Imaging modular unit and endoscope

Abstract

An imaging modular unit and an endoscope. The imaging modular unit comprises an image capturing module and a second circuit board (20), wherein the image capturing module comprises a camera (30), a light source member (41) and a first circuit board, the first circuit board comprising a first hard board (11), and the camera (30) and the light source member (41) both being electrically connected to the first hard board (11); and the second circuit board (20) comprises a second hard board (21) and a soft board (22), one end of the second hard board (21) being electrically connected to the first hard board (11), the second hard board (21) being arranged at an angle with the first hard board (11), and the other end of the second hard board (21) being electrically connected to the soft board (22). For the imaging modular unit, the difficulty of a manufacturing process is reduced, and the production efficiency and the product yield are improved.

Description

Imaging modules and endoscopes Technical Field

[0001] The present application relates to the technical field of medical devices, and in particular to an imaging module and an endoscope. Background Art

[0002] Endoscopes are primarily used in surgical procedures and routine medical examinations. In clinical use, doctors insert the endoscope through natural orifices or tiny incisions in the body. Using other surgical instruments and an image processor, they perform surgical procedures externally and internally. Compared to traditional surgical procedures, minimally invasive procedures using endoscopes require smaller incisions and allow for faster recovery. Consequently, endoscopes have become widely used.

[0003] Endoscopes are mainly used to illuminate and observe human cavities or tissues through imaging modules. In order to ensure that the insertion portion of the endoscope can smoothly pass through narrow human cavities, and to reduce the harm to patients during the operation, the size of the imaging module has been made smaller and smaller, resulting in the difficulty of implementing the manufacturing process of the imaging module. In related technologies, the imaging module usually uses electronic wires or flexible circuit boards (i.e., FPCs) for signal extraction. Due to the small size of the imaging module and the soft material of the electronic wires or flexible circuit boards, welding is difficult, the defect rate is high, and the production efficiency is low.

[0004] Summary of the Invention

[0005] Based on this, it is necessary to provide an imaging module and endoscope to reduce process difficulty and improve product reliability and yield.

[0006] An imaging module for endoscope, comprising:

[0007] An imaging module, the imaging module comprising a camera, a light source, and a first circuit board, the first circuit board comprising a first hard board, the camera and the light source being electrically connected to the first hard board; and

[0008] The second circuit board includes a second hard board and a soft board, one end of the second hard board is electrically connected to the first hard board, and the second hard board is arranged at an angle to the first hard board, and the other end of the second hard board is electrically connected to the soft board.

[0009] The technical solution is further described below:

[0010] In one embodiment, the first hard board has a first mounting surface and a second mounting surface that are arranged opposite to each other, the camera and the light source are electrically connected to the first mounting surface, the second hard board is electrically connected to the second mounting surface, and the second hard board is arranged at an angle to the second mounting surface.

[0011] In one embodiment, the second hard plate is disposed at a right angle to the second mounting surface.

[0012] In one embodiment, the second rigid board includes an end section and a narrowing section connected to each other, the end section is electrically connected to the first rigid board, the narrowing section is electrically connected to the flexible board, and the width of the narrowing section is smaller than that of the end section.

[0013] In one embodiment, the width of the soft plate is less than or equal to the width of the narrowed section.

[0014] In one embodiment, the imaging module further includes a sleeve, the narrowed section is provided with an electronic component, and the sleeve is sleeved on the narrowed section and covers the electronic component.

[0015] In one embodiment, the sleeve is a heat shrinkable tube, and the heat shrinkable tube shrinks and wraps the narrowed section by heating.

[0016] In one embodiment, the first hard plate has a first mounting surface and a second mounting surface that are arranged opposite to each other, the camera and the light source are electrically connected to the first mounting surface, and the end section is electrically connected to the second mounting surface.

[0017] In one embodiment, the end section is provided with contacts, and the end section is welded to the second mounting surface via the contacts.

[0018] In one embodiment, reinforcing glue is coated between the end section and the second mounting surface.

[0019] In one embodiment, the imaging module further includes a connector, which is electrically connected to an end of the soft board away from the second hard board, and the connector is used to electrically connect to a circuit board in the handle of the endoscope.

[0020] In one embodiment, the imaging module further includes a discharge component for releasing static electricity, and the discharge component is disposed through the first hard plate.

[0021] In one embodiment, the imaging module also includes a front end shell, which is provided with a cavity for accommodating the camera and the first hard board. The front end of the front end shell is also provided with a first mounting hole connected to the cavity. The light source is arranged in the mounting hole, and the light source is electrically connected to the first hard board through an electric wire.

[0022] In one embodiment, the light source component is arranged on a first hard plate, and the imaging module also includes a front shell, the front shell is provided with a cavity for accommodating the imaging module, and a light guide component is provided in the cavity, one end of the light guide component is in contact with the light source component, and the other end of the light guide component extends to the front end of the front shell.

[0023] In one embodiment, the light guide and the front end housing are an integral injection-molded structure.

[0024] In one embodiment, the camera includes a lens and an imaging chip, the imaging chip is electrically connected to the first hard board, the lens is connected to the end of the imaging chip facing away from the first hard board, the imaging module also includes a pad, the pad is connected to the first hard board, and the light source is connected to the end of the pad facing away from the first hard board.

[0025] In one embodiment, the distance from the light-emitting surface of the light source to the first hard plate is greater than the distance from the junction of the imaging chip and the lens to the first hard plate, and the distance from the light-emitting surface of the light source to the first hard plate is less than or equal to the distance from the front end surface of the lens to the first hard plate.

[0026] In one embodiment, the raising block includes an insulating member and a conductive member attached to the insulating member, and the conductive member electrically connects the light source member and the first hard plate.

[0027] In one embodiment, the conductive members are attached to both sides of the insulating member, and the two conductive members are respectively connected to the positive electrode and the negative electrode of the light source member.

[0028] On the other hand, the present application also provides an endoscope, which includes an insertion part, a handle and the above-mentioned imaging module, wherein the front end of the insertion part is connected to the imaging module, the rear end of the insertion part is connected to the handle, the second circuit board is arranged in the insertion part, and the end of the soft board away from the second hard board is used to be electrically connected to the circuit board in the handle.

[0029] The imaging module is configured such that the first circuit board includes a hard first hard board, and the second circuit board includes a hard second hard board and a soft soft board. When the second circuit board is welded to the first circuit board, the hard second hard board and the first hard board will not bend or deform, thereby facilitating the welding and alignment of the second hard board and the first hard board, reducing the difficulty of the welding process, improving production efficiency and product yield, and the second hard board and the first hard board are arranged at an angle, which is conducive to reducing the size of the imaging module. At the same time, the hard second hard board can also provide more stable support for the imaging module, improving the structural stability of the imaging module. When the imaging module is assembled to the insertion part, the second hard board can be used as a grip, which is convenient for both manual assembly and automated assembly. The soft soft board can be bent and deformed, so that it can better conform to the bending angle of the insertion part and the handle, and can then easily pass through the insertion part of the endoscope and be electrically connected to the circuit board in the handle, ensuring the stability of signal transmission between the imaging module and the handle. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The drawings that constitute a part of this application are used to provide further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute improper limitations on this application.

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0032] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the various elements are drawn only for illustrative purposes and are not necessarily drawn to true scale.

[0033] FIG1 is an exploded view of the structure of an imaging module according to an embodiment.

[0034] FIG2 is a schematic structural diagram of the imaging module shown in FIG1 with the front end housing and the light source component hidden.

[0035] FIG3 is a front view of the imaging module shown in FIG2 .

[0036] FIG4 is a schematic structural diagram of a second circuit board according to an embodiment.

[0037] FIG5 is a schematic diagram of the cooperation between the second circuit board and the sleeve shown in FIG4 .

[0038] FIG6 is a schematic diagram of the rear end structure of a flexible board according to an embodiment.

[0039] FIG. 7 is an exploded view of the structure of an imaging module according to another embodiment.

[0040] FIG8 is a schematic structural diagram of the imaging module of the imaging module shown in FIG7 .

[0041] FIG. 9 is a schematic structural diagram of the padding block of the imaging module shown in FIG. 7 .

[0042] FIG10 is an exploded view of the structure of an imaging module according to yet another embodiment.

[0043] FIG11 is a schematic structural diagram of the imaging module of the imaging module shown in FIG10 .

[0044] FIG12 is a cross-sectional view of the front end housing of the imaging module shown in FIG10.

[0045] Explanation of the accompanying drawings: 11. First hard board; 111. First mounting surface; 112. Second mounting surface; 20. Second circuit board; 21. Second hard board; 211. End section; 212. Narrowed section; 213. Electronic component; 22. Flexible board; 23. Sleeve; 24. Connector; 30. Camera; 31. Lens; 32. Imaging chip; 41. Light source; 42. Heightening block; 421. Conductive component; 422. Insulating component; 51. Discharge component; 60. Tip housing; 61. Mounting hole; 62. Camera port; 63. Light guide. DETAILED DESCRIPTION

[0046] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0047] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0048] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0049] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0050] In this application, unless otherwise expressly specified or limited, when a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0051] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0052] One embodiment of the present application provides an endoscope for obtaining image information within a target cavity or tissue. Specifically, the endoscope of one embodiment includes an insertion portion, a handle, and an imaging module, wherein the front end of the insertion portion is connected to the imaging module, and the rear end of the insertion portion is connected to the handle. The imaging module is used to illuminate the target cavity or tissue and collect image information, and the imaging module is electrically connected to a circuit board in the handle.

[0053] Specifically, in a traditional endoscope, the imaging module generally includes a light source for lighting and a camera for acquiring image information. The circuit board in the handle is used to electrically connect to the imaging module to cooperate with the imaging module. The insertion portion is usually long and may need to have a certain degree of flexibility. At the same time, a certain angle is formed between the handle and the insertion portion. In order to ensure the flexibility of the insertion portion and facilitate the wiring between the imaging module and the circuit board in the handle, the imaging module is usually electrically connected to the circuit board in the handle through a soft electronic wire or a flexible circuit board. However, since the electronic wire or flexible circuit board is soft and the imaging module is generally small in size, it is difficult to control the alignment during welding, resulting in difficult welding, a high defect rate, and reduced production efficiency. In addition, the soft electronic wire or flexible circuit board cannot support the imaging module well, resulting in an unstable overall structure of the imaging module, poor reliability, and inconvenient assembly.

[0054] Based on this, an embodiment of the present application also provides an imaging module. Specifically, referring to Figures 1 to 3, the imaging module of one embodiment includes an imaging module and a second circuit board 20. The imaging module includes a camera 30, a light source 41 and a first circuit board. The first circuit board includes a first hard board 11. The camera 30 and the light source 41 are both electrically connected to the first hard board 11, wherein the camera 30 is used to obtain image information in the target cavity or tissue, and the light source 41 is used for lighting. The second circuit board 20 includes a second hard board 21 and a soft board 22. One end of the second hard board 21 is electrically connected to the first hard board 11, and the second hard board 21 is arranged at an angle to the first hard board 11, and the other end of the second hard board 21 is electrically connected to the soft board 22. Furthermore, the imaging module is used to be arranged at the front end of the insertion part, and the second circuit board 20 is used to be inserted into the insertion part, wherein the end of the soft board 22 away from the second hard board 21 is used to be electrically connected to the circuit board in the handle. Preferably, in this embodiment, the first rigid board 11 and the second rigid board 21 are both rigid PCB boards, and the flexible board 22 is a flexible FPC board.

[0055] Specifically, during manufacturing, the camera 30 and the light source 41 are first assembled to the first hard board 11 to form an integrated imaging module, and then one end of the second hard board 21 of the second circuit board 20 is assembled to the first hard board 11, so that an integrated imaging module can be formed. Compared with the traditional imaging module that leads out signals through electronic wires or flexible circuit boards, the imaging module of the present application configures the first circuit board to include a hard first hard board 11, and configures the second circuit board 20 to include a hard second hard board 21 and a soft soft board 22. When the second circuit board 20 is welded to the first hard board 11, the hard second hard board 21 and the first hard board 11 will not bend and deform, thereby facilitating the welding and alignment of the second hard board 21 and the first hard board 11, reducing the difficulty of the welding process, improving production efficiency and product yield, and the second hard board 21 is arranged at an angle to the first hard board 11, which is conducive to reducing the size of the imaging module. The rigid second hard plate 21 also provides more stable support for the imaging module, improving its structural stability. When assembling the imaging module into the insertion section, the second hard plate 21 serves as a grip, facilitating both manual and automated assembly. The flexible soft plate 22 is bendable and deformable, better adapting to the curvature of the insertion section and handle. This allows it to easily pass through the endoscope's insertion section and electrically connect to the circuit board in the handle, ensuring stable signal transmission between the imaging module and the handle.

[0056] Referring to Figure 3 , optionally, in one embodiment, the first rigid board 11 has a first mounting surface 111 and a second mounting surface 112 disposed opposite each other. The camera 30 and the light source 41 are both electrically connected to the first mounting surface 111. The second rigid board 21 is electrically connected to the second mounting surface 112, and the second rigid board 21 is disposed at an angle to the second mounting surface 112. Preferably, in this embodiment, the second rigid board 21 is disposed at a right angle to the second mounting surface 112, thereby forming a stable and reliable "T"-shaped structure with the first rigid board 11, which saves space and facilitates wiring.

[0057] Referring to FIG. 5 , optionally, in one embodiment, the imaging module further includes a sleeve 23 , which is sleeved on the second circuit board 20 , thereby protecting the second circuit board 20 from electrostatic discharge and waterproof and dustproof conditions.

[0058] Furthermore, in conjunction with Figure 4, the second hard board 21 includes an end section 211 and a narrowing section 212 connected to each other. The end section 211 is electrically connected to the first hard board 11, and the narrowing section 212 is connected to the soft board 22. The width of the narrowing section 212 is smaller than the width of the end section 211. The width of the soft board 22 is smaller than or equal to the width of the narrowing section 212. The narrowing section 212 is provided with electronic components 213 such as resistors and capacitors. The sleeve 23 is sleeved on the narrowing section 212 and covers the electronic components 213, thereby protecting the electronic components 213 on the narrowing section 212. Specifically, in order to enable the insertion part to smoothly pass through the narrow cavity of the human body and avoid damaging human tissue, the insertion part is usually relatively small, and correspondingly, the lumen of the insertion part is also relatively small. At the same time, in addition to accommodating the second circuit board 20, the lumen of the insertion part also needs to reserve an instrument channel for surgical instruments to pass through. Therefore, the size of the second circuit board 20 needs to be as small as possible. By providing a narrowed section 212 with a smaller width and a soft board 22 with a smaller width, and sleeve 23 being sleeved on the narrowed section 212, the electronic components 213 on the second circuit board 20 can be protected while preventing the overall size of the second circuit board 20 and the sleeve 23 from being too large.

[0059] Preferably, referring to Figure 5 , sleeve 23 is a heat-shrinkable tube. Heat-shrinkable tubing shrinks around narrowed section 212 by heating, making it easy to process and smaller in size. Specifically, end section 211 is electrically connected to second mounting surface 112 and is provided with contacts. These contacts allow for reliable welding of end section 211 to second mounting surface 112. Furthermore, reinforcing adhesive is applied between end section 211 and second mounting surface 112 to enhance overall structural stability.

[0060] Referring to Figure 6 , in one embodiment, the imaging module further includes a connector 24, which is electrically connected to the end of the flexible board 22 that is distal from the second rigid board 21. Connector 24 is used to electrically connect to the circuit board within the endoscope's handle. During assembly, the flexible board 22 and the circuit board are electrically connected simply by plugging connector 24 into the handle's circuit board, eliminating the need for soldering and improving assembly efficiency.

[0061] Referring to Figure 2, the imaging module also includes a discharge member 51 for releasing static electricity, and the discharge member 51 is provided on the first hard plate 11. The discharge member 51 is used to conduct static electricity in the environment, thereby eliminating static electricity on the first hard plate 11, so as to provide electrostatic protection for components such as the camera 30 and the light source 41 on the first hard plate 11, and prevent the camera 30 and the light source 41 from being subject to electromagnetic interference. Preferably, a through hole is provided on the first hard plate 11, and the discharge member 51 is provided in the through hole. Furthermore, the number of the discharge members 51 is at least two, and at least two discharge members 51 are provided on the first hard plate 11 at intervals, thereby improving the effect of electrostatic protection and preventing electromagnetic interference. Preferably, the discharge member 51 is a metal needle.

[0062] Continuing to refer to Figure 2, in one embodiment, the camera 30 includes a lens 31 and an imaging chip 32. The imaging chip 32 is electrically connected to the first hard board 11, and the lens 31 is connected to the end of the imaging chip 32 facing away from the first hard board 11. Preferably, the imaging chip 32 is electrically connected to the first mounting surface 111 of the first hard board 11 through conductive glue, and the lens 31 is then bonded and packaged to the imaging chip 32 through conductive glue.

[0063] Referring to Figure 1, the imaging module also includes a tip shell 60, which is used to provide waterproof and dustproof protection for the imaging module. Specifically, the tip shell 60 is provided with a cavity for accommodating the camera 30 and the first hard plate 11, and the front end of the tip shell 60 is provided with a camera port 62 connected to the container, and the camera 30 is arranged in the camera port 62. Optionally, in one embodiment, during manufacturing, the tip shell 60 can be first injection molded, and then the imaging module can be loaded into the cavity of the tip shell 60, and finally glue can be poured into the cavity to connect and fix the tip shell 60 to the imaging module. In another embodiment, the imaging module can also be first fixed in the tip shell mold, and then glue can be poured into the tip shell mold, and finally, after curing and demoulding, the tip shell 60 can be integrated outside the imaging module to form an integrated tip shell 60.

[0064] Referring to Figure 1 , in one embodiment, the front end of the tip housing 60 optionally further defines a first mounting hole 61 that communicates with the cavity. The light source 41 is disposed in the mounting hole 61 and electrically connected to the first rigid board 11 via electrical wiring. This secures the light source 41 to the front end of the tip housing 60, preventing light from the light source 41 from being blocked and ensuring more uniform illumination of the target area. Preferably, there are at least two light sources 41. Accordingly, the front end of the tip housing 60 defines at least two mounting holes 61, with the light sources 41 disposed in corresponding mounting holes 61. Furthermore, the light sources 41 can be secured to the mounting holes 61 using glue. During installation, the camera 30 and first circuit board 11 are first inserted into the cavity from the rear end of the tip housing 60. The light source 41, with its electrical wiring attached, is then inserted into the mounting hole 61 from the front end of the tip housing 60 and secured with glue. Finally, the electrical wiring is connected to the first circuit board 11 to complete the installation of the light source 41. Preferably, in this embodiment, the light source 41 may be an LED lamp.

[0065] It is worth noting that in other embodiments, the light source 41 can also be installed on the first hard board 11, so that the heat of the light source 41 can be transferred to the second circuit board 20 through the first hard board 11, avoiding the heat of the light source 41 being directly transferred to the patient through the front end shell 60 and burning the patient, and also avoiding the heat being concentrated at the front end of the front end shell 60. On the one hand, it meets the temperature limits involved in relevant domestic and international standards for medical devices; on the other hand, the camera 30 is a heat-sensitive device, and overheating will produce noise and cannot form stable images. Therefore, by installing the light source 41 on the first hard board 11, the heat of the light source 41 can be transferred backward through the first hard board 11 and the second circuit board 20, thereby ensuring stable imaging of the camera module.

[0066] Furthermore, when placing the light source 41 on the first rigid plate 11, it is necessary to ensure that the light-emitting surface of the light source 41 and the front face of the lens 31 maintain an appropriate relative position. Specifically, if the light-emitting surface of the light source 41 is higher than the front face of the lens 31, the camera 30 may be easily exposed. If the light-emitting surface of the light source 41 is much lower than the front face of the lens 31, part of the light from the light source 41 will be blocked by the side of the camera 30, resulting in uneven illumination of the target area, which will lead to uneven brightness and color of the image, and thus make it impossible to accurately and quickly diagnose the lesion, or even misdiagnosis.

[0067] Based on this, referring to Figures 7 and 8 , in one embodiment, the imaging module further includes a spacer 42 connected to the first rigid board 11. The light source 41 is connected to the end of the spacer 42 facing away from the first rigid board 11, ensuring that the light-emitting surface of the light source 41 and the front face of the lens 31 maintain a suitable relative position. Preferably, the distance between the light-emitting surface of the light source 41 and the first rigid board 11 is greater than the distance between the junction of the imaging chip 32 and the lens 31 and the first rigid board 11, and the distance between the light-emitting surface of the light source 41 and the first rigid board 11 is less than or equal to the distance between the front face of the lens 31 and the first rigid board 11. Thus, by elevating the light source 41 with the spacer 42, the light-emitting surface of the light source 41 is elevated above the junction of the imaging chip 32 and the lens 31, preventing light emitted by the light source 41 from penetrating the junction of the imaging chip 32 and the lens 31 and affecting the photosensitive surface of the imaging chip 32. Furthermore, by positioning the light-emitting surface of light source 41 below or flush with the front surface of lens 31, exposure of camera 30 is prevented. This also prevents partial light from light source 41 from being blocked by the sides of camera 30, resulting in more uniform illumination of the target area and improved imaging quality. Heat from light source 41 is also transferred via spacers 42 to first rigid board 11 and then to second circuit board 20, preventing heat from concentrating at the front of distal housing 60, potentially burning the patient and affecting the imaging of camera 30.

[0068] Furthermore, referring to FIG9 , the spacer block 42 includes an insulating member 422 and a conductive member 421 attached to the insulating member 422. The conductive member 421 electrically connects the light source member 41 and the first hard plate 11 to achieve effective electrical conduction. Specifically, a conductive member 421 is attached to both sides of the insulating member 422, and the two conductive members 421 are respectively connected to the positive and negative poles of the light source member 41. Isolating the two conductive members 421 by the insulating member 422 can prevent the light source member 41 from short-circuiting. Preferably, in this embodiment, the light source member 41 can be an LED lamp.

[0069] Referring to Figures 10 to 12 , in another embodiment, the light source 41 is disposed on the first rigid plate 11, and a light guide 63 is disposed within the cavity of the distal housing 60. One end of the light guide 63 abuts the light source 41, while the other end extends to the front end of the distal housing 60. This allows the light energy of the light source 41 to be concentrated and transmitted to the front end of the distal housing 60 via the light guide 63, reducing the loss of luminous energy from the light source 41. This eliminates the concern that the light from the light source 41 will be blocked by the camera 30 and reduces the amount of light from the light source 41 scattering at the junction between the imaging chip 32 and the lens 31. Optionally, the light guide 63 and the distal housing 60 are integrally injection-molded, providing enhanced structural strength. Preferably, in this embodiment, the light source 41 may be an LED lamp. Furthermore, a light-shielding layer or material may be provided at the junction between the imaging chip 32 and the lens 31 to further reduce the amount of light from the light source 41 entering the junction between the imaging chip 32 and the lens 31. In addition, the heat of the light source 41 can also be transferred backward through the first hard board 11 and the second circuit board 20, ensuring stable imaging of the camera module.

[0070] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0071] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. An imaging module for an endoscope, It is characterized in that include: An imaging module, the imaging module comprising a camera, a light source and a first circuit board, the first circuit board comprising a first hard board, the camera and the light source being electrically connected to the first hard board; as well as, The second circuit board includes a second hard board and a soft board, one end of the second hard board is electrically connected to the first hard board, and the second hard board is arranged at an angle to the first hard board, and the other end of the second hard board is electrically connected to the soft board.

2. The imaging module according to claim 1, It is characterized in that The first hard board has a first mounting surface and a second mounting surface which are arranged opposite to each other, the camera and the light source are electrically connected to the first mounting surface, the second hard board is electrically connected to the second mounting surface, and the second hard board is arranged at an angle to the second mounting surface.

3. The imaging module according to claim 2, It is characterized in that The second hard plate is arranged at a right angle to the second mounting surface.

4. The imaging module according to claim 1, It is characterized in that The second hard board includes an end section and a narrowing section connected to each other, the end section is electrically connected to the first hard board, the narrowing section is electrically connected to the soft board, and the width of the narrowing section is smaller than that of the end section.

5. The imaging module according to claim 4, It is characterized in that The width of the soft plate is less than or equal to the width of the narrowed section.

6. The imaging module according to claim 4, It is characterized in that The imaging module further includes a sleeve, the narrowing section is provided with an electronic component, and the sleeve is sleeved on the narrowing section and covers the electronic component.

7. The imaging module according to claim 6, It is characterized in that The sleeve is a heat shrinkable tube, and the heat shrinkable tube shrinks and wraps the narrowed section by heating.

8. The imaging module according to claim 4, It is characterized in that The first hard plate has a first mounting surface and a second mounting surface which are arranged opposite to each other. The camera and the light source are electrically connected to the first mounting surface, and the end section is electrically connected to the second mounting surface.

9. The imaging module according to claim 8, It is characterized in that The end section is provided with contacts, and the end section is welded to the second mounting surface via the contacts.

10. The imaging module according to claim 9, It is characterized in that Reinforcing glue is coated between the end section and the second mounting surface.

11. The imaging module according to claim 1, It is characterized in that The imaging module also includes a connector, which is electrically connected to an end of the soft board away from the second hard board, and the connector is used to electrically connect to a circuit board in the handle of the endoscope.

12. The imaging module according to claim 1, It is characterized in that The imaging module also includes a discharge component for discharging static electricity, and the discharge component is penetrated through the first hard plate.

13. The imaging module according to claim 1, It is characterized in that The imaging module also includes a front shell, which is provided with a cavity for accommodating the camera and the first hard board. The front end of the front shell is also provided with a first mounting hole connected to the cavity. The light source is arranged in the mounting hole, and the light source is electrically connected to the first hard board through wires.

14. The imaging module according to claim 1, It is characterized in that The light source component is arranged on a first hard plate, and the imaging module also includes a front shell, which is provided with a cavity for accommodating the imaging module, and a light guide component is provided in the cavity, one end of the light guide component abuts against the light source component, and the other end of the light guide component extends to the front end of the front shell.

15. The imaging module according to claim 1, It is characterized in that The light guide and the front end housing are an integral injection molding structure.

16. The imaging module according to claim 1, It is characterized in that The camera includes a lens and an imaging chip, the imaging chip is electrically connected to the first hard board, the lens is connected to the end of the imaging chip facing away from the first hard board, the imaging module also includes a padding block, the padding block is connected to the first hard board, and the light source is connected to the end of the padding block facing away from the first hard board.

17. The imaging module according to claim 16, It is characterized in that The distance from the light emitting surface of the light source to the first hard plate is greater than the distance from the junction of the imaging chip and the lens to the first hard plate, and the distance from the light emitting surface of the light source to the first hard plate is less than or equal to the distance from the front end surface of the lens to the first hard plate.

18. The imaging module according to claim 16, It is characterized in that The padding block includes an insulating member and a conductive member attached to the insulating member, and the conductive member electrically connects the light source member and the first hard plate.

19. The imaging module according to claim 18, It is characterized in that The conductive members are attached to both sides of the insulating member, and the two conductive members are respectively connected to the positive electrode and the negative electrode of the light source member.

20. An endoscope, It is characterized in that The endoscope comprises an insertion part, a handle and an imaging module according to any one of claims 1 to 19, wherein a front end of the insertion part is connected to the imaging module, a rear end of the insertion part is connected to the handle, the second circuit board is passed through the insertion part, and an end of the soft board away from the second hard board is used for electrical connection to the circuit board in the handle.

Images