of a display device. FIGS. 9A to 9C are diagrams showing a structural example of a display device. FIGS. 10A to 10C are diagrams showing a structural example of a display device. FIGS. 11A to 11C are perspective views showing an example of a display device. FIGS. 12A and 12B are cross-sectional views showing an example of a display device. FIG. 13A is a cross-sectional view showing an example of a display device. FIG. 13B is a cross-sectional view showing an example of a transistor. FIGS. 14A and 14B are perspective views showing an example of a display module. FIG. 15 is a cross-sectional view showing an example of a display device. FIG. 16 is a cross-sectional view showing an example of a display device. Fig. 17 is a cross-sectional view showing an example of a display device. Figs. 18A to 18D are diagrams showing a configuration example of a light-emitting element. Figs. 19A1 to 19B3 are cross-sectional views showing an example of a sensor module. Figs. 20A and 20B are diagrams showing an example of an electronic device. Figs. 21A to 21D are diagrams showing an example of an electronic device. Figs. 22A to 22F are diagrams showing an example of an electronic device. Figs. 23A to 23F are diagrams showing an example of an electronic device.

[0020] Hereinafter, embodiments will be described with reference to the drawings. However, it will be readily understood by those skilled in the art that the embodiments can be implemented in many different ways and that various changes in form and details can be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the following description of the embodiments.

[0021] In the configuration of the invention described below, the same parts or parts having similar functions are denoted by the same reference numerals in different drawings, and repeated explanations thereof will be omitted. In addition, when referring to similar functions, the same hatch pattern may be used and no particular reference numeral may be assigned.

[0022] In the drawings described in this specification, the size of each component, the thickness of a layer, or an area may be exaggerated for clarity, and therefore, the drawings are not necessarily limited to the scale.

[0023] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components and do not limit the number.

[0024] Furthermore, in this specification and the like, the terms "film" and "layer" are interchangeable. For example, the terms "conductive layer" and "insulating layer" may be interchangeable with the terms "conductive film" and "insulating film."

[0025] In this specification, the EL layer refers to a layer provided between a pair of electrodes of a light-emitting element and containing at least a light-emitting substance (also referred to as a light-emitting layer), or a stack including a light-emitting layer.

[0026] In this specification and the like, a display panel, which is one aspect of a display device, has a function of displaying (outputting) an image or the like on a display surface, and therefore the display panel is one aspect of an output device.

[0027] In addition, in this specification, a display panel having a connector such as an FPC (Flexible Printed Circuit) or a TCP (Tape Carrier Package) attached to the substrate, or a display panel having an IC mounted on the substrate using a COG (Chip On Glass) method or the like, may be referred to as a display panel module, a display module, or simply a display panel.

[0028] Embodiment 1 In this embodiment, a structural example of a display device according to one embodiment of the present invention and an example of a manufacturing method of the display device will be described.

[0029] One embodiment of the present invention is a display device including a light-emitting element (which can also be referred to as a light-emitting device) and a light-receiving element (which can also be referred to as a light-receiving device or a photoelectric conversion device). The display device includes two or more light-emitting elements that emit light of different colors, and includes at least a light-emitting element that emits infrared light. Note that infrared light is invisible light, but this is also sometimes referred to as "color" in this specification and the like. Each light-emitting element includes a pair of electrodes and an EL layer therebetween. The light-emitting element is preferably an organic EL element (organic electroluminescent element). Two or more light-emitting elements that emit different colors each have an EL layer containing a different material. For example, a full-color display device with a personal authentication function can be realized by including four types of light-emitting elements that emit red (R), green (G), or blue (B) visible light and infrared light (IR).

[0030] Here, one aspect of the present invention includes a light-emitting element having a function of emitting infrared light and a light-receiving element having a function of detecting infrared light. This allows one aspect of the present invention to realize a personal authentication function using infrared light. That is, by irradiating an object with infrared light emitted from the light-emitting element and detecting the infrared light reflected from the object with the light-receiving element, personal authentication of the object can be performed. For example, by using a human face as the object, facial authentication can be performed. By using a human finger as the object, fingerprint authentication can be performed. By using a human hand as the object, palmprint authentication can be performed.

[0031] In this case, one embodiment of the present invention performs personal authentication using invisible infrared light, which allows personal authentication without interfering with the display of a display device. In particular, when performing face authentication, the user can use the display device without stress because unnecessary light is not sensed by the user.

[0032] Furthermore, by providing an infrared light emitting element in the same location as the display light emitting elements (RGB, etc.), there is no need to provide an infrared light emitting device for personal authentication, which allows for space saving of the display device, making it possible to reduce the weight of the display device or increase the size of the battery.

[0033] Furthermore, when different EL layers are formed for light-emitting elements of different colors, it is known to form them by a vapor deposition method using a shadow mask such as a metal mask or an FMM (fine metal mask, high-resolution metal mask). Note that in this specification, devices formed in this manner may be referred to as an MM (metal mask) structure. However, with an MM structure, deviations from the design occur in the shape and position of the island-shaped organic film due to various influences, such as the accuracy of the metal mask, misalignment between the metal mask and the substrate, deflection of the metal mask, and the spread of the contours of the deposited film due to vapor scattering, making it difficult to achieve high definition and a high aperture ratio. Therefore, measures have been taken to artificially increase the definition (also known as pixel density) by applying special pixel arrangement methods such as a pentile arrangement.

[0034] In one embodiment of the present invention, an EL layer is processed into a fine pattern without using a metal mask or a shadow mask such as an FMM. For example, the EL layer is processed into a fine pattern using a photolithography method. In this specification and the like, a device formed as described above may be referred to as a device with an MML (metal maskless) structure. By using a device with an MML structure, a display device with high definition and a large aperture ratio, which have been difficult to achieve until now, can be realized. Furthermore, because the EL layer can be individually fabricated, a display device with extremely vivid images, high contrast, and high display quality can be realized.

[0035] For example, while it is difficult to achieve a distance of less than 10 μm between EL layers of different colors with an MM structure, with an MML structure, this distance can be reduced to 6 μm or less, 4 μm or less, 3 μm or less, 2 μm or less, or even 1 μm or less. Furthermore, by using an exposure device for LSIs, for example, the distance can be reduced to 500 nm or less, 200 nm or less, 100 nm or less, or even 50 nm or less. This significantly reduces the area of ​​the non-light-emitting region that may exist between two light-emitting elements, enabling the aperture ratio to approach 100%. For example, the aperture ratio can be 50% or more, 60% or more, 70% or more, 80% or more, or even 90% or more, and even less than 100%.

[0036] Furthermore, the pattern of the EL layer itself can be made much smaller than when a metal mask is used. Furthermore, for example, when a metal mask is used to separately form an EL layer, thickness variations occur between the center and edges of the pattern, resulting in a smaller effective area that can be used as the light-emitting region relative to the overall area of ​​the pattern. On the other hand, with the above-described fabrication method, a pattern is formed by processing a film deposited to a uniform thickness, making it possible to achieve a uniform thickness within the pattern, and even with a fine pattern, almost the entire area can be used as the light-emitting region. Therefore, the above-described fabrication method can achieve both high definition and a high aperture ratio.

[0037] In this way, according to the above-described manufacturing method, a display device integrating minute light-emitting elements can be realized, and therefore there is no need to apply a special pixel arrangement method such as a pen tile method to artificially increase the resolution. Therefore, it is possible to realize a display device with a so-called stripe arrangement in which R, G, and B are each arranged in one direction, and with a resolution of 500 ppi or more, 1000 ppi or more, 2000 ppi or more, or even 3000 ppi or more, or even 5000 ppi or more.

[0038] In this way, by using the MML structure, it is possible to provide a display device that combines a personal authentication function with high definition.

[0039] Below, a structure of a display device according to one embodiment of the present invention will be described with reference to FIGS. 1A to 1C. FIG.

[0040] [Configuration Example of Display Device Having Display Portion and Sensor Portion] Fig. 1A is a schematic diagram of a display device according to one embodiment of the present invention. The display device shown in Fig. 1A includes a display portion 100, a sensor portion 104, a housing 103, and a protective member 105. The display portion 100 and the sensor portion 104 are disposed in a region sandwiched between the housing 103 and the protective member 105 or in a region surrounded by the housing 103 and the protective member 105. Here, the display portion 100 and the sensor portion 104 are disposed side by side on the housing 103. Note that details of each component will be described later.

[0041] The display unit 100 includes a substrate 101, a substrate 102, and a plurality of light-emitting elements. For example, the plurality of light-emitting elements may be configured to include a light-emitting element 110R that emits red light, a light-emitting element 110G that emits green light, a light-emitting element 110B that emits blue light, and a light-emitting element 110IR that emits infrared light. Hereinafter, the light-emitting elements 110R, 110G, 110B, and 110IR may be collectively referred to as light-emitting elements 110. The light-emitting elements 110 are disposed in a region sandwiched between the substrates 101 and 102. In other words, the substrate 101 is disposed between the housing 103 and the light-emitting elements 110, and the substrate 102 is disposed between the light-emitting elements 110 and the protective member 105.

[0042] The light emitted by the light emitting element 110IR preferably includes infrared light, and more preferably near-infrared light. For example, near-infrared light having one or more peaks in the wavelength range of 700 nm to 2500 nm can be suitably used.

[0043] The sensor unit 104 has a light receiving element that has a function of detecting infrared light. The light receiving element preferably has optical sensitivity corresponding to infrared light, preferably near-infrared light, emitted by the light emitting element 110IR.

[0044] 1A , an image is displayed by light emitted by light-emitting elements 110R, 110G, and 110B of display unit 100. Furthermore, infrared light emitted from light-emitting element 110IR of display unit 100 is reflected by the user's face 109, and the reflected light is detected by the light-receiving element of sensor unit 104, thereby performing personal authentication. Therefore, substrate 102 and protective member 105 must be transparent to both visible light emitted from light-emitting elements 110R, 110G, and 110B, and infrared light emitted from light-emitting element 110IR and reflected by face 109. Therefore, substrate 102 and protective member 105 are preferably translucent to visible light and infrared light.

[0045] As described above, in the display device shown in FIG. 1A , the display unit 100 and the sensor unit 104 are arranged side by side on the housing 103. Therefore, the distance between the light-emitting element 110IR and the light-receiving element of the sensor unit 104 in a direction parallel to the substrate surface is relatively large. Therefore, with the display device shown in FIG. 1A , it is difficult to sense an object that is close to the protective member 105. For this reason, the display device shown in FIG. 1A is preferably used for face authentication, in which the distance between the sensing object (face 109) and the protective member 105 is relatively large.

[0046] One embodiment of the present invention may have a structure as shown in FIG. 1B . The display device shown in FIG. 1B differs from the display device shown in FIG. 1A in that a sensor portion 104 is provided under the display portion 100. In the display device shown in FIG. 1B , the sensor portion 104 is provided over the housing 103, the display portion 100 is provided over the sensor portion 104, and a protective member 105 is provided over the display portion 100. Note that the other configurations are similar to those of the display device shown in FIG. 1A , and therefore the above description of FIG. 1A can be referred to for details.

[0047] As shown in FIG. 1B , an image is displayed by light emitted by light-emitting elements 110R, 110G, and 110B of display unit 100. Furthermore, infrared light emitted from light-emitting element 110IR of display unit 100 is reflected by user's finger 108, and the reflected light is detected by the light-receiving element of sensor unit 104, thereby performing personal authentication. Therefore, substrate 102 and protective member 105 must transmit both visible light from light-emitting elements 110R, 110G, and 110B, and infrared light reflected by light-emitting element 110IR and finger 108. Therefore, substrate 102 and protective member 105 are preferably translucent for visible light and infrared light. Furthermore, infrared light reflected by finger 108 must be able to pass through substrate 101. Therefore, substrate 101 is preferably translucent for at least infrared light.

[0048] As described above, in the display device shown in FIG. 1B , the display unit 100 is disposed so as to overlap the sensor unit 104. Therefore, the distance between the light-emitting element 110IR and the light-receiving element of the sensor unit 104 in a direction parallel to the substrate surface is relatively small. Therefore, the display device shown in FIG. 1B facilitates sensing of an object that is close to the protective member 105. For this reason, the display device shown in FIG. 1B is preferably used for fingerprint authentication, in which the sensing object (finger 108) comes into contact with the protective member 105.

[0049] 1B shows an example in which the finger 108 is in contact with the protective member 105, but the finger 108 does not necessarily have to be in contact with the protective member 105. For example, as shown in FIG. 1C , sensing may be possible in a state in which the finger 108 and the protective member 105 are separated. In this case, however, it is preferable that the distance between the finger 108 and the protective member 105 is relatively short, and this state may be called near touch or hover touch.

[0050] In this specification, near-touch or hover-touch refers to, for example, a state in which the target (finger 108) can be detected without the target (finger 108) touching the display device. For example, it is preferable that the display device be configured to detect the target (finger 108) when the distance between the display device and the target (finger 108) is in the range of 0.1 mm to 300 mm, preferably 3 mm to 50 mm. This configuration enables the target (finger 108) to operate the display device without directly touching it, in other words, to operate the display device in a contactless (touchless) manner. This configuration reduces the risk of the display device becoming dirty or scratched, or enables the target (finger 108) to operate the display device without directly touching dirt (e.g., dust, viruses, etc.) that may adhere to the display device.

[0051] Note that, while FIG. 1A shows a configuration in which the sensor unit 104 is disposed to the side of the display unit 100, and FIGS. 1B and 1C show configurations in which the sensor unit 104 is disposed below the display unit 100, these configurations may be used in combination. That is, a first sensor unit may be disposed to the side of the display unit, and a second sensor unit may be disposed below the display unit. This configuration allows face authentication and fingerprint authentication to be used in combination depending on the level of security. For example, general security processes (e.g., unlocking the screen) can be performed using face authentication, and processes requiring higher levels of security (e.g., purchasing goods) can also be performed using fingerprint authentication.

[0052] Although the above example shows a case where the sensing target is a face and a fingerprint, the present invention is not limited to this. For example, the display device may perform personal authentication by sensing palm prints, pulse patterns (including vein patterns and arterial patterns), irises, etc.

[0053] Although the above description has been given of a function for performing personal authentication using the display device according to the present invention, the present invention is not limited to this. For example, the display device may be provided with a function for capturing an image of a gesture using a sensor unit and performing processing in accordance with the gesture. Furthermore, for example, the display device may be provided with a function for acquiring biometric data such as pulse rate, respiratory rate, pulse wave, oxygen saturation level, blood glucose level, and triglyceride concentration from the image data captured by the sensor unit.

[0054] In addition, in the above description, a configuration is shown in which a pixel is formed using four types of light-emitting elements, namely, light-emitting element 110R that emits red light, light-emitting element 110G that emits green light, light-emitting element 110B that emits blue light, and light-emitting element 110IR that emits infrared light, but the present invention is not limited to this. For example, a configuration may be adopted in which light-emitting element 110R emits light that has peaks in both the red wavelength and the infrared wavelength, and a pixel may be formed using three types of light-emitting elements, namely, light-emitting element 110R, light-emitting element 110G, and light-emitting element 110B.

[0055] Next, a more specific example of a structure and a manufacturing method of the display portion 100 provided in the display device of one embodiment of the present invention will be described with reference to the drawings.

[0056] 2A shows a schematic top view of a display unit 100 according to one embodiment of the present invention. The display unit 100 includes a plurality of light-emitting elements 110R that emit red light, a plurality of light-emitting elements 110G that emit green light, a plurality of light-emitting elements 110B that emit blue light, and a plurality of light-emitting elements 110IR that emit infrared light. In FIG. 2A, the light-emitting elements are labeled with R, G, B, and IR in their light-emitting regions to easily distinguish them from one another.

[0057] The light emitting elements 110R, 110G, 110B, and 110IR are arranged in a matrix. Fig. 2A shows a so-called stripe arrangement in which light emitting elements of the same color are arranged in one direction. The arrangement of the light emitting elements is not limited to this; other arrangements such as a delta arrangement or a zigzag arrangement may also be used, and a pentile arrangement may also be used.

[0058] The light emitting elements 110R, 110G, 110B, and 110IR are arranged in the X direction. Furthermore, light emitting elements of the same color are arranged in the Y direction that intersects with the X direction.

[0059] 1A shows an example in which one pixel is formed by one each of the light-emitting element 110R, the light-emitting element 110G, the light-emitting element 110B, and the light-emitting element 110IR, but the present invention is not limited to this. For example, a basic pixel may be formed by the light-emitting element 110R, the light-emitting element 110G, and the light-emitting element 110B, and a pixel having the light-emitting element 110IR may be partially provided.

[0060] As the light-emitting element 110R, the light-emitting element 110G, the light-emitting element 110B, and the light-emitting element 110IR, it is preferable to use an EL element such as an OLED (organic light-emitting diode) or a QLED (quantum-dot light-emitting diode). Examples of light-emitting materials included in the EL elements include fluorescent materials (fluorescent materials), phosphorescent materials (phosphorescent materials), inorganic compounds (such as quantum dot materials), and materials that exhibit thermally activated delayed fluorescence (thermally activated delayed fluorescence: TADF materials).

[0061] 2B is a schematic cross-sectional view corresponding to the dashed-dotted line A1-A2 in FIG. 2A, and FIG. 2C is a schematic cross-sectional view corresponding to the dashed-dotted line B1-B2.

[0062] 2B shows cross sections of the light-emitting elements 110R, 110G, 110B, and 110IR. The light-emitting element 110R has a pixel electrode 111R, an EL layer 112R, an EL layer 114, and a common electrode 113. The light-emitting element 110G has a pixel electrode 111G, an EL layer 112G, an EL layer 114, and a common electrode 113. The light-emitting element 110B has a pixel electrode 111B, an EL layer 112B, an EL layer 114, and a common electrode 113. The light-emitting element 110IR has a pixel electrode 111IR, an EL layer 112IR, an EL layer 114, and a common electrode 113. The EL layer 114 and the common electrode 113 are provided in common to the light-emitting elements 110R, 110G, 110B, and 110IR. The EL layer 114 can also be referred to as a common layer.

[0063] The EL layer 112R of the light-emitting element 110R contains a light-emitting organic compound that emits light having an intensity in at least the red wavelength range. The EL layer 112G of the light-emitting element 110G contains a light-emitting organic compound that emits light having an intensity in at least the green wavelength range. The EL layer 112B of the light-emitting element 110B contains a light-emitting organic compound that emits light having an intensity in at least the blue wavelength range.

[0064] The EL layers 112R, 112G, 112B, and 112IR may each include one or more of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer in addition to a layer containing a light-emitting organic compound (light-emitting layer). The EL layer 114 may not include a light-emitting layer. For example, the EL layer 114 includes one or more of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer.

[0065] The pixel electrodes 111R, 111G, 111B, and 111IR are provided for each light-emitting element. The common electrode 113 and the EL layer 114 are provided as a continuous layer common to each light-emitting element. A conductive film transmissive to visible light is used for either one of the pixel electrodes or the common electrode 113, and a conductive film reflective to visible light is used for the other. By making each pixel electrode transmissive and the common electrode 113 reflective, a bottom-emission display device can be obtained. Conversely, by making each pixel electrode reflective and the common electrode 113 transmissive, a top-emission display device can be obtained. Note that by making both the pixel electrodes and the common electrode 113 transmissive, a dual-emission display device can be obtained.

[0066] An insulating layer 131 is provided to cover the ends of the pixel electrodes 111R, 111G, 111B, and 111IR. The ends of the insulating layer 131 are preferably tapered. Note that the insulating layer 131 does not have to be provided if it is not necessary.

[0067] The EL layer 112R, the EL layer 112G, the EL layer 112B, and the EL layer 112IR each have a region in contact with the upper surface of the pixel electrode and a region in contact with the surface of the insulating layer 131. In addition, the ends of the EL layer 112R, the EL layer 112G, the EL layer 112B, and the EL layer 112IR are located on the insulating layer 131.

[0068] As shown in Figure 2B, a gap is provided between two EL layers between light-emitting elements of different colors. In this manner, it is preferable that the EL layers 112R, 112G, 112B, and 112IR are arranged so as not to contact each other. This effectively prevents current from flowing through two adjacent EL layers, which would otherwise cause unintended light emission. This allows for increased contrast and a display device with high display quality to be realized.

[0069] As shown in Figure 2C, the EL layer 112R is formed in a strip shape so that the EL layer 112R is continuous in the Y direction. By forming the EL layer 112R and the like in a strip shape, space to separate them is not required, and the area of ​​the non-light-emitting region between the light-emitting elements can be reduced, thereby increasing the aperture ratio. Note that while Figure 2C shows a cross section of the light-emitting element 110R as an example, the light-emitting element 110G, the light-emitting element 110B, and the light-emitting element 110IR can also be formed in a similar shape.

[0070] A protective layer 121 is provided on the common electrode 113 to cover the light emitting elements 110R, 110G, 110IR, and 110B. The protective layer 121 has a function of preventing impurities such as water from diffusing from above into each light emitting element.

[0071] The protective layer 121 may have, for example, a single-layer structure or a multilayer structure including at least an inorganic insulating film. Examples of the inorganic insulating film include oxide films or nitride films such as a silicon oxide film, a silicon oxynitride film, a silicon nitride oxide film, a silicon nitride film, an aluminum oxide film, an aluminum oxynitride film, and a hafnium oxide film. Alternatively, the protective layer 121 may be made of a semiconductor material such as indium gallium oxide or indium gallium zinc oxide.

[0072] Alternatively, the protective layer 121 may be a laminated film of an inorganic insulating film and an organic insulating film. For example, a configuration in which an organic insulating film is sandwiched between a pair of inorganic insulating films is preferable. Furthermore, it is preferable that the organic insulating film functions as a planarizing film. This allows the upper surface of the organic insulating film to be flat, thereby improving the coverage of the inorganic insulating film thereon and enhancing the barrier properties. Furthermore, since the upper surface of the protective layer 121 is flat, it is preferable that when a structure (e.g., a color filter, a touch sensor electrode, a lens array, etc.) is provided above the protective layer 121, the influence of uneven shapes caused by the structure below can be reduced.

[0073] 2A also shows a connection electrode 111C that is electrically connected to the common electrode 113. The connection electrode 111C is given a potential (e.g., an anode potential or a cathode potential) to be supplied to the common electrode 113. The connection electrode 111C is provided outside the display area where the light-emitting elements 110R and the like are arranged. In addition, in FIG. 2A, the common electrode 113 is shown by a dashed line.

[0074] The connection electrode 111C can be provided along the periphery of the display area. For example, it may be provided along one side of the periphery of the display area, or it may be provided over two or more sides of the periphery of the display area. That is, when the top surface of the display area has a rectangular shape, the top surface of the connection electrode 111C can have a strip shape, an L-shape, a U-shape (square bracket shape), a square shape, or the like.

[0075] Fig. 2D is a schematic cross-sectional view corresponding to dashed line C1-C2 in Fig. 2A. Fig. 2D shows a connection portion 130 where the connection electrode 111C and the common electrode 113 are electrically connected. In the connection portion 130, the common electrode 113 is provided in contact with the connection electrode 111C, and a protective layer 121 is provided covering the common electrode 113. In addition, an insulating layer 131 is provided covering the end of the connection electrode 111C.

[0076] [Fabrication Method Example 1] An example of a method for fabricating a display device of one embodiment of the present invention will be described below with reference to the drawings. Here, the display unit 100 shown in the above configuration example will be described as an example. FIGS. 3A to 4F are cross-sectional schematic views of steps in a fabrication method of a display device exemplified below. Also, in FIG. 3A and other figures, a cross-sectional schematic view of the connection portion 130 and its vicinity is also shown on the right side. Note that although the light-emitting element 110B is omitted in FIGS. 3A to 4F for clarity, the light-emitting element 110B can also be fabricated in the same manner as the light-emitting element 110R, the light-emitting element 110G, and the light-emitting element 110IR.

[0077] Thin films (insulating films, semiconductor films, conductive films, etc.) constituting the display device can be formed using a sputtering method, a chemical vapor deposition (CVD) method, a vacuum evaporation method, a pulsed laser deposition (PLD) method, an atomic layer deposition (ALD) method, etc. CVD methods include a plasma enhanced chemical vapor deposition (PECVD) method and a thermal CVD method. One type of thermal CVD method is a metal organic chemical vapor deposition (MOCVD) method.

[0078] Furthermore, thin films (insulating films, semiconductor films, conductive films, etc.) constituting the display device can be formed by methods such as spin coating, dipping, spray coating, inkjet, dispensing, screen printing, offset printing, doctor knife method, slit coating, roll coating, curtain coating, knife coating, etc.

[0079] Furthermore, when processing the thin film that constitutes the display device, a photolithography method or the like can be used. Alternatively, the thin film may be processed by a nanoimprint method, a sandblasting method, a lift-off method, or the like. Furthermore, the island-shaped thin film may be directly formed by a film formation method using a shielding mask such as a metal mask.

[0080] There are two typical photolithography methods: one is to form a resist mask on the thin film to be processed, process the thin film by etching or the like, and then remove the resist mask; the other is to form a photosensitive thin film, and then process the thin film into the desired shape by exposure and development.

[0081] In photolithography, the light used for exposure may be, for example, i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or a mixture of these. Other light sources that can be used include ultraviolet light, KrF laser light, ArF laser light, etc. Exposure may also be performed by immersion exposure technology. Extreme ultraviolet (EUV) light, X-rays, etc. may also be used as light for exposure. An electron beam may also be used instead of light for exposure. Extreme ultraviolet light, X-rays, or an electron beam are preferred because they enable extremely fine processing. When exposure is performed by scanning a beam such as an electron beam, a photomask is not required.

[0082] For etching the thin film, dry etching, wet etching, sandblasting, or the like can be used.

[0083] [Preparation of Substrate 101] The substrate 101 can be a substrate having heat resistance at least sufficient to withstand subsequent heat treatment. When an insulating substrate is used as the substrate 101, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, an organic resin substrate, or the like can be used. Furthermore, a semiconductor substrate such as a single crystal semiconductor substrate made of silicon, silicon carbide, or the like, a polycrystalline semiconductor substrate, a compound semiconductor substrate such as silicon germanium, or an SOI substrate can be used. However, when used in a display device such as that shown in FIG. 1B, it is preferable to use a light-transmitting material such as a glass substrate for the substrate 101.

[0084] In particular, it is preferable to use a substrate in which a semiconductor circuit including semiconductor elements such as transistors is formed on the semiconductor substrate or insulating substrate as the substrate 101. The semiconductor circuit preferably constitutes, for example, a pixel circuit, a gate line driving circuit (gate driver), a source line driving circuit (source driver), etc. In addition to the above, an arithmetic circuit, a memory circuit, etc. may also be configured.

[0085] [Formation of pixel electrodes 111R, 111G, 111B, 111IR, and connection electrode 111C] Next, the pixel electrodes 111R, 111G, 111B (not shown), 111IR, and connection electrode 111C are formed on the substrate 101. First, a conductive film that will become the pixel electrodes is formed, a resist mask is formed by photolithography, and unnecessary portions of the conductive film are removed by etching. Then, the resist mask is removed, thereby forming the pixel electrodes 111R, 111G, 111B, and 111IR.

[0086] When a conductive film reflective to visible light is used as each pixel electrode, it is preferable to use a material (such as silver or aluminum) with as high a reflectance as possible over the entire wavelength range of visible light, which not only increases the light extraction efficiency of the light-emitting element but also improves color reproducibility.

[0087] [Formation of Insulating Layer 131] Next, the insulating layer 131 is formed to cover the edges of the pixel electrodes 111R, 111G, 111B, and 111IR ( FIG. 3A ). An organic insulating film or an inorganic insulating film can be used as the insulating layer 131. The insulating layer 131 preferably has tapered edges to improve the step coverage of the EL film that will be formed later. In particular, when using an organic insulating film, it is preferable to use a photosensitive material, as this makes it easier to control the shape of the edges by adjusting the exposure and development conditions.

[0088] [Formation of EL Film 112Rf] Subsequently, an EL film 112Rf, which will later become the EL layer 112R, is formed on the pixel electrodes 111R, 111G, 111B, 111IR, and the insulating layer 131.

[0089] The EL film 112Rf includes a film containing at least a light-emitting compound. Alternatively, the EL film 112Rf may have a structure in which one or more of films functioning as an electron injection layer, an electron transport layer, a charge generation layer, a hole transport layer, or a hole injection layer are stacked. The EL film 112Rf can be formed by, for example, a vapor deposition method, a sputtering method, an inkjet method, or the like. However, the EL film 112Rf is not limited to these methods, and the above-described film formation methods can be used as appropriate.

[0090] As an example, the EL film 112Rf is preferably a stacked film in which a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer are stacked in this order. In this case, a film having an electron injection layer can be used as the EL layer 114 to be formed later. In particular, providing an electron transport layer to cover the light-emitting layer can prevent the light-emitting layer from being damaged in a later photolithography process, etc., thereby enabling the fabrication of a highly reliable light-emitting element. Furthermore, by using layers containing the same organic compound for the electron transport layer used in the EL film 112Rf, etc., and the electron injection layer used in the later EL layer 114, the bonding between them is improved, resulting in a light-emitting element with high light-emitting efficiency and high reliability. For example, an organic compound with electron transport properties can be used for the electron transport layer, and a material containing the organic compound and a metal can be used for the electron injection layer.

[0091] The EL film 112Rf is preferably formed so as not to be provided on the connection electrode 111C. For example, when the EL film 112Rf is formed by vapor deposition (or sputtering), it is preferably formed using a shielding mask so that the EL film 112Rf is not formed on the connection electrode 111C.

[0092] [Formation of Sacrificial Film 144a] Subsequently, a sacrificial film 144a is formed to cover the EL film 112Rf. The sacrificial film 144a is provided in contact with the upper surface of the connection electrode 111C. The sacrificial film can also be called a mask film.

[0093] The sacrificial film 144a can be a film that is highly resistant to the etching process of each EL film, such as the EL film 112Rf, i.e., a film with a large etching selectivity. The sacrificial film 144a can also be a film that has a large etching selectivity with respect to a protective film, such as the protective film 146a described below. Furthermore, the sacrificial film 144a can be a film that can be removed by wet etching, which causes little damage to each EL film.

[0094] The sacrificial film 144a may be, for example, a metal film, an alloy film, a metal oxide film, a semiconductor film, an inorganic insulating film, etc. The sacrificial film 144a may be formed by various film formation methods such as a sputtering method, a vapor deposition method, a CVD method, an ALD method, etc.

[0095] The sacrificial film 144a may be made of a metal material such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, titanium, aluminum, yttrium, zirconium, or tantalum, or an alloy material containing such a metal material. In particular, it is preferable to use a low-melting-point material such as aluminum or silver.

[0096] The sacrificial film 144a may be made of a metal oxide such as indium gallium zinc oxide (In—Ga—Zn oxide, also referred to as IGZO). Other examples include indium oxide, indium zinc oxide (In—Zn oxide), indium tin oxide (In—Sn oxide), indium titanium oxide (In—Ti oxide), indium tin zinc oxide (In—Sn—Zn oxide), indium titanium zinc oxide (In—Ti—Zn oxide), and indium gallium tin zinc oxide (In—Ga—Sn—Zn oxide). Alternatively, indium tin oxide containing silicon may be used.

[0097] The present invention can also be applied to a case where, instead of the gallium, an element M (wherein M is one or more elements selected from aluminum, silicon, boron, yttrium, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, and magnesium) is used. In particular, it is preferable that M is one or more elements selected from gallium, aluminum, and yttrium.

[0098] The sacrificial film 144a may be made of an inorganic insulating material such as aluminum oxide, hafnium oxide, or silicon oxide.

[0099] Furthermore, it is preferable to use a material for the sacrificial film 144a that can be dissolved in a solvent that is chemically stable with respect to the film located on the top of the EL film 112Rf. In particular, a material that dissolves in water or alcohol is suitable for use in the sacrificial film 144a. When forming the sacrificial film 144a, it is preferable to apply the material dissolved in a solvent such as water or alcohol using a wet film formation method, and then perform a heat treatment to evaporate the solvent. In this case, performing the heat treatment under a reduced pressure atmosphere is preferable because it allows the solvent to be removed at a low temperature and in a short time, thereby reducing thermal damage to the EL film 112Rf.

[0100] Wet film formation methods that can be used to form the sacrificial film 144a include spin coating, dipping, spray coating, inkjet, dispensing, screen printing, offset printing, doctor knife method, slit coating, roll coating, curtain coating, knife coating, etc.

[0101] The sacrificial film 144a may be made of an organic material such as polyvinyl alcohol (PVA), polyvinyl butyral, polyvinyl pyrrolidone, polyethylene glycol, polyglycerin, pullulan, water-soluble cellulose, or alcohol-soluble polyamide resin.

[0102] [Formation of Protective Film 146a] Subsequently, a protective film 146a is formed on the sacrificial film 144a (FIG. 3B).

[0103] The protective film 146a is a film that is used as a hard mask when etching the sacrificial film 144a later. Furthermore, when processing the protective film 146a later, the sacrificial film 144a is exposed. Therefore, a combination of films that have a large etching selectivity relative to each other is selected for the sacrificial film 144a and the protective film 146a. Therefore, a film that can be used for the protective film 146a can be selected depending on the etching conditions for the sacrificial film 144a and the etching conditions for the protective film 146a.

[0104] For example, when dry etching using a gas containing fluorine (also referred to as a fluorine-based gas) is used to etch the protective film 146a, silicon, silicon nitride, silicon oxide, tungsten, titanium, molybdenum, tantalum, tantalum nitride, an alloy containing molybdenum and niobium, an alloy containing molybdenum and tungsten, or the like can be used for the protective film 146a. Here, examples of films that can achieve a large etching selectivity (i.e., a slower etching rate) compared to dry etching using the fluorine-based gas include metal oxide films such as IGZO and ITO, which can be used for the sacrificial film 144a.

[0105] The protective film 146a is not limited to this, and can be selected from various materials depending on the etching conditions of the sacrificial film 144a and the protective film 146b. For example, the protective film 146a can be selected from the films that can be used for the sacrificial film 144a. For example, a metal oxide such as IGZO or ITO can be used as the protective film 146a. For example, aluminum oxide formed by ALD can be used as the sacrificial film 144a, and IGZO formed by sputtering can be used as the protective film 146b. Note that using aluminum oxide as the sacrificial film 144a is particularly preferable because it can reduce manufacturing costs. Furthermore, ALD can be used to form the sacrificial film 144a with less film formation damage to the underlying material than sputtering.

[0106] The sacrificial film 144 a may have a single layer structure or a laminated structure of two or more layers, such as a two-layer structure of an In—Ga—Zn oxide formed by sputtering and a silicon nitride film formed by sputtering, a two-layer structure of an In—Ga—Zn oxide formed by sputtering and aluminum oxide formed by ALD, or a two-layer structure of aluminum oxide formed by ALD and In—Ga—Zn oxide formed by sputtering.

[0107] Note that when the sacrificial film 144a is formed by the ALD method or the sputtering method, it may be configured to be heated. In this configuration, it is preferable that the base material (here, the EL film 112Rf) is not deteriorated, and the substrate temperature during the formation of the sacrificial film 144a may be set to a temperature of room temperature or higher and 200°C or lower, preferably 50°C or higher and 150°C or lower, more preferably 70°C or higher and 100°C or lower, typically around 80°C. By using the above configuration, it is possible to improve the adhesion between the base material and the sacrificial film 144a.

[0108] The protective film 146a may be, for example, a nitride film, such as silicon nitride, aluminum nitride, hafnium nitride, titanium nitride, tantalum nitride, tungsten nitride, gallium nitride, or germanium nitride.

[0109] Alternatively, an oxide film can be used as the protective film 146a. Typically, an oxide film or an oxynitride film such as silicon oxide, silicon oxynitride, aluminum oxide, aluminum oxynitride, hafnium oxide, or hafnium oxynitride can be used.

[0110] Alternatively, the protective film 146a may be an organic film that can be used for the EL film 112Rf, etc. For example, the same organic film as that used for the EL film 112Rf, EL film 112Gf, or EL film 112Bf may be used for the protective film 146a. Using such an organic film is preferable because it allows the same film-forming equipment to be used for the EL film 112Rf, etc.

[0111] [Formation of Resist Mask 143a] Subsequently, resist masks 143a are formed on the protective film 146a at positions overlapping the pixel electrode 111R and the connection electrode 111C (FIG. 3C).

[0112] The resist mask 143a can be made of a resist material containing a photosensitive resin, such as a positive resist material or a negative resist material.

[0113] Here, if the resist mask 143a is formed on the sacrificial film 144a without the protective film 146a, there is a risk that the EL film 112Rf will be dissolved by the solvent of the resist material if there are defects such as pinholes in the sacrificial film 144a. By using the protective film 146a, it is possible to prevent such problems from occurring.

[0114] When the sacrificial film 144a is made of a film that is less likely to have defects such as pinholes, the resist mask 143a may be formed directly on the sacrificial film 144a without using the protective film 146a.

[0115] [Etching of Protective Film 146a] Subsequently, a portion of the protective film 146a that is not covered by the resist mask 143a is removed by etching to form a strip-shaped protective layer 147a. At the same time, the protective layer 147a is also formed on the connection electrode 111C.

[0116] When etching the protective film 146a, it is preferable to use etching conditions with a high selectivity so that the sacrificial film 144a is not removed by the etching. The protective film 146a can be etched by wet etching or dry etching, but using dry etching can prevent the pattern of the protective film 146a from shrinking.

[0117] [Removal of Resist Mask 143a] Subsequently, the resist mask 143a is removed (FIG. 3D).

[0118] The resist mask 143a can be removed by wet etching or dry etching. In particular, the resist mask 143a is preferably removed by dry etching (also called plasma ashing) using oxygen gas as an etching gas.

[0119] At this time, the resist mask 143a is removed in a state in which the EL film 112Rf is covered with the sacrificial film 144a, so that the influence on the EL film 112Rf is suppressed. In particular, if the EL film 112Rf comes into contact with oxygen, it may have an adverse effect on the electrical characteristics, so this is suitable for performing etching using oxygen gas, such as plasma ashing.

[0120] [Etching of Sacrificial Film 144a] Next, using the protective layer 147a as a mask, a portion of the sacrificial film 144a that is not covered by the protective layer 147a is removed by etching to form a strip-shaped sacrificial layer 145a (FIG. 3E). At the same time, the sacrificial layer 145a is also formed on the connection electrode 111C. The sacrificial layer can also be called a mask layer.

[0121] The sacrificial film 144a can be etched by wet etching or dry etching, but dry etching is preferable because it can prevent the pattern from shrinking.

[0122] [Etching of EL film 112Rf and protective layer 147a] Next, the protective layer 147a is etched, and at the same time, a portion of the EL film 112Rf that is not covered by the sacrificial layer 145a is removed by etching to form a strip-shaped EL layer 112R (FIG. 3F). At this time, the protective layer 147a on the connection electrode 111C is also removed.

[0123] By etching the EL film 112Rf and the protective layer 147a in the same process, the process can be simplified and the manufacturing cost of the display device can be reduced, which is preferable.

[0124] In particular, it is preferable to use dry etching using an etching gas that does not contain oxygen as a main component for etching the EL film 112Rf. This makes it possible to suppress the deterioration of the EL film 112Rf and realize a highly reliable display device. Examples of etching gases that do not contain oxygen as a main component include CF ４ , C ４ F ８ , SF ６ , CHF ３ , Cl ２ , H ２ O, BCl ３ , H ２ Alternatively, a noble gas such as He may be used. A mixed gas of the above gas and a dilution gas that does not contain oxygen may be used as the etching gas.

[0125] The EL film 112Rf and the protective layer 147a may be etched separately. In this case, the EL film 112Rf may be etched first, or the protective layer 147a may be etched first.

[0126] At this point, the EL layer 112R and the connection electrode 111C are covered with the sacrificial layer 145a.

[0127] [Formation of EL film 112Gf] Next, the EL film 112Gf, which will later become the EL layer 112G, is formed on the sacrificial layer 145a, the insulating layer 131, the pixel electrode 111G, the pixel electrode 111B, and the pixel electrode 111IR. At this time, similar to the EL film 112Rf, it is preferable not to provide the EL film 112Gf on the connection electrode 111C.

[0128] The above description of the EL film 112Rf can be used to describe the method of forming the EL film 112Gf.

[0129] [Formation of Sacrificial Film 144b] Next, the sacrificial film 144b is formed on the EL film 112Gf. The sacrificial film 144b can be formed by the same method as the sacrificial film 144a. In particular, it is preferable to use the same material for the sacrificial film 144b as for the sacrificial film 144a.

[0130] At the same time, a sacrificial film 144a is formed on the connection electrode 111C, covering the sacrificial layer 145a.

[0131] [Formation of Protective Film 146b] Next, the protective film 146b is formed on the sacrificial film 144b. The protective film 146b can be formed by the same method as the protective film 146a. In particular, it is preferable that the protective film 146b is made of the same material as the protective film 146a.

[0132] [Formation of Resist Mask 143b] Subsequently, a resist mask 143b is formed on the protective film 146b in an area overlapping the pixel electrode 111G and an area overlapping the connection electrode 111C (FIG. 4A).

[0133] The resist mask 143b can be formed in the same manner as the resist mask 143a.

[0134] [Etching of Protective Film 146b] Subsequently, a portion of the protective film 146b that is not covered by the resist mask 143b is removed by etching to form a strip-shaped protective layer 147b (FIG. 4B). At the same time, the protective layer 147b is also formed on the connection electrode 111C.

[0135] The above description of the protective film 146a can be applied to the etching of the protective film 146b.

[0136] [Removal of Resist Mask 143b] Next, the resist mask 143b is removed. The above description of the resist mask 143a can be applied to the removal of the resist mask 143b.

[0137] [Etching of Sacrificial Film 144b] Next, using the protective layer 147b as a mask, a portion of the sacrificial film 144b that is not covered by the protective layer 147b is removed by etching to form a strip-shaped sacrificial layer 145b. At the same time, a sacrificial layer 145b is also formed on the connection electrode 111C. A sacrificial layer 145a and a sacrificial layer 145b are stacked on the connection electrode 111C.

[0138] The above description of the sacrificial film 144a can be applied to the etching of the sacrificial film 144b.

[0139] [Etching of EL film 112Gf and protective layer 147b] Next, the protective layer 147b is etched, and at the same time, a portion of the EL film 112Gf that is not covered by the sacrificial layer 145b is removed by etching to form a strip-shaped EL layer 112G (FIG. 4C). At this time, the protective layer 147b on the connection electrode 111C is also removed.

[0140] The above description of the EL film 112Rf and the protective layer 147a can be applied to the etching of the EL film 112Gf and the protective layer 147b.

[0141] At this time, since the EL layer 112R is protected by the sacrificial layer 145a, it is possible to prevent the EL layer 112R from being damaged in the etching process of the EL film 112Gf.

[0142] In this way, the strip-shaped EL layers 112R and 112G can be formed with high positional accuracy. The distance between the strip-shaped EL layers 112R and 112G can be narrowed to 6 μm or less, 4 μm or less, 3 μm or less, 2 μm or less, or even 1 μm or less. Furthermore, by using an exposure tool for LSIs, for example, the distance can be narrowed to 500 nm or less, 200 nm or less, 100 nm or less, or even 50 nm or less.

[0143] [Formation of EL layer 112B and EL layer 112IR] By performing the above steps on the EL film 112Bf (not shown), an island-shaped EL layer 112B (not shown) and an island-shaped sacrificial layer 145c (not shown) can be formed.

[0144] Furthermore, by performing the same process on the EL film 112IRf (not shown), an island-shaped EL layer 112IR and an island-shaped sacrificial layer 145d can be formed (FIG. 4D).

[0145] The EL layer 112IR is formed as follows. After the EL layer 112B is formed, the EL film 112IRf, sacrificial film 144d, protective film 146d, and resist mask 143d (none of which are shown) are formed in this order. Next, the protective film 146d is etched to form a protective layer 147d (not shown), and then the resist mask 143d is removed. Next, the sacrificial film 144d is etched to form a sacrificial layer 145d. After that, the protective layer 147d and the EL film 112IRf are etched to form the strip-shaped EL layer 112IR. The EL layer 112B can also be formed using the same process as the EL layer 112IR.

[0146] After the EL layer 112B is formed, a sacrificial layer 145c is also formed on the connection electrode 111C at the same time, and after the EL layer 112IR is formed, a sacrificial layer 145d is formed on the EL layer 112IR. In other words, the sacrificial layers 145a, 145b, 145c, and 145d are stacked on the connection electrode 111C.

[0147] [Removal of Sacrificial Layers] Next, the sacrificial layers 145a, 145b, 145c, and 145d are removed to expose the upper surfaces of the EL layers 112R, 112G, 112B, and 112IR ( FIG. 4E ). At the same time, the upper surface of the connection electrode 111C is also exposed.

[0148] The sacrificial layers 145a, 145b, 145c, and 145d can be removed by wet etching or dry etching. At this time, it is preferable to use a method that causes as little damage as possible to the EL layers 112R, 112G, 112B, and 112IR. In particular, it is preferable to use a wet etching method. For example, it is preferable to use wet etching using a tetramethylammonium hydroxide (TMAH) aqueous solution, dilute hydrofluoric acid, oxalic acid, phosphoric acid, acetic acid, nitric acid, or a mixture thereof.

[0149] Alternatively, the sacrificial layers 145a, 145b, 145c, and 145d are preferably removed by dissolving them in a solvent such as water or alcohol. Here, various alcohols such as ethyl alcohol, methyl alcohol, isopropyl alcohol (IPA), or glycerin can be used as the alcohol that can dissolve the sacrificial layers 145a, 145b, 145c, and 145d.

[0150] After removing the sacrificial layers 145a, 145b, 145c, and 145d, it is preferable to perform drying treatment to remove water contained inside the EL layers 112R, 112G, 112B, and 112IR and water adsorbed to their surfaces. For example, it is preferable to perform heat treatment in an inert gas atmosphere or a reduced-pressure atmosphere. The heat treatment can be performed at a substrate temperature of 50°C or higher and 200°C or lower, preferably 60°C or higher and 150°C or lower, and more preferably 70°C or higher and 120°C or lower. A reduced-pressure atmosphere is preferable because it enables drying at a lower temperature.

[0151] In this manner, the EL layer 112R, the EL layer 112G, the EL layer 112B, and the EL layer 112IR can be separately produced.

[0152] [Formation of EL Layer 114] Subsequently, the EL layer 114 is formed to cover the EL layer 112R, the EL layer 112G, the EL layer 112B, and the EL layer 112IR.

[0153] The EL layer 114 can be formed by the same method as the EL film 112Rf, etc. When the EL layer 114 is formed by evaporation, it is preferable to form the EL layer 114 using a shielding mask so that the EL layer 114 is not formed on the connection electrode 111C.

[0154] [Formation of Common Electrode 113] Subsequently, the common electrode 113 is formed to cover the EL layer 114 and the connection electrode 111C (FIG. 4F).

[0155] The common electrode 113 can be formed by a film formation method such as evaporation or sputtering. Alternatively, a film formed by evaporation and a film formed by sputtering may be stacked. In this case, the common electrode 113 is preferably formed so as to encompass the region where the EL layer 114 is formed. That is, the edge of the EL layer 114 can overlap with the common electrode 113. The common electrode 113 is preferably formed using a shielding mask.

[0156] The common electrode 113 is electrically connected to the connection electrode 111C outside the display area.

[0157] [Formation of Protective Layer] Next, the protective layer 121 is formed on the common electrode 113. The inorganic insulating film used for the protective layer 121 is preferably formed by sputtering, PECVD, or ALD. The ALD method is particularly preferred because it has excellent step coverage and is less likely to cause defects such as pinholes. The inkjet method is also preferred for forming the organic insulating film because it can form a uniform film in the desired area.

[0158] In this manner, the display section 100 shown in FIGS. 2A to 2D can be manufactured.

[0159] In the above description, the common electrode 113 and the EL layer 114 are formed to have different top surface shapes, but they may be formed in the same region.

[0160] 5A shows a schematic cross-sectional view of the structure after the sacrificial layer is removed. Subsequently, as shown in FIG. 5B, the EL layer 114 and the common electrode 113 are formed using the same mask or without a mask. This reduces manufacturing costs compared to when different masks are used.

[0161] 5B , the connection portion 130 has a configuration in which the EL layer 114 is sandwiched between the connection electrode 111C and the common electrode 113. In this case, it is preferable to use a material with as low an electrical resistance as possible for the EL layer 114. Alternatively, it is preferable to form the EL layer 114 as thin as possible to reduce the electrical resistance in the thickness direction of the EL layer 114. For example, by using an electron-injecting or hole-injecting material with a thickness of 1 nm to 5 nm, preferably 1 nm to 3 nm, for the EL layer 114, it may be possible to reduce the electrical resistance between the connection electrode 111C and the common electrode 113 to a negligible level.

[0162] 5C, a protective layer 121 is formed. At this time, as shown in Fig. 5C, it is preferable that the protective layer 121 is provided so as to cover the end portion of the common electrode 113 and the end portion of the EL layer 114. This makes it possible to effectively prevent impurities such as water or oxygen from diffusing from the outside into the EL layer 114 and into the interface between the EL layer 114 and the common electrode 113.

[0163] This completes the description of the example of the method for manufacturing the display device.

[0164] [Configuration Example 2 of Display Unit] The following describes a configuration example of the display unit that is partially different from the above-described configuration example 1. In the following, descriptions of parts that overlap with the above-described configuration example may be omitted.

[0165] A display section 100A shown in FIGS. 6A to 6D differs from the display section 100 described above mainly in that the shapes of the EL layer 114 and the common electrode 113 are different.

[0166] 6C , in the cross section in the Y direction, the EL layer 112R, the EL layer 114, and the common electrode 113 are separated between the two light-emitting elements 110R. In other words, the EL layer 112R, the EL layer 114, and the common electrode 113 have ends in the portions that overlap with the insulating layer 131.

[0167] The protective layer 121 is provided to cover the side surfaces of the EL layer 112R, the EL layer 114, and the common electrode 113 in the region where it overlaps with the insulating layer 131.

[0168] 6C , a recess may be formed in a part of the upper surface of the insulating layer 131. In this case, it is preferable that the protective layer 121 is provided in contact with the surface of the recess of the insulating layer 131. This is preferable because it increases the contact area between the insulating layer 131 and the protective layer 121 and improves the adhesion therebetween.

[0169] In Fig. 6A, the outlines of the common electrode 113 and the EL layer 114 are indicated by dashed lines. As shown in Fig. 6A, the common electrode 113 and the EL layer 114 each have a strip-like shape on the top surface, with the longitudinal direction parallel to the X direction. On the other hand, as shown in Fig. 6B and Fig. 6C, the EL layer 112R has an island-like shape.

[0170] Although not shown here, the light emitting elements 110G, 110B, and 110IR can also have a similar configuration.

[0171] [Fabrication Method Example 2] An example of a fabrication method for the display unit 100A will be described below. Note that, in the following, parts that overlap with Fabrication Method Example 1 will be referred to and will not be described again. The fabrication method example exemplified here differs from Fabrication Method Example 1 in the steps subsequent to the step of forming the common electrode 113.

[0172] 7A to 7D are schematic cross-sectional views illustrating the steps described below, in which a cross section corresponding to dashed dotted line B3-B4 and a cross section corresponding to dashed dotted line C3-C4 in FIG.

[0173] Similar to the above-described Example 1 of Fabrication Method, steps are carried out in order up to the formation of the common electrode 113 (FIG. 7A).

[0174] Next, a plurality of resist masks 143e are formed on the common electrode 113. The resist masks 143e are formed so as to have a strip-like upper surface extending in the X direction. The resist masks 143e overlap the pixel electrodes 111R. In addition, ends of the resist masks 143e are provided on the insulating layer 131.

[0175] Next, the portions of the common electrode 113, the EL layer 114, the EL layer 112R, the EL layer 112G (not shown), the EL layer 112B (not shown), and the EL layer 112IR (not shown) that are not covered by the resist mask 143e are removed by etching ( FIG. 7C ). As a result, the common electrode 113 and the EL layer 114, which had been provided continuously and covering all the pixel electrodes, are divided by forming slits by the etching, and a plurality of strip-shaped common electrodes 113 and EL layers 114 are formed.

[0176] The etching is preferably performed by dry etching. For example, it is preferable to sequentially etch the common electrode 113, the EL layer 114, the EL layer 112R, and the like by switching the etching gas without exposing them to the air. Furthermore, it is preferable to use a gas that does not contain oxygen as a main component as the etching gas.

[0177] When etching the common electrode 113, the EL layer 114, the EL layer 112R, etc., a part of the insulating layer 131 may be etched, and as shown in Fig. 7C, a recess may be formed in the upper part of the insulating layer 131. Alternatively, a part of the insulating layer 131 that is not covered by the resist mask 143e may be etched, and the insulating layer 131 may be divided into two parts.

[0178] Next, the resist mask 143e is removed by wet etching or dry etching.

[0179] Next, the protective layer 121 is formed (FIG. 7D). The protective layer 121 is provided so as to cover the side surfaces of the common electrode 113, the EL layer 114, and the EL layer 112R. The protective layer 121 is preferably provided in contact with the upper surface of the insulating layer 131.

[0180] 7E , a void (also referred to as a gap or space) 122 may be formed above the insulating layer 131 during the formation of the protective layer 121. The void 122 may be under reduced pressure or atmospheric pressure. The void 122 may also contain a gas such as air, nitrogen, or a noble gas, or a deposition gas used to deposit the protective layer 121.

[0181] This concludes the description of the exemplary method for producing the display unit 100A.

[0182] Note that although the resist mask 143e is formed directly on the common electrode 113 here, a film functioning as a hard mask may be provided on the common electrode 113. At this time, a hard mask is formed using the resist mask 143e as a mask, and after the resist mask is removed, the common electrode 113, the EL layer 114, the EL layer 112R, and the like can be etched using the hard mask as a mask. At this time, the hard mask may be removed or may be left.

[0183] [Modification] The following describes an example in which the configuration is partially different from that described above. Note that the same parts as those described above will be used hereinafter, and the description will be omitted.

[0184] 8A and 8B are schematic cross-sectional views of a display unit 100B. The top view of the display unit 100B is the same as that of FIG. 2A. FIG. 8A corresponds to a cross section in the X direction, and FIG. 8B corresponds to a cross section in the Y direction.

[0185] The display section 100B differs from the display section 100 in that it does not have the EL layer 114, which is a common layer.

[0186] The common electrode 113 is provided in contact with the upper surfaces of the EL layer 112R, the EL layer 112G, the EL layer 112B, and the EL layer 112IR. By not providing the EL layer 114, the light-emitting element 110R, the light-emitting element 110G, the light-emitting element 110B, and the light-emitting element 110IR can have completely different stacked structures, which increases the number of material options and increases the degree of freedom in design.

[0187] 8C is an example in which, like the display unit 100A, slits extending in the X direction are formed in the area of ​​the common electrode 113 that overlaps with the insulating layer 131. In the display unit 100C, the protective layer 121 is provided in contact with the side surfaces of the common electrode 113, the side surfaces of the EL layer 112R, and the upper surface of the insulating layer 131.

[0188] [Modification 2] A display section 100D shown in Figs. 9A and 9B differs from the display section 100 described above mainly in that the configuration of the light-emitting elements is different.

[0189] The light-emitting element 110R has an optical adjustment layer 115R between the pixel electrode 111R and the EL layer 112R. The light-emitting element 110G has an optical adjustment layer 115G between the pixel electrode 111G and the EL layer 112G. The light-emitting element 110B has an optical adjustment layer 115B between the pixel electrode 111B and the EL layer 112B. The light-emitting element 110IR has an optical adjustment layer 115IR between the pixel electrode 111IR and the EL layer 112IR.

[0190] Furthermore, optical adjustment layer 115R, optical adjustment layer 115G, optical adjustment layer 115B, and optical adjustment layer 115IR are each translucent to visible light. Optical adjustment layer 115R, optical adjustment layer 115G, optical adjustment layer 115B, and optical adjustment layer 115IR have different thicknesses. This allows the optical path length to be different for each light-emitting element.

[0191] Here, a conductive film that is reflective to visible light is used for the pixel electrodes 111R, 111G, 111B, and 111IR, and a conductive film that is reflective and transparent to visible light and infrared light is used for the common electrode 113. This allows each light-emitting element to have a so-called microcavity structure (a microresonator structure), which intensifies light of a specific wavelength. This makes it possible to realize a display device with improved color purity.

[0192] Each optical adjustment layer can be made of a conductive material that is translucent to visible light or infrared light, such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide containing gallium, indium tin oxide containing silicon, or indium zinc oxide containing silicon.

[0193] Each optical adjustment layer can be formed after forming the pixel electrodes 111R, 111G, 111B, and 111IR, and before forming the EL film 112Rf, etc. Each optical adjustment layer may use a conductive film having a different thickness, or may have a single-layer structure, a two-layer structure, a three-layer structure, etc., in order from thinnest to thinnest.

[0194] 9C shows a cross section of two light-emitting elements 110G arranged side by side in the Y direction.

[0195] [Modification 3] A display unit 100F shown in Figs. 10A and 10B differs from the display unit 100D described above mainly in that it does not have an optical adjustment layer.

[0196] The display unit 100F is an example in which a microcavity structure is realized by the thicknesses of the EL layers 112R, 112G, 112B, and 112IR. With this configuration, there is no need to provide a separate optical adjustment layer, which simplifies the manufacturing process.

[0197] For example, in the display unit 100F, the EL layer 112IR of the light-emitting element 110IR that emits light with the longest wavelength is the thickest, and the EL layer 112B of the light-emitting element 110B that emits light with the shortest wavelength is the thinnest. However, the thickness of each EL layer can be adjusted in consideration of the wavelength of light emitted by each light-emitting element, the optical characteristics of the layers that make up the light-emitting element, the electrical characteristics of the light-emitting element, and the like.

[0198] 10C shows a cross section of two light-emitting elements 110G arranged side by side in the Y direction.

[0199] The above is a description of the modified example.

[0200] Although the EL layer 114 is used in the above-described modified examples 2 and 3, the EL layer 114 may not be provided.

[0201] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be combined as appropriate with other configuration examples or drawings.

[0202] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0203] Embodiment 2 In this embodiment, a structural example of a display device according to one embodiment of the present invention will be described.

[0204] [Display Device 400A] FIG. 11 shows a perspective view of the display device 400A, and FIG. 12A shows a cross-sectional view of the display device 400A.

[0205] The display device 400A has a structure in which a substrate 452 and a substrate 451 are attached to each other. In Fig. 11 , the substrate 452 is clearly indicated by a dashed line. The display device described in this embodiment can be used for the display portion 100 shown in Figs. 1A to 1C , and the substrate 451 corresponds to the substrate 101 of the display portion 100, and the substrate 452 corresponds to the substrate 102 of the display portion 100.

[0206] The display device 400A includes a display portion 462, a circuit 464, wiring 465, and the like. Fig. 11 shows an example in which an IC 473 and an FPC 472 are mounted on the display device 400A. Therefore, the configuration shown in Fig. 11 can also be considered as a display module including the display device 400A, an IC (integrated circuit), and an FPC.

[0207] The circuit 464 can be, for example, a scanning line driver circuit.

[0208] The wiring 465 has a function of supplying signals and power to the display portion 462 and the circuit 464. The signals and power are input to the wiring 465 from the outside via the FPC 472 or input to the wiring 465 from the IC 473.

[0209] 11 shows an example in which an IC 473 is provided on a substrate 451 by a chip-on-glass (COG) method, a chip-on-film (COF) method, or the like. The IC 473 can be, for example, an IC having a scanning line driver circuit or a signal line driver circuit. The display device 400A and the display module may not include an IC. Alternatively, the IC may be mounted on an FPC by a COF method or the like.

[0210] 11A shows an enlarged view of pixels formed in the display portion 462. The pixels formed in the display portion 462 include light-emitting elements 430a, 430b, 430c, and 430d that emit light of different colors. Here, the light-emitting element 430a has a function of emitting red light, the light-emitting element 430b has a function of emitting green light, the light-emitting element 430c has a function of emitting blue light, and the light-emitting element 430d has a function of emitting infrared light. The light-emitting elements described in Embodiment 1 can be applied to the light-emitting elements 430a, 430b, 430c, and 430d.

[0211] The types of colors emitted by the light-emitting elements are not limited to those described above. When a pixel of a display device has three types of subpixels other than the infrared subpixel, the three subpixels may be subpixels of three colors: yellow (Y), cyan (C), and magenta (M). When a pixel of a display device has four subpixels other than the infrared subpixel, the four subpixels may be subpixels of four colors: R, G, B, and white (W), or subpixels of four colors: R, G, B, and Y.

[0212] 11A, the light-emitting elements 430a to 430d may be arranged in a stripe array in which the light-emitting elements are arranged in a horizontal line. The stripe array allows pixel circuits to be arranged at high density, and therefore a high-definition display device can be provided.

[0213] 11B, the light-emitting elements 430a to 430d may be arranged in a 2x2 matrix. Alternatively, the light-emitting elements 430a to 430d may be arranged such that the light-emitting elements 430a, 430b, and 430c are arranged in a horizontal line, and the horizontally elongated light-emitting element 430d is arranged below them, as shown in FIG. 11B. Although not shown, various arrangement methods such as a delta arrangement or a pentile arrangement may be applied.

[0214] FIG. 12A shows an example of a cross section of the display device 400A, in which a part of a region including the FPC 472, a part of the circuit 464, a part of the display portion 462, and a part of a region including an end portion are cut away.

[0215] 12A includes a transistor 201, a transistor 205, a light-emitting element 430a that emits red light, a light-emitting element 430b that emits green light, a light-emitting element 430c that emits blue light (not shown), a light-emitting element 430d that emits infrared light, and the like, between a substrate 451 and a substrate 452. Note that although the light-emitting element 430c is omitted in FIGS. 12A and 12B for clarity of the drawings, the light-emitting element 430c can also be provided in the same manner as the light-emitting element 430a, the light-emitting element 430b, and the light-emitting element 430d.

[0216] The protective layer 416 and the substrate 452 are bonded via an adhesive layer 442. A solid sealing structure, a hollow sealing structure, or the like can be applied to seal the light-emitting element. In FIG. 12A , a space 443 surrounded by the substrate 452, the adhesive layer 442, and the substrate 451 is filled with an inert gas (such as nitrogen or argon), and a hollow sealing structure is applied. The adhesive layer 442 may be provided so as to overlap the light-emitting element. Furthermore, the space 443 surrounded by the substrate 452, the adhesive layer 442, and the substrate 451 may be filled with a resin different from the adhesive layer 442.

[0217] The light-emitting elements 430a, 430b, 430c, and 430d each have an optical adjustment layer between the pixel electrode and the EL layer. The light-emitting element 430a has an optical adjustment layer 426a, the light-emitting element 430b has an optical adjustment layer 426b, the light-emitting element 430c has an optical adjustment layer 426c (not shown), and the light-emitting element 430d has an optical adjustment layer 426d. For details of the light-emitting elements, refer to Embodiment 1.

[0218] The pixel electrodes 411 a , 411 b , 411 c (not shown), and 411 d are connected to the conductive layer 222 b of the transistor 205 through openings provided in the insulating layer 214 .

[0219] The pixel electrodes and the edges of the optical adjustment layer are covered with an insulating layer 421. The pixel electrodes contain a material that reflects visible light, and the counter electrode contains a material that transmits visible light and infrared light.

[0220] Light emitted from the light-emitting element is emitted toward the substrate 452. The substrate 452 is preferably made of a material that is highly transparent to visible light and infrared light.

[0221] The transistor 201 and the transistor 205 are both formed over a substrate 451. These transistors can be manufactured using the same material and through the same process.

[0222] An insulating layer 211, an insulating layer 213, an insulating layer 215, and an insulating layer 214 are provided over the substrate 451 in this order. A part of the insulating layer 211 functions as a gate insulating layer of each transistor. A part of the insulating layer 213 functions as a gate insulating layer of each transistor. The insulating layer 215 is provided to cover the transistor. The insulating layer 214 is provided to cover the transistor and functions as a planarization layer. Note that the number of gate insulating layers and the number of insulating layers covering the transistors are not limited, and each may be a single layer or two or more layers.

[0223] At least one insulating layer covering the transistor is preferably made of a material that is resistant to the diffusion of impurities such as water and hydrogen. This allows the insulating layer to function as a barrier layer. With this structure, it is possible to effectively prevent impurities from diffusing into the transistor from the outside, thereby improving the reliability of the display device.

[0224] It is preferable to use an inorganic insulating film for each of the insulating layers 211, 213, and 215. Examples of the inorganic insulating film that can be used include a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a silicon nitride oxide film, an aluminum oxide film, and an aluminum nitride film. Alternatively, a hafnium oxide film, an yttrium oxide film, a zirconium oxide film, a gallium oxide film, a tantalum oxide film, a magnesium oxide film, a lanthanum oxide film, a cerium oxide film, and a neodymium oxide film may also be used. Two or more of the above insulating films may be stacked.

[0225] Here, organic insulating films often have lower barrier properties than inorganic insulating films. Therefore, it is preferable that the organic insulating film has an opening near the edge of the display device 400A. This makes it possible to prevent impurities from entering from the edge of the display device 400A through the organic insulating film. Alternatively, the organic insulating film may be formed so that the edge of the organic insulating film is located inside the edge of the display device 400A, so that the organic insulating film is not exposed at the edge of the display device 400A.

[0226] An organic insulating film is suitable for the insulating layer 214 that functions as a planarizing layer. Materials that can be used for the organic insulating film include acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins.

[0227] 12A , an opening is formed in insulating layer 214. This makes it possible to prevent impurities from entering display unit 462 from the outside through insulating layer 214, even when an organic insulating film is used for insulating layer 214. This makes it possible to improve the reliability of display device 400A.

[0228] The transistor 201 and the transistor 205 each include a conductive layer 221 that functions as a gate, an insulating layer 211 that functions as a gate insulating layer, conductive layers 222a and 222b that function as a source and a drain, a semiconductor layer 231, an insulating layer 213 that functions as a gate insulating layer, and a conductive layer 223 that functions as a gate. Here, the same hatching pattern is applied to multiple layers obtained by processing the same conductive film. The insulating layer 211 is located between the conductive layer 221 and the semiconductor layer 231. The insulating layer 213 is located between the conductive layer 223 and the semiconductor layer 231.

[0229] The structure of the transistor included in the display device of this embodiment is not particularly limited. For example, a planar transistor, a staggered transistor, an inverted staggered transistor, or the like can be used. Furthermore, either a top-gate transistor or a bottom-gate transistor structure may be used. Alternatively, gates may be provided above and below a semiconductor layer in which a channel is formed.

[0230] The transistor 201 and the transistor 205 have a structure in which a semiconductor layer in which a channel is formed is sandwiched between two gates. The two gates may be connected and the same signal may be supplied to drive the transistor. Alternatively, the threshold voltage of the transistor may be controlled by applying a potential for controlling the threshold voltage to one of the two gates and a potential for driving to the other.

[0231] The crystallinity of a semiconductor material used for a transistor is not particularly limited, and any of an amorphous semiconductor, a single-crystal semiconductor, and a semiconductor having crystallinity other than single crystal (a microcrystalline semiconductor, a polycrystalline semiconductor, or a semiconductor having a crystalline region in part) may be used. The use of a single-crystal semiconductor or a crystalline semiconductor is preferable because it can suppress deterioration of transistor characteristics.

[0232] The semiconductor layer of the transistor preferably contains metal oxide (also referred to as an oxide semiconductor). That is, the display device of this embodiment preferably uses a transistor in which a channel formation region is formed using metal oxide (hereinafter referred to as an OS transistor). Alternatively, the semiconductor layer of the transistor may contain silicon. Examples of silicon include amorphous silicon and crystalline silicon (such as low-temperature polysilicon and single-crystal silicon).

[0233] The semiconductor layer preferably contains, for example, indium, M (wherein M is one or more elements selected from gallium, aluminum, silicon, boron, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, and magnesium), and zinc. In particular, M is preferably one or more elements selected from aluminum, gallium, yttrium, and tin.

[0234] In particular, it is preferable to use an oxide containing indium (In), gallium (Ga), and zinc (Zn) (also referred to as IGZO) as the semiconductor layer.

[0235] When the semiconductor layer is an In-M-Zn oxide, the atomic ratio of In in the In-M-Zn oxide is preferably equal to or greater than the atomic ratio of M. Examples of atomic ratios of metal elements in such In-M-Zn oxides include a composition in which In:M:Zn=1:1:1 or thereabouts, a composition in which In:M:Zn=1:1:1.2 or thereabouts, a composition in which In:M:Zn=2:1:3 or thereabouts, a composition in which In:M:Zn=3:1:2 or thereabouts, a composition in which In:M:Zn=4:2:3 or thereabouts, a composition in which In:M:Zn=4:2:4.1 or thereabouts, a composition in which In:M:Zn=5:1:3 or thereabouts, a composition in which In:M:Zn=5:1:6 or thereabouts, a composition in which In:M:Zn=5:1:7 or thereabouts, a composition in which In:M:Zn=5:1:8 or thereabouts, a composition in which In:M:Zn=6:1:6 or thereabouts, and a composition in which In:M:Zn=5:2:5 or thereabouts. The term "nearby composition" includes a range of ±30% of the desired atomic ratio.

[0236] For example, when describing a composition having an atomic ratio of In:Ga:Zn=4:2:3 or thereabout, this includes a case where, when the atomic ratio of In is 4, the atomic ratio of Ga is 1 or more and 3 or less, and the atomic ratio of Zn is 2 or more and 4 or less. Furthermore, when describing a composition having an atomic ratio of In:Ga:Zn=5:1:6 or thereabout, this includes a case where, when the atomic ratio of In is 5, the atomic ratio of Ga is more than 0.1 and 2 or less, and the atomic ratio of Zn is 5 or more and 7 or less. Furthermore, when describing a composition having an atomic ratio of In:Ga:Zn=1:1:1 or thereabout, this includes a case where, when the atomic ratio of In is 1, the atomic ratio of Ga is more than 0.1 and 2 or less, and the atomic ratio of Zn is more than 0.1 and 2 or less.

[0237] The transistors included in the circuit 464 may have the same structure as or different from the transistors included in the display portion 462. The transistors included in the circuit 464 may all have the same structure or may have two or more types of structures. Similarly, the transistors included in the display portion 462 may all have the same structure or may have two or more types of structures.

[0238] A connection portion 204 is provided in a region of the substrate 451 where the substrate 452 does not overlap. In the connection portion 204, a wiring 465 is electrically connected to an FPC 472 via a conductive layer 466 and a connection layer 242. The conductive layer 466 has an example of a stacked structure of a conductive film obtained by processing the same conductive film as the pixel electrode and a conductive film obtained by processing the same conductive film as the optical adjustment layer. The conductive layer 466 is exposed on the top surface of the connection portion 204. This allows the connection portion 204 and the FPC 472 to be electrically connected via the connection layer 242.

[0239] It is preferable to provide a light-shielding layer 417 on the surface of substrate 452 facing substrate 451. In addition, various optical members can be arranged on the outside of substrate 452. Examples of optical members include a polarizing plate, a retardation plate, a light diffusion layer (such as a diffusion film), an anti-reflection layer, and a light-collecting film. In addition, an antistatic film that suppresses the adhesion of dust, a water-repellent film that makes it difficult for dirt to adhere, a hard coat film that suppresses the occurrence of scratches during use, an impact absorbing layer, etc. may be arranged on the outside of substrate 452.

[0240] By providing the protective layer 416 that covers the light-emitting element, impurities such as water can be prevented from entering the light-emitting element, and the reliability of the light-emitting element can be improved.

[0241] In a region 228 near the edge of the display device 400A, it is preferable that the insulating layer 215 and the protective layer 416 contact each other through the opening in the insulating layer 214. In particular, it is preferable that the inorganic insulating film of the insulating layer 215 and the inorganic insulating film of the protective layer 416 contact each other. This makes it possible to prevent impurities from entering the display unit 462 from the outside via the organic insulating film. Therefore, it is possible to improve the reliability of the display device 400A.

[0242] 12B shows an example of a three-layer structure of the protective layer 416. In Fig. 12B, the protective layer 416 has an inorganic insulating layer 416a on the light-emitting element 430d, an organic insulating layer 416b on the inorganic insulating layer 416a, and an inorganic insulating layer 416c on the organic insulating layer 416b.

[0243] The ends of inorganic insulating layer 416a and inorganic insulating layer 416c extend outward beyond the ends of organic insulating layer 416b and are in contact with each other. Inorganic insulating layer 416a is in contact with insulating layer 215 (inorganic insulating layer) through an opening in insulating layer 214 (organic insulating layer). This allows the insulating layer 215 and protective layer 416 to surround the light-emitting element, thereby improving the reliability of the light-emitting element.

[0244] In this way, the protective layer 416 may have a laminated structure of an organic insulating film and an inorganic insulating film. In this case, it is preferable that the end of the inorganic insulating film extends further outward than the end of the organic insulating film.

[0245] The substrate 451 and the substrate 452 can each be made of glass, quartz, ceramic, sapphire, resin, metal, alloy, semiconductor, or the like. A light-transmitting material is used for the substrate on the side from which light from the light-emitting element is extracted. For example, when used in the display portion 100 shown in FIG. 1A , the substrate 452 preferably transmits visible light and infrared light. For example, when used in the display portion 100 shown in FIGS. 1B and 1C , the substrate 452 preferably transmits visible light and infrared light, and the substrate 451 preferably transmits at least infrared light. Using flexible materials for the substrates 451 and 452 can increase the flexibility of the display device. A polarizing plate may be used as the substrate 451 or 452.

[0246] The substrates 451 and 452 can be made of polyester resins such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyacrylonitrile resin, acrylic resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin (nylon, aramid, etc.), polysiloxane resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyurethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, polytetrafluoroethylene (PTFE) resin, ABS resin, cellulose nanofiber, etc. One or both of the substrates 451 and 452 may be made of glass having a thickness sufficient to provide flexibility.

[0247] When a circularly polarizing plate is superimposed on a display device, it is preferable that the display device has a substrate with high optical isotropy. A substrate with high optical isotropy has small birefringence (or a small amount of birefringence).

[0248] The absolute value of the retardation (phase difference) of a substrate having high optical isotropy is preferably 30 nm or less, more preferably 20 nm or less, and even more preferably 10 nm or less.

[0249] Examples of films with high optical isotropy include triacetyl cellulose (TAC, also known as cellulose triacetate) films, cycloolefin polymer (COP) films, cycloolefin copolymer (COC) films, and acrylic films.

[0250] Furthermore, when a film is used as a substrate, the film may absorb water, causing deformation such as wrinkles in the display panel. Therefore, it is preferable to use a film with low water absorption for the substrate. For example, it is preferable to use a film with a water absorption rate of 1% or less, more preferably 0.1% or less, and even more preferably 0.01% or less.

[0251] The adhesive layer can be made of various curable adhesives, such as photocurable adhesives (e.g., ultraviolet curable), reactive curable adhesives, thermosetting adhesives, and anaerobic adhesives. Examples of such adhesives include epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, and EVA (ethylene vinyl acetate) resin. Materials with low moisture permeability, such as epoxy resin, are particularly preferred. Two-component resins may also be used. Adhesive sheets, etc., may also be used.

[0252] The connection layer 242 may be an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), or the like.

[0253] Materials that can be used for conductive layers such as the gate, source, and drain of a transistor, as well as various wirings and electrodes that constitute a display device include metals such as aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten, and alloys containing these metals as main components, etc. Films containing these materials can be used as a single layer or a stacked layer structure.

[0254] Examples of light-transmitting conductive materials include conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide containing gallium, or graphene. Alternatively, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium, or alloy materials containing such metal materials, can be used. Alternatively, nitrides of such metal materials (e.g., titanium nitride) can be used. When using metal materials or alloy materials (or their nitrides), it is preferable to thin them sufficiently to ensure light-transmitting properties. A stacked film of the above materials can also be used as the conductive layer. For example, a stacked film of an alloy of silver and magnesium and indium tin oxide is preferable because it can enhance conductivity. These materials can also be used for conductive layers such as various wirings and electrodes constituting a display device, and for conductive layers (conductive layers functioning as pixel electrodes or common electrodes) of light-emitting elements.

[0255] Examples of insulating materials that can be used for each insulating layer include resins such as acrylic resin and epoxy resin, and inorganic insulating materials such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide.

[0256] [Display Device 400B] Figure 13A shows a cross-sectional view of the display device 400B. The perspective view of the display device 400B is similar to that of the display device 400A (Figure 11). Figure 13A shows an example of a cross-section of the display device 400B, where a portion of a region including the FPC 472, a portion of the circuit 464, and a portion of the display unit 462 are cut away. Figure 13A shows an example of a cross-section of the display unit 462, particularly, where a region including the light-emitting element 430b that emits green light and the light-emitting element 430d that emits infrared light is cut away. Note that descriptions of parts similar to those of the display device 400A may be omitted.

[0257] 13A includes a transistor 202, a transistor 210, a light-emitting element 430b, a light-emitting element 430d, and the like between a substrate 453 and a substrate 454. Here, the substrate 453 corresponds to the substrate 101 of the display unit 100, and the substrate 454 corresponds to the substrate 102 of the display unit 100.

[0258] The substrate 454 and the protective layer 416 are bonded together via an adhesive layer 442. The adhesive layer 442 is provided to overlap the light-emitting element 430b and the light-emitting element 430d, respectively, and a solid sealing structure is applied to the display device 400B.

[0259] The substrate 453 and the insulating layer 212 are bonded together by an adhesive layer 455 .

[0260] The display device 400B is manufactured by first bonding a fabrication substrate provided with the insulating layer 212, the transistors, the light-emitting elements, and the like to a substrate 454 provided with a light-shielding layer 417 with an adhesive layer 442. The fabrication substrate is then peeled off, and a substrate 453 is attached to the exposed surface, thereby transferring each component formed on the fabrication substrate to the substrate 453. The substrate 453 and the substrate 454 are preferably flexible. This can increase the flexibility of the display device 400B.

[0261] The insulating layer 212 can be formed using the inorganic insulating film that can be used for the insulating layer 211, the insulating layer 213, and the insulating layer 215, respectively.

[0262] The pixel electrode is connected to a conductive layer 222b of the transistor 210 through an opening provided in the insulating layer 214. The conductive layer 222b is connected to a low-resistance region 231n through openings provided in the insulating layer 215 and the insulating layer 225. The transistor 210 has a function of controlling driving of a light-emitting element.

[0263] The ends of the pixel electrodes are covered with an insulating layer 421 .

[0264] Light emitted from the light emitting elements 430b and 430d is emitted toward the substrate 454. The substrate 454 is preferably made of a material that is highly transparent to visible light and infrared light.

[0265] A connection portion 204 is provided in a region of the substrate 453 where the substrate 454 does not overlap. In the connection portion 204, a wiring 465 is electrically connected to an FPC 472 via a conductive layer 466 and a connection layer 242. The conductive layer 466 can be obtained by processing the same conductive film as the pixel electrode. This allows the connection portion 204 and the FPC 472 to be electrically connected via the connection layer 242.

[0266] The transistor 202 and the transistor 210 each include a conductive layer 221 functioning as a gate, an insulating layer 211 functioning as a gate insulating layer, a semiconductor layer including a channel formation region 231i and a pair of low-resistance regions 231n, a conductive layer 222a connected to one of the pair of low-resistance regions 231n, a conductive layer 222b connected to the other of the pair of low-resistance regions 231n, an insulating layer 225 functioning as a gate insulating layer, a conductive layer 223 functioning as a gate, and an insulating layer 215 covering the conductive layer 223. The insulating layer 211 is located between the conductive layer 221 and the channel formation region 231i. The insulating layer 225 is located between the conductive layer 223 and the channel formation region 231i.

[0267] The conductive layer 222a and the conductive layer 222b are each connected to the low-resistance region 231n through an opening provided in the insulating layer 215. One of the conductive layer 222a and the conductive layer 222b functions as a source, and the other functions as a drain.

[0268] 13A shows an example in which the top surface and side surfaces of the semiconductor layer are covered with an insulating layer 225. The conductive layer 222a and the conductive layer 222b are connected to the low-resistance region 231n through openings provided in the insulating layer 225 and the insulating layer 215, respectively.

[0269] 13B , the insulating layer 225 overlaps with the channel formation region 231i of the semiconductor layer 231 but does not overlap with the low-resistance region 231n. For example, the insulating layer 225 is processed using the conductive layer 223 as a mask, thereby manufacturing the structure shown in FIG. 13B . In FIG. 13B , the insulating layer 215 is provided to cover the insulating layer 225 and the conductive layer 223, and the conductive layer 222a and the conductive layer 222b are connected to the low-resistance region 231n through openings in the insulating layer 215. Furthermore, an insulating layer 218 may be provided to cover the transistor.

[0270] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be combined as appropriate with other configuration examples or drawings.

[0271] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0272] Embodiment Mode 3 In this embodiment mode, a structural example of a display device different from the above will be described.

[0273] The display device of the present embodiment can be a high-definition display device, and therefore can be used as a display unit of a wearable device that can be worn on the head, such as a wristwatch-type or bracelet-type information terminal (wearable device), a head-mounted display or other VR device, or a glasses-type AR device.

[0274] 14A shows a perspective view of display module 280. Display module 280 has a display device 400C and an FPC 290. Note that the display device included in display module 280 is not limited to display device 400C, and may be display device 400D or display device 400E, which will be described later.

[0275] The display module 280 has a substrate 291 and a substrate 292. The display module 280 has a display portion 281. The display portion 281 is a region that displays an image in the display module 280, and is a region where light from each pixel provided in a pixel portion 284 (described later) can be viewed.

[0276] 14B is a perspective view schematically illustrating the configuration on the substrate 291 side. A circuit portion 282, a pixel circuit portion 283 on the circuit portion 282, and a pixel portion 284 on the pixel circuit portion 283 are stacked on the substrate 291. A terminal portion 285 for connecting to the FPC 290 is provided in a portion of the substrate 291 that does not overlap with the pixel portion 284. The terminal portion 285 and the circuit portion 282 are electrically connected by a wiring portion 286 composed of a plurality of wirings.

[0277] The pixel section 284 has a plurality of periodically arranged pixels 284a. An enlarged view of one pixel 284a is shown on the right side of FIG. 14B. The pixel 284a has light-emitting elements 430a, 430b, 430c, and 430d that emit light of different colors. The plurality of light-emitting elements may be arranged in a stripe array as shown in FIG. 14B. The stripe array allows pixel circuits to be arranged at high density, thereby providing a high-resolution display device. The plurality of light-emitting elements may also be arranged as shown in FIGS. 11B and 11C. Various arrangement methods, such as a delta array and a pentile array, may also be applied.

[0278] The pixel circuit section 283 has a plurality of pixel circuits 283a arranged periodically.

[0279] One pixel circuit 283a is a circuit that controls the light emission of three light-emitting elements included in one pixel 284a. One pixel circuit 283a may be configured to have three circuits that control the light emission of one light-emitting element. For example, the pixel circuit 283a may be configured to have at least one selection transistor, one current control transistor (drive transistor), and a capacitor for each light-emitting element. In this case, a gate signal is input to the gate of the selection transistor, and a source signal is input to either the source or the drain. This realizes an active matrix display device.

[0280] The circuit portion 282 includes a circuit for driving each pixel circuit 283 a of the pixel circuit portion 283. For example, the circuit portion 282 preferably includes one or both of a gate line driver circuit and a source line driver circuit. In addition, the circuit portion 282 may include at least one of an arithmetic circuit, a memory circuit, a power supply circuit, and the like.

[0281] The FPC 290 functions as wiring for supplying a video signal, a power supply potential, or the like from the outside to the circuit portion 282. An IC may be mounted on the FPC 290.

[0282] The display module 280 can be configured such that one or both of the pixel circuit unit 283 and the circuit unit 282 are stacked below the pixel unit 284, thereby enabling the aperture ratio (effective display area ratio) of the display unit 281 to be extremely high. For example, the aperture ratio of the display unit 281 can be 40% or more and less than 100%, preferably 50% or more and 95% or less, and more preferably 60% or more and 95% or less. Furthermore, the pixels 284a can be arranged at an extremely high density, enabling the resolution of the display unit 281 to be extremely high. For example, it is preferable that the pixels 284a be arranged in the display unit 281 at a resolution of 2000 ppi or more, preferably 3000 ppi or more, more preferably 5000 ppi or more, and even more preferably 6000 ppi or more, and 20,000 ppi or less, or 30,000 ppi or less.

[0283] Because such a display module 280 has extremely high resolution, it can be suitably used in VR devices such as head-mounted displays, or in glasses-type AR devices. For example, even in a configuration in which the display unit of the display module 280 is viewed through lenses, the display module 280 has an extremely high-resolution display unit 281, so even when the display unit is enlarged with lenses, the pixels are not visible, allowing for a highly immersive display. Furthermore, the display module 280 is not limited to this, and can be suitably used in electronic devices with relatively small display units. For example, it can be suitably used in the display unit of a wearable electronic device such as a wristwatch.

[0284] 15 includes a substrate 301, light-emitting elements 430a, 430b, 430c (not shown), and 430d, a capacitor 240, and a transistor 310. Note that although the light-emitting element 430c is omitted in FIGS. 15 to 17 for clarity, the light-emitting element 430c can also be provided in the same manner as the light-emitting element 430a, the light-emitting element 430b, and the light-emitting element 430d.

[0285] 14A and 14B. The laminated structure from the substrate 301 to the insulating layer 255 corresponds to the substrate in the first embodiment.

[0286] The transistor 310 has a channel formation region in a substrate 301. The substrate 301 can be, for example, a semiconductor substrate such as a single crystal silicon substrate. The transistor 310 includes a part of the substrate 301, a conductive layer 311, a low-resistance region 312, an insulating layer 313, and an insulating layer 314. The conductive layer 311 functions as a gate electrode. The insulating layer 313 is located between the substrate 301 and the conductive layer 311 and functions as a gate insulating layer. The low-resistance region 312 is a region in which the substrate 301 is doped with impurities and functions as one of a source and a drain. The insulating layer 314 is provided to cover a side surface of the conductive layer 311 and functions as an insulating layer.

[0287] An element isolation layer 315 is provided between two adjacent transistors 310 so as to be embedded in the substrate 301 .

[0288] In addition, an insulating layer 261 is provided to cover the transistor 310 , and a capacitor 240 is provided over the insulating layer 261 .

[0289] The capacitor 240 has a conductive layer 241, a conductive layer 245, and an insulating layer 243 located therebetween. The conductive layer 241 functions as one electrode of the capacitor 240, the conductive layer 245 functions as the other electrode of the capacitor 240, and the insulating layer 243 functions as a dielectric of the capacitor 240.

[0290] The conductive layer 241 is provided over the insulating layer 261 and is buried in the insulating layer 254. The conductive layer 241 is electrically connected to one of the source and drain of the transistor 310 by a plug 271 buried in the insulating layer 261. The insulating layer 243 is provided to cover the conductive layer 241. The conductive layer 245 is provided in a region overlapping with the conductive layer 241 with the insulating layer 243 interposed therebetween.

[0291] An insulating layer 255 is provided to cover the capacitor 240, and light emitting elements 430a, 430b, 430c (not shown), 430d, etc. are provided on the insulating layer 255. A protective layer 416 is provided on the light emitting elements 430a, 430b, 430c (not shown), and 430d, and a substrate 420 is bonded to the upper surface of the protective layer 416 by a resin layer 419. The substrate 420 corresponds to the substrate 292 in FIG. 14A .

[0292] The pixel electrode of the light-emitting element is electrically connected to one of the source or drain of the transistor 310 by a plug 256 embedded in the insulating layer 255, a conductive layer 241 embedded in the insulating layer 254, and a plug 271 embedded in the insulating layer 261.

[0293] 16 is different from the display device 400C mainly in the configuration of the transistors. Note that descriptions of parts that are the same as those of the display device 400C may be omitted.

[0294] The transistor 320 is a transistor in which a metal oxide (also referred to as an oxide semiconductor) is used for a semiconductor layer in which a channel is formed.

[0295] The transistor 320 includes a semiconductor layer 321 , an insulating layer 323 , a conductive layer 324 , a pair of conductive layers 325 , an insulating layer 326 , and a conductive layer 327 .

[0296] 14A and 14B. The layered structure from the substrate 331 to the insulating layer 255 corresponds to the substrate in Embodiment 1. The substrate 331 can be an insulating substrate or a semiconductor substrate.

[0297] An insulating layer 332 is provided over a substrate 331. The insulating layer 332 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the substrate 331 to the transistor 320 and prevents oxygen from being released from the semiconductor layer 321 toward the insulating layer 332. The insulating layer 332 can be, for example, a film through which hydrogen or oxygen is less likely to diffuse than a silicon oxide film, such as an aluminum oxide film, a hafnium oxide film, or a silicon nitride film.

[0298] A conductive layer 327 is provided over the insulating layer 332, and an insulating layer 326 is provided to cover the conductive layer 327. The conductive layer 327 functions as a first gate electrode of the transistor 320, and part of the insulating layer 326 functions as a first gate insulating layer. An oxide insulating film such as a silicon oxide film is preferably used for at least a portion of the insulating layer 326 that is in contact with the semiconductor layer 321. The top surface of the insulating layer 326 is preferably planarized.

[0299] The semiconductor layer 321 is provided over the insulating layer 326. The semiconductor layer 321 preferably includes a metal oxide (also referred to as an oxide semiconductor) film having semiconductor properties. Materials that can be suitably used for the semiconductor layer 321 will be described in detail later.

[0300] The pair of conductive layers 325 are provided over and in contact with the semiconductor layer 321 and function as a source electrode and a drain electrode.

[0301] An insulating layer 328 is provided to cover top surfaces and side surfaces of the pair of conductive layers 325 and side surfaces of the semiconductor layer 321, and an insulating layer 264 is provided over the insulating layer 328. The insulating layer 328 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the insulating layer 264 or the like to the semiconductor layer 321 and prevents oxygen from being released from the semiconductor layer 321. The insulating layer 328 can be an insulating film similar to the insulating layer 332.

[0302] Openings reaching the semiconductor layer 321 are provided in the insulating layer 328 and the insulating layer 264. Inside the openings, an insulating layer 323 and a conductive layer 324 are buried, which are in contact with side surfaces of the insulating layer 264, the insulating layer 328, and the conductive layer 325 and an upper surface of the semiconductor layer 321. The conductive layer 324 functions as a second gate electrode, and the insulating layer 323 functions as a second gate insulating layer.

[0303] The upper surfaces of the conductive layer 324, the insulating layer 323, and the insulating layer 264 are planarized so that their heights are approximately the same, and insulating layers 329 and 265 are provided to cover them.

[0304] The insulating layer 264 and the insulating layer 265 function as interlayer insulating layers. The insulating layer 329 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the insulating layer 265 or the like to the transistor 320. The insulating layer 329 can be formed using an insulating film similar to the insulating layer 328 and the insulating layer 332.

[0305] A plug 274 electrically connected to one of the pair of conductive layers 325 is provided to be embedded in the insulating layer 265, the insulating layer 329, and the insulating layer 264. Here, the plug 274 preferably includes a conductive layer 274a covering the side surfaces of the openings of the insulating layer 265, the insulating layer 329, the insulating layer 264, and the insulating layer 328 and part of the top surface of the conductive layer 325, and a conductive layer 274b in contact with the top surface of the conductive layer 274a. In this case, the conductive layer 274a is preferably made of a conductive material through which hydrogen and oxygen do not easily diffuse.

[0306] The configuration of the display device 400D from the insulating layer 254 to the substrate 420 is the same as that of the display device 400C.

[0307] 17 has a stacked structure of a transistor 310 in which a channel is formed in a substrate 301 and a transistor 320 in which a channel is formed and a semiconductor layer containing metal oxide. Note that descriptions of parts similar to those of the display devices 400C and 400D may be omitted.

[0308] An insulating layer 261 is provided to cover the transistor 310, and a conductive layer 251 is provided over the insulating layer 261. An insulating layer 262 is provided to cover the conductive layer 251, and a conductive layer 252 is provided over the insulating layer 262. The conductive layers 251 and 252 each function as wirings. An insulating layer 263 and an insulating layer 332 are provided to cover the conductive layer 252, and the transistor 320 is provided over the insulating layer 332. An insulating layer 265 is provided to cover the transistor 320, and a capacitor 240 is provided over the insulating layer 265. The capacitor 240 and the transistor 320 are electrically connected by a plug 274.

[0309] The transistor 320 can be used as a transistor that forms a pixel circuit. The transistor 310 can be used as a transistor that forms a pixel circuit or a driver circuit (gate line driver circuit, source line driver circuit) that drives the pixel circuit. The transistors 310 and 320 can be used as transistors that form various circuits such as an arithmetic circuit or a memory circuit.

[0310] With this configuration, not only pixel circuits but also driver circuits and the like can be formed directly under the light-emitting elements, making it possible to miniaturize the display device compared to when driver circuits are provided around the periphery of the display area.

[0311] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be combined as appropriate with other configuration examples or drawings.

[0312] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0313] Embodiment 4 In this embodiment, a light-emitting element (also referred to as a light-emitting device) that can be used for a display device that is one embodiment of the present invention will be described.

[0314] 18A , the light-emitting element has an EL layer 23 between a pair of electrodes (a lower electrode 21 and an upper electrode 25). The EL layer 23 can be composed of a plurality of layers such as a layer 4420, a light-emitting layer 4411, and a layer 4430. The layer 4420 can have, for example, a layer containing a substance with high electron injection properties (electron injection layer) and a layer containing a substance with high electron transport properties (electron transport layer). The light-emitting layer 4411 contains, for example, a light-emitting compound. The layer 4430 can have, for example, a layer containing a substance with high hole injection properties (hole injection layer) and a layer containing a substance with high hole transport properties (hole transport layer).

[0315] A structure having the layer 4420, the light-emitting layer 4411, and the layer 4430 provided between a pair of electrodes can function as a single light-emitting unit, and the structure of FIG. 18A is referred to as a single structure in this specification.

[0316] 18B shows a modified example of the EL layer 23 included in the light-emitting element 20 shown in Fig. 18A. Specifically, the light-emitting element 20 shown in Fig. 18B includes a layer 4430-1 on the lower electrode 21, a layer 4430-2 on the layer 4430-1, a light-emitting layer 4411 on the layer 4430-2, a layer 4420-1 on the light-emitting layer 4411, a layer 4420-2 on the layer 4420-1, and an upper electrode 25 on the layer 4420-2. For example, when the lower electrode 21 is an anode and the upper electrode 25 is a cathode, the layer 4430-1 functions as a hole injection layer, the layer 4430-2 functions as a hole transport layer, the layer 4420-1 functions as an electron transport layer, and the layer 4420-2 functions as an electron injection layer. Alternatively, when the lower electrode 21 is used as a cathode and the upper electrode 25 is used as an anode, the layer 4430-1 functions as an electron injection layer, the layer 4430-2 functions as an electron transport layer, the layer 4420-1 functions as a hole transport layer, and the layer 4420-2 functions as a hole injection layer. By using such a layer structure, it is possible to efficiently inject carriers into the light-emitting layer 4411 and increase the efficiency of carrier recombination in the light-emitting layer 4411.

[0317] Note that a configuration in which a plurality of light-emitting layers (light-emitting layers 4411, 4412, and 4413) are provided between the layer 4420 and the layer 4430 as shown in FIG. 18C is also a variation of the single structure.

[0318] 18D, a configuration in which a plurality of light-emitting units (EL layer 23a, EL layer 23b) are connected in series via an intermediate layer (charge generating layer) 4440 is referred to as a tandem structure in this specification. Note that, although the configuration shown in FIG. 18D is referred to as a tandem structure in this specification and the like, this is not limiting, and for example, the tandem structure may also be referred to as a stack structure. Note that by using a tandem structure, a light-emitting element capable of emitting light with high brightness can be obtained.

[0319] 18C and 18D, the layer 4420 and the layer 4430 may have a laminated structure consisting of two or more layers, as shown in FIG. 18B.

[0320] In addition, in this specification and the like, a structure in which a separate light-emitting layer is formed for each light-emitting element of each color (here, blue (B), green (G), red (R), and infrared light (IR)), or in which the light-emitting layers are painted separately, may be referred to as an SBS (Side By Side) structure.

[0321] The light-emitting element can emit light of red, green, blue, cyan, magenta, yellow, white, infrared light, or the like, depending on the material constituting the EL layer 23. Furthermore, the color purity can be further improved by providing the light-emitting element with a microcavity structure.

[0322] In this specification and the like, a light-emitting device capable of emitting white light may be referred to as a white light-emitting device. Note that a white light-emitting device can be made into a light-emitting device that displays full color by combining it with a colored layer (for example, a color filter).

[0323] Furthermore, light-emitting devices can be broadly divided into single structures and tandem structures. A single-structure device has one light-emitting unit between a pair of electrodes, and the light-emitting unit preferably includes one or more light-emitting layers. To obtain white light emission, two or more light-emitting layers may be selected so that the light emitted from each of the two or more light-emitting layers has a complementary color relationship. For example, by making the emission color of the first light-emitting layer and the emission color of the second light-emitting layer complementary, a configuration in which the entire light-emitting device emits white light can be obtained. The same applies to light-emitting devices having three or more light-emitting layers.

[0324] A tandem-structure device preferably has two or more light-emitting units between a pair of electrodes, and each light-emitting unit preferably includes one or more light-emitting layers. To obtain white light emission, light from the light-emitting layers of the light-emitting units may be combined to obtain white light emission. The configuration for obtaining white light emission is the same as that of the single-structure device. In a tandem-structure device, it is preferable to provide an intermediate layer such as a charge-generating layer between the light-emitting units.

[0325] Furthermore, when comparing the above-described white light-emitting device (single structure or tandem structure) with a light-emitting device having an SBS structure, the light-emitting device having an SBS structure can reduce power consumption compared to the white light-emitting device. If it is desired to reduce power consumption, it is preferable to use a light-emitting device having an SBS structure. On the other hand, the manufacturing process of a white light-emitting device is simpler than that of a light-emitting device having an SBS structure, and therefore the manufacturing cost can be reduced or the manufacturing yield can be increased, making it preferable.

[0326] The light-emitting layer of the white light-emitting device may contain two or more light-emitting materials that emit light of R (red), G (green), B (blue), Y (yellow), O (orange), etc. Alternatively, the light-emitting layer may contain two or more light-emitting materials, and the light emitted by each of the light-emitting materials may contain spectral components of two or more colors of R, G, and B.

[0327] Here, a specific example of the configuration of the light-emitting element will be described.

[0328] The light-emitting element has at least a light-emitting layer. The light-emitting element may further have, as a layer other than the light-emitting layer, a layer containing a substance having a high hole-injecting property, a substance having a high hole-transporting property, a hole-blocking material, a substance having a high electron-transporting property, an electron-blocking material, a substance having a high electron-injecting property, a bipolar substance (a substance having a high electron-transporting property and a high hole-transporting property), or the like.

[0329] The light-emitting device can be made of either a low-molecular-weight compound or a high-molecular-weight compound, and may contain an inorganic compound. The layers constituting the light-emitting device can be formed by a method such as vapor deposition (including vacuum vapor deposition), transfer, printing, inkjet printing, or coating.

[0330] For example, a light emitting device can include one or more of a hole injection layer, a hole transport layer, a hole blocking layer, an electron blocking layer, an electron transport layer, and an electron injection layer.

[0331] The hole injection layer is a layer that injects holes from the anode into the hole transport layer and contains a material with high hole injection properties, such as an aromatic amine compound and a composite material containing a hole transport material and an acceptor material (electron acceptor material).

[0332] The hole transport layer is a layer that transports holes injected from the anode by the hole injection layer to the light emitting layer. The hole transport layer is a layer that contains a hole transporting material. Examples of the hole transporting material include 10 −６ cm ２ A substance having a hole mobility of 1 / Vs or more is preferred. Note that other substances can also be used as long as they have a higher hole transporting property than electron transporting property. As the hole transporting material, a material having a high hole transporting property, such as a π-electron-rich heteroaromatic compound (e.g., a carbazole derivative, a thiophene derivative, a furan derivative, etc.) or an aromatic amine (a compound having an aromatic amine skeleton), is preferred.

[0333] The electron transport layer is a layer that transports electrons injected from the cathode by the electron injection layer to the light emitting layer. The electron transport layer is a layer that contains an electron transporting material. The electron transporting material is a material having a molecular weight of 1×10 −６ cm ２A substance having an electron mobility of 1 / Vs or more is preferred. Note that other substances can also be used as long as they have a higher electron transporting property than holes. Examples of electron-transporting materials that can be used include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, and metal complexes having a thiazole skeleton, as well as oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives having a quinoline ligand, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, and other π-electron-deficient heteroaromatic compounds including nitrogen-containing heteroaromatic compounds.

[0334] The electron injection layer is a layer that injects electrons from the cathode to the electron transport layer and contains a material with high electron injection properties. Examples of the material with high electron injection properties include alkali metals, alkaline earth metals, and compounds thereof. Examples of the material with high electron injection properties include a composite material containing an electron transport material and a donor material (electron donor material).

[0335] The electron injection layer may be formed of, for example, lithium, cesium, lithium fluoride (LiF), cesium fluoride (CsF), calcium fluoride (CaF ２ ), 8-(quinolinolato)lithium (abbreviation: Liq), 2-(2-pyridyl)phenolatolithium (abbreviation: LiPP), 2-(2-pyridyl)-3-pyridinolatolithium (abbreviation: LiPPy), 4-phenyl-2-(2-pyridyl)phenolatolithium (abbreviation: LiPPP), lithium oxide (LiO ｘ ), alkali metals such as cesium carbonate, alkaline earth metals, or compounds thereof can be used.

[0336] Alternatively, the electron injection layer may be formed using a material having electron transport properties. For example, a compound having an unshared electron pair and an electron-deficient heteroaromatic ring may be used as the material having electron transport properties. Specifically, a compound having at least one of a pyridine ring, a diazine ring (pyrimidine ring, pyrazine ring, pyridazine ring), and a triazine ring may be used.

[0337] The organic compound having an unshared electron pair preferably has a lowest unoccupied molecular orbital (LUMO) of -3.6 eV to -2.3 eV. Generally, the highest occupied molecular orbital (HOMO) level and the LUMO level of an organic compound can be estimated by cyclic voltammetry (CV), photoelectron spectroscopy, optical absorption spectroscopy, inverse photoelectron spectroscopy, or the like.

[0338] For example, 4,7-diphenyl-1,10-phenanthroline (abbreviation: BPhen), 2,9-bis(naphthalen-2-yl)-4,7-diphenyl-1,10-phenanthroline (abbreviation: NBPhen), diquinoxalino[2,3-a:2',3'-c]phenazine (abbreviation: HATNA), 2,4,6-tris[3'-(pyridin-3-yl)biphenyl-3-yl]-1,3,5-triazine (abbreviation: TmPPPyTz), etc. can be used as the organic compound having an unshared electron pair. Note that NBPhen has a higher glass transition temperature (Tg) and is superior in heat resistance compared to BPhen.

[0339] The light-emitting layer is a layer containing a light-emitting substance. The light-emitting layer can contain one or more light-emitting substances. As the light-emitting substance, a substance that emits light of a color such as blue, purple, blue-purple, green, yellow-green, yellow, orange, or red is appropriately used. Furthermore, a substance that emits near-infrared light can also be used as the light-emitting substance.

[0340] Examples of the light-emitting material include fluorescent materials, phosphorescent materials, TADF materials, and quantum dot materials.

[0341] Examples of fluorescent materials include pyrene derivatives, anthracene derivatives, triphenylene derivatives, fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofuran derivatives, dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrimidine derivatives, phenanthrene derivatives, and naphthalene derivatives.

[0342] Examples of phosphorescent materials include organometallic complexes (particularly iridium complexes) having a 4H-triazole skeleton, a 1H-triazole skeleton, an imidazole skeleton, a pyrimidine skeleton, a pyrazine skeleton, or a pyridine skeleton; organometallic complexes (particularly iridium complexes) having a phenylpyridine derivative having an electron-withdrawing group as a ligand; platinum complexes; and rare earth metal complexes.

[0343] The light-emitting layer may contain one or more organic compounds (host materials, assist materials, etc.) in addition to a light-emitting substance (guest material). As the one or more organic compounds, one or both of a hole-transporting material and an electron-transporting material can be used. Furthermore, as the one or more organic compounds, a bipolar material or a TADF material can be used.

[0344] The light-emitting layer preferably includes, for example, a phosphorescent material and a hole-transporting material and an electron-transporting material that are a combination that easily forms an exciplex. This configuration allows for efficient emission using Exciplex-Triple Energy Transfer (ExTET), which is energy transfer from the exciplex to the light-emitting material (phosphorescent material). By selecting a combination that forms an exciplex that emits light that overlaps with the wavelength of the lowest-energy absorption band of the light-emitting material, energy transfer becomes smooth, allowing for efficient emission. This configuration simultaneously enables high efficiency, low-voltage operation, and long life of the light-emitting device.

[0345] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be combined as appropriate with other configuration examples or drawings.

[0346] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0347] Embodiment 5 In this embodiment, a metal oxide (also referred to as an oxide semiconductor) that can be used for the OS transistor described in the above embodiment will be described.

[0348] The metal oxide preferably contains at least indium or zinc. It is particularly preferable that it contains indium and zinc. It is also preferable that it contains aluminum, gallium, yttrium, tin, or the like in addition to these. It may also contain one or more elements selected from boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, cobalt, and the like.

[0349] The metal oxide can be formed by a sputtering method, a chemical vapor deposition (CVD) method such as a metal organic chemical vapor deposition (MOCVD) method, or an atomic layer deposition (ALD) method.

[0350] <Classification of Crystal Structure> Examples of the crystal structure of an oxide semiconductor include amorphous (including completely amorphous), c-axis-aligned crystalline line (CAAC), nanocrystalline line (nc), cloud-aligned composite (CAC), single crystal, and polycrystalline.

[0351] The crystalline structure of the film or substrate can be evaluated using an X-ray diffraction (XRD) spectrum. For example, it can be evaluated using an XRD spectrum obtained by a GIXD (Grazing-Incident XRD) measurement. The GIXD method is also called the thin film method or the Seemann-Bohlin method.

[0352] For example, in the case of a quartz glass substrate, the shape of the peak in the XRD spectrum is almost symmetrical. On the other hand, in the case of an IGZO film having a crystalline structure, the shape of the peak in the XRD spectrum is asymmetrical. The asymmetrical shape of the peak in the XRD spectrum clearly indicates the presence of crystals in the film or substrate. In other words, if the shape of the peak in the XRD spectrum is not symmetrical, the film or substrate cannot be said to be in an amorphous state.

[0353] The crystalline structure of the film or substrate can be evaluated by a diffraction pattern (also referred to as a nanobeam electron diffraction pattern) observed by nanobeam electron diffraction (NBED). For example, a halo is observed in the diffraction pattern of a quartz glass substrate, and it can be confirmed that the quartz glass is in an amorphous state. Furthermore, a spot-like pattern is observed in the diffraction pattern of an IGZO film formed at room temperature, rather than a halo. For this reason, it is estimated that the IGZO film formed at room temperature is neither crystalline nor amorphous, but is in an intermediate state, and it cannot be concluded that it is in an amorphous state.

[0354] <<Structure of Oxide Semiconductor>> Note that oxide semiconductors may be classified differently from the above when focusing on their structures. For example, oxide semiconductors are classified into single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. Examples of non-single-crystal oxide semiconductors include the above-mentioned CAAC-OS and nc-OS. Non-single-crystal oxide semiconductors include polycrystalline oxide semiconductors, pseudo-amorphous-like oxide semiconductors (a-like OSs), amorphous oxide semiconductors, and the like.

[0355] Here, the above-mentioned CAAC-OS, nc-OS, and a-like OS will be described in detail.

[0356] [CAAC-OS] A CAAC-OS is an oxide semiconductor having multiple crystalline regions, each with its c-axis aligned in a specific direction. The specific direction refers to the thickness direction of the CAAC-OS film, the normal direction to the surface where the CAAC-OS film is formed, or the normal direction to the surface of the CAAC-OS film. A crystalline region is a region having periodic atomic arrangement. If the atomic arrangement is considered as a lattice arrangement, a crystalline region is also a region with a uniform lattice arrangement. Furthermore, a CAAC-OS has a region where multiple crystalline regions are connected in the a-b plane direction, and the region may have distortion. Note that distortion refers to a portion where the lattice arrangement changes between a region with a uniform lattice arrangement and a region with another uniform lattice arrangement in a region where multiple crystalline regions are connected. In other words, a CAAC-OS is an oxide semiconductor whose c-axes are aligned and whose orientation is not clearly aligned in the a-b plane direction.

[0357] Each of the multiple crystalline regions is composed of one or more minute crystals (crystals with a maximum diameter of less than 10 nm). When a crystalline region is composed of a single minute crystal, the maximum diameter of the crystalline region is less than 10 nm. When a crystalline region is composed of many minute crystals, the size of the crystalline region may be several tens of nanometers.

[0358] In an In-M-Zn oxide (wherein the element M is one or more elements selected from aluminum, gallium, yttrium, tin, titanium, and the like), the CAAC-OS tends to have a layered crystal structure (also referred to as a layered structure) in which a layer containing indium (In) and oxygen (hereinafter referred to as an In layer) and a layer containing the element M, zinc (Zn), and oxygen (hereinafter referred to as an (M, Zn) layer) are stacked. Note that indium and the element M are mutually substituted. Therefore, the (M, Zn) layer may contain indium. The In layer may contain the element M. The In layer may contain Zn. The layered structure is observed as a lattice image in a high-resolution transmission electron microscope (TEM) image, for example.

[0359] When a CAAC-OS film is subjected to structural analysis using an XRD apparatus, for example, a peak indicating c-axis orientation is detected at or near 2θ = 31° in out-of-plane XRD measurement using θ / 2θ scanning. Note that the position of the peak indicating c-axis orientation (the value of 2θ) may vary depending on the type and composition of the metal elements constituting the CAAC-OS.

[0360] For example, multiple bright spots are observed in the electron diffraction pattern of a CAAC-OS film, and the spots are observed at positions that are point-symmetric with respect to a spot of an incident electron beam that has passed through the sample (also referred to as a direct spot).

[0361] When a crystalline region is observed from the specific direction, the lattice arrangement in the crystalline region is basically a hexagonal lattice, but the unit cell is not necessarily a regular hexagon and may be a non-regular hexagon. The distortion may have a pentagonal, heptagonal, or other lattice arrangement. In CAAC-OS, no clear grain boundary can be identified even near the distortion. This indicates that the distortion in the lattice arrangement suppresses the formation of grain boundaries. This is thought to be because CAAC-OS can tolerate distortion due to the lack of close-packed oxygen atom arrangement in the a-b plane direction and the change in interatomic bond distance caused by metal atom substitution.

[0362] Note that a crystal structure in which clear grain boundaries are observed is called polycrystalline. The grain boundaries act as recombination centers, and are likely to trap carriers, resulting in a decrease in the on-state current of a transistor and a decrease in field-effect mobility. Therefore, CAAC-OS, in which clear grain boundaries are not observed, is one of the crystalline oxides having a crystal structure suitable for a semiconductor layer of a transistor. Note that a structure containing Zn is preferable for forming a CAAC-OS. For example, In—Zn oxide and In—Ga—Zn oxide are suitable because they can suppress the generation of grain boundaries more effectively than In oxide.

[0363] CAAC-OS is an oxide semiconductor with high crystallinity and no clear crystal grain boundaries. Therefore, it can be said that the CAAC-OS is less susceptible to a decrease in electron mobility due to crystal grain boundaries. Furthermore, since the crystallinity of an oxide semiconductor can be reduced by the inclusion of impurities, the formation of defects, or the like, the CAAC-OS can also be said to be an oxide semiconductor with few impurities and defects (such as oxygen vacancies). Therefore, an oxide semiconductor having a CAAC-OS has stable physical properties. Therefore, an oxide semiconductor having a CAAC-OS is heat-resistant and highly reliable. Furthermore, the CAAC-OS is stable even against high temperatures (so-called thermal budget) in the manufacturing process. Therefore, the use of a CAAC-OS in an OS transistor can increase the flexibility of the manufacturing process.

[0364] [nc-OS] The nc-OS has periodic atomic arrangement in a microscopic region (e.g., a region of 1 nm to 10 nm, particularly a region of 1 nm to 3 nm). In other words, the nc-OS has microcrystals. Note that the size of the microcrystals is, for example, 1 nm to 10 nm, particularly 1 nm to 3 nm, and therefore the microcrystals are also called nanocrystals. Furthermore, the nc-OS does not exhibit regularity in the crystal orientation between different nanocrystals. Therefore, no orientation is observed throughout the film. Therefore, depending on the analysis method, the nc-OS may be indistinguishable from an a-like OS or an amorphous oxide semiconductor. For example, when a structural analysis of an nc-OS film is performed using an XRD apparatus, no peak indicating crystallinity is detected in out-of-plane XRD measurement using θ / 2θ scanning. When an nc-OS film is subjected to electron diffraction (also referred to as selected-area electron diffraction) using an electron beam with a probe diameter larger than that of a nanocrystal (e.g., 50 nm or more), a diffraction pattern resembling a halo pattern is observed. On the other hand, when an nc-OS film is subjected to electron diffraction (also referred to as nanobeam electron diffraction) using an electron beam with a probe diameter close to or smaller than that of a nanocrystal (e.g., 1 nm to 30 nm), an electron diffraction pattern in which multiple spots are observed within a ring-shaped region centered on a direct spot may be obtained.

[0365] [a-Like OS] The a-like OS is an oxide semiconductor having a structure between the nc-OS and the amorphous oxide semiconductor. The a-like OS has a pore or low-density region. That is, the a-like OS has lower crystallinity than the nc-OS and the CAAC-OS. Furthermore, the a-like OS has a higher hydrogen concentration in the film than the nc-OS and the CAAC-OS.

[0366] <<Structure of Oxide Semiconductor>> Next, the above-described CAC-OS will be described in detail. Note that the CAC-OS relates to a material structure.

[0367] [CAC-OS] CAC-OS is, for example, a material in which elements constituting a metal oxide are unevenly distributed in a size of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or in the vicinity thereof. Note that hereinafter, a state in which one or more metal elements are unevenly distributed in a metal oxide and regions containing the metal elements are mixed in a size of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or in the vicinity thereof, is also referred to as a mosaic or patch state.

[0368] Furthermore, the CAC-OS has a mosaic structure in which a material is separated into a first region and a second region, and the first region is distributed throughout the film (hereinafter also referred to as a cloud structure). That is, the CAC-OS is a composite metal oxide having a structure in which the first region and the second region are mixed.

[0369] Here, the atomic ratios of In, Ga, and Zn to the metal elements constituting the CAC-OS in the In—Ga—Zn oxide are denoted as [In], [Ga], and [Zn], respectively. For example, in the CAC-OS in the In—Ga—Zn oxide, the first region is a region where [In] is larger than [In] in the composition of the CAC-OS film. The second region is a region where [Ga] is larger than [Ga] in the composition of the CAC-OS film. Alternatively, for example, the first region is a region where [In] is larger than [In] in the second region and [Ga] is smaller than [Ga] in the second region. The second region is a region where [Ga] is larger than [Ga] in the first region and [In] is smaller than [In] in the first region.

[0370] Specifically, the first region is a region whose main component is indium oxide, indium zinc oxide, or the like. The second region is a region whose main component is gallium oxide, gallium zinc oxide, or the like. In other words, the first region can be referred to as a region whose main component is In. The second region can be referred to as a region whose main component is Ga.

[0371] It should be noted that there are cases where a clear boundary between the first region and the second region cannot be observed.

[0372] Furthermore, CAC-OS in In—Ga—Zn oxide refers to a structure in which a mosaic of regions containing Ga as the main component and regions containing In as the main component are randomly arranged in a material composition containing In, Ga, Zn, and O. Therefore, it is presumed that CAC-OS has a structure in which metal elements are distributed nonuniformly.

[0373] The CAC-OS can be formed by sputtering, for example, under the condition that the substrate is not intentionally heated. When the CAC-OS is formed by sputtering, any one or more of an inert gas (typically argon), oxygen gas, and nitrogen gas may be used as the deposition gas. The lower the flow rate ratio of oxygen gas to the total flow rate of deposition gas during deposition, the more preferable it is. For example, the flow rate ratio of oxygen gas to the total flow rate of deposition gas during deposition is preferably 0% or more and less than 30%, and more preferably 0% or more and 10% or less.

[0374] Furthermore, for example, in the case of CAC-OS in an In—Ga—Zn oxide, EDX mapping obtained using energy dispersive X-ray spectroscopy (EDX) can confirm that the CAC-OS has a structure in which a region containing In as a main component (first region) and a region containing Ga as a main component (second region) are unevenly distributed and mixed.

[0375] Here, the first region has higher conductivity than the second region. That is, the flow of carriers through the first region causes the metal oxide to exhibit conductivity. Therefore, the first region is distributed in a cloud-like manner in the metal oxide, thereby achieving a high field-effect mobility (μ).

[0376] On the other hand, the second region has higher insulating properties than the first region. That is, the second region is distributed in the metal oxide, thereby suppressing leakage current.

[0377] Therefore, when a CAC-OS is used in a transistor, the conductivity due to the first region and the insulating property due to the second region act complementarily, thereby providing the CAC-OS with a switching function (a function of turning on / off). In other words, a CAC-OS has a conductive function in a part of the material and an insulating function in a part of the material, and the entire material functions as a semiconductor. By separating the conductive function and the insulating function, both functions can be maximized. Therefore, by using a CAC-OS in a transistor, a high on-current (I ｏｎ ), high field-effect mobility (μ), and good switching behavior can be achieved.

[0378] Furthermore, a transistor using the CAC-OS has high reliability, and therefore, the CAC-OS is ideal for various semiconductor devices such as display devices.

[0379] Oxide semiconductors have a variety of structures, each of which has different characteristics. The oxide semiconductor of one embodiment of the present invention may include two or more of an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, an a-like OS, a CAC-OS, an nc-OS, and a CAAC-OS.

[0380] <Transistor Having Oxide Semiconductor> Next, a case where the oxide semiconductor is used for a transistor will be described.

[0381] By using the oxide semiconductor for a transistor, a transistor with high field-effect mobility and high reliability can be realized.

[0382] For the transistor, an oxide semiconductor having a low carrier concentration is preferably used. For example, the carrier concentration of the oxide semiconductor is 1×10 １７ cm −３ Below 1 × 10, preferably １５ cm −３ More preferably, 1×10 １３ cm −３ Less than 1×10, more preferably 1×10 １１ cm −３ More preferably, 1×10１０ cm −３ is less than 1×10 −９ cm −３ That is all. Note that in order to reduce the carrier concentration of an oxide semiconductor film, the impurity concentration in the oxide semiconductor film may be reduced to reduce the density of defect states. In this specification and the like, a semiconductor having a low impurity concentration and a low density of defect states is referred to as a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor. Note that an oxide semiconductor having a low carrier concentration may also be referred to as a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor.

[0383] Furthermore, a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has a low density of defect states, and therefore the density of trap states may also be low.

[0384] Furthermore, charges trapped in the trap states of an oxide semiconductor take a long time to dissipate and may behave like fixed charges. Therefore, a transistor in which a channel formation region is formed in an oxide semiconductor with a high density of trap states may have unstable electrical characteristics.

[0385] Therefore, in order to stabilize the electrical characteristics of a transistor, it is effective to reduce the impurity concentration in the oxide semiconductor. Furthermore, in order to reduce the impurity concentration in the oxide semiconductor, it is preferable to also reduce the impurity concentration in the adjacent film. Examples of impurities include hydrogen, nitrogen, alkali metals, alkaline earth metals, iron, nickel, and silicon.

[0386] <Impurities> Here, the influence of each impurity in an oxide semiconductor will be described.

[0387] When an oxide semiconductor contains silicon or carbon, which is one of Group 14 elements, defect levels are formed in the oxide semiconductor. Therefore, the concentration of silicon or carbon in the oxide semiconductor and the concentration of silicon or carbon near the interface with the oxide semiconductor (concentration obtained by secondary ion mass spectrometry (SIMS)) are set to 2×10 １８ atoms / cm ３ Below 2 × 10, preferably １７ atoms / cm３ The following applies.

[0388] Furthermore, when an oxide semiconductor contains an alkali metal or an alkaline earth metal, defect levels are formed and carriers are generated in some cases. Therefore, a transistor using an oxide semiconductor containing an alkali metal or an alkaline earth metal is likely to have normally-on characteristics. For this reason, when the concentration of the alkali metal or the alkaline earth metal in the oxide semiconductor obtained by SIMS is 1×10 １８ atoms / cm ３ Below 2 × 10, preferably １６ atoms / cm ３ Do the following:

[0389] Furthermore, when nitrogen is contained in an oxide semiconductor, electrons serving as carriers are generated, the carrier concentration increases, and the semiconductor is likely to become n-type. As a result, a transistor using an oxide semiconductor containing nitrogen as a semiconductor tends to have normally-on characteristics. Alternatively, when nitrogen is contained in an oxide semiconductor, trap states may be formed. As a result, the electrical characteristics of the transistor may become unstable. For this reason, the nitrogen concentration in the oxide semiconductor obtained by SIMS is set to 5×10 １９ atoms / cm ３ Less than 5×10 １８ atoms / cm ３ Less than 1×10, more preferably 1×10 １８ atoms / cm ３ or less, more preferably 5 × 10 １７ atoms / cm ３ Do the following:

[0390] Furthermore, hydrogen contained in an oxide semiconductor may react with oxygen bonded to a metal atom to form water, which may form an oxygen vacancy. Hydrogen entering the oxygen vacancy may generate electrons as carriers. Furthermore, some of the hydrogen may bond with oxygen bonded to a metal atom to generate electrons as carriers. Therefore, a transistor using an oxide semiconductor containing hydrogen is likely to have normally-on characteristics. Therefore, it is preferable to reduce hydrogen in the oxide semiconductor as much as possible. Specifically, the hydrogen concentration in the oxide semiconductor measured by SIMS is 1×10 ２０ atoms / cm ３ less than 1×10 １９ atoms / cm ３ less than 5×10 １８ atoms / cm ３ less than 1×10 １８ atoms / cm ３ Make it less than.

[0391] When an oxide semiconductor with sufficiently reduced impurities is used for a channel formation region of a transistor, stable electrical characteristics can be obtained.

[0392] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0393] In this embodiment, an example of a package and a sensor module that house an image sensor chip will be described. The package and the sensor module that house the image sensor chip can be used for the sensor unit 104 shown in FIGS. 1A to 1C.

[0394] Here, the image sensor chip has a pixel section in which a plurality of light receiving elements are arranged in a matrix, a drive circuit for controlling the pixel section, etc. The light receiving elements may be photodiodes or the like in which a photoelectric conversion layer is formed on a silicon substrate.

[0395] Furthermore, an optical conversion layer is provided above the pixel section, in other words, in the direction from which the incident light is incident. If a wavelength cut filter is used in the optical conversion layer, an image corresponding to the wavelength region of the wavelength cut filter can be obtained. Therefore, if a filter that blocks light having a wavelength equal to or shorter than visible light is used in the optical conversion layer, the light receiving element can function as an infrared sensor. Furthermore, if a filter that blocks light having a wavelength equal to or shorter than near-infrared light is used in the optical conversion layer, the light receiving element can function as a far-infrared sensor.

[0396] In addition, wavelength cut filters in the optical conversion layer may be assigned to each pixel. For example, a filter that blocks light with wavelengths shorter than visible light and a color filter may be used in the optical conversion layer. By assigning color filters of colors such as R (red), G (green), B (blue), Y (yellow), C (cyan), and M (magenta) to each pixel, it is possible to obtain a color image while functioning as an infrared sensor.

[0397] Photodiodes can also be formed from compound semiconductors. Compound semiconductors can change the band gap depending on the combination of constituent elements and their atomic ratios, making it possible to form photodiodes that are sensitive to infrared light. For example, to form a photodiode that is sensitive to visible light to mid-infrared light, InGaAs or the like can be used for the photoelectric conversion layer.

[0398] 19A1 is a perspective view of the top surface of a package containing an image sensor chip. The package includes a package substrate 610 for fixing an image sensor chip 650, a cover glass 620, and an adhesive 630 for bonding the two together.

[0399] 19A2 is a perspective view of the underside of the package. The underside of the package has a BGA (Ball Grid Array) with solder balls as bumps 640. Note that the package is not limited to a BGA, and may have an LGA (Land Grid Array) or a PGA (Pin Grid Array), etc.

[0400] 19A3 is a perspective view of the package, with the cover glass 620 and part of the adhesive 630 omitted. Electrode pads 660 are formed on the package substrate 610, and the electrode pads 660 and bumps 640 are electrically connected via through holes. The electrode pads 660 are electrically connected to the image sensor chip 650 by wires 670.

[0401] 19B1 is an external perspective view of the top surface of a sensor module in which an image sensor chip is housed in a lens-integrated package. The sensor module includes a package substrate 611 for fixing an image sensor chip 651, a lens cover 621, and a lens 635. An IC chip 690 having functions such as a light-receiving element drive circuit and a signal conversion circuit is also provided between the package substrate 611 and the image sensor chip 651, and the sensor module is configured as a SiP (System in Package).

[0402] 19B2 is an external perspective view of the underside of the sensor module. The sensor module has a QFN (quad flat no-lead package) configuration with mounting lands 641 provided on the underside and side surfaces of a package substrate 611. Note that this configuration is just one example, and a QFP (quad flat package) or the aforementioned BGA may also be provided.

[0403] 19B3 is a perspective view of the module, omitting a portion of the lens cover 621 and the lens 635. The lands 641 are electrically connected to electrode pads 661, and the electrode pads 661 are electrically connected to the image sensor chip 651 or the IC chip 690 by wires 671.

[0404] By housing the image sensor chip in a package of the above-described type, it becomes easy to mount the image sensor chip on a printed circuit board or the like, and the image sensor chip can be incorporated into various semiconductor devices and electronic devices.

[0405] This embodiment mode can be combined with the descriptions of other embodiment modes as appropriate.

[0406] Embodiment 7 In this embodiment, electronic devices that can use a display device according to one embodiment of the present invention will be described with reference to FIGS.

[0407] The electronic devices of this embodiment include the display device of one embodiment of the present invention. The display device of one embodiment of the present invention can easily achieve high definition, high resolution, and a large size. Therefore, the display device of one embodiment of the present invention can be used as a display portion of various electronic devices.

[0408] Furthermore, the display device of one embodiment of the present invention can be manufactured at low cost, which leads to a reduction in the manufacturing cost of electronic devices.

[0409] Examples of electronic devices include electronic devices with relatively large screens such as television sets, desktop or notebook personal computers, computer monitors, digital signage, large game machines such as pachinko machines, as well as digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, smartphones, wristwatch-type terminals, tablet terminals, personal digital assistants, and sound playback devices.

[0410] In particular, the display device of one embodiment of the present invention can be suitably used in electronic devices having a relatively small display portion because it can increase the resolution. Examples of such electronic devices include information terminals (wearable devices) such as wristwatches and bracelets, as well as head-mounted wearable devices such as VR devices and eyeglass-type AR devices. Examples of wearable devices include devices for Substitutional Reality (SR) and Mixed Reality (MR).

[0411] The display device of one embodiment of the present invention preferably has an extremely high resolution such as HD (1280 × 720 pixels), FHD (1920 × 1080 pixels), WQHD (2560 × 1440 pixels), WQXGA (2560 × 1600 pixels), 4K2K (3840 × 2160 pixels), or 8K4K (7680 × 4320 pixels). A resolution of 4K2K, 8K4K, or higher is particularly preferable. Furthermore, the pixel density (resolution) of the display device of one embodiment of the present invention is preferably 300 ppi or higher, more preferably 500 ppi or higher, more preferably 1000 ppi or higher, more preferably 2000 ppi or higher, more preferably 3000 ppi or higher, more preferably 5000 ppi or higher, and even more preferably 7000 ppi or higher. By using a display device with such high resolution or high definition, it is possible to further enhance the sense of presence and depth in electronic devices for personal use such as portable or home use.

[0412] The electronic device of this embodiment can be incorporated along the curved surface of the inner or outer wall of a house or building, or the interior or exterior of an automobile.

[0413] The electronic device of this embodiment may have an antenna. By receiving a signal through the antenna, images, information, and the like can be displayed on a display portion. In addition, when the electronic device has an antenna and a secondary battery, the antenna may be used for contactless power transmission.

[0414] The electronic device of this embodiment may have a sensor (including the function of detecting, detecting, or measuring force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor, or infrared rays).

[0415] The electronic device of the present embodiment can have various functions, such as a function to display various information (still images, videos, text images, etc.) on a display unit, a touch panel function, a function to display a calendar, date, time, etc., a function to execute various software (programs), a wireless communication function, a function to read out programs or data recorded on a recording medium, etc.

[0416] The electronic device 6500 shown in FIG. 20A is a portable information terminal that can be used as a smartphone.

[0417] The electronic device 6500 includes a housing 6501, a display portion 6502, a power button 6503, a button 6504, a speaker 6505, a microphone 6506, a camera 6507, a light source 6508, and a sensor portion 6520. The display portion 6502 has a touch panel function.

[0418] The display portion 6502 corresponds to the display portion 100 shown in FIGS. 1A to 1C and can be, for example, the display device 400A shown in FIGS. 12A and 12B or the display device 400B shown in FIGS. 13A and 13B. The sensor portion 6520 corresponds to the sensor portion 104 shown in FIGS. 1B and 1C and can be, for example, a package or a sensor module containing an image sensor chip shown in FIGS. 19A1 to 19B3. Note that a configuration without the sensor portion 6520 is also possible. In that case, it is preferable to make the camera 6507 function as the sensor portion 104 shown in FIG. 1A. This allows the electronic device 6500 to function as the display device shown in FIG. 1A.

[0419] FIG. 20B is a schematic cross-sectional view including the end of the housing 6501 on the microphone 6506 side.

[0420] A light-transmitting protective member 6510 is provided on the display surface side of the housing 6501. Note that the protective member 6510 corresponds to the protective member 105 shown in FIGS. 1A to 1C, and the housing 6501 corresponds to the housing 103 shown in FIGS. 1A to 1C.

[0421] A display panel 6511, an optical member 6512, a touch sensor panel 6513, a printed circuit board 6517, a battery 6518, a sensor unit 6520, a housing 6521, and the like are arranged in a space surrounded by a housing 6501 and a protective member 6510. Here, the display panel 6511, the optical member 6512, and the touch sensor panel 6513 are separated from the printed circuit board 6517, the battery 6518, and the sensor unit 6520 by the housing 6521. Note that the housing 6521 may be fixed to the housing 6501, or the housing 6521 and the housing 6501 may be formed integrally.

[0422] A display panel 6511, an optical member 6512, and a touch sensor panel 6513 are fixed to the protective member 6510 by adhesive layers (not shown).

[0423] In a region outside the display portion 6502, a part of the display panel 6511 is folded back, and an FPC 6515 is connected to the folded back part. An IC 6516 is mounted on the FPC 6515. The FPC 6515 is connected to a terminal provided on a printed circuit board 6517. Note that the FPC 6515 may be connected to the terminal of the printed circuit board 6517 through an opening provided in the housing 6521. Similarly, the sensor portion 6520 may also be connected to the terminal of the printed circuit board 6517 by an FPC (not shown).

[0424] The flexible display (flexible display device) of one embodiment of the present invention can be applied to the display panel 6511. Therefore, an extremely lightweight electronic device can be realized. In addition, since the display panel 6511 is extremely thin, a large-capacity battery 6518 can be mounted thereon while keeping the thickness of the electronic device small. Furthermore, by folding back a part of the display panel 6511 and arranging a connection portion with the FPC 6515 on the back side of the pixel portion, an electronic device with a narrow frame can be realized.

[0425] The sensor portion 6520 is preferably fixed to the housing 6521. This fixes the position of the light receiving portion of the sensor portion 6520, thereby enabling more precise sensing. Note that the sensor portion 6520 may be fixed to the housing 6501 without providing the housing 6521.

[0426] The housing 6521 preferably has an opening formed therein so as to expose the light-receiving portion of the sensor portion 6520. When a light-shielding member (for example, an FPC 6515) is disposed so as to overlap the light-receiving portion of the sensor portion 6520, an opening is preferably provided in a region of the light-shielding member that overlaps the light-receiving portion. In this manner, infrared light incident from above the protective member 6510 needs to be received by the sensor portion 6520.

[0427] 21A shows an example of a television set. A television set 7100 has a display portion 7000 built into a housing 7101. Here, the housing 7101 is supported by a stand 7103.

[0428] The display device of one embodiment of the present invention can be applied to the display portion 7000 .

[0429] 21A can be operated using operation switches provided on the housing 7101 and a separate remote control 7111. Alternatively, the display portion 7000 may be provided with a touch sensor, and the television set 7100 may be operated by touching the display portion 7000 with a finger or the like. The remote control 7111 may have a display portion that displays information output from the remote control 7111. Using operation keys or a touch panel provided on the remote control 7111, the channel and volume can be controlled, and an image displayed on the display portion 7000 can be controlled.

[0430] The television device 7100 is configured to include a receiver, a modem, and the like. The receiver can receive general television broadcasts. Furthermore, by connecting to a wired or wireless communication network via the modem, it is possible to perform one-way (from a sender to a receiver) or two-way (between a sender and a receiver, or between receivers, etc.) information communication.

[0431] 21B shows an example of a laptop personal computer 7200. The laptop personal computer 7200 includes a housing 7211, a keyboard 7212, a pointing device 7213, an external connection port 7214, and the like. A display portion 7000 is incorporated in the housing 7211.

[0432] The display device of one embodiment of the present invention can be applied to the display portion 7000 .

[0433] 21C and 21D show an example of digital signage.

[0434] 21C includes a housing 7301, a display portion 7000, and a speaker 7303. The digital signage 7300 may further include an LED lamp, operation keys (including a power switch or an operation switch), a connection terminal, various sensors, a microphone, and the like.

[0435] 21D shows a digital signage 7400 attached to a cylindrical pillar 7401. The digital signage 7400 has a display unit 7000 provided along the curved surface of the pillar 7401.

[0436] 21C and 21D, the display device of one embodiment of the present invention can be applied to the display portion 7000.

[0437] The larger the display unit 7000, the more information can be provided at one time. Also, the larger the display unit 7000, the more easily it will attract people's attention, which can increase the advertising effectiveness of, for example, advertisements.

[0438] Applying a touch panel to the display unit 7000 is preferable because it not only displays images or videos on the display unit 7000 but also allows the user to intuitively operate it. Furthermore, when used to provide information such as route information or traffic information, the intuitive operation can improve usability.

[0439] 21C and 21D , the digital signage 7300 or the digital signage 7400 is preferably capable of wirelessly linking with an information terminal 7311 or an information terminal 7411 such as a smartphone carried by a user. For example, advertising information displayed on the display unit 7000 can be displayed on the screen of the information terminal 7311 or the information terminal 7411. By operating the information terminal 7311 or the information terminal 7411, the display on the display unit 7000 can be switched.

[0440] Furthermore, the digital signage 7300 or the digital signage 7400 can be made to run a game using the screen of the information terminal 7311 or the information terminal 7411 as an operation means (controller), thereby allowing an unspecified number of users to simultaneously participate in and enjoy the game.

[0441] FIG. 22A is a diagram showing the appearance of the camera 8000 with the viewfinder 8100 attached.

[0442] The camera 8000 includes a housing 8001, a display unit 8002, operation buttons 8003, a shutter button 8004, and the like. A detachable lens 8006 is attached to the camera 8000. Note that the lens 8006 and the housing of the camera 8000 may be integrated together.

[0443] The camera 8000 can capture an image by pressing a shutter button 8004 or touching a display portion 8002 that functions as a touch panel.

[0444] The housing 8001 has a mount with electrodes, and can be connected to a finder 8100 as well as a strobe device and the like.

[0445] The finder 8100 includes a housing 8101, a display portion 8102, a button 8103, and the like.

[0446] The housing 8101 is attached to the camera 8000 by a mount that engages with the mount of the camera 8000. The viewfinder 8100 can display an image received from the camera 8000 on a display portion 8102.

[0447] The button 8103 has a function as a power button or the like.

[0448] The display device of one embodiment of the present invention can be applied to a display portion 8002 of a camera 8000 and a display portion 8102 of a finder 8100. Note that the camera 8000 may have a built-in finder.

[0449] FIG. 22B is a diagram showing the appearance of the head-mounted display 8200.

[0450] The head-mounted display 8200 includes a mounting portion 8201, a lens 8202, a main body 8203, a display portion 8204, and a cable 8205. The mounting portion 8201 has a built-in battery 8206.

[0451] A cable 8205 supplies power from a battery 8206 to the main body 8203. The main body 8203 includes a wireless receiver or the like and can display received video information on a display portion 8204. The main body 8203 also includes a camera and can use information on the movement of the user's eyeballs or eyelids as an input means.

[0452] The wearing unit 8201 may have a plurality of electrodes at positions that come into contact with the user, capable of detecting a current that flows in accordance with the movement of the user's eyeballs, and may have a function of recognizing the line of sight. The wearing unit 8201 may also have a function of monitoring the user's pulse based on the current that flows through the electrodes. The wearing unit 8201 may also have various sensors such as a temperature sensor, a pressure sensor, and an acceleration sensor, and may have a function of displaying biometric information of the user on the display unit 8204 and a function of changing an image displayed on the display unit 8204 in accordance with the movement of the user's head.

[0453] The display device of one embodiment of the present invention can be applied to the display portion 8204 .

[0454] 22C to 22E are diagrams showing the appearance of a head mounted display 8300. The head mounted display 8300 includes a housing 8301, a display portion 8302, a band-shaped fixture 8304, and a pair of lenses 8305.

[0455] A user can view the display on the display portion 8302 through the lens 8305. Note that it is preferable to curve the display portion 8302 because the user can feel a high sense of presence. In addition, by viewing different images displayed in different regions of the display portion 8302 through the lens 8305, three-dimensional display using parallax can be performed. Note that the present invention is not limited to a configuration in which one display portion 8302 is provided, and two display portions 8302 may be provided, with one display portion provided for each eye of the user.

[0456] The display device of one embodiment of the present invention can be applied to the display portion 8302. The display device of one embodiment of the present invention can also achieve extremely high definition. For example, even when the display is enlarged and viewed using the lens 8305 as shown in FIG. 22E , the pixels are hardly visible to the user. That is, the display portion 8302 can be used to allow the user to view a highly realistic image.

[0457] 22F is a diagram showing the appearance of a goggle-type head-mounted display 8400. The head-mounted display 8400 includes a pair of housings 8401, an attachment portion 8402, and a buffer member 8403. A display portion 8404 and a lens 8405 are provided in each of the pair of housings 8401. By displaying different images on the pair of display portions 8404, three-dimensional display using parallax can be performed.

[0458] A user can view the display portion 8404 through the lens 8405. The lens 8405 has a focus adjustment mechanism, and its position can be adjusted according to the user's eyesight. The display portion 8404 is preferably a square or a horizontally long rectangle. This can enhance the sense of realism.

[0459] The attachment portion 8402 preferably has plasticity and elasticity so that it can be adjusted according to the size of the user's face and does not slip off. Furthermore, a portion of the attachment portion 8402 preferably has a vibration mechanism that functions as a bone conduction earphone. This allows the user to enjoy video and audio simply by wearing the device, without the need for separate audio equipment such as earphones or speakers. The housing 8401 may also have a function for outputting audio data via wireless communication.

[0460] The mounting portion 8402 and the buffer member 8403 are portions that come into contact with the user's face (forehead, cheeks, etc.). The close contact of the buffer member 8403 with the user's face can prevent light leakage and enhance the sense of immersion. The buffer member 8403 is preferably made of a soft material so that it can be in close contact with the user's face when the user wears the head-mounted display 8400. For example, materials such as rubber, silicone rubber, urethane, and sponge can be used. Furthermore, using a sponge or the like with its surface covered with cloth, leather (natural leather or synthetic leather), or the like can prevent gaps from forming between the user's face and the buffer member 8403, thereby effectively preventing light leakage. Furthermore, using such a material is preferable because it feels pleasant to the touch and prevents the user from feeling cold when worn in cold seasons. It is preferable that the buffer member 8403 or the mounting portion 8402, or other components that come into contact with the user's skin, are removable for easy cleaning or replacement.

[0461] The electronic device shown in Figures 23A to 23F has a housing 9000, a display unit 9001, a speaker 9003, operation keys 9005 (including a power switch or an operation switch), a connection terminal 9006, a sensor 9007 (including the function of detecting, detecting, or measuring force, displacement, position, speed, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor, or infrared rays), a microphone 9008, etc.

[0462] The electronic devices shown in Figures 23A to 23F have various functions. For example, they may have a function to display various information (still images, videos, text images, etc.) on a display unit, a touch panel function, a function to display a calendar, date, or time, a function to control processing using various software (programs), a wireless communication function, a function to read and process programs or data recorded on a recording medium, etc. Note that the functions of the electronic devices are not limited to these, and they may have various other functions. The electronic devices may have multiple display units. Furthermore, the electronic devices may have a function to include a camera or the like to capture still images or videos and store them on a recording medium (external or built-in to the camera), a function to display the captured images on a display unit, etc.

[0463] The display device of one embodiment of the present invention can be applied to the display portion 9001 .

[0464] The electronic device shown in FIGS. 23A to 23F will be described in detail below.

[0465] FIG. 23A is a perspective view showing a mobile information terminal 9101. The mobile information terminal 9101 can be used as, for example, a smartphone. Note that the mobile information terminal 9101 may be provided with a speaker 9003, a connection terminal 9006, a sensor 9007, and the like. The mobile information terminal 9101 can display text and image information on multiple surfaces. FIG. 23A shows an example in which three icons 9050 are displayed. Information 9051, indicated by a dashed rectangle, can also be displayed on another surface of the display unit 9001. Examples of the information 9051 include notifications of incoming emails, SNS messages, phone calls, etc., the title of the email or SNS message, the sender's name, the date and time, the remaining battery level, and the strength of antenna reception. Alternatively, an icon 9050 or the like may be displayed in the position where the information 9051 is displayed.

[0466] 23B is a perspective view showing the mobile information terminal 9102. The mobile information terminal 9102 has a function of displaying information on three or more surfaces of the display unit 9001. Here, an example is shown in which information 9052, information 9053, and information 9054 are displayed on different surfaces. For example, a user can check information 9053 displayed in a position that can be observed from above the mobile information terminal 9102 while the mobile information terminal 9102 is placed in a breast pocket of clothes. The user can check the display without taking the mobile information terminal 9102 out of the pocket and decide, for example, whether to answer a call.

[0467] FIG. 23C is a perspective view showing a wristwatch-type mobile information terminal 9200. The mobile information terminal 9200 can be used as, for example, a smart watch (registered trademark). The display surface of the display unit 9001 is curved, and display can be performed along the curved display surface. The mobile information terminal 9200 can also perform hands-free communication by communicating with, for example, a headset capable of wireless communication. The mobile information terminal 9200 can also perform data transmission and charging with another information terminal through a connection terminal 9006. Charging may be performed by wireless power supply.

[0468] 23D to 23F are perspective views showing a foldable mobile information terminal 9201. Also, FIG. 23D is a perspective view of the mobile information terminal 9201 in an unfolded state, FIG. 23F is a perspective view of the mobile information terminal 9201 in a folded state, and FIG. 23E is a perspective view of a state in the process of changing from one of FIGS. 23D and 23F to the other. The mobile information terminal 9201 is highly portable when folded, and has a seamless, wide display area when unfolded, providing excellent visibility of the display. The display portion 9001 of the mobile information terminal 9201 is supported by three housings 9000 connected by hinges 9055. For example, the display portion 9001 can be bent with a curvature radius of 0.1 mm or more and 150 mm or less.

[0469] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be combined as appropriate with other configuration examples or drawings.

[0470] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0471] 20: light-emitting element, 21: lower electrode, 23: EL layer, 23a: EL layer, 23b: EL layer, 25: upper electrode, 100: display section, 100A: display section, 100B: display section, 100C: display section, 100D: display section, 100E: display section, 100F: display section, 100G: display section, 101: substrate, 102: substrate, 103: housing, 104: sensor section, 105: protective member, 108: finger, 109: face, 110: light-emitting element, 110B: light-emitting element, 110G: light-emitting element, 110IR: light-emitting element, 110R: light-emitting element, 111B: pixel electrode, 111C: connection electrode, 111G: pixel electrode , 111IR: pixel electrode, 111R: pixel electrode, 112B: EL layer, 112Bf: EL film, 112G: EL layer, 112Gf: EL film, 112IR: EL layer, 112IRf: EL film, 112R: EL layer, 112Rf: EL film, 113: common electrode, 114: EL layer, 115B: optical adjustment layer, 115G: optical adjustment layer, 115IR: optical adjustment layer, 115R: optical adjustment layer, 121: protective layer, 122: gap, 130: connecting portion, 131: insulating layer, 143a: resist mask, 143b: resist mask, 143d: resist mask, 143e: resist mask, 144a : sacrificial film, 144b: sacrificial film, 144d: sacrificial film, 145a: sacrificial layer, 145b: sacrificial layer, 145c: sacrificial layer, 145d: sacrificial layer, 146a: protective film, 146b: protective film, 146d: protective film, 147a: protective layer, 147b: protective layer, 147d: protective layer, 201: transistor, 202: transistor, 204: connecting portion, 205: transistor, 209: transistor, 210: transistor, 211: insulating layer, 212: insulating layer, 213: insulating layer, 214: insulating layer, 215: insulating layer, 218: insulating layer, 221: conductive layer, 222a: conductive layer, 222b: conductive layer , 223: conductive layer, 225: insulating layer, 228: region, 231: semiconductor layer, 231i: channel formation region, 231n: low resistance region, 240: capacitance, 241: conductive layer, 242: connection layer, 243: insulating layer, 245: conductive layer, 251: conductive layer, 252: conductive layer, 254: insulating layer, 255: insulating layer, 256: plug, 261: insulating layer, 262: insulating layer, 263: insulating layer, 264: insulating layer, 265: insulating layer, 271: plug, 274: plug, 274a: conductive layer, 274b: conductive layer, 280: display module, 281: display section, 282: circuit section, 283: pixel circuit section,283a: pixel circuit, 284: pixel portion, 284a: pixel, 285: terminal portion, 286: wiring portion, 290: FPC, 291: substrate, 292: substrate, 301: substrate, 310: transistor, 311: conductive layer, 312: low resistance region, 313: insulating layer, 314: insulating layer, 315: element isolation layer, 320: transistor, 321: semiconductor layer, 323: insulating layer, 324: conductive layer, 325: conductive layer, 326: insulating layer, 327: conductive layer, 328: insulating layer, 329: insulating layer, 331: substrate, 332: insulating layer, 400A: display device, 400B: display device, 400C: display device, 40 0D: display device, 400E: display device, 411a: pixel electrode, 411b: pixel electrode, 411c: pixel electrode, 416: protective layer, 416a: inorganic insulating layer, 416b: organic insulating layer, 416c: inorganic insulating layer, 417: light-shielding layer, 419: resin layer, 420: substrate, 421: insulating layer, 426a: optical adjustment layer, 426b: optical adjustment layer, 426c: optical adjustment layer, 426d: optical adjustment layer, 430a: light-emitting element, 430b: light-emitting element, 430c: light-emitting element, 430d: light-emitting element, 442: adhesive layer, 443: space, 451: substrate, 452: substrate, 453: substrate, 454: substrate, 45 5: adhesive layer, 462: display unit, 464: circuit, 465: wiring, 466: conductive layer, 472: FPC, 473: IC, 610: package substrate, 611: package substrate, 620: cover glass, 621: lens cover, 630: adhesive, 635: lens, 640: bump, 641: land, 650: image sensor chip, 651: image sensor chip, 660: electrode pad, 661: electrode pad, 670: wire, 671: wire, 690: IC chip, 4411: light-emitting layer, 4412: light-emitting layer, 4413: light-emitting layer, 4420: layer, 4420-1: layer, 4 420-2: layer, 4430: layer, 4430-1: layer, 4430-2: layer, 6500: electronic device, 6501: housing, 6502: display unit, 6503: power button, 6504: button, 6505: speaker, 6506: microphone, 6507: camera, 6508: light source, 6510: protective member, 6511: display panel, 6512: optical member, 6513: touch sensor panel, 6515: FPC, 6516: IC, 6517: printed circuit board, 6518: battery, 6520: sensor unit, 6521: housing, 7000: display unit, 7100: television device, 7101: housing,7103: Stand, 7111: Remote control device, 7200: Notebook personal computer, 7211: Housing, 7212: Keyboard, 7213: Pointing device, 7214: External connection port, 7300: Digital signage, 7301: Housing, 7303: Speaker, 7311: Information terminal, 7400: Digital signage, 7401: Pillar, 7411: Information terminal, 8000: Camera, 8001: Housing, 8002: Display unit, 8003: Operation buttons, 8004: Shutter button, 8006: Lens, 8100: Viewfinder, 8101: Housing, 8102: Display unit, 8103: Button, 8200: Head-mounted display, 8201: Mounting unit, 8202: Lens, 8203: Main body, 8 204: display unit, 8205: cable, 8206: battery, 8300: head mounted display, 8301: housing, 8302: display unit, 8304: fixture, 8305: lens, 8400: head mounted display, 8401: housing, 8402: attachment part, 8403: cushioning material, 8404: display unit, 8405: lens, 9000: housing, 9001: display unit, 9003: speaker, 9005: operation keys, 9006: connection terminal, 9007: sensor, 9008: microphone, 9050: icon, 9051: information, 9052: information, 9053: information, 9054: information, 9055: hinge, 9101: mobile information terminal, 9102: mobile information terminal, 9200: mobile information terminal, 9201: mobile information terminal,

Claims

1. A display device having a display section having a plurality of pixels and a sensor section, One of the pixels has at least a first light-emitting element and a second light-emitting element, The first light-emitting element has a first light-emitting layer having a function of emitting visible light, the second light-emitting element has a second light-emitting layer having a function of emitting infrared light, a first conductive layer having a region located above the first light-emitting layer and a region located above the second light-emitting layer, and having a function as a common electrode for the first light-emitting element and a function as a common electrode for the second light-emitting element; the first light-emitting element and the second light-emitting element each have a function of emitting light toward the first conductive layer; The sensor unit has a light receiving element having a function of detecting infrared light, The display device, wherein the light receiving element is disposed outside the display unit and on the back side.

2. A display device having a display unit having a plurality of pixels and a sensor unit, One of the pixels has at least a first light-emitting element and a second light-emitting element, The first light-emitting element has a first light-emitting layer having a function of emitting visible light, the second light-emitting element has a second light-emitting layer having a function of emitting infrared light, a first conductive layer having a region located above the first light-emitting layer and a region located above the second light-emitting layer, and having a function as a common electrode for the first light-emitting element and a function as a common electrode for the second light-emitting element; the first light-emitting element and the second light-emitting element each have a function of emitting light toward the first conductive layer; The sensor unit has a light receiving element having a function of detecting infrared light, The light receiving element is disposed on a rear surface side of the pixel.

3. In claim 1 or 2, The display device, wherein the first conductive layer functions as a common electrode for a first light-emitting element and a second light-emitting element disposed in one of the pixels and in one of the pixels adjacent to the one of the pixels.