Power Conversion Unit

Abstract

The power conversion unit includes a housing, a first element, a second element, and an explosion-proof plate. The first element is disposed inside the housing. The second element is disposed inside the housing horizontally adjacent to the first element. The explosion-proof plate covers the first element and the second element when viewed from above the housing. The explosion-proof plate is a laminated conductor connected to the first element and the second element.

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE An embodiment of the present invention relates to a power conversion unit. [Background technology]

[0002] The power conversion unit has a shelf provided in the housing and units stored on the shelf. The power conversion unit has a DC fuse to prevent short circuits and explosions. If a short circuit occurs in a power conversion unit, it could affect other healthy units. Each unit has an explosion-proof mechanism. As an example, the explosion-proof mechanism has a cover that seals the unit. The unit has a cooling mechanism for cooling the items inside. The cooling mechanism can be an air-cooling mechanism or a water-cooling mechanism. If the unit is sealed, heat may build up inside the unit, reducing the cooling efficiency. In addition, large-capacity power conversion units do not include DC fuses in order to reduce costs and size. Without DC fuses, if a short circuit occurred, it could affect other healthy units. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2019 / 207666 [Patent Document 2] Japanese Patent Application Publication No. 2016-111794 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a power conversion unit capable of improving explosion-proof performance. [Means for solving the problem]

[0005] The power conversion unit of the embodiment includes a housing, a first element, a second element, and an explosion-proof plate. The first element is disposed inside the housing. The second element is disposed inside the housing horizontally adjacent to the first element. The explosion-proof plate covers the first element and the second element when viewed from above the housing. The explosion-proof plate is a laminated conductor connected to the first element and the second element. [Brief description of the drawings]

[0006] [Figure 1] FIG. 2 is a perspective view showing the configuration of a power conversion unit according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view showing a configuration of a power control unit in the power conversion unit of the first embodiment. [Diagram 3] FIG. 2 is a cross-sectional view showing the configuration of a power control unit in the power conversion unit of the first embodiment. [Figure 4] FIG. 3 is a cross-sectional view showing a flow of cooling air in the power conversion unit of the first embodiment. [Diagram 5] FIG. 13 is a perspective view showing a configuration of a power control unit in a power conversion unit according to a second embodiment. [Figure 6] FIG. 11 is a cross-sectional view showing the configuration of a power control unit in a power conversion unit according to a second embodiment. [Figure 7] FIG. 13 is a perspective view showing the configuration of a power control unit in a power conversion unit according to a third embodiment. [Figure 8] FIG. 13 is a cross-sectional view showing the configuration of a power control unit in a power conversion unit according to a fourth embodiment. [Figure 9] FIG. 13 is a top view showing the configuration of a unit in a power conversion unit according to a fourth embodiment. [Figure 10] FIG. 13 is a cross-sectional view showing the configuration of a power control unit in a power conversion unit according to a fifth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Hereinafter, a power conversion unit according to a first embodiment will be described with reference to the drawings.

[0008] (First embodiment) 1 is a perspective view showing a power conversion unit according to the present embodiment, in which reference numeral 10 denotes the power conversion unit.

[0009] Hereinafter, the X-axis, Y-axis, and Z-axis directions, which are mutually orthogonal in a three-dimensional space, are parallel to each other. For example, as shown in Fig. 1, the X-axis direction is parallel to the left-right direction of the power conversion unit 10. The Y-axis direction is parallel to the front-rear direction of the power conversion unit 10. The Z-axis direction is parallel to the up-down direction of the power conversion unit 10.

[0010] The power conversion unit 10 according to this embodiment is, for example, a board provided in electrical equipment, etc. The board is a switchboard, distribution board, control board, etc. that constitutes a power supply device, a motor drive device, etc. The power conversion unit 10 includes various circuit components, for example, semiconductor elements, conductors, fuses, capacitors, transformers, switches, circuit breakers, and measuring instruments.

[0011] 1, the power conversion unit 10 includes an operation unit 10a and a power control unit 10b. The operation unit 10a receives, for example, an input operation by an operator related to the operation of the power control unit 10b. The operation unit 10a outputs a signal instructing the operation of the power control unit 10b in response to the input operation by the operator. The operation unit 10a includes, for example, an input device such as an operation button and a display such as a liquid crystal display.

[0012] The power control unit 10b includes, for example, a housing 11, a plurality of fans (fluid machines) 13, and a plurality of power control units (units) 15. An upper portion 11a of the housing 11 in the Z-axis direction supports a plurality of fans 13. An exhaust port 11A (see FIG. 3) formed in the upper portion 11a faces and communicates with each fan 13, for example, along the Z-axis direction. A plurality of intake ports 11B formed in a front portion 11b of the housing 11 in the Y-axis direction faces, for example, an appropriate power control unit 15 along the Y-axis direction. Each intake port 11B is, for example, a rectangular opening. The housing 11 supports a number of power control units 15 disposed therein.

[0013] The multiple fans 13 are, for example, two fans 13. Each fan 13 draws air from outside the housing 11 into the housing 11 through a respective air intake 11B in the front part 11b of the housing 11. Each fan 13 exhausts air inside the housing 11 to the outside through an exhaust 11A in an upper part 11a of the housing 11. Each fan 13 cools the multiple power control units 15 with cooling air F formed by air flowing inside the housing 11.

[0014] The plurality of power control units 15 are, for example, 12 power control units 15. The plurality of power control units 15 are arranged inside the housing 11, for example, in six rows in the Z-axis direction and two rows in the X-axis direction. Of the plurality of power control units 15, each of the power control units 15 other than the power control units 15 in the top two rows is arranged so as to face each intake port 11B of the housing 11 along, for example, the Y-axis direction.

[0015] Fig. 2 is a perspective view showing the configuration of power control unit 15 in power conversion unit 10 of the present embodiment. Fig. 3 is a cross-sectional view showing the configuration of power control unit 15 of the present embodiment and the flow of heat and cooling air F. Each power control unit 15 includes, for example, an element unit 21, a driving unit 23, and a capacitor unit 25. As shown in FIGS. 2 and 3, the element unit 21 and the drive unit 23 are arranged so as to be stacked along the Z-axis direction, for example.

[0016] The element unit 21 includes a first unit housing 31, a plurality of semiconductor elements (first elements) 33, and a heat sink (heat dissipation member) 35. The first unit housing 31 supports the plurality of semiconductor elements 33 and the heat sink 35 therein. A front opening 31A and a rear opening 31B are formed in a front part 31a and a rear part 31b in the Y-axis direction of the first unit housing 31, which face and communicate with the heat sink 35 along the Y-axis direction, for example.

[0017] The semiconductor elements 33 are, for example, a plurality of switching elements and rectifying elements that are bridge-connected to form a bridge circuit. The switching elements are transistors such as IGBTs (Insulated Gate Bipolar Transistors) or MOSFETs (Metal Oxide Semiconductor Field Effect Transistors). The rectifying elements are diodes connected in parallel to each transistor.

[0018] The multiple semiconductor elements 33 are arranged on an element placement surface 35A of the heat sink 35. The element placement surface 35A of the heat sink 35 is, for example, the upper end surface of the upper portion 35a in the Z-axis direction of the heat sink 35. The multiple semiconductor elements 33 are arranged, for example, in a row on the element placement surface 35A along the X-axis direction.

[0019] The outer shape of the heat sink 35 is, for example, a rectangular parallelepiped. The length of the heat sink 35 along the Y-axis direction is formed to be, for example, a predetermined length longer than the length in the Y-axis direction of each semiconductor element 33 arranged on the element mounting surface 35A. The predetermined length is, for example, approximately the length required to fix each semiconductor element 33 to the element mounting surface 35A.

[0020] The heat sink 35 includes a plurality of fin members 35b. The outer shape of each fin member 35b is, for example, a plate shape parallel to the YZ plane. The plurality of fin members 35b extend downward in the Z-axis direction from the upper portion 35a and contact a partition member 37a of the drive unit 23, which will be described later. The plurality of fin members 35b are arranged side by side at predetermined intervals along the X-axis direction. The multiple fin members 35b of the heat sink 35 form flow paths 35c for air to flow inside the housing 11. The flow direction of air in the heat sink 35 is set parallel to the YZ plane by the multiple fin members 35b.

[0021] The drive unit 23 includes a second unit housing 37 and a substrate 39. The second unit housing 37 supports the substrate 39 disposed therein. The second unit housing 37 includes a partition member 37a. The partition member 37a separates the interior of the second unit housing 37, in which the substrate 39 is disposed, from an air flow path 35c formed by the heat sink 35.

[0022] The partition member 37a has an outer shape, for example, a plate shape parallel to the XY plane. The partition member 37a prevents the air (cooling air) F flowing through the flow path 35c in the heat sink 35 from flowing into the inside of the second unit housing 37. The substrate 39 includes, for example, a drive substrate that drives and controls the switching elements of the plurality of semiconductor elements 33 .

[0023] The capacitor unit 25 is disposed adjacent to the element unit 21 and the drive unit 23 along the Y-axis direction while being separated from the element unit 21 and the drive unit 23, for example. 2 and 3, capacitor unit 25 includes a third unit housing (support member) 41 and a plurality of capacitors (capacitors: second elements) 43. Third unit housing 41 supports the plurality of capacitors 43 arranged therein.

[0024] The third unit housing 41 includes, for example, a left side portion 41a and a right side portion 41b in the X-axis direction, an upper portion 41c and a lower portion 41d in the Z-axis direction, and a support member 41e between the upper portion 41c and the lower portion 41d. The outer shape of each of the left side portion 41a and the right side portion 41b is, for example, a plate shape parallel to the YZ plane. Each of the left side portion 41a and the right side portion 41b may be formed with a plurality of side openings through which air (cooling air) F passes. Each side opening is, for example, a circular opening penetrating the left side portion 41a and the right side portion 41b.

[0025] The outer shape of each of the upper portion 41c, the lower portion 41d, and the support member 41e is, for example, a plate-like shape parallel to the XY plane. The upper portion 41c is formed with a plurality of insertion holes 45b into which the plurality of capacitors 43 are inserted. Each upper opening 45c is, for example, a circular opening penetrating the upper portion 41c. The upper portion 41c is formed with a plurality of upper openings 45c through which air (cooling air) F passes.

[0026] The lower portion 41d may be formed with a plurality of lower openings for passing air (cooling air) F. Each lower opening is, for example, a penetrating opening having a rounded rectangular shape. A plurality of support portion openings (through holes) 45e are formed in the support member 41e on which the plurality of capacitors 43 are arranged, for passing air (cooling air) F. Each support portion opening 45e is, for example, a circular through opening.

[0027] Between the upper portion 41c and the support member 41e, which are arranged with a predetermined distance in the Z-axis direction, a pair of opposing openings 45f is formed for allowing air (cooling air) F to pass along the Y-axis direction. Each opening 45f is, for example, a rectangular opening.

[0028] Between the lower portion 41d and the support member 41e arranged at a predetermined distance along the Z-axis direction, an opening 45g is formed in the front portion 41f in the Y-axis direction, through which air (cooling air) F passes. The opening 45g is, for example, a trapezoidal opening. Between the lower portion 41d and the support member 41e, a rear portion 41g in the Y-axis direction is formed with a plurality of openings 45h for passing through air (cooling air) F. The plurality of openings 45h are, for example, circular through-holes.

[0029] Each capacitor 43 includes, for example, a capacitor that smoothes out voltage fluctuations that occur with the on / off switching operation of a switching element among the multiple semiconductor elements 33 . The first unit housing 31, the second unit housing 37 and the third unit housing 41 may also be configured as one unit.

[0030] The upper surface of the power control unit 15 is covered by an explosion-proof plate 50. The upper surface of the power control unit 15 is closed by the explosion-proof plate 50. The explosion-proof plate 50 is a conductor. The explosion-proof plate 50 may be a copper plate. The explosion-proof plate 50 covers at least the plurality of semiconductor elements 33 and the plurality of capacitors 43. The explosion-proof plate 50 covers the semiconductor elements 33 and the capacitors 43 to such an extent that they are not visible when viewed from above.

[0031] The explosion-proof plate 50 covers the element unit 21 and the capacitor unit 25. The explosion-proof plate 50 continuously covers the element unit 21 and the capacitor unit 25. The explosion-proof plate 50 blocks the upper surface of the power control unit 15. Blocking means that even if an unpredictable arc flash or the like occurs in the power control unit 15, the high-temperature gas and pressure wave associated with this will not be released to the other power control units 15. Even if an unpredictable arc flash or the like occurs in the power control unit 15, the explosion-proof plate 50 will not allow the high-temperature gas and pressure wave associated with this to be released to the other power control units 15. The explosion-proof plate 50 has a rectangular outline that matches the outline of the power control unit 15 when viewed from above. The explosion-proof plate 50 has a rectangular outline that is slightly smaller than the outline of the power control unit 15 when viewed from above.

[0032] The explosion-proof plate 50 has a predetermined thickness dimension necessary for blocking. Also, as a part of the circuit that converts a large amount of power in the power control unit 15, the explosion-proof plate 50 has a predetermined thickness dimension necessary. The explosion-proof plate 50 has a configuration that allows it to be closed off from the first unit housing 31 and the third unit housing 41 at both ends in the Y direction. The explosion-proof plate 50 has a configuration that allows it to be closed off from the first unit housing 31 and the third unit housing 41 at both ends in the X direction.

[0033] The explosion-proof plate 50 has an end in the X direction spaced apart from the left side portion 41a and the right side portion 41b. The distance between the explosion-proof plate 50 and the left side portion 41a is a distance that allows insulation. This insulation distance is set based on the rated voltage of the power control unit 15, etc. The distance between the explosion-proof plate 50 and the right side portion 41b is a distance that allows insulation. This insulation distance is set based on the rated voltage of the power control unit 15, etc.

[0034] The explosion-proof plate 50 may be connected to the left side portion 41a and the right side portion 41b in the X direction. In this case, the explosion-proof plate 50 and the left side portion 41a are connected by an insulator. The explosion-proof plate 50 and the right side portion 41b are connected by an insulator. The explosion-proof plate 50 is supported by the first unit housing 31 and the third unit housing 41. In the capacitor unit 25, a flow passage 25c is formed between the explosion-proof plate 50 and the third unit housing 41. The explosion-proof plate 50 is spaced apart from the semiconductor element 33 and the capacitor 43 in the Z direction.

[0035] The explosion-proof plate 50 is connected to the plurality of semiconductor elements 33 and the plurality of capacitors 43. The explosion-proof plate 50 also serves as a PN conductor that configures a circuit together with the plurality of semiconductor elements 33 and the plurality of capacitors 43. The explosion-proof plate 50 is formed by laminating a plurality of conductor plates. The explosion-proof plate 50 is formed by laminating, for example, a conductor plate (laminated conductor) 51 and a conductor plate (laminated conductor) 52. The conductor plates 51 and 52 may be copper plates. The conductor plates 51 and 52 may be copper plates having a thickness of 1 mm or more. The conductor plates 51 and 52 may be copper plates having a thickness of about 2 mm, 2 mm±0.5 mm. Both the conductor plates 51 and 52 extend along the XY plane.

[0036] The conductor plate 51 and the conductor plate 52 may have substantially the same contour shape when viewed from above. The conductor plate 51 and the conductor plate 52 may have different contour shapes when viewed from above. The conductor plate 51 is disposed, for example, above the conductor plate 52 in the Z direction. The conductive plate 51 and the conductive plate 52 are spaced apart in the Z direction. There is a distance in the Z direction between the conductive plate 51 and the conductive plate 52. A spacer can be disposed in the gap in the Z direction between the conductive plate 51 and the conductive plate 52. The spacer is an insulator. The conductive plate 51 and the conductive plate 52 are connected to different terminals of the plurality of semiconductor elements 33 and the plurality of capacitors 43, respectively.

[0037] The conductive plate 51 is connected to the semiconductor element 33 via a connection portion (spacer) 51a. The connection portion 51a also serves as a spacer between the conductive plate 51 and the semiconductor element 33. The conductive plate 51 and the connection portion 51a are fixed by bolting. The connection portion 51a is disposed on the upper surface of the semiconductor element 33. The connection portion 51a may be integrated with a terminal of the semiconductor element 33. The connection portion 51a is made of a conductive conductor. The connection portion 51a is not connected to the conductive plate 52. The connection portion 51a passes through a through hole (opening) 52e formed in the conductive plate 52. Air (cooling air) F can pass through the through hole 52e. The through hole 52e is covered by the conductive plate 51 when viewed from above. The conductive plate 51 is located above the through hole 52e in the Z direction.

[0038] The conductive plate 51 is connected to the capacitor 43 via a connection portion (spacer) 51b. The connection portion 51b also serves as a spacer between the conductive plate 51 and the capacitor 43. The conductive plate 51 and the connection portion 51b are fixed by bolting. The connection portion 51b is disposed on the upper surface of the capacitor 43. The connection portion 51b may be integral with the terminal of the capacitor 43. The connection portion 51b is made of a conductive conductor. The connection portion 51b is not connected to the conductive plate 52. The connection portion 51b passes through a through hole 52e formed in the conductive plate 52. Air (cooling air) F can pass through the through hole 52e. The through hole 52e is covered by the conductive plate 51 when viewed from above. The conductive plate 51 is located above the through hole 52e in the Z direction.

[0039] The conductive plate 52 is connected to the semiconductor element 33 via a connecting portion (spacer) 52a. The connecting portion 52a also serves as a spacer between the conductive plate 52 and the semiconductor element 33. The conductive plate 52 and the connecting portion 52a are fixed by bolting. The connecting portion 52a is disposed on the upper surface of the semiconductor element 33. The connecting portion 52a may be integrated with a terminal of the semiconductor element 33. The connecting portion 52a is made of a conductive conductor.

[0040] The conductive plate 52 is connected to the capacitor 43 via a connection portion (spacer) 52b. The connection portion 52b also serves as a spacer between the conductive plate 52 and the capacitor 43. The conductive plate 52 and the connection portion 52b are fixed by bolting. The connection portion 52b is disposed on the upper surface of the capacitor 43. The connection portion 52b may be integral with a terminal of the capacitor 43. The connection portion 52b is made of a conductive conductor.

[0041] The conductive plate 52 is spaced apart from the semiconductor element 33 and the capacitor 43 in the Z direction. In addition to the connection parts 52a and 52b, a spacer may be disposed between the conductive plate 52 and the semiconductor element 33. In this case, the spacer is an insulating material with high thermal conductivity.

[0042] FIG. 4 is a cross-sectional view showing the flow of cooling air F in the power conversion unit 10 of the present embodiment. As shown in Figures 3 and 4, the power conversion unit 10 is cooled by driving a plurality of fans 13. The fans 13 draw air from outside the housing 11 into the housing 11 through the plurality of air intakes 11B. The air that has passed through the inside of the housing 11 is exhausted to the outside of the housing 11 through each of the exhaust ports 11A and each of the fans 13. The air passing through the inside of the housing 11 acts as cooling air F in a flow path from each of the air intakes 11B to each of the exhaust ports 11A, thereby cooling the plurality of power control units 15.

[0043] First, the cooling air F is sucked into the housing 11 from each intake port 11B. The cooling air F flows along the Y-axis direction toward the element unit 21 and the drive unit 23 of each power control unit 15. The cooling air F reaches each power control unit 15.

[0044] Here, in the element unit 21, the lower surface of the semiconductor element 33 contacts the heat sink 35. As shown in Fig. 3, heat is conducted from the semiconductor element 33 to the heat sink 35. The semiconductor element 33 is cooled. The upper surface of the semiconductor element 33 is connected to the explosion-proof plate 50 via the connection parts 51a and 52a. Heat is conducted from the semiconductor element 33 to the explosion-proof plate 50 via the connection parts 51a and 52a. The semiconductor element 33 is cooled.

[0045] At the same time, the upper surface of the semiconductor element 33 faces the lower surface of the explosion-proof plate 50. The upper surface of the semiconductor element 33 faces the lower surface of the conductive plate 52. Heat is radiated from the semiconductor element 33 to the explosion-proof plate 50. The semiconductor element 33 is cooled. In element unit 21, heat transferred from semiconductor element 33 to explosion-proof plate 50 moves toward capacitor unit 25 on which cooling air F is blowing, as will be described later.

[0046] In the power control unit 15, the cooling air F flows from the front opening 31A of the first unit housing 31 of the element unit 21 toward the heat sink 35, as shown in FIGS. The cooling air F passes through a flow path 35c formed by the heat sink 35. The cooling air F flows between the multiple fin members 35b arranged side by side at intervals. The cooling air F cools the fin members 35b. The cooling air F cools the heat sink 35. The multiple semiconductor elements 33 are cooled by heat dissipation from the heat sink 35.

[0047] The cooling air F passes through the heat sink 35 and the rear opening 31B of the first unit housing 31. The cooling air F flows inside the third unit housing 41 of the capacitor unit 25. The cooling air F flows inside the third unit housing 41, between the upper portion 41c and the support member 41e. The cooling air F flows between the multiple capacitors 43. The cooling air F cools each of the capacitors 43. The cooling air F passes through the inside of the third unit housing 41. The cooling air F flows toward each exhaust port 11A and each fan 13. The cooling air F is exhausted to the outside of the housing 11.

[0048] Here, in capacitor unit 25, capacitor 43 is cooled by cooling air F as shown in FIG. Capacitor 43 is connected on its upper surface to explosion-proof plate 50 via connection parts 51b and 52b. Heat is conducted from capacitor 43 to explosion-proof plate 50 via connection parts 51b and 52b. Capacitor 43 is cooled. At the same time, the upper surface of capacitor 43 faces the lower surface of explosion-proof plate 50. The upper surface of capacitor 43 faces the lower surface of conductive plate 52. Heat is radiated from capacitor 43 to explosion-proof plate 50. Semiconductor element 33 is cooled.

[0049] In capacitor unit 25, cooling air F flows along the lower surface of explosion-proof plate 50. Explosion-proof plate 50 is cooled by cooling air F. As explosion-proof plate 50 is cooled, capacitor 43 is cooled. In capacitor unit 25, cooling air F passes through through hole 52e of conductive plate 52. This causes cooling air F to pass between conductive plates 51 and 52. Conductive plates 51 and 52 are cooled by cooling air F.

[0050] Furthermore, in element unit 21, cooling air F does not directly hit explosion-proof plate 50. However, explosion-proof plate 50 is cooled by cooling air F at capacitor unit 25. Explosion-proof plate 50 conducts heat from element unit 21 to capacitor unit 25. Explosion-proof plate 50 conducts heat from element unit 21 to capacitor unit 25, which is cooled by cooling air F. Explosion-proof plate 50 can cool element unit 21. Cooling explosion-proof plate 50 cools semiconductor element 33 and capacitor 43.

[0051] In capacitor unit 25, cooling air F passes through a pair of openings 45f, opening 45g, and multiple openings 45h in the Y-axis direction. In addition, cooling air F passes through multiple side openings and multiple upper openings 45c in each of the X-axis and Z-axis directions. Cooling air F passes through multiple lower openings 45d and multiple support portion openings 45e. Furthermore, cooling air F passes through through hole 52e of conductive plate 52. Multiple capacitor units 25 arranged side by side in the Z-axis direction function as a so-called wind tunnel for cooling air F passing through the inside along the X-axis, Y-axis, and Z-axis directions.

[0052] In the power conversion unit 10 of the present embodiment, by disposing an explosion-proof plate 50 that covers the entire upper surface of the power control unit 15, it is possible to provide a power conversion unit 10 that has an explosion-proof structure and is excellent in cooling.

[0053] In the power conversion unit 10 of this embodiment, the upper surface of the power control unit 15 is entirely covered by the explosion-proof plate 50, which prevents broken items from scattering and prevents damage from spreading. Moreover, the explosion-proof plate 50 is a laminated conductor that also serves as a PN conductor, and is made of a material (copper) with excellent electrical and thermal conductivity, which prevents heat from building up inside the power control unit 15 while maintaining low inductance. Furthermore, the power conversion unit 10 allows the number of parts of the power control unit 15 to be reduced.

[0054] Furthermore, since the power conversion unit 10 is configured such that the entire upper surface of the power control unit 15 is covered by the explosion-proof plate 50, the heat dissipation area is larger than in a configuration without the explosion-proof plate 50, and the cooling efficiency of the semiconductor element 33 and the capacitor 43 can be improved.

[0055] In the power conversion unit 10, the semiconductor element 33 is mainly cooled by the heat sink 35. In addition, the heat generated by the semiconductor element 33 is transferred to the explosion-proof plate 50, which is a conductor, and the temperature of the explosion-proof plate 50 is increased by the heat, thereby further cooling the semiconductor element 33 and improving the cooling efficiency.

[0056] In the power conversion unit 10, a plurality of semiconductor elements 33 are arranged in a row along a direction perpendicular to the flow direction of the cooling air F. Moreover, all of the semiconductor elements 33 are connected to the explosion-proof plate 50. The upper surfaces of all of the semiconductor elements 33 face the explosion-proof plate 50. This improves the cooling efficiency by the explosion-proof plate 50 in addition to the heat sink 35. For example, compared to a case in which a plurality of semiconductor elements 33 are arranged in a plurality of rows along the flow direction of the cooling air F, each semiconductor element 33 can be actively cooled, and since cooling by the explosion-proof plate 50 can be performed, the length of the heat sink 35 in the flow direction of the cooling air F can be reduced.

[0057] In the power conversion unit 10, the cooling air F hits the explosion-proof plate 50 on the capacitor unit 25 side, which is the downwind side of the cooling air F, so that heat can be conducted and pulled from the upwind side to the downwind side by the thermal conduction of the explosion-proof plate 50, which is a conductor, and dissipated from the explosion-proof plate 50 in the capacitor unit 25. Since the cooling air F hits the explosion-proof plate 50 in the capacitor unit 25, the explosion-proof plate 50 can also contribute to cooling the semiconductor element 33. The power conversion unit 10 can prevent the semiconductor element 33 on the upstream side from thermally acting on the capacitor 43 on the downstream side.

[0058] The power conversion unit 10 can prevent the flow path of the cooling air F from becoming longer by improving the cooling efficiency with the explosion-proof plate 50. By preventing the flow path of the cooling air F in the power control unit 15 from becoming longer, an increase in the temperature gradient of the power control unit 15 can be prevented. The explosion-proof plate 50 improves the cooling efficiency of the semiconductor element 33, thereby making it possible to prevent the flow path in the heat sink 35 from becoming longer. By preventing the flow path in the heat sink 35 from becoming longer, it is possible to prevent an increase in the temperature gradient of the heat sink 35.

[0059] By preventing the flow path of the cooling air F from becoming longer, it is possible to prevent an increase in pressure loss of the cooling air F. By reducing the pressure loss of the cooling air F, it is possible to increase the wind speed of the cooling air F and improve the cooling efficiency of the multiple semiconductor elements 33 and the multiple capacitors 43. By reducing the length of the heat sink 35 in the flow direction of the cooling air F and reducing the pressure loss of the cooling air F, it is possible to improve the cooling efficiency of other electrical equipment arranged downstream of the cooling air F.

[0060] The power conversion unit 10 includes a heat sink 35 disposed upstream in the flow direction of the cooling air F. This allows the multiple semiconductor elements 33 disposed on the heat sink 35 to be actively cooled. Moreover, the semiconductor elements 33 can be cooled by the explosion-proof plate 50 in addition to the heat sink 35. For example, the multiple semiconductor elements 33 can be cooled more efficiently than when the semiconductor elements 33 that generate a relatively large amount of heat are disposed downstream in the flow direction of the cooling air F relative to other circuit elements.

[0061] The power conversion unit 10 includes a third unit housing 41 having a plurality of upper openings formed therein, and an explosion-proof plate 50. This can encourage the cooling air F to pass through the inside of the third unit housing 41 along the explosion-proof plate 50. By making the insides of the plurality of third unit housings 41 and the explosion-proof plate 50 function as a wind tunnel, an increase in pressure loss inside the housing 11 can be suppressed.

[0062] The power conversion unit 10 can prevent the need to provide a separate ventilation path for the cooling air F inside the housing 11. The power conversion unit 10 can prevent the housing 11 from becoming large. By reducing the pressure loss inside the housing 11, the cooling capacity by the cooling air F inside the housing 11 can be improved and the internal capacity of the housing 11 can be increased. By having the cooling air F flow along the explosion-proof plate 50, the cooling capacity can be improved and the internal capacity of the housing 11 can be increased. By increasing the cooling capacity of the cooling air F, the increase in the power consumption of each fan 13 can be suppressed and each fan 13 can be made smaller.

[0063] The power conversion unit 10 includes a partition member 37a that separates the inside of the second unit housing 37 from the air flow path 35c formed by the heat sink 35. This makes it possible to prevent the exhaust heat of the heat sink 35 from thermally acting on the substrate 39 inside the second unit housing 37. At the same time, the explosion-proof plate 50 that conducts heat from the element unit 21 to the capacitor unit 25 can increase the cooling efficiency of the element unit 21. The explosion-proof plate 50 improves the cooling efficiency of the element unit 21, and by separating the element unit 21 and the drive unit 23 from the capacitor unit 25, the ease of maintenance can be improved.

[0064] In the above-described embodiment, the element unit 21, the driving unit 23, and the capacitor unit 25 may be separated from one another, or may be integrally formed in an appropriate combination.

[0065] Hereinafter, a power conversion unit according to a second embodiment will be described with reference to the drawings.

[0066] Second embodiment Fig. 5 is a perspective view showing the configuration of the power control unit 15 in the power conversion unit 10 of this embodiment. Fig. 6 is a cross-sectional view showing the configuration of the power control unit 15 of this embodiment.

[0067] This embodiment differs from the above-described first embodiment in terms of the insulating reinforcing portion 55. The insulating reinforcement portion 55 is provided to increase the strength of the explosion-proof plate 50. Specifically, the insulating reinforcement portion 55 prevents the explosion-proof plate 50 from being turned over and deformed at the four corners of the explosion-proof plate 50 due to an upward blast from below, etc. The insulating reinforcement portion 55 is attached to the upper surface of the explosion-proof plate 50. The insulating reinforcement portion 55 contacts the upper surface of the explosion-proof plate 50. The insulating reinforcement portion 55 is attached to at least the four corners of the explosion-proof plate 50.

[0068] The insulating reinforcement part 55 is made of an insulating material. The insulating reinforcement part 55 is made of a material capable of imparting strength to maintain the strength so that the four corners do not turn up when the force of the explosion-proof plate 50 acts from below. The insulating reinforcement part 55 is made of, for example, Dallas epoxy resin. The insulating reinforcement part 55 has a thickness and shape capable of maintaining the strength so that the four corners do not turn up when the force of the explosion-proof plate 50 acts from below.

[0069] As shown in Figs. 5 and 6, the insulating reinforcement portion 55 has a rod insulating reinforcement portion 55a and a rod insulating reinforcement portion 55b.

[0070] The rod insulating reinforcement portion 55a connects two of the four corners of the explosion-proof plate 50 that are located on the same side in the Y direction. The rod insulating reinforcement portion 55a is arranged along a side extending in the X direction of the rectangular outline of the explosion-proof plate 50 when viewed from above. The rod insulating reinforcement portion 55a is arranged along an end of the explosion-proof plate 50 in the Y direction. The rod insulating reinforcement portion 55a is arranged at an end of the element unit 21 of the rectangular outline of the explosion-proof plate 50 when viewed from above.

[0071] The rod insulating reinforcement part 55a is fixed to the upper surface of the explosion-proof plate 50. The rod insulating reinforcement part 55a may be screwed to the explosion-proof plate 50. At both ends in the X direction, the ends of the rod insulating reinforcement part 55a in the X direction are closer to the left side part 41a and the right side part 41b than the explosion-proof plate 50. The ends of the rod insulating reinforcement part 55a in the X direction are connected to the left side part 41a and the right side part 41b. The ends of the rod insulating reinforcement part 55a in the X direction are fixed to the left side part 41a and the right side part 41b. The ends of the rod insulating reinforcement part 55a in the X direction may be screwed to the left side part 41a and the right side part 41b.

[0072] The rod insulating reinforcement portion 55b connects two of the four corners of the explosion-proof plate 50 that are located on the same side in the Y direction. The rod insulating reinforcement portion 55b is arranged along a side extending in the X direction of the rectangular outline of the explosion-proof plate 50 when viewed from above. The rod insulating reinforcement portion 55b is arranged along the end of the explosion-proof plate 50 in the Y direction. The rod insulating reinforcement portion 55b is arranged at the end of the rectangular outline of the explosion-proof plate 50 at the capacitor unit 25.

[0073] The rod insulating reinforcing portion 55b is fixed to the upper surface of the explosion-proof plate 50. The rod insulating reinforcing portion 55b may be screwed to the explosion-proof plate 50. At both ends in the X direction, the ends of the rod insulating reinforcement part 55b in the X direction are closer to the left side part 41a and the right side part 41b than the explosion-proof plate 50. The ends of the rod insulating reinforcement part 55b in the X direction are connected to the left side part 41a and the right side part 41b. The ends of the rod insulating reinforcement part 55b in the X direction are fixed to the left side part 41a and the right side part 41b. The ends of the rod insulating reinforcement part 55b in the X direction may be screwed to the left side part 41a and the right side part 41b.

[0074] In the insulating reinforcement portion 55, the rod insulating reinforcement portion 55a and the rod insulating reinforcement portion 55b face each other in the Y direction. The rod insulating reinforcement portion 55a and the rod insulating reinforcement portion 55b are arranged parallel to each other. The rod insulating reinforcement portion 55a and the rod insulating reinforcement portion 55b have approximately the same thickness. The insulating reinforcing portion 55 is fixed to the first unit housing 31 and the third unit housing 41. In this way, the explosion-proof plate 50 is fixed to the first unit housing 31 and the third unit housing 41.

[0075] The power conversion unit 10 in this embodiment is configured with an insulating reinforcement portion 55 provided on the explosion-proof plate 50 covering the entire upper surface of the power control unit 15, which prevents scattering of damaged items and further prevents damage from spreading. Since the insulating reinforcement portion 55 is made of a material with excellent insulation properties for the explosion-proof plate 50 made of a laminated conductor, there is no need to consider electrical effects on the power control unit 15. Since the insulating reinforcement portion 55 is made of a material with excellent insulation properties, it can be closely attached to the explosion-proof plate 50 made of a laminated conductor. The insulating reinforcement portion 55 can suppress deformation of the explosion-proof plate 50 due to damage.

[0076] The insulating reinforcing portion 55 is made of a material having excellent insulating properties, so that it does not affect the performance of preventing heat buildup within the power control unit 15. The insulating reinforcing portion 55 is made of a material having excellent strength, so that the explosion-proof property can be further improved. Furthermore, by fixing the insulating reinforcing portion 55 to the first unit housing 31 and the third unit housing 41, the first unit housing 31 and the third unit housing 41 can be reinforced, and the strength of the power control unit 15 can be improved.

[0077] In this embodiment, it is possible to achieve the same effects as the above-described embodiment.

[0078] In this embodiment, the rod insulating reinforcement portion 55a and the rod insulating reinforcement portion 55b are configured to extend over the entire length in the X direction in the contour shape of the explosion-proof plate 50, but are not limited to this configuration. For example, the rod insulating reinforcement portion 55a and the rod insulating reinforcement portion 55b may each extend over about 1 / 4 to 1 / 3 of the entire length in the X direction, including the corners, in the contour shape of the explosion-proof plate 50.

[0079] Hereinafter, a power conversion unit according to a third embodiment will be described with reference to the drawings.

[0080] (Third embodiment) FIG. 7 is a perspective view showing the configuration of the power control unit 15 in the power conversion unit 10 of the present embodiment. This embodiment differs from the above-described second embodiment in terms of the insulating reinforcing portion 55.

[0081] As shown in FIG. 7, the insulating reinforcement portion 55 has a rod-shaped insulating reinforcement portion 55c and a rod-shaped insulating reinforcement portion 55d.

[0082] The rod insulating reinforcement portion 55c connects two of the four corners of the explosion-proof plate 50 that are located on the same side in the X direction. The rod insulating reinforcement portion 55c is arranged along a side extending in the Y direction of the rectangular outline of the explosion-proof plate 50 when viewed from above. The rod insulating reinforcement portion 55c is arranged along an end of the explosion-proof plate 50 in the X direction. The rod insulating reinforcement portion 55c is arranged at an end of the rectangular outline of the explosion-proof plate 50 when viewed from above that extends from the element unit 21 to the capacitor unit 25.

[0083] The rod insulating reinforcement part 55c is fixed to the upper surface of the explosion-proof plate 50. The rod insulating reinforcement part 55c may be screwed to the explosion-proof plate 50. The rod insulating reinforcement part 55c is closer to the left side part 41a than the explosion-proof plate 50 at its end in the X direction. The rod insulating reinforcement part 55c protrudes beyond the outline of the explosion-proof plate 50 at its end in the X direction. The rod insulating reinforcement part 55c has its end in the X direction connected to the left side part 41a. The rod insulating reinforcement part 55c has its end in the X direction fixed to the left side part 41a. The rod insulating reinforcement part 55c may have its end in the X direction screwed to the left side part 41a. The rod insulating reinforcing portion 55c is fixed to the first unit housing 31 and the third unit housing 41 over its entire length in the Y direction.

[0084] The rod insulating reinforcement portion 55d connects two of the four corners of the explosion-proof plate 50 that are located on the same side in the X direction. The rod insulating reinforcement portion 55d is arranged along a side extending in the Y direction of the rectangular outline of the explosion-proof plate 50 when viewed from above. The rod insulating reinforcement portion 55d is arranged along an end of the explosion-proof plate 50 in the X direction. The rod insulating reinforcement portion 55d is arranged at an end of the rectangular outline of the explosion-proof plate 50 that extends from the element unit 21 to the capacitor unit 25.

[0085] The rod insulating reinforcement portion 55d is fixed to the upper surface of the explosion-proof plate 50. The rod insulating reinforcement portion 55d may be screwed to the explosion-proof plate 50. The rod insulating reinforcement part 55b is closer to the right side part 41b than the explosion-proof plate 50 at both ends in the X direction. The rod insulating reinforcement part 55d has an end in the X direction connected to the right side part 41b. The rod insulating reinforcement part 55d has an end in the X direction fixed to the right side part 41b. The rod insulating reinforcement part 55d may have an end in the X direction screwed to the right side part 41b. The rod insulating reinforcing portion 55d is fixed to the first unit housing 31 and the third unit housing 41 over its entire length in the Y direction.

[0086] In the insulating reinforcement portion 55, the rod insulating reinforcement portion 55c and the rod insulating reinforcement portion 55d face each other in the X direction. The rod insulating reinforcement portion 55c and the rod insulating reinforcement portion 55d are arranged parallel to each other. The rod insulating reinforcement portion 55c and the rod insulating reinforcement portion 55d have approximately the same thickness. The insulating reinforcing portion 55 is fixed to the first unit housing 31 and the third unit housing 41. In this way, the explosion-proof plate 50 is fixed to the first unit housing 31 and the third unit housing 41.

[0087] By fixing the insulating reinforcement portion 55 to the first unit housing 31 and the third unit housing 41 over its entire length in the Y direction, the explosion-proof plate 50 can be fixed more firmly to the first unit housing 31 and the third unit housing 41. The insulating reinforcing portion 55 is fixed to the first unit housing 31 and the third unit housing 41 over its entire length in the Y direction, thereby eliminating gaps and further improving the explosion-proof performance.

[0088] This embodiment can also achieve the same effects as the above-described embodiment.

[0089] In this embodiment, the rod insulating reinforcement portion 55c and the rod insulating reinforcement portion 55d are configured to extend over the entire length in the Y direction in the contour shape of the explosion-proof plate 50, but are not limited to this configuration. For example, the rod insulating reinforcement portion 55a and the rod insulating reinforcement portion 55b may each extend over about 1 / 4 to 1 / 3 of the entire length in the Y direction, including the corners, in the contour shape of the explosion-proof plate 50.

[0090] Hereinafter, a power conversion unit according to a fourth embodiment will be described with reference to the drawings.

[0091] (Fourth embodiment) Fig. 8 is a cross-sectional view showing the configuration of the power control unit 15 in the power conversion unit 10 of this embodiment. Fig. 9 is a schematic top view showing the configuration of the power control unit 15. This embodiment differs from the above-described first embodiment in terms of the through-hole (opening) 51e.

[0092] As shown in Figs. 8 and 9, the explosion-proof plate 50 has through holes 51e formed in the upper conductive plate 51. Air (cooling air) F can pass through the through holes (openings) 51e. The through holes 51e overlap the conductive plate 52 when viewed from above. The conductive plate 52 is located below the through holes 51e in the Z direction. The through holes 51e are disposed at positions corresponding to the respective through holes 52e. Specifically, the through holes 51e are disposed at positions downstream of the through holes 52e along the flow direction of the cooling air F.

[0093] For example, the through hole 51e is disposed at a position overlapping the connection portion 52a in a top view. The through hole 51e is disposed at a position overlapping the connection portion 52b in a top view. The position of the through hole 51e is not limited to this position as long as it is downstream of the through hole 52e.

[0094] By arranging through hole 51e at a position downstream of through hole 52e in the flow direction of cooling air F, cooling air F that has passed through through hole 52e further passes through through hole 51e. Cooling air F flows along both surfaces of lower conductive plate 52. Cooling air F flows along the lower surface of upper conductive plate 51.

[0095] This cools the conductive plate 52 and the conductive plate 51. Therefore, the cooling efficiency of the explosion-proof plate 50 by the cooling air F can be improved.

[0096] This embodiment can also achieve the same effects as the above-described embodiment.

[0097] Hereinafter, a power conversion unit according to a fourth embodiment will be described with reference to the drawings.

[0098] Fifth embodiment FIG. 10 is a cross-sectional view showing the configuration of the power control unit 15 in the power conversion unit 10 of the present embodiment. This embodiment differs from the above-described first to fourth embodiments in terms of the insulating heat transfer portion 57.

[0099] The insulating heat transfer portion 57 is disposed between the conductive plates 51 and 52. The insulating heat transfer portion 57 is in close contact with the conductive plates 51 and 52, respectively. The insulating heat transfer portion 57 fills the entire area between the conductive plates 51 and 52. The insulating heat transfer portion 57 may also fill the through hole 52e.

[0100] The insulating heat transfer part 57 is made of a high-strength material. The insulating heat transfer part 57 is made of a material having insulating properties. The insulating heat transfer part 57 is made of a material having high thermal conductivity. The material of the insulating heat transfer part 57 can be appropriately selected. Alternatively, the insulating heat transfer part 57 can be made of the same material as the insulating reinforcing part 55.

[0101] The insulating and heat-transferring part 57 can have the same contour shape as the explosion-proof plate 50 when viewed from above. Alternatively, the insulating heat transfer part 57 may have a contour shape that protrudes in the X direction from the contour shape of the explosion-proof plate 50 in a top view. In this case, the X direction end of the insulating heat transfer part 57 may be fixed to the first unit housing 31 and the third unit housing 41, similar to the insulating reinforcing part 55.

[0102] By fixing the ends of the insulating and heat-transfer part 57 in the X direction to the first unit housing 31 and the third unit housing 41, the explosion-proof plate 50 can be fixed more firmly to the first unit housing 31 and the third unit housing 41.

[0103] Furthermore, the X-direction end of the insulating heat transfer part 57 can be fixed to the first unit housing 31 and the third unit housing 41 over the entire length in the Y direction. By fixing the insulating and heat-transferring part 57 to the first unit housing 31 and the third unit housing 41 over its entire length in the Y direction, the explosion-proof plate 50 can be fixed more firmly to the first unit housing 31 and the third unit housing 41. The insulating and heat-transferring part 57 is fixed to the first unit housing 31 and the third unit housing 41 over its entire length in the Y direction, thereby eliminating gaps and further improving the explosion-proof performance.

[0104] Heat is conducted from the upper conductive plate 51 to the lower conductive plate 52 by the insulating heat transfer part 57. Heat is conducted from the lower conductive plate 52 to the upper conductive plate 51 by the insulating heat transfer part 57. Moreover, heat conduction between the conductive plates 51 and 52 is facilitated over the entire area of ​​the explosion-proof plate 50. Heat dissipation is further promoted by the thermal conduction of the insulating heat transfer part 57. As a result, when the temperature of the conductive plate 51 is high, the heat can be conducted to the conductive plate 52 which is actively cooled by the cooling air F hitting and flowing along the conductive plate 52, thereby improving the cooling efficiency.

[0105] Therefore, the heat transferred from semiconductor element 33 to explosion-proof plate 50 can be transferred to conductive plate 52, which is located in capacitor unit 25 and has high cooling efficiency, and can be cooled efficiently.

[0106] This embodiment can also achieve the same effects as the above-described embodiment.

[0107] In the present embodiment, the insulating heat transfer portion 57 is configured to fill the entire area of ​​the explosion-proof plate 50, but is not limited to this configuration. For example, the insulating heat transfer portion 57 may be configured such that a plurality of members equivalent to the rod insulating reinforcing portion 55a extending in the X direction are arranged between the conductive plate 51 and the conductive plate 52 at intervals in the Y direction. Alternatively, the insulating heat transfer portion 57 may be configured such that a plurality of members equivalent to the rod insulating reinforcing portion 55c extending in the Y direction are arranged between the conductive plates 51 and 52 and spaced apart in the X direction. Furthermore, the contour shape of the explosion-proof plate 50 may be configured so that each of the corners extends to about 1 / 4 to 1 / 3 of the total length in the X direction.

[0108] Furthermore, it is also possible to individually select the individual configurations in each of the above-described embodiments and implement them in combination. For example, the insulating heat transfer section 57 can be configured such that a plurality of members equivalent to the rod insulating reinforcement section 55c extending in the Y direction are arranged between the conductor plates 51 and 52, spaced apart in the X direction, and the insulating heat transfer section 57 has a through hole 51e arranged at a position downstream of the through hole 52e along the flow direction of the cooling air F.

[0109] According to at least one of the embodiments described above, the explosion-proof plate 50 is provided, thereby making it possible to improve explosion-proofing and cooling performance.

[0110] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope of the invention and its equivalents described in the claims, as well as in the scope and spirit of the invention. [Explanation of symbols]

[0111] 10...power conversion unit, 11...housing, 13...fan (fluid machine), 15...power control unit (unit), 21...element unit, 23...drive unit, 25...capacitor unit, 31...first unit housing, 33...semiconductor element (first element), 35...heat sink (heat dissipation member), 35c...flow path (distribution flow path), 37...second unit housing, 39...substrate, 41...third unit housing (support member), 43...capacitor (capacitor, second element), 50...explosion-proof plate, 51, 52...conductor plate (laminated conductor), 51a, 51b, 51a, 52b...connection portion (spacer), 51e...through hole (opening), 52e...through hole (opening), 55...insulating reinforcement portion, 57...insulating heat transfer portion,

Claims

1. A housing and A first element disposed inside the housing; a second element disposed horizontally adjacent to the first element within the housing; an explosion-proof plate covering the first element and the second element when viewed from above the housing; A heat dissipation member connected to the first element; a flow passage formed inside the housing along the explosion-proof plate so that a refrigerant flows in a direction from the heat dissipation member toward the second element; a fluid machine that generates a flow of the refrigerant in the distribution flow path; having the explosion-proof plate is a laminated conductor connected to the first element and the second element, The explosion-proof plate has openings at different positions in a top view for each of the laminated conductors of different layers, The openings of the upper laminated conductor are located downstream in the flow direction of the coolant with respect to the openings of the lower laminated conductor, The coolant flows from the lower opening to the upper opening. Power conversion unit.

2. The corners of the explosion-proof plate have insulating reinforcement parts. The power conversion unit according to claim 1 .

3. The explosion-proof plate is spaced apart from the first element and the second element in the vertical direction, The explosion-proof plate has a spacer connected to the first element and the second element. The power conversion unit according to claim 1 .

4. The insulating reinforcement portion is disposed along the edge of the explosion-proof plate.

3. The power conversion unit according to claim 2.

5. The explosion-proof plate is formed by filling an insulating heat transfer part between the laminated conductors of different layers. The power conversion unit according to claim 1 .

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