Processing system and measurement system

Abstract

This processing system comprises a processing device capable of processing an object by radiating a processing beam at the object, a measurement device capable of measuring the positions of the object and the processing device, and a control device capable of controlling the processing device. The processing device comprises a first movement device capable of changing the position of a processing head for emitting the processing beam, and a second movement device on which the first movement device is placed and that is capable of moving with the first movement device. The control device controls the movement by the second movement device on the basis of the result of measurement by the measurement device and model information pertaining to the shape of the object.

Description

Processing and Measuring Systems

[0001] The present invention relates to the technical field of, for example, a processing system that processes an object and a measurement system that can measure an object.

[0002] As a processing system capable of processing an object, Patent Document 1 describes a processing system that processes an object by irradiating a surface of the object with processing light. This type of processing system is required to process the object appropriately. Also, a measurement system that can measure an object is required to measure the object appropriately.

[0003] International Publication No. 2000 / 054925

[0004] According to a first aspect, there is provided a processing system for processing an object, comprising: a processing device capable of processing the object by irradiating a processing beam onto the object; a measuring device capable of measuring the position of the object and the position of the processing device; and a control device capable of controlling the processing device, wherein the processing device comprises a first moving device capable of changing the position of a processing head that emits the processing beam; and a second moving device on which the first moving device is mounted and which can move together with the first moving device, and the control device controls the movement of the second moving device based on the measurement results of the measuring device and model information regarding the shape of the object.

[0005] According to a second aspect, there is provided a processing system for processing an object, comprising: a processing device capable of processing the object by irradiating the object with a processing beam; and a measuring device equipped with a measuring head capable of measuring an object to be processed by the processing device or an object processed by the processing device, wherein the processing device comprises a first moving device capable of changing the position of the processing head that emits the processing beam, and a second moving device on which the first moving device is mounted and movable together with the first moving device, and the measuring device comprises a third moving device capable of changing the position of the measurement head, and a fourth moving device on which the third moving device is mounted and movable together with the third moving device.

[0006] According to a third aspect, there is provided a processing system for processing an object, comprising: a processing device capable of processing the object by irradiating the object with a processing beam; a measuring device capable of measuring the position of the object; and a control device capable of controlling the processing device, wherein the processing device comprises a first moving device capable of changing the position of a processing head that emits the processing beam; and a second moving device on which the first moving device is mounted and which is capable of moving on a first plane, and the control device controls the movement of the second moving device on the first plane based on the measurement results of the measuring device and model information regarding the shape of the object.

[0007] According to a fourth aspect, there is provided a processing system for processing an object, comprising: a processing device capable of processing the object by irradiating the object with a processing beam; an imaging device capable of imaging the object; and a control device capable of controlling the processing device, wherein the processing device comprises a first moving device capable of changing the position of a processing head that emits the processing beam; and a second moving device on which the first moving device is mounted and which is capable of moving on a first plane, and the control device controls the movement of the second moving device on the first plane based on the imaging results of the imaging device and model information regarding the shape of the object.

[0008] According to a fifth aspect, there is provided a measurement system comprising: a measurement device equipped with a measurement head capable of measuring the position or shape of an object; a measurement device capable of measuring the position of the object and also capable of measuring the position of the measurement device; and a control device capable of controlling the measurement device, wherein the measurement device comprises a first moving device capable of changing the position of the measurement head, and a second moving device on which the first moving device is placed and which is movable on a first plane, and the control device controls the movement on the first plane by the second moving device based on the measurement results of the measurement device and model information related to the shape of the object.

[0009] According to a sixth aspect, there is provided a measurement system comprising a measurement device equipped with a measurement head capable of measuring the position or shape of an object, a measurement device capable of measuring the position of the object, and a control device capable of controlling the measurement device, wherein the measurement device comprises a first moving device capable of changing the position of the measurement head, and a second moving device on which the first moving device is placed and which is capable of moving on a first plane, and the control device controls the movement of the second moving device on the first plane based on the measurement results of the measurement device and model information regarding the shape of the object.

[0010] According to a seventh aspect, there is provided a measurement system comprising a measurement device equipped with a measurement head capable of measuring the position or shape of an object, an imaging device capable of imaging the object, and a control device capable of controlling the measurement device, wherein the measurement device comprises a first moving device capable of changing the position of the measurement head, and a second moving device on which the first moving device is placed and which is capable of moving on a first plane, and the control device controls the movement of the second moving device on the first plane based on the imaging results of the imaging device and model information regarding the shape of the object.

[0011] According to an eighth aspect, there is provided a processing system for processing an object, comprising a processing device capable of processing the object by irradiating the object with a processing beam, a measuring device capable of measuring the position of the object, and a control device capable of controlling the processing device, wherein the processing device comprises a first moving device capable of changing the position of a processing head that emits the processing beam, and a second moving device on which the first moving device is mounted and which is capable of moving on a first plane.

[0012] FIG. 1 is a schematic diagram showing an example of the overall configuration of a machining system in this embodiment. FIG. 2 is a side view showing the appearance of a machining apparatus in this embodiment. FIG. 3 is a block diagram showing the overall configuration of the machining apparatus in this embodiment. FIG. 4 is a schematic diagram showing the configuration of a self-propelled drive system and an arm drive system. FIG. 5 is a schematic diagram showing the configuration of a fine movement drive system. FIG. 6 is a side view showing the appearance of a measuring apparatus in this embodiment. FIG. 7 is a block diagram showing the overall configuration of the measuring apparatus in this embodiment. FIG. 8 is a schematic diagram showing the configuration of a self-propelled drive system and an arm drive system. FIG. 9 is a front view showing the appearance of a position measuring apparatus in this embodiment. FIG. 10 is a block diagram showing the configuration of a position measuring apparatus in this embodiment. FIG. 11 is a block diagram showing the configuration of a control server 4 in this embodiment. FIG. 12 shows the data structure of a machining information DB. FIG. 13 shows the data structure of a measurement information DB. FIG. 14 is a schematic diagram showing a specific example of a workpiece machined by a machining apparatus and measured by a measuring apparatus. FIG. 15 is a flowchart showing the flow of machining operations. FIG. 16 is a top view showing the positional relationship between a position measurement device and an aircraft, which is an example of a workpiece. FIG. 17 is a top view showing an aircraft, which is an example of a workpiece. FIG. 18 is a flowchart showing the operation flow for moving the machining head in step S112 of FIG. 15. FIG. 19 is a top view showing an example of a fine-adjustment area. FIG. 20 is a flowchart showing the operation flow for measuring. FIGS. 21(a) to 21(c) are cross-sectional views showing a processing device that processes a workpiece and a measuring device that measures the workpiece. FIG. 22 is a cross-sectional view showing a workpiece including a substrate and a film. FIG. 23 is a top view conceptually showing a non-processing area set on a workpiece. FIG. 24 is a block diagram showing the configuration of a processing system in a first modified example. FIGS. 25(a) and 25(b) each schematically show an example of uses of at least two processing devices 1 and at least two measuring devices 2. FIG. 26 is a block diagram showing the configuration of a processing device in a second modified example. FIG. 27 is a block diagram showing the configuration of a control server in a third modified example.

[0013] Hereinafter, embodiments of a processing system, a processing method, a measurement system, and a measurement method will be described with reference to the drawings. Hereinafter, embodiments of a processing system, a processing method, a measurement system, and a measurement method will be described using a processing system SYS. However, the present invention is not limited to the embodiments described below.

[0014] In the following description, the positional relationships of the various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For ease of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (i.e., a predetermined direction within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) will be referred to as the θX direction, θY direction, and θZ direction, respectively.

[0015] (1) Configuration of Machining System SYS First, the configuration of the machining system SYS in this embodiment will be described.

[0016] (1-1) Overall Configuration of Machining System SYS First, the overall configuration of the machining system SYS in this embodiment will be described with reference to Fig. 1. Fig. 1 is a block diagram showing the overall configuration of the machining system SYS in this embodiment.

[0017] As shown in FIG. 1, the machining system SYS includes a machining device 1, a measuring device 2, a position measuring device 3, and a control server 4.

[0018] Each of the processing device 1, the measuring device 2, and the position measuring device 3 can communicate with the control server 4 via a communication network. That is, the control server 4 can communicate with each of the processing device 1, the measuring device 2, and the position measuring device 3 via the communication network. The communication network may typically include a wireless communication network. An example of a wireless communication network is a communication network that complies with the IMT (International Mobile Telecommunication) standard (e.g., a communication network that complies with 4G, 5G, or 6G). Another example of a wireless communication network is a wireless LAN (Local Area Network). Another example of a wireless communication network is a communication network that can perform optical wireless communication.

[0019] The processing device 1 is capable of processing a workpiece W, which is an example of an object, under the control of the control server 4. The workpiece W may be, for example, a metal, an alloy (e.g., duralumin, etc.), a semiconductor (e.g., silicon), a resin, a composite material such as CFRP (Carbon Fiber Reinforced Plastic), paint (e.g., a paint layer applied to a substrate), glass, or an object made of any other material.

[0020] The processing device 1 may perform additional processing on the workpiece W. In other words, the processing device 1 may perform additional processing to form a shaped object on the workpiece W. The processing device 1 may perform subtractive processing on the workpiece W. In other words, the processing device 1 may perform subtractive processing to remove a portion of the workpiece W. The processing device 1 may perform marking processing to form a desired mark on the surface of the workpiece W. The processing device 1 may perform peening processing to change the surface characteristics of the workpiece W. The processing device 1 may perform peeling processing to peel off the surface of the workpiece W. The processing device 1 may perform welding processing to join one workpiece W to another workpiece W. The processing device 1 may perform cutting processing to cut the workpiece W.

[0021] The processing device 1 may process the workpiece W to form a desired structure on the surface of the workpiece W. However, the processing device 1 may perform processing other than the processing for forming the desired structure on the surface of the workpiece W.

[0022] An example of a desired structure is a riblet structure. The riblet structure may include a structure that can reduce the resistance of the surface of the workpiece W to the fluid (particularly, at least one of frictional resistance and turbulent frictional resistance). For this reason, the riblet structure may be formed on a workpiece W having a component that is installed (in other words, located) in the fluid. Note that the term "fluid" here refers to a medium (e.g., at least one of gas and liquid) that flows relative to the surface of the workpiece W. For example, when the surface of the workpiece W moves relative to a medium while the medium itself is stationary, this medium may also be referred to as a fluid. Note that the state in which the medium is stationary may also refer to a state in which the medium is not moving relative to a predetermined reference object (e.g., the ground surface).

[0023] Examples of workpieces W on which riblet structures can be formed include at least one of an aircraft, a wind turbine, an engine turbine, and a power-generating turbine. When such riblet structures are formed on the workpiece W, the workpiece W becomes more easily movable relative to the fluid. This reduces the resistance that hinders the movement of the workpiece W relative to the fluid, leading to energy savings. In other words, it becomes possible to manufacture environmentally friendly workpieces W. For example, if the workpiece W is a component exposed on the surface of an aircraft (e.g., at least a part of the aircraft), the resistance that hinders the movement of the aircraft is reduced, leading to fuel savings for the aircraft. For example, if the workpiece W is a wind turbine (e.g., at least a part of the wind turbine), the resistance that hinders the movement (typically, rotation) of the wind turbine is reduced, leading to higher efficiency of the wind turbine. For example, if the workpiece W is an engine turbine (e.g., at least a part of the engine turbine), the resistance that hinders the movement (typically, rotation) of the engine turbine is reduced, leading to higher efficiency and energy savings for the engine turbine. For example, if the workpiece W is a power generation turbine (e.g., at least a part of a power generation turbine), the resistance that hinders the movement (typically, rotation) of the power generation turbine is reduced, which leads to higher efficiency of the power generation turbine (i.e., improved power generation efficiency). The processing device 1 may be able to contribute to "13.2.2 Reduce total greenhouse gas emissions per year," one of the targets set out in Goal 13 of the United Nations-led Sustainable Development Goals (SDGs), "Take urgent action to combat climate change and its impact."

[0024] The measuring device 2 is capable of measuring the workpiece W under the control of the control server 4. For example, the measuring device 2 may measure the workpiece W that is to be machined by the processing device 1. For example, the measuring device 2 may measure the workpiece W that has already been machined by the processing device 1. The measuring device 2 may be capable of measuring the position of the workpiece W. In other words, the measurement of the workpiece W by the measuring device 2 may include measuring the position of the workpiece W. The measuring device 2 may be capable of measuring the shape (e.g., three-dimensional shape) of the workpiece W. In other words, the measurement of the workpiece W by the measuring device 2 may include measuring the shape of the workpiece W.

[0025] Since the machining system SYS is capable of measuring the workpiece W using the measuring device 2, the machining system SYS may also be called a measuring system.

[0026] The position measuring device 3 is capable of measuring the position of the measurement object. The operation of measuring the position of the measurement object may mean an operation of obtaining information that directly or indirectly indicates the position of the measurement object as a measurement result. The measurement object may include the workpiece W. The measurement object may include the processing device 1. The measurement object may include the measuring device 2. In other words, the position measuring device 3 may be capable of measuring the position of at least one of the workpiece W, the processing device 1, and the measuring device 2.

[0027] The position measuring device 3 can measure the position of a measurement target object within a measurement coordinate system defined based on the position measuring device 3. In this embodiment, an example will be described in which the measurement coordinate system of the position measuring device 3 is used as a reference coordinate system that serves as the reference for the machining system SYS. The measurement coordinate system (i.e., the reference coordinate system) may be, for example, a coordinate system in which the X-axis and Y-axis directions are horizontal, the Z-axis direction is vertical, and the origin position is set based on the position where the position measuring device 3 is disposed. In the following description, unless otherwise specified, the X-axis, Y-axis, and Z-axis may refer to the X-axis, Y-axis, and Z-axis, respectively, in the measurement coordinate system (i.e., the reference coordinate system). For example, the position measuring device 3 may measure the position of the workpiece W in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. For example, the position measuring device 3 may measure the position of the machining device 1 in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. For example, the position measuring device 3 may measure the position of the measuring device 2 in at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction.

[0028] The position of the workpiece W measured by the position measuring device 3 (i.e., the position of the workpiece W indicated by the measurement results of the position measuring device 3) may be used as a reference position serving as a reference for the workpiece W. In this case, the position measuring device 3 may be considered to be measuring the reference position of the workpiece W. Similarly, the position of the processing device 1 measured by the position measuring device 3 (i.e., the position of the processing device 1 indicated by the measurement results of the position measuring device 3) may be used as a reference position serving as a reference for the processing device 1. In this case, the position measuring device 3 may be considered to be measuring the reference position of the processing device 1. Similarly, the position of the measuring device 2 measured by the position measuring device 3 (i.e., the position of the measuring device 2 indicated by the measurement results of the position measuring device 3) may be used as a reference position serving as a reference for the measuring device 2. In this case, the position measuring device 3 may be considered to be measuring the reference position of the measuring device 2.

[0029] The control server 4 may be capable of controlling the processing device 1. For example, the control server 4 may control the processing device 1 so that the processing device 1 processes the workpiece W in a desired processing manner. To control the processing device 1, the control server 4 may receive (i.e., acquire) position information indicating measurement results of the position of at least one of the workpiece W, the processing device 1, and the measuring device 2 from the position measuring device 3 via a communication network. The control server 4 may generate processing control information for controlling the processing device 1 based on the position information. The control server 4 may transmit (i.e., output) the generated processing control information to the processing device 1 via the communication network. The processing device 1 may process the workpiece W based on the processing control information transmitted from the control server 4.

[0030] The control server 4 may manage the progress status of machining of the workpiece W by the machining device 1. In this case, the control server 4 may receive (i.e., acquire) machining progress information regarding the progress status of machining of the workpiece W by the machining device 1 from the machining device 1 via the communication network. The machining device 1 may transmit (i.e., output) the machining progress information to the control server 4 via the communication network.

[0031] The control server 4 may be capable of controlling the measuring device 2 in addition to or instead of being capable of controlling the processing device 1. For example, the control server 4 may control the measuring device 2 so that the measuring device 2 measures the workpiece W in a desired measurement manner. To control the measuring device 2, the control server 4 may receive (i.e., acquire) position information indicating measurement results of the positions of at least one of the workpiece W, the processing device 1, and the measuring device 2 from the measuring device 2 via a communication network. The control server 4 may generate measurement control information for controlling the measuring device 2 based on the position information. The control server 4 may transmit (i.e., output) the generated measurement control information to the measuring device 2 via the communication network. The measuring device 2 may measure the workpiece W based on the measurement control information transmitted from the control server 4.

[0032] The control server 4 may acquire the measurement results of the workpiece W by the measuring device 2. In this case, the control server 4 may receive (i.e., acquire) measurement result information regarding the measurement results of the workpiece W by the measuring device 2 from the measuring device 2 via the communication network. The measuring device 2 may transmit (i.e., output) the measurement result information to the control server 4 via the communication network.

[0033] The control server 4 may control at least one of the processing device 1 and the measuring device 2 using the measurement result information acquired from the measuring device 2. For example, the control server 4 may generate processing control information based on the above-mentioned position information and measurement result information. For example, the control server 4 may generate measurement control information based on the above-mentioned position information and measurement result information.

[0034] The machining system SYS may include at least one of the machining apparatus 1, the measuring apparatus 2, and the position measuring apparatus 3, but may not include at least one other of the machining apparatus 1, the measuring apparatus 2, and the position measuring apparatus 3. For example, the machining system SYS may include the machining apparatus 1 and the measuring apparatus 2, but may not include the position measuring apparatus 3. For example, the machining system SYS may include the measuring apparatus 2 and the position measuring apparatus 3, but may not include the machining apparatus 1. For example, the machining system SYS may include the machining apparatus 1 and the position measuring apparatus 3, but may not include the measuring apparatus 2.

[0035] (1-2) Configuration of Processing Apparatus 1 Next, the configuration of the processing apparatus 1 in this embodiment will be described.

[0036] (1-2-1) Overall Configuration of Processing Apparatus 1 First, the overall configuration of the processing apparatus 1 in this embodiment will be described with reference to Fig. 2. Fig. 2 is a side view that schematically shows the appearance of the processing apparatus 1 in this embodiment.

[0037] As shown in FIG. 2, the processing apparatus 1 may process a workpiece W placed on a support surface SS. In the example shown in FIG. 2, the workpiece W may be placed on the support surface SS via a support member SM that supports the workpiece W on the support surface SS. The support member SM may be movable on the support surface SS. In this case, the support member SM may function as a transport device that transports the workpiece W to a desired position. Alternatively, the support member SM may not be movable on the support surface SS. The support member SM may be fixed to the support surface SS. Alternatively, the workpiece W may be placed directly on the support surface SS. Note that the workpiece W may be placed on a self-propelled drive system or a movable stage. In this case, the position of the workpiece W relative to the support surface SS is changeable.

[0038] In this embodiment, the processing apparatus 1 irradiates the workpiece W with processing light EL (i.e., an energy beam in the form of light) in order to process the workpiece W. In other words, the processing apparatus 1 processes the workpiece W by irradiating the workpiece W with the processing light EL. The processing light EL may be any type of light as long as it can process the workpiece W when irradiated onto the workpiece W. In this embodiment, the processing light EL will be described using an example in which the processing light EL is laser light. However, the processing light EL may be a type of light other than laser light. Furthermore, the wavelength of the processing light EL may be any wavelength as long as it can process the workpiece W when irradiated onto the workpiece W. For example, the processing light EL may be visible light or invisible light (e.g., at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The processing light EL may include pulsed light (e.g., pulsed light having an emission time of picoseconds or less). Alternatively, the processing light EL may not include pulsed light. In other words, the processing light EL may be continuous light.

[0039] In order to process the workpiece W using the processing light EL, as shown in FIG. 2 and FIG. 3, which is a block diagram showing the overall configuration of the processing device 1, the processing device 1 is equipped with a processing light source 11, a processing head 12, a head drive system 13, and a control device 14.

[0040] The processing light source 11 is capable of generating processing light EL. The processing light source 11 emits the generated processing light EL toward the processing head 12 via a light-transmitting member (not shown). An example of the light-transmitting member is at least one of an optical fiber and a light pipe.

[0041] The machining head 12 irradiates the workpiece W with the machining light EL emitted from the machining light source 11. In order to irradiate the workpiece W with the machining light EL, the machining head 12 is equipped with a machining optical system 121. The machining head 12 irradiates the workpiece W with the machining light EL via the machining optical system 121. In other words, the machining optical system 121 is an optical system for irradiating the workpiece W with the machining light EL. For this reason, the machining optical system 121 may also be referred to as an irradiation optical system.

[0042] The processing optical system 121 may include a focus optical element 1211. For example, the focus optical element 1211 may be capable of changing the convergence position of the processing light EL. In particular, the focus optical element 1211 may be capable of changing the convergence position of the processing light EL in a direction along the optical axis AX of the processing optical system 121. Because the optical axis AX of the processing light EL typically intersects with the surface of the workpiece W, the focus optical element 1211 may be capable of changing the convergence position of the processing light EL in a direction intersecting with the surface of the workpiece W.

[0043] The head drive system 13 moves the machining head 12. For this reason, the head drive system 13 may be referred to as a moving device. Specifically, the head drive system 13 moves the machining head 12 relative to the workpiece W. In order to move the machining head 12, the head drive system 13 includes a self-propelled drive system 131, an arm drive system 132, and a fine movement drive system 133. However, the head drive system 13 does not necessarily have to include at least one of the self-propelled drive system 131, the arm drive system 132, and the fine movement drive system 133.

[0044] The configurations of the self-propelled drive system 131, the arm drive system 132, and the fine movement drive system 133 will be described in detail later with reference to FIGS. 4 and 5 . Here, the self-propelled drive system 131, the arm drive system 132, and the fine movement drive system 133 will be briefly described below. The self-propelled drive system 131 is capable of moving on a support surface SS that supports or places the workpiece W. In particular, the self-propelled drive system 131 is capable of self-propelling on the support surface SS that supports or places the workpiece W. The self-propelled drive system 131 moves the machining head 12 (i.e., changes the position of the machining head 12) by self-propelling on the support surface SS. The arm drive system 132 is a drive system that can function as a robot arm that moves the machining head 12 (i.e., changes the position of the machining head 12). Like the arm drive system 132, the fine movement drive system 133 is also a drive system that moves the machining head 12 (i.e., changes the position of the machining head 12).

[0045] The self-propelled drive system 131, the arm drive system 132, and the fine movement drive system 133 each move the machining head 12 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. However, in this embodiment, the self-propelled drive system 131 moves on a support surface SS. The support surface SS is typically a surface along the XY plane. Therefore, the following description will discuss an example in which the self-propelled drive system 131 can move the machining head 12 along each of the X-axis direction and the Y-axis direction. Furthermore, the following description will discuss an example in which the arm drive system 132 can move the machining head 12 along each of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. Note that moving the machining head 12 along at least one of the θX direction, the θY direction, and the θZ direction may be considered equivalent to changing the orientation of the machining head 12 around at least one of the X-axis, the Y-axis, and the Z-axis. Alternatively, moving the machining head 12 along at least one of the θX direction, the θY direction, and the θZ direction may be considered equivalent to rotating the machining head 12 around at least one of the X-axis, the Y-axis, and the Z-axis. The support surface SS may be a surface inclined with respect to the XY plane, or may be a non-planar surface.

[0046] When the machining head 12 moves, the positional relationship between the machining head 12 and the workpiece W changes. Furthermore, when the positional relationship between the workpiece W and the machining head 12 changes, the positional relationship between the workpiece W and the machining optical system 121 provided in the machining head 12 changes. Furthermore, when the positional relationship between the workpiece W and the machining head 12 changes, the irradiation position of the machining light EL on the workpiece W changes. Therefore, moving the machining head 12 is equivalent to changing the irradiation position of the machining light EL on the workpiece W.

[0047] The control device 14 controls the operation of the processing device 1. For example, the control device 14 may control at least one of the processing light source 11, the processing head 12, and the head drive system 13 provided in the processing device 1 so as to process the workpiece W in a desired processing mode based on processing control information transmitted from the control server 4. Furthermore, the control device 14 may monitor the progress of processing of the workpiece W by the processing device 1 and generate processing progress information regarding the processing progress. The control device 14 may transmit the generated processing progress information to the control server 4.

[0048] The control device 14 may include, for example, an arithmetic device and a storage device. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The control device 14 functions as a device that controls the operation of the machining device 1 by the arithmetic device executing a computer program. This computer program is a computer program for causing the arithmetic device to perform (i.e., execute) the operations to be performed by the control device 14, which will be described later. In other words, this computer program is a computer program for causing the control device 14 to function so as to cause the machining device 1 to perform the operations to be performed later. The computer program executed by the arithmetic device may be recorded in a storage device (i.e., a recording medium) included in the control device 14, or may be recorded in any storage medium (e.g., a hard disk or semiconductor memory) built into or externally attachable to the control device 14. Alternatively, the arithmetic device may download the computer program to be executed from a device external to the control device 14 via a network interface.

[0049] The control device 14 may control the emission mode of the processing light EL by the processing head 12. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes multiple pulsed lights, the emission mode may include, for example, at least one of the emission time of the pulsed light, the emission cycle of the pulsed light, and the ratio between the emission time of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control device 14 may control the movement mode of the processing head 12 by the head drive system 13. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time).

[0050] The control device 14 does not have to be provided inside the processing apparatus 1. For example, the control device 14 may be provided as a server or the like outside the processing apparatus 1. In this case, the control device 14 and the processing apparatus 1 may be connected via a wired and / or wireless network (or a data bus and / or a communication line). As the wired network, for example, a network using a serial bus interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB may be used. As the wired network, a network using a parallel bus interface may be used. As the wired network, a network using an interface compliant with Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. As the wireless network, a network using radio waves may be used. An example of a network using radio waves is a network compliant with IEEE 802.1x (e.g., at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control device 14 and the processing device 1 may be configured to be able to transmit and receive various information via the network. The control device 14 may also be capable of transmitting information such as commands and control parameters to the processing device 1 via the network. The processing device 1 may include a receiving device that receives information such as commands and control parameters from the control device 14 via the network. The processing device 1 may also include a transmitting device (i.e., an output device that outputs information to the control device 14) that transmits information such as commands and control parameters to the control device 14 via the network. Alternatively, a first control device that performs part of the processing performed by the control device 14 may be provided inside the processing device 1, while a second control device that performs another part of the processing performed by the control device 14 may be provided outside the processing device 1.The control device 14 or the second control device provided outside the processing device 1 may be provided in a location different from the facility (e.g., a hangar) where the processing device 1 is used.

[0051] A computational model that can be constructed by machine learning may be implemented in the control device 14 by the computation device executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The control device 14 may control the operation of the processing device 1 using the computational model. That is, the operation of controlling the operation of the processing device 1 may include the operation of controlling the operation of the processing device 1 using the computational model. Note that the control device 14 may be implemented with a computational model that has been constructed by offline machine learning using teacher data. Furthermore, the computational model implemented in the control device 14 may be updated by online machine learning on the control device 14. Alternatively, the control device 14 may control the operation of the processing device 1 using a computational model implemented in a device external to the control device 14 (i.e., a device provided outside the processing device 1) in addition to or instead of the computational model implemented in the control device 14.

[0052] The recording medium for recording the computer program executed by the control device 14 may be at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVD-RW, a DVD+RW, and an optical disk such as Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one form such as software or firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control device 14 (i.e., a computer) when the control device 14 executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit)) provided in the control device 14, or may be realized in a form that combines logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0053] The processing device 1 may include a power supply. For example, the processing device 1 may include a power supply disposed on the carriage 1311 of the self-propelled drive system 131. The processing device 1 may operate using power supplied from the power supply. For example, the processing light source 11 may generate processing light EL using power supplied from the power supply. For example, the head drive system 13 may move the processing head 12 using power supplied from the power supply. The power supply may be rechargeable. For example, the power supply may be capable of contactless charging (wireless charging).

[0054] (1-2-2) Configuration of Head Drive System 13 Next, we will explain an example of the configuration of the head drive system 13. As described above, the head drive system 13 includes a self-propelled drive system 131, an arm drive system 132, and a fine movement drive system 133. Therefore, below, we will explain the self-propelled drive system 131, the arm drive system 132, and the fine movement drive system 133 in that order.

[0055] (1-2-2-1) Configuration of Self-Propelled Drive System 131 First, the self-propelled drive system 131 will be described with reference to Fig. 4. Fig. 4 is a cross-sectional view showing the configuration of the self-propelled drive system 131.

[0056] As shown in Fig. 4, the self-propelled drive system 131 includes a bogie 1311 and a motor 1312. The bogie 1311 is a platform equipped with wheels. The bogie 1311 is placed on a support surface SS. The wheels of the bogie 1311 can rotate using the power of the motor 1312. As a result, the bogie 1311 can move on the support surface SS using the power of the motor 1312, which is driven under the control of the control device 14. In other words, the bogie 1311 can self-propel on the support surface SS using the power of the motor 1312.

[0057] In this way, the self-propelled drive system 131 can self-propel on the support surface SS. That is, because the support surface SS is a surface along the XY plane as described above, the self-propelled drive system 131 can self-propel along at least one of the X-axis direction and the Y-axis direction. Note that the phrase "the state in which the self-propelled drive system 131 self-propels on the support surface SS" here may also mean a state in which the self-propelled drive system 131 moves relative to the support surface SS using power generated by the self-propelled drive system 131 itself.

[0058] An arm drive system 132 is placed on the carriage 1311. Specifically, the arm drive system 132 is attached (i.e., fixed) to the carriage 1311 (to the upper surface of the carriage 1311 in the example shown in FIG. 4 ). Therefore, when the carriage 1311 moves, the arm drive system 132 also moves. That is, the self-propelled drive system 131 moves together with the arm drive system 132. Furthermore, a fine movement drive system 133 is connected to the arm drive system 132. Specifically, the fine movement drive system 133 is attached (i.e., fixed) to the arm drive system 132. Therefore, when the carriage 1311 moves, the fine movement drive system 133 also moves. That is, the self-propelled drive system 131 moves together with the fine movement drive system 133. Furthermore, the machining head 12 is connected to the fine movement drive system 133. Specifically, the machining head 12 is attached (i.e., fixed) to the fine movement drive system 133. Therefore, when the carriage 1311 moves, the machining head 12 also moves. In other words, the self-propelled drive system 131 moves together with the machining head 12. Therefore, the self-propelled drive system 131 can function as a moving device that moves the machining head 12 by self-propelling. The self-propelled drive system 131 can function as a moving device that changes the position of the machining head 12.

[0059] (1-2-2-2) Configuration of Arm Drive System 132 Next, the configuration of the arm drive system 132 will be described with reference to Fig. 4. Fig. 4 is a cross-sectional view showing the configuration of the arm drive system 132.

[0060] As shown in Fig. 4, the arm drive system 132 includes a base 1320. The base 1320 is connected to the self-propelled drive system 131 (specifically, a carriage 1311). That is, the base 1320 is attached to (i.e., fixed to) the carriage 1311. One end of a robot arm 1321 is attached to the base 1320. The base 1320 supports the robot arm 1321.

[0061] The robot arm 1321 includes a plurality of arm members 1322. The plurality of arm members 1322 are movably connected via at least one joint member 1323. The robot arm 1321 may be a manipulator with three or more degrees of freedom. Therefore, the arm drive system 132 may function as a robot having a so-called vertical multi-joint structure. Note that the arm drive system 132 is not limited to robots having a vertical multi-joint structure. For example, the arm drive system 132 may function as a polar coordinate robot, cylindrical coordinate robot, Cartesian coordinate robot, or parallel link robot having a horizontal multi-joint structure.

[0062] The joint member 1323 may connect at least two arm members 1322 such that one arm member 1322 connected to the joint member 1323 can rotate around one drive axis (e.g., at least one of a rotation axis about the X-axis, a rotation axis about the Y-axis, and a rotation axis about the Z-axis) with respect to the other arm member 1322 connected to the joint member 1323. The joint member 1323 may connect at least two arm members such that one arm member 1322 connected to the joint member 1323 can move along one drive axis (e.g., at least one of a movement axis along the X-axis, a movement axis along the Y-axis, and a movement axis along the Z-axis) with respect to the other arm member 1322 connected to the joint member 1323.

[0063] The two arm members 1322 connected via joint members 1323 are moved by actuators 1324 corresponding to each joint. Figure 4 shows an example in which the arm drive system 132 is equipped with four actuators 1324 corresponding to the four joint members 1323. As a result, at least one arm member 1322 moves. Therefore, at least one arm member 1322 is movable with respect to the workpiece W. In other words, at least one arm member 1322 is movable so that the relative positional relationship between the at least one arm member 1322 and the workpiece W is changed.

[0064] A fine movement drive system 133 is connected to the robot arm 1321. Specifically, the fine movement drive system 133 is connected (i.e., attached or fixed) to one of the multiple arm members 1322 that is located farthest from the base 1320. For ease of explanation, the arm member 1322 to which the fine movement drive system 133 is attached will be referred to as the distal arm member 1325 below. The fine movement drive system 133 may be attached directly to the distal arm member 1325, or may be attached indirectly to the distal arm member 1325 via another member. The distal arm member 1325 may also be referred to as a connecting member to which the fine movement drive system 133 is connected.

[0065] When the distal arm member 1325 is moved by the actuator 1324 described above, the distal arm member 1325 moves relative to the base 1320. In other words, when the distal arm member 1325 moves, the relative position between the base 1320 and the distal arm member 1325 changes. As a result, the fine movement drive system 133 attached to the distal arm member 1325 also moves. Therefore, the arm drive system 132 can move the fine movement drive system 133. Specifically, the arm drive system 132 can move the fine movement drive system 133 relative to the workpiece W. The arm drive system 132 can move the fine movement drive system 133 so that the relative positional relationship between the fine movement drive system 133 and the workpiece W is changed. Furthermore, when the fine movement drive system 133 moves, the machining head 12 attached to the fine movement drive system 133 also moves. Therefore, the arm drive system 132 can function as a moving device that moves the machining head 12. The arm drive system 132 can function as a moving device that changes the position of the machining head 12. Here, the distal arm member 1325 of the robot arm 1321 may be referred to as a movable part.

[0066] (1-2-2-3) Configuration of Fine Movement Drive System 133 Next, the configuration of the fine movement drive system 133 will be described with reference to Fig. 5. Fig. 5 is a cross-sectional view showing the configuration of the fine movement drive system 133.

[0067] As shown in FIG. 5, the fine movement drive system 133 includes a support member 1331 , a support member 1332 , an air spring 1333 , a damper member 1334 , and a drive member 1335 .

[0068] The support member 1331 is connected to the arm drive system 132. Specifically, the support member 1331 is attached (i.e., fixed) to the distal arm member 1325 of the arm drive system 132. The support member 1332 is attached to the machining head 12.

[0069] The support member 1331 and the support member 1332 are coupled (in other words, linked or connected) via the air spring 1333, the damper member 1334, and the drive member 1335. That is, the air spring 1333, the damper member 1334, and the drive member 1335 are attached to the support members 1331 and 1332, respectively, so as to couple the support member 1331 and the support member 1332. Because the arm drive system 132 is attached to the support member 1331 and the machining head 12 is attached to the support member 1332, the air spring 1333, the damper member 1334, and the drive member 1335 can be considered to be attached to the support members 1331 and 1332, respectively, so as to substantially couple the arm drive system 132 and the machining head 12.

[0070] The air spring 1333, under the control of the control device 14, applies an elastic force caused by the pressure of gas (air, for example) to at least one of the support members 1331 and 1332. The air spring 1333, under the control of the control device 14, applies an elastic force caused by the pressure of the gas to at least one of the arm drive system 132 and the machining head 12 via at least one of the support members 1331 and 1332. In particular, the air spring 1333 may apply an elastic force caused by the pressure of the gas to at least one of the arm drive system 132 and the machining head 12 along the direction in which the support members 1331 and 1332 are aligned (for example, the Z-axis direction).

[0071] In order to impart elastic force resulting from gas pressure, gas is supplied to the air spring 1333 from a gas supply device 13361 via a pipe 13362 and a valve 13363. The control device 14 controls at least one of the gas supply device 13361 and the valve 13363 based on the measurement result of a pressure gauge 1336 that measures the pressure of the gas in the air spring 1333.

[0072] The air spring 1333 may use its elastic force to support the weight of the machining head 12 under the control of the control device 14. In this case, the air spring 1333 may function as a weight canceller that cancels the weight of the machining head 12. Under the control of the control device 14, the air spring 1333 may use its elastic force to reduce (in other words, damp) vibrations transmitted between the arm drive system 132 and the machining head 12 via the fine movement drive system 133.

[0073] The damper member 1334 applies an elastic force caused by a factor other than air pressure to at least one of the support members 1331 and 1332. The damper member 1334 applies an elastic force caused by a factor other than air pressure to at least one of the arm drive system 132 and the machining head 12 via at least one of the support members 1331 and 1332. In particular, the damper member 1334 may apply an elastic force to at least one of the arm drive system 132 and the machining head 12 along a direction in which the support members 1331 and 1332 are aligned (for example, the Z-axis direction).

[0074] The damper member 1334 may support the weight of the machining head 12 by using elastic force, similar to the air spring 1333. The damper member 1334 may reduce vibrations transmitted between the arm drive system 132 and the machining head 12 via the fine movement drive system 133 by using elastic force, similar to the air spring 1333.

[0075] The damper member 1334 may be any member that can apply elastic force. For example, the damper member 1334 may include a compression spring coil. For example, the damper member 1334 may include a leaf spring.

[0076] The driving member 1335 is capable of generating a driving force under the control of the control device 14. The driving member 1335 is capable of applying the generated driving force to at least one of the support members 1331 and 1332. The driving member 1335 is capable of applying the generated driving force to at least one of the arm drive system 132 and the machining head 12 via at least one of the support members 1331 and 1332. The driving member 1335 may have any configuration as long as it is capable of generating a driving force. For example, the driving member 1335 may be configured to be capable of electrically generating a driving force. For example, the driving member 1335 may be configured to be capable of magnetically generating a driving force. As an example, FIG. 5 shows an example in which the driving member 1335 is a voice coil motor (VCM) capable of electrically generating a driving force.

[0077] The driving member 1335 may use a driving force to move at least one of the support members 1331 and 1332 under the control of the control device 14. The driving member 1335 may use a driving force to move at least one of the support members 1331 and 1332 under the control of the control device 14, thereby moving at least one of the arm driving system 132 and the machining head 12. In this case, the driving member 1335 may use a driving force to move at least one of the arm driving system 132 and the machining head 12, thereby changing the relative position between the arm driving system 132 and the machining head 12.

[0078] Under the control of the control device 14, the drive member 1335 may change the relative position between the arm drive system 132 and the machining head 12 based on the measurement results of a position measurement device 1337 provided in the fine movement drive system 133. The position measurement device 1337 measures the relative position between the arm drive system 132 and the machining head 12. For example, the position measurement device 1337 may be an encoder including a detection unit 13371 attached to the support member 1331 and a scale unit 13372 attached to the support member 1332. The measurement results of the position measurement device 1337 include information regarding the relative positions of the support members 1331 and 1332. Because the arm drive system 132 is attached to the support member 1331 and the machining head 12 is attached to the support member 1332, the information regarding the relative positions between the support members 1331 and 1332 includes information regarding the relative positions of the arm drive system 132 and the machining head 12. Therefore, the control device 14 can appropriately identify the relative position between the arm drive system 132 and the machining head 12. As a result, the control device 14 can appropriately change the relative position between the arm drive system 132 and the machining head 12 based on the measurement result of the position measurement device 1337.

[0079] The driving member 1335 may change the relative position between the arm drive system 132 and the machining head 12 (typically, move the machining head 12 with respect to the arm drive system 132) under the control of the control device 14, thereby moving the machining head 12 with respect to the workpiece W. The driving member 1335 may move (i.e., drive) the machining head 12 so that the relative positional relationship between the machining head 12 and the workpiece W is changed.

[0080] Here, since the support member 1332 to which the processing head 12 is attached is moved by the drive member 1335, the support member 1332 may also be referred to as a movable part. Furthermore, since the fine movement drive system 133 is moved by the arm drive system 132, at least some of the components constituting the fine movement drive system 133 may also be referred to as a movable part.

[0081] The drive member 1335 may use a driving force to change the relative position of the arm drive system 132 and the machining head 12 under the control of the control device 14, thereby reducing vibrations transmitted between the arm drive system 132 and the machining head 12 via the fine movement drive system 133. A device that actively reduces vibrations using an elastic member such as an air spring 1333 and the drive member 1335 may be referred to as an active vibration isolation device. For this reason, the fine movement drive system 133 may also be referred to as an active vibration isolation device. An active vibration isolation device may also be referred to as an active vibration isolation system (AVIS).

[0082] (1-2-2-4) Relationship between the self-propelled drive system 131, the arm drive system 132, and the fine movement drive system 133 The arm drive system 132 moves the machining head 12 with a smaller movement stroke than the self-propelled drive system 131. In other words, the self-propelled drive system 131 moves the machining head 12 with a larger movement stroke than the arm drive system 132. Note that the movement stroke may mean the maximum amount of movement in one direction. However, the arm drive system 132 may move the machining head 12 with a movement stroke that is the same as or larger than that of the self-propelled drive system 131.

[0083] On the other hand, the movement accuracy (in other words, movement resolution) of the machining head 12 by the arm drive system 132 is higher than the movement accuracy of the machining head 12 by the self-propelled drive system 131. In other words, the movement accuracy of the machining head 12 by the self-propelled drive system 131 is lower than the movement accuracy of the machining head 12 by the arm drive system 132. Note that the movement accuracy (movement resolution) may mean the limit value of the fineness of movement (for example, the minimum movement amount). However, the movement accuracy of the machining head 12 by the arm drive system 132 may be the same as or lower than the movement accuracy of the machining head 12 by the self-propelled drive system 131.

[0084] The fine movement drive system 133 moves the machining head 12 with a smaller movement stroke than the arm drive system 132. In other words, the arm drive system 132 moves the machining head 12 with a larger movement stroke than the fine movement drive system 133. However, the fine movement drive system 133 may move the machining head 12 with the same or larger movement stroke as the arm drive system 132.

[0085] On the other hand, the movement accuracy of the machining head 12 by the fine movement drive system 133 is higher than the movement accuracy of the machining head 12 by the arm drive system 132. In other words, the movement accuracy of the machining head 12 by the arm drive system 132 is lower than the movement accuracy of the machining head 12 by the fine movement drive system 133. However, the movement accuracy of the machining head 12 by the fine movement drive system 133 may be the same as or lower than the movement accuracy of the machining head 12 by the arm drive system 132.

[0086] In this case, the machining system SYS may use the self-propelled drive system 131 to align the machining head 12 with respect to the workpiece W. In parallel with or subsequent to the alignment of the machining head 12 by the self-propelled drive system 131, the machining system SYS may use the arm drive system 132 to align the machining head 12 with respect to the workpiece W with finer or higher accuracy than the self-propelled drive system 131. In parallel with or subsequent to the alignment of the machining head 12 by the arm drive system 132, the machining system SYS may use the fine movement drive system 133 to align the machining head 12 with respect to the workpiece W with finer or higher accuracy than the arm drive system 132. Alternatively, the processing system SYS may use the fine-motion drive system 133 to align the processing head 12 with respect to the workpiece W so that the positional relationship between the workpiece W and the processing head 12 is maintained at the desired positional relationship (for example, the distance between the workpiece W and the processing head 12 is maintained constant).

[0087] In addition, since the processing head 12 is moved by the self-propelled drive system 131, the arm drive system 132 and / or the fine movement drive system 133, the processing head 12 may also be referred to as a movable part.

[0088] (1-3) Configuration of the Measuring Apparatus 2 Next, the configuration of the measuring apparatus 2 in this embodiment will be described with reference to Fig. 6. Fig. 6 is a side view that schematically shows the appearance of the measuring apparatus 2 in this embodiment.

[0089] As shown in Fig. 6, the measuring device 2 may measure a workpiece W placed on a support surface SS. To measure the workpiece W, as shown in Fig. 6 and Fig. 7, which is a block diagram showing the overall configuration of the measuring device 2, the measuring device 2 includes a measuring head 22, a head drive system 23, and a control device 24.

[0090] The measurement head 22 measures the workpiece W. For example, the measurement head 22 may measure the position of the workpiece W. For example, the measurement head 22 may measure the shape (e.g., three-dimensional shape) of the workpiece W.

[0091] The measurement head 22 may have any configuration as long as it is capable of measuring the workpiece W. For example, the measurement head 22 may be a non-contact measurement device that can measure the workpiece W without contacting the workpiece W. For example, the measurement head 22 may be a contact measurement device that can measure the workpiece W by contacting the workpiece W. An example of a non-contact measurement device is an optical measurement device that optically measures the workpiece W. An example of a contact measurement device is a probe measurement device that measures the workpiece W by contacting a probe with the workpiece W.

[0092] An example of an optical measuring device is a measuring device (e.g., an imaging device such as a camera) that measures the workpiece W by capturing an image of the workpiece W. An example of an optical measuring device is a measuring device that uses a pattern projection method. A measuring device that uses the pattern projection method may measure the workpiece W by projecting slit light onto the surface of the workpiece W and measuring the shape of the projected slit light. An example of an optical measuring device is a measuring device that uses a pattern projection method. A measuring device that uses the pattern projection method may measure the workpiece W by projecting pattern light onto the surface of the workpiece W and measuring the shape of the projected pattern light. An example of an optical measuring device is a measuring device that uses an interferometry method. A measuring device that uses an interferometry method may measure the workpiece W by measuring the interference pattern between object light that passes through the workpiece W and reference light that does not pass through the workpiece W. An example of an optical measuring device is a measuring device that uses a time-of-flight method. A measuring device using the time-of-flight method may measure the workpiece W by projecting measurement light onto the surface of the workpiece W and measuring the distance from the measuring device to the workpiece W based on the time it takes for the projected measurement light to return from the workpiece W to the measuring device, at multiple positions on the workpiece W. Other examples of optical measuring devices include measuring devices that use at least one of a moire topography method (specifically, a grating irradiation method or a grating projection method), a holographic interferometry method, an autocollimation method, a stereo method, an astigmatism method, a critical angle method, and a knife-edge method.

[0093] The head drive system 23 moves the measurement head 22. For this reason, the head drive system 23 may be referred to as a moving device. Specifically, the head drive system 23 moves the measurement head 22 relative to the workpiece W. In order to move the measurement head 22, the head drive system 23 includes a self-propelled drive system 231, an arm drive system 232, and a fine movement drive system 233. However, the head drive system 23 does not necessarily have to include at least one of the self-propelled drive system 231, the arm drive system 232, and the fine movement drive system 233.

[0094] The configuration of the self-propelled drive system 231 provided in the measuring device 2 may be the same as the configuration of the self-propelled drive system 131 provided in the processing device 1. Specifically, as shown in FIG. 8 , which is a cross-sectional view showing the configuration of the self-propelled drive system 231, the self-propelled drive system 231 includes a carriage 2311 and a motor 2312. The characteristics of the carriage 2311 may be the same as the characteristics of the carriage 1311 shown in FIG. 4 . The characteristics of the motor 2312 may be the same as the characteristics of the motor 1312 shown in FIG. 4 . Therefore, the above description of the self-propelled drive system 131 can be used as a description of the self-propelled drive system 231 by replacing the terms carriage 1311, motor 2312, and processing head 12 with the terms carriage 2311, motor 2312, and measuring head 22, respectively. Therefore, a detailed description of the self-propelled drive system 231 will be omitted.

[0095] The configuration of the arm drive system 232 included in the measuring device 2 may be the same as the configuration of the arm drive system 132 included in the processing device 1. Specifically, as shown in FIG. 8 , which is a cross-sectional view showing the configuration of the arm drive system 232, the arm drive system 232 includes a base 2320 and a robot arm 2321 (specifically, a plurality of arm members 2322 including a distal arm member 2325, a plurality of joint members 2323, and a plurality of actuators 2324). The characteristics of the base 2320 may be the same as the characteristics of the base 1320 shown in FIG. 4 . The characteristics of the robot arm 2321 may be the same as the characteristics of the robot arm 1321 shown in FIG. 4 . The characteristics of the arm member 2322 may be the same as the characteristics of the arm member 1322 shown in FIG. 4 . The characteristics of the joint member 2323 may be the same as the characteristics of the joint member 1323 shown in FIG. 4 . The characteristics of the actuator 2324 may be the same as the characteristics of the actuator 1324 shown in FIG. 4 . The features of the distal arm member 2325 may be the same as the features of the distal arm member 1325 shown in Fig. 4. Therefore, the above description of the arm drive system 132 can be used as a description of the arm drive system 232 by replacing the terms "base 1320," "robot arm 1321," "arm member 1322," "joint member 1323," "actuator 1324," distal arm member 1325," "self-propelled drive system 131," "fine movement drive system 133," and "processing head 12" with "base 2320," "robot arm 2321," "arm member 2322," "joint member 2323," "actuator 2324," distal arm member 2325," "self-propelled drive system 231," "fine movement drive system 233," and "measuring head 22," respectively. Therefore, a detailed description of the arm drive system 232 will be omitted.

[0096] The configuration of the fine movement drive system 233 provided in the measuring device 2 may be the same as the configuration of the fine movement drive system 133 provided in the processing device 1. In other words, the fine movement drive system 233 may have the configuration shown in Fig. 5 which shows the configuration of the fine movement drive system 133. Therefore, a detailed description of the fine movement drive system 233 will be omitted.

[0097] The self-propelled drive system 231, the arm drive system 232, and the fine movement drive system 233 each move the measurement head 22 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. However, in this embodiment, the self-propelled drive system 231 moves by itself on the support surface SS. The support surface SS is typically a surface along the XY plane. Therefore, in the following description, an example will be described in which the self-propelled drive system 231 is capable of moving the measurement head 22 along each of the X-axis direction and the Y-axis direction. Furthermore, in the following description, an example will be described in which the arm drive system 232 is capable of moving the measurement head 22 along each of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. Note that moving the measurement head 22 along at least one of the θX direction, the θY direction, and the θZ direction may be considered equivalent to changing the orientation of the measurement head 22 around at least one of the X-axis, the Y-axis, and the Z-axis. Alternatively, moving the measurement head 22 along at least one of the θX direction, the θY direction, and the θZ direction may be considered equivalent to rotating the measurement head 22 around at least one of the X axis, the Y axis, and the Z axis.

[0098] When the measurement head 22 moves, the positional relationship between the measurement head 22 and the workpiece W changes. When the positional relationship between the workpiece W and the measurement head 22 changes, the measurement area of ​​the measurement head 22 moves on the workpiece W. Therefore, moving the measurement head 22 is equivalent to moving the measurement area on the workpiece W. Note that, because the measurement head 22 moves by the self-propelled drive system 231, the arm drive system 232, and / or the fine movement drive system 233, the measurement head 22 may also be referred to as a movable part.

[0099] The control device 24 controls the operation of the measuring device 2. For example, the control device 24 may control at least one of the measuring head 22 and the head drive system 23 provided in the measuring device 2 so as to measure the workpiece W in a desired measurement manner based on measurement control information transmitted from the control server 4. Furthermore, the control device 24 may transmit measurement result information regarding the measurement results of the workpiece W by the measuring device 2 to the control server 4.

[0100] The control device 24 may include, for example, an arithmetic device and a storage device. The arithmetic device may include, for example, at least one of a CPU and a GPU. The storage device may include, for example, a memory. The control device 24 functions as a device that controls the operation of the measurement device 2 by the arithmetic device executing a computer program. This computer program is a computer program for causing the arithmetic device to perform (i.e., execute) the operations to be performed by the control device 24, which will be described later. In other words, this computer program is a computer program for causing the control device 24 to function so as to cause the measurement device 2 to perform the operations to be performed later. The computer program executed by the arithmetic device may be recorded in a storage device (i.e., a recording medium) included in the control device 24, or may be recorded in any storage medium (e.g., a hard disk or semiconductor memory) built into or externally attachable to the control device 24. Alternatively, the arithmetic device may download the computer program to be executed from a device external to the control device 24 via a network interface.

[0101] The control device 24 may control the measurement mode of the workpiece W by the measurement head 22. The measurement mode may include, for example, at least one of a measurement position and a measurement time. The control device 24 may control the movement mode of the measurement head 22 by the head drive system 23. The movement mode may include, for example, at least one of a movement amount, a movement speed, a movement direction, and a movement timing (movement time).

[0102] The control device 24 does not have to be provided inside the measurement device 2. For example, the control device 24 may be provided outside the measurement device 2 as a server or the like. In this case, the control device 24 and the measurement device 2 may be connected via a wired and / or wireless network (or a data bus and / or communication line). The wired network may be a network using a serial bus interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an interface compliant with Ethernet (registered trademark), such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless network may be a network using radio waves. An example of a network using radio waves is a network compliant with IEEE 802.1x (e.g., at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control device 24 and the measurement device 2 may be configured to be able to send and receive various information via the network. The control device 24 may also be able to send information such as commands and control parameters to the measurement device 2 via the network. The measurement device 2 may include a receiving device that receives information such as commands and control parameters from the control device 24 via the network. The measurement device 2 may also include a transmitting device (i.e., an output device that outputs information to the control device 24) that transmits information such as commands and control parameters to the control device 24 via the network. Alternatively, a first control device that performs part of the processing performed by the control device 24 may be provided inside the measurement device 2, while a second control device that performs another part of the processing performed by the control device 24 may be provided outside the measurement device 2.

[0103] A computational model that can be constructed by machine learning may be implemented within the control device 24 by the computational device executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning the computational model may include learning parameters of the neural network (e.g., at least one of a weight and a bias). The control device 24 may control the operation of the measurement device 2 using the computational model. That is, the operation of controlling the operation of the measurement device 2 may include the operation of controlling the operation of the measurement device 2 using the computational model. The control device 24 may be implemented with a computational model that has been constructed by offline machine learning using teacher data. Furthermore, the computational model implemented in the control device 24 may be updated by online machine learning on the control device 24. Alternatively, the control device 24 may control the operation of the measurement device 2 using a computational model implemented in a device external to the control device 24 (i.e., a device external to the measurement device 2), in addition to or instead of the computational model implemented in the control device 24.

[0104] The recording medium for recording the computer program executed by the control device 24 may be at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVD-RW, a DVD+RW, and an optical disk such as Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control device 24 when the control device 24 (i.e., the computer) executes the computer program, or may be realized by hardware such as a specified gate array (FPGA, ASIC) provided in the control device 24, or may be realized in a form that mixes logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0105] The measuring device 2 may be equipped with a power supply. For example, the measuring device 2 may be equipped with a power supply arranged on the carriage 2311 of the self-propelled drive system 231. The measuring device 2 may operate using power supplied from the power supply. For example, the measuring unit 221 may measure the workpiece W using power supplied from the power supply. Processing light EL may be generated. For example, the head drive system 23 may move the measuring head 22 using power supplied from the power supply. The power supply may be rechargeable. For example, the power supply may be capable of contactless charging (wireless charging).

[0106] (1-4) Configuration of Position Measuring Device 3 Next, we will explain the configuration of the position measuring device 3. As described above, the position measuring device 3 can measure the position of at least one of the workpiece W, the processing device 1, and the measuring device 2. The position measuring device 3 may have any configuration as long as it can measure the position of at least one of the workpiece W, the processing device 1, and the measuring device 2.

[0107] In this embodiment, an example will be described in which the position measuring device 3 measures the position of a measurement object including at least one of a workpiece W, a processing device 1, and a measuring device 2 using the measurement light ML. In this case, the position measuring device 3 may measure the position of the measurement object by irradiating the measurement light ML onto the measurement object and detecting return light of the measurement light ML from the measurement object. The return light of the measurement light ML from the measurement object may include at least one of reflected light of the measurement light ML by the measurement object and scattered light of the measurement light ML by the measurement object.

[0108] In order to irradiate the measurement object with the measurement light ML, the position measuring device 3 may be disposed at a position away from the measurement object. In other words, the position measuring device 3 may be disposed at a position away from at least one of the workpiece W, the processing device 1, and the measuring device 2. In this case, the position measuring device 3 may irradiate the measurement object with the measurement light ML from a position away from the measurement object. The position measuring device 3 may detect the return light of the measurement light ML from the measurement object at a position away from the measurement object.

[0109] The position measuring device 3 may irradiate the measurement light ML toward a desired measurement target portion of the measurement object and detect the measurement light ML from the desired measurement target portion of the measurement object. If a reflector capable of reflecting the measurement light ML (typically capable of retroreflection) is attached to the measurement target portion, the position measuring device 3 may irradiate the measurement light ML toward the reflector and detect the measurement light ML from the reflector. In either case, the position measuring device 3 can measure the position of the desired measurement target portion of the measurement object.

[0110] The position measuring device 3 may irradiate the measuring light ML toward each of a plurality of measurement target portions of the measurement object and detect the measuring light ML from the plurality of measurement target portions of the measurement object. In this case, the position measuring device 3 can measure the positions of the plurality of measurement target portions of the measurement object.

[0111] An example of a position measurement device 3 that measures the position of a measurement object using measurement light ML is a measurement device including a laser radar system (e.g., a measurement device using frequency-modulated measurement light) described in U.S. Patent Application Publication No. 2012 / 188557. An example of a position measurement device 3 including the laser radar system described in U.S. Patent Application Publication No. 2012 / 188557 will be described below with reference to FIGS. 9 and 10 . FIG. 9 is a front view showing the appearance of the position measurement device 3. FIG. 10 is a block diagram showing the configuration of the position measurement device 3.

[0112] As shown in FIG. 9 , the position measuring device 3 includes a base 310 and a housing 320. The base 310 is a platform that supports the housing 320. The base 310 may be disposed on a support surface SS on which the workpiece W, the processing device 1, and the measuring device 2 are disposed, for example. The base 310 may be disposed on the support surface SS via a support member (not shown), or may be disposed directly on the support surface SS. The housing 320 is a member that accommodates the optical assembly 330 shown in FIG. 10 . The housing 320 may be rotatable around a predetermined rotation axis. In the example shown in FIG. 9 , the housing 320 is rotatable around a rotation axis along the Y axis and a rotation axis along the Z axis.

[0113] As shown in FIG. 10, optical assembly 330 includes measurement light source 331 , pointing beam source 332 , beam splitter 333 , beam splitter 334 , beam splitter 335 , mirror 336 , optical circuit 337 , and detector 338 .

[0114] The measurement light source 331 generates measurement light ML. A portion of the measurement light ML generated by the measurement light source 331 is emitted from an exit port 321 formed in the housing 320 via beam splitters 334 and 335 and a mirror 336. The measurement light ML emitted from the exit port 321 is incident on the measurement object. As described above, when the housing 320 rotates around the rotation axis, the emission direction of the measurement light ML from the position measurement device 3 changes. Therefore, the position measurement device 3 may rotate the housing 320 so that the measurement light ML is incident on a desired measurement target portion of the measurement object. At least a portion of the measurement light ML reflected by the measurement object (hereinafter referred to as "return light RL") is incident on the optical assembly 330 via the exit port 321. The return light RL incident on the optical assembly 330 is incident on the detector 338 via the mirror 336 and the beam splitter 335. Meanwhile, another part of the measurement light ML generated by the measurement light source 331 is incident on a detector 338 via a beam splitter 334 and an optical circuit 337 described in U.S. Patent Application Publication No. 2012 / 188557 (or U.S. Patent No. 4,733,606, etc.). The position measuring device 3 transmits the detection result of the detector 338 to the control server 4 as position information indicating the measurement result of the position of at least one of the workpiece W, the processing device 1, and the measuring device 2.

[0115] The control server 4 calculates the position of the measurement object based on the detection results of the measurement light ML and the return light RL by the detector 338. For example, the control server 4 calculates the position of the measurement object based on the detection results of the measurement light ML and the return light RL by the detector 338 using optical heterodyne detection as described in U.S. Patent Application Publication No. 2012 / 188557 (or U.S. Patent No. 4,733,606, etc.).

[0116] The pointing beam source 332 generates a pointing beam B. The pointing beam B is used to identify a position on the measurement object to which the measurement light ML is directed. The pointing beam B may include visible light. The pointing beam B generated by the pointing beam source 332 is emitted from an emission port 321 formed in the housing 320 via beam splitters 333, 334, and 335 and a mirror 336. The pointing beam B emitted from the emission port 321 is incident on the measurement object. However, the optical assembly 330 does not have to irradiate the pointing beam B onto the measurement object.

[0117] The position measuring device 3 is not limited to a measuring device including a laser radar system as described in U.S. Patent Application Publication No. 2012 / 188557. For example, the position measuring device 3 may be a measuring device including a laser coordinate measuring device as described in U.S. Patent No. 7,800,758 (e.g., a measuring device using intensity-modulated measuring light). For example, the position measuring device 3 may be a measuring device including an absolute distance meter as described in U.S. Patent No. 6,847,436 (e.g., a measuring device using intensity-modulated measuring light).

[0118] (1-5) Configuration of Control Server 4 Next, the control server 4 in this embodiment will be described with reference to Fig. 11. Fig. 11 is a block diagram showing the configuration of the control server 4 in this embodiment.

[0119] 11 , the control server 4 may include a calculation device 41, a storage device 42, a communication device 43, an input device 44, and an output device 45. The calculation device 41, the storage device 42, the communication device 43, the input device 44, and the output device 45 may be connected via a data bus 46.

[0120] The arithmetic device 41 includes, for example, at least one of a CPU and a GPU. The arithmetic device 41 loads a computer program. For example, the arithmetic device 41 may load a computer program stored in the storage device 42. For example, the arithmetic device 41 may load a computer program stored in a computer-readable, non-transitory storage medium using a storage medium reading device (not shown). The arithmetic device 41 may acquire (i.e., download or load) the computer program from a device (not shown) located outside the control server 4 via the communication device 43. The arithmetic device 41 executes the loaded computer program. As a result, logical functional blocks for executing operations to be performed by the control server 4 are realized within the arithmetic device 41. In other words, the arithmetic device 41 can function as a controller for realizing the logical functional blocks for executing operations to be performed by the control server 4.

[0121] A computational model that can be constructed by machine learning may be implemented within the computational device 41 by the computational device 41 executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The computational device 41 may use the computational model to execute the operation to be performed by the control server 4. The computational device 41 may be implemented with a computational model that has been constructed by offline machine learning using teacher data. Furthermore, the computational model implemented in the computational device 41 may be updated by online machine learning on the computational device 41. Alternatively, the computational device 41 may execute the operation to be performed by the control server 4 using a computational model implemented in a device external to the computational device 41 (i.e., a device external to the control server 4), in addition to or instead of the computational model implemented in the computational device 41.

[0122] 11 shows an example of logical functional blocks realized in the arithmetic device 41. As shown in FIG. 11, an information acquisition unit 411 and a control information generation unit 412 are realized in the arithmetic device 41. The information acquisition unit 411 may receive (i.e., acquire) machining progress information from the machining device 1 using the communication device 43. The information acquisition unit 411 may receive (i.e., acquire) measurement result information from the measuring device 2 using the communication device 43. The information acquisition unit 411 may receive (i.e., acquire) position information from the position measuring device 3 using the communication device 43. The control information generation unit 412 may generate machining control information and measurement control information based on the position information.

[0123] The storage device 42 can store desired data. For example, the storage device 42 may temporarily store a computer program executed by the arithmetic device 41. The storage device 42 may temporarily store data that the arithmetic device 41 temporarily uses when the arithmetic device 41 is executing a computer program. The storage device 42 may store data that the control server 4 stores long-term. The storage device 42 may include at least one of a RAM (Random Access Memory), a ROM (Read Only Memory), a hard disk device, a magneto-optical disk device, an SSD (Solid State Drive), and a disk array device. In other words, the storage device 42 may include a non-temporary recording medium.

[0124] In the present embodiment, the storage device 42 may store a processing information DB 421 and a measurement information DB 422. The processing information DB 421 is a database for storing information related to the processing device 1. The measurement information DB 422 is a database for storing information related to the measuring device 2.

[0125] An example of the data structure of the processing information DB 421 is shown in FIG. 12. As shown in FIG. 12, the processing information DB 421 includes a plurality of processing information records 4210. Each processing information record 4210 may include device identification information 4211, time information 4212, and processing device information 4213. The device identification information 4211 is information for uniquely identifying the processing device 1. The time information 4212 is information indicating a time corresponding to the processing device information 4213. The processing device information 4213 is information related to the processing device 1. For example, the processing device information 4213 may include device position information indicating the position of the processing device 1 at the time indicated by the time information 4212. The processing device information 4213 may include processing progress information acquired by the information acquisition unit 411. The processing progress information may include information related to the progress of the processing operation at the time indicated by the time information 4212. In other words, the machining progress information may include information regarding the proportion of steps that the machining device 1 has completed relative to the total steps of the machining operation that the machining device 1 is to perform (i.e., progress rate). The machining progress information may include information regarding a machined area of ​​the workpiece W where machining by the machining device 1 has been completed. The machining progress information may include information regarding an incomplete area of ​​the workpiece W where machining by the machining device 1 has not yet been completed. If the machining device 1 is equipped with a power supply, the machining device information 4213 may include information regarding the amount of time the machining device 1 can operate using the power stored in the power supply (i.e., the remaining power supply).

[0126] In addition to the processing progress information, the information acquisition unit 411 may receive (i.e., acquire) information necessary to construct the processing information DB 421 (for example, at least one of device identification information 4211, time information 4212, and processing device information 4213) from the processing device 1.

[0127] An example of the data structure of the measurement information DB 422 is shown in FIG. 13. As shown in FIG. 13, the measurement information DB 421 includes a plurality of measurement information records 4220. Each measurement information record 4220 may include device identification information 4221, time information 4222, and measurement device information 4223. The device identification information 4221 is information for uniquely identifying the measurement device 2. The time information 4222 is information indicating a time corresponding to the measurement device information 4223. The measurement device information 4223 is information related to the measurement device 2. For example, the measurement device information 4223 may include measurement result information indicating the measurement results by the measurement device 2 at the time indicated by the time information 4222 (i.e., measurement result information acquired by the information acquisition unit 411). The measurement device information 4223 may include measurement progress information. The measurement progress information may include information related to the progress of the measurement operation at the time indicated by the time information 4222. In other words, the measurement progress information may include information regarding the proportion of the steps that the measuring device 2 has completed relative to the overall steps of the measurement operation that the measuring device 2 is to perform (i.e., progress rate). The measurement progress information may include information regarding measurement-completed areas of the workpiece W where measurement by the measuring device 2 has been completed. The measurement progress information may include information regarding measurement-incomplete areas of the workpiece W where measurement by the measuring device 2 has not yet been completed. If the measuring device 2 is equipped with a power supply, the measuring device information 4223 may include information regarding the amount of time the measuring device 2 can operate using the power stored in the power supply (i.e., the remaining power supply).

[0128] In addition to the measurement result information, the information acquisition unit 411 may receive (i.e., acquire) information necessary to construct the measurement information DB 422 (e.g., at least one of device identification information 4221, time information 4222, and measurement device information 4223) from the measurement device 2.

[0129] The storage device 42 may store a processing information DB 421 having an arbitrary data format (in other words, an arbitrary file format). For example, the storage device 42 may store the processing information DB 421 as data (file) in the tabular format shown in FIG. 12. Similarly, the storage device 42 may store a measurement information DB 422 having an arbitrary data format (in other words, an arbitrary file format). For example, the storage device 42 may store the measurement information DB 422 as data (file) in the tabular format shown in FIG. 13.

[0130] Referring again to FIG. 11, the communication device 43 is capable of communicating with each of the processing device 1, the measuring device 2, and the position measuring device 3 via a communication network.

[0131] The input device 44 is a device that accepts information input to the control server 4 from outside the control server 4. For example, the input device 44 may include an operation device (for example, at least one of a keyboard, a mouse, and a touch panel) that can be operated by an operator (for example, a user of the machining system SYS). For example, the input device 44 may include a reading device that can read information recorded as data on a recording medium that can be externally attached to the control server 4. For example, the input device 44 may include a receiving device that can receive information that a device external to the control server 4 transmits as data to the control server 4 via a communication network.

[0132] The output device 45 is a device that outputs information to the outside of the control server 4. For example, the output device 45 may output information as an image. That is, the output device 45 may include a display device (a so-called display) that can display an image showing the information to be output. For example, the output device 45 may output information as sound. That is, the output device 45 may include an audio device (a so-called speaker) that can output sound. For example, the output device 45 may output information on paper. That is, the output device 45 may include a printing device (a so-called printer) that can print desired information on paper.

[0133] The output device 45 may output (for example, display) information stored in at least one of the processing information DB 421 and the measurement information DB 422. For example, the output device 45 may display a table (for example, the table shown in FIG. 12 ) showing information stored in the processing information DB 421. For example, the output device 45 may display a table (for example, the table shown in FIG. 13 ) showing information stored in the measurement information DB 422.

[0134] Alternatively, the control server 4 may analyze information stored in at least one of the processing information DB 421 and the measurement information DB 422, and the output device 45 may output (e.g., display) the analysis results. For example, the output device 45 may display the analysis results in association with the workpiece W. For example, the output device 45 may display the analysis results in a display format in which the analysis results are associated with the workpiece W (e.g., a display format different from the display format using the table described above). As an example, the control server 4 may analyze the processing progress status included in the processing information DB 421, and the output device 45 may display the workpiece W and the analysis results in a display format in which each part of a display object simulating the workpiece W (e.g., an aircraft) is associated with the processing progress rate of each part. In other words, the output device 45 may display a heat map indicating the processing progress rate in association with the workpiece W. As a result, a user of the processing system SYS can intuitively recognize the processing progress rate of each part of the workpiece W.

[0135] (2) Operation of Machining System SYS Next, a machining operation performed by the machining system SYS to machine the workpiece W and a measurement operation performed by the machining system SYS to measure the workpiece W will be described.

[0136] (2-1) Specific Example of Workpiece W to be Subjected to Machining Operation and Measuring Operation First, with reference to FIG. 14, a specific example of workpiece W to be subject to machining operation and measuring operation will be described.

[0137] As shown in Figure 14, the processing device 1 may process a workpiece W that is larger than the processing device 1. In the example shown in Figure 14, the processing device 1 processes a workpiece W that corresponds to at least a portion of an aircraft. For example, the processing device 1 may process at least a portion of an aircraft so as to form the above-mentioned riblet structure on at least a portion of the aircraft's fuselage, main wing, horizontal stabilizer, and / or vertical stabilizer. However, the processing device 1 may also process a workpiece W that is smaller than the processing device 1. The processing device 1 may also process a workpiece W that is the same size as the processing device 1.

[0138] As shown in Figure 14, the measuring device 2 may measure a workpiece W that is larger than the measuring device 2. In the example shown in Figure 14, the measuring device 2 measures a workpiece W that corresponds to at least a part of an aircraft. For example, the measuring device 2 may measure at least a part of the aircraft's fuselage, main wing, horizontal stabilizer, and / or vertical stabilizer. However, the measuring device 2 may process a workpiece W that is smaller than the measuring device 2. The measuring device 2 may process a workpiece W that is the same size as the measuring device 2.

[0139] In the following description, processing operations and measurement operations performed when the workpiece W is at least a part of an aircraft will be described. However, even when the workpiece W is not at least a part of an aircraft, the processing system SYS may perform the processing operations and measurement operations described below.

[0140] (2-2) Machining Operation Next, the machining operation performed by the machining system SYS will be described.

[0141] (2-2-1) Overall Flow of Machining Operation First, the overall flow of the machining operation will be described with reference to Fig. 15. Fig. 15 is a flowchart showing the overall flow of the machining operation.

[0142] 15 , first, the control information generation unit 412 of the control server 4 acquires model data indicating a three-dimensional model of the workpiece W to be machined by the machining device 1 (step S411). That is, the control information generation unit 412 acquires model data indicating a three-dimensional model having a designed three-dimensional shape of the workpiece W to be machined by the machining device 1 (step S411). An example of model data is CAD (Computer Aided Design) data. An example of a file format for CAD data is at least one of DWF (Design Web Format), DXF (Drawing Exchange Format), DWG, STEP (Standard for the Exchange of Product Data), and STL (Stereolithography).

[0143] The model data may be stored in the storage device 42 of the control server 4. In this case, the control information generator 412 may acquire the model data from the storage device 42. The model data may be stored in a storage device provided in the control device 14 of the processing device 1. In this case, the control information generator 412 may acquire the model data from the processing device 1. The model data may be stored in an external device different from the control server 4 and the processing device 1. In this case, the control information generator 412 may acquire the model data from the external device.

[0144] In parallel with or before or after the operation of step S411, the position measuring device 3 measures the positions of the workpiece W, the processing device 1, and the measuring device 2 (step S311). However, in the processing operation, the position measuring device 3 does not necessarily have to measure the position of the measuring device 2.

[0145] The position measuring device 3 may measure the positions of multiple measurement target portions of the workpiece W. The measurement target portions may include characteristic portions of the workpiece W. For example, if the workpiece W is an aircraft, the measurement target portions may include at least one of a characteristic portion of the main wing (e.g., tip), a characteristic portion of the horizontal stabilizer (e.g., tip), a characteristic portion of the vertical stabilizer (e.g., tip), and a characteristic portion of the fuselage (e.g., tip). However, the position measuring device 3 may also measure the position of a single measurement target portion of the workpiece W. Note that if the position of the workpiece W is changeable, the position measuring device 3 may set at least a part of a mechanism that changes the position of the workpiece W to the measurement target portion and measure the position of that mechanism.

[0146] The position measuring device 3 may measure the positions of a plurality of measurement target portions of the processing device 1. The measurement target portions may include characteristic portions of the processing device 1. For example, the measurement target portions may include at least one of the characteristic portions of the processing head 12, the characteristic portions of the arm drive system 132, and the characteristic portions of the self-propelled drive system 131. However, the position measuring device 3 may measure the position of a single measurement target portion of the processing device 1.

[0147] The position measuring device 3 may measure the positions of multiple measurement target portions of the measurement device 2. The measurement target portions may include characteristic portions of the measurement device 2. For example, the measurement target portions may include at least one of the characteristic portions of the measurement head 22, the characteristic portions of the arm drive system 232, and the characteristic portions of the self-propelled drive system 231. However, the position measuring device 3 may also measure the position of a single measurement target portion of the measurement device 2.

[0148] If the workpiece W is a large object such as an aircraft, there is a possibility that a portion of the workpiece W may fall outside the range measurable by the position measuring device 3 (e.g., the measurement field of the position measuring device 3). As a result, there is a possibility that the position measuring device 3 may not be able to properly measure the positions of multiple measurement target portions of the workpiece W. Therefore, as shown in FIG. 16 , which shows the positional relationship between the workpiece W and the position measuring devices 3, the machining system SYS may be provided with multiple position measuring devices 3. In this case, a first position measuring device 3 of the multiple position measuring devices 3 may be aligned with the workpiece W so as to be able to measure the position of a first measurement target portion of the workpiece W. On the other hand, a second position measuring device 3 different from the first position measuring device 3 of the multiple position measuring devices 3 may be aligned with the workpiece W so as to be able to measure the position of a second measurement target portion of the workpiece W different from the first measurement target portion. As a result, the machining system SYS can properly measure the positions of multiple measurement target portions of the workpiece W using the multiple position measuring devices 3.

[0149] As described above, the position measuring device 3 may measure the position of the workpiece W by irradiating the measurement light ML toward a reflector attached to the workpiece W as the measurement object. In this case, the reflector may be attached to a predetermined position on the workpiece W. In particular, if the workpiece W is a large object such as an aircraft, multiple reflectors may be attached to at least three predetermined locations on the workpiece W. As an example, a first reflector may be attached near the cockpit of the aircraft (for example, near the nose of the aircraft), a second reflector may be attached near the tip of the left main wing of the aircraft, and a third reflector may be attached near the tip of the right main wing of the aircraft. Other reflectors may be attached at other positions on the aircraft. The number of reflectors attached to the workpiece W may be three or more or three or less.

[0150] As described above, the position measuring device 3 may measure the position of the processing device 1 by irradiating the measurement light ML toward a reflector attached to the processing device 1 as the measurement object. In this case, the reflector may be attached to a predetermined position of the processing device 1. For example, the reflector may be attached near the tip of the head drive system 13 included in the processing device 1 (for example, at a position where the processing head 12 is attached). For example, the reflector may be attached to the processing head 12. In this case, the position measuring device 3 can appropriately measure the position of the processing head 12. For example, the reflector may be attached to the self-propelled drive system 131. In this case, the position measuring device 3 can roughly measure the position of the processing head 12.

[0151] As described above, the position measuring device 3 may measure the position of the measuring device 2 by irradiating the measuring light ML toward a reflector attached to the measuring device 2 as the measurement target. In this case, the reflector may be attached to a predetermined position of the measuring device 2. For example, the reflector may be attached near the tip of the head drive system 23 included in the measuring device 2 (for example, at the position where the measuring head 22 is attached). For example, the reflector may be attached to the measuring head 22. In this case, the position measuring device 3 can appropriately measure the position of the measuring head 22. For example, the reflector may be attached to the self-propelled drive system 231. In this case, the position measuring device 3 can roughly measure the position of the measuring head 22.

[0152] As described above, in this embodiment, the measurement coordinate system defined based on the position measuring device 3 is used as the reference coordinate system that serves as the reference of the machining system SYS. If the machining system SYS includes multiple position measuring devices 3, a first measurement coordinate system defined based on a first position measuring device 3 of the multiple position measuring devices 3 may be used as the reference coordinate system. On the other hand, a second position measuring device 3 of the multiple position measuring devices 3 measures the respective positions of the workpiece W, the machining device 1, and the measuring device 2 in a second measurement coordinate system defined based on the second position measuring device 3. However, because the second measurement coordinate system is different from the reference coordinate system, the second position measuring device 3 cannot measure the respective positions of the workpiece W, the machining device 1, and the measuring device 2 in the reference coordinate system. Specifically, a technical problem arises in that the control server 4 may not be able to calculate the respective positions of the workpiece W, the processing device 1, and the measuring device 2 in the reference coordinate system from the position information indicating the measurement results by the second position measuring device 3 (for example, the detection results of the measurement light ML and the return light RL by the detector 338 shown in Figure 10 described above).

[0153] To solve this technical problem, either one of the first and second position measuring devices 3 may measure the position of either the other of the first and second position measuring devices 3. In this case, the control server 4 may acquire the measurement result of the position of either the other of the first and second position measuring devices 3 by either one of the first and second position measuring devices 3 as at least part of the position information. In this case, the control server 4 can calculate the relative positional relationship between the first and second position measuring devices 3 based on the measurement result of the position of either the other of the first and second position measuring devices 3 by either one of the first and second position measuring devices 3. As a result, the control server 4 can convert the position in the second measurement coordinate system into a position in the first measurement coordinate system (i.e., a position in the reference coordinate system) based on the relative positional relationship between the first and second position measuring devices 3. In other words, the control server 4 can appropriately calculate the positions of multiple measurement target portions of the workpiece W in the reference coordinate system using the position information acquired from each of the multiple position measuring devices 3.

[0154] The machining system SYS may include, as the multiple position measuring devices 3, a position measuring device 3 for measuring the position of the workpiece W, a position measuring device 3 for measuring the position of the machining device 1, and a position measuring device 3 for measuring the position of the measuring device 2. In other words, the machining system SYS may include a position measuring device 3 that measures the position of the workpiece W but does not need to measure the positions of the machining device 1 and the measuring device 2. The machining system SYS may include a position measuring device 3 that measures the position of the machining device 1 but does not need to measure the positions of the workpiece W and the measuring device 2. The machining system SYS may include a position measuring device 3 that measures the position of the measuring device 2 but does not need to measure the positions of the workpiece W and the machining device 1. In this case, the workpiece W may move during at least a portion of the period during which the machining operation is being performed. In other words, the position of the workpiece W in the reference coordinate system may be changed during at least a portion of the period during which the machining operation is being performed.

[0155] Referring again to FIG. 15, the information acquisition unit 411 of the control server 4 uses the communication device 43 to receive (i.e., acquire) position information indicating the measurement results of the positions of the workpiece W, the processing device 1, and the measuring device 2 in step S311 from the position measuring device 3 (step S412).

[0156] Thereafter, the control information generator 412 of the control server 4 calculates the position of the workpiece W in the reference coordinate system based on the model data acquired in step S411 and the position information acquired in step S412 (particularly, the position information indicating the measurement results of the position of the workpiece W) (step S413). For example, the control information generator 412 may calculate the position of the workpiece W in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. For example, the control information generator 412 may calculate the position of the workpiece W in at least one of the θX direction, the θY direction, and the θZ direction (i.e., the posture of the workpiece W).

[0157] Here, the position information indicating the measurement results of the position of the workpiece W indicates the position of the measurement target portion of the workpiece W whose position has been measured by the position measurement device 3, but does not indicate the position of the non-measurement target portion of the workpiece W whose position has not been measured by the position measurement device 3. Therefore, the control information generator 412 can only calculate the position of a portion of the workpiece W within the reference coordinate system by simply referring to the position information. In other words, the control information generator 412 cannot calculate the position of the remaining portion of the workpiece W within the reference coordinate system. Therefore, the control information generator 412 performs a fitting process in which the same measurement target portion of the three-dimensional model indicated by the model data is positioned at the position of the measurement target portion of the workpiece W indicated by the position information within the reference coordinate system. The fitting process may include at least one of a process of translating the three-dimensional model, a process of enlarging or reducing the three-dimensional model, and a process of rotating the three-dimensional model. Note that the fitting process may also include a process of affine transforming the three-dimensional model. The process of affine transforming the three-dimensional model may include at least one of a process of translating the three-dimensional model, a process of enlarging or reducing the three-dimensional model, a process of rotating the three-dimensional model, and a process of skew-deforming the three-dimensional model. As a result, the three-dimensional model of the workpiece W is placed at a position assumed to be the same as the position of the workpiece W in the reference coordinate system. The three-dimensional model of the workpiece W is placed at an orientation assumed to be the same as the orientation of the workpiece W in the reference coordinate system. In this case, the control information generator 412 uses the position of the three-dimensional model of the workpiece W in the reference coordinate system as the position of the workpiece W in the reference coordinate system. Specifically, the control information generator 412 calculates the position of the measurement target portion of the three-dimensional model of the workpiece W as the position of the measurement target portion of the workpiece W. Furthermore, the control information generator 412 calculates the position of the non-measurement target portion of the three-dimensional model of the workpiece W as the position of the non-measurement target portion of the workpiece W. As a result, the control information generator 412 can generate map information indicating the workpiece W mapped within the reference coordinate system. In other words, the control information generator 412 can generate map information indicating the position of each part of the workpiece W within the reference coordinate system.In addition, since the map information is information indicating the position of an object, that is, the workpiece W, it may also be called workpiece position information or object position information.

[0158] Thereafter, the control information generating unit 412 of the control server 4 assigns at least a part of the area of ​​the workpiece W to the processing device 1 as a target processing area to be processed by the processing device 1 (step S414). In this case, the processing device 1 processes the target processing area assigned in step S414.

[0159] In order to assign the target machining area to the machining device 1, the control information generation unit 412 may set the target machining area in the workpiece W based on the map information generated in step S413. For example, the control information generation unit 412 may set the position of the target machining area in a reference coordinate system. The control information generation unit 412 may set a single target machining area or may set multiple target machining areas. After that, when a single target machining area is set, the control information generation unit 412 may assign the set target machining area to the machining device 1. When multiple target machining areas are set, the control information generation unit 412 may assign at least one of the multiple target machining areas to the machining device 1. In other words, the control information generation unit 412 may assign multiple target machining areas to the machining device 1.

[0160] Thereafter, the control information generation unit 412 of the control server 4 calculates a target movement path TR for the machining head 12 based on the map information generated in step S413 and the target machining area assigned in step S414 (step S415). If multiple target machining areas are assigned to the machining device 1 in step S414, the control information generation unit 412 calculates a target movement path TR for the machining head 12 based on the map information and one of the multiple target machining areas that has not yet been machined (step S415). The target movement path TR for the machining operation includes a movement path for moving the machining head 12 toward a position where the target machining area assigned in step S414 can be machined. In particular, the target movement path TR may include a movement path for the self-propelled drive system 131 to move. In other words, the target movement path TR may include a movement path for the self-propelled drive system 131 to move the machining head 12.

[0161] An example of the operation for calculating the target movement path TR will be described below with reference to Fig. 17. Fig. 17 is a top view showing the workpiece W.

[0162] As shown in FIG. 17 , the control information generator 412 may set (in other words, acquire) a movement start position MS corresponding to the starting point of the target movement path TR. That is, the control information generator 412 may set the movement start position MS at which the machining head 12 starts moving along the target movement path TR. For example, the control information generator 412 may set the movement start position MS based on the position information acquired in step S412. That is, the movement start position MS may be input based on the position information. As an example, the control information generator 412 may calculate the current position of the processing device 1 (e.g., the current position of the processing head 12; the same applies hereinafter) based on the position information and set the calculated current position of the processing device 1 as the movement start position MS. Alternatively, the control information generator 412 may set a position different from the current position of the processing device 1 as the movement start position MS. For example, if the processing device 1 is equipped with a power source as described above, the control information generator 412 may set the movement start position MS to the location of a charging station where the processing device 1 charges its power source. As described above, since the machining head 12 moves within a reference coordinate system defined by the X-axis, Y-axis, and Z-axis, the movement start position MS may include at least one of the X-coordinate, Y-coordinate, and Z-coordinate.

[0163] As shown in FIG. 17 , the control information generator 412 may set (in other words, acquire) a movement end position ME corresponding to the end point of the target movement path TR. That is, the control information generator 412 may set a movement start position MS at which the machining head 12 ends its movement along the target movement path TR. For example, the control information generator 412 may set the movement end position ME based on the position of the target machining area assigned in step S414. As an example, the control information generator 412 may set the movement end position ME to a position at which the machining head 12 can machine the workpiece W without the self-propelled drive system 131 moving the machining head 12. In particular, the control information generator 412 may set the movement end position ME to a position at which the machining head 12 can machine the target machining area without the self-propelled drive system 131 moving the machining head 12. As another example, the control information generating unit 412 may set the movement end position ME to a position where the distance between the workpiece W and the machining head 12 is less than the movement stroke of the machining head 12 caused by the arm drive system 132. In particular, the control information generating unit 412 may set the movement end position ME to a position where the distance between the target machining area and the machining head 12 is less than the movement stroke of the machining head 12 caused by the arm drive system 132. In either example, the movement end position ME may be set to a position a certain distance away from the workpiece W. The movement end position ME may include at least one of an X coordinate, a Y coordinate, and a Z coordinate.

[0164] Furthermore, since the target machining area is assigned based on map information generated based on model data, the operation of setting the movement end position ME based on the target machining area may be considered equivalent to the operation of setting the movement end position ME based on model data.

[0165] Alternatively, the control information generator 412 may set the movement end position ME based on the movement start position MS. For example, the control information generator 412 may set the movement end position ME to a position that is a certain distance or more away from the movement start position MS.

[0166] Thereafter, the control information generator 412 may calculate a movement path from the movement start position MS to the movement end position ME as a target movement path TR. The control information generator 412 may calculate a movement path from the movement start position MS to the movement end position ME as a target movement path TR. In this case, the machining head 12 moves from the movement start position MS along the target movement path TR to the movement end position ME, which is the target position (i.e., destination).

[0167] 17 , the control information generator 412 may calculate a target movement path TR that does not interfere with other objects different from the processing device 1. That is, the control information generator 412 may calculate a target movement path TR that does not pass through an area where other objects are located. Specifically, the control information generator 412 may identify an area where other objects are located based on the map information generated in step S413, and calculate a target movement path TR that does not pass through (i.e., avoids) the identified area. For example, the control information generator 412 may calculate the shortest target movement path TR that ensures a distance of at least a predetermined distance between the other object and the processing device 1.

[0168] An example of another object is a workpiece W. In this case, the control information generation unit 412 may calculate a target movement path TR that does not interfere with the workpiece W, as shown in FIG. 17 . That is, the control information generation unit 412 may calculate a target movement path TR that does not pass through the area where the workpiece W is located. Specifically, the control information generation unit 412 may identify the area where the workpiece W is located based on the map information generated in step S413, and calculate a target movement path TR that does not pass through (i.e., avoids) the identified area. For example, the control information generation unit 412 may calculate the shortest target movement path TR that can ensure a distance between the workpiece W and the processing device 1 of at least a predetermined distance.

[0169] An example of the other object is the measuring device 2. In this case, the control information generator 412 may calculate a target movement path TR that does not interfere with the measuring device 2, as shown in FIG. 17 . That is, the control information generator 412 may calculate a target movement path TR that does not pass through the area where the measuring device 2 is located. Specifically, the control information generator 412 may identify the area where the measuring device 2 is located based on the position information acquired in step S412 (particularly, position information indicating the measurement results of the position of the measuring device 2), and calculate a target movement path TR that does not pass through (i.e., avoids) the identified area. For example, the control information generator 412 may calculate the shortest target movement path TR that ensures a distance between the measuring device 2 and the processing device 1 that is equal to or greater than a predetermined distance.

[0170] As will be described later, there is a possibility that the measuring device 2 will move. In this case, the control information generator 412 may calculate a target movement path TR that will not interfere with the moving measuring device 2. In other words, the control information generator 412 may calculate a target movement path TR that will prevent the measuring device 2 and the processing device 1 from being located in the same position at the same time. The control information generator 412 may calculate a target movement path TR that will prevent the measuring device 2 from colliding with the processing device 1. Specifically, the control information generator 412 may calculate a target movement path TR for the processing device 1 that will not interfere with the moving measuring device 2, based on the target movement path TR for the measuring device 2 calculated in a measurement operation that will be described later.

[0171] When information about an obstacle that impedes the movement of the machining head 12 is already known to the control server 4, the control information generator 412 may calculate a target movement route TR that does not interfere with the obstacle. In other words, the control information generator 412 may calculate a target movement route TR that does not pass through an area where the obstacle is located. For example, the control information generator 412 may calculate the shortest target movement route TR that ensures a distance of at least a predetermined distance between the obstacle and the machining device 1.

[0172] In addition, in order to calculate the target movement path TR, the control information generation unit 412 may take into consideration at least one of the attitude of the arm drive system 132 in the processing device 1 and the movable range of the processing head 12 based on the self-propelled drive system 131.

[0173] The control server 4 may typically acquire information about an obstacle before a machining operation is performed. For example, an obstacle detection device may detect an obstacle before the machining operation is started, and the control server 4 may acquire the detection result by the obstacle detection device as information about the obstacle. Alternatively, the worker may input information about the obstacle to the control server 4 using the input device 44. Note that the control server 4 may acquire information about the obstacle during at least a part of the period during which the machining operation is being performed. For example, the control server 4 may acquire information about the obstacle before calculating the target movement path TR.

[0174] As shown in FIG. 17 , the control information generator 412 may set (in other words, acquire) a machining start position PS corresponding to the position of the machining head 12 at the time when the machining head 12 actually starts machining the target machining area after completing movement along the target movement path TR. For example, the control information generator 412 may set the machining start position PS based on the position of the target machining area assigned in step S414. As an example, the control information generator 412 may set the desired position of the target machining area as the machining start position PS. Note that, because the target machining area is assigned based on map information generated based on model data, the operation of setting the machining start position PS based on the target machining area may be considered equivalent to the operation of setting the machining start position PS based on model data. Note that the machining start position PS may include at least one of an X coordinate, a Y coordinate, and a Z coordinate.

[0175] Alternatively, the control information generator 412 may set the machining start position PS based on the movement start position MS. For example, the control information generator 412 may set the machining start position PS to a position that is a certain distance or more away from the movement start position MS.

[0176] Once the machining start position PS is set, the machining head 12 is moved by the self-propelled drive system 131 from the movement start position MS along the target movement path TR to the movement end position ME, which is the first target position (i.e., first destination). The machining head 12 is then moved by the arm drive system 132 from the movement end position ME to the machining start position PS, which is the second target position (i.e., second destination). In this case, on the movement path of the machining head 12 caused by the self-propelled drive system 131 and the arm drive system 132, the movement end position ME may be considered to be located between the movement start position MS and the machining start position PS. In this case, the length of the movement path from the movement start position MS to the movement end position ME may typically be longer than the length of the movement path from the movement end position ME to the machining start position PS. In other words, the movement amount of the machining head 12 caused by the self-propelled drive system 131 (i.e., the amount of change in the position of the machining head 12; the same applies below) may be greater than the movement amount of the machining head 12 caused by the arm drive system 132.

[0177] When the machining start position PS is set, the control information generation unit 412 may set the movement end position ME based on the machining start position PS. For example, the control information generation unit 412 may set the movement end position ME to a position that is a certain distance away from the machining start position PS in a direction away from the workpiece W. As a result, the possibility that the machining device 1 that has finished moving along the target movement path TR will accidentally come into contact with the workpiece W is reduced. In this case, the control information generation unit 412 may set the movement end position ME to a position that is a distance away from the machining start position PS that is shorter than the movement stroke of the machining head 12 by the arm drive system 132. As a result, the self-propelled drive system 131 does not need to move the machining head 12 to move the machining head 12 from the movement end position ME to the machining start position PS.

[0178] As shown in FIG. 17 , the control information generator 412 may set (in other words, acquire) a standby position WP where the machining head 12 temporarily waits after completing movement along the target movement path TR. For example, the control information generator 412 may set the standby position PS to a position that is a certain distance away from the machining start position PS in the direction away from the workpiece W and a certain distance away from the movement end position ME in the direction toward the workpiece W. In this case, the distance between the machining start position PS and the standby position WP is shorter than the distance between the machining start position PS and the movement end position ME. As a result, the machining device 1 that has completed movement along the target movement path TR is less likely to accidentally contact the workpiece W. Furthermore, the time required for the machining head 12 to move to the machining start position PS is shorter than when the machining head 12 waits at the movement end position ME. This allows the machining head 12 to quickly start machining. The standby position WP may include at least one of an X coordinate, a Y coordinate, and a Z coordinate.

[0179] When the standby position WP is set, the machining head 12 is moved by the self-propelled drive system 131 from the movement start position MS along the target movement path TR to the movement end position ME, which is the first target position (i.e., first destination). The machining head 12 is then moved by the arm drive system 132 from the movement end position ME to the standby position WP, which is the second target position (i.e., second destination). The machining head 12 is then moved by the arm drive system 132 from the standby position WP to the machining start position PS, which is the third target position (i.e., third destination). In this case, on the movement path of the machining head 12 caused by the self-propelled drive system 131 and the arm drive system 132, the movement end position ME may be considered to be located between the movement start position MS and the standby position WP. The standby position WP may be considered to be located between the movement end position ME and the machining start position PS.

[0180] 15 , the control information generator 412 then generates processing control information (step S416). For example, the control information generator 412 may generate processing control information for controlling the head drive system 13 to move the processing head 12 along the target movement path TR calculated in step S415. For example, the control information generator 412 may generate processing control information for controlling the processing device 1 to process the target processing area assigned in step S414.

[0181] Thereafter, the control information generator 412 uses the communication device 43 to transmit the processing control information to the processing device 1. As a result, the control device 14 of the processing device 1 receives the processing control information (step S111).

[0182] Thereafter, the control device 14 of the processing device 1 controls the head drive system 13 to move the processing head 12 based on the processing control information received in step S111 (step S112). Specifically, the self-propelled drive system 131 moves the processing head 12 along the target movement path TR. That is, the self-propelled drive system 131 moves the processing head 12 along the target movement path TR by self-propelling on the support surface SS along the target movement path TR. When a standby position WP is set, the arm drive system 132 may further move the processing head 12 located at the movement end position ME to the standby position WP. When a processing start position PS is set, the arm drive system 132 may further move the processing head 12 located at the movement end position ME or the standby position WP to the processing start position PS.

[0183] The control device 14 controls the movement of the machining head 12 based on the machining control information generated by the control server 4. In this case, it may be considered that the control server 4 controls the movement of the machining head 12.

[0184] After the machining head 12 has finished moving along the target movement area TR (i.e., after the machining head 12 has reached the movement end position ME), the machining device 1 processes the target machining area assigned in step S414 (step S113).

[0185] Thereafter, the machining system SYS repeats the same operation until it determines that the machining operation is to be terminated (step S417: Yes). For example, if it is necessary to machine another target machining area different from the target machining area machined in step S113, the machining system SYS may determine not to terminate the machining operation (step S417: No). If it is not necessary to machine another target machining area different from the target machining area machined in step S113, the machining system SYS may determine to terminate the machining operation (step S417: Yes). If it is necessary to machine another workpiece W different from the workpiece W machined in step S113, the machining system SYS may determine not to terminate the machining operation (step S417: No). If it is not necessary to machine another workpiece W different from the workpiece W machined in step S113, the machining system SYS may determine to terminate the machining operation (step S417: Yes).

[0186] If it is determined that the machining operation is not to be terminated (step S417: No), the machining system SYS may perform the operations from step S415 to step S113 again. That is, the control server 4 calculates a target movement path TR including a movement path for moving the machining head 12 toward a position where the machining device 1 can process a new target machining area to be machined next (step S415). The control server 4 then generates machining control information (step S416). The machining device 1 then receives the machining control information from the control server 4 (step S111). The machining device 1 then controls the head drive system 13 to move the machining head 12 based on the machining control information (step S112). The machining device 1 then processes the new target machining area to be machined next (step S113).

[0187] Furthermore, if it is determined that the machining operation is not to be terminated (step S417: No), the machining system SYS may perform the operations from step S311 to step S113 again. That is, if it is determined that the machining operation is not to be terminated (step S417: No), the position measurement device 3 may measure the respective positions of the workpiece W, the machining device 1, and the measuring device 2 again (step S311). Furthermore, the control server 4 may recalculate the position of the workpiece W in the reference coordinate system (step S413). In this case, even if at least one of the shape and position of the workpiece W changes as the workpiece W is machined, the control server 4 can accurately calculate the position of the workpiece W. As a result, the control server 4 can appropriately calculate the target movement path TR even if at least one of the shape and position of the workpiece W changes as the workpiece W is machined.

[0188] In addition, if the processing device 1 is equipped with a power supply as described above, the power supply may be charged after the processing operation is completed. For example, after the processing operation is completed, the processing device 1 may be moved to a charging station where the processing device 1 charges the power supply, and the power supply may be charged.

[0189] (2-2-2) Modified Example of Operation for Moving Machining Head 12 When moving the machining head 12 in step S112 of Fig. 15 described above, the machining system SYS may perform the operation shown in Fig. 18. Fig. 18 is a flowchart showing the flow of the operation for moving the machining head 12 in step S112 of Fig. 15. However, the machining system SYS does not have to perform the operation shown in Fig. 18.

[0190] 18, the control device 14 of the processing device 1 controls the head drive system 13 to move the processing head 12 based on the processing control information received in step S111 of Fig. 15 (step S1121). As a result, the processing head 12 moves along the target movement path TR.

[0191] In particular, in step S1121, the control device 14 moves the machining head 12 using the self-propelled drive system 131. That is, the control device 14 controls the self-propelled drive system 131 to move the machining head 12 based on the machining control information. As a result, the self-propelled drive system 131 moves along the target movement path TR together with the machining head 12. That is, the machining head 12 moves along the target movement path TR.

[0192] During the period in which the machining head 12 is moving along the target movement path TR, the control device 14 of the machining device 1 may determine whether or not the machining head 12 has entered the fine adjustment area AA (step S1122).

[0193] An example of the fine-adjustment area AA is shown in Figures 19(a) and 19(b). As shown in Figures 19(a) and 19(b), the fine-adjustment area AA may be an area determined based on the workpiece W. For example, the fine-adjustment area AA may be an area that includes the workpiece W, as shown in Figure 19(a). For example, the fine-adjustment area AA may be an area whose distance from the workpiece W is equal to or less than a predetermined first distance, as shown in Figure 19(b). However, the fine-adjustment area AA may also be an area that is determined independently of the workpiece W. Note that information regarding the fine-adjustment area AA (for example, information regarding the position of the fine-adjustment area AA in the reference coordinate system) may be information already known to the control device 14.

[0194] To determine whether the machining head 12 has entered the fine-adjustment area AA, the control device 14 may acquire position information indicating the measurement results of the position of the machining device 1 from the position measurement device 3. The control device 14 may then determine whether the machining head 12 has entered the fine-adjustment area AA based on the acquired position information and information related to the fine-adjustment area AA. Specifically, the control device 14 may calculate the current position of the machining head 12 based on the position information, and determine whether the calculated current position of the machining head 12 is included in the fine-adjustment area AA indicated by the information related to the fine-adjustment area AA. If it is determined that the current position of the machining head 12 is included in the fine-adjustment area AA, the control device 14 may determine that the machining head 12 has entered the fine-adjustment area AA.

[0195] When the fine-adjustment area AA is an area whose distance from the workpiece W is equal to or shorter than a predetermined first distance, the control device 14 may calculate the distance between the machining head 12 and the workpiece W based on the position of the workpiece W calculated in step S413 of Fig. 15 and the position information (particularly, position information indicating the measurement result of the position of the machining device 1) acquired in step S412 of Fig. 15, in order to determine whether the machining head 12 has entered the fine-adjustment area AA. When the calculated distance is shorter than the first distance that defines the fine-adjustment area AA, the control device 14 may determine that the machining head 12 has entered the fine-adjustment area AA.

[0196] As described above, the movement end position ME, where the self-propelled drive system 131 ends the movement of the machining head 12, is typically set at a position a certain distance away from the workpiece W. In this case, the fine-adjustment area AA, which is determined based on the workpiece W, may be considered to be an area determined based on the movement end position ME, which is a certain distance away from the workpiece W. Specifically, the fine-adjustment area AA may be an area whose distance from the movement end position ME is equal to or less than a predetermined second distance. In this case, the fine-adjustment area AA may be set by the control server 4, which sets the movement end position ME. Furthermore, in this case, to determine whether the machining head 12 has entered the fine-adjustment area AA, the control device 14 may calculate the distance between the machining head 12 and the movement end position ME based on position information indicating the measurement results of the position of the machining device 1. The control device 14 may determine that the machining head 12 has entered the fine-adjustment area AA if the calculated distance is shorter than the second distance that defines the fine-adjustment area AA.

[0197] At least one of the first distance and the second distance may be set in consideration of the movable range of the machining head 12 relative to the self-propelled drive system 131 .

[0198] Referring again to Figure 18, if the result of the judgment in step S1122 is that the machining head 12 has not entered the fine adjustment area AA (for example, the distance between the machining head 12 and the movement end position ME is not shorter than the second distance) (step S1122: No), the control device 14 continues to move the machining head 12 along the target movement path TR using the self-propelled drive system 131 (step S1121).

[0199] On the other hand, even if the result of the determination in step S1122 indicates that the machining head 12 has entered the fine-adjustment area AA (e.g., the distance between the machining head 12 and the movement end position ME is shorter than the second distance) (step S1122: Yes), the control device 14 uses the self-propelled drive system 131 to move the machining head 12 along the target movement path TR (step S1123). However, in step S1123, the control device 14 acquires new position information from the position measurement device 3 indicating the measurement result of the position of the machining device 1 by the position measurement device 3, and moves the machining head 12 along the target movement path TR based on the newly acquired position information and the machining control information. In this case, the control device 14 can calculate the accurate current position of the machining device 1 (i.e., the accurate current position of the machining head 12) based on the position information. Therefore, compared to when position information is not used, the control device 14 can appropriately move the machining head 12 along the target movement path TR. Therefore, the processing device 1 can prevent a collision between the processing device 1 and the workpiece W caused by the control device 14 not being able to accurately grasp the current position of the processing device 1.

[0200] However, even before the machining head 12 enters the fine adjustment area AA, the control device 14 may move the machining head 12 along the target movement path TR based on position information indicating the measurement results of the position of the machining device 1 by the position measurement device 3. For example, the position measurement device 3 may continue to measure the position of the machining device 1 at all times while the machining head 12 is moving. For example, the position measurement device 3 may continue to measure the position of the machining device 1 at a predetermined cycle while the machining head 12 is moving. In this case, the control device 14 will never be unable to grasp the current position of the machining device 1. Therefore, the control device 14 can appropriately move the machining head 12 along the target movement path TR.

[0201] After the machining head 12 enters the fine adjustment area AA, the self-propelled drive system 131 may move the machining head 12 with a movement accuracy higher than the movement accuracy of the machining head 12 before the machining head 12 entered the fine adjustment area AA. In other words, the self-propelled drive system 131 may move the machining head 12 with a first movement accuracy until the machining head 12 enters the fine adjustment area AA, and after the machining head 12 enters the fine adjustment area AA, the self-propelled drive system 131 may move the machining head 12 with a second movement accuracy higher than the first movement accuracy. As a result, the machining device 1 can prevent a collision between the machining device 1 and the workpiece W caused by low movement accuracy of the machining head 12 at a position close to the workpiece W.

[0202] Thereafter, the control device 14 continues to move the machining head 12 along the target movement path TR based on the position information using the self-propelled drive system 131 until the machining head 12 reaches the movement end position ME (step S1124: No) (step S1123).

[0203] After the machining head 12 reaches the movement end position ME (step S1124: Yes), the control device 14 may control the arm drive system 132 so that the machining head 12 that has reached the movement end position ME moves to the standby position WP or the machining start position PS (step S1125). In step S1125, the control device 14 may also move the machining head 12 based on position information indicating the measurement results of the position of the machining device 1 by the position measurement device 3. As a result, even if a target movement path from the movement end position ME to the standby position WP or the machining start position PS is not pre-set, the control device 14 can appropriately move the machining head 12 from the movement end position ME to the standby position WP or the machining start position PS based on the position information. Furthermore, the machining device 1 can prevent a collision between the machining device 1 and the workpiece W caused by the control device 14 not accurately determining the current position of the machining device 1.

[0204] Furthermore, the control device 14 may control the arm drive system 132 to move the machining head 12 during at least a portion of the time period during which the self-propelled drive system 131 is moving the machining head 12. In this case, the time required to move the machining head 12 to the standby position WP or the machining start position PS is shortened compared to when the arm drive system 132 moves the machining head 12 after the self-propelled drive system 131 has finished moving the machining head 12.

[0205] (2-3) Measurement Operation Next, the measurement operation performed by the machining system SYS will be described.

[0206] (2-3-1) Overall Flow of Measurement Operation First, the overall flow of the measurement operation will be described with reference to Fig. 20. Fig. 20 is a flowchart showing the overall flow of the measurement operation.

[0207] 20 , first, the control information generator 412 of the control server 4 acquires model data indicating a three-dimensional model of the workpiece W to be measured by the measuring device 2 (step S421). The operation of step S421 may be the same as the operation of step S411 in FIG. 15 described above.

[0208] In parallel with or before or after the operation of step S421, the position measuring device 3 measures the respective positions of the workpiece W, the processing device 1, and the measuring device 2 (step S321). The operation of step S321 may be the same as the operation of step S311 in Fig. 15 described above. However, in the measurement operation, the position measuring device 3 does not necessarily need to measure the position of the processing device 1.

[0209] Then, the information acquisition unit 411 of the control server 4 uses the communication device 43 to receive (i.e., acquire) position information indicating the measurement results of the positions of the workpiece W, the processing device 1, and the measuring device 2 in step S321 from the position measuring device 3 (step S422).

[0210] Thereafter, the control information generator 412 of the control server 4 calculates the position of the workpiece W in the reference coordinate system based on the model data acquired in step S421 and the position information acquired in step S412 (particularly, the position information indicating the measurement results of the position of the workpiece W) (step S423). The operation of step S423 may be the same as the operation of step S413 in FIG. 15 described above.

[0211] Thereafter, the control information generation unit 412 of the control server 4 assigns at least a partial area of ​​the workpiece W to the measuring device 2 as a target measurement area to be measured by the measuring device 2 (step S424). In this case, the measuring device 2 measures the target measurement area assigned in step S424. The operation of step S424 may be the same as the operation of step S414 in FIG. 15 described above. Specifically, the explanation of the operation of step S414 in FIG. 15 described above can be used as an explanation of the operation of step S424 by replacing the terms "machining device 1" and "target machining area" with "measuring device 2" and "target measurement area", respectively.

[0212] Thereafter, the control information generating unit 412 of the control server 4 calculates a target movement path TR of the measurement head 22 based on the map information generated in step S423 and the target measurement area assigned in step S424 (step S425). The target movement path TR in the measurement operation includes a movement path for moving the measurement head 22 toward a position where the target measurement area assigned in step S424 can be measured. In particular, the target movement path TR may include a movement path for moving the self-propelled drive system 231. In other words, the target movement path TR may include a movement path for moving the measurement head 22 by the self-propelled drive system 231.

[0213] The operation of step S425 may be the same as the operation of step S415 in Fig. 15 described above. Specifically, the description of the operation of step S415 in Fig. 15 described above can be reused as the description of the operation of step S425 by replacing the terms "machining device 1," "machining head 12," "self-propelled drive system 131," "arm drive system 132," "measuring device 2," "machining operation," "target machining area," "machining start position," and "machining" with the terms "measuring device 2," "measuring head 22," "self-propelled drive system 231," "arm drive system 232," "machining device 1," "measurement operation," "target measurement area," "measurement start position," and "measurement," respectively.

[0214] Thereafter, the control information generator 412 generates measurement control information (step S426). For example, the control information generator 412 may generate measurement control information for controlling the head drive system 23 to move the measurement head 22 along the target movement path TR calculated in step S425. For example, the control information generator 412 may generate measurement control information for controlling the measurement device 2 to measure the target measurement area assigned in step S424.

[0215] Thereafter, the control information generator 412 uses the communication device 43 to transmit the measurement control information to the measuring device 2. As a result, the control device 24 of the measuring device 2 receives the measurement control information (step S121).

[0216] Thereafter, the control device 24 of the measuring device 2 controls the head drive system 23 to move the measuring head 22 based on the measurement control information received in step S121 (step S122). The operation of step S122 may be the same as the operation of step S112 in FIG. 15 described above. Specifically, the self-propelled drive system 231 moves the measuring head 22 along the target movement path TR. That is, the self-propelled drive system 231 moves the measuring head 22 along the target movement path TR by self-propelling on the support surface SS along the target movement path TR. When a standby position WP is set, the arm drive system 232 may further move the measuring head 22 located at the movement end position ME to the standby position WP. When a processing start position PS is set, the arm drive system 232 may further move the measuring head 22 located at the movement end position ME or the standby position WP to the processing start position PS.

[0217] Furthermore, in step S122, the machining system SYS may perform the same operation as that shown in Fig. 18. Specifically, the above-mentioned description of the operation shown in Fig. 18 can be used as a description of the operation that may be performed in step S122 by replacing the terms "machining device 1," "machining head 12," "self-propelled drive system 131," "arm drive system 132," "control device 14," "machining control information," "Fig. 15," and "step S413" with the terms "measuring device 2," "measuring head 22," "self-propelled drive system 231," "arm drive system 232," "control device 24," "measurement control information," "Fig. 20," and "step S423," respectively.

[0218] The control device 24 controls the movement of the measuring head 22 based on the measurement control information generated by the control server 4. In this case, it may be considered that the control server 4 controls the movement of the measuring head 22.

[0219] After the measurement head 22 has finished moving along the target movement region TR (i.e., after the measurement head 22 has reached the movement end position ME), the measurement device 2 measures the target measurement region assigned in step S424 (step S123).

[0220] Thereafter, the machining system SYS repeats the same operation until it determines that the measurement operation is to be ended (step S427: Yes). For example, if it is necessary to measure another target measurement area different from the target measurement area measured in step S123, the machining system SYS may determine not to end the measurement operation (step S427: No). If it is not necessary to process another target measurement area different from the target measurement area measured in step S123, the machining system SYS may determine to end the measurement operation (step S427: Yes). If it is necessary to measure another workpiece W different from the workpiece W measured in step S123, the machining system SYS may determine not to end the measurement operation (step S427: No). If it is not necessary to measure another workpiece W different from the workpiece W measured in step S123, the machining system SYS may determine to end the measurement operation (step S427: Yes).

[0221] (2-3-2) Specific Examples of Measurement Operations Next, specific examples of measurement operations will be described.

[0222] (2-3-2-1) Preliminary Measurement The measuring device 2 may measure the workpiece W before the processing device 1 processes the workpiece W. For example, as shown in Fig. 21(a) , the measuring device 2 may measure the first portion P1 of the workpiece W before the processing device 1 processes the first portion P1 of the workpiece W by irradiating the first portion P1 with processing light EL. After the measuring device 2 measures the first portion P1 of the workpiece W, the processing device 1 may process the first portion P1 of the workpiece W by irradiating the first portion P1 with processing light EL.

[0223] The control information generator 412 may generate processing control information for controlling the processing device 1 to process the first portion P1 based on the measurement results of the first portion P1 by the measuring device 2. For example, the control information generator 412 may generate processing control information including a processing path indicating the irradiation position of the processing light EL for processing the first portion P1 based on the measurement results of the first portion P1 by the measuring device 2. In this case, the processing device 1 can process the first portion P1 of the workpiece W based on the results of the measurement of the first portion P1 of the workpiece W (i.e., the preliminary measurement performed before the first portion P1 is processed). In other words, the processing device 1 can process the workpiece W based on the results of the preliminary measurement of the workpiece W. Therefore, the processing device 1 can more appropriately process the first portion P1 of the workpiece W compared to when the results of the preliminary measurement of the first portion P1 of the workpiece W are not used. In other words, the processing device 1 can more appropriately process the workpiece W compared to when the results of the preliminary measurement of the workpiece W are not used.

[0224] 21(a) can also be said to show an example in which the measuring device 2 measures a first portion P1 of the workpiece W at a first time, and the processing device 1 processes the first portion P1 of the workpiece W at a second time after the first time. In this case, the measuring device 2 may measure a second portion P2 of the workpiece W that is different from the first portion P1 at the second time when the processing device 1 processes the first portion P1 of the workpiece W. In this case, since the processing of the workpiece W by the processing device 1 and the measurement of the workpiece W by the measuring device 2 are performed in parallel, the overall throughput related to the processing and measurement of the workpiece W is improved.

[0225] (2-3-2-2) Post-Measurement The measuring device 2 may measure the workpiece W after the processing device 1 processes the workpiece W. For example, as shown in FIG. 21B, the measuring device 2 may measure the third portion P3 of the workpiece W after the processing device 1 processes the third portion P3 of the workpiece W by irradiating the third portion P3 with the processing light EL. The processing device 1 may process the third portion P3 of the workpiece W by irradiating the third portion P3 with the processing light EL before the measuring device 2 measures the third portion P3 of the workpiece W.

[0226] In this case, the control information generation unit 412 of the control server 4 may determine (in other words, evaluate) whether the machining performed by the machining device 1 on the workpiece W is appropriate based on the measurement results of the measuring device 2. In particular, the control information generation unit 412 may determine (in other words, evaluate) whether the machining performed by the machining device 1 on the third portion P3 of the workpiece W is appropriate based on the measurement results of the third portion P3 by the measuring device 2. For example, the control information generation unit 412 may calculate the shape of the third portion P3 based on the measurement results of the third portion P3 by the measuring device 2, and determine whether the calculated shape of the third portion P3 is the target shape (i.e., the shape that the third portion P3 should have after machining). If the shape of the third portion P3 is the target shape, the control information generation unit 412 may determine that the machining performed by the machining device 1 on the third portion P3 of the workpiece W is appropriate. On the other hand, if the shape of the third portion P3 is not the target shape, the control information generating unit 412 may determine that the processing performed by the processing device 1 on the third portion P3 of the workpiece W is inappropriate.

[0227] If it is determined that the processing performed by the processing device 1 on the third portion P3 of the workpiece W is inappropriate, the control information generation unit 412 may control the processing device 1 to further process the third portion P3. For example, the control information generation unit 412 may generate processing control information for controlling the processing device 1 to perform processing to shape the third portion P3 into a target shape. In this case, the processing device 1 can process the third portion P3 of the workpiece W based on the results of measurement of the third portion P3 of the workpiece W (i.e., post-measurement performed after the third portion P3 is processed). In other words, the processing device 1 can process the workpiece W based on the results of the post-measurement of the workpiece W. Therefore, the processing device 1 can process the third portion P3 of the workpiece W more appropriately than when the results of the post-measurement of the third portion P3 of the workpiece W are not used. In other words, the processing device 1 can process the workpiece W more appropriately than when the results of the post-measurement of the workpiece W are not used.

[0228] When it is determined that the machining performed by the machining device 1 on the workpiece W is inappropriate, the control information generator 412 may store information on the improperly machined area of ​​the workpiece W that is determined to have been improperly machined in the machining information DB 421 (particularly, machining progress information) or the measurement information DB 422 (particularly, measurement progress information). The information on the improperly machined area stored in the machining information DB 421 or the measurement information DB 422 may be presented to an operator (e.g., a user of the machining system SYS), as will be described in detail later in a third modified example.

[0229] 21(b) can also be said to show an example in which the processing device 1 processes a third portion P3 of the workpiece W at a third time, and the measuring device 2 measures the third portion P3 of the workpiece W at a fourth time after the third time. In this case, the processing device 1 may process a fourth portion P4 of the workpiece W that is different from the third portion P3 at the fourth time when the measuring device 2 measures the third portion P3 of the workpiece W. In this case, since the processing of the workpiece W by the processing device 1 and the measurement of the workpiece W by the measuring device 2 are performed in parallel, the overall throughput related to the processing and measurement of the workpiece W is improved.

[0230] (2-3-2-3) Simultaneous Measurement The measuring device 2 may measure the workpiece W during at least a portion of the period during which the processing device 1 processes the workpiece W. For example, as shown in FIG. 21( c), the measuring device 2 may measure the fifth portion P5 of the workpiece W during at least a portion of the period during which the processing device 1 processes the fifth portion P5 of the workpiece W by irradiating the fifth portion P5 with processing light EL. The processing device 1 may process the fifth portion P5 of the workpiece W by irradiating the fifth portion P5 with processing light EL during at least a portion of the period during which the measuring device 2 measures the fifth portion P5 of the workpiece W. In this case, since the processing of the workpiece W by the processing device 1 and the measurement of the workpiece W by the measuring device 2 are performed in parallel, the overall throughput for processing and measurement of the workpiece W is improved.

[0231] In this case, the control information generation unit 412 of the control server 4 may generate processing control information for controlling the processing device 1 to process the fifth portion P5 based on the measurement result of the fifth portion P5 by the measuring device 2. The control information generation unit 412 may determine (in other words, evaluate) whether or not the processing performed by the processing device 1 on the workpiece W (particularly the fifth portion P5) is appropriate based on the measurement result of the fifth portion P5 by the measuring device 2. If it is determined that the processing performed by the processing device 1 on the fifth portion P5 of the workpiece W is inappropriate, the control information generation unit 412 may control the processing device 1 to appropriately process the fifth portion P5.

[0232] (2-3-2-4) Film Thickness Measurement The processing system SYS may perform film thickness measurement, which will be described below, as an example of the above-mentioned preliminary measurement. Film thickness measurement will be described below.

[0233] 22 , the workpiece W may include a base material BM and a film CF formed on the surface of the base material BM. The film CF may include, for example, a paint film. As an example, if the workpiece W is an aircraft, the base material BM may include the fuselage of the aircraft, and the film CF may include a paint film applied to the fuselage of the aircraft.

[0234] In this case, the processing apparatus 1 may perform a removal process to remove a portion of the film CF. For example, the processing apparatus 1 may perform a removal process to form a riblet structure in the film CF by removing a portion of the film CF. In this case, the processing apparatus 1 may perform a removal process to remove a portion of the film CF without exposing the substrate BM from the film CF. For example, the processing apparatus 1 may perform a removal process to form the above-mentioned riblet structure in the film CF (paint film) without exposing the substrate BM, which corresponds to the base of an aircraft fuselage, from the film CF, which corresponds to the paint film.

[0235] In this case, the control information generator 412 may calculate the thickness of the film CF based on the measurement results of the workpiece W by the measuring device 2. Specifically, the control information generator 412 may calculate a film thickness parameter that directly or indirectly indicates the thickness of the film CF based on the measurement results of the workpiece W by the measuring device 2. For example, the measurement results of the workpiece W by the measuring device 2 include information about the shape (e.g., three-dimensional shape) of the workpiece W. In this case, the control information generator 412 may calculate the height difference (i.e., the height of the peak) between the top of the film CF (i.e., the peak) and the bottom of the film CF (i.e., the valley) in a local region of the workpiece W as a film thickness parameter that directly or indirectly indicates the thickness of the film CF in the local region. In this case, the smaller the film thickness parameter, the thinner the thickness of the film CF. This is because the smaller the film thickness parameter, the lower the peak of the film CF corresponding to the thick portion of the film CF.

[0236] 23 , the control information generating unit 412 may set a non-processing area on the surface of the workpiece W that should not be processed by the processing device 1 based on the thickness of the film CF (i.e., the film thickness parameter). For example, the control information generating unit 412 may set an area of ​​the workpiece W where the thickness of the film CF is thinner than a predetermined thickness threshold as a non-processing area. For example, the control information generating unit 412 may set an area where the above-mentioned film thickness parameter is smaller than a predetermined thickness threshold as a non-processing area.

[0237] In this case, since the non-processing areas where the film CF is thin are not processed by the processing device 1, there is a low possibility that the film CF will be removed and the substrate BM will be exposed to the outside in the non-processing areas. Therefore, the processing device 1 can selectively process the film CF without exposing the substrate BM from the film CF. For example, the processing device 1 can selectively process the above-mentioned riblet structure into the film CF without exposing the substrate BM, which corresponds to the base of an aircraft fuselage, from the film CF, which corresponds to a paint film.

[0238] Taking into consideration such technical effects, the predetermined thickness threshold used to set the non-processing area may be set to a desired value that can distinguish between a thickness of the film CF that will cause the substrate BM to be exposed from the film CF when the processing device 1 processes the film CF and a thickness of the film CF that will not cause the substrate BM to be exposed from the film CF even when the processing device 1 processes the film CF.

[0239] Alternatively, the processing apparatus 1 may process the non-processing area with a processing amount less than the normal processing amount. That is, the processing apparatus 1 may process the non-processing area so that the processing amount in the non-processing area is less than the processing amount in an area on the workpiece W different from the non-processing area. For example, the processing apparatus 1 may process the non-processing area with a processing amount less than the normal processing amount by controlling the focus optical element 1211 to make the defocus amount of the processing light EL for processing the non-processing area greater than the defocus amount of the processing light EL for processing an area different from the non-processing area. As a result, the processing apparatus 1 can selectively process the film CF even in the non-processing area without exposing the substrate BM from the film CF.

[0240] The film CF may be reformed in a non-processed area where the thickness of the film CF is thin. For example, a coating film as the film CF may be reapplied to the non-processed area where the thickness of the film CF is thin. In this case, for reforming the film CF (for example, for reapplication of a coating film), information on the thickness distribution of the film CF may be output from the control information generating unit 412 via the output device 45 to a device that reforms the film CF.

[0241] The control information generating unit 412 may set the non-machining area regardless of the thickness of the film CF based on the measurement results of the workpiece W by the measuring device 2. Alternatively, even if the workpiece W does not include the base material BM and the film CF, the control information generating unit 412 may set the non-machining area based on the measurement results of the workpiece W by the measuring device 2.

[0242] As an example, the control information generating unit 412 may determine whether or not a defect has occurred in the workpiece W based on the measurement results of the workpiece W by the measuring device 2. The defect may include a defect that makes it difficult to perform appropriate processing by the processing device 1. If it is determined that a defect has occurred in the workpiece W, the control information generating unit 412 may set the defective area of ​​the workpiece W determined to have a defect as a non-processing area that should not be processed by the processing device 1.

[0243] As another example, the control information generating unit 412 may determine whether or not a structure that should not be machined by the processing device 1 exists in the workpiece W, based on the measurement results of the workpiece W by the measuring device 2. For example, if the workpiece W is an aircraft, an example of a structure that should not be machined by the processing device 1 is at least one of a rivet (particularly, its head) and a bolt (particularly, its head). When it is determined that a structure that should not be machined by the processing device 1 exists in the workpiece W, the control information generating unit 412 may set an area of ​​the workpiece W where the structure that should not be machined by the processing device 1 exists as a non-machining area that should not be machined by the processing device 1.

[0244] When the non-processing area is set, the control information generating unit 412 may store information about the non-processing area in a processing information DB 421 related to the processing device 1. The information about the non-processing area stored in the processing information DB 421 may be presented to a worker (for example, a user of the processing system SYS), as will be described in detail later in a third modified example.

[0245] (3) Technical Effects of the Machining System SYS As described above, the machining system SYS of this embodiment includes a movable machining device 1 and a measuring device 2 that can move independently of the machining device 1. Therefore, compared to the machining system of the comparative example in which the machining device 1 and the measuring device 2 are integrated (i.e., the machining device 1 and the measuring device 2 cannot move separately), the machining position where the machining device 1 performs machining is less likely to be restricted by the measurement position where the measuring device 2 performs measurement. Similarly, the measurement position where the measuring device 2 performs measurement is less likely to be restricted by the machining position where the machining device 1 performs machining. Therefore, the machining system SYS can efficiently machine and measure the workpiece W by selectively using the machining device 1 and the measuring device 2.

[0246] Furthermore, in this embodiment, the machining system SYS can calculate the target movement path TR for each of the machining head 12 and the measuring head 22 based on model data indicating a three-dimensional model of the workpiece W and position information indicating the measurement results of the position of the workpiece W by the position measuring device 3. Therefore, the machining system SYS can generate the target movement path TR with higher accuracy than when the model data and position information indicating the measurement results of the position of the workpiece W by the position measuring device 3 specialized for measuring the position of a measurement target are not used.

[0247] Furthermore, in this embodiment, after the machining head 12 or the measuring head 22 enters the fine adjustment area AA, the machining system SYS can move the machining head 12 or the measuring head 22 based on position information indicating the measurement results of the position of the machining device 1 or the measuring device 2 by the position measuring device 3. Therefore, the machining system SYS can move the machining head 12 or the measuring head 22 to a more accurate position in the vicinity of the workpiece W. Furthermore, because the machining system SYS can recognize the accurate position of the machining head 12 or the measuring head 22, it can move the machining head 12 or the measuring head 22 while preventing collision between the machining device 1 or the measuring device 2 and the workpiece W.

[0248] (4) Modifications Next, modifications of the machining system SYS will be described.

[0249] (4-1) First Modified Example First, a first modified example of the machining system SYS will be described with reference to Fig. 24. Fig. 24 is a block diagram showing the configuration of the first modified example of the machining system SYS. In the following description, the first modified example of the machining system SYS will be referred to as "machining system SYSa."

[0250] 24 , the machining system SYSa in the first modified example differs from the machining system SYS described above in that it may include a plurality of machining apparatuses 1 and a plurality of measuring apparatuses 2. However, the machining system SYSa may include a plurality of machining apparatuses 1, but may also include a single measuring apparatus 2. The machining system SYSa may include a single machining apparatus 1, but may also include a plurality of measuring apparatuses 2. Other features of the machining system SYSa may be the same as other features of the machining system SYS.

[0251] The number of processing devices 1 and the number of measuring devices 2 may be the same. Alternatively, the number of processing devices 1 and the number of measuring devices 2 may be different. For example, the number of processing devices 1 may be greater than the number of measuring devices 2. For example, the number of measuring devices 2 may be greater than the number of processing devices 1.

[0252] The control server 4 may be capable of controlling a plurality of processing devices 1. When a plurality of processing devices 1 are located at the same base, the control server 4 may function as an edge server located at the base where the plurality of processing devices 1 are located. The control server 4 may function as a cloud server located on a network as viewed from the plurality of processing devices 1. When at least two of the plurality of processing devices 1 are located at different bases, the control server 4 may function as a cloud server located on a network as viewed from the plurality of processing devices 1.

[0253] The control server 4 may be capable of controlling multiple measurement devices 2. When multiple measurement devices 2 are located at the same base, the control server 4 may function as an edge server located at the base where the multiple measurement devices 2 are located. The control server 4 may function as a cloud server located on a network as seen from the multiple measurement devices 2. When at least two of the multiple measurement devices 2 are located at different bases, the control server 4 may function as a cloud server located on a network as seen from the multiple measurement devices 2.

[0254] The processing system SYSa may use at least two of the multiple processing apparatuses 1 for different purposes. The processing system SYSa may use at least two of the multiple measuring apparatuses 2 for different purposes. Hereinafter, with reference to Figures 25(a) to 25(c), an example of the uses of the at least two processing apparatuses 1 and the at least two measuring apparatuses 2 will be described.

[0255] As shown in FIG. 25( a), the machining system SYSa may use a first measuring device 2 (2#1) for the above-described preliminary measurement and a second measuring device 2 (2#2) different from the first measuring device 2#1 for the above-described post-measurement. In this case, as shown in FIG. 25( a), the first measuring device 2#1 may perform preliminary measurement to measure a first portion P11 of the workpiece W. Then, based on the results of the preliminary measurement by the first measuring device 2#1, the control server 4 may generate machining control information for controlling the machining device 1 to machine the first portion P11. Then, the machining device 1 may machine the first portion P11 based on the machining control information. Then, the second measuring device 2#2 may perform post-measurement to measure the first portion P11 of the workpiece W machined by the machining device 1.

[0256] As shown in FIG. 25( b), the machining system SYSa may use a first machining apparatus 1 (1#1) to machine a workpiece W with a first machining accuracy, and a second machining apparatus 1 (1#2) different from the first machining apparatus 1#1 to machine a workpiece W with a second machining accuracy higher than the first machining accuracy. In this case, the machining by the first machining apparatus 1#1 may be referred to as rough machining, and the machining by the second machining apparatus 1#2 may be referred to as finish machining or fine machining. Furthermore, the machining system SYSa may use a third measuring apparatus 2 (2#3) for preliminary measurement to generate machining control information for the first machining apparatus 1#1, and a fourth measuring apparatus 2 (2#4) different from the third measuring apparatus 2#3 for preliminary measurement to generate machining control information for the second machining apparatus 1#2. In this case, as shown in FIG. 25( b), the third measuring device 2#3 may perform preliminary measurement to measure the second portion P12 of the workpiece W. Then, the control server 4 may generate first processing control information for controlling the first processing device 1#1 to process the second portion P12 based on the results of the preliminary measurement by the third measuring device 2#3. Then, the first processing device 1#1 may process the second portion P12 based on the first processing control information. Then, the fourth measuring device 2#4 may perform preliminary measurement to measure the second portion P12 of the workpiece W processed by the first processing device 1#1. Then, the control server 4 may generate second processing control information for controlling the second processing device 1#2 to process the second portion P12 based on the results of the preliminary measurement by the fourth measuring device 2#4. Then, the second processing device 1#2 may process the second portion P12 based on the second processing control information.

[0257] The first processing device 1#1 and the second processing device 1#2 may be different in that the characteristics of the processing light EL used by the first processing device 1#1 and the characteristics of the processing light EL used by the second processing device 1#2 are different. For example, the first processing device 1#1 uses pulsed light (e.g., CO ２Alternatively, the first machining device 1#1 may use pulsed light having a pulse width of picoseconds or femtoseconds to machine the workpiece W with the second machining accuracy. In this case, the second machining device 1#2 may use non-thermal machining (e.g., ablation machining).

[0258] As shown in FIG. 25( c), the machining system SYSa may use the third machining device 1 (1#3) to machine the workpiece W so that the surface flatness of the workpiece W is reduced compared to before machining (i.e., the surface of the workpiece W approaches flatness), and may use a fourth machining device 1 (1#4) different from the third machining device 1#3 to machine the workpiece W so that the above-described riblet structure is formed on the surface of the workpiece W. Alternatively, the machining system SYSa may use the third machining device 1 (1#3) to reduce or eliminate fine irregularities on the surface of the workpiece W (specifically, fine irregularities distributed at a pitch shorter than the pitch of the undulations on the entire surface of the workpiece W). In this case, the machining by the third machining device 1#3 may be referred to as flattening, and the machining by the fourth machining device 1#4 may be referred to as riblet machining. Furthermore, the machining system SYSa may use a fifth measuring device 2 (2#5) for preliminary measurement to generate machining control information for the third machining device 1#3, and a sixth measuring device 2 (2#6) different from the fifth measuring device 2#5 for preliminary measurement to generate machining control information for the fourth machining device 1#4. In this case, as shown in FIG. 25(c), the fifth measuring device 2#5 may perform preliminary measurement to measure a third portion P13 of the workpiece W. Then, based on the results of the preliminary measurement by the fifth measuring device 2#5, the control server 4 may generate third machining control information for controlling the third machining device 1#3 to machine the third portion P13. Then, the third machining device 1#3 may machine the third portion P13 based on the third machining control information. Then, the sixth measuring device 2#6 may perform preliminary measurement to measure the third portion P13 of the workpiece W machined by the third machining device 1#3. Thereafter, the control server 4 may generate fourth processing control information for controlling the fourth processing device 1#4 to process the third portion P13 based on the result of the preliminary measurement by the sixth measuring device 2#6. Thereafter, the fourth processing device 1#4 may process the third portion P13 based on the fourth processing control information.

[0259] However, in the case where the workpiece W includes a substrate BM and a film CF and the surface of the substrate BM is curved as shown in FIG. 22 , the processing system SYS may use the third processing device 1 (1#3) for a purpose other than the purpose of reducing the size of the workpiece W compared to before processing. Specifically, the processing system SYS may use the third processing device 1 (1#3) for the purpose of making the shape of the surface of the workpiece W (in this case, the surface of the film CF) curved similarly to the surface of the substrate BM compared to before processing. In other words, the third processing device 1 (1#3) may process the film CF so that the surface shape of the film CF becomes curved similarly to the surface of the substrate BM. As an example, the third processing device 1 (1#3) may identify the surface shape of the substrate BM based on a three-dimensional model showing the three-dimensional shape of the substrate BM, and then process the film CF based on the identified surface shape of the substrate BM so that the surface shape of the film CF formed on the curved region of the substrate BM becomes curved similarly to the surface of the curved region of the substrate BM. In this case, the third processing device 1 (1#3) may process the film CF so that the curvature of the surface of the film CF is smaller than a predetermined ratio. The third processing device 1 (1#3) may process the film CF so that fine irregularities on the surface of the film CF (specifically, fine irregularities distributed at a pitch shorter than the pitch of the undulations on the entire surface of the film CF) are reduced or eliminated.

[0260] (4-2) Second Modification Next, a second modification of the machining system SYS will be described. In the following description, the second modification of the machining system SYS will be referred to as the "machining system SYSb." The machining system SYSb in the second modification differs from the machining system SYS or SYSa described above in that it includes a machining device 1b instead of the machining device 1. Other features of the machining system SYSb may be the same as other features of the machining system SYS or SYSa. Therefore, the configuration of the machining device 1b in the second modification will be described below with reference to FIG. 26. FIG. 26 is a block diagram showing the configuration of the machining device 1b in the second modification.

[0261] 26 , the processing apparatus 1b in the second modification is different from the above-described processing apparatus 1 in that it further includes a periphery monitoring device 15b. Other features of the processing apparatus 1b may be the same as other features of the processing apparatus 1.

[0262] The periphery monitoring device 15b is a device capable of monitoring the situation around the processing device 1. For example, the periphery monitoring device 15b may include an object detection device capable of detecting objects present around the processing device 1. Examples of objects present around one processing device 1 include at least one of a workpiece W, another processing device 1, a measuring device 2, and other obstacles. Examples of such a periphery monitoring device 15b include at least one of a 3D scanner, an imaging device, a radar, and a LiDAR (Light Detection and Ranging).

[0263] When moving along the target movement path TR, the processing apparatus 1 may perform SLAM (Simultaneous Localization and Mapping) movement using the monitoring results of the periphery monitoring device 15b. Specifically, the processing apparatus 1 may estimate its own position based on the monitoring results of the periphery monitoring device 15b. Furthermore, the processing apparatus 1 may reflect the monitoring results of the periphery monitoring device 15b in the map information generated by the control server 4. For example, the processing apparatus 1 may update the map information generated by the control server 4 so that information about objects detected by the periphery monitoring device 15b as objects present in the periphery of the processing apparatus 1 is included in the map information. Therefore, when performing SLAM movement, the processing apparatus 1 may acquire map information from the control server 4 and update the acquired map information. Thereafter, the processing apparatus 1 may move along the target movement path TR based on the estimation result of the position of the processing apparatus 1 itself and the updated map information. In this case, even if the position measurement device 3 does not measure the position of the processing device 1 while the processing device 1 moves along the target movement path TR, the processing device 1 can move with relatively high accuracy. Alternatively, even if the processing device 1 falls out of the measurement field of view of the position measurement device 3 while the processing device 1 moves along the target movement path TR, the processing device 1 can move with relatively high accuracy. Alternatively, even if the processing device 1 is located in a blind spot of the measurement field of view of the position measurement device 3 while the processing device 1 moves along the target movement path TR, the processing device 1 can move with relatively high accuracy.

[0264] The processing apparatus 1 may transmit information regarding the monitoring results by the periphery monitoring device 15b to the control server 4. The control server 4 may reflect the monitoring results by the periphery monitoring device 15b in the map information. For example, the control server 4 may update the map information so that information regarding objects detected by the periphery monitoring device 15b as objects present in the periphery of the processing apparatus 1 is included in the map information. Thereafter, the control server 4 may calculate a target movement path TR based on the updated map information. That is, the control server 4 may generate processing control information (and further measurement control information) including the target movement path TR based on the updated map information.

[0265] If the processing apparatus 1 is equipped with multiple different types of perimeter monitoring devices 15b, the processing apparatus 1 may select at least one monitoring result with a high reliability from the multiple monitoring results from the multiple different types of perimeter monitoring devices 15b and perform SLAM movement based on the selected at least one monitoring result. The control server 4 may select at least one monitoring result with a high reliability from the multiple monitoring results from the multiple different types of perimeter monitoring devices 15b and update the map information (i.e., calculate the target movement path TR) based on the selected at least one monitoring result. As an example, if the processing apparatus 1 is equipped with multiple different types of perimeter monitoring devices 15b, such as a 3D scanner, an imaging device, and LiDAR, the LiDAR monitoring results have the highest reliability, followed by the imaging device monitoring results, and then the 3D scan monitoring results. In this case, the processing apparatus 1 may, in principle, perform SLAM movement using the LiDAR monitoring results. If the LiDAR monitoring results cannot be used, the processing apparatus 1 may perform SLAM movement using the imaging device monitoring results. When the monitoring results from the imaging device cannot be used, the processing device 1 may perform SLAM movement using the monitoring results from 3D scanning. In principle, the control server 4 may update the map information using the monitoring results from LiDAR. When the monitoring results from LiDAR cannot be used, the control server 4 may update the map information using the monitoring results from the imaging device. When the monitoring results from the imaging device cannot be used, the control server 4 may update the map information using the monitoring results from 3D scanning.

[0266] In the above description, the processing apparatus 1b is equipped with the periphery monitoring device 15b, but the measuring apparatus 2 may also be equipped with the periphery monitoring device 15b. In this case, the periphery monitoring device 15b of the measuring apparatus 2 may monitor the situation around the measuring apparatus 2. As with the processing apparatus 1b, when the measuring apparatus 2 moves along the target movement path TR, it may perform SLAM movement using the monitoring results of the periphery monitoring device 15b. The control server 4 may update the map information so that information about objects detected by the periphery monitoring device 15b as objects present in the periphery of the measuring apparatus 2 is included in the map information.

[0267] Furthermore, if the processing device 1b (or the measuring device 2) is equipped with an imaging device as the periphery monitoring device 15b, the images generated by the imaging device (i.e., the imaging results by the imaging device) may be used for maintenance work by a worker (e.g., a user of the processing system SYS) in addition to or instead of being used for the above-mentioned SLAM movement. For example, if the workpiece W is an aircraft, the images generated by the imaging device may be used for maintenance work on the aircraft by a worker.

[0268] Alternatively, in addition to or instead of the machining apparatus 1b (or the measuring apparatus 2) being provided with an imaging device as the periphery monitoring device 15b, the machining system SYSb may be provided with an imaging device. For example, the machining system SYSb may be provided with an imaging device that captures an image of the workpiece W from a position that allows a bird's-eye view of the workpiece W. Even in this case, the image generated by the imaging device may be used for maintenance work by an operator (for example, a user of the machining system SYSb).

[0269] If the machining system SYSb is equipped with an imaging device, the imaging device may be used as a position measuring device 3 that can measure the position of the workpiece W (and further, the respective positions of the machining device 1 and the measuring device 2). That is, the machining system SYSb may be equipped with an imaging device that can function as the position measuring device 3. For example, the machining system SYSb may be equipped with a monocular camera or a stereo camera as an imaging device that can function as the position measuring device 3. Even in this case, the control server 4 can calculate the position of the measurement object (that is, at least one of the workpiece W, the machining device 1, and the measuring device 2) based on the image generated by the imaging device. Therefore, the machining system SYSb can appropriately perform the above-mentioned machining operation and measurement operation.

[0270] (4-3) Third Modification Next, a third modification of the machining system SYS will be described. In the following description, the third modification of the machining system SYS will be referred to as the "machining system SYSc." The machining system SYSc in the third modification differs from the machining systems SYS, SYSa, or SYSb described above in that it includes a control server 4c instead of the control server 4. Other features of the machining system SYSc may be the same as other features of the machining systems SYS, SYSa, or SYSb. Therefore, the configuration of the control server 4c in the third modification will be described below with reference to FIG. 27. FIG. 27 is a block diagram showing the configuration of the control server 4c in the third modification.

[0271] 27 , a control server 4c in the third modification example differs from the above-described control server 4 in that a UI (User Interface) display control unit 413c is implemented in the computing device 41. Other features of the control server 4c may be the same as other features of the control server 4.

[0272] The UI display control unit 413c controls the display device, which is an example of the output device 45, to display a route setting UI that can be operated by an operator (e.g., a user of the machining system SYSc) to set the target travel route TR. In this case, the operator may set the target travel route TR by operating the route setting UI using the input device 44. That is, in the third modified example, the target travel route TR may be automatically calculated by the control information generation unit 412 or may be manually set by the operator.

[0273] For example, the worker may use the route setting UI to set the above-mentioned movement start position MS (see FIG. 17 ). That is, the worker may use the route setting UI to input information about the movement start position MS to the control server 4. For example, the worker may use the route setting UI to set the above-mentioned movement end position ME (see FIG. 17 ). That is, the worker may use the route setting UI to input information about the movement end position ME to the control server 4. For example, the worker may use the route setting UI to set the above-mentioned processing start position PS (see FIG. 17 ). That is, the worker may use the route setting UI to input information about the processing start position PS to the control server 4. For example, the worker may use the route setting UI to set the above-mentioned standby position WP (see FIG. 17 ). That is, the worker may use the route setting UI to input information about the standby position WP to the control server 4.

[0274] The control information generator 412 of the control server 4 may calculate a target movement route TR based on information set by the worker. For example, the control information generator 412 may calculate a target movement route TR whose starting point is the movement start position MS set by the worker. For example, the control information generator 412 may calculate a target movement route TR whose end point is the movement end position ME set by the worker. As a result, the control information generator 412 can calculate a target movement route that reflects the worker's wishes.

[0275] The control information generator 412 may calculate multiple different movement routes as candidates for the target movement route TR. In this case, the UI display controller 413c may control a display device, which is an example of the output device 45, to display a route setting UI including a screen that allows the worker to select one of the multiple different movement routes as the target movement route TR. The worker may select one of the multiple different movement routes as the target movement route TR. The control information generator 412 may generate processing control information or measurement control information that includes the target movement route TR selected by the worker. As a result, the control information generator 412 can calculate a target movement route TR that reflects the worker's wishes.

[0276] The UI display control unit 413c may control the display device, which is an example of the output device 45, to display a route setting UI including a screen displaying the calculated target travel route TR. For example, the UI display control unit 413c may control the display device, which is an example of the output device 45, to display a route setting UI including a screen displaying the target travel route TR in a three-dimensional space corresponding to the reference coordinate system (i.e., displaying it three-dimensionally). For example, the UI display control unit 413c may control the display device, which is an example of the output device 45, to display a route setting UI including a screen displaying the target travel route TR in a two-dimensional plane obtained by projecting the three-dimensional space corresponding to the reference coordinate system onto a predetermined plane (e.g., an XY plane). As a result, the worker can intuitively recognize the target travel route TR.

[0277] The UI display control unit 413c may control the display device, which is an example of the output device 45, to display a route setting UI including a screen that allows the worker to set no-entry areas where the processing device 1 or the measuring device 2 is prohibited from entering. The worker may set the no-entry areas using the route setting UI. The control information generation unit 412 may calculate a target movement route TR that does not pass through (i.e., avoids) the no-entry areas set by the worker. As a result, the control information generation unit 412 can calculate a target movement route TR that reflects the worker's wishes.

[0278] In addition to or instead of displaying the above-described path setting GUI, the UI display control unit 413c may control a display device, which is an example of the output device 45, to display information related to the processing device 1. For example, the UI display control unit 413c may display information related to the current position of the processing device 1. For example, the UI display control unit 413c may display information related to the time required for the processing device 1 to move along the target movement path TR. For example, the UI display control unit 413c may display information stored in the processing information DB 421. As a result, the worker can appropriately recognize the status of the processing device 1.

[0279] In addition to or instead of displaying the above-described path setting GUI, the UI display control unit 413c may control the display device, which is an example of the output device 45, to display information about the measurement device 2. For example, the UI display control unit 413c may display information about the current position of the measurement device 2. For example, the UI display control unit 413c may display information about the time required for the measurement device 2 to move along the target movement path TR. For example, the UI display control unit 413c may display information stored in the measurement information DB 422. As a result, a worker (for example, a user of the machining system SYS) can appropriately recognize the status of the measurement device 2.

[0280] As described in the second modified example, when the machining system SYS is equipped with an imaging device capable of capturing an image of the workpiece W, the UI display control unit 413c may control a display device, which is an example of the output device 45, to display an image of the workpiece W generated by the imaging device. In this case, the UI display control unit 413c may superimpose information about the workpiece W on the image of the workpiece W. For example, the UI display control unit 413c may superimpose information about the workpiece W stored in at least one of the machining information DB 421 and the measurement information DB 422 on the image of the workpiece W. Examples of information about the workpiece W stored in at least one of the processing information DB 421 and the measurement information DB 422 include at least one of information about a processed area of ​​the workpiece W where processing by the processing device 1 has been completed, information about an incomplete processed area of ​​the workpiece W where processing by the processing device 1 has not yet been completed, information about a measurement-completed area of ​​the workpiece W where measurement by the measuring device 2 has been completed, information about an incomplete measured area of ​​the workpiece W where measurement by the measuring device 2 has not yet been completed, information about a non-processed area of ​​the workpiece W that should not be processed by the processing device 1, and information about an improperly processed area of ​​the workpiece W where processing has been determined to have been improperly performed by the above-mentioned post-measurement. As a result, the worker can properly recognize the condition of the workpiece W.

[0281] (4-4) Other Modifications In the above description, the head drive system 13 of the processing device 1 includes a self-propelled drive system 131 capable of self-propelling on the support surface SS. However, the head drive system 13 may include a flight drive system, such as a drone, that can move in three-dimensional space, in addition to or instead of the self-propelled drive system 131. The flight drive system is a drive system capable of flight. The flight drive system is a drive system that flies together with the arm drive system 132, the fine movement drive system 133, and the processing head 12, thereby moving the arm drive system 132, the fine movement drive system 133, and the processing head 12. Note that the head drive system 23 of the measuring device 2 may also include a flight drive system, in addition to or instead of the self-propelled drive system 231, that flies together with the arm drive system 232, the fine movement drive system 233, and the measuring head 22, thereby moving the arm drive system 232, the fine movement drive system 233, and the measuring head 22. In addition to or instead of a flight drive system movable in three-dimensional space, the head drive system 13 may be provided with a three-dimensional drive mechanism that moves the arm drive system 132, the fine movement drive system 133, and the processing head 12 (the arm drive system 232, the fine movement drive system 233, and the measurement head 22) in three-dimensional space. In addition to or instead of a flight drive system movable in three-dimensional space, the head drive system 23 may be provided with a three-dimensional drive mechanism that moves the arm drive system 232, the fine movement drive system 233, and the measurement head 22 in three-dimensional space. A gantry stage is an example of such a three-dimensional drive mechanism.

[0282] In the above description, the processing apparatus 1 processes the workpiece W, and the measuring apparatus 2 measures the workpiece W. However, the processing apparatus 1 may process the workpiece W and measure it. For example, the processing apparatus 1 may process the workpiece W by irradiating the workpiece W with the processing light EL via the processing optical system 121, and measure the workpiece W by irradiating the workpiece W with the measurement light ML via the same processing optical system 121. Similarly, the processing apparatus 1 may measure the workpiece W and process the workpiece W. For example, the measuring apparatus 2 may measure the workpiece W by irradiating the workpiece W with the measurement light ML via a measurement optical system (not shown) provided in the measurement unit 221, and process the workpiece W by irradiating the workpiece W with the processing light EL via the same measurement optical system.

[0283] In this case, the machining system SYS may include a machining device 1 capable of machining the workpiece W and measuring the workpiece W, and a measuring device 2 capable of machining the workpiece W and measuring the workpiece W. The machining system SYS may include a machining device 1 capable of machining the workpiece W and measuring the workpiece W, and a measuring device 2 that is not capable of machining the workpiece W but can measure the workpiece W. The machining system SYS may include a machining device 1 that is capable of machining the workpiece W but not capable of measuring the workpiece W, and a measuring device 2 that is capable of machining the workpiece W and measuring the workpiece W.

[0284] In the above description, the control server 4 calculates the target movement path TR of each of the machining head 12 and the measuring head 22. However, a device different from the control server 4 may calculate the target movement path TR of at least one of the machining head 12 and the measuring head 22. For example, the control device 14 of the machining device 1 may calculate the target movement path TR of at least one of the machining head 12 and the measuring head 22. For example, the control device 24 of the measuring device 2 may calculate the target movement path TR of at least one of the machining head 12 and the measuring head 22.

[0285] The processing system SYS may include a drawing device that draws a line marker indicating the target movement path TR on the support surface SS. For example, the processing system SYS may include, as the drawing device, a projection device that projects a line marker indicating the target movement path TR onto the support surface SS. The processing system SYS may include, as the drawing device, a laser irradiation device that draws a line marker indicating the target movement path TR on the support surface SS with laser light. Each of the processing device 1 and the measuring device 2 may move along the line marker projected on the support surface SS (i.e., along the target movement path TR). For example, the processing device 1 may include an imaging device that captures the line marker projected on the support surface SS, and the self-propelled drive system 131 may move along the line marker based on the image generated by the imaging device. For example, the measuring device 2 may include an imaging device that captures the line marker projected on the support surface SS, and the self-propelled drive system 231 may move along the line marker based on the image generated by the imaging device. In this case, the control server 4 does not need to transmit information regarding the target movement route TR to each of the processing device 1 and the measuring device 2.

[0286] The processing system SYS may include a movement limiting device that limits the movement of each of the processing device 1 and the measuring device 2. For example, the processing system SYS may include, as the movement limiting device, an infrared transceiver that can set, using infrared rays, a no-entry area into which the processing device 1 and the measuring device 2 are prohibited from entering. In this case, the processing system SYS can appropriately prevent the processing device 1 and the measuring device 2 from entering the no-entry area. Note that the control server 4 may switch the state of the infrared transceiver between an on state in which a no-entry area is set and an off state in which a no-entry area is not set.

[0287] In the above description, the machining system SYS may include a holding device having an end effector capable of holding the workpiece W. The holding device may be a device different from the machining device 1 in that it includes an end effector instead of the machining head 12. The holding device may be a device different from the measuring device 2 in that it includes an end effector instead of the measuring head 22. The end effector may include a robot hand capable of grasping the workpiece W. The end effector may include a suction mechanism capable of suctioning the workpiece W.

[0288] In the above description, the processing apparatus 1 processes the workpiece W by irradiating the workpiece W with processing light EL. However, the processing apparatus 1 may also process the workpiece W by irradiating the workpiece W with any energy beam other than light (this energy beam may be referred to as a "processing beam"). In this case, the processing apparatus 1 may be provided with a beam source capable of generating the any energy beam in addition to or instead of the processing light source 11. Examples of the any energy beam include charged particle beams such as electron beams and ion beams. Another example of the any energy beam includes electromagnetic waves.

[0289] The processing device 1 may process the workpiece W by irradiating the workpiece W with a single processing beam (for example, a single processing light EL). Alternatively, the processing device 1 may process the workpiece W by simultaneously irradiating the workpiece W with multiple processing beams (for example, multiple processing light EL). When multiple processing beams are irradiated simultaneously onto the workpiece W, the processing device 1 may form multiple grooves that form the above-mentioned riblet structure with the multiple processing beams, respectively.

[0290] When a riblet structure is formed using multiple processing beams, the control server 4 may calculate the pitch of grooves to be formed on the surface of the workpiece W by performing fluid analysis to analyze the flow of fluid on the surface of the workpiece W. The processing device 1 may form the riblet structure by irradiating multiple processing beams at different positions on the surface of the workpiece W based on the pitch calculated by the control server 4. Even when the groove pitch changes depending on the position on the surface of the workpiece W, the numerical aperture of the processing optical system 121 provided in the processing device 1 may be constant.

[0291] Alternatively, the processing apparatus 1 may form a riblet structure using interference light obtained by interference of at least two of the multiple processing beams. For example, the processing apparatus 1 may use interference light to form interference fringes on the surface of the workpiece W, thereby removing portions of the workpiece W that are irradiated with bright portions of the interference fringes. As a result, a riblet structure having a pitch corresponding to the interference fringes is formed.

[0292] (5) Supplementary Notes The following supplementary notes are added to the above-described embodiments. [Supplementary Note 1] A processing system for processing an object, comprising: a processing device capable of processing the object by irradiating the object with a processing beam; a measuring device capable of measuring the position of the object and the position of the processing device; and a control device capable of controlling the processing device, wherein the processing device comprises: a first moving device capable of changing the position of a processing head that emits the processing beam; and a second moving device on which the first moving device is mounted and movable together with the first moving device, and the control device controls movement by the second moving device based on measurement results of the measuring device and model information related to the shape of the object. [Supplementary Note 2] The processing system described in Supplementary Note 1, wherein the control device calculates a target movement path that is a movement path from a movement start position at which movement by the second moving device starts to a first target position, based on the measurement results and the model information, and the second moving device is movable along the target movement path. [Supplementary Note 3] The second movement device moves the machining head along the target movement path until a distance between the machining head and a first target position becomes shorter than a predetermined distance, and at least one of the first movement device and the second movement device moves the machining head to the first target position based on a measurement result of the measuring device after the distance between the machining head and the first target position becomes shorter than the predetermined distance. [Supplementary Note 4] The second movement device moves the machining device with a first movement accuracy until a distance between the machining device and a movement end position where movement by the second movement device ends becomes shorter than a predetermined distance, and moves the machining device with a second movement accuracy higher than the first movement accuracy after the distance between the machining device and the movement end position becomes shorter than the predetermined distance.[Supplementary Note 5] The processing system according to any one of Supplements 1 to 4, wherein the processing device further includes a monitoring device capable of monitoring a situation around the processing device, and the control device calculates a target movement path that is a movement path from a movement start position where movement by the second mobile device is started to a first target position based on the measurement results, the model information, and the monitoring results by the monitoring device. [Supplementary Note 6] The control device acquires position information on a position of at least a first portion of the object as the measurement result, and performs a fitting process to place the first portion of a three-dimensional model of the object having a shape indicated by the model information at the position of the first portion of the object in a coordinate system of the position information, thereby generating object position information that indicates the position of the first portion of the object and a position of a second portion of the object different from the first portion in the coordinate system, and calculates a target movement path that is a movement path from a movement start position where movement by the second mobile device is started to a first target position based on the object position information. [Supplementary Note 7] The machining system according to Supplementary Note 2 or 3, wherein the movement start position is input based on the measurement result of the measuring device. [Supplementary Note 8] The machining system according to Supplementary Note 2, 3 or 7, wherein the movement start position is input by an operator. [Supplementary Note 9] The machining system according to Supplementary Note 2, 3, 7 or 8, wherein the first moving device is capable of moving the position of the machining head from the first target position to a second target position, and wherein a distance between the machining start position at which machining is started by the machining device and the second target position is shorter than a distance between the machining start position and the first target position, or the machining start position is the second target position. [Supplementary Note 10] The machining system according to Supplementary Note 9, wherein at least one of the movement start position and the machining start position is input by an operator. [Supplementary Note 11] The machining system according to Supplementary Note 9 or 10, wherein at least one of the first target position and the second target position is input by an operator.[Supplementary Note 12] The machining system according to any one of Supplements 9 to 11, wherein the control device acquires the first target position based on at least one of the movement start position, the processing start position, and the model information, and acquires the second target position based on at least one of the movement start position, the processing start position, and the model information. [Supplementary Note 13] The machining system according to any one of Supplements 9 to 12, wherein the second target position is the processing start position, and the first target position is located between the movement start position and the processing start position. [Supplementary Note 14] The machining system according to any one of Supplements 1 to 13, wherein the first moving device is capable of moving the position of the machining head from a first target position to a second target position, and a distance between the processing start position at which processing is started by the machining device and the second target position is shorter than a distance between the processing start position and the first target position, or the processing start position is the second target position. [Supplementary Note 15] The processing system according to any one of Supplements 1 to 14, wherein the measuring device is capable of measuring the position of the object from a position distant from the object and the processing device, and the control device acquires position information of the object from the measuring device as the measurement result. [Supplementary Note 16] The processing system according to any one of Supplements 1 to 15, wherein the measuring device is capable of measuring the position of each of a plurality of portions of the object. [Supplementary Note 17] The processing system according to any one of Supplements 1 to 16, wherein the processing system includes a plurality of the measuring devices, and a first measuring device of the plurality of measuring devices is capable of measuring the position of a second measuring device of the plurality of measuring devices. [Supplementary Note 18] The processing system according to any one of Supplements 1 to 17, wherein an amount of change in position of the processing head caused by the second moving device is larger than an amount of change in position of the processing head caused by the first moving device. [Supplementary Note 19] The processing system according to any one of Supplements 1 to 18, wherein the object that can be processed by the processing device includes at least one of an aircraft, a wind turbine, an engine turbine, and a power generation turbine.[Supplementary Note 20] The machining system according to any one of Supplements 1 to 19, wherein the second moving device is capable of moving the machining head in a first axial direction and a second axial direction intersecting with the direction of gravity, and the first moving device is capable of moving the machining head in the first axial direction, the second axial direction, and a third axial direction intersecting with the first and second axial directions. [Supplementary Note 21] The machining system according to Supplementary Note 20, wherein the first moving device is capable of moving the machining head in a first rotation direction around a rotation axis along the first axial direction, a second rotation direction around a rotation axis along the second axial direction, and a third rotation direction around a rotation axis along the third axial direction. [Supplementary Note 22] A processing system for processing an object, comprising: a processing device capable of processing the object by irradiating the object with a processing beam; and a measuring device having a measuring head capable of measuring an object to be processed by the processing device or an object processed by the processing device, wherein the processing device comprises: a first moving device capable of changing the position of the processing head that emits the processing beam, and a second moving device on which the first moving device is mounted and movable together with the first moving device, and the measuring device comprises: a third moving device capable of changing the position of the measurement head, and a fourth moving device on which the third moving device is mounted and movable together with the third moving device. [Supplementary Note 23] The measuring device measures a first portion of the object, and the processing device processes the first portion by irradiating the first portion with the processing beam after the measuring device has measured the first portion. [Supplementary Note 24] The processing system according to Supplementary Note 22 or 23, wherein the processing device processes a second portion of the object by irradiating the processing beam onto the second portion, and the measuring device measures the second portion after the processing device has processed the second portion. [Supplementary Note 25] The processing system according to any one of Supplementary Notes 22 to 24, wherein the processing device processes a third portion of the object by irradiating the processing beam onto the third portion, and the measuring device measures the third portion during at least a portion of a period during which the processing device is processing the third portion.[Supplementary Note 26] The processing system according to Supplementary Note 22, wherein the measuring device measures a first portion of the object at a first time and measures a second portion of the object at a second time later than the first time, and the processing device processes the first portion at the second time using a measurement result of the first portion by the measuring device. [Supplementary Note 27] The processing system according to Supplementary Note 22, wherein the processing device processes the first portion of the object at a first time and processes the second portion of the object at a second time later than the first time, and the measuring device measures the first portion processed by the processing device at the second time. [Supplementary Note 28] The processing system according to any one of Supplements 22 to 27, wherein the processing system includes a plurality of the processing devices. [Supplementary Note 29] The processing system according to Supplementary Note 28, wherein a first processing device among the plurality of processing devices processes a fourth portion of the object by irradiating the processing beam onto the fourth portion, and a second processing device among the plurality of processing devices, different from the first processing device, processes the fourth portion by irradiating the fourth portion with the processing beam after the first processing device has processed the fourth portion. [Supplementary Note 30] The processing system according to Supplementary Note 29, wherein the first processing device processes the fourth portion with a first processing accuracy, and the second processing device processes the fourth portion with a second processing accuracy higher than the first processing accuracy. [Supplementary Note 31] The processing system according to Supplementary Note 29, wherein the first processing device processes the fourth portion so that a surface flatness of the fourth portion is reduced compared to before processing, and the second processing device processes the fourth portion so as to form a desired structure in the fourth portion. [Supplementary Note 32] The processing system according to any one of Supplements 22 to 31, wherein the processing system includes a plurality of the measuring devices. [Supplementary Note 33] The processing system described in Supplementary Note 32, wherein a first measuring device among the plurality of measuring devices measures a fifth portion of the object, and a second measuring device among the plurality of measuring devices, different from the first measuring device, measures the fifth portion after the first measuring device has measured the fifth portion.[Supplementary Note 34] The processing system according to any one of Supplements 22 to 33, further comprising a control device that controls at least one of the processing device and the measuring device. [Supplementary Note 35] The processing system according to Supplementary Note 34, wherein the control device controls the processing device to process the object based on a measurement result of the object by the measuring device. [Supplementary Note 36] The processing system according to Supplementary Note 34 or 35, wherein the control device determines whether the processing performed by the processing device is appropriate based on a measurement result of the object by the measuring device. [Supplementary Note 37] The processing system according to Supplementary Note 36, wherein the control device controls the processing device to process the object when it determines that the processing performed by the processing device is inappropriate. [Supplementary Note 38] The processing system according to any one of Supplements 34 to 37, further comprising a measuring device capable of measuring the position of the object and capable of measuring the position of the processing device, wherein the control device calculates a first target movement path which is a movement path from a first movement start position where movement is started by the second moving device to a first target position based on the measurement result of the measuring device, and the second moving device is capable of moving along the first target movement path. [Supplementary Note 39] The processing system according to Supplementary Note 38, wherein the measuring device is further capable of measuring the position of the measuring device, and the control device calculates a second target movement path which is a movement path from a second movement start position where movement is started by the fourth moving device to a second target position based on the measurement result, and the fourth moving device is capable of moving along the second target movement path. [Appendix 40] The machining system described in any one of Appendices 22 to 39, wherein the amount of change in position of the machining head by the second moving device is larger than the amount of change in position of the machining head by the first moving device, and the amount of change in position of the measurement head by the fourth moving device is larger than the amount of change in position of the measurement head by the third moving device.[Supplementary Note 41] The processing system according to any one of Supplements 34 to 39, wherein the object includes a substrate and a film formed on the substrate, and the control device calculates a thickness of the film based on a measurement result of the object by the measurement device, and controls the processing device based on the calculated film thickness. [Supplementary Note 42] The processing system according to Supplementary Note 41, wherein the control device identifies a non-processing portion of the object that should not be processed by the processing device based on the calculated film thickness, and controls the processing device so as not to process the non-processing portion. [Supplementary Note 43] The processing system according to Supplementary Note 41 or 42, wherein the processing device includes an optical element capable of changing a convergence position of the processing beam in a direction intersecting the surface of the object, and the control device controls the optical element based on the calculated film thickness. [Supplementary Note 44] The processing system according to any one of Supplements 22 to 43, wherein the object that can be processed by the processing device includes at least one of an aircraft, a wind turbine, and a power-generating turbine. [Supplementary Note 45] The machining system according to any one of Supplementary Notes 22 to 44, wherein the second moving device is capable of moving the machining head in a first axial direction and a second axial direction intersecting with the direction of gravity, the first moving device is capable of moving the machining head in the first axial direction, the second axial direction, and a third axial direction intersecting with the first and second axial directions, the fourth moving device is capable of moving the measurement head in the first axial direction and the second axial direction, and the third moving device is capable of moving the measurement head in the first axial direction, the second axial direction, and the third axial direction. [Supplementary Note 46] The machining system according to Supplementary Note 45, wherein the first moving device is capable of moving the machining head in a first rotation direction about a rotation axis along the first axial direction, a second rotation direction about a rotation axis along the second axial direction, and a third rotation direction about a rotation axis along the third axial direction, and the third moving device is capable of moving the measurement head in the first rotation direction, the second rotation direction, and the third rotation direction.[Supplementary Note 47] A processing system for processing an object, comprising: a processing device capable of processing the object by irradiating the object with a processing beam; a measuring device capable of measuring a position of the object; and a control device capable of controlling the processing device, wherein the processing device comprises: a first moving device capable of changing the position of a processing head that emits the processing beam; and a second moving device on which the first moving device is placed and which is movable on a first plane, and the control device controls the movement on the first plane by the second moving device based on the measurement results of the measuring device and model information regarding the shape of the object. [Supplementary Note 48] A processing system for processing an object, comprising: a processing device capable of processing the object by irradiating the object with a processing beam; an imaging device capable of imaging the object; and a control device capable of controlling the processing device, wherein the processing device comprises: a first moving device capable of changing the position of a processing head that emits the processing beam; and a second moving device on which the first moving device is placed and which is movable on a first plane, and the control device controls the movement on the first plane by the second moving device based on the imaging results of the imaging device and model information regarding the shape of the object. [Supplementary Note 49] A measurement system comprising: a measurement device equipped with a measurement head capable of measuring the position or shape of an object; a measurement device capable of measuring the position of the object and also capable of measuring the position of the measurement device; and a control device capable of controlling the measurement device, wherein the measurement device comprises: a first movement device capable of changing the position of the measurement head; and a second movement device on which the first movement device is placed and which is movable on a first plane, and the control device controls the movement on the first plane by the second movement device based on the measurement results of the measurement device and model information related to the shape of the object.[Supplementary Note 50] A measurement system comprising: a measurement device equipped with a measurement head capable of measuring the position or shape of an object, the measurement device capable of measuring the position of the object, and a control device capable of controlling the measurement device, wherein the measurement device comprises: a first movable device capable of changing the position of the measurement head, and a second movable device on which the first movable device is placed and movable on a first plane, and the control device controls the movement of the second movable device on the first plane based on the measurement results of the measurement device and model information related to the shape of the object. [Supplementary Note 51] A measurement system comprising: a measurement device equipped with a measurement head capable of measuring the position or shape of an object, an imaging device capable of imaging the object, and a control device capable of controlling the measurement device, wherein the measurement device comprises: a first movable device capable of changing the position of the measurement head, and a second movable device on which the first movable device is placed and movable on a first plane, and the control device controls the movement of the second movable device on the first plane based on the imaging results of the imaging device and model information related to the shape of the object. [Supplementary Note 52] A processing system for processing an object, comprising: a processing device capable of processing the object by irradiating the object with a processing beam, a measuring device capable of measuring the position of the object, and a control device capable of controlling the processing device, wherein the processing device comprises: a first movement device capable of changing the position of a processing head that emits the processing beam, and a second movement device on which the first movement device is mounted and movable on a first plane. [Supplementary Note 53] A processing method for processing an object using a processing device comprising: a first movement device capable of changing the position of a processing head that emits the processing beam, and a second movement device on which the first movement device is mounted and movable together with the first movement device, the processing method comprising: processing the object by irradiating the object with the processing beam from the processing head, measuring the position of the object and the position of the processing device using a measuring device, and controlling movement by the second movement device based on the measurement results of the measuring device and model information related to the shape of the object.[Supplementary Note 54] A processing method for processing an object, comprising: processing the object by irradiating a processing beam from a processing device onto the object; and measuring the object to be processed by the processing device or the object processed by the processing device using a measurement head provided in a measurement device, wherein the processing device comprises: a first moving device capable of changing the position of the processing head that emits the processing beam; and a second moving device on which the first moving device is mounted and movable together with the first moving device; and the measurement device comprises: a third moving device capable of changing the position of the measurement head; and a fourth moving device on which the third moving device is mounted and movable together with the third moving device. [Supplementary Note 55] A processing method for processing an object using a processing device equipped with a first moving device capable of changing the position of a processing head that emits a processing beam, and a second moving device on which the first moving device is mounted and which is movable on a first plane, the processing method including: processing the object by irradiating the processing beam from the processing head onto the object; measuring a reference position that serves as a reference for the object using a measuring device; and controlling movement on the first plane by the second moving device based on the measurement results of the measuring device and model information regarding the shape of the object. [Supplementary Note 56] A processing method for processing an object using a processing device comprising a first moving device capable of changing the position of a processing head that emits a processing beam, and a second moving device on which the first moving device is mounted and which is movable on a first plane, the processing method including: processing the object by irradiating the processing beam from the processing head onto the object; capturing an image of the object using an imaging device; and controlling movement on the first plane by the second moving device based on the imaging results of the imaging device and model information regarding the shape of the object.[Supplementary Note 57] A measurement method for measuring an object using a measurement device comprising a first movable device capable of changing the position of a measurement head, and a second movable device on which the first movable device is placed and movable on a first plane, the measurement method comprising: measuring the position or shape of the object using the measurement head, measuring the position of the object and the position of the measurement device using a measurement device, and controlling movement on the first plane by the second movable device based on the measurement results of the measurement device and model information related to the shape of the object. [Supplementary Note 58] A measurement method for measuring an object using a measurement device comprising a first movable device capable of changing the position of a measurement head, and a second movable device on which the first movable device is placed and movable on a first plane, the measurement method comprising: measuring the position or shape of the object using the measurement head, measuring the position of the object using the measurement device, and controlling movement on the first plane by the second movable device based on the measurement results of the measurement device and model information related to the shape of the object. [Supplementary Note 59] A measurement method for measuring an object using a measurement device comprising a first moving device capable of changing the position of a measurement head, and a second moving device on which the first moving device is placed and which is movable on a first plane, the measurement method including: measuring the position or shape of the object using the measurement head; capturing an image of the object using an imaging device; and controlling the movement on the first plane by the second moving device based on the imaging results of the imaging device and model information relating to the shape of the object.

[0293] The requirements of the above-described embodiments may be combined as appropriate. Some of the requirements of the above-described embodiments may not be used. The requirements of the above-described embodiments may be replaced with requirements of other embodiments as appropriate. Furthermore, to the extent permitted by law, the disclosures of all publications and U.S. patents relating to the devices, etc. cited in the above-described embodiments are incorporated herein by reference.

[0294] Furthermore, the present invention can be modified as appropriate within the scope that does not contradict the gist or idea of ​​the invention that can be read from the claims and the entire specification, and the processing system, measurement system, processing method, and measurement method that involve such modifications are also included in the technical idea of ​​the present invention.

[0295] REFERENCE SIGNS LIST 1 Machining device 12 Machining head 13 Head drive system 131 Self-propelled drive system 132 Arm drive system 14 Control device 2 Measuring device 22 Measuring head 23 Head drive system 231 Self-propelled drive system 232 Arm drive system 24 Control device 3 Position measuring device 4 Control server EL Machining light W Work SYS Machining system

Claims

1. 1. A processing system for processing an object, comprising: a processing device capable of processing the object by irradiating the object with a processing beam; a measuring device capable of measuring a position of the object and a position of the processing device; A control device capable of controlling the processing device; Equipped with The processing device includes: a first moving device capable of changing a position of a processing head that emits the processing beam; a second moving device on which the first moving device is mounted and which is movable together with the first moving device; Equipped with The control device controls the movement of the second moving device based on the measurement result of the measuring device and model information related to the shape of the object. Processing system.

2. the control device calculates a target movement path, which is a movement path from a movement start position where movement by the second movement device is started to a first target position, based on the measurement result and the model information; The second mobile device is movable along the target movement path. The processing system of claim 1 .

3. the second moving device moves the processing head along the target movement path until a distance between the processing head and a first target position becomes shorter than a predetermined distance; At least one of the first moving device and the second moving device moves the processing head to the first target position based on a measurement result of the measuring device after the distance between the processing head and the first target position becomes shorter than the predetermined distance. The processing system of claim 2 .

4. The second moving device moves the processing device with a first movement accuracy until a distance between the processing device and a movement end position, which is a position where the movement by the second moving device is ended, becomes shorter than a predetermined distance, and moves the processing device with a second movement accuracy higher than the first movement accuracy after the distance between the processing device and the movement end position becomes shorter than the predetermined distance. The processing system according to any one of claims 1 to 3.

5. The processing apparatus further includes a monitoring device capable of monitoring a situation around the processing apparatus, The control device calculates a target movement path, which is a movement path from a movement start position where movement by the second moving device is started to a first target position, based on the measurement result, the model information, and the monitoring result by the monitoring device. The processing system according to any one of claims 1 to 3.

6. The control device acquires position information on at least a position of a first portion of the object as the measurement result, and performs a fitting process to place the first portion of a three-dimensional model of the object having a shape indicated by the model information at the position of the first portion of the object in a coordinate system of the position information, thereby generating object position information indicating the position of the first portion of the object and the position of a second portion of the object different from the first portion in the coordinate system, and calculates a target movement path, which is a movement path from a movement start position where movement is started by the second moving device to a first target position, based on the object position information. The processing system according to any one of claims 1 to 3.

7. The movement start position is input based on the measurement result of the measuring device. The processing system according to claim 2 or 3.

8. The movement start position is input by the operator. The processing system according to claim 2 or 3.

9. The first moving device is capable of moving a position of the processing head from the first target position to a second target position, A distance between a processing start position where processing is started by the processing device and the second target position is shorter than a distance between the processing start position and the first target position, or the processing start position is the second target position. The processing system according to claim 2 or 3.

10. At least one of the movement start position and the processing start position is input by an operator. The processing system of claim 9.

11. At least one of the first target position and the second target position is input by an operator. The processing system of claim 9.

12. The control device includes: The first target position is acquired based on at least one of the movement start position, the processing start position, and the model information; The second target position is acquired based on at least one of the movement start position, the processing start position, and the model information. The processing system of claim 9.

13. the second target position is the processing start position, The first target position is located between the movement start position and the processing start position. The processing system of claim 9.

14. The first moving device is capable of moving a position of the processing head from a first target position to a second target position, A distance between a processing start position where processing is started by the processing device and the second target position is shorter than a distance between the processing start position and the first target position, or the processing start position is the second target position. The processing system according to any one of claims 1 to 3.

15. the measuring device is capable of measuring a position of the object from a position remote from the object and the processing device; The control device acquires position information of the object from the measurement device as the measurement result. The processing system according to any one of claims 1 to 3.

16. The measuring device is capable of measuring the position of each of a plurality of portions of the object. The processing system according to any one of claims 1 to 3.

17. the processing system includes a plurality of the measuring devices, A first measuring device of the plurality of measuring devices is capable of measuring a position of a second measuring device of the plurality of measuring devices. The processing system according to any one of claims 1 to 3.

18. The amount of change in the position of the machining head caused by the second moving device is greater than the amount of change in the position of the machining head caused by the first moving device. The processing system according to any one of claims 1 to 3.

19. The object that can be processed by the processing device includes at least one of an aircraft, a wind turbine, an engine turbine, and a power generation turbine. The processing system according to any one of claims 1 to 3.

20. The second moving device is capable of moving the processing head in a first axial direction and a second axial direction intersecting a gravity direction, The first moving device is capable of moving the processing head in the first axial direction, the second axial direction, and a third axial direction intersecting the first and second axial directions. The processing system according to any one of claims 1 to 3.

21. The first moving device is capable of moving the processing head in a first rotation direction around a rotation axis along the first axial direction, a second rotation direction around a rotation axis along the second axial direction, and a third rotation direction around a rotation axis along the third axial direction.

21. The processing system of claim 20.

22. A processing method for processing an object using a processing device including a first moving device capable of changing a position of a processing head that emits a processing beam, and a second moving device on which the first moving device is mounted and which is movable together with the first moving device, comprising: Processing the object by irradiating the processing beam from the processing head to the object; Measuring a position of the object and a position of the processing device using a measurement device; Controlling the movement of the second moving device based on the measurement results of the measuring device and model information relating to the shape of the object. A processing method comprising the steps of: