Power Conversion Equipment

Abstract

The power converter (100A, 100B, 100C, 100D) includes a cooler (10) and a component (50) disposed on the cooler. A coolant flow path (40) through which a coolant flows is provided inside the cooler. The flow path area of ​​the coolant flow path is reduced in a temperature range where the temperature of the component is equal to or higher than a reference temperature.

Description

[Technical field]

[0001] The present disclosure relates to a power conversion device. [Background technology]

[0002] Japanese Patent Laid-Open Publication No. 2015-130430 (Patent Document 1) describes a power module substrate with a heat sink. In the power module substrate with a heat sink described in Patent Document 1, deformation (warping) caused by temperature changes is suppressed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-130430 A Summary of the Invention [Problem to be solved by the invention]

[0004] A cooler for cooling components such as power devices is provided with a coolant passage through which a coolant flows. Typically, coolers are designed to increase the flow rate of the coolant by minimizing the flow area of ​​the coolant passage, thereby facilitating heat transfer to the coolant. In a design that reduces the flow area of ​​the coolant passage, the pressure loss increases when the coolant flows through the coolant passage. If deformation due to temperature changes is suppressed as in Patent Document 1, the pressure loss increases, and this is inefficient when there is no need for strong cooling of the components, i.e., when the components are at low temperatures.

[0005] The present disclosure has been made in view of the problems of the conventional techniques as described above. More specifically, the present disclosure provides a power conversion device capable of efficiently cooling components. [Means for solving the problem]

[0006] The power conversion device of the present disclosure includes: The heating apparatus has a jacket and a top plate attached to the jacket.The cooling device includes a cooler and a component disposed on the cooler. The cooler includes a coolant passage therein through which a coolant flows. The refrigerant flow path is defined by the inner space of the jacket and the top plate. do. The top plate has a first surface facing the interior space and a second surface opposite the first surface, and the component is disposed on the second surface. The flow area of ​​the coolant flow path is the temperature range where the component temperature is equal to or higher than the reference temperature. The warping of the top plate due to temperature changes in the components It will be reduced. Effect of the Invention

[0007] According to the power conversion device of the present disclosure, efficient cooling of components is possible. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a perspective view of a power conversion device 100A. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] FIG. 1 is a first explanatory diagram illustrating the operation of the power conversion device 100A. [Figure 4] FIG. 2 is a second explanatory diagram illustrating the operation of the power conversion device 100A. [Diagram 5] 1 is a schematic diagram of a cooling system 200 using a power conversion device 100A. [Figure 6] FIG. 10 is an explanatory diagram illustrating the operation of a power conversion device 100A according to a modified example. [Figure 7] FIG. 2 is a cross-sectional view of a power conversion device 100B. [Figure 8] FIG. 11 is a first explanatory diagram illustrating an operation of a power conversion device 100B according to a modified example. [Figure 9] FIG. 21 is a second explanatory diagram illustrating the operation of the power conversion device 100B according to the modified example. [Figure 10] FIG. 2 is a cross-sectional view of a power conversion device 100C. [Figure 11] 13 is a bottom view of the top plate 30 in the power conversion device 100C. FIG. [Figure 12] FIG. 11 is a first explanatory diagram illustrating an operation of a power conversion device 100C according to a modified example. [Figure 13] FIG. 21 is a second explanatory diagram illustrating the operation of the power conversion device 100C according to the modified example. [Figure 14] 13 is a bottom view of the top plate 30 in the power conversion device 100C according to a modified example. FIG. [Figure 15] FIG. 11 is a cross-sectional view of a power conversion device 100D. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The details of the embodiments of the present disclosure will be described with reference to the drawings. In the following drawings, the same or corresponding parts are designated by the same reference numerals, and redundant description will not be repeated.

[0010] Embodiment 1 A description will be given of a power conversion device according to embodiment 1. The power conversion device according to embodiment 1 is designated as a power conversion device 100A.

[0011] (Configuration of power conversion device 100A) The configuration of the power conversion device 100A will be described below.

[0012] Fig. 1 is a perspective view of a power converter 100A. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. As shown in Fig. 1 and Fig. 2, the power converter 100A includes a cooler 10 and a component 50.

[0013] The cooler 10 has a jacket 20 and a top plate 30. Inside the cooler 10, there is a refrigerant flow path 40. A refrigerant flows through the refrigerant flow path 40. The refrigerant is, for example, water.

[0014] The jacket 20 has a side wall 21 and a bottom wall 22. The bottom wall 22 is continuous with the lower end of the side wall 21. The space defined by the side wall 21 and the bottom wall 22 is defined as an internal space 23 of the jacket 20. A refrigerant inlet 21a and a refrigerant outlet 21b are formed in the side wall 21. The refrigerant inlet 21a and the refrigerant outlet 21b communicate the internal space 23 with the outside of the jacket 20.

[0015] The top plate 30 has a first surface 30a and a second surface 30b. The first surface 30a and the second surface 30b are end surfaces in the thickness direction of the top plate 30. The second surface 30b is the surface opposite to the first surface 30a. The top plate 30 is attached to the jacket 20 so as to close the internal space 23. When the top plate 30 is attached to the jacket 20, the first surface 30a faces the internal space 23. The refrigerant flow path 40 is defined by the internal space 23 and the top plate 30 (the first surface 30a). The refrigerant flowing in from the refrigerant inlet 21a flows through the refrigerant flow path 40 and flows out from the refrigerant outlet 21b. In FIG. 2, the refrigerant flows in a direction perpendicular to the paper surface.

[0016] A plurality of fins 31 are formed on the first surface 30a. The fins 31 protrude from the first surface 30a toward the opposite side to the second surface 30b. That is, the plurality of fins 31 are located inside the coolant flow path 40.

[0017] The component 50 is disposed on the cooler 10. More specifically, the component 50 is disposed on the second surface 30b. The component 50 is, for example, a power device having a power semiconductor element such as a metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), or a diode. However, the component 50 is not limited thereto. The component 50 may be, for example, a capacitor. The component 50 is in surface contact with the cooler 10 (the second surface 30b), for example. The component 50 has, for example, a housing 51 and a terminal 52 protruding from the housing 51. The housing 51 seals the power semiconductor element, and the terminal 52 is electrically connected to the power semiconductor element.

[0018] FIG. 3 is a first explanatory diagram for explaining the operation of the power conversion device 100A. FIG. 4 is a second explanatory diagram for explaining the operation of the power conversion device 100A. FIG. 3 shows the state of the power conversion device 100A in a temperature range in which the temperature of the component 50 is less than a reference temperature, and FIG. 4 shows the state of the power conversion device 100A in a temperature range in which the temperature of the component 50 is equal to or higher than the reference temperature. The reference temperature is, for example, the lowest temperature in the operating temperature range of the component 50. As shown in FIG. 3 and FIG. 4, the top plate 30 warps toward the opposite side to the internal space 23 in a temperature range in which the temperature of the component 50 is less than the reference temperature, while it warps toward the internal space 23 in a temperature range in which the temperature of the component 50 is equal to or higher than the reference temperature. As a result, the flow path area of ​​the coolant flow path 40 is reduced in a temperature range in which the temperature of the component 50 is equal to or higher than the reference temperature.

[0019] The above-mentioned change in the flow path area of ​​the coolant flow path 40 is realized by making the linear expansion coefficient of the top plate 30 larger than that of the component 50. In order to obtain a sufficient reduction in the flow path area of ​​the coolant flow path 40, the difference between the linear expansion coefficient of the top plate 30 and the linear expansion coefficient of the component 50 is, for example, 3 ppm / K or more and 10 ppm / K or less. This difference in linear expansion coefficient is preferably 7 ppm / K or more. For example, when the constituent material of the top plate 30 is aluminum, aluminum alloy, copper, etc., and the component 50 is a DCB (Direct Copper Bonding) substrate (i.e., a substrate having a ceramic insulating layer and a copper wiring layer disposed on the ceramic insulating layer), such a difference in linear expansion coefficient can be realized. The linear expansion coefficient of the top plate 30 and the linear expansion coefficient of the component 50 are, for example, 17 ppm / K or more and 10 ppm / K or less, respectively.

[0020] Even if the difference between the linear expansion coefficient of the top plate 30 and the linear expansion coefficient of the component 50 is small, the flow path area of ​​the refrigerant flow path 40 can be sufficiently reduced by reducing the rigidity of the top plate 30 (reducing the thickness of the top plate 30) or increasing the range of change in temperature of the component 50. The change in the flow path area of ​​the refrigerant flow path 40 as described above may be achieved by making the linear expansion coefficient of the jacket 20 larger than that of the top plate 30.

[0021] The jacket 20 is made of, for example, an aluminum alloy. The top plate 30 is made of, for example, aluminum, an aluminum alloy, copper, a copper alloy, or MMC (Metal Matrix Composites). The housing 51 is made of, for example, an epoxy resin containing silica filler. The terminals 52 are made of, for example, copper. The housing 51 may be formed by dropping silicone gel or the like into a formwork.

[0022] FIG. 5 is a schematic diagram of a cooling system 200 using the power conversion device 100A. As shown in FIG. 5, the cooling system 200 includes the power conversion device 100A, a pump 110, and other component groups 120. The pump 110 circulates the coolant. As a result, the coolant flows into the coolant flow passage 40 from the coolant inlet 21a and flows out from the coolant outlet 21b. The coolant that flows out from the coolant outlet 21b passes through the coolers of the other component groups 120 and returns to the pump 110. In this way, in the cooling system 200, the other component groups 120 connected in series to the power conversion device 100A are also cooled in the same manner.

[0023] (Effects of the power conversion device 100A) The effects of the power conversion device 100A will be described below.

[0024] When the temperature of the component 50 is low, the need for cooling the component 50 by the cooler 10 is low, whereas when the temperature of the component 50 is high, the need for cooling the component 50 by the cooler 10 is high. In the power conversion device 100A, when the temperature of the component 50 is high, the flow path area of ​​the refrigerant flow path 40 is reduced, and the cooling performance of the cooler 10 is improved. On the other hand, when the temperature of the component 50 is low, the flow path area of ​​the refrigerant flow path 40 is expanded, and the cooling performance is reduced, but instead the pressure loss when the refrigerant flows through the refrigerant flow path 40 is reduced. Therefore, the power conversion device 100A enables efficient cooling of the component 50 according to the temperature of the component 50.

[0025] (Modification) Below, a modification of the power conversion device 100A will be described.

[0026] FIG. 6 is an explanatory diagram for explaining the operation of the power conversion device 100A according to the modified example. As shown in FIG. 6, as the temperature of the component 50 rises, the tip of the fin 31 may come into contact with the jacket 20 (bottom wall 22). When the tip of the fin 31 comes into contact with the jacket 20, the space between the tip of the fin 31 and the jacket 20 disappears, and the coolant stops flowing in the space, so that the coolant tends to flow between the adjacent fins 31. As a result, the cooling efficiency when the temperature of the component 50 rises is further improved. When the temperature of the component 50 is low, the tip of the fin 31 moves away from the jacket 20.

[0027] It is possible to arbitrarily set the temperature at which the tip of the fin 31 contacts the jacket 20. For example, by adding a warp to the top plate 30 before attaching it to the jacket 20 and adjusting the degree of the warp, it is possible to adjust the temperature of the component 50 when the tip of the fin 31 contacts the jacket 20.

[0028] Embodiment 2 A power conversion device according to the second embodiment will be described. The power conversion device according to the second embodiment is assumed to be a power conversion device 100B. Here, differences from the power conversion device 100A will be mainly described, and overlapping descriptions will not be repeated.

[0029] (Configuration of power conversion device 100B) The configuration of the power conversion device 100B will be described below.

[0030] Fig. 7 is a cross-sectional view of the power converter 100B. As shown in Fig. 7, the power converter 100B has a cooler 10 and a component 50. In the power converter 100B, the cooler 10 has a jacket 20 and a top plate 30, and a refrigerant flow path 40 is provided inside the cooler 10. In these respects, the configuration of the power converter 100B is common to the configuration of the power converter 100A.

[0031] In the power converter 100B, the top plate 30 is composed of a plurality of layers. In the example shown in FIG. 7, the top plate 30 is composed of two layers (a first layer 32 and a second layer 33), and the fins 31 form a part of the second layer 33. The second layer 33 is closer to the first surface 30a (closer to the refrigerant flow path 40) than the first layer 32. The layers constituting the top plate 30 have a larger linear expansion coefficient as they are closer to the first surface 30a (closer to the refrigerant flow path 40). In the example shown in FIG. 7, the linear expansion coefficient of the second layer 33 is larger than that of the first layer 32. The material of the first layer 32 is, for example, copper, a copper alloy, or MMC. The material of the second layer 33 is, for example, aluminum, an aluminum alloy. In these respects, the configuration of the power converter 100B is different from the configuration of the power converter 100A.

[0032] (Effects of power conversion device 100B) The effects of the power conversion device 100B will be described below.

[0033] In the power conversion device 100B, due to the difference in the linear expansion coefficient between the first layer 32 and the second layer 33, the flow path area of ​​the refrigerant flow path 40 decreases as the temperature of the component 50 increases, while the flow path area of ​​the refrigerant flow path 40 increases as the temperature of the component 50 decreases. As a result, as with the power conversion device 100A, efficient cooling of the component 50 is possible in accordance with the temperature of the component 50.

[0034] In the power conversion device 100B, the linear expansion coefficient of each of the multiple layers constituting the top plate 30 changes to become larger as they approach the refrigerant flow path 40, making it possible to reduce the stress generated between adjacent layers and improve the structural reliability of the top plate 30.

[0035] (Modification) A modification of the power conversion device 100B will be described below.

[0036] Fig. 8 is a first explanatory diagram explaining the operation of the power conversion device 100B according to the modified example. Fig. 9 is a second explanatory diagram explaining the operation of the power conversion device 100B according to the modified example. As shown in Figs. 8 and 9, the area of ​​the first layer 32 may be smaller than the area of ​​the second layer 33 in a plan view. That is, the outer periphery of the first layer 32 may be located inside the outer periphery of the second layer 33 in a plan view.

[0037] The outer peripheral edge of the second layer 33 in plan view may be thicker than a portion of the second layer 33 located inside the outer peripheral edge. The outer peripheral edge of the second layer 33 is on the upper end of the side wall 21. The first layer 32 is not disposed on the outer peripheral edge of the second layer 33. It is not necessary for the outer peripheral edge of the second layer 33 to be thick over the entire circumference. The outer peripheral edge of the second layer 33 may be thicker in parts.

[0038] The top plate 30 exhibits a large amount of warpage deformation inside the outer peripheral edge of the second layer 33 due to the difference between the linear expansion coefficient of the first layer 32 and the linear expansion coefficient of the second layer 33. On the other hand, the outer peripheral edge of the second layer 33 has a large thickness, so the amount of warpage deformation is small. As a result, the coolant is less likely to flow out from between the jacket 20 and the top plate 30. In this way, with the above configuration, it is possible to reduce the risk of coolant leakage while achieving efficient cooling of the component 50 according to the temperature of the component 50.

[0039] Embodiment 3 A power conversion device according to the third embodiment will be described. The power conversion device according to the third embodiment is assumed to be a power conversion device 100C. Here, differences from the power conversion device 100A will be mainly described, and overlapping descriptions will not be repeated.

[0040] (Configuration of power conversion device 100C) The configuration of the power conversion device 100C will be described below.

[0041] Fig. 10 is a cross-sectional view of the power converter 100C. As shown in Fig. 10, the power converter 100C has a cooler 10 and a component 50. In the power converter 100C, the cooler 10 has a jacket 20 and a top plate 30, and a refrigerant flow path 40 is provided inside the cooler 10. In these respects, the configuration of the power converter 100C is common to the configuration of the power converter 100A.

[0042] FIG. 11 is a bottom view of the top plate 30 in the power converter 100C. In FIG. 11, the fins 31 are omitted. As shown in FIG. 10 and FIG. 11, the first surface 30a has a first region 30aa and a second region 30ab. The first region 30aa is a region of the first surface 30a that overlaps with the component 50 in a plan view. The second region 30ab is a region of the first surface 30a that does not overlap with the component 50 in a plan view. In the example shown in FIG. 11, one component 50 is disposed in the center of the top plate 30 in a plan view, and the second region 30ab surrounds the periphery of the first region 30aa.

[0043] The fins 31 formed in the first region 30aa are referred to as fins 31a. The fins 31 formed in the second region 30ab are referred to as fins 31b. The fins 31b are longer than the fins 31a. In these respects, the configuration of the power conversion device 100C differs from the configuration of the power conversion device 100A.

[0044] (Effects of the power conversion device 100C) The effects of the power conversion device 100C will be described below.

[0045] Fig. 12 is a first explanatory diagram explaining the operation of the power conversion device 100C according to the modified example. Fig. 13 is a second explanatory diagram explaining the operation of the power conversion device 100C according to the modified example. As shown in Fig. 12 and Fig. 13, when the temperature of the component 50 decreases, the top plate 30 warps toward the side opposite to the internal space 23, whereas when the temperature of the component 50 increases, the top plate warps toward the internal space 23.

[0046] As described above, since the fins 31b are longer than the fins 31a, when the temperature of the component 50 rises, the height positions of the tips of the fins 31a and 31b become closer to each other, and the clearance between the tips of the fins 31a and 31b and the jacket 20 (bottom wall 22) becomes narrower. As a result, the coolant is less likely to flow between the tips of the fins 31a and 31b and the jacket 20, and is more likely to flow between the adjacent fins 31. In this way, according to the power conversion device 100C, the cooling efficiency when the temperature of the component 50 rises is further improved.

[0047] (Modification) A modification of the power conversion device 100C will be described below.

[0048] Fig. 14 is a bottom view of the top plate 30 in a power converter 100C according to a modified example. As shown in Fig. 14, when a plurality of components 50 are arranged in a row along the direction of the coolant flow, the first region 30aa may be disposed between two second regions 30ab in a direction perpendicular to the coolant flow. That is, the first region 30aa and the second region 30ab may be disposed in a stripe pattern.

[0049] Embodiment 4 A power conversion device according to embodiment 4 will be described. The power conversion device according to embodiment 4 is assumed to be a power conversion device 100D. Here, differences from the power conversion device 100A will be mainly described, and overlapping descriptions will not be repeated.

[0050] (Configuration of power conversion device 100D) The configuration of the power conversion device 100D will be described below.

[0051] Fig. 15 is a cross-sectional view of the power converter 100D. As shown in Fig. 15, the power converter 100D has a cooler 10 and a component 50. In the power converter 100D, the cooler 10 has a jacket 20 and a top plate 30, and a refrigerant flow path 40 is provided inside the cooler 10. In these respects, the configuration of the power converter 100D is common to the configuration of the power converter 100A.

[0052] The power converter 100D has a plate member 60. The plate member 60 is disposed in the internal space 23 so as to face the top plate 30 with a gap therebetween. In the power converter 100D, the refrigerant flow path 40 is defined by the internal space 23, the top plate 30 (first surface 30a), and the plate member 60. The plate member 60 is composed of a plurality of layers. In the example shown in FIG. 15, the plate member 60 is composed of a first layer 61 and a second layer 62. The layers constituting the plate member 60 have a smaller linear expansion coefficient as they are closer to the refrigerant flow path 40. In the example shown in FIG. 15, the linear expansion coefficient of the first layer 61 is smaller than that of the second layer 62. The material of the first layer 61 is, for example, copper, a copper alloy, or MMC. The material of the second layer 62 is, for example, aluminum, an aluminum alloy. In these respects, the configuration of the power converter 100D is different from the configuration of the power converter 100A.

[0053] (Effects of the power conversion device 100D) The effects of the power conversion device 100D will be described below.

[0054] As described above, the linear expansion coefficient of the first layer 61 is smaller than the linear expansion coefficient of the second layer 62. Therefore, in the power conversion device 100D, when the temperature of the component 50 rises, the plate member 60 warps toward the top plate 30, and the flow path area of ​​the coolant flow path 40 is reduced. On the other hand, when the temperature of the component 50 drops, the plate member 60 warps toward the opposite side to the top plate 30, and the flow path area of ​​the coolant flow path 40 is expanded. Therefore, according to the power conversion device 100D, like the power conversion device 100A, the component 50 can be efficiently cooled in accordance with the temperature of the component 50.

[0055] (Modification) A modification of the power conversion device 100D will be described below.

[0056] Since the jacket 20 is usually a part of the inverter housing, it has high rigidity and hardly warps. However, in the power conversion device 100D, the flow path area of ​​the coolant flow path 40 may be changed according to the temperature of the component 50 by, for example, reducing the thickness of the jacket 20 to lower the rigidity of the jacket 20. In this case, the power conversion device 100D may not have the plate member 60. In this case, the thickness of the jacket 20 is preferably 0.5 mm or more and 3.0 mm or more from the viewpoint of ensuring the strength of the jacket 20 while enabling the flow path area of ​​the coolant flow path 40 to be changed.

[0057] (Additional Note) Aspects of the present disclosure are summarized in the appendix.

[0058] <Appendix 1> A cooler; a component disposed on the cooler; The cooler includes a refrigerant flow passage through which a refrigerant flows. A power conversion device, wherein a flow path area of ​​the coolant flow path is reduced in a temperature range in which the temperature of the component is equal to or higher than a reference temperature.

[0059] <Appendix 2> The cooler has a jacket and a top plate, The refrigerant flow path is defined by an internal space of the jacket and the top plate, The top plate has a first surface facing the internal space and a second surface opposite the first surface, the component is disposed on the second surface; 2. The power conversion device of claim 1, wherein the linear expansion coefficient of the top plate is greater than the linear expansion coefficient of the component.

[0060] <Appendix 3> The cooler has a jacket and a top plate, The refrigerant flow path is defined by an internal space of the jacket and the top plate, The top plate has a first surface facing the internal space and a second surface opposite the first surface, the component is disposed on the second surface; 2. The power conversion device according to claim 1, wherein the jacket has a greater linear expansion coefficient than the top plate.

[0061] <Appendix 4> The cooler has a jacket and a top plate, The refrigerant flow path is defined by an internal space of the jacket and the top plate, The top plate has a first surface facing the internal space and a second surface opposite the first surface, the component is disposed on the second surface; 2. The power conversion device according to claim 1, wherein the top plate is composed of a plurality of layers stacked along a thickness direction of the top plate.

[0062] <Appendix 5> the plurality of layers includes a first layer and a second layer located closer to the first surface than the first layer; 5. The power conversion device according to claim 4, wherein the second layer has a greater linear expansion coefficient than the first layer.

[0063] <Appendix 6> the plurality of layers includes a first layer and a second layer located closer to the first surface than the first layer; In a plan view, an area of ​​the first layer is smaller than an area of ​​the second layer, The power conversion device of claim 4, wherein the thickness of the second layer is at least partially thicker at the outer periphery than inside the outer periphery.

[0064] <Appendix 7> The cooler has a jacket and a top plate, The refrigerant flow path is defined by an internal space of the jacket and the top plate, The top plate has a first surface facing the internal space and a second surface opposite the first surface, the component is disposed on the second surface; A plurality of fins are formed on the first surface, the first surface has a first region that overlaps with the component in a plan view and a second region that does not overlap with the component in a plan view; the plurality of fins includes a first fin formed in the first region and a second fin formed in the second region; 2. The power conversion device of claim 1, wherein the second fin is longer than the first fin.

[0065] <Appendix 8> The cooler has a jacket and a top plate, The refrigerant flow path is defined by an internal space of the jacket and the top plate, The top plate has a first surface facing the internal space and a second surface opposite the first surface, the component is disposed on the second surface; A plurality of fins are formed on the first surface, 2. The power conversion device according to claim 1, wherein at least a portion of the plurality of fins contact the jacket when a flow path area of ​​the coolant flow path is reduced.

[0066] <Appendix 9> The cooler has a jacket, a top plate, and a plate member, The plate member is disposed in the internal space of the jacket, The refrigerant flow path is defined by the internal space, the top plate, and the plate member, The top plate has a first surface facing the internal space and a second surface opposite the first surface, the component is disposed on the second surface; The second surface has a plurality of fins formed thereon, 2. The power conversion device according to claim 1, wherein an area of ​​the coolant flow path is changed by warping deformation of the plate member due to a temperature change of the component.

[0067] <Appendix 10> The cooler has a jacket and a top plate, The refrigerant flow path is defined by an internal space of the jacket and the top plate, The top plate has a first surface facing the internal space and a second surface opposite the first surface, the component is disposed on the second surface; 2. The power conversion device of claim 1, wherein an area of ​​the coolant flow path is changed by warping deformation of the jacket due to a temperature change of the component.

[0068] <Appendix 11> The power conversion device according to any one of Supplementary Note 1 to Supplementary Note 10, wherein the reference temperature is a minimum temperature in an operating range temperature of the component.

[0069] <Appendix 12> 12. The power conversion apparatus according to any one of claims 1 to 11, wherein the component is a power device.

[0070] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of this application is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0071] 100A, 100B, 100C, 100D power conversion device, 10 cooler, 20 jacket, 21 side wall, 21a refrigerant inlet, 21b refrigerant outlet, 22 bottom wall, 23 internal space, 30 top plate, 30a first surface, 30aa first region, 30ab second region, 30b second surface, 31, 31a, 31b fins, 32 first layer, 33 second layer, 40 refrigerant flow path, 50 component, 51 housing, 52 terminal, 60 plate member, 61 first layer, 62 second layer, 110 pump, 120 component group, 200 cooling system.

Claims

1. A cooler having a jacket and a top plate attached to the jacket; a component disposed on the cooler; The cooler includes a refrigerant flow passage through which a refrigerant flows. The refrigerant flow path is defined by an internal space of the jacket and the top plate, The top plate has a first surface and a second surface opposite to the first surface, the component is disposed on the second surface; A power conversion device, wherein a flow path area of ​​the coolant flow path is reduced due to warping deformation of the top plate caused by temperature changes of the component in a temperature range in which the temperature of the component is equal to or higher than a reference temperature.

2. A cooling device, a component disposed on the cooler; The cooler includes a refrigerant flow passage through which a refrigerant flows. a flow path area of ​​the refrigerant flow path is reduced in a temperature range in which the temperature of the component is equal to or higher than a reference temperature; The cooler has a jacket and a top plate, The refrigerant flow path is defined by an internal space of the jacket and the top plate, The top plate has a first surface facing the internal space and a second surface opposite to the first surface, the component is disposed on the second surface; A power conversion device, wherein the linear expansion coefficient of the top plate is greater than the linear expansion coefficient of the component.

3. A cooling device, a component disposed on the cooler; The cooler includes a refrigerant flow passage through which a refrigerant flows. a flow path area of ​​the refrigerant flow path is reduced in a temperature range in which the temperature of the component is equal to or higher than a reference temperature; The cooler has a jacket and a top plate, The refrigerant flow path is defined by an internal space of the jacket and the top plate, The top plate has a first surface facing the internal space and a second surface opposite to the first surface, the component is disposed on the second surface; A power conversion device, wherein the jacket has a larger linear expansion coefficient than the top plate.

4. A power conversion device as described in claim 1, wherein the top plate is composed of multiple layers stacked along the thickness direction of the top plate.

5. the plurality of layers includes a first layer and a second layer located closer to the first surface than the first layer; The power conversion device according to claim 4 , wherein the second layer has a linear expansion coefficient greater than a linear expansion coefficient of the first layer.

6. the plurality of layers includes a first layer and a second layer located closer to the first surface than the first layer; In a plan view, an area of ​​the first layer is smaller than an area of ​​the second layer, The power conversion device according to claim 4 , wherein the thickness of the second layer is at least partially greater at the outer periphery than an inside of the outer periphery.

7. A plurality of fins are formed on the first surface, the first surface has a first region that overlaps with the component in a plan view and a second region that does not overlap with the component in a plan view; the plurality of fins include a first fin formed in the first region and a second fin formed in the second region; The power converter according to claim 1 , wherein the second fin is longer than the first fin.

8. A cooling device, a component disposed on the cooler; The cooler includes a refrigerant flow passage through which a refrigerant flows. a flow path area of ​​the refrigerant flow path is reduced in a temperature range in which the temperature of the component is equal to or higher than a reference temperature; The cooler has a jacket and a top plate, The refrigerant flow path is defined by an internal space of the jacket and the top plate, The top plate has a first surface facing the internal space and a second surface opposite to the first surface, the component is disposed on the second surface; A plurality of fins are formed on the first surface, At least a portion of the fins come into contact with the jacket when a flow path area of ​​the coolant flow path is reduced.

9. A cooler having a jacket, a top plate attached to the jacket, and a plate member disposed in an internal space of the jacket; a component disposed on the cooler; The cooler includes a refrigerant flow passage through which a refrigerant flows. The refrigerant flow path is defined by the internal space, the top plate, and the plate member, The top plate has a first surface facing the internal space and a second surface opposite to the first surface, the component is disposed on the second surface; The second surface has a plurality of fins formed thereon, A power conversion device, wherein the area of ​​the coolant flow path is changed by warping deformation of the plate member accompanying temperature changes of the component in a temperature range in which the temperature of the component is equal to or higher than a reference temperature.

10. A cooler having a jacket, a top plate attached to the jacket, and a plate member disposed in an internal space of the jacket; a component disposed on the cooler; The cooler includes a refrigerant flow passage through which a refrigerant flows. The refrigerant flow path is defined by an internal space of the jacket and the top plate, The top plate has a first surface facing the internal space and a second surface opposite to the first surface, the component is disposed on the second surface; A power conversion device, wherein the area of ​​the coolant flow path is changed by warping deformation of the jacket accompanying temperature changes of the component in a temperature range in which the temperature of the component is equal to or higher than a reference temperature.

11. The power conversion device according to claim 1 , wherein the reference temperature is a minimum temperature in an operating range temperature of the component.

12. The power conversion apparatus according to claim 1 , wherein the component is a power device.