Processing information display device, laser processing controller, and processing information display program

Abstract

This processing information display device comprises a display part which displays processing information for laser processing including a processing route and a beam profile, an input part where a specific processing position on the displayed processing route is selected and inputted, and a control unit having the function of determining a beam profile in the processing position on the basis of the inputted processing position. The control unit includes a processing condition acquisition unit which acquires laser processing conditions for processing along the processing route, a selected-processing-condition extraction unit which extracts selected processing conditions for the processing position from the laser processing conditions, and a profile determination unit which determines a beam profile in a position corresponding to the processing position, on the basis of the selected processing conditions.

Description

Processing information display device, laser processing control device, and processing information display program

[0001] The present disclosure relates to a processing information display device, a laser processing control device, and a processing information display program.

[0002] Laser processing devices such as laser cutting machines and laser welding machines can perform predetermined processing by transmitting a laser beam output from a laser oscillator to irradiate a workpiece and moving the laser beam and the workpiece relative to each other. In particular, in order to obtain a good cut cross section in laser cutting processing or a stable weld bead in laser welding processing, it is desirable to appropriately adjust the irradiation conditions (e.g., laser output and energy density) per unit processing length (e.g., beam spot diameter) on the processing path of the laser beam for each processing position.

[0003] In such laser processing, if the processing path for the workpiece is simply a straight line, there is no need to change the irradiation conditions per unit processing length as long as the processing is performed at a constant processing speed and constant laser output. However, if a series of processing programs involves a mixture of laser beam cutting and marking, the melting depth and melting width caused by the laser beam will differ depending on the required processing, and it becomes necessary to appropriately adjust and control the irradiation conditions along the processing path.

[0004] In this way, when adjusting or controlling the irradiation conditions of the laser beam on the machining path, it is preferable to have a display device that displays various machining conditions on a single screen on the machining path, because this allows the various machining conditions on the machining path to be understood at a glance. As an example of such a display device, for example, Patent Document 1 discloses a machining path display device that displays the machining path of a laser machining machine, which includes: a position information acquisition unit that acquires position information of at least one drive axis for each predetermined control period; a laser machining head coordinate calculation unit that calculates coordinate values ​​of the laser machining head from the position information and information on the mechanical configuration of the laser machining machine; a first data acquisition unit and a second data acquisition unit that acquire machining data related to the laser machining; a display format setting unit that sets a display format according to the acquired machining data; and a display unit that displays the machining path based on the coordinate values ​​of the laser machining head and the set display format.

[0005] JP 2018-180780 A

[0006] Conventionally known processing path display devices display position information on the processing path in association with processing data acquired during processing, which certainly has the advantage that it is easy for the operator to understand whether various conditions for laser processing are appropriate or the relationship between the quality of the processing and the processing. However, since such processing path display devices create image data to be displayed based on the results of actual processing according to the processing program, it is necessary to perform so-called "trial processing," which has the problem of imposing a heavy burden on the operator in terms of preparation and execution for the "trial processing."

[0007] Furthermore, conventional machining path display devices can express the magnitude of predetermined machining conditions on the machining path by color coding or by using different shades of color. However, this method merely displays the distribution of machining conditions over the entire machining path, and is unable to obtain the irradiation state of the laser beam (e.g., beam profile) at a predetermined machining position.

[0008] Given this background, there is a demand for technology that can predict and display the beam profile at a specified processing position on the processing path in laser processing based on a specified processing program, without performing actual processing such as trial processing.

[0009] A processing information display device according to a representative aspect of the present disclosure includes a display unit that displays processing information including a processing path when performing laser processing, an input unit that selects and inputs a specific processing position on the displayed processing path, and a control unit that has the function of determining a beam profile at the processing position based on the input processing position, and the control unit includes a processing condition acquisition unit that acquires laser processing conditions for processing the processing path, a selected processing condition extraction unit that extracts selected processing conditions at the processing position from the acquired laser processing conditions, and a profile determination unit that determines a beam profile at a position corresponding to the processing position based on the selected processing conditions.

[0010] 1 is a schematic diagram showing the configuration of a processing information display device according to a first embodiment. FIG. 1 is a block diagram showing the specific configuration of a control unit shown in FIG. 1 and its relationship with peripheral devices. FIG. 1 is a schematic diagram showing an example of a processing path for laser processing according to the first embodiment displayed on a display unit. FIG. 1 is a schematic diagram showing an example of a display screen when cutting processing is performed. FIG. 1 is a schematic diagram showing an example of a display screen when cutting processing is performed. FIG. 1 is a schematic diagram showing an example of a display screen when marking processing is performed. FIG. 1 is a schematic diagram showing an example of a display screen when marking processing is performed. FIG. 1 is a schematic diagram showing the configuration of a processing information display device according to a second embodiment. FIG. 6 is a block diagram showing the specific configuration of the control unit shown in FIG. 6 and its relationship with peripheral devices. FIG. 7 is a schematic diagram showing an example of a display screen displaying an operation for changing a beam profile. FIG. 8 is a schematic diagram showing an example of a display screen displaying an operation for changing a beam profile. FIG. 9 is a block diagram showing the specific configuration of a control unit in a modified example of the processing information display device according to the second embodiment and its relationship with peripheral devices. FIG. 10 is a schematic diagram showing an example of a specific operation of the processing information display device shown in FIG. 10. 13 is a block diagram showing an example of the configuration of the laser processing control device shown in FIG. 12. FIG.

[0011] Hereinafter, an embodiment of a display device having a function of displaying a laser processing state and a processing control device including the same according to a representative example of the present disclosure will be described with reference to the drawings.

[0012] In this disclosure, "based on XX" means "based on at least XX," and includes cases where it is based on other elements in addition to XX. Furthermore, "based on XX" is not limited to cases where XX is used directly, but also includes cases where it is based on XX that has been calculated or processed. Here, "XX" means any element (for example, any information).

[0013] 1 is a schematic diagram showing the configuration of a processing information display device according to a first embodiment of the present disclosure, which is a representative example. Also, FIG. 2 is a block diagram showing the specific configuration of the control unit shown in FIG. 1 and its relationship with peripheral devices.

[0014] As shown in FIG. 1, the processing information display device 100 includes, as an example, a display unit 110 that displays processing information including a processing path when performing laser processing, an input unit 120 that selects and inputs a specific processing position on the displayed processing path, and a control unit 130 that has the function of determining a beam profile at the processing position based on the input processing position.

[0015] The display unit 110 is configured as a means for receiving a command signal from a display command unit 132 of the control unit 130 (described later) and displaying the machining path on the workpiece to be laser machined, various machining conditions (machining parameters), etc. As the display unit 110, various display means such as a liquid crystal display, an organic EL display, or a plasma display can be used.

[0016] 1, the input unit 120 includes a cross key 122 for moving a selection pointer (see symbol PT in FIG. 4A ) on the screen of the display unit 110, and a button unit 124 including a confirm button 124a and a cancel button 124b for confirming or canceling the position of the selection pointer PT. Examples of such an input unit 120 include a controller-type unit including the cross key 122 shown in FIG. 1, a keyboard including a numeric keypad, or a joystick-type unit. The input unit 120 and the control unit 130 may be connected by wire or wirelessly, as long as they can exchange signals with each other.

[0017] As an example, as shown in FIG. 2, the control unit 130 includes a display command unit 132 that outputs a display command to the display unit 110, a processing condition acquisition unit 133 that acquires laser processing conditions for processing the processing path, a selected processing condition extraction unit 134 that extracts selected processing conditions at the processing position selected by the input unit 120 from the acquired laser processing conditions, and a profile determination unit 135 that determines a beam profile at a position corresponding to the processing position based on the selected processing conditions.

[0018] As an example, the display command unit 132 reads information on the machining path and machining conditions included in the machining program from an external storage device 140 such as a database, and receives the beam profile determined by the profile determination unit 135. Then, the display command unit 132 creates a display command to display the determined beam profile together with the machining path and machining conditions, and outputs the display command to the display unit 110.

[0019] The machining condition acquisition unit 133 reads machining path data and machining condition data from the external storage device 140, and associates the two data to create correspondence information indicating the machining conditions for each position or section on the machining path. The machining condition acquisition unit then sends the created correspondence information to the selected machining condition extraction unit 134. Note that the "machining conditions" include, for example, information such as the machining speed on the machining path, the power of the laser beam, the focal position, the distance from the workpiece, or the wavelength of the laser beam and settings of the optical system such as lenses.

[0020] The selected processing condition extraction unit 134 receives the above-mentioned correspondence information from the processing condition acquisition unit 133, and also receives position information of a specific processing position on the processing path selected and input by the operator from the input unit 120. Then, based on the position information of the selected processing position, the selected processing condition extraction unit 134 extracts processing conditions corresponding to the processing position from the correspondence information, determines selected processing conditions, and sends the selected processing conditions to the profile determination unit 135.

[0021] The profile determination unit 135 determines the beam profile of the laser beam at the selected processing position based on the selected processing conditions received from the selected processing condition extraction unit 134. At this time, the beam profile is determined, for example, by a method of obtaining it from a predetermined arithmetic expression using parameters included in the selected processing conditions, or by a method of storing a condition table in advance in the external storage device 140 or the like, in which the laser beam processing conditions are associated with representative beam profiles, and reading out and selecting the beam profile from the condition table. Then, the profile determination unit 135 sends the determined beam profile to the display command unit 132 together with position information of the processing position.

[0022] Next, a specific example of the operation of the processing information display device according to the first embodiment will be described with reference to FIGS. 3 to 5B.

[0023] Fig. 3 is a schematic diagram showing an example of a processing path for laser processing according to the first embodiment displayed on a display unit. Figs. 4A and 4B are schematic diagrams showing an example of a display screen when performing cutting processing. Figs. 5A and 5B are schematic diagrams showing an example of a display screen when performing marking processing.

[0024] As shown in Figure 3, the machining path according to the first embodiment includes, as an example, a first machining path R1 for performing a cutting process CP on the workpiece W from a machining start point P1 via intermediate bending points P2 to P4 and returning to the machining start point P1, and a second machining path R2 for performing a marking process MP along a trajectory that draws predetermined characters or symbols on the surface of the workpiece W.

[0025] First, when it is desired to check the beam profile when performing the cutting process CP along the first processing path R1, as shown in Fig. 4A, the operator selects and displays the processing path R1 of the cutting process CP on the display unit 110. Next, the operator operates the cross key 122 of the input unit 120 to move the selection pointer PT displayed on the display screen of the display unit 110 to a specific processing position SP1 on the processing path R1.

[0026] At this position, the operator sets the processing position SP1 for which the operator wishes to obtain beam profile information by pressing the decision button 124a of the input unit 120. Then, the position information of the processing position SP1 from the input unit 120 is sent to the selected processing condition extraction unit 134 of the control unit 130, and the beam profile at the processing position SP1 is determined by the profile determination unit 135 based on the position information of the processing position SP1.

[0027] 4B, a pop-up screen PW1 starting from the processing position SP1 is additionally displayed together with the beam profile image BP1 on the display screen of the display unit 110. Here, in FIG. 4B, a two-dimensional laser power distribution is illustrated as the beam profile image BP1, but a three-dimensional laser power distribution may also be displayed.

[0028] By performing such an operation, it is possible to display the beam profile at a specific processing position SP1 when performing cutting processing CP without performing actual processing such as trial processing, and to predict the processing state. If it is desired to view information on the beam profile at another processing position on the processing path R1, the release button 124b of the input unit 120 is pressed to release the selection of the selection pointer PT, and another processing position SP1 is selected by operating the cross key 122 again.

[0029] On the other hand, when it is desired to check the beam profile when performing the marking process MP along the second processing path R2, as shown in Fig. 5A, the operator selects and displays the processing path R2 of the marking process MP on the display unit 110. Next, the operator operates the cross key 122 of the input unit 120 to move the selection pointer PT displayed on the display screen of the display unit 110 to a specific processing position SP2 on the processing path R2.

[0030] [Correction based on Rule 91 22.01.2025] At this position, the operator sets the processing position SP2 for which the operator wants to obtain beam profile information by pressing the decision button 124a of the input unit 120. Then, the position information of the processing position SP2 from the input unit 120 is sent to the selected processing condition extraction unit 134 of the control unit 130, and the beam profile at the processing position SP2 is determined by the profile determination unit 135 based on the position information of the processing position SP2.

[0031] 5B, a pop-up screen PW2 starting from the processing position SP2 is additionally displayed together with a beam profile image BP2 on the display screen of the display unit 110. Here, unlike cutting, marking only requires processing a narrow groove near the surface of the workpiece W, and therefore the beam profile for marking shown in Fig. 5B has a distribution in which the peak power of the laser beam is smaller and the width of the high-output region is narrower than the beam profile for cutting shown in Fig. 5A.

[0032] By performing such an operation, it is possible to display the beam profile at a specific processing position SP2 when performing the marking process MP without performing actual processing such as trial processing, and to predict the processing state. Note that in the display examples shown in Figures 5A and 5B, an example is given in which the display of either the cutting process CP or the marking process MP is selected and the predicted result of only one of the beam profiles is presented, but it is also possible to configure the display to simultaneously present beam profiles at multiple processing positions corresponding to both the cutting process CP and the marking process MP. It is also possible to simultaneously present beam profiles at multiple processing positions in one processing.

[0033] By having the above-mentioned configuration, the processing information display device according to the first embodiment has the function of extracting selected processing conditions at a specific processing position on the processing path input from the input unit, and determining and displaying a beam profile at a position corresponding to the above-mentioned processing position based on the selected processing conditions, thereby making it possible to predict and display a beam profile at a predetermined processing position on the processing path in laser processing based on a predetermined processing program without performing actual processing such as trial processing.

[0034] Second Embodiment Fig. 6 is a schematic diagram showing the configuration of a processing information display device according to a second embodiment. Fig. 7 is a block diagram showing the specific configuration of the control unit shown in Fig. 6 and its relationship with peripheral devices. In the second embodiment, in the schematic diagrams shown in Figs. 1 to 5B, components that can adopt the same or common configuration as those in the first embodiment are assigned the same reference numerals, and repeated description of these components will be omitted.

[0035] The processing information display device 200 according to the second embodiment differs in configuration from the processing information display device 100 according to the first embodiment in that the input unit 220 includes a keypad 224 including the functions of the decision button 124a and the release button 124b shown in the first embodiment, instead of the button unit 124. That is, the processing information display device 200 according to the second embodiment includes a function of inputting change information for changing the beam profile displayed on the display unit 110.

[0036] As an example, as shown in FIG. 6, the processing information display device 200 according to the second embodiment includes a display unit 110, an input unit 220 having a function of selecting a specific processing position on the displayed processing path and allowing the operator to input change information, and a control unit 230 having a function of determining a beam profile at the processing position based on the input processing position and changing the beam profile based on the change information.

[0037] 6, the input unit 220 includes a cross key 222 and a keypad 224 for inputting modification information for modifying the beam profile, such as letters and numbers. Also, as shown in FIG. 7, the control unit 230 includes a display command unit 232, a processing condition acquisition unit 233, a selected processing condition extraction unit 234, a profile determination unit 235, a profile modification unit 236 that modifies the beam profile based on the modification information input by the input unit 220, and a laser processing condition modification unit 237 that modifies the laser processing conditions to reflect the modified beam profile. Note that the input unit 220 and the control unit 230 may be connected by wire or wirelessly, as long as they can exchange signals with each other, as in the first embodiment.

[0038] As in the first embodiment, the profile determination unit 235 determines the beam profile of the laser beam at the selected processing position based on the selected processing conditions received from the selected processing condition extraction unit 234. Then, the profile determination unit 235 sends the determined beam profile together with the position information of the processing position to the display command unit 232 and the profile change unit 236.

[0039] The profile modification unit 236 modifies and updates the power distribution of the laser beam based on the beam profile modification information sent from the input unit 220. At this time, the beam profile is modified by directly inputting the power distribution numerically or manually, or by inputting parameters as modification conditions and reading the power distribution corresponding to the parameters from a condition table stored in the external storage device 140. The profile modification unit 236 then sends the modified beam profile together with position information of the processing position to the display command unit 232 and the laser processing condition modification unit 237.

[0040] The laser processing condition correction unit 237 creates corrected processing conditions by changing the laser processing conditions acquired by the processing condition acquisition unit 233 based on the changed beam profile sent from the profile change unit 236. At this time, the laser processing conditions may be changed by changing only the beam profile at the position corresponding to the processing position selected for the change, or by further selecting an arbitrary processing section including the selected processing position and changing the beam profile of the entire processing section.

[0041] Furthermore, the laser processing condition correction unit 237 sends the changed corrected processing conditions to the display command unit 232. Then, the display command unit 232 outputs a display command to cause the display unit 110 to display the processing information reflecting the sent corrected processing conditions and beam profile.

[0042] Next, a specific example of the operation of the processing information display device according to the second embodiment will be described with reference to FIGS. 8A and 8B.

[0043] 8A and 8B are schematic diagrams showing an example of a display screen that displays an operation for changing the beam profile.

[0044] 8A, when changing the beam profile when performing the cutting process CP along the first processing path R1, the operator selects and displays the processing path R1 of the cutting process CP on the display unit 110, and then selects and inputs the processing position SP1 for which the operator wants to obtain beam profile information. Then, position information of the processing position SP1 from the input unit 220 is sent to the selected processing condition extraction unit 234 of the control unit 230, and the beam profile at the processing position SP1 is determined by the profile determination unit 235, as in the first embodiment.

[0045] Then, in response to a display command from the display command unit 232, a pop-up screen PW1 starting from the processing position SP1 is additionally displayed together with the beam profile image BP1 on the display screen of the display unit 110. At this time, the pop-up screen PW1 can display position information, the peak power value of the laser beam, and the like in addition to the beam profile image BP1.

[0046] 8A, the operator inputs modification information for modifying the beam profile using the input unit 220. The modification information is input by manually directly moving the power distribution using the cross key 222, or by directly inputting numerical values ​​into parameters using the keypad 224.

[0047] When the change information is input, the beam profile is changed by the profile change unit 236 as described above, and accordingly the laser processing conditions are changed by the laser processing condition correction unit 237. Then, in response to a display command from the display command unit 232 that has received information about these changes, a pop-up screen PW1 including an image BP1a of the changed beam profile is newly displayed on the display unit 110, as shown in Fig. 8B.

[0048] By performing such an operation, the beam profile at a specific processing position SP1 on the processing path R1 can be displayed without performing actual processing such as trial processing, and the beam profile and laser processing conditions can be changed arbitrarily based on the change information input by the operator.

[0049] Next, a modified example of the processing information display device according to the second embodiment will be described with reference to FIG.

[0050] FIG. 9 is a block diagram showing a specific configuration of a control unit and its relationship with peripheral devices in a modified example of the processing information display device according to the second embodiment.

[0051] In a modified example of the second embodiment, the control unit 230 includes, for example, as shown in FIG. 9, a display command unit 232, a processing condition acquisition unit 233, a selected processing condition extraction unit 234, a profile determination unit 235, a profile change unit 236, a laser processing condition correction unit 237, and a corrected processing condition output unit 238 that outputs the corrected processing conditions corrected by the laser processing condition correction unit 237 to the outside.

[0052] In this modified example, the laser processing condition correction unit 237 creates corrected processing conditions by changing the laser processing conditions acquired by the processing condition acquisition unit 233 based on the changed beam profile sent from the profile change unit 236. Then, the laser processing condition correction unit 237 sends data on the beam profile and position information together with the corrected processing conditions to the display command unit 232 and the corrected processing condition output unit 238.

[0053] 8A and 8B, the display command unit 232 outputs a display command to display the processing information reflecting the sent changed laser processing conditions and beam profile on the display unit 110. Meanwhile, the corrected processing condition output unit 238 outputs and stores information on the corrected processing conditions and the changed beam profile in, for example, a portable storage device such as a USB memory or an external storage device 140 such as a database shown in FIG.

[0054] By being provided with the above-described configuration, the processing information display device according to the second embodiment not only has the effects described in the first embodiment, but also allows the operator to arbitrarily change the beam profile by inputting change information for the predicted beam profile displayed on the display unit. Also, by changing the beam profile at a selected processing position, it is possible to reflect this in the laser processing conditions and create corrected processing conditions.

[0055] Furthermore, by adding a function to output the modified processing conditions externally, the modified processing conditions can be overwritten and saved in the database, and by transferring the modified processing conditions to the processing control device of the laser processing device, it is also possible to modify the processing program of the laser processing device.

[0056] <Third embodiment> Fig. 10 is a schematic diagram showing the configuration of a processing information display device according to a third embodiment. Also, Figs. 11A and 11B are schematic diagrams showing an example of specific operation of the processing information display device shown in Fig. 10. Note that in the third embodiment, in the schematic diagrams shown in Figs. 1 to 9, components that can employ the same or common configurations as those in the first and second embodiments are assigned the same reference numerals, and repeated description of these components will be omitted.

[0057] The processing information display device 300 according to the third embodiment differs in configuration from the processing information display device 100 according to the first embodiment in that it is configured as a mobile terminal 350 including a touch panel type display unit 310 that serves as both a display section and an input section. That is, the processing information display device 300 according to the third embodiment is a device that omits the input section that is configured as a separate unit.

[0058] 10, the mobile terminal 350 constituting the processing information display device 300 according to the third embodiment includes a display unit 310 and a control unit (not shown). Note that the control unit (not shown) may have the same configuration as the control unit described in the first or second embodiment, and therefore will not be described here.

[0059] 11A and 11B, the operator first selects and displays the processing path R1 of the cutting process CP on the display unit 310. Next, the operator uses his / her hand HD (or finger) to touch the display screen of the display unit 310, which also serves as an input unit, to acknowledge that selection has begun from the display unit 310.

[0060] Next, when the operator performs a tapping operation (a light tap on the screen) at a specific processing position on the processing path R1, the processing position SP1 for which the operator wants to obtain beam profile information is set. Then, position information of the processing position SP1 from the display unit 310 is sent to the control unit, and the beam profile at the processing position SP1 is determined based on the position information of the processing position SP1, as in the first or second embodiment.

[0061] 11B, a pop-up screen PW1 starting from the processing position SP1 is additionally displayed together with the beam profile image BP1 on the display screen of the display unit 310. Note that the pop-up screen PW1 may be configured to display position information, the peak power value of the laser beam, and the like in addition to the beam profile image BP1, as in the cases shown in FIGS.

[0062] When it is desired to view information on the beam profile at another processing position on the processing path R1, another processing position SP1 can be selected by tapping another position on the processing path R1 on the display screen of the display unit 310. As in the first embodiment, it is also possible to simultaneously present beam profiles at a plurality of processing positions corresponding to both the cutting processing CP and the marking processing MP on the display screen of the display unit 310, or to simultaneously present beam profiles at a plurality of processing positions in one processing.

[0063] By having the above-mentioned configuration, the processing information display device according to the third embodiment, in addition to the effects described in the first or second embodiment, is configured as a portable terminal equipped with a display unit that integrates the functions of the display section and the input section, thereby simplifying the overall configuration and making it easier for the operator to use.

[0064] <Fourth embodiment> Fig. 12 is a schematic diagram showing an example of a laser processing apparatus equipped with a laser processing control device including a processing information display device according to a fourth embodiment. Fig. 13 is a block diagram showing an example of the configuration of the laser processing control device shown in Fig. 12. In the fourth embodiment, in the schematic diagrams shown in Figs. 1 to 11B, components that can adopt the same or common configurations as those in the first to third embodiments are assigned the same reference numerals, and repeated description of these components will be omitted.

[0065] 12 , the laser processing apparatus 1 to which the laser processing control device 50 according to the fourth embodiment is applied includes a laser oscillator 10 that oscillates a processing laser beam LB, a processing table 20 that holds the workpiece W, a processing head 30 that irradiates the processing laser beam LB onto the workpiece W, a transport mechanism 40 that moves the processing head 30 relative to the processing table 20, and a laser processing control device 50 that controls a predetermined laser processing operation on the workpiece W. The laser processing control device 50 further includes a processing information display device 400.

[0066] The laser oscillator 10 uses a laser source with a wavelength that has high absorption efficiency depending on the material of the workpiece W to be processed, and the output processing laser beam LB is transmitted to the processing head 30 via a transmission path 12 such as an optical fiber. In addition, the processing table 20 is provided with, for example, a chuck mechanism (not shown) for mounting the workpiece W, and is configured to grip and fix the workpiece W.

[0067] As an example, the processing head 30 introduces a processing laser beam LB from one end (upper end) side, is focused by a focusing lens (not shown) arranged inside, and is then emitted from a nozzle 32 on the other end (lower end) side toward a focusing point FP on the workpiece W. Note that instead of the configuration described above, the processing head 30 that irradiates the processing laser beam LB to the focusing point FP on the workpiece W may have a built-in scanning optical unit (not shown) such as a galvanometer mirror inside, and the scanning optical unit may scan the optical axis of the processing laser beam LB across the workpiece W.

[0068] As an example, the transport mechanism 40 is configured as a linear drive body that moves relatively in three mutually orthogonal axis directions, X, Y and Z, and has the processing head 30 attached to one end of the linear drive body. Note that the transport mechanism 40 may also be configured as a six-axis or seven-axis industrial robot equipped with a robot arm having the processing head 30 attached to one end.

[0069] As an example, as shown in FIG. 13, the laser processing control device 50 includes a main control device 52 that controls the overall operation of the laser processing control device 50, a user interface 54 that allows an operator to manually input various parameter items and numerical values ​​for performing laser processing, an external storage device 140 that stores processing programs for performing laser processing and condition tables corresponding to laser processing conditions, and a processing information display device 400.

[0070] The main control device 52 of the laser processing control device 50 is connected to various sensors and the like provided in each component of the laser processing device 1 to receive detection signals and outputs control command signals based on the processing program to each component. The user interface 54 is configured as, for example, a keyboard for inputting character strings, numbers, and the like, and in the fourth embodiment, is configured to also function as an input unit of the processing information display device 400.

[0071] The machining information display device 400 includes, for example, a display unit 410, a user interface 54 functioning as an input unit, and a control unit 430. Similarly to the first embodiment, the control unit 430 includes a display command unit 432, a machining condition acquisition unit 433, a selected machining condition extraction unit 434, and a profile determination unit 435.

[0072] By being configured as described above, the laser processing control device according to the fourth embodiment is equipped with a processing status display device that has the function of extracting selected processing conditions at a specific processing position on the processing path input from the user interface, and determining and displaying a beam profile at a position corresponding to the processing position based on the selected processing conditions, so that the beam profile at a specified processing position on the processing path can be predicted and displayed before actual processing such as trial processing is performed.

[0073] 13 illustrates an example of the processing information display device 400 that includes the same control unit 430 as in the first embodiment, but a control unit having a function of modifying the beam profile and laser processing conditions based on input of additional change information from an operator may also be used, as shown in, for example, Fig. 7 and Fig. 9 of the second embodiment. Also, the processing information display device 400 may be configured as a portable terminal as shown in Fig. 10 of the third embodiment, and may be detachable from the laser processing control device 50.

[0074] <Fifth embodiment> In the first to fourth embodiments, a processing information display device and a laser processing control device to which the same is applied have been described as representative configurations of the present disclosure. However, another specific example of the present disclosure can be a processing information display program that causes a laser processing control device equipped with a general-purpose display device or display unit to execute control operations based on the technical concept of the present disclosure.

[0075] That is, the processing information display program according to the fifth embodiment is stored, for example, in the control unit of the display device, as a program that displays the beam profile together with the processing information on the display unit of a general-purpose display device having a display unit, an input unit, and a control unit, by executing a series of steps including the steps of displaying processing information including the processing path when performing laser processing on the display unit of the display device, selecting and inputting a specific processing position on the displayed processing path, acquiring laser processing conditions for processing the processing path, extracting selected processing conditions at the processing position from the acquired laser processing conditions, and determining a beam profile at a position corresponding to the processing position based on the extracted selected processing conditions.

[0076] The processing information display program according to the fifth embodiment can be recorded on various recording media such as USB memory or magnetic disks, or on large-scale recording devices such as databases or cloud servers, and can be used as software that can be installed on the display device or laser processing control device to be used as needed.

[0077] In addition, the processing information display program according to the fifth embodiment may further include, in addition to the above-mentioned series of steps, a step of inputting change information for the displayed beam profile, a step of changing the beam profile based on the change information, and a step of modifying the laser processing conditions to reflect the changed beam profile.

[0078] Furthermore, the processing information display program according to the fifth embodiment may further include, in addition to the above-mentioned series of steps, a step of outputting the modified processing conditions, and a step of modifying the processing program that performs laser processing based on the modified processing conditions.

[0079] With the above-described configuration, the processing information display program according to the fifth embodiment can be stored as a control program in a general-purpose display device or laser processing control device equipped with a display unit, an input unit, and a control unit, thereby adding a function of predicting and displaying the beam profile at a specified processing position on the processing path without performing actual processing such as trial processing.

[0080] Although the present disclosure has been described in detail above, the present disclosure is not limited to the individual embodiments described above. Various additions, substitutions, modifications, partial deletions, etc. are possible in these embodiments without departing from the gist of the present disclosure or the spirit of the present disclosure derived from the content of the claims and their equivalents. These embodiments can also be implemented in combination. For example, in the above-described embodiments, the order of each operation and the order of each process are shown as examples and are not limited to these. The same applies when numerical values ​​or mathematical expressions are used in the description of the above-described embodiments.

[0081] The following additional notes are further disclosed regarding the above-described embodiment and modifications.

[0082] (Supplementary Note 1) A processing information display device comprising: a display unit that displays processing information including a processing path and a beam profile when performing laser processing, an input unit that selects and inputs a specific processing position on the processing path displayed on the display unit, and a control unit having a function of determining the beam profile at the processing position based on the processing position input from the input unit, wherein the control unit includes: a processing condition acquisition unit that acquires laser processing conditions for processing the processing path, a selected processing condition extraction unit that extracts selected processing conditions at the processing position from the laser processing conditions, and a profile determination unit that determines the beam profile at a position corresponding to the processing position based on the selected processing conditions. (Supplementary Note 2) The input unit further has a function of being able to input change information for the beam profile displayed on the display unit, and the control unit further includes: a profile change unit that changes the beam profile based on the change information, and a laser processing condition correction unit that corrects the laser processing conditions to reflect the changed beam profile. (Supplementary Note 3) The processing information display device according to Supplementary Note 2, wherein the control unit further includes a modified processing condition output unit that outputs the modified processing conditions modified by the laser processing condition modification unit. (Supplementary Note 4) The processing information display device according to any one of Supplementary Notes 1 to 3, wherein the display unit is configured as a touch panel that also functions as the input unit.(Supplementary Note 5) A laser processing control device comprising: a main control device that controls the laser processing operation of a laser processing device based on a laser processing program; and a processing information display device including a display unit that displays processing information including a processing path and a beam profile when performing the laser processing, wherein the processing information display device comprises: an input unit that selects and inputs a specific processing position on the processing path displayed on the display unit; and a control unit having a function of determining the beam profile at the processing position based on the processing position input from the input unit, and the control unit comprises: a processing condition acquisition unit that acquires laser processing conditions for processing the processing path, a selected processing condition extraction unit that extracts selected processing conditions at the processing position from the laser processing conditions, and a profile determination unit that determines the beam profile at a position corresponding to the processing position based on the selected processing conditions. (Supplementary Note 6) The laser processing control device according to Supplementary Note 5, wherein the input unit further has a function of inputting change information for the beam profile displayed on the display unit, and the control unit further includes: a profile change unit that changes the beam profile based on the change information, and a laser processing condition correction unit that corrects the laser processing conditions to reflect the changed beam profile. (Supplementary Note 7) The laser processing control device according to Supplementary Note 6, wherein the control unit further includes: a corrected processing condition output unit that outputs the corrected processing conditions corrected by the laser processing condition correction unit, and the main control unit further has a function of correcting the laser processing program based on the corrected processing conditions from the corrected processing condition output unit. (Supplementary Note 8) The laser processing control device according to any one of Supplementary Notes 5 to 7, wherein the display unit is configured as a touch panel that also functions as the input unit.(Supplementary Note 9) A processing information display program that causes the processing information display device to display the beam profile together with the processing information by executing a series of steps including: a step of displaying processing information including a processing path when performing laser processing on a processing information display device, a step of selecting and inputting a specific processing position on the processing path displayed on the processing information display device, a step of acquiring laser processing conditions for processing the processing path, a step of extracting selected processing conditions at the processing position from the laser processing conditions, and a step of determining a beam profile at a position corresponding to the processing position based on the selected processing conditions. (Supplementary Note 10) The processing information display program according to Supplementary Note 9, further including: a step of inputting modification information for the beam profile displayed on the processing information display device, a step of changing the beam profile based on the modification information, and a step of modifying the laser processing conditions to reflect the modified beam profile. (Supplementary Note 11) The processing information display program according to Supplementary Note 10, further including: a step of outputting the modified modified processing conditions, and a step of modifying a processing program that executes the laser processing based on the modified processing conditions.

[0083] REFERENCE SIGNS LIST 1 Laser processing device 10 Laser oscillator 12 Transmission path 20 Processing table 30 Processing head 32 Nozzle 40 Conveying mechanism 50 Laser processing control device 52 Main control device 54 User interface 100 Processing information display device 110 Display unit 120 Input unit 122 Cross key 124 Button unit 124a Confirm button 124b Cancel button 130 Control unit 132 Display command unit 133 Processing condition acquisition unit 134 Selected processing condition extraction unit 135 Profile determination unit 140 External storage device 200 Processing information display device 220 Input unit 222 Cross key 224 Keypad 230 Control unit 232 Display command unit 233 Processing condition acquisition unit 234 Selected processing condition extraction unit 235 Profile determination unit 236 Profile change unit 237 Laser processing condition correction unit 238 Corrected machining condition output unit 300 Machining information display device 310 Display unit 350 Portable terminal 400 Machining information display device 410 Display unit 430 Control unit 432 Display command unit 433 Machining condition acquisition unit 434 Selected machining condition extraction unit 435 Profile determination unit

Claims

1. A processing information display device comprising: a display unit that displays processing information including a processing path and a beam profile when performing laser processing; an input unit that selects and inputs a specific processing position on the processing path displayed on the display unit; and a control unit having a function of determining the beam profile at the processing position based on the processing position input from the input unit, wherein the control unit includes: a processing condition acquisition unit that acquires laser processing conditions for processing the processing path; a selected processing condition extraction unit that extracts selected processing conditions at the processing position from the laser processing conditions; and a profile determination unit that determines the beam profile at a position corresponding to the processing position based on the selected processing conditions.

2. The processing information display device according to claim 1, wherein the input unit further has a function of inputting modification information for the beam profile displayed on the display unit, and the control unit further includes: a profile modification unit that modifies the beam profile based on the modification information; and a laser processing condition modification unit that modifies the laser processing conditions to reflect the modified beam profile.

3. The processing information display device according to claim 2, wherein the control unit further includes a modified processing condition output unit for outputting the modified processing conditions modified by the laser processing condition modification unit.

4. A processing information display device according to any one of claims 1 to 3, wherein the display unit is configured as a touch panel that also functions as the input unit.

5. A laser processing control device comprising: a main control device which controls the laser processing operation of a laser processing device based on a laser processing program; and a processing information display device including a display unit which displays processing information including a processing path and a beam profile when performing the laser processing, wherein the processing information display device comprises: an input unit which selects and inputs a specific processing position on the processing path displayed on the display unit; and a control unit having a function of determining the beam profile at the processing position based on the processing position input from the input unit, wherein the control unit comprises: a processing condition acquisition unit which acquires laser processing conditions for processing the processing path, a selected processing condition extraction unit which extracts selected processing conditions at the processing position from the laser processing conditions, and a profile determination unit which determines the beam profile at a position corresponding to the processing position based on the selected processing conditions.

6. A laser processing control device as described in claim 5, wherein the input unit further has a function of inputting modification information for the beam profile displayed on the display unit, and the control unit further includes: a profile modification unit that modifies the beam profile based on the modification information; and a laser processing condition modification unit that modifies the laser processing conditions to reflect the modified beam profile.

7. A laser processing control device as described in claim 6, wherein the control unit further includes a modified processing condition output unit that outputs the modified processing conditions modified by the laser processing condition modification unit, and the main control device further has a function of modifying the laser processing program based on the modified processing conditions from the modified processing condition output unit.

8. A laser processing control device according to any one of claims 5 to 7, wherein the display section is configured as a touch panel that also functions as the input section.

9. A processing information display program that causes the processing information display device to display the beam profile together with the processing information by executing a series of steps including: a step of displaying processing information including a processing path when performing laser processing on a processing information display device; a step of selecting and inputting a specific processing position on the processing path displayed on the processing information display device; a step of acquiring laser processing conditions for processing the processing path; a step of extracting selected processing conditions at the processing position from the laser processing conditions; and a step of determining a beam profile at a position corresponding to the processing position based on the selected processing conditions.

10. The processing information display program according to claim 9, further comprising the steps of: inputting modification information for the beam profile displayed on the processing information display device; modifying the beam profile based on the modification information; and modifying the laser processing conditions to reflect the modified beam profile.

11. The processing information display program according to claim 10, further comprising: a step of outputting the modified processing conditions; and a step of modifying a processing program for executing the laser processing based on the modified processing conditions.

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