Transfer method of connection member and display panel including connection member

Abstract

Disclosed are a connection sheet for connecting a substrate with a plurality of light-emitting diodes, and a display panel including the connection sheet. The connection sheet includes a plurality of first cutting lines arranged at first intervals, a plurality of second cutting lines arranged at second intervals and perpendicular to the plurality of first cutting lines, and a plurality of connection members partitioned in a lattice shape by the plurality of first cutting lines and the plurality of second cutting lines. Each of the plurality of connection members includes an adhesive resin and a plurality of conductive particles dispersed in the adhesive resin.

Description

A method for transferring a connecting member and a display panel including the connecting member

[0001] The present disclosure relates to a method for transferring a connecting member and a display panel including the connecting member.

[0002] When mounting multiple light-emitting diodes on a substrate, a conductive connection material is placed between the multiple light-emitting diodes and the substrate. An anisotropic conductive film containing multiple conductive balls is used as the connection material.

[0003] Anisotropic conductive film, an expensive interconnect material, is laminated across the entire surface of the substrate. The area requiring electrical connection across the entire substrate surface is limited to the area where multiple light-emitting diodes are connected. However, because expensive anisotropic conductive film is used even in areas of the substrate where electrical connection is not required, it increases the product cost.

[0004] The present disclosure provides a method for transferring a connecting member capable of reducing manufacturing costs and a display panel including the connecting member.

[0005] According to one or more embodiments, a connecting sheet connecting a substrate and a plurality of light-emitting diodes may include a plurality of first cutting lines arranged at a first interval; a plurality of second cutting lines arranged at a second interval and orthogonal to the plurality of first cutting lines; and a plurality of connecting members divided into a grid shape by the plurality of first cutting lines and the plurality of second cutting lines. Each of the plurality of connecting members may include an adhesive resin and a plurality of conductive particles dispersed within the adhesive resin.

[0006] According to one or more embodiments, a display panel may include: a substrate; a plurality of connecting members covering a plurality of substrate pads provided on the substrate; and a plurality of light-emitting diodes each connected to the substrate by the plurality of connecting members. Each of the plurality of connecting members may include an adhesive resin and a plurality of conductive particles dispersed within the adhesive resin.

[0007] Each of the above plurality of connecting members can cover a corresponding pair of substrate pads among the above plurality of substrate pads.

[0008] The size of each of the above plurality of connecting members may be larger than the area of ​​a corresponding pair of substrate pads.

[0009] The above display panel may further include a light-absorbing layer filled between the plurality of light-emitting diodes. The light-absorbing layer may be made of a resin having a black color.

[0010] The above light absorption layer can cover the substrate exposed between the plurality of connecting members.

[0011] The adhesive resin of the above-mentioned plurality of connecting members may have a black color.

[0012] The light absorbing layer may cover the substrate and the plurality of connecting members exposed between the plurality of connecting members. The light absorbing layer may surround the side surfaces of the plurality of light emitting diodes.

[0013] According to one or more embodiments, a method for transferring a connecting member may include: cutting a connecting sheet including an adhesive resin and a plurality of conductive particles dispersed within the adhesive resin to form a plurality of connecting members partitioned in a grid shape; picking up some of the connecting members arranged at a constant pitch among the plurality of connecting members with a stamp; moving the stamp to align some of the connecting members with corresponding substrate pads among a plurality of substrate pads provided on a substrate; and placing some of the connecting members on the corresponding substrate pads.

[0014] The step of forming the plurality of connecting members may include a step of forming a plurality of first cutting lines by vertically irradiating a laser beam onto the connecting sheet at regular intervals in the horizontal direction; and a step of forming a plurality of second cutting lines by vertically irradiating a laser beam onto the connecting sheet at regular intervals in the vertical direction in a direction orthogonal to the first cutting lines.

[0015] The method for transferring the above connecting member may further include, before the step of picking up some of the connecting members with a stamp, a step of inspecting whether a plurality of connecting members of the connecting sheet are defective using a vision camera; and a step of setting an area in the connecting sheet where a defective connecting member exists as a non-picking area based on the inspection.

[0016] The method for transferring the above-mentioned connecting member may further include, after the placing step, a step of inspecting the connecting member placed on the corresponding substrate pad using a vision camera; a step of removing the defective connecting member from the substrate if a defective connecting member is found based on the inspection; and a step of transferring a new connecting member to the position from which the defective connecting member was removed.

[0017] FIG. 1 is a drawing illustrating a display panel according to one or more embodiments.

[0018] FIG. 2 is a drawing showing a connecting sheet including a plurality of connecting members according to one or more embodiments.

[0019] Figures 3 to 6 are drawings for explaining a manufacturing process of a connecting member according to one or more embodiments.

[0020] FIG. 7 is a drawing showing an area where a defective connection member is placed in a connection sheet according to one or more embodiments.

[0021] FIGS. 8 to 13 are drawings for explaining a transfer process of pieces of a connecting member according to one or more embodiments.

[0022] Figure 14 is a flowchart showing an example of repairing a defective connection member mounted on a board.

[0023] FIG. 15 is a drawing showing an example of transferring a plurality of light-emitting diodes onto a substrate of a display panel according to one or more embodiments.

[0024] FIG. 16 is a drawing showing an example of thermally compressing a plurality of light-emitting diodes transferred to a substrate of a display panel according to one or more embodiments.

[0025] FIG. 17 is a drawing showing an example of forming a light absorption layer on a substrate of a display panel according to one or more embodiments.

[0026] FIG. 18 is a drawing illustrating a display panel according to one or more embodiments.

[0027] FIG. 19 is a block diagram illustrating a display device according to one or more embodiments.

[0028] Hereinafter, various embodiments will be described in more detail with reference to the accompanying drawings. One or more embodiments described herein may be variously modified. Specific embodiments may be depicted in the drawings and further described in the detailed description. However, the specific embodiments disclosed in the accompanying drawings are merely intended to facilitate understanding of various embodiments. Therefore, the technical concepts disclosed in the accompanying drawings are not intended to be limited by the specific embodiments disclosed in the accompanying drawings, but should be understood to include all equivalents or alternatives falling within the spirit and technical scope of the present disclosure.

[0029] In this disclosure, terms including ordinal numbers such as “first,” “second,” etc. may be used to describe various components, but these components are not limited by the aforementioned terms. The aforementioned terms are used solely for the purpose of distinguishing one component from another. In this disclosure, terms such as “comprises” or “has” should be understood to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but do not preemptively exclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. When a component is referred to as being “connected” or “connected” to another component, it should be understood that it may be directly connected or connected to the other component, but that other components may also be present in between. On the other hand, when a component is referred to as being “directly connected” or “directly connected” to another component, it should be understood that there are no other components present in between. In this disclosure, the term "identical" may encompass not only complete matching but also differences that take into account the scope of processing errors. If a detailed description of a related known function or configuration is deemed likely to unnecessarily obscure the gist of this disclosure, the detailed description will be abbreviated or omitted.

[0030] Below, with reference to the attached drawings, an embodiment of the present disclosure is described in detail so that those skilled in the art can easily implement the present disclosure. However, the embodiment of the present disclosure may be implemented in various different forms and is not limited to the embodiment of the present disclosure described herein.

[0031] Hereinafter, a display panel according to one or more embodiments will be described with reference to the drawings. According to one or more embodiments, the display panel (10) may be a flat display panel or a curved display panel having a screen having a predetermined curvature.

[0032] FIG. 1 is a cross-sectional view illustrating a display panel according to one or more embodiments.

[0033] Referring to FIG. 1, the display panel (10) may include a substrate (30), a plurality of connecting members (50a) provided on the substrate (30), and a plurality of light-emitting diodes (60) electrically and physically connected to the substrate (30) by the plurality of connecting members (50a).

[0034] According to one or more embodiments, the substrate (30) may be a glass substrate, a substrate made of a flexible synthetic resin series (e.g., polyimide (PI), polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), polycarbonate (PC), etc.), or a ceramic substrate.

[0035] According to one or more embodiments, a TFT layer including a TFT (thin film transistor) may be provided on a first surface (30a) of the substrate (30). The TFT provided on the TFT layer may be, for example, an LTPS TFT (low-temperature polycrystalline silicon TFT), an LTPO (low-temperature polycrystalline oxide) TFT, an oxide TFT, a Si TFT (poly silicon, a-silicon), an organic TFT, or a graphene TFT. The TFT may also be applied by manufacturing only a P-type (or N-type) MOSFET in a Si wafer CMOS process.

[0036] According to one or more embodiments, the TFT layer of the substrate (30) may be formed integrally with the first surface (30a) of the substrate (30), or may be manufactured in the form of a separate film and attached to the first surface (30a) of the substrate (30).

[0037] According to one or more embodiments, the second side (30b) of the substrate (30) may be provided with a power supply circuit for supplying power to the TFT circuit, a data drive driver, a gate drive driver, or a timing controller for controlling each drive driver.

[0038] According to one or more embodiments, the first side (30a) of the substrate (30) may be divided into an active region and a non-active region. The active region may be a region occupied by a TFT layer among the entire area of ​​the first side (30a) of the substrate (30). The non-active region may be a region excluding the active region among the entire area of ​​the first side (30a) of the substrate (30). The edge region of the substrate (30) may be the outermost region of the substrate. For example, the edge region of the substrate (30) may include a region corresponding to a side surface of the substrate, a portion of the first side (30a) of the substrate (30) adjacent to each side surface, and a portion of the second side (30b) of the substrate (30). A plurality of side wirings may be arranged in the edge region of the substrate (30) to electrically connect a TFT circuit on the first side (30a) of the substrate (30) and a driving circuit on the second side (30b) of the substrate (30).

[0039] According to one or more embodiments, the substrate (30) may omit the TFT layer on which the TFT circuit is formed. In this case, a plurality of micro IC chips that function as the TFT circuit may be mounted on the first surface (30a) of the substrate (30). In this case, the plurality of micro ICs may be electrically connected to a plurality of light-emitting diodes (60) arranged on the first surface (30a) of the substrate (30) via wiring.

[0040] According to one or more embodiments, the substrate (30) may have a plurality of pixels arranged on the TFT layer. Each pixel may be driven by a TFT circuit. One pixel may include at least two light-emitting diodes (60) that emit light of different colors. In the present disclosure, one light-emitting diode (60) may be referred to as one sub-pixel.

[0041] According to one or more embodiments, the light emitting diode (60) may be an inorganic light emitting diode having a size of 100 μm or less. The inorganic light emitting diode may be a micro LED or a mini LED.

[0042] According to one or more embodiments, the light emitting diode (60) may be formed in the form of a flip chip in which a first electrode pad (61) (e.g., an anode electrode pad) and a second electrode pad (62) (e.g., a cathode electrode pad) are arranged on opposite sides of the light emitting surface.

[0043] According to one or more embodiments, a plurality of connecting members (50a) may be laminated to a first surface (30a) of a substrate (30). In this case, the plurality of connecting members (50a) may cover a plurality of substrate pads (31, 32) provided on the substrate (30). For example, one connecting member (50a) may cover a corresponding pair of substrate pads (31, 32).

[0044] According to one or more embodiments, each connecting member (50a) includes a plurality of conductive particles to electrically connect electrode pads of a light-emitting diode (60) (first electrode pad (61) and second electrode pad (62)) and electrode pads of a substrate (30) corresponding to the electrode pads of the light-emitting diode (60) (first substrate pad (31) and second substrate pad (32)).

[0045] Each connecting member (50a) may have conductivity that allows electricity to flow in the pressing direction (the direction in which a plurality of light-emitting diodes (60) transferred to the substrate (30) are pressed toward the substrate (30) in the manufacturing process of the display panel (10)) so as to allow current to flow between the substrate pads (31, 32) of the substrate (30) and the electrode pads (61, 62) of the light-emitting diode (60), insulation that prevents electricity from flowing in the direction perpendicular to the pressing direction, and adhesiveness that allows a physically solid connection between the substrate pads (31, 32) of the substrate (30) and the electrode pads (61, 62) of the light-emitting diode (60).

[0046] According to one or more embodiments, the connecting member (50a) may include an adhesive resin (55, see FIG. 3) and a plurality of conductive particles (53, see FIG. 3) included in the adhesive resin (55). The plurality of conductive particles (53) may be anisotropic. Here, the anisotropy may be a property of the conductive particles (53), that is, a property of conducting electricity in a pressing direction and insulating in a direction perpendicular to the pressing direction. The plurality of conductive particles (53) may have a fine size. The diameter of each conductive particle (53) may be about 3 μm to 15 μm. Each conductive particle (53) may include a polymer particle and a conductive metal material (e.g., gold (Au), nickel (Ni), lead (Pd), etc.) coated on the surface of the polymer particle. The adhesive resin (55) may be a thermoplastic material (e.g., styrene butadiene, polyvinyl butylene, etc.) or a thermosetting material (epoxy resin, polyurethane, acrylic resin).

[0047] According to one or more embodiments, when a plurality of light emitting diodes (60) transferred to a substrate (30) are thermally compressed, the adhesive resin (55) of the connecting member (50a) melts and becomes fluid, so that the lower portions of the plurality of light emitting diodes (60) can be drawn into the connecting member (50a). Then, when the adhesive resin (55) of the connecting member (50a) is cured through a curing process, the plurality of light emitting diodes (60) can be physically firmly fixed to the first surface (30a) of the substrate (30).

[0048] According to one or more embodiments, the display panel (10) may further include a light-absorbing layer (70) provided between a plurality of light-emitting diodes (60) mounted on the substrate (30). The light-absorbing layer (70) may be formed of a resin having a black color with high optical density and low reflectivity to reduce interference of light emitted from adjacent light-emitting diodes (60) to improve contrast ratio and secure black visibility. For example, the resin having a black color may have a reflectivity of about 9% or less in the entire wavelength range of visible light (e.g., 390 nm to 700 nm).

[0049] FIG. 2 is a perspective view illustrating a connecting sheet including a plurality of connecting members according to one or more embodiments.

[0050] Referring to FIG. 2, the connecting sheet (50) may be an anisotropic conductive film (ACF) including an adhesive resin (55) and a plurality of conductive particles (53) that are regularly arranged or irregularly dispersed within the adhesive resin (55). The connecting sheet (50) may be formed with a first cutting line (L1) and a second cutting line (L2) that is orthogonal to the first cutting line (L1). The connecting sheet (50) may include a plurality of connecting members (50a) that are partitioned by the first cutting line (L1) and the second cutting line (L2).

[0051] According to one or more embodiments, a single connecting sheet (50) may be cut to form a plurality of connecting members (50a). The plurality of connecting members (50a) may be transferred to the substrate (30) at intervals, respectively. In this case, the position at which each connecting member (50a) is transferred to the substrate (30) may be the position of a pair of substrate pads (31, 32) provided on the first surface (30a) of the substrate (30). Accordingly, the connecting sheet (50) may not be laminated to the entire area of ​​the first surface (30a) of the substrate (30), but each connecting member (50a) may be selectively laminated only to a portion of the first surface (30a) of the substrate (30) (e.g., a corresponding pair of substrate pads (31, 32)). When the connection sheet (50) uses an expensive anisotropic conductive film (ACF), selectively laminating a plurality of connection members (50a) to only a portion of the substrate (30) can reduce the manufacturing cost of the display panel (10) compared to laminating the entire area of ​​the first surface (30a) of the substrate (30).

[0052] Hereinafter, a manufacturing process of a connecting member according to one or more embodiments will be described. FIGS. 3 to 6 are drawings for explaining a manufacturing process of a connecting member according to one or more embodiments.

[0053] FIG. 3 is a drawing showing an example of a release sheet attached to a connection sheet according to one or more embodiments.

[0054] Referring to FIG. 3, the connection sheet (50) can have a first release paper (45) and a second release paper (47) detachably attached to both sides. The connection sheet (50) can be stored and transported with the first release paper (45) and the second release paper (47) attached. The connection sheet (50) can include an adhesive resin (55) and a plurality of conductive particles (53) arranged in a grid shape inside the adhesive resin (55).

[0055] FIG. 4 is a drawing showing an example in which a connecting sheet according to one or more embodiments is mounted on a support plate.

[0056] Referring to Fig. 4, the first release paper (45) and the second release paper (47) attached to both sides of the connection sheet (50) are removed, and the connection sheet (50) is placed on the support plate (21).

[0057] FIG. 5 is a drawing showing an example of irradiating a laser beam with a connecting sheet according to one or more embodiments, and FIG. 6 is a drawing showing an example of forming a connecting sheet according to one or more embodiments with a plurality of connecting members.

[0058] Referring to Fig. 5, a laser beam (23) is irradiated in the vertical direction at regular intervals in the horizontal direction on the connecting sheet (50). A plurality of first cutting lines (L1) can be formed on the connecting sheet (50) as shown in Fig. 6.

[0059] Next, a laser beam (23) is irradiated to the connection sheet (50) in a direction perpendicular to the first cutting line (L1) at regular intervals in the vertical direction on the connection sheet (50). A plurality of second cutting lines (L2) can be formed on the connection sheet (50) as shown in Fig. 2.

[0060] Here, the first cutting line (L1) and the second cutting line (L2) may mean a straight-line shaped empty space formed by removing a portion of the connecting sheet (50) by the laser beam (23).

[0061] In this way, the connection sheet (50) may include a plurality of connection members (50a) defined by a first cutting line (L1) and a second cutting line (L2). In this case, the plurality of connection members (50a) may be arranged roughly in a grid shape. The plurality of connection members (50a) arranged in a grid shape may be individually or in multiple pieces picked by a stamp (25, see FIG. 8) and then placed in preset positions on the substrate (30).

[0062] FIG. 7 is a drawing showing an area where a defective connection member is placed in a connection sheet according to one or more embodiments.

[0063] Referring to Fig. 7, the connecting sheet (50) mounted on the support plate (21) can be manufactured into a plurality of connecting members (50a) as the first cutting line (L1) and the second cutting line (L2) are formed.

[0064] For a plurality of connecting members (50a) mounted on a support plate (21), the entire area of ​​the connecting sheet (50) can be inspected using a vision camera. For example, an area in which conductive particles (53) do not exist in the connecting members (50a) can be set as a non-pickable area (F). Accordingly, the connecting members (50a) present in the non-pickable area (F) are not picked by the stamp (25) during the transfer process.

[0065] FIGS. 8 to 13 are drawings for explaining a transfer process of a connecting member according to one or more embodiments.

[0066] FIG. 8 is a drawing showing the bottom surface of a stamp according to one or more embodiments.

[0067] Referring to Fig. 8, a plurality of connecting members (50a) mounted on a support plate (21) can be picked by a stamp (25). A plurality of elastic protrusions (26-1, 26-2, 26-3, 26-4) for picking a plurality of connecting members (50a) can be arranged in a grid shape on the bottom surface of the stamp (25).

[0068] The material of the plurality of elastic protrusions (26-1, 26-2, 26-3) may include an elastomer. In this case, the elastomer may include, but is not limited to, PDMS (polydimethylsiloxane). In addition, the plurality of elastic protrusions (26-1, 26-2, 26-3, 26-4) may each have an adhesive applied to the picking surface (27) that comes into contact with the adhesive member (50a).

[0069] The elastic protrusions (26-1, 26-2) adjacent in the horizontal direction may be spaced apart by a first pitch (P1), and the elastic protrusions (26-1, 26-4) adjacent in the vertical direction may be spaced apart by a second pitch (P2). The first pitch (P1) and the second pitch (P2) may be the same, but are not limited thereto.

[0070] FIG. 9 is a drawing showing an example in which a plurality of substrate pads are arranged on a substrate according to one or more embodiments.

[0071] Referring to FIG. 9, a plurality of substrate pads (31, 32) may be arranged in a grid arrangement on a substrate (30) to which a plurality of connecting members (50a) are to be transferred. In this case, the plurality of substrate pads (31, 32) may be spaced apart in the horizontal direction by a third pitch (P3) and in the vertical direction by a fourth pitch (P4). In this case, the third pitch (P3) may be substantially the same as the first pitch (P1), and the fourth pitch (P4) may be substantially the same as the second pitch (P2).

[0072] FIG. 10 is a drawing showing an example of aligning stamps on a connection sheet according to one or more embodiments.

[0073] Referring to Fig. 10, the stamp (25) is moved to the upper side of the plurality of connecting members (50a) to align the plurality of elastic protrusions (26-1, 26-2, 26-3, 26-4) of the stamp (25) with the plurality of connecting members (50a). The stamp (25) is lowered to pick up the plurality of connecting members (50a).

[0074] FIG. 11 is a drawing showing an example of picking multiple connecting members with a stamp according to one or more embodiments.

[0075] Referring to Fig. 11, the stamp (25) is raised to a predetermined height while a plurality of connecting members (50a) are picked by a plurality of elastic protrusions (26-1, 26-2, 26-3, 26-4).

[0076] FIG. 12 is a drawing showing a connection sheet according to one or more embodiments.

[0077] Referring to Fig. 12, when a plurality of connecting members (50a) are picked from a connecting sheet (50) through a stamp (25), empty spaces (57) are created at each position corresponding to the plurality of connecting members (50a) picked on the support plate (21).

[0078] FIG. 13 is a drawing showing an example of transferring a plurality of connecting members to a substrate according to one or more embodiments.

[0079] Referring to Fig. 13, the stamp (25) is moved to the upper side of the substrate (30) and aligned to a position where a plurality of connecting members (50a) are to be placed. Subsequently, the stamp (25) is lowered toward the substrate (30) and a plurality of connecting members (50a) are placed by applying a predetermined pressure onto a corresponding pair of substrate pads (31, 32).

[0080] According to one or more embodiments, after transferring a plurality of connecting members (50a) to a substrate (30), a plurality of light-emitting diodes (60) may be transferred to the substrate (30). However, the present invention is not limited thereto, and a process inspection may be performed before transferring a plurality of light-emitting diodes (60) to the substrate (30).

[0081] Figure 14 is a flowchart showing an example of repairing a defective connection member mounted on a board.

[0082] Referring to Fig. 14, for a plurality of connecting members (50a) transferred to a substrate (30), a vision camera is used to inspect whether there are any defects, such as whether there are no conductive particles (53) on the plurality of connecting members (50a) transferred to the substrate (30) or whether the plurality of connecting members (50a) transferred to the substrate (30) are transferred to the correct position (1401).

[0083] Based on the inspection results, if a defective connection member is found on the substrate (30), the defective connection member is removed from the substrate (30) (1402). In this case, the substrate (30) may be heated to a predetermined temperature to impart fluidity to the defective connection member so that the defective connection member can be easily removed from the substrate (30).

[0084] A new connecting member is transferred to the location where the defective connecting member has been removed on the substrate (30) (1403). In this case, in addition to the stamp (25) described above, another stamp capable of transferring individual connecting members to the substrate (30) may be used.

[0085] FIG. 15 is a drawing showing an example of transferring a plurality of light-emitting diodes onto a substrate of a display panel according to one or more embodiments.

[0086] Referring to Fig. 15, before transferring a plurality of light emitting diodes (60) to a substrate (30), the first electrode pad (61) and the second electrode pad (62) of each light emitting diode (60) are aligned with the first substrate pad (31) and the second substrate pad (32) of the substrate (30), respectively. After alignment, the plurality of light emitting diodes (60) can be transferred from a transfer carrier to the substrate (30) by a laser transfer method. In this case, the plurality of light emitting diodes (60) are not limited to the laser transfer method, and can be transferred to the substrate (30) by a pick-and-place transfer method or a stamp transfer method.

[0087] According to one or more embodiments, a plurality of light-emitting diodes (60) may be respectively mounted on the upper surfaces (59) of a plurality of connecting members (50a) transferred to the substrate (30). In this case, the first electrode pad (61) and the second electrode pad (62) provided on each light-emitting diode (60) are in contact with the upper surfaces (59) of the plurality of connecting members (50a).

[0088] FIG. 16 is a drawing showing an example of thermally compressing a plurality of light-emitting diodes transferred to a substrate of a display panel according to one or more embodiments.

[0089] Referring to Fig. 16, a plurality of light-emitting diodes (60) transferred to a substrate (30) can be thermally compressed toward the substrate (30) by a pressurizing device (80). In this case, the temperature of the heat emitted from the pressurizing device (90) can be about 60 degrees to 150 degrees, and the pressure can be about 10 Mpa or less.

[0090] According to one or more embodiments, the pressurizing device (80) may have an area approximately corresponding to the substrate (30) and may have a heater built into the inside including a heating coil. The pressurizing device (80) may release high-temperature heat while pressing the light-emitting surface (65) of the light-emitting diode (60) at a predetermined pressure.

[0091] According to one or more embodiments, the adhesive resin (55) of the connecting member (50a) may be made fluid by the heat emitted from the pressurizing device (80). Accordingly, the light emitting diode (40) may be inserted into the fluid connecting sheet (50) while being pressed toward the substrate (30) by the pressurizing device (90).

[0092] According to one or more embodiments, the first electrode pad (41) and the second electrode pad (42) of the light emitting diode (40) may be in contact with a plurality of conductive adhesive members (51) of a corresponding connection sheet (50). In this case, the first electrode pad (41) and the second electrode pad (42) of the light emitting diode (40) may be electrically connected to the first substrate pad (31) and the second substrate pad (32) of the corresponding substrate (30) through the plurality of conductive adhesive members (51) of the connection sheet (50). In addition, the lower portion of the light emitting diode (40) may be physically firmly fixed to the substrate (30) as the adhesive resin (55) is cured.

[0093] FIG. 17 is a drawing showing an example of forming a light absorption layer on a substrate of a display panel according to one or more embodiments.

[0094] Referring to FIG. 17, the display panel (10) may include a light absorption layer (70) formed between a plurality of light emitting diodes (60). The light absorption layer (70) may be applied to the substrate (30) using a photolithography method, an inkjet printing method, or a 3D printing method using a three-dimensional printer.

[0095] According to one or more embodiments, the light absorption layer (70) may be formed of a resin having a black color with high optical density and low reflectivity to reduce interference of light emitted from adjacent light emitting diodes (60) to improve contrast ratio and secure black visibility.

[0096] According to one or more embodiments, the light absorbing layer (70) may cover the first surface (30a) of the substrate (30) exposed between the plurality of connecting members (50a) and the plurality of connecting members (50a). In this case, the light absorbing layer (70) may surround the side surfaces (67) of the plurality of light emitting diodes (60). The upper surface (72) of the light absorbing layer (70) may have a height approximately equal to the height of the light emitting surface (65) of the light emitting diodes (60).

[0097] FIG. 18 is a drawing illustrating a display panel according to one or more embodiments.

[0098] Referring to FIG. 18, the light absorption layer (70') included in the display panel (10') may be formed to cover the first surface (30a) of the substrate (30) exposed between the plurality of connecting members (50a') and surround the side surfaces (58') of the plurality of connecting members (50a'). In this case, the upper surface (72') of the light absorption layer (70') included in the display panel (10') may have a height approximately equal to the height of the upper surfaces (59') of the plurality of connecting members (50a').

[0099] In this case, the adhesive resin (55') of the plurality of connecting members (50a') can be replaced with an adhesive resin having a black color. Accordingly, since both the light absorption layer (70') and the plurality of connecting members (50a') can have a black color, the black visibility of the display panel (10') can be improved.

[0100] FIG. 19 is a block diagram illustrating a display device according to one or more embodiments.

[0101] Referring to FIG. 19, a display device (1) may include a display module (3) and a processor (5). The display module (3) may include a display panel (10) and a display driver integrated circuit (IC) (7) for controlling the display panel (10).

[0102] The processor (5) may be implemented as a digital signal processor (DSP), a microprocessor, a graphics processing unit (GPU), an artificial intelligence (AI) processor, a neural processing unit (NPU), or a time controller (TCON) that processes a digital image signal. However, the present invention is not limited thereto, and may include one or more of a central processing unit (CPU), a micro controller unit (MCU), a micro processing unit (MPU), a controller, an application processor (AP), a communication processor (CP), or an ARM processor, or may be defined by the relevant terminology. In addition, the processor (5) may be implemented as a system on chip (SoC) or large scale integration (LSI) having a built-in processing algorithm, or may be implemented in the form of an application specific integrated circuit (ASIC), or a field programmable gate array (FPGA).

[0103] The processor (5) can control hardware or software components connected to the processor (5) by running an operating system or application program, and can perform various data processing and calculations. In addition, the processor (5) can load commands or data received from at least one of the other components into volatile memory and process them, and store various data in non-volatile memory.

[0104] The display driver IC (7) may include an interface module (7a), a memory (7b) (e.g., a buffer memory), an image processing module (7c), or a mapping module (7d). The display driver IC (7) may receive, for example, image information including image data or an image control signal corresponding to a command for controlling the image data, from another component of the display device (1) through the interface module (7a). For example, according to one embodiment, the image information may be received from a processor (5) (e.g., a main processor (e.g., an application processor) or an auxiliary processor (e.g., a graphics processing unit) that operates independently of the function of the main processor).

[0105] The display driver IC (7) can communicate with the sensor module through the interface module (7a). In addition, the display driver IC (7) can store at least a part of the received image information in the memory (7b), for example, on a frame basis. The image processing module (7c) can, for example, perform preprocessing or postprocessing (e.g., resolution, brightness, or size adjustment) on at least a part of the image data based on at least the characteristics of the image data or the characteristics of the display panel (10). The mapping module (7d) can generate a voltage value or a current value corresponding to the image data preprocessed or postprocessed through the image processing module (7c). According to one embodiment, the generation of the voltage value or the current value can be performed based at least in part on, for example, the properties of the pixels of the display panel (10) (e.g., the arrangement of the pixels (RGB stripe or pentile structure), or the size of each subpixel). At least some pixels of the display panel (10) may be driven based at least in part on, for example, the voltage value or current value, so that visual information (e.g., text, image, or icon) corresponding to the image data may be displayed through the display panel (10).

[0106] The display driver IC (7) can transmit a driving signal (e.g., a driver driving signal, a gate driving signal, etc.) to the display based on image information received from the processor (5).

[0107] The display driver IC (7) can display an image based on an image signal received from the processor (5). For example, the display driver IC (7) can display an image by generating a driving signal for a plurality of sub-pixels based on the image signal received from the processor (5) and controlling the light emission of the plurality of sub-pixels based on the driving signal.

[0108] According to one or more embodiments, the display module (3) may further include a touch circuit. The touch circuit may include a touch sensor and a touch sensor IC for controlling the same. The touch sensor IC may control the touch sensor to detect, for example, a touch input or a hovering input for a designated location of the display panel (10). For example, the touch sensor IC may detect a touch input or a hovering input by measuring a change in a signal (e.g., voltage, light quantity, resistance, or charge quantity) for a designated location of the display panel (10). The touch sensor IC may provide information (e.g., location, area, pressure, or time) about the detected touch input or hovering input to the processor (5). According to one embodiment, at least a portion of the touch circuit (e.g., the touch sensor IC) may be included as a part of the display driver IC (7), the display panel (10), or another component (e.g., a coprocessor) disposed externally to the display module (3).

[0109] According to one or more embodiments, the pixel driving method of the display module (3) may be an AM (active matrix) driving method or a PM (passive matrix) driving method.

[0110] According to one or more embodiments, the display device (1) may include a display module (3). The display module (3) may display various images. Here, the images may include still images and / or moving images. The display module (3) may display various images, such as broadcast content, multimedia content, etc. In addition, the display module (3) may also display a user interface and icons.

[0111] According to one or more embodiments, the display module (3) can be installed and applied in a wearable device, a portable device, a handheld device, and various electronic products or battlefields requiring a display.

[0112] According to one or more embodiments, the display device (1) may include a plurality of display modules (3). The plurality of display modules (3) may be physically connected to implement a large display (e.g., a large format display). The large display may be a monitor for a personal computer, a high-resolution television, a signage (or digital signage), or an electronic display by connecting a plurality of display modules in a grid arrangement.

[0113] While the present disclosure has been illustrated and described above with reference to various examples, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents.

Claims

1. In a connection sheet connecting a substrate and a plurality of light-emitting diodes, A plurality of first cutting lines arranged at first intervals; a plurality of second cutting lines arranged at second intervals and orthogonal to said plurality of first cutting lines; and A plurality of connecting members are divided into a grid shape by the plurality of first cutting lines and the plurality of second cutting lines; A connecting sheet, wherein each of the plurality of connecting members comprises an adhesive resin and a plurality of conductive particles dispersed within the adhesive resin.

2. On the display panel, substrate; a plurality of connecting members covering a plurality of substrate pads provided on the substrate; and A plurality of light emitting diodes, each connected to the substrate by the plurality of connecting members; A display panel, wherein each of the plurality of connecting members comprises an adhesive resin and a plurality of conductive particles dispersed within the adhesive resin.

3. In paragraph 2, A display panel, wherein each of the plurality of connecting members covers a corresponding pair of substrate pads among the plurality of substrate pads.

4. In paragraph 3, A display panel, wherein each of the plurality of connecting members has a size larger than the area of ​​a corresponding pair of substrate pads.

5. In paragraph 2, Further comprising a light absorbing layer filled between the plurality of light emitting diodes, A display panel in which the above light-absorbing layer is made of a resin having a black color.

6. In paragraph 5, A display panel, wherein the light absorbing layer covers the substrate exposed between the plurality of connecting members.

7. In paragraph 6, A display panel in which the adhesive resin of the above plurality of connecting members has a black series color.

8. In paragraph 5, A display panel, wherein the light absorbing layer covers the substrate and the plurality of connecting members exposed between the plurality of connecting members.

9. In paragraph 8, A display panel, wherein the light absorbing layer surrounds side surfaces of the plurality of light emitting diodes.

10. A step of cutting a connecting sheet including an adhesive resin and a plurality of conductive particles dispersed within the adhesive resin to form a plurality of connecting members partitioned in a grid shape; A step of picking up some of the connecting members arranged at a certain pitch among the above-mentioned plurality of connecting members using a stamp; A step of moving the stamp to align the some connecting members with corresponding substrate pads among a plurality of substrate pads provided on the substrate; and A method for transferring a connecting member, comprising: a step of placing some of the connecting members on the corresponding substrate pads; 11. In paragraph 10, The step of forming the above plurality of connecting members is: A step of forming a plurality of first cutting lines by irradiating a laser beam on the connecting sheet in a vertical direction at a predetermined interval in the horizontal direction; and A method for transferring a connecting member, comprising: a step of forming a plurality of second cutting lines by irradiating a laser beam onto the connecting sheet in a direction orthogonal to the first cutting line at regular intervals in the vertical direction of the connecting sheet.

12. In paragraph 10, Before the step of picking up some of the above connection absences with a stamp, A step of inspecting whether a plurality of connecting members of the above connecting sheet are defective using a vision camera; and A method for transferring a connecting member, further comprising: a step of setting an area in which a defective connecting member exists in the connecting sheet as a non-pickable area based on the inspection; 13. In paragraph 10, After the above playing step, A step of inspecting the above-described connecting member placed on the corresponding substrate pad using a vision camera; A step of removing a defective connection member from the substrate if a defective connection member is found based on the above inspection; and A method for transferring a connecting member, further comprising: a step of transferring a new connecting member to a location from which the defective connecting member has been removed.

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