Buffer device, mounting device, and mounting method

Abstract

Provided are a buffer device, a mounting device, and a mounting method with which it is possible to reduce bonding failure due to the lapse of time from preprocessing to bonding of an electronic component and a mounting substrate. A buffer device according to an embodiment comprises: a storage container 161 in which a component supply body TW, which is a workpiece in which a wafer W singulated into electronic components E is affixed to a tape T attached to a ring R, and a mounting substrate BW, which is a workpiece on which the electronic components E separated from the component supply body TW are to be mounted, are stored after surface treatment and / or cleaning is performed thereon; a chamber 162 in which the storage container 161 is accommodated; and an in-container adjustment unit 163 that adjusts the temperature, humidity, and pressure of gas in the storage container 161 independently of the chamber 162.

Description

Buffer device, mounting device, and mounting method

[0001] The present invention relates to a buffer device, a mounting device, and a mounting method.

[0002] Direct bonding is a method for mounting electronic components such as semiconductor chips onto a mounting substrate. Direct bonding is a method of directly bonding the connection terminals of the mounting substrate and electronic component together by solid-state bonding, without using bonding materials (adhesives) such as solder bumps. A bonding machine is a device that performs the bonding process to bond electronic components to the mounting substrate in this way. Direct bonding eliminates the need to consider the effects of bonding materials, allowing for narrow spacing between connection terminals and enabling high-density packaging.

[0003] When electronic components are directly bonded to a mounting substrate, pretreatment is performed on the electronic components and mounting substrate before bonding. This pretreatment involves surface treatments such as activation and cleaning, as well as cleaning. Activation is a process in which the surfaces of the electronic components and mounting substrate are activated by active species such as ions and radicals generated by converting reactive gas into plasma. Activation refers to breaking the chemical bonds of molecules on the surface. Cleaning is a process in which the surfaces of the electronic components and mounting substrate are cleaned by the generated active species such as ions and radicals. Cleaning refers to the removal of particles adhering to the surface by flicking them off or the decomposition and removal of organic matter. Cleaning is a process in which particles remaining on the surfaces of the electronic components and mounting substrate are removed.

[0004] Japanese Patent Application Publication No. 6-302486

[0005] The surface condition of electronic components and mounting boards that have undergone the above pretreatment may gradually deactivate over time or organic matter may adhere to the surface, causing changes. This can lead to a decrease in bonding strength. If the bonding strength is insufficient, the bonding will be poor, leading to product defects.

[0006] Furthermore, in bonding processes using a bonding device that tightly attaches electronic components to a mounting substrate, when multiple electronic components are mounted on a single mounting substrate, the timing of supplying the mounting substrate and electronic components to the bonding device may not coincide. There are also differences in the preparation time required for electronic components and mounting substrates after activation and cleaning processes before they can be loaded into the bonding device. Such differences in the timing and number of processes (number of mountings) during the bonding process (mounting process) of electronic components and mounting substrates result in differences in the surface condition at the time of bonding, increasing the possibility of deactivation or organic matter adhesion to either the electronic components or the mounting substrate.

[0007] An object of the embodiments of the present invention is to provide a buffer device, a mounting device, and a mounting method that can reduce bonding defects that occur due to the lapse of time from pre-processing of an electronic component and a mounting substrate to bonding processing.

[0008] The buffer device of the embodiment has a storage facility that stores component supply bodies, which are workpieces in which wafers diced into electronic components are attached to tape attached to a ring, and mounting boards, which are workpieces on which the electronic components are mounted, after performing surface treatment and / or cleaning processes on them, a chamber that houses the storage facility, and an internal adjustment unit that adjusts the temperature, humidity, and pressure of the gas within the storage facility independently of the chamber.

[0009] The mounting apparatus of the embodiment comprises a surface treatment section that uses plasma to treat the surface of a component supply body having wafers diced into electronic components attached to a tape attached to a ring and / or a surface of a mounting substrate on which the electronic components are mounted, a supply body cleaning section that cleans the component supply body, a mounting substrate cleaning section that cleans the mounting substrate, the buffer device, a bonding section that detaches the electronic components from the component supply body and mounts them on the mounting substrate, and a transport section that transports the component supply body and the mounting substrate, and a pretreatment control section that, when a preset time has elapsed since the component supply body or the mounting substrate was accommodated in the buffer device, causes any of the surface treatment section, the supply body cleaning section, or the mounting substrate cleaning section to perform cleaning and surface treatment again.

[0010] The mounting method of the embodiment includes a surface treatment step in which a surface treatment unit uses plasma to surface-treat a component supply having wafers attached to a tape attached to a ring and singulated into electronic components, and / or a surface of a mounting substrate on which the electronic components are to be mounted; a supply cleaning step in which a supply cleaning unit cleans the component supply; a mounting substrate cleaning step in which a mounting substrate cleaning unit cleans the mounting substrate; a supply accommodating step in which a buffer device for the supply is provided in a chamber and the component supply is temporarily accommodated in a storage facility whose internal gas is controlled independently from the chamber; and a bonding step in which a bonding unit detaches the electronic components from the component supply body and mounts them on the mounting substrate. In the supply body accommodating step, when a preset time has elapsed since the component supply body was accommodated, the surface treatment step and / or the supply body cleaning step are performed again, and in the mounting substrate accommodating step, when a preset time has elapsed since the mounting substrate was accommodated, the surface treatment step and / or the mounting substrate cleaning step are performed again.

[0011] The embodiment of the present invention can reduce bonding defects that occur due to the lapse of time from pre-processing of the electronic component and the mounting substrate to bonding processing.

[0012] 11 is an explanatory diagram showing processing of a mounting apparatus according to an embodiment; FIG. 12 is a simplified perspective plan view showing the configuration of a mounting apparatus according to an embodiment; FIG. 13 is a simplified configuration diagram showing a supply item cleaning unit and a mounting substrate cleaning unit of the mounting apparatus; FIG. 14 is a simplified configuration diagram showing a supply item buffer unit and a mounting substrate buffer unit of the mounting apparatus; FIG. 15 is a block diagram showing a control unit; FIG. 16 is a flowchart showing an operation procedure of an embodiment; FIG. 17 is a flowchart showing the procedure from storing workpieces in the supply item buffer unit and the mounting substrate buffer unit to carrying them out; FIG. 18 is a simplified perspective plan view showing a modified example in which a storage facility for component supply items and a storage facility for mounting substrates are provided in a common chamber; FIG. 19 is a simplified perspective plan view showing an example in which a placing unit for component supply items and a placing unit for mounting substrates are provided in a chamber, in a modified example of FIG. 8;

[0013] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the drawings are schematic diagrams, and the size, proportions, etc. of each part are exaggerated for ease of understanding.

[0014] [Overview] In this embodiment, as shown in FIG. 1 , processing is performed on a component supply TW and a mounting board BW. The component supply TW is a wafer (semiconductor wafer) W attached to tape T attached to a ring R. At this time, the wafer W is singulated into electronic components E. The tape T is a stretchable sheet with an adhesive surface, and its adhesive strength can be reduced by irradiation with UV (ultraviolet) light. The mounting board BW is a wafer (semiconductor wafer) onto which electronic components E detached from the component supply TW are bonded (mounted). Note that, since the target of processing is electronic components E, processing on the component supply TW in the following description refers to processing on electronic components E. Furthermore, when the component supply TW and the mounting board BW are not to be distinguished from each other, they may be referred to as workpieces.

[0015] As shown in FIG. 2 , the mounting apparatus 1 of this embodiment is an apparatus that performs pre-processing (activation processing, cleaning processing, washing processing) on ​​component supplies TW and mounting boards BW, which are supplied in multiple sheets housed in a transport container F such as a FOUP (Front Opening Unified Pod) or a FOSB (Front Opening Shipping Box) in a pre-process, one by one, and mounts electronic components E.

[0016] The mounting apparatus 1 is configured by arranging a plurality of chambers 12 housing various processing devices around a base 11, which is a box-shaped container. The base 11 is provided with a load port 13 on which a transfer container F is mounted. A transfer container F housing unprocessed component supplies TW and mounting boards BW is mounted on the load port 13, and the component supplies TW and mounting boards BW are removed one by one from the transfer container F by a transfer unit 190, and are carried into each chamber 12, processed, and then carried out. In addition, a fan filter unit (FFU) (not shown) is provided on the ceiling of the base 11, and a downflow of clean air is generated to maintain a clean atmosphere inside the base 11. Such an FFU may also be provided in the chamber 12 as needed.

[0017] The mounting apparatus 1 of this embodiment includes a pre-processing device that performs pre-processing including activation processing, cleaning processing, and washing processing of the electronic components E, a buffer device that temporarily accommodates the component supply body TW and the mounting board BW, and a bonding device that presses the electronic components E onto the mounting board BW.

[0018] More specifically, the mounting apparatus 1 of this embodiment is an apparatus including a surface treatment section 100, a supply cleaning section 110, a mounting substrate cleaning section 120, an adjustment treatment section 130, a gauging section 140, an alignment section 150, a supply buffer section 160, a mounting substrate buffer section 170, a bonding section 180, a transport section 190, and a control section 200.

[0019] The pre-processing device is made up of a surface treatment section 100, a supply cleaning section 110, a mounting substrate cleaning section 120, an adjustment treatment section 130, a gauging section 140, and an alignment section 150. The buffer device is made up of a supply buffer section 160 and a mounting substrate buffer section 170. The bonding device is made up of a bonding section 180. A transport device, which is a transport section 190, is configured to transfer workpieces to each device. Each device is controlled by a control section 200, and the mounting device 1 is made up.

[0020] [Surface Treatment Unit] The surface treatment unit 100 is a treatment chamber that performs surface treatment on the component supply body TW and the mounting substrate BW. The surface treatment is a process that modifies (activates and cleans) the surfaces where the component supply body TW and the mounting substrate BW are bonded. This modification also provides a hydrophilic effect. The surface treatment unit 100 of this embodiment has a plasma generator that converts a reactive gas introduced into the vacuum chamber 12 into plasma, and irradiates the generated ions onto the surfaces where the component supply body TW and the mounting substrate BW are bonded, thereby modifying each surface.

[0021] [Supplier Cleaning Section] The supplier cleaning section 110 is a processing chamber that cleans the component supplier TW. The supplier cleaning section 110 cleans and removes particles remaining on the plasma-treated component supplier TW or particles generated by the plasma processing. The cleaning targets are the surfaces of the electronic components E, the spaces between the electronic components E, and the adhesive surface of the tape T, and cleans and removes particles adhering thereto. The presence of particles affects the bonding strength (weakening the bonding strength). Therefore, cleaning the bonding surfaces can prevent the bonding strength from weakening.

[0022] 3, the supplier cleaning unit 110 includes a cleaning chamber 111 which is a container in which the cleaning process is performed, a support part 112 which supports the component supplier TW, a rotation mechanism 113 which rotates the support part 112, a cup 114 which receives the scattering cleaning liquid L from around the component supplier TW, and a supplier 115 which supplies the cleaning liquid L. The supplier 115 is provided with a nozzle 115a which drips the cleaning liquid L and a moving mechanism 115b which moves the nozzle 115a.

[0023] The cleaning process is performed by supplying cleaning liquid L from a nozzle 115a to the surface to be treated of the component supply TW, which is supported by a support part 112 and rotated by a rotation mechanism 113. DIW, for example, is used as the cleaning liquid L. The cleaning chamber 111 is provided with an opening 111a through which the component supply TW is carried in and out, and the opening 111a is configured to be openable and closable by a shutter 111b.

[0024] The rotation mechanism 113 of the supply cleaning unit 110 is equipped with an expanding unit (not shown) that stretches (expands) the tape T of the supply cleaning unit 110 supported by the support unit 112 to widen the gap between the electronic components E and also clean any particles in that gap.

[0025] [Mounting Substrate Cleaning Unit] The mounting substrate cleaning unit 120 is a processing chamber that cleans the mounting substrate BW. The mounting substrate cleaning unit 120 cleans and removes particles remaining on the plasma-treated mounting substrate BW or particles generated by the plasma processing. The presence of particles affects the bonding strength (weakening the bonding strength). Therefore, cleaning the bonding surface can prevent the bonding strength from weakening. Similar to the supplier cleaning unit 110 shown in FIG. 3 , the mounting substrate cleaning unit 120 includes a cleaning chamber 111, which is a container in which the cleaning process is performed, a support unit 112 that supports the mounting substrate BW, a rotation mechanism 113 that rotates the support unit 112, a cup 114 that receives the cleaning liquid L that splashes from around the mounting substrate BW, and a supplier unit 115 that supplies the cleaning liquid L.

[0026] [Adjustment Processing Unit] The adjustment processing unit 130 adjusts the tape T on the cleaned component supply unit TW by irradiating it with UV light, thereby reducing the adhesive strength of the tape T. As shown in FIG. 1 , the adjustment processing unit 130 has an irradiation device 131 that irradiates the entire area below the accommodated component supply unit TW with UV light by scanning a UV light source.

[0027] [Gauging Unit] The gauging unit 140 positions the component supply unit TW. The gauging unit 140 is a contact-type centering device that adjusts the position by contacting the outer periphery of the component supply unit TW so that the center of the component supply unit TW coincides with a reference position set inside.

[0028] [Alignment Unit] The alignment unit 150 positions the mounting substrate BW. The alignment unit 150 is a non-contact (optical) centering device that adjusts the position of the mounting substrate BW so that the center of the mounting substrate BW coincides with a reference position provided inside.

[0029] [Supplier Buffer Section] The supplier buffer section 160 is a buffer device that temporarily stores component suppliers TW. The supplier buffer section 160 stores component suppliers TW before they are transported to the bonding section 180. The supplier buffer section 160 may also store component suppliers TW from which some electronic components E have been detached by bonding. As shown in FIG. 4 , the supplier buffer section 160 includes a storage 161, a chamber 162 (12), and an internal adjustment section 163. The storage 161 is a container that stores component suppliers TW after cleaning by the supplier cleaning section 110. The chamber 162 is one of the chambers 12 that constitute the mounting apparatus 1 and is a container that stores the storage 161. The internal adjustment section 163 controls the temperature, humidity, and pressure within the storage 161 independently from the chamber 162. "Independently controlled" means that the control is performed without gas flow between them.

[0030] (Storage) The storage 161 is box-shaped and is configured to accommodate a plurality of component suppliers TW stacked at intervals. The storage 161 has a support portion 611, an opening 612, a storage-side shutter 613, and an irradiation device 614.

[0031] The support section 611 is a shelf that supports the component supply units TW. A plurality of support sections 611 are provided in multiple stages within the storehouse 161, each supporting one component supply unit TW.

[0032] Opening 612 is a hole for loading and unloading component suppliers TW, and is provided on one side of storage facility 161. Storage facility-side shutter 613 is large enough to cover opening 612, and is provided on the side of storage facility 161 on which opening 612 is provided, so as to be movable between a closed position that closes opening 612 and an open position that opens opening 612.

[0033] The storage-side shutter 613 is a door that is in an open position when the component supplier TW is carried in or out of the storage 161, and is in a closed position when the component supplier TW is carried in or out of the chamber 162. The storage-side shutter 613 is connected to an opening / closing mechanism 613a that is driven by a cylinder and slides along a guide member.

[0034] The irradiation device 614 is a device that irradiates the component supplier TW with UV light. For example, an excimer UV lamp is used as the irradiation device 614. The irradiation device 614 has a light source disposed on the opposite side of the opening 612 across the support portion 611 in the storage 161, at a height and angle that allows irradiation of the component supplier TW on the support portion 611 so that the electronic components E on each component supplier TW are irradiated.

[0035] Furthermore, the hangar 161 is provided with a thermometer 161a for detecting the temperature of the gas inside the hangar 161, a hygrometer 161b for detecting the humidity, and a pressure gauge 161c for detecting the pressure (see FIG. 5). The thermometer 161a, the hygrometer 161b, and the pressure gauge 161c are connected to the control unit 200, which will be described later.

[0036] (Chamber) The chamber 162 is box-shaped and large enough to accommodate the storage 161. The chamber 162 has an opening 615, a chamber-side shutter 616, a placement unit 617, a robot 618, and an air blower 619.

[0037] The opening 615 is a hole for loading and unloading the component supplier TW, and is provided on one side surface of the chamber 162. The chamber-side shutter 616 is large enough to cover the opening 615, and is provided on the side surface of the chamber 162 on which the opening 615 is provided, so as to be movable between a closed position where the opening 615 is closed and an open position where the opening 615 is open.

[0038] The chamber-side shutter 616 is a door that is in an open position when the component supplier TW is carried in or out of the chamber 162, and is in a closed position when the component supplier TW is carried in or out of the storage facility 161. The chamber-side shutter 616 is connected to an opening / closing mechanism 616a that is driven by a cylinder and slides along a guide member.

[0039] The placement unit 617 is provided in the chamber 162 between the opening 615 and the storage 161, and is a platform on which the component supplier TW carried in through the opening 615 is placed. The robot 618 has a robot hand 618a that supports the component supplier TW, and is a transport device that transports the component supplier TW between the placement unit 617 and the storage 161. In other words, the robot 618 transports the component supplier TW placed on the placement unit 617 into and out of the storage 161. Note that the transport device is not limited to the robot 618, and may have any configuration as long as it can transport the component supplier TW placed on the placement unit 617 into and out of the storage 161.

[0040] The blower 619 is a device that generates a downflow of clean gas within the chamber 162. The blower 619 is a fan filter unit (FFU) equipped with an ultra low penetration air filter (ULPA filter). An exhaust port (not shown) is provided near the bottom of the chamber 162, and exhausts the clean gas to the outside of the chamber 162 without disrupting the downflow. Alternatively, an air vent pipe (not shown) is provided to circulate the clean gas to the FFU.

[0041] (Inside Adjustment Section) The inside adjustment section 163 has an air supply passage 163a, a gas supply device 163b, a flow meter 163c, a filter 163d, a valve 163e, an exhaust passage 163f, and a valve 163g. The air supply passage 163a is connected to the top of the storage 161 and is a ventilation path drawn out to the outside of the chamber 162 without communicating with the inside of the chamber 162. The gas supply device 163b is a device that supplies gas into the storage 161 via the air supply passage 163a. ​​In this embodiment, preheated N ２ This is a bubbling device that supplies humidified gas by passing water through it.

[0042] The flow meter 163c is a device that measures the flow rate of gas in the gas supply path 163a. ​​The filter 163d is a device that purifies the gas in the gas supply path 163a. ​​The valve 163e is a flow rate adjustment valve that opens and closes the gas supply path 163a and adjusts the gas flow rate.

[0043] The exhaust path 163f is a ventilation path that is connected to the bottom of the housing 161, does not communicate with the inside of the chamber 162, and is drawn out to the outside of the chamber 162. The valve 163g is a flow rate adjustment valve that opens and closes the exhaust path 163f and adjusts the gas flow rate.

[0044] [Mounting Board Buffer Section] The mounting board buffer section 170 is a buffer device that temporarily stores mounting boards BW before they are carried into the bonding section 180. The mounting board buffer section 170 stores mounting boards BW before they are carried into the bonding section 180. Note that the mounting board buffer section 170 may also store mounting boards BW on which electronic components E have been mounted by bonding. As shown in FIG. 4 , the mounting board buffer section 170 has a storage facility 161, a chamber 162 (12), and an internal adjustment section 163, similar to the above-described supply buffer section 160. In other words, the mounting board buffer section 170 has the same configuration as the supply buffer section 160, except that the object that is carried into the chamber 162 and stored in the storage facility 161 is a mounting board BW.

[0045] [Bonding Section] The bonding section 180 is a processing chamber that detaches electronic components E from the component supply body TW and mounts them on the mounting board BW. Although not shown, the bonding section 180 includes a supply mechanism, a pickup mechanism, and a mounting mechanism. The pickup mechanism picks up the electronic components E from the component supply body TW that have been carried into the supply mechanism, transfers them to the mounting mechanism, and mounts them on the mounting board BW that has been carried into the mounting mechanism. Note that, as shown in FIG. 1 , the bonding section 180 of this embodiment flips the picked-up electronic components E and mounts the pre-treated surface on the surface of the mounting board BW that has also been pre-treated.

[0046] [Transport Unit] The transport unit 190 transports component supply units TW and mounting boards BW between the load port 13 and each chamber 12, and between each chamber 12. As shown in FIG. 2 , the transport unit 190 has a transport robot 191 and a moving mechanism 192. The transport robot 191 is of a double-arm type and has a pair of robot hands 191a. The pair of robot hands 191a can support the component supply units TW and mounting boards BW, respectively. The moving mechanism 192 moves the transport robot 191 and positions it at the load port 13 and each chamber 12. The robot hands 191a load and unload the component supply units TW and mounting boards BW into and out of each transport container F and each chamber 12.

[0047] [Control Unit] The control unit 200 is a computer that controls each unit of the mounting apparatus 1. The control unit 200 has a processor that executes programs, a memory that stores various information such as the programs and operating conditions, and a drive circuit that drives each element. That is, the control unit 200 controls the surface treatment unit 100, the supply element cleaning unit 110, the mounting substrate cleaning unit 120, the adjustment treatment unit 130, the gauging unit 140, the alignment unit 150, the supply element buffer unit 160, the mounting substrate buffer unit 170, the bonding unit 180, and the transport unit 190. As shown in FIG. 5 , the control unit 200 has a memory unit 210 that stores information, an input unit 220 that inputs information, and a display unit 230 that displays information.

[0048] 5, the control unit 200 of this embodiment also includes a temperature and humidity control unit 240 that controls the temperature and humidity inside the storage chamber 161. The temperature and humidity control unit 240 controls the storage chamber adjustment unit 163 based on the temperature measured by the thermometer 161a, the humidity measured by the hygrometer 161b, and the pressure measured by the pressure gauge 161c, thereby adjusting the temperature, humidity, and pressure inside the storage chamber to maintain the active state of the electronic components E and mounting boards BW of the component suppliers TW housed in the storage chamber 161 (see FIG. 4). The temperature, humidity, and pressure ranges within which the active state is maintained are determined in advance by experiment or the like, input by the input unit 220, and stored in the memory unit 210.

[0049] Furthermore, the control unit 200 includes a preprocessing control unit 250 and an irradiation control unit 260. When a preset time has elapsed since the buffer device (supply buffer unit 160, mounting substrate buffer unit 170) accommodated the component supply body TW or the mounting substrate BW, the preprocessing control unit 250 causes the surface treatment unit 100, supply body cleaning unit 110, or mounting substrate cleaning unit 120 to perform cleaning and surface treatment again. In other words, if a long period of time passes without mounting on the component supply body TW or the mounting substrate BW after preprocessing by surface treatment and cleaning, the activation state of the bonding surfaces of the electronic components E and the mounting substrate BW may gradually become inactive or organic matter may adhere to them. For this reason, the preprocessing control unit 250 measures the elapsed time from accommodation and causes preprocessing to be performed again when a preset time has elapsed. This time is the time during which the activation state of the bonding surfaces is maintained within an acceptable range. When the electronic component E is mounted on the mounting board BW within this time, the bonding strength will be within the allowable range, but once this time has elapsed, the bonding strength will exceed the allowable range. In other words, the required bonding strength will no longer be obtained. The set time is determined in advance through experiments, etc. Such a set time is input in advance by the input unit 220 and stored in the storage unit 210.

[0050] When a preset time has elapsed, the irradiation control unit 260 causes the irradiation device 614 to irradiate the component supply unit TW or the mounting board BW with UV light rather than performing pretreatment again (see FIG. 4 ). Whether to remove the component supply unit TW from the storage facility 161 and perform pretreatment again or to irradiate the component supply unit TW with UV light while it is still stored in the storage facility 161 is determined based on the condition and type of the workpiece. For example, if some electronic components E from the component supply unit TW have been removed for mounting but other electronic components E remain, a large portion of the tape T is exposed, and cleaning may contaminate the remaining electronic components E. For this reason, UV light irradiation is performed rather than pretreatment again. Furthermore, if there is a possibility that electronic components E mounted on the mounting board BW may become detached due to transportation or cleaning of the mounting board BW, UV light irradiation is performed rather than pretreatment again. Whether UV light irradiation is performed is input in advance by the input unit 220 and stored in the memory unit 210.

[0051] [Operation] The operation of the mounting apparatus 1 of this embodiment as described above will be described with reference to the flowcharts of Figures 6 and 7 in addition to Figures 1 to 5. A mounting method for mounting an electronic component E on a mounting board BW according to the following procedure is also one aspect of this embodiment. Note that the following description follows the flowchart of Figure 6, but it also includes a state in which each process is performed simultaneously in parallel.

[0052] As shown in Fig. 2, a transport container F containing a component supply TW and a transport container F containing a mounting board BW are loaded onto the load port 13. As shown in Fig. 4, a downflow is generated in the chamber 162 of the supply buffer section 160 and the mounting board buffer section 170 by the air blower 619. In addition, the inside of the storage facility 161 is supplied with N gas from the gas supply device 163b of the internal adjustment section 163. ２ Gas is being supplied. ２ The gas supply and exhaust rates are adjusted by valves 163e and 163g to maintain preset temperature, humidity, and pressure.

[0053] 1 and 2, the transport robot 191 receives a component supply TW from the transport container F of the load port 13, transports the component supply TW to the surface treatment section 100, and activates and cleans the surfaces of the electronic components E by plasma treatment (supply surface treatment process: step S101). While the surface treatment of the component supply TW is being performed, the transport robot 191 receives a mounting substrate BW from the transport container F. The transport robot 191 receives the component supply TW after surface treatment from the surface treatment section 100, and transports the mounting substrate BW to the surface treatment section 100. In the surface treatment section 100, the surface of the mounting substrate BW is activated and cleaned by plasma treatment (mounting substrate surface treatment process: step S102).

[0054] The transport robot 191 delivers the component supply TW, whose surface has been treated, to the support unit 112 of the supply cleaning unit 110. The supply cleaning unit 110 rotates the component supply TW using the support unit 112 and the rotation mechanism 113, while supplying cleaning liquid L to clean it (supply supply cleaning process: step S103). At this time, the expanding unit expands the tape T of the component supply TW, widening the gaps between the electronic components E while cleaning. After supplying cleaning liquid L and cleaning, the component supply TW is then rotated at high speed to shake off the cleaning liquid L and dry. The expanding unit then releases the tape T, causing it to shrink back to its original state, restoring the gaps between the electronic components E. When the cleaning liquid L is water, hydroxyl groups can be added to the surface of the component supply TW.

[0055] After the surface treatment of the mounting substrate BW in the surface treatment unit 100 is completed, the transport robot 191 receives the mounting substrate BW from the surface treatment unit 100 and transfers it to the mounting substrate cleaning unit 120. The mounting substrate cleaning unit 120 cleans the mounting substrate BW by supplying cleaning liquid L while rotating the mounting substrate BW (mounting substrate cleaning step: step S104). After supplying cleaning liquid L and cleaning, the mounting substrate BW is then rotated at high speed to shake off the cleaning liquid L and dry it. This mounting substrate cleaning step includes a state in which it is performed simultaneously with the supply body cleaning step. In other words, the time spent cleaning the component supply body TW and the time spent cleaning the mounting substrate BW overlap. Note that if the cleaning liquid L is water, hydroxyl groups can also be added to the surface of the mounting substrate BW.

[0056] After the cleaning process of the component supply TW is completed, the transport robot 191 receives the component supply TW from the supply cleaning unit 110 and hands it over to the gauging unit 140. In the gauging unit 140, the component supply TW is aligned (positioning step: step S105). After the alignment is complete, the transport robot 191 receives the component supply TW from the gauging unit 140 and hands it over to the adjustment processing unit 130. In the adjustment processing unit 130, an adjustment process is performed to reduce the adhesive strength of the tape T by irradiating the component supply TW with UV light (adjustment step: step S106). These positioning and adjustment steps overlap with the mounting substrate cleaning step.

[0057] After the cleaning process of the mounting substrate BW is completed, the transfer robot 191 receives the mounting substrate BW from the mounting substrate cleaning unit 120 and delivers it to the alignment unit 150. In the alignment unit 150, the mounting substrate BW is aligned (positioning step: step S107).

[0058] After the adjustment process of the component supply unit TW is completed, the transport robot 191 receives the component supply unit TW from the adjustment processing unit 130 and hands it over to the supply unit buffer unit 160. After the alignment of the mounting board BW is completed, the transport robot 191 receives the mounting board BW from the alignment unit 150 and hands it over to the mounting board buffer unit 170.

[0059] In this way, after the component supply items TW and mounting boards BW are accommodated in the supply item buffer section 160 and mounting board buffer section 170 (accommodating step: step S108), when the bonding section 180 becomes ready to accept them, the transport robot 191 receives the component supply items TW and mounting boards BW and hands them over to the bonding section 180. In other words, in response to a signal from the bonding section 180 indicating that they are ready to accept, the transport robot 191 takes out the component supply items TW and mounting boards BW from the supply item buffer section 160 and mounting board buffer section 170 and carries them into the bonding section 180.

[0060] As will be described later, if the bonding unit 180 is not performing any processing or has completed processing after the surface treatment and / or cleaning, the component supply TW and the mounting board BW can be supplied directly to the bonding unit 180 without going through the supply buffer unit 160 and the mounting board buffer unit 170.

[0061] The storage of component suppliers TW in supplier buffer section 160, the storage of mounting boards BW in substrate buffer section 170, and the subsequent removal will be described with reference to the flowchart in Figure 7. Here, the component suppliers TW and mounting boards BW will not be distinguished from each other and will be described as works. First, with the storehouse-side shutter 613 closed, the chamber-side shutter 616 opens (step S201), and the transfer robot 191 places the work on the placement section 617 (step S202).

[0062] The chamber-side shutter 616 closes (step S203), the storage-side shutter 613 opens (step S204), and the robot 618 stores the workpiece on the placement section 617 so that it is supported by the support section 611 inside the storage section 161 (step S205). The storage-side shutter 613 closes (step S206), and the temperature, humidity, and pressure inside the storage section 161 are subsequently adjusted.

[0063] Furthermore, if the preset time has not elapsed (NO in step S207) but it is time to load the workpiece into the bonding unit 180 (YES in step S208), the workpiece is unloaded. That is, with the chamber-side shutter 616 closed, the storage-side shutter 613 opens (step S209), and the robot 618 removes the workpiece and places it on the placement unit 617 (step S210). The storage-side shutter 613 closes (step S211), the chamber-side shutter 616 opens (step S212), and the transfer robot 191 unloads the workpiece from the placement unit 617 (step S213).

[0064] If the preset time has elapsed (YES in step S207) and UV irradiation is not set to be performed in the storage room 161 (NO in step S214), after the workpieces are removed in steps S209 to S213, surface treatment, cleaning, and adjustment are performed again according to each workpiece (component supplier TW, mounting board BW). If UV irradiation is set to be performed in the storage room 161 (YES in step S214), UV irradiation is performed on the workpieces by the irradiation device 614 (step S215).

[0065] 6, the transport robot 191 delivers the component supplier TW and the mounting board BW to the bonding unit 180. In the bonding unit 180, the electronic component E is picked up from the component supplier TW and mounted on the mounting board BW (mounting process: step S109).

[0066] During mounting, the transport robot 191 receives the next component supply TW and mounting board BW from the transport container F of the load port 13, and performs the same processing for the second and subsequent sheets as described above. After mounting of the first sheet is completed, the transport robot 191 receives the component supply TW and mounting board BW from the bonding unit 180 between processing for the second and subsequent sheets, and transfers them to the transport container F of the load port 13.

[0067] The above operations are repeated to mount electronic components E on the mounting board BW, and when the supply of the component supplier TW and / or the mounting board BW is completed, the mounting process is completed.

[0068] After the electronic component E of the component supplier TW is mounted on the mounting board BW, a different electronic component E may be bonded to an unmounted area of ​​the mounting board BW, or the same or a different electronic component E may be bonded on top of an already mounted electronic component E.

[0069] When using different electronic components E in this way, the component supply TW may be replaced with a component supply TW of different electronic components E while the electronic components E remain on the component supply TW. The replaced component supply TW has been surface treated and cleaned for some time, and further time will pass before it can be used again. Therefore, if necessary, the component supply TW may be surface treated and cleaned again.

[0070] In this embodiment, the temperature, humidity, and pressure ranges within which the active state is maintained are stored in the memory unit 210. The stored temperature, humidity, and pressure ranges can be set to optimal values ​​for the component supplier TW and the mounting board BW, respectively. Therefore, the optimal in-storage environment can be achieved for each of the supplier buffer unit 160 and the mounting board buffer unit 170. Of course, the temperature, humidity, and pressure can also be set to common values.

[0071] The mounting apparatus 1 of this embodiment has been described as having a pre-processing device that performs pre-processing including activation processing, cleaning processing, and washing processing of the electronic components E, a buffer device that temporarily accommodates the component supply body TW and the mounting board BW, and a bonding device that presses the electronic components E onto the mounting board BW, but the pre-processing device and the buffer device do not necessarily have to be included as an integrated part of the mounting apparatus 1.

[0072] The mounting apparatus 1 of this embodiment may be configured such that the pre-processing device, buffer device, and bonding device are mounted on a single base 11 to form an integrated device, or such that the pre-processing device, buffer device, and bonding device are configured as independent devices and workpieces are transferred by independent transport devices. In this case, the control unit 200 may be included in each device, or each device may be controlled by a single control unit 200, or each device may be controlled by a control unit of each device and a control unit 200 that controls each device collectively.

[0073] [Effects] (1) The buffer device (supplier buffer section 160, mounting board buffer section 170) of this embodiment as described above includes a storage facility 161 that stores component suppliers TW, which are workpieces each having a wafer W diced into electronic components E attached to a tape T attached to a ring R, and a mounting board BW, which is a workpiece on which the electronic components E are mounted, after performing surface treatment and / or cleaning processing on the component suppliers TW, a chamber 162 that houses the storage facility 161, and an internal chamber adjustment section 163 that adjusts the temperature, humidity, and pressure of the gas in the storage facility 161 independently of the chamber 162.

[0074] The mounting apparatus 1 of this embodiment also includes a surface treatment section 100 that uses plasma to treat the surface of a component supply TW, in which wafers W that have been singulated into electronic components E are attached to tape T attached to a ring R, and / or a mounting substrate BW on which the electronic components E are mounted, a supply item cleaning section 110 that cleans the component supply TW, a mounting substrate cleaning section 120 that cleans the mounting substrate BW, buffer devices (supply item buffer section 160, mounting substrate buffer section 170), a bonding section 180 that detaches the electronic components E from the component supply TW and mounts them on the mounting substrate BW, and a transport section 190 that transports the component supply TW and the mounting substrate BW, and a pretreatment control section 250 that causes any of the surface treatment section 100, supply item cleaning section 110, or mounting substrate cleaning section 120 to perform cleaning and surface treatment again when a preset time has elapsed since the component supply TW or the mounting substrate BW was accommodated in the buffer device.

[0075] The mounting method of this embodiment includes a surface treatment step in which the surface treatment section 100 performs surface treatment, using plasma, on the surface of a component supply TW having a wafer W attached to a tape T attached to a ring R and singulated into electronic components E, and / or a mounting substrate BW on which the electronic components E are to be mounted; a supply cleaning step in which the supply cleaning section 110 cleans the component supply TW; a mounting substrate cleaning step in which the mounting substrate cleaning section 120 cleans the mounting substrate BW; and a buffer device for the supply (supply buffer section 160) performs surface treatment on the surface of a component supply TW having a wafer W singulated into electronic components E, and / or a mounting substrate BW on which the electronic components E are to be mounted, using plasma. a supply body accommodating step of temporarily accommodating a component supply body TW in a storage 161 provided in the chamber 162 and having an internal gas controlled independently of the chamber 162; a mounting substrate accommodating step of temporarily accommodating a mounting substrate BW in the storage 161, a buffer device for mounting substrates (mounting substrate buffer section 170) provided in the chamber 162 and having an internal gas controlled independently of the chamber 162; and a bonding step of a bonding section 180 detaching an electronic component E from the component supply body TW and mounting it on the mounting substrate BW.

[0076] Furthermore, in the mounting method, when a predetermined time has elapsed since the component supply TW was accommodated in the supply accommodating step, the surface treatment step and / or the supply cleaning step are performed again, and when a predetermined time has elapsed since the mounting board BW was accommodated in the mounting substrate accommodating step, the surface treatment step and / or the mounting substrate cleaning step are performed again.

[0077] In this way, even if there is a waiting time before bonding after the pre-processing is completed, the workpieces are kept waiting in the storage 161 provided in the chamber 162, where the temperature, humidity, and pressure are adjusted to maintain the workpieces in an active and clean state, thereby maintaining the active and clean state of the bonding surfaces and enabling good bonding. This reduces bonding defects that occur due to the lapse of time between cleaning the workpieces and mounting the electronic component E.

[0078] The housing 161 is disposed within the chamber 162, and workpieces are carried in and out of the housing 161 via the chamber 162. This prevents the interior of the housing 161 from coming into direct contact with the outside of the housing 161, minimizing environmental changes within the housing 161. The bonding surfaces of the workpieces housed within the housing 161 can be maintained in an active and clean state, enabling good bonding. This reduces bonding defects that occur due to the lapse of time between cleaning the workpieces and mounting the electronic components E.

[0079] Furthermore, the pressure inside chamber 162 and the pressure inside storage 161 can be adjusted independently. This makes it possible to prevent external gas from flowing into chamber 162 by making the pressure inside chamber 162 higher than the pressure outside chamber 162, and to prevent gas inside chamber 162 from flowing into storage 161 by making the pressure inside storage 161 higher than the pressure inside chamber 162. This makes it possible to more reliably reduce environmental changes inside storage 161.

[0080] The pressure in chamber 162 and storage 161 is not limited to the above, and by making the air pressure in storage 161 and the air pressure in chamber 162 the same, the outflow of gas from storage 161 and the inflow of gas from chamber 162 into storage 161 can be suppressed, and environmental changes in storage 161 can be reduced.

[0081] In this way, by adjusting the pressure in the housing 161 and the chamber 162, the workpieces can be stored in the housing 161, where environmental changes are small, and the bonding surfaces can be maintained in an active and clean state, enabling good bonding. This reduces bonding defects that occur due to the lapse of time between cleaning the workpieces and mounting the electronic components E.

[0082] In addition, a gas such as nitrogen (N ２ ), minimizing the amount of gas used, such as nitrogen. This reduces running costs and improves the ability to maintain the in-chamber environment, active and clean, on the workpiece joining surfaces. Furthermore, gases that create the same environment as within the storage facility 161 can be supplied to the chamber 162, creating the same environmental conditions as within the storage facility 161. This allows the environment within the storage facility 161 to be maintained more strictly when loading and unloading workpieces. The environmental conditions referred to here refer to conditions determined by the type of gas, components, component ratio, pressure, temperature, humidity, and the like. However, when describing the same environment, it is not necessary for all of the items listed here to be the same; it also includes conditions in which one or several of the items are the same.

[0083] (2) The chamber 162 is provided with an air blower 619 that generates a downflow of clean gas within the chamber 162. Therefore, the cleanliness of the workpieces can be maintained from the time the workpieces are carried into the chamber 162 until they are stored in the storage facility 161.

[0084] (3) The chamber 162 and the storehouse 161 are provided with openings 615, 612 for loading and unloading workpieces, respectively. The opening 615 of the chamber 162 is provided with a chamber-side shutter 616 that opens when a workpiece is loaded or unloaded into the chamber 162 and closes when a workpiece is loaded or unloaded into the storehouse 161. The opening 612 of the storehouse 161 is provided with a storehouse-side shutter 613 that opens when a workpiece is loaded or unloaded into the storehouse 161 and closes when a workpiece is loaded or unloaded into the chamber 162.

[0085] Therefore, when workpieces are loaded or unloaded into chamber 162, gas outside chamber 162 is prevented from flowing into storage 161, and changes in the environmental conditions inside storage 161 can be minimized. In other words, by using double doors and controlling the timing so that the doors do not open simultaneously, environmental changes inside storage 161 when workpieces are loaded or unloaded can be minimized. More specifically, when workpieces are loaded or unloaded into chamber 162, it is preferable to close opening 615 of chamber 162 and wait until the environment inside chamber 162 becomes the same as that inside storage 161, and then open opening 612 of storage 161 once the environment has become the same. This makes it possible to strictly maintain the environment inside storage 161.

[0086] (4) The chamber 162 includes a placement unit 617 on which a workpiece carried into the chamber 162 is placed, and a robot 618, which is a transport device that carries the workpiece placed on the placement unit 617 into and out of the storage facility 161. This allows the workpiece to be carried in and out automatically while maintaining the cleanliness of the storage facility 161.

[0087] (5) The storage facility 161 is provided with an irradiation device 614 that irradiates the workpieces with UV light. This allows the surface of the workpiece to be activated and cleaned. Furthermore, the activated and cleaned state of workpieces returned from the bonding unit 180 and stored again can be maintained, or they can be reactivated and re-cleaned. Furthermore, even workpieces that are not suitable for pretreatment, such as plasma surface treatment or cleaning, can be reactivated and re-cleaned. Furthermore, the workpieces can be returned to the surface treatment unit 100, the supply cleaning unit 110, or the mounting substrate cleaning unit 120 for reprocessing. This reduces the number of reprocessing steps, thereby preventing a decrease in processing efficiency.

[0088] [Modifications] (1) In the processing steps of the mounting apparatus 1, it is not always necessary to temporarily store the workpieces in a buffer device (supplier buffer unit 160, mounting substrate buffer unit 170) before bonding. If the bonding unit 180 is able to accept the workpieces, the workpieces may be carried directly to the bonding unit 180 without going through a buffer device. In this case, the workpieces are immediately put into the mounting process with their surfaces in the required activated and cleaned state, so there is little impact on the mounting strength, and operating efficiency can be improved without unnecessary storage time in a buffer device.

[0089] Furthermore, even if the bonding unit 180 is not ready to accept the work, the waiting time can be calculated from the processing status of the bonding unit 180, and if the waiting time is within a predetermined threshold time, the work can be left waiting without being stored in the buffer device. This threshold time can be the time required to maintain the surface state of the workpiece in the required activated and clean state, and can be determined in advance by experiment, etc.

[0090] Furthermore, the time required for the mounting process to be completed after the workpiece is carried into the bonding unit 180 is calculated, and if this time is within a threshold time that allows the surface state of the workpiece to be maintained in the required activated and clean state, the workpiece can be carried into the bonding unit 180 without being stored in a buffer device. If a waiting time occurs at this time, this waiting time can be taken into account.

[0091] In other words, when a workpiece is carried into the bonding unit 180, if a waiting time occurs due to the processing status of the bonding unit 180, it is possible to determine whether or not to store the workpiece in the buffer device based on that waiting time. This makes it possible to improve operating efficiency by avoiding unnecessary storage time in the buffer device. Furthermore, it is possible to reliably store the workpiece in the buffer device when necessary, thereby ensuring the necessary mounting strength for mounting.

[0092] Of course, if it is determined that a waiting time will occur, it is also possible to immediately accommodate the packet in the buffer device. As described above, it may be possible to select whether to determine whether to accommodate the packet in the buffer device depending on the waiting time, or to accommodate the packet immediately.

[0093] (2) The irradiation device 614 may be configured such that the light source is movable and scans along the surface of each workpiece, thereby irradiating the entire workpiece uniformly.

[0094] (3) The pretreatment control unit 250 can also perform surface treatment and cleaning again as appropriate, using both the elapsed time after surface treatment and the elapsed time after cleaning, depending on whether to prioritize the activated and cleaned state of the surface or the state of hydroxyl groups after cleaning. Furthermore, it is also possible to perform only the cleaning process without performing the surface treatment again. By selecting from a variety of processes in this way, it is possible to perform treatments that suit the various properties of the workpiece surface. This increases the number of applicable products (see FIG. 1).

[0095] If the pre-processing control unit 250 determines that a predetermined threshold time has elapsed during mounting at the bonding unit 180, it can perform surface treatment and cleaning again without transporting the component supply body TW or the mounting board BW to the bonding unit 180.

[0096] (4) A dedicated transport unit 190 can be provided separately to perform surface treatment and cleaning again. Furthermore, this dedicated transport unit 190 can be provided separately for the component supply unit TW and the mounting board BW. This allows the transport process for surface treatment and cleaning again to be performed in parallel with the normal transport unit 190, thereby realizing a highly productive mounting apparatus 1 with high-speed processing and parallel processing.

[0097] (5) In the above embodiment, two buffer sections, the supplier buffer section 160 for the component supplier TW and the mounting board buffer section 170 for the mounting board BW, are used. However, a single buffer section may be used. For example, as shown in FIG. 8 , a single chamber 162 may be provided with a storage section 161D for the component supplier TW and a storage section 161E for the mounting board BW, so that the chamber 162 is shared by the component supplier TW and the mounting board BW. In this case, as shown in the figure, a single robot 618 may be used to sort and store the workpieces in the storage section 161D and the storage section 161E. This allows the number of chambers 162 and transport devices (robots 618) to be reduced, thereby saving space, energy, and costs.

[0098] Furthermore, as shown in FIG. 9 , a placement unit 617D for the component supplier TW and a placement unit 617E for the mounting board BW may be provided within the shared chamber 162. This allows workpieces to be loaded into the chamber 162 without waiting even if the timing of loading / unloading between the component supplier TW and the mounting board BW coincides. Furthermore, even when one placement unit (617D or 617E) is accessed from outside the chamber 162 to load or unload a workpiece, the robot 618 can simultaneously access the other placement unit (617E or 617D), thereby shortening the takt time. Even in this case, the transport device within the chamber 162 can be a single robot 618. In this way, the number of chambers 162 and transport devices (robots 618) can be reduced, resulting in space savings, energy savings, and cost savings.

[0099] 10 , when the chamber 162 is shared, a single storage container 161 can be used for both the component supply TW and the mounting board BW. In this case, when the component supply TW is formed of a ring R that holds tape T to which electronic components E are attached, and the mounting board BW is a wafer, the component supply TW and the mounting board BW are different sizes, as in the case of a component supply TW formed of a ring R that holds tape T to which electronic components E are attached, and the mounting board BW is a wafer, the component supply TW and the mounting board BW can be stored in the storage container 161 using a common tray TR, allowing the single storage container 161 to be shared. The tray TR is sized to accommodate both the component supply TW and the mounting board BW. By configuring the storage container 161 to accommodate the tray TR, both the component supply TW and the mounting board BW can be loaded onto the tray TR, allowing the storage container 161 to be shared. Of course, even in this case, a single robot 618 can be used. This allows the chamber 162 to be made smaller and the number of robots 618 to be reduced, resulting in greater space savings, energy savings, and costs.

[0100] 11, a placement unit 617D for the component supplier TW and a placement unit 617E for the mounting board BW may be provided within the shared chamber 162. This allows the chamber 162 to be made smaller and the number of robots 618 to be reduced, thereby saving space, energy, and cost. Furthermore, even if the timing of loading and unloading coincides between the component supplier TW and the mounting board BW, workpieces can be loaded into the chamber 162 without waiting. Furthermore, even if one placement unit (617D or 617E) is accessed from outside the chamber 162 to load or unload a workpiece, the robot 618, which is a transport device, can simultaneously access the other placement unit (617E or 617D), thereby shortening the takt time.

[0101] [Other Embodiments] While the embodiments of the present invention and modifications of each part have been described above, these embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be embodied in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included within the scope and spirit of the invention, and are also included in the invention described in the claims.

[0102] 1 Mounting device 11 Base 12 Chamber 13 Load port 100 Surface treatment section 110 Supply body cleaning section 111 Cleaning chamber 111a Opening 111b Shutter 112 Support section 113 Rotation mechanism 114 Cup 115 Supply section 115a Nozzle 115b Moving mechanism 120 Mounting substrate cleaning section 130 Adjustment processing section 131 Irradiation device 140 Gauging section 150 Alignment section 160 Supply body buffer section 161, 161D, 161E Storage 161a Thermometer 161b Hygrometer 161c Pressure gauge 162 Chamber 163 In-chamber adjustment section 163a Air supply path 163b Gas supply device 163c Flow meter 163d Filter 163e Valve 163f Exhaust path 163g Valve 170 Mounting substrate buffer section 180 Bonding section 190 Transport section 191 Transport robot 191a Robot hand 192 Moving mechanism 200 Control section 210 Memory section 220 Input section 230 Display section 240 Temperature and humidity control section 250 Pre-processing control section 260 Irradiation control section 611 Support section 612 Opening 613 Storage side shutter 613a Opening / closing mechanism 614 Irradiation device 615 Opening 616 Chamber side shutter 616a Opening / closing mechanism 617, 617D, 617E Placement section 618 Robot 618a Robot hand 619 Air blower

Claims

1. A buffer device comprising: a storage facility for storing component supplies, which are workpieces in the form of wafers diced into electronic components attached to a tape attached to a ring, and mounting boards, which are workpieces on which the electronic components are mounted, after surface treatment and / or cleaning; a chamber for housing the storage facility; and an internal adjustment unit for adjusting the temperature, humidity, and pressure of gas within the storage facility independently of the chamber.

2. A buffer device according to claim 1, characterized in that said chamber is provided with an air blower for generating a downflow of clean gas within said chamber.

3. A buffer device as described in claim 1, characterized in that the chamber and the storehouse are each provided with an opening for loading and unloading the workpiece, the chamber opening is provided with a chamber-side shutter that opens when the workpiece is loaded or unloaded into the chamber and that closes when the workpiece is loaded or unloaded into the storehouse, and the storehouse opening is provided with a storehouse-side shutter that opens when the workpiece is loaded or unloaded into the storehouse and that closes when the workpiece is loaded or unloaded into the chamber.

4. A buffer device as described in claim 1, characterized in that the chamber has a placement section for placing the workpiece brought into the chamber, and a transport device for transporting the workpiece placed on the placement section into and out of the storage facility.

5. The buffer device according to claim 1, wherein the storage is provided with an irradiation device for irradiating the works with UV light.

6. A buffer device according to claim 1, characterized in that the storehouse stores the component supplier from which some of the electronic components have been detached and / or the mounting board on which the electronic components are mounted.

7. A mounting device comprising: a surface treatment section which uses plasma to treat the surface of a component supply having a wafer diced into electronic components attached to a tape attached to a ring and / or a mounting board on which the electronic components are mounted; a supply cleaning section which cleans the component supply; a mounting board cleaning section which cleans the mounting board; a buffer device as described in any of claims 1 to 6; a bonding section which detaches the electronic components from the component supply and mounts them on the mounting board; and a transport section which transports the component supply and the mounting board; and a pre-processing control section which, when a preset time has elapsed since the component supply or the mounting board was accommodated in the buffer device, causes any of the surface treatment section, the supply cleaning section or the mounting board cleaning section to perform cleaning and surface treatment again.

8. A surface treatment process in which a surface treatment section performs surface treatment, by plasma, on a component supply having a wafer affixed to a tape attached to a ring and singulated into electronic components, and / or a surface of a mounting board on which the electronic components are mounted; a supply cleaning process in which a supply cleaning section cleans the component supply; a mounting board cleaning process in which a mounting board cleaning section cleans the mounting board; a supply accommodating process in which a supply buffer device is provided in a chamber and the component supply is temporarily accommodated in a housing having an internal gas controlled independently of the chamber; a mounting board accommodating process in which a mounting board buffer device is provided in a chamber and the mounting board is temporarily accommodated in a housing having an internal gas controlled independently of the chamber; and a bonding process in which a bonding section detaches the electronic components from the component supply and mounts them on the mounting board, wherein when a preset time has elapsed since the component supply was accommodated in the supply accommodating process, the surface treatment process and / or the supply cleaning process are performed again, performing the surface treatment step and / or the mounting substrate cleaning step again when a preset time has elapsed since the mounting substrate was accommodated in the mounting substrate accommodation step.

Images