Mounting device and mounting method

Abstract

Provided are a mounting device and a mounting method with which it is possible to reduce bonding failure due to the lapse of time from preprocessing of an electronic component and a mounting substrate to bonding. A mounting device 1 according to an embodiment comprises: a supply body cleaning unit 110; a mounting substrate cleaning unit 120; a surface processing unit 100 for processing the surfaces of a component supply body TW and a mounting substrate BW; a bonding unit 180 that mounts an electronic component E on the component supply body TW onto the mounting substrate BW; a supply body buffer unit 160 and a mounting substrate buffer unit 170 for temporarily housing the component supply body TW and the mounting substrate BW; a conveyance unit 190; and a control unit 240 for performing control so that cleaning processing of the component supply body TW and cleaning processing of the mounting substrate BW are performed simultaneously in parallel with each other.

Description

Mounting device and mounting method

[0001] The present invention relates to a mounting apparatus and a mounting method.

[0002] Direct bonding is a method for mounting electronic components such as semiconductor chips onto a mounting substrate. Direct bonding is a method in which the connection terminals of the mounting substrate and electronic components are directly bonded together by solid-state bonding, without using bonding materials (adhesives) such as solder bumps. This eliminates the need to consider the influence of bonding materials, allows for narrow spacing between connection terminals, and enables high-density packaging.

[0003] When electronic components are directly bonded to a mounting substrate, pretreatment is performed on the electronic components and mounting substrate beforehand. This pretreatment involves surface treatments such as activation and cleaning, as well as cleaning. Activation is a process in which the surfaces of electronic components and mounting substrates are activated by active species such as ions and radicals generated by converting reactive gases into plasma. Activation refers to the severing of chemical bonds between molecules on the surfaces. Cleaning is a process in which the surfaces of electronic components and mounting substrates are cleaned by the generated active species such as ions and radicals. Cleaning refers to the removal of particles adhering to the surface by flicking them off or the decomposition and removal of organic matter. Cleaning is a process in which particles remaining on the surfaces of electronic components and mounting substrates are removed.

[0004] Japanese Patent Application Publication No. 6-302486

[0005] The surface condition of electronic components and mounting boards that have undergone the above pretreatment may gradually deactivate over time or organic matter may adhere to the surface, causing changes. This can lead to a decrease in bonding strength. If the bonding strength is insufficient, the bonding will be poor, leading to product defects.

[0006] Furthermore, in bonding processes using a bonding device that tightly attaches electronic components to a mounting substrate, when multiple electronic components are mounted on a single mounting substrate, the timing of supplying the mounting substrate and electronic components to the bonding device may not coincide. There are also differences in the preparation time required for electronic components and mounting substrates after activation and cleaning processes before they can be loaded into the bonding device. Such differences in the timing and number of processes (number of mountings) during the bonding process (mounting process) of electronic components and mounting substrates result in differences in the surface condition at the time of bonding, increasing the possibility of deactivation or organic matter adhesion to either the electronic components or the mounting substrate.

[0007] An object of the embodiments of the present invention is to provide a mounting apparatus and a mounting method that can reduce bonding defects that occur due to the lapse of time from pre-processing of an electronic component and a mounting substrate to bonding processing.

[0008] The mounting apparatus of the embodiment includes a load port on which a transport container is mounted that contains a component supply body, which has an unprocessed or processed tape attached to a ring and has wafers diced into electronic components attached thereto, and a mounting substrate on which the electronic components are to be mounted; a supply body cleaning unit that cleans the component supply body; a mounting substrate cleaning unit that cleans the mounting substrate; a surface processing unit that performs surface processing on the surface of the component supply body and / or the mounting substrate with plasma; an adjustment processing unit that adjusts the tape by irradiating UV light onto the tape so that the adhesive strength of the tape is reduced; a bonding unit that detaches the electronic components from the component supply body and mounts them on the mounting substrate; the component supply unit includes a supply buffer unit that temporarily stores component supplies; a mounting substrate buffer unit that temporarily stores the mounting substrates before they are carried into the bonding unit; a transport unit that transports the component supplies and the mounting substrates; and a control unit that controls the transport unit to transport the component supplies and / or the mounting substrates from the supply buffer unit, the mounting substrate buffer unit, or the bonding unit to any one of the supply cleaning unit, the mounting substrate cleaning unit, or the surface treatment unit, and the control unit further controls the supply cleaning unit, the mounting substrate cleaning unit, and the transport unit so as to include a state in which the cleaning process of the component supply unit and the cleaning process of the mounting substrate are performed simultaneously in parallel with each other.

[0009] The mounting method of the embodiment includes: a loading step in which a transport container is loaded onto a load port, the transport container containing a component supply unit, which has unprocessed or processed tape attached to a ring and on which wafers diced into electronic components are attached, and a mounting substrate on which the electronic components will be mounted; a surface treatment step in which a surface treatment unit performs surface treatment on a surface of the component supply unit and / or the mounting substrate with plasma; a supply cleaning step in which a supply unit cleaning unit cleans the component supply unit; a mounting substrate cleaning step in which the mounting substrate cleaning unit cleans the mounting substrate so as to include a state in which the supply unit cleaning step is performed simultaneously with the supply unit cleaning step; an adjustment step in which an adjustment unit irradiates UV light onto the tape to adjust the tape so that its adhesive strength is reduced; a supply accommodating step in which a supply buffer unit temporarily accommodates the component supply unit; a mounting substrate accommodating step in which a mounting substrate buffer unit temporarily accommodates the mounting substrate; and a bonding step in which a bonding unit detaches the electronic components from the component supply unit and mounts them on the mounting substrate.

[0010] The embodiment of the present invention can reduce bonding defects that occur due to the lapse of time from pre-processing of the electronic component and the mounting substrate to bonding processing.

[0011] FIG. 1 is an explanatory diagram showing processing of a mounting apparatus according to an embodiment; FIG. 2 is a simplified perspective plan view showing the configuration of a mounting apparatus according to an embodiment; FIG. 3 is a simplified configuration diagram showing a supplier cleaning unit and a mounting substrate cleaning unit of a mounting apparatus; FIG. 4 is a block diagram showing a control unit; FIG. 5 is a flowchart showing an operation procedure of an embodiment; FIG. 6 is a timing chart showing an operation procedure of an embodiment; and FIG. 7 is a flowchart showing an operation procedure of a return mode of an embodiment.

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the drawings are schematic diagrams, and the size, proportions, etc. of each part are exaggerated for ease of understanding.

[0013] [Overview] In this embodiment, as shown in FIG. 1 , processing is performed on a component supply TW and a mounting board BW. The component supply TW is a wafer (semiconductor wafer) W attached to tape T attached to a ring R. At this time, the wafer W is singulated into electronic components E. The tape T is a stretchable sheet with an adhesive surface, and its adhesive strength can be reduced by irradiation with UV (ultraviolet) light. The mounting board BW is a wafer (semiconductor wafer) onto which electronic components E detached from the component supply TW are bonded (mounted). In the following description, processing on the component supply TW refers to processing on the electronic components E.

[0014] As shown in FIG. 2 , the mounting apparatus 1 of this embodiment is an apparatus that performs pre-processing (activation processing, cleaning processing, washing processing) on ​​component supplies TW and mounting boards BW, which are supplied in multiple sheets housed in a transport container F such as a FOUP (Front Opening Unified Pod) or a FOSB (Front Opening Shipping Box) in a pre-process, one by one, and mounts electronic components E.

[0015] The mounting apparatus 1 is configured by arranging multiple chambers 12 housing various processing devices around a base 11, which is a box-shaped container. The base 11 is provided with a load port 13 on which a transfer container F is mounted. A transfer container F housing unprocessed component supplies TW and mounting boards BW is mounted on the load port 13, and the component supplies TW and mounting boards BW are removed one by one from the transfer container F by a transfer unit 190, and are carried into each chamber 12, processed, and then carried out. In addition, a fan filter unit (FFU) (not shown) is provided on the ceiling of the base 11, and a downflow of clean air is generated to maintain a clean atmosphere inside the base 11. Such an FFU may also be provided in the chambers 12 as needed.

[0016] The mounting apparatus 1 of this embodiment includes a pre-processing device that performs pre-processing including activation processing, cleaning processing, and washing processing of electronic components E, a buffer device that temporarily accommodates component suppliers TW and mounting boards BW, and a bonding device that presses the electronic components E onto the mounting boards BW.

[0017] More specifically, the mounting apparatus 1 of this embodiment is an apparatus including a surface treatment section 100, a supply cleaning section 110, a mounting substrate cleaning section 120, an adjustment treatment section 130, a gauging section 140, an alignment section 150, a supply buffer section 160, a mounting substrate buffer section 170, a bonding section 180, a transport section 190, and a control section 200.

[0018] The pre-processing device is made up of a surface treatment section 100, a supply cleaning section 110, a mounting substrate cleaning section 120, an adjustment treatment section 130, a gauging section 140, and an alignment section 150. The buffer device is made up of a supply buffer section 160 and a mounting substrate buffer section 170. The bonding device is made up of a bonding section 180. A transport device, which is a transport section 190, is configured to transfer workpieces to each device. Each device is controlled by a control section 200, and the mounting device 1 is made up.

[0019] [Surface Treatment Unit] The surface treatment unit 100 is a treatment chamber that performs surface treatment on the component supply body TW and the mounting substrate BW. The surface treatment is a process that modifies (activates and cleans) the surfaces where the component supply body TW and the mounting substrate BW are bonded. This modification also provides a hydrophilic effect. The surface treatment unit 100 of this embodiment has a plasma generator that converts a reactive gas introduced into the vacuum chamber 12 into plasma, and irradiates the generated ions onto the surfaces where the component supply body TW and the mounting substrate BW are bonded, thereby modifying each surface.

[0020] [Supplier Cleaning Section] The supplier cleaning section 110 is a processing chamber that cleans the component supplier TW. The supplier cleaning section 110 uses water to clean particles remaining on the plasma-treated component supplier TW or particles generated by the plasma treatment. The cleaning targets are the surfaces of the electronic components E, the spaces between the electronic components E, and the adhesive surface of the tape T, and particles adhering to these surfaces are cleaned and removed. In addition to the water cleaning, hydroxyl groups are also added to the surfaces of the electronic components E.

[0021] 3, the supplier cleaning unit 110 includes a cleaning chamber 111 which is a container in which the cleaning process is performed, a support part 112 which supports the component supplier TW, a rotation mechanism 113 which rotates the support part 112, a cup 114 which receives the scattering cleaning liquid L from around the component supplier TW, and a supplier 115 which supplies the cleaning liquid L. The supplier 115 is provided with a nozzle 115a which drips the cleaning liquid L and a moving mechanism 115b which moves the nozzle 115a.

[0022] The cleaning process is performed by supplying cleaning liquid L from a nozzle 115a to the surface to be treated of the component supply TW, which is supported by a support part 112 and rotated by a rotation mechanism 113. DIW, for example, is used as the cleaning liquid L. The cleaning chamber 111 is provided with an opening 111a through which the component supply TW is carried in and out, and the opening 111a is configured to be openable and closable by a shutter 111b.

[0023] The rotation mechanism 113 of the supply cleaning unit 110 is equipped with an expanding unit (not shown) that stretches (expands) the tape T of the supply cleaning unit 110 supported by the support unit 112 to widen the gap between the electronic components E and also clean any particles in that gap.

[0024] [Mounting Substrate Cleaning Unit] The mounting substrate cleaning unit 120 is a processing chamber that cleans the mounting substrate BW. The mounting substrate cleaning unit 120 uses water to clean particles remaining on the plasma-treated mounting substrate BW or particles generated by the plasma processing. In addition to the water cleaning, hydroxyl groups are also added to the surface of the mounting substrate BW. Similar to the supplier cleaning unit 110 shown in FIG. 3 , the mounting substrate cleaning unit 120 includes a cleaning chamber 111 that is a container in which the cleaning process is performed, a support unit 112 that supports the mounting substrate BW, a rotation mechanism 113 that rotates the support unit 112, a cup 114 that receives the cleaning liquid L that splashes from around the mounting substrate BW, and a supply unit 115 that supplies the cleaning liquid L.

[0025] [Adjustment Processing Unit] The adjustment processing unit 130 adjusts the tape T on the cleaned component supply unit TW by irradiating it with UV light, thereby reducing the adhesive strength of the tape T. As shown in FIG. 1 , the adjustment processing unit 130 has an irradiation device 131 that irradiates the entire area below the accommodated component supply unit TW with UV light by scanning a UV light source.

[0026] [Gauging Unit] The gauging unit 140 positions the component supply unit TW. The gauging unit 140 is a contact-type centering device that adjusts the position by contacting the outer periphery of the component supply unit TW so that the center of the component supply unit TW coincides with a reference position set inside.

[0027] [Alignment Unit] The alignment unit 150 positions the mounting substrate BW. The alignment unit 150 is a non-contact (optical) centering device that adjusts the position of the mounting substrate BW so that the center of the mounting substrate BW coincides with a reference position provided inside.

[0028] [Supplier Buffer Section] The supplier buffer section 160 temporarily stores component suppliers TW before they are carried into the bonding section 180. As shown in FIG. 1 , the supplier buffer section 160 has a storehouse 161 that can store multiple component suppliers TW stacked at intervals.

[0029] [Mounting Board Buffer Section] The mounting board buffer section 170 temporarily stores the mounting boards BW before they are carried into the bonding section 180. The mounting board buffer section 170 has a storage 171 that can store multiple mounting boards BW stacked at intervals.

[0030] [Bonding Section] The bonding section 180 is a processing chamber that detaches electronic components E from the component supply body TW and mounts them on the mounting board BW. Although not shown, the bonding section 180 includes a supply mechanism, a pickup mechanism, and a mounting mechanism. The pickup mechanism picks up the electronic components E from the component supply body TW that have been carried into the supply mechanism, transfers them to the mounting mechanism, and mounts them on the mounting board BW that has been carried into the mounting mechanism. Note that, as shown in FIG. 1 , the bonding section 180 of this embodiment flips the picked-up electronic components E and mounts the pre-treated surface on the surface of the mounting board BW that has also been pre-treated.

[0031] [Transport Unit] The transport unit 190 transports component supply units TW and mounting boards BW between the load port 13 and each chamber 12, and between each chamber 12. As shown in FIG. 2 , the transport unit 190 has a transport robot 191 and a moving mechanism 192. The transport robot 191 is of a double-arm type and has a pair of robot hands 191a. One of the pair of robot hands 191a can support the component supply unit TW, and the other can support the mounting board BW. The moving mechanism 192 moves the transport robot 191 and positions it at the load port 13 and each chamber 12. The robot hand 191a loads and unloads the component supply units TW and mounting boards BW into and out of each transport container F and each chamber 12.

[0032] [Control Unit] The control unit 200 is a computer that controls each unit of the mounting apparatus 1. The control unit 200 has a processor that executes programs, a memory that stores various information such as the programs and operating conditions, and a drive circuit that drives each element. That is, the control unit 200 controls the surface treatment unit 100, the supply element cleaning unit 110, the mounting substrate cleaning unit 120, the adjustment treatment unit 130, the gauging unit 140, the alignment unit 150, the supply element buffer unit 160, the mounting substrate buffer unit 170, the bonding unit 180, and the transport unit 190. As shown in FIG. 4 , the control unit 200 has a memory unit 210 that stores information, an input unit 220 that inputs information, and a display unit 230 that displays information.

[0033] The control unit 200 in this embodiment controls the transport unit 190 to transport the component supply TW and / or the mounting board BW from the supply buffer unit 160, the mounting board buffer unit 170, or the bonding unit 180 to either the supply cleaning unit 110, the mounting board cleaning unit 120, or the surface treatment unit 100.

[0034] That is, the transport unit 190 is controlled by the control unit 200 so as to transport the component supply units TW accommodated in the supply unit buffer unit 160 to the surface treatment unit 100 or the supply unit cleaning unit 110. Similarly, the transport unit 190 is controlled by the control unit 200 so as to transport the mounting substrate BW accommodated in the mounting substrate buffer unit 170 to the surface treatment unit 100 or the mounting substrate cleaning unit 120. Furthermore, the transport unit 190 is controlled by the control unit 200 so as to transport the component supply units TW and the mounting substrate BW from the bonding unit 180 to the surface treatment unit 100, the supply unit cleaning unit 110, and the mounting substrate cleaning unit 120.

[0035] By this transport, the workpieces (component supply body TW, mounting board BW) that have undergone surface treatment or cleaning treatment are returned to the surface treatment section 100, supply body cleaning section 110, or mounting board cleaning section 120, where they are treated again in each section. There is no limit to the number of times that such re-treatment can be carried out by returning the workpieces, and they can be repeated as many times as necessary.

[0036] The control unit 200 is also configured to be able to switch whether the transport unit 190 transports the component supply TW and / or the mounting board BW from the supply buffer unit 160, the mounting board buffer unit 170 or the bonding unit 180 to either the supply cleaning unit 110, the mounting board cleaning unit 120 or the surface treatment unit 100, or to the transport container F of the load port 13.

[0037] The mounting apparatus 1 of this embodiment normally performs a single pre-processing of surface treatment and cleaning on the workpiece before bonding. This process is repeated until all electronic components E are bonded to the mounting area of ​​the mounting board BW. This mode in which bonding is performed with only a single pre-processing is called the normal mode. As will be described later, in some cases, the pre-processing can be repeated. In other words, a workpiece that has already been pre-processed is subjected to pre-processing again. This mode in which pre-processing is repeated and then re-processed is called the return mode, since the workpiece is returned to pre-processing again.

[0038] Furthermore, the control unit 200 of this embodiment has a cleaning control unit 240. The cleaning control unit 240 controls the supply item cleaning unit 110, the mounting substrate cleaning unit 120, and the transport unit 190 so as to include a state in which the cleaning process of the component supply item TW and the cleaning process of the mounting substrate BW are performed simultaneously in parallel. Performed simultaneously in parallel does not mean that the start and end of the cleaning of the component supply item TW (supply item cleaning process) need to completely coincide with the start and end of the cleaning of the mounting substrate BW (mounting substrate cleaning process), as long as there is some overlap in time between the two processes.

[0039] The control unit 200 also has a normal mode processing unit 241 and a return mode processing unit 242. The normal mode processing unit 241 executes a normal mode in which surface treatment is performed on the component supply body TW or the mounting board BW transported from the load port 13, and electronic components E are mounted on the mounting board BW in the bonding unit 180. In the normal mode, for example, the surface processing unit 100 performs surface treatment once on the component supply body TW and / or the mounting board BW.

[0040] The return mode processing unit 242 executes a return mode in which the component supply body TW or the mounting substrate BW transported from the supply body buffer unit 160, the mounting substrate buffer unit 170, or the bonding unit 180 undergoes surface treatment repeatedly, thereby re-processing the pre-treatment. The return mode may also be referred to as a repeat mode. In other words, the repeat here refers to the re-processing of workpieces (component supply body TW and / or mounting substrate BW) that have undergone pre-treatment such as surface treatment or cleaning once. In the return mode, for example, the same processing as in the normal mode is performed, but cleaning is performed multiple times by the supply body cleaning unit 110 and the mounting substrate cleaning unit 120. In other words, plasma treatment is performed repeatedly, or the surfaces of the component supply body TW and the mounting substrate BW are repeatedly cleaned. To avoid any misunderstanding, repeating plasma treatment here does not mean performing plasma treatment multiple times on the component supply body TW and / or the mounting substrate BW while they remain in the surface processing unit 100. Furthermore, the component supply body TW and / or the mounting board BW are not repeatedly taken in and out of the surface treatment section 100 without being transported from the surface treatment section 100 to another treatment section, and plasma treatment is not performed multiple times.

[0041] The control unit 200 is also configured to be able to selectively switch between executing the normal mode by the normal mode processing unit 241 and executing the return mode by the return mode processing unit 242. That is, the control unit 200 has a selection unit 250 that selectively switches between the normal mode and the return mode. For example, the selection unit 250 selects the return mode when an electronic component E is to be mounted on a mounting board BW on which an electronic component E has already been mounted, and selects the normal mode otherwise. Examples of cases in which an electronic component E is mounted on a mounting board BW on which an electronic component E has already been mounted include a case in which an electronic component E is mounted on a partial region of the mounting board BW and then a different type of electronic component E is mounted on another region, and a case in which an electronic component E is mounted on top of an electronic component E mounted on the mounting board BW.

[0042] For example, driver chips, cache memory elements, etc. are mounted around the arithmetic processing unit, image sensor, etc. In this case, the arithmetic processing unit, image sensor, etc. are mounted in the entire mounting area of ​​the mounting board BW, and then the component supply unit TW is replaced and the elements to be mounted around them are mounted. The mounting board BW waits while the component supply unit TW is replaced. Also, since multiple types of electronic components E are mounted, the mounting board BW stays at the bonding unit 180 for a long time. As a result, the surface condition of the mounting board BW gradually becomes unsuitable for bonding. Therefore, the mounting board BW is temporarily removed from the bonding unit 180 and reprocessed. This type of processing is also applicable when, for example, memory elements are stacked.

[0043] When stacking memory elements, the picked-up electronic component E, which is the memory element, is flipped over and the pre-treated surface is mounted on the mounting board BW. However, in this case, the surface of the mounted electronic component E is not modified by surface treatment. In other words, when stacking electronic components E, mounting is performed on the surface of the electronic component E that has not been surface-treated. In such a case, it is necessary to perform surface treatment and cleaning on the exposed surface of the flipped and mounted electronic component E using the return mode.

[0044] Information regarding whether or not an electronic component E will be mounted on a mounting board BW on which an electronic component E has already been mounted is input in advance by the input unit 220 and stored in the storage unit 210. The selection unit 250 uses this information to select in advance whether the process to be performed by the mounting apparatus 1 will be in normal mode or return mode. When the processing mode is determined in advance from the stored information in this manner, the normal mode is selected for at least the first process of mounting an electronic component E on a mounting board BW, and the return mode is selected next to reprocess the mounting board BW. In other words, when an electronic component E will be mounted on a mounting board BW on which an electronic component E has already been mounted, the return mode is selected for that mounting board BW.

[0045] Furthermore, the selection unit 250 can select either the normal mode or the return mode depending on the time that has elapsed since the surface treatment of the component supply body TW and the mounting board BW. That is, the selection unit 250 measures how much time has elapsed since the surface treatment at the time of transporting the component supply body TW and the mounting board BW to the bonding unit 180, and selects the return mode if a preset time has elapsed. The time here is preferably an allowable time from the surface treatment until the component supply body TW and the mounting board BW are transported to the bonding unit 180.

[0046] The allowable time is set on the condition that the surface condition of the electronic component E and the surface condition of the mounting board BW are within an allowable range for the mounting strength. In other words, it is set as a time that will not cause the surface condition to deteriorate to an unacceptable extent for the mounting strength. Such a time is determined in advance through experiments, etc. Note that, as long as the mounting strength is within an allowable range, it is allowable even if the activation state of the bonding surfaces of the electronic component E and the mounting board BW gradually decreases or the cleanliness gradually decreases.

[0047] The time compared with this preset time may be any time that allows determination of whether it is within an allowable time. For example, instead of the elapsed time after surface treatment, the elapsed time since the substrate was accommodated in the supply buffer unit 160 or the mounting substrate buffer unit 170 may be measured, and the return mode may be selected when the preset time has elapsed. Alternatively, if the surface condition is maintained while the substrate is accommodated in the supply buffer unit 160 or the mounting substrate buffer unit 170, the return mode may be selected when the time elapsed since the surface treatment was completed minus the time spent in the supply buffer unit 160 or the mounting substrate buffer unit 170 exceeds the preset time.

[0048] In this way, the selection unit 250 can initially select the normal mode to start the mounting process, and then switch to the return mode during the process based on the elapsed time in a specific step during the process.

[0049] In this embodiment, since the cleaning process is also performed again in the return mode, when the control unit 200 selects the return mode, it causes the transport unit 190 to carry out the component supply unit TW from the supply unit buffer unit 160 and carry it into the surface treatment unit 100, and to carry out the mounting board BW from the mounting board buffer unit 170 and carry it into the surface treatment unit 100. After the surface treatment in the surface treatment unit 100, the transport unit 190 carries the component supply unit TW and the mounting board BW into the supply unit cleaning unit 110 and the mounting board cleaning unit 120, respectively, where they are cleaned.

[0050] [Operation] The operation of the mounting apparatus 1 of this embodiment as described above will be described with reference to the flowchart of Fig. 5, the timing chart of Fig. 6, and the flowchart of Fig. 7, in addition to Figs. 1 to 4. A mounting method for mounting an electronic component E on a mounting board BW according to the following procedure is also one aspect of this embodiment. Note that the following description follows the flowcharts of Figs. 5 and 7, but as shown in Fig. 6, it also includes a state in which each process is performed simultaneously in parallel.

[0051] 2, a transport container F containing a component supply TW and a transport container F containing a mounting board BW are loaded onto the load port 13 (loading step). The transport robot 191 receives the component supply TW from the transport container F at the load port 13, transports the component supply TW to the surface treatment section 100, and activates and cleans the surfaces of the electronic components E by plasma treatment (supply surface treatment step: step S101). While the surface treatment of the component supply TW is being performed, the transport robot 191 receives the mounting board BW from the transport container F. The transport robot 191 receives the component supply TW after surface treatment from the surface treatment section 100, and transports the mounting board BW to the surface treatment section 100. In the surface treatment section 100, the surface of the mounting board BW is activated and cleaned by plasma treatment (mounting board surface treatment step: step S102).

[0052] The transport robot 191 delivers the component supply TW, for which surface treatment has been completed, to the support unit 112 of the supply cleaning unit 110. The supply cleaning unit 110 cleans the component supply TW by supplying cleaning liquid L while rotating the component supply TW using the support unit 112 and the rotation mechanism 113 (supply supply cleaning step: step S103). At this time, the tape T of the component supply TW is expanded by the expanding unit, and the electronic components E are cleaned in a state in which the intervals between them are widened. After cleaning by supplying cleaning liquid L, the component supply TW is then rotated at high speed to shake off the cleaning liquid L and dry, and then the expanding unit releases the tape T to contract it to its original state, restoring the intervals between the electronic components E to their original state.

[0053] After the surface treatment of the mounting substrate BW in the surface treatment section 100 is completed, the transport robot 191 receives the mounting substrate BW from the surface treatment section 100 and transfers it to the mounting substrate cleaning section 120. The mounting substrate cleaning section 120 cleans the mounting substrate BW by supplying cleaning liquid L while rotating the mounting substrate BW (mounting substrate cleaning step: step S104). After supplying cleaning liquid L and cleaning, the mounting substrate BW is then rotated at high speed to shake off the cleaning liquid L and dry it. As shown by the dotted rectangle in FIG. 6 , this mounting substrate cleaning step includes a state in which it is performed simultaneously with the supply body cleaning step. In other words, the time during which the component supply body TW is cleaned and the time during which the mounting substrate BW is cleaned overlap.

[0054] After the cleaning process of the component supply TW is completed, the transport robot 191 receives the component supply TW from the supply cleaning unit 110 and transfers it to the gauging unit 140. The gauging unit 140 aligns the component supply TW (positioning step: step S105). After the alignment is complete, the transport robot 191 receives the component supply TW from the gauging unit 140 and transfers it to the adjustment processing unit 130. The adjustment processing unit 130 performs an adjustment process to reduce the adhesive strength of the tape T by irradiating the component supply TW with UV light (adjustment step: step S106). These positioning and adjustment steps overlap with the mounting substrate cleaning step, as shown in FIG. 6 .

[0055] After the cleaning process of the mounting substrate BW is completed, the transfer robot 191 receives the mounting substrate BW from the mounting substrate cleaning unit 120 and delivers it to the alignment unit 150. In the alignment unit 150, the mounting substrate BW is aligned (positioning step: step S107).

[0056] After the adjustment process of the component supply unit TW is completed, the transport robot 191 receives the component supply unit TW from the adjustment processing unit 130 and hands it over to the supply unit buffer unit 160. After the alignment of the mounting board BW is completed, the transport robot 191 receives the mounting board BW from the alignment unit 150 and hands it over to the mounting board buffer unit 170.

[0057] In this way, the component supply items TW and the mounting boards BW are accommodated in the supply item buffer section 160 and the mounting board buffer section 170 (accommodation step: step S108), and when the bonding section 180 becomes ready to accept them, the transport robot 191 receives the component supply items TW and the mounting boards BW and hands them over to the bonding section 180. That is, in response to a signal from the bonding section 180 indicating that they are ready to accept, the transport robot 191 removes the component supply items TW and the mounting boards BW from the supply item buffer section 160 and the mounting board buffer section 170 and carries them into the bonding section 180. In the bonding section 180, the electronic components E are picked up from the component supply items TW and mounted on the mounting boards BW (mounting step: step S109).

[0058] In addition, if the bonding unit 180 is not performing any processing or has completed processing after the surface treatment and / or cleaning, the component supply body TW and the mounting board BW can be supplied directly to the bonding unit 180 without going through the supply body buffer unit 160 and the mounting board buffer unit 170.

[0059] In the normal mode, during mounting, the transport robot 191 receives the next component supply TW and mounting board BW from the transport container F of the load port 13, and performs the same processing as above for the second and subsequent sheets. After mounting of the first sheet is completed, the transport robot 191 receives the component supply TW and mounting board BW from the bonding unit 180 between processing of the second and subsequent sheets, and transports and hands them over to the transport container F of the load port 13.

[0060] The above operations are repeated to mount electronic components E on the mounting board BW, and when the supply of the component supplier TW and / or the mounting board BW is completed, the mounting process is completed.

[0061] Note that the return mode is selected in advance when an electronic component E is mounted on a portion of the mounting substrate BW and then a different type of electronic component E is mounted on another portion, or when an electronic component E is mounted on top of an electronic component E already mounted on the mounting substrate BW. The operational procedure in this case will be described with reference to the flowchart in FIG. 7 . First, the transfer robot 191 receives the mounting substrate BW from the bonding unit 180 and transfers it to the surface treatment unit 100. The surface treatment unit 100 reactivates and re-cleans the surface of the mounting substrate BW using plasma treatment (mounting substrate re-surface treatment step: step S201). After the surface treatment of the mounting substrate BW in the surface treatment unit 100 is completed, the transfer robot 191 receives the mounting substrate BW from the surface treatment unit 100 and transfers it to the mounting substrate cleaning unit 120. The mounting substrate cleaning unit 120 rotates the mounting substrate BW and supplies cleaning liquid L to re-clean it (mounting substrate re-cleaning treatment step: step S202).

[0062] After the cleaning process for the mounting substrate BW is completed, the transport robot 191 receives the mounting substrate BW from the mounting substrate cleaning unit 120 and transfers it to the alignment unit 150. The alignment unit 150 aligns the mounting substrate BW (positioning step: step S203). After the alignment of the mounting substrate BW is complete, the transport robot 191 receives the mounting substrate BW from the alignment unit 150 and transfers it to the mounting substrate buffer unit 170 (accommodation step: step S204). The transport robot 191 sequentially receives the mounting substrates BW that have been accommodated in the mounting substrate buffer unit 170 for the longest time, and transfers them to the bonding unit 180. In the bonding unit 180, electronic components E are picked up from the component supplier TW and bonded to an unmounted area of ​​the mounting substrate BW or to an electronic component E already mounted thereon (mounting step: step S205). The electronic components E may be the same or different electronic components E.

[0063] Furthermore, the selection unit 250 selects the return mode when a preset time has elapsed while a component supplier TW accommodated in the supplier buffer unit 160 or a mounting board BW accommodated in the mounting board buffer unit 170 is waiting before being transported to the bonding unit 180. In this case, the transport robot 191 takes out the component supplier TW from the supplier buffer unit 160 or the mounting board BW from the mounting board buffer unit 170, and carries it into the surface treatment unit 100. Thereafter, surface treatment and cleaning are performed in the same manner as described above.

[0064] [Effects] (1) The mounting apparatus 1 of this embodiment as described above includes a load port 13 on which a transport container F is mounted, which contains a component supply TW in which wafers W singulated into electronic components E are attached to tape T attached to a ring R, either unprocessed or processed, and a mounting board BW on which the electronic components E are mounted; a supply cleaning unit 110 that cleans the component supply TW; a mounting board cleaning unit 120 that cleans the mounting board BW; a surface treatment unit 100 that performs surface treatment on the surfaces of the component supply TW and / or the mounting board BW with plasma; an adjustment processing unit 130 that adjusts the tape T so that the adhesive strength of the tape T is reduced by irradiating UV light on the tape T; a bonding unit 180 that detaches the electronic components E from the component supply TW and mounts them on the mounting board BW; The system includes a supply buffer section 160 that temporarily stores the previous component supply TW, a mounting substrate buffer section 170 that temporarily stores the mounting substrate BW before it is carried into the bonding section 180, a transport section 190 that transports the component supply TW and the mounting substrate BW, and a control section 200 that controls the transport section 190 to transport the component supply TW and / or the mounting substrate BW from the supply buffer section 160, the mounting substrate buffer section 170, or the bonding section 180 to any one of the supply cleaning section 110, the mounting substrate cleaning section 120, or the surface treatment section 100, and the control section 200 further controls the supply cleaning section 110, the mounting substrate cleaning section 120, and the transport section 190 so as to include a state in which the cleaning process of the component supply TW and the cleaning process of the mounting substrate BW are performed simultaneously in parallel with each other.

[0065] The mounting method of this embodiment includes a loading step in which a transport container F containing a component supply TW, which is an unprocessed or processed tape T attached to a ring R and has wafers W diced into electronic components E attached thereto, and a mounting substrate BW on which the electronic components E are to be mounted, is loaded onto the load port 13; a surface treatment step in which the surface treatment section 100 performs surface treatment on the surfaces of the component supply TW and / or the mounting substrate BW with plasma; a supply cleaning step in which the supply cleaning section 110 cleans the component supply TW; is performed simultaneously in parallel with the supply body cleaning process, the supply body cleaning process includes a mounting substrate cleaning process for cleaning the mounting substrate BW, an adjustment process in which the adjustment processing unit 130 adjusts the tape T so that the adhesive strength of the tape T is reduced, a supply body accommodating process in which the supply body buffer unit 160 temporarily accommodates the component supply body TW, a mounting substrate accommodating process in which the mounting substrate buffer unit 170 temporarily accommodates the mounting substrate BW, and a bonding process in which the bonding unit 180 detaches the electronic component E from the component supply body TW and mounts it on the mounting substrate BW.

[0066] In this way, by processing the component supply TW and the mounting board BW in one device, continuous processing can be performed in a clean environment. This suppresses changes in the surface condition of the electronic components E and the mounting board BW, which contribute to bonding, over time, and allows processing while maintaining an active and clean state. This prevents weakening of the bonding strength.

[0067] Furthermore, by providing the supply body cleaning unit 110 and the mounting substrate cleaning unit 120, the cleaning process for the mounting substrate BW can be performed while the cleaning process for the component supply body TW is being performed (the time indicated by the dotted line in FIG. 6), thereby reducing the time lag between the pre-processing of the component supply body TW and the pre-processing of the mounting substrate BW. This reduces the waiting time from pre-processing to mounting, and allows mounting to be performed while maintaining the surfaces of the component supply body TW and the mounting substrate BW in an active and clean state, thereby suppressing a decrease in bonding strength.

[0068] (2) The control unit 200 is configured to be able to switch whether the transport unit 190 transports the component supply TW and / or the mounting board BW from the supply buffer unit 160, the mounting board buffer unit 170, or the bonding unit 180 to either the supply cleaning unit 110, the mounting board cleaning unit 120, or the surface treatment unit 100, or to the transport container F of the load port 13.

[0069] This makes it possible to activate and clean mounting substrates BW and component suppliers TW that are inactive, uncleaned, insufficiently activated, insufficiently cleaned, or that may be deactivated or contaminated. Since the bonding section 180, surface treatment section 100, supplier cleaning section 110, and mounting substrate cleaning section 120 are configured within the common mounting apparatus 1, reprocessing of surface treatment and cleaning treatment can be performed efficiently.

[0070] As an example of a more specific configuration, the control unit 200 has a normal mode processing unit 241 that executes a normal mode in which the surface treatment unit 100 performs surface treatment on the component supply unit TW or mounting board BW transported from the load port 13 and mounts the electronic component E on the mounting board BW in the bonding unit 180, and a return mode processing unit 242 that executes a return mode in which the surface treatment unit 100 performs surface treatment on the component supply unit TW or mounting board BW transported from the supply unit buffer unit 160, the mounting board buffer unit 170, or the bonding unit 180, and the control unit 200 is configured to be able to selectively switch between executing the normal mode by the normal mode processing unit 241 and executing the return mode by the return mode processing unit 242.

[0071] (3) When mounting another electronic component E on a mounting board BW on which an electronic component E has already been mounted, the control unit 200 selects the return mode for the mounting board BW. For example, when stacking memory elements, this allows the inactive and uncleaned exposed surfaces of the inverted mounted electronic components E to be activated and cleaned. In addition, cleaning with a cleaning liquid L can be performed. Alternatively, cleaning alone can be performed. Depending on the surface condition of the electronic component E at the bottom of the stack, various reprocessing processes can be performed in the required combination. Therefore, when directly stacking electronic components E, the required bonding strength can be easily achieved.

[0072] For example, if electronic components E are mounted in one area of ​​the mounting board BW and then a different type of electronic component E is mounted in another area, it may be necessary to replace the component supplier TW. When such a replacement occurs, the mounting board BW will have to wait during that time. Furthermore, the mounting board BW will have to stay at the bonding section 180 for a long time. This increases the possibility that the surface condition of the mounting board BW will become unsuitable for mounting.

[0073] Furthermore, a mounting board BW with electronic components E mounted on some areas may become inactive or have organic matter attached over time. For this reason, when a preset time has elapsed, the mounting board BW is surface-treated again in the return mode. Also, electronic components E may be left on one component supplier TW in order to be replaced with other electronic components E. In the case of such a component supplier TW, when a preset time has elapsed, the surface is also surface-treated again in the return mode.

[0074] Similarly to when stacking electronic components E, cleaning with the cleaning liquid L can be performed. Alternatively, cleaning alone can be performed. Necessary reprocessing can be performed in combination. Therefore, when mounting another electronic component E on one mounting board BW, the required bonding strength can be easily achieved.

[0075] In this way, by executing the return mode, the surface conditions of the mounting board BW and the component supplier TW can be returned to an appropriate state.

[0076] (4) The control unit 200 selects between the normal mode and the return mode depending on the time elapsed since the surface treatment of the mounting board BW. The control unit 200 also selects between the normal mode and the return mode depending on the time elapsed since the surface treatment of the component supply TW. This allows the mounting board BW and the component supply TW, which may have become deactivated or contaminated over time, to be surface treated or cleaned again.

[0077] (5) When the control unit 200 selects the return mode, it causes the transport unit 190 to transport the mounting substrate BW from the mounting substrate buffer unit 170 and into the surface treatment unit 100 or the mounting substrate cleaning unit 120. When the control unit 200 selects the return mode, it causes the transport unit 190 to transport the component supply unit TW from the supply unit buffer unit 160 and into the surface treatment unit 100. Therefore, within the mounting apparatus 1, the transport unit 190 can efficiently transport the mounting substrate BW and the component supply unit TW, and pretreatments such as surface treatment and cleaning can be repeatedly performed.

[0078] (6) The transport unit 190 has a transport robot 191 equipped with a pair of robot hands 191a. One robot hand 191a supports a component supply TW, and the other robot hand 191a supports a mounting board BW. This allows the component supply TW and the mounting board BW to be transported simultaneously in parallel, thereby shortening the transport time from pre-processing to mounting. Note that, as in the above embodiment, arranging the supply unit cleaning unit 110 and the mounting board cleaning unit 120 adjacent to each other makes it easier for the transport unit 190 to transfer components simultaneously in parallel.

[0079] In particular, in this embodiment, the supply buffer unit 160 and the mounting board buffer unit 170 are arranged adjacent to the bonding unit 180. This allows the component supply units TW and the mounting boards BW to be removed together and transported together to the surface treatment unit 100. This allows the transport unit 190 to move efficiently when transporting the component supply units TW and the mounting boards BW in the return mode, thereby improving productivity.

[0080] (Modification) The selection unit 250 may measure the time after cleaning and switch between the normal mode and the return mode depending on the time after cleaning. In other words, if a threshold time has elapsed after cleaning the component supplier TW or the mounting board BW, the return mode is selected, and surface treatment and cleaning are performed again, thereby preventing a decrease in bonding strength over time.

[0081] The selection unit 250 can also switch to the return mode as appropriate, using both the elapsed time after surface treatment and the elapsed time after cleaning, depending on whether to prioritize the activated or cleaned state of the surface or the state of hydroxyl groups after cleaning. Furthermore, it is also possible to perform only the cleaning process without performing another surface treatment. This allows for a variety of treatments to be selected, making it possible to perform treatments suited to the various properties of the surface of the component supply body TW or the mounting board BW. This increases the number of applicable products (see FIG. 1).

[0082] When the selection unit 250 transports the component supply body TW or the mounting board BW to the bonding unit 180, if it determines that a predetermined threshold time will pass while the transported component supply body TW or the mounting board BW is being mounted at the bonding unit 180, it can switch to the return mode processing without transporting the component supply body TW or the mounting board BW to the bonding unit 180. This makes it possible to avoid a situation in which the component supply body TW or the mounting board BW is transported to the bonding unit 180 when the measured time at the moment of determining to transport it to the bonding unit 180 is within a predetermined time tolerance range, and the time from surface treatment immediately after transport exceeds the tolerance range, resulting in continued mounting that reduces the mounting strength.

[0083] Furthermore, if it is determined that there is still a sufficient amount of time until such an overrun occurs, it is possible to transport the component supply body TW or the mounting board BW to the bonding unit 180 without switching to the return mode process. Such a determination can be made based on the elapsed time from the surface treatment of the next component supply body TW or mounting board BW that can be transported to the bonding unit 180.

[0084] The selection unit 250, normal mode processing unit 241, and return mode processing unit 242 may each be configured by hardware such as an independent electrical circuit, or may be configured by a program. When processing in return mode, process management is required for all component suppliers TW and mounting boards BW fed into the mounting device 1, and in addition, process management is also required for the component suppliers TW and mounting boards BW that are repeatedly processed in return mode. Process management requires each processing unit to grasp what processing each component supplier TW and each mounting board BW is currently performing, when it will be completed, and the processing status of each component supplier TW and each mounting board BW before and after, and to make a transport plan and processing plan for the next processing to be performed.

[0085] Therefore, execution of the return mode requires processing power that enables a huge amount of calculation processing. Therefore, as described above, the normal mode processing unit 241 and the return mode processing unit 242 are constructed independently in hardware. For example, the processing power required for the return mode is provided by multiple calculation processing units. When executing the normal mode, only some of the multiple calculation processing units are used. This reduces power consumption. Furthermore, even if an electrical circuit is constructed with a calculation processing unit with processing power required for the normal mode and both modes are used separately, efficient processing can be performed with low power consumption by performing processing using hardware optimized for both modes.

[0086] The same is true for programs. Of the routines that execute complex return modes, only a limited number are used in normal mode. Therefore, if normal mode is executed using a program that can execute return mode, the amount of unnecessary processing that is skipped increases, resulting in poor efficiency. By configuring the normal mode processing unit 241 and the return mode processing unit 242 as independent routines (programs), processing can be performed using programs optimized for both modes, allowing for efficient processing with low power consumption. This also shortens the takt time.

[0087] A separate return-only transport section 190 can be provided to accommodate the return mode. Furthermore, separate return-only transport sections 190 can be provided for the component supply unit TW and the mounting board BW. Since the return mode transport process can be performed in parallel with the transport section 190 used in the normal mode, a highly productive mounting apparatus 1 can be realized through high-speed processing and parallel processing.

[0088] [Other Embodiments] While the embodiments of the present invention and modifications of each part have been described above, these embodiments and modifications of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be embodied in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included within the scope and spirit of the invention, and are also included in the invention described in the claims.

[0089] 1 Mounting apparatus 11 Substrate 12 Chamber 13 Load port 100 Surface treatment section 110 Supply body cleaning section 111 Cleaning chamber 111a Opening 111b Shutter 112 Support section 113 Rotation mechanism 114 Cup 115 Supply section 115a Nozzle 115b Moving mechanism 120 Mounting substrate cleaning section 130 Adjustment processing section 131 Irradiation device 140 Gauging section 150 Alignment section 160 Supply body buffer section 161 Storage 170 Mounting substrate buffer section 171 Storage 180 Bonding section 190 Transport section 191 Transport robot 191a Robot hand 192 Moving mechanism 200 Control section 210 Memory section 220 Input section 230 Display section 240 Cleaning control section 241 Normal mode processing unit 242 Return mode processing unit 250 Selection unit

Claims

1. A load port on which is mounted a transport container containing a component supply having an unprocessed or processed tape attached to a ring and a wafer singulated with electronic components attached thereto, and a mounting board on which the electronic components are mounted; a supply cleaning section for cleaning the component supply; a mounting board cleaning section for cleaning the mounting board; a surface treatment section for performing surface treatment on the surface of the component supply and / or the mounting board with plasma; an adjustment section for adjusting the tape by irradiating UV light onto the tape so that the adhesive strength of the tape is reduced; a bonding section for detaching the electronic components from the component supply and mounting them on the mounting board; a supply buffer section for temporarily storing the component supply before it is carried into the bonding section; a mounting board buffer section for temporarily storing the mounting board before it is carried into the bonding section; and a transport section for transporting the component supply and the mounting board. a control unit that controls the transport unit so as to transport the component supply and / or the mounting board from the supply buffer unit, the mounting board buffer unit, or the bonding unit to any one of the supply cleaning unit, the mounting board cleaning unit, or the surface treatment unit, wherein the control unit further controls the supply cleaning unit, the mounting board cleaning unit, and the transport unit so as to include a state in which the cleaning process of the component supply and the cleaning process of the mounting board are performed simultaneously in parallel with each other.

2. The mounting device according to claim 1, characterized in that the control unit is configured to be able to switch whether the transport unit transports the component supplier and / or the mounting board from the supplier buffer unit, the mounting board buffer unit or the bonding unit to either the supplier cleaning unit, the mounting board cleaning unit or the surface processing unit, or to the transport container of the load port.

3. The control unit has: a normal mode processing unit that executes a normal mode in which the surface processing unit performs surface processing on the component supply body or the mounting board transported from the load port, and in which the electronic component is mounted on the mounting board in the bonding unit; and a return mode processing unit that executes a return mode in which the surface processing unit performs surface processing on the component supply body or the mounting board transported from the supply body buffer unit, the mounting board buffer unit or the bonding unit, wherein the control unit is configured to be selectively switchable between executing the normal mode by the normal mode processing unit and executing the return mode by the return mode processing unit.

4. The mounting device according to claim 3, characterized in that the control unit selects the return mode for the mounting board when mounting another electronic component on the mounting board on which the electronic component is mounted.

5. The mounting device according to claim 3, wherein the control unit selects between the normal mode and the return mode depending on the time that has elapsed since the surface treatment of the mounting substrate.

6. The mounting device according to claim 3, wherein the control unit selects between the normal mode and the return mode depending on the time that has elapsed since the surface treatment of the component supply body.

7. The mounting device according to claim 1, wherein the transport section comprises a pair of robot hands, one of which supports the component supply body and the other of which has a transport robot supporting the mounting board.

8. A mounting method comprising: a loading step in which a transport container containing a component supply having a wafer singulated with electronic components attached to a tape attached to a ring, the component supply having untreated or treated wafers, and a mounting board on which the electronic components are to be mounted, is loaded onto a load port; a surface treatment step in which a surface treatment unit performs surface treatment on a surface of the component supply and / or the mounting board with plasma; a supply cleaning step in which a supply cleaning unit cleans the component supply; a mounting board cleaning step in which a mounting board cleaning unit cleans the mounting board so as to include a state in which the supply cleaning step is performed simultaneously with the supply cleaning step; an adjustment step in which an adjustment processing unit adjusts the tape by irradiating UV light onto the tape so as to reduce adhesive strength of the tape; a supply accommodating step in which a supply buffer unit temporarily accommodates the component supply; a mounting board accommodating step in which a mounting board buffer unit temporarily accommodates the mounting board; and a bonding step in which a bonding unit detaches the electronic components from the component supply and mounts them on the mounting board.

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