Bonding apparatus, bonding method, and bonding control program

Abstract

A bonding apparatus 1 comprises: a bonding head 2 including a pressure tool PT that pressurizes an electronic component 9 and a heater 22 that heats the pressure tool PT, the pressure tool PT being configured so as to be detachable from the heater 22; a storage unit 5 that stores temperature control data indicating temporal changes in the set temperature of the heater 22; and a control unit 4 that controls the set temperature of the heater 22 on the basis of the temperature control data. The temperature control data has one or more temperature control patterns associated with bonding conditions for bonding the electronic component 9 to a substrate 8. The control unit 4 reads one of the one or more temperature control patterns according to the bonding conditions and controls the set temperature of the heater 22.

Description

Bonding device, bonding method, and bonding control program

[0001] The present invention relates to a bonding apparatus, a bonding method, and a bonding control program.

[0002] In technology for bonding electronic components to a substrate, it is important to control the temperature of the tip of the bonding head according to the bonding conditions when bonding the electronic component mounted on the substrate. This is because the temperature control of the bonding head during bonding varies depending on the bonding conditions when mounting the electronic component on the substrate, such as the thickness of the electronic component, the type of electrodes or bonding material, and the orientation of the electronic component (e.g., whether the surface on which the integrated circuit pattern is formed faces the substrate). During bonding, the solder or adhesive between the electronic component and the substrate is melted, and then the bonding head is cooled, cooling the solder or adhesive and solidifying the electronic component, completing the bonding between the electronic component and the substrate. For example, Patent Document 1 discloses a bonding device having a cooling structure that controls the temperature of the tip of the bonding head when pressing the substrate against the electronic component.

[0003] Japanese Patent Application Laid-Open No. 2016-149567

[0004] However, the technique described in Patent Document 1 was unable to perform high-precision bonding associated with the bonding conditions of the electronic component to be mounted on the substrate.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a bonding apparatus, a bonding method, and a bonding control program that enable highly accurate bonding associated with the bonding conditions of electronic components.

[0006] A bonding apparatus in a first aspect of the present invention is a bonding apparatus for bonding an electronic component to a substrate, and includes a pressure tool for pressurizing the electronic component and a heater for heating the pressure tool, the pressure tool being configured to be detachable from the heater, a bonding head, a memory unit for storing temperature control data indicating changes in the set temperature of the heater over time, and a control unit for controlling the set temperature of the heater based on the temperature control data, the temperature control data having one or more temperature control patterns associated with bonding conditions for bonding the electronic component to the substrate, and the control unit reads out one of the one or more temperature control patterns in accordance with the bonding conditions and controls the set temperature of the heater.

[0007] Furthermore, a bonding method according to a second aspect of the present invention includes preparing a bonding head including a pressure tool for applying pressure to an electronic component and a heater for heating the pressure tool, the pressure tool being configured to be detachable from the heater; applying pressure to the electronic component toward a substrate using the pressure tool; and reading, from a memory unit, temperature control data indicating changes in the set temperature of the heater over time, and controlling, by a control unit, the set temperature of the heater based on the temperature control data, the temperature control data having one or more temperature control patterns associated with bonding conditions for bonding the electronic component to the substrate, and controlling the set temperature of the heater includes reading, in accordance with the bonding conditions, one of the one or more temperature control patterns to control the set temperature of the heater.

[0008] In addition, a bonding control program in a third aspect of the present invention is a bonding control program for controlling a bonding apparatus having a bonding head including a pressure tool that applies pressure to an electronic component and a heater that heats the pressure tool, the pressure tool being configured to be detachable from the heater, a memory unit that stores temperature control data that indicates changes in the set temperature of the heater over time, and a control unit that controls the set temperature of the heater based on the temperature control data, wherein the temperature control data has one or more temperature control patterns associated with bonding conditions for bonding the electronic component to a substrate, and causes a computer in the control unit to read out one of the one or more temperature control patterns in accordance with the bonding conditions, and to control the set temperature of the heater from the read temperature control pattern.

[0009] The present invention can provide a bonding apparatus, a bonding method, and a bonding control program that enable high-precision bonding associated with bonding conditions.

[0010] FIG. 1 is a diagram showing an example of the configuration of a bonding apparatus 1 according to an embodiment of the present disclosure; FIG. 2 is a diagram showing an example of the configuration of a bonding apparatus 1 according to an embodiment of the present disclosure; FIG. 3 is a flowchart showing a heater temperature control method according to an exemplary embodiment; FIG. 4 is a flowchart showing bonding according to an exemplary embodiment; FIG. 5 is a diagram showing a temperature control signal output to a heater according to an exemplary embodiment; FIG. 6 is a diagram showing a comparative example of a process window and a measurement pattern according to an exemplary embodiment; FIG. 7 is a diagram showing a comparative example of a process window and a measurement pattern according to another exemplary embodiment;

[0011] The present invention will be described below through embodiments of the invention, but the invention according to the claims is not limited to the following embodiments. Furthermore, not all of the configurations described in the embodiments are necessarily essential as means for solving the problems.

[0012] <Configuration Example of Bonding Apparatus> A configuration example of a bonding apparatus will be described below with reference to Fig. 1 and Fig. 2. Fig. 1 and Fig. 2 are diagrams showing an example of the configuration of a bonding apparatus 1 according to an embodiment of the present disclosure.

[0013] In a bonding apparatus 1 according to one embodiment of the present invention, as shown in FIG. 1 , the temperature of the heater 22 is adjusted in advance in accordance with bonding conditions (e.g., the type of electronic component 9), and then, as shown in FIG. 2 , the electronic component 9 is bonded to the substrate 8. The electronic component 9 is, for example, a semiconductor die. In this case, the semiconductor die has a certain thickness and has a surface on which an integrated circuit pattern is formed and a back surface opposite the surface. Note that the external dimensions, thickness, electrode configuration, etc. of semiconductor dies vary depending on the type, and the temperature and pressure changes required for bonding also vary. Therefore, to achieve suitable bonding, it is necessary to perform temperature adjustment and bonding in accordance with the bonding conditions. The bonding apparatus 1 described below can provide a bonding apparatus 1 that enables high-precision bonding corresponding to, for example, the type of electronic component 9 to be mounted on the substrate 8.

[0014] The bonding apparatus 1 according to the present disclosure includes a bonding head 2, an input unit 3, a control unit 4, a storage unit 5, and a display unit 6.

[0015] The bonding head 2 is composed of an actuator 21, a heater 22, and an adjustment tool AT or a pressure tool PT. The bonding head 2 can be moved in the z-axis direction (the up-down direction in FIGS. 1 and 2) and rotated around the z-axis. The bonding head 2 may also be attached to an XY mechanism that moves it in two axes, the x-axis direction (the left-right direction in FIG. 1) and the y-axis direction (the front-to-back direction in FIGS. 1 and 2), not shown, and may be rotated on each axis or swiveled around each axis.

[0016] The actuator 21 moves the bonding head 2 in the z-axis direction. As shown in Figures 1 and 2, the actuator 21 is equipped with a heater 22 and an adjustment tool AT or a pressure tool PT, and is capable of driving the entire bonding head 2.

[0017] The heater 22 is heated or cooled based on temperature control from the control unit 4, and heats or radiates heat to the adjustment tool AT or the pressure tool PT. The adjustment tool AT or the pressure tool PT is configured to be detachably attached to the tip of the heater 22. The heater 22 is heated or cooled by receiving a temperature control signal from the control unit 4. The heater 22 may include a heater circuit, and, for example, the heater 22 may be heated by receiving a temperature control signal via the heater circuit, or may be cooled by radiating heat into the atmosphere. The heater 22 may be attached to the actuator 21 via a heat insulating material.

[0018] The adjustment tool AT is heated or radiated by the heater 22. The adjustment tool AT may have a built-in temperature sensor, and for example, the temperature of the adjustment tool AT is measured by the temperature sensor. Note that a temperature sensor (not shown) may be separately provided on the surface of the adjustment tool AT. Furthermore, since the method of applying temperature or pressure differs depending on the type of electronic component 9, multiple types of adjustment tools AT are prepared for each electronic component 9. In other words, an adjustment tool AT selected from the multiple types of adjustment tools AT is used to perform temperature control associated with the type of electronic component 9. Note that a common adjustment tool AT may be used for multiple types of electronic components 9 if it is possible to perform common temperature control for each type, or different adjustment tools AT may be used for each type.

[0019] The pressure tool PT is heated or heat-dissipated by the heater 22. The pressure tool PT bonds the electronic component 9 to the substrate 8 in response to the driving of the bonding head 2. For example, the pressure tool PT has a pressure surface pf, and the pressure surface pf applies pressure and heat for a predetermined period of time while pressing against the main surface 10 of the electronic component 9. Since the method of applying temperature or pressure differs depending on the type of electronic component 9, multiple types of pressure tools PT are prepared for each electronic component 9. That is, a pressure tool PT selected from the multiple types of pressure tools PT is used to perform temperature control and pressure control associated with the type of electronic component 9. Note that a common pressure tool PT may be used for multiple types of electronic components 9 if it is possible to perform a common temperature control for each type, or different pressure tools PT may be used for each type.

[0020] The input unit 3 generates various types of input information in response to input operations by the user, and transmits the generated input information to the control unit 4. For example, the input unit 3 generates information for driving the bonding head 2 and information for controlling the temperature of the heater 22. The input unit 3 also accepts data input operations from the user, and may include, for example, various buttons, a mouse, a keyboard, and a touch panel.

[0021] The control unit 4 controls the bonding head 2. The control unit 4 is also connected to the input unit 3, storage unit 5, and display unit 6 so that they can communicate with each other. The control unit 4 performs different operation flows when adjusting the heater temperature and when performing bonding. Details of each flow will be described later using Figures 3 and 4. The control unit 4 includes a drive control unit 41, a temperature control unit 42, and a temperature measurement unit 43.

[0022] The drive control unit 41 controls the overall driving such as the movement, position and orientation of the bonding head 2. For example, the drive control unit 41 drives the bonding head 2 to move up and down when bonding is performed.

[0023] The temperature control unit 42 controls the temperature of the heater 22 and generates a temperature control pattern, which will be described later. When adjusting the heater temperature, the temperature control unit 42 compares the process window acquired from the storage unit 5 with the measurement pattern acquired from the temperature measurement unit 43 to generate a temperature control pattern. At this time, the measurement pattern acquired from the temperature measurement unit 43 is a feedback value obtained from the adjustment tool AT when the temperature control unit 42 controls the temperature of the heater 22. The generated temperature control pattern is stored in the storage unit 5, and when bonding is performed, the temperature control unit 42 acquires the temperature control pattern from the storage unit 5 and controls the temperature of the heater 22 based on this.

[0024] The temperature measurement unit 43 generates a measurement pattern from the adjustment tool AT. As described above, the measurement pattern is a feedback value obtained from the adjustment tool AT by the temperature control unit 42 controlling the temperature of the heater 22, and may be, for example, data on the temperature change of the adjustment tool AT over a predetermined period of time. The temperature measurement unit 43 supplies the generated measurement pattern to the temperature control unit 42.

[0025] The storage unit 5 stores a plurality of process windows and one or more temperature control patterns. The plurality of process windows are data associated with each of a plurality of types of electronic components 9 stored in advance in the storage unit 5, and may be, for example, a plurality of data with predetermined time ranges and temperature ranges. The one or more temperature control patterns are data generated by the temperature control unit 42 for each of the plurality of types of electronic components 9.

[0026] The display unit 6 receives and displays information obtained based on various input information input by the input unit 3 from the control unit 4. The display unit 6 displays, for example, position information of the tip of the bonding head 2, the process window, the measurement pattern, and other information.

[0027] FIG. 3 is a flowchart illustrating a heater temperature adjustment method (hereinafter also referred to as "this adjustment method") according to an exemplary embodiment. This adjustment method illustrates an example in which one or more temperature control patterns associated with bonding conditions for bonding an electronic component 9 to a substrate 8 are stored in a storage unit 5. As shown in FIG. 3, this adjustment method includes a heater temperature control step st11, a measurement pattern generation step st12, a determination step st13 for determining whether the temperature is within the process window, a temperature control pattern generation step st14, and a temperature control pattern storage step st15. By repeatedly executing this adjustment method multiple times, multiple temperature control patterns associated with multiple types of pressure tools are generated. The processing in each step may be performed by the bonding apparatus 1 shown in FIG. 1. The following describes an example in which this adjustment method is executed using the bonding apparatus 1 shown in FIG. 1. The type of pressure tool is an example of a bonding condition. Bonding conditions include the types of chips and substrates constituting the electronic component, differences in other device configurations, differences in adhesives and solders used to bond the chip and substrate, and differences in bonding conditions for bonding the chip and substrate.

[0028] <Bonding Apparatus During Heater Temperature Adjustment> (Step st11: Heater Temperature Control) In step st11, the temperature control unit 42 controls the temperature of the heater 22 and heats or radiates heat from the adjustment tool AT attached to the heater 22.

[0029] 1 controls the temperature of the heater 22. The temperature of the heater 22 may be controlled, for example, by a user's input operation on the input unit 3, so as to increase or decrease the temperature.

[0030] (Step st12: Generate Measurement Pattern) In step st12, the temperature measurement unit 43 generates a measurement pattern from the change in temperature over time obtained from the adjustment tool AT.

[0031] 1 generates a measurement pattern as a feedback value obtained from the adjustment tool AT when the temperature control unit 42 controls the temperature of the heater 22. The measurement pattern is generated, for example, by dividing the time-dependent change in temperature obtained from the adjustment tool AT into predetermined time intervals in the temperature measurement unit 43.

[0032] (Step st13: Determining Whether the Measurement Pattern Fits Within the Process Window) In step st13, the temperature control unit 42 determines whether the measurement pattern fits within the process window. That is, the temperature control unit 42 obtains the process window associated with the type of electronic component 9 from the storage unit 5, and determines whether the measurement pattern obtained from the temperature measurement unit 43 fits within the process window. If the measurement pattern does not fit within the process window, the process may be executed again from step st11. Note that steps st11 to st13 may be repeated multiple times until the measurement pattern fits within the process window. If the measurement pattern fits within the process window, the process proceeds to step st14.

[0033] 1 acquires from the storage unit 5 a process window associated with the type of electronic component 9, and determines whether the measurement pattern acquired from the temperature measurement unit 43 fits within the process window. The determination of whether the measurement pattern fits within the process window may be displayed on the display unit 6. For example, if at least a portion of the measurement pattern does not fit within the temperature range of the process window, the user may input information via the input unit 3 to bring at least a portion of the measurement pattern within the temperature range of the process window, and then execute the process again from step st11. Note that if a common temperature control is applicable, a common process window may be used for multiple types of electronic components 9.

[0034] (Step st14: Generating Temperature Control Pattern) In step st14, the temperature control unit 42 generates a temperature control pattern based on the measurement pattern that fits within the process window. That is, the temperature control unit 42 generates a temperature control pattern associated with the type of electronic component 9. Note that when a temperature control pattern is generated using a common process window for multiple types of electronic components 9, a common temperature control pattern may be generated for the multiple types of electronic components 9.

[0035] (Step st15: Storing Temperature Control Pattern) In step st15, the temperature control pattern generated by the temperature control unit 42 is stored in the memory unit 5. The temperature control pattern is generated in association with the type of electronic component 9, and is stored in the memory unit 6 in association with identification information that specifies the type of pressurizing tool PT, which will be described later. Note that a common temperature control pattern may be associated with multiple types of pressurizing tools PT.

[0036] From the above steps st11 to st15, a temperature control pattern associated with the type of electronic component 9 is generated, and is stored in association with the pressure tool PT in the storage unit 5. The above processing method is repeated multiple times, and the temperature control patterns associated with each of the multiple types of electronic components 9 are stored in advance in the storage unit 5, and then the bonding process is started.

[0037] FIG. 4 is a flowchart illustrating bonding according to an exemplary embodiment. The control unit 4 reads one of the temperature control patterns stored in the memory unit 5 according to the bonding conditions and performs bonding. As shown in FIG. 4 , the bonding process includes a step st21 for determining the type of pressure tool, a step st22 for reading the temperature control pattern, and a step st23 for performing bonding. One of the temperature control patterns generated by this adjustment method is selected and bonding is performed. The processing in each step may be performed by the bonding apparatus 1 shown in FIG. 2 . The following describes an example of performing bonding using the bonding apparatus 1 shown in FIG. 2 . The type of pressure tool is an example of a bonding condition. Bonding conditions include the types of chips and substrates constituting the electronic component, differences in other device configurations, differences in adhesives and solders used to bond the chip and substrate, and differences in bonding conditions for bonding the chip and substrate.

[0038] <Bonding Apparatus During Bonding> (Step st21: Determining Type of Pressure Tool) In step st21, the temperature control unit 42 determines the type of pressure tool PT. Because the pressure tool PT is associated with the type of electronic component 9, determining the type of pressure tool PT makes it possible to determine the temperature control or pressure control that is suitable for the electronic component 9 to be mounted. In this case, the control unit 4 may determine the type of pressure tool PT by acquiring identification information for the pressure tool PT, or the type of pressure tool PT attached to the bonding head 2 may be determined by the user visually checking the type of electronic component 9 or pressure rule PT and inputting it as input information for the input unit 3.

[0039] (Step st22: Reading Temperature Control Pattern) In step st22, the temperature control unit 42 reads out a temperature control pattern from the storage unit 5. Specifically, the temperature control unit 42 reads out one of the temperature control patterns associated with the pressurizing tool PT from one or more temperature control patterns associated with each type of pressurizing tool PT.

[0040] (Step st23: Executing Bonding) In step st23, the control unit 4 controls the bonding head 2 to execute bonding.

[0041] 2 performs temperature control by outputting a temperature control pattern read from the storage unit 5 to the heater 22. The temperature control unit 42 may perform temperature control of the heater 22 in accordance with the pressure applied by the lifting and lowering operation of the bonding head 2. For example, the temperature control unit 42 may output a temperature control pattern to perform temperature control so that the drive control unit 41 synchronizes the drive of the bonding head 2.

[0042] The step st23 is performed in a state where the electronic component 9 is placed on the main surface of the substrate 8 placed on the stage 7.

[0043] 2 drives the bonding head 2 to lower it until the electronic component 9 presses against the substrate 8, and applies pressure and heat for a predetermined time while the bonding head 2 is pressing the electronic component 9 against the substrate 8. At this time, for example, by applying pressure and heat for a predetermined time while the bonding head 2 is pressing the electronic component 9 against the substrate 8, solder or the like provided on the electronic component 9 melts, and the substrate 8 and the electronic component 9 are bonded together.

[0044] Through the above steps st21 to st23, one or more temperature control patterns associated with the pressure tool PT are read from the storage unit 5, and the bonding apparatus 1 performs bonding.

[0045] FIG. 5A is a diagram showing a temperature control signal output to a heater according to one exemplary embodiment. FIG. 5B is a diagram showing a comparative example of a process window and a measurement pattern according to one exemplary embodiment. The temperature control signal, measurement pattern, and process window shown in FIGS. 5A and 5B may each be generated in the bonding apparatus 1 shown in FIG. 1. Below, with reference to FIGS. 1 and 3, the operation of the bonding apparatus 1 in this adjustment method and each waveform will be described. The temperature control signal is a control waveform used by the temperature control unit 42 to control the temperature of the heater 22, and may be generated based on information input from the input unit 3, for example.

[0046] 5A shows the temperature control signal generated by the temperature control unit 42 in step st11. As shown in FIG. 5A, the temperature control signal increases at a constant rate from time t10 to t11, passes through a constant current holding period from time t11 to t12, increases again at a constant rate from time t12 to t13, holds the constant current value from time t13 to t14, and decreases at a constant rate from time t14 onwards.

[0047] 5A is generated by the temperature control unit 42 and supplied to the heater 22. The temperature control signal shown in Fig. 5A may be generated by the temperature control unit 42 based on information input via the input unit 3, for example.

[0048] 5B shows a comparative example in which a measurement pattern generated in step st12 is determined to fit within the process window in step st13. As shown in FIG. 5B, the measurement pattern fits within the process window. That is, the measurement pattern fits between the lower limit threshold temperature Tmpl and the upper limit threshold temperature Tmpu during the period from time t101 to time t102.

[0049] The comparison of the measurement pattern shown in Fig. 5B with the process window may be performed by the temperature control unit 42. For example, the comparison of the measurement pattern shown in Fig. 5B with the process window may be performed by generating a feedback value obtained by inputting the temperature control signal of Fig. 5A to the heater 22 as a measurement pattern in the temperature measurement unit 43, and displaying the comparison result with the process window obtained from the storage unit 5 on the display unit 6.

[0050] Based on the measurement pattern shown in FIG. 5B, the temperature control unit 42 generates a temperature control pattern in step st14, and stores the pattern in the storage unit 5 in step st15.

[0051] Fig. 6A is a diagram showing a temperature control signal output to a heater according to another exemplary embodiment. Fig. 6B is a diagram showing a comparative example of a process window and a measurement pattern according to another exemplary embodiment. The temperature control signal, measurement pattern, and process window shown in Figs. 6A and 6B may each be generated in the bonding apparatus 1 shown in Fig. 1. Below, with reference to Figs. 1 and 3, the operation of the bonding apparatus 1 in this adjustment method and each waveform will be described.

[0052] 6A shows the temperature control signal generated by the temperature control unit 42 in step st11. As shown in FIG. 6A, the temperature control signal increases at a constant rate from time t10 to t11, passes through a constant current holding period from time t11 to t12, decreases again at a constant rate from time t12 to t13, passes through a constant current holding period from time t13 to t14, increases at a constant rate from time t14 to t15, the constant current value is maintained from time t15 to t16, and decreases at a constant rate from time t16 onwards.

[0053] 6A is generated by the temperature control unit 42 and supplied to the heater 22. The temperature control signal shown in Fig. 6A may be generated by the temperature control unit 42 based on information input via the input unit 3, for example.

[0054] 6B shows a comparative example in which a determination is made in step st13 as to whether the measurement pattern generated in step st12 falls within the process window. As shown in FIG. 6B, the measurement pattern falls within the process window. That is, the measurement pattern falls between the lower limit threshold temperature Tmpl and the upper limit threshold temperature Tmpu during the period from time t101 to time t102.

[0055] The comparison of the measurement pattern shown in Fig. 6B with the process window may be performed by the temperature control unit 42. For example, the comparison of the measurement pattern shown in Fig. 6B with the process window may be performed by generating a feedback value obtained by inputting the temperature control signal of Fig. 6A to the heater 22 as a measurement pattern in the temperature measurement unit 43, and displaying the comparison result with the process window obtained from the storage unit 5 on the display unit 6.

[0056] Based on the measurement pattern shown in FIG. 6B, a temperature control pattern is generated by the temperature control unit 42 in step st14, and is stored in the storage unit 5 in step st15.

[0057] As described above, in this adjustment method, it is possible to fit the measurement pattern generated based on the temperature control signal within the process window, as shown in Figures 5A and 5B. That is, by providing a constant current holding period from time t11 to time t12 of the temperature control signal in Figure 5A, it is possible for the measurement pattern in Figure 5B to fit within the process window without exceeding the upper limit threshold temperature Tmpu at its rising edge.

[0058] 6A and 6B, this adjustment method allows the measurement pattern generated based on the temperature control signal to fit within the process window. That is, by providing a constant current holding period from time t11 to t12 for the temperature control signal in Fig. 6A, the measurement pattern in Fig. 6B does not exceed the upper threshold temperature Tmpu at its rising edge, and by providing a constant current holding period from time t13 to t14, the measurement pattern in Fig. 6B does not fall below the lower threshold temperature Tmpl at its rising edge, allowing the measurement pattern to fit within the process window.

[0059] 5A and 5B, and 6A and 6B are examples of waveforms to which the present adjustment method is applied, assuming different types of electronic components 9. That is, FIGS. 5A and 5B and 6A and 6B have different temperature control signals and different process windows. The present adjustment method is not limited to these waveforms.

[0060] <Other Examples of the Present Embodiment> Various modifications can be made to the embodiments of the present disclosure without departing from the scope and spirit of the present disclosure. For example, in the present embodiment, the bonding head 2 is controlled using a common control unit 4 during heater temperature adjustment and during bonding, but different control units may be used to control the bonding head. In other words, when applying the present adjustment method, the control unit may be a tester having only the functions of the temperature control unit 42 and the temperature measurement unit 43, and the heater temperature may be adjusted.

[0061] For example, pressure patterns associated with each of multiple types of electronic components 9 may be stored in the memory unit 5, and when bonding is performed, the drive control unit 41 may obtain the pressure pattern associated with the type of electronic component 9 from the memory unit 5 and drive the bonding head 2.

[0062] Furthermore, for example, in the present adjustment method, an example has been described in which the heater 22 is heated to adjust the temperature, but the electronic component 9 and the substrate 8 may actually be prepared, and bonding may be performed thereon to adjust the temperature of the heater 22. For example, the bonding head 2 may be driven based on various control information input via the input unit 3 to bond the electronic component 9 and the substrate 8, and the user may visually check the bonding condition between the electronic component 9 and the substrate 8 and correct the input information via the input unit 3, thereby controlling the temperature of the heater 22.

[0063] Furthermore, for example, in the present adjustment method, an example has been described in which the temperature control unit 42 acquires a process window from the storage unit 5 and a measurement pattern from the temperature measurement unit 43 to generate a temperature control pattern, but the temperature control unit 42 may acquire the process window and measurement pattern from the storage unit 5 to generate a temperature control pattern. For example, the temperature measurement unit 43 may generate a plurality of measurement patterns and store them in the storage unit 5, and the temperature control unit 42 may acquire the plurality of measurement patterns and one selected from the plurality of process windows from the storage unit 5 to generate a temperature control pattern.

[0064] 1...bonding device, 2...bonding head, 21...actuator, 22...heater, 3...input section, 4...control section, 41...control drive section, 42...temperature control section, 43...temperature measurement section, 5...storage section, 6...display section, 7...stage, 8...substrate, 9...electronic component, AT...adjustment tool, PT...pressure tool

Claims

1. A bonding apparatus for bonding an electronic component to a substrate, comprising: a bonding head including a pressure tool for applying pressure to the electronic component and a heater for heating the pressure tool, the pressure tool being configured to be detachable from the heater; a storage unit for storing temperature control data indicating a change in a set temperature of the heater over time; a control unit that controls a set temperature of the heater based on the temperature control data; an adjustment tool that is replaceable with the pressure tool and is configured to be detachably attached to the heater; a temperature sensor for measuring the temperature of the adjustment tool; Equipped with the temperature control data includes one or more temperature control patterns associated with bonding conditions for bonding the electronic component to the substrate; the control unit reads out one of the one or more temperature control patterns in accordance with the bonding conditions, and controls a set temperature of the heater; The temperature control pattern is generated based on a measurement pattern indicating a time change in a measurement value from the temperature sensor when the control unit controls the set temperature of the heater. Bonding equipment.

2. (delete)

3. The bonding apparatus according to claim 1 , wherein the storage unit stores the measurement pattern in association with the temperature control pattern.

4. The bonding apparatus according to claim 1 , wherein the measurement pattern has temperature characteristics within a range that falls within a process window when bonding the electronic component to the substrate.

5. The bonding conditions include a type of the pressure tool, 2. The bonding apparatus according to claim 1, wherein a set temperature of the heater is controlled by reading out one of the one or more temperature control patterns according to a type of the pressure tool.

6. the electronic component is a semiconductor chip having a bump-forming surface with a plurality of bumps; 5. The bonding apparatus according to claim 1, wherein the pressure tool presses the electronic component in such a direction that the bump-formed surface of the semiconductor chip faces the base material.

7. preparing a bonding head including a pressure tool for applying pressure to an electronic component and a heater for heating the pressure tool, the pressure tool being configured to be detachable from the heater; pressing the electronic component against a substrate with the pressure tool; reading out temperature control data indicating a time change in the set temperature of the heater from a storage unit, and controlling the set temperature of the heater based on the temperature control data by a control unit; and Generating a temperature control pattern Including, the temperature control data includes one or more of the temperature control patterns associated with bonding conditions for bonding the electronic component to the substrate; controlling the set temperature of the heater includes reading out any one of the one or more temperature control patterns in accordance with the bonding condition to control the set temperature of the heater; Generating the temperature control pattern includes: attaching an adjustment tool to the heater, the adjustment tool being interchangeable with the pressure tool; measuring the temperature of the adjustment tool attached to the heater by a temperature sensor; The control unit controls the set temperature of the heater to obtain a measurement pattern indicating a time change in the measurement value from the temperature sensor; and generating the temperature control pattern based on the measurement pattern; A bonding method comprising:

8. (delete)

9. a bonding head including a pressure tool for applying pressure to an electronic component and a heater for heating the pressure tool, the pressure tool being configured to be detachable from the heater; a storage unit for storing temperature control data indicating a change in a set temperature of the heater over time; a control unit that controls a set temperature of the heater based on the temperature control data; an adjustment tool that is replaceable with the pressure tool and is configured to be detachably attached to the heater; a temperature sensor for measuring the temperature of the adjustment tool; A bonding control program for controlling a bonding apparatus comprising: the temperature control data includes one or more temperature control patterns associated with bonding conditions for bonding the electronic component to the substrate; The computer of the control unit reading out one of the one or more temperature control patterns according to the bonding condition; Controlling the set temperature of the heater based on the read temperature control pattern; and the temperature control pattern is generated based on a measurement pattern indicating a time change in a measurement value from the temperature sensor when the control unit controls the set temperature of the heater; A bonding control program that executes the above.