Electronic device for outputting sound and sound output method using same

Abstract

An electronic device for outputting sound, according to embodiments of the present disclosure, may comprise: a memory for storing at least one instruction; a processor for executing the at least one instruction; at least one speaker; and an audio processing module for processing an input audio signal and outputting same through the at least one speaker. The audio processing module can include: a digital amplifier for amplifying a digital audio signal; a DAC for converting the digital audio signal into an analog audio signal; an analog amplifier for amplifying the analog audio signal; a boost amplifier for boosting the analog audio signal to a reference high voltage or higher; and at least one noise gate for cancelling noise included in the analog audio signal. The digital amplifier can apply a positive (+) digital gain to the digital audio signal. The analog amplifier can apply a negative (-) analog gain to the analog audio signal.

Description

Electronic device for outputting sound and method for outputting sound using the same

[0001] Various embodiments of the present disclosure relate to an electronic device for outputting sound and a sound output method using the same.

[0002] With the advancement of digital technology, various electronic devices, such as earphones, earbuds, wireless speakers, or wireless headsets, are becoming widespread to output audio data played by audio source devices such as mobile terminals, personal digital assistants (PDAs), electronic notebooks, smartphones, tablets, personal computers (PCs), or wearable devices. These electronic devices can receive audio data from audio source devices via a wireless communication connection.

[0003] In relation to the aforementioned wireless communication connection technology, the Bluetooth standard defines a protocol for short-range wireless communication between electronic devices. In a Bluetooth network environment, electronic devices can transmit or receive data packets containing content such as text, voice, images, or video over a designated frequency band. For example, a user equipment (UE) such as a smartphone, tablet, desktop computer, or laptop computer can transmit data packets to another user equipment (UE) or accessory device.

[0004] Electronic devices (e.g., a pair of wireless earphones, a wireless speaker) can each establish an independent communication link (e.g., an audio over Bluetooth low energy (AoBLE) topology) with a user terminal (e.g., a smartphone) and provide the same purpose and the same service. Matching or coupling can be performed between the electronic devices to enable them to provide the same purpose and the same service.

[0005] Various embodiments of the present disclosure can provide an electronic device that performs dynamic range enhancement (DRE) on an input audio signal, boosts the input audio signal, and removes noise generated during audio processing.

[0006] An electronic device for outputting sound according to embodiments of the present disclosure includes a memory for storing at least one command, a processor for executing the at least one command, at least one speaker, and an audio processing module for processing an input audio signal and outputting the input audio signal to the at least one speaker. The audio processing module includes a digital amplifier for amplifying a digital audio signal, a DAC for converting the digital audio signal into an analog audio signal, an analog amplifier for amplifying the analog audio signal, a boost amplifier for boosting the analog audio signal above a reference high voltage, and at least one noise gate for removing noise included in the analog audio signal. The digital amplifier applies a positive (+) digital gain to the digital audio signal. The analog amplifier applies a negative (-) analog gain to the analog audio signal.

[0007] In addition, an audio processing module for processing an input audio signal according to embodiments of the present disclosure and outputting the input audio signal to at least one speaker includes a digital amplifier for amplifying a digital audio signal, a DAC for converting the digital audio signal into an analog audio signal, an analog amplifier for amplifying the analog audio signal, a boost amplifier for boosting the analog audio signal above a reference high voltage, and at least one noise gate for removing noise included in the analog audio signal. The digital amplifier applies a positive (+) digital gain to the digital audio signal. The analog amplifier applies a negative (-) analog gain to the analog audio signal.

[0008] In addition, the sound output method according to embodiments of the present disclosure includes an operation of amplifying a digital audio signal, an operation of converting the digital audio signal into an analog audio signal, an operation of amplifying the analog audio signal, an operation of boosting the analog audio signal above a reference high voltage, an operation of removing noise included in the analog audio signal, and an operation of outputting the analog audio signal to at least one speaker. The operation of amplifying the digital audio signal applies a positive (+) digital gain to the digital audio signal. The operation of amplifying the analog audio signal applies a negative (-) analog gain to the analog audio signal.

[0009] According to various embodiments of the present disclosure, an electronic device for outputting sound of the present disclosure and a sound output method using the same can implement high-resolution sound with minimized noise by performing DRE (dynamic range enhancement) on an input audio signal and removing noise generated during audio processing using a noise gate.

[0010] In addition, the electronic device for outputting sound of the present disclosure and the sound output method using the same can drive a piezo speaker requiring high voltage output by boosting an input audio signal above a reference high voltage.

[0011] The effects that can be obtained from the exemplary embodiments of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure pertain from the following description. In other words, unintended effects resulting from implementing the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0012] FIG. 1 illustrates a block diagram of an electronic device within a network environment according to one embodiment.

[0013] Figure 2 illustrates a block configuration of an audio module according to one embodiment.

[0014] FIG. 3 illustrates a block diagram of an electronic device for processing audio signals to output sound from a speaker according to one embodiment.

[0015] Figure 4 illustrates a block configuration of an audio processing module according to one embodiment.

[0016] Figure 5 illustrates a block configuration of an audio processing module according to one embodiment.

[0017] Figure 6 illustrates a block configuration of an audio processing module according to one embodiment.

[0018] Figure 7 illustrates a block configuration of an audio processing module according to one embodiment.

[0019] Figure 8 illustrates a block configuration of an audio processing module according to one embodiment.

[0020] Figure 9 illustrates a block configuration of an audio processing module according to one embodiment.

[0021] Figure 10 illustrates a block configuration of an audio processing module according to one embodiment.

[0022] Fig. 11 illustrates a sound output method using an electronic device according to one embodiment.

[0023] FIG. 12A illustrates a block diagram of a wearable electronic device according to one embodiment.

[0024] FIG. 12b illustrates an external configuration of a wearable electronic device according to one embodiment.

[0025] FIG. 12c illustrates the internal configuration of a wearable electronic device according to one embodiment.

[0026] FIG. 13 illustrates a wearable device electrically connected to an electronic device according to one embodiment.

[0027] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0028] FIG. 1 illustrates a block configuration of an electronic device (101) within a network environment (100) according to one embodiment.

[0029] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0030] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0031] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0032] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0033] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0037] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0038] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0042] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0044] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0047] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0048] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0049] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0050] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0051] Figure 2 illustrates a block configuration of an audio module (170) according to one embodiment.

[0052] Referring to FIG. 2, the audio module (170) may include, for example, an audio input interface (210), an audio input mixer (220), an analog to digital converter (ADC) (230), an audio signal processor (240), a digital to analog converter (DAC) (250), an audio output mixer (260), or an audio output interface (270).

[0053] The audio input interface (210) can receive an audio signal corresponding to a sound acquired from the outside of the electronic device (101) as part of the input module (150) or through a microphone (e.g., a dynamic microphone, a condenser microphone, or a piezo microphone) configured separately from the electronic device (101). For example, when the audio signal is acquired from an external electronic device (102) (e.g., a headset or a microphone), the audio input interface (210) can be directly connected to the external electronic device (102) through a connection terminal (178) or wirelessly (e.g., Bluetooth communication) through a wireless communication module (192) to receive the audio signal. According to one embodiment, the audio input interface (210) can receive a control signal (e.g., a volume control signal received through an input button) related to the audio signal acquired from the external electronic device (102). The audio input interface (210) includes a plurality of audio input channels and can receive different audio signals for each corresponding audio input channel among the plurality of audio input channels. According to one embodiment, additionally or alternatively, the audio input interface (210) can receive audio signals from other components of the electronic device (101), such as the processor (120) or the memory (130).

[0054] The audio input mixer (220) can synthesize a plurality of input audio signals into at least one audio signal. For example, according to one embodiment, the audio input mixer (220) can synthesize a plurality of analog audio signals input through the audio input interface (210) into at least one analog audio signal.

[0055] The ADC (230) can convert an analog audio signal into a digital audio signal. For example, according to one embodiment, the ADC (230) can convert an analog audio signal received through the audio input interface (210) or, additionally or alternatively, an analog audio signal synthesized through the audio input mixer (220) into a digital audio signal.

[0056] The audio signal processor (240) may perform various processing on a digital audio signal input through the ADC (230) or a digital audio signal received from another component of the electronic device (101). For example, according to one embodiment, the audio signal processor (240) may change a sampling rate, apply one or more filters, perform interpolation processing, amplify or attenuate all or part of a frequency band, process noise (e.g., noise or echo reduction), change a channel (e.g., switching between mono and stereo), mix, or extract a specified signal on one or more digital audio signals. According to one embodiment, one or more functions of the audio signal processor (240) may be implemented in the form of an equalizer.

[0057] The DAC (250) can convert a digital audio signal into an analog audio signal. For example, according to one embodiment, the DAC (250) can convert a digital audio signal processed by an audio signal processor (240) or a digital audio signal obtained from another component of the electronic device (101) (e.g., a processor (120) or a memory (130)) into an analog audio signal.

[0058] The audio output mixer (260) can synthesize a plurality of audio signals to be output into at least one audio signal. For example, according to one embodiment, the audio output mixer (260) can synthesize an audio signal converted into analog through the DAC (250) and another analog audio signal (e.g., an analog audio signal received through the audio input interface (210)) into at least one analog audio signal.

[0059] The audio output interface (270) can output an analog audio signal converted by the DAC (250), or additionally or alternatively, an analog audio signal synthesized by the audio output mixer (260), to the outside of the electronic device (101) through the audio output module (155). The audio output module (155) can include, for example, a speaker such as a dynamic driver or a balanced armature driver, or a receiver. According to one embodiment, the audio output module (155) can include a plurality of speakers. In this case, the audio output interface (270) can output an audio signal having a plurality of different channels (e.g., stereo or 5.1 channels) through at least some of the speakers among the plurality of speakers. According to one embodiment, the audio output interface (270) can be directly connected to an external electronic device (102) (e.g., an external speaker or headset) through a connection terminal (178) or wirelessly through a wireless communication module (192) to output an audio signal.

[0060] According to one embodiment, the audio module (170) can generate at least one digital audio signal by synthesizing a plurality of digital audio signals using at least one function of the audio signal processor (240) without separately having an audio input mixer (220) or an audio output mixer (260).

[0061] According to one embodiment, the audio module (170) may include an audio amplifier (not shown) (e.g., a speaker amplifier circuit) capable of amplifying an analog audio signal input through the audio input interface (210) or an audio signal to be output through the audio output interface (270). According to one embodiment, the audio amplifier may be configured as a separate module from the audio module (170).

[0062] FIG. 3 illustrates a block configuration of an electronic device (300) that processes an audio signal to output sound from a speaker according to one embodiment.

[0063] An electronic device (300) (e.g., electronic device (101) of FIG. 1) may include an audio receiving module (310), a communication module (320), a codec (330), an audio processing module (340), a speaker (350), a sensor (360), a memory (388), and a processor (399). The above components of the electronic device (300) may be operatively or electrically connected to each other.

[0064] In one embodiment, the audio receiving module (310) can receive an audio file from an audio source. For example, the audio receiving module (310) can receive an audio file automatically or manually selected by a user or a server as audio to be played (e.g., streaming playback) from an external audio source (e.g., a streaming media server) via a communication module (320) (e.g., a wireless communication module (192) of FIG. 1), and store the audio file in a buffer (e.g., memory (388)). For example, the audio receiving module (310) can retrieve an audio file selected by a user as audio to be played from among audio files stored in an internal audio source (e.g., memory (388)).

[0065] In one embodiment, the codec (330) can decode an audio file received from the audio receiving module (310) into a digital audio signal. For example, the codec (330) can decompress an audio file compressed in a lossy compression format, such as MP3 or AAC (advanced audio coding), into a playable digital audio signal. The codec (330) can decompress an audio file compressed in a lossless compression format, such as TTA (the true audio) or FLAC (free lossless audio codec), into a digital audio signal. In addition to the formats exemplified above, audio files in various formats can be decompressed by the codec (330).

[0066] In one embodiment, the audio processing module (340) can check the format of the audio file. For example, the audio processing module (340) can check the format information that constitutes the digital audio signal (e.g., digital data) in the audio file (e.g., header) obtained from the codec (330). For example, the audio processing module (340) can check at least one of a bit rate, a sampling rate, a bit depth, and a number of channels. The bit rate is defined as the number of bits processed per unit time (e.g., 1 second), and the unit thereof can be bps (bits per second). The higher the bit rate, the higher the quality (e.g., fidelity) of the corresponding audio file can be understood. The sampling rate can be defined as the number of samples extracted from the original sound per unit time (e.g., 1 second), and the unit thereof can be hertz (Hz). For example, an audio file with a sampling rate of 48 kHz can be understood as an audio file included in multimedia rather than music. Bit depth corresponds to the resolution of an image and can be an indicator of how precisely the amplitude of an audio signal can be expressed, and its unit can be bits. The higher the bit depth, the higher the resolution of the audio file can be understood. The number of channels can be, for example, at least one of 1 (mono), 2 (stereo), 5.1, and 7.1.

[0067] According to one example, the audio processing module (340) can process a digital audio signal (e.g., digital data) based on format information. For example, the audio processing module (340) estimates the type (or purpose) of the corresponding audio file (e.g., music, multimedia, voice, high-resolution, or surround sound) using the format information, and processes the digital audio signal using a processing method based on the type, thereby providing a sound field effect expected by the user when playing back audio. The processing method may include at least one of an operation for adjusting the pitch (frequency), volume, or tone of an audio signal, an operation for amplifying (or attenuating) an audio component of a specific frequency band in an audio signal, an operation for synthesizing a sound effect (e.g., echo) into an audio signal, an operation for removing noise from an audio signal, an operation for gradually increasing (or decreasing) a sound, and an operation for decreasing a small sound in an audio signal and increasing a large sound. The processing method may include various processing methods in addition to the above operations. The audio processing module (340) can configure a processing method based on the type of audio file by using at least one of the above operations, and apply the processing method based on the type of audio file to the processing of digital data.

[0068] In one embodiment, the audio processing module (340) may process a digital audio signal based on bit depth. For example, if the bit depth is greater than or equal to a specified value (e.g., 24 bits), the audio processing module (340) may consider the audio file as a high-resolution audio file and apply a processing method to the audio signal received from the codec (330) to emphasize the high-resolution characteristics and minimize distortion so that the audio is played back closer to the original sound. For example, if the speaker (350) has a performance lower than a specified standard, the audio processing module (340) may emphasize (e.g., amplify) audio components belonging to a frequency band higher than a specified first frequency (e.g., approximately 16 kHz) and audio components belonging to a frequency band lower than a specified second frequency (e.g., approximately 40 Hz) in the audio signal.

[0069] For example, the speaker (350) may be connected to the electronic device (300) via an audio connector or a communication module (320). The electronic device (300) may receive specifications regarding the performance of the speaker (350) (e.g., reproducible frequency band, sound pressure level, recommended amplifier output, or impedance) from the speaker (350) via the audio connector or the communication module (320). Based on the received performance information, the electronic device (300) may determine that the speaker (350) has performance exceeding a specified standard. Based on this determination, the audio processing module (340) may output an audio signal to the speaker (350) without the above-described emphasis processing.

[0070] In one embodiment, the audio processing module (340) can process digital data based on the number of channels. For example, when the number of channels is one, the audio processing module (340) can regard the digital data as voice data for information transmission (e.g., online lectures) and can emphasize (e.g., amplify) audio components belonging to a specific frequency (e.g., approximately 1 kHz) in the digital data for clear information transmission. For example, when the number of channels exceeds two, the audio processing module (340) can regard the digital data as audio data having surround sound and can apply a processing method for emphasizing three-dimensionality and presence to the audio signal received from the codec (330). For example, when the number of channels is two, the audio processing module (340) can output the audio signal to a speaker without applying the above processing method to the digital data.

[0071] In one embodiment, the audio processing module (340) may process digital data based on a sampling rate. For example, if the sampling rate is a specified first value (e.g., 44.1 kHz), the audio processing module (340) may regard the corresponding digital data as music data. If the digital data is regarded as music data, the audio processing module (340) may output an audio signal received from the codec (330) to a speaker. If the sampling rate is a specified second value (e.g., 48 kHz) that is greater than the first value, the audio processing module (340) may regard the corresponding digital data as audio data included in multimedia (e.g., a movie or a game). If the sampling rate is the second value, the audio processing module (340) may process the audio signal received from the codec (330) to produce dynamic effects in the multimedia. If the sampling rate is greater than or equal to a specified third value (e.g., 96 kHz) that is greater than the second value, the audio processing module (340) may regard the digital data as high-resolution audio data and process the audio signal received from the codec (330) based on the performance of the speaker. For example, if the speaker (350) has a performance lower than a specified standard, the audio processing module (340) may emphasize (e.g., amplify) audio components of a specified low-frequency band (e.g., less than 40 Hz) and a specified high-frequency band (e.g., greater than 16 kHz) in the audio signal received from the codec (330). If the speaker (350) has a performance higher than the specified standard, the audio processing module (340) may output the audio signal received from the codec (330) to the playback device without the above-described emphasis processing.

[0072] In one embodiment, the audio processing module (340) may process digital data based on a bit rate. For example, if the bit rate exceeds 100 kbps, the audio processing module (340) may regard the digital data as audio data compressed with less loss. Accordingly, the audio processing module (340) may output the audio signal received from the codec (330) to a playback device. If the bit rate is 100 kbps or less, the audio processing module (340) may regard the digital data as audio data compressed with relatively more loss. If the bit rate is 100 kbps or less, the audio processing module (340) may perform an operation of restoring audio components in a high-frequency band (e.g., 11 kHz or more) lost in the process of compressing the audio signal, or an operation of attenuating audio components in the high-frequency band and the low-frequency band.

[0073] In one embodiment, the audio processing module (340) may include a DAC (e.g., the DAC (250) of FIG. 2). The DAC may convert a digital audio signal into an analog audio signal and output the signal to the speaker (350). The speaker (350) may convert the received analog audio signal into a sound wave and output the sound. For example, the audio processing module (340) may select a device to play back digital data. The audio processing module (340) may select the speaker (350) of the electronic device (300) as the playback device through the communication module (320) (e.g., a Bluetooth module or a Wi-Fi module).

[0074] The sensor (360) (e.g., the sensor module (176) of FIG. 1) may include at least one of a proximity sensor, a contact sensor, a touch sensor, and an acceleration sensor. The proximity sensor may detect when an external object (e.g., a user's ear) approaches within a predetermined distance of the electronic device (300). The proximity sensor may be implemented as an optical proximity sensor, but is not limited thereto. For example, the proximity sensor may be implemented as any one of a magnetic proximity sensor, an ultrasonic proximity sensor, and an inductive proximity sensor. The contact sensor may detect contact with an external object when the external object is a part of the body. For example, the contact sensor may be implemented as a capacitive type sensor, and may not output a signal corresponding to contact detection when an external object that is not a part of the body makes contact. For example, the contact sensor may be configured as an integrated circuit (IC) integrated with a touch sensor. The touch sensor may receive a user's touch input. For example, a touch sensor may be used as an input means for performing control operations of an electronic device (300) related to audio output. An acceleration sensor may detect the acceleration and intensity of impact of the electronic device (300). For example, the acceleration sensor may be at least one of an inertia sensor and a gyroscope.

[0075] The memory (388) (e.g., the memory (130) of FIG. 1) can store at least one instruction. For example, the memory (388) can store instructions necessary for the operation of the audio processing module (340). The processor (399) (e.g., the processor (120) of FIG. 1) can operate the audio processing module (340) by executing the at least one instruction. For example, the audio processing module (340) can be executed by a processor specialized in audio signal processing (e.g., the auxiliary processor (123) of FIG. 1, or the audio signal processor (240) of FIG. 2).

[0076] Figure 4 illustrates a block configuration of an audio processing module (400) according to one embodiment.

[0077] Referring to FIG. 4, the audio processing module (400) of the present disclosure (e.g., the audio processing module (340) of FIG. 3) can receive an input audio signal from a codec (e.g., the codec (330) of FIG. 3). The input audio signal can include a digital audio signal (e.g., digital data). The audio processing module (400) can process the input audio signal and output it to at least one speaker (e.g., the speaker (350) of FIG. 3).

[0078] The at least one speaker may include a piezo speaker. For example, the piezo speaker may be at least one of a disk piezo speaker, a bass strip piezo speaker, a tweeter piezo speaker, a glass / ceramic piezo speaker, and a plain form piezo speaker. The piezo speaker can output sound by directly driving an internal diaphragm. Accordingly, the piezo speaker may require a high voltage output to drive the diaphragm.

[0079] The audio processing module (400) may include a digital amplifier (410) that amplifies a digital audio signal, a DAC (420) that converts a digital audio signal into an analog audio signal, an analog amplifier (430) that amplifies an analog audio signal, a boost amplifier (440) that boosts an analog audio signal above a reference high voltage, and at least one noise gate (NG) that removes noise included in the analog audio signal.

[0080] The digital amplifier (410) can digitally amplify a digital audio signal by applying a digital gain to the digital audio signal. For example, the digital amplifier (410) can convert an input digital audio signal into a number and amplify the size of the output digital audio signal by adjusting the size of the number multiplied by the digital audio signal.

[0081] The DAC (420) can receive a digital audio signal from the digital amplifier (410) and convert the digital audio signal into an analog audio signal. For example, the DAC (420) can convert the digital audio signal from a binary number into an analog voltage to generate an analog audio signal.

[0082] An analog amplifier (430) can amplify an analog audio signal in an analog manner by applying an analog gain to the analog audio signal. For example, the analog amplifier (430) can amplify the size of an output analog audio signal by adjusting the voltage multiplied by the input analog audio signal.

[0083] The boost amplifier (440) can boost an analog audio signal to a level higher than a reference high voltage. For example, the boost amplifier (440) can generate a high voltage output for driving a piezo speaker by boosting the analog audio signal. The reference high voltage may be a minimum voltage for driving the piezo speaker. For example, the reference high voltage may have a voltage level of 27 V to 33 V.

[0084] At least one noise gate (NG) can remove noise included in an analog audio signal. For example, at least one noise gate (NG) can remove at least one of DAC noise generated by a DAC (420), analog amplifier noise generated by an analog amplifier (430), and boost amplifier noise generated by a boost amplifier (440). At least one noise gate (NG) can output an analog audio signal from which noise has been removed to at least one speaker.

[0085] In one embodiment, the electronic device can perform dynamic range enhancement (DRE) on an input audio signal. DRE can increase the dynamic range of the input audio signal and minimize noise and distortion of the input audio signal. For example, the digital amplifier (410) can apply a positive (+) digital gain to the digital audio signal. For example, the analog amplifier (430) can apply a negative (-) analog gain to the analog audio signal.

[0086] The magnitude of the above digital gain and the magnitude of the above analog gain may be the same. For example, the digital amplifier (410) and the analog amplifier (430) may perform DRE (dynamic range enhancement) by setting the positive (+) digital gain and the negative (-) analog gain so that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB.

[0087] In this way, the electronic device can perform DRE on the input audio signal and remove noise generated during the audio processing process using a noise gate (NG), thereby implementing high-resolution sound with minimized noise.

[0088] FIG. 5 illustrates a block configuration of an audio processing module (500) according to one embodiment.

[0089] Referring to FIG. 5, the audio processing module (500) (e.g., the audio processing module (340) of FIG. 3) may include a digital amplifier (510), a DAC (520), a first noise gate (NG1), an analog amplifier (530), a boost amplifier (540), and a second noise gate (NG2). Similar to the audio processing module (400) of FIG. 4, the digital amplifier (510) and the analog amplifier (530) may perform dynamic range enhancement (DRE) by setting the positive (+) digital gain and the negative (-) analog gain such that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB. In addition, similar to the audio processing module (400) of FIG. 4, the boost amplifier (540) may generate a high voltage output for driving a piezo speaker by boosting an analog audio signal.

[0090] The audio processing module (500) may include a first noise gate (NG1) disposed between the DAC (520) and the analog amplifier (530), and a second noise gate (NG2) disposed between the boost amplifier (540) and at least one speaker. For example, the first noise gate (NG1) may remove DAC noise generated by the DAC (520). For example, the second noise gate (NG2) may remove analog amplifier noise generated by the analog amplifier (530) and boost amplifier noise generated by the boost amplifier (540).

[0091] The first noise gate (NG1) can remove DAC noise generated in the DAC (520) and output an analog audio signal with the DAC noise removed to the analog amplifier (530). The DAC noise may be system noise generated in the process of the DAC (520) converting a digital audio signal into an analog audio signal. For example, the threshold level of the first noise gate (NG1) can be set based on the DAC noise. For example, the first noise gate (NG1) can remove DAC noise as a noise removal signal is input.

[0092] The second noise gate (NG2) can remove analog amplifier noise generated by the analog amplifier (530) and boost amplifier noise generated by the boost amplifier (540), and output an analog audio signal from which the analog amplifier noise and the boost amplifier noise have been removed to at least one speaker. The analog amplifier noise may be noise generated during the process in which the analog audio signal is amplified by the analog amplifier (530). The boost amplifier noise may be noise generated during the process in which the analog audio signal is boosted by the boost amplifier (540).

[0093] For example, the threshold level of the second noise gate (NG2) can be determined by [Formula 1] below.

[0094] [Formula 1]

[0095] TL=(Noise AA ×Gain BA )+Noise BA

[0096] Here, TL is the threshold level of the noise gate, and Noise AA is the above analog amplifier noise, and Gain BA is the boost amplifier (540) gain, and Noise BAmay be the above boost amplifier noise.

[0097] FIG. 6 illustrates a block configuration of an audio processing module (600) according to one embodiment.

[0098] Referring to FIG. 6, the audio processing module (600) (e.g., the audio processing module (340) of FIG. 3) may include a digital amplifier (610), a DAC (620), a first noise gate (NG1), an analog amplifier (630), a third noise gate (NG3), a boost amplifier (640), and a second noise gate (NG2). Similar to the audio processing module (400) of FIG. 4, the digital amplifier (610) and the analog amplifier (630) may perform dynamic range enhancement (DRE) by setting the positive (+) digital gain and the negative (-) analog gain such that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB. In addition, similar to the audio processing module (400) of FIG. 4, the boost amplifier (640) may generate a high voltage output for driving a piezo speaker by boosting an analog audio signal.

[0099] The audio processing module (600) may include a first noise gate (NG1) disposed between the DAC (620) and the analog amplifier (630), a second noise gate (NG2) disposed between the boost amplifier (640) and at least one speaker, and a third noise gate (NG3) disposed between the analog amplifier (630) and the boost amplifier (640). For example, the first noise gate (NG1) may remove DAC noise generated by the DAC (620). For example, the second noise gate (NG2) may remove boost amplifier noise generated by the boost amplifier (640). For example, the third noise gate (NG3) may remove analog amplifier noise generated by the analog amplifier (630).

[0100] The first noise gate (NG1) can remove DAC noise generated in the DAC (620) and output an analog audio signal with the DAC noise removed to the analog amplifier (630). The DAC noise may be system noise generated in the process of the DAC (620) converting a digital audio signal into an analog audio signal. For example, the threshold level of the first noise gate (NG1) can be set based on the DAC noise. For example, the first noise gate (NG1) can remove DAC noise as a noise removal signal is input.

[0101] The third noise gate (NG3) can remove analog amplifier noise generated by the analog amplifier (630) and output an analog audio signal with the analog amplifier noise removed to the boost amplifier (640). The analog amplifier noise may be noise generated during the process of amplifying an analog audio signal by the analog amplifier (630). For example, the threshold level of the third noise gate (NG3) can be set based on the analog amplifier noise.

[0102] The second noise gate (NG2) can remove the boost amplifier noise generated by the boost amplifier (640) and output the analog audio signal with the boost amplifier noise removed to at least one speaker. The boost amplifier noise may be noise generated during the process of the analog audio signal being boosted by the boost amplifier (640). For example, the threshold level of the second noise gate (NG2) can be set based on the boost amplifier noise.

[0103] Figure 7 illustrates a block configuration of an audio processing module (700) according to one embodiment.

[0104] Referring to FIG. 7, the audio processing module (700) (e.g., the audio processing module (340) of FIG. 3) may include a digital amplifier (710), a DAC (720), a first noise gate (NG1), a boost amplifier (730), an analog amplifier (740), and a second noise gate (NG2). Similar to the audio processing module (400) of FIG. 4, the digital amplifier (710) and the analog amplifier (740) may perform dynamic range enhancement (DRE) by setting the positive (+) digital gain and the negative (-) analog gain such that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB. In addition, similar to the audio processing module (400) of FIG. 4, the boost amplifier (730) may generate a high voltage output for driving a piezo speaker by boosting an analog audio signal.

[0105] Meanwhile, unlike the audio processing module (400) of FIG. 4, the audio processing module (700) of FIG. 7 can perform amplification on the boosted analog audio signal after boosting is performed on the analog audio signal to generate a high voltage output.

[0106] In this case, in order to perform amplification of the boosted analog audio signal, a higher power supply voltage may be required for the analog amplifier (740) compared to the audio processing module (400) of FIG. 4.

[0107] Figure 8 illustrates a block configuration of an audio processing module (800) according to one embodiment.

[0108] Referring to FIG. 8, an audio processing module (800) (e.g., the audio processing module (340) of FIG. 3) may include a digital amplifier (810), a DAC (820), a first noise gate (NG1), a boost amplifier (830), an analog amplifier (840), and a second noise gate (NG2). The audio processing module (800) of FIG. 8, similar to the audio processing module (700) of FIG. 7, may perform amplification on the boosted analog audio signal after boosting is performed on the analog audio signal to generate a high voltage output.

[0109] Meanwhile, as shown in FIG. 8, the boost amplifier (830) may include at least two sub-amplifiers (e.g., Sub-Amp1, Sub-Amp2, Sub-Amp3, …, Sub-AmpN). The at least two sub-amplifiers may be arranged in parallel with each other within the boost amplifier (830). Based on the at least two sub-amplifiers being connected in parallel with each other, the signal-to-noise ratio (SNR) of the analog audio signal boosted by the boost amplifier (830) may increase.

[0110] Specifically, analog audio signals boosted by at least two sub-amplifiers may be correlated. For example, an analog audio signal boosted by N sub-amplifiers connected in parallel may be increased by N times. On the other hand, boost amplifier noise generated by at least two sub-amplifiers may be uncorrelated. For example, boost amplifier noise generated by N sub-amplifiers connected in parallel may be can be increased by a factor of two. In this way, the signal-to-noise ratio of the analog audio signal can be increased based on the correlation difference between the analog audio signal and the boost amplifier noise in the N sub-amplifiers connected in parallel.

[0111] FIG. 9 illustrates a block configuration of an audio processing module (900) according to one embodiment.

[0112] Referring to FIG. 9, an audio processing module (900) (e.g., audio processing module (340) of FIG. 3) may include a bit-depth converter (910), a DAC (920), a first noise gate (NG1), an analog amplifier (930), and a second noise gate (NG2). The audio processing module (900) may include a bit-depth converter (910) in which the digital amplifier and the boost amplifier are integrated.

[0113] The bit depth converter (910) and the analog amplifier (930) can perform DRE (dynamic range enhancement) by setting the positive (+) digital gain and the negative (-) analog gain so that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB.

[0114] In addition, the bit depth converter (910) can generate a high voltage output for driving a piezo speaker by boosting a digital audio signal. For example, the bit depth converter (910) can increase the digital gain by changing the bit depth of the digital audio signal. For example, the bit depth converter (910) can output a digital audio signal (e.g., 32-bit float) by increasing the bit depth of an input audio signal (e.g., 24-bit fixed). As the bit depth increases, headroom is secured, so the digital audio signal (e.g., 32-bit float) is prevented from overflowing, and a high digital gain can be applied.

[0115] FIG. 10 illustrates a block configuration of an audio processing module (1000) according to one embodiment.

[0116] Referring to FIG. 10, the audio processing module (1000) (e.g., the audio processing module (340) of FIG. 3) may include a digital amplifier (1010), a DAC (1020), a first noise gate (NG1), an analog amplifier (1030), a boost amplifier (1040), and a second noise gate (NG2). Similar to the audio processing module (400) of FIG. 4, the digital amplifier (1010) and the analog amplifier (1030) may perform dynamic range enhancement (DRE) by setting the positive (+) digital gain and the negative (-) analog gain such that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB. In addition, similar to the audio processing module (400) of FIG. 4, the boost amplifier (1040) may generate a high voltage output for driving a piezo speaker by boosting an analog audio signal.

[0117] In one embodiment, the DAC (1020) may be implemented as a multi-DAC to separately process at least two channels. For example, the DAC (1020) may be implemented as a two-DAC (1020) to separately process the left channel and the right channel.

[0118] In one embodiment, the at least one speaker may be implemented as a 2-way speaker. For example, the at least one speaker may include a coil speaker operating as a woofer and a piezo speaker operating as a tweeter. An analog audio signal output from an analog amplifier (1030) may be branched and output to at least one of the coil speaker and the piezo speaker. The coil speaker may receive a first analog audio signal amplified by the analog amplifier (1030). The piezo speaker may receive a second analog audio signal in which the first analog audio signal is boosted to a voltage higher than the reference high voltage by the boost amplifier (1040) and analog amplifier noise generated by the analog amplifier (1030) and the boost amplifier noise generated by the boost amplifier (1040) are removed by a second noise gate (NG2).

[0119] Fig. 11 illustrates a sound output method using an electronic device according to one embodiment. For example, the sound output method illustrated in Fig. 11 may be implemented based on the electronic device (101) of Fig. 1.

[0120] According to an example, in operation 1110 of the sound output method, a digital amplifier (e.g., a digital amplifier (410) of FIG. 4) can digitally amplify a digital audio signal by applying a digital gain to the digital audio signal. For example, the digital amplifier can convert an input digital audio signal into a number and amplify the size of an output digital audio signal by adjusting the size of a number multiplied by the digital audio signal.

[0121] According to an example, in operation 1120 of the sound output method, a DAC (e.g., DAC (420) of FIG. 4) may receive a digital audio signal from a digital amplifier (e.g., digital amplifier (410) of FIG. 4) and convert the digital audio signal into an analog audio signal. For example, the DAC may convert the digital audio signal from a binary number into an analog voltage to generate an analog audio signal.

[0122] According to an example, in operation 1130 of the sound output method, an analog amplifier (e.g., an analog amplifier (430) of FIG. 4) can amplify an analog audio signal in an analog manner by applying an analog gain to the analog audio signal. For example, the analog amplifier can amplify the size of an output analog audio signal by adjusting a voltage multiplied by an input analog audio signal.

[0123] In one embodiment, the audio output method can perform dynamic range enhancement (DRE) on an input audio signal. DRE can increase the dynamic range of the input audio signal and minimize noise and distortion of the input audio signal. For example, the operation of amplifying the digital audio signal can apply a positive (+) digital gain to the digital audio signal. For example, the operation of amplifying the analog audio signal can apply a negative (-) analog gain to the analog audio signal.

[0124] The operation of amplifying the above digital audio signal and the operation of amplifying the above analog audio signal can perform DRE (dynamic range enhancement) by setting the positive (+) digital gain and the negative (-) analog gain so that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB.

[0125] In one example, in operation 1140 of the sound output method, a boost amplifier (e.g., the boost amplifier (440) of FIG. 4) may boost an analog audio signal to a reference high voltage or higher. For example, the boost amplifier may generate a high voltage output for driving a piezo speaker by boosting the analog audio signal. The reference high voltage may be a minimum voltage for driving the piezo speaker.

[0126] According to an example, in operation 1150 of the sound output method, at least one noise gate (e.g., the noise gate (NG) of FIG. 4) can remove noise included in an analog audio signal. For example, the at least one noise gate can remove at least one of DAC noise generated by a DAC, analog amplifier noise generated by an analog amplifier, and boost amplifier noise generated by a boost amplifier. The at least one noise gate can output the analog audio signal from which noise has been removed to at least one speaker.

[0127] In one example, in operation 1160 of the audio output method, the audio processing module may output an analog audio signal to at least one speaker. The at least one speaker may include a piezo speaker. For example, the audio processing module may output a high voltage output of the boosted analog audio signal to the at least one piezo speaker.

[0128] At least one speaker can output sound based on an analog audio signal. For example, at least one piezo speaker can receive a high-voltage output of a boosted analog audio signal from an audio processing module and output high-resolution sound to the user based on the analog audio signal.

[0129] In this way, the electronic device for outputting sound of the present disclosure and the sound output method using the same perform DRE (dynamic range enhancement) on an input audio signal and remove noise generated during audio processing using a noise gate, thereby enabling the implementation of high-resolution sound with minimized noise.

[0130] In addition, the electronic device for outputting sound of the present disclosure and the sound output method using the same can drive a piezo speaker requiring high voltage output by boosting an input audio signal above a reference high voltage.

[0131] However, since this has been described above, a duplicate explanation will be omitted.

[0132] FIG. 12A illustrates a block diagram of a wearable electronic device according to one embodiment.

[0133] Referring to FIG. 12A, a wearable electronic device (1200) may include a first wireless earphone (1200-1) and a second wireless earphone (1200-2). The first wireless earphone (1200-1) and the second wireless earphone (1200-2) may include substantially the same or similar configurations. The first wireless earphone (1200-1) and the second wireless earphone (1200-2) may perform substantially the same or similar functions. The wearable electronic device (1200) may include at least some of the components included in the electronic device (101) disclosed in FIG. 1. For example, the wearable electronic device (1200) may include the audio module (170) of FIG. 1.

[0134] In one embodiment, the first wireless earphone (1200-1) may include a first speaker (1220-1), a first microphone (1230-1), a first sensor module (1276-1), a first processor (1260-1), and / or a first communication module (1290-1).

[0135] In one embodiment, the second wireless earphone (1200-2) may include a second speaker (1220-2), a second microphone (1230-2), a second sensor module (1276-2), a second processor (1260-2), and / or a second communication module (1290-2).

[0136] In one embodiment, a wearable electronic device (1200) (e.g., a first wireless earphone (1200-1) and / or a second wireless earphone (1200-2)) is operatively connected to an electronic device (e.g., an electronic device (101) of FIG. 1) via wireless communication, and can transmit and / or receive various information.

[0137] According to various embodiments, the first speaker (1220-1) and / or the second speaker (1220-2) may include the audio output module (155) of FIG. 1. The first microphone (1230-1) and / or the second microphone (1230-2) may include the input module (150) of FIG. 1. The first sensor module (1276-1) and / or the second sensor module (1276-2) may include the sensor module (176) of FIG. 1. The first processor (1260-1) and / or the second processor (1260-2) may include the processor (120) of FIG. 1. The first communication module (1290-1) and / or the second communication module (1290-2) may include the communication module (190) of FIG. 1. For example, the first speaker (1220-1) may include at least one of a tweeter speaker and a coil speaker. For example, the second speaker (1220-2) may include at least one of a tweeter speaker and a coil speaker.

[0138] In one embodiment, the first speaker (1220-1) and / or the second speaker (1220-2) can generate analog sound based on an input signal (e.g., an acoustic signal and / or an audio signal) input to the wearable electronic device (1200). The first speaker (1220-1) and / or the second speaker (1220-2) can output the analog sound to the user through a speaker hole.

[0139] In one embodiment, the first microphone (1230-1) and / or the second microphone (1230-2) can receive sounds (e.g., sound signals and / or audio signals) generated in the vicinity of the wearable electronic device (1200). The first microphone (1230-1) and / or the second microphone (1230-2) can convert sounds input through a sound hole (e.g., sound hole (1255) of FIG. 12B) into electrical signals. The first microphone (1230-1) can transmit the converted electrical signals to the first processor (1260-1), and the second microphone (1230-2) can transmit the converted electrical signals to the second processor (1260-2).

[0140] In one embodiment, the first sensor module (1276-1) and / or the second sensor module (1276-2) can detect a rotational direction, a rotational speed, and / or a rotational angle of the wearable electronic device (1200). The first sensor module (1276-1) and / or the second sensor module (1276-2) can include a gyro sensor (e.g., a rotation detection sensor) and / or an acceleration sensor. For example, the gyro sensor (e.g., a rotation detection sensor) can measure signals related to angular velocity and / or angle acting with respect to each axis of the wearable electronic device (1200). For example, the gyro sensor (e.g., a rotation detection sensor) can measure the amount of change in rotational angle per unit of time of the roll, pitch, and yaw axes around a reference axis. For example, the acceleration sensor can measure signals related to acceleration of the wearable electronic device (1200). For example, an acceleration sensor can measure the rotation angles of the roll, pitch, and yaw axes around a reference axis.

[0141] In one embodiment, the first communication module (1290-1) and / or the second communication module (1290-2) may communicate with the electronic device (101) and / or the external electronic device (102, 104, 108) of FIG. 1 through a network (e.g., the first network (198) and / or the second network (199) of FIG. 1) to receive and / or transmit various information.

[0142] In one embodiment, the first processor (1260-1) may be electrically connected to the first communication module (1290-1), and the second processor (1260-2) may be electrically connected to the second communication module (1290-2). The first processor (1260-1) may process various information received from the electronic device (101) and / or the external electronic device (102, 104, 108) through the first communication module (1290-1). The second processor (1260-2) may process various information received from the electronic device (101) and / or the external electronic device (102, 104, 108) through the second communication module (1290-2). The first processor (1260-1) can transmit various information to the electronic device (101) and / or external electronic devices (102, 104, 108) through the first communication module (1290-1). The second processor (1260-2) can transmit various information to the electronic device (101) and / or external electronic devices (102, 104, 108) through the second communication module (1290-2).

[0143] In one embodiment, a first processor (1260-1) may be operatively or electrically connected to a first speaker (1220-1), a first microphone (1230-1), a first sensor module (1276-1), and a first communication module (1290-1). A second processor (1260-2) may be operatively or electrically connected to a second speaker (1220-2), a second microphone (1230-2), a second sensor module (1276-2), and a second communication module (1290-2).

[0144] FIG. 12b illustrates an external configuration of a wearable electronic device according to one embodiment, and FIG. 12c illustrates an internal configuration of a wearable electronic device according to one embodiment.

[0145] In one embodiment, the wearable electronic device (1200) disclosed in FIGS. 12B and 12C may be the first wireless earphone (1200-1) or the second wireless earphone (1200-2) disclosed in FIG. 12A. In addition, the wearable electronic device (1200) disclosed in FIGS. 12B and 12C may substantially identically include the embodiments described in the first wireless earphone (1200-1) or the second wireless earphone (1200-2) disclosed in FIG. 12A.

[0146] In one embodiment, a wearable electronic device (1200) is worn on a user's ear and can output sound of music or a video or process the user's voice. In one embodiment, the wearable electronic device (1200) can operate independently in a stand-alone manner or can operate in conjunction with an external electronic device (e.g., the electronic device (101), electronic devices (102, 104) and / or server (108) of FIG. 1) in an interaction manner. For example, when the wearable electronic device (1200) operates in a stand-alone manner, the wearable electronic device (1200) can output sound corresponding to music or a video being played on its own or receive and process the user's voice. For example, when the wearable electronic device (1200) operates through an interaction method, the wearable electronic device (1200) can be paired with an electronic device such as a smart phone (e.g., the electronic device (101) of FIG. 1) through Bluetooth communication, and can convert data received from the electronic device (e.g., the electronic device (101) of FIG. 1) to output sound or receive a user's voice and transmit it to the electronic device (e.g., the electronic device (101) of FIG. 1).

[0147] Referring to FIGS. 12B and 12C , a wearable electronic device (1200) (e.g., a first wireless earphone (1200-1) and / or a second wireless earphone (1200-2)) may include a housing (1210), a speaker (1220) (e.g., a first speaker (1220-1) or a second speaker (1220-2)), a microphone (1230) (e.g., a first microphone (1230-1) or a second microphone (1230-2)), a printed circuit board (1240), a sound hole cover (1250), a sensor module (1276) (e.g., a first sensor module (1276-1) or a second sensor module (1276-2)), and / or a battery (1280).

[0148] According to various embodiments, the wearable electronic device (1200) is not limited to the configuration described above and may further include various other components.

[0149] In one embodiment, the housing (1210) can house and protect a speaker (1220) (e.g., a first speaker (1220-1) or a second speaker (1220-2)), a microphone (1230) (e.g., a first microphone (1230-1) or a second microphone (1230-2)), a printed circuit board (1240), and / or a sensor module (1276) (e.g., a first sensor module (1276-1) or a second sensor module (1276-2)). The housing (1210) can include a first housing (1210a) (e.g., an upper housing) and a second housing (1210b) (e.g., a lower housing). The first housing (1210a) (e.g., an upper housing) and the second housing (1210b) (e.g., a lower housing) can be removably coupled. The first housing (1210a) (e.g., upper housing) and the second housing (1210b) (e.g., lower housing) may be formed integrally.

[0150] In one embodiment, the housing (1210) may include a protrusion (1211) for insertion into a user's ear. The housing (1210) may be integrally connected with the protrusion (1211). The protrusion (1211) may form a portion of the housing (1210). For example, the protrusion (1211) may protrude outwardly from a portion of the housing (1210) in a substantially cylindrical shape. The protrusion (1211) may include a sound hole (1255) therein. For example, the sound hole (1255) may include a speaker hole (not shown) communicating with a speaker (1220) (e.g., a first speaker (1220-1) or a second speaker (1220-2)) and / or a microphone hole (not shown) communicating with a microphone (1230) (e.g., a first microphone (1230-1) or a second microphone (1230-2)). In one embodiment, the speaker hole (not shown) and the microphone hole (not shown) may be physically separated by a partition. In various embodiments, the speaker hole (not shown) and the microphone hole (not shown) may not be separated by the partition.

[0151] In one embodiment, the speaker (1220) (e.g., the first speaker (1220-1) or the second speaker (1220-2)) can convert an electrical signal into sound (e.g., an audio signal) and output the converted sound through the sound hole (1255). The speaker (1220) can receive an electrical signal from a processor (e.g., the first processor (1260-1) or the second processor (1260-2)) disposed on the printed circuit board (1240). In one embodiment, the speaker (1220) (e.g., the first speaker (1220-1) or the second speaker (1220-2)) can be configured in a cylindrical shape. The speaker (1220) (e.g., the first speaker (1220-1) or the second speaker (1220-2)) can be electrically connected to the printed circuit board (1240).

[0152] For example, as shown in FIG. 12c, a speaker (1220) (e.g., a first speaker (1220-1) or a second speaker (1220-2)) may include at least one of a tweeter speaker (1220a) and a woofer speaker (1220b). The tweeter speaker (1220a) is a speaker unit that outputs high-frequency sounds and may be responsible for the high-frequency range of the speaker. For example, the tweeter speaker (1220a) may have a small diaphragm, a narrow range of vibration, and may emphasize high-frequency output. The woofer speaker (1220b) is a large speaker unit that outputs low-frequency sounds and may be responsible for the low-frequency range of the speaker. For example, the woofer speaker (1220b) may have a large diaphragm, a wide range of vibration, and may emphasize low-frequency output.

[0153] In one embodiment, at least one of the tweeter speaker (1220a) and the woofer speaker (1220b) may be implemented as a piezo speaker (e.g., the speaker (SPK) of FIG. 4). For example, at least one of the tweeter speaker (1220a) and the woofer speaker (1220b) may be at least one of a disk piezo speaker, a bass strip piezo speaker, a tweeter piezo speaker, a glass / ceramic piezo speaker, and a plain form piezo speaker. For example, the piezo speaker (e.g., the speaker (SPK) of FIG. 4) may be the tweeter speaker (1220a) that outputs high-frequency sounds and may be responsible for the high-frequency range. For example, a piezo speaker (e.g., speaker (SPK) of FIG. 4) may be a woofer speaker (1220b) that outputs low-frequency sounds and may be responsible for the low-frequency range. For example, a piezo speaker (e.g., speaker (SPK) of FIG. 4) may be an integrated speaker that outputs both high-frequency sounds and low-frequency sounds and may be responsible for both high-frequency sounds and low-frequency sounds.

[0154] In one embodiment, the microphone (1230) (e.g., the first microphone (1230-1) or the second microphone (1230-2)) can convert sound input through the sound hole (1255) into an electrical signal. The microphone (1230) (e.g., the first microphone (1230-1) or the second microphone (1230-2)) can transmit the converted electrical signal to a processor (e.g., the first processor (1260-1) or the second processor (1260-2)) disposed on the printed circuit board (1240). In one embodiment, the microphone (1230) (e.g., the first microphone (1230-1) or the second microphone (1230-2)) can include at least one external microphone and / or at least one internal microphone. For example, referring to FIG. 12a, at least one external microphone may be positioned on an exterior surface of a housing (1210) (e.g., a first housing (1210a)). For example, at least one internal microphone may be positioned adjacent to a printed circuit board (1240) within the housing (1210).

[0155] In one embodiment, a processor (e.g., a first processor (1260-1) or a second processor (1260-2)) may be disposed on a printed circuit board (1240). The processor (e.g., the first processor (1260-1) or the second processor (1260-2)) may be electrically connected to a speaker (1220), a microphone (1230), and a sensor module (1276). The processor (e.g., the first processor (1260-1) or the second processor (1260-2)) may process signals related to the speaker (1220), the microphone (1230), and the sensor module (1276). The printed circuit board (1240) may include a flexible printed circuit board.

[0156] In one embodiment, a sound hole cover (1250) may be placed at an end of a protrusion (1211). The sound hole cover (1250) may cover an end of the protrusion (1211). The housing (1210) may prevent foreign substances from entering the interior of the sound hole (1255) through the sound hole cover (1250). The sound hole cover (1250) may include at least one hole to allow sound to enter and exit through the sound hole (1255). According to one embodiment, the sound hole cover (1250) may include a grill mesh.

[0157] In one embodiment, a sensor module (1276) (e.g., a first sensor module (1276-1) or a second sensor module (1276-2)) may be electrically connected to a processor (e.g., a first processor (1260-1) or a second processor (1260-2)) disposed on a printed circuit board (1240). The sensor module (1276) (e.g., a first sensor module (1276-1) or a second sensor module (1276-2)) may detect a rotational direction, a rotational speed, and / or a rotational angle of the wearable electronic device (1200). For example, the sensor module (1276) (e.g., a first sensor module (1276-1) or a second sensor module (1276-2)) may include a gyro sensor (e.g., a rotation detection sensor) and / or an acceleration sensor.

[0158] In one embodiment, the battery (1280) may power at least one component of the wearable electronic device (1200), such as a speaker (1220), a microphone (1230), a printed circuit board (1240), or a sensor module (1276). For example, the battery (1280) may include at least one of a rechargeable secondary battery and a fuel cell.

[0159] FIG. 13 illustrates a wearable device (1320) electrically connected to an electronic device (1310) according to one embodiment.

[0160] Referring to FIG. 13, an electronic device (1310) and at least one wearable device (1320) can perform data communication.

[0161] An electronic device (1310) can generate input data and output the input data to at least one wearable device (1320). For example, the input data may include an input audio signal. For example, the electronic device (1310) may be at least one of a smartphone, a tablet PC, a camera, a television, a home system control device, and a car.

[0162] At least one wearable device (1320) can perform a predetermined function based on input data received from the electronic device (1310). For example, at least one wearable device (1320) can generate an analog audio signal based on an input audio signal received from the electronic device (1310) and output a sound based on the analog audio signal. For example, at least one wearable device (1320) can include at least one of smart earphones (1321), a smart watch (1322), smart glasses (1323), and a smart ring (1324).

[0163] According to an example, at least one wearable device (1320) may include an audio processing module (e.g., an audio processing module (400) of FIG. 4) and a speaker (e.g., a speaker (SPK) of FIG. 4). For example, at least one wearable device (1320) may include at least one of a digital amplifier that amplifies a digital audio signal, a DAC that converts a digital audio signal into an analog audio signal, an analog amplifier that amplifies an analog audio signal, a boost amplifier that boosts an analog audio signal above a reference high voltage, and at least one noise gate that removes noise included in the analog audio signal. For example, the speaker may include a piezo speaker.

[0164] Accordingly, at least one wearable device (1320) can perform DRE on an input audio signal and remove noise generated during audio processing using a noise gate, thereby implementing high-resolution sound with minimized noise.

[0165] An electronic device (e.g., electronic device (101) of FIG. 1) for outputting sound according to embodiments of the present disclosure may include a memory (e.g., memory (130) of FIG. 1) for storing at least one command, a processor (e.g., processor (120) of FIG. 1) for executing the at least one command, at least one speaker (e.g., sound output module (155) of FIG. 1), and an audio processing module (e.g., audio module (170) of FIG. 1) for processing an input audio signal and outputting the same to the at least one speaker. The audio processing module may include a digital amplifier (e.g., a digital amplifier (410) of FIG. 4) for amplifying a digital audio signal, a DAC (e.g., a DAC (420) of FIG. 4) for converting the digital audio signal into an analog audio signal, an analog amplifier (e.g., an analog amplifier (430) of FIG. 4) for amplifying the analog audio signal, a boost amplifier (e.g., a boost amplifier (440) of FIG. 4) for boosting the analog audio signal to a voltage higher than a reference high voltage, and at least one noise gate (e.g., a noise gate (NG) of FIG. 4) for removing noise included in the analog audio signal. The digital amplifier may apply a positive (+) digital gain to the digital audio signal. The analog amplifier may apply a negative (-) analog gain to the analog audio signal.

[0166] In one embodiment, the digital amplifier and the analog amplifier can perform dynamic range enhancement (DRE) by setting the positive (+) digital gain and the negative (-) analog gain so that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB.

[0167] In one embodiment, the at least one speaker may comprise a piezo speaker. The reference high voltage may be a minimum voltage for driving the piezo speaker.

[0168] In one embodiment, the at least one noise gate can remove analog amplifier noise generated by the analog amplifier and boost amplifier noise generated by the boost amplifier.

[0169] In one embodiment, the threshold level of at least one noise gate may be determined by [Formula 1] below.

[0170] [Formula 1]

[0171] TL=(Noise AA ×Gain BA )+Noise BA

[0172] (However, here, TL is the threshold level of at least one noise gate, and Noise AA is the above analog amplifier noise, and Gain BA is the boost amplifier gain, and Noise BA is the above boost amplifier noise.)

[0173] In one embodiment, the at least one noise gate can remove DAC noise generated by the DAC.

[0174] In one embodiment, the at least one noise gate may include a first noise gate disposed between the DAC and the analog amplifier and configured to remove DAC noise generated by the DAC, and a second noise gate disposed between the boost amplifier and the at least one speaker and configured to remove analog amplifier noise and boost amplifier noise.

[0175] In one embodiment, the at least one noise gate may include a first noise gate disposed between the DAC and the analog amplifier and removing DAC noise generated by the DAC, a second noise gate disposed between the boost amplifier and the at least one speaker and removing boost amplifier noise, and a third noise gate disposed between the analog amplifier and the boost amplifier and removing analog amplifier noise.

[0176] In one embodiment, the at least one noise gate may include a first noise gate disposed between the DAC and the boost amplifier and configured to remove DAC noise generated by the DAC, and a second noise gate disposed between the analog amplifier and the at least one speaker and configured to remove boost amplifier noise and analog amplifier noise.

[0177] In one embodiment, the boost amplifier may include at least two sub-amplifiers. Based on the at least two sub-amplifiers being connected in parallel with each other, the signal-to-noise ratio of the analog audio signal boosted by the boost amplifier may increase.

[0178] In one embodiment, the audio processing module may include a bit-depth converter that integrates the digital amplifier and the boost amplifier. The bit-depth converter may increase the digital gain by changing the bit depth of the digital audio signal.

[0179] In one embodiment, the at least one speaker may include a coil speaker and a piezo speaker. The coil speaker may receive a first analog audio signal amplified by the analog amplifier. The piezo speaker may receive a second analog audio signal in which the first analog audio signal is boosted by the boost amplifier to a voltage higher than the reference high voltage.

[0180] An audio processing module (e.g., an audio processing module (400) of FIG. 4) that processes an input audio signal according to embodiments of the present disclosure and outputs the signal to at least one speaker may include a digital amplifier (e.g., a digital amplifier (410) of FIG. 4) that amplifies a digital audio signal, a DAC (e.g., a DAC (420) of FIG. 4) that converts the digital audio signal into an analog audio signal, an analog amplifier (e.g., an analog amplifier (430) of FIG. 4) that amplifies the analog audio signal, a boost amplifier (e.g., a boost amplifier (440) of FIG. 4) that boosts the analog audio signal to a voltage higher than a reference high voltage, and at least one noise gate (e.g., a noise gate (NG) of FIG. 4) that removes noise included in the analog audio signal. The digital amplifier may apply a positive (+) digital gain to the digital audio signal. The analog amplifier may apply a negative (-) analog gain to the analog audio signal.

[0181] In one embodiment, the digital amplifier and the analog amplifier can perform dynamic range enhancement (DRE) by setting the positive (+) digital gain and the negative (-) analog gain so that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB.

[0182] In one embodiment, the at least one speaker may include a piezo speaker. The reference high voltage may be a minimum voltage for driving the piezo speaker.

[0183] In one embodiment, the at least one noise gate can remove analog amplifier noise generated by the analog amplifier and boost amplifier noise generated by the boost amplifier.

[0184] An audio output method according to embodiments of the present disclosure may include an operation of amplifying a digital audio signal, an operation of converting the digital audio signal into an analog audio signal, an operation of amplifying the analog audio signal, an operation of boosting the analog audio signal to a voltage higher than a reference high voltage, an operation of removing noise included in the analog audio signal, and an operation of outputting the analog audio signal to at least one speaker. The operation of amplifying the digital audio signal may apply a positive (+) digital gain to the digital audio signal. The operation of amplifying the analog audio signal may apply a negative (-) analog gain to the analog audio signal.

[0185] In one embodiment, the operation of amplifying the digital audio signal and the operation of amplifying the analog audio signal can perform dynamic range enhancement (DRE) by setting the positive (+) digital gain and the negative (-) analog gain so that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB.

[0186] In one embodiment, the at least one speaker may comprise a piezo speaker. The reference high voltage may be a minimum voltage for driving the piezo speaker.

[0187] In one embodiment, the operation of removing noise included in the analog audio signal can remove analog amplifier noise generated by the analog amplifier and boost amplifier noise generated by the boost amplifier.

[0188] The various embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. For example, a component expressed in the singular should be understood to include a concept including plural components unless the context clearly indicates only the singular. It should be understood that the term "and / or" used in this document encompasses any and all possible combinations of one or more of the listed items. The terms "comprise," "have," "consist of," and the like used in this disclosure are intended to specify only the presence of a feature, component, part, or combination thereof described in this disclosure, and the use of such terms does not exclude the presence or addition of one or more other features, components, parts, or combinations thereof. In this document, phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish the corresponding component from other corresponding components and do not limit the corresponding components in any other respect (e.g., importance or order).

[0189] The term "part" or "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. The "part" or "module" may be an integrally formed component or a minimum unit or part of the component that performs one or more functions. For example, according to one embodiment, the "part" or "module" may be implemented in the form of an application-specific integrated circuit (ASIC).

[0190] The term “if” as used in various embodiments of this document may be interpreted to mean “when”, “when”, “in response to determining”, or “in response to detecting”, depending on the context. Similarly, “if it is determined that” or “if ~ is detected” may be interpreted to mean “upon determining”, “in response to determining”, or “upon detecting”, or “in response to detecting”, depending on the context.

[0191] The program executed by the electronic device (200) described in this document may be implemented as hardware components, software components, and / or a combination of hardware components and software components. The program may be executed by any system capable of executing computer-readable instructions.

[0192] Software may include a computer program, code, instructions, or a combination of one or more of these, which can configure a processing device to perform a desired operation or command the processing device, either independently or collectively. Software may be implemented as a computer program including instructions stored on a computer-readable storage medium. Examples of the computer-readable storage medium include magnetic storage media (e.g., read-only memory (ROM), random-access memory (RAM), floppy disks, hard disks, etc.) and optical reading media (e.g., CD-ROMs, digital versatile discs (DVDs)). The computer-readable storage medium may be distributed across network-connected computer systems so that the computer-readable code can be stored and executed in a distributed manner. Computer programs can be distributed online (e.g., by download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0193] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an audio processing module (400) that processes an input audio signal and outputs it to at least one speaker, A digital amplifier (410) that amplifies digital audio signals; A DAC (420) that converts the above digital audio signal into an analog audio signal; An analog amplifier (430) that amplifies the above analog audio signal; A boost amplifier (440) that boosts the above analog audio signal to a reference high voltage or higher; and At least one noise gate (NG) for removing noise included in the above analog audio signal, The above digital amplifier, Applying a positive (+) digital gain to the above digital audio signal, The above analog amplifier, Applying a negative (-) analog gain to the above analog audio signal, Audio processing module.

2. In paragraph 1, The above digital amplifier and the above analog amplifier, By setting the positive (+) digital gain and the negative (-) analog gain so that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB, DRE (dynamic range enhancement) is performed. Audio processing module.

3. In any one of the above-mentioned clauses, At least one of the above noise gates, Remove analog amplifier noise generated from the above analog amplifier and boost amplifier noise generated from the above boost amplifier, To remove DAC noise generated from the above DAC, Audio processing module.

4. In paragraph 3, The threshold level of at least one of the above noise gates is determined by [Formula 1] below: Audio processing module. [Formula 1] TL=(Noise AA ×Gain BA )+Noise BA (Wherein, TL is the threshold level of at least one noise gate, and Noise AA is the above analog amplifier noise, and Gain BA is the boost amplifier gain, and Noise BA is the above boost amplifier noise.) 5. In any one of the above-mentioned clauses, At least one of the above noise gates, A first noise gate disposed between the DAC and the analog amplifier and removing DAC noise generated by the DAC; and A second noise gate disposed between the boost amplifier and the at least one speaker, the second noise gate removing analog amplifier noise and boost amplifier noise. Audio processing module.

6. In any one of the above-mentioned clauses, At least one of the above noise gates, A first noise gate disposed between the DAC and the analog amplifier and removing DAC noise generated by the DAC; A second noise gate disposed between the boost amplifier and the at least one speaker and removing boost amplifier noise; and A third noise gate is disposed between the analog amplifier and the boost amplifier and includes a third noise gate for removing analog amplifier noise. Audio processing module.

7. In any one of the above-mentioned clauses, At least one of the above noise gates, A first noise gate disposed between the DAC and the boost amplifier and removing DAC noise generated by the DAC; and A second noise gate disposed between the analog amplifier and the at least one speaker, the second noise gate removing the boost amplifier noise and the analog amplifier noise. Audio processing module.

8. In paragraph 7, The above boost amplifier comprises at least two sub-amplifiers, Based on the fact that at least two sub-amplifiers are connected in parallel with each other, the signal to noise ratio of the analog audio signal boosted by the boost amplifier increases. Audio processing module.

9. In any one of the preceding clauses, The above audio processing module, Further comprising a bit-depth converter incorporating the above digital amplifier and the above boost amplifier, The above bit depth converter is, By changing the bit depth of the above digital audio signal, the digital gain is increased. Audio processing module.

10. In an electronic device that outputs sound, Memory that stores at least one instruction; A processor executing at least one instruction of the above; at least one speaker; and An audio processing module comprising any one of the preceding clauses, Electronic devices.

11. In paragraph 10, The at least one speaker comprises a coil speaker and a piezo speaker, The above reference high voltage is the minimum voltage for driving the piezo speaker, The above coil speaker receives a first analog audio signal amplified by the above analog amplifier, The above piezo speaker receives a second analog audio signal in which the first analog audio signal is boosted above the reference high voltage by the boost amplifier. Electronic devices.

12. In the method of outputting sound, An operation for amplifying a digital audio signal (1110); An operation (1120) of converting the above digital audio signal into an analog audio signal; An operation of amplifying the above analog audio signal (1130); An operation (1140) of boosting the above analog audio signal above the reference high voltage; An operation for removing noise included in the above analog audio signal (1150); and Including an operation (1160) of outputting the above analog audio signal to at least one speaker, The operation of amplifying the above digital audio signal is: Applying a positive (+) digital gain to the above digital audio signal, The operation of amplifying the above analog audio signal is: Applying a negative (-) analog gain to the above analog audio signal, method.

13. In paragraph 12, The operation of amplifying the above digital audio signal and the operation of amplifying the above analog audio signal are, By setting the positive (+) digital gain and the negative (-) analog gain so that the total gain of the positive (+) digital gain and the negative (-) analog gain becomes 0 dB, DRE (dynamic range enhancement) is performed. method.

14. In paragraph 12 or 13, wherein at least one speaker comprises a piezo speaker, The above reference high voltage is the minimum voltage for driving the piezo speaker. method.

15. In paragraph 12, paragraph 13, or paragraph 14, The operation of removing noise included in the above analog audio signal is: Removing analog amplifier noise generated from the above analog amplifier and boost amplifier noise generated from the above boost amplifier. method.

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