Cold source integration device, heat dissipation system, controller, and related method

Abstract

A cold source integration device, a heat dissipation system, a controller and a heat dissipation control method, relating to the technical field of heat dissipation. The cold source integration device is connected to an air-liquid heat exchange mode assembly by means of a liquid cooling pipeline and connected to a liquid-liquid heat exchange mode assembly by means of the liquid cooling pipeline, the air-liquid heat exchange mode assembly and the liquid-liquid heat exchange mode assembly being connected by means of the liquid cooling pipeline. The cold source integration device is used for providing a cooling liquid by means of the liquid cooling pipeline, the cooling liquid successively passing through the air-liquid heat exchange mode assembly used for dissipating heat of a first device of an apparatus and the liquid-liquid heat exchange mode assembly used for dissipating heat of a second device of the apparatus; the cold source integration device is further used for receiving the cooling liquid output after heat of the second device is dissipated. The device meets the requirements of different liquid cooling modes on temperature by supplying one path of cooling liquid, decreases the number of cooling liquid supply lines, and decreases the number of cooling towers, the number of circulation pumps and the number of liquid cooling pipelines, thus greatly reducing system complexity.

Description

Cold source integrated device, heat dissipation system, controller and related methods

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on June 16, 2023, with application number 202310729682.9 and invention name “A heat dissipation system”, as well as priority to the Chinese patent application filed with the State Intellectual Property Office on July 31, 2023, with application number 2023109537247 and invention name “Cold source integrated device, heat dissipation system, controller and related methods”, and priority to the Chinese patent application filed with the State Intellectual Property Office on December 14, 2023, with application number 202311724720.8 and invention name “Cold source integrated device, heat dissipation system, controller and related methods”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of heat dissipation technology, and in particular to a cold source integrated device, a heat dissipation system, a controller, and a heat dissipation control method. Background Art

[0003] With the advent of the information age, massive amounts of data have been generated, necessitating the emergence of data centers (DCs) to store this vast amount of data. A DC is a specialized network of collaborative devices used to transmit, accelerate, display, compute, and store data on a network infrastructure. As the computing power of chips in data centers increases, so does their power consumption. Optimizing the use of natural cooling sources (such as water and wind) to reduce power consumption and improve device reliability has become a key issue.

[0004] Currently, the industry primarily uses a full liquid cooling model to dissipate heat for data center equipment. This is illustrated by the cooling solution for servers in data centers. Server cooling solutions include liquid cooling plates and liquid cooling doors. The liquid cooling plate cooling circuit utilizes a cooling distribution unit (CDU) or an embedded cooling unit (ECU). This system uses a liquid-to-liquid heat exchange mechanism (a method in which liquid is used as a heat transfer medium within the cooling plate to achieve cooling through heat transfer) to transfer heat from large heat-generating components such as chips to the primary side (i.e., the low-temperature side) of the ECU. A circulating water pump then transfers the heat to a closed cooling tower. The liquid cooling door cooling circuit utilizes a liquid cooling door (a typical example is a water-cooled door). This system uses an air-to-liquid heat exchange mechanism (a method in which hot air generated by the server exchanges heat with coolant provided by the cooling tower) to transfer heat from smaller heat-generating components such as memory and hard drives to the primary side of the liquid cooling door. A circulating water pump then transfers the heat to a closed cooling tower.

[0005] Considering the different water temperature requirements for the liquid cooling plate and the liquid cooling door at the water inlet, the above-mentioned liquid cooling heat dissipation solution usually requires one water circuit to supply water to the CDU and be equipped with corresponding cooling towers, circulating pumps and other components to achieve heat exchange processing for the liquid cooling plate; another water circuit is used to supply water to the liquid cooling door. Accordingly, this water circuit also needs to be equipped with corresponding cooling towers, circulating pumps and other components to achieve heat exchange processing for the liquid cooling door. The above-mentioned two water circuits form a circulation loop. During the setup process, not only the water temperature requirements of the liquid cooling plate and the liquid cooling door must be considered, but also the location of the components in the water circuit and the space occupied. This makes the entire water circuit setup complicated, requiring more cooling towers, circulating pumps and other components, which increases costs.

[0006] Summary of the Invention

[0007] In response to the above problems, the present application provides a cold source integrated device, heat dissipation system, controller, and heat dissipation control method, which solves the problem that the existing liquid cooling heat dissipation solutions have complex pipelines, require more cooling towers, circulation pumps and other components, and increase costs.

[0008] In the first aspect, the present application provides a cold source integrated device. The cold source integrated device is connected to an air-liquid heat exchange mode component through a liquid cooling pipeline (a pipeline for transporting coolant for liquid cooling and heat dissipation, which can usually be a water cooling pipeline), and is connected to a liquid-liquid heat exchange mode component through a liquid cooling pipeline, and the air-liquid heat exchange mode component and the liquid-liquid heat exchange mode component are connected through a liquid cooling pipeline. Among them, the air-liquid heat exchange mode component refers to a component that exchanges heat with the hot air generated by the server and the coolant provided by the cooling tower, including but not limited to a liquid cooling door. The liquid-liquid heat exchange mode component refers to a component that uses liquid as a heat transfer medium to flow in the internal flow channel of the liquid cooling plate and realizes cooling through heat transfer, including but not limited to a liquid cooling plate heat dissipation control unit. The liquid cooling plate heat dissipation control unit can be a liquid cooling distribution unit (Cooling Distribution Unit, CDU) or an embedded liquid cooling unit (Embedded Cooling Unit, ECU).

[0009] Specifically, the cold source integrated device is used to provide cooling liquid through a liquid cooling pipeline. The cooling liquid flows through an air-to-liquid heat exchange mode component for dissipating heat to a first device of the equipment and a liquid-to-liquid heat exchange mode component for dissipating heat to a second device of the equipment. The cold source integrated device is then also used to receive the cooling liquid output by the liquid-to-liquid heat exchange mode component after dissipating heat to the second device.

[0010] The air-to-liquid heat exchange module and the liquid-to-liquid heat exchange module have different coolant temperature requirements. Typically, the temperature of the liquid inlet of the air-to-liquid heat exchange module is lower than that of the liquid-to-liquid heat exchange module. Therefore, the coolant enters the air-to-liquid heat exchange module first, where it dissipates heat from the first component. This heat dissipation causes the coolant to heat up, but the heated coolant still meets the temperature requirement of the liquid-to-liquid heat exchange module and can then enter the liquid-to-liquid heat exchange module, where it dissipates heat from the second component. This allows the integrated cooling system to meet the cooling requirements of both the air-to-liquid heat exchange module and the liquid-to-liquid heat exchange module through a single coolant channel, simplifying the liquid cooling circuit and reducing the number of components, such as cooling towers and circulating pumps, thereby lowering costs. Furthermore, these components can be integrated into a single system, reducing floor space, shortening the construction period, and facilitating deployment and maintenance. Furthermore, this solution reuses the coolant output from the air-to-liquid heat exchange module, improving energy efficiency.

[0011] In some possible implementations, the coolant flows sequentially through an air-to-liquid heat exchange mode component for dissipating heat for a first device of the apparatus and a liquid-to-liquid heat exchange mode component for dissipating heat for a second device of the apparatus.

[0012] In some possible implementations, the integrated cooling system is specifically designed to provide a mixed coolant through the liquid cooling pipeline when the supplemental cooling condition is triggered. The mixed coolant's temperature meets the temperature requirements of the air-to-liquid heat exchange mode components. This system can adopt a supplemental cooling design with mixed coolant (supplementing the cooling load to ensure the coolant temperature meets the requirements), further simplifying the system architecture and improving system energy efficiency.

[0013] In some possible implementations, the cold source integrated device includes a cooling tower, a circulating pump, a three-way valve, and a supplemental cooling chiller. The cooling tower and the circulating pump are connected via a liquid cooling pipeline, and the circulating pump and the supplemental cooling chiller are connected via a liquid cooling pipeline. The liquid cooling pipeline connecting the circulating pump and the supplemental cooling chiller is provided with a three-way valve. The cold source integrated device is specifically configured to, when a supplemental cooling condition is triggered, adjust the state of the three-way valve to a three-way state, so that the coolant provided by the cooling tower is divided into two paths after passing through the circulating pump, and the coolant in one of the two paths is mixed with the coolant in the other path after passing through the supplemental cooling chiller to obtain a mixed coolant.

[0014] This solution adjusts the three-way valve to a three-way state, allowing the coolant to be diverted and enter the supplementary cooling chiller in one direction before being mixed with the other. This eliminates the need for a separate circulation pump for the supplementary cooling line, enabling the reuse of the circulation pump, simplifying the system architecture, and improving system energy efficiency.

[0015] In some possible implementations, the circulation pump includes a primary circulation pump and a secondary circulation pump, and the three-way valve includes a first three-way valve and a second three-way valve. The cold source integration device is specifically configured to: when the supplementary cooling condition is triggered, adjust the state of the first three-way valve to a three-way state, so that the coolant in the cooling tower is divided into two paths after passing through the primary circulation pump, one of the two coolant paths passes through the condenser of the supplementary cooling chiller and is combined with the other coolant path through the plate heat exchanger before being merged in front of the cooling tower; and adjust the state of the second three-way valve to a three-way state, so that the coolant passing through the plate heat exchanger is divided into two paths after passing through the secondary circulation pump, one of the two coolant paths passes through the evaporator of the supplementary cooling chiller and is mixed with the other coolant path to obtain a mixed coolant.

[0016] This solution enables reuse of the primary circulation pump through the first three-way valve and reuse of the secondary circulation pump through the second three-way valve, which simplifies the system architecture, reduces the number of circulation pumps, and reduces costs.

[0017] In some possible implementations, the supplemental cooling condition includes a supply liquid temperature greater than or equal to a preset threshold. The cold source integrated device also includes a controller configured to, upon detecting that the supply liquid temperature is greater than or equal to the preset threshold, control the three-way valve to a three-way position and activate the supplemental cooling chiller. This allows for on-demand cooling and refined regulation through temperature-based automatic supplemental cooling control at the cold source.

[0018] In some possible implementations, the controller is specifically used to determine the bypass flow of the three-way valve based on the liquid supply temperature, the cooling temperature of the supplementary cooling machine, the required temperature of the air-liquid heat exchange mode component, and the flow required for heat dissipation, determine the opening ratio of the three-way valve based on the bypass flow, and adjust the state of the three-way valve to the three-way state according to the opening ratio.

[0019] This solution uses the law of conservation of energy to determine the bypass flow of the three-way valve, and then determines the valve opening ratio of the three-way valve based on the bypass flow. The state of the three-way valve is adjusted according to the valve opening ratio, which can more accurately control the temperature of the mixed coolant, thereby meeting the temperature requirements of the air-to-liquid heat exchange mode components.

[0020] In some possible implementations, the controller is further configured to: control the cooling tower's liquid supply temperature based on the wet-bulb temperature and the cooling tower's proximity; and then control the plate heat exchanger's secondary-side temperature based on the liquid supply temperature and the plate heat exchanger's proximity. This allows the integrated cooling device's liquid supply temperature (e.g., the plate heat exchanger's secondary-side temperature) to be linked to the ambient wet-bulb temperature. When the ambient wet-bulb temperature decreases, the integrated cooling device's liquid supply temperature also decreases. This is reflected in the machine room as the air outlet temperature of the air-to-liquid heat exchange mode components decreases, which in turn reduces the machine room temperature.

[0021] In some possible implementations, the controller is further configured to control the secondary side temperature of the plate heat exchanger based on the wet-bulb temperature, the proximity of the cooling tower, and the proximity of the plate heat exchanger. In this solution, the controller directly uses the secondary side temperature of the plate heat exchanger as an anchor point for temperature control, thereby enabling the supply temperature of the integrated cooling source device (e.g., the secondary side temperature of the plate heat exchanger) to be linked to the wet-bulb temperature of the environment.

[0022] In some possible implementations, the controller is further configured to detect that the temperature difference between the liquid outlet of the liquid-to-liquid heat exchange module and the liquid inlet of the air-to-liquid heat exchange module is lower than a set value, thereby reducing the opening of the electric valve deployed at the liquid inlet of the air-to-liquid heat exchange module. This can reduce flow rate, reduce power consumption of the secondary circulation pump, and achieve energy-saving control.

[0023] In some possible implementations, the circulating pump includes a primary circulating pump and a secondary circulating pump, with a plate heat exchanger disposed between the primary and secondary circulating pumps. The controller is further configured to: detect when the temperature difference between the primary outlet and the primary inlet of the plate heat exchanger is lower than a set value, and control the primary circulating pump to operate at a variable frequency; or detect when the temperature difference between the primary outlet and the secondary inlet of the plate heat exchanger is lower than the plate heat exchanger's approximation, and control the primary circulating pump to operate at a variable frequency. This can reduce power consumption of the primary circulating pump and achieve energy-saving control.

[0024] In a second aspect, the present application provides a heat dissipation system. The heat dissipation system includes the integrated cold source device provided in the first aspect of the present application, as well as an air-to-liquid heat exchange mode component and a liquid-to-liquid heat exchange mode component. The integrated cold source device is configured to collaborate with the air-to-liquid heat exchange mode component and the liquid-to-liquid heat exchange mode component to dissipate heat from the device.

[0025] In a third aspect, the present application provides a heat dissipation control method. The method is applied to a cold source integrated device, the cold source integrated device including a controller, a cooling tower, a circulating pump, a three-way valve, and a supplementary cooling chiller, the cooling tower and the circulating pump being connected via a liquid cooling pipeline, the circulating pump and the supplementary cooling chiller being connected via a liquid cooling pipeline, the liquid cooling pipeline connecting the circulating pump and the supplementary cooling chiller being equipped with the three-way valve, the method comprising:

[0026] The controller detects the temperature of the liquid supply;

[0027] When the liquid supply temperature is greater than or equal to a preset threshold, the controller controls the state of the three-way valve to be a three-way state, and turns on the supplementary cooling machine so that the coolant of the cooling tower is divided into two paths after passing through the circulation pump, and the coolant in one path is mixed with the coolant in the other path after passing through the supplementary cooling machine to obtain a mixed coolant.

[0028] In some possible implementations, the controller controls the state of the three-way valve to be a three-way state, including:

[0029] The controller determines the bypass flow of the three-way valve according to the liquid supply temperature, the cooling temperature of the supplementary cooling chiller, the required temperature of the air-to-liquid heat exchange mode component, and the flow required for heat dissipation;

[0030] The controller determines an opening ratio of the three-way valve according to the bypass flow rate, and adjusts the state of the three-way valve to a three-way state according to the opening ratio.

[0031] In some possible implementations, the circulation pump includes a primary circulation pump and a secondary circulation pump, a plate heat exchanger is provided between the primary circulation pump and the secondary circulation pump, and the method further includes:

[0032] controlling the liquid supply temperature of the cooling tower according to the wet bulb temperature and the proximity of the cooling tower, and then controlling the secondary side temperature of the plate heat exchanger according to the liquid supply temperature and the proximity of the plate heat exchanger; or,

[0033] The secondary side temperature of the plate heat exchanger is controlled according to the wet bulb temperature, the proximity of the cooling tower, and the proximity of the plate heat exchanger.

[0034] In some possible implementations, the method further includes:

[0035] It is detected that the temperature difference between the liquid outlet of the liquid-liquid heat exchange mode component and the liquid inlet of the air-liquid heat exchange mode component is lower than the set value, and the opening of the electric valve deployed at the liquid inlet of the air-liquid heat exchange mode component is reduced.

[0036] In some possible implementations, the circulation pump includes a primary circulation pump and a secondary circulation pump, a plate heat exchanger is provided between the primary circulation pump and the secondary circulation pump, and the method further includes:

[0037] It is detected that the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger is lower than the set value, and the primary circulation pump is controlled to operate at a variable frequency; or,

[0038] It is detected that the temperature difference between the primary side liquid outlet and the secondary side liquid inlet of the plate heat exchanger is lower than the approach degree of the plate heat exchanger, and the primary circulation pump is controlled to operate at a variable frequency.

[0039] In a fourth aspect, the present application provides a controller. The controller includes a processor and an input / output unit, the input / output unit being configured to communicate with a three-way valve in a cold source integrated device, and the processor being configured to execute computer-readable instructions, thereby causing the controller to perform the heat dissipation control method provided in any implementation of the third aspect of the present application.

[0040] In some possible implementations, the controller further includes a memory, and the processor is specifically configured to:

[0041] The computer-readable instructions are loaded from the memory and executed.

[0042] Based on the implementation methods provided in the above aspects, this application can also be further combined to provide more implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] FIG1 is a schematic diagram of the architecture of a data center provided by this application;

[0044] FIG2 is a schematic diagram of a liquid cooling pipeline of a cold source integrated device provided by the present application;

[0045] FIG3 is a schematic diagram of the architecture of another data center provided by this application;

[0046] FIG4 is a schematic diagram of a coolant circulation path of a cooling source integrated device or a heat dissipation system provided by the present application in a non-supplementing cooling operation state;

[0047] FIG5 is a schematic diagram of a coolant circulation path of a cooling source integrated device or a heat dissipation system provided by the present application in a supplementary cooling operation state;

[0048] FIG6 is a schematic diagram of the architecture of another data center provided by this application;

[0049] FIG7 is a schematic diagram of determining the valve opening ratio of a three-way valve provided by the present application;

[0050] FIG8 is a schematic diagram of a temperature control method provided by the present application;

[0051] FIG9 is a schematic diagram of energy-saving control of a circulation pump provided by the present application;

[0052] FIG10 is a flow chart of a heat dissipation control method provided in the present application. DETAILED DESCRIPTION

[0053] In order to solve the problem of complex piping in the above-mentioned liquid cooling heat dissipation solution, which requires the configuration of multiple circulating pumps, cooling towers and other components resulting in high costs, the present application provides a cold source integrated device and a heat dissipation system including the above-mentioned cold source integrated device. Among them, the cold source integrated device can be an integrated liquid cooling module. The heat dissipation system can include the above-mentioned cold source integrated device, an air-liquid heat exchange mode component (or called an air-liquid heat exchange device) and a liquid-liquid heat exchange mode component (or called a liquid-liquid heat exchange device). The cold source integrated device is connected to the air-liquid heat exchange mode component through a liquid cooling pipeline, and is connected to the liquid-liquid heat exchange mode component (such as a liquid cooling plate heat dissipation control unit such as an ECU or CDU) through a liquid cooling pipeline. The air-liquid heat exchange mode component and the liquid-liquid heat exchange mode component are connected through a liquid cooling pipeline. The cold source integrated device is used to provide coolant through the above-mentioned liquid cooling pipeline. The coolant passes through the air-liquid heat exchange mode component for dissipating heat to the first component of the device and the liquid-liquid heat exchange mode component for dissipating heat to the second component of the device in sequence. Then the cold source integrated device receives the coolant output after dissipating heat to the second component.

[0054] Among them, the air-cooled heat exchange mode component and the liquid-liquid heat exchange mode component have different requirements for the temperature of the coolant. Under normal circumstances, the temperature of the liquid inlet of the air-cooled heat exchange mode component (such as the liquid cooling door) is lower than the temperature of the liquid-liquid heat exchange mode component (such as the liquid cooling plate heat dissipation control unit such as the ECU or CDU). Therefore, the coolant first enters the air-cooled heat exchange mode component, and the air-cooled heat exchange mode component dissipates heat to the first device based on the coolant, which can take away the heat of the first device. At this time, the coolant will heat up because it takes away the heat of the first device. The heated coolant can still meet the temperature requirements of the liquid-liquid heat exchange mode component and can then enter the liquid-liquid heat exchange mode component. The liquid-liquid heat exchange mode component dissipates heat to the second device based on the heated coolant. In this way, the cold source integrated device can meet the requirements of the air-cooled heat exchange mode component and the liquid-liquid heat exchange mode component through one coolant, simplifying the liquid cooling pipeline, reducing the number of components such as cooling towers and circulation pumps, and reducing costs. Moreover, the above components can be integrated into one, reducing the footprint, shortening the construction period, and facilitating deployment and maintenance.

[0055] To facilitate understanding, the technical terms involved in this application are first introduced.

[0056] Liquid cooling refers to the technology that uses liquid as a heat transfer medium to exchange heat for heat-generating devices in a computing system (such as servers in a data center) and transfer the heat to the outside of the heat-generating devices. Liquid cooling technology supports multiple heat dissipation modes, including but not limited to liquid-to-liquid heat exchange (such as water-to-water heat exchange) mode and air-to-liquid heat exchange mode. Typically, the liquid-to-liquid heat exchange mode components include a liquid-cooled plate heat dissipation control unit, and the liquid-cooled plate heat dissipation circuit uses liquid-cooled distribution units (CDU) or embedded liquid cooling units (ECU) and other liquid-to-liquid heat exchange mode components to dissipate heat from devices with higher heat generation, such as the central processing unit (CPU). The air-to-liquid heat exchange mode components include components such as liquid-cooled doors inside the cabinet or air-cooled terminal devices such as row-level air conditioners outside the cabinet to achieve heat exchange between the hot air generated by the server and the coolant. If the liquid-cooled door heat dissipation circuit uses a liquid-cooled door, the air-to-liquid heat exchange mode is used to dissipate heat from devices with lower heat generation, such as memory and hard drives. Alternatively, when the air-to-liquid heat exchange mode component is a row-level air conditioner, air-to-liquid heat exchange processing can be achieved through the row-level air conditioner. For ease of description, the following embodiments are described using the liquid-to-liquid heat exchange mode component as a liquid cooling plate heat dissipation control unit and the air-to-liquid heat exchange mode component as a liquid cooling door as an example.

[0057] The liquid cooling distribution unit (CDU) is a liquid cooling control unit located inside the computer room of the data center, used to adjust the cooling capacity, temperature and flow rate of the coolant of a group of cabinets.

[0058] The embedded liquid cooling unit ECU is pre-integrated into the cabinet and is used as an integral part of the cabinet to control the cooling capacity, coolant temperature and flow rate of the cabinet.

[0059] The principles of the liquid cooling door heat dissipation route and the liquid cooling plate heat dissipation route are described in detail below with reference to the accompanying drawings.

[0060] FIG1 is a schematic diagram of the architecture of a data center provided by the present application, in which the present application uses liquid cooling to dissipate heat from cabinets in the data center. As shown in FIG1 , a data center 100 includes a liquid cooling room 110 and a heat dissipation system 120 .

[0061] Liquid cooling room 110 includes multiple liquid cooling cabinets 111. Liquid cooling cabinets 111 are entities that provide high-performance computing and use liquid cooling to dissipate heat from servers within the cabinets. For example, liquid cooling cabinets 111 may include multiple server nodes. A server node can be an independent physical device.

[0062] The heat dissipation system 120 includes one or more heat dissipation subsystems, each of which is used to dissipate heat from the liquid-cooled cabinet 111. To improve heat dissipation efficiency, if multiple heat dissipation subsystems exist in the heat dissipation system 120, different heat dissipation subsystems can dissipate heat from the liquid-cooled cabinet 111 via different heat dissipation circuits. For example, the liquid-cooled plate heat dissipation subsystem can dissipate heat from the liquid-cooled cabinet 111 via the liquid-cooled plate heat dissipation circuit, while the liquid-cooled door heat dissipation subsystem can dissipate heat from the liquid-cooled cabinet via the liquid-cooled door heat dissipation circuit.

[0063] The liquid cooling plate heat dissipation subsystem includes a cooling tower 121, a circulating pump 123 (for example, a circulating water pump, referred to as a water pump) and a liquid cooling plate heat dissipation control unit 125 (for example, a CDU). The cooling tower 121 is used to use a liquid cooling medium (for example, water) as a circulating cooling medium (coolant) to discharge heat into the atmosphere to reduce the temperature. The circulating pump 123 is used to provide power for conveying the coolant, for example, it is suitable for conveying water or liquid cooling medium with physical and chemical properties in a high-pressure operating system. The cooling tower 121 can supply a coolant with a lower temperature, such as cold water, and the circulating pump 123 conveys the coolant to the CDU in the computer room. The CDU controls the cooling capacity, temperature and flow rate of the liquid cooling cabinet 111, thereby cooling the server nodes in the liquid cooling cabinet 111. The coolant can take away the heat of the liquid cooling cabinet 111 and return to the cooling tower 121 through the CDU and the circulating pump 123, and the cooling tower 121 performs heat exchange.

[0064] The liquid-cooled door heat dissipation subsystem includes a cooling tower 122, a circulating pump 124, a plate heat exchanger 126 (referred to as the plate heat exchanger), and a liquid-cooled door 128. The plate heat exchanger 126 is a new, high-efficiency heat exchanger constructed from stacked corrugated metal plates. It includes gaskets, compression plates (movable and fixed end plates), and a frame (upper and lower guide rods, front struts). Gaskets seal and guide the plates, separating the cold and hot fluid channels. The cold and hot heat exchange media flow through their respective channels, exchanging heat with the separated plates to achieve the desired user temperature. The cooling tower 122 can supply a relatively low-temperature coolant, such as cold water, which is then delivered to the plate heat exchanger 126 by the circulating pump 124. When the temperature of the coolant separated by the plate heat exchanger 126 is below 28°C, it can be delivered to the liquid-cooled door 128 to cool the servers within the liquid-cooled cabinet 111. The coolant can take away the heat of the liquid-cooled cabinet 111 and return to the cooling tower 122 for heat exchange.

[0065] Compared with the liquid-cooled plate heat dissipation subsystem, the liquid-cooled door heat dissipation subsystem has higher requirements for the temperature of the coolant. When the ambient temperature is high, the liquid-cooled door heat dissipation subsystem usually also needs to supplement the cooling load (referred to as supplementary cooling) so that the coolant meets the temperature requirements of the liquid-cooled door heat dissipation subsystem. Specifically, the liquid-cooled plate heat dissipation subsystem also includes a circulating pump 12A, a chiller 12C, a circulating pump 12E and a cooling tower 12G. Specifically, when the temperature of the coolant separated by the plate heat exchanger 126 is greater than 28°C, the circulating pump 12A and the chiller 12C (usually a large unit) are turned on to supplement the cooling of the coolant separated by the plate heat exchanger 126, so that the coolant temperature is less than 28°C and then transported to the liquid-cooled door 128. In addition, the coolant (such as cold water) used for supplementary cooling of the chiller 12C can be provided by the cooling tower 12G. Among them, the cooling tower 12G can be an open cooling tower, and the cooling tower 12G transports the coolant to the chiller 12C through the circulating pump 12E. The chiller 12 can further cool the coolant transported by the cooling tower through the refrigeration system, thereby providing a coolant with a temperature of 18°C. The chiller 12C can take away the heat after supplementary cooling with the coolant with a temperature of 18°C, and return it to the cooling tower 12G through the circulating pump 12E, and the cooling tower 12G performs heat exchange.

[0066] It should be noted that the cooling tower that provides coolant for the liquid cooling plate heat dissipation control unit 125 and the liquid cooling door 128, the circulating pump that transports the coolant and other components can also be reused. The cooling tower, circulating pump and other components can be integrated to form a cold source integrated device.

[0067] FIG2 is a schematic diagram of a liquid cooling pipeline of a cold source integrated device provided by the present application. As shown in FIG2 , the cold source integrated device is used to provide cooling liquid through the liquid cooling pipeline. The cooling liquid can sequentially pass through a liquid cooling door for dissipating heat to a first device of the device (e.g., a small heat-generating device of a server in a data center, including but not limited to memory and hard disk) and a liquid cooling plate control unit for dissipating heat to a second device of the device (e.g., a large heat-generating device of a server in a data center, including but not limited to a CPU). The cold source integrated device is also used to receive the cooling liquid output by the liquid cooling plate heat dissipation control unit after dissipating heat to the second device.

[0068] Figures 1 and 2 illustrate the example of an air-to-liquid heat exchange mode component being a liquid-cooled door and a liquid-to-liquid heat exchange mode component being a liquid-cooled plate heat dissipation control unit, wherein heat dissipation components such as a liquid-cooled door can usually be arranged inside a liquid-cooled cabinet (the inside of a cabinet where a server using liquid cooling is located, which can also be referred to as the inside of a cabinet). Figures 1 and 2 are for the purpose of showing the flow direction of the coolant, and the liquid-cooled door is placed outside the liquid-cooled cabinet in the figure. When the air-to-liquid heat exchange mode component is a row-level air conditioner, the row-level air conditioner can be arranged outside the cabinet. Among them, the row-level air conditioner can perform air-to-liquid heat exchange on the cabinets arranged in rows in the computer room, in units of rows, thereby achieving row-level cooling. In some examples, the air-to-liquid heat exchange mode component can also be a room-level air conditioner, which is usually arranged outside the cabinet and performs air-to-liquid heat exchange on multiple cabinets in the computer room, thereby achieving room-level cooling.

[0069] This technical solution provides a single channel of water coolant to simultaneously meet the needs of both the liquid-cooled door and the liquid-cooled plate heat dissipation control unit. For example, a cooling source integrated device provides a channel of coolant, which first enters the liquid-cooled door to dissipate heat from the first component of the device. The coolant exiting the liquid-cooled door will heat up due to the heat it carries. Because the inlet temperature of the liquid-cooled door is lower than that of the liquid-cooled plate, the heated coolant still meets the temperature requirements of the liquid-cooled plate heat dissipation control unit. Therefore, the heated coolant can then enter the liquid-cooled plate heat dissipation control unit, such as the ECU, to dissipate heat from the second component of the device. After the liquid-cooled plate heat dissipation control unit dissipates heat from the second component, the coolant returns to the cooling source integrated device for heat exchange. This technical solution reduces the number of coolant supply lines, cooling towers, circulation pumps, and liquid cooling pipelines, thereby reducing costs. Furthermore, this solution significantly reduces system complexity, simplifies deployment and maintenance, and shortens the construction period. Furthermore, by reusing the coolant exiting the liquid-cooled door, this technical solution improves power usage effectiveness (PUE), meeting business needs.

[0070] Furthermore, this technical solution can employ mixed coolants for supplemental cooling (e.g., mixed water supplemental cooling) and reuse circulation pumps (e.g., reusing primary and secondary circulation pumps), further simplifying the system architecture and improving system energy efficiency. Furthermore, this technical solution supports integrated controllers, such as embedded programmable logic controllers (PLCs), to achieve interconnected cooling systems, enabling on-demand cooling and refined regulation.

[0071] The integrated cold source device of the present application and the heat dissipation system architecture including the integrated cold source device are described in detail below with reference to the accompanying drawings.

[0072] Referring to the architectural diagram of a data center shown in FIG3 , the data center 300 includes a liquid cooling room 310 and a heat dissipation system 320 . The liquid cooling room 310 includes multiple liquid cooling cabinets 311 , each of which contains one or more server nodes. A server node can be a separate physical device. The heat dissipation system 320 includes a cold source integrated device 322 , a cold door 324 , and a cold plate heat dissipation control unit 326 . The cold plate heat dissipation control unit 326 can be an ECU or a CDU. The cold source integrated device 322 is connected to the cold door 324 and the cold plate heat dissipation control unit 326 via a cold pipe. The cold door 324 and the cold plate heat dissipation control unit 326 are connected via a cold pipe. The cold source integrated device 322 , the cold door 324 , and the cold plate heat dissipation control unit 326 work together to dissipate heat for the equipment.

[0073] In a specific implementation, the cooling source integrated device 322 is used to provide cooling liquid through the liquid cooling pipeline. The cooling liquid can be a cooled liquid, such as cold water. The cooling liquid sequentially passes through the liquid cooling door 324, which is used to dissipate heat from a first device (such as a server node) in the liquid cooling room 310, and the liquid cooling plate heat dissipation control unit 326, which is used to dissipate heat from a second device in the liquid cooling room 310. The cooling source integrated device 322 is also used to receive the cooling liquid (such as hot water) output by the liquid cooling plate heat dissipation control unit 326 after the cooling process is completed on the second device.

[0074] In some possible implementations, the cold source integrated device 322 is specifically used to provide mixed coolant through the liquid cooling pipeline when the supplementary cooling condition is triggered, so as to supplement the cooling of the coolant entering the liquid cooling door 324. The temperature of the mixed coolant meets the temperature requirement of the liquid cooling door 324. The temperature requirement of the liquid cooling door may be less than or equal to the target temperature, which may be 28°C or 25°C. The target temperature may be different depending on the application scenario. The supplementary cooling condition can be set according to business needs. For example, the supplementary cooling condition can be set to a liquid supply temperature greater than or equal to a preset threshold. The cold source integrated device 322 can achieve supplementary cooling of the mixed coolant by opening the three-way valve.

[0075] Specifically, the integrated cold source device 322 includes a cooling tower 3222, a circulating pump 3224, a three-way valve 3226, and a supplementary cooling chiller 3228. The three-way valve 3226 and supplementary cooling chiller 3228 are optional components. For example, in areas where the ambient temperature remains relatively low year-round, the integrated cold source device 322 does not require supplementary cooling and thus may not include the three-way valve 3226 or supplementary cooling chiller 3228. This embodiment uses an example of an area where the ambient temperature varies significantly with the seasons. Due to the hot summer weather and high ambient temperature, the integrated cold source device 322 is equipped with the three-way valve 3226 and supplementary cooling chiller 3228 to provide supplementary cooling. The cooling tower 3222 and the circulating pump 3224 are connected by a liquid cooling pipeline, which in turn is connected to the supplementary cooling chiller 3228. The liquid cooling pipeline connecting the circulating pump 3224 and the supplementary cooling chiller 3228 is equipped with a three-way valve 3226.

[0076] Specifically, when the supplementary cooling condition is triggered, the cooling source integration device 322 adjusts the three-way valve 3226 to a three-way state. This allows the coolant from the cooling tower 3222 to flow through the circulation pump 3224 and then be split into two paths. The coolant from one path then flows through the supplementary cooling chiller 3228 and mixes with the coolant from the other path to produce a mixed coolant. This mixed coolant can meet the temperature requirements of the liquid cooling door 324.

[0077] The circulation pump 3224 may include a primary circulation pump 3224A and a secondary circulation pump 3224B. Accordingly, the three-way valve 3226 may include a first three-way valve 3226A and a second three-way valve 3226B. The primary circulation pump 3224A is connected to the first three-way valve 3226A, and the secondary circulation pump is connected to the second three-way valve 3226B. Specifically, when the supplementary cooling condition is triggered, the cold source integration device 322 adjusts the state of the first three-way valve 3226A to a three-way state. This allows the coolant from the cooling tower 3222 to be split into two paths after passing through the primary circulation pump 3224A. One of the two coolant paths passes through the condenser of the supplementary cooling chiller 3228, and the other coolant path passes through the plate heat exchanger 3225 before merging in front of the cooling tower 3222. Furthermore, the state of the second three-way valve 3226B is adjusted to a three-way state. This allows the coolant from the plate heat exchanger 3225 to be split into two paths after passing through the secondary circulation pump 3224B. One of the two coolant paths passes through the evaporator of the supplementary cooling chiller 3228, and then mixes with the other coolant path to form a mixed coolant. This mixed coolant can provide supplementary cooling and meet the temperature requirements of the liquid cooling door 324.

[0078] Considering that the cooling pump 3222 and the plate heat exchanger 3225 can output coolant to supply coolant to the downstream equipment, the cold source integrated device 322 can decide whether to open the three-way valve 3224 to mix the coolant and provide supplementary cooling to the coolant entering the liquid cooling door 324 based on the liquid supply temperature of the cooling pump 3222 and the plate heat exchanger 3225, or the final liquid supply temperature of the entire cold source integrated device 322. In other words, the liquid supply temperature in the supplementary cooling condition can be the liquid supply temperature of the cooling tower 3222, the liquid supply temperature of the plate heat exchanger 3225 (such as the secondary side liquid outlet temperature), or the final liquid supply temperature of the entire cold source integrated device 322. Accordingly, the preset threshold values ​​corresponding to the supply temperatures at different points can be different. For example, the preset threshold value corresponding to the liquid supply temperature of the cooling tower 3222 can be set to 32°C, and the preset threshold value corresponding to the final liquid supply temperature of the entire cold source integrated device 322 can be set to 28°C.

[0079] It should be noted that the cooling tower 322 in the integrated cooling source device 322 of the present application can be either an open cooling tower or a closed cooling tower. In a closed cooling tower, the coolant flows within a sealed pipe without contact with the outside air. Heat is exchanged with the external air, spray water, etc. through the heat exchanger tube walls. The coolant is protected from contamination, evaporation, and concentration, eliminating the need for water replenishment or dosing, thereby ensuring the performance and lifespan of the associated equipment. In an open cooling tower, the coolant circulates within an open system, evaporating and concentrating, requiring replenishment. Furthermore, the coolant is directly exposed to air and sunlight, making it susceptible to contamination, such as the formation of algae or salt crystals. Therefore, the coolant typically requires treatment, such as the application of medication, to prevent the growth of algae and salt crystals. FIG3 illustrates an open cooling tower using cooling tower 322 as an example. Accordingly, the integrated cooling source device 322 also includes a coolant treatment device 3223A, which is used to descale, filter, soften, or sterilize the coolant. A three-way valve 3227 may also be connected between the coolant treatment device 3223A and the plate heat exchanger 3225. Similarly, a coolant treatment device 3223B may be included between the liquid outlet of the liquid cooling cabinet 311 and the plate heat exchanger 3225 to descale, filter, soften, or sterilize the coolant output from the liquid cooling cabinet 311 after heat dissipation. The coolant treatment device 3223A or the coolant treatment device 3223B may be optional components. For example, when the cold source integrated device 322 utilizes a closed cooling tower, the coolant treatment device 3223A or the coolant treatment device 3223B may not be included.

[0080] In some possible implementations, the cold source integrated device 322 may also be integrated with a fluid replenishment device 3229. For example, the fluid replenishment device 3229 may be a constant-pressure water replenishment device. A constant-pressure water replenishment device is a pressure-stabilizing water replenishment device that includes a pressure-stabilizing tank, a water pump, a pressure switch, an intelligent control box, a safety valve, a base, and piping. It is used to reduce the number of times the circulating pump 3224 is started, adjusts the system's water pressure and water volume, and facilitates automatic water replenishment. Similarly, the fluid replenishment device 3229 may be an optional component. If the cold source integrated device 322 does not include the fluid replenishment device 3229, the pressure and flow rate can be adjusted manually.

[0081] The cold source integrated device 322 shown in Figure 3 or the heat dissipation system 320 including the cold source integrated device 322 has multiple operating states. For example, the operating state of the cold source integrated device 322 or the heat dissipation system 320 can be divided into: no cold supplement operating state, cold supplement operating state according to whether the cold supplement condition is triggered. The following introduces the circulation paths of the coolant (such as the water circulation path) under different operating states of the above-mentioned cold source integrated device 322 or the heat dissipation system 320 respectively.

[0082] When the cooling source integrated device 322 or the heat dissipation system 320 is operating without supplemental cooling, the coolant does not require supplemental cooling and therefore does not pass through the supplemental cooling chiller. Instead, it circulates through the primary and secondary sides of the plate heat exchanger 3225. The coolant provided by the cooling tower 3222 is transported to the plate heat exchanger 3225 via the primary circulation pump 3224A for heat exchange. The primary side of the plate heat exchanger 3225 can output the heated coolant, which is then processed by the coolant treatment device 3223A and returned to the cooling tower 3222, thus completing a single cycle. The cooled coolant obtained through heat exchange in the plate heat exchanger 3225 can be output from the secondary side of the plate heat exchanger 3225. The coolant output from the secondary side liquid outlet of the plate heat exchanger 3225 is transported to the liquid cooling door 324 through the secondary circulation pump 3224B, and the liquid cooling door 324 dissipates heat to the first component based on the coolant. Then the coolant is output from the liquid outlet of the liquid cooling door 324 and enters the liquid cooling plate heat dissipation control unit 326, and the liquid cooling plate heat dissipation control unit 326 dissipates heat to the second component. The coolant output from the liquid outlet of the liquid cooling plate heat dissipation control unit 326 is processed by the coolant treatment device 3223B and reaches the secondary side liquid inlet of the plate heat exchanger 3225, thereby realizing secondary circulation.

[0083] For ease of understanding, this application also introduces the circulation path of the coolant in conjunction with the accompanying drawings.

[0084] 4 shows a schematic diagram of a coolant circulation path in a non-supplementing cooling operation state. The cold source integrated device 322 or the heat dissipation system 320 includes a primary circulation and a secondary circulation.

[0085] During a single cycle, the coolant circulates along the path 1->2->3->4->5->6->7. At this point, the three-way valves between 2->3 and 5->6 are in a two-way state. In other words, the coolant from cooling tower 3222 passes through primary circulation pump 3224A, reaches first three-way valve 3224A, and then exits through one passage of first three-way valve 3224A to plate heat exchanger 3225, for example, at the primary inlet of plate heat exchanger 3225. Plate heat exchanger 3222 then delivers the coolant (e.g., through the primary outlet) to three-way valve 3227. Three-way valve 3227 delivers the coolant to coolant treatment device 3223A for treatment before returning it to cooling tower 3222.

[0086] During the secondary circulation, the coolant circulates along the path 8->9->10->11->12->13, with the three-way valve between 9->10 in a two-way state. In other words, after heat exchange in the plate heat exchanger 3225, the coolant from the open cooling tower 3222 is delivered through the secondary outlet of the plate heat exchanger 3225 to the secondary circulation pump 3224B. The secondary circulation pump 3224B delivers the coolant to the second three-way valve 3224B. Because the second three-way valve 3224B is in a two-way state, the coolant is discharged through one passage (the normally closed passage) of the second three-way valve 3224B and reaches the liquid cooling room 310. The coolant first enters the liquid cooling door 324 to dissipate heat from small heat-generating components in the server nodes of the liquid cooling cabinet 311, such as memory and hard drives. The coolant takes away the heat from the memory and hard disk, which may cause the temperature of the coolant to rise. The heated coolant can then enter the liquid cooling plate heat dissipation control unit 326 (such as an ECU). The ECU can control the flow rate of the coolant to dissipate heat from large heat-generating components such as the CPU in the server node of the liquid cooling cabinet 311. The coolant takes away the heat from the CPU, which may cause the temperature of the coolant to rise further. The heated coolant can reach the plate heat exchanger 3225 (for example, the secondary side liquid inlet of the plate heat exchanger 3225) after being processed by the coolant processing device 3223B. Among them, the plate heat exchanger 3225 can recycle the heated coolant for heat exchange.

[0087] When the cold source integrated device 322 or the heat dissipation system 320 is in the supplementary cooling mode, the coolant needs supplementary cooling to meet the temperature requirements of the liquid cooling door 324. In other words, during the supplementary cooling mode, the coolant also needs to enter the supplementary cooling chiller 3228. Specifically, as the coolant circulates through the primary and secondary sides of the plate heat exchanger 3225, it is also diverted to enter the supplementary cooling chiller 3228. The coolant provided by the cooling tower 3222 is delivered to the first three-way valve 3226A via the primary circulation pump 3224A. The first three-way valve 3226A divides the coolant into two paths, each of which is delivered to the plate heat exchanger 3225 and the supplementary cooling chiller 3228 for heat exchange. The coolant output from the primary outlet of the plate heat exchanger 3225 and the coolant output from the condenser of the supplementary cooling chiller 3228 are treated by the coolant treatment device 3223A before being combined in front of the cooling tower 3222, thus completing a single cycle. The coolant, which has been cooled by heat exchange in the plate heat exchanger 3225, can be output from the secondary side of the plate heat exchanger 3225. The coolant output from the secondary side outlet of the plate heat exchanger 3225 is transported by the secondary circulation pump 3224B to the second three-way valve 3226B. The second three-way valve 3226B then splits the coolant into two paths. One path enters the evaporator of the supplementary cooling unit 3228 for heat exchange. The coolant output from the evaporator mixes with the coolant from the other path to form a mixed coolant. The mixed coolant first enters the liquid cooling door 324 and then the liquid cooling plate heat dissipation control unit 326. The coolant output from the liquid cooling plate heat dissipation control unit 326 is treated by the coolant treatment device 3223B before reaching the secondary side inlet of the plate heat exchanger 3225, thus completing the secondary circulation.

[0088] For ease of understanding, this application also introduces the circulation path of the coolant in conjunction with the accompanying drawings.

[0089] 5 , a schematic diagram of a coolant circulation path in a supplementary cooling operation state is shown. The cold source integration device 322 or the heat dissipation system 320 includes a primary circulation and a secondary circulation.

[0090] During a single cycle, the coolant can circulate through the following paths: 1->2->4->5->7->8 and 1->2->3->6->7->8. The three-way valves between 2->3 and 5->7 are in a three-way state. The coolant output from point 2 is diverted through the three-way valve to the condenser of the supplemental chiller 3228. The flow then passes through point 6 and rejoins the three-way valve before the cooling tower 3222. In other words, the coolant in the cooling tower 3222 passes through the primary circulation pump 3224A and reaches the first three-way valve 3224A. Since the first three-way valve 3224A is in a three-way state, the coolant is divided into two paths. One path passes through the plate heat exchanger 3225 and reaches the coolant treatment device 3223A through a passage of the three-way valve 3227. The other path passes through the condenser of the supplementary cooling machine 3228 for condensation and then reaches the coolant treatment device 3223A through another passage of the three-way valve 3227. The coolant treatment device 3223A descales, filters, softens or sterilizes the above two coolants and then merges them in front of the cooling tower.

[0091] During the secondary circulation, the coolant can circulate through the paths 9->10->12->14->15->16 and 9->10->11->13->14->15->16. The three-way valve between 10->12 is in the three-way state. A portion of the coolant output from point 12 passes through point 11, where it is cooled by the evaporator of supplementary chiller 3228 and then mixed with the coolant from point 12 to form a cooling source that meets the cooling temperature requirements of the server nodes. In other words, after the coolant in the cooling tower 3222 passes through the plate heat exchanger 3225 for heat exchange, it is transported to the secondary circulation pump 3224B, and the secondary circulation pump 3224B transports the coolant to the second three-way valve 3224B. Since the second three-way valve 3224B is in a three-way state, the coolant is output from the two channels of the second three-way valve 3224B respectively. One channel of coolant reaches the evaporator of the supplementary cooling machine 3228 for evaporation and cooling, and then mixes with the other channel of coolant. The temperature of the mixed coolant can meet the temperature requirement of the liquid cooling door 324 and can be input into the liquid cooling door 324. The liquid cooling door 324 dissipates heat to the small heat-generating components in the equipment based on the mixed coolant. The coolant takes away the heat of the small heat-generating components, which may cause the temperature of the coolant to increase. The heated coolant can then enter the liquid cooling plate heat dissipation control unit 326 (such as an ECU). The ECU can control the flow rate of the coolant to dissipate heat to the large heat-generating components in the server nodes of the liquid cooling cabinet 311. The heated coolant is processed by the coolant treatment device 3223B and then reaches the plate heat exchanger 3225. The plate heat exchanger 3225 can heat the heated coolant for recycling.

[0092] It should be noted that the same point number in Figures 4 and 5 can indicate different points. For example, point number 3 in Figure 4 and point number 3 in Figure 5 respectively indicate different paths of the three-way valve.

[0093] In the above solution, the cold source can be integrated. For example, a circulation pump 3224 (such as a primary circulation pump 3224A and a secondary circulation pump 3224B), a plate heat exchanger 3225, three-way valves 3226 (a first three-way valve 3226A and a second three-way valve 3226B), and a supplemental cooling chiller 3228 can be integrated into a container. The container is then integrated with a cooling tower 3222 to form a cold source integrated device 322. In this device, the supplemental cooling design uses a mixed coolant solution that reuses the primary and secondary circulation pumps, greatly simplifying the system architecture and improving system energy efficiency.

[0094] Furthermore, referring to FIG6 , the cold source integrated device 322 can also integrate a controller 3221. The controller 3221 is used to implement linkage control based on liquid temperature, thereby realizing on-demand cooling and forming a normal temperature machine room. Among them, the controller 3221 can be implemented by a PLC control board. Specifically, the controller 3221 can detect whether the cooling supplement condition is triggered. For example, the controller 3221 can detect whether the liquid supply temperature (also called the water supply temperature when the coolant is cold water) is greater than or equal to a preset threshold. Specifically, the cold source integrated device 322 can deploy a temperature sensor at a set point, and the temperature sensor can detect the temperature of the coolant at the set point. The temperature sensor establishes a communication connection with the controller 3221, and the temperature sensor can report the detection result to the controller 3221, so that the controller 3221 can obtain the liquid supply temperature.

[0095] When the supply liquid temperature is greater than or equal to the preset threshold, it indicates that the supplementary cooling condition is triggered. The controller can control the state of the three-way valve 3224 to be a three-way state and turn on the supplementary cooling machine 3228 to achieve supplementary cooling control.

[0096] When the supplementary cooling condition is triggered, the controller 3221 can adjust the state of the first three-way valve 3224A to a three-way state, so that the coolant in the cooling tower 3222 is divided into two paths after passing through the primary circulation pump 3224A. One of the two coolant paths passes through the condenser of the supplementary cooling chiller 3228 and the other coolant path passes through the plate heat exchanger 3225 before merging in front of the cooling tower. The controller 3221 can also adjust the state of the second three-way valve 3224B to a three-way state, so that the coolant passing through the plate heat exchanger 3225 is divided into two paths after passing through the secondary circulation pump 3224B. One of the two coolant paths passes through the evaporator of the supplementary cooling chiller 3228 and mixes with the other coolant path to obtain a mixed coolant. The mixed coolant meets the temperature requirements of the liquid cooling door 324.

[0097] When performing supplementary cooling control, the controller 3221 can determine the bypass flow of the three-way valve 3224 based on the liquid supply temperature, the cooling temperature of the supplementary cooling machine 3228, the required temperature of the liquid cooling door and the flow required for heat dissipation, determine the opening ratio of the three-way valve 3224 based on the bypass flow, and adjust the state of the three-way valve 3224 to the three-way state according to the valve opening ratio.

[0098] Furthermore, the controller 3221 can also control the liquid supply temperature to be linked with the ambient temperature to reduce overall power consumption and achieve energy-saving control. Similarly, the controller 3221 can also perform energy-saving control on the primary circulation pump 3224A and the secondary circulation pump 3224B to improve system energy efficiency.

[0099] Still taking FIG. 6 as an example, the linkage control of the controller 3221 is described in detail.

[0100] The control points of the controller 3221 include, but are not limited to, the fan frequency of the cooling tower 3222, the frequency of the primary circulation pump 3224A, the opening of the electric valve (including a three-way valve and a two-way valve), the operating parameters of the supplemental cooling machine 3228, the operating parameters of the refill device 3229, the operating parameters of the coolant treatment device 3223, and the operating parameters of the liquid cooling plate heat dissipation control unit 326 (such as an ECU). The operating parameters of the supplemental cooling machine 3228 include the input frequency and liquid outlet temperature of the variable frequency compressor, the operating parameters of the refill device 3229 may include the start / stop status of the liquid pump (such as a water pump), the operating parameters of the coolant treatment device 3223 include the start / stop status of the coolant treatment device 3223, and the operating parameters of the liquid cooling plate heat dissipation control unit 326 include the opening of the primary-side proportional valve (such as a reused V5 or V6, or a separate proportional valve), the secondary-side liquid supply temperature, and the liquid pump frequency.

[0101] The controller 3221 can collect data, analyze the collected data, and control the above-mentioned control points based on the analysis results. The data collected by the controller 3221 can include one or more of the operating parameters of the cooling tower 3222, the external ambient temperature, the operating parameters of the primary circulation pump 3224A, the opening of the electric valve (including three-way valves and two-way valves, such as V1 to V7 in the figure), the temperature collected by the temperature sensor, the pressure collected by the pressure sensor, the operating parameters of the liquid replenishing device 3229, the operating parameters of the coolant treatment device 3223, the operating parameters of the supplemental cooling chiller 3228, the parameters of the flow meter, and the operating parameters of the liquid cooling plate heat dissipation control unit 326.

[0102] The operating parameters of cooling tower 3222 collected by controller 3221 include one or more of fan frequency, power consumption, liquid outlet temperature, and liquid inlet temperature. The ambient temperature collected by controller 3221 includes dry-bulb temperature and wet-bulb temperature. The dry-bulb temperature is the actual temperature of the air contacting the cooling tower surface, while the wet-bulb temperature is the temperature of the cooling tower after water evaporates and removes heat from the cooling tower surface. The amount of water evaporation is related to the humidity of the air. The higher the humidity, the lower the evaporation, the less heat removed by evaporation, and the smaller the difference between the dry-bulb and wet-bulb temperatures. The lower the humidity, the greater the evaporation, the greater the heat removed by evaporation, and the larger the difference between the dry-bulb and wet-bulb temperatures. Therefore, the variation in the dry-bulb and wet-bulb temperature difference can be used to reflect the current humidity level. Based on this, the wet-bulb temperature can also be determined from the dry-bulb temperature and relative humidity. The operating parameters of primary circulation pump 3224A collected by controller 3221 include one or more of operating frequency, power consumption, inlet pressure, and outlet pressure. The operating parameters of the fluid replenishment device 3229 collected by the controller 3221 may include its start / stop status. The operating parameters of the coolant treatment device 3223 collected by the controller 3221 may include its start / stop status. The operating parameters of the supplemental cooling unit 3228 collected by the controller 3221 may include the input frequency and liquid outlet temperature of the variable frequency compressor. The operating parameters of the liquid cooling plate heat dissipation control unit 326 collected by the controller 3221 may include the opening of the primary-side proportional valve, the secondary-side liquid supply temperature, and the liquid pump frequency.

[0103] When the controller 3221 detects that the liquid supply temperature is greater than or equal to a preset threshold, for example, when the liquid supply temperature of the integrated cold source device 322 is detected to be greater than 32 degrees Celsius for three consecutive times, the controller 3221 can control the state of the first three-way valve 3224A and the second three-way valve 3224B (for example, V1 and V4 in Figure 6) to be a three-way state, and turn on the supplementary cold machine 3228. Among them, the three-way valve generally includes a normally open passage and a normally closed passage. In the example of Figure 6, the normally open passage is also deployed with an electric valve (for example, the two-way valves V2 and V3 in Figure 6). For this reason, the controller 3221 can also control the state of V2 and V3 to be a valve open state, thereby closing the normally open passage.

[0104] Among them, the controller 3221 is used to determine the bypass flow of the three-way valve based on the liquid supply temperature, the cooling temperature of the supplementary cooling machine 3228, the required temperature of the liquid cooling door 324 and the flow required for heat dissipation, and then determine the valve opening ratio of the three-way valve (such as V1, V4) based on the bypass flow, and adjust the state of the three-way valve to the three-way state according to the valve opening ratio.

[0105] The following uses V4 as an example to illustrate the process of determining the valve opening ratio. Specifically, the valve opening ratio (opening degree) of the V4 valve corresponds one-to-one to the flow rate. The valve opening ratio of V4 (also known as the bypass opening degree) can be determined by calculating the required bypass flow rate. The bypass flow rate can be calculated based on the law of conservation of energy. As shown in Figure 7, the temperature of the coolant flowing into V4 is recorded as T1, and the flow rate of the coolant flowing into V4 is the flow rate required for heat dissipation (for example, the flow rate required for heat dissipation of the server in the liquid cooling cabinet 311), recorded as Q3. The coolant is divided into two paths when passing through V4. The temperature of the two coolant paths remains unchanged, still T1, and the flow rates of the two coolant paths are Q1 and Q2, respectively. Among them, the coolant with a flow rate of Q2 drops to T2 after passing through the supplementary cooling chiller 3228, and then merges with the coolant with a flow rate of Q1.

[0106] Based on the law of conservation of energy, the following model can be established: Q1*T1+Q2*T2=Q3*T3 (1) Q3=Q1+Q2 (2)

[0107] Among them, Q3 is the flow rate required for server heat dissipation. Q3 can usually be obtained by measuring with sensors, and T1 can be obtained based on the wet-bulb temperature and the approach of the cooling tower 3222. Among them, the approach of the cooling tower 3221 can be the difference between the coolant temperature (such as water temperature) after cooling by the cooling tower 3221 and the wet-bulb temperature, which is used to indicate the degree to which the coolant temperature after cooling by the cooling tower 3221 approaches the wet-bulb temperature. Under normal circumstances, the approach of the cooling tower 3221 can be 3-4°C. T2 can be set, for example, T2 can be set to 15°C, and similarly, T3 can be set to 32°C. Based on the formula in the above model, Q1 and Q2 (bypass flow) can be solved.

[0108] After the controller 3221 determines the valve opening ratio based on the bypass flow, it can send the valve opening ratio to the corresponding three-way valve, thereby controlling the state of the three-way valve to be a three-way state according to the valve opening ratio.

[0109] Similarly, when turning on the supplementary cooling chiller 3228, the controller 3221 may also send a start instruction to the supplementary cooling chiller. After receiving the start instruction, the supplementary cooling chiller 3228 may turn on the supplementary cooling.

[0110] Furthermore, in order to avoid the disadvantages of high-temperature computer rooms, improve the reliability of information technology (IT) equipment, reduce IT power consumption, and achieve global optimization, the integrated cold source device 322 can also perform global linkage control based on the coolant temperature.

[0111] One control method is for the controller 3221 to control the cooling tower's liquid supply temperature according to the wet bulb temperature and the cooling tower's proximity, and then control the secondary side temperature of the plate heat exchanger 3225 according to the liquid supply temperature and the plate heat exchanger's proximity.

[0112] Specifically, referring to a schematic diagram of temperature control shown in FIG8 , the cooling tower 3222 controls the liquid supply temperature of the cooling tower 3222 (when the coolant is water, specifically the outlet water temperature) using the wet-bulb temperature and the degree of approach of the cooling tower 3222. Then, the secondary side temperature of the plate heat exchanger 3225 is controlled using the liquid supply temperature of the cooling tower 3222 and the degree of approach of the plate heat exchanger 3225. In other words, when controlling the secondary side temperature of the plate heat exchanger 3225, control can be performed through two anchor points. In this way, the liquid supply temperature of the integrated cold source device 322 is linked to the wet-bulb temperature. When the wet-bulb temperature of the external environment decreases, the liquid supply temperature of the integrated cold source device 322 also decreases. This is reflected on the side of the liquid cooling room 310 as the air outlet temperature of the liquid cooling door decreases, and the temperature of the liquid cooling room 310 decreases.

[0113] The controller 3221 can also simultaneously manage the liquid cooling plate heat dissipation control unit 326 such as ECU. The secondary side temperature can be set to the primary side temperature + approximation. At this time, the liquid supply temperature of the liquid cooling plate heat dissipation control unit 326 changes with the wet-bulb temperature of the external environment. When the temperature of the external environment is low, under the same business model, the temperature of the server node in the liquid cooling cabinet 311 is reduced and the IT power consumption is reduced.

[0114] Another control method is for the controller 3221 to control the secondary side temperature of the plate heat exchanger 3225 based on the wet bulb temperature, the proximity of the cooling tower 3222, and the proximity of the plate heat exchanger 3225. In other words, the controller 3221 directly uses the secondary side temperature of the plate heat exchanger 3225 as an anchor point for temperature control.

[0115] In some possible implementations, controller 3221 can also perform energy-saving control on circulation pumps 3224, such as primary circulation pump 3224A and secondary circulation pump 3224B. A plate heat exchanger 3225 is provided between primary circulation pump 3224A and secondary circulation pump 3224B. Controller 3221 can perform energy-saving control on circulation pumps 3224 based on the liquid outlet temperature or liquid inlet temperature of plate heat exchanger 3225.

[0116] For the primary circulation pump 3224A, the controller 3221 can deploy temperature sensors at the primary side liquid inlet and primary side liquid outlet of the plate heat exchanger 3225 after the primary circulation pump 3224A. The controller 3221 is used to detect the temperature of the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger 3225 after the primary circulation pump 3224A, for example, the temperature of the primary side liquid outlet and the primary side liquid inlet reported by the receiving temperature sensor. When the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger 3225 is lower than the set value (for example, 9°C), the controller 3221 is used to control the primary circulation pump 3224A to operate at a variable frequency to save power. Similarly, the controller 3221 can also control the primary circulation pump 3224A based on the proximity of the plate heat exchanger 3225 to save power. In a specific implementation, the controller 3221 can deploy temperature sensors at the primary liquid outlet and secondary liquid inlet of the plate heat exchanger 3225. When it detects that the temperature difference between the primary liquid outlet and the secondary liquid inlet of the plate heat exchanger 3225 is lower than the approximation of the plate heat exchanger 3225 (e.g., 1°C to 1.5°C), the primary circulation pump 3224A is controlled to operate at a variable frequency.

[0117] Regarding the secondary circulation pump 3224B, as shown in Figure 9 , the controller 3221 can deploy temperature sensors at the liquid outlet of the liquid cooling plate heat dissipation control unit 326 and the liquid inlet of the liquid cooling door 324. Furthermore, the controller 3221 can deploy an electric valve at the liquid inlet of the liquid cooling door 324. The controller 3221 is configured to detect the temperature T1 of the liquid inlet of the liquid cooling door 324 and the temperature T2 of the liquid outlet of the liquid cooling plate heat dissipation control unit 326. When the temperature difference (T2-T1) between the liquid outlet of the liquid cooling plate heat dissipation control unit 326 and the liquid inlet of the liquid cooling door 324 falls below a set value (e.g., 9°C), the controller 3221 is further configured to reduce the opening of the electric valve deployed at the liquid inlet of the liquid cooling door 324. This reduces the flow rate and thus the power consumption of the secondary circulation pump 3224B.

[0118] Based on the cold source integrated device 322 and the heat dissipation system 320 of the aforementioned embodiment, the present application further provides a heat dissipation control method.

[0119] The heat dissipation control method disclosed in this application is described in detail below with reference to the accompanying drawings.

[0120] Referring to the flow chart of a heat dissipation control method shown in FIG10 , this method is applied to a cold source integrated device 322, which includes a controller 3221, a cooling tower 3222, a circulating pump 3224, a three-way valve 3226, and a supplementary cooling chiller 3228. The cooling tower 3222 and the circulating pump 3224 are connected via a liquid cooling pipeline, and the circulating pump 3224 and the supplementary cooling chiller 3228 are also connected via a liquid cooling pipeline. The liquid cooling pipeline connecting the circulating pump 3224 and the supplementary cooling chiller 3228 is equipped with a three-way valve 3224. The method includes the following steps:

[0121] S1002: The controller 3221 detects the liquid supply temperature. When the liquid supply temperature is greater than or equal to a preset threshold, S1004 is executed.

[0122] Specifically, the controller 3221 can deploy a temperature sensor at the liquid outlet of the cooling tower 3222, and the temperature sensor can be used to detect the liquid supply temperature (for example, the outlet water temperature) of the cooling tower 3222. In some examples, the controller 3221 can also deploy a temperature sensor at the liquid outlet (such as the secondary side liquid outlet) of the plate heat exchanger 3225, or at the end (output end) of the entire cold source integrated device 322, and detect the liquid supply temperature of the plate heat exchanger 3225 or the final liquid supply temperature of the entire cold source integrated device 322 through the above temperature sensor.

[0123] When the supply temperature is greater than or equal to a preset threshold, the cooling supply condition is triggered and the controller 3221 can perform cooling supply control. The controller 3221 can control the three-way valve 3224 to a three-way state to mix the coolants in different paths for cooling supply.

[0124] S1004: The controller 3221 determines the bypass flow of the three-way valve 3224 according to the liquid supply temperature, the cooling temperature of the supplementary cooling chiller 3228, the required temperature of the liquid cooling door, and the flow required for heat dissipation.

[0125] The coolant flow rate entering three-way valve 3224 is equal to the sum of the flow rates of the three-way valve's various output channels. The sum of the energy of the coolant in these channels equals the energy of the mixed coolant. Based on this, controller 3221 can apply the law of conservation of energy to model the flow rate, based on the supply temperature, the cooling temperature of the supplemental cooler 3228, the required temperature of the liquid cooling door, and the required heat dissipation flow rate, thereby establishing the model shown in Figure 7. By solving this model, controller 3221 determines the bypass flow rate of three-way valve 3224.

[0126] In some possible implementations, the circulation pump 3224 includes a primary circulation pump 3224A and a secondary circulation pump 3224B, and the three-way valve 3226 includes a first three-way valve 3226A and a second three-way valve 3226B. Accordingly, the controller 3221 determines the bypass flow rate of the second three-way valve 3224B based on the liquid supply temperature, the cooling temperature of the supplemental cooler 3228, the required temperature of the liquid cooling door 324, and the required heat dissipation flow rate. The controller 3221 can also determine the bypass flow rate of the first three-way valve 3224A in a similar manner.

[0127] S1006 , the controller 3221 determines the valve opening ratio of the three-way valve 3224 according to the bypass flow, and adjusts the state of the three-way valve 3224 to the three-way state according to the valve opening ratio.

[0128] The bypass flow of the three-way valve 3224 corresponds to the valve opening ratio of the three-way valve 3224. The controller 3221 can determine the valve opening ratio of the three-way valve 3224 based on the bypass flow. The controller 3221 can then send the valve opening ratio to the three-way valve 3224, thereby adjusting the state of the three-way valve 3224 to a three-way state according to the valve opening ratio.

[0129] When the three-way valve 3226 includes a first three-way valve 3226A and a second three-way valve 3226B, the controller 3221 can determine the valve opening ratio of the first three-way valve 3226A according to the bypass flow of the first three-way valve 3226A, and determine the valve opening ratio of the second three-way valve 3226B according to the bypass flow of the second three-way valve 3226B.

[0130] The controller 3221 can adjust the state of the first three-way valve 3226A to a three-way state according to the opening ratio of the first three-way valve 3226A, so that the coolant in the cooling tower 3222 is divided into two paths after passing through the primary circulation pump 3224A. One of the two coolant paths passes through the condenser of the supplementary cooling machine 3228 and the other coolant passes through the plate heat exchanger 3225 and then converges in front of the cooling tower 3222.

[0131] The controller 3221 can adjust the state of the second three-way valve 3226B to a three-way state according to the opening ratio of the second three-way valve 3226B, so that the coolant passing through the plate heat exchanger 3225 is divided into two paths after passing through the secondary circulation pump 3224B. One of the two coolant paths passes through the evaporator of the supplementary cooling machine 3228 and is mixed with the other coolant to obtain a mixed coolant.

[0132] It should be noted that the above S1004 and S1006 are a specific implementation method for the controller 3221 to control the state of the three-way valve 3224 to be a three-way state. In other possible implementation methods of the embodiment of the present application, the controller 3221 can also control the state of the three-way valve 3224 to be a three-way state according to a preset valve opening ratio (for example, a default valve opening ratio).

[0133] S1008, the controller 3221 turns on the supplementary cooling machine 3228 so that the coolant in the cooling tower 3222 is divided into two paths after passing through the circulation pump 3224, and the coolant in one path is mixed with the coolant in the other path after passing through the supplementary cooling machine 3228 to obtain a mixed supplementary cooling liquid.

[0134] Specifically, the controller 3221 may send a start instruction to the supplementary cooling chiller 3228 to start the supplementary cooling chiller 3228 .

[0135] It should be noted that the above S1004 and S1006 can be executed in parallel with S1008, or can be executed in sequence, which is not limited in this embodiment of the present application.

[0136] In some possible implementations, the controller 3221 may also perform global temperature control, or perform energy-saving control on the circulation pump 3224 .

[0137] During global temperature control, the controller 3221 can control the cooling tower's liquid supply temperature based on the wet-bulb temperature and the cooling tower's proximity, and then control the secondary-side temperature of the plate heat exchanger 3225 based on the liquid supply temperature and the plate heat exchanger's proximity, thereby achieving a linkage between the liquid supply temperature of the integrated cold source device 322 and the wet-bulb temperature. The controller 3221 can also control the secondary-side temperature of the plate heat exchanger 3225 based on the wet-bulb temperature and the proximity of the cooling tower 3222 and the plate heat exchanger 3225, thereby achieving a linkage between the liquid supply temperature of the integrated cold source device 322 and the wet-bulb temperature.

[0138] When performing energy-saving control on the circulation pump 3224, the controller 3221 can detect the temperature of the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger 3225 after the circulation pump (for example, the primary circulation pump 3224A). When the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger 3225 is lower than the set value, the circulation pump (for example, the primary circulation pump 3224A) is controlled to operate at a variable frequency, thereby saving the power consumption of the primary circulation pump 3224A. In some examples, the controller 3221 also supports energy-saving control of the primary circulation pump 3224A based on the proximity of the plate heat exchanger 3225. Specifically, when the controller 3221 detects that the temperature difference between the primary side liquid outlet and the secondary side liquid inlet of the plate heat exchanger 3225 is lower than the proximity of the plate heat exchanger 3225, the controller 3221 controls the primary circulation pump 3224A to operate at a variable frequency to reduce the power consumption of the primary circulation pump 3224A.

[0139] The controller 3221 can also detect the temperature of the liquid outlet of the liquid cooling plate heat dissipation control unit 326 (for example, an ECU) and the liquid inlet of the liquid cooling door 324. When the temperature difference between the liquid outlet of the liquid cooling plate heat dissipation control unit 326 and the liquid inlet of the liquid cooling door 324 is lower than the set value, the opening of the electric valve deployed at the liquid inlet of the liquid cooling door 324 is reduced, thereby reducing the power consumption of the secondary circulation pump 3224B.

[0140] Based on the aforementioned heat dissipation control method, the embodiment of the present application further provides a controller 3221. The controller 3221 may be a PLC control board, which is a digital electronic device with a microprocessor and a digital logic controller for automated control. The PLC control board can execute control instructions (computer-readable instructions) to implement the aforementioned heat dissipation control method.

[0141] Specifically, controller 3221 includes a processor and an input / output module. The processor can be a CPU or a microprocessor, and the input / output module can be a network card or a transceiver. The input / output module can communicate with the circulation pump 3224 and three-way valve 3226 in the cooling source integrated device 322. For example, the input / output module can receive (input) and send (output) various types of electrical or electronic signals and use them to control or monitor nearly any type of mechanical and electrical system. The processor can execute computer-readable instructions, thereby causing controller 3221 to perform the aforementioned heat dissipation control method.

[0142] Furthermore, the controller 3221 may further include a memory that can store computer-readable instructions. Accordingly, the processor is specifically configured to load the computer-readable instructions from the memory and execute the computer-readable instructions, thereby enabling the controller 3221 to perform the aforementioned heat dissipation control method.

[0143] It should be understood that in this application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0144] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the protection scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A cold source integrated device, characterized in that: The cold source integrated device is connected to the air-liquid heat exchange mode component through a liquid cooling pipeline, and is connected to the liquid-liquid heat exchange mode component through a liquid cooling pipeline, and the air-liquid heat exchange mode component and the liquid-liquid heat exchange mode component are connected through a liquid cooling pipeline; The cold source integrated device is used to provide cooling liquid through a liquid cooling pipeline, and the cooling liquid flows through the air-to-liquid heat exchange mode component for dissipating heat for the first device of the equipment and the liquid-to-liquid heat exchange mode component for dissipating heat for the second device of the equipment; The cold source integrated device is also used to receive the cooling liquid output after the second device dissipates heat.

2. The device according to claim 1, characterized in that The coolant flows sequentially through the air-to-liquid heat exchange mode component for dissipating heat from a first device of the equipment and the liquid-to-liquid heat exchange mode component for dissipating heat from a second device of the equipment.

3. The device according to claim 2, characterized in that The cold source integrated device is specifically used for: When the supplementary cooling condition is triggered, a mixed coolant is provided through the liquid cooling pipeline, and the temperature of the mixed coolant meets the temperature requirement of the air-liquid heat exchange mode component.

4. The device according to claim 3, characterized in that The cold source integrated device comprises a cooling tower, a circulating pump, a three-way valve and a supplementary cooling machine, wherein the cooling tower and the circulating pump are connected via a liquid cooling pipeline, the circulating pump and the supplementary cooling machine are connected via a liquid cooling pipeline, and the liquid cooling pipeline connecting the circulating pump and the supplementary cooling machine is provided with the three-way valve; The cold source integrated device is specifically used for: When the supplementary cooling condition is triggered, the state of the three-way valve is adjusted to a three-way state so that the coolant provided by the cooling tower is divided into two paths after passing through the circulation pump, and one of the two paths of coolant is mixed with the other path of coolant after passing through the supplementary cooling chiller to obtain a mixed coolant.

5. The device according to claim 4, characterized in that The circulation pump includes a primary circulation pump and a secondary circulation pump, and the three-way valve includes a first three-way valve and a second three-way valve; The cold source integrated device is specifically used for: When the supplementary cooling condition is triggered, the state of the first three-way valve is adjusted to a three-way state, so that the coolant in the cooling tower is divided into two paths after passing through the primary circulation pump, and one of the two coolant paths passes through the condenser of the supplementary cooling machine and merges with the other coolant path through the plate heat exchanger in front of the cooling tower, and the state of the second three-way valve is adjusted to a three-way state, so that the coolant passing through the plate heat exchanger is divided into two paths after passing through the secondary circulation pump, and one of the two coolant paths passes through the evaporator of the supplementary cooling machine and mixes with the other coolant path to obtain a mixed coolant.

6. The device according to claim 4 or 5, characterized in that The cooling supplement condition includes that the liquid supply temperature is greater than or equal to a preset threshold value, and the cold source integrated device also includes a controller, which is used to: When it is detected that the liquid supply temperature is greater than or equal to the preset threshold, the state of the three-way valve is controlled to be a three-way state, and the supplementary cooling machine is turned on.

7. The device according to claim 6, characterized in that The controller is specifically used for: Determining the bypass flow of the three-way valve according to the liquid supply temperature, the cooling temperature of the supplementary cooling machine, the required temperature of the air-liquid heat exchange mode component and the flow required for heat dissipation; The opening ratio of the three-way valve is determined according to the bypass flow, and the state of the three-way valve is adjusted to a three-way state according to the opening ratio.

8. The device according to claim 6, characterized in that The controller is also used for: The supply temperature of the cooling tower is controlled according to the wet bulb temperature and the degree of approach of the cooling tower, and then the secondary side temperature of the plate heat exchanger is controlled according to the supply temperature and the degree of approach of the plate heat exchanger.

9. The device according to claim 6, characterized in that The controller is also used for: The secondary side temperature of the plate heat exchanger is controlled according to the wet bulb temperature, the proximity of the cooling tower, and the proximity of the plate heat exchanger.

10. The device according to any one of claims 6 to 9, characterized in that The controller is also used for: When it is detected that the temperature difference between the liquid outlet of the liquid-liquid heat exchange mode component and the liquid inlet of the air-liquid heat exchange mode component is lower than a set value, the opening of the electric valve deployed at the liquid inlet of the air-liquid heat exchange mode component is reduced.

11. The device according to any one of claims 6 to 9, characterized in that The circulation pump comprises a primary circulation pump and a secondary circulation pump, a plate heat exchanger is arranged between the primary circulation pump and the secondary circulation pump, and the controller is further used for: It is detected that the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger is lower than the set value, and the primary circulation pump is controlled to operate with variable frequency; or, It is detected that the temperature difference between the primary side liquid outlet and the secondary side liquid inlet of the plate heat exchanger is lower than the approach degree of the plate heat exchanger, and the primary circulation pump is controlled to operate at a variable frequency.

12. A heat dissipation system, characterized in that: The heat dissipation system includes a cold source integrated device as described in any one of Figures 1 to 10, as well as an air-to-liquid heat exchange mode component and a liquid-to-liquid heat exchange mode component. The cold source integrated device is used to cooperate with the air-to-liquid heat exchange mode component and the liquid-to-liquid heat exchange mode component to dissipate heat for the equipment.

13. A heat dissipation control method, characterized in that: Applied to a cold source integrated device, the cold source integrated device includes a controller, a cooling tower, a circulating pump, a three-way valve and a supplementary cooling machine, the cooling tower and the circulating pump are connected through a liquid cooling pipeline, the circulating pump and the supplementary cooling machine are connected through a liquid cooling pipeline, the liquid cooling pipeline connecting the circulating pump and the supplementary cooling machine is deployed with the three-way valve, the method includes: The controller detects the temperature of the liquid supply; When the liquid supply temperature is greater than or equal to a preset threshold, the controller controls the state of the three-way valve to be a three-way state, and turns on the supplementary cooling machine so that the coolant in the cooling tower is divided into two paths after passing through the circulating pump, and one of the two paths of coolant is mixed with the other path of coolant after passing through the supplementary cooling machine to obtain a mixed coolant.

14. The method according to claim 13, characterized in that The controller controls the state of the three-way valve to be a three-way state, including: The controller determines the bypass flow of the three-way valve according to the liquid supply temperature, the cooling temperature of the supplementary cooling machine, the required temperature of the air-liquid heat exchange mode component and the flow required for heat dissipation; The controller determines the valve opening ratio of the three-way valve according to the bypass flow, and adjusts the state of the three-way valve to a three-way state according to the valve opening ratio.

15. The method according to claim 13, characterized in that The circulation pump comprises a primary circulation pump and a secondary circulation pump, a plate heat exchanger is arranged between the primary circulation pump and the secondary circulation pump, and the method further comprises: controlling the liquid supply temperature of the cooling tower according to the wet bulb temperature and the degree of approach of the cooling tower, and then controlling the secondary side temperature of the plate heat exchanger according to the liquid supply temperature and the degree of approach of the plate heat exchanger; or, The secondary side temperature of the plate heat exchanger is controlled according to the wet bulb temperature, the degree of approach of the cooling tower, and the degree of approach of the plate heat exchanger.

16. The method according to any one of claims 13 to 15, characterized in that The method further comprises: When it is detected that the temperature difference between the liquid outlet of the liquid-liquid heat exchange mode component and the liquid inlet of the air-liquid heat exchange mode component is lower than a set value, the opening of the electric valve deployed at the liquid inlet of the air-liquid heat exchange mode component is reduced.

17. The method according to any one of claims 13 to 16, characterized in that The circulation pump comprises a primary circulation pump and a secondary circulation pump, a plate heat exchanger is arranged between the primary circulation pump and the secondary circulation pump, and the method further comprises: It is detected that the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger is lower than the set value, and the primary circulation pump is controlled to operate with variable frequency; or, It is detected that the temperature difference between the primary side liquid outlet and the secondary side liquid inlet of the plate heat exchanger is lower than the approach degree of the plate heat exchanger, and the primary circulation pump is controlled to operate at a variable frequency.

18. A controller, characterized in that: The controller includes a processor and an input-output unit, the input-output unit is used to communicate with the three-way valve in the cold source integrated device, and the processor is used to execute computer-readable instructions, so that the controller executes the heat dissipation control method as described in any one of claims 13 to 16.

19. The controller according to claim 18, characterized in that The controller also includes a memory, and the processor is specifically used to: load the computer-readable instructions from the memory and execute the computer-readable instructions.

Images