Electronic device

Abstract

Embodiments of the present application provide an electronic device, capable of solving the problem that the layout area on a circuit board is insufficient. The electronic device comprises: a housing structure, at least comprising a first part and a second part, wherein the plane where the first part is located is different from the plane where the second part is located; and a circuit board assembly located on one side of the housing structure, wherein the circuit board assembly comprises at least two layers of circuit boards; the at least two layers of circuit boards at least comprise a first circuit board and at least one layer of second circuit board which are stacked; the first circuit board is located on the side of the second circuit board away from the housing structure; the distance from the first part to the first circuit board is larger than the distance from the second part to the first circuit board; each circuit board comprises a first surface and a second surface; functional devices are provided at positions of the circuit board assembly corresponding to the first part, and the number of surfaces on which the functional devices are provided is a first preset value; functional devices are provided at positions of the circuit board assembly corresponding to the second part, and the number of surfaces on which the functional devices are provided is a second preset value; and the first preset value is larger than the second preset value.

Description

electronic devices

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on May 26, 2023, with application number 202310610247.4 and application name “Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0003] As electronic devices like mobile phones and tablets become increasingly versatile and perform better, the need for more components to be integrated onto circuit boards is increasing. Conventional electronic devices have a single-layer circuit board, limiting the number of components to a single plane. However, as battery life and other factors increase, circuit board size decreases, resulting in a lack of layout space. Therefore, how to accommodate more components within this limited space is a pressing issue.

[0004] Summary of the Invention

[0005] In order to solve the above technical problems, the present application provides an electronic device that can solve the problem of insufficient layout area.

[0006] In a first aspect, an embodiment of the present application provides an electronic device, which includes: a shell structure, including at least a first part and a second part, and the plane where the first part is located is different from the plane where the second part is located; a circuit board assembly, along a first direction, the circuit board assembly is located on one side of the shell structure, wherein the first direction is perpendicular to the plane where the first part is located; the circuit board assembly includes at least two layers of circuit boards, the at least two layers of circuit boards include at least a first circuit board and at least one second circuit board arranged in a stacked manner, along the first direction, the first circuit board is located on the side of the second circuit board away from the shell structure, and the distance from the first part to the first circuit board is greater than the distance from the second part to the first circuit board; along the first direction, the circuit board includes two opposite surfaces, the two surfaces include a first surface and a second surface, functional devices are provided on the first surface and / or the second surface, the functional devices are provided at the position of the circuit board assembly corresponding to the first part, and the number of surfaces provided with functional devices is a first preset value; the functional devices are provided at the position of the circuit board assembly corresponding to the second part, and the number of surfaces provided with functional devices is a second preset value, and the first preset value is greater than the second preset value.

[0007] Exemplarily, the first direction is the Z-axis direction in the embodiment.

[0008] Exemplarily, the plane where the first portion is located is parallel to the plane where the second portion is located.

[0009] Exemplarily, the plane where each circuit board is located is parallel to the plane where the first part is located.

[0010] Exemplarily, the position of the circuit board assembly corresponding to the first portion is an area where a projection of the circuit board assembly on the plane formed by the X-axis and the Y-axis overlaps with a projection of the first portion on the plane formed by the X-axis and the Y-axis.

[0011] Illustratively, the position of the circuit board assembly corresponding to the second portion is an area where a projection of the circuit board assembly on the plane formed by the X-axis and the Y-axis overlaps with a projection of the second portion on the plane formed by the X-axis and the Y-axis.

[0012] Since each circuit board only includes two surfaces, the number of surfaces on which functional devices are installed is not only related to the surface of the circuit board on which the functional devices are installed, but also to the number of circuit boards. Because the plane where the first part is located is different from the plane where the second part is located, the height limit of the circuit board assembly by the housing structure is different. The embodiments of the present application flexibly utilize the height limit difference to increase the number of circuit boards in the Z-axis space, and the number of surfaces on which functional devices are installed is different at different locations. Alternatively, the number of circuit boards is the same, but the number of surfaces on which functional devices are installed is different, resulting in different heights of the circuit board assembly in the Z-axis direction. This fully utilizes the space of the electronic device in the Z-axis direction, increases the device layout area, improves the device integration, and solves the problem of insufficient layout area.

[0013] According to the first aspect, the position of the circuit board assembly corresponding to the first part, the number of circuit boards is a third preset value, the position of the circuit board assembly corresponding to the second part, the number of circuit boards is a fourth preset value, and the third preset value is greater than or equal to the fourth preset value.

[0014] Exemplarily, the number of circuit boards at the position corresponding to the first part of the shell structure in the circuit board assembly is three, the number of circuit boards at the position corresponding to the second part of the shell structure in the circuit board assembly is two, the number of surfaces of the three circuit boards is six, the number of surfaces of the two circuit boards is four, functional devices are arranged on five of the six surfaces, and functional devices are arranged on three of the four surfaces.

[0015] Exemplarily, at a position in the circuit board assembly corresponding to the first part of the shell structure, there are two circuit boards, and functional devices are set on four surfaces of the two circuit boards. At a position in the circuit board assembly corresponding to the second part of the shell structure, there are two circuit boards, and functional devices are set on three of the four surfaces of the two circuit boards.

[0016] According to the first aspect, or any implementation of the first aspect above, the circuit board assembly also includes at least one third circuit board, the first circuit board includes at least a first area and a second area, the second circuit board is at least located in the first area, and the first circuit board and at least one layer of the second circuit board are stacked in sequence, and the third circuit board is at least located in the second area, and the first circuit board and at least one layer of the third circuit board are stacked in sequence; the circuit board assembly also includes a supporting connector, located between two adjacent circuit boards, for supporting the circuit board and electrically connecting the two adjacent circuit boards; the first area is opposite to the first part, and the second area is opposite to the second part, functional devices are arranged in the first area, and the number of surfaces with functional devices is a first preset value, and functional devices are arranged in the second area, and the number of surfaces with functional devices is a second preset value.

[0017] That is, the number of circuit boards is large, so that more functional devices can be arranged without occupying the horizontal size of the electronic equipment.

[0018] Illustratively, the second circuit board is located not only in the first area but also in other areas, and the third circuit board is located not only in the second area but also in other areas.

[0019] According to the first aspect, or any implementation of the first aspect above, the electronic device further includes a back cover, and the shell structure is the back cover of the electronic device. Of course, the shell structure is not limited to the back cover, and can also be other structures.

[0020] When the shell structure is a back cover, the specific structure of the circuit board assembly can be set according to the shape of the back cover, thereby making full use of the space in the Z-axis direction, increasing the device layout area, improving the device integration, and solving the problem of insufficient layout area.

[0021] According to the first aspect, or any implementation of the first aspect above, the electronic device also includes a back cover with a decorative hole; the shell structure includes a camera decorative part (hereinafter referred to as the decorative part), the camera decorative part includes a shielding part and a skirt, the skirt at least partially surrounds the shielding part, the decorative part is fixed to the battery cover through the skirt, and the shielding part is exposed through the decorative hole; the first part is the shielding part, and the second part is the skirt; wherein, H1>H2>H3, H1 is the distance from the shielding part to the first circuit board, H2 is the distance from the back cover to the first circuit board, and H3 is the distance from the skirt to the first circuit board; the first circuit board includes a first area, a second area and a third area; the first area is opposite to the shielding part, the second area is opposite to the skirt, and the third area is opposite to the preset area of ​​the back cover, wherein the preset area of ​​the back cover is the part where the projection of the back cover on the plane where the first circuit board is located overlaps with the third area; the number of surfaces with functional devices in the first area is greater than the number of surfaces with functional devices in the second area, and greater than the number of surfaces with functional devices in the third area.

[0022] That is to say, the space between the plane where the shielding part is located and the first circuit board is larger, the space between the plane where the back cover is located and the first circuit board is moderate, and the space between the plane where the skirt is located and the first circuit board is smaller. More functional components and / or functional components with larger heights are arranged in the area with larger space, a moderate number of functional components and / or functional components with moderate heights are arranged in the area with moderate space, and fewer functional components and / or functional components with smaller heights are arranged in the area with smaller space, so as to make full use of the space of the electronic device in the Z-axis direction and solve the problem of insufficient layout area.

[0023] According to the first aspect, or any implementation of the first aspect above, along the second direction, the second area includes a first sub-area and a second sub-area arranged on both sides of the first area, wherein the second direction is perpendicular to the first direction; the circuit board assembly includes a first circuit board, two layers of second circuit boards and a layer of third circuit board, the two layers of second circuit boards are stacked in the first area at intervals, and the second circuit board adjacent to the first circuit board extends to the second sub-area and the third area, and the third circuit board is at least arranged in the second sub-area; the first surface is located on the side of the second surface away from the shell structure; functional devices are provided on both surfaces of the first circuit board, functional devices are provided on both surfaces of the second circuit board adjacent to the first circuit board, functional devices are provided on the second surface of the second circuit board away from the first circuit board, and functional devices are provided on the second surface of the third circuit board.

[0024] That is, the first area, the second sub-area and the third area share the same second circuit board, so as to reduce the number of circuit boards and further simplify the process steps.

[0025] Exemplarily, the second direction is the Y-axis direction in the embodiment.

[0026] According to the first aspect, or any implementation of the first aspect above, along the first direction, the height of the first functional component is less than the height of the second functional component, wherein the first functional component is the tallest functional component disposed on the second surface of the first circuit board in the first sub-region, and the second functional component is the tallest functional component disposed on the second surface of the first circuit board in other regions. This reduces the thickness of the supporting connector in the first sub-region, thereby ensuring a relatively low overall thickness of the circuit board assembly in the first sub-region.

[0027] According to the first aspect, or any implementation of the first aspect above, along the first direction, the height of the functional components on the second surface of the third circuit board is greater than the height of the functional components on the surfaces of other circuit boards. That is, the taller functional components are concentrated on the second surface of the third circuit board, thereby avoiding waste of Z-axis space caused by the uneven heights of functional components installed in other areas.

[0028] According to the first aspect, or any implementation of the first aspect above, the functional components on the second surface of the third circuit board include relatively high components such as a board-to-board connector.

[0029] According to the first aspect, or any implementation of the first aspect above, the second surface of the first circuit board, the first surface of the second circuit board adjacent to the first circuit board, and the supporting connecting member form a first accommodating space, the second surface of the second circuit board adjacent to the first circuit board, the first surface of the second circuit board away from the first circuit board, and the supporting connecting member form a second accommodating space, and the second surface of the first circuit board, the first surface of the third circuit board, and the supporting connecting member form a third accommodating space; the functional components on the second surface of the first circuit board corresponding to the first area, the second sub-area, and the third area and the functional components on the first surface of the second circuit board adjacent to the first circuit board are all located in the first accommodating space, the functional components on the second surface of the second circuit board adjacent to the first circuit board corresponding to the first area are located in the second accommodating space, and the functional components on the second surface of the first circuit board corresponding to the first sub-area are located in the third accommodating space, so as to protect the functional components.

[0030] According to the first aspect, or any implementation of the first aspect above, a shielding cover is provided on the outside of at least part of the functional components in the first surface of the first circuit board, the second surface of the second circuit board away from the first circuit board, and the second surface of the second circuit board adjacent to the first circuit board and corresponding to the second sub-area to protect the functional components.

[0031] Exemplarily, a shielding cover is provided on the outer side of the functional device on the first surface of the first circuit board, a shielding cover is provided on the outer side of the functional device on the second surface of the second circuit board away from the first circuit board, and / or a shielding cover is provided on the outer side of the functional device on the second surface of the second circuit board adjacent to the first circuit board and corresponding to the second sub-area.

[0032] According to the first aspect, or any implementation method of the first aspect above, a light-transmitting hole is provided on the shielding portion; the electronic device also includes a camera module, the projection of the camera module on the plane where the first part is located overlaps with the projection of the shielding portion on the plane where the first part is located, and the camera module collects light through the light-transmitting hole to realize the shooting function of the electronic device and improve the shooting effect of the camera module.

[0033] According to the first aspect, or any implementation of the first aspect above, the thickness of the camera module is greater than the distance between the shielding portion and the first circuit board; the first circuit board further includes a fourth region, the fourth region opposing the shielding portion, and the first circuit board defines a clearance hole in the fourth region, through which one end of the camera module passes. This ensures the normal operation of the camera module and fully utilizes the space of the electronic device in the Z-axis direction, thereby increasing the device layout area, improving device integration, and resolving the problem of insufficient layout area.

[0034] According to the first aspect, or any implementation of the first aspect above, the difference between the distance between the shielding portion and the first circuit board and the thickness of the camera module is within a preset range; the first circuit board further includes a fourth area, the fourth area being opposite the shielding portion, the camera module is disposed in the fourth area of ​​the first circuit board, and the camera module is fixed and supported by the first circuit board. This makes the placement of the camera module more flexible and frees up area on the support member of the middle frame to facilitate the placement of other structures on the support member.

[0035] According to the first aspect, or any implementation of the first aspect above, the difference between the distance between the shielding portion and the third circuit board and the thickness of the camera module is within a preset range; the third circuit board extends below the camera module, the camera module is disposed on the third circuit board, and the camera module is fixed and supported by the third circuit board. This allows for greater flexibility in the placement of the camera module and frees up space on the support member of the midframe for facilitating the placement of other structures on the support member.

[0036] According to the first aspect, or any implementation of the first aspect above, when the circuit board assembly further includes a supporting connector, the supporting connector includes a frame plate. A frame plate is a type of PCB that has the same or substantially the same structure as a conventional PCB and contains internal traces for electrical connections. The frame plate can be manufactured by segmenting a single PCB. When placed on a circuit board, the frame plate occupies less area on the circuit board, freeing up space for arranging more components.

[0037] According to the first aspect, or any implementation of the first aspect above, when the circuit board assembly further includes a supporting connector, the supporting connector is integrally formed with the circuit board. For example, the integrally formed supporting connector and circuit board can be formed using a manufacturing process for a PCB cavity (local recessed) structure. Furthermore, since the supporting connector and circuit board do not require reflow soldering, the number of reflows can be reduced, thereby avoiding the impact on functional components on the circuit board caused by a high number of reflows. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0039] FIG2 is an exploded view of an electronic device provided in an embodiment of the present application;

[0040] FIG3 is a cross-sectional view of the electronic device shown in FIG1 along the WW' direction;

[0041] FIG4 is a schematic structural diagram of a decorative element provided in an embodiment of the present application;

[0042] FIG5 is a top view of the positional relationship between the decorative component and the circuit board assembly provided in an embodiment of the present application;

[0043] FIG6 is a side view of the positional relationship of the decorative element, the circuit board assembly, and the battery cover provided in an embodiment of the present application;

[0044] FIG7 is another side view of the positional relationship of the decorative component, the circuit board assembly, and the battery cover provided in an embodiment of the present application;

[0045] FIG8 is another side view of the positional relationship of the decorative element, the circuit board assembly, and the battery cover provided in an embodiment of the present application;

[0046] FIG9 is another side view of the positional relationship of the decorative member, the circuit board assembly, and the battery cover provided in an embodiment of the present application;

[0047] FIG10 is a flow chart of a method for preparing a circuit board assembly provided in an embodiment of the present application. DETAILED DESCRIPTION

[0048] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0049] The term "and / or" in this article is merely a description of the association relationship between associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0050] In the description and claims of the embodiments of this application, the terms "first" and "second" are used to distinguish different objects, rather than to describe a specific order of objects. For example, the terms "first target object" and "second target object" are used to distinguish different objects, rather than to describe a specific order of objects.

[0051] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0052] In the description of the embodiments of this application, unless otherwise specified, "multiple" means two or more. For example, "multiple processing units" means two or more processing units; "multiple systems" means two or more systems.

[0053] The embodiments of the present application provide an electronic device. The electronic device provided in the embodiments of the present application can be a mobile phone, a tablet computer, a laptop computer, a personal digital assistant (PDA), an in-car computer, a television, a smart wearable device (such as a smart watch, a smart bracelet, etc.), a smart home device, etc. The embodiments of the present application do not specifically limit the specific form of the above-mentioned electronic devices. For the convenience of explanation, the following description takes the electronic device as an example.

[0054] 1 , which is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. As shown in FIG1 , the mobile phone includes a middle frame 10 , a housing assembly 20 , and a display screen 30 .

[0055] In Figure 1, the mobile phone 100 is in the shape of a rectangular flat plate. In order to facilitate the clear description of the subsequent structural features and the positional relationship of the structural features, the positional relationship of the various structures in the mobile phone is specified in terms of the X-axis direction, the Y-axis direction and the Z-axis direction, wherein the X-axis direction is the width direction of the mobile phone, the Y-axis direction (also referred to as the second direction) is the length direction of the mobile phone, and the Z-axis direction (also referred to as the first direction) is the thickness direction of the mobile phone. It is understandable that the coordinate system (i.e., the X-axis, Y-axis and Z-axis) of the electronic device can be flexibly set according to actual needs and is not specifically limited here. In other optional embodiments, the shape of the electronic device can also be a square flat plate, a circular flat plate, an elliptical flat plate, etc. Of course, the electronic device can also be a foldable electronic device, etc.

[0056] Refer to Figure 2, which is an exploded view of an electronic device provided in an embodiment of the present application. As shown in Figures 1 and 2, the middle frame 10 includes an appearance part 11 and a support part (not shown in the figure). The appearance part 11, the shell assembly 20 and the display screen 30 of the middle frame 10 can surround the accommodating cavity, and the support part of the middle frame 10 is located between the display screen 30 and the shell assembly 20. Structures such as a printed circuit board (PCB) 40, a flexible printed circuit (FPC) 50, a camera module 60, and a battery 70 are arranged in the accommodating cavity. The support part of the middle frame 10 can support some structures and / or the display screen 30 in the accommodating cavity. For example, the display screen 30 is fixed to the support part by adhesive.

[0057] In the embodiment of the present application, the PCB 40 includes a main board 41 and a sub-board 42. Along the Y-axis direction, the main board 41 and the sub-board 42 are respectively arranged on both sides of the battery 70. The FPC 50 passes through the battery 70 (located on one side of the battery 70 along the Z-axis direction) and electrically connects the main board 41 and the sub-board 42 to realize the transmission of data and signals between the main board 41 and the sub-board 42.

[0058] The motherboard 40 integrates functional components such as a control chip. The control chip includes, for example, a system on chip (SoC), an application processor (AP), a radio frequency device, and a baseband device (not shown). The SoC integrates, for example, a central processing unit (CPU), a graphics processing unit (GPU), and a modem.

[0059] The sub-board 50 integrates functional components such as Universal Serial Bus (USB) components.

[0060] The so-called functional devices are all electronic components provided on the PCB, which include, for example, control chips, USB devices, etc., as well as passive devices such as resistors, capacitors, and inductors.

[0061] The camera module 60 includes, for example, a rear camera 61, and the number of the rear cameras 61 can be one or more. When there are multiple rear cameras 61, the functions of the multiple rear cameras 61 can be different. In one possible implementation, the number of rear cameras 61 is, for example, three, one of which is responsible for the main camera, one of which is responsible for zoom, and one of which is responsible for wide-angle, etc. In some embodiments, the camera module 60 also includes a flash 62. When a user uses the camera function of the mobile phone to take pictures in a dark environment, the flash 62 can provide fill light to improve the shooting effect.

[0062] The rear camera 61 is electrically connected to the mainboard 41 via an FPC 50. In some embodiments, a board-to-board connector (BTB) (not shown) is provided between the FPC 50 of the rear camera 61 and the mainboard 41, and the FPC 50 of the rear camera 61 is electrically connected to the mainboard 41 via the BTB. Similarly, the FPC 50 electrically connecting the mainboard 41 and the sub-board 42 can also be electrically connected to the mainboard 41 and the sub-board 42 via the BTB. That is, one BTB can be provided between the mainboard 41 and the FPC 50 (the FPC 50 electrically connecting the mainboard 41 and the sub-board 42), and the FPC 50 is electrically connected to the mainboard 41 via the BTB. Another BTB can be provided between the sub-board 42 and the FPC 50, and the same FPC 50 is electrically connected to the sub-board 42 via the BTB, thereby electrically connecting the mainboard 41 and the sub-board 42 via the FPC 50.

[0063] The battery 70 is used to supply power to the display screen 30 , at least some functional components on the main board 41 , at least some functional components on the sub-board 42 , and the camera module 60 , etc., to ensure their normal operation.

[0064] 1 and 2 , the housing assembly 20 includes a battery cover (also referred to as a rear cover or rear shell) 21 and a decorative member 22 . A decorative hole 211 is formed on the battery cover 21 .

[0065] Referring to FIG. 3 , FIG. 3 is a cross-sectional view of the electronic device shown in FIG. 1 along the WW' direction. It should be noted that, to more clearly illustrate the positional relationship between the battery cover 21, decorative member 22, and camera module 60, FIG. 3 only illustrates the battery cover 21, decorative member 22, and camera module 60, and does not illustrate other structures, such as the display screen 30. As shown in FIG. 2 and FIG. 3 , decorative member 22 includes a shielding portion 221 and a skirt 222. Skirt 222 surrounds shielding portion 221. The plane in which shielding portion 221 lies (i.e., the plane formed by the X-axis and the Y-axis) differs from the plane in which skirt 222 lies (i.e., the plane formed by the X-axis and the Y-axis). Thus, shielding portion 221 and skirt 222 are located in different planes. Accordingly, decorative member 22 also includes, for example, a connecting portion 223 connecting shielding portion 221 and skirt 222. Shielding portion 221 is provided with a light-transmitting hole 2211.

[0066] The decorative member 22 is secured to the battery cover 21 via a skirt 222. The obstructing portion 221 of the decorative member 22 is exposed through the decorative hole 211 of the battery cover 21, and at least a portion of the connecting portion 223 is located within the decorative hole 211. Along the Z-axis, the rear camera 61 is opposed to the obstructing portion 221. That is, the projection of the rear camera 61 on the plane formed by the X-axis and the Y-axis overlaps with the projection of the obstructing portion 221 on the plane formed by the X-axis and the Y-axis. The rear camera 61 collects light through the light-transmitting hole 2211 to achieve functions such as taking photos and / or videos.

[0067] It should be noted here that Figures 1 to 3 are used as an example to illustrate that the connecting portion 223 is perpendicular to the shielding portion 221 and the skirt 222 respectively, but this does not constitute a limitation to the present application. In other optional embodiments of the present application, refer to Figure 4, which is a structural schematic diagram of a decorative part provided in an embodiment of the present application. As shown in Figure 4, the connecting portion 223 can also be set at an angle. For example, the connecting portion 223 is in the shape of a crater. The so-called crater shape is a trumpet shape that is narrow at the top and wide at the bottom. By setting the crater shape, the appearance quality of the electronic device can be improved.

[0068] The embodiment of the present application does not limit the shape of the decorative hole 211. For example, the decorative hole 211 may be shaped like a racetrack, a circle, a square with rounded corners, or a rectangle with rounded corners. The embodiment of the present application uses a circular shape as an example for the description of the decorative hole 211. It is understood that the racetrack shape can be formed by two arcs surrounding two opposing sides of a rectangle, wherein the two arcs are arranged opposite each other and are adjacent to the opposing sides.

[0069] It is understandable that the shape of the shielding portion 221 corresponds to the shape of the decorative hole 211. For example, when the shape of the decorative hole 211 is circular, the shape of the shielding portion 221 is also circular.

[0070] As can be seen from the background technology, as the functions of electronic devices such as mobile phones and tablets are gradually enriched and their performance is gradually improved, it is required that more devices can be integrated on the PCB (i.e., the main board and / or sub-board). The PCB in conventional electronic devices has only one layer, and more devices can only be arranged in the plane direction. However, as the battery life capacity increases (i.e., the size of the battery increases), the size of the circuit board decreases accordingly; and in order to meet better shooting needs, the number of cameras included in the camera module increases, and the size of the camera module becomes larger, resulting in the center area of ​​the main board becoming larger and larger due to the hole to avoid the camera module, which in turn leads to a reduction in the projection area of ​​the main board on the plane formed by the X-axis and the Y-axis. As a result, the PCB layout area is insufficient. In other words, the area of ​​the PCB where the functional devices are set is small, which cannot meet the requirement of integrating more devices on the PCB.

[0071] Based on this, an embodiment of the present application also provides an electronic device, which includes a shell structure and a circuit board assembly located on one side of the shell structure. When the heights of different areas of the shell structure are different, the number of surfaces (surfaces of the circuit board) in the circuit board assembly corresponding to different areas of the shell structure where functional devices are set is different. The number of surfaces in the circuit board assembly corresponding to the same area of ​​the shell structure (same height) but different positions where functional devices are set can be the same or different. The circuit board assembly includes at least two layers of circuit boards, each layer of circuit boards including two opposite surfaces along the Z-axis. The different numbers of surfaces on which functional devices are provided can be achieved by having different numbers of circuit board layers stacked in different regions of the housing structure in the circuit board assembly, with functional devices provided on both surfaces of each circuit board. Alternatively, the number of circuit board layers stacked in different regions of the housing structure in the circuit board assembly is the same, but the number of surfaces on which functional devices are provided is different. Alternatively, the number of circuit board layers stacked in different regions of the housing structure in the circuit board assembly is different, and the number of surfaces on which functional devices are provided is also different. In other words, the space in the Z-axis direction of the electronic device is increased by increasing the number of circuit boards, thereby increasing the device layout area and improving the device integration. Different regions of the housing structure have different height restrictions on the circuit board assembly, and accordingly, the number of surfaces on which functional devices are provided in the circuit board assembly corresponding to different regions is different, thereby fully utilizing the space in the Z-axis direction of the electronic device and solving the problem of insufficient layout area. The housing structure can be, for example, the decorative component described above, or a battery cover (for example, for electronic devices with different heights of different regions of the battery cover, such as a smart watch), etc., and this embodiment of the present application is not limited thereto.

[0072] The specific structure of the shell structure and circuit board assembly provided in the embodiment of the present application and the positional relationship of each structure are described below with reference to specific examples. In order to more conveniently and clearly describe the subsequent scheme, the following example uses the shell structure as a decorative part to illustrate the specific structure of the shell structure and circuit board assembly and the positional relationship of each structure. The following content does not constitute a limitation of the present application.

[0073] It can be understood that when the shell structure is a battery cover, etc., the specific structure of the circuit board assembly corresponding to different areas of the battery cover and the effects produced are the same as the examples below where the shell structure is a decorative part. The specific structure of the circuit board assembly when the shell structure is a battery cover and the positional relationship of each structure will not be repeated below.

[0074] Referring to Figures 5 and 6 , Figure 5 shows a top view of the relationship between the decorative element and the circuit board assembly according to an embodiment of the present application, and Figure 6 shows a side view of the relationship between the decorative element, the circuit board assembly, and the battery cover according to an embodiment of the present application. As shown in Figures 5 and 6 , the PCB 40 includes a circuit board assembly 43. Specifically, the main board 41 and / or the sub-board 42 described above constitute the circuit board assembly 43. The present embodiment is described using the main board 41 as the circuit board assembly 43. The circuit board assembly 43 includes a first circuit board 431, which includes at least two areas, namely a first area A1 and a second area A2. The circuit board assembly 43 also includes at least one second circuit board 432 stacked in the first area A1 and at least one third circuit board 433 stacked in the second area A2. Adjacent circuit boards are stacked with an interval along the Z-axis. The interval means that the adjacent circuit boards are spaced apart along the Z-axis and do not directly contact each other. The circuit board assembly 43 also includes a supporting connector 434. Along the Z-axis direction, the supporting connector 434 is located between two adjacent layers of circuit boards for supporting the circuit boards and electrically connecting the two adjacent circuit boards. The two adjacent circuit boards and the supporting connector 434 located between the two adjacent layers of circuit boards form a storage space. Along the Z-axis direction, each layer of circuit board includes a first surface and a second surface opposite to each other, and a functional device 80 is provided on the first surface and / or the second surface of each layer of circuit board, and the functional device 80 located between the two adjacent layers of circuit boards is provided in the storage space, that is, along the Z-axis direction, the first circuit board 431, the second circuit board 432 and the third circuit board 433 all include a first surface and a second surface opposite to each other, and a functional device 80 is provided on the first surface and / or the second surface of the first circuit board 431, the functional device 80 is provided on the first surface and / or the second surface of the second circuit board 432, and the functional device 80 is provided on the first surface and / or the second surface of the third circuit board 433. The functional device 80, the functional device 80 between the first circuit board 431 and one of the second circuit boards 432 is located in the accommodation space surrounded by the first circuit board 431, one of the second circuit boards 432 and the supporting connecting member 434 between the two circuit boards, the functional device 80 between the two second circuit boards 432 is located in the accommodation space surrounded by the two second circuit boards 432 and the supporting connecting member 434 between the two second circuit boards 432, and the functional device 80 between the first circuit board 431 and the third circuit board 433 is located in the accommodation space surrounded by the first circuit board 431, the third circuit board 433 and the supporting connecting member 434 between the two circuit boards.

[0075] As can be seen from the foregoing, the decorative element includes a shielding portion 221 (also referred to as the first portion) and a skirt 222 (also referred to as the second portion). The shielding portion 221 and the skirt 222 are located in different planes. Specifically, along the Z-axis, the distance from the plane containing the shielding portion 221 to the first circuit board 431 is greater than the distance from the plane containing the skirt 222 to the first circuit board 431. A first area A1 opposes the shielding portion 221, while a second area A2 opposes the skirt 222. In other words, the projection of the shielding portion 221 on the first circuit board 431 overlaps with the first area A1, while the projection of the skirt 222 on the first circuit board 431 overlaps with the second area A2. The number of surfaces provided with functional devices in the first area A1 is greater than the number of surfaces provided with functional devices in the second area A2. Since each circuit board has only two surfaces, the number of surfaces provided with functional devices is related to the number of circuit boards. When the number of surfaces provided with functional devices in the first area A1 is greater than the number of surfaces provided with functional devices in the second area A2, the number of second circuit boards 432 in the first area A1 may be greater than the number of third circuit boards 433 in the second area A2, or the number of second circuit boards 432 in the first area A1 and the number of third circuit boards 433 in the second area A2 may be the same, but no functional devices are provided on the first or second surfaces of the third circuit boards 433 in the second area A2. This allows the circuit board assemblies 43 in the first area A1 and the second area A2 to have different heights in the Z-axis direction, thereby corresponding to different portions of the decorative element (the first area A1 corresponds to the first portion, and the second area A2 corresponds to the second portion). Compared to providing more functional devices in a planar direction, this embodiment of the present application can fully utilize the space in the Z-axis direction of the electronic device, solving the problem of insufficient layout area.

[0076] That is to say, the distance from the plane where the shielding portion 221 is located to the first circuit board 431 is greater than the distance from the plane where the skirt 222 is located to the first circuit board 431. Therefore, the space between the plane where the shielding portion 221 is located and the first circuit board 431 is larger, and the space between the plane where the skirt 222 is located and the first circuit board 431 is smaller. More functional components 80 and / or functional components 80 with larger heights are arranged in areas with larger space, and fewer functional components 80 and / or functional components 80 with smaller heights are arranged in areas with smaller space, so as to make full use of the space of the electronic equipment in the Z-axis direction and solve the problem of insufficient layout area.

[0077] It should be noted that the number of surfaces with functional devices installed at different locations within the same area can be the same or different, and can be determined based on the height of the functional devices installed at different locations. For example, the second area A2 includes a first sub-area A21 and a second sub-area A22. Both the first sub-area A21 and the second sub-area A22 are provided with two-layer circuit boards. The first sub-area A21 is provided with taller devices such as BTBs. Therefore, functional devices are installed on only three of the four surfaces of the first sub-area A21, while functional devices are installed on all four surfaces of the second sub-area A22.

[0078] For example, referring again to Figures 5 and 6, the circuit board assembly 43 includes a first circuit board 431, which includes a first area A1, a second area A2, and a third area A3. The first area A1 is opposite the shielding portion 221, i.e., the projection of the shielding portion 221 on the plane of the first circuit board 431 overlaps with the first area A1. The second area A2 is opposite the skirt 222, i.e., the projection of the skirt 222 on the plane of the first circuit board 431 overlaps with the second area A2. The third area A3 is opposite the predetermined area of ​​the battery cover 21, i.e., the portion where the projection of the battery cover 21 on the plane of the first circuit board 431 overlaps with the third area A3. The second area A2 includes a first sub-area A21 and a second sub-area A22. The first sub-area A21 and the second sub-area A22 correspond to different positions on the skirt 222. For example, the first sub-area A21 corresponds to a first position 2221 of the skirt 222, and the second sub-area A22 corresponds to a second position 2222 of the skirt 222. Along the Y-axis, the first position 2221 and the second position 2222 are located on opposite sides of the shielding portion 221. The shielding portion 221, the skirt 222, and the predetermined area of ​​the battery cover 21 are all located on different planes. Specifically, along the Z-axis, the distance H1 between the plane where the shielding portion 221 resides and the first circuit board 431 is greater than the distance H2 between the plane where the predetermined area of ​​the battery cover 21 resides and the first circuit board 431. The distance H2 between the plane where the predetermined area of ​​the battery cover 21 resides and the first circuit board 431 is also greater than the distance H3 between the plane where the skirt 222 resides and the first circuit board 431.

[0079] The circuit board assembly 43 also includes two layers of second circuit boards 432 stacked in the first area A1 and a layer of third circuit board 433 stacked in the first sub-area A21 of the second area A2, and the second circuit board 432 adjacent to the first circuit board 431 in the two layers of second circuit boards 432 arranged in the first area A1 extends to the second sub-area A22 and the third area A3 of the second area A2. This is because most of the area relative to the blocking portion 221 is used to set the camera module 60, and the remaining area can be used to set the circuit board. The circuit board of the area adjacent to the remaining area (that is, the area where the second sub-area A22 is located) and the circuit board of the area where the third area A3 adjacent to the area where the second sub-area A22 is located can be the same circuit board as the circuit board set in the remaining area, so as to reduce the number of circuit boards and simplify the process steps. In this way, the first area A1 includes three layers of circuit boards (one layer of first circuit board 431 and two layers of second circuit boards 432), the first sub-area A21 of the second area A2 includes two layers of circuit boards (one layer of first circuit board 431 and one layer of third circuit board 433), the second sub-area A22 of the second area A2 includes two layers of circuit boards (one layer of first circuit board 431 and one layer of second circuit board 432), and the third area A3 includes two layers of circuit boards (one layer of first circuit board 431 and one layer of second circuit board 432), and the second circuit board 432 of the second sub-area A22 and the second circuit board 432 of the third area A3 are the same circuit board as one of the second circuit boards 432 in the first area A1 (the second circuit board 432 adjacent to the first circuit board 431).

[0080] Along the Z-axis direction, the first circuit board 431 and the third circuit board 433 are stacked at intervals, and the first circuit board 431 and the two second circuit boards 432 are stacked at intervals in sequence, that is, the first circuit board 431 and one of the second circuit boards 432 (the second circuit board 432 adjacent to the first circuit board 431) are stacked at intervals, and one of the second circuit boards 432 (the second circuit board 432 adjacent to the first circuit board 431) and the other second circuit board 432 (the second circuit board 432 away from the first circuit board 431) are stacked at intervals.

[0081] The circuit board assembly 43 further includes a supporting connector 434. Along the Z-axis direction, at least one supporting connector 434 (also referred to as a first supporting connector) is provided between the first circuit board 431 and one of the second circuit boards 432. The at least one supporting connector 434 is, for example, provided at the periphery of the second circuit board 432. The supporting connector 434 is used to support the second circuit board 432 and electrically connect the first circuit board 431 and the second circuit board 432. At least one supporting connector is also provided between one of the second circuit boards 432 (the second circuit board 432 that is adjacent to the first circuit board 431) and another second circuit board 432 (the second circuit board 432 that is away from the first circuit board 431). Connectors 434 (also called second supporting connectors) are provided. At least one supporting connector 434 is, for example, disposed on the periphery of another second circuit board 432. This supporting connector 434 is used to support the other second circuit board 432 and electrically connect the two second circuit boards 432. At least one supporting connector 434 (also called third supporting connector) is also provided between the first circuit board 431 and the third circuit board 433. At least one supporting connector 434 is, for example, disposed on the periphery of the third circuit board 433. This supporting connector 434 is used to support the third circuit board 433 and electrically connect the first circuit board 431 and the third circuit board 433. Along the Z-axis, each circuit board includes a first surface and a second surface facing away from each other. The second surface is located on the side of the first surface facing away from the display screen 30. Alternatively, the first surface is located on the side of the second surface facing away from the battery cover 21. The second surface of the first circuit board 431, the first surface of the third circuit board 433 and the third supporting connecting member 434 between the first circuit board 431 and the third circuit board 433 form a accommodating space (also called a third accommodating space), the second surface of the first circuit board 431, the first surface of one of the second circuit boards 432 and the first supporting connecting member 434 between the first circuit board 431 and the second circuit board 432 form another accommodating space (also called a first accommodating space), the second surface of one of the second circuit boards 432, the first surface of another second circuit board 432 and the second supporting connecting member 434 between the two second circuit boards 432 form another accommodating space (also called a second accommodating space).

[0082] Functional devices 80 are provided on the first surface and the second surface of the first circuit board 431, wherein functional devices 80 are provided on the first surface and the second surface of one second circuit board 432 (the second circuit board 432 adjacent to the first circuit board 431), functional devices 80 are provided on the second surface only of the other second circuit board 432, and functional devices 80 are provided on the second surface only of the third circuit board 433, and the height of the highest functional device 80 in the first sub-area A21 of the second area A2 is less than the height of the highest functional device 80 in the first area A1, so as to reduce the thickness of the supporting connection 434 between the first circuit board 431 and the third circuit board 433, thereby ensuring that the overall thickness of the circuit board assembly 43 of the first sub-area A21 is as small as possible. The functional devices 80 on the second surface of the first circuit board 431 corresponding to the first area A1, the second sub-area A22 and the third area A3 and the functional devices 80 on the first surface of the second circuit board 432 are both located in the first accommodation space, the functional devices 80 on the second surface of the second circuit board 432 adjacent to the first circuit board 431 corresponding to the first area A1 are located in the second accommodation space, and the functional devices 80 on the second surface of the first circuit board 431 corresponding to the first sub-area are located in the third accommodation space to protect the functional devices 80. In addition, a shielding cover 90 can be set on the outside of the functional device 80 that is not set in the accommodation space to protect the functional device 80, such as the functional devices 80 on the first surface of the first circuit board 431 and the functional devices 80 on the second surface of the second circuit board 432 are both provided with shielding covers 90, etc.

[0083] That is to say, since the distances from the shielding portion 221 of the decorative member 22, the skirt 222 of the decorative member 22 and the preset area of ​​the battery cover 21 to the first circuit board 41 are different, that is, the height restrictions on the circuit board assembly 43 by the shielding portion 221 of the decorative member 22, the skirt 222 of the decorative member 22 and the preset area of ​​the battery cover 21 are different, by utilizing the height restriction difference, the five surfaces in the first area A1 (the two surfaces of the first circuit board 431, the two surfaces of one of the second circuit boards 432 and the second surface of the other second circuit board 432) are provided with functional devices 80, and the second sub-area A22 of the second area A2 and the four surfaces in the third area A3 (the two surfaces of the first circuit board 431 and the two surfaces of one of the second circuit boards 432) are provided with functional devices 80. Functional devices 80 are provided on the first surface of the battery cover 21, and because the third area A3 corresponds to the higher elevation of the predetermined area of ​​the battery cover 21, the height of the functional device 80 is greater on one surface of the third area A3, such as the position on the second surface of the second circuit board 432 corresponding to the third area A3. This reduces the thickness of the supporting connector 434 between the first circuit board 431 and the second circuit board 432. Functional devices are provided on three surfaces of the first sub-area A21 of the second area A2, allowing for a taller functional device to be provided on one surface of the first sub-area A21 of the second area A2. For example, a thicker BTB can be provided on the second surface of the third circuit board 433, such as the BTB connecting the FPC 50 and the mainboard 41 described above. This fully utilizes the Z-direction space of the entire device and solves the problem of insufficient layout area.

[0084] It is understandable that the thickness of the supporting connector 434 can be determined according to the height and gap of the functional components actually arranged (the gap between the functional components on the two opposite surfaces of the two circuit boards in the Z-axis direction).

[0085] Regarding the type of the supporting connector 434 , the embodiment of the present application does not limit the type of the supporting connector 434 , as long as it can support the circuit board and electrically connect two adjacent circuit boards.

[0086] In a possible implementation, referring to FIG6 , the supporting connector 434 includes a frame board (FB), which is a PCB board that is hollowed out in the middle or partially hollowed out.

[0087] In another possible implementation, see FIG7 , which is another side view of the positional relationship of the decorative member, circuit board assembly, and battery cover provided in an embodiment of the present application. As shown in FIG7 , the support connector 434 is integrally formed with the circuit board, i.e., the first support connector is integrally formed with one of the second circuit boards 432, the second support connector is integrally formed with the other second circuit board 432, and the third support connector is integrally formed with the third circuit board 433. For example, the above-mentioned integrally formed first support connector and one of the second circuit boards 432, the above-mentioned integrally formed second support connector and the other second circuit board 432, and the above-mentioned integrally formed third support connector and the third circuit board 433 can be formed by a manufacturing process of a PCB cavity (local recessed) structure.

[0088] When the main board in the mobile phone is a circuit board assembly 43, since the circuit board assembly 43 and the camera module 60 are both arranged in the area opposite to the shielding portion 221 of the decorative part 22, in order to avoid mutual interference between the circuit board assembly 43 and the camera module 60, the circuit board assembly 43 can be improved accordingly according to the thickness of the camera module 60 (the dimension along the Z-axis direction).

[0089] In one possible implementation, the thickness of the camera module 60 is relatively thick. For example, the thickness of the camera module 60 is greater than the distance from the shielding portion 221 to the first circuit board 431. In order to avoid the camera module 60, referring to Figure 6, the first circuit board 431 also includes a fourth area A4, which is opposite to the shielding portion 221, that is, the projection of the shielding portion 221 on the first circuit board 431 overlaps with the fourth area A4. In order to avoid the camera, an avoidance hole is opened in the fourth area A4 of the first circuit board 431, and one end of the camera module 60 is fixedly connected to the support member of the middle frame 10 through the avoidance hole, and the camera module 60 is supported by the support member.

[0090] Regarding the size of the avoidance hole, the embodiment of the present application does not limit the size of the avoidance hole, and those skilled in the art can set it according to actual conditions, as long as it can avoid interference and obstruction to the camera module 60 and ensure the normal operation of the camera module 60.

[0091] In another possible implementation, the thickness of the camera module 60 is moderate. For example, the difference between the distance from the shielding portion 221 to the first circuit board 431 and the thickness of the camera module 60 is within a preset range. The preset range is, for example, between 0.5-3.5 mm. For example, the difference between the distance from the shielding portion 221 to the first circuit board 431 and the thickness of the camera module 60 is 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm or 3.5 mm, etc. See Figure 8, which is another side view position relationship diagram of the decorative part, circuit board assembly and battery cover provided in an embodiment of the present application. As shown in Figure 8, the first circuit board 431 also includes a fourth area A4, which is opposite to the blocking portion 221, that is, the projection of the blocking portion 221 on the first circuit board 431 overlaps with the fourth area A4, and the camera module 60 is arranged in the fourth area A4 of the first circuit board 431. The camera module 60 is fixed and supported by the first circuit board 431. In this way, the setting position of the camera module 60 is more flexible, and the area of ​​the support member of the middle frame 10 can be released to facilitate the setting of other structures on the support member.

[0092] In another possible implementation, the thickness of the camera module 60 is relatively thin. For example, the difference between the distance from the shielding portion 221 to the third circuit board 433 and the thickness of the camera module 60 is within a preset range, and the preset range is, for example, between 0.5-3.5 mm. For example, the difference between the distance from the shielding portion 221 to the third circuit board 433 and the thickness of the camera module 60 is 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm or 3.5 mm, etc. See Figure 9, which is another side view position relationship diagram of the decorative part, circuit board assembly and battery cover provided in an embodiment of the present application. As shown in Figure 9, the third circuit board 433 extends to the bottom of the camera module 60, and the camera module 60 is arranged on the third circuit board 433, that is, the second surface of the third circuit board 433 is not only provided with functional devices, such as BTB, but also provided with the camera module 60. The camera module 60 is fixed and supported by the third circuit board 433. In this way, the setting position of the camera module 60 is more flexible, and the area of ​​the support part of the middle frame 10 can be released to facilitate the setting of other structures on the support part.

[0093] In summary, the electronic device provided in the embodiment of the present application has different distances from the shielding portion 221 of the decorative part 22, the skirt 222 of the decorative part 22 and the preset area of ​​the battery cover 21 to the first circuit board 41, that is, different positions of the decorative part 22 have different height limits on the circuit board assembly 43. By flexibly utilizing the height limit differences, the number of circuit boards in the space in the Z-axis direction is increased, and the number of surfaces of functional devices set at different positions is different, which fully utilizes the space of the electronic device in the Z-axis direction, increases the device layout area, improves the device integration, and solves the problem of insufficient layout area.

[0094] The present application also provides a method for preparing a circuit board assembly, which is used to prepare the circuit board assembly shown in FIG6 , and has the same beneficial effects. For details not fully described below, reference can be made to the description above. The following describes the method for preparing the circuit board assembly in conjunction with the circuit board assembly of FIG6 . The following does not constitute a limitation of the present application.

[0095] Referring to FIG10 , FIG10 is a flow chart of a method for preparing a circuit board assembly provided in an embodiment of the present application. As shown in FIG10 , the method for preparing the circuit board assembly includes the following steps:

[0096] S101. Provide a first circuit board motherboard, two second circuit board motherboards, and a third circuit board motherboard, wherein each circuit board motherboard includes a plurality of circuit board setting areas.

[0097] To simplify the process steps, a larger circuit board motherboard can be provided first. After components are placed on each circuit board placement area of ​​the circuit board motherboard, the circuit board motherboard is divided into panels, wherein the panels are divided according to the number of circuit board placement areas to form multiple circuit boards, that is, each circuit board placement area corresponds to a circuit board.

[0098] S102: Arrange a plurality of functional devices on the second surface of one of the second circuit board motherboards, wherein the number and type of functional devices in each circuit board arrangement area of ​​the second circuit board motherboard are the same.

[0099] S103 , disposing a plurality of second supporting and connecting members on the first surface of the second circuit board motherboard in step S102 , wherein the number of the second supporting and connecting members in each circuit board disposing area of ​​the second circuit board motherboard is the same.

[0100] It can be understood that before the second supporting connector is set on the first surface of the second circuit board motherboard, it is necessary to form the second supporting connector first. For example, the second supporting connector motherboard is first divided into panels to form multiple second supporting connectors. The specific steps of forming the second supporting connector can be referred to the existing technology and will not be repeated in the embodiments of this application.

[0101] S104. Depanel the second circuit board motherboard provided with functional devices and second supporting connectors to form a plurality of second circuit boards, wherein the second surfaces of the second circuit boards are provided with functional devices and the first surfaces are provided with at least one second supporting connector.

[0102] The second circuit board 432 separated from the first circuit board 431 in the above content is formed through step S104.

[0103] S105. Arrange multiple functional devices and multiple first supporting connectors on the first surface of another second circuit board motherboard, wherein the number and type of functional devices in each circuit board setting area of ​​the second circuit board motherboard are the same, and the number of first supporting connectors in each circuit board setting area is the same.

[0104] It can be understood that before the first supporting connector is set on the first surface of the second circuit board motherboard, it is necessary to form the first supporting connector first. For example, the first supporting connector motherboard is first divided into panels to form multiple first supporting connectors. The specific steps of forming the first supporting connector can be referred to the existing technology and will not be repeated in the embodiments of this application.

[0105] S106. Arrange functional devices on the second surface of another second circuit board motherboard and arrange the second circuit board in step S104, wherein the number and type of functional devices in each circuit board arrangement area of ​​the second circuit board motherboard are the same, and each circuit board arrangement area of ​​the second circuit board motherboard corresponds to a second circuit board in step S104.

[0106] S107. Depanel the second circuit board motherboard that has been provided with functional devices and the second circuit board in step S104 to form a plurality of second circuit boards, wherein the first surface of the second circuit board is provided with functional devices and at least one first supporting connection, and the second surface of the second circuit board is provided with functional devices and a second circuit board in step S104.

[0107] The second circuit board 432 adjacent to the first circuit board 431 is formed in the above content through step S107 , and a second circuit board 432 facing away from the first circuit board 431 is provided on the second circuit board 432 .

[0108] S108. Arrange a plurality of functional devices on the second surface of the third circuit board motherboard, wherein the number and type of functional devices in each circuit board arrangement area of ​​the third circuit board motherboard are the same.

[0109] S109: Arrange a plurality of third supporting and connecting members on the first surface of the third circuit board motherboard, wherein the number of the third supporting and connecting members in each circuit board arrangement area of ​​the third circuit board motherboard is the same.

[0110] It can be understood that before the third supporting connector is set on the first surface of the third circuit board motherboard, it is necessary to form the third supporting connector first. For example, the third supporting connector motherboard is first divided into panels to form multiple third supporting connectors. The specific steps of forming the third supporting connector can be referred to the existing technology and will not be repeated in the embodiments of this application.

[0111] S110. Divide the third circuit board motherboard provided with functional devices and third supporting connectors to form a plurality of third circuit boards, wherein the functional devices are provided on the second surface of the third circuit board and at least one third supporting connector is provided on the first surface.

[0112] The third circuit board 433 described above is formed through step S110 .

[0113] S111. Arrange a plurality of functional devices on a first surface of a first circuit board motherboard, wherein the number and type of functional devices in each circuit board arrangement area of ​​the first circuit board motherboard are the same.

[0114] S112. Arrange the third circuit board formed in step S110 and the second circuit board formed in step S107 on the first surface of the first circuit board motherboard, wherein the number and type of functional components in each circuit board arrangement area of ​​the first circuit board motherboard are the same, and each circuit board arrangement area of ​​the first circuit board motherboard corresponds to a third circuit board in step S110 and a second circuit board in step S107.

[0115] S113. The first circuit board motherboard on which functional devices, a second circuit board, and a third circuit board are provided is divided into panels to form a plurality of first circuit boards, wherein functional devices are provided on the first surface of the first circuit board, and a third circuit board in step S110 and a second circuit board in step S107 are provided on the second surface.

[0116] The first circuit board 431 mentioned above is formed through step S113 , and two layers of second circuit boards and one layer of third circuit board are provided on the first circuit board 431 , that is, the circuit board assembly 43 mentioned above is formed.

[0117] It is understandable that when the circuit board assembly further includes other structures, such as a shielding cover, etc., the steps for preparing the circuit board assembly can be adaptively adjusted.

[0118] It should be noted that the above example merely illustrates a process for preparing a circuit board assembly and does not constitute a limitation of the present application. For example, multiple functional devices may be first disposed on the first surface of a first circuit board motherboard, and then multiple functional devices may be disposed on the second surface of one of the second circuit board motherboards.

[0119] Each of the above steps can be performed, for example, through a reflow soldering process. The functional components on the second surface of the second circuit board 432, which is away from the first circuit board 431, need to undergo multiple reflows, for example, at least two low-temperature reflows (a low-temperature reflow soldering process is used when soldering the supporting connectors) and two high-temperature reflows (a high-temperature reflow soldering process is used when soldering the functional components). This means that even multiple reflows will not affect the functional components on each circuit board.

[0120] In addition, when the supporting connector 434 is formed integrally with the circuit board, that is, the first supporting connector and one of the second circuit boards 432 are formed integrally, the second supporting connector and another second circuit board 432 are formed integrally, and the third supporting connector and the third circuit board 433 are formed integrally, for example, the above-mentioned integrally formed first supporting connector and one of the second circuit boards 432, the above-mentioned integrally formed second supporting connector and another second circuit board 432, and the above-mentioned integrally formed third supporting connector and the third circuit board 433 can be formed by the manufacturing process of the cavity (local recess) structure of the PCB, the number of reflows can be further reduced, for example, only two high-temperature reflows are required (a high-temperature reflow soldering process is used when soldering functional components). The specific process steps are similar to the above-mentioned process steps. The only difference is that the step of setting the supporting connector is not included. Please refer to the above-mentioned steps for details and will not be repeated here.

[0121] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: The shell structure comprises at least a first part and a second part, wherein a plane where the first part is located is different from a plane where the second part is located; A circuit board assembly, the circuit board assembly being located at one side of the housing structure along a first direction, wherein the first direction is perpendicular to a plane where the first portion is located; The circuit board assembly comprises at least two layers of circuit boards, the at least two layers of circuit boards at least comprise a first circuit board and at least one second circuit board which are stacked, along the first direction, the first circuit board is located on a side of the second circuit board away from the housing structure, the distance from the first part to the first circuit board is greater than the distance from the second part to the first circuit board; along the first direction, the circuit board comprises two opposite surfaces, the two surfaces comprise a first surface and a second surface, and functional devices are arranged on the first surface and / or the second surface; The circuit board assembly is provided with functional devices at a position corresponding to the first portion, and the number of surfaces provided with the functional devices is a first preset value; Functional devices are provided at positions of the circuit board assembly corresponding to the second portion, and the number of surfaces provided with the functional devices is a second preset value, and the first preset value is greater than the second preset value.

2. The electronic device according to claim 1, characterized in that: The circuit board assembly corresponds to the position of the first part, and the number of the circuit boards is a third preset value; the circuit board assembly corresponds to the position of the second part, and the number of the circuit boards is a fourth preset value, and the third preset value is greater than or equal to the fourth preset value.

3. The electronic device according to claim 1 or 2, characterized in that: The circuit board assembly further includes at least one third circuit board, the first circuit board includes at least a first area and a second area, the second circuit board is at least located in the first area, and the first circuit board and at least one layer of the second circuit board are sequentially stacked, and the third circuit board is at least located in the second area, and the first circuit board and at least one layer of the third circuit board are sequentially stacked; The circuit board assembly further includes a supporting connector, which is located between two adjacent circuit boards and is used to support the circuit boards and electrically connect the two adjacent circuit boards; The first area is opposite to the first part, and the second area is opposite to the second part. Functional devices are arranged in the first area, and the number of surfaces provided with the functional devices is the first preset value; functional devices are arranged in the second area, and the number of surfaces provided with the functional devices is the second preset value.

4. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device further comprises a back cover, and the housing structure is the back cover of the electronic device.

5. The electronic device according to any one of claims 1 to 3, characterized in that: The electronic device further comprises a back cover, and a decorative hole is formed on the back cover; The housing structure is a camera decoration, the camera decoration comprises a shielding portion and a skirt, the skirt at least partially surrounds the shielding portion, the decoration is fixed to the back cover through the skirt, and the shielding portion is exposed through the decoration hole; The first part is the shielding portion, and the second part is the skirt; wherein H1>H2>H3, H1 is the distance from the shielding portion to the first circuit board, H2 is the distance from the back cover to the first circuit board, and H3 is the distance from the skirt to the first circuit board; The first circuit board includes a first area, a second area and a third area; the first area is opposite to the shielding portion, the second area is opposite to the skirt, and the third area is opposite to a preset area of ​​the back cover, wherein the preset area of ​​the back cover is a portion where a projection of the back cover on the plane where the first circuit board is located overlaps with the third area; The number of surfaces provided with functional devices in the first region is greater than the number of surfaces provided with functional devices in the second region, and greater than the number of surfaces provided with functional devices in the third region.

6. The electronic device according to claim 5, characterized in that: Along a second direction, the second region includes a first sub-region and a second sub-region arranged on both sides of the first region, wherein the second direction is perpendicular to the first direction; The circuit board assembly comprises a first circuit board, two layers of second circuit boards and one layer of third circuit board, the two layers of the second circuit boards are stacked in the first area at intervals, and the second circuit board adjacent to the first circuit board extends to the second sub-area and the third area, and the third circuit board is at least arranged in the second sub-area; The first surface is located on a side of the second surface facing away from the housing structure; Functional devices are arranged on both surfaces of the first circuit board, functional devices are arranged on both surfaces of the second circuit board adjacent to the first circuit board, functional devices are arranged on the second surface of the second circuit board far away from the first circuit board, and functional devices are arranged on the second surface of the third circuit board.

7. The electronic device according to claim 6, characterized in that: Along the first direction, the height of the first functional device is less than the height of the second functional device, wherein the first functional device is the functional device with the highest height arranged on the second surface of the first circuit board in the first sub-area, and the second functional device is the functional device with the highest height arranged on the second surface of the first circuit board in other areas.

8. The electronic device according to claim 6, characterized in that: Along the first direction, the height of the functional components on the second surface of the third circuit board is greater than the height of the functional components on the surfaces of other circuit boards.

9. The electronic device according to claim 8, characterized in that: The functional devices on the second surface of the third circuit board include a board-to-board connector.

10. The electronic device according to claim 6, characterized in that: The second surface of the first circuit board, the first surface of the second circuit board adjacent to the first circuit board, and the supporting connection member form a first accommodation space, the second surface of the second circuit board adjacent to the first circuit board, the first surface of the second circuit board away from the first circuit board, and the supporting connection member form a second accommodation space, and the second surface of the first circuit board, the first surface of the third circuit board, and the supporting connection member form a third accommodation space; The functional components on the second surface of the first circuit board corresponding to the first area, the second sub-area and the third area and the functional components on the first surface of the second circuit board adjacent to the first circuit board are all located in the first accommodation space, the functional components on the second surface of the second circuit board adjacent to the first circuit board and corresponding to the first area are located in the second accommodation space, and the functional components on the second surface of the first circuit board and corresponding to the first sub-area are located in the third accommodation space.

11. The electronic device according to claim 6, characterized in that: A shielding cover is provided on the outer sides of at least some functional components in the first surface of the first circuit board, the second surface of the second circuit board away from the first circuit board, and the second surface of the second circuit board adjacent to the first circuit board and corresponding to the second sub-area.

12. The electronic device according to any one of claims 5 to 11, characterized in that: A light-transmitting hole is provided on the shielding portion; the electronic device further comprises a camera module, a projection of the camera module on the plane where the first portion is located overlaps with a projection of the shielding portion on the plane where the first portion is located, and the camera module collects light through the light-transmitting hole.

13. The electronic device according to claim 12, characterized in that: The thickness of the camera module is greater than the distance from the shielding portion to the first circuit board; The first circuit board also includes a fourth area, the fourth area is opposite to the shielding portion, and the first circuit board is provided with an avoidance hole in the fourth area, and one end of the camera module passes through the avoidance hole.

14. The electronic device according to claim 12, characterized in that: The difference between the distance between the shielding portion and the first circuit board and the thickness of the camera module is within a preset range; The first circuit board also includes a fourth area, which is opposite to the shielding portion. The camera module is arranged at the fourth area of ​​the first circuit board, and the camera module is fixed and supported by the first circuit board.

15. The electronic device according to claim 12, characterized in that: The difference between the distance between the shielding portion and the third circuit board and the thickness of the camera module is within a preset range; The third circuit board extends to the bottom of the camera module. The camera module is arranged on the third circuit board. The camera module is fixed and supported by the third circuit board.

16. The electronic device according to any one of claims 3 to 15, characterized in that: When the circuit board assembly further includes a supporting connection member, the supporting connection member includes a frame plate.

17. The electronic device according to any one of claims 3 to 15, characterized in that: When the circuit board assembly further includes a supporting connector, the supporting connector is formed integrally with the circuit board.

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