Multi-layer substrate

Abstract

The multilayer board comprises a board body (11) made of resin or ceramics, a hollow portion (12) provided inside the board body 11, a magnet (13) provided inside the hollow portion (12), and a coil (16) provided around the hollow portion (12) in the board body (11).

Description

[Technical field]

[0001] The present disclosure relates to a multi-layer substrate incorporating a movable part. [Background technology]

[0002] Patent Document 1 discloses a technique in which a multilayer board has a hollow structure and electronic components are mounted inside the hollow portion. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2004-179573 A Summary of the Invention [Problem to be solved by the invention]

[0004] The multilayer board disclosed in Patent Document 1 is designed to mount electronic components within a hollow portion, but the electronic components are not movable within the hollow portion.

[0005] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a multilayer substrate in which a movable part can be moved inside a hollow part. [Means for solving the problem]

[0006] The multilayer substrate according to the present disclosure includes a substrate body made of resin or ceramics, a hollow portion provided inside the substrate body, a movable portion provided inside the hollow portion and made of a conductor or magnetic material, and a coil provided around the hollow portion in the substrate body. The movable portion includes a protrusion portion formed of a conductive material on the lower surface of the movable portion, a waveguide provided on the substrate body, and a cavity resonator provided in the middle of the waveguide and into which the protrusion portion is inserted and removed. It is something. Effect of the Invention

[0007] According to the present disclosure, the movable part can be moved inside the hollow part. At this time, the present disclosure allows the hollow part to be manufactured without using semiconductor manufacturing technology and MEMS (Micro Electro Mechanical Systems) technology. [Brief description of the drawings]

[0008] [Figure 1] 1A is a vertical cross-sectional view of a multilayer board according to embodiment 1, showing a state in which a magnet has moved downward in a hollow space (non-conductive state), and FIG 1B is a view showing a state in which a magnet has moved upward in a hollow space (conductive state). [Diagram 2] Fig. 2A is a cross-sectional view of a multilayer substrate according to embodiment 1. Fig. 2A is a cross-sectional view taken along line AA in Fig. 1A. Fig. 2B is a cross-sectional view taken along line BB in Fig. 1A. Fig. 2C is a cross-sectional view taken along line CC in Fig. 1A. [Diagram 3] 3A is a diagram showing a configuration of a first modified example of a multilayer substrate according to embodiment 1. FIG 3A is a vertical cross-sectional view of the first modified example. FIG 3B is a cross-sectional view taken along the line DD in FIG 3. [Figure 4] 4A and 4B are diagrams illustrating configurations of modified examples 2 and 3 of the multilayer substrate according to embodiment 1. Fig. 4A is a vertical cross-sectional view of modified example 2. Fig. 4B is a vertical cross-sectional view of modified example 3. [Diagram 5] 5A and 5B are diagrams illustrating configurations of fourth and fifth modified examples of the multilayer substrate according to the embodiment 1. FIG 5A is a vertical cross-sectional view of the fourth modified example. FIG 5B is a vertical cross-sectional view of the fifth modified example. [Figure 6] FIG. 13 is a vertical sectional view of a sixth modified example of the multilayer substrate according to the first embodiment. [Figure 7] 7A and 7B are longitudinal sectional views of a multilayer board according to embodiment 2. Fig. 7A is a diagram showing a state in which the magnet has been moved to an upper part of a hollow portion, and Fig. 7B is a diagram showing a state in which the magnet has been moved to a lower part of the hollow portion. [Figure 8] 8A and 8B are diagrams illustrating configurations of first and second modified examples of a multilayer substrate according to embodiment 2. FIG 8A is a vertical cross-sectional view of the first modified example. FIG 8B is a vertical cross-sectional view of the second modified example. [Figure 9]9A and 9B are diagrams illustrating configurations of third and fourth modified examples of the multilayer substrate according to the second embodiment, respectively. FIG 9A is a vertical cross-sectional view of the third modified example. FIG 9B is a vertical cross-sectional view of the fourth modified example. [Figure 10] FIG. 11 is a vertical cross-sectional view of a multilayer board according to a third embodiment. [Figure 11] Fig. 11A is a cross-sectional view of a multilayer substrate according to embodiment 3. Fig. 11A is a cross-sectional view taken along line EE in Fig. 10. Fig. 11B is a cross-sectional view taken along line FF in Fig. 10. Fig. 11C is a cross-sectional view taken along line GG in Fig. 10. [Figure 12] FIG. 11 is a vertical cross-sectional view of a first modified example of a multilayer substrate according to a third embodiment. [Figure 13] Fig. 13A is a cross-sectional view of a first modified example of the multilayer substrate according to the third embodiment. Fig. 13A is a cross-sectional view taken along the line HH in Fig. 12. Fig. 13B is a cross-sectional view taken along the line II in Fig. 12. Fig. 13C is a cross-sectional view taken along the line JJ in Fig. 12. [Figure 14] FIG. 13 is a vertical cross-sectional view of a second modified example of the multilayer substrate according to the third embodiment. [Figure 15] FIG. 11 is a vertical cross-sectional view of a multilayer substrate according to a fourth embodiment. [Figure 16] 16A and 16B are diagrams illustrating configurations of first and second modified examples of a multilayer substrate according to embodiment 4. FIG 16A is a vertical cross-sectional view of the first modified example. FIG 16B is a vertical cross-sectional view of the second modified example. [Figure 17] Fig. 17A is a vertical cross-sectional view of Modification 3 of the multilayer substrate according to the fourth embodiment. Fig. 17B is a cross-sectional view taken along the line KK in Fig. 17A. Fig. 17C is a cross-sectional view taken along the line LL in Fig. 17A. [Figure 18] 18A and 18B are longitudinal sectional views of a multilayer board according to embodiment 5. Fig. 18A is a diagram showing a non-conducting state of a magnet, and Fig. 18B is a diagram showing a conducting state of a magnet. [Figure 19] Fig. 19A is a cross-sectional view of a multilayer board according to embodiment 5. Fig. 19A is a cross-sectional view taken along the line MM in Fig. 18A. Fig. 19B is a cross-sectional view taken along the line NN in Fig. 18A. Fig. 19C is a cross-sectional view taken along the line OO in Fig. 18A. Fig. 19D is a cross-sectional view taken along the line PP in Fig. 18A. [Figure 20]FIG. 13 is a longitudinal sectional view of a modified example 1-4 of the multilayer substrate according to the fifth embodiment. [Figure 21] FIG. 13 is a vertical cross-sectional view of a multilayer board according to a sixth embodiment. [Figure 22] FIG. 13 is a vertical cross-sectional view of a multilayer substrate according to a seventh embodiment. [Figure 23] FIG. 23 is a vertical cross-sectional view of a first modified example of a multilayer substrate according to the seventh embodiment. [Figure 24] FIG. 23 is a vertical cross-sectional view of a second modified example of a multilayer substrate according to the seventh embodiment. [Diagram 25] Fig. 25A is a vertical cross-sectional view of the multilayer board according to embodiment 8 when the magnet has been moved to the right side of the hollow part. Fig. 25B is a cross-sectional view taken along the line QQ in Fig. 25A. [Figure 26] Fig. 26A is a vertical cross-sectional view of the multilayer board according to embodiment 8 when the magnet has been moved to the left side of the hollow part. Fig. 26B is a cross-sectional view taken along the line RR in Fig. 26A. [Figure 27] Fig. 27A is a vertical cross-sectional view of the multilayer board according to embodiment 9 when the magnet has moved to the right in the hollow portion. Fig. 27B is a cross-sectional view taken along the line SS in Fig. 27A. [Figure 28] Fig. 28A is a vertical cross-sectional view of the multilayer board according to embodiment 8, showing the magnet having moved to the left in the hollow portion in the multilayer board according to embodiment 9. Fig. 28B is a cross-sectional view taken along the line TT in Fig. 28A. [Figure 29] FIG. 23 is a longitudinal sectional view of a multilayer substrate according to a tenth embodiment. [Diagram 30] Fig. 30A is a vertical cross-sectional view of the multilayer board according to embodiment 11. Fig. 30B is a cross-sectional view taken along line UU in Fig. 30A. [Diagram 31] Fig. 31A is a diagram showing a configuration of a multilayer board according to an embodiment 12. Fig. 31A is a longitudinal sectional view of the multilayer board according to the embodiment 12. Fig. 31B is a sectional view taken along the line VV in Fig. 31A. Fig. 31C is a sectional view taken along the line WW in Fig. 31A. [Diagram 32]Fig. 32A is a vertical cross-sectional view of Modification 1 of the multilayer substrate according to the embodiment 12. Fig. 32B is a cross-sectional view taken along the line XX in Fig. 32A. Fig. 32C is a cross-sectional view taken along the line YY in Fig. 32A. [Diagram 33] FIG. 23 is a vertical cross-sectional view of a second modified example of a multilayer substrate according to the twelfth embodiment. [Diagram 34] FIG. 23 is a longitudinal sectional view of a multilayer substrate according to a thirteenth embodiment. [Diagram 35] Fig. 35A is a diagram showing a configuration of a multilayer board according to an embodiment 14. Fig. 35A is a vertical cross-sectional view of the multilayer board according to the embodiment 14. Fig. 35B is a cross-sectional view taken along the line ZZ in Fig. 35A. Fig. 35C is a diagram showing a state where a protruding portion has moved downward. [Diagram 36] 36A is a vertical cross-sectional view of a first variation of the multilayer board according to the embodiment 14. FIG 36B is a vertical cross-sectional view of a second variation of the multilayer board according to the embodiment 14. FIG 36C is a vertical cross-sectional view of a third variation of the multilayer board according to the embodiment 14. [Figure 37] Fig. 37A is a diagram showing a configuration of a multilayer board according to an embodiment 15. Fig. 37A is a longitudinal sectional view of the multilayer board according to the embodiment 15. Fig. 37B is a sectional view taken along the line A1-A1 in Fig. 37A. Fig. 37C is a diagram showing a state in which the protrusion has been moved to the right. [Figure 38] FIG. 23 is a vertical cross-sectional view of a first modified example of a multilayer substrate according to a fifteenth embodiment. [Figure 39] FIG. 21 is a longitudinal sectional view of a multilayer substrate according to a sixteenth embodiment. [Diagram 40] Fig. 40A is a vertical cross-sectional view of the multilayer board according to the seventeenth embodiment, and Fig. 40B is a cross-sectional view taken along the line B1-B1 in Fig. 40A. [Diagram 41] FIG. 23 is a longitudinal sectional view of a multilayer substrate according to an eighteenth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In order to explain the present disclosure in more detail, the embodiments for carrying out the present disclosure will be described below with reference to the accompanying drawings. Note that the same reference numerals are used to designate components having the same functions as those described in the previous embodiments, and the description thereof will be omitted.

[0010] Embodiment 1 A multilayer substrate according to a first embodiment will be described with reference to FIGS. 1 to 6. FIG.

[0011] Fig. 1 is a vertical cross-sectional view of the multilayer board according to the first embodiment. Fig. 2 is a horizontal cross-sectional view of the multilayer board according to the first embodiment.

[0012] 1 and 2, the multilayer board according to the first embodiment includes a board body 11, a hollow portion 12, a magnet 13 serving as a movable portion, a first switch conductor pattern 14, a second switch conductor pattern 15, and a coil 16. The thickness direction of the multilayer board and the vertical direction of the multilayer board are the same direction.

[0013] The substrate body 11 is made of, for example, resin or ceramics. That is, the multilayer substrate according to the first embodiment is a resin multilayer substrate or a ceramic multilayer substrate. A hollow portion 12 is formed inside the substrate body 11. The length, width, and height (thickness) of the hollow portion 12 are each formed to have dimensions of several tens of μm to several tens of mm.

[0014] Magnet 13 is provided inside hollow portion 12 so as to be movable up and down. Here, the magnetic pole of the upper half of magnet 13, which is a magnetic body, is an S pole, and the magnetic pole of the lower half of magnet 13 is an N pole. The entire surface of magnet 13 is plated with a conductor. This conductor plated portion is hereinafter referred to as conductor plating 13a. Magnet 13 is, for example, a ferrite magnet, a samarium-cobalt magnet, or a neodymium magnet. Conductor plating 13a, which becomes a conductor layer, is, for example, nickel-gold plating. This conductor plating 13a may be omitted if magnet 13 is a magnet that is a good conductor.

[0015] A pair of the first switch conductor pattern 14 and the second switch conductor pattern 15 are provided on the left and right sides of the top surface of the hollow portion 12, respectively. The first switch conductor pattern 14 arranged on the left side and the second switch conductor pattern 15 arranged on the right side do not overlap each other in the thickness direction of the substrate body 11. The first switch conductor pattern 14 and the second switch conductor pattern 15 are arranged with a predetermined amount of gap in the width direction of the substrate body 11. The narrow portion of the first switch conductor pattern 14 is provided inside the left side of the substrate body 11. In addition, the wide portion is exposed inside the hollow portion 12 and faces the upper surface of the magnet 13. On the other hand, the narrow substrate of the second switch conductor pattern 15 is provided inside the right side of the substrate body 11. In addition, the wide portion is exposed inside the hollow portion 12 and faces the upper surface of the magnet 13.

[0016] The coil 16 is provided above the first switch conductor pattern 14 and the second switch conductor pattern 15 on the substrate body 11. This coil 16 generates a magnetic field for moving the magnet 13, which is the movable part. The coil 16 also has a lower layer coil conductor pattern 16a, an upper layer coil conductor pattern 16b, and vias 16c.

[0017] The lower coil conductor pattern 16a and the upper coil conductor pattern 16b are formed in a coil shape. The lower coil conductor pattern 16a is disposed below the upper coil conductor pattern 16b. The winding direction of the lower coil conductor pattern 16a and the winding direction of the upper coil conductor pattern 16b are opposite to each other. The via 16c forms the central axis of the coil 16. The via 16c connects the central end of the lower coil conductor pattern 16a and the central end of the upper coil conductor pattern 16b.

[0018] Therefore, when a voltage is applied between the outer end of the lower layer coil conductor pattern 16a and the outer end of the upper layer coil conductor pattern 16b, a current flows through the lower layer coil conductor pattern 16a, the upper layer coil conductor pattern 16b, and the via 16c. As a result, a magnetic pole is formed in the thickness direction of the coil 16. At this time, by changing the direction of the current flowing through the coil 16, the magnetic pole formed in the coil 16 is switched.

[0019] As shown in Fig. 1A, when magnet 13 is placed on the bottom surface of hollow portion 12, if a current is passed through coil 16 so that an N pole is formed on the lower side of coil 16 and an S pole is formed on the upper side of coil 16, the S pole of magnet 13 is attracted to the N pole formed in coil 16. Therefore, as shown in Fig. 1B, magnet 13 floats up from the bottom surface of hollow portion 12 and comes into contact with first switch conductor pattern 14 and second switch conductor pattern 15. At this time, since conductor plating 13a is applied to the surface of magnet 13, first switch conductor pattern 14 and second switch conductor pattern 15 are electrically connected. That is, the first switch conductor pattern 14 and second switch conductor pattern 15 are switched ON.

[0020] 1B, an S pole is formed on the lower side of the coil 16, while an N pole is formed on the upper side of the coil 16. Therefore, the S pole of the magnet 13 and the S pole formed on the coil 16 repel each other. As a result, as shown in FIG. 1A, the magnet 13 falls away from the first switch conductor pattern 14 and the second switch conductor pattern 15, and sits on the bottom surface of the hollow portion 12. Therefore, the first switch conductor pattern 14 and the second switch conductor pattern 15 are not electrically connected. That is, the first switch conductor pattern 14 and the second switch conductor pattern 15 are switched OFF.

[0021] Therefore, the multilayer board according to the first embodiment can move magnet 13, which serves as a movable part, in the vertical direction of hollow part 12 inside hollow part 12, which has a side measuring several tens of μm to several tens of mm. Such hollow part 12 and magnet 13 are difficult to manufacture even using semiconductor manufacturing technology and MEMS technology. Moreover, the multilayer board according to the first embodiment can easily form coil 16 having a complex three-dimensional structure around hollow part 12. In contrast, coil 16 is difficult to manufacture even using semiconductor manufacturing technology and MEMS technology.

[0022] Next, a modification of the multilayer substrate according to the first embodiment will be described with reference to FIGS.

[0023] FIG. 3 is a diagram showing a configuration of a first modified example of the multilayer substrate according to the first embodiment. As shown in FIG. 3, the multilayer substrate according to the first embodiment may include a single-layer coil 17 instead of the two-layer coil 16. The coil 17 has a coil conductor pattern 17a, an extension conductor pattern 17b, and a via 17c. The coil conductor pattern 17a is provided above the hollow portion 12. The extension conductor pattern 17b is formed in a straight line from the center to the side of the substrate body 11. One end of the extension conductor pattern 17b is disposed in the center of the substrate body 11. The other end of the extension conductor pattern 17b is exposed from the side of the substrate body 11. The via 17c is a central axis of the coil 17. The via 17c connects between the central end of the coil conductor pattern 17a and one end of the extension conductor pattern 17b.

[0024] Fig. 4 is a diagram showing the configurations of modified examples 2 and 3 of the multilayer board according to the first embodiment. As shown in Fig. 4A, the multilayer board according to the first embodiment may include a three-layer coil 18 instead of the two-layer coil 16. Also, as shown in Fig. 4B, the multilayer board according to the first embodiment may include a nine-layer coil 19 instead of the two-layer coil 16. However, if the extension conductor pattern 17b is not very effective in increasing the magnetic force, it is preferable to apply the extension conductor pattern 17b to the coils in the even layers, since the coils in the even layers can utilize more of the board area than the coils in the odd layers.

[0025] 5A and 5B are diagrams showing the configurations of modified examples 4 and 5 of the multilayer substrate according to the first embodiment. As shown in FIG. 5A, the multilayer substrate according to the first embodiment may have the first switch conductor pattern 14 and the second switch conductor pattern 15 on the left and right sides of the bottom surface of the hollow portion 12, respectively. As shown in FIG. 5B, the multilayer substrate according to the first embodiment may have the third switch conductor pattern 20 and the fourth switch conductor pattern 21 on the left and right sides of the bottom surface of the hollow portion 12, respectively. In this case, one of the pair of the first switch conductor pattern 14 and the second switch conductor pattern 15 and the pair of the third switch conductor pattern 20 and the fourth switch conductor pattern 21 may be used in a switch-on state, and the other pair may be used in a switch-off state.

[0026] Fig. 6 is a vertical cross-sectional view of Modification 6 of the multilayer substrate according to Embodiment 1. As shown in Fig. 6, the multilayer substrate according to Embodiment 1 may not only have a coil (upper coil) 16 above hollow portion 12, but may also have a coil (lower coil) 16 below hollow portion 12.

[0027] A lubricant may be applied to the surface of hollow portion 12. In this case, the multilayer board according to embodiment 1 can suppress friction and wear that occur when magnet 13 moves.

[0028] Embodiment 2 Second Embodiment A multilayer substrate according to a second embodiment will be described with reference to FIGS.

[0029] Fig. 7 is a vertical cross-sectional view of a multilayer board according to embodiment 2. As shown in Fig. 7, the multilayer board according to embodiment 2 includes an upper yoke 22 and a lower yoke 23 in addition to the configuration of the multilayer board according to embodiment 1 shown in Fig. 1.

[0030] The upper yoke 22 is provided on the upper surface of the substrate body 11. The lower yoke 23 is provided on the lower surface of the substrate body 11. The upper yoke 22 and the lower yoke 23 are made of a soft magnetic material such as SUS430. A soft magnetic material is one that is strongly magnetized under the influence of a magnetic field and has no magnetic force when no magnetic field exists, and has the role of collecting magnetic fields.

[0031] The upper yoke 22 and the lower yoke 23 are designed so that the attractive force generated between the magnet 13 and the coil 16 is greater than the attractive force generated between the magnet 13 and the yokes 22, 23. When the attractive force generated between the magnet 13 and the yokes 22, 23 is greater than the attractive force generated between the magnet 13 and the coil 16, the thickness of the yokes 22, 23 and the contact area with the substrate main body 11 may be reduced, or the distance of the yokes 22, 23 from the coil 16 may be increased.

[0032] 7 shows an example in which the contact area between the lower yoke 23, which is disposed far from the coil 16, and the substrate body 11 is smaller than the contact area between the upper yoke 22, which is disposed close to the coil 16, and the substrate body 11. This is because when the magnet 13 is disposed on the bottom surface of the hollow portion 12, the magnet 13 is farther from the coil 16, and therefore the attractive force generated between the magnet 13 and the coil 16 is smaller.

[0033] In addition, the attractive force generated between the magnet 13 and the upper yoke 22 at the position where the magnet 13 is closest to the upper yoke 22 is made larger than the attractive force generated between the magnet 13 and the lower yoke 23 at that position. On the other hand, the attractive force generated between the magnet 13 and the lower yoke 23 at the position where the magnet 13 is closest to the lower yoke 23 is made larger than the attractive force generated between the magnet 13 and the upper yoke 22 at that position.

[0034] Furthermore, the attractive force generated between the magnet 13 and the upper yoke 22 at the position where the magnet 13 is closest to the upper yoke 22, and the attractive force generated between the magnet 13 and the lower yoke 23 at the position where the magnet 13 is closest to the lower yoke 23 are made greater than the gravity acting on the magnet 13.

[0035] Therefore, as shown in Fig. 7A, magnet 13 is placed on the bottom surface of hollow portion 12 by the attractive force generated between magnet 13 and lower yoke 23. Then, a current is passed through coil 16 so that the attractive force generated between magnet 13 and coil 16 is greater than the attractive force generated between magnet 13 and lower yoke 23. Therefore, as shown in Fig. 7B, magnet 13 floats up from the bottom surface of hollow portion 12 and comes into contact with first switch conductor pattern 14 and second switch conductor pattern 15. As a result, first switch conductor pattern 14 and second switch conductor pattern 15 are conductive.

[0036] At this time, even if the current flowing through the coil 16 is stopped, the magnet 13 maintains contact between the first switch conductor pattern 14 and the second switch conductor pattern 15 due to the attractive force generated between the magnet 13 and the upper yoke 22. Therefore, the switch is maintained in the ON state.

[0037] Therefore, the multilayer board according to the second embodiment can keep the magnet 13 in contact with the first switch conductor pattern 14 and the second switch conductor pattern 15 without passing a current through the coil 16. Therefore, the multilayer board according to the second embodiment can reduce power consumption and heat generation.

[0038] Next, a modified example of the multilayer substrate according to the second embodiment will be described with reference to FIGS.

[0039] Fig. 8 is a diagram showing the configurations of modified examples 1 and 2 of the multilayer board according to the second embodiment. As shown in Fig. 8A, the multilayer board according to the second embodiment may have the upper yoke 22 and the lower yoke 23 embedded inside the board body 11. Also, as shown in Fig. 8B, the multilayer board according to the second embodiment may have the upper yoke pattern 24 and the lower yoke pattern 25 embedded inside the board body 11. The upper yoke pattern 24 and the lower yoke pattern 25 are formed by, for example, providing stainless steel foil made of SUS430, which is a soft magnetic material, on the board body 11 using stainless steel etching technology.

[0040] 9A and 9B are diagrams showing configurations of modified examples 3 and 4 of the multilayer substrate according to the second embodiment. As shown in FIG. 9A, the multilayer substrate according to the second embodiment may be provided with an adjustment hole 23a that is a through hole in the thickness direction in the lower yoke 23, thereby adjusting the magnitude of the attractive force generated between the magnet 13 and the lower yoke 23. Also, as shown in FIG. 9B, the multilayer substrate according to the second embodiment may include either one of the upper yoke 22 and the lower yoke 23. In this case, it is preferable to provide a yoke that holds the magnet 13 for a longer period of time.

[0041] Embodiment 3 The multilayer board according to the third embodiment will be described with reference to FIGS.

[0042] Fig. 10 is a longitudinal sectional view of the multilayer board according to embodiment 3. Fig. 11 is a transverse sectional view of the multilayer board according to embodiment 3. Note that magnet 13 is omitted in Fig. 11. As shown in Figs. 10 and 11, the multilayer board according to embodiment 3 includes a three-layer coil 26 instead of coil 16 of the multilayer board according to embodiment 1 shown in Fig. 1.

[0043] The coil 26 is disposed so as to surround the periphery of the side surface of the hollow portion 12. The coil 26 has a lower layer coil conductor pattern 26a, a middle layer coil conductor pattern 26b, an upper layer coil conductor pattern 26c, and vias 26d and 26e. The lower layer coil conductor pattern 26a, the middle layer coil conductor pattern 26b, and the upper layer coil conductor pattern 26c are arranged in this order from bottom to top. These are also formed into a single-turn coil.

[0044] One end of the lower coil conductor pattern 26a is exposed from the side surface of the substrate body 11. The other end of the lower coil conductor pattern 26a and one end of the middle coil conductor pattern 26b are connected by a via 26d. The other end of the middle coil conductor pattern 26b and one end of the upper coil conductor pattern 26c are connected by a via 26e. The other end of the upper coil conductor pattern 26c is exposed from the side surface of the substrate body 11.

[0045] Therefore, when a voltage is applied between one end of the lower coil conductor pattern 26a and the other end of the upper coil conductor pattern 26c, a current flows through the lower coil conductor pattern 26a, the middle coil conductor pattern 26b, the upper coil conductor pattern 26c, and the vias 26d and 26e. As a result, a magnetic pole is formed in the thickness direction of the coil 26. At this time, by changing the direction of the current flowing through the coil 26, the magnetic pole formed in the coil 26 is switched.

[0046] Therefore, in the multilayer board of embodiment 3, by arranging coil 26 so as to surround the side surface of hollow portion 12, it is possible to obtain an attractive force between magnet 13 and coil 26 with a small number of turns of coil 26.

[0047] Next, a modified example of the multilayer substrate according to the third embodiment will be described with reference to FIGS.

[0048] Fig. 12 is a vertical cross-sectional view of a first modified example of a multilayer board according to the third embodiment. Fig. 13 is a horizontal cross-sectional view of a first modified example of a multilayer board according to the third embodiment. Note that magnet 13 is omitted in Fig. 13. As shown in Figs. 12 and 13, the multilayer board according to the third embodiment includes a three-layer coil 27 instead of three-layer coil 26. Coil 27 has a lower layer coil conductor pattern 27a, a middle layer coil conductor pattern 27b, an upper layer coil conductor pattern 27c, and vias. These are formed into a two-turn coil shape.

[0049] Fig. 14 is a vertical cross-sectional view of a second modified example of the multilayer board according to the embodiment 3. As shown in Fig. 14, the multilayer board according to the embodiment 3 is obtained by adding coil 16 that configures the lower coil in the multilayer board according to the embodiment 1.

[0050] Embodiment 4 A multilayer board according to a fourth embodiment will be described with reference to FIGS.

[0051] Fig. 15 is a longitudinal sectional view of a multilayer board according to a fourth embodiment. As shown in Fig. 15, the multilayer board according to the fourth embodiment includes a yoke 31 serving as a movable part, instead of magnet 13 of the multilayer board according to the sixth variation of the first embodiment shown in Fig. 6. Yoke 31 is provided inside hollow part 12. The entire surface of yoke 31 is plated with a conductor. This conductor-plated portion is hereinafter referred to as conductor plating 31a.

[0052] 15, when the yoke 31 is placed on the bottom surface of the hollow portion 12, a current flows through the upper coil 16, but no current flows through the lower coil 16. The yoke 31 floats up from the bottom surface of the hollow portion 12 and comes into contact with the first switch conductor pattern 14 and the second switch conductor pattern 15. At this time, since the surface of the yoke 31 is provided with conductor plating 31a, the first switch conductor pattern 14 and the second switch conductor pattern 15 are electrically connected. That is, the first switch conductor pattern 14 and the second switch conductor pattern 15 are switched ON.

[0053] Therefore, the multilayer board according to the fourth embodiment includes yoke 31 as a movable part, and is therefore less likely to break than magnet 13, and can be made smaller in size.

[0054] Next, a modified example of the multilayer substrate according to the fourth embodiment will be described with reference to FIGS.

[0055] 16A and 16B are diagrams illustrating the configurations of modified examples 1 and 2 of the multilayer substrate according to embodiment 4. As shown in FIG. 16A, modified example 1 of the multilayer substrate according to embodiment 4 adds an upper magnet 32 ​​and a lower magnet 33 to the configuration of the multilayer substrate according to embodiment 4. Upper magnet 32 ​​is provided on the upper surface of substrate main body 11. Lower magnet 33 is provided on the lower surface of substrate main body 11.

[0056] Therefore, even if the current flowing through the upper coil 16 is stopped, the yoke 31 maintains contact between the first switch conductor pattern 14 and the second switch conductor pattern 15 due to the attractive force generated between the yoke 31 and the upper magnet 32. This keeps the switch in the ON state.

[0057] Therefore, in the multilayer board according to the fourth embodiment, the yoke 31 can be kept in contact with the first switch conductor pattern 14 and the second switch conductor pattern 15 even without passing a current through the upper coil 16. Therefore, the multilayer board according to the fourth embodiment can reduce power consumption and heat generation.

[0058] Furthermore, as shown in FIG. 16B, the multilayer substrate of embodiment 4 may be provided with either a pair of a lower coil 16 and an upper magnet 32, or a pair of an upper coil 16 and a lower magnet 33.

[0059] Fig. 17 is a diagram showing the configuration of a third modified example of the multilayer substrate according to the fourth embodiment. Note that yoke 31 is omitted in Figs. 17B and 17C. As shown in Fig. 17, the multilayer substrate according to the fourth embodiment may include a coil 34 instead of coil 16. Coil 34 is provided so as to surround the periphery of the side surface of hollow portion 12. This coil 34 is made up of two layers, and each layer is formed by one turn.

[0060] Therefore, in the multilayer board of embodiment 4, by arranging the coil 34 so as to surround the side surface of the hollow portion 12, it is possible to obtain an attractive force between the yoke 31 and the coil 34 with a small number of turns of the coil 34.

[0061] Embodiment 5. A multilayer board according to the fifth embodiment will be described with reference to FIGS.

[0062] Fig. 18 is a vertical cross-sectional view of a multilayer board according to embodiment 5. Fig. 19 is a horizontal cross-sectional view of the multilayer board according to embodiment 5.

[0063] Figure 18 and As shown in FIG. 19, the multilayer board according to the fifth embodiment includes a board body 11, a hollow portion 12, a magnet 41, a first switch conductor pattern 42, a second switch conductor pattern 43, and a coil 44.

[0064] The magnet 41 is provided inside the hollow portion 12 so as to be movable in the width direction. Here, the magnetic pole on the left side of the magnet 41, which is a magnetic body, in the width direction is an N pole, and the magnetic pole on the right side of the magnet 41 in the width direction is an S pole. The entire surface of the magnet 41 is plated with a conductor. Hereinafter, the portion plated with this conductor is referred to as conductor plating 41a.

[0065] A pair of first switch conductor patterns 42 and second switch conductor patterns 43 are provided on the left and right sides, respectively, of the bottom surface of the hollow portion 12. The first switch conductor pattern 42 arranged on the left side and the second switch conductor pattern 43 arranged on the right side do not overlap with each other in the width direction of the substrate body 11. The first switch conductor pattern 42 and the second switch conductor pattern 43 are arranged with a predetermined amount of gap between them in the width direction of the substrate body 11.

[0066] The coil 44 is provided so as to surround the top and bottom surfaces of the hollow portion 12 and further the top and bottom surfaces of the first switch conductor pattern 42. Specifically, the coil 44 is composed of a plurality of coil conductor patterns 44a and a plurality of vias 44b connecting them. The multiple coil conductor patterns 44a are approximately parallel to the top and bottom surfaces of the hollow portion 12 and the top and bottom surfaces of the first switch conductor pattern 42. In addition, the multiple vias 44b are arranged so as to extend in the up-down direction of the substrate body 11.

[0067] Therefore, when a voltage is applied between one end and the other end of the coil 44, a current flows through the coil 44. As a result, a magnetic pole is formed in the axial direction of the coil 44 (in other words, in the width direction of the substrate body 11). That is, a magnetic pole is formed on the left and right sides of the coil 44.

[0068] As shown in Fig. 18A, when magnet 41 is located on the right side of hollow portion 12 and in contact with second switch conductor pattern 43, if a current is passed through coil 44 so that the right side of coil 44 becomes the S pole, the N pole of magnet 41 is attracted to the S pole of coil 44. Therefore, as shown in Fig. 18B, magnet 41 moves leftward in hollow portion 12 and comes into contact with second switch conductor pattern 43 and also with first switch conductor pattern 42. As a result, first switch conductor pattern 42 and second switch conductor pattern 43 are electrically connected. That is, the first switch conductor pattern 42 and second switch conductor pattern 43 are switched ON.

[0069] In contrast, by changing the direction of the current flowing through coil 44, the right side of coil 44 becomes an N pole, and the N pole of magnet 41 and the N pole formed in coil 44 repel each other. As a result, as shown in Fig. 18A, magnet 41 moves toward the right side in hollow portion 12, moves away from first switch conductor pattern 42, and comes into contact only with second switch conductor pattern 43. Therefore, the first switch conductor pattern 42 and the second switch conductor pattern 43 are not electrically connected. That is, the first switch conductor pattern 42 and the second switch conductor pattern 43 are switched into the OFF state.

[0070] Therefore, the multilayer board according to the fifth embodiment can move magnet 41, which serves as a movable part, in the width direction of hollow part 12 inside hollow part 12, which has a side measuring several tens of μm to several tens of mm. Such hollow part 12 and magnet 41 are difficult to manufacture even using semiconductor manufacturing technology and MEMS technology. Moreover, the multilayer board according to the fifth embodiment can easily form coil 44 having a complex three-dimensional structure around hollow part 12. In contrast, coil 44 is difficult to manufacture even using semiconductor manufacturing technology and MEMS technology.

[0071] Next, a modification of the multilayer board according to the fifth embodiment will be described with reference to Fig. 20. Fig. 20 is a vertical cross-sectional view of a modification 1-4 of the multilayer board according to the fifth embodiment.

[0072] 20A, the multilayer board according to the fifth embodiment may also have a coil 44 provided on the right side of hollow portion 12. Therefore, in the multilayer board according to the fifth embodiment, one coil 44 can be used for attracting magnet 41, and the other coil 44 can be used for repelling magnet 41.

[0073] Furthermore, as shown in FIG. 20B, the multilayer substrate according to the fifth embodiment may also have a coil 44 provided in the center of hollow portion 12. As shown in FIG.

[0074] Furthermore, as shown in FIG. 20C, the multilayer board according to the fifth embodiment may have a coil 44 provided on the side of the hollow portion 12.

[0075] 20D, the multilayer board according to the fifth embodiment may include a magnetic body 45 provided inside the coil 44. Therefore, the multilayer board according to the fifth embodiment can hold the moved position even when no current flows through the coil 44.

[0076] Embodiment 6 A multilayer board according to a sixth embodiment will be described with reference to Fig. 21. Fig. 21 is a vertical cross-sectional view of the multilayer board according to the sixth embodiment.

[0077] As shown in Fig. 21, the multilayer board according to the sixth embodiment includes a yoke 31 instead of the magnet 41 of the first modification of the multilayer board according to the fifth embodiment shown in Fig. 20A. Therefore, since the multilayer board according to the sixth embodiment includes the yoke 31 as a movable part, it is less likely to break and can be made smaller than the magnet 41.

[0078] In the sixth embodiment, a coil may be provided on either the left or right side of hollow portion 12, and a magnetic body may be provided on either the left or right side of hollow portion 12.

[0079] Embodiment 7 A multilayer board according to the seventh embodiment will be described with reference to FIGS.

[0080] Fig. 22 is a vertical cross-sectional view of a multilayer board according to embodiment 7. As shown in Fig. 22, the multilayer board according to embodiment 7 includes a board body 11, a hollow portion 12, a magnet 13, a coil 16, a first stripline pattern 51, a second stripline pattern 52, a first ground pattern 53, a second ground pattern 54, a third ground pattern 55, and a plurality of vias 56. The first stripline pattern 51, the second stripline pattern 52, the first ground pattern 53, the second ground pattern 54, the third ground pattern 55, and the plurality of vias 56 are provided inside the board body 11.

[0081] The first stripline pattern 51 and the second stripline pattern 52 are provided below the hollow portion 12. The first stripline pattern 51 is disposed on the left side of the hollow portion 12. The second stripline pattern 52 is disposed on the right side of the hollow portion 12. The first ground pattern 53 is disposed on the lower part of the substrate body 11. The second ground pattern 54 is disposed around the side surface of the hollow portion 12. The first stripline pattern 51 and the second stripline pattern 52 are disposed between the first ground pattern 53 and the second ground pattern 54 in the up-down direction.

[0082] The third ground pattern 55 is disposed above the second ground pattern 54. The third ground pattern 55 is provided so as to form the top surface of the hollow portion 12. A plurality of vias 56 connect the second ground pattern 54 and the third ground pattern 55. The vias 56 extend in the vertical direction and are disposed so as to surround the periphery of the side surface of the hollow portion 12. The vias 56 are disposed at intervals less than half the wavelength of the high-frequency signal passing through the first stripline pattern 51 and the second stripline pattern 52.

[0083] Therefore, when magnet 13 moves upward due to the attractive force generated between magnet 13 and coil 16, the distance between magnet 13 and first stripline pattern 51 and second stripline pattern 52 increases. As a result, the capacitance therebetween decreases. In contrast, when magnet 13 moves downward, the distance between magnet 13 and first stripline pattern 51 and second stripline pattern 52 decreases. As a result, the capacitance therebetween increases.

[0084] Therefore, the multilayer board according to the seventh embodiment can function as a variable capacitor by having the above-mentioned configuration.

[0085] Next, a modification of the multilayer substrate according to the seventh embodiment will be described with reference to FIGS.

[0086] 23 is a vertical cross-sectional view of a first modified example of the multilayer board according to the seventh embodiment. As shown in FIG. 23, in the multilayer board according to the seventh embodiment, the first stripline pattern 51 and the second stripline pattern 52 are exposed on the bottom surface of the hollow portion 12, and the magnet 13 is Insulating film 13b is covered with

[0087] Fig. 24 is a vertical cross-sectional view of Modification 2 of the multilayer substrate according to Embodiment 7. As shown in Fig. 24, third ground pattern 55 is disposed above coil 16. Therefore, a plurality of vias 56 are disposed in addition to hollow portion 12 so as to surround coil 16.

[0088] The multilayer board according to the seventh embodiment may include a yoke 31 instead of the magnet 13.

[0089] Embodiment 8 The multilayer board according to the eighth embodiment will be described with reference to Fig. 25 and Fig. 26. Fig. 25 is a diagram of the multilayer board according to the eighth embodiment when magnet 41 has moved to the right side in hollow portion 12. Fig. 26 is a diagram of the multilayer board according to the eighth embodiment when magnet 41 has moved to the left side in hollow portion 12.

[0090] As shown in Figures 25 and 26, the multilayer substrate of embodiment 8 includes a substrate body 11, a hollow portion 12, a magnet 41, a coil 44, a first strip line pattern 61, a second strip line pattern 62, a plurality of ground patterns 63a to 63d, and a plurality of vias 64a to 64d.

[0091] The first stripline pattern 61 and the second stripline pattern 62 are disposed on the lower right side of the hollow portion 12. They are disposed side by side in a direction perpendicular to the direction of movement of the magnet 41. One ends of the first stripline pattern 61 and the second stripline pattern 62, which face each other, are located directly below the hollow portion 12. In addition, the hollow portion 12, the first stripline pattern 61, and the second stripline pattern 62 of The periphery is surrounded by a plurality of ground patterns 63a to 63d and a plurality of vias 64a to 64d.

[0092] 25, the more the magnet 41 moves rightward in the hollow portion 12, the larger the area where the magnet 41 overlaps with the first stripline pattern 61 and the second stripline pattern 62. Thus, the greater the area where the magnet 41 overlaps with the first stripline pattern 61 and the second stripline pattern 62, the greater the capacitance of the multilayer board.

[0093] 26, the more the magnet 41 moves leftward in the hollow portion 12, the smaller the area where the magnet 41 overlaps with the first stripline pattern 61 and the second stripline pattern 62. Thus, in the multilayer board, the smaller the area where the magnet 41 overlaps with the first stripline pattern 61 and the second stripline pattern 62, the smaller the capacitance.

[0094] Therefore, the multilayer board according to the eighth embodiment can function as a variable capacitor by having the above-mentioned configuration.

[0095] Embodiment 9 The multilayer board according to the ninth embodiment will be described with reference to Fig. 27 and Fig. 28. Fig. 27 is a diagram of the multilayer board according to the ninth embodiment when magnet 41 has moved to the right side in hollow portion 12. Fig. 28 is a diagram of the multilayer board according to the ninth embodiment when magnet 41 has moved to the left side in hollow portion 12.

[0096] As shown in FIGS. 27 and 28, the multilayer board according to the ninth embodiment includes a board body 11, a hollow portion 12, a magnet 41, a coil 44, a first stripline pattern 61, a second stripline pattern 62, a dielectric 65, and a conductive material 66. 、 It includes a plurality of ground patterns 66a to 66f and a plurality of vias 67a to 67f.

[0097] The dielectric 65 is provided to the right of the magnet 41. The first stripline pattern 61 is disposed at the bottom right of the hollow portion 12. The second stripline pattern 62 is disposed at the top right of the hollow portion 12. The hollow portion 12, the first stripline pattern 61, and the second stripline pattern 62 are disposed at the bottom right of the hollow portion 12. of The periphery is surrounded by a plurality of ground patterns 66a to 66f and a plurality of vias 67a to 67f.

[0098] 27, the more the magnet 41 moves rightward in the hollow portion 12, the larger the area of ​​the dielectric 65 overlapping with the first stripline pattern 61 and the second stripline pattern 62. Thus, in the multilayer board, the larger the area of ​​overlap between the dielectric 65 and the first stripline pattern 61 and the second stripline pattern 62, the greater the capacitance.

[0099] 28, the more the magnet 41 moves leftward in the hollow portion 12, the smaller the area of ​​the dielectric 65 that overlaps with the first stripline pattern 61 and the second stripline pattern 62. Thus, in the multilayer board, the smaller the area of ​​overlap between the dielectric 65 and the first stripline pattern 61 and the second stripline pattern 62, the smaller the capacitance.

[0100] Therefore, the multilayer board according to the ninth embodiment can function as a variable capacitor by having the above-mentioned configuration.

[0101] Embodiment 10 A multilayer board according to a tenth embodiment will be described with reference to Fig. 29. Fig. 29 is a vertical cross-sectional view of the multilayer board according to the tenth embodiment.

[0102] Fig. 29 To 22. As shown, the multilayer board according to the tenth embodiment includes a dielectric 71 and a strip line pattern 72 instead of the first strip line pattern 51 and the second strip line pattern 52 of the multilayer board according to the seventh embodiment shown in FIG. 22. The dielectric 71 is provided on the lower surface of the magnet 13. The strip line pattern 72 is provided so as to be exposed at the bottom surface of the hollow portion 12.

[0103] Therefore, when magnet 13 moves upward due to the attractive force generated between magnet 13 and coil 16, the distance between dielectric 71 provided on magnet 13 and stripline pattern 72 becomes longer. As a result, the effective dielectric constant of stripline pattern 72 decreases, and the electrical length becomes shorter. In contrast, when magnet 13 moves downward due to the repulsive force generated between magnet 13 and coil 16, the distance between dielectric 71 provided on magnet 13 and stripline pattern 72 becomes shorter. As a result, the effective dielectric constant of stripline pattern 72 increases, and the electrical length becomes longer.

[0104] Therefore, the multilayer board according to the tenth embodiment can operate as a variable phase shifter by having the above-mentioned configuration.

[0105] Embodiment 11 The multilayer board according to the eleventh embodiment will be described with reference to Fig. 30. Fig. 30 is a diagram showing the configuration of the multilayer board according to the eleventh embodiment.

[0106] As shown in Fig. 30, the multilayer board according to the eleventh embodiment includes a strip line pattern 72 instead of the first strip line pattern 61 and the second strip line pattern 62 of the multilayer board according to the ninth embodiment shown in Fig. 27 and Fig. 28. The strip line pattern 72 is disposed so as to form the right bottom surface of the hollow portion 12.

[0107] Therefore, the more magnet 41 moves to the right in hollow portion 12, the larger the area of ​​dielectric 65 that overlaps with stripline pattern 72. In this way, the multilayer board can increase the effective dielectric constant of stripline pattern 72 as the area of ​​overlap between dielectric 65 and stripline pattern 72 increases. This allows the electrical length of the multilayer board to be increased. In contrast, the more magnet 41 moves leftward in hollow portion 12, the smaller the area of ​​dielectric 65 that overlaps with stripline pattern 72. In this way, the multilayer board can reduce the effective dielectric constant of stripline pattern 72 as the area of ​​overlap between dielectric 65 and stripline pattern 72 decreases. This allows the electrical length of the multilayer board to be shortened.

[0108] Therefore, the multilayer board according to the eleventh embodiment can operate as a variable phase shifter by having the above-mentioned configuration.

[0109] Embodiment 12 A multilayer board according to a twelfth embodiment will be described with reference to FIGS.

[0110] Fig. 31 is a diagram showing a configuration of a multilayer board according to embodiment 12. As shown in Fig. 31, the multilayer board according to embodiment 12 includes a soft magnetic body 76 and a first signal coil 73 instead of the dielectric 71 and the strip line pattern 72 of the multilayer board according to embodiment 10 shown in Fig. 29.

[0111] The soft magnetic body 76 is provided on the lower surface of the magnet 13. This soft magnetic body 76 has the role of collecting a magnetic field. The first signal coil 73 is provided below the hollow portion 12 in the substrate main body 11. This first signal coil 73 has a variable inductance. The first signal coil 73 has a coil conductor pattern 73a, an extension conductor pattern 73b, and a via 73c.

[0112] Therefore, when the magnet 13 moves upward due to the attractive force generated between the magnet 13 and the coil 16, the distance between the soft magnetic body 76 provided on the magnet 13 and the first signal coil 73 becomes longer. As a result, the inductance of the first signal coil 73 decreases. In contrast, when the magnet 13 moves downward due to the repulsive force generated between the magnet 13 and the coil 16, the distance between the soft magnetic body 76 provided on the magnet 13 and the first signal coil 73 becomes shorter. As a result, the inductance of the first signal coil 73 increases.

[0113] Therefore, the multilayer board according to the twelfth embodiment can function as a variable inductance by having the above-mentioned configuration.

[0114] A modification of the multilayer substrate according to the twelfth embodiment will be described below with reference to FIGS.

[0115] Fig. 32 is a diagram showing a configuration of Modification 1 of the multilayer substrate according to the embodiment 12. As shown in Fig. 32, the multilayer substrate according to the embodiment 12 includes a first signal coil 73 and a second signal coil 74 below the hollow portion 12 in the substrate body 11. The second signal coil 74 has a coil conductor pattern 74a, an extension conductor pattern 74b, and a via 74c.

[0116] Therefore, when the magnet 13 moves upward due to the attractive force generated between the magnet 13 and the coil 16, the distance between the soft magnetic body 76 provided on the magnet 13 and the first signal coil 73 and the second signal coil 74 increases. Therefore, the coupling coefficient between the first signal coil 73 and the second signal coil 74 decreases. As a result, the inductance of the first signal coil 73 and the second signal coil 74 decreases.

[0117] In contrast, when the magnet 13 moves downward due to the repulsive force generated between the magnet 13 and the coil 16, the distance between the soft magnetic body 76 provided on the magnet 13 and the first signal coil 73 and the second signal coil 74 becomes shorter. Therefore, the coupling coefficient between the first signal coil 73 and the second signal coil 74 increases. As a result, the inductance of the first signal coil 73 and the second signal coil 74 increases.

[0118] Fig. 33 is a vertical cross-sectional view of Modification 2 of the multilayer board according to the twelfth embodiment. As shown in Fig. 33, the multilayer board according to the twelfth embodiment includes a second substrate 75 instead of the soft magnetic material 76. The first signal coil 73 is provided below the hollow portion 12 in the substrate main body 11. The second signal coil 74 is provided on the second substrate 75.

[0119] Therefore, when the magnet 13 moves upward due to the attractive force generated between the magnet 13 and the coil 16, the distance between the second signal coil 74 provided on the magnet 13 and the first signal coil 73 becomes longer. Therefore, the coupling coefficient between the first signal coil 73 and the second signal coil 74 decreases. As a result, the inductance of the first signal coil 73 and the second signal coil 74 decreases.

[0120] In contrast, when the magnet 13 moves downward due to the repulsive force generated between the magnet 13 and the coil 16, the distance between the second signal coil 74 provided on the magnet 13 and the first signal coil 73 becomes shorter. Therefore, the coupling coefficient between the first signal coil 73 and the second signal coil 74 increases. As a result, the inductance of the first signal coil 73 and the second signal coil 74 increases.

[0121] Embodiment 13 A multilayer board according to the thirteenth embodiment will be described with reference to Fig. 34. Fig. 34 is a vertical cross-sectional view of the multilayer board according to the thirteenth embodiment.

[0122] 34, the multilayer board according to the thirteenth embodiment includes a board body 11, a hollow portion 12, a magnet 41, a coil 44, a soft magnetic body 77, and a signal coil 78. The soft magnetic body 77 is provided on the right side of the magnet 41. The coil 44 is disposed on the left side of the hollow portion 12. The signal coil 78 is disposed on the right side of the hollow portion 12.

[0123] Therefore, the more the magnet 41 moves toward the right in the hollow portion 12, the longer the overlapping length of the soft magnetic material 77 with the signal coil 78. As a result, the inductance of the signal coil 78 increases. In contrast, the more the magnet 41 moves toward the left in the hollow portion 12, the shorter the overlapping length of the soft magnetic material 77 with the signal coil 78. As a result, the inductance of the signal coil 78 decreases.

[0124] Therefore, the multilayer board according to the thirteenth embodiment can function as a variable inductance by having the above-mentioned configuration.

[0125] Embodiment 14 A multilayer substrate according to a fourteenth embodiment will be described with reference to FIGS.

[0126] Fig. 35 is a diagram showing a configuration of a multilayer substrate according to embodiment 14. As shown in Fig. 35, the multilayer substrate according to embodiment 14 includes a protrusion 81, a waveguide 82, and a cavity resonator 83.

[0127] The protrusion 81 is provided on the lower surface of the magnet 13. The protrusion 81 is formed so as to protrude downward from the lower surface of the magnet 13. The protrusion 81 is formed of, for example, a conductive material.

[0128] A waveguide 82 and a cavity resonator 83 are provided below the hollow portion 12. The waveguide 82 and the cavity resonator 83 are composed of a plurality of conductor patterns and a plurality of vias. The cavity resonator 83 is provided in the middle of the waveguide 82 and is located directly below the hollow portion 12. A communication hole through which the protrusion 81 can be inserted is formed in the lower portion of the hollow portion 12. This communication hole communicates between the hollow portion 12 and the cavity resonator 83. The length of each side of the hollow portion 12 is shorter than the half wavelength of the high frequency signal transmitted through the waveguide 82.

[0129] Therefore, when the magnet 13 moves up and down, the protrusion 81 provided on the magnet 13 moves in and out of the cavity resonator 83. In this way, when the protrusion 81 made of a conductive material moves in and out of the cavity resonator 83, the high-frequency electromagnetic field distribution inside the cavity resonator 83 changes.

[0130] That is, when the protrusion 81, which is a conductor, is inserted into the electric field of the cavity resonator 83, the electric field can hardly exist. At this time, the cavity resonator 83 can be treated as if it has expanded by the insertion length of the protrusion 81. Therefore, the resonance frequency of the cavity resonator 83 decreases. Therefore, the resonance frequency of the cavity resonator 83 can be controlled by adjusting the insertion length of the protrusion 81, and the cavity resonator 83 plays the role of a variable filter for high-frequency signals transmitted through the waveguide 82.

[0131] Therefore, the multilayer board according to the fourteenth embodiment can change the characteristics of a high-frequency signal passing through the cavity resonator 83. The protruding portion 81 may be made of a dielectric material or a magnetic material. When the protruding portion 81 is made of a magnetic material, the protruding portion 81 is moved in and out of a portion inside the cavity resonator 83 where a strong magnetic field is present.

[0132] Next, a modified example of the multilayer board according to the fourteenth embodiment will be described with reference to Fig. 36. Fig. 36 is a diagram showing a modified example of the multilayer board according to the fourteenth embodiment.

[0133] As shown in FIG. 36A, the inside of the waveguide 82 and the cavity resonator 83 may be filled with a dielectric material except for the movable range of the protrusion 81. As shown in FIG. 36B, the protrusion 81 may have a large diameter portion 81a. This large diameter portion 81a is formed in a flat plate shape and has an area larger than the opening cross-sectional area of ​​the communication hole. The large diameter portion 81a is disposed outside the communication hole, that is, inside the cavity resonator 83. As shown in FIG. 36C, the multilayer substrate may change the electrical length of a stub formed in the cavity resonator 83, instead of inserting and removing the protrusion 81 into and from the cavity resonator 83.

[0134] Embodiment 15 A multilayer board according to a fifteenth embodiment will be described with reference to FIGS.

[0135] Fig. 37 is a diagram showing a configuration of a multilayer board according to embodiment 15. As shown in Fig. 37, the multilayer board according to embodiment 15 includes a protrusion 85, a waveguide 86, and a cavity resonator 87.

[0136] The protrusion 85 is provided on the right side surface of the magnet 13. The protrusion 85 is formed so as to protrude outward from the right side surface of the magnet 13. The protrusion 85 is formed, for example, from a conductive material.

[0137] A waveguide 86 and a cavity resonator 87 are provided on the right side of the hollow portion 12. The waveguide 86 and the cavity resonator 87 are composed of a plurality of conductor patterns and a plurality of vias. The cavity resonator 87 is provided in the middle of the waveguide 86 and is located directly to the side of the hollow portion 12. A communication hole is formed in the side of the hollow portion 12, through which the protrusion 85 can be inserted. This communication hole communicates between the hollow portion 12 and the cavity resonator 87.

[0138] Therefore, when the magnet 13 moves left and right, the protrusion 85 provided on the magnet 13 moves in and out of the cavity resonator 87. In this way, the protrusion 85 made of a conductive material moves in and out of the cavity resonator 87, whereby the high-frequency electromagnetic field distribution inside the cavity resonator 87 changes.

[0139] Therefore, the multilayer board according to the fifteenth embodiment can change the characteristics of a high-frequency signal passing through the cavity resonator 87.

[0140] The protrusion 85 may be a dielectric or magnetic material. When the protrusion 85 is a magnetic material, the protrusion 81 is moved in and out of a portion of the cavity resonator 83 where a strong magnetic field exists. The inside of the waveguide 86 and the cavity resonator 87 may be filled with a dielectric material except for the movable range of the protrusion 85. Furthermore, the multilayer substrate may change the electrical length of a stub formed in the cavity resonator 87, instead of moving the protrusion 85 in and out of the cavity resonator 87.

[0141] Next, a modification of the multilayer board according to the fifteenth embodiment will be described with reference to Fig. 38. Fig. 38 is a vertical cross-sectional view of a first modification of the multilayer board according to the fifteenth embodiment.

[0142] 38, the protrusion 85 may have a large diameter portion 85a. The large diameter portion 85a is formed in a flat plate shape and has an area larger than the opening cross-sectional area of ​​the communication hole. The large diameter portion 85a is disposed outside the communication hole, i.e., inside the cavity resonator 87.

[0143] Embodiment 16 A multilayer board according to a sixteenth embodiment will be described with reference to Fig. 39. Fig. 39 is a vertical cross-sectional view of the multilayer board according to the sixteenth embodiment.

[0144] As shown in Fig. 39, the multilayer board according to the sixteenth embodiment includes a first high-frequency circuit pattern 91, a second high-frequency circuit pattern 92, and a second substrate 93. The first high-frequency circuit pattern 91 is provided in the lower part of the hollow part 12. The first high-frequency circuit pattern 91 is disposed so as to form the bottom surface of the hollow part 12. The second substrate 93 is provided on the lower surface of the magnet 13. The second substrate 93 is provided with a second high-frequency circuit pattern 92. The second high-frequency circuit pattern 92 is a circuit having an electrical length of a quarter wavelength of the frequency of the high-frequency signal passing through the first high-frequency circuit pattern 91.

[0145] Therefore, when magnet 13 is moved up and down, the distance between first high-frequency circuit pattern 91 and second high-frequency circuit pattern 92 changes, and the coupling coefficient therebetween changes. As a result, the multilayer board according to embodiment 16 can form high-frequency circuits with variable functions, such as a variable resonator, a variable filter, and a variable attenuator, by changing the high-frequency signal characteristics of first high-frequency circuit pattern 91 according to the distance between first high-frequency circuit pattern 91 and second high-frequency circuit pattern 92.

[0146] Embodiment 17 A multilayer board according to the seventeenth embodiment will be described with reference to Fig. 40. Fig. 40 is a diagram showing the configuration of the multilayer board according to the seventeenth embodiment.

[0147] As shown in Fig. 40, the multilayer substrate according to the seventeenth embodiment includes a substrate body 11, a hollow portion 12, a cantilever portion 101, a coil 102, and a magnet 103. The cantilever portion 101, which is the movable portion, is supported at a cantilever on the side surface of the hollow portion 12. Gaps are formed between the cantilever portion 101 and the top and bottom surfaces of the hollow portion 12. The coil 102 is provided in the cantilever portion 101. The magnet 103 is provided on the bottom surface of the substrate body 11.

[0148] Therefore, when a current is passed through the coil 102, an attractive or repulsive force is generated between the coil 102 and the magnet 103 due to an interaction between the magnetic field generated in the coil 102 and the magnetic field of the magnet 103. As a result, the cantilever portion 101 bends in the vertical direction.

[0149] The coil 102 and the magnet 103 may be disposed in opposite positions. In the multilayer board according to the seventeenth embodiment, the magnet 103 may be replaced with a yoke made of a soft magnetic material.

[0150] Embodiment 18 A multilayer board according to an eighteenth embodiment will be described with reference to Fig. 41. Fig. 41 is a cross-sectional view of the multilayer board according to the eighteenth embodiment.

[0151] As shown in FIG. 41, the multilayer board according to the eighteenth embodiment includes a conductor 104 instead of the yoke 31 of the multilayer board according to the sixth embodiment shown in FIG.

[0152] Therefore, when a current is passed through the left coil 44 for a short time while the conductor 104 is on the left side of the hollow portion 12, an eddy current is generated inside the conductor 104 due to the induced magnetic field. Then, while the eddy current is generated inside the conductor 104, if a current is passed through the right coil 44 so as to generate a magnetic field in the opposite direction to the magnetic field caused by the eddy current inside the conductor 104, the conductor 104 moves toward the right side of the hollow portion 12 due to the interaction between the magnetic field in the right coil 44 and the eddy current inside the conductor 104. Note that when the conductor 104 is to be moved from the right side to the left side of the hollow portion 12, the reverse operation of the above-mentioned operation can be performed.

[0153] In addition, within the scope of the present disclosure, the embodiments may be freely combined, or any of the components in each embodiment may be modified, or any of the components in each embodiment may be omitted. [Industrial Applicability]

[0154] The multilayer board according to the present disclosure is suitable for use in multilayer boards and the like because a coil is provided around the hollow portion, allowing the movable portion to move within the hollow portion. [Explanation of symbols]

[0155] 11 substrate body, 12 hollow portion, 13 magnet, 13a conductor plating, 13b insulating film, 14 first switch conductor pattern, 15 second switch conductor pattern, 16 coil, 16a lower coil conductor pattern, 16b upper coil conductor pattern, 16c via, 17 coil, 17a coil conductor pattern, 17b lead-out conductor pattern, 17c via, 18, 19 coil, 20 third switch conductor pattern, 21 fourth switch conductor pattern, 22 upper yoke, 23 lower yoke, 23a adjustment hole, 24 upper yoke pattern, 25 lower yoke pattern, 26 coil, 26a lower coil conductor pattern, 26b middle coil conductor pattern, 26c upper coil conductor pattern, 26d, 26e via, 27 coil, 27a lower coil conductor pattern, 27b middle coil conductor pattern, 27c Upper coil conductor pattern, 31 yoke, 31a conductor plating, 32 upper magnet, 33 lower magnet, 34 coil, 41 magnet, 41a conductor plating, 42 first switch conductor pattern, 43 second switch conductor pattern, 44 coil, 44a coil conductor pattern, 44b via, 45 magnetic body, 51 first strip line pattern, 52 second strip line pattern, 53 first ground pattern, 54 second ground pattern, 55 third ground pattern, 56 via, 61 first strip line pattern, 62 second strip line pattern, 63a to 63d ground pattern, 64a to 64d via, 65 dielectric, 66a to 66f ground pattern, 67a to 67f via, 71 dielectric, 72 strip line pattern, 73 first signal coil, 73a coil conductor pattern, 73b lead-out conductor pattern, 73c Via, 74 second signal coil, 74a coil conductor pattern, 74b lead-out conductor pattern, 74c via, 75 second substrate, 76, 77 soft magnetic material, 78 signal coil, 81 protrusion, 81a large diameter portion, 82 waveguide, 83 cavity resonator, 84 stub, 85 protrusion, 85a large diameter portion, 86 waveguide, 87 cavity resonator, 91 first high frequency circuit pattern, 92 second high frequency circuit pattern, 93 second substrate, 101 cantilever portion, 102 coil, 103 magnet, 104 conductor.

Claims

1. A substrate body formed of resin or ceramics, A hollow portion provided inside the substrate body, A movable portion provided inside the hollow portion and formed of a conductor or a magnetic material, A coil provided around the hollow portion in the substrate body, A protrusion provided on the lower surface of the movable portion and formed of a conductive material, A waveguide provided on the substrate body, A cavity resonator provided in an intermediate portion of the waveguide and into which the protrusion is inserted and removed, A multilayer substrate, characterized in that it comprises the above.

2. A substrate body formed of resin or ceramics, A hollow portion provided inside the substrate body, A movable portion provided inside the hollow portion and formed of a conductor or a magnetic material, A pair of switch conductor patterns that form the bottom surface of the hollow portion and are in contact with the movable portion, A coil provided so as to surround the top surface and the bottom surface of the hollow portion in the substrate body, A strip line pattern provided on at least one of the upper and lower sides of the hollow portion in the substrate body, A multilayer substrate, characterized in that it comprises the above.

3. The multilayer substrate according to claim 2, further comprising a magnetic material provided inside the coil in the substrate body.

4. The multilayer substrate according to claim 2, further comprising a dielectric provided on a side surface of the movable portion.

5. The multilayer substrate according to any one of claims 2 to 4, further comprising a signal coil provided so as to surround the top surface and the bottom surface of the hollow portion in the substrate body.

6. A substrate body formed of resin or ceramics, A hollow portion provided inside the substrate body, A movable portion provided inside the hollow portion and formed of a conductor or a magnetic material, A pair of switch conductor patterns that form the bottom surface of the hollow portion and contact the movable portion, A coil provided so as to surround the top surface and the bottom surface of the hollow portion in the substrate body, A protrusion provided on the side surface of the movable portion and formed of a conductive material, A waveguide provided on the substrate body, A cavity resonator provided in an intermediate portion of the waveguide, into which the protrusion is inserted and removed. A multilayer substrate characterized by the above.

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