Laser system

Abstract

The present application belongs to the technical field of photoelectricity. Disclosed is a laser system. The laser system comprises a laser and a circuit board; the laser comprises a bottom plate, a frame body located on the bottom plate, light-emitting chips located on the bottom plate and surrounded by the frame body, and conductive structures embedded in the frame body and connecting the inside and outside of the surrounded area of the frame body; first areas of the conductive structures are located within the surrounded area of the frame body and are electrically connected to the light-emitting chips; the circuit board has bonding pads connected to a power supply, the laser being located on the circuit board, and the bottom plate being close to the circuit board; second areas of the conductive structures are located outside the surrounded area of the frame body, and are electrically connected to the bonding pads. The present application solves the problem of relatively complex electric connection between lasers and circuit boards. The present application is used for emitting light.

Description

Laser system

[0001] This application claims priority to Chinese Patent Application No. 202211732590.8, filed on December 30, 2022, and entitled "Laser system", and Chinese Patent Application No. 202211732527.4, filed on December 30, 2022, and entitled "Laser system", the contents of which are incorporated herein by reference in their entirety. TECHNICAL FIELD

[0002] The present application relates to the field of optoelectronic technology, and in particular to a laser system. BACKGROUND

[0003] With the development of optoelectronic technology, lasers are widely used, and the requirements for lasers in various aspects are also increasingly high.

[0004] In related technologies, a laser is electrically connected with a circuit board, and the circuit board is used to supply power to the laser. The laser includes a bottom plate, a packaging shell fixed to the bottom plate, and a light-emitting chip located in the packaging shell. The bottom plate is provided with a circuit connected with the circuit board, and the packaging shell is embedded with a conductive structure. The light-emitting chip is connected with the circuit on the bottom plate through the conductive structure in the packaging shell, and then the circuit board, the circuit and the conductive structure can transmit current to the light-emitting chip to make the light-emitting chip emit light.

[0005] However, the process of setting the circuit on the circuit board in the related technology is relatively complex, so the process of electrically connecting the laser with the circuit board is relatively complex.

[0006] SUMMARY

[0007] The present application provides a laser system, which can solve the problem of complex process of electrically connecting the laser with the circuit board. The laser system comprises a laser and a circuit board.

[0008] The laser comprises a bottom plate, a frame located on the bottom plate, a light-emitting chip located on the bottom plate and surrounded by the frame, and a conductive structure embedded in the frame and communicating between the inside and outside of the surrounding area of the frame. The first area of the conductive structure is located in the surrounding area of the frame and is electrically connected with the light-emitting chip.

[0009] The circuit board has a pad connected with a power supply, the laser is located on the circuit board, and the bottom plate is close to the circuit board.

[0010] The second area of the conductive structure is located outside the surrounding area of the frame and is electrically connected with the pad.

[0011] The technical scheme provided by the present application has at least the following beneficial effects:

[0012] In the laser system provided by the present application, the frame is arranged on the bottom plate, and the conductive structure is embedded in the frame to communicate the inside and outside of the surrounding area of the frame. One end of the conductive structure in the surrounding area of the frame is electrically connected with the light emitting chip, and the other end of the conductive structure outside the surrounding area of the frame is electrically connected with the pad in the circuit board, so that the current can be transmitted to the light emitting chip through the circuit board. In this way, when the laser and the circuit board are fixed, only the connection between the other end of the conductive structure outside the surrounding area of the frame and the pad of the circuit board is needed, and the electrical connection mode of the laser and the circuit board can be simplified. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0014] FIG. 1 is a structural schematic diagram of a laser system provided in the related art;

[0015] FIG. 2 is a structural schematic diagram of a laser system provided in an embodiment of the present application;

[0016] FIG. 3 is a structural schematic diagram of another laser system provided in an embodiment of the present application;

[0017] FIG. 4 is a structural schematic diagram of a laser provided in an embodiment of the present application;

[0018] FIG. 5 is a structural schematic diagram of another laser provided in an embodiment of the present application;

[0019] FIG. 6 is a structural schematic diagram of a frame provided in an embodiment of the present application;

[0020] FIG. 7 is a structural schematic diagram of another laser system provided in an embodiment of the present application;

[0021] FIG. 8 is a structural schematic diagram of another laser system provided in an embodiment of the present application;

[0022] FIG. 9 is a structural schematic diagram of another laser provided in an embodiment of the present application;

[0023] FIG. 10 is a structural schematic diagram of another laser provided in an embodiment of the present application;

[0024] FIG. 11 is a structural schematic diagram of another laser provided in another embodiment of the present application;

[0025] FIG. 12 is a structural schematic diagram of a laser system provided in another embodiment of the present application;

[0026] FIG. 13 is a structural schematic diagram of a conductive structure according to an embodiment of the present application;

[0027] FIG. 14 is a structural schematic diagram of a bottom plate according to an embodiment of the present application;

[0028] FIG. 15 is a structural schematic diagram of another laser system according to another embodiment of the present application;

[0029] FIG. 16 is a structural schematic diagram of still another laser system according to another embodiment of the present application;

[0030] FIG. 17 is a structural schematic diagram of a laser according to another embodiment of the present application;

[0031] FIG. 18 is a structural schematic diagram of a laser system according to an embodiment of the present application;

[0032] FIG. 19 is a structural schematic diagram of another laser system according to an embodiment of the present application;

[0033] FIG. 20 is a structural schematic diagram of a laser according to an embodiment of the present application;

[0034] FIG. 21 is a structural schematic diagram of another laser according to an embodiment of the present application;

[0035] FIG. 22 is a structural schematic diagram of still another laser according to an embodiment of the present application;

[0036] FIG. 23 is a structural schematic diagram of still another laser system according to an embodiment of the present application;

[0037] FIG. 24 is a structural schematic diagram of yet another laser according to an embodiment of the present application;

[0038] FIG. 25 is a structural schematic diagram of a frame according to an embodiment of the present application;

[0039] FIG. 26 is a structural schematic diagram of a laser according to another embodiment of the present application;

[0040] FIG. 27 is a structural schematic diagram of a conductive structure according to an embodiment of the present application;

[0041] FIG. 28 is a structural schematic diagram of another laser according to another embodiment of the present application;

[0042] FIG. 29 is a structural schematic diagram of yet another laser system according to an embodiment of the present application;

[0043] FIG. 30 is a structural schematic diagram of a laser system according to another embodiment of the present application;

[0044] FIG. 31 is a structural schematic diagram of another laser system according to an embodiment of the present application. DETAILED DESCRIPTION

[0045] In order to make the objects, technical solutions and advantages of the present application clearer, the following further describes the embodiments of the present application with reference to the accompanying drawings.

[0046] With the development of optoelectronic technology, the application of lasers is more and more extensive, and the requirements for the simplicity of the preparation of lasers and the simplicity of the connection with other devices are also higher. The laser needs to be connected with a circuit board to transmit current to the laser through the circuit board to excite the light-emitting chip in the laser to emit laser. FIG. 1 is a structural schematic diagram of a laser system provided by the related art. As shown in FIG. 1, the laser system includes a laser 00 and a circuit board 01, and the laser 00 is located on the circuit board 01. The laser 00 includes a bottom plate 001, a packaging shell 002 fixed on the bottom plate 001, and a light-emitting chip 003 located in the packaging shell 002. The bottom plate is of metal material, and an electric circuit layer (not shown in the figure) connected with the circuit board 01 is arranged between the bottom plate 001 and the packaging shell 002. An insulating layer (not shown in the figure) is further arranged between the electric circuit layer and the bottom plate 001 and between the electric circuit layer and the packaging shell 002. An electrically conductive structure (not shown in the figure) is embedded in the packaging shell 002, and the two ends of the electrically conductive structure are connected with the electric circuit layer on the bottom plate 001 and the light-emitting chip 003, respectively. Thus, the current can be transmitted to the light-emitting chip 003 through the circuit board 01 and the electrically conductive structure to make the light-emitting chip 003 emit light.

[0047] In the laser 00, the insulating layer and the electric circuit layer need to be arranged on the bottom plate 001, and the arrangement process is relatively complex. The preparation process of the laser 00 is relatively complex, and accordingly, the process of realizing the electrical connection between the laser 00 and the circuit board 01 is relatively complex. In addition, the electrically conductive structure in the laser 00 needs to be accurately electrically connected with the corresponding position in the electric circuit layer first, and then the electric circuit layer needs to be accurately electrically connected with the circuit board 01, which further improves the implementation complexity of the electrical connection between the laser 00 and the circuit board 01. The insulating layer may be damaged or have poor laying quality at some places, which may cause the electrically conductive structure to be in conduction with the bottom plate 001 or the short circuit between different electrically conductive structures, and thus the electrical connection effect between the laser 00 and the circuit board 01 is poor. Since the electric circuit layer is located inside the laser 00, if the electrical connection between the laser 00 and the circuit board 01 has a problem, the maintenance difficulty is high and the cost is high.

[0048] The laser system provided by the following embodiments of the present application has a relatively simple preparation process of the laser in the laser system, a relatively low implementation complexity of the electrical connection between the laser and the circuit board, and a good electrical connection effect between the laser and the circuit board.

[0049] Figure 2 is a structural schematic diagram of a laser system according to an embodiment of the present application. As shown in Figure 2, the laser system includes a laser 10 and a circuit board 20. The laser 10 is located on the circuit board 20, and the laser 10 and the circuit board 20 can be electrically connected. The circuit board 20 is a printed circuit board (PCB).

[0050] The circuit board 20 has a plate structure with two opposite and relatively large plate surfaces and a plurality of relatively small side surfaces connecting the two plate surfaces. The two plate surfaces can be parallel to each other. The two plate surfaces can be a first plate surface B1 and a second plate surface B2, respectively. The circuit board 20 has a solder pad H connected to a power supply on a plate surface close to the laser 10. The solder pad H can be a positive electrode or a negative electrode, and is used to supply power to the laser 10.

[0051] In this embodiment, the laser 10 includes a bottom plate 101, a frame 102 located on the bottom plate 101, a light-emitting chip 103 located on the bottom plate 101 and surrounded by the frame 102, and a conductive structure 104 embedded in the frame 102 and connecting the inside and outside of the surrounding area of the frame 102. A first area of the conductive structure 104 is located in the surrounding area of the frame 102 and is electrically connected to the light-emitting chip 103. The circuit board 20 has a solder pad H connected to a power supply. The laser 10 is located on the circuit board 20, and the bottom plate 101 is close to the circuit board 20. A second area of the conductive structure 104 is located outside the surrounding area of the frame 102 and is electrically connected to the solder pad H.

[0052] The bottom plate 101 has a plate structure. The frame 102 and the light-emitting chip 103 are located on one plate surface of the bottom plate 101. The frame 102 has a frame structure with two opposite annular end surfaces at two ends in the axial direction (e.g., the z direction), and an inner wall and an outer wall connecting the two end surfaces. One end surface of the frame 102 in the axial direction is fixed to the plate surface of the bottom plate 101. The frame 102 and the bottom plate 101 form a recess, which is a receiving space for receiving the light-emitting chip 103 and other components. The bottom plate 101 of the laser 10 is close to the circuit board 20, for example, the laser 10 is fixed to the circuit board 20 by the bottom plate 101.

[0053] The laser 10 system provided in the present application is provided with the frame 102 on the bottom plate 101, and the conductive structure 104 is embedded in the frame 102 to communicate the inside and outside of the surrounding area of the frame 102; one end of the conductive structure 104 located in the surrounding area of the frame 102 is electrically connected with the light emitting chip 103, and the other end located outside the surrounding area of the frame 102 is electrically connected with the pad H in the circuit board 20, so that the current can be transmitted to the light emitting chip 103 through the circuit board 20. In this way, when the laser 10 and the circuit board 20 are fixed, only the connection between the other end of the conductive structure 104 located outside the surrounding area of the frame 102 and the pad H of the circuit board 20 is needed, so that the electrical connection mode of the laser 10 and the circuit board 20 can be simplified.

[0054] In the embodiment of the present application, two modes of electrical connection between the conductive structure 104 and the pad H are provided. In the first mode, the pad H on the circuit board 20 can be located outside the coverage area of the laser 10, which can refer to the orthographic projection area of the laser 10 on the circuit board 20, and the conductive structure 104 and the pad H are indirectly electrically connected. In the second mode, at least part of the pad H on the circuit board 20 can be located in the coverage area of the laser 10, which can refer to the orthographic projection area of the laser 10 on the circuit board 20, and the conductive structure 104 and the pad H are directly electrically connected. The two modes are described below.

[0055] The first mode:

[0056] FIG. 3 is a structural schematic diagram of another laser system provided in the embodiment of the present application, which can be a top view of the laser system shown in FIG. 2, and FIG. 2 can be a schematic diagram of the cross section a-a' of the laser system shown in FIG. 3. As shown in FIG. 2 and FIG. 3.

[0057] In the embodiment, the laser system further comprises the soldering sheet 30 located outside the surrounding area of the frame 102. The second area of the conductive structure 104 is electrically connected with the pad H through the soldering sheet 30.

[0058] In this way, the light emitting chip 103 and the pad H can be electrically connected through the conductive structure 104 and the soldering sheet 30, and then the current can be transmitted to the light emitting chip 103 to excite the light emitting chip 103 to emit laser.

[0059] In the laser system of the embodiment of the present application, the frame body 102 in the laser 10 is located on the bottom plate 101, and the light emitting chip 103 is located on the bottom plate 101 and surrounded by the frame body 102. Thus, the bottom of the packaging shell in the related art is omitted, and thus the thickness of the laser 10 can be small, which is beneficial to the miniaturization of the laser 10. The light emitting chip 103 in the laser 10 can be directly connected to the circuit board 20 through the conductive structure 104 and the soldering sheet 30, and the bottom plate 101 does not need to be provided with an insulating layer and a circuit layer, and the preparation of the laser 10 is relatively simple. When the laser 10 and the circuit board 20 are electrically connected, the soldering sheet 30 only needs to be fixed between the conductive structure 104 of the laser 10 and the soldering pad H in the circuit board 20, and the connection mode is relatively simple. If the electrical connection between the laser 10 and the circuit board 20 is problematic, the soldering sheet 30 can be re-fixed for maintenance, which has low maintenance difficulty and low cost.

[0060] In summary, in the laser system provided by the embodiment of the present application, the frame body is arranged on the bottom plate, and the conductive structure is embedded in the frame body to communicate the inside and outside of the surrounded area of the frame body. One end of the conductive structure in the surrounded area of the frame body is electrically connected with the light emitting chip, and the other end of the conductive structure outside the surrounded area of the frame body is electrically connected with the soldering pad in the circuit board through the soldering sheet, and then the current can be transmitted to the light emitting chip through the circuit board and the soldering sheet. In this way, when the laser and the circuit board are fixed, the soldering sheet only needs to be arranged between the other end of the conductive structure outside the surrounded area of the frame body and the soldering pad of the circuit board, and thus the electrical connection mode of the laser and the circuit board can be simplified.

[0061] In the embodiment of the present application, the number of the light emitting chip 103 in the laser 10 can be one or multiple, and FIG. 2 and FIG. 3 take the laser 10 including six light emitting chips 103 arranged in two rows and three columns as an example, and the row direction is the x direction and the column direction is the y direction. The number and arrangement mode of the light emitting chip 103 can be designed arbitrarily, and the embodiment of the present application does not make any limitation. The number of the conductive structure 104 is multiple, and different conductive structures 104 are spaced from each other. The number of the soldering sheet 30 is the same as the number of the conductive structure 104, each conductive structure 104 corresponds to one soldering sheet 30, and each conductive structure 104 is electrically connected with one soldering pad H on the circuit board 20 through the corresponding soldering sheet 30. The number of the soldering pad H in the circuit board 20 is also the same as the number of the conductive structure 104.

[0062] The number of the conductive structures 104 is related to the number and connection mode of the light emitting chips 103. Each light emitting chip 103 is electrically connected with two conductive structures 104, and the two conductive structures 104 are connected with the positive and negative power supply respectively through the soldering sheet 30 and the soldering pad H. For example, if the light emitting chips 103 in each row are connected in series, and the two ends need to be connected with two conductive structures 104 respectively, then the number of the conductive structures 104 can be 2 times of the number of the rows of the light emitting chips 103, and each conductive structure 104 can be located on the two sides of the light emitting chips 103 in the row direction. As shown in the laser system in FIG. 3, the laser 10 includes four conductive structures 104, the laser system includes four soldering sheets 30, and the circuit board 20 has four soldering pads H corresponding to the four conductive structures 104, and the four conductive structures 104 and the four soldering pads H are connected through the four soldering sheets 30 respectively.

[0063] In the embodiments of the present application, one conductive structure 104 in the laser 10 and the corresponding soldering sheet 30 and soldering pad H are mainly introduced, and the other conductive structures 104, soldering sheets 30 and soldering pads H can be referred to the introduction, and the embodiments of the present application do not make too much repetition.

[0064] The frame 102 in the laser 10 can be surrounded by multiple side walls, for example, the frame 102 in the embodiments of the present application is rectangular and surrounded by four side walls. Each conductive structure 104 is embedded in one side wall of the frame 102, and in the embodiments of the present application, the multiple conductive structures 104 in the laser 10 are embedded in the opposite two side walls of the frame 102 as an example. The laser 10 in the embodiments of the present application can have multiple optional structures, and two optional structures of the laser 10 are introduced below.

[0065] In the first optional structure, FIG. 4 is a structure schematic diagram of a laser provided by the embodiments of the present application, and FIG. 5 is another structure schematic diagram of a laser provided by the embodiments of the present application, and FIG. 5 can be a left view of the laser shown in FIG. 4. FIG. 4 and FIG. 5 show the laser 10 in the laser system shown in FIG. 2 and FIG. 3. FIG. 6 is a structure schematic diagram of a frame provided by the embodiments of the present application, and the frame can be the frame 102 of the laser 10 shown in FIG. 4 and FIG. 5. Please refer to FIG. 2 to FIG. 6, the outer wall of the frame 102 is flat, the second region of the conductive structure 104 is located on the outer wall of the frame 102, and the end surface M2 of the second region of the conductive structure 104 can be flush with the outer wall of the frame 102. Alternatively, the second region of the conductive structure 104 can also protrude relative to the outer wall of the frame 102, which is not shown in the present application.

[0066] In a second alternative structure, FIG. 7 is a structural schematic diagram of a laser system according to an embodiment of the present application, FIG. 8 is a structural schematic diagram of another laser system according to an embodiment of the present application, and FIG. 8 can be a top view of the laser system shown in FIG. 7, and FIG. 7 can be a schematic diagram of a cross section a-a' of the laser system shown in FIG. 8. FIG. 9 is a structural schematic diagram of a laser according to an embodiment of the present application, and FIG. 10 is a structural schematic diagram of another laser according to an embodiment of the present application, and FIG. 10 can be a left view of the laser shown in FIG. 9. FIG. 9 and FIG. 10 show the laser 10 in the laser system shown in FIG. 7 and FIG. 8. FIG. 11 is a structural schematic diagram of another frame according to an embodiment of the present application, and the frame can be the frame 102 of the laser 10 shown in FIG. 9 and FIG. 10.

[0067] Please refer to FIG. 7 to FIG. 11, the first protrusion T1 is formed on the outer wall of the frame 102 near one end of the bottom plate 101, and the conductive structure 104 is embedded in the first protrusion T1 near the portion outside the enclosed area of the frame 102, and the second area of the conductive structure 104 is located on the first protrusion T1. For example, the first protrusion T1 is in the shape of a prism, the surface of the first protrusion T1 near the bottom plate 101 is referred to as the bottom surface of the first protrusion T1, the surface opposite to the bottom surface is referred to as the top surface of the first protrusion T1, and the other surfaces are referred to as the side surfaces of the first protrusion T1. The second area of the conductive structure 104 can be located on the side surface of the first protrusion T1, such as the side surface of the first protrusion T1 away from the enclosed area of the frame 102. Alternatively, FIG. 12 is a structural schematic diagram of a laser system according to another embodiment of the present application. As shown in FIG. 12, the second area of the conductive structure 104 can also be located on the top surface of the first protrusion T1.

[0068] The present application only takes the example that the end surface M2 of the second area of the conductive structure 104 is flush with the surface in the first protrusion T1. As shown in FIG. 7, the end surface M2 of the second area of the conductive structure 104 is flush with the side surface of the first protrusion T1 away from the enclosed area of the frame 102, and as shown in FIG. 12, the end surface M2 of the second area of the conductive structure 104 is flush with the top surface of the first protrusion T1. Alternatively, the end surface M2 of the second area of the conductive structure 104 can also protrude relative to the surface in the first protrusion T1.

[0069] Please continue to refer to FIG. 7 to FIG. 12, each conductive structure 104 in the laser 10 can correspond to a first boss T1 in the frame 102, and the area of each first boss T1 can be slightly larger than the area of the end surface M2 of the second region of the corresponding conductive structure 104. The outer wall of the side wall in which the plurality of conductive structures 104 are embedded in the frame 102 can have a plurality of mutually spaced first bosses T1 corresponding to the plurality of conductive structures 104; the portion of each conductive structure 104 close to the outside of the enclosed region of the frame 102 is embedded in the corresponding first boss T1, and the second region of each conductive structure 104 is located on the corresponding first boss T1.

[0070] Alternatively, the outer wall of the side wall in which the conductive structure 104 is embedded in the frame 102 can also have only one first boss T1 in the form of a strip, the length of the first boss T1 can be equal to the length of the side wall, and the first boss T1 can cover the entire area of the side wall close to one end of the bottom plate 101. When the side wall has a plurality of conductive structures 104 embedded therein, the portions of the plurality of conductive structures 104 close to the outside of the enclosed region of the frame 102 are embedded in the same first boss T1, the second regions of the plurality of conductive structures 104 are located on the first boss T1, and the second regions of the respective conductive structures 104 are mutually spaced.

[0071] In the second structure of the laser 10, the second region of the conductive structure 104 is far away from the bottom plate 101, so as to reduce the risk of solder overflow on the bottom plate 101 when welding the second region of the conductive structure 104 to the soldering pad 30, and reduce the risk of mis-conduction between the conductive structure 104 and the bottom plate 101. Since the solder pad H on the circuit board 101 is located outside the coverage area of the laser 10, the distance between the solder pad H and the bottom plate 101 can also be far away, which can reduce the risk of solder overflow on the bottom plate 101 when welding the soldering pad 30 to the solder pad H, and reduce the risk of mis-conduction.

[0072] Please continue to refer to FIG. 2 to FIG. 12, the inner wall of the frame 102 can have a second boss T2, such as the inner wall of the side wall in which each conductive structure 104 is located. The second boss T2 can be located in the inner wall of the frame 102 close to one end of the bottom plate 101. The portion of the conductive structure 104 close to the inside of the enclosed region of the frame 102 is embedded in the second boss T2. The first region of the conductive structure 104 is located on the surface of the second boss T2 away from the bottom plate 101, so as to facilitate the arrangement of the wire X on the first region. For example, the end surface M1 of the first region of the conductive structure 104 can be flush with the surface of the second boss T2 away from the bottom plate 101, or can also protrude relative to the surface of the second boss T2 away from the bottom plate 101.

[0073] As shown in FIGS. 2-12, the second protrusion T2 on each side wall of the frame 102 in which the conductive structure 104 is embedded can be in the form of a strip, the length of the second protrusion T2 can be equal to the length of the side wall, and the second protrusion T2 covers the entire area in the end of the side wall close to the bottom plate 101. The side wall of the laser 10 of FIGS. 2-6 in which the conductive structure 104 is embedded can be in the form of an L shape, and the side wall of the laser 10 of FIGS. 7-12 in which the conductive structure 104 is embedded can be in the form of a T shape. Alternatively, the side wall in which the plurality of conductive structures 104 are embedded can also have a plurality of second protrusions T2 spaced from each other, each conductive structure 104 is embedded in a corresponding second protrusion T2, and the first area of each conductive structure 104 is located on the corresponding second protrusion T2.

[0074] FIG. 13 is a structural schematic diagram of a conductive structure according to an embodiment of the present application. As shown in FIG. 13, the conductive structure 104 can include a first area 1041, a second area 1042, and an intermediate portion 1043 between the first area 1041 and the second area 1042. The end surface M1 of the first area 1041 is exposed to the surrounding area of the frame 102 and is used to electrically connect with the light-emitting chip 103. The end surface M2 of the second area 1042 is exposed to the outside of the surrounding area of the frame 102 and is used to electrically connect with the soldering pad 30. The sizes of the first area 1041 and the second area 1042 can be slightly larger than the size of the intermediate portion 1043, so as to facilitate the connection with the light-emitting chip 103 and the soldering pad 30.

[0075] In the embodiments of the present application, the material of the frame 102 can be an insulating material, for example, the material of the frame 102 can include ceramic. The material of the conductive structure 104 can include metal, for example, the material of the conductive structure 104 can include tungsten. The frame 102 can be prepared by a ceramic printing process, and the metal material (for example, tungsten) can be pre-placed in the process of printing ceramic, so as to obtain an integrated frame 102 and conductive structure 104 after the ceramic printing structure. The thickness and the number of layers of the metal material in the printing process can be designed according to the size of the current required to pass through the conductive structure 104. Alternatively, the independent conductive structure 104 can be prepared first, and then the ceramic printing is performed outside the conductive structure 104 to prepare the frame 102, so as to embed the conductive structure 104 in the frame 102 in the process of preparing the frame 102.

[0076] After the frame 102 and the conductive structure 104 are prepared, the frame 102 and the bottom plate 101 can be soldered and packaged. For example, the soldering material can be arranged between the end surface of the frame 102 and the bottom plate 101, and then the soldering material is melted to fix the frame 102 and the bottom plate 101. Alternatively, the soldering material can be a metal soldering material such as tin-silver-copper.

[0077] FIG. 14 is a structural schematic diagram of a bottom plate according to an embodiment of the present application. As shown in FIG. 14, the bottom plate 101 can have a first region D1 and a second region D2 surrounding the first region D1. The first region D1 is used for mounting components such as the light emitting chip 103, and the second region D2 is used for fixing the frame 102. The first region D1 can be protruded relative to the second region D2, so that the first region D1 can have a higher strength, which is conducive to ensuring that the first region D1 has a higher flatness and the mounting effect of the light emitting chip 103 is better. Optionally, the material of the bottom plate 101 in the laser 10 can include metal, such as copper, and the material of the bottom plate 101 can be oxygen-free copper.

[0078] The conductive structure 104 can be reserved a certain safety distance from the upper and lower ends of the frame 102, so as to avoid the conductive structure 104 from being misdirected with the bottom plate 101 below and affecting the fixation of the frame 102 and other components above. For example, the side of the frame 102 away from the bottom plate 101 needs to be fixed with a component having a thermal expansion coefficient similar to that of the frame 102, and the thermal expansion coefficient of the conductive structure 104 is quite different from that of the frame 102, so that the conductive structure 104 is far away from the component fixed above the frame 102, which can avoid affecting the fixation effect of the component due to the conductive structure 104, and thus ensure the preparation reliability of the laser 10.

[0079] For example, the minimum distance between the conductive structure 104 and the bottom plate 101 is greater than or equal to 0.5 mm, and / or the minimum distance between the conductive structure 104 and the surface of the frame 102 away from the bottom plate 101 is greater than or equal to 0.5 mm. The minimum distance between the conductive structure 104 and another component refers to the minimum value among the distances between each position of the conductive structure 104 and the component, and the distance between each position of the conductive structure 104 and the bottom plate 101 is greater than or equal to 0.5 mm, and the distance between each position of the conductive structure 104 and the surface of the frame 102 away from the bottom plate 101 is also greater than or equal to 0.5 mm. As shown in FIGS. 2 and 7, the minimum distance between the conductive structure 104 and the bottom plate 101 is the distance d1 in the direction perpendicular to the bottom plate 101 (such as the z direction), and d1 can also be referred to as the distance between the conductive structure 104 and the end surface of the frame 102 close to the bottom plate 101; and the minimum distance between the conductive structure 104 and the surface of the frame 102 away from the bottom plate 101 is the distance d2 in the z direction, and both d1 and d2 are greater than or equal to 0.5 mm.

[0080] In the embodiment of the present application, the soldering piece 30 in the laser system can have a bent structure. The soldering piece 30 can have one bent portion or multiple bent portions. The shape of the soldering piece 30 can also be designed accordingly based on the different conductive structures 104.

[0081] In an alternative, as shown in FIG. 2, FIG. 3, FIG. 7, FIG. 8 and FIG. 12, the soldering sheet 30 can have a bending portion, and the soldering sheet 30 can be substantially L-shaped, and the soldering sheet 30 comprises a first connecting portion L1 and a second connecting portion L2 which are connected to each other and are both plate-shaped. The plate surface of the first connecting portion L1 can be perpendicular to the plate surface of the second connecting portion L2, for example, the plate surface of the first connecting portion L1 is parallel to the plate surface of the bottom plate 101, and the plate surface of the second connecting portion L2 is perpendicular to the plate surface of the bottom plate 101. Alternatively, the included angle between the plate surface of the first connecting portion L1 and the plate surface of the second connecting portion L2 can also be an acute angle or an obtuse angle, which is not limited in the embodiments of the present application.

[0082] The first connecting portion L1 is connected to the conductive structure 104, and the second connecting portion L2 is connected to the soldering pad H. The end of the first connecting portion L1 away from the second connecting portion L2 is fixed to the second region of the conductive structure 104, and the end of the second connecting portion L2 away from the first connecting portion L1 is fixed to the soldering pad H. As shown in FIG. 2, FIG. 3, FIG. 7 and FIG. 8, the end surface of the first connecting portion L1 away from the second connecting portion L2 is connected and fixed to the end surface M2 of the second region of the conductive structure 104; as shown in FIG. 12, the end of the surface of the second connecting portion L1 close to the bottom plate 101 away from the second connecting portion L2 is connected and fixed to the end surface M2 of the second region of the conductive structure 104.

[0083] Conductive solder can be arranged between the first connecting portion L1 and the second region of the conductive structure 104 to realize fixation and electrical connection; conductive solder can also be arranged between the second connecting portion L2 and the soldering pad H to realize fixation and electrical connection. When the solder is arranged between the conductive structure 104 and the first connecting portion L1, the solder can be arranged from the side of the first connecting portion L1 away from the bottom plate 101, so that the first connecting portion L1 can block the solder to a certain extent, so as to avoid the solder overflowing to the bottom plate 101 and causing mis-conduction between the conductive structure 104 and the bottom plate 101.

[0084] In another alternative, FIG. 15 is a structural schematic diagram of another laser system provided by another embodiment of the present application. As shown in FIG. 15, on the basis of the laser shown in FIG. 12, the soldering sheet 30 in the laser system can have two bending portions, and the soldering sheet 30 can be substantially U-shaped.

[0085] In still another alternative, FIG. 16 is a structural schematic diagram of still another laser system provided by another embodiment of the present application. As shown in FIG. 16, the soldering sheet 30 in the laser system can also be arc-shaped.

[0086] In the drawings of the embodiments of the present application, the area of the surface of the soldering sheet 30 fixed to the soldering pad H is equal to the area of the soldering pad H. Alternatively, the area of the surface of the soldering sheet 30 fixed to the soldering pad H can be greater than or less than the area of the soldering pad H, which is not limited in the embodiments of the present application.

[0087] Please continue to refer to the laser 10 in FIGS. 2-16, the laser 10 can further include a heat sink 105 and a reflecting prism 106. Each light emitting chip 103 corresponds to one heat sink 105 and one reflecting prism 107. The heat sink 105 is located on the bottom plate 101, the light emitting chip 103 is located on the surface of the heat sink 105 away from the bottom plate 101, and the heat sink 105 is used to assist the light emitting chip 103 in heat dissipation. The material of the heat sink 105 can include ceramic. The reflecting prism 106 is located on the light emitting side of the corresponding light emitting chip 103, and the laser emitted by the light emitting chip 103 can be shot to the corresponding reflecting prism 106, and the reflecting prism 106 can reflect the received laser in a direction away from the bottom plate 101, so that the laser is shot out of the accommodating space surrounded by the bottom plate 101 and the frame 102.

[0088] FIG. 17 is a structural schematic diagram of a laser provided by another embodiment of the present application. As shown in FIG. 17, on the basis of the laser 10 shown in FIG. 2, the laser 10 can further include a light-transmitting sealing component 107. The light-transmitting sealing component 107 can be in the form of a plate, and the light-transmitting sealing component 107 is located on the side of the frame 102 away from the bottom plate 101, and is used to seal the accommodating space surrounded by the frame 102 and the bottom plate 101, so as to avoid damage to the light emitting chip 103 by external water and oxygen and other pollutants. The edge region of the surface of the light-transmitting sealing component 107 close to the bottom plate 101 is fixed with the surface of the frame 102 away from the bottom plate 101. For example, the edge region of the light-transmitting sealing component 107 can be pre-provided with solder. The light-transmitting sealing component 107 can be placed on the side of the frame 102 away from the bottom plate 101, and the solder is in contact with the surface of the frame 102 away from the bottom plate 101. Then the frame 102 and the light-transmitting sealing component 107 are placed in a high-temperature furnace, so that the solder is melted to weld the frame 102 and the light-transmitting sealing component 107.

[0089] Please continue to refer to FIG. 17, the laser 10 can further include a collimating lens group 108 located on the side of the light-transmitting sealing component 107 away from the bottom plate 101. The collimating lens group 108 can include a plurality of collimating lenses corresponding to each light emitting chip 103. The laser emitted by each light emitting chip 103 can be shot to the corresponding collimating lens after being reflected by the corresponding reflecting prism 106, and the collimating lens can collimate the received laser and then shoot it out, so that the laser is close to parallel light.

[0090] In summary, in the laser system provided by the embodiment of the present application, the frame is arranged on the bottom plate, and the conductive structure is embedded in the frame to communicate the inside and outside of the surrounding area of the frame. One end of the conductive structure located in the surrounding area of the frame is electrically connected with the light emitting chip, and the other end of the conductive structure located outside the surrounding area of the frame is electrically connected with the pad in the circuit board through the soldering sheet, and then the current can be transmitted to the light emitting chip through the circuit board and the soldering sheet. In this way, when the laser and the circuit board are fixed, only the soldering sheet needs to be arranged between the other end of the conductive structure located outside the surrounding area of the frame and the pad of the circuit board, and the electrical connection mode of the laser and the circuit board can be simplified.

[0091] The second implementation manner:

[0092] FIG. 18 is a structural schematic diagram of a laser system provided by an embodiment of the present application, and FIG. 19 is a structural schematic diagram of another laser system provided by an embodiment of the present application. FIG. 19 is an exploded view of the laser system shown in FIG. 18, and FIG. 18 can be a sectional view of the laser system shown in FIG. 19. FIG. 20 is a structural schematic diagram of a laser provided by an embodiment of the present application, and FIG. 20 shows a view of the side where the first plate surface B1 of the laser 10 is located. Please combine FIGS. 18 to 20, in the present embodiment, the end surface of the frame located at one end in the axial direction is flush with the first plate surface of the bottom plate, and the first plate surface of the bottom plate is the surface of the bottom plate close to the circuit board. The second region of the conductive structure is at least partially located on the end surface of the frame. The edge of the first plate surface of the bottom plate close to the frame has an air gap, and the air gap is used to separate the first plate surface and the second region of the conductive structure. The second region of the conductive structure covers the pad and is electrically connected with the pad.

[0093] In the laser system of the embodiment of the present application, the inner wall of the frame 102 in the laser 10 is fixed with the side surface of the bottom plate 101, and the light emitting chip 103 is located on the second plate surface B2 of the bottom plate 101 and is surrounded by the frame 102. This is equivalent to saving the bottom of the packaging shell in the related art, so the thickness of the laser 10 can be smaller, which is beneficial to the miniaturization of the laser 10. The light emitting chip 103 in the laser 10 can be directly connected to the circuit board 20 through the conductive structure 104, and the bottom plate 101 does not need to be provided with an insulating layer and a circuit layer, so the preparation of the laser 10 is relatively simple. When the laser 10 and the circuit board 20 are electrically connected, only the conductive structure 104 of the laser 10 and the pad H in the circuit board 20 need to be fixed, and the connection mode is relatively simple. Since the conductive structure 104 extends out of the laser 10, if the electrical connection between the laser 10 and the circuit board 20 has a problem, the maintenance can be facilitated, the maintenance difficulty is relatively low, and the cost is also relatively low.

[0094] In summary, in the laser system provided by the embodiment of the present application, the inner wall of the frame body is fixed with the side surface of the bottom plate, and the end surface of the frame body in the axial direction is flush with the first plate surface of the bottom plate. The conductive structure is embedded in the frame body, the first region of the conductive structure is located in the surrounding region of the frame body and is electrically connected with the light-emitting chip, and the second region is located on the end surface of the frame body, which can directly cover the pad in the circuit board and be electrically connected with the pad, so that the current can be transmitted to the light-emitting chip through the circuit board and the conductive structure. In this way, when the laser is electrically connected with the circuit board, only the second region of the conductive structure in the laser needs to be directly fixed and electrically connected with the pad, and the electrical connection mode of the laser and the circuit board can be simplified.

[0095] In addition, the edge of the first plate surface of the bottom plate close to the frame body also has a clearance groove, which can block the solder from flowing between the second region of the conductive structure and the pad to the bottom plate, avoid the misdirected conduction of the conductive structure and the bottom plate, and further avoid the influence of the misdirected conduction on the light-emitting effect of the light-emitting chip.

[0096] In the embodiment of the present application, the number of light-emitting chips 103 in the laser 10 can be one or multiple, and FIGS. 18 and 19 take the laser 10 including six light-emitting chips 103 arranged in two rows and three columns as an example, and the row direction is the x direction and the column direction is the y direction. The number and arrangement of the light-emitting chips 103 can be designed arbitrarily, and the embodiment of the present application does not limit it. The number of the conductive structures 104 is multiple, and different conductive structures 104 are spaced from each other, and each conductive structure 104 is electrically connected with one pad H on the circuit board 20. The number of the pads H in the circuit board 20 can be the same as the number of the conductive structures 104.

[0097] The number of the conductive structures 104 is related to the number and connection mode of the light-emitting chips 103, each light-emitting chip 103 is electrically connected with two conductive structures 104, and the two conductive structures 104 and the pads H are respectively connected with the positive electrode and the negative electrode of the power supply. For example, if the light-emitting chips 103 in each row are connected in series and the two ends need to be connected with two conductive structures 104 respectively, the number of the conductive structures 104 can be 2 times the number of the rows of the light-emitting chips 103, and each conductive structure 104 can be located on the two sides of the light-emitting chips 103 in the row direction. As shown in the laser system in FIG. 19, the laser 10 includes four conductive structures 104, and the circuit board 20 has four pads H corresponding to the four conductive structures 104, and the four conductive structures 104 and the four pads H are connected respectively.

[0098] The present embodiment mainly introduces one conductive structure 104 and the corresponding pad H in the laser 10, and the other conductive structures 104 and pads H can be referred to the introduction, and the present embodiment does not make too much repetition. The frame 102 in the laser 10 can be surrounded by a plurality of side walls, for example, the frame 102 in the present embodiment is rectangular and surrounded by four side walls. Each conductive structure 104 is embedded in one side wall of the frame 102, and the present embodiment takes an example that the plurality of conductive structures 104 in the laser 10 are embedded in the opposite two side walls of the frame 102.

[0099] In the present embodiment, the clearance groove C on the bottom plate 101 can have various optional structures, and the following takes two optional structures as examples for introduction.

[0100] In the first optional structure of the clearance groove C, please continue to refer to FIGS. 18-20, the edge of the first plate surface B1 of the bottom plate 101 in the laser 10 close to the frame 102 has a plurality of clearance grooves C spaced from each other, and the plurality of clearance grooves C correspond one-to-one to the plurality of conductive structures 104 in the laser 10. Each clearance groove C is close to the second region of the corresponding conductive structure 104, and is used to separate the second region of the conductive structure 104 and the first plate surface B1 of the bottom plate 101. The arrangement direction of each clearance groove C and the second region of the corresponding conductive structure 104 can be parallel to the arrangement direction of the side wall of the bottom plate 101 and the conductive structure 104.

[0101] Alternatively, in the direction parallel to the wall surface of the frame 102, the width of the clearance groove C can be greater than or equal to the width of the second region of the corresponding conductive structure 104. For example, in FIG. 20, in the y direction, the width of the clearance groove C can be greater than the width of the second region of the corresponding conductive structure 104. In this way, it can be ensured that the conductive solder can be accommodated by the clearance groove C after overflowing from the second region.

[0102] The clearance groove C can be semicircular or rectangular, and the shape of the clearance groove C described in the present embodiment refers to the shape of the opening of the clearance groove C. The clearance groove C has an opening and a bottom, the opening is the part of the clearance groove C away from the second plate surface B2 of the bottom plate 101, and the bottom is the part of the clearance groove C close to the second plate surface B2. When the clearance groove C is semicircular, the stress of the area around the clearance groove C can be evenly distributed when the bottom plate 101 is stressed, ensuring that the strength of the bottom plate 101 is high. Alternatively, the clearance groove C can also have other shapes, such as pentagonal or hexagonal, and the present embodiment does not make any limitation.

[0103] In the embodiments of the present application, the clearance groove C has a flat bottom opposite to the opening, and the shape and size of the bottom are the same as those of the opening. For example, the bottom and the opening of the clearance groove C are congruent semicircles. Alternatively, the bottom of the clearance groove C can not be flat, but can be concave-convex, or can be conical.

[0104] In a second alternative structure of the clearance groove C, FIG. 21 is a structural schematic diagram of another laser provided by the embodiments of the present application. As shown in FIG. 21, each of the side walls of the frame 102 in which the conductive structures 104 are embedded has a strip-shaped clearance groove C between the first plate surface B1 of the bottom plate 101, and the clearance groove C is used to separate all the conductive structures 104 embedded in the side wall from the first plate surface B1 of the bottom plate 101.

[0105] Alternatively, the length of the clearance groove C can be equal to the length of the side wall. Alternatively, the length of the clearance groove C can be greater than or equal to the maximum distance of the second region of the two conductive structures 104 farthest apart in the side wall. In this way, the preparation process of the clearance groove C can be simplified, and the strength of the bottom plate 101 can be maximized while ensuring that all the conductive structures 104 are separated from the first plate surface B1.

[0106] Alternatively, the first plate surface B1 of the bottom plate 101 can have a ring-shaped clearance groove C to separate all the first end surfaces of the side walls from the first plate surface B1, and the embodiments of the present application do not illustrate this way.

[0107] Since the strength of the position of the clearance groove C on the bottom plate 101 will be weakened to a certain extent, in order to ensure the use reliability of the bottom plate 101, the thickness of the bottom plate 101 at the position of the clearance groove C can be greater than or equal to 1 millimeter in the embodiments of the present application.

[0108] In the embodiments of the present application, the clearance groove C can also be filled with insulating materials such as insulating paint. In this way, the spacing effect of the second region of the conductive structure 104 and the first plate surface of the bottom plate 101 can be further ensured.

[0109] Please continue to refer to FIGS. 18-21, the end surface M2 of the second region of the conductive structure 104 can be flush with the first end surface of the frame 102. The pad H in the circuit board 20 can also be flush with the plate surface of the circuit board 20. In this way, the second region of the conductive structure 104 can be directly aligned with the corresponding pad H and welded and fixed.

[0110] In another alternative implementation, FIG. 22 is a structural schematic diagram of still another laser according to an embodiment of the present application, and FIG. 23 is a structural schematic diagram of still another laser system according to an embodiment of the present application, which can include the laser 10 shown in FIG. 22. As shown in FIG. 22 and FIG. 23, the second region of the conductive structure 104 can protrude relative to the first end surface of the frame 102. The solder pad H on the circuit board 20 can be located in a recess (not shown in the drawings), and the solder pad H can be located in the recess. When the laser 10 and the circuit board 20 are fixed, the second region of the conductive structure 104 can be inserted into the recess where the solder pad H is located, so as to be fixed and electrically connected with the solder pad H. In this way, the alignment of the conductive structure 104 and the solder pad H is more convenient, and the distance between the second region of the conductive structure 104 and the first plate surface B1 of the bottom plate 101 is further increased, so as to further reduce the misdirecting of the conductive structure 104 and the bottom plate 101.

[0111] The bottom plate 101 in the laser 10 according to an embodiment of the present application has four side surfaces, and the laser 10 can have various alternative structures, and the fixing manner of the bottom plate 101 and the frame 102 can be different in different alternative structures. Two alternative structures of the laser 10 are introduced below.

[0112] In the first alternative structure, the inner walls of part of the side walls in the frame 102 are fixed with part of the side surfaces of the bottom plate 101. FIG. 24 is a structural schematic diagram of still another laser according to an embodiment of the present application, which is a view of the side where the second plate surface B2 of the bottom plate 101 is located. FIG. 25 is a structural schematic diagram of a frame according to an embodiment of the present application, which can be the frame 102 in the laser 10 shown in FIG. 18 to FIG. 24. Please refer to FIG. 18 to FIG. 24, the inner walls of the opposite two side walls of the four side walls of the frame 102 are fixed with the opposite two side surfaces of the four side surfaces of the bottom plate 101, and the two side walls are the side walls in which the conductive structure 104 is embedded. The first end surface of the frame 102 flush with the first plate surface B1 of the bottom plate 101 includes the surfaces of the two side walls away from the second end surface of the frame 102 in the axial direction. The surfaces of the other two side walls of the four side walls away from the second end surface of the frame 102 in the axial direction of the frame 102 are fixed with the second plate surface B2 of the bottom plate 101.

[0113] In the second optional structure, the inner walls of the side walls of the frame 102 are fixed one by one with the side faces of the bottom plate 101, and the frame 102 surrounds the bottom plate 101. FIG. 26 is a structural schematic view of a laser provided by another embodiment of the present application, and FIG. 26 is a view of the side on which the second plate face B2 of the bottom plate 101 of the laser 10 is located. As shown in FIG. 26, the inner walls of the four side walls of the frame 102 are fixed with the four side faces of the bottom plate 101 respectively, and the first end face of the frame 102 which is flush with the first plate face B1 of the bottom plate 101 comprises the surfaces of the four side walls which are axially away from the second end face of the frame 102.

[0114] Please continue to refer to FIGS. 18-26, the inner wall of the frame 102 can have a third boss T, such as the inner wall of the side wall on which each conductive structure 104 is located can have a third boss T. The third boss T can be located on the inner wall of the frame 102 close to the second plate face B2 of the bottom plate 101. The portion of the conductive structure 104 close to the surrounding area of the frame 102 is embedded in the third boss T. The first region of the conductive structure 104 is located on the surface of the third boss T away from the bottom plate 101, so that the lead wire X can be conveniently arranged on the first region. For example, the end face M1 of the first region of the conductive structure 104 can be flush with the surface of the third boss T away from the bottom plate 101, or can also be protruding relative to the surface of the third boss T away from the bottom plate 101.

[0115] As shown in FIGS. 18-26, the third boss T on each side wall of the frame 102 in which the conductive structure 104 is embedded can be in a strip shape, the length of the third boss T can be equal to the length of the side wall, and the third boss T covers all positions of the side wall close to the bottom plate 101. Alternatively, the side wall in which the plurality of conductive structures 104 are embedded can also have a plurality of third bosses T which are spaced apart from each other, each conductive structure 104 is embedded in a corresponding third boss T, and the first region of each conductive structure 104 is located on the corresponding third boss T.

[0116] FIG. 27 is a structural schematic view of a conductive structure provided by an embodiment of the present application. As shown in FIG. 27, the conductive structure 104 can comprise a first region 1041, a second region 1042, and an intermediate portion 1043 between the first region 1041 and the second region 1042. The end face M1 of the first region 1041 is exposed to the surrounding area of the frame 102 for electrical connection with the light-emitting chip 103. The end face M2 of the second region 1042 is exposed outside the surrounding area of the frame 102 for electrical connection with the pad H in the circuit board 20. The sizes of the first region 1041 and the second region 1042 can be slightly larger than the size of the intermediate portion 1043, so as to facilitate the connection with the light-emitting chip 103 and the pad H.

[0117] In the embodiments of the present application, the material of the frame 102 can be an insulating material, for example, the material of the frame 102 can include ceramic. The material of the conductive structure 104 can include metal, for example, the material of the conductive structure 104 can include tungsten. The frame 102 can be prepared by a ceramic printing process, and the metal material (for example, tungsten) can be pre-placed in the process of printing ceramic, so that the integrated frame 102 and conductive structure 104 can be obtained after the ceramic printing structure. The thickness and number of layers of the metal material in the printing process can be designed according to the size of the current required to pass through the conductive structure 104. Alternatively, the independent conductive structure 104 can be prepared first, and then the ceramic printing can be performed outside the conductive structure 104 to prepare the frame 102, so that the conductive structure 104 can be embedded in the frame 102 in the process of preparing the frame 102.

[0118] After the frame 102 and the conductive structure 104 are prepared, the frame 102 and the bottom plate 101 can be soldered and packaged. For example, the soldering material can be arranged between the end surface of the frame 102 and the bottom plate 101, and then the soldering material can be melted to fix the frame 102 and the bottom plate 101. Alternatively, the soldering material can be a metal solder such as tin-silver-copper.

[0119] The bottom plate 101 includes a first area and a second area around the first area, the first area is used to arrange the light emitting chip 103 and other components, and the second area is used to fix the frame 102. The first area can be protruded relative to the second area, so that the strength of the first area can be higher, which is beneficial to ensure that the flatness of the first area is higher, and the mounting effect of the light emitting chip 103 and other components is better.

[0120] A certain safety distance can be reserved between the conductive structure 104 and the bottom plate 101, so as to avoid the misdirecting of the conductive structure 104 and the bottom plate 101. A certain safety distance can be reserved between the conductive structure 104 and the second end surface of the frame 102, so as to avoid the influence of the conductive structure 104 on the fixation of the frame 102 and other components above. For example, the side of the frame 102 away from the bottom plate 101 needs to be fixed with a component having a similar thermal expansion coefficient to that of the frame 102, and the thermal expansion coefficient of the conductive structure 104 is greatly different from that of the frame 102, so that the distance between the conductive structure 104 and the component fixed above the frame 102 is far, which can avoid the influence of the conductive structure 104 on the fixation effect when fixing the component, and thus ensure the preparation reliability of the laser 10.

[0121] For example, the minimum distance between the conductive structure 104 and the bottom plate 101 is greater than or equal to 0.5 mm, and / or the minimum distance between the conductive structure 104 and the surface of the frame 102 away from the bottom plate 101 is greater than or equal to 0.5 mm. The minimum distance between the conductive structure 104 and another component refers to the minimum value among the distances between each position in the conductive structure 104 and the component, the distance between each position in the conductive structure 104 and the bottom plate 101 is greater than or equal to 0.5 mm, and the distance between each position in the conductive structure 104 and the surface of the frame 102 away from the bottom plate 101 is also greater than or equal to 0.5 mm. As shown in FIG. 18, the minimum distance between the conductive structure 104 and the bottom plate 101 is the distance d1 in the x direction, which can also be referred to as the distance between the second region of the conductive structure 104 and the side surface of the bottom plate 101; and the minimum distance between the conductive structure 104 and the surface of the frame 102 away from the bottom plate 101 is the distance d2 in the z direction, both d1 and d2 are greater than or equal to 0.5 mm.

[0122] Please continue to refer to the laser 10 in FIG. 18, FIG. 24 and FIG. 26, the laser 10 can further include a heat sink 105 and a reflective prism 106. Each light emitting chip 103 corresponds to one heat sink 105 and one reflective prism 107. The heat sink 105 is located on the bottom plate 101, and the light emitting chip 103 is located on the surface of the heat sink 105 away from the bottom plate 101, and the heat sink 105 is used to assist the light emitting chip 103 in heat dissipation. The material of the heat sink 105 can include ceramic. The reflective prism 106 is located on the light emitting side of the corresponding light emitting chip 103, and the laser emitted by the light emitting chip 103 can be directed to the corresponding reflective prism 106, and the reflective prism 106 can reflect the received laser in a direction away from the bottom plate 101, so that the laser is emitted out of the accommodating space surrounded by the bottom plate 101 and the frame 102.

[0123] FIG. 28 is a structural schematic diagram of another laser provided by another embodiment of the present application. As shown in FIG. 28, on the basis of the laser 10 shown in FIG. 18, the laser 10 can further include a light-transmitting sealing component 107. The light-transmitting sealing component 107 can be in the form of a plate, and the light-transmitting sealing component 107 is located on the side of the frame 102 away from the bottom plate 101, and is used to seal the accommodating space surrounded by the frame 102 and the bottom plate 101, so as to avoid damage to the light emitting chip 103 by external pollutants such as water and oxygen. The edge region of the light-transmitting sealing component 107 close to the surface of the bottom plate 101 is fixed with the surface of the frame 102 away from the bottom plate 101. For example, the edge region of the light-transmitting sealing component 107 can be pre-provided with solder. The light-transmitting sealing component 107 can be placed on the side of the frame 102 away from the bottom plate 101, and the solder is in contact with the surface of the frame 102 away from the bottom plate 101. Then the frame 102 and the light-transmitting sealing component 107 are placed in a high-temperature furnace, so that the solder is melted to weld the frame 102 and the light-transmitting sealing component 107.

[0124] Please continue to refer to FIG. 28, the laser 10 can further include a collimating mirror set 108 located on the side of the light-transmitting sealing component 107 away from the bottom plate 101. The collimating mirror set 108 can include a plurality of collimating lenses corresponding to the respective light-emitting chips 103 one-to-one. The laser emitted by each light-emitting chip 103 can be reflected by the corresponding reflecting prism 106 and then can be emitted to the corresponding collimating lens, which can collimate the received laser and then emit it to make the laser close to parallel light.

[0125] FIG. 29 is a structural schematic diagram of another laser system according to an embodiment of the present application, and FIG. 30 is a structural schematic diagram of a laser system according to another embodiment of the present application. FIG. 30 is an exploded view of the laser system shown in FIG. 29, and FIG. 29 can be a sectional view of the laser system shown in FIG. 30. As shown in FIG. 29 and FIG. 30, the circuit board 20 in the embodiment of the present application can have a hollow region, and the solder pad H is located outside the hollow region. The bottom plate 101 in the laser 10 can cover the hollow region, and the area of the bottom plate 101 is greater than the area of the hollow region. The hollow region can be used to set a heat sink, and the cold head of the heat sink can extend into the hollow region and contact the bottom plate 101 of the laser 10 to achieve better heat dissipation effect of the laser 10.

[0126] FIG. 31 is a structural schematic diagram of another laser system according to an embodiment of the present application. As shown in FIG. 31, the second region of the conductive structure 104 can be located at other positions of the frame 102 in addition to the end surface of the frame 102.

[0127] For example, in the embodiment, the second region of the conductive structure 104 is at least partially located at the side surface of the frame 102, which is the surface of the frame 102 away from the bottom plate 101 and connected to the end surface of the frame 102.

[0128] When soldering the conductive structure 104 and the solder pad H on the circuit board 20, a plurality of soldering solders can be additionally provided on the circuit board 20, so that after the soldering solders are melted, they can overflow the end surface of the frame 102 under the mutual extrusion of the end surface of the frame 102 and the circuit board 20, and spread to the side surface of the frame 102, so that the second region of the conductive structure 104 located at the side surface of the frame 102 is electrically connected to the solder pad H through the soldering solders. In this way, the second region of the conductive structure 104 is significantly increased, so that the current carrying capacity of the conductive structure 104 is enhanced. Moreover, the significant increase of the second region of the conductive structure 104 can also be beneficial to heat dissipation under large current.

[0129] In summary, in the laser system provided by the embodiment of the present application, the inner wall of the frame body is fixed with the side of the bottom plate, and the end surface of the frame body in the axial direction is flush with the first plate surface of the bottom plate. The conductive structure is embedded in the frame body, the first region of the conductive structure is located in the surrounding region of the frame body and is electrically connected with the light-emitting chip, and the second region is located on the end surface of the frame body. The second region can directly cover the solder pad in the circuit board and is electrically connected with the solder pad, and then the current can be transmitted to the light-emitting chip through the circuit board and the conductive structure. In this way, when the laser is electrically connected with the circuit board, only the second region of the conductive structure in the laser needs to be directly fixed and electrically connected with the solder pad, and the electrical connection mode of the laser and the circuit board can be simplified.

[0130] In addition, the edge of the first plate surface of the bottom plate close to the frame body also has a clearance groove, which can block the solder from flowing between the second region of the conductive structure and the solder pad to the bottom plate, avoid the misdirected conduction of the conductive structure and the bottom plate, and avoid the influence of the misdirected conduction on the light-emitting effect of the light-emitting chip.

[0131] The laser system in the embodiment of the present application can be applied to laser projection as a light source in a projection device. In addition to the laser system, the projection light source can also include other optical components, such as a light homogenizing component, a shaping component, and a converging lens, etc. The light homogenizing component is used to homogenize the laser emitted by the laser system, the shaping component can shape the laser spot into the shape required by the projection picture, and the converging lens can converge the laser into the subsequent components. For example, the light homogenizing component can be a light guide pipe.

[0132] The embodiment of the present application also provides a projection device, which can include the light source assembly described above, and can also include a light valve and a lens. The laser emitted by the light source assembly can be incident on the light valve, and then be modulated by the light valve and be incident on the lens, and then the lens can project the received laser to form a projection picture. Since the quality of the laser emitted by the projection light source is good, the display effect of the projection picture formed based on the laser can also be good, and the display effect of the projection device can be improved.

[0133] In the present application, the terms "at least one of A and B" and "A and / or B" are only used to describe the association relationship of the associated objects, and indicate that there can be three relationships, namely, A exists alone, A and B exist simultaneously, and B exists alone. The term "at least one of A, B and C" indicates that there can be seven relationships, which can indicate that A exists alone, B exists alone, C exists alone, A and B exist simultaneously, A and C exist simultaneously, C and B exist simultaneously, and A, B and C exist simultaneously. In the embodiments of the present application, the terms "first" and "second" are only used for description purposes, and cannot be understood as indicating or implying relative importance. The term "at least one" refers to one or more, and the term "multiple" refers to two or more, unless otherwise explicitly limited.

[0134] Throughout the specification and claims, the following terms take the meanings given them as follows: "include" and "comprise" and variations thereof will be construed to be open- ended, meaning that they include but do not limit the items or components that follow. "Approximately" means within an acceptable error range for the corresponding function or operation, which will be understood by those having ordinary skill in the art. Certain words are used to connote reciprocal relationships between elements. Those skilled in the art will understand that a manufacturer can use terms different from those used herein to connote the same element. The specification and claims are not to be limited by these terms.

[0135] The above description is merely exemplary of the application, and it is not intended to limit the application. Any modification, equivalent replacement, improvement, and the like made within the spirit and principle of the application should be included in the protection scope of the application.

Claims

1. A laser system, characterized by, The laser system comprises a laser and a circuit board; The laser comprises a bottom plate, a frame on the bottom plate, a light emitting chip on the bottom plate and surrounded by the frame, and a conductive structure embedded in the frame and communicating between the inside and outside of the surrounding area of the frame, a first area of the conductive structure being located in the frame close to the surrounding area and electrically connected with the light emitting chip; The circuit board has a solder pad connected with a power supply, the laser is located on the circuit board, and the bottom plate is close to the circuit board; A second area of the conductive structure is located in the frame away from the surrounding area and is electrically connected with the solder pad.

2. The laser system of claim 1, wherein, The laser system further comprises a solder piece; The solder piece is located outside the surrounding area of the frame; The second area of the conductive structure is electrically connected with the solder pad through the solder piece.

3. The laser system of claim 2, wherein, The solder piece is L-shaped, and the solder piece comprises a first connecting part and a second connecting part which are connected with each other and are both plate-shaped; One end of the first connecting part away from the second connecting part is fixed with the conductive structure, and one end of the second connecting part away from the first connecting part is fixed with the solder pad.

4. The laser system of claim 3, wherein, The solder piece is arc-shaped or U-shaped.

5. The laser system of any of claims 2 to 4, wherein, An outer wall of the frame is flat, and the second area of the conductive structure is located on the outer wall.

6. The laser system of any of claims 2 to 4, wherein, One end of the outer wall of the frame close to the bottom plate has a first boss, and part of the conductive structure is embedded in the first boss, and the second area of the conductive structure is located on the first boss.

7. The laser system of claim 6, wherein, The second area of the conductive structure is flush with the surface of the first boss away from the surrounding area of the frame, or is flush with the surface of the first boss away from the bottom plate.

8. The laser system of claim 6, wherein, The laser comprises a plurality of conductive structures, and the outer wall has a plurality of first bosses corresponding to the plurality of conductive structures, and the second area of each conductive structure is located on the corresponding first boss.

9. The laser system of any of claims 2 to 4, wherein, An inner wall of the frame has a second boss, and part of the conductive structure is embedded in the second boss; The first area of the conductive structure is located on the surface of the second boss away from the bottom plate.

10. The laser system of claim 1, wherein, An end surface of the frame located at one end in the axial direction is flush with a first plate surface of the bottom plate, and the first plate surface of the bottom plate is a surface of the bottom plate close to the circuit board; The second area of the conductive structure is at least partially located on the end surface of the frame; The first plate surface of the bottom plate close to the edge of the frame has a clearance groove for spacing the first plate surface and the second area of the conductive structure; The second area of the conductive structure covers the solder pad and is electrically connected with the solder pad.

11. The laser system of claim 10, wherein, The laser comprises a plurality of conductive structures, and the first plate surface of the bottom plate close to the edge of the frame has a plurality of clearance grooves corresponding to the plurality of conductive structures; Each clearance groove is close to the second area of the corresponding conductive structure for spacing the second area and the first plate surface.

12. The laser system of claim 11, wherein, The clearance groove is semicircular or rectangular.

13. The laser system of claim 10, wherein, The clearance groove is filled with insulating material.

14. The laser system of any of claims 10 to 13, wherein, The second area of the conductive structure is flush with the end surface.

15. The laser system of any of claims 10 to 13, wherein, The second region of the conductive structure protrudes relative to the end face, and the circuit board has a recess at the position of the pad, and the pad is located in the recess; The second region is inserted into the recess and is electrically connected with the pad.

16. The laser system of any of claims 10 to 13, wherein, The bottom plate has four side faces, and the frame is surrounded by four side walls; The inner walls of two opposite side walls of the four side walls are fixed with two opposite side faces of the four side faces, and the end face of the frame flush with the first plate face of the bottom plate comprises surfaces of the two side walls at one end of the frame in the axial direction; The other two side walls of the four side walls are located on the second plate face of the bottom plate, and the surfaces of the other two side walls at one end of the frame in the axial direction are fixed with the second plate face.

17. The laser system of any of claims 10 to 13, wherein, The inner wall of the frame has a third boss, and part of the conductive structure is embedded in the third boss; The first region of the conductive structure is located on the surface of the third boss away from the bottom plate.

18. The laser system of any of claims 10 to 13, wherein, The second region of the conductive structure is at least partially located on the side face of the frame, the side face of the frame is a face of the frame away from the bottom plate, and the side face of the frame is connected with the end face of the frame.

19. The laser system of claim 1, wherein, The minimum distance between the conductive structure and the bottom plate is greater than or equal to 0.5mm, and / or the minimum distance between the conductive structure and the surface of the frame away from the bottom plate is greater than or equal to 0.5mm.

20. The laser system of claim 1, wherein, The laser satisfies at least one of the following conditions: The material of the bottom plate comprises metal; The material of the frame comprises ceramic; And the material of the conductive structure comprises tungsten.

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