Method for manufacturing adhesive laminate sheet, laminate, and wiring board

Abstract

The present invention provides an adhesive laminate sheet that can be quickly peeled off and removed after use as a reinforcing sheet, the adhesive laminate sheet comprising a carrier, a release layer provided on the carrier, and an adhesive layer provided on the release layer and including an adhesive material.

Description

[Technical field]

[0001] The present invention relates to a method for producing an adhesive laminate sheet, a laminate, and a wiring board. [Background technology]

[0002] In recent years, in order to increase the packaging density of printed wiring boards and reduce their size, multi-layered printed wiring boards have become widespread. Such multi-layered printed wiring boards are used in many portable electronic devices for the purpose of reducing their weight and size. There is a demand for further reduction in the thickness of the interlayer insulating layer and further weight reduction as a wiring board.

[0003] As a technique for satisfying such requirements, a method for manufacturing a multilayer printed wiring board using a coreless build-up method has been adopted. The coreless build-up method is a method for forming a multilayer by alternately stacking (building up) insulating layers and wiring layers without using a so-called core substrate. In the coreless build-up method, it has been proposed to use a carrier-attached copper foil so that the support body and the multilayer printed wiring board can be easily peeled off. For example, Patent Document 1 (JP Patent Publication 2005-101137 A) discloses a method for manufacturing a package substrate for mounting a semiconductor element, which includes attaching an insulating resin layer to the carrier surface of a carrier-attached copper foil to form a support body, forming a first wiring conductor by processes such as photoresist processing, pattern electrolytic copper plating, and resist removal on the ultrathin copper layer side of the carrier-attached copper foil, forming a build-up wiring layer, peeling off the carrier-attached support substrate, and removing the ultrathin copper layer.

[0004] In addition, in order to miniaturize the embedded circuit as shown in Patent Document 1, a carrier-attached copper foil with an ultrathin copper layer having a thickness of 1 μm or less is desired. Therefore, in order to realize a reduction in the thickness of the ultrathin copper layer, it has been proposed to form an ultrathin copper layer by a gas phase method such as sputtering. For example, Patent Document 2 (WO 2017 / 150283) discloses a carrier-attached copper foil in which a release layer, an anti-reflection layer, and an ultrathin copper layer are formed by sputtering on a carrier such as glass or ceramics. In addition, Patent Document 3 (WO 2017 / 150284) discloses a carrier-attached copper foil in which an intermediate layer (e.g., an adhesive metal layer and a release auxiliary layer), a release layer, and an ultrathin copper layer (e.g., a film thickness of 300 nm) are formed by sputtering on a carrier such as glass or ceramics. Patent documents 2 and 3 also teach that the inclusion of an intermediate layer made of a specific metal provides excellent stability in the mechanical peel strength of the carrier, and that the anti-reflective layer exhibits a desirable dark color, thereby improving visibility in image inspection (e.g., automated image inspection (AOI)).

[0005] In particular, with the further miniaturization and power saving of electronic devices, there is an increasing need for higher integration and thinner semiconductor chips and printed wiring boards. In recent years, the adoption of FO-WLP (Fan-Out Wafer Level Packaging) and PLP (Panel Level Packaging) has been considered as next-generation packaging technologies to meet such needs. The adoption of a coreless build-up method is also considered for FO-WLP and PLP. One such method is a method called the RDL-First (Redistribution Layer-First) method, in which a wiring layer and, if necessary, a build-up wiring layer are formed on the surface of a coreless support, and the support is peeled off if necessary, and then chips are mounted. For example, Patent Document 4 (JP 2015-35551 A) discloses a method for manufacturing a semiconductor device, including forming a metal release layer on a main surface of a support made of glass or a silicon wafer, forming an insulating resin layer thereon, forming a redistribution layer including a build-up layer thereon, mounting and sealing a semiconductor integrated circuit thereon, exposing the release layer by removing the support, exposing secondary mounting pads by removing the release layer, forming solder bumps on the surfaces of the secondary mounting pads, and secondary mounting.

[0006] In response to recent technological trends in which the adoption of FO-WLP and PLP is being considered, there is a demand for thinner build-up layers. However, when the build-up layer is thin, the build-up layer may be locally curved when peeling off the base material from the base material with the build-up layer produced using the coreless build-up method. Such a large curvature of the build-up layer may cause disconnection or peeling of the wiring layer inside the build-up layer, and as a result, the connection reliability of the wiring layer may be reduced. In order to address this problem, it has been proposed to improve the handling properties by laminating a reinforcing sheet on the multilayer laminate. For example, Patent Document 5 (Japanese Patent No. 6731060) discloses that in the manufacture of a multilayer wiring board, a reinforcing sheet is laminated on a laminate with a multilayer wiring layer including a peelable base material via a second peeling layer that provides a predetermined peel strength. According to this method, it is said that the base material and the reinforcing sheet can be peeled off in this order without locally curving the multilayer wiring layer. Patent Document 6 (Japanese Patent No. 6731061) discloses laminating a reinforcing sheet having a lower Vickers hardness than the substrate on a laminate with a multilayer wiring layer including a peelable substrate in order to improve the connection reliability of the multilayer wiring layer and the flatness of the multilayer wiring layer surface. Patent Document 7 (Japanese Patent No. 7112962) discloses providing an opening in the reinforcing sheet and using a soluble adhesive layer to laminate the reinforcing sheet to the multilayer laminate. Patent Document 8 (Japanese Patent No. 7208011) discloses using a soluble adhesive layer to laminate the reinforcing sheet to the multilayer laminate and providing a non-occupied region in which the soluble adhesive layer is not formed within a predetermined region. According to the techniques disclosed in Patent Documents 7 and 8, it is said that the reinforcing sheet that has fulfilled its role can be peeled off in an extremely short time by a technique such as dissolving and peeling while minimizing the stress applied to the multilayer laminate. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2005-101137 A [Patent Document 2] International Publication No. 2017 / 150283 [Patent Document 3] International Publication No. 2017 / 150284 [Patent Document 4] JP 2015-35551 A [Patent Document 5] Patent No. 6731060 [Patent Document 6] Patent No. 6731061 [Patent Document 7] Patent No. 7112962 [Patent Document 8] Patent No. 7208011 Summary of the Invention

[0008] When the reinforcing sheets disclosed in Patent Documents 7 and 8 are laminated to a multilayer laminate, the reinforcing sheet can be peeled off in a short time after having fulfilled its function. However, there is a demand for even faster peeling of the reinforcing sheet.

[0009] The inventors have now discovered that in an adhesive laminate sheet, by providing a release layer and an adhesive layer containing an adhesive material in that order on a carrier, the sheet can be quickly peeled off and removed after use as a reinforcing sheet.

[0010] SUMMARY OF THE PRESENT EMBODIMENTS Accordingly, an object of the present invention is to provide an adhesive laminate sheet which can be quickly peeled off and removed after use as a reinforcing sheet.

[0011] According to the present invention, the following aspects are provided. [Aspect 1] Career and a release layer provided on the carrier; an adhesive layer provided on the release layer and including an adhesive material; An adhesive laminate sheet comprising: [Aspect 2] 2. The adhesive laminate sheet of embodiment 1, further comprising a metal layer disposed between the release layer and the adhesive layer. [Aspect 3] 3. The adhesive laminate sheet of claim 1 or 2, wherein the carrier is made of metal. [Aspect 4] 4. The adhesive laminate sheet according to any one of Aspects 1 to 3, wherein the carrier is made of at least one material selected from the group consisting of aluminum, stainless steel, copper, titanium, nickel, and duralumin. [Aspect 5] The adhesive laminate sheet according to any one of Aspects 1 to 4, wherein the adhesive material is at least one selected from the group consisting of a thermosetting epoxy resin, a thermosetting polyimide resin, a photosensitive polyimide resin, an acrylic resin, and a phenolic resin. [Aspect 6] The adhesive laminate sheet according to any one of aspects 1 to 5, wherein the adhesive layer has a thickness of 1 μm or more and 2000 μm or less. [Aspect 7] Plan view area A of the carrier C The planar area A of the adhesive layer A Ratio of A A / A C 3. The adhesive laminate sheet according to claim 1 or 2, wherein [Aspect 8] The adhesive laminate sheet according to any one of aspects 2 to 7, wherein the metal layer is composed of at least one metal selected from the group consisting of Ti, Cu, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo. [Aspect 9] The adhesive laminate sheet according to any one of aspects 2 to 8, wherein the metal layer has a thickness of 10 nm or more and 1000 nm or less. [Aspect 10] 10. The adhesive laminate sheet according to any one of aspects 1 to 9, wherein the release layer comprises carbon. [Aspect 11] A laminate comprising: an adhesive laminate sheet according to any one of aspects 1 to 10; a resin-containing layer provided on the adhesive layer of the adhesive laminate sheet; and an additional metal layer provided on the resin-containing layer. [Aspect 12] 12. The laminate of embodiment 11, further comprising an additional release layer disposed on the additional metal layer, and an additional carrier disposed on the additional release layer. [Aspect 13] A method for manufacturing a wiring board, comprising the steps of: preparing a laminate including a first carrier, a first release layer, a first metal layer, and a resin-containing layer in this order; a step of laminating an adhesive laminate sheet onto the laminate, the adhesive laminate sheet comprising a second carrier, a second release layer, and an adhesive layer containing an adhesive material, in that order, and the adhesive laminate sheet is laminated onto the laminate so that the adhesive layer and the resin-containing layer are in contact with each other; peeling the first carrier from the laminate having the adhesive laminate sheet laminated thereon at the first release layer; peeling the second carrier from the laminate from which the first carrier has been peeled off at the second release layer; removing the second release layer from the laminate from which the second carrier has been peeled off, thereby exposing the adhesive layer; removing the adhesive layer from the laminate from which the second release layer has been removed; A method for manufacturing a wiring board comprising: [Aspect 14] 14. The method for producing a wiring board according to claim 13, wherein the adhesive sheet further comprises a second metal layer between the second release layer and the adhesive layer. [Aspect 15] A method for manufacturing a wiring board described in aspect 13 or 14, wherein the resin-containing layer includes a first redistribution layer provided on the first metal layer, a molded resin layer provided on the first redistribution layer, and a second redistribution layer provided on the molded resin layer. [Aspect 16] 16. The method for producing a wiring board according to claim 15, wherein the molding resin layer contains an epoxy resin and / or a phenolic resin. [Aspect 17] 17. The method for producing a wiring board according to any one of aspects 13 to 16, wherein the first carrier is peeled off by a laser lift-off method or a mechanical method. [Aspect 18] The method for manufacturing a wiring board according to any one of aspects 13 to 17, further comprising a step of heating the laminate to a temperature of 100°C or higher and 350°C or lower before peeling off the second carrier after laminating the adhesive laminate sheet onto the laminate. [Aspect 19] After peeling off the first carrier from the laminate, and before peeling off the second carrier, a step of laminating an additional adhesive laminate sheet on the side of the laminate from which the first carrier has been peeled off, the additional adhesive laminate sheet comprising, in order, a third carrier, a third release layer, and a second adhesive layer comprising an adhesive material; A method for manufacturing a wiring board described in any one of aspects 13 to 18, wherein the additional adhesive laminate sheet is laminated onto the laminate so that the second adhesive layer abuts against the surface of the laminate from which the first carrier has been peeled off. [Brief description of the drawings]

[0012] [Figure 1] 1 is a schematic cross-sectional view showing one embodiment of an adhesive laminate sheet of the present invention. [Diagram 2] 2 is a schematic cross-sectional view showing one embodiment of a laminate including the adhesive laminate sheet of FIG. 1. [Diagram 3] FIG. 1 is a process flow diagram showing, in schematic cross-sectional views, an example of a method for producing a wiring board of the present invention, the initial steps ((i) to (iii)). [Figure 4] FIG. 4 is a process flow diagram showing, in schematic cross-sectional views, an example of a method for producing a wiring board of the present invention, and corresponds to steps ((iv) to (vi)) subsequent to the steps shown in FIG. [Diagram 5] FIG. 5 is a process flow diagram showing, in schematic cross-sectional views, an example of a method for producing a wiring board of the present invention, and corresponds to steps ((vii) to (ix)) subsequent to the steps shown in FIG. [Figure 6] FIG. 6 is a process flow diagram showing, in schematic cross-sectional views, an example of a method for producing a wiring board of the present invention, and corresponds to steps ((x) and (xi)) subsequent to the steps shown in FIG. 5. [Figure 7]FIG. 1 is a process flow diagram showing, in schematic cross-sectional views, an example of a method for producing a laminate using a metal foil with a carrier, and corresponds to early steps ((i) to (iii)). [Figure 8] FIG. 8 is a process flow diagram showing, in schematic cross-sectional views, an example of a method for producing a laminate using a metal foil with a carrier, and corresponds to the later steps ((iv) to (vi)) following the steps shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Adhesive laminate sheet An example of the adhesive laminate sheet of the present invention is shown in FIG. 1. As shown in FIG. 1, the adhesive laminate sheet 10 comprises a carrier 12, a release layer 16, and an adhesive layer 20 in this order. The release layer 16 is provided on the carrier 12. The adhesive layer 20 is provided on the release layer 16 and contains an adhesive material. The adhesive laminate sheet 10 preferably further comprises a metal layer 18 between the release layer 16 and the adhesive layer 20. If desired, the adhesive laminate sheet 10 may further comprise an intermediate layer 14 between the carrier 12 and the release layer 16. Each of the intermediate layer 14, the release layer 16, the metal layer 18, and the adhesive layer 20 may be a single layer consisting of one layer, or may be a multilayer consisting of two or more layers. In this way, in the adhesive laminate sheet 10, by providing the release layer 16 and the adhesive layer 20 containing an adhesive material on the carrier 12, it becomes possible to quickly remove the sheet after using it as a reinforcing sheet.

[0014] The adhesive laminate sheet 10 can be used as a reinforcing sheet and then peeled off and removed, for example, as follows. First, the adhesive layer 20 side of the adhesive laminate sheet 10 is attached to an adherend (for example, a laminate with a wiring layer), and the adherend is reinforced by the carrier 12, etc., improving handling properties. Then, since the release layer 16 is provided between the carrier 12 and the adhesive layer 20, the carrier 12 (and the intermediate layer 14, if present) that has served as a reinforcing sheet can be peeled off at the position of the release layer 16. After the carrier 12, etc. is peeled off, the release layer 16 (and the metal layer 18, if present) is removed, thereby exposing most or all of the surface of the adhesive layer 20. The adhesive layer 20 is removed by using a technique such as contacting the surface of the adhesive layer 20 thus exposed with a stripping liquid. In this way, according to the adhesive laminate sheet 10 of the present invention, the exposed adhesive layer 20 can be directly removed after the carrier 12, etc. that can function as a reinforcing sheet is peeled off. Therefore, compared to conventional methods in which the reinforcing sheet itself is present when the soluble adhesive layer is dissolved or softened, such as those disclosed in Patent Document 7 (Patent Publication No. 7112962) and Patent Document 8 (Patent Publication No. 7208011), and the like, and the contact area with the dissolving liquid, etc. is not sufficiently large, it is possible to peel off and remove the sheet and the adhesive layer more quickly.

[0015] The adhesive layer 20 is preferably a layer that can attach the adhesive laminate sheet 10 to the adherend with a desired degree of adhesion and can be removed from the adherend after use. The adhesive mode between the adhesive laminate sheet 10 and the adherend via the adhesive layer 20 is not particularly limited, and may be, for example, a mechanical bond (i.e., adhesion by anchor effect), a physical interaction (i.e., adhesion by van der Waals force), a chemical bond, etc. Examples of adhesive materials contained in the adhesive layer 20 include phenolic resins, urea resins, melamine resins, epoxy resins, polyimide resins, ethylene-vinyl acetate copolymer resins (EVA), urethane resins, acrylic resins, synthetic rubbers, and starches, and preferably thermosetting epoxy resins, thermosetting polyimide resins, photosensitive polyimide resins, acrylic resins, phenolic resins, or combinations thereof.

[0016] When the adhesive laminate sheet 10 is used as a reinforcing sheet for an adherend (e.g., a laminate with a wiring layer) that is to be subjected to a heat treatment at high temperature (e.g., 260°C for several minutes), it is preferable that the adhesive layer 20 can retain its adhesiveness even after such a heat treatment and can be removed after use. From this viewpoint, it is preferable that the adhesive material contains a thermosetting resin. Preferred examples of thermosetting resins include thermosetting epoxy resins, thermosetting polyimide resins, thermosetting phenolic resins, thermosetting melamine resins, and combinations thereof, and more preferably, thermosetting epoxy resins. An example of a product of an adhesive layer containing a thermosetting epoxy resin is TSA-16 manufactured by Toray Industries, Inc.

[0017] The adhesive layer 20 preferably has a thickness of 1 μm to 2000 μm, more preferably 3 μm to 1000 μm, even more preferably 5 μm to 800 μm, and particularly preferably 10 μm to 500 μm. With such a thickness, the adhesion to the adherend can be easily controlled within a desired range, and the adhesive laminate sheet 10 can be peeled off and removed in a shorter time after use as a reinforcing sheet or the like.

[0018] The adhesive layer 20 is preferably a layer that not only exhibits adhesiveness at room temperature, but also dissolves or softens when it comes into contact with a dissolving liquid. Therefore, the adhesive layer 20 preferably contains a solution-soluble resin, such as an acid-soluble resin or an alkali-soluble resin. This solution-soluble resin can be efficiently dissolved or softened when it comes into contact with a dissolving liquid, so that the adhesive layer 20 can be removed more quickly. In particular, the adhesive layer 20 preferably contains an alkali-soluble resin. A preferred example of the alkali-soluble resin is the thermosetting resin described above.

[0019] The method for forming the adhesive layer 20 is not particularly limited, and known methods can be used. For example, the adhesive layer 20 can be formed by applying a coating liquid in which an adhesive material is dissolved in a solvent onto the release layer 16 (or the metal layer 18, if present), and then drying to volatilize the solvent. Alternatively, a commercially available adhesive film may be placed on the release layer 16 (or the metal layer 18, if present), and then the two may be attached together by a method such as roll lamination or vacuum lamination.

[0020] The adhesive laminate sheet 10 has a plan view area A C Planar area A of adhesive layer 20 A Ratio of A A / A C is preferably 0.03 or more and 1.0 or less, more preferably 0.05 or more and 0.95 or less, further preferably 0.08 or more and 0.93 or less, and particularly preferably 0.10 or more and 0.90 or less. C and A A means the area of ​​the carrier 12 and the area of ​​the adhesive layer 20, respectively, when the adhesive laminate sheet 10 is viewed in plan. By forming the adhesive layer 20 to be sufficiently large relative to the carrier 12 in this way, the adhesive laminate sheet 10 can be stably and reliably adhered to the adherend. Nevertheless, as described above, the adhesive laminate sheet 10 can be contacted with a dissolving solution or the like in a state where most or all of the surface of the adhesive layer 20 is exposed after the carrier 12 is peeled off, so that the adhesive layer 20 can be removed in a short time.

[0021] Typically, the carrier 12 has a function of reinforcing the adherend and improving its handling properties when the adhesive laminate sheet 10 is laminated on the adherend. The carrier 12 has a spring limit value Kb 0.1 is 100N / mm 2 More than 1500N / mm 2 It is preferably equal to or less than 150 N / mm 2 More than 1200N / mm 2 Less than 200N / mm 2 More than 1000N / mm2 The following is the result.

[0022] For reference, the spring limit values ​​Kb for various candidate materials are 0.1 are illustrated in Tables 1 and 2 below.

[0023] [Table 1]

[0024] [Table 2]

[0025] The carrier 12 is preferably made of resin, metal (including alloys and intermetallic compounds), glass, ceramics, silicon, or a combination thereof, and more preferably made of metal. The use of a metal carrier has the advantages of effectively preventing damage to the carrier 12 during handling when the adhesive laminate sheet 10 is used as a reinforcing sheet, and of making it possible to recycle the carrier 12 after use. Examples of metals that make up the carrier 12 include metals having the above-mentioned spring limit value Kb 0.1 From the viewpoint of the Young's modulus, aluminum (including aluminum alloys), stainless steel, copper (including copper alloys such as bronze, phosphorus copper, copper-nickel alloy, and copper-titanium alloy), titanium (including titanium alloys), nickel (including nickel alloys) and duralumin (for example, A2017, A2024 and A7075 in the JIS standard), are listed, but stainless steel is particularly preferred from the viewpoint of chemical resistance. Examples of resins include epoxy resin, polyimide resin, polyethylene resin and phenol resin, and may be prepregs made of such resins and fiber reinforcement materials. The carrier 12 made of silicon may be any one containing Si as an element, and may be a SiO2 substrate, a SiN substrate, a Si single crystal substrate, a Si polycrystalline substrate, or the like. Preferred examples of glass constituting the carrier 12 include quartz glass, borosilicate glass, alkali-free glass, soda-lime glass, aluminosilicate glass, and combinations thereof.

[0026] The form of the carrier 12 is not limited to a sheet, and may be other forms such as a film, plate, and foil, as long as it can prevent or suppress bending of the adherend, and is preferably in the form of a sheet or plate. The carrier 12 may be a laminate of these sheets, films, plates, and foils. Typical examples of the carrier 12 include metal sheets, resin sheets (particularly hard resin sheets), and glass sheets. From the viewpoint of maintaining the strength of the carrier 12 and facilitating handling of the carrier 12, the thickness of the carrier 12 is preferably 10 μm or more and 1 mm or less, more preferably 50 μm or more and 800 μm or less, and even more preferably 100 μm or more and 600 μm or less. When the carrier 12 is a metal sheet (e.g., a stainless steel sheet), the ten-point average roughness Rz-jis (measured in accordance with JIS B 0601-2001) of the surface of the metal sheet on which the release layer 16 (or intermediate layer 14, if present) is formed is preferably 0.05 μm to 500 μm, more preferably 0.5 μm to 400 μm, and even more preferably 1 μm to 300 μm. With such a surface roughness, the anchor effect caused by the unevenness of the surface makes it easier to control the peel strength between the carrier and the adhesive layer to a desired value.

[0027] The intermediate layer 14, which is provided as desired, is a layer that is interposed between the carrier 12 and the release layer 16 and contributes to ensuring the adhesion between the carrier 12 and the release layer 16. Examples of metals constituting the intermediate layer 14 include Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, Mo, and combinations thereof (hereinafter, sometimes referred to as metal M), preferably Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, Mo, and combinations thereof, more preferably Cu, Ti, Zr, Al, Cr, W, Ni, Mo, and combinations thereof, even more preferably Cu, Ti, Al, Cr, Ni, Mo, and combinations thereof, and particularly preferably Cu, Ti, Al, Ni, and combinations thereof. The intermediate layer 14 may be a pure metal or an alloy. The metal constituting the intermediate layer 14 may contain impurities resulting from raw material components, film formation process, etc. In addition, although not particularly limited, when the intermediate layer 14 is exposed to the atmosphere after being formed, the presence of oxygen due to the exposure is permitted. The upper limit of the content of the above metals is not particularly limited and may be 100 atomic %. The intermediate layer 14 is preferably a layer formed by physical vapor deposition (PVD), more preferably a layer formed by sputtering. In terms of uniformity of the film thickness distribution, it is particularly preferable that the intermediate layer 14 is a layer formed by magnetron sputtering using a metal target. The thickness of the intermediate layer 14 is preferably 10 nm or more and 1000 nm or less, more preferably 30 nm or more and 800 nm or less, even more preferably 60 nm or more and 600 nm or less, and particularly preferably 100 nm or more and 400 nm or less. By setting the thickness in this range, it is possible to obtain an intermediate layer having a roughness equivalent to that of the carrier. This thickness is a value measured by analyzing the layer cross section with an energy dispersive X-ray spectrometer (TEM-EDX) of a transmission electron microscope.

[0028] The intermediate layer 14 may be a single layer or may be a two or more layer structure. When the intermediate layer 14 is a single layer structure, the intermediate layer 14 is preferably a layer containing a metal composed of Cu, Al, Ti, Ni, or a combination thereof (e.g., an alloy or an intermetallic compound), more preferably Al, Ti, or a combination thereof (e.g., an alloy or an intermetallic compound), and even more preferably a layer containing mainly Al or a layer containing mainly Ti. On the other hand, when a metal or alloy that does not have a sufficiently high adhesion to the carrier 12 is used for the intermediate layer 14, the intermediate layer 14 is preferably a two-layer structure. An example of a preferred two-layer structure of the intermediate layer 14 is a laminated structure consisting of a Ti-containing layer adjacent to the carrier 12 and a Cu-containing layer adjacent to the release layer 16. In addition, since the peel strength also changes when the balance of the constituent elements and thicknesses of each layer of the two-layer structure is changed, it is preferable to appropriately adjust the constituent elements and thicknesses of each layer. In this specification, the category of the "metal M-containing layer" also includes alloys containing elements other than the metal M within a range that does not impair the releasability of the carrier. Therefore, the intermediate layer 14 can also be said to be a layer mainly containing the metal M. From the above points of view, the content of the metal M in the intermediate layer 14 is preferably 50 atomic % or more and 100 atomic % or less, more preferably 60 atomic % or more and 100 atomic % or less, even more preferably 70 atomic % or more and 100 atomic % or less, particularly preferably 80 atomic % or more and 100 atomic % or less, and most preferably 90 atomic % or more and 100 atomic % or less.

[0029] When the intermediate layer 14 is made of an alloy, a preferred example of the alloy is a Ni alloy. The Ni alloy preferably has a Ni content of 45% by weight or more and 98% by weight or less, more preferably 55% by weight or more and 90% by weight or less, and even more preferably 65% ​​by weight or more and 85% by weight or less. A preferred Ni alloy is an alloy of Ni and at least one selected from the group consisting of Cr, W, Ta, Co, Cu, Ti, Zr, Si, C, Nd, Nb, and La, and more preferably an alloy of Ni and at least one selected from the group consisting of Cr, W, Cu, and Si. When the intermediate layer 14 is a Ni alloy layer, it is particularly preferred in terms of uniformity of the film thickness distribution that the layer is formed by magnetron sputtering using a Ni alloy target.

[0030] The release layer 16 is a layer that enables or facilitates the peeling of the carrier 12 and, if present, the intermediate layer 14. The release layer 16 may be peelable by a method in which a physical force is applied, or may be peelable by a method in which the layer is peeled off by a laser (laser lift-off, LLO). When the release layer 16 is made of a material that enables peeling by laser lift-off, the release layer 16 may be made of a resin whose interfacial adhesive strength decreases when irradiated with a laser beam after curing, or may be a layer of silicon, silicon carbide, metal oxide, or the like that is modified by irradiation with a laser beam. The release layer 16 may be either an organic release layer or an inorganic release layer, but is preferably an inorganic release layer from the viewpoint of heat resistance. Examples of organic components used in the organic release layer include nitrogen-containing organic compounds, sulfur-containing organic compounds, carboxylic acids, and the like. Examples of nitrogen-containing organic compounds include triazole compounds, imidazole compounds, and the like. On the other hand, examples of inorganic components used in the inorganic release layer include metal oxides or metal oxynitrides containing at least one of Ni, Mo, Co, Cr, Fe, Ti, W, P, Zn, Cu, Al, Nb, Zr, Ta, Ag, In, Sn, and Ga, or carbon layers. Among these, the release layer 16 preferably contains carbon, and more preferably is a carbon-containing layer, i.e., a layer mainly containing carbon, from the viewpoint of ease of release and film formability, and is even more preferably a layer mainly composed of carbon or hydrocarbon, and is particularly preferably a layer composed of amorphous carbon, which is a hard carbon film. In this case, the release layer 16 (i.e., the carbon-containing layer) preferably has a carbon concentration measured by XPS of 60 atomic % or more, more preferably 70 atomic % or more, even more preferably 80 atomic % or more, and particularly preferably 85 atomic % or more. The upper limit of the carbon concentration is not particularly limited and may be 100 atomic %, but 98 atomic % or less is practical. The release layer 16 may contain impurities (for example, oxygen, hydrogen, etc. derived from the surrounding environment such as the atmosphere). Furthermore, the release layer 16 may contain metal atoms of types other than the metal contained in the release layer 16 due to the film-forming method of the metal layer 18 and the like.When a carbon-containing layer is used as the peeling layer 16, the mutual diffusion and reactivity with the carrier is small, and even if the layer is subjected to press processing at a temperature exceeding 300°C, the formation of a metal bond caused by high-temperature heating between the metal layer (if present) and the bonding interface can be prevented, and the carrier can be easily peeled off and removed. This peeling layer 16 is also preferably formed by a gas phase method such as sputtering, in terms of suppressing excessive impurities in the peeling layer 16 and continuous productivity with the film formation of the intermediate layer 14 that is provided as desired. When a carbon-containing layer is used as the peeling layer 16, the thickness is preferably 1 nm or more and 20 nm or less, more preferably 1 nm or more and 10 nm or less. By setting the thickness in this way, it is possible to obtain a peeling layer that has the same roughness as the carrier and has a peeling function. This thickness is a value measured by analyzing the layer cross section with an energy dispersive X-ray spectrometer (TEM-EDX) of a transmission electron microscope.

[0031] The release layer 16 may include a metal oxide layer and a carbon-containing layer, or may be a layer containing both a metal oxide and carbon. In particular, when the adhesive laminate sheet 10 includes the intermediate layer 14 and the metal layer 18, the carbon-containing layer contributes to stable release of the carrier 12, and the metal oxide layer can suppress the diffusion of metal elements derived from the intermediate layer 14 and the metal layer 18 due to heating, so that it is possible to maintain stable release properties even after heating at high temperatures of, for example, 350°C or higher. The metal oxide layer is preferably a layer containing an oxide of a metal composed of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, Mo, or a combination thereof. The metal oxide layer is particularly preferably a layer formed by a reactive sputtering method in which sputtering is performed under an oxidizing atmosphere using a metal target, because the film thickness can be easily controlled by adjusting the film formation time. The thickness of the metal oxide layer is preferably 0.1 nm or more and 100 nm or less. The upper limit of the thickness of the metal oxide layer is more preferably 60 nm or less, even more preferably 30 nm or less, and particularly preferably 10 nm or less. This thickness is a value measured by analyzing the layer cross section with a transmission electron microscope energy dispersive X-ray spectrometer (TEM-EDX). At this time, the order in which the metal oxide layer and the carbon layer are laminated as the release layer 16 is not particularly limited. In addition, the release layer 16 may exist in a mixed phase state (i.e., a layer containing both metal oxide and carbon) in which the boundary between the metal oxide layer and the carbon-containing layer is not clearly specified.

[0032] Similarly, from the viewpoint of maintaining stable peelability even after heat treatment at high temperatures, the release layer 16 may be a metal-containing layer whose surface adjacent to the adhesive layer 20 (or the metal layer 18, if present) is a fluoride-treated surface and / or a nitriding surface. The metal-containing layer preferably has a region (hereinafter referred to as "(F+N) region") in which the sum of the fluorine content and the nitrogen content is 1.0 atomic % or more over a thickness of 10 nm or more, and the (F+N) region is preferably present on the adhesive layer 20 side of the metal-containing layer. The thickness (SiO2 equivalent) of the (F+N) region is a value determined by performing a depth direction elemental analysis of the adhesive laminate sheet 10 using XPS. The fluoride-treated surface or the nitriding surface can be preferably formed by reactive ion etching (RIE) or reactive sputtering. On the other hand, the metal element contained in the metal-containing layer preferably has a negative standard electrode potential. Preferred examples of the metal element contained in the metal-containing layer include Cu, Ag, Sn, Zn, Ti, Al, Nb, Zr, W, Ta, Mo, and combinations thereof (e.g., alloys and intermetallic compounds). The content of the metal element in the metal-containing layer is preferably 50 atomic % or more and 100 atomic % or less. The metal-containing layer may be a single layer composed of one layer, or may be a multilayer composed of two or more layers. The thickness of the entire metal-containing layer is preferably 10 nm or more and 1000 nm or less, more preferably 30 nm or more and 500 nm or less, even more preferably 50 nm or more and 400 nm or less, and particularly preferably 100 nm or more and 300 nm or less. The thickness of the metal-containing layer itself is a value measured by analyzing the layer cross section with an energy dispersive X-ray spectrometer (TEM-EDX) of a transmission electron microscope.

[0033] Alternatively, the release layer 16 may be a metal oxynitride-containing layer instead of a carbon layer or the like. The surface of the metal oxynitride-containing layer opposite to the carrier 12 (i.e., the adhesive layer 20 side) preferably contains at least one metal oxynitride selected from the group consisting of TaON, NiON, TiON, NiWON and MoON. In addition, when the adhesive laminate sheet 10 contains the metal layer 18, in order to ensure the adhesion between the carrier 12 and the metal layer 18, the surface of the metal oxynitride-containing layer on the carrier 12 side preferably contains at least one selected from the group consisting of Cu, Ti, Ta, Cr, Ni, Al, Mo, Zn, W, TiN and TaN. In this way, it is possible to suppress the number of foreign particles on the surface of the metal layer 18 and maintain a stable peel strength even after being heated at a high temperature for a long time. The thickness of the metal oxynitride-containing layer is preferably 5 nm or more and 500 nm or less, more preferably 10 nm or more and 400 nm or less, even more preferably 20 nm or more and 200 nm or less, and particularly preferably 30 nm or more and 100 nm or less. This thickness is a value measured by analyzing a cross section of the layer with a transmission electron microscope with an energy dispersive X-ray spectrometer (TEM-EDX).

[0034] The metal layer 18, which is provided as desired, is a layer made of a metal. The metal layer 18 is interposed between the release layer 16 and the adhesive layer 20, so that the carrier 12 (and the intermediate layer 14, if present) can be peeled off more smoothly. The metal layer 18 may be a single layer structure or a structure of two or more layers. Preferred examples of the metal constituting the metal layer 18 include Ti, Cu, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, Mo, and combinations thereof, more preferably Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, Mo, and combinations thereof, even more preferably Cu, Ti, Al, Cr, Ni, Mo, and combinations thereof, and particularly preferably Cu, Ti, Al, Ni, and combinations thereof. The metal layer 18 may be a pure metal or an alloy. The metal constituting the metal layer 18 may contain impurities resulting from raw material components, film formation processes, and the like. The upper limit of the content of the metal is not particularly limited and may be 100 atomic %. The metal layer 18 is preferably a layer formed by physical vapor deposition (PVD), more preferably a layer formed by sputtering. The thickness (total thickness) of the metal layer 18 is preferably 10 nm to 1000 nm, more preferably 20 nm to 900 nm, more preferably 30 nm to 800 nm, even more preferably 40 nm to 700 nm, and particularly preferably 50 nm to 500 nm. In this way, the metal layer 18 can be removed in an extremely short time, and the adhesive laminate sheet 10 can be peeled off and removed more quickly after being used as a reinforcing sheet. The thickness of the metal layer 18 is a value measured by analyzing the layer cross section with an energy dispersive X-ray spectrometer (TEM-EDX) of a transmission electron microscope.

[0035] The intermediate layer 14 (if present), the release layer 16, and the metal layer 18 (if present) are preferably formed by a physical vapor deposition (PVD) method. Examples of physical vapor deposition (PVD) methods include sputtering, vacuum deposition, and ion plating, but the sputtering method is the most preferable because it can control the film thickness in a wide range, such as 0.05 nm to 5000 nm, and can ensure film thickness uniformity over a wide width or area. In particular, by forming all of the intermediate layer 14 (if present), the release layer 16, and the metal layer 18 (if present) by a sputtering method, the manufacturing efficiency is significantly improved. Therefore, the intermediate layer 14 (if present), the release layer 16, and the metal layer 18 (if present) are preferably physical vapor deposition (PVD) films, i.e., films formed by a physical vapor deposition (PVD) method, and more preferably sputtered films, i.e., films formed by a sputtering method.

[0036] The film formation by the physical vapor deposition (PVD) method may be performed under known conditions using a known vapor phase film formation apparatus, and is not particularly limited. For example, when the sputtering method is adopted, the sputtering method may be various known methods such as magnetron sputtering, bipolar sputtering, and facing target sputtering, but magnetron sputtering is preferred in terms of high film formation speed and high productivity. Sputtering may be performed with either a DC (direct current) or RF (radio frequency) power source. In addition, a plate-type target, which is widely known, may be used as the target shape, but a cylindrical target is preferably used from the viewpoint of target utilization efficiency. The purity of the target is preferably 99.9% or more. As the gas used for sputtering, an inert gas such as argon gas is preferably used. The flow rate of the argon gas may be appropriately determined according to the sputtering chamber size and film formation conditions, and is not particularly limited. In addition, from the viewpoint of continuous film formation without operational failure such as abnormal discharge and plasma irradiation failure, the pressure during film formation is preferably in the range of 0.1 Pa to 20 Pa. This pressure range may be set by adjusting the deposition power and the flow rate of argon gas according to the structure and capacity of the device, the exhaust capacity of the vacuum pump, the rated capacity of the deposition power source, etc. Also, the sputtering power is set to 0.05 W / cm per unit area of ​​the target, taking into consideration the uniformity of the deposited film thickness, productivity, etc. 2 More than 10.0W / cm 2 It may be set appropriately within the following range.

[0037] When the adhesive laminate sheet 10 has a metal layer 18 or the like, it is preferable that the metal layer 18, the intermediate layer 14 if desired, and the peel layer 16 if desired (i.e., at least the metal layer 18, for example, the metal layer 18 and the intermediate layer 14) extend to the end face of the carrier 12 to cover the end face. That is, it is preferable that not only the surface of the carrier 12 but also the end face is covered with at least the metal layer 18. By covering the end face, it is possible to prevent the infiltration of a chemical solution into the carrier 12 during the manufacturing process of the wiring board, etc., and also to firmly prevent chipping due to peeling at the side edge when handling the adhesive laminate sheet 10, that is, chipping of the coating (i.e., the metal layer 18) on the peel layer 16. The covered area on the end face of the carrier 12 is preferably an area of ​​0.1 mm or more, more preferably an area of ​​0.2 mm or more, and even more preferably the entire end face of the carrier 12 from the surface of the carrier 12 in the thickness direction (i.e., the direction perpendicular to the carrier surface).

[0038] The thickness of the adhesive laminate sheet 10 as a whole is not particularly limited, but is preferably 100 μm or more and 5000 μm or less, more preferably 130 μm or more and 4800 μm or less, even more preferably 150 μm or more and 4500 μm or less, and particularly preferably 200 μm or more and 4000 μm or less. The size of the adhesive laminate sheet 10 is not particularly limited, but is preferably 10 cm or more in diameter or 10 cm or more in square, more preferably 20 cm or more in diameter or 20 cm or more in square, and even more preferably 25 cm or more in diameter or 25 cm or more in square. The upper limit of the size of the adhesive laminate sheet 10 is not particularly limited, but a diameter of 1000 cm or 1000 cm in square is one of the upper limits. In addition, the adhesive laminate sheet 10 is in a form that can be handled by itself.

[0039] Laminate According to a preferred embodiment of the present invention, a laminate including an adhesive laminate sheet is provided. An example of the laminate of the present invention is shown in FIG. 2. As shown in FIG. 2, the laminate 30 includes an adhesive laminate sheet 10, a resin-containing layer 40 provided on the adhesive layer 20 of the adhesive laminate sheet 10, and an additional metal layer 38 provided on the resin-containing layer 40. If desired, the laminate 30 may further include an additional release layer 36 provided on the additional metal layer 38, and an additional carrier 32 provided on the additional release layer 36. The laminate 30 may further include an additional intermediate layer 34 between the additional release layer 36 and the additional carrier 32.

[0040] The laminate 30 corresponds to an intermediate product obtained after laminating an adhesive laminate sheet 70 onto the laminate 50, or an intermediate product obtained after peeling off the first carrier 52, etc., in a method for producing a wiring board, which will be described later. Therefore, the preferred embodiments of the laminate 50, which will be described later, are the same as the preferred embodiments of the laminate 30.

[0041] Method for manufacturing wiring board According to another preferred embodiment of the present invention, there is provided a method for manufacturing a wiring board using an adhesive laminate sheet. This method includes the steps of (1) preparing a laminate, (2) laminating an adhesive laminate sheet, (3) peeling off the first carrier, (4) laminating an additional adhesive laminate sheet as required, (5) peeling off the second carrier, (6) removing the second release layer, and (7) removing the adhesive layer. Each of the steps (1) to (7) will be described below with reference to the drawings.

[0042] (1) Preparation of the laminate An example of the method for manufacturing a wiring board of the present invention is shown in Figs. 3 to 6. First, a laminate 50 is prepared as shown in Fig. 3(i). This laminate 50 includes a first carrier 52, an optional first intermediate layer 54 (an optional layer), a first release layer 56, a first metal layer 58, and a resin-containing layer 60 in this order. The first carrier 52, the first intermediate layer 54, the first release layer 56, and the first metal layer 58 may be similar to the carrier-attached metal foil as disclosed in Patent Document 2 (WO 2017 / 150283) and Patent Document 3 (WO 2017 / 150284), and are not particularly limited. Alternatively, these various layers may be similar to the preferred embodiments of the carrier 12, intermediate layer 14, release layer 16, and metal layer 18 described above with respect to the adhesive laminate sheet 10.

[0043] The resin-containing layer 60 is a layer containing a resin, and preferably includes a rewiring layer. In the present invention, the rewiring layer means a layer including an insulating layer and a wiring layer formed inside and / or on the surface of the insulating layer. As described later, the resin-containing layer 60 preferably includes a first rewiring layer 60a provided on the first metal layer 58, a molded resin layer 60b provided on the first rewiring layer 60a, and a second rewiring layer 60c provided on the molded resin layer 60b. The molded resin layer 60b is a layer containing a resin for sealing an electronic element such as a chip. Therefore, the molded resin layer 60b can embed an electronic element. Examples of the electronic element include a semiconductor element, a chip capacitor, a resistor, and the like. Preferred examples of the resin included in the resin-containing layer 60 (typically the molded resin layer 60b) include an epoxy resin and a phenol resin.

[0044] An example of a preferred method for forming the resin-containing layer 60 is shown in Figs. 7 and 8. First, a carrier-attached metal foil is prepared, which includes a first intermediate layer 54 (any layer), a first release layer 56, and a first metal layer 58 in this order on a first carrier 52 (Fig. 7(i)). A wiring layer and an insulating layer are formed on the surface of the first metal layer 58 of the carrier-attached metal foil by a coreless build-up method to obtain a first rewiring layer 60a (Fig. 7(ii)). Specifically, a photoresist is laminated on the first metal layer 58, and exposed and developed to form a predetermined pattern to form a resist pattern. Then, electroplating (e.g., copper electroplating) is performed between the resist patterns, and the resist pattern is peeled off. After that, unnecessary parts of the first metal layer 58 exposed by the peeling of the resist pattern (i.e., parts that do not form a wiring pattern) are removed by etching to form a first wiring layer. Then, an insulating layer and an n-th wiring layer (n is an integer of 2 or more) are alternately formed on the surface of the carrier-attached metal foil on which the first wiring layer is formed. In this way, a first redistribution layer 60a including an insulating layer and a wiring layer formed inside and / or on the surface of the insulating layer is obtained. If desired, a pillar (columnar electrode) P may be formed on the first redistribution layer 60a, a chip C may be mounted, etc. (FIG. 7(iii)). The pillar P, the chip C, etc. may be embedded in an insulating resin to form a molded resin layer 60b (FIG. 8(iv)). The molded resin layer 60b may be surface-polished to expose the pillar P, etc. from the molded resin layer 60b (FIG. 8(v)). Preferable examples of surface polishing include grinding using a grindstone and chemical mechanical polishing (CMP). Thereafter, a second redistribution layer 60c is formed on the surface of the molded resin layer 60b by the above-mentioned coreless build-up method (FIG. 8(vi)). In this way, a laminate 50 can be preferably produced which includes a resin-containing layer 60 including a first rewiring layer 60a, a molded resin layer 60b, and a second rewiring layer 60c on the first metal layer 58 of the metal foil with a carrier.

[0045] If desired, the edges of the first carrier 52, the first intermediate layer 54, the first release layer 56, the first metal layer 58 and / or the resin-containing layer 60 may be trimmed before laminating the adhesive laminate sheet described below (FIG. 3(ii)). By doing so, the trimmed portion can be used as a trigger to more easily peel off the first carrier 52, etc., described below. The trimming method is not particularly limited, and for example, a cutting tool T (e.g., a cutter) or a machine tool (e.g., a cutting blade) as shown in FIG. 3(ii) can be used.

[0046] (2) Lamination of adhesive laminate sheets The adhesive laminate sheet 70 is laminated on the laminate 50 (FIG. 3(iii)). The adhesive laminate sheet 70 includes, in this order, a second carrier 72, an optional second intermediate layer 74 (optional layer), a second peeling layer 76, an optional second metal layer 78 (optional layer), and an adhesive layer 80 containing an adhesive material. The adhesive laminate sheet 70 is then laminated on the laminate 50 so that the adhesive layer 80 and the resin-containing layer 60 come into contact with each other. In this way, the resin-containing layer 60 is reinforced by the second carrier 72, etc., and it is possible to prevent or suppress the resin-containing layer 60 from curving significantly locally when the first carrier 52 is peeled off, etc. In particular, when the resin-containing layer 60 includes a rewiring layer, it is possible to prevent disconnection or peeling of the wiring layer on the surface and / or inside of the rewiring layer, thereby improving the connection reliability of the rewiring layer. In addition, by effectively preventing or suppressing curvature, it is also possible to improve the flatness (coplanarity) of the surface of the rewiring layer. When the adhesive laminate sheet 70 is laminated to the laminate 50, an additional release layer (not shown) may be interposed between the adhesive layer 80 and the resin-containing layer 60. In this way, when the second carrier 72 is peeled off after the first carrier 52 described below is peeled off, the second carrier 72 and the like can be peeled off and removed starting from the additional release layer, and the amount of residue of the adhesive layer 80 that may remain on the surface of the resin-containing layer 60 can be significantly reduced. A preferred embodiment of the additional release layer is not particularly limited, and may be, for example, similar to the preferred embodiment of the release layer 16 described above.

[0047] The preferred aspects of the adhesive laminate sheet 10 described above also apply to the adhesive laminate sheet 70. That is, the second carrier 72, the second intermediate layer 74, the second peeling layer 76, the second metal layer 78, and the adhesive layer 80 may be similar to the carrier 12, the intermediate layer 14, the peeling layer 16, the metal layer 18, and the adhesive layer 20 described above. When the adhesive layer 80 contains a thermosetting resin as an adhesive material, it is preferable to perform a curing treatment (cure treatment) after laminating the adhesive laminate sheet 70 on the laminate 50. The conditions of the curing treatment can be appropriately determined depending on the type of thermosetting resin, etc., and are not particularly limited.

[0048] The second carrier 72 preferably has a lower Vickers hardness than the first carrier 52. This allows the second carrier 72 itself to bend, thereby allowing stress that may occur during lamination or peeling to be effectively released, and as a result, curvature of the resin-containing layer 60 can be more effectively prevented or suppressed. The Vickers hardness of the second carrier 72 is preferably 2% to 99% of the Vickers hardness of the first carrier 52, more preferably 6% to 90%, and even more preferably 10% to 85%. Preferably, the Vickers hardness of the second carrier 72 is 50HV or more and 700HV or less, and the Vickers hardness of the first carrier 52 is 500HV or more and 3000HV or less, more preferably, the Vickers hardness of the second carrier 72 is 150HV or more and 550HV or less, and the Vickers hardness of the first carrier 52 is 550HV or more and 2500HV or less, and even more preferably, the Vickers hardness of the second carrier 72 is 200HV or more and 500HV or less, and the Vickers hardness of the first carrier 52 is 600HV or more and 2000HV or less. In this specification, the Vickers hardness is measured in accordance with the "Vickers hardness test" described in JIS Z 2244-2009.

[0049] For reference, the Vickers hardness HV of various materials that could be candidates are listed below: sapphire glass (2300HV), cemented carbide (1700HV), cermet (1650HV), quartz (crystal) (1103HV), SKH56 (high-speed tool steel, high-speed steel) (722HV), tempered glass (640HV), SUS440C (stainless steel) (615HV), SUS630 (stainless steel) (375HV), titanium alloy 60 types (64 alloys) (around 280HV), Inconel (heat resistant) Nickel alloys) (150HV or more and 280HV or less), S45C (carbon steel for mechanical construction) (201HV or more and 269HV or less), Hastelloy alloy (corrosion-resistant nickel alloy) (100HV or more and 230HV or less), SUS304 (stainless steel) (187HV), SUS430 (stainless steel) (183HV), cast iron (160HV or more and 180HV or less), titanium alloy (110HV or more and 150HV or less), brass (80HV or more and 150HV or less), and bronze (50HV or more and 100HV or less).

[0050] (3) Peeling off the first carrier The first carrier 52 (and the first intermediate layer 54, if present) is peeled off from the laminate 50 on which the adhesive laminate sheet 70 is laminated, at the first peeling layer 56 (FIG. 4(iv)). At this time, the second carrier 72 etc. reinforce the resin-containing layer 60, and therefore it is possible to prevent the resin-containing layer 60 from curving significantly locally when the first carrier 52 etc. is peeled off. That is, the second carrier 72 etc. reinforces the resin-containing layer 60 to resist the peeling force while the first carrier 52 is being peeled off, and it is possible to effectively prevent or suppress curvature. The peeling off of the first carrier 52 is preferably performed by a laser lift-off method in which the first carrier 52 is peeled off by a laser, or a mechanical method in which the first carrier 52 is peeled off by applying a physical force using a machine.

[0051] If desired, the remaining first release layer 56 and first metal layer 58 may be removed from the laminate 50 after the first carrier 52 has been peeled off (FIG. 4(v)). The method for removing the first release layer 56 and the first metal layer 58 is not particularly limited, and a known method may be appropriately selected depending on the materials of the first release layer 56 and the first metal layer 58. For example, when the first release layer 56 is a carbon layer, the first release layer 56 can be preferably removed by subjecting the laminate to an oxygen plasma treatment. The first metal layer 58 can be removed, for example, by contacting the laminate with an etching solution capable of dissolving the first metal layer 58.

[0052] After removing the first release layer 56 and the first metal layer 58, various electronic elements such as an integrated passive device I and solder balls B may be mounted on the resin-containing layer 60 (e.g., the first redistribution layer 60a) by a known method (Figure 4(vi)), after which resin sealing may be performed. Furthermore, in order to smoothly peel off the second carrier 72 described below, the edges of the adhesive laminate sheet 70 (e.g., the second carrier 72, the second intermediate layer 74, the second release layer 76 and / or the second metal layer 78) may be trimmed using a cutting tool T or the like (Figure 5(vii)).

[0053] If desired, after laminating the adhesive laminate sheet 70 and before peeling off the second carrier 72 described below, the laminate 50 may be heated to 100° C. or more and 350° C. or less (preferably 200° C. or more and 300° C. or less). Such a heat treatment may be carried out for the purpose of, for example, reflow soldering of the various electronic elements described above.

[0054] (4) Lamination of additional adhesive laminate sheets (optional step) If desired, after the first carrier 52 is peeled off and before the second carrier 72 described later is peeled off, an additional adhesive laminate sheet 90 is laminated on the surface of the laminate 50 from which the first carrier 52 has been peeled off (FIG. 5(viii)). The additional adhesive laminate sheet 90 includes a third carrier 92, an optional third intermediate layer 94 (optional layer), a third peeling layer 96, an optional third metal layer 98 (optional layer), and a second adhesive layer 100 containing an adhesive material, in this order. The additional adhesive laminate sheet 90 is then laminated on the laminate 50 so that the second adhesive layer 100 abuts against the surface of the laminate 50 from which the first carrier 52 has been peeled off. This improves the handleability of the laminate after the second carrier 72 is peeled off, and further prevents or suppresses local curvature of the resin-containing layer 60. In addition, when an integrated passive device I, solder balls B, etc. are mounted on the resin-containing layer 60 (for example, the first rewiring layer 60a) after the first carrier 52, etc. are peeled off, it is preferable to laminate an additional adhesive laminate sheet 90 so that the solder balls B, etc. are embedded in the second adhesive layer 100, as shown in Fig. 5(viii). Therefore, it is preferable that the thickness of the second adhesive layer 100 is greater than the height of the solder balls B, etc. mounted on the resin-containing layer 60.

[0055] The preferred embodiments of the adhesive laminate sheet 10 described above also apply to the additional adhesive laminate sheet 90. That is, the third carrier 92, the third intermediate layer 94, the third release layer 96, the third metal layer 98, and the second adhesive layer 100 may be similar to the carrier 12, the intermediate layer 14, the release layer 16, the metal layer 18, and the adhesive layer 20 described above, respectively.

[0056] (5) Peeling off the second carrier The second carrier 72 is peeled off from the laminate 50 from which the first carrier 52 has been peeled off at the second peeling layer 76 (FIG. 5(ix)). By peeling off and removing the second carrier 72, which has thus played a role as a reinforcing sheet, first, it becomes possible to smoothly remove the second peeling layer 76, the second metal layer 78 (if present), and the adhesive layer 80, which will be described later.

[0057] There are no particular limitations on the method for peeling off the second carrier 72, and the method may be appropriately determined depending on the material of the second release layer 76. For example, the above-mentioned laser lift-off method or mechanical method can be preferably adopted.

[0058] (6) Removal of the second peeling layer The second release layer 76 (and the second metal layer 78, if present) is removed from the laminate 50 from which the second carrier 72 has been peeled off, thereby exposing the adhesive layer 80 (FIG. 6(x)). The method of removing the second release layer 76 is not particularly limited, and a known method may be appropriately selected depending on the material of the second release layer 76, etc. For example, when the second release layer 76 is a carbon layer, the second release layer 76 can be preferably removed by performing an oxygen plasma treatment on the laminate 50. In cases such as when the adhesive laminate sheet 70 has the second metal layer 78 and the amount of the second release layer 76 remaining on the laminate 50 is small, instead of removing the second release layer 76 alone, the second release layer 76 and the second metal layer 78 may be removed simultaneously. In other words, the second metal layer 78 may be removed first, and the second release layer 76 may also be removed at the same time. The second metal layer 78 may be removed, for example, by contacting the second metal layer 78 with an etching solution capable of dissolving the second metal layer 78.

[0059] (7) Removal of adhesive layer The adhesive layer 80 is removed from the laminate 50 from which the second release layer 76 and the like have been removed (FIG. 6(xi)). The method for removing the adhesive layer 80 is not particularly limited, and a known method may be appropriately selected depending on the material of the adhesive layer 80 and the like. For example, the adhesive layer 80 can be dissolved or softened and removed by contacting it with a solution capable of dissolving the adhesive layer 80. In any case, according to the present invention, the adhesive layer 80 can be directly removed without the interposition of a reinforcing sheet (second carrier 72, etc.), so that the adhesive laminate sheet 70 can be peeled off and removed in a short time.

[0060] After removing the adhesive layer 80, a process of mounting an electronic element such as a chip on the exposed resin-containing layer 60 (for example, the second rewiring layer 60c) may be further performed to form a wiring board. The degree of integration can be improved by stacking a plurality of IC packages together with the chip C that can be embedded in the resin-containing layer 60 (for example, the molded resin layer 60b) and mounting them on the substrate. In addition, the third carrier 92, the third intermediate layer 94 (if present), the third release layer 96, the third metal layer 98 (if present), and the second adhesive layer 100 may be removed by a method similar to that of the adhesive laminate sheet 70. In any case, the laminate 50 can be subjected to various known processes to form a wiring board as a final product.

[0061] Examples of electronic elements to be mounted on the resin-containing layer 60 as an optional step include semiconductor elements, chip capacitors, resistors, etc., as described above. Examples of methods for mounting electronic elements include flip-chip mounting and die bonding. The flip-chip mounting method is a method for bonding the mounting pad of the electronic element to a rewiring layer, etc. Pillars, solder bumps, etc. may be formed on the mounting pad, and a sealing resin film such as NCF (Non-Conductive Film) may be attached to the surface of the rewiring layer before mounting. The bonding is preferably performed using a low-melting point metal such as solder, but an anisotropic conductive film, etc. may also be used. The die bonding adhesion method is a method for bonding the surface opposite to the mounting pad surface of the electronic element to the rewiring layer. For this bonding, a paste or film, which is a resin composition containing a thermosetting resin and a thermally conductive inorganic filler, is preferably used. EXAMPLES

[0062] The present invention will now be further illustrated by the following examples.

[0063] Example 1 After a resin-containing layer was laminated on a metal foil with a carrier to obtain a laminate, an adhesive laminate sheet was attached to the laminate. Then, the adhesive laminate sheet and the like were peeled off and removed. Specifically, the procedure is as follows.

[0064] (1) Preparation of the laminate A glass substrate (material: soda lime glass) having a size of 100 mm square and a thickness of 1.1 mm was prepared as the first carrier 52. A titanium layer (thickness 50 nm) and a copper layer (thickness 200 nm) as the first intermediate layer 54 having a two-layer structure, an amorphous carbon layer (thickness 6 nm) as the first release layer 56, and a titanium layer (thickness 100 nm) and a copper layer (thickness 300 nm) as the first metal layer 58 having a two-layer structure were formed in this order on the first carrier 52 by sputtering to obtain a metal foil with a carrier. At this time, the first metal layer 58 was formed so as to extend to the end face of the carrier 12, thereby covering the end of the first release layer 56.

[0065] On the first metal layer 58 (metal foil) of the metal foil with a carrier, a 100 mm square, 30 μm thick insulating layer (material: polyimide resin) was formed as a resin-containing layer 60 to obtain a laminate 50 (see FIG. 3(i)). After that, the peripheral portion (width 10 mm) of the laminate 50 was trimmed using a cutter (see FIG. 3(ii)).

[0066] (2) Lamination of adhesive laminate sheets A stainless steel sheet having a size of 130 mm square and a thickness of 0.3 mm was prepared as the second carrier 72. On this second carrier 72, a titanium layer (thickness 50 nm) and a copper layer (thickness 200 nm) as the second intermediate layer 74 having a two-layer structure, an amorphous carbon layer (thickness 6 nm) as the second release layer 76, and a titanium layer (thickness 100 nm) and a copper layer (thickness 300 nm) as the second metal layer 78 having a two-layer structure were formed in this order by sputtering. Then, a thermosetting epoxy resin film having a size of 100 mm square and a thickness of 20 μm (manufactured by Toray Industries, Inc., TSA-16) was placed on the second metal layer 78 as the adhesive layer 80, and vacuum lamination was performed for 1 minute under conditions of a pressure of 0.5 MPa and 80° C. to obtain an adhesive laminated sheet 70.

[0067] The obtained adhesive laminate sheet 70 was laminated on the laminate 50 so that the adhesive layer 80 and the resin-containing layer 60 were in contact with each other, and vacuum lamination was performed for 1 minute under conditions of a pressure of 0.2 MPa and 80° C. Then, as a curing treatment, heat treatment was performed in the air at 100° C. for 1 hour, and then heat treatment was performed at 170° C. for 2 hours. In this way, the adhesive laminate sheet 70 was laminated on the laminate 50 (see FIG. 3(iii)).

[0068] (3) Heat treatment A heat treatment simulating solder reflow was performed on the laminate 50 after laminating the adhesive laminate sheet 70. This heat treatment was performed at 260° C. for 1 minute in a nitrogen atmosphere.

[0069] (4) Peeling off the first carrier The first carrier 52 was peeled off together with the first intermediate layer 54 from the laminate 50 after the heat treatment (see FIG. 4(iv)). That is, with the adhesive laminate sheet 70 fixed, a force was applied in a direction in which the first carrier 52 and the resin-containing layer 60 were separated from each other, thereby peeling off the first carrier 52 and the first intermediate layer 54.

[0070] (5) Peeling off of the second carrier, The second carrier 72 was peeled off together with the second intermediate layer 74 from the laminate 50 from which the first carrier 52 had been peeled off (see FIG. 5(ix)). That is, while the resin-containing layer 60 side of the laminate 50 (the side from which the first carrier 52 had been peeled off) was fixed, a force was applied in a direction in which the second carrier 72 and the resin-containing layer 60 were separated, thereby peeling off the second carrier 72 and the second intermediate layer 74.

[0071] (6) Removal of the second release layer and the second metal layer The second peeling layer 76 remaining on the laminate 50 was removed by ashing. That is, the laminate 50 was placed in an ashing chamber, oxygen gas was introduced, and the oxygen was activated by plasma generation power. As a result, carbon, which is the main component of the second peeling layer 76, was combined with the activated oxygen to form carbon dioxide, and the second peeling layer 76 was removed as a reaction product gas. Thereafter, the second metal layer 78 exposed on the surface of the laminate 50 was removed by etching. Specifically, the Ti layer was removed by treating with a hydrogen peroxide-based alkaline etching solution at about 40°C for 1 minute, and the Cu layer was removed by treating with a sulfuric acid-hydrogen peroxide-based etching solution at about 25°C for 1 minute. In this way, the adhesive layer 80 was exposed (see FIG. 6(x)).

[0072] (7) Removal of adhesive layer After removing the second release layer 76 and the second metal layer 78, the laminate 50 was immersed in a resist remover (ST-120, manufactured by Tokyo Ohka Kogyo Co., Ltd.) at 50° C. for 3 minutes. As a result, the adhesive layer 80 exposed on the surface of the laminate 50 was dissolved while swelling (see FIG. 6(xi)). Thus, it was confirmed that the adhesive laminate sheet of the present invention can be quickly peeled off and removed after being used as a reinforcing sheet.

Claims

1. A method for manufacturing a wiring board, comprising the steps of: preparing a laminate including a first carrier, a first release layer, a first metal layer, and a resin-containing layer in this order; a step of laminating an adhesive laminate sheet onto the laminate, the adhesive laminate sheet comprising a second carrier, a second release layer, and an adhesive layer containing an adhesive material, in that order, and the adhesive laminate sheet is laminated onto the laminate so that the adhesive layer and the resin-containing layer are in contact with each other; peeling the first carrier from the laminate having the adhesive laminate sheet laminated thereon at the first release layer; peeling the second carrier from the laminate from which the first carrier has been peeled off at the second release layer; removing the second release layer from the laminate from which the second carrier has been peeled off, thereby exposing the adhesive layer; removing the adhesive layer from the laminate from which the second release layer has been removed; A method for manufacturing a wiring board comprising:

2. The method for manufacturing a wiring board according to claim 1 , wherein the adhesive laminate sheet further comprises a second metal layer between the second release layer and the adhesive layer.

3. 3. The method for manufacturing a wiring board according to claim 1, wherein the resin-containing layer includes a first redistribution layer provided on the first metal layer, a molded resin layer provided on the first redistribution layer, and a second redistribution layer provided on the molded resin layer.

4. The method for producing a wiring board according to claim 3 , wherein the mold resin layer contains an epoxy resin and / or a phenolic resin.

5. The method for manufacturing a wiring board according to claim 1 , wherein the first carrier is peeled off by a laser lift-off method or a mechanical method.

6. The method for manufacturing a wiring board according to claim 1 or 2, further comprising a step of heating the laminate to a temperature of 100° C. or more and 350° C. or less after laminating the adhesive laminate sheet onto the laminate and before peeling off the second carrier.

7. After peeling the first carrier from the laminate, and before peeling the second carrier, a step of laminating an additional adhesive laminate sheet on the side of the laminate from which the first carrier has been peeled off, the additional adhesive laminate sheet comprising, in order, a third carrier, a third release layer, and a second adhesive layer comprising an adhesive material; The method for manufacturing a wiring board according to claim 1 or 2, wherein the additional adhesive laminate sheet is laminated to the laminate so that the second adhesive layer abuts against the surface of the laminate from which the first carrier has been peeled off.

8. An adhesive laminate sheet used in the method for producing a wiring board according to claim 1 or 2, Career and a release layer provided on the carrier; an adhesive layer provided on the release layer and including an adhesive material; An adhesive laminate sheet comprising:

9. An adhesive laminate sheet as described in claim 8, further comprising a metal layer disposed between the release layer and the adhesive layer.

10. The adhesive laminate sheet of claim 8, wherein the carrier is composed of a metal.

11. An adhesive laminate sheet as described in claim 8, wherein the carrier is composed of at least one material selected from the group consisting of aluminum, stainless steel, copper, titanium, nickel and duralumin.

12. An adhesive laminate sheet as described in claim 8, wherein the adhesive material is at least one selected from the group consisting of thermosetting epoxy resins, thermosetting polyimide resins, photosensitive polyimide resins, acrylic resins and phenolic resins.

13. An adhesive laminate sheet as described in claim 8, wherein the adhesive layer has a thickness of 1 μm or more and 2000 μm or less.

14. The adhesive laminate sheet according to claim 8, wherein a ratio A A / A C of a planar area A A of the adhesive layer to a planar area A C of the carrier is 0.03 or more and 1.0 or less.

15. An adhesive laminate sheet as described in claim 9, wherein the metal layer is composed of at least one metal selected from the group consisting of Ti, Cu, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga and Mo.

16. The adhesive laminate sheet of claim 9, wherein the metal layer has a thickness of 10 nm or more and 1000 nm or less.

17. The adhesive laminate sheet of claim 8, wherein the release layer comprises carbon.

18. A laminate comprising an adhesive laminate sheet as described in claim 8, a resin-containing layer provided on the adhesive layer of the adhesive laminate sheet, and an additional metal layer provided on the resin-containing layer.

19. The laminate of claim 18, further comprising an additional release layer disposed on the additional metal layer, and an additional carrier disposed on the additional release layer.

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