Plating Equipment

Abstract

A technology is provided that can prevent plating solution from scattering outside a plating tank when the plating solution is stirred. The plating apparatus 1000 comprises a plating tank 10, a substrate holder 30, a paddle 70, and a scattering suppression member 60a, the scattering suppression member having a first member 61 and a second member 62, the first member being arranged in a region above the paddle and below the upper end 10ba of the outer peripheral wall 10b of the plating tank, and being arranged in a region between the outer peripheral wall 10b of the plating tank and the substrate holder, and extending in the vertical direction and extending in a curved shape circumferentially around the outer peripheral wall, the second member being arranged above the upper end of the outer peripheral wall, and being arranged above the first member with a space SP1 between it and the first member, and having a lower surface 62a extending horizontally.

Description

[Technical Field]

[0001] The present invention relates to a plating apparatus. [Background technology]

[0002] Conventionally, plating devices capable of plating a substrate have been known (see, for example, Patent Document 1). Such plating devices generally include a plating tank that stores a plating solution and in which an anode is disposed, a substrate holder that holds a substrate as a cathode facing the anode, and a paddle that is disposed in a region inside the plating tank above the anode and below the substrate holder and configured to agitate the plating solution. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7079388 Summary of the Invention [Problem to be solved by the invention]

[0004] In the conventional plating apparatus described above, when the plating solution is stirred, the plating solution may splash up and splash outside the plating tank. In this respect, the conventional plating apparatus has room for improvement.

[0005] The present invention has been made in consideration of the above, and one of its objects is to provide a technology that can prevent plating solution from splashing outside the plating tank when the plating solution is stirred. [Means for solving the problem]

[0006] (Aspect 1) In order to achieve the above-mentioned object, a plating apparatus according to one embodiment of the present invention comprises a plating tank configured to store plating solution and in which an anode is disposed, a substrate holder for holding a substrate as a cathode facing the anode, a paddle disposed in a region inside the plating tank above the anode and below the substrate holder and configured to stir the plating solution, and a scattering suppression member configured to suppress the plating solution from splashing up and scattering outside the plating tank when the plating solution is stirred by the paddle, wherein the scattering suppression member has a first member and a second member, wherein the first member is disposed in a region above the paddle and below the upper end of an outer peripheral wall of the plating tank, and is disposed in a region between the outer peripheral wall and the substrate holder, and extends in the vertical direction and in a curved shape circumferentially of the outer peripheral wall, and the second member is disposed above the upper end of the outer peripheral wall, has a space between it and the first member, and has a lower surface extending horizontally.

[0007] According to this aspect, when the plating solution is agitated by the paddle, it is possible to prevent the plating solution from splashing outside the plating tank.

[0008] (Aspect 2) In the above-mentioned first aspect, the anti-scattering member may further include a third member that is arranged in a region above the paddle and below the upper end of the outer peripheral wall, and that is arranged in a region closer to the center of the plating tank than the outer peripheral wall and closer to the outer periphery than the first member, and the third member may have a lower surface that extends horizontally.

[0009] According to this aspect, it is possible to effectively prevent the plating solution from scattering outside the plating tank.

[0010] (Aspect 3) In the above-mentioned aspect 2, the scattering suppression member further includes a fourth member that is disposed above the puddle, a portion of which is disposed in a region above the upper end of the outer peripheral wall, and another portion of which is disposed in a region below the upper end of the outer peripheral wall, and that is disposed in a region closer to the center of the plating tank than the outer peripheral wall and closer to the outer periphery than the first member, The fourth member may have an outer peripheral surface that extends in the vertical direction.

[0011] According to this aspect, it is possible to effectively prevent the plating solution from scattering outside the plating tank.

[0012] (Aspect 4) In any one of the above-mentioned aspects 1 to 3, the first member may have at least one opening configured to pass through the first member.

[0013] (Aspect 5) In the above-mentioned aspect 2, the third member may have at least one opening configured to pass through the third member.

[0014] (Aspect 6) In the above-mentioned aspect 3, the fourth member may have at least one opening configured to pass through the fourth member.

[0015] (Aspect 7) In the above-described third aspect, the fourth member may extend in a curved shape in the circumferential direction of the outer peripheral wall.

[0016] (Aspect 8) In the above-mentioned third aspect, the fourth member may extend in a tangential direction of the first member extending in the curved shape. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a perspective view showing the overall configuration of a plating apparatus according to an embodiment; [Figure 2]1 is a plan view showing the overall configuration of a plating apparatus according to an embodiment; [Figure 3] FIG. 2 is a schematic diagram showing the configuration of a plating module according to an embodiment. [Figure 4] FIG. 2 is a schematic view showing a state in which a substrate according to an embodiment is immersed in a plating solution. [Figure 5] 3A and 3B are schematic diagrams illustrating a paddle and a drive device according to an embodiment. [Figure 6] FIG. 2 is a flow chart for explaining a series of operations from supplying a plating solution to starting a plating process according to an embodiment. [Figure 7] 7(A) and 7(B) are schematic perspective views of a scattering prevention member according to an embodiment. [Figure 8] FIG. 2 is a schematic enlarged cross-sectional view showing a state in which a scattering-prevention member according to an embodiment is placed in a plating tank. [Figure 9] 4 is a schematic enlarged cross-sectional view showing the flow of plating solution around a scattering suppression member according to an embodiment. FIG. [Figure 10] FIG. 10 is a schematic diagram illustrating a plating apparatus according to a first modified example of the embodiment. [Figure 11] FIG. 10 is a schematic plan view of a plating tank according to a second modified example of the embodiment, viewed from above. [Figure 12] FIG. 10 is a schematic diagram for explaining a paddle connecting member. [Figure 13] 10A and 10B are schematic diagrams illustrating a scattering suppression member according to a third modified example of the embodiment. [Figure 14] 10 is a schematic diagram illustrating a scattering suppression member according to a fourth modified example of the embodiment. FIG. [Figure 15] FIG. 2 is a schematic perspective view of an overflow tank according to an embodiment. [Figure 16] FIG. 13 is a schematic perspective view illustrating a scattering suppression member according to a fifth modified example of the embodiment. [Figure 17] 10 is a schematic diagram illustrating a scattering suppression member 60a according to a sixth modified example of the embodiment. FIG. [Figure 18]18(A) and 18(B) are schematic diagrams illustrating a scattering suppression member according to the seventh modification of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the drawings are diagrammatically illustrated to facilitate understanding of the features of the components, and the dimensional ratios of the components may not be the same as those in reality. In addition, some drawings show XYZ Cartesian coordinates for reference. In these Cartesian coordinates, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts).

[0019] Fig. 1 is a perspective view showing the overall configuration of a plating apparatus 1000 of this embodiment. Fig. 2 is a plan view (top view) showing the overall configuration of the plating apparatus 1000 of this embodiment. As shown in Figs. 1 and 2, the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-soak module 300, a plating module 400, a cleaning module 500, a spin rinse dryer 600, a transfer device 700, and a control module 800.

[0020] The load port 100 is a module for loading substrates stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and unloading substrates from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged horizontally, but the number and arrangement of the load ports 100 are optional. The transfer robot 110 is a robot for transporting substrates and is configured to transfer substrates between the load ports 100, the aligner 120, the pre-wet module 200, and the spin rinse dryer 600. When transferring substrates between the transfer robot 110 and the transfer apparatus 700, the transfer robot 110 and the transfer apparatus 700 can transfer the substrates via a temporary stage (not shown).

[0021] The aligner 120 is a module for aligning the positions of the substrate's orientation flat, notch, and the like in a predetermined direction. In this embodiment, two aligners 120 are arranged horizontally, but the number and arrangement of the aligners 120 are arbitrary. The prewet module 200 wets the surface of the substrate to be plated with a treatment liquid such as pure water or degassed water before plating, thereby replacing air inside the pattern formed on the substrate surface with the treatment liquid. The prewet module 200 is configured to perform a prewet process that replaces the treatment liquid inside the pattern with a plating liquid during plating, making it easier to supply the plating liquid inside the pattern. In this embodiment, two prewet modules 200 are arranged vertically, but the number and arrangement of the prewet modules 200 are arbitrary.

[0022] The presoak module 300 is configured to perform a presoak process, which involves etching away, for example, an oxide film with high electrical resistance present on the surface of a seed layer formed on the surface of a substrate to be plated using a treatment solution such as sulfuric acid or hydrochloric acid, thereby cleaning or activating the surface of the substrate to be plated. In this embodiment, two presoak modules 300 are arranged vertically, but the number and arrangement of the presoak modules 300 are optional. The plating module 400 performs plating on the substrate. In this embodiment, two sets of 12 plating modules 400 are arranged vertically, three vertically and four horizontally, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are optional.

[0023] The cleaning module 500 is configured to perform a cleaning process on the substrate to remove plating solution and the like remaining on the substrate after plating. In this embodiment, two cleaning modules 500 are arranged vertically, but the number and arrangement of the cleaning modules 500 are optional. The spin rinse dryer 600 is a module for drying the substrate after cleaning by rotating it at high speed. In this embodiment, two spin rinse dryers 600 are arranged vertically, but the number and arrangement of the spin rinse dryers 600 are optional. The transport device 700 is a device for transporting substrates between multiple modules in the plating apparatus 1000. The control module 800 is configured to control the multiple modules of the plating apparatus 1000 and can be configured, for example, as a general computer or a dedicated computer equipped with an input / output interface with an operator.

[0024] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, a substrate stored in a cassette is loaded into the load port 100. Next, the transfer robot 110 removes the substrate from the cassette on the load port 100 and transfers the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation flat, notch, etc. of the substrate to a predetermined direction. The transfer robot 110 delivers the substrate, whose direction has been aligned by the aligner 120, to the pre-wet module 200.

[0025] The pre-wet module 200 performs a pre-wet process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-wet process to the pre-soak module 300. The pre-soak module 300 performs a pre-soak process on the substrate. The transport device 700 transports the substrate that has been subjected to the pre-soak process to the plating module 400. The plating module 400 performs a plating process on the substrate.

[0026] The transfer device 700 transfers the plated substrate to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transfer device 700 transfers the cleaned substrate to the spin rinse dryer 600. The spin rinse dryer 600 dries the substrate. The transfer robot 110 receives the substrate from the spin rinse dryer 600 and transfers the dried substrate to a cassette on the load port 100. Finally, the cassette containing the substrate is removed from the load port 100.

[0027] It should be noted that the configuration of the plating apparatus 1000 described in FIGS. 1 and 2 is merely an example, and the configuration of the plating apparatus 1000 is not limited to the configurations shown in FIGS.

[0028] Next, a description will be given of the plating module 400. Since the multiple plating modules 400 included in the plating apparatus 1000 according to this embodiment have the same configuration, only one plating module 400 will be described.

[0029] Fig. 3 is a schematic diagram showing the configuration of a plating module 400 in the plating apparatus 1000 according to this embodiment. Specifically, Fig. 3 shows the plating module 400 in a state before the substrate Wf is immersed in the plating solution Ps. Fig. 4 is a schematic diagram showing the state after the substrate Wf is immersed in the plating solution Ps.

[0030] The plating apparatus 1000 illustrated in FIGS. 3 and 4 is, for example, a plating apparatus of a type in which the substrate Wf is immersed in the plating solution Ps with its surface oriented horizontally (a so-called cup-type plating apparatus).

[0031] 3 and 4 includes a plating module 400 of a plating apparatus 1000, which includes a plating tank 10, an overflow tank 20, a substrate holder 30, and a paddle 70. The plating module 400 may also include a rotation mechanism 40, a tilt mechanism 45, and a lifting mechanism 50, as shown in FIG.

[0032] The plating tank 10 according to this embodiment is configured as a bottomed container with an opening at the top. Specifically, the plating tank 10 has a bottom wall 10a and an outer peripheral wall 10b extending upward from the outer peripheral edge of the bottom wall 10a, with the upper part of the outer peripheral wall 10b being open. The shape of the outer peripheral wall 10b of the plating tank 10 is not particularly limited, but the outer peripheral wall 10b according to this embodiment has a cylindrical shape, as an example. A plating solution Ps is stored inside the plating tank 10.

[0033] The plating solution Ps may be any solution containing ions of the metal elements that make up the plating film, and specific examples thereof are not particularly limited. In this embodiment, copper plating is used as an example of plating, and a copper sulfate solution is used as an example of plating solution Ps. The plating solution Ps may also contain certain additives.

[0034] An anode 11 is disposed inside the plating tank 10. The specific type of the anode 11 is not particularly limited, and may be an insoluble anode or a soluble anode. In the present embodiment, an insoluble anode is used as an example of the anode 11. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, or the like may be used.

[0035] 3 and 4, an ion resistor 12 may be disposed above the anode 11 inside the plating tank 10. Specifically, as shown in the partially enlarged view of FIG. 4, the ion resistor 12 is formed of a porous plate member having a plurality of holes 12a (pores). The holes 12a are provided so as to connect the lower surface and the upper surface of the ion resistor 12.

[0036] The ion resistor 12 is provided to homogenize the electric field formed between the anode 11 and the substrate Wf serving as the cathode. By disposing the ion resistor 12 in the plating tank 10 as in this embodiment, it is possible to easily homogenize the thickness of the plating film (plating layer) formed on the substrate Wf.

[0037] As illustrated in FIGS. 3 and 4, a membrane 16 may be disposed inside the plating tank 10 above the anode 11 and below the ionic resistor 12. In this case, the membrane 16 divides the interior of the plating tank 10 into an anode chamber 17a below the membrane 16 and a cathode chamber 17b above the membrane 16. The anode 11 is disposed in the anode chamber 17a, and the ionic resistor 12 and the substrate Wf are disposed in the cathode chamber 17b. The membrane 16 is configured to allow ionic species, including metal ions, contained in the plating solution Ps to pass through the membrane 16 while preventing nonionic plating additives contained in the plating solution Ps from passing through the membrane 16. For example, an ion exchange membrane can be used as the membrane 16.

[0038] The plating tank 10 is provided with a supply port for supplying the plating solution Ps to the plating tank 10. Specifically, the outer wall 10b of the plating tank 10 according to this embodiment is provided with a first supply port 13a for supplying the plating solution Ps to the anode chamber 17a and a second supply port 13b for supplying the plating solution Ps to the cathode chamber 17b.

[0039] The plating tank 10 is also provided with a first outlet 14a for discharging the plating solution Ps in the anode chamber 17a to the outside of the plating tank 10. The plating solution Ps discharged from the first outlet 14a is pressure-fed by a pump (not shown) and supplied again to the anode chamber 17a from the first supply port 13a.

[0040] The overflow tank 20 is composed of a bottomed container disposed outside the plating tank 10. The overflow tank 20 is provided to temporarily store the plating solution Ps that has exceeded the upper end of the outer wall 10b of the plating tank 10 (i.e., the plating solution Ps that has overflowed from the plating tank 10). The plating solution Ps stored in the overflow tank 20 is discharged from the second outlet 14b, then pressure-fed by a pump (not shown), and again supplied to the cathode chamber 17b from the second supply port 13b.

[0041] The substrate holder 30 holds the substrate Wf as a cathode so that the surface Wfa to be plated of the substrate Wf faces the anode 11. In this embodiment, the surface Wfa to be plated of the substrate Wf is specifically provided on the surface (lower surface) facing downward of the substrate Wf.

[0042] The substrate holder 30 is connected to a rotation mechanism 40. The rotation mechanism 40 is a mechanism for rotating the substrate holder 30. "R1" illustrated in Figure 3 is an example of the rotation direction of the substrate holder 30. A known rotation motor or the like can be used as the rotation mechanism 40. The tilt mechanism 45 is a mechanism for tilting the rotation mechanism 40 and the substrate holder 30. The lifting mechanism 50 is supported by a support shaft 51 extending in the vertical direction. The lifting mechanism 50 is a mechanism for raising and lowering the substrate holder 30, the rotation mechanism 40, and the tilting mechanism 45 in the vertical direction. A known lifting mechanism such as a linear actuator can be used as the lifting mechanism 50.

[0043] The control module 800 includes a microcomputer, which includes a processor 801, a storage device 802 as a non-transitory storage medium, etc. The control module 800 controls the operation of the plating module 400 by the processor 801 operating based on instructions from a program stored in the storage device 802.

[0044] 5 is a schematic diagram illustrating the paddle 70 and a driving device 90, which will be described later. Referring to FIGS. 4 and 5, the paddle 70 is disposed in a region above the anode 11 and below the substrate holder 30 inside the plating tank 10. Specifically, the paddle 70 according to this embodiment is disposed between the ion resistor 12, which is disposed above the anode 11, and the substrate holder 30.

[0045] 5, the paddle 70 is an "agitation member" configured to be driven by a drive device 90 to agitate the plating solution Ps. As an example, the drive device 90 according to this embodiment receives instructions from a control module 800 and alternately drives the paddle 70 in a "first direction (1st)" parallel to the anode 11 (or the substrate Wf) and in a "second direction (2nd)" opposite to the first direction. That is, the paddle 70 according to this embodiment reciprocates in the first direction and the second direction.

[0046] It should be noted that known technology can be applied to the mechanical mechanism itself of such drive device 90. Specifically, drive device 90 according to this embodiment includes an electric motor 91 and a power conversion mechanism 92 that is connected to paddle 70 and is configured to convert the rotational motion of electric motor 91 into linear reciprocating motion and transmit the motion to paddle 70.

[0047] The first direction and the second direction are not limited to the above-mentioned directions. A direction perpendicular to the reciprocating direction of the paddle 70 is referred to as the "third direction (3rd)." Fig. 5 illustrates, as central axes of the paddle 70, a first central axis XL1 extending in the third direction and a second central axis XL2 extending in the reciprocating direction of the paddle 70.

[0048] The paddle 70 only needs to be disposed inside the plating tank 10 at least when stirring the plating solution Ps, and does not need to be disposed inside the plating tank 10 at all times. For example, when the driving of the paddle 70 is stopped and the plating solution Ps is not stirred by the paddle 70, the paddle 70 may be configured to be disposed outside the plating tank 10.

[0049] The specific configuration of the paddle 70 is not particularly limited as long as it can agitate the plating solution Ps. The paddle 70 shown in FIG. 5 includes, as an example, a honeycomb structure portion 71 having a honeycomb structure and a pair of outer frames (a first outer frame 72a and a second outer frame 72b) connected to the third direction end of the honeycomb structure portion 71. The specific structures of the first outer frame 72a and the second outer frame 72b are not particularly limited. As an example, the first outer frame 72a and the second outer frame 72b according to this embodiment are made of flat plate-like members. At least one of the first outer frame 72a and the second outer frame 72b is connected to a driving device 90.

[0050] The honeycomb structure section 71 has a plurality of polygonal holes 74 partitioned by beam members 73. The holes 74 according to this embodiment penetrate in the vertical direction so as to connect the upper and lower surfaces of the honeycomb structure section 71. The honeycomb structure section 71 also has a first peripheral wall 75 facing in a first direction and a second peripheral wall 76 facing in a second direction. The first peripheral wall 75 and the second peripheral wall 76 are formed by the beam members 73.

[0051] The specific polygonal shape of the holes 74 is not particularly limited, and various N-sided shapes (N is a natural number equal to or greater than 3) such as a triangle, a rectangle, a pentagon, a hexagon, a heptagon, an octagon, etc. may be used. In this modification, a hexagon is used as an example of a polygon.

[0052] As an example, the paddle 70 illustrated in Fig. 5 has a portion in which the "paddle width D1 (the length in the reciprocating movement direction of the paddle 70)" of the honeycomb structure portion 71 changes along the third direction in plan view. Specifically, the paddle 70 has a shape in which the paddle width D1 at the center in the third direction is wider than the paddle width D1 at the end in the third direction. In other words, the paddle 70 has a shape in which the portion closer to the center than the end in the third direction protrudes in the first and second directions more than the end.

[0053] Moreover, the paddle 70 according to this embodiment has, as an example, a shape that is line-symmetric (bilaterally symmetric) with respect to the second central axis XL2.

[0054] The honeycomb structure portion 71 of the paddle 70 according to this embodiment includes a first outer peripheral wall 75 facing a first direction and a second outer peripheral wall 76 facing a second direction. The first outer peripheral wall 75 and the second outer peripheral wall 76 are formed by beam members 73.

[0055] The specific manufacturing method of the paddle 70 is not particularly limited, but as an example, the paddle 70 according to this embodiment can be manufactured using a known three-dimensional printing machine such as a 3D printer.

[0056] The configuration of the paddle 70 is not limited to the above-described configuration, and may be any other known configuration (for example, various configurations such as those exemplified in Patent Document 1) as long as it can agitate the plating solution Ps. As another example, the paddle 70 may include, instead of the honeycomb structure portion 71, a plurality of beam members extending linearly in the third direction.

[0057] 6 is a flow diagram illustrating a series of operations from supplying the plating solution to starting the plating process according to this embodiment. First, the plating solution Ps is supplied to the plating tank 10 (step S10). Specifically, the plating solution Ps is supplied to the plating tank 10 so that the anode 11 and the ion resistor 12 are immersed in the plating solution Ps. More specifically, in this embodiment, the plating solution Ps is supplied to the plating tank 10 from the first supply port 13a and the second supply port 13b.

[0058] Next, the substrate Wf is immersed in the plating solution Ps (step S20). Specifically, in this embodiment, the lifting mechanism 50 lowers the substrate holder 30, thereby immersing at least the plating surface Wfa of the substrate Wf in the plating solution Ps.

[0059] Next, the driving device 90 starts driving the paddle 70, thereby causing the paddle 70 to start stirring the plating solution Ps (step S30).

[0060] Next, a current is applied between the anode 11 and the substrate Wf by a current applying device (not shown), thereby starting the plating process on the substrate Wf (step S40). This starts the formation of a plating film on the plating surface Wfa of the substrate Wf. Specifically, in this embodiment, even during the plating process on the substrate Wf in step S40, the plating solution Ps is being stirred by the paddle 70 in step S30 (i.e., the plating solution Ps is being stirred while the plating film is being formed on the plating surface Wfa).

[0061] Preferably, the control module 800 starts the rotation of the substrate holder 30 when performing step S20, step S30, or step S40, so that the substrate holder 30 can be rotated at least during the plating process in step S40.

[0062] The timing at which the paddle 70 stirs the plating solution Ps is not limited to the above-mentioned timing. For example, the plating solution Ps may be stirred by the paddle 70 between steps S10 and S20 (i.e., after the plating solution Ps is supplied to the plating tank 10 and before the substrate Wf is immersed in the plating solution Ps).

[0063] Referring to the above-mentioned Figures 3 and 4, the plating module 400 of the plating apparatus 1000 according to this embodiment further includes a scattering suppression member 60a (i.e., a first scattering suppression member) and a scattering suppression member 60b (i.e., a second scattering suppression member).

[0064] Fig. 7(A) is a schematic perspective view of the scattering suppression member 60a. Fig. 7(B) is a schematic perspective view of the scattering suppression member 60b. Fig. 8 is a schematic enlarged cross-sectional view showing the scattering suppression member 60a arranged in the plating tank 10 (Fig. 8 corresponds to the enlarged cross-sectional view of part A1 in Fig. 4). Fig. 9 is a schematic enlarged cross-sectional view showing the flow of plating solution Ps around the scattering suppression member 60a.

[0065] 7 to 9, the scattering suppression members 60a, 60b are configured to suppress the plating solution Ps from splashing up and scattering outside the plating tank 10 when the plating solution Ps is stirred by the paddle 70. Specifically, the scattering suppression members 60a, 60b are disposed in the plating tank 10 and used at least when the plating solution Ps is stirred by the paddle 70 (i.e., at least when the paddle 70 is driven). The scattering suppression members 60a, 60b are members that can be called "scatter suppression cover members."

[0066] The specific manner in which the anti-scattering members 60a, 60b are connected to the plating apparatus 1000 is not particularly limited, but as an example, the anti-scattering members 60a, 60b in this embodiment are connected to the outer wall 21 of the overflow tank 20 (i.e., the outer tank).

[0067] Specifically, as illustrated in Fig. 15, the outer peripheral wall 21 of the overflow tank 20 according to this embodiment has a rectangular shape in plan view, for example. The upper end of the outer peripheral wall 21 of the overflow tank 20 is located higher than the upper end of the outer peripheral wall 10b of the plating tank 10. With reference to Figs. 7(A), 7(B), and 15, the scattering suppression member 60a is placed on the upper end of the outer peripheral wall 21 of the overflow tank 20 such that the predetermined position C1a of the scattering suppression member 60a corresponds to the predetermined position C1b of the outer peripheral wall 21 of the overflow tank 20, and the predetermined position C2a of the scattering suppression member 60a corresponds to the predetermined position C2b of the outer peripheral wall 21. Similarly, the anti-scattering member 60b is placed on the upper end of the outer peripheral wall 21 of the overflow tank 20 so that the predetermined location C3a of the anti-scattering member 60b corresponds to the predetermined location C3b of the outer peripheral wall 21 of the overflow tank 20, and the predetermined location C4a of the anti-scattering member 60b corresponds to the predetermined location C4b of the outer peripheral wall 21.

[0068] The scattering suppression members 60a and 60b connected to the outer peripheral wall 21 of the overflow tank 20 may be fixed to the outer peripheral wall 21 by detachable fastening members such as bolts or pins.

[0069] 7 to 9, the scatter suppression member 60a and the scatter suppression member 60b each include a first member 61 and a second member 62. The scatter suppression member 60a and the scatter suppression member 60b may each further include a third member 63 or a fourth member 64. The configuration of the scatter suppression member 60b is similar to the configuration of the scatter suppression member 60a, so hereafter, the scatter suppression member 60a will be described in detail.

[0070] 8 and 9, the first member 61 is disposed in a region above the paddle 70 and below the upper end 10ba of the outer peripheral wall 10b of the plating tank 10. Specifically, the first member 61 according to this embodiment is disposed in a region above the paddle 70 and below the liquid level Ls of the plating solution Ps. The first member 61 is also disposed in a region between the outer peripheral wall 10b of the plating tank 10 and the substrate holder 30. The first member 61 according to this embodiment is formed, for example, of a plate member (plate-shaped member). The first member 61 has an inner peripheral surface 61a on the side facing the substrate holder 30 and an outer peripheral surface 61b on the side facing the outer peripheral wall 10b.

[0071] Furthermore, the first member 61 extends in the vertical direction and also in a curved shape in the circumferential direction of the outer peripheral wall 10b (or in the circumferential direction of the substrate holder 30). Specifically, the first member 61 according to this embodiment extends in a curved shape in the circumferential direction of the outer peripheral wall 10b so as to follow the shape of the inner circumferential surface of the outer peripheral wall 10b of the plating tank 10 (in this embodiment, the shape extending in a curved shape in the circumferential direction of the outer peripheral wall 10b).

[0072] According to this configuration, when the plating solution Ps is stirred by the paddle 70 (or when the substrate holder 30 is further rotated), for example, the momentum of the plating solution Ps flowing from the outer peripheral wall 10b side of the plating tank 10 toward the center of the plating tank 10, or the momentum of the plating solution Ps flowing from the center of the plating tank 10 toward the outer peripheral wall 10b side, can be reduced by the first member 61. This makes it possible to prevent the plating solution Ps from colliding forcefully with the substrate holder 30 or the outer peripheral wall 10b. As a result, it is possible to prevent the plating solution Ps from splashing outside the plating tank 10.

[0073] The second member 62 is disposed above the upper end 10ba of the outer peripheral wall 10b of the plating tank 10. A space SP3 may be provided between the second member 62 and the upper end 10ba of the outer peripheral wall 10b. This allows the plating solution Ps that overflows from the outer peripheral wall 10b of the plating tank 10 to pass through this space SP3 and flow into the overflow tank 20. Furthermore, the second member 62 according to this embodiment is disposed above the liquid level Ls of the plating solution Ps.

[0074] The second member 62 is disposed above the first member 61, with a space SP1 between them. That is, a space SP1 is provided between the first member 61 and the second member 62. As illustrated in FIG. 7(A), the second member 62 according to this embodiment is connected to both ends of the first member 61 in the circumferential extension direction via connecting members 65. The second member 62 according to this embodiment is formed of a plate member, for example.

[0075] 8 and 9, the second member 62 has a lower surface 62a extending in the horizontal direction. Referring to Fig. 9, the lower surface 62a of the second member 62 is configured to allow the plating solution Ps that has splashed upward along the first member 61 to come into contact with the lower surface 62a. Specifically, the lower surface 62a of the second member according to this embodiment is located directly above the first member 61 and extends from the point directly above the first member 61 a predetermined distance toward the center of the plating tank 10 and also a predetermined distance toward the outer periphery of the plating tank 10.

[0076] The space SP1 provided between the first member 61 and the second member 62 is provided mainly to allow the plating solution Ps that has come into contact with the lower surface 62a of the second member 62 to escape in the horizontal direction.

[0077] If the space SP1 were not provided between the first member 61 and the second member 62, the flow of the plating solution Ps would be concentrated between the substrate holder 30 and the scattering suppression member 60a (particularly the first member 61). In this case, the plating solution Ps would be likely to spurt upward from between the substrate holder 30 and the scattering suppression member 60a. In contrast, according to the present embodiment, the space SP1 is provided between the first member 61 and the second member 62, so that such a problem can be effectively prevented from occurring.

[0078] 8, the second member 62 is preferably disposed at a position where it does not come into contact with the substrate holder 30. Specifically, in this case, a space SP4 is provided between the second member 62 and the substrate holder 30.

[0079] According to this embodiment, when the plating solution Ps stirred and flowing by the paddle 70 splashes upward along the first member 61, the lower surface 62a of the second member 62 can receive the splashed plating solution Ps. The plating solution Ps received by the lower surface 62a can then be released horizontally in the space SP1. This effectively prevents the plating solution Ps from scattering outside the plating tank 10.

[0080] 8 and 9, the third member 63 is disposed above the paddle 70 and in a region below the upper end 10ba of the outer peripheral wall 10b of the plating tank 10. Specifically, the third member 63 is disposed above the paddle 70 and below the liquid level Ls of the plating solution Ps. The third member 63 is disposed in a region closer to the center of the plating tank 10 than the outer peripheral wall 10b of the plating tank 10 and closer to the outer periphery than the first member 61. Specifically, the third member 63 according to this embodiment extends a predetermined distance toward the outer periphery of the plating tank 10, starting from the upper end of the outer peripheral surface 61b of the first member 61. The third member 63 according to this embodiment is, for example, formed of a plate member.

[0081] 9, the third member 63 has a lower surface 63a extending horizontally. The lower surface 63a of the third member 63 is configured to come into contact with the lower surface 63a when the plating solution Ps between the outer peripheral wall 10b of the plating tank 10 and the first member 61 flows upward along the first member 61.

[0082] With this configuration, when the plating solution Ps is agitated by the paddle 70 and the plating solution Ps between the outer peripheral wall 10b of the plating tank 10 and the first member 61 flows upward along the first member 61, the flowing plating solution Ps can be prevented from splashing upward above the lower surface 63a of the third member 63. This effectively prevents the plating solution Ps from splashing outside the plating tank 10.

[0083] Referring to Figures 8 and 9, the fourth member 64 is positioned above the paddle 70, with a portion of it being positioned in an area above the upper end 10ba of the outer peripheral wall 10b of the plating tank 10, and the other portion being positioned in an area below the upper end 10ba of the outer peripheral wall 10b.

[0084] Specifically, the fourth member 64 according to this embodiment is disposed above the paddle 70, with a portion of the fourth member 64 disposed in an area above the liquid level Ls of the plating solution Ps and another portion disposed in an area below the liquid level Ls. Furthermore, the fourth member 64 is disposed in an area closer to the center of the plating tank 10 than the outer peripheral wall 10b of the plating tank 10 and closer to the outer periphery than the first member 61. Specifically, the fourth member 64 according to this embodiment extends upward a predetermined distance from the outer peripheral end of the third member 63 as a starting point.

[0085] In this embodiment, a space SP1 may be provided between the upper end of the fourth member 64 and the lower surface 62a of the second member 62. This allows the plating solution Ps in the plating tank 10 to easily flow over the upper end of the fourth member 64 into the overflow tank 20.

[0086] Moreover, the fourth member 64 according to this embodiment is formed of a plate member, for example. The fourth member 64 has an outer peripheral surface 64a extending in the vertical direction. Referring to Fig. 9, the outer peripheral surface 64a of the fourth member 64 is configured so that the plating solution Ps flowing from the outer peripheral wall 10b side of the plating tank 10 toward the center of the plating tank 10 abuts against this outer peripheral surface 64a.

[0087] With this configuration, the plating solution Ps flowing from the outer peripheral wall 10b side of the plating tank 10 toward the center of the plating tank 10 can be brought into contact with the outer peripheral surface 64a of the fourth member 64, thereby preventing the plating solution Ps flowing from the outer peripheral wall 10b side of the plating tank 10 toward the center from colliding with, for example, the substrate holder 30 and splashing upward. This effectively prevents the plating solution Ps from scattering outside the plating tank 10.

[0088] In a configuration in which the paddle 70 agitates the plating solution Ps while the substrate holder 30 rotates during plating of the substrate Wf, as in the present embodiment, the rotation of the substrate holder 30 rotates the plating solution Ps in the plating tank 10, which in turn facilitates the flow of the plating solution Ps from the outer peripheral wall 10b side toward the center of the plating tank 10. According to the present embodiment, by providing the fourth member 64 described above, scattering of the plating solution Ps caused by the plating solution P flowing from the outer peripheral wall 10b side toward the center of the plating tank 10 can be effectively suppressed.

[0089] According to the present embodiment as described above, since the above-mentioned first member 61 and second member 62 are provided, when the plating solution Ps is stirred by the paddle 70, it is possible to prevent the plating solution Ps from splashing outside the plating tank 10.

[0090] This makes it possible to prevent problems such as corrosion or contamination of the plating apparatus 1000 due to the plating solution Ps scattered outside the plating tank 10, for example.

[0091] Furthermore, according to this embodiment, since the third member 63 and the fourth member 64 described above are also provided, scattering of the plating solution Ps outside the plating tank 10 can be effectively prevented.

[0092] It should be noted that this embodiment may also be configured without the third member 63 and the fourth member 64 described above.

[0093] (Variation 1) Fig. 10 is a schematic diagram illustrating a plating apparatus 1000 according to Modification 1 of the embodiment. Specifically, Fig. 10 is a schematic enlarged cross-sectional view showing a state in which a scattering suppression member 60a of the plating apparatus 1000 according to this modification is disposed in a plating tank 10. Note that in Fig. 10, the second member 62 of the scattering suppression member 60a is not shown.

[0094] 10, the first member 61 of the shatterproof member 60a according to this modification may have at least one opening 66 configured to penetrate the first member 61. That is, the first member 61 may have only one opening 66, or may have multiple openings 66.

[0095] Similarly, the third member 63 of the shatterproof member 60a may have at least one opening 66 configured to pass through the third member 63. That is, the third member 63 may have only one opening 66, or may have multiple openings 66.

[0096] Similarly, the fourth member 64 of the shatterproof member 60a may have at least one opening 66 configured to pass through the fourth member 64. That is, the fourth member 64 may have only one opening 66, or may have multiple openings 66.

[0097] This modification also has the same effects as the above-described embodiment.

[0098] The scattering suppression member 60b may also have the same configuration as the scattering suppression member 60a according to this modified example.

[0099] (Variation 2) In the above-described embodiment and Modification 1, the specific locations of the anti-scattering members 60a, 60b in the plating tank 10 are not limited to the locations illustrated in Fig. 4 etc. Preferably, the anti-scattering members 60a, 60b are arranged in locations where scattering of the plating solution Ps is particularly likely to occur, depending on the shape of the plating tank 10 etc. For example, the anti-scattering members 60a, 60b may be arranged as in this modification described below.

[0100] 11 is a schematic plan view of the plating tank 10 of the plating apparatus 1000 according to the second modification of the embodiment, viewed from above. In FIG. 11, of the scattering suppression members 60a, 60b, only the first member 61 is illustrated by a solid line, and the second member 62 is illustrated by a dotted line. Also, the third member 63, the fourth member 64, etc. are not shown.

[0101] As illustrated in Fig. 11, the paddle 70 according to this modification agitates the plating solution Ps by reciprocating in a first direction (1st) and a second direction (2nd). Fig. 11 illustrates, as central axes of the plating tank 10, a first central axis XL1 and a second central axis XL2 perpendicular to the first central axis XL1. The second central axis XL2 extends in a direction parallel to the movement direction of the paddle 70 in a plan view, and the first central axis XL1 extends in a direction perpendicular to the movement direction of the paddle 70 (a third direction (3rd)) in a plan view.

[0102] As illustrated in FIG. 11 , the plating apparatus 1000 according to this modification has, for example, a configuration in which the interior of the overflow tank 20 (i.e., the "outer tank") is partitioned by a first inner tank wall 15a and a second inner tank wall 15b. The upper end of the overflow tank 20 is located higher than the upper ends of the first inner tank wall 15a and the second inner tank wall 15b. The plating solution Ps is stored in the area surrounded by the first inner tank wall 15a, the second inner tank wall 15b, and the overflow tank 20. Note that the first inner tank wall 15a and the second inner tank wall 15b according to this modification correspond to the aforementioned "outer peripheral wall 10b of the plating tank 10," and the upper ends of the first inner tank wall 15a and the second inner tank wall 15b correspond to the aforementioned "upper end 10ba of the outer peripheral wall 10b of the plating tank 10."

[0103] The first inner tank wall 15a and the second inner tank wall 15b extend generally in a direction (third direction) perpendicular to the movement direction of the paddle 70. The first inner tank wall 15a and the second inner tank wall 15b have flat portions 15c formed by a plane extending linearly in a direction perpendicular to the movement direction of the paddle 70 in regions near the ends in the extension direction (regions located a predetermined distance from the ends toward the center of the plating tank 10).

[0104] FIG. 12 is a schematic diagram for explaining a paddle connecting member 77, which will be described later. Specifically, FIG. 12 is a schematic cross-sectional view of a region near region B1 in FIG. 11, which will be described later. Note that the illustration of scattering suppression members 60a and 60b is omitted in FIG. 12. As illustrated in FIG. 12, a paddle connecting member 77 may be connected to the paddle 70. This paddle connecting member 77 is a member for connecting the paddle 70 to a drive unit 90 for the paddle 70 (see FIG. 5 described above). Specifically, one end of the paddle connecting member 77 is connected to an end of the paddle 70 inside the plating tank 10, and the other end is connected to the drive unit 90 outside the plating tank 10.

[0105] The paddle connecting member 77 includes, for example, a first portion 77a extending upward and a second portion 77b extending horizontally. The lower end of the first portion 77a is connected to an end of the paddle 70, and the upper end of the first portion 77a is connected to one end of the second portion 77b. The second portion 77b is disposed so as to pass through a hole 21a formed in the outer peripheral wall 21 of the overflow tank 20. The other end of the second portion 77b (the end opposite to the end connected to the first portion 77a) is connected to the drive device 90 described above.

[0106] Referring to FIG. 11, when the paddle 70 arranged in the plating tank 10 as described above moves back and forth in the first direction (1st) and the second direction (2nd) to agitate the plating solution Ps, the plating solution Ps that comes into contact with the flat portion 15c of the first inner tank wall 15a and the flat portion 15c of the second inner tank wall 15b tends to bounce back toward the center of the plating tank 10 (the side of the first central axis XL1), which tends to cause the plating solution Ps to splash up.

[0107] In this plating tank 10, the anti-scattering members 60a, 60b are preferably disposed near the flat portion 15c, as illustrated in FIG. 11 . Specifically, the anti-scattering members 60a, 60b are preferably disposed such that the second member 62 covers at least the region B1 between the flat portion 15c of the first inner tank wall 15a and the opposing flat portion 15c of the second inner tank wall 15b. Furthermore, the anti-scattering members 60a, 60b are more preferably disposed such that the first member 61 faces the outer peripheral wall 21 of the overflow tank 20, which connects the flat portion 15c of the first inner tank wall 15a to the flat portion 15c of the second inner tank wall 15b. This configuration effectively prevents the plating solution Ps from scattering outside the plating tank 10.

[0108] (Variation 3) Fig. 13 is a schematic diagram illustrating a scattering suppression member 60a of a plating apparatus 1000 according to Modification 3 of the embodiment. Specifically, Fig. 13 schematically illustrates a state in which the first member 61 and the fourth member 64 of the scattering suppression member 60a according to this modification are viewed from above.

[0109] 7 to 9 mainly in that the fourth member 64 extends in a curved shape in the circumferential direction of the outer peripheral wall 10b (or in the circumferential direction of the substrate holder 30) like the first member 61. Specifically, the fourth member 64 in this modification extends in a curved shape in the circumferential direction of the outer peripheral wall 10b so as to follow the outer peripheral surface 61b of the first member 61.

[0110] This modification also has the same effects as the above-described embodiment.

[0111] Furthermore, according to this modification, for example, when the rotation of the substrate holder 30 causes the plating solution Ps in the plating tank 10 to rotate around the center of the plating tank 10, causing the plating solution Ps to flow from the outer peripheral wall 10b side of the plating tank 10 toward the center, or from the center toward the outer peripheral wall 10b side of the plating tank 10, the flowing plating solution Ps can be made to flow along the fourth member 64. In this respect as well, scattering of the plating solution Ps can be effectively suppressed.

[0112] 13, the shattering suppression member 60a according to this modified example includes two fourth members 64. In this case, a space SP2 may be provided between two adjacent fourth members 64 (i.e., between the first fourth member and the second fourth member) in plan view.

[0113] According to this configuration, for example, a portion of the plating solution Ps flowing from the outer peripheral wall 10b side of the plating tank 10 toward the center can pass through the space SP2 of the fourth member 64. As a result, compared to a case where this space SP2 is not provided, it is possible to effectively prevent the plating solution Ps flowing from the outer peripheral wall 10b side of the plating tank 10 toward the center from colliding with the fourth member 64 with force and splashing upward.

[0114] The number of fourth members 64 included in the scattering suppression member 60a according to this modified example is not limited to two, but may be one, or may be three or more.

[0115] The shatter suppression member 60b may also have a configuration similar to the fourth member 64 of the shatter suppression member 60a according to this modified example. Furthermore, the shatter suppression members 60a and 60b according to the above-described modified examples 1 and 2 may further have the features of the fourth member 64 according to this modified example.

[0116] (Variation 4) Fig. 14 is a schematic diagram illustrating a scattering suppression member 60a of a plating apparatus 1000 according to Modification 4 of the embodiment. Specifically, Fig. 14 schematically illustrates a state in which the first member 61 and the fourth member 64 of the scattering suppression member 60a according to this modification are viewed from above.

[0117] The scattering suppression member 60a of this modified example differs from the embodiment described above with reference to Figures 7 to 9 mainly in that the fourth member 64 extends in the tangential direction of the first member 61 (which extends in a curved shape).

[0118] This modification also has the same effects as the third modification described above.

[0119] Furthermore, when comparing Modification 3 (FIG. 13) with this Modification (FIG. 14), the shattering suppression member 60a can be manufactured at a lower cost in this Modification than in Modification 3. That is, according to this Modification, the manufacturing cost can be reduced compared to Modification 3.

[0120] 14, the shattering suppression member 60a according to this modified example includes two fourth members 64. In this case, a space SP2 may be provided between two adjacent fourth members 64 in plan view.

[0121] Furthermore, the number of fourth members 64 included in the scattering suppression member 60a according to this modified example is not limited to two, but may be one, or may be three or more.

[0122] The shatter suppression member 60b may also have a configuration similar to the fourth member 64 of the shatter suppression member 60a according to this modified example. Furthermore, the shatter suppression members 60a and 60b according to the above-described modified examples 1 and 2 may further have the features of the fourth member 64 according to this modified example.

[0123] (Variation 5) Fig. 16 is a schematic perspective view illustrating a scattering suppression member 60a of a plating apparatus 1000 according to Modification 5 of the embodiment. In the scattering suppression member 60a as illustrated in Fig. 7(A) described above, if the central portion of the third member 63 is thin and its strength is considered to be insufficient, the first member 61, the third member 63, and the fourth member 64 may be configured to have a space SP5 in their central portions, as illustrated in Fig. 16.

[0124] Specifically, in this case, the first member 61 of the shatter-prevention member 60a includes a first member piece 61-1 arranged on one side of the space SP5 and a first member piece 61-2 arranged on the other side. The third member 63 includes a third member piece 63-1 arranged on one side of the space SP5 and a third member piece 63-2 arranged on the other side. The fourth member 64 includes a fourth member piece 64-1 arranged on one side of the space SP5 and a fourth member piece 64-2 arranged on the other side.

[0125] The scattering suppression member 60b may also have the same configuration as the scattering suppression member 60a according to this modified example.

[0126] (Variation 6) Fig. 17 is a schematic diagram illustrating a scattering suppression member 60a of a plating apparatus 1000 according to a sixth modified example of the embodiment. The scattering suppression member 60a according to this modified example differs from the scattering suppression member 60a illustrated in Fig. 8 in that a lower surface 63a of a third member 63 extends further downward. Specifically, in the scattering suppression member 60a according to this modified example illustrated in Fig. 17, the third member 63 extends downward so that the lower surface 63a of the third member 63 coincides with the position of the lower end of the first member 61, for example.

[0127] For example, if the configuration of the anti-scattering member 60a illustrated in FIG. 8 is not easy to manufacture, the anti-scattering member 60a according to this modified example illustrated in FIG. 17 may be used.

[0128] The scattering suppression member 60b may also have the same configuration as the scattering suppression member 60a according to this modified example.

[0129] (Variation 7) 18(A) and 18(B) are schematic diagrams illustrating a scattering suppression member 60a of a plating apparatus 1000 according to Modification 7 of the embodiment. In the plating apparatus 1000 according to Modification 2 described above, the scattering suppression member 60a may be configured without the connecting member 65 connecting the first member 61 and the second member 62, as illustrated in FIG. 18(A). In other words, the scattering suppression member 60a according to this modification is configured as being divided into two parts: a "second member 62" and a "first member 61, a third member 63, and a fourth member 64."

[0130] Furthermore, as illustrated in Figure 18(B), the first member 61 of the scattering prevention member 60a in this modified example may be fixed to the first inner tank wall 15a and the second inner tank wall 15b by having its circumferential ends connected to the inner surfaces of the first inner tank wall 15a and the second inner tank wall 15b.

[0131] The scattering suppression member 60b may also have the same configuration as the scattering suppression member 60a according to this modified example.

[0132] Although the embodiments and modifications of the present invention have been described in detail above, the present invention is not limited to such specific embodiments and modifications, and various further modifications and alterations are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0133] 10 Plating tank 10b Outer wall 10ba top end 11 Anode 30 Substrate holder 60a, 60b Scattering prevention member 61 First member 61b Outer surface 62 Second member 62a Bottom side 63 Third member 63a Bottom side 64 Fourth member 66 Aperture 70 paddles 1000 plating equipment Ps plating solution Ls liquid level SP1 Space Wf substrate

Claims

1. a plating tank configured to store a plating solution and having an anode disposed therein; a substrate holder for holding a substrate as a cathode so as to face the anode; a paddle disposed in a region inside the plating tank above the anode and below the substrate holder, and configured to agitate the plating solution; a scattering suppression member configured to suppress the plating solution from splashing up and scattering outside the plating tank when the plating solution is stirred by the paddle, The scattering suppression member has a first member and a second member, the first member is disposed in a region above the paddle and below an upper end of an outer peripheral wall of the plating tank, and in a region between the outer peripheral wall and the substrate holder, and extends in a vertical direction and in a curved shape in a circumferential direction of the outer peripheral wall; the second member is disposed above the upper end of the outer peripheral wall and above the first member with a space between it and the first member, and has a lower surface extending in a horizontal direction; The anti-scattering member further includes a pair of connecting members configured to connect both circumferentially extending end portions of the first member to the underside of the second member, the space between the second member and the first member is provided in a region between the second member and the first member and between the pair of connecting members; Plating equipment.

2. the anti-scattering member further includes a third member that is disposed in a region above the puddle and below the upper end of the outer peripheral wall, and that is disposed in a region closer to the center of the plating tank than the outer peripheral wall and closer to the outer periphery than the first member, The plating apparatus according to claim 1 , wherein the third member has a lower surface extending horizontally.

3. The scattering suppression member is disposed above the paddle, and a portion of the scattering suppression member is disposed in a region above the upper end of the outer peripheral wall, and another portion of the scattering suppression member is disposed in a region below the upper end of the outer peripheral wall. and a fourth member disposed in a region closer to the center of the plating tank than the outer peripheral wall and closer to the outer peripheral side than the first member, The plating apparatus according to claim 2 , wherein the fourth member has an outer peripheral surface extending in the vertical direction.

4. The plating apparatus of claim 1 , wherein the first member has at least one opening configured to extend therethrough.

5. The plating apparatus of claim 2 , wherein the third member has at least one opening configured to extend through the third member.

6. The plating apparatus of claim 3 , wherein the fourth member has at least one opening configured to extend through the fourth member.

7. The plating apparatus according to claim 3 , wherein the fourth member extends in a curved shape in the circumferential direction of the outer peripheral wall.

8. The plating apparatus according to claim 3 , wherein the fourth member extends in a tangential direction of the first member that extends in the shape of the curved surface.

9. the anti-scattering member further includes a third member that is disposed in a region above the puddle and below the upper end of the outer peripheral wall, and that is disposed in a region closer to the center of the plating tank than the outer peripheral wall and closer to the outer periphery than the first member, The plating apparatus according to claim 1 , wherein the third member is configured by a plate member extending horizontally.

10. the scattering suppression member further comprises a fourth member, the fourth member being disposed above the paddle, a portion of the fourth member being disposed in a region above the upper end of the outer peripheral wall, and another portion of the fourth member being disposed in a region below the upper end of the outer peripheral wall, the fourth member being disposed in a region closer to the center of the plating tank than the outer peripheral wall and closer to the outer periphery than the first member; The plating apparatus according to claim 9 , wherein the fourth member extends upward from an outer peripheral end of the third member.