Component base material flatness evaluation device, component mounting machine, component mounting system, and component base material flatness evaluation method

Abstract

Pattern light Lp radiated onto a body bottom surface Es (surface) of a package body Eb (base material) of a component E and reflected by the body bottom surface Es is imaged to acquire a body bottom surface image Is (base material surface image) (step S103). A body bottom surface shape Ses (base material surface shape) indicating the three-dimensional shape of the body bottom surface Es of the package body Eb is acquired on the basis of the body bottom surface image Is (step S105). The flatness of the body bottom surface Es of the package body Eb is evaluated on the basis of the body bottom surface shape Ses (step S106). Thus, the distortion of the package body Eb of the component E mounted on a substrate B, that is, the flatness of the body bottom surface Es of the package body Eb, can be evaluated.

Description

Component substrate flatness evaluation device, component mounter, component mounting system, and component substrate flatness evaluation method

[0001] The present invention relates to a technique for evaluating components mounted on a board.

[0002] As shown in Patent Documents 1 to 4, component mounters that produce component-mounted boards by mounting components on a board are known. In such component mounters, various measurements are appropriately performed to ensure proper component mounting on the board. For example, Patent Document 1 uses a stereo camera to measure the condition of solder, which serves as a bonding material for bonding components mounted on a board to the board. Furthermore, Patent Documents 2 and 3 describe techniques for evaluating components by performing various measurements on the components. Specifically, Patent Document 2 measures the height of lead terminals of a lead component using stereo matching, and Patent Document 3 measures the shape of a component held by a suction nozzle using a phase shift method to control the elevation and lowering of the suction nozzle that holds the component.

[0003] WO2017 / 064777 JP 2021-193707 A JP 2014-154750 A JP 2010-272778 A

[0004] However, when analyzing defects occurring in the mounting state of components, it was found that defects occur due to factors that cannot be evaluated by the measurements shown in Patent Documents 2 and 3, etc. Specifically, it was confirmed that defects in the mounting state of components occur due to distortion of the component substrate itself (in other words, the main body of the package excluding the electrodes). In contrast, the technology in Patent Document 2 measures the height of the lead terminals, but is not capable of evaluating distortion of the component substrate. Furthermore, Patent Document 3 only measures the shape of the component in order to control the elevation of the suction nozzle that holds the component, and is not capable of evaluating distortion of the component substrate.

[0005] The present invention has been made in view of the above-mentioned problems, and has an object to provide a technique that can evaluate distortion of the base material of a component mounted on a board.

[0006] The component substrate flatness evaluation device according to the present invention includes an irradiation unit that irradiates light onto the substrate surface, which is the surface of the substrate of the component; an imaging unit that acquires an image of the substrate surface by capturing the light irradiated by the irradiation unit and reflected by the substrate surface; a three-dimensional shape acquisition unit that acquires a substrate surface shape that indicates the three-dimensional shape of the substrate surface based on the substrate surface image; and a flatness evaluation unit that evaluates the flatness of the substrate surface based on the substrate surface shape.

[0007] The component mounting machine of the present invention comprises a component supply unit that supplies components, a component mounting unit that mounts the components supplied by the component supply unit onto a board, and the above-mentioned component substrate flatness evaluation device, and the component substrate flatness evaluation device evaluates the flatness of the substrate surface of the components supplied by the component supply unit before they are mounted on the board.

[0008] The component mounting system according to the present invention comprises the component mounting machine described above and a data storage unit, and the data storage unit stores the flatness evaluation results for the components obtained by the component substrate flatness evaluation device in association with the board on which the components were mounted by the component mounting machine.

[0009] The component substrate flatness evaluation method according to the present invention includes a step of irradiating light onto the substrate surface, which is the surface of the substrate of the component, a step of acquiring a substrate surface image by capturing an image of the light reflected from the substrate surface, a step of acquiring a substrate surface shape that indicates the three-dimensional shape of the substrate surface based on the substrate surface image, and a step of evaluating the flatness of the substrate surface based on the substrate surface shape.

[0010] In the present invention (component substrate flatness evaluation device, component mounter, component mounting system, and component substrate flatness evaluation method) configured as described above, light is irradiated onto the substrate surface of a component and reflected from the substrate surface, an image of the substrate surface is acquired, and a substrate surface shape indicating the three-dimensional shape of the substrate surface is acquired based on this substrate surface image.The flatness of the substrate surface is then evaluated based on this substrate surface shape.In this way, it is possible to evaluate the distortion of the substrate of a component mounted on a board, i.e., the flatness of the substrate surface.

[0011] The component substrate flatness evaluation device may be configured so that the flatness evaluation unit evaluates the flatness of the substrate surface based on a comparison between a flat reference plane and the substrate surface shape. With this configuration, the flatness of the component substrate surface can be evaluated by a simple calculation such as a comparison with the reference plane.

[0012] The component substrate flatness evaluation device may be configured so that the flatness evaluation unit determines that the substrate surface is flat when the difference between the material surface shape and the reference plane is within a predetermined range, and determines that the substrate surface is not flat when the difference between the substrate surface shape and the reference plane is outside the predetermined range. With this configuration, it is possible to easily evaluate whether the substrate surface is flat, in other words, whether there is distortion on the substrate surface.

[0013] The component substrate flatness evaluation device may be configured to further include a memory unit that stores a reference plane, and the flatness evaluation unit evaluates the flatness of the substrate surface based on a comparison between the reference plane stored in the memory unit and the substrate surface shape. With this configuration, the flatness of the component substrate surface can be evaluated by a simple calculation such as a comparison with the reference plane read from the memory unit.

[0014] The component substrate flatness evaluation device may also be configured to further include a holding head capable of holding a reference member having a flat reference plane, wherein, while the holding head holds the reference member, the irradiation unit irradiates light onto the reference plane of the reference member while the imaging unit images the reference plane of the reference member to obtain a reference plane image, the three-dimensional shape acquisition unit acquires a reference plane shape indicating the three-dimensional shape of the reference plane based on the reference plane image, and the flatness evaluation unit sets the plane indicated by the reference plane shape as a reference plane and stores the reference plane in the memory. With this configuration, an appropriate reference plane can be set based on the results of measuring the three-dimensional shape of the flat reference plane of the reference member.

[0015] The component substrate flatness evaluation device may also be configured to include a plurality of holding heads, including a holding head, and a holding head that holds a reference member holds a component, with the illumination unit irradiating light onto the component substrate surface while the imaging unit images the component substrate surface to obtain a substrate surface image. In this configuration, the holding head that holds the reference member for setting the reference plane and the holding head that holds the component for evaluating the flatness of the component substrate surface are the same. Therefore, the flatness of the substrate surface can be evaluated based on a comparison with the reference plane while eliminating individual differences between the plurality of holding heads.

[0016] The component substrate flatness evaluation device may also be configured so that the flatness evaluation unit sets a reference plane based on the substrate surface shape and evaluates the flatness of the substrate surface based on a comparison between the reference plane and the substrate surface shape. With this configuration, it is possible to set an appropriate reference plane according to the shape of the component substrate surface, as described above.

[0017] The component substrate flatness evaluation device may be configured so that the flatness evaluation unit sets a reference plane based on multiple edges of the substrate surface shape. In this configuration, an appropriate reference plane can be set according to the shape of the component substrate surface.

[0018] The component substrate flatness evaluation device may also be configured such that the flatness evaluation unit sets the reference plane based on the plane with the largest area among the planes included in the substrate surface shape. With this configuration, an appropriate reference plane can be set according to the shape of the component substrate surface. Incidentally, if the substrate surface shape includes multiple planes, the reference plane is set based on the plane with the largest area among the multiple planes. If the substrate surface shape includes a single plane, the reference plane is set based on the single plane.

[0019] The component substrate flatness evaluation device may be configured so that the component has terminals provided on the substrate, the irradiation unit irradiates the terminals with light, the imaging unit acquires terminal images by capturing images of the light irradiated by the irradiation unit and reflected by the terminals, the three-dimensional shape acquisition unit acquires terminal shapes indicating the three-dimensional shapes of the terminals based on the terminal images, and the flatness evaluation unit evaluates errors in the position of the terminals based on the substrate surface shape and the terminal shapes. With this configuration, it is possible to evaluate not only the flatness of the component substrate surface but also errors in the component terminals.

[0020] Incidentally, the position error of a component's terminals has generally been evaluated by the difference between each terminal and a plane (regression plane) set based on the positions of multiple terminals. This method is not effective when there is one or two terminals because the plane cannot be uniquely determined. In contrast, by evaluating based on the substrate surface shape and terminal shape, it is possible to evaluate the terminal position error even when there is one or two terminals.

[0021] However, because the surface of a component substrate is relatively uniform, it is difficult to extract the feature points required for stereo matching from the substrate surface, and stereo matching is not suitable for obtaining the three-dimensional shape of the substrate surface. Therefore, the component substrate flatness evaluation device may be configured so that the irradiation unit irradiates the substrate surface with linear laser light, and the imaging unit acquires a substrate surface image by capturing the laser light irradiated on the substrate surface. Alternatively, the component substrate flatness evaluation device may be configured so that the irradiation unit sequentially irradiates the substrate surface with multiple patterned lights having different phases from each other, and the imaging unit acquires a substrate surface image by capturing the patterned lights irradiated on the substrate surface.

[0022] According to the present invention, it is possible to evaluate distortion of the base material of a component mounted on a board.

[0023] 1. A block diagram showing an example of a component mounting system according to the present invention. 2. A plan view schematically showing the configuration of an example of a component mounter provided in the component mounting system of FIG. 1. 3. A block diagram showing the electrical configuration provided in the component mounter of FIG. 2. 4. A diagram schematically showing a mounting head and a component recognition unit provided in the component mounter. 5. A flowchart showing an example of component inspection. 6. A diagram schematically showing an example of a component that is the target of the component inspection of FIG. 5. 7. A block diagram showing an example of the electrical configuration for performing the component inspection of FIG. 5. 8. A diagram schematically showing the calculation contents performed in the flatness evaluation in the component inspection of FIG. 7. 9. A flowchart showing an example of a reference plane setting process for setting a reference plane. 10. A diagram schematically showing an example of a reference plate used in the reference plane setting process of FIG. 9. 11. A diagram schematically showing a first example of a method for evaluating flatness by setting a reference plane based on the shape of the bottom surface of a main body. 12. A diagram schematically showing a second example of a method for evaluating flatness by setting a reference plane based on the shape of the bottom surface of a main body. 13. A diagram schematically showing the calculation contents performed in the method of FIG. 12. 14. A diagram schematically showing the calculation contents performed in the method of FIG. 12. A diagram schematically showing the calculation contents performed by the method of Fig. 12. A diagram schematically showing the calculation contents performed by the method of Fig. 12. A diagram schematically showing the calculation contents performed by the method of Fig. 12. A diagram schematically showing the calculation contents performed by the method of Fig. 12. A diagram schematically showing the calculation contents performed by the method of Fig. 12. A diagram schematically showing a first example of a method for determining a position error of a terminal of a component. A bottom view schematically showing another example of a target component. A side view schematically showing another example of a target component.

[0024] Fig. 1 is a block diagram showing an example of a component mounting system according to the present invention, Fig. 2 is a plan view showing a schematic configuration of an example of a component mounter provided in the component mounting system of Fig. 1, Fig. 3 is a block diagram showing an electrical configuration provided in the component mounter of Fig. 2, and Fig. 4 is a diagram showing a schematic mounting head and a component recognition unit provided in the component mounter. In this specification, the X direction, which is the horizontal direction, the Y direction, which is the horizontal direction perpendicular to the X direction, and the Z direction, which is the vertical direction, are appropriately indicated.

[0025] 1, the component mounting system 1 includes a plurality of component mounters 2 and a management server 9 that manages the plurality of component mounters 2. Boards B are sequentially carried into the plurality of component mounters 2, and each component mounter 2 mounts small piece-like electronic components E such as integrated circuits, transistors, capacitors, etc. onto the carried-in boards B.

[0026] 3 , the component mounter 2 includes a controller 3 that performs overall control of the component mounter 2. The controller 3 includes a main control unit 31, which is a processor configured with a CPU (Central Processing Unit) and RAM (Random Access Memory), and a storage unit 32 configured with an HDD (Hard Disk Drive) or SSD (Solid State Drive). The controller 3 also includes a drive control unit 33 that controls the drive system of the component mounter 2, and the main control unit 31 controls the drive system via the drive control unit 33 to perform component mounting to mount components E on the board B. The controller 3 also includes an imaging control unit 34 that controls imaging of components E by a component recognition unit 4 (described later), and a communication unit 35 that communicates with the management server 9.

[0027] 2, the component mounter 2 includes a transport unit 21 that transports a board B in the X direction (board transport direction). This transport unit 21 has a pair of conveyors 211 arranged in parallel in the X direction, and transports the board B in the X direction using the conveyors 211. The spacing between these conveyors 211 is changeable in the Y direction (width direction), which is perpendicular to the X direction, and the transport unit 21 adjusts the spacing between the conveyors 211 according to the width of the board B being transported. This transport unit 21 transports the board B from the upstream side in the X direction, which is the board transport direction, to a predetermined work position 212, and transports the board B, on which components E have been mounted at the work position 212, from the work position 212 to the downstream side in the X direction.

[0028] This component mounter 2 is provided with a total of four component supply carts 22. Specifically, two component supply carts 22 are lined up in the X direction on each side of the transport unit 21 in the Y direction. Each component supply cart 22 has a plurality of tape feeders 23 lined up in the X direction, and a plurality of component supply reels are arranged corresponding to the plurality of tape feeders 23. A component storage tape is wound around the component supply reel. This component storage tape has a plurality of pockets arranged in a row, and components E are stored in each pocket. Each tape feeder 23 has a component supply position 231 at its tip on the transport unit 21 side in the Y direction, and supplies components E in the component storage tape to the component supply position 231 by intermittently feeding the component storage tape pulled out from the component supply reel toward the transport unit 21.

[0029] The mounter 2 is also provided with a pair of Y-axis rails 241 extending in the Y direction, a Y-axis ball screw 242 extending in the Y direction, and a Y-axis motor My that rotates and drives the Y-axis ball screw 242. An X-axis rail 244 is supported on the pair of Y-axis rails 241 so as to be movable in the Y direction and is fixed to the nut of the Y-axis ball screw 242. An X-axis ball screw 245 extending in the X direction and an X-axis motor Mx that rotates and drives the X-axis ball screw 245 are attached to the X-axis rail 244. The mounter 2 is also provided with a head unit 25, which is supported on the X-axis rails 244 so as to be movable in the X direction and is fixed to the nut of the X-axis ball screw 245. Therefore, the drive control unit 33 can rotate the Y-axis ball screw 242 using the Y-axis motor My to move the head unit 25 in the Y direction, or rotate the X-axis ball screw 245 using the X-axis motor Mx to move the head unit 25 in the X direction.

[0030] The head unit 25 is a rotary type having multiple (eight) mounting heads 5 arranged circumferentially, and supports the multiple mounting heads 5 so that they can rotate together. A nozzle 51 ( FIG. 4 ) is detachably attached to the lower end of the mounting head 5, and the mounting head 5 picks up components E using the nozzle 51. In contrast, the component mounter 2 has a Z-axis motor Mz that raises and lowers the mounting head 5 in the Z direction, and an R-axis motor Mr that rotates the mounting head 5. The drive control unit 33 adjusts the height of the mounting head 5 (i.e., the height of the nozzle 51) using the Z-axis motor Mz, and adjusts the rotation angle of the mounting head 5 (i.e., the rotation angle of the nozzle 51) using the R-axis motor Mr.

[0031] In the component mounter 2, the drive control unit 33 executes control in response to commands from the main control unit 31, thereby mounting the component E on the board B. That is, the drive control unit 33 moves the mounting head 5 using the X-axis motor Mx and the Y-axis motor My, thereby causing the nozzle 51 of the mounting head 5 to face the component E supplied to the component supply position 231 from above. Next, the drive control unit 33 lowers the nozzle 51 using the Z-axis motor Mz, thereby bringing the nozzle 51 into contact with the upper surface of the component E supplied to the component supply position 231, and then adsorbs the component E onto the nozzle 51. Furthermore, the drive control unit 33 raises the nozzle 51 using the Z-axis motor Mz. In this way, the head unit 25 picks up the component E from the component supply position 231 using the nozzle 51 of the mounting head 5. Next, the drive control unit 33 moves the mounting head 5 using the X-axis motor Mx and the Y-axis motor My, so that the component E to be picked up by the nozzle 51 of the mounting head 5 faces the land of the board B from above. Furthermore, the drive control unit 33 adjusts the angle of the component E picked up by the nozzle 51 relative to the land using the R-axis motor Mr, and then lowers the nozzle 51 using the Z-axis motor Mz, thereby placing the component E on the land of the board B.

[0032] The component mounter 2 also includes a component recognition unit 4 disposed between the two component supply carts 22 in the X direction. This component recognition unit 4 has a component recognition camera 41 that faces upward and captures an image within a field of view V41. The component recognition units 4 are disposed on both sides of the transport section 21 in the Y direction.

[0033] The mounting head 5, which has picked up a component E from the component supply position 231 with the nozzle 51, positions the component E from above toward the component recognition camera 41 of the component recognition unit 4 before placing the component E on the board B. This positions the component E within the field of view V41 of the component recognition camera 41. The component recognition camera 41 then captures an image of the component E picked up by the nozzle 51 from below, thereby obtaining a component recognition image Ir. This component recognition image Ir is then stored in the memory unit 32 from the component recognition camera 41 via the imaging control unit 34. The main control unit 31 then performs component recognition, which recognizes the position of the component E based on the component recognition image Ir stored in the memory unit 32. Specifically, the main control unit 31 recognizes the position of the component E relative to the nozzle 51 based on the position of the nozzle 51 at the time the component recognition image Ir was acquired and the position of the component E in the component recognition image Ir. The main control unit 31 can confirm the position of the nozzle 51 at the time of acquiring the component recognition image Ir by receiving the encoder outputs of the motors Mx, My, and Mr from the drive control unit 33. The main control unit 31 then controls the motors Mx, My, and Mr in accordance with the position of the component E recognized based on the component recognition image Ir, thereby adjusting the position of the component E relative to the land on the board B and mounting the component E on the land.

[0034] Furthermore, the component recognition unit 4 has a projector 42 that projects a predetermined pattern of light (pattern light Lp) onto the field of view V41 of the component recognition camera 41. The component recognition unit 4 then performs component inspection on the component E located in the field of view V41 of the component recognition camera 41, based on the result of the component recognition camera 41 capturing an image of the pattern light Lp projected from the projector 42 onto the component E within the field of view V41. Only components E that pass this component inspection are mounted onto lands on the board B.

[0035] FIG. 5 is a flowchart showing an example of a component inspection, FIG. 6 is a diagram showing an example of a component that is the subject of the component inspection of FIG. 5, FIG. 7 is a block diagram showing an example of an electrical configuration for performing the component inspection of FIG. 5, and FIG. 8 is a diagram showing an example of the calculation content performed in flatness evaluation in the component inspection of FIG. 7.

[0036] As shown in Fig. 6, component E has a package Ep that constitutes the exterior of component E. This package Ep has a package body Eb (base material). The package body Eb is made of molded resin and a package substrate, and has a body bottom surface Es that faces the surface of board B when component E is mounted on board B. Furthermore, package Ep has a plurality of terminals Et provided on package body Eb. In the example of Fig. 6, the plurality of terminals Et are arranged on the body bottom surface Es of package body Eb.

[0037] 7, the drive control unit 33 has a control unit 331, a three-phase inverter 332, and an encoder frequency divider unit 333. The control unit 331 controls the three-phase inverter 332 and the encoder frequency divider unit 333. The three-phase inverter 332 drives the motor M (X-axis motor Mx, Y-axis motor My, Z-axis motor Mz, or R-axis motor Mr). The encoder frequency divider unit 333 generates pulses by dividing the encoder output from the motor M.

[0038] The imaging control unit 34 has a control unit 341, an image processing unit 342, and a camera trigger generation unit 343. The control unit 341 controls the image processing unit 342 and the camera trigger generation unit 343. The image processing unit 342 performs image processing on the image captured by the component recognition camera 41. The camera trigger generation unit 343 generates a camera trigger in response to the pulse generated by the encoder frequency division unit 333.

[0039] The component recognition camera 41 includes a solid-state image sensor 421, an image storage unit 422, an image calculation unit 423, and a transmission unit 424. The solid-state image sensor 421 is a CMOS sensor or the like, and upon receiving a camera trigger from the camera trigger generation unit 343, captures an image within the field of view V41 to acquire the image. The image storage unit 422 stores the image acquired by the solid-state image sensor 421. The image calculation unit 423 reads the image stored in the image storage unit 422 and performs a predetermined calculation (e.g., color correction) on the image. The transmission unit 424 outputs the image after the predetermined calculation has been performed by the image calculation unit 423 as a captured image Ii. The image processing unit 342 of the imaging control unit 34 receives the captured image Ii output from the component recognition camera 41 and performs image processing required for the component inspection of FIG. 5 on the captured image Ii.

[0040] In the component inspection of FIG. 5 , when component E is positioned in the field of view V41 of the component recognition camera 41 as shown in FIG. 4 , the three-phase inverter 332 drives the motor M to start moving component E held by the nozzle 51 of the mounting head 5 (step S101). In this example, the three-phase inverter 332 drives the Y-axis motor My to move component E in the Y direction, and the encoder frequency divider 333 generates pulses by dividing the encoder output from the Y-axis motor My. Therefore, the camera trigger generator 343 generates a camera trigger synchronized with the movement of component E in the Y direction. However, the movement direction of component E is not limited to the Y direction and may be the X direction or a direction inclined toward the X and Y directions. Regardless of the movement direction of component E, the camera trigger generator 343 generates a camera trigger synchronized with the movement of component E.

[0041] In step S102, the projector 42 irradiates the field of view V41 with patterned light Lp, which is laser light having a linear pattern extending in a direction perpendicular to the movement direction of the component E (the X direction in this example). This causes the patterned light Lp to scan the bottom surface Es of the package body Eb of the component E in the Y direction. Each time the camera trigger generation unit 343 outputs a camera trigger, the component recognition camera 41 captures an image of the bottom surface Es of the component E to obtain a body bottom image Is, which is a captured image Ii of the body bottom surface Es (step S103). This body bottom image Is includes the patterned light Lp bent according to the three-dimensional shape of the body bottom surface Es, and is output from the component recognition camera 41 to the image processing unit 342. The imaging of step S103 is then performed each time the camera trigger is output until imaging of the entire bottom surface Es of the package body Eb is completed (until step S104 returns "YES"). In other words, imaging is repeatedly performed while the pattern light Lp moves from one end of the bottom surface Es of the package body Eb to the other end in the Y direction, and when the pattern light Lp moves outward from the other end, it is determined that imaging of the entire area of ​​the bottom surface Es of the package body Eb has been completed.

[0042] When imaging of the entire bottom surface Es of the package body Eb (step S103) is completed ("YES" in step S104), the image processing unit 342 calculates the three-dimensional shape of the bottom surface Es (bottom surface shape Ses) using the light cutting method based on the multiple bottom surface images Is received from the component recognition camera 41 (step S105).

[0043] Incidentally, the body bottom image Is used to calculate the body bottom shape Ses may include terminals Et. Therefore, the image processing unit 342 may calculate the body bottom shape Ses while masking the terminals Et from the body bottom image Is in order to abstract the terminals Et and extract only the body bottom Es. In this case, the image processing unit 342 reads component data De indicating the configuration of component E from the storage unit 32, and calculates the body bottom shape Ses while performing masking on the area where the terminals Et are present, as indicated by the component data De. This component data De is stored in advance in the storage unit 32.

[0044] The body bottom shape Ses calculated in step S105 is output from the imaging control unit 34 to the main control unit 31, and the main control unit 31 evaluates the flatness of the body bottom surface Es of the package body Eb based on the body bottom shape Ses (step S106). This flatness evaluation is performed based on the reference plane Pr. That is, reference plane data Dr indicating the flat reference plane Pr is stored in the memory unit 32, and the main control unit 31 calculates the difference Δ between the reference plane Pr indicated by the reference plane data Dr and the body bottom shape Ses ( FIG. 8 ). This difference Δ is calculated for each of a plurality of grids arranged in a matrix in the X and Y directions relative to the body bottom surface Es of the package body Eb.

[0045] Then, in step S106, the main control unit 31 determines that the body bottom surface Es is flat if the difference Δ is equal to or less than a predetermined threshold value across the entire body bottom surface shape Ses (in other words, for all of the multiple grids). On the other hand, the main control unit 31 determines that the body bottom surface Es is not flat if there is a portion of the body bottom surface shape Ses where the difference Δ exceeds the threshold value (in other words, if there is a grid with a difference Δ that exceeds the threshold value). In other words, if the maximum value of the differences Δ calculated for each of the multiple grids is equal to or less than a threshold value, the body bottom surface Es is determined to be flat, and if the maximum value is greater than the threshold value, the body bottom surface Es is determined to be not flat.

[0046] In this case, the reference plane Pr may be aligned with the body bottom shape Ses in the Z direction, and then the body bottom shape Ses and the reference plane Pr may be compared. Specifically, the reference plane Pr may be fitted to the body bottom shape Ses by, for example, the least squares method, and then the difference Δ between the reference plane Pr and the body bottom shape Ses may be calculated.

[0047] The main control unit 31 causes the mounting head 5 to mount components E (accepted components) whose main body bottom surfaces Es are determined to be flat onto the board B. On the other hand, the main control unit 31 causes the mounting head 5 to discard components E (rejected components) whose main body bottom surfaces Es are determined to be not flat. In other words, the components E are not mounted on the board B, but are discarded in a specified discard box.

[0048] Furthermore, the main control unit 31 generates evaluation information Fe that associates the flatness evaluation result for the component E (the difference Δ between each grid) with the board B (the type and lot number of the board B) on which the component E, for which the evaluation result has been given, is mounted. The main control unit 31 then transmits this evaluation information Fe to the management server 9 via the communication unit 35, and the management server 9 stores the evaluation information Fe received from the communication unit 35 ( FIG. 1 ).

[0049] In the embodiment described above, the pattern light Lp is irradiated onto the bottom surface Es (surface) of the package body Eb (substrate) of the component E and reflected by the bottom surface Es, and an image of the bottom surface Is (substrate surface image) is acquired (step S103). Based on the bottom surface image Is, a bottom surface shape Ses (substrate surface shape) indicating the three-dimensional shape of the bottom surface Es of the package body Eb is acquired (step S105). The flatness of the bottom surface Es of the package body Eb is then evaluated based on the bottom surface shape Ses (step S106). In this way, it is possible to evaluate the distortion of the package body Eb of the component E mounted on the board B, i.e., the flatness of the bottom surface Es of the package body Eb.

[0050] The main control unit 31 (flatness evaluation unit) evaluates the flatness of the body bottom surface Es based on a comparison between the flat reference plane Pr and the body bottom shape Ses (step S106). With this configuration, the flatness of the body bottom surface Es of the part E can be evaluated by a simple calculation such as a comparison with the reference plane Pr.

[0051] Furthermore, if the difference Δ between the body bottom shape Ses and the reference plane Pr over the entire body bottom shape Ses measured in steps S101 to S105 falls within a predetermined range (a threshold or less), the main control unit 31 determines that the body bottom surface Es is flat. On the other hand, if there is a portion of the body bottom shape Ses where the difference between the body bottom shape Ses and the reference plane Pr falls outside the predetermined range, the main control unit 31 determines that the body bottom surface Es is not flat. With this configuration, it is possible to easily evaluate whether the body bottom surface Es is flat, in other words, whether there is distortion in the body bottom surface Es.

[0052] The main control unit 31 evaluates the flatness of the body bottom surface Es based on a comparison between the reference plane Pr stored in the memory unit 32 and the body bottom shape Ses (step S106). With this configuration, the flatness of the body bottom surface Es of the part E can be evaluated by a simple calculation such as a comparison with the reference plane Pr read from the memory unit 32.

[0053] The management server 9 (data storage unit) also stores evaluation information Fe that associates the evaluation results of the flatness of the main body bottom surface Es with the component E (the difference Δ between each grid) with the board B on which the component E was mounted by the component mounter 2. With this configuration, the history of mounting the component E on the board B and the evaluation information Fe for the component E can be easily traced at a later date. Furthermore, it becomes possible to treat the variation in the flatness of the main body bottom surface Es (the difference Δ between each grid) due to the properties of the component E as big data.

[0054] Fig. 9 is a flowchart showing an example of a reference plane setting process for setting a reference plane, and Fig. 10 is a diagram schematically showing an example of a reference plate used in the reference plane setting process of Fig. 9. The reference plate Tr shown in Fig. 10 is a ceramic plate having a rectangular parallelepiped shape. The bottom surface of this reference plate Tr is a flat reference plane Trs.

[0055] 5 , one of the multiple mounting heads 5 sucks the reference plate Tr with the nozzle 51 (step S201). As a result, the reference plate Tr is held by the mounting head 5 with the reference plane Trs of the reference plate Tr facing downward. Furthermore, when the reference plate Tr is positioned in the field of view V41 of the component recognition camera 41, the three-phase inverter 332 drives the motor M to start moving the reference plate Tr held by the nozzle 51 of the mounting head 5 (step S202). The movement direction of the reference plate Tr is the same direction (Y direction) as the movement direction of the component E during component inspection in FIG. 5 .

[0056] In step S203, the projector 42 irradiates the field of view V41 with pattern light Lp, which is laser light having a line pattern extending in a direction (X direction) perpendicular to the movement direction of the component E. This causes the pattern light Lp to scan the reference plane Trs of the reference plate Tr in the Y direction. Then, each time the camera trigger generation unit 343 outputs a camera trigger, the component recognition camera 41 captures an image of the reference plane Trs of the reference plate Tr to obtain a reference plane image Irs, which is the captured image Ii of the reference plane Trs (step S204). Then, the imaging of step S204 is executed each time the camera trigger is output until imaging of the entire reference plane Trs of the reference plate Tr is completed (until step S205 returns "YES"). In other words, imaging is repeatedly performed while the pattern light Lp moves from one end to the other end of the reference plane Trs of the reference plate Tr in the Y direction, and when the pattern light Lp moves outward from the other end, it is determined that imaging of the entire area of ​​the reference plane Trs of the reference plate Tr has been completed.

[0057] When imaging of the entire reference plane Trs of the reference plate Tr (step S204) is completed ('YES' in step S205), the image processing unit 342 calculates the three-dimensional shape of the reference plane Trs (reference plane shape Srs) using the light cutting method based on the multiple reference plane images Irs received from the component recognition camera 41.

[0058] The reference planar shape Srs calculated in step S206 is output from the imaging control unit 34 to the main control unit 31, and the main control unit 31 sets a base plane Pr for the reference planar shape Srs (step S207). Specifically, the main control unit 31 sets a regression plane for the reference planar shape Srs calculated by the least squares method or the like as the base plane Pr.

[0059] The reference plane Pr set in this manner is stored in the storage unit 32. Then, in the flatness evaluation of the component inspection in Fig. 5 (step S106), the flatness of the main body bottom shape Ses is evaluated based on the reference plane Pr set in step S207.

[0060] Incidentally, the head unit 25 is equipped with a plurality of mounting heads 5. Therefore, the reference plane setting process of Fig. 9 may be executed for each of the plurality of mounting heads 5 to set a plurality of reference planes Pr corresponding to the plurality of mounting heads 5. In this case, in the flatness evaluation in step S106 of the component inspection of Fig. 5, the flatness of the main body bottom shape Ses of the component E that is the subject of the flatness evaluation is evaluated based on the reference plane Pr corresponding to one mounting head 5 that picks up the component E.

[0061] In this case, in the component inspection of Figure 5, the drive control unit 33 may control the R-axis motor Mr so that the rotation angle of the mounting head 5 that holds the component E for evaluating the flatness of the component E is equal to the rotation angle of the mounting head 5 that holds the reference plate Tr for setting the reference plane Pr corresponding to the mounting head 5.

[0062] 5 , the drive control unit 33 may control the Z-axis motor Mz so that the height of the component E held by the mounting head 5 for evaluating the flatness of the component E is equal to the height of a reference plate Tr held by the mounting head 5 for setting a reference plane Pr corresponding to the mounting head 5. Note that the height of the component E is, for example, the value obtained by subtracting the thickness of the component E from the height of the lower end of the nozzle 51, and the height of the reference plate Tr is, for example, the value obtained by subtracting the thickness of the reference plate Tr from the height of the lower end of the nozzle 51.

[0063] In this embodiment, the mounting head 5 (holding head) holds a reference plate Tr (reference member) having a flat reference plane Trs using the nozzle 51. While the mounting head 5 holds the reference plate Tr, the projector 42 (illumination unit) irradiates the reference plane Trs of the reference plate Tr with pattern light Lp, while the component recognition camera 41 captures the reference plane Trs of the reference plate Tr to acquire a reference plane image Irs (steps S203-S204). The image processing unit 342 (three-dimensional shape acquisition unit) acquires a reference plane shape Srs indicating the three-dimensional shape of the reference plane Trs based on the reference plane image Irs (step S206). The main control unit 31 (flatness evaluation unit) sets the plane (regression plane) indicated by the reference plane shape Srs as the reference plane Pr and stores the reference plane Pr in the memory unit (step S207). In this configuration, an appropriate reference plane Pr can be set based on the results of measuring the three-dimensional shape of the flat reference plane Trs of the reference plate Tr.

[0064] Furthermore, multiple mounting heads 5 are provided, and one of the multiple mounting heads 5, which is the same as the mounting head 5 holding the reference plate Tr, holds the component E. While the projector 42 irradiates the main body bottom surface Es (substrate surface) of the component E with pattern light Lp, the component recognition camera 41 (imaging unit) captures the main body bottom surface Es of the component E to obtain a main body bottom surface image Is (substrate surface image). In this configuration, the mounting head 5 which holds the reference plate Tr for setting the reference plane Pr and the mounting head 5 which holds the component E for evaluating the flatness of the main body bottom surface Es of the component E are the same. Therefore, the flatness of the main body bottom surface Es can be evaluated based on comparison with the reference plane Pr while eliminating individual differences between the multiple mounting heads 5.

[0065] Furthermore, the method for setting the reference plane Pr is not limited to the above example using the reference plate Tr, and the reference plane Pr may be set based on the measured bottom surface shape Ses of the main body. Flatness can be evaluated based on the reference plane Pr set in this manner. This point will be explained next.

[0066] 11 is a diagram schematically illustrating a first example of a method for evaluating flatness by setting a reference plane based on the shape of the bottom surface of the main body. Calculations shown in FIG.

[0067] In the "reference plane fitting" step of FIG. 11 , a reference plane Pr is fitted to the measured body bottom shape Ses. In particular, in the first example, the reference plane Pr is set based on multiple edges Sst of the body bottom shape Ses. Various specific methods for selecting the edges Sst are conceivable. For example, the following can be selected as edges Sst: · Points located at the midpoints of each of the four sides of the rectangular body bottom shape Ses; · Points at the four corners of the rectangular body bottom shape Ses; · Points included in the point cloud that constitutes the four sides of the rectangular body bottom shape Ses. The main control unit 31 then sets the regression plane for the multiple edges Sst selected in this way as the reference plane Pr.

[0068] In the "difference calculation" step in Fig. 11, the difference Δ between the reference plane Pr thus set and the body bottom shape Ses is calculated. Furthermore, in the "pass / fail determination" step in Fig. 11, the pass / fail of the body bottom Es is determined based on the difference Δ, in the same manner as described above, based on the magnitude relationship between the difference Δ and the threshold H. Specifically, if the difference Δ (absolute value) is within the threshold H (absolute value), it is determined to be pass, and if the difference Δ exceeds the threshold H, it is determined to be fail.

[0069] In the above example, the main control unit 31 (flatness evaluation unit) sets a reference plane Pr based on the body bottom shape Ses, and evaluates the flatness of the body bottom surface Es based on a comparison between the reference plane Pr and the body bottom shape Ses. With this configuration, it is possible to set an appropriate reference plane Pr according to the shape of the body bottom surface Es of the part E, as described above.

[0070] In particular, the main control unit 31 sets the reference plane Pr based on the multiple ends Sst of the body bottom shape Ses. With this configuration, it is possible to set an appropriate reference plane Pr according to the shape of the body bottom surface Es of the part E.

[0071] Fig. 12 is a diagram schematically illustrating a second example of a method for evaluating flatness by setting a reference plane based on the shape of the bottom surface of the main body, and Figs. 13A to 13H are diagrams schematically illustrating the calculation contents executed by the method of Fig. 12. Each calculation shown in Figs. 12 and 13A to 13H is executed by main control unit 31.

[0072] In the "reference plane fitting" step in Fig. 12, a reference plane Pr is fitted to the measured body bottom shape Ses. In particular, in the second example, the calculations shown in Figs. 13A to 13G are performed to fit the reference plane Pr. These calculations shown in Figs. 13A to 13G are performed to identify the plane with the largest area among multiple planes with different inclinations included in the body bottom shape Ses.

[0073] As shown in FIG. 13A, a plurality of lattices K arranged in a two-dimensional matrix in the X and Y directions are set for the main body bottom shape Ses. Each lattice K has a rectangular shape with two sides parallel to the X direction and two sides parallel to the Y direction. Then, as shown in FIG. 13B, the height (value in the Z direction) of each lattice K indicated by the main body bottom shape Ses is calculated. The difference in height between each pair of lattices K adjacent in the X direction is calculated (FIG. 13C). Furthermore, the average value of the differences calculated for the lattices K arranged in a row in the X direction is calculated for each row (FIG. 13D).

[0074] Then, the absolute value of the difference between the height difference shown in Figure 13C and the average value of the differences shown in Figure 13D is calculated. That is, the calculation to find the absolute value of the difference between the difference of the target lattice K in Figure 13C and the average value in Figure 13D corresponding to the column to which the target lattice K belongs is performed while changing the target lattice K. Then, a "circle" indicating "OK" is marked for a lattice K whose absolute value is less than or equal to a predetermined offset (e.g., "1"), and an "x" indicating "NOGOOD" is marked for a lattice K whose absolute value exceeds the predetermined offset (Figure 13E).

[0075] As in the case of the X direction, the height difference between each two adjacent grids K in the Y direction is calculated ( FIG. 13F ). Furthermore, the average value of the differences calculated for multiple grids K arranged in a row in the Y direction is calculated for each row ( FIG. 13G ). The absolute value of the difference between the height difference shown in FIG. 13F and the average value of the differences shown in FIG. 13G is then calculated. That is, the calculation to calculate the absolute value of the difference between the difference of the target grid K in FIG. 13F and the average value in FIG. 13G corresponding to the column to which the target grid K belongs is performed while changing the target grid K. Then, a "circle" indicating "OK" is marked for grids K whose absolute value is less than a predetermined offset (e.g., "1"), and a "cross" indicating "NO GOOD" is marked for grids K whose absolute value exceeds the predetermined offset ( FIG. 13H ).

[0076] Then, among the rectangular regions formed by adjacent lattice Ks that are determined to be OK in the X direction (i.e., marked with a circle in FIG. 13E) and that are determined to be OK in the Y direction, the widest region (i.e., the region containing the largest number of lattice Ks) is identified as the maximum planar region. In the examples of FIGS. 13A to 13H, the hatched region in FIG. 13H is identified as the maximum planar region Rx.

[0077] Then, in the "reference plane fitting" step of FIG. 12 , a reference plane Pr is set based on the maximum planar region Rx. That is, the main control unit 31 sets the reference plane Pr so as to include a regression plane for the maximum planar region Rx. In the "difference calculation" step of FIG. 12 , the difference Δ between the reference plane Pr thus set and the body bottom shape Ses is calculated. Furthermore, in the "pass / fail determination" step of FIG. 12 , the pass / fail of the body bottom shape Es is determined based on the magnitude relationship between the difference Δ and a threshold H, as described above. Specifically, if the difference Δ (absolute value) is within the threshold H (absolute value), the body bottom shape Es is determined to be pass. If the difference Δ exceeds the threshold H, the body bottom shape Es is determined to be fail.

[0078] In the above example, the main control unit 31 (flatness evaluation unit) sets a reference plane Pr based on the body bottom shape Ses, and evaluates the flatness of the body bottom surface Es based on a comparison between the reference plane Pr and the body bottom shape Ses. With this configuration, it is possible to set an appropriate reference plane Pr according to the shape of the body bottom surface Es of the part E, as described above.

[0079] In particular, the main control unit 31 (flatness evaluation unit) sets the reference plane Pr based on the plane with the largest area (maximum plane region Rx) among the planes included in the body bottom shape Ses (substrate surface shape). With this configuration, it is possible to set an appropriate reference plane Pr according to the shape of the body bottom surface Es of the part E.

[0080] As described above, in the above embodiment, the component mounting system 1 corresponds to an example of a "component mounting system" of the present invention, the component mounter 2 corresponds to an example of a "component mounter" of the present invention, the tape feeder 23 corresponds to an example of a "component supply unit" of the present invention, the head unit 25 corresponds to an example of a "component mounting unit" of the present invention, the main control unit 31 corresponds to an example of a "flatness evaluation unit" of the present invention, the memory unit 32 corresponds to an example of a "memory unit" of the present invention, the image processing unit 342 corresponds to an example of a "three-dimensional shape acquisition unit" of the present invention, and the component recognition camera 41 corresponds to an example of a "component supply unit" of the present invention. corresponds to an example of the "imaging section" of the present invention, the projector 42 corresponds to an example of the "irradiation section" of the present invention, the controller 3 and the component recognition unit 4 work together to function as the "component substrate flatness evaluation device" of the present invention, the mounting head 5 corresponds to an example of the "holding head" of the present invention, the management server 9 corresponds to an example of the "data storage section" of the present invention, the component E corresponds to an example of the "component" of the present invention, the package body Eb corresponds to an example of the "substrate" of the present invention, the body bottom surface Es corresponds to an example of the "substrate surface" of the present invention, the body bottom surface image Is corresponds to an example of the "substrate surface image" of the present invention, the reference plane image Irs corresponds to an example of the "reference plane image" of the present invention, the reference plane Pr corresponds to an example of the "reference plane" of the present invention, the body bottom surface shape Ses corresponds to an example of the "substrate surface shape" of the present invention, the reference plane shape Srs corresponds to an example of the "reference plane shape" of the present invention, the reference plane Trs corresponds to an example of the "reference plane" of the present invention, and the reference plate Tr corresponds to an example of the "reference member" of the present invention.

[0081] The present invention is not limited to the above embodiment, and various modifications can be made to the above without departing from the spirit of the present invention. For example, the position error of the terminal Et of the component E can be evaluated based on the body bottom shape Ses (FIG. 14).

[0082] FIG. 14 is a diagram illustrating a first example of a method for determining the position error of a component terminal. In the example of FIG. 14, the main control unit 31 calculates the terminal position C as the difference in the Z direction between the reference plane Pr, determined based on the body bottom shape Ses, and the vertex of the terminal Et. The position of the vertex of the terminal Et can be determined based on the results of calculating the three-dimensional shape of the terminal Et contained in multiple body bottom images Is using the light-section method. The main control unit 31 then determines whether the terminal position C falls within a predetermined determination range. The main control unit 31 determines that a component E having a terminal Et whose terminal position C does not fall within the predetermined range is unacceptable, and determines that a component E in which the terminal positions C of all terminals Et fall within the predetermined range is acceptable.

[0083] In this modification, the component E has terminals Et provided on a package body Eb (substrate). The projector 42 (illumination unit) irradiates the terminals Et with patterned light Lp, and the component recognition camera 41 (imaging unit) captures the patterned light Lp irradiated by the projector 42 and reflected by the terminals Et to obtain a body bottom image Is (terminal image). The image processing unit 342 (three-dimensional shape acquisition unit) acquires a terminal shape representing the three-dimensional shape of the terminals Et based on the body bottom image Is, and the main control unit 31 evaluates the positional error of the terminals Et based on the body bottom shape Ses and the shape of the terminals Et. This configuration makes it possible to evaluate not only the flatness of the package body Eb of the component E, but also the error of the terminals Et of the component E.

[0084] Furthermore, the components E that are the subject of component inspection are not limited to components E whose terminals Et are arranged on the bottom surface Es of the main body as described above. In other words, components E having terminals Et (i.e., lead terminals) extending laterally from the package main body Eb can be subject to component inspection.

[0085] FIG. 15A is a bottom view schematically illustrating another example of the target component, and FIG. 15B is a side view schematically illustrating another example of the target component. The component E in FIGS. 15A and 15B has two terminals Et extending from both ends of the package body Eb. For such a component E, the bottom surface shape Ses of the body bottom Es can be obtained in the same manner as described above, and the flatness of the bottom surface shape Ses can be evaluated. Furthermore, the main control unit 31 can obtain the shape of each terminal Et using the optical section method and evaluate the positional error of the terminals Et by comparing the position of the lower end of the terminal Et with the bottom surface shape Ses.

[0086] Incidentally, the position error of the terminals Et of the component E has generally been evaluated by the difference between each terminal Et and a plane (regression plane) set based on the positions of multiple terminals Et. This method is ineffective when the number of terminals Et is one or two (see FIGS. 15A and 15B ) because the plane cannot be uniquely determined. In contrast, by evaluating the position error based on the bottom surface shape Ses of the body bottom surface Es and the shape of the terminals Et, it is possible to evaluate the position error of the terminals Et even when the number of terminals Et is one or two. However, it goes without saying that the number of terminals Et (lead terminals) of the component E is not limited to one or two, and may be three or more.

[0087] Furthermore, the method for acquiring the three-dimensional shape is not limited to the light-section method, but may also be the phase-shift method. In this case, the projector 42 sequentially irradiates the component E (the bottom surface Es and terminals Et) with four different patterned lights Lp, each having a sinusoidal pattern with a different phase from the others, while the component recognition camera 41 captures each patterned light Lp to acquire a bottom surface image Is containing each patterned light Lp. The image processing unit 342 then calculates the three-dimensional shape of the component E (the bottom surface Es and terminals Et) based on each bottom surface image Is. The flatness can then be evaluated based on the three-dimensional shape of the bottom surface Es, and the position error of the terminals Et can be evaluated based on the three-dimensional shape of the terminals Et. The three-dimensional shape of the reference plate Tr can also be calculated using the phase-shift method.

[0088] In particular, the light-section method and phase-shift method are advantageous over stereo matching. In other words, because the bottom surface Es of the component E to be inspected in FIG. 5 is relatively uniform, it is difficult to extract the feature points required for stereo matching from the bottom surface Es, and stereo matching is not suitable for acquiring the three-dimensional shape of the bottom surface Es. Therefore, the projector 42 (illumination unit) irradiates the bottom surface Es (substrate surface) with linear pattern light Lp (laser light), and the component recognition camera 41 (imaging unit) captures the pattern light Lp irradiated onto the bottom surface Es to acquire a bottom surface image Is (substrate surface image), thereby accurately acquiring the three-dimensional shape of the bottom surface Es (body bottom shape Ses). Alternatively, the projector 42 (illumination unit) sequentially illuminates multiple pattern lights Lp having different phases onto the bottom surface Es of the main body (substrate surface), and the component recognition camera 41 (imaging unit) captures the pattern lights Lp illuminated onto the bottom surface Es of the main body to obtain a main body bottom image Is (substrate surface image), thereby accurately obtaining the three-dimensional shape of the main body bottom surface Es (main body bottom shape Ses).

[0089] Furthermore, the component inspection of FIG. 5 may be performed to evaluate the flatness of the bottom surface Es of the body of a component E that does not have terminals Et.

[0090] 5 (the mechanism shown in FIG. 7) may be provided as a component inspection device separate from the component mounter 2. In this case, the component inspection of FIG. 5 can be performed by the component inspection device provided separate from the component mounter 2, and the flatness of the main body bottom surface Es of the component E and the position of the terminals Et can be evaluated.

[0091] Furthermore, the method for setting the reference plane Pr based on the measured body bottom shape Ses is not limited to the example shown in Fig. 11 or 12. That is, a regression plane calculated by regression analysis of the entire body bottom shape Ses may be set as the reference plane Pr.

[0092] Furthermore, the configuration of the head unit 25 is not limited to the rotary type described above, but may be an in-line type having a plurality of mounting heads 5 arranged in a line.

[0093] DESCRIPTION OF SYMBOLS 1...Component mounting system 2...Component mounter 23...Tape feeder (component supply section) 25...Head unit (component mounting section) 31...Main control section (flatness evaluation section) 32...Memory section 342...Image processing section (three-dimensional shape acquisition section) 41...Component recognition camera (imaging section) 42...Projector (irradiation section) 3...Controller (component substrate flatness evaluation device) 4...Component recognition unit (component substrate flatness evaluation device) 5...Mounting head (holding head) 9...Management server (data storage section) E...Component Eb...Package body (substrate) Es...Body bottom surface (substrate surface) Is...Body bottom surface image (substrate surface image) Irs...Reference plane image Pr...Reference plane Ses...Body bottom surface shape (substrate surface shape) Srs...Reference plane shape Trs...Reference plane Tr...Reference plate (reference member)

Claims

1. an irradiation unit that irradiates light onto a substrate surface that is a surface of a substrate of a component; an imaging unit that captures an image of the substrate surface by capturing light that is irradiated by the irradiating unit and reflected by the substrate surface; a three-dimensional shape acquisition unit that acquires a substrate surface shape indicating a three-dimensional shape of the substrate surface based on the substrate surface image; a flatness evaluation unit that evaluates the flatness of the substrate surface based on the substrate surface shape; A component substrate flatness evaluation device comprising:

2. 2. The component substrate flatness evaluation device according to claim 1, wherein the flatness evaluation unit evaluates the flatness of the substrate surface based on a comparison between a flat reference plane and the substrate surface shape.

3. 3. The component substrate flatness evaluation device according to claim 2, wherein the flatness evaluation unit determines that the substrate surface is flat when a difference between the substrate surface shape and the reference plane falls within a predetermined range, and determines that the substrate surface is not flat when the difference between the substrate surface shape and the reference plane falls outside the predetermined range.

4. Further, a storage unit that stores the reference plane is provided, 4. The component substrate flatness evaluation device according to claim 2, wherein the flatness evaluation unit evaluates the flatness of the substrate surface based on a comparison between the reference plane stored in the memory unit and the substrate surface shape.

5. a holding head capable of holding a reference member having a flat reference plane; With the holding head holding the reference member, the irradiation unit irradiates the reference plane of the reference member with light, while the imaging unit images the reference plane of the reference member to obtain a reference plane image; the three-dimensional shape acquisition unit acquires a reference plane shape indicating a three-dimensional shape of the reference plane based on the reference plane image; 5. The component substrate flatness evaluation device according to claim 4, wherein the flatness evaluation unit sets the plane indicated by the reference planar shape as the reference plane, and stores the reference plane in the storage unit.

6. a plurality of holding heads including the holding head are provided, 6. The component substrate flatness evaluation device according to claim 5, wherein, in a state where one of the plurality of holding heads that is the same holding head that holds the reference member holds the component, the irradiation unit irradiates the substrate surface of the component with light while the imaging unit images the substrate surface of the component to obtain the substrate surface image.

7. 3. The component substrate flatness evaluation device according to claim 2, wherein the flatness evaluation unit sets the reference plane based on the substrate surface shape, and evaluates the flatness of the substrate surface based on a comparison between the reference plane and the substrate surface shape.

8. The component substrate flatness evaluation device according to claim 7 , wherein the flatness evaluation unit sets the reference plane based on a plurality of edges of the substrate surface shape.

9. 8. The component substrate flatness evaluation device according to claim 7, wherein the flatness evaluation unit sets the reference plane based on a plane having a largest area among planes included in the substrate surface shape.

10. the component has a terminal provided on the substrate, the irradiating unit irradiates the terminal with light, the imaging unit captures an image of the terminal by capturing an image of light irradiated by the irradiation unit and reflected by the terminal; the three-dimensional shape acquisition unit acquires a terminal shape indicating a three-dimensional shape of the terminal based on the terminal image; 10. The component substrate flatness evaluation device according to claim 1, wherein the flatness evaluation unit evaluates the positional error of the terminals based on the substrate surface shape and the terminal shape.

11. the irradiation unit irradiates the surface of the substrate with linear laser light, The component substrate flatness evaluation device according to claim 1 , wherein the imaging unit acquires the substrate surface image by imaging the laser light irradiated onto the substrate surface.

12. the irradiation unit sequentially irradiates the substrate surface with a plurality of pattern lights having mutually different phases, The component substrate flatness evaluation device according to claim 1 , wherein the imaging unit acquires the substrate surface image by capturing an image of the pattern light irradiated onto the substrate surface.

13. a parts supply unit that supplies parts; a component mounting unit that mounts the components supplied by the component supply unit onto a board; The component substrate flatness evaluation device according to any one of claims 1 to 12, Equipped with The component substrate flatness evaluation device is a component mounter that evaluates the flatness of the substrate surface of the component supplied by the component supply unit before being mounted on the board.

14. The component mounter according to claim 13; Data storage unit and Equipped with The component mounting system according to claim 11, wherein the data storage unit stores the flatness evaluation results of the component by the component substrate flatness evaluation device and the substrate on which the component was mounted by the component mounter in association with each other.

15. irradiating a substrate surface, which is a surface of a substrate of a component, with light; acquiring an image of the substrate surface by capturing an image of the light reflected by the substrate surface; acquiring a substrate surface shape indicating a three-dimensional shape of the substrate surface based on the substrate surface image; evaluating the flatness of the substrate surface based on the substrate surface shape; A component substrate flatness evaluation method comprising:

16. an irradiation unit that irradiates light onto a substrate surface that is a surface of a substrate of a component; an imaging unit that captures an image of the substrate surface by capturing light that is irradiated by the irradiating unit and reflected by the substrate surface; a three-dimensional shape acquisition unit that acquires a substrate surface shape indicating a three-dimensional shape of the substrate surface based on the substrate surface image; a flatness evaluation unit that evaluates the flatness of the substrate surface based on the substrate surface shape; Equipped with The component has a package that defines the external appearance of the component, the package has a package body and a terminal provided on the package body; The component substrate flatness evaluation device, wherein the substrate of the component is the package body.

17. irradiating a substrate surface, which is a surface of a substrate of a component, with light; acquiring an image of the substrate surface by capturing an image of the light reflected by the substrate surface; acquiring a substrate surface shape indicating a three-dimensional shape of the substrate surface based on the substrate surface image; evaluating the flatness of the substrate surface based on the substrate surface shape; Equipped with The component has a package that defines the external appearance of the component, the package has a package body and a terminal provided on the package body; The component substrate flatness evaluation method, wherein the substrate of the component is the package body.