Machining path display device and computer-readable storage medium

Abstract

Provided is a machining path display device comprising: a condition acquisition unit that acquires a machining condition for a machining path; a reference condition acquisition unit that acquires a reference condition serving as a reference of the machining condition; a determination unit that determines whether or not the machining condition acquired by the condition acquisition unit satisfies the reference condition acquired by the reference condition acquisition unit; and a display unit that displays at least a part of the machining path in a predetermined manner on the basis of the result of the determination by the determination unit.

Description

Processing path display device and computer-readable storage medium

[0001] The present disclosure relates to a processing path display device and a computer-readable storage medium.

[0002] A conventional technique is known in which, when one path is selected from the tool trajectories displayed on a display device, the machining conditions corresponding to the selected path are read out and displayed (see, for example, Patent Document 1). This allows the operator to check whether each path is being machined under appropriate conditions.

[0003] Japanese Patent Application Laid-Open No. 2000-353003

[0004] However, in the above technology, for example, an operator must sequentially select all paths to check whether machining is being performed under appropriate machining conditions at all positions on the machining path. Such work places a heavy burden on the operator. Therefore, a technology is needed that allows the operator to easily check whether machining is being performed under appropriate machining conditions along each machining path.

[0005] The processing path display device of the present disclosure includes a condition acquisition unit that acquires processing conditions for the processing path, a reference condition acquisition unit that acquires reference conditions that serve as references for the processing conditions, a judgment unit that judges whether the processing conditions acquired by the condition acquisition unit satisfy the reference conditions acquired by the reference condition acquisition unit, and a display unit that displays at least a portion of the processing path in a predetermined manner based on the judgment result by the judgment unit.

[0006] The computer-readable storage medium of the present disclosure stores instructions that cause a computer to acquire processing conditions for a processing path, acquire reference conditions that serve as standards for the processing conditions, determine whether the acquired processing conditions satisfy the acquired reference conditions, and display at least a portion of the processing path in a predetermined manner based on the determination results.

[0007] 1 is a diagram for explaining an example of a machining path of a tool. FIG. 2 is a block diagram showing an example of a hardware configuration of a machining path display device. FIG. 3 is a block diagram showing an example of a function of a machining path display device. FIG. 4 is an example of a display mode of a machining path displayed by a display unit. FIG. 5 is a flowchart showing an example of processing executed by the machining path display device. FIG. 6 is a block diagram showing an example of a function of the machining path display device. FIG. 7 is a flowchart showing an example of processing executed by the machining path display device. FIG. 8 is a block diagram showing an example of a function of the machining path display device. FIG. 9 is a flowchart showing an example of processing executed by the machining path display device. FIG. 10 is a diagram showing an example of a reference condition in laser machining.

[0008] Hereinafter, a processing path display device and a computer-readable storage medium according to an embodiment of the present disclosure will be described with reference to the drawings. In the following description, components having the same or similar functions will be assigned the same reference numerals. Duplicate descriptions of those components may be omitted.

[0009] In this application, "based on XX" means "based on at least XX," and includes cases where it is based on other elements in addition to XX. Furthermore, "based on XX" is not limited to cases where XX is used directly, but also includes cases where it is based on XX that has been calculated or processed. "XX" is any element (for example, any information).

[0010] The machining path display device is a device for displaying a machining path of a tool in a processing machine. The machining path display device is a device for executing a machining simulation based on a machining program before the processing machine processes a workpiece. The machining path display device may execute a machining simulation when the processing machine processes a workpiece.

[0011] The machining path display device is implemented in, for example, a PC (Personal Computer) or a server. The machining path display device may also be implemented in a numerical control device that controls the machining machine.

[0012] Examples of the processing machine include a machine tool, a wire electric discharge machine, a laser processing machine, a plasma cutting machine, a gas cutting machine, and a water jet cutting machine. Examples of the machine tool include a machining center, a lathe, and a multi-tasking machine. Examples of the laser processing machine include a laser cutting machine and a laser welding machine.

[0013] The tool is a component that processes a workpiece. Examples of the tool include a drill, an end mill, and a cutting tool. If the processing machine is a wire electric discharge machine, the tool is a wire. If the processing machine is a laser processing machine, the tool is a laser processing head.

[0014] The machining path is the path along which the tool moves. The machining path may be the surface of the workpiece that is machined by the tool. In other words, the machining path may be a line or a surface that sequentially connects the positions where machining is performed.

[0015] When the tool is an end mill, the machining path is the movement trajectory of the center of the tip of the tool. When the tool is an end mill, the machining path may be a line or a plane that sequentially connects the contact points between the tool and the workpiece.

[0016] When the tool is a laser processing head, the processing path is the surface of the workpiece that is processed by the laser. When laser cutting is performed, the processing path is a line or surface that sequentially connects the positions where cutting is performed.

[0017] FIG. 1 is a diagram for explaining an example of a machining path of a tool. Machining path P1 is the movement trajectory of the center of the tip of the tool. Machining path P2 is a line that sequentially connects the outer periphery of the tool tip with the contact portion of the workpiece W. Machining path P3 is a surface that sequentially connects the contact portion of the outer periphery of the tool with the workpiece W. In other words, machining path P3 is a machining surface.

[0018] 2 is a block diagram showing an example of the hardware configuration of the processing path display device 1. The processing path display device 1 includes, for example, a hardware processor 101, a bus 102, a read-only memory (ROM) 103, a random access memory (RAM) 104, a non-volatile memory 105, and an input / output device 106.

[0019] The hardware processor 101 is a processor that uses a system program to control the entire machining path display device 1. The hardware processor 101 reads the system program stored in the ROM 103 via the bus 102. The hardware processor 101 is, for example, a CPU (Central Processing Unit) or an electronic circuit.

[0020] The bus 102 is a communication path that connects the respective hardware components of the processing path display device 1. The respective hardware components of the processing path display device 1 exchange data via the bus 102.

[0021] The ROM 103 is a storage device that stores system programs, etc. The ROM 103 is a computer-readable storage medium.

[0022] The RAM 104 is a storage device that temporarily stores various data and functions as a work area for the hardware processor 101 to process various data.

[0023] The nonvolatile memory 105 is a storage device that retains data even when the machining path display device 1 is turned off. The nonvolatile memory 105 stores, for example, a machining program. The nonvolatile memory 105 is a computer-readable storage medium. The nonvolatile memory 105 is, for example, a battery-backed memory or a solid state drive (SSD).

[0024] The input / output device 106 receives various data and displays the data on a display. The input / output device 106 displays, for example, a machining path on a display. The input / output device 106 also receives input of various data and sends the data to, for example, the hardware processor 101 and the RAM 104.

[0025] The input / output device 106 includes, for example, a display, a keyboard, and a mouse. The input / output device 106 may be a touch panel. When the input / output device 106 is a touch panel, the input / output device 106 is, for example, a capacitive touch panel. The touch panel is not limited to a capacitive touch panel, and may be a touch panel of another type.

[0026] 3 is a block diagram showing an example of the functions of the machining path display device 1. The machining path display device 1 includes, for example, a condition acquisition unit 111, a reference condition acquisition unit 112, a determination unit 113, and a display unit 114. The condition acquisition unit 111, the reference condition acquisition unit 112, the determination unit 113, and the display unit 114 are realized, for example, by the hardware processor 101 performing arithmetic processing using a system program stored in the ROM 103, a machining program stored in the non-volatile memory 105, and the like.

[0027] The condition acquisition unit 111 acquires machining conditions for a machining path. The machining conditions include one or more elements. The machining conditions include, for example, a feed rate, a rotation rate, and a cutting depth. The condition acquisition unit 111 acquires the feed rate and the rotation rate, for example, from a machining program. In the machining program, the feed rate is specified by an F code. In the machining program, the rotation rate is specified by an S code.

[0028] The condition acquisition unit 111 acquires the cutting amount based on the machining path. The condition acquisition unit 111 acquires the cutting amount based on the difference between the tool position in the first pass and the tool position in the second pass.

[0029] The reference condition acquisition unit 112 acquires reference conditions that serve as references for machining conditions. The reference conditions are conditions that are compared with machining conditions. The reference conditions include elements that correspond to the machining conditions. The reference conditions include, for example, a feed rate, a rotation speed, and a cutting depth. The reference conditions are, for example, machining conditions recommended by a tool manufacturer.

[0030] The determination unit 113 determines whether the processing conditions acquired by the condition acquisition unit 111 satisfy the reference conditions acquired by the reference condition acquisition unit 112. The processing conditions satisfying the reference conditions means that the value indicating the processing conditions is less than the value indicating the reference conditions. In other words, the determination unit 113 determines whether the value indicating the processing conditions is equal to or greater than the value indicating the reference conditions.

[0031] When a value indicating the machining conditions when a certain part on the machining path is machined is equal to or greater than the value indicating the reference conditions, the machining conditions of that part do not satisfy the reference conditions. On the other hand, when a value indicating the machining conditions when a certain part on the machining path is machined is less than the value indicating the reference conditions, the machining conditions of that part satisfy the reference conditions.

[0032] When the machining conditions and the reference conditions each include a feed rate, a rotation rate, and a cutting depth, the judgment unit 113 compares the feed rate, the rotation rate, and the cutting depth of the machining conditions with the feed rate, the rotation rate, and the cutting depth of the reference conditions, respectively.

[0033] The determination unit 113 determines that the processing conditions do not satisfy the standard condition when one element of the processing conditions does not satisfy the standard condition. The determination unit 113 may also determine that the processing conditions do not satisfy the standard condition when all elements of the processing conditions do not satisfy the standard condition.

[0034] The determination unit 113 determines whether the machining conditions for each section included in the machining path satisfy the reference conditions. The length of the section may be set in advance using parameters or the like. The length of the section is, for example, 1 mm. The length of the section may be, for example, the distance traveled by the tool in 10 msec. The length of the section may be the travel distance of the tool specified in one block of the machining program. Note that a block refers to a line in the machining program in which various commands are specified.

[0035] The display unit 114 displays at least a part of the machining path in a predetermined manner based on the determination result by the determination unit 113. The display unit 114 displays, among the parts included in the machining path, parts that satisfy the reference condition using a first line type. Furthermore, the display unit 114 displays, among the parts included in the machining path, parts that do not satisfy the reference condition using a second line type that is different from the first line type.

[0036] 4 shows an example of a display mode of a machining path displayed by the display unit 114. The display unit 114 displays a portion of the machining path that satisfies the standard conditions with a relatively thin solid line. The display unit 114 displays a portion of the machining path that does not satisfy the standard conditions with a relatively thick solid line.

[0037] In the example shown in Fig. 4, at least one of the feed rate, rotation rate, and cutting depth of the machining path indicated by the thick solid line exceeds the reference condition. In other words, the machining conditions of the part indicated by the thick solid line do not satisfy the reference condition.

[0038] The line types include solid lines, dashed lines, dashed lines, broken lines, etc. The line types may also include line color, line thickness, and line brightness. The first line type and the second line type may be distinguished by blinking, lighting, etc.

[0039] 5 is a flowchart showing an example of processing executed by the processing path display device 1. In the processing path display device 1, the condition acquisition unit 111 acquires processing conditions (step SA1). Next, the reference condition acquisition unit 112 acquires reference conditions (step SA2).

[0040] Next, the determination unit 113 determines whether the machining conditions when machining is performed along the machining path satisfy the reference conditions (step SA3). Next, the display unit 114 displays the machining path in a predetermined manner based on the determination result by the determination unit 113 (step SA4), and the process ends.

[0041] The machining path display device 1 may further include a comparison information generating section that generates information for facilitating a comparison between the machining conditions and the reference conditions.

[0042] 6 is a block diagram showing an example of the functions of the processing path display device 1 having the comparison information generating unit. Note that detailed description of the same functions as those of the units described using FIG. 3 will be omitted.

[0043] The processing path display device 1 includes a condition acquisition unit 111, a reference condition acquisition unit 112, a determination unit 113, and a display unit 114, as well as a comparison information generation unit 115. The comparison information generation unit 115 is realized, for example, by the hardware processor 101 performing arithmetic processing using the system program stored in the ROM 103 and various information stored in the non-volatile memory 105.

[0044] The comparison information generating unit 115 generates first information indicating a predetermined type of physical quantity based on the machining conditions, and generates second information indicating a predetermined type of physical quantity based on the reference conditions. The predetermined type of physical quantity is, for example, a cutting load. That is, the first information is information indicating a cutting load generated based on the machining conditions. The second information is information indicating an allowable cutting load generated based on the reference conditions.

[0045] The cutting load is the torque applied to the spindle during cutting. The cutting load may be the torque applied to each servo motor of the processing machine during cutting. The torque Mc [Nm] applied to the spindle can be calculated using the following formula 1.

[0046]

[0047] However, a p is the axial cutting depth [mm]. e is the radial cutting depth [mm]. f n is the feed amount per revolution [mm], k c is the specific cutting resistance [N / mm 2 ]. Feed amount per revolution f n can be calculated from the feed rate [mm / min] and rotation speed [rpm]. c can be obtained from the correspondence table of the type of work material and the feed rate per tooth. The feed rate per tooth is calculated by multiplying the feed rate per revolution f nand the number of teeth of the tool. The correspondence table between the type of work material and the feed rate per one piece is well known, so an explanation of this will be omitted.

[0048] The comparison information generating unit 115 may generate first information indicating a predetermined type of physical quantity, without generating second information, based on the processing conditions acquired by the condition acquiring unit 111. In this case, the reference condition acquiring unit 112 may acquire the second information from a predetermined storage area.

[0049] The determination unit 113 determines whether the machining conditions satisfy the reference conditions based on the first information and the second information generated by the comparison information generation unit 115. If the value indicated by the first information is less than the value indicated by the second information, the determination unit 113 determines that the machining conditions when machining is performed along the machining path satisfy the reference conditions. If the value indicated by the first information is equal to or greater than the value indicated by the second information, the determination unit 113 determines that the machining conditions do not satisfy the reference conditions.

[0050] The display unit 114 displays the machining path in a predetermined format based on the determination result by the determination unit 113 .

[0051] 7 is a flowchart showing an example of processing executed by the processing path display device 1 including the comparison information generating unit 115. In the processing path display device 1, the condition acquiring unit 111 acquires processing conditions (step SB1). Next, the reference condition acquiring unit 112 acquires reference conditions (step SB2).

[0052] Next, the comparison information generating unit 115 generates the comparison information (step SB3). The comparison information includes the first information and the second information.

[0053] Next, the determination unit 113 determines whether the machining conditions when machining is performed along the machining path satisfy the reference conditions (step SB4). Next, the display unit 114 displays the machining path in a predetermined manner based on the determination result by the determination unit 113 (step SB5), and the process ends.

[0054] The machining path display device 1 may acquire machining conditions and reference conditions based on information about the tool and information about the workpiece W.

[0055] Fig. 8 is a block diagram showing an example of the functions of the machining path display device 1 that acquires machining conditions and reference conditions based on information about the tool and information about the workpiece W. Note that detailed description of functions that are the same as the functions of each unit described using Fig. 3 or Fig. 6 will be omitted.

[0056] The machining path display device 1 includes a condition acquisition unit 111, a reference condition acquisition unit 112, a determination unit 113, a display unit 114, and a comparison information generation unit 115, as well as a tool information acquisition unit 116 and a workpiece information acquisition unit 117. The tool information acquisition unit 116 and the workpiece information acquisition unit 117 are realized, for example, by the hardware processor 101 performing arithmetic processing using a system program stored in the ROM 103 and various information stored in the non-volatile memory 105.

[0057] The tool information acquisition unit 116 acquires tool information related to the tool used to machine the workpiece W. The tool information includes information indicating the type and shape of the tool. The tool information includes, for example, information indicating that the tool is a square end mill, a ball end mill, or a cutting tool. The tool information may also include information indicating that the tool is a tool for rough machining or a tool for finish machining. The tool information may also include information indicating the length and diameter of the tool. The tool information acquisition unit 116 acquires the tool information from, for example, a predetermined storage area of ​​the machining path display device 1.

[0058] The work information acquisition unit 117 acquires work information related to the workpiece W. The workpiece information is, for example, information indicating the material of the workpiece W. The workpiece information includes information indicating the type of workpiece W, the shape of the workpiece W, and the material of the workpiece W. The information indicating the material of the workpiece W includes, for example, information indicating the hardness of the workpiece W and the tensile strength of the workpiece W. The workpiece information acquisition unit 117 acquires the workpiece information from, for example, a predetermined storage area of ​​the machining path display device 1.

[0059] The condition acquisition unit 111 acquires machining conditions based on the tool information acquired by the tool information acquisition unit 116 and the workpiece information acquired by the workpiece information acquisition unit 117. In other words, the condition acquisition unit 111 acquires machining conditions according to the tool used for machining in the processing machine and the workpiece W.

[0060] The reference condition acquisition unit 112 acquires the reference conditions based on the tool information acquired by the tool information acquisition unit 116 and the workpiece information acquired by the workpiece information acquisition unit 117. In other words, the reference condition acquisition unit 112 acquires the reference conditions according to the tool used for machining in the machining machine and the workpiece W.

[0061] For example, a storage unit (not shown) stores a table in which tool information, workpiece information, and reference conditions are associated with each other. In this case, the reference condition acquisition unit 112 may acquire the reference conditions by comparing the tool information and workpiece information with the information stored in the table.

[0062] The comparison information generating unit 115 generates first information indicating a predetermined type of physical quantity based on the processing conditions, and generates second information indicating the predetermined type of physical quantity based on the reference conditions.

[0063] 9 is a flowchart showing an example of processing executed by the machining path display device 1 including the tool information acquisition unit 116 and the workpiece information acquisition unit 117. In the machining path display device 1, the condition acquisition unit 111 acquires machining conditions (step SC1). Next, the tool information acquisition unit 116 acquires tool information (step SC2). Next, the workpiece information acquisition unit 117 acquires workpiece information (step SC3).

[0064] Next, the reference condition acquisition unit 112 acquires the reference conditions (step SC4), and the comparison information generation unit 115 generates comparison information (step SC5).

[0065] Next, the determination unit 113 determines whether the machining conditions when machining is performed along the machining path satisfy the reference conditions (step SC6). Next, the display unit 114 displays the machining path in a predetermined manner based on the determination result by the determination unit 113 (step SC7), and the process ends.

[0066] The machining path display device 1 may accept correction of machining conditions that do not satisfy the reference conditions.

[0067] Fig. 10 is a block diagram showing an example of the functions of the processing route display device 1. Note that detailed description of the same functions as those of the respective units described with reference to Fig. 3 will be omitted.

[0068] The processing path display device 1 includes a condition acquisition unit 111, a reference condition acquisition unit 112, a determination unit 113, and a display unit 114, as well as a selection unit 118, a program display unit 119, and an editing unit 120. The selection unit 118, the program display unit 119, and the editing unit 120 are realized, for example, by the hardware processor 101 performing arithmetic processing using the system program stored in the ROM 103 and various information stored in the non-volatile memory 105.

[0069] The selection unit 118 selects at least a part of the machining path. The selection unit 118 selects a part of the machining path based on, for example, an operator's operation on the input / output device 106. That is, the operator executes an operation to select a part of the machining path displayed on the display of the input / output device 106. The part of the machining path is a part where the machining conditions when the machining path is machined do not satisfy the reference conditions.

[0070] The program display unit 119 displays a block of the machining program that specifies machining conditions for at least a portion selected by the selection unit 118. The program display unit 119 may display not only the block that specifies machining conditions for a portion of the machining path selected by the selection unit 118, but also blocks before and after the block, or all blocks. In this case, the program display unit 119 may highlight the block that specifies the machining conditions for the selected machining path.

[0071] The editing unit 120 edits the blocks displayed by the program display unit 119. The editing unit 120 edits the blocks displayed by the program display unit 119 based on, for example, an editing operation by an operator on the input / output device 106. That is, the operator edits the blocks displayed on the display of the input / output device 106. Editing a block means rewriting the processing conditions specified in the block.

[0072] 11 is a flowchart showing an example of processing executed by the processing path display device 1. In the processing path display device 1, the condition acquisition unit 111 acquires processing conditions (step SD1). Next, the reference condition acquisition unit 112 acquires reference conditions (step SD2).

[0073] Next, the determination unit 113 determines whether the machining conditions when machining is performed along the machining path satisfy the reference conditions (step SD3). Next, the display unit 114 displays the machining path in a predetermined manner based on the determination result by the determination unit 113 (step SD4).

[0074] Next, the selection unit 118 selects at least a part of the machining path (step SD5). Next, the program display unit 119 displays a block of the machining program that specifies the machining conditions for at least a part of the machining path (step SD6). Next, the editing unit 120 edits the block displayed by the program display unit 119 (step SD7), and the process ends.

[0075] The above-described machining path display device 1 displays the machining path of the tool during cutting in a predetermined format. However, the machining path display device 1 may also display the machining path during laser machining in a predetermined format.

[0076] The processing conditions in laser processing include laser power [W] and feed rate [mm / min]. Therefore, the reference conditions in laser processing also include laser power and feed rate.

[0077] Fig. 12 is a diagram showing an example of reference conditions for laser processing. The ellipse in Fig. 12 represents the reference conditions. In other words, when the position indicating the processing conditions is located inside the ellipse, the processing conditions satisfy the reference conditions. When the position indicating the processing conditions is located on or outside the ellipse, the processing conditions do not satisfy the reference conditions. The display unit 114 displays, in a predetermined manner, the processing path processed under processing conditions that do not satisfy the reference conditions by the determination unit 113.

[0078] In the above-described embodiment, when the value indicating the machining condition is equal to or greater than the value indicating the reference condition, the determination unit 113 determines that the machining condition does not satisfy the reference condition. However, the cases in which the determination unit 113 determines that the machining condition does not satisfy the reference condition are not limited to these cases.

[0079] For example, the reference conditions may include a value indicating an upper limit and a value indicating a lower limit. Specifically, the reference conditions may include an upper limit value of the cutting load and a lower limit value of the cutting load. In this case, if the value indicated by the first information is equal to or greater than the upper limit value or equal to or less than the lower limit value, the determination unit 113 determines that the machining conditions do not satisfy the reference conditions.

[0080] As described above, the machining path display device 1 includes a condition acquisition unit 111 that acquires the machining conditions of the workpiece W, a reference condition acquisition unit 112 that acquires reference conditions that serve as the basis for the machining conditions, a judgment unit 113 that judges whether or not the machining path specified in the machining program satisfies the conditions based on the machining conditions acquired by the condition acquisition unit 111 and the reference conditions acquired by the reference condition acquisition unit 112, and a display unit 114 that displays at least a portion of the machining path in a predetermined manner based on the judgment result by the judgment unit 113.

[0081] That is, when a machining program is executed, the machining path display device 1 displays positions that do not satisfy the machining conditions, thereby enabling the operator to efficiently find positions that do not satisfy the machining conditions.

[0082] The processing path display device 1 further includes a comparison information generating unit 115 that generates first information indicating a predetermined type of physical quantity based on the processing conditions and generates second information indicating the predetermined type of physical quantity based on the reference conditions, and the determination unit 113 determines whether the processing path satisfies the conditions based on the first information and second information generated by the comparison information generating unit 115. In this case, the operator can easily understand the comparison result in the determination unit 113.

[0083] The machining path display device 1 further includes a tool information acquisition unit 116 that acquires tool information indicating the type of tool used to machine the workpiece W, and a workpiece information acquisition unit 117 that acquires workpiece information indicating the type of workpiece W, and the reference condition acquisition unit 112 acquires the reference conditions based on the tool information and the workpiece information. Therefore, the machining path display device 1 can determine whether the machining conditions satisfy the reference conditions depending on the tool and the workpiece W.

[0084] The machining conditions include a feed rate, a rotation rate, and a cutting depth, and the condition acquisition unit 111 acquires the feed rate and the rotation rate from the machining program and acquires the cutting depth based on the machining path. Therefore, the operator does not need to input the machining conditions into the machining path display device 1. Therefore, the machining path display device 1 can reduce the workload of the operator.

[0085] The machining path display device 1 further includes a selection unit 118 that selects at least a part of the machining paths, a program display unit 119 that displays blocks of a machining program that specify at least a part of the machining paths selected by the selection unit 118, and an editing unit 120 that edits the blocks displayed by the program display unit 119. This allows the operator to easily correct parts of the machining program that do not satisfy the reference conditions.

[0086] Although the present disclosure has been described in detail, the present disclosure is not limited to the individual embodiments described above. Various additions, substitutions, modifications, partial deletions, etc. are possible to these embodiments without departing from the gist of the present disclosure or the gist of the present disclosure derived from the content of the claims and their equivalents. Furthermore, these embodiments can also be implemented in combination.

[0087] The following are supplementary notes related to embodiments of the present disclosure. Supplementary note [1] A machining path display device comprising: a condition acquisition unit that acquires machining conditions for a machining path; a reference condition acquisition unit that acquires reference conditions that serve as references for the machining conditions; a determination unit that determines whether the machining conditions acquired by the condition acquisition unit satisfy the reference conditions acquired by the reference condition acquisition unit; and a display unit that displays at least a part of the machining path in a predetermined manner based on a determination result by the determination unit. Supplementary note [2] The machining path display device according to supplementary note [1] further comprises a comparison information generation unit that generates first information indicating a predetermined type of physical quantity based on the machining conditions and generates second information indicating the predetermined type of physical quantity based on the reference conditions, and the determination unit determines whether the machining conditions satisfy the reference conditions based on the first information and the second information generated by the comparison information generation unit. Supplementary Note [3] The machining path display device according to Supplementary Note [1] or [2], further comprising a tool information acquisition unit that acquires tool information related to a tool, and a workpiece information acquisition unit that acquires workpiece information related to a workpiece, wherein the reference condition acquisition unit acquires the reference conditions based on the tool information and the workpiece information. Supplementary Note [4] The machining path display device according to any of Supplementary Note [1] to [3], wherein the machining conditions include a feed rate, a rotation speed, and a cutting-in amount, and the condition acquisition unit acquires the feed rate and the rotation speed from a machining program and acquires the cutting-in amount based on the machining path. Supplementary Note [5] The machining path display device according to Supplementary Note [4], further comprising a selection unit that selects at least a portion of the machining path, a program display unit that displays a block of the machining program that specifies the machining conditions for at least the portion selected by the selection unit, and an editing unit that edits the block displayed by the program display unit. Supplementary Note [6] A computer-readable storage medium that stores instructions that cause a computer to execute the following: acquiring machining conditions for a machining path; acquiring reference conditions that serve as references for the machining conditions; determining whether the acquired machining conditions satisfy the acquired reference conditions; and displaying at least a part of the machining path in a predetermined manner based on the determination result.

[0088] REFERENCE SIGNS LIST 1 Machining path display device 101 Hardware processor 102 Bus 103 ROM 104 RAM 105 Non-volatile memory 106 Input / output device 111 Condition acquisition unit 112 Reference condition acquisition unit 113 Determination unit 114 Display unit 115 Comparison information generation unit 116 Tool information acquisition unit 117 Work information acquisition unit 118 Selection unit 119 Program display unit 120 Editing unit

Claims

1. a condition acquisition unit that acquires machining conditions for a machining path; a reference condition acquisition unit that acquires reference conditions that are the references for the processing conditions; a determination unit that determines whether the machining conditions acquired by the condition acquisition unit satisfy the reference conditions acquired by the reference condition acquisition unit; a display unit that displays at least a part of the machining path in a predetermined manner based on a determination result by the determination unit; A processing path display device comprising:

2. a comparison information generating unit that generates first information indicating a predetermined type of physical quantity based on the processing conditions and generates second information indicating the predetermined type of physical quantity based on the reference conditions; The machining path display device according to claim 1 , wherein the determination unit determines whether the machining conditions satisfy the reference conditions based on the first information and the second information generated by the comparison information generation unit.

3. a tool information acquisition unit that acquires tool information related to a tool; a work information acquisition unit that acquires work information related to the work, The machining path display device according to claim 1 , wherein the reference condition acquisition unit acquires the reference conditions based on the tool information and the workpiece information.

4. The machining conditions include a feed rate, a rotation rate, and a cutting depth. The machining path display device according to claim 1 or 2, wherein the condition acquisition unit acquires the feed rate and the rotation speed from a machining program, and acquires the cutting depth based on the machining path.

5. a selection unit for selecting the at least part of the machining path; a program display unit that displays a block of the machining program that specifies the machining conditions for at least the part selected by the selection unit; The machining path display device according to claim 4 , further comprising: an editing section that edits the block displayed by the program display section.

6. Acquiring machining conditions for a machining path; acquiring reference conditions that serve as references for the processing conditions; determining whether the acquired processing conditions satisfy the acquired reference conditions; displaying at least a part of the processing path in a predetermined manner based on the determination result; A computer-readable storage medium that stores instructions for causing a computer to execute the above.