Metallized film manufacturing device, metallized film, and film capacitor

Abstract

This metallized film manufacturing device comprises: a supply unit that supplies a dielectric film in a lengthwise direction; a printing roll that has a rotational axis in the width direction of the dielectric film, and that prints an insulation pattern on a surface of the dielectric film; and a deposition unit that forms a metal deposition electrode at positions, except where the insulation pattern is, on the surface of the dielectric film. The printing roll has protrusions that are formed axially extending on the outer circumferential surface of the printing roll, and that correspond to the insulation pattern. A reinforcing part is formed at one end of each protrusion in the axial direction of the protrusion.

Description

Metallized film manufacturing apparatus, metallized film, and film capacitor

[0001] The present invention relates to a metallized film manufacturing apparatus, a metallized film, and a film capacitor.

[0002] A film capacitor is known that is formed by laminating or winding a dielectric film having a vapor-deposited electrode formed on its surface. For example, Patent Document 1 describes a metallized film capacitor in which a first vapor-deposited electrode is disposed on one side of the dielectric film and a second vapor-deposited electrode is disposed on the other side of the dielectric film.

[0003] In the film capacitor of Patent Document 1, the first and second vapor deposited electrodes are divided by a dividing margin extending in the width direction to form first and second divided electrodes.

[0004] JP 2010-199479 A

[0005] The metallized film capacitor described in Patent Document 1 still has room for improvement in terms of suppressing variations in capacitance.

[0006] The present invention provides a metallized film manufacturing apparatus, a metallized film, and a film capacitor that can suppress variations in capacitance.

[0007] A metallized film manufacturing apparatus according to one aspect of the present invention comprises: a supply unit that supplies a dielectric film in a longitudinal direction; a printing roll having a rotation axis in the width direction of the dielectric film and that prints an insulating pattern on the surface of the dielectric film; and a vapor deposition unit that forms a metal vapor deposition electrode on the surface of the dielectric film at a position excluding the insulating pattern, wherein the printing roll has a convex portion that extends axially on the outer peripheral surface of the printing roll and corresponds to the insulating pattern, and a reinforcing portion is formed at one end of the convex portion in the axial direction of the printing roll.

[0008] A metallized film according to one embodiment of the present invention comprises: a dielectric film; and a metal vapor deposition electrode formed on the surface of the dielectric film so as to provide an insulating margin at one end of the dielectric film in the width direction, wherein the metal vapor deposition electrode includes a plurality of split electrodes divided by slits provided along the width direction of the dielectric film, and each of the plurality of split electrodes has a notch provided in the corner facing the insulating margin.

[0009] A film capacitor according to one aspect of the present invention includes the above-described metallized film and a pair of end electrodes arranged on both ends of the metallized film.

[0010] According to the present invention, it is possible to provide a metallized film manufacturing apparatus, a metallized film, and a film capacitor that can suppress variations in capacitance.

[0011] 1A is an enlarged view of region E1;

[0033] FIG. 1B is a schematic diagram showing a film capacitor according to the first embodiment of the present invention;

[0034] FIG. 1C is a schematic diagram showing a pair of metallized films included in a wound body;

[0035] FIG. 1D is a schematic diagram showing a metallized film manufacturing apparatus according to the first embodiment of the present invention;

[0036] FIG. 4 is a perspective view showing a printing roll of the metallized film manufacturing apparatus of FIG. 4;

[0037] FIG. 5 is a planar development of the convex portion of the printing roll;

[0038] FIG. 6 is a diagram showing an insulating pattern printed by the convex portion of the printing roll;

[0039] FIG. 6D is a schematic diagram showing a process of forming an insulating pattern in the metallized film manufacturing apparatus of FIG. 4;

[0039] FIG. 7 is a table showing the relationship between the slit width and the distance between the ends of adjacent split electrodes on the insulating margin side, and the occurrence of distortion in the split electrodes;

[0039] FIG. 7E is a schematic diagram showing a metallized film according to a first modification of the first embodiment;

[0039] FIG. 8 is a schematic diagram showing a metallized film according to a second modification of the first embodiment;

[0039] FIG. 8F is a schematic diagram showing a metallized film according to a third modification of the first embodiment;

[0012] (Background to the Invention) Film capacitors are known that are formed by winding or laminating dielectric films having vapor-deposited electrodes on their surfaces. In some film capacitors, pattern margins are formed on the vapor-deposited electrodes to improve safety. For example, in the film capacitor described in Patent Document 1, the vapor-deposited electrodes are divided by partition margins extending in the width direction.

[0013] The compartment margin is a portion that does not contribute to the capacitance of the film capacitor, so reducing the width of the compartment margin is effective in increasing the capacitance of the film capacitor and achieving smaller and lower cost film capacitors.

[0014] The compartment margins are formed by applying oil to the areas where the compartment margin patterns are to be formed before metal is vapor-deposited on the dielectric film. A printing roll, for example, is used to apply the oil, but narrowing the compartment margins also reduces the pattern width of the printing roll, which can cause distortion in the printing roll. Distortion in the printing roll also causes distortion in the compartment margins formed on the dielectric film, reducing the area of ​​the vapor-deposited electrodes and resulting in a decrease in the capacitance of the film capacitor.

[0015] The present inventor(s) have investigated a metallized film manufacturing apparatus, a metallized film, and a film capacitor that can reduce distortion of the compartment margin and suppress variation in capacitance, and have arrived at the following invention.

[0016] First Embodiment Overall Configuration Fig. 1A is a schematic diagram showing a metallized film 11 according to a first embodiment of the present invention. Fig. 1B is an enlarged view of region E1 in Fig. 1A.

[0017] <Metallized Film> Metallized film 11 is a film in which a vapor-deposited metal electrode 13 is formed on the surface of dielectric film 12. Metallized film 11 is stacked or wound to form film capacitor 1 shown in Fig. 2, which will be described later.

[0018] Dielectric film 12 is formed of a plastic film containing a thermoplastic resin such as polyethylene terephthalate, polypropylene, polyphenylene sulfide, or polyethylene naphthalate, or a plastic film containing a thermosetting resin such as a cured product obtained by reacting a hydroxyl group (OH group) of the first organic material with an isocyanate group (NCO group) of the second organic material. Vapor-deposited metal electrode 13 is formed of a metal such as aluminum or zinc.

[0019] Vapor deposited metal electrode 13 is divided into a plurality of segmented electrodes 13a by a plurality of slits 14 provided along the width direction W of dielectric film 12. Vapor deposited metal electrode 13 includes a connecting portion 13b at one end of dielectric film 12 in the width direction W, extending along the longitudinal direction L of dielectric film 12. Each of the plurality of segmented electrodes 13a is connected to connecting portion 13b via a fuse 15.

[0020] At the other end of dielectric film 12 in width direction W, an insulating margin 16 where no vapor deposited metal electrodes are formed is provided along longitudinal direction L of dielectric film 12. Insulating margin 16 is connected to each of slits 14.

[0021] Each of the plurality of split electrodes 13a has a notch 17 at a corner facing the insulating margin 16. As shown in Fig. 1B, each notch 17 is formed at the end of the slit 14 facing the insulating margin 16 so that the width of the slit 14 increases toward the insulating margin 16. In other words, the slit 14 is formed so that the width increases from d1 to d2 toward the insulating margin 16 at the end on the insulating margin 16 side. In this embodiment, the notch 17 is formed in a C-plane shape.

[0022] In this embodiment, the slit width d1 of the slit 14 is set to 0.2 mm or less. The slit 14 is a portion of the dielectric film 12 where the metal vapor deposition electrode 13 is not formed, and does not contribute to the capacitance of the film capacitor 1. Therefore, in order to maximize the capacitance of the film capacitor 1, it is desirable that the slit width d1 be small, preferably 0.2 mm or less. By setting the slit width d1 to 0.2 mm or less, the film capacitor 1 can be made smaller.

[0023] 1B , the ratio of the first slit width d1 of the slit 14 to the second slit width d2, which is wider than the first slit width d1, is preferably 2 to 42. The second slit width d2 indicates the distance between the ends of adjacent split electrodes 13a on the insulating margin 16 side. In other words, the ratio of the distance d2 between the ends of adjacent split electrodes 13a on the insulating margin 16 side to the slit width d1 is preferably 2 to 42. The notches 17 are formed so that the ratio of the first slit width d1 to the second slit width d2 is 2 to 42. Forming the notches 17 in this manner can prevent distortion of the slit 14 and suppress a decrease in the capacitance of the film capacitor 1.

[0024] <Film Capacitor> FIG. 2 is a schematic diagram showing the film capacitor 1 according to the first embodiment of the present invention.

[0025] As shown in FIG. 2 , film capacitor 1 includes wound body 10 formed by overlapping and winding a pair of metallized films 11 , and a pair of end electrodes 20 disposed on both ends of wound body 10 .

[0026] 3 is a schematic diagram showing a pair of metallized films 11 included in roll 10. Roll 10 is formed by winding a pair of metallized films 11 stacked in the thickness direction. Roll 10 may also be formed by stacking multiple metallized films 11.

[0027] 3, the pair of metallized films 11 are stacked with a shift amount As in the width direction W of the dielectric film 12. The metallized films 11 are stacked such that the connection portions 13b of each metallized film 11 are positioned on opposite sides in the width direction W of the dielectric film 12. After the pair of metallized films 11 are wound, the connection portion 13b of one metallized film 11 is connected to one of the pair of end surface electrodes 20, and the connection portion 13b of the other metallized film 11 is connected to the other of the pair of end surface electrodes 20.

[0028] By forming an insulating margin 16 at the end opposite the connection portion 13b of the metallized film 11, it is possible to prevent a short circuit from occurring between the connection portion 13b of one metallized film 11 and the end surface electrode 20 of the other.

[0029] <Metallized Film Manufacturing Apparatus> Metallized film manufacturing apparatus 100 will be described with reference to Figures 4 to 6B. Figure 4 is a schematic diagram showing metallized film manufacturing apparatus 100 according to a first embodiment of the present invention. Figure 5 is a perspective view showing print roll 40 of metallized film manufacturing apparatus 100 of Figure 4. Figure 6A is a planar development of convex portions 41 of print roll 40 of Figure 5. Figure 6B is a diagram showing an insulating pattern printed by convex portions 41 of print roll 40.

[0030] Metallized film manufacturing apparatus 100 includes a supply unit 30, a printing roll 40, and a vapor deposition unit 50. Supply unit 30 supplies dielectric film 12 to metallized film manufacturing apparatus 100. Printing roll 40 applies oil to the surface of dielectric film 12 to form an insulating pattern on which metal is not vapor-deposited. Vapor deposition unit 50 vapor-deposits metal on the areas not coated with oil by printing roll 40.

[0031] In manufacturing apparatus 100, dielectric film 12 is supplied from supply unit 30 in the direction of arrow S1, i.e., in the longitudinal direction L of dielectric film 12, and oil is applied by print roll 40 to form an insulating pattern on the surface of dielectric film 12. Then, vapor deposition unit 50 forms vapor-deposited metal electrodes 13 on the surface of dielectric film 12 in areas other than the insulating pattern. Metallized film 11 with vapor-deposited metal electrodes 13 formed thereon is fed in the direction of arrow S2 and taken up by take-up unit 60. An intermediate roller 61 is disposed between supply unit 30 and take-up unit 60.

[0032] 5 , the printing roll 40 has a rotation axis Ax aligned with the width direction W of the dielectric film 12, which is supplied in the longitudinal direction L. That is, the printing roll 40 has a rotation axis Ax in a direction intersecting the direction in which the dielectric film 12 is supplied, and applies oil to the surface of the dielectric film 12 to form an insulating pattern. The insulating pattern refers to portions, such as slits 14 and insulating margins 16, where oil is applied to provide portions on the surface of the dielectric film 12 where metal is not vapor-deposited.

[0033] 5, the print roll 40 is formed in a generally cylindrical shape. Slit-forming portions 41 corresponding to the insulating pattern are provided on the outer peripheral surface of the print roll 40. The slit-forming portions 41 correspond to the "protrusions" of the present invention.

[0034] As shown in FIG. 6A , the slit forming portions 41 are formed to extend in the axial direction of the print roll 40, and in this embodiment, a plurality of slit forming portions 41 are arranged at intervals in the circumferential direction of the print roll 40. Each slit forming portion 41 corresponds to a corresponding slit 14 in the metallized film 11. In this embodiment, the slit forming portions 41 are formed in two rows in the axial direction of the print roll 40. By forming the slit forming portions 41 in two rows, two metallized films can be formed at one time. The slit forming portions 41 may be formed in one row, or in three or more rows.

[0035] The slit forming portion 41 is formed to be elongated along the axial direction Ax of the print roll 40 and the width direction W of the dielectric film 12. The slit forming portion 41 is formed to have a small width in order to reduce the slit width d1 of the slit 14. Therefore, a reinforcing portion 42 is provided to prevent distortion at the end of the slit forming portion 41. The reinforcing portion 42 is formed at one end of the slit forming portion 41 in the axial direction Ax of the print roll 40. By forming the slit forming portion 41 in this shape, notches 17 are formed at the corners of the divided electrodes 13a of the metallized film 11, as shown in FIG. 1A . In other words, the reinforcing portion 42 corresponds to the notch 17 provided in the divided electrodes 13a.

[0036] In the present embodiment, an insulating margin forming portion 43 extending in the circumferential direction is formed on the printing roll 40. The insulating margin forming portion 43 corresponds to the insulating margin 16 of the metallized film 11.

[0037] As shown in Fig. 6B, when oil 70 is applied to dielectric film 12 by printing roll 40, insulating patterns 14a, 17a, and 16a are formed. Insulating pattern 14a is an insulating pattern for forming slit 14 shown in Fig. 1A. Insulating pattern 17a is an insulating pattern for forming notch 17 shown in Fig. 1A. Insulating pattern 16a is an insulating pattern for forming insulating margin 16 shown in Fig. 1A. In this way, slit forming portion 41, reinforcing portion 42, and insulating margin forming portion 43 are formed in shapes corresponding to the insulating patterns.

[0038] 7 is a schematic diagram showing the process of forming an insulating pattern in the metallized film manufacturing apparatus 100 of FIG. 4. Dielectric film 12 is fed in the direction of arrow A1. At this time, oil 70 is fed to the tip of slit forming section 41 as printing roll 40 rotates in the direction of arrow A2. Oil 70 adhering to the tip of slit forming section 41 is transferred to dielectric film 12, forming an insulating pattern on dielectric film 12. At this time, oil 70 is also fed to reinforcing section 42 of slit forming section 41, and the insulating pattern is formed in a shape corresponding to slit 14. Similarly, oil is applied to a position corresponding to insulating margin 16.

[0039] The width of the slit forming portion 41 is preferably 0.2 mm or less to correspond to the slit width d1. The width of the slit forming portion 41 is formed so as to gradually increase toward one end of the slit forming portion 41. Therefore, the width of one end of the slit forming portion 41 is formed so as to increase outward. The ratio of the width of the end of the reinforcing portion 42 to the width of the slit forming portion 41 is preferably 2 to 42 times. This corresponds to the ratio of the distance between the ends of adjacent split electrodes 13a to the slit width d1.

[0040] In this embodiment, the other end of the slit forming portion 41 is formed to have a constant width.

[0041] After the insulating pattern is formed by printing roll 40, vapor deposition electrode 13 is formed by vapor deposition unit 50. At this time, no metal is vapor-deposited on the area where the insulating pattern is formed, and this becomes slit 14 and insulating margin 16. Because slit forming unit 41 is provided with reinforcing unit 42, notches 17 are formed at the corners of segmented electrodes 13a of vapor deposition electrode 13, as shown in FIG. 1A .

[0042] By forming the reinforcing portion 42 at one end of the slit forming portion 41, the end of the slit forming portion 41 can be reinforced, and distortion of the end of the slit forming portion 41 can be reduced.

[0043] Metallized film 11 on which vapor deposited metal electrode 13 has been formed by vapor deposition unit 50 is taken up by take-up unit 60 .

[0044] [Example] We investigated whether distortion occurs in the split electrodes by changing the slit width in the metallized film described in Embodiment 1. Fig. 8 is a table showing the relationship between the slit width d1, the distance between the ends of adjacent split electrodes on the insulating margin side, and the occurrence of distortion in the split electrodes.

[0045] In metallized film 11 of embodiment 1, electrode width d3 (see FIG. 1A ) of split electrode 13a was kept constant at 2 mm, and slit width d1 was varied to 0.1 mm, 0.2 mm, and 0.05 mm. Furthermore, distance d2 (shown as "edge distance d2" in FIG. 8 ) between the ends of adjacent split electrodes 13a on the insulating margin 16 side was varied. Edge distance d2 was varied by changing chamfer dimension d4 shown in FIG. 1A . Chamfer dimension d4 indicates the size of notch 17 in the width direction of split electrode 13a (longitudinal direction L of dielectric film 12) at the end of split electrode 13a on the insulating margin 16 side.

[0046] As shown in FIG. 8 , when the slit width d1 is 0.1 mm and the edge distance d2 is 1.1 mm, the edge distance d2 / slit width d1 ratio is 11. That is, the ratio of the distance d2 between the edge of the adjacent split electrode 13a on the insulating margin 16 side to the slit width d1 is 11. Similarly, when the slit width d1 is 0.2 mm and the edge distance d2 is 0.4 mm, the edge distance d2 / slit width d1 ratio is 2. When the slit width d1 is 0.05 mm and the edge distance d2 is 2.1 mm, the edge distance d2 / slit width d1 ratio is 42. When the slit width d1 is 0.1 mm and the edge distance d2 is 0.15 mm, the edge distance d2 / slit width d1 ratio is 1.5. Note that No. 4 in the table of FIG. 8 is a comparative example without a reinforcing portion, while Nos. 1 to 3 and 5 are examples with a reinforcing portion. In Example 5, distortion occurred because the reinforcing portion was small, but the degree of distortion was smaller than in the case where there was no reinforcing portion.

[0047] After forming vapor-deposited metal electrode 13 using the above four patterns, we checked whether or not distortion occurred in segmented electrode 13a. As a result, as shown in Figure 8, when end distance d2 / slit width d1 was 2 times or more and 42 times or less, no distortion occurred in the segmented electrode. This indicates that no distortion occurred at the end of slit formation portion 41 of printing roll 40.

[0048] Therefore, it can be seen that when the value of end distance d2 / slit width d1 is 2 times or more and 42 times or less, vapor-deposited metal electrode 13 can be formed as designed using printing roll 40. This allows the shape of segmented electrode 13a to be stabilized, and when film capacitor 1 is formed using metallized film 11, a decrease in capacitance can be suppressed.

[0049] [Effects] According to the above-described embodiment, the following effects can be achieved.

[0050] Metallized film 11 includes dielectric film 12 and vapor-deposited metal electrode 13. Vapor-deposited metal electrode 13 is formed on the surface of dielectric film 12 so that insulating margin 16 is provided at one widthwise end of dielectric film 12, and includes a plurality of segmented electrodes 13a separated by slits 14 provided along the widthwise direction of dielectric film 12. Each of segmented electrodes 13a has a notch 17 provided at a corner facing insulating margin 16.

[0051] With this configuration, vapor deposited metal electrode 13 is divided into a plurality of divided electrodes 13a, providing a safety function for the film capacitor, while suppressing a decrease in capacitance due to distortion of divided electrodes 13a.

[0052] The width d1 of the slit 14 is 0.2 mm or less.

[0053] With this configuration, the slit width can be reduced and the capacitance of the film capacitor can be increased.

[0054] The ratio of the distance between the ends of the adjacent divided electrodes 13a on the insulating margin 16 side to the width d1 of the slit 14 is 2 times or more and 42 times or less.

[0055] With this configuration, distortion of the split electrodes 13a can be suppressed, and a decrease in capacitance can be suppressed.

[0056] The notch 17 is formed in a C-face shape.

[0057] With this configuration, distortion of the split electrodes 13a can be suppressed, and a decrease in the capacitance of the film capacitor can be suppressed.

[0058] Film capacitor 1 includes metallized film 11 and end electrodes 20. End electrodes 20 are disposed on both ends of metallized film 11.

[0059] With this configuration, it is possible to provide a film capacitor 1 in which the decrease in capacitance is suppressed.

[0060] The metallized film manufacturing apparatus 100 includes a supply unit 30, a printing roll 40, and a vapor deposition unit 50. The supply unit 30 supplies the dielectric film 12 in the longitudinal direction. The printing roll 40 has a rotation axis in the width direction of the dielectric film 12 and prints an insulating pattern on the surface of the dielectric film 12. The vapor deposition unit 50 forms a vapor-deposited metal electrode 13 on the surface of the dielectric film 12 at a position other than the insulating pattern. The printing roll 40 has a protrusion 41 formed on the outer circumferential surface of the printing roll 40, extending in the axial direction, and corresponding to the insulating pattern. A reinforcing portion 42 is formed at one end of the protrusion 41 in the width direction of the dielectric film 12.

[0061] With this configuration, it is possible to prevent distortion from occurring in the convex portions 41 of the printing roll 40 when applying oil to the insulating pattern.

[0062] The reinforcing portion 42 is formed so that its width gradually increases toward one end of the protruding portion 41 .

[0063] With this configuration, distortion of the protrusions 41 can be further suppressed.

[0064] The width of the portion of the protrusion 41 where the reinforcing portion 42 is not formed is 0.2 mm or less.

[0065] With this configuration, the width d1 of slit 14 in metallized film 11 can be reduced, and the capacitance of film capacitor 1 can be increased.

[0066] The ratio of the width of the reinforcing portion 42 on one end side of the protrusion 41 to the width of the protrusion 41 is 2 times or more and 42 times or less.

[0067] With this configuration, it is possible to reduce the width of the protrusions 41 while suppressing distortion of the protrusions 41 .

[0068] The other end of the protrusion 41 in the width direction of the dielectric film 12 is formed to have a constant width.

[0069] With this configuration, the area of ​​the split electrode 13a can be made as large as possible, and the capacitance of the film capacitor 1 can be increased.

[0070] 9 is a schematic diagram showing a metallized film according to Modification 1 of Embodiment 1. As shown in Fig. 9, in metallized film 111, notch 117 may be formed larger than notch 17 of metallized film 11 according to Embodiment 1, and split electrode 113a may have a pointed tip.

[0071] 10 is a schematic diagram showing a metallized film according to Variation 2 of Embodiment 1. As shown in FIG. 10, notch 217 may be formed in a rounded shape in metallized film 211. By forming notch 217 in a rounded shape, the corners of split electrode 213a are rounded, which can further suppress distortion of split electrode 213a.

[0072] 11 is a schematic diagram showing a metallized film according to Modification 3 of Embodiment 1. As shown in FIG. 11 , in metallized film 311, notch 317 may be formed in a rounded shape, and the end of split electrode 313 a may be formed in an arc shape.

[0073] (Summary of the embodiment) (1) The metallized film manufacturing apparatus of the present invention comprises a supply section that supplies a dielectric film in the longitudinal direction, a printing roll having a rotation axis in the width direction of the dielectric film and that prints an insulating pattern on the surface of the dielectric film, and a vapor deposition section that forms a metal vapor deposition electrode at a position on the surface of the dielectric film excluding the insulating pattern, wherein the printing roll is formed on the outer peripheral surface of the printing roll extending in the axial direction and has a convex portion corresponding to the insulating pattern, and a reinforcing portion is formed at one end of the convex portion in the axial direction of the printing roll.

[0074] (2) In the metallized film manufacturing apparatus of (1), the reinforcing portion may be formed so that its width gradually increases toward one end of the convex portion in the axial direction of the printing roll.

[0075] (3) In the apparatus for producing a metallized film according to (1) or (2), the width of the portion of the convex portion where the reinforcing portion is not formed may be 0.2 mm or less.

[0076] (4) In any one of the metallized film manufacturing apparatuses (1) to (3), the ratio of the width of the reinforcing portion at one end of the convex portion to the width of the convex portion may be 2 times or more and 42 times or less.

[0077] (5) In the metallized film manufacturing apparatus according to any one of (1) to (4), the other end of the convex portion in the width direction of the dielectric film may be formed to have a constant width.

[0078] (6) The metallized film of the present invention comprises a dielectric film and a metal vapor deposition electrode formed on the surface of the dielectric film so as to provide an insulating margin at one end of the dielectric film in the width direction, the metal vapor deposition electrode including a plurality of divided electrodes divided by slits provided along the width direction of the dielectric film, and each of the plurality of divided electrodes having a notch at the corner facing the insulating margin.

[0079] (7) In the metallized film of (6), the width of the slit may be 0.2 mm or less.

[0080] (8) In the metallized film of (6) or (7), the ratio of the distance between the ends of adjacent split electrodes on the insulating margin side to the width of the slit may be 2 to 42 times.

[0081] (9) In the metallized film of any one of (6) to (8), the notch may be formed in a C-plane shape.

[0082] (10) In the metallized film of any one of (6) to (8), the notch may be formed in a rounded shape.

[0083] (11) A film capacitor of the present invention includes the metallized film of any one of (6) to (10) and a pair of end electrodes disposed on both ends of the metallized film.

[0084] The present invention can be widely applied to metallized films for forming film capacitors and to manufacturing apparatuses thereof.

[0085] REFERENCE SIGNS LIST 1 film capacitor 10 wound body 11, 111, 211, 311 metallized film 12 dielectric film 13 metal vapor deposition electrode 13a, 113a, 213a, 313a divided electrode 13b connection portion 14 slit 15 fuse 16 insulation margin 20 end surface electrode 30 supply portion 40 printing roll 41 slit forming portion (convex portion) 42 reinforcement portion 50 vapor deposition portion 100 manufacturing apparatus d1 slit width d2 end distance L longitudinal direction W width direction

Claims

1. a supply unit that supplies the dielectric film in a longitudinal direction; a printing roll having a rotation axis in a width direction of the dielectric film and configured to print an insulating pattern on a surface of the dielectric film; a deposition unit for forming a metal deposition electrode on the surface of the dielectric film at a position other than the insulating pattern; Equipped with the printing roll has a convex portion formed on an outer circumferential surface of the printing roll, the convex portion extending in an axial direction and corresponding to the insulating pattern; a reinforcing portion is formed at one end of the protruding portion in the axial direction of the printing roll; Metallized film manufacturing equipment.

2. The reinforcing portion is formed so as to have a width gradually increasing toward the one end of the protruding portion in the axial direction.

2. The apparatus for producing a metallized film according to claim 1.

3. The width of the portion of the protrusion where the reinforcing portion is not formed is 0.2 mm or less.

2. The apparatus for producing a metallized film according to claim 1.

4. The ratio of the width of the reinforcing portion on one end side of the convex portion to the width of the convex portion is 2 times or more and 42 times or less.

2. The apparatus for producing a metallized film according to claim 1.

5. the other end of the protrusion in the width direction of the dielectric film is formed to have a constant width. The apparatus for producing a metallized film according to claim 1 .

6. A dielectric film; a metal vapor deposition electrode formed on a surface of the dielectric film so as to provide an insulating margin at one end of the dielectric film in a width direction; Equipped with the vapor-deposited metal electrode includes a plurality of divided electrodes divided by slits provided in a width direction of the dielectric film, Each of the plurality of split electrodes has a notch at a corner portion facing the insulating margin, and has a flat portion that is flat along an extending direction of the insulating margin. Metallized film.

7. The width of the slit is 0.2 mm or less. The metallized film of claim 6.

8. a ratio of a distance between the ends of the adjacent split electrodes on the insulating margin side to a width of the slit is 2 times or more and 42 times or less; The metallized film of claim 6.

9. The notch is formed in a C-face shape. The metallized film of claim 6.

10. The notch is formed in an R-shaped surface. The metallized film of claim 6.

11. The metallized film according to any one of claims 6 to 10, a pair of end electrodes disposed on both ends of the metallized film; Equipped with Film capacitor.