Component using anodic oxide film, and method for manufacturing same

Abstract

The present invention provides: a component using an anodic oxide film in which the pores of the anodic oxide film are prevented from opening during a photoresist process so that foreign substances of the photoresist do not enter the pores during a subsequent process for forming a specific material inside the pores; and a method for manufacturing same.

Description

Components using anodic oxide film and their manufacturing method

[0001] The present invention relates to a component using an anodic oxide film and a method for manufacturing the same.

[0002] FIG. 1a and FIG. 1b are drawings illustrating an anodic oxide film (10) according to the prior art. FIG. 1a is a drawing illustrating a perspective view of the anodic oxide film (10), and FIG. 1b is a drawing illustrating a cross-sectional view of FIG. 1a.

[0003] The anodic oxide film (10) refers to a film formed by anodizing a base metal (M), and pores (P) refer to holes formed in the process of forming an anodic oxide film by anodizing the base metal (M). For example, when the base metal (M) is aluminum (Al) or an aluminum alloy, when the base metal (M) is anodized, an anodic oxide film (10) made of aluminum oxide (Al2O3) is formed on the surface of the base metal (M). The anodic oxide film (10) is divided into a porous layer (11) in which pores (P) are formed and a barrier layer (12) in which pores (P) are not formed. The barrier layer (12) is positioned between the porous layer (11) and the base metal (M), so that only one end of the pores (P) is opened.

[0004] Since the anodic oxide film (10) has a barrier layer (12) at the bottom, the lower part of the pore (P) is closed and the upper part of the pore (P) is open. In order to form various materials inside the pore (P), the pore (P) must be open. To this end, a state in which the openings of the pores (P) face upward is utilized. However, when a specific material is deposited inside the pores (P) while leaving the state in the regular arrangement, the following problem occurs. A crown protrusion (CD) exists at the opening of the pore (P). The crown protrusion (CD) is formed on the upper part of the porous layer (11). Based on each pore (P), the upper surface has a concave groove shape, and the crown protrusion (CD) is formed when the concave grooves overlap with adjacent concave grooves. Since the crown protrusion (CD) contains a sharp part, when depositing various materials, the part formed on the crown protrusion (CD) becomes a structurally weak part, and flatness cannot be managed.

[0005] Meanwhile, when a specific material is to be deposited inside the pores (P) of the anodic oxide film (10), the pores (P) must not contain any foreign substances. Before depositing a specific material inside the pores (P), a photoresist process can be performed to form parts such as various electrodes. When the photoresist process is performed on the opened pores of the anodic oxide film or when the photoresist process is performed on the opened pores after the barrier layer (12) is removed to open the pores (P), there is a problem in that fine particles generated from the photoresist enter and remain inside the pores (P). These fine particles cause problems such as lowering the quality and lowering the yield when forming a specific material inside the pores (P) in a subsequent process. In addition, when two electrodes, etc. are formed together on the upper surface of the anodic oxide film (10), there is a problem in that it is difficult to structurally distinguish the areas for forming each electrode, etc. from each other.

[0006] [Prior Art Literature]

[0007] [Patent Document]

[0008] (Patent Document 1) Patent Publication No. 10-0907467

[0009] The present invention has been devised to solve the problems of the above-described prior art, and the purpose of the present invention is to provide a component using an anodic oxide film and a manufacturing method thereof, in which foreign substances of the photoresist do not enter the pores in a subsequent process of forming a specific material inside the pores by preventing the pores of the anodic oxide film from being opened during a photoresist process.

[0010] In addition, the present invention aims to provide a component using an anodic oxide film and a manufacturing method thereof that eliminates the deterioration of the quality of the deposition material due to the crown protrusion of the pores.

[0011] In addition, the present invention aims to provide a component using an anodic oxide film and a manufacturing method thereof, which can structurally separate the region of an anodic oxide film by using a region provided with a barrier layer of an anodic oxide film and a region not provided with a barrier layer to manufacture the component.

[0012] In order to achieve the above-described purpose, a component using an anodic oxide film according to the present invention includes an anodic oxide film body having a first region in which a porous layer having pores and a barrier layer without pores are vertically provided, and a second region composed only of the porous layer; and a functional part formed within the pores of the second region.

[0013] In addition, the functional portion includes a first metal layer formed within the pore of the second region and at least a portion of which is provided on the inner wall of the pore; a functional layer at least a portion of which is provided on the first metal layer; and a second metal layer at least a portion of which is provided on the functional layer.

[0014] Additionally, it includes a first electrode electrically connected to the first metal layer; and a second electrode electrically connected to the second metal layer.

[0015] Additionally, the first electrode is provided on the upper portion of the barrier layer of the first region.

[0016] Additionally, the second electrode is provided on the upper part of the first region or the upper part of the second region.

[0017] Additionally, the first electrode is provided at the lower portion of the anodic oxide film body, and the second electrode is provided at the upper portion of the first region.

[0018] In addition, in the second region, the pores of the second region are opened upward and downward as the barrier layer is removed, and in the first region, the barrier layer is not removed, so the upper portions of the pores of the first region are closed by the barrier layer and the lower portions of the pores are opened.

[0019] In addition, the first metal layer is formed in a tube shape that extends vertically inside the pores but has a closed lower portion, and the functional layer is formed continuously along the surface of the first metal layer, and the functional layer is provided between the first metal layer and the second metal layer.

[0020] Additionally, the vertical height of the first region is higher than the vertical height of the second region.

[0021] Additionally, the first metal layer, the functional layer, and the second metal layer are provided to extend to the upper portion of the first region.

[0022] Additionally, the pores of the first region are provided as empty spaces, and the pores of the second region are filled by the functional part.

[0023] In addition, it includes a blocking layer provided at the lower portion of the anodic oxide film body to close the lower opening of the pore.

[0024] Additionally, the vertical height of the pores in the first region is higher than the vertical height of the pores in the second region.

[0025] Additionally, the functional layer is a dielectric layer or an electrolyte layer.

[0026] Meanwhile, in the method for manufacturing a component using an anodic oxide film according to the present invention, in the method for manufacturing a component using an anodic oxide film by forming a material inside the pores of an anodic oxide film body, when performing a photoresist process performed before forming the material inside the pores, the photoresist process is performed in a state where the pores are not opened so that fine particles of the photoresist do not enter the pores.

[0027] In addition, the method includes a step of performing a step of forming a first electrode in a first region after the photoresist process; a step of removing a barrier layer in a second region where the first electrode is not formed to open the pores; and a step of forming the material within the pores of the second region.

[0028] Additionally, the vertical height of the first region is higher than the vertical height of the second region.

[0029] The present invention provides a component using an anodic oxide film and a manufacturing method thereof, in which foreign substances of the photoresist do not enter the pores of the anodic oxide film during a photoresist process by preventing the pores of the anodic oxide film from being opened, thereby preventing a specific material from entering the pores during a subsequent process of forming the pores.

[0030] In addition, the present invention provides a component using an anodic oxide film and a manufacturing method thereof that eliminates the deterioration of the quality of the deposition material due to crown protrusions of pores.

[0031] In addition, the present invention provides a component using an anodic oxide film and a manufacturing method thereof, which can manufacture a component by structurally dividing an area of ​​an anodic oxide film into an area provided with a barrier layer of an anodic oxide film and an area not provided with a barrier layer.

[0032] FIG. 1a and FIG. 1b are drawings illustrating an anodic oxide film (10) according to the prior art. FIG. 1a is a drawing illustrating a perspective view of the anodic oxide film (10), and FIG. 1b is a drawing illustrating a cross-sectional view of FIG. 1a.

[0033] FIG. 2 is a cross-sectional view of an anodic oxide film body according to a preferred embodiment of the present invention.

[0034] Figure 3 is a cross-sectional view of a component using an anodic oxide film according to a preferred first embodiment of the present invention.

[0035] Figure 4 is a cross-sectional view of a component using an anodic oxide film according to a preferred second embodiment of the present invention.

[0036] Figure 5 is a cross-sectional view of a component using an anodic oxide film according to a preferred third embodiment of the present invention.

[0037] Figure 6 is a cross-sectional view of a component using an anodic oxide film according to a preferred fourth embodiment of the present invention.

[0038] Figure 7 is a cross-sectional view of a component using an anodic oxide film according to a fifth preferred embodiment of the present invention.

[0039] FIGS. 8 to 19 are cross-sectional views illustrating a method for manufacturing a component using an anodic oxide film according to a preferred embodiment of the present invention.

[0040] The following merely exemplifies the principles of the invention. Therefore, those skilled in the art will be able to implement the principles of the invention and invent various devices within the scope and spirit of the invention, even if not explicitly described or illustrated herein. Furthermore, all conditional terms and embodiments listed herein are expressly intended, in principle, to facilitate understanding of the invention's concepts and should be understood as being in no way limiting to the specifically listed embodiments and conditions.

[0041] The above-described purposes, features and advantages will become clearer through the following detailed description with reference to the attached drawings, so that a person having ordinary skill in the art to which the invention pertains can easily practice the technical idea of ​​the invention.

[0042] Embodiments described herein will be described with reference to cross-sectional and / or perspective views, which are ideal exemplary drawings of the present invention. The thicknesses of films and regions, etc., illustrated in these drawings are exaggerated for the purpose of effectively explaining the technical contents. The form of the exemplary drawings may be modified due to manufacturing techniques and / or tolerances. Therefore, embodiments of the present invention are not limited to the specific forms illustrated, but also include changes in form resulting from the manufacturing process. The technical terms used herein are used only to describe specific embodiments and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this specification, it should be understood that the terms "comprises" or "includes" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in this specification, but do not preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0043] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. In describing various embodiments below, components that perform the same function will be given the same designations and reference numbers for convenience, even if the embodiments differ. Furthermore, configurations and operations already described in other embodiments will be omitted for convenience.

[0044] Anodized body (100) according to a preferred embodiment

[0045] Below, the anodic oxide film body (100) according to a preferred embodiment of the present invention will first be described.

[0046] FIG. 2 is a drawing showing a cross-sectional view of an anodic oxide film body (100) according to a preferred embodiment of the present invention.

[0047] The anodic oxide film body (100) refers to a film formed by anodizing a base metal, and the pores (P) refer to holes formed in the process of forming an anodic oxide film by anodizing the base metal. For example, when the base metal is aluminum (Al) or an aluminum alloy, when the base metal is anodized, an anodic oxide film body (100) made of aluminum oxide (Al2O3) is formed on the surface of the base metal. However, the base metal is not limited thereto, and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or alloys thereof. The anodic oxide film body (100) formed as described above is vertically divided into a porous layer (111) in which pores (P) are formed inside, and a barrier layer (112) in which no pores (P) are formed. When the base metal is removed after anodizing, only the anodic oxide film body (100) made of aluminum oxide (Al2O3) remains. The anodic oxide film body (100) has a plurality of pores (P), and the pores (P) have a length of 20 ㎛ or more and 200 ㎛ or less and a diameter of 10 nm or more and 1 ㎛ or less. The pitch between adjacent pores (P) has a distance of 20 ㎚ or more and 200 ㎚ or less.

[0048] FIG. 2 is a diagram showing the anodic oxide film body (10) of FIGS. 1a and 1b inverted so that the barrier layer (112) is positioned at the top and the porous layer (111) is positioned at the bottom.

[0049] The anodic oxide film body (100) is structurally divided into two regions, including a first region (110) and a second region (120). The first region (110) is provided with a porous layer (111) having pores (P) and a barrier layer (112) without pores (P) vertically, and the second region (120) is provided with only the porous layer (111). The first region (110) is a region provided with both the porous layer (111) and the barrier layer (112), whereas the second region (120) is a region provided with only the porous layer (111) by removing the barrier layer (112). That is, the anodic oxide film body (100) has a first region (110) in which a porous layer (111) having pores (P) and a barrier layer (112) without pores (P) are vertically provided, and a second region (120) composed only of the porous layer (111).

[0050] In the second region (120), the pores (P) of the second region (120) are opened upward and downward as the barrier layer (112) is removed. On the other hand, in the first region (110), the barrier layer (112) is not removed, so one end (upper) of the pores (P) of the first region (110) is closed by the barrier layer (112) and the other end (lower) of the pores (P) is opened. A material is deposited inside the pores (P) of the second region (120), but a material is not deposited inside the pores (P) of the first region (110).

[0051] The vertical height of the first region (110) is higher than the vertical height of the second region (120) by the vertical height by which the barrier layer (112) is removed in the second region (120). In addition, the vertical height of the pores (P) of the first region (110) is higher than the vertical height of the pores (P) of the second region (120).

[0052] In this way, structurally, the first region (110) is a region equipped with a barrier layer (112) unlike the second region (120), and is formed with a higher vertical height than the second region (120). Therefore, the anodic oxide film body (100) structurally divides the regions of the anodic oxide film body (100) by using the first region (110) equipped with a barrier layer (112) and the second region (120) not equipped with a barrier layer (112).

[0053] Parts (1000) using an anodic oxide film according to the first embodiment

[0054] Next, a component (1000) using an anodic oxide film according to the first embodiment will be described.

[0055] Figure 3 is a cross-sectional view of a component (1000) using an anodic oxide film according to a preferred first embodiment of the present invention.

[0056] A component (1000) using an anodic oxide film includes an anodic oxide film body (100) having a first region (110) in which a porous layer (111) having pores (P) and a barrier layer (112) without pores (P) are vertically provided, and a second region (120) composed only of the porous layer (111).

[0057] A component (1000) using an anodic oxide film includes a first metal layer (210), a functional layer (220), and a second metal layer (230) formed on an anodic oxide film body (100).

[0058] The first metal layer (210) includes a first surface metal layer (211) formed on the surface of the anodic oxide film body (100) and a first porous metal layer (213) formed on the inner wall of the pore (P). The first surface metal layer (211) is a portion of the first metal layer (210) formed on the surface side of the anodic oxide film body (100), and the first porous electrode portion (113) is a portion of the first metal layer (210) formed on the inner wall side of the pore (P). The first surface metal layer (211) is formed entirely along the surface of the anodic oxide film body (100). The first porous electrode portion (113) is formed along the inner wall of the pore (P).

[0059] The functional layer (220) includes a surface functional layer (221) formed on the first surface metal layer (211) and a porous functional layer (223) formed on the first porous metal layer (213). The surface functional layer (221) is a portion formed on the surface side of the anodic oxide film body (100) in the functional layer (220), and the porous functional layer (223) is a portion formed on the inner wall side of the pores (P) in the functional layer (220). The surface functional layer (221) is formed along the surface of the first surface metal layer (211), and the porous functional layer (223) is formed along the surface of the first porous metal layer (213).

[0060] The second metal layer (230) includes a second surface metal layer (231) formed on the surface functional layer (221) and a second porous metal layer (233) formed on the porous functional layer (223). The second surface metal layer (231) is a portion formed on the surface side of the anodic oxide film body (100) in the second metal layer (230), and the second porous metal layer (233) is a portion formed on the inner wall side of the pores (P) in the second metal layer (230). The second surface metal layer (231) is formed along the surface of the surface functional layer (221), and the second porous metal layer (233) is formed along the surface of the porous functional layer (223).

[0061] A functional portion (200) is formed in the pore (P) of the second region (120). The functional portion (200) is formed within the pore (P) of the second region (120). The functional portion (200) is configured by stacking a first metal layer (210), a functional layer (220), and a second metal layer (230) within the pore (P). The functional portion (200) includes a first metal layer (210) at least partially formed on the inner wall of the pore (P), a functional layer (220) at least partially formed on the first metal layer (210), and a second metal layer (230) at least partially formed on the functional layer (220). More specifically, the functional portion (200) includes a first porous metal layer (213) at least partially provided on the inner wall of the pores (P), a porous functional layer (223) at least partially provided on the first porous metal layer (213), and a second porous metal layer (233) at least partially provided on the porous functional layer (223).

[0062] The first metal layer (210) is formed in a tube shape that extends vertically inside the pores (P) but is closed at the bottom, the functional layer (220) is continuously formed along the surface of the first metal layer (210), and the functional layer (220) is provided between the first metal layer (210) and the second metal layer (230). More specifically, the first porous metal layer (213) is formed in a tube shape that extends vertically inside the pores (P) but is closed at the bottom, the porous functional layer (223) is continuously formed along the surface of the first metal layer (210), and the porous functional layer (223) is provided between the first porous metal layer (213) and the second porous metal layer (233).

[0063] The first electrode (300) is electrically connected to the first metal layer (210), and the second electrode (400) is electrically connected to the second metal layer (230). More specifically, the first electrode (300) is electrically connected by being in contact with the first surface metal layer (211), and the second electrode (400) is electrically connected by being in contact with the second surface metal layer (231).

[0064] The first electrode (300) is provided on the upper part of the barrier layer (112) of the first region (110), and the second electrode (400) is provided on the upper part of the second region (120).

[0065] The first metal layer (210), the functional layer (220), and the second metal layer (230) are provided so as to extend to the upper side of the side of the first region (110). The first metal layer (210), the functional layer (220), and the second metal layer (230) extend vertically while covering the side of the barrier layer (112) of the first region (110) and the side of the first electrode (300). The first metal layer (210), the functional layer (220), and the second metal layer (230) may not be provided on the upper surface of the first electrode (300). More specifically, the first surface metal layer (211), the surface functional layer (221), and the second surface metal layer (231) extend vertically while covering the side of the barrier layer (112) of the first region (110) and the side of the first electrode (300). The upper surface of the first electrode (300) may not include a first surface metal layer (211), a surface functional layer (221), and a second surface metal layer (231). The first surface metal layer (211) extending to the upper portion of the first region (110) is in contact with and electrically connected to the first electrode (300). A second electrode (400) is formed on the upper portion of the second surface metal layer (231), and the second surface metal layer (231) is in contact with and electrically connected to the second electrode (400).

[0066] The pores (P) of the first region (110) are provided as empty spaces, and the pores (P) of the second region (120) are filled by the functional portion (200). The functional portion (200) is not provided in the first region (110), and only the functional portion (200) is provided in the second region (120). As a result, the pores (P) of the anodic oxide film body (100) are composed of pores (P) provided with the functional portion (200) and pores (P) not provided with the functional portion (200).

[0067] Since the vertical height of the first area (110) is higher than that of the second area (120), it is easy to distinguish between the first area (110) and the second area (120) through the stepped portion.

[0068] Since the functional portion (200) is not formed in the first region (110) and the first electrode (300) is formed on the upper portion of the first region (110), the heat generated in the first electrode (300) is insulated by the barrier layer (112) and is minimized from being transferred to the lower portion of the component (1000). The second region (120) is used as a functional region using the first metal layer (210), the functional layer (220), and the second metal layer (230), and the first region (110) is used as a wiring region where at least some electrodes such as the first electrode (300) are formed, thereby minimizing the heat generated in the wiring region from being transferred to the lower portion. In addition, since the first region (110) exists between the second regions (120), the heat transfer between the second regions (120) can be minimized.

[0069] Meanwhile, when cutting the anodic oxide film body (100) to manufacture it into an individualized unit, since the first region (110) does not have a functional portion (200), the first region (110) can serve as a cutting line. By making the first region (110) a cutting line, individualization of the component becomes easier, and by minimizing the stress applied to the functional portion (200) during cutting, it becomes possible to manufacture a high-quality component.

[0070] In contrast, the pores (P) of the first region (110) may not be formed as empty spaces but may be filled with a material different from the material of the functional portion (200) to impart functionality.

[0071] A blocking layer (600) is formed on the lower part of the anodic oxide film body (100) to close the lower opening of the pore (P). This blocks fine particles from entering the pore (P) opened on the lower part of the anodic oxide film body (100).

[0072] The barrier layer (600) may be formed of a non-conductive material. The barrier layer (600) may preferably include at least one of tantalum oxide (Ta2O5), aluminum oxide (Al2O3), titanium oxide (TiO2), zirconium oxide (ZrO2), and hafnium oxide (HfO2).

[0073] The barrier layer (600) can be formed by, but is not limited to, sputtering, CVD, PVD, ALD, spray application, coating, etc. In addition, the barrier layer (600) can be manufactured in a film form and attached to the anodic oxide film body (100).

[0074] The functional part (200) has different functions depending on the material of the functional layer (220), and can be different components (1000) depending on the material constituting the functional part (200). Here, the functional layer (220) can be a dielectric layer or an electrolyte layer. If the functional layer (220) is a dielectric layer, the component (1000) using an anodic oxide film can be a capacitor, and if the functional layer (220) is an electrolyte layer, the component (1000) using an anodic oxide film can be a battery.

[0075] When the functional layer (220) is a dielectric layer, each of the first electrode (300) and the second electrode (400) may be formed of a metal film made of a first metal, a metal oxide film including the first metal, a metal nitride film including the first metal, a metal oxynitride film including the first metal, or a combination thereof. In exemplary embodiments, the first metal may be Ti, Co, Nb, or Sn. In exemplary embodiments, the first electrode (300) and the second electrode (400) may each include Ti, Ti oxide, Ti nitride, Ti oxynitride, Co, Co oxide, Co nitride, Co oxynitride, Nb, Nb oxide, Nb nitride, Nb oxynitride, Sn, Sn oxide, Sn nitride, Sn oxynitride, or a combination thereof. For example, the first electrode (300) and the second electrode (400) may each be made of TiN, CoN, NbN, SnO2, or a combination thereof.

[0076] When the functional layer (220) is a dielectric layer, the functional layer (220) may be formed of a metal oxide film including a second metal. The second metal may be Hf, Zr, Nb, Ce, or Ti. In exemplary embodiments, the functional layer (220) may be formed of Al2O3, ZrO2, HfO2, Nb2O5, CeO2, or TiO2.

[0077] When the functional layer (220) is an electrolyte layer, the first electrode (300) may be a lithium transition metal oxide such as lithium cobalt oxide (LCO), lithium nickel oxide, lithium nickel cobalt oxide, lithium nickel cobalt aluminum oxide (NCA), lithium nickel cobalt manganese oxide (NCM), lithium manganate, lithium iron phosphate, nickel sulfide, copper sulfide, lithium sulfide, iron oxide, or vanadium oxide, but is not necessarily limited thereto, and any material used as a cathode active material in the relevant technical field may be used. The first electrode (300) may be, for example, lithium cobalt oxide (LCO) having excellent high-voltage stability.

[0078] When the functional layer (220) is an electrolyte layer, the functional layer (220) is at least one selected from among a sulfide-based solid electrolyte and an oxide-based solid electrolyte, but is not necessarily limited to these, and any inorganic solid electrolyte used in the relevant technical field may be used.

[0079] When the functional layer (220) is an electrolyte layer, the second electrode (400) may be a carbon-based negative electrode active material and / or a non-carbon-based negative electrode active material. The carbon-based negative electrode active material may be crystalline carbon, amorphous carbon, or a mixture thereof. The crystalline carbon may be graphite such as natural graphite or artificial graphite in a non-shaped, plate-like, flake-like, spherical, or fiber-like shape, and the amorphous carbon may be soft carbon (low-temperature calcined carbon) or hard carbon, mesophase pitch carbide, calcined coke, or the like. The amorphous carbon may be, for example, carbon black (CB), acetylene black (AB), furnace black (FB), ketjen black (KB), graphene, or the like, but is not necessarily limited thereto, and any material used in the relevant technical field may be used. The non-carbon negative electrode active material is at least one selected from the group consisting of a metal capable of forming an alloy with lithium, an alloy of a metal capable of forming an alloy with lithium, and an oxide of a metal capable of forming an alloy with lithium. The metal capable of forming an alloy with lithium may be, for example, Si, Sn, Al, Ge, Pb, Bi, Sb, a Si-Y alloy (wherein Y is an alkali metal, an alkaline earth metal, a group 13-16 element, a transition metal, a rare earth element, or a combination thereof, and is not Si), a Sn-Y alloy (wherein Y is an alkali metal, an alkaline earth metal, a group 13-16 element, a transition metal, a rare earth element, or a combination thereof, and is not Sn), etc.

[0080] Before forming the first metal layer (210), the functional layer (220), and the second metal layer (230), the first electrode (300) is first formed. The first electrode (300) is formed in the first region (110) using a photoresist process using photoresist (PR), and then the barrier layer (112) corresponding to the position of the second region (120) is removed, and then the first metal layer (210), the functional layer (220), and the second metal layer (230) are formed. As a result, the first electrode (300) is provided on the upper portion of the barrier layer (112) of the first region (110), and the functional portion (200) is provided inside the pores (P) of the second region (120).

[0081] In the process of performing a photoresist process using photoresist (PR), since the barrier layer (112) closes the end of the pore (P), fine particles generated from the photoresist (PR) do not enter the pore (P), thereby enabling the implementation of a high-quality functional part (200).

[0082] Parts (1000) using an anodic oxide film according to the second embodiment

[0083] Next, a component (1000) using an anodic oxide film according to the second embodiment will be examined. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted.

[0084] Figure 4 is a cross-sectional view of a component (1000) using an anodic oxide film according to a preferred second embodiment of the present invention.

[0085] A component (1000) using an anodic oxide film according to the second embodiment is provided with a bonding layer (510) and a seed layer (520) on top of a barrier layer (112) of a first region (110), and a first electrode (300) on top of the seed layer (520).

[0086] The bonding layer (510) may be titanium (Ti) as a layer for securing bonding strength. The seed layer (520) may be copper (Cu) or gold (Au) as a pretreatment layer for facilitating electrolytic plating of the plating metal.

[0087] The first electrode (300) includes a first-first electrode (310) formed in contact with the seed layer (520) and having an area equal to that of the seed layer (520), and a first-second electrode (320) formed in contact with the first-first electrode (310) and having an area smaller than that of the first-first electrode (310). The first metal layer (210), the functional layer (220), and the second metal layer (230) are provided within the pores (P) of the second region (120) to form the functional portion (200), which is the same as the configuration of the first embodiment.

[0088] The first metal layer (210), the functional layer (220), and the second metal layer (230) are provided so as to extend to the upper surface of the first region (110). More specifically, the first metal layer (210), the functional layer (220), and the second metal layer (230) extend vertically while covering the side surface of the barrier layer (112) of the first region (110) and the side surface of the first electrode (300), and extend horizontally while covering the upper portion of the first-first electrode (310). The first-second electrode (320) is provided on the upper surface of the first-first electrode (310) that is not covered by the first metal layer (210), the functional layer (220), and the second metal layer (230). The first-second electrode (320) is in contact only with the first-first electrode (310) and does not contact the first metal layer (210), the functional layer (220), and the second metal layer (230). Through this, the first electrode (300) is electrically connected to the first metal layer (210).

[0089] The second electrode (400) is provided on top of another first region (110) where the first electrode (300) is not formed. The first electrode (300) and the second electrode (400) are provided in different first regions (110).

[0090] In the first region (110) where the second electrode (400) is formed, unlike the first region (110) where the first electrode (300) is formed, the first metal layer (210), the functional layer (220), and the second metal layer (230) are formed to cover the entire region. The second electrode (400) is provided in contact with the second metal layer (230) and is electrically connected to the second metal layer (230).

[0091] Parts (1000) using an anodic oxide film according to the third embodiment

[0092] Next, a component (1000) using an anodic oxide film according to a third embodiment will be examined. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted.

[0093] Figure 5 is a cross-sectional view of a component (1000) using an anodic oxide film according to a preferred third embodiment of the present invention.

[0094] A component (1000) using an anodic oxide film according to the third embodiment is provided with a bonding layer (510) and a seed layer (520) on top of a barrier layer (112) of a first region (110), and a first electrode (300) on top of the seed layer (520). The first electrode (300) includes a first-first electrode (310) formed in contact with the seed layer (520) and having an area equal to that of the seed layer (520), and a first-second electrode (320) formed in contact with the first-first electrode (310) and having an area smaller than that of the first-first electrode (310). The configuration is the same as that of the first embodiment in that the first metal layer (210), the functional layer (220), and the second metal layer (230) are provided within the pores (P) of the second region (120) to form the functional portion (200).

[0095] The first metal layer (210), the functional layer (220), and the second metal layer (230) are provided so as to extend to the upper surface of the first region (110). More specifically, the first metal layer (210), the functional layer (220), and the second metal layer (230) extend vertically while covering the side surface of the barrier layer (112) of the first region (110) and the side surface of the first electrode (300), and extend horizontally while covering the upper portion of the first-first electrode (310). The first-second electrode (320) is provided on the upper surface of the first-first electrode (310) that is not covered by the first metal layer (210), the functional layer (220), and the second metal layer (230). The first-second electrode (320) is in contact only with the first-first electrode (310) and does not contact the first metal layer (210), the functional layer (220), and the second metal layer (230). Through this, the first electrode (300) is electrically connected to the first metal layer (210).

[0096] The second electrode (400) is provided on the upper portion of the first region (110) where the first electrode (300) is formed. The first electrode (300) and the second electrode (400) are provided in the same first region (110). The second electrode (400) is provided in contact with the second metal layer (230) and is electrically connected to the second metal layer (230).

[0097] The first metal layer (210), the functional layer (220), and the second metal layer (230) extend to the upper portion of the first region (110), and in the extended first metal layer (210), the functional layer (220), and the second metal layer (230), the first metal layer (210) is electrically connected to the first electrode (300), and the second metal layer (230) is electrically connected to the second electrode (400).

[0098] Parts (1000) using an anodic oxide film according to the fourth embodiment

[0099] Next, a component (1000) using an anodic oxide film according to the fourth embodiment will be examined. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted.

[0100] Figure 6 is a cross-sectional view of a component (1000) using an anodic oxide film according to a preferred fourth embodiment of the present invention.

[0101] A component (1000) using an anodic oxide film according to the fourth embodiment has a first electrode (300) provided on the lower portion of an anodic oxide film body (100), and a second electrode (400) provided on the upper portion of a first region (110). A component (1000) using an anodic oxide film according to the fourth embodiment has a configuration in which a blocking layer (600) provided in the first to third embodiments is made of an electrically conductive material, so that the blocking layer (600) also functions as the first electrode (300). The configuration is the same as that of the first embodiment in that a first metal layer (210), a functional layer (220), and a second metal layer (230) are provided within the pores (P) of the second region (120) to form a functional portion (200).

[0102] The first metal layer (210), the functional layer (220), and the second metal layer (230) are conformally formed on the anodic oxide film body (100).

[0103] The first metal layer (210) formed inside the pore (P) is exposed at the bottom of the anodic oxide film body (100) and is electrically connected to the first electrode (300) provided at the bottom of the anodic oxide film body (100).

[0104] The first metal layer (210), the functional layer (220), and the second metal layer (230) are provided to extend to the upper surface of the first region (110), and the second electrode (230) is in contact with the upper surface of the second metal layer (230) of the first region (110) and is electrically connected to the second metal layer (230).

[0105] Parts (1000) using an anodic oxide film according to the fifth embodiment

[0106] Next, a component (1000) using an anodic oxide film according to the fifth embodiment will be examined. However, the embodiments described below will be described focusing on characteristic components compared to the first embodiment, and descriptions of components identical or similar to those of the first embodiment will be omitted.

[0107] Figure 7 is a cross-sectional view of a component (1000) using an anodic oxide film according to a preferred fifth embodiment of the present invention.

[0108] A component (1000) using an anodic oxide film according to the fifth embodiment is provided with a bonding layer (510) and a seed layer (520) on top of a barrier layer (112) of a first region (110), and a first electrode (300) on top of the seed layer (520). The first electrode (300) includes a first-first electrode (310) formed in contact with the seed layer (520) and having an area equal to that of the seed layer (520), and a first-second electrode (320) formed in contact with the first-first electrode (310) and having an area smaller than that of the first-first electrode (310).

[0109] The first metal layer (210), the functional layer (220), and the second metal layer (230) are provided so as to extend to the upper surface of the first region (110). More specifically, the first metal layer (210), the functional layer (220), and the second metal layer (230) extend vertically while covering the side surface of the barrier layer (112) of the first region (110) and the side surface of the first electrode (300), and extend horizontally while covering the upper portion of the first-first electrode (310). The first-second electrode (320) is provided on the upper surface of the first-first electrode (310) that is not covered by the first metal layer (210), the functional layer (220), and the second metal layer (230). The first-second electrode (320) is in contact only with the first-first electrode (310) and does not contact the first metal layer (210), the functional layer (220), and the second metal layer (230). Through this, the first electrode (300) is electrically connected to the first metal layer (210).

[0110] The first electrode (300) is provided on the upper portion of the barrier layer (112) of the first region (110), and the second electrode (400) is provided on the upper portion of the second region (120). Through this, the first electrode (300) is electrically connected to the first metal layer (210), and the second electrode (400) is electrically connected to the second metal layer (230).

[0111] Method for manufacturing a component (1000) using an anodic oxide film according to a preferred embodiment

[0112] Next, a method for manufacturing a component (1000) using an anodic oxide film according to a preferred embodiment of the present invention will be described. Hereinafter, the manufacturing method will be described by exemplifying a component (1000) using an anodic oxide film according to the fifth embodiment, but the manufacturing method described below can also be applied to the manufacturing method for a component (1000) using an anodic oxide film according to the first to fourth embodiments.

[0113] When the photoresist process is performed with the pores (P) open, fine particles generated from the photoresist (PR) may enter the pores (P) or block the entrance of the pores (P). In this case, a problem occurs in that the quality of the material to be formed inside the pores (P) is deteriorated. According to an embodiment of the present invention, in a method for manufacturing a component (1000) using an anodic oxide film by forming a material inside the pores (P) of an anodic oxide film body (100), when performing the photoresist process performed before forming the material inside the pores (P), the photoresist process is performed with the pores (P) not opened so that fine particles of the photoresist (PR) do not enter the pores (P). Of course, since there is no concern about quality degradation of the functional portion (200) due to fine particles of the photoresist (PR) after forming the material inside the pore (P), it is possible to perform the photoresist process after forming the material inside the pore (P).

[0114] According to an embodiment of the present invention, a method for manufacturing a component (1000) using an anodic oxide film includes: a step of performing a step of forming a first electrode (300) in a first region (110) after a photoresist process; a step of removing a barrier layer (112) of a second region (120) in which the first electrode (300) is not formed to open pores (P); and a step of forming a material within the pores (P) of the second region (120).

[0115] In addition, a method for manufacturing a component (1000) using an anodic oxide film includes: a step of forming a blocking layer (600) that closes the openings of pores (P) of a porous layer (111) in an anodic oxide film body (100) having a porous layer (111) and a barrier layer (112), and partially forming a first electrode (300) on top of the barrier layer (112); a step of removing the barrier layer (112) in an area where the first electrode (300) is not formed to form a second area (120) in which the anodic oxide film body (100) is composed only of the porous layer (111), and a step of forming a first area (110) in which the porous layer (111) and the barrier layer (112) are vertically provided in an area where the barrier layer (112) is not etched; A step of forming a first metal layer (210) formed in a pore (P) of a second region (120) and provided on the inner wall of the pore (P), a functional layer (220) provided on the first metal layer (210), and a second metal layer (230) provided on the functional layer (220), wherein the first metal layer is electrically connected to the first electrode (300); and a step of forming a second electrode (400) provided on the upper portion of the second region (120) and electrically connected to the second metal layer (230).

[0116] The following is a detailed explanation with reference to the drawings.

[0117] FIGS. 8 to 19 are cross-sectional views illustrating a method for manufacturing a component (1000) using an anodic oxide film according to a preferred embodiment of the present invention.

[0118] Figure 8 is a cross-sectional view showing a state in which a bonding layer (510) and a seed layer (520) are provided on the upper surface of an anodic oxide body (100) and a blocking layer (600) is provided on the lower surface of the anodic oxide body (100).

[0119] The anodic oxide film body (100) refers to a film formed by anodizing a base metal (M), and the pores (P) refer to holes formed in the process of forming an anodic oxide film by anodizing the base metal. After anodizing, when the base metal is removed, only the anodic oxide film body (100) made of aluminum oxide (Al2O3) remains. The pores (P) have a length of 1 ㎛ or more and 200 ㎛ or less and a diameter of 10 nm or more and 1 ㎛ or less. The pitch between adjacent pores (P) is a distance of 20 nm or more and 200 nm or less.

[0120] One end of the pore (P) is closed by a barrier layer (112) and the other end of the pore (P) is open. A blocking layer (600) is additionally formed on the open other end of the pore (P) to close the other end of the pore (P). After forming the blocking layer (600), a bonding layer (510) and a seed layer (520) are formed on top of the barrier layer (112) while the barrier layer (112) is inverted so that it faces upward. The bonding layer (510) is a layer for securing bonding strength and may be titanium (Ti). The seed layer (520) is a pretreatment layer for facilitating electrolytic plating of a plating metal and may be copper (Cu) or gold (Au).

[0121] Next, referring to FIG. 9, a process for forming a photoresist (PR) is performed. After the photoresist (PR) is formed on top of the seed layer (520), it is patterned to form a first opening (710). In the process for forming the photoresist (PR), both ends of the pores (P) are already closed, so fine particles generated from the photoresist (PR) do not enter the pores (P).

[0122] Next, referring to FIG. 10, a first electrode (310) is formed within the first opening (710) by plating using a seed layer (520). Thereafter, a CMP process is performed to flatten the upper surface.

[0123] Next, referring to Fig. 11, a process for removing photoresist (PR) is performed. Since both ends of the pores (P) are closed, fine particles generated from the photoresist (PR) do not enter the pores (P).

[0124] The photoresist (PR) process includes at least some processes such as forming, patterning, and removing the photoresist (PR), and since both ends of the pores (P) are kept closed during the series of processes of forming, patterning, and removing the photoresist (PR), there is no concern that fine particles generated from the photoresist (PR) will enter the pores (P).

[0125] Next, referring to FIG. 12, the barrier layer (112) is removed from a portion of the anodic oxide body (100). The process of removing the barrier layer (112) is performed by an etching process, and preferably, can be performed by dry etching. Through dry etching, a portion of the depth of the anodic oxide body (100) can be precisely removed, and as a result, a first region (110) and a second region (120) are distinguished. The first region (110) is a region in which both the porous layer (111) and the barrier layer (120) are provided, and the second region (120) is a region in which only the porous layer (111) is provided. A first electrode (300) is provided on the upper portion of the first region (110). Since the second region (120) is composed only of the porous layer (111), the upper portions of the pores (P) are open.

[0126] Next, referring to FIG. 13, a first metal layer (210), a functional layer (220), and a second metal layer (230) are deposited. The first metal layer (210), the functional layer (220), and the second metal layer (230) can be conformally deposited on the exposed surface by atomic layer deposition (ALD). The method of forming the first metal layer (210), the functional layer (220), and the second metal layer (230) is preferably atomic layer deposition (ALD), but is not limited thereto. Each of the first metal layer (210), the functional layer (220), and the second metal layer (230) can be formed to a thickness of 1 nm or more and 100 nm or less.

[0127] The first metal layer (210), the functional layer (220), and the second metal layer (230) are formed entirely, including the inside of the pores (P) of the second region (120), the upper surface of the second region (120), and the upper surface of the first-first electrode (210). The first metal layer (210) is formed conformally along the surface of the anodic oxide film body (100), the functional layer (220) is formed conformally on the surface of the first metal layer (210), and the second metal layer (230) is formed conformally on the surface of the functional layer (220).

[0128] The first metal layer (210), the functional layer (220), and the second metal layer (230) formed inside the pore (P) form a functional portion (200). The functional portion (200) has a length of 20 ㎛ or more and 200 ㎛ or less and a diameter of 10 nm or more and 1 ㎛ or less. The pitch between adjacent functional portions (200) has a distance of 20 ㎚ or more and 200 ㎚ or less.

[0129] The functional unit (200) is provided only in the second area (120) and not in the first area (110).

[0130] Next, referring to FIG. 14, a photoresist (PR) is formed and patterned to form a second opening (720). Since the first metal layer (210), the functional layer (220), and the second metal layer (230) are formed within the pores (P) of the second region (120), the photoresist process performed thereafter does not affect the quality of the functional portion (200).

[0131] Next, referring to FIG. 15, a portion of the first metal layer (210), the functional layer (220), and the second metal layer (230) formed on the first region (110) are removed using the second opening (720). The first metal layer (210), the functional layer (220), and the second metal layer (230) can be removed using a dry etching process. Through this, a portion of the upper surface of the first-first electrode (310) is exposed.

[0132] Next, referring to Fig. 16, the photoresist (PR) is removed.

[0133] Next, referring to FIG. 17, a photoresist (PR) is formed again and patterned to form a third opening (730) and a fourth opening (740). The third opening (730) is formed in the first region (110), and the fourth opening (740) is formed in the second region (120). The third opening (730) is formed with an area smaller than the open area of ​​the second opening (720) so that a portion of the photoresist (PR) covers a portion of the first-first electrode (310) whose upper surface is exposed.

[0134] Next, referring to Fig. 18, metal is formed in the third opening (730) and the fourth opening (740) using a method such as plating. The metal formed in the third opening (730) becomes the first-second electrode (320), and the metal formed in the fourth opening (740) becomes the second metal (400).

[0135] Next, referring to Fig. 19, the photoresist (PR) is removed.

[0136] Meanwhile, a process of cutting into individual units may be additionally performed in a later stage. When cutting and manufacturing individualized units, since the first region (110) does not have a functional portion (200), the first region (110) may serve as a cutting line. By using the first region (110) as a cutting line, individualization of the component becomes easier, and by minimizing the stress applied to the functional portion (200) during cutting, a high-quality component (1000) can be manufactured.

[0137] As described above, the present invention has been described with reference to preferred embodiments thereof, but it will be apparent to those skilled in the art that various modifications or variations may be made to the present invention without departing from the spirit and scope of the present invention as set forth in the following claims.

[0138] [Explanation of symbols]

[0139] 100: Anodized body

[0140] 200: Functional Department

[0141] 300: First electrode

[0142] 400: Second electrode

[0143] 510: Bonding layer

[0144] 520: Seed layer

[0145] 600: Blocking layer

Claims

1. An anodic oxide film body having a first region in which a porous layer having pores and a barrier layer without pores are vertically arranged, and a second region composed only of the porous layer; and A component using an anodic oxide film, including a functional portion formed within the pores of the second region.

2. In paragraph 1, A component using an anodic oxide film, wherein the functional part comprises a first metal layer formed within the pore of the second region and at least a portion of which is provided on the inner wall of the pore; a functional layer at least a portion of which is provided on the first metal layer; and a second metal layer at least a portion of which is provided on the functional layer.

3. In paragraph 2, a first electrode electrically connected to the first metal layer; and A component using an anodic oxide film, comprising a second electrode electrically connected to the second metal layer.

4. In paragraph 3, The above first electrode is a component using an anodic oxide film provided on the upper part of the barrier layer of the above first region.

5. In paragraph 3, The above second electrode is a component using an anodic oxide film, which is provided on the upper part of the first region or the upper part of the second region.

6. In paragraph 3, A component using an anodic oxide film, wherein the first electrode is provided on the lower portion of the anodic oxide film body, and the second electrode is provided on the upper portion of the first region.

7. In paragraph 1, The above second region is opened upward and downward when the barrier layer is removed, A component using an anodic oxide film, wherein the first region is not removed from the barrier layer, so that the upper part of the pores of the first region is closed by the barrier layer and the lower part of the pores is open.

8. In paragraph 2, The first metal layer is formed in the form of a tube extending vertically inside the pores but having a closed lower portion. The functional layer is continuously formed along the surface of the first metal layer, A component using an anodic oxide film, wherein the functional layer is provided between the first metal layer and the second metal layer.

9. In paragraph 1, A component using an anodic oxide film, wherein the vertical height of the first region is higher than the vertical height of the second region.

10. In paragraph 2, A component using an anodic oxide film, wherein the first metal layer, the functional layer, and the second metal layer extend to the upper portion of the first region.

11. In paragraph 1, The above pores of the above first region are provided as empty spaces, A component using an anodic oxide film, wherein the pores of the second region are filled by the functional part.

12. In paragraph 1, A component using an anodic oxide film, comprising a blocking layer provided at the lower portion of the anodic oxide film body to close the lower opening of the pore.

13. In paragraph 1, A component using an anodic oxide film, wherein the vertical height of the pores in the first region is higher than the vertical height of the pores in the second region.

14. In paragraph 2, The above functional layer is a component using an anodic oxide film, which is a dielectric layer or an electrolyte layer.

15. A method for manufacturing a part using an anodic oxide film by forming a material inside the pores of an anodic oxide film body, A method for manufacturing a component using an anodic oxide film, wherein the photoresist process is performed before forming the material inside the pore, and the photoresist process is performed in a state where the pore is not opened so that fine particles of the photoresist do not enter the pore.

16. In paragraph 15, A step of performing a process of forming a first electrode in a first region after the above photoresist process; A step of opening the pores by removing the barrier layer of the second region where the first electrode is not formed; and A method for manufacturing a part using an anodic oxide film, comprising: forming the material within the pores of the second region.

17. In paragraph 16, A method for manufacturing a component using an anodic oxide film, wherein the vertical height of the first region is higher than the vertical height of the second region.

Images