Bridging resistor, light-emitting substrate, and light-emitting apparatus

Abstract

A bridging resistor, a light-emitting substrate, and a light-emitting apparatus. The bridging resistor comprises: a conductive body, which comprises a bridging portion and two connecting portions, wherein the bridging portion is connected between the two connecting portions, each connecting portion comprises a welding surface, the maximum distance between the surface of the side of the bridging portion that faces the welding surface and the welding surface is a first distance, and the first distance is greater than 0; and a first insulating layer, which wraps around the surface of the conductive body, wherein openings corresponding to the connecting portions are formed in the first insulating layer, at least part of the welding surface is exposed by means of the opening, and by means of the parts exposed from the openings, the welding surface forms a first pad that is electrically connected to a metal wire. After a bridging resistor is connected to a metal wire on a wiring substrate by means of welding, even if there is a conductive foreign matter on the wiring substrate, the conductive foreign matter does not cause a short circuit between the bridging resistor and other metal wires, thereby reducing the short-circuit risk of the bridging resistor and the metal wire.

Description

Jumper resistor, light-emitting substrate, and light-emitting device

[0001] This application claims priority to Chinese patent application No. 202310738504.2 filed on June 19, 2023, entitled “A jumper resistor, a light-emitting substrate and a light-emitting device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to a jumper resistor, a light-emitting substrate, and a light-emitting device. Background Art

[0003] Miniaturizing light-emitting diodes (LEDs) can produce sub-millimeter LEDs (Mini LEDs) or micro LEDs (Micro LEDs). These diodes are mounted on a wiring substrate, which controls their illumination. The wiring substrate is equipped with multiple metal traces, and two metal traces that are spaced apart but electrically connected can be connected using jumper resistors.

[0004] Summary of the Invention

[0005] Embodiments of the present disclosure provide a jumper resistor, a light-emitting substrate, and a light-emitting device.

[0006] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a jumper resistor, including:

[0007] The conductive body includes a bridge portion and two connecting portions, the bridge portion is connected between the two connecting portions, the connecting portion includes a welding surface, and a maximum distance between a surface of the bridge portion facing the welding surface and the welding surface is a first preset distance, and the first distance is greater than 0;

[0008] The first insulating layer is coated on the surface of the conductive body. The first insulating layer is provided with openings corresponding to each connecting portion. At least a portion of the welding surface is exposed through the openings. The portion of the welding surface exposed through the openings forms a first pad for electrical connection to the metal trace.

[0009] In some embodiments, the thickness of the first insulating layer is less than the first distance.

[0010] In some embodiments, the thickness of the first insulating layer is 0.05 mm to 0.15 mm; and / or the first distance is 0.15 mm to 0.25 mm.

[0011] In some embodiments, the surface of the first insulating layer is white.

[0012] In some embodiments, the maximum dimension of the jumper resistor in a direction perpendicular to the welding surface is 0.5 mm to 0.6 mm; and / or the dimension of the jumper resistor in an extending direction of the bridge portion is 9 mm to 10.5 mm.

[0013] In some embodiments, the conductive body includes a metal substrate and a metal layer located on a surface of the metal substrate. The material of the metal substrate includes copper, and the material of the metal layer includes nickel.

[0014] In some embodiments, the surface of the bridging portion facing the welding surface includes: a first surface parallel to the welding surface, and a second surface connected between the first surface and the welding surface; the distance between the first surface and the welding surface is the first distance, and the first insulating layer covers the second surface.

[0015] As a second aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a light-emitting substrate, including:

[0016] A wiring substrate comprises a base and a metal layer located on one side of the base, wherein the metal layer comprises two first metal traces separated from each other;

[0017] In any one of the embodiments of the present disclosure, the two first pads of the jumper resistor are respectively in contact with and connected to the two first metal traces.

[0018] In some embodiments, the metal layer further includes a second metal trace, where the second metal trace passes between the two first metal traces.

[0019] In some embodiments, a packaging layer is further included, which is arranged along the outer edge of the connecting portion of the jumper resistor, and the surface of the packaging layer away from the wiring substrate is close to the wiring substrate relative to the surface of the bridge portion of the jumper resistor away from the wiring substrate.

[0020] In some embodiments, the maximum dimension of the encapsulation layer in a direction perpendicular to the substrate is 0.45 mm to 0.55 mm.

[0021] In some embodiments, the encapsulation layer includes a first encapsulation portion arranged along the outer edge of the connecting portion, the size of the first encapsulation portion in the extension direction of the jumper resistor is 3.5mm~4mm, and the size of the first encapsulation portion in the extension direction perpendicular to the jumper resistor is 3mm~3.5mm.

[0022] In some embodiments, the wiring substrate further includes a second insulating layer having a white surface, the second insulating layer being located on a side of the metal layer facing away from the substrate, the second insulating layer being provided with a first window corresponding to the first metal trace, the first window at least partially overlapping with an orthographic projection of the corresponding first metal trace on the substrate, the first metal trace forming a second pad through a portion exposed by the first window, and the first pad of the jumper resistor being electrically connected to the second pad;

[0023] The light-emitting substrate further includes an encapsulation layer including a first encapsulation portion arranged along the outer edge of the connecting portion. In the area outside the jumper resistor, the orthographic projection of the first window on the substrate is located within the orthographic projection of the corresponding first encapsulation portion on the substrate.

[0024] In some embodiments, the light-emitting substrate includes several jumper resistors, the metal layer includes several first metal traces, different first metal traces are separated from each other, and the two first pads of each jumper resistor are respectively connected to two of the several first metal traces.

[0025] As a third aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a light-emitting device, including the jumper resistor or the light-emitting substrate in the embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0028] FIG1 is a schematic diagram of a partial structure of a light-emitting substrate in one embodiment of the present disclosure;

[0029] FIG2 is a schematic diagram of another partial structure of a light-emitting substrate in one embodiment of the present disclosure;

[0030] FIG3 is a schematic diagram of a top view of a jumper resistor in the related art;

[0031] FIG4 is a schematic diagram of the AA cross-sectional view of the jumper resistor shown in FIG3 ;

[0032] FIG5 is an enlarged schematic diagram of area C in FIG2;

[0033] FIG6 is a schematic diagram of the BB section in FIG5 ;

[0034] FIG7 is a schematic top view of another light-emitting substrate in one embodiment of the present disclosure;

[0035] FIG8 is a schematic diagram of the EE section in FIG7 ;

[0036] FIG9 is a schematic structural diagram of a jumper resistor in one embodiment of the present disclosure;

[0037] FIG10 is a schematic top view of a jumper resistor according to an embodiment of the present disclosure;

[0038] FIG11 is a schematic cross-sectional view taken along line AA of FIG10 in one embodiment;

[0039] FIG12 is a schematic diagram of the AA cross section of FIG10 in another embodiment;

[0040] FIG13 is an enlarged schematic diagram of area C in FIG2 according to an embodiment of the present disclosure;

[0041] FIG14 is a schematic diagram of the BB section in FIG13;

[0042] FIG15 is a schematic EE cross-sectional view of FIG7 in one embodiment of the present disclosure;

[0043] FIG16 is a schematic EE cross-sectional view of FIG7 in another embodiment of the present disclosure;

[0044] FIG17 is a schematic cross-sectional view taken along line DD of the light-emitting substrate shown in FIG7 .

[0045] Explanation of the accompanying drawings: 10. Base; 121. Light-emitting element; 122. Micro-driver chip; 140. First metal trace; 150. Partition opening; 160. Second metal trace; 20. Jumper resistor; 21. Conductive body; 211. Bridging portion; 212. Connecting portion; 213. Metal base; 214. Metal layer; 22. First insulating layer; 221. Opening; 215. Welding surface; 215a. First pad; 30. Second insulating layer; 31. First window; 40. Encapsulation layer; 41. First encapsulation portion; 42. Second encapsulation portion; 43. Third encapsulation portion; 50. Reflection layer / reflection sheet. DETAILED DESCRIPTION

[0046] In the following, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure, and different embodiments may be combined in any manner without conflict. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0047] Figure 1 is a schematic diagram of a partial structure of a light-emitting substrate according to an embodiment of the present disclosure. Figure 2 is a schematic diagram of another partial structure of a light-emitting substrate according to an embodiment of the present disclosure. Figure 3 is a schematic diagram of a top view of a jumper resistor in the related art. Figure 4 is a schematic diagram of a cross-sectional view taken along line AA of the jumper resistor shown in Figure 3. Figure 5 is an enlarged schematic diagram of area C in Figure 2. Figure 6 is a schematic diagram of a cross-sectional view taken along line BB in Figure 5. As shown in Figures 1-6, the light-emitting substrate includes a wiring substrate and electronic components disposed on the wiring substrate. The electronic components may include a light-emitting element 121, a jumper resistor 20, and a micro-driver chip. The light-emitting element 121 may be a light-emitting diode. The wiring substrate may include a base 10 and a metal layer disposed on one side of the base 10. The metal layer includes two first metal traces 140, separated by a partition 150 and insulated from each other. The metal layer also includes a second metal trace that passes between the two first metal traces 140. As shown in Figures 1 and 2, the two first metal traces 140 are electrically connected via the jumper resistor 20. The first metal trace 140 may include a first power line VLED or a second power line GND. The signal transmitted by the first metal trace 140 is not limited here, and the signal transmitted by the first metal trace 140 can be set according to actual needs.

[0048] As shown in Figures 3 and 4, as a comparative example in the related art, the jumper resistor 20 includes a conductive body 21, which includes a bridge portion 211 and two connecting portions 212. The bridge portion 211 is connected between the two connecting portions 212. The conductive body 21 includes a metal base 213 and an anti-oxidation layer 214 located on the surface of the metal base 213. The metal base 213 is made of copper, and the anti-oxidation layer 214 is made of nickel. For example, the length L1 of the jumper resistor 20 can be 9.6 mm and the height H1 can be 0.45 mm. The thickness of the anti-oxidation layer 214 can be 2 μm, the length L2 of the connecting portion 212 can be 1.5 mm, and the width w1 of the connecting portion 212 can be 1.0 mm. The bridge portion 211 is arched upward relative to the connecting portion 212, and the height H2 of the bridge portion 211 relative to the connecting portion 212 can be 0.2 mm.

[0049] The connecting portion 212 includes a welding surface 215, at least a portion of which forms a first solder pad 215a, and the first solder pad 215a is used to electrically connect to the metal trace. The bridging portion 211 protrudes upward relative to the connecting portion 212, so that when the first solder pad 215a is welded to the first metal trace 140 on the wiring substrate, a trace gap is formed between the bridging portion 211 and the partition opening 150. As shown in Figure 6, the second metal trace 160 passes through the partition opening 150 between the two first metal traces 140a and 140b. In the related art, the outer layer of the jumper resistor 20 is an anti-oxidation layer 214, and the anti-oxidation layer 214 is a conductive material. Although a second insulating layer 30 is provided above the metal layer in the wiring substrate, the first window 31 of the second insulating layer 30 exposes a portion of the second metal trace 160. When there is a conductive foreign object on the display substrate, it is easy to cause a short circuit between the jumper resistor 20 and the second metal trace 160, increasing the risk of short circuit between the jumper resistor 20 and the metal trace. The dotted circle in FIG6 shows the position where the short circuit is likely to occur.

[0050] FIG7 is a schematic diagram of a top view of another light-emitting substrate in an embodiment of the present disclosure; FIG8 is a schematic diagram of the EE cross-section in FIG7 . As a comparative example in the related art, the surface of the jumper resistor 20 is silver, which affects the optical effect. Therefore, a first packaging part 41 is provided above the jumper resistor 20. The first packaging part 41 encapsulates the jumper resistor 20 as a whole. The packaging effect is shown in FIG5 and FIG6 . The material of the first packaging part 41 is usually white silicone. In the related art, the packaging length L2 of the first packaging part 41 is 12.6 mm, the packaging width W2 is 3.6 mm, and the packaging height H0 is 1.0 mm.

[0051] As shown in Figures 7 and 8 , in a comparative example of the related art, the light-emitting substrate further includes a reflective layer 50 disposed above the first encapsulation portion 41. The reflective layer 50 is attached to the upper surface of the light-emitting substrate. Due to the large size of the first encapsulation portion 41, the reflective layer 50 forms a bulge at the location of the first encapsulation portion 41. This bulge affects the light efficiency of the surrounding LEDs and prevents the reflective layer 50 from properly bonding to the light-emitting substrate around the surrounding LEDs, thereby affecting the light extraction efficiency of the corresponding LEDs. The darker the area where the jumper resistors 20 are densely packed, the more severe the darkening problem.

[0052] It should be noted that in order to more clearly show the positional relationship among the reflective layer 50, the first packaging portion 41 and the jumper resistor 20 in the direction perpendicular to the wiring substrate, FIG8 adopts the EE section in FIG7, and FIG8 schematically illustrates the positional relationship among the jumper resistor 20, the first packaging portion 41 and the reflective layer 50 in the vertical direction.

[0053] In order to solve the problems in the related art, an embodiment of the present disclosure provides a jumper resistor 20 .

[0054] FIG9 is a schematic diagram of the structure of a jumper resistor in an embodiment of the present disclosure, FIG10 is a schematic diagram of the structure of a jumper resistor in an embodiment of the present disclosure from above, FIG11 is a schematic diagram of the AA cross-section of FIG10 in one embodiment, and FIG12 is a schematic diagram of the AA cross-section of FIG10 in another embodiment. As shown in FIG9-12, the jumper resistor 20 includes a conductive body 21 and a first insulating layer 22. The conductive body 21 includes a bridging portion 211 and two connecting portions 212, and the bridging portion 211 is connected between the two connecting portions 212. The connecting portion 212 includes a welding surface 215, and the maximum distance between the surface of the bridging portion 211 facing the welding surface 215 and the welding surface 215 is a first preset distance H2, and the first preset distance H2 is greater than 0. Therefore, the surface of the bridging portion 211 facing the welding surface 215 is arched upward relative to the welding surface 215, as shown in FIG11 and FIG12.

[0055] The first insulating layer 22 covers the surface of the conductive body 21. The first insulating layer 22 is provided with an opening 221 corresponding to the connecting portion 212. At least a portion of the welding surface 215 is exposed through the opening 221. The portion of the welding surface 215 exposed through the opening 221 forms a first pad 215a for electrically connecting to a metal trace. For example, a portion of the welding surface 215 can be exposed through the opening 221, or the entire welding surface 215 can be exposed through the opening 221.

[0056] In the jumper resistor 20 of the disclosed embodiment, the surface of the conductive body 21 is covered with a first insulating layer 22. The first insulating layer 22 is provided with openings 221 corresponding to the connecting portions 212. For example, there are two connecting portions 212, and the number of openings 221 is also two, and the two openings 221 correspond to the two connecting portions 212. The soldering surface 215 exposed by the opening 221 forms a first pad 215a, which is used to electrically connect to the metal trace. In such a jumper resistor 20, the area outside the first pad 215a of the jumper resistor 20 is covered by the first insulating layer 22. Therefore, when the first pad 215a of the jumper resistor 20 is welded to the metal trace on the wiring substrate, since the area outside the first pad 215a of the jumper resistor 20 is covered by the first insulating layer 22, even if there is conductive foreign matter on the wiring substrate, the conductive foreign matter will not cause the jumper resistor 20 to short-circuit with irrelevant metal traces, thereby reducing the risk of short circuit between the jumper resistor 20 and irrelevant metal traces and improving the performance of the light-emitting substrate.

[0057] In one embodiment, the surface color of the first insulating layer 22 is white. When the jumper resistor 20 is disposed on the light-emitting substrate, the white color can reflect light, thereby preventing the jumper resistor 20 from being dark and improving the light effect.

[0058] For example, the first insulating layer 22 may be made of a white insulating material such as white ink. Alternatively, the first insulating layer 22 may include an insulating material layer and a white film coated on the surface of the insulating material layer. The insulating material layer may include at least one of silicon oxide, silicon nitride, and silicon oxynitride, and the white film may be made of white ink.

[0059] In one embodiment, the thickness of the first insulating layer 22 is less than the first preset distance. It is understandable that the first preset distance H2 is greater than 0, so that the surface of the bridge portion 211 facing the welding surface 215 is arched upward relative to the welding surface 215. The thickness of the first insulating layer 22 is set to be less than the first preset distance. This ensures that after the first insulating layer 22 is formed on the surface of the conductive body 21, the surface of the bridge portion 211 facing the welding surface 215 is still arched upward relative to the welding surface 215, as shown in Figure 11. When the jumper resistor 20 is welded to the light-emitting substrate, a routing gap can be formed between the bridge portion 211 and the partition opening 150 of the light-emitting substrate. When the second metal trace passes through the routing gap, an insulating gap is retained between the first insulating layer 22 on the lower surface of the bridge portion 211 and the second metal trace.

[0060] As shown in FIG11 , the thickness w1 of the first insulating layer 22 may be 0.05 mm to 0.15 mm. For example, the thickness of the first insulating layer 22 may be one of 0.05 mm, 0.08 mm, 0.10 mm, 0.12 mm, and 0.15 mm. The first preset distance H2 may be 0.15 mm to 0.25 mm. For example, the first preset distance H2 may be one of 0.15 mm, 0.18 mm, 0.20 mm, 0.22 mm, and 0.25 mm.

[0061] For example, a sputtering or printing method can be used to form the first insulating layer 22 on the surface of the conductive body 21. After the first insulating layer 22 is formed, the first insulating layer 22 can be patterned to form an opening 221, where the opening 221 exposes at least a portion of the welding surface 215. For example, before forming the first insulating layer 22, the location of the opening 221 can be protected. Therefore, when the first insulating layer 22 is formed, the first insulating layer 22 material will not form the first insulating layer 22 at the location of the opening 221. The formed first insulating layer 22 is located on the surface outside the opening 221.

[0062] As shown in FIG11 , the maximum dimension H3 of the jumper resistor 20 in a direction perpendicular to the welding surface 215 is 0.5 mm to 0.6 mm. For example, the maximum dimension H3 of the jumper resistor 20 in a direction perpendicular to the welding surface 215 can be 0.5 mm, 0.55 mm, or 0.6 mm. The dimension L3 of the jumper resistor 20 in the direction in which the bridge portion 211 extends can be 9 mm to 10.5 mm. For example, L3 can be 9 mm, 9.5 mm, 9.8 mm, 10 mm, or 10.5 mm.

[0063] As shown in FIG. 10 , the width W3 of the jumper resistor 20 may be 1.0 mm to 1.5 mm. For example, the width W3 of the jumper resistor 20 may be 1.0 mm, 1.2 mm, or 1.5 mm.

[0064] In one embodiment, as shown in FIG11 , the bridging portion 211 protrudes relative to the connecting portion 212 in a direction away from the welding surface 215. The bridging portion 211 may include a first sub-bridging portion 2111 and a second sub-bridging portion 2112. The number of the second sub-bridging portions 2112 is two, and the two second sub-bridging portions 2112 are respectively connected to the two ends of the first sub-bridging portion 2111. The second sub-bridging portion 2112 connects the first sub-bridging portion 2111 to the connecting portion 212.

[0065] In one embodiment, as shown in FIG12 , the surface of the bridge portion 211 on the side away from the welding surface 215 and the surface of the connecting portion 212 on the side away from the welding surface 215 can be located on the same plane. The surface of the bridge portion 211 on the side close to the welding surface 215 is recessed toward the side away from the welding surface 215, that is, the lower surface of the bridge portion 211 is recessed toward the upper side, thereby forming the bridge portion 211. In one example, referring to FIG12 , the surface of the bridge portion 211 facing the welding surface includes: a first surface S1 parallel to the welding surface 215, and a second surface S2 connected between the first surface S1 and the welding surface 215; the distance between the first surface S1 and the welding surface 215 is the above-mentioned first distance H2, and the first insulating layer 22 covers the second surface S2.

[0066] As shown in FIG11 , the conductive body 21 includes a metal base 213 and an anti-oxidation layer 214 located on the surface of the metal base 213. The metal base 213 may be made of copper, and the anti-oxidation layer 214 may be made of nickel.

[0067] Figure 13 is an enlarged schematic diagram of area C in Figure 2 according to an embodiment of the present disclosure, and Figure 14 is a schematic diagram of the cross-section BB in Figure 13 . The present disclosure also provides a light-emitting substrate, comprising a wiring substrate and a jumper resistor 20 according to any embodiment of the present disclosure. As shown in Figures 2, 13, and 14, the wiring substrate comprises a base 10 and a metal layer located on one side of the base 10. The metal layer comprises two mutually insulated first metal traces 140. The two first pads 215a of the jumper resistor 20 are respectively electrically connected to the two first metal traces 140, thereby achieving electrical connection between the two first metal traces 140.

[0068] In the light-emitting substrate of the embodiment of the present disclosure, when there is a conductive foreign object on the light-emitting substrate, since the outer surface of the jumper resistor 20 is provided with a first insulating layer 22, a short circuit between the jumper resistor 20 and metal traces other than the first metal trace 140 is avoided, thereby reducing the risk of short circuit between the jumper resistor 20 and other metal traces and improving the performance of the light-emitting substrate.

[0069] As shown in Figures 2, 13 and 14, the metal layer may further include a second metal trace, which passes through the partition 150 between the two first metal traces 140. In the related art shown in Figure 6, the jumper resistor 20 is easily short-circuited with the second metal trace, causing a short-circuit risk. In the embodiment of the present disclosure, since the outer surface of the jumper resistor 20 is provided with a first insulating layer 22, the short-circuit between the jumper resistor 20 and the second metal trace is avoided, thereby reducing the short-circuit risk between the jumper resistor 20 and other metal traces. As shown in Figure 14, after the first insulating layer 22 is provided on the surface of the jumper resistor 20, under the protection of the first insulating layer 22, the risk of short-circuiting at the position indicated by the dotted circle is greatly reduced.

[0070] As shown in Figures 13 and 14 , the light-emitting substrate may further include an encapsulation layer 40, which is disposed along the outer edge of the connection portion 212 of the jumper resistor 20. The surface of the encapsulation layer 40, which is located away from the wiring substrate, is closer to the wiring substrate than the surface of the first insulating layer 22, which is located away from the wiring substrate, of the bridge portion 211. As shown in Figure 14 , the surface of the encapsulation layer 40, which is located away from the wiring substrate, is surface E1, and the surface of the first insulating layer 22, which is located away from the wiring substrate, of the bridge portion 211 is surface E2. Surface E1 is closer to the wiring substrate than surface E2, that is, surface E1 is lower than surface E2.

[0071] In the related art, as shown in Figures 6 and 8, the first packaging part 41 (also called the packaging layer 40) needs to encapsulate the jumper resistor 20 as a whole. Therefore, the upper surface of the first packaging part 41 is higher than the upper surface of the bridge part 211 of the jumper resistor 20.

[0072] In the embodiment of the present disclosure, as shown in FIG14 , due to the use of the jumper resistor 20 of the present disclosure, the outer surface of the jumper resistor 20 is provided with a first insulating layer 22. Therefore, the encapsulation layer 40 only needs to be provided along the outer edge of the connection portion 212 to encapsulate the first pad 215a. The encapsulation layer 40 no longer needs to encapsulate the entire jumper resistor 20. Therefore, the surface of the encapsulation layer 40 away from the wiring substrate can be closer to the wiring substrate than the surface of the bridge portion 211 of the jumper resistor 20 away from the wiring substrate. This means that the provision of the first encapsulation portion 41 does not increase the height of the jumper resistor 20. The height of the jumper resistor 20 in the light-emitting substrate of the present disclosure is the height of the upper surface of the bridge portion 211 of the jumper resistor 20. The height of the jumper resistor 20 is greatly reduced compared to the related art shown in FIG6 .

[0073] For example, the material of the first packaging portion 41 may include white silica gel, so that the first packaging portion 41 can reflect light and improve the light efficiency of the light-emitting substrate.

[0074] As shown in Figure 13, the first encapsulation portion 41 is disposed along the outer edge of the corresponding connection portion 212. In another embodiment, the first encapsulation portion 41 is disposed along the outer edge of the corresponding connection portion 212, and the first encapsulation portion 41 may cover the corresponding connection portion 212, that is, the orthographic projection of the connection portion 212 on the light-emitting substrate is located within the orthographic projection of the corresponding first encapsulation portion 41 on the light-emitting substrate.

[0075] FIG15 is a schematic diagram of the BB cross-section of FIG7 in one embodiment of the present disclosure, and FIG16 is a schematic diagram of the BB cross-section of FIG7 in another embodiment of the present disclosure. It should be noted that in order to more clearly show the positional relationship between the reflective layer 50, the first packaging parts 41a and 41b, and the jumper resistor 20 in the direction perpendicular to the wiring substrate, FIG15 and FIG16 use the EE cross-section in FIG7. FIG15 and FIG16 schematically illustrate the positional relationship between the jumper resistor 20, the first packaging parts 41a and 41b, and the reflective layer 50 in the vertical direction. It should be noted that one jumper resistor 20 corresponds to two first packaging parts 41. In order to distinguish the two first packaging parts, in the drawings of the specification, the first packaging part located on the left side of the jumper resistor 20 is marked as 41a, and the first packaging part located on the right side of the jumper resistor 20 is marked as 41b.

[0076] As shown in Figures 15 and 16 , the light-emitting substrate further includes a reflective layer 50. Exemplarily, the reflective layer 50 may be a reflective sheet 50. As shown in Figure 7 , the reflective layer 50 has a plurality of first functional regions Q1, and at least a portion of the orthographic projection of the jumper resistor 20 and the corresponding first encapsulation portion 41 on the substrate 10 is located in the first functional region Q1.

[0077] To improve reflectivity, as shown in FIG7 , the reflective sheet 50 adopts a straight-line slit design in the first functional area Q1. The reflective sheet 50 adopts an opening design at the location of the light-emitting element 121. As shown in FIG7 , the reflective sheet 50 is provided with a first through hole M1. The orthographic projection of the light-emitting element 120 on the substrate 10 is located within the orthographic projection of the first through hole M1 on the substrate 10. Thus, the light-emitting element 121 can be exposed through the first through hole M1.

[0078] The reflective sheet 50 is attached to the surface of the light-emitting substrate facing the encapsulation layer 40. Compared to the related art shown in Figures 6 and 8, the height of the position of the jumper resistor 20 in the light-emitting substrate of the present embodiment is greatly reduced. Therefore, after the reflective sheet 50 is attached, since the surface E1 is lower than the surface E2, the reflective sheet 50 can be attached to the surface of the first insulating layer 22 on the side away from the wiring substrate of the bridge portion 211 of the jumper resistor 20. As shown in Figures 15 and 16, the bulging height of the reflective sheet 50 at the position of the jumper resistor 20 can be greatly reduced, reducing the impact of the bulging of the reflective sheet 50 on the light efficiency of the surrounding LEDs, improving the adhesion of the reflective sheet 50 around the surrounding LEDs, improving the dim light at the position of the LEDs, and improving the performance of the light-emitting substrate.

[0079] For example, as shown in FIG. 14 , a maximum dimension H4 of the encapsulation layer 40 in a direction perpendicular to the substrate 10 may be 0.45 mm to 0.55 mm. For example, H4 may be 0.45 mm, 0.5 mm, or 0.55 mm.

[0080] As shown in Figures 13 and 14 , the encapsulation layer 40 may include a first encapsulation portion 41 disposed along the outer edge of the connecting portion 212. Since the first encapsulation portion 41 is disposed along the outer edge of the connecting portion 212, the first encapsulation portion 41 may have a "U"-shaped structure. The shape of the first encapsulation portion is schematically illustrated in Figure 13 using thicker lines.

[0081] For example, the dimension L5 of the first packaging portion 41 in the direction extending the jumper resistor 20, i.e., the X direction in FIG. 13 , can be 3.5 mm to 4 mm. For example, L5 can be 3.5 mm, 3.8 mm, or 4 mm. The dimension W4 of the first packaging portion 41 in the direction perpendicular to the extending direction of the jumper resistor 20, i.e., the Y direction in FIG. 13 , can be 3 mm to 3.5 mm. For example, W4 can be 3 mm, 3.3 mm, or 3.5 mm.

[0082] In one embodiment, as shown in FIG14 , the wiring substrate may further include a second insulating layer 30, the surface of which may be white. The second insulating layer 30 is located on the side of the metal layer facing away from the substrate 10. A reflective sheet 50 may be attached to the surface of the second insulating layer 30. The second insulating layer 30 is provided with a first window 31 corresponding to the first metal trace 140. The first window 31 at least partially overlaps with the orthographic projection of the corresponding first metal trace 140 on the substrate 10. The portion of the first metal trace 140 exposed through the first window 31 may form a second pad, and the first pad 215a of the jumper resistor 20 is electrically connected to the second pad. As shown in FIG13 , to ensure that the encapsulation layer 40 covers the metal exposed through the first window 31, the orthographic projection of the first window 31 on the substrate 10 in the area outside the jumper resistor 20 is located within the orthographic projection of the corresponding first encapsulation portion 41 on the substrate 10. This allows the first encapsulation portion 41 to completely cover the metal exposed through the first window 31, thereby preventing the risk of short circuits.

[0083] Exemplarily, the material of the second insulating layer 30 may be white ink.

[0084] FIG17 is a schematic cross-sectional view taken along line DD of the light-emitting substrate shown in FIG7 .

[0085] In one embodiment, as shown in Figures 7 and 17, the electronic component may include a light-emitting element 121, such as a light-emitting diode. The light-emitting substrate may further include a second encapsulation portion 42, wherein the orthographic projection of the light-emitting element 121 on the substrate 10 is located within the orthographic projection of the second encapsulation portion 42 on the substrate 10. The reflective layer 50 is provided with a first through hole M1, and the orthographic projection of the second encapsulation portion 42 on the substrate 10 is located within the orthographic projection of the first through hole M1 on the substrate 10, thereby exposing the second encapsulation portion 42 through the first through hole M1.

[0086] For example, as shown in FIG17 , the second packaging portion 42 covers the light-emitting element 121, thereby protecting the light-emitting element 121 and extending the service life of the light-emitting element 121. The second packaging portion 42 is made of a light-transmitting material, which reduces the light blocking effect of the second packaging portion 42 and increases the intensity of light that can pass through the second packaging portion 42.

[0087] In some examples, the material of the second encapsulation portion 42 includes transparent adhesive. In some embodiments, the second encapsulation portion 42 may be mushroom-shaped or approximately mushroom-shaped.

[0088] It should be noted that the number of cross-line resistors in the light-emitting substrate of the present disclosure is not limited to one, and can be, for example, 20 to 800 (or 300 to 400), and each cross-line resistor is connected to two of the plurality of first metal traces. In one example, the metal layer includes a plurality of the aforementioned first metal traces, with different first metal traces separated from each other, and the two first pads of each cross-line resistor are respectively connected to two of the plurality of first metal traces.

[0089] Based on the inventive concepts of the aforementioned embodiments, the present disclosure further provides a light-emitting device, which includes the jumper resistor 20 of the present disclosure, or includes the light-emitting substrate of the present disclosure. The light-emitting device can be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system.

[0090] The light-emitting substrate in the embodiment of the present disclosure can be assembled in a light-emitting device as a display panel, or as a light source. The light-emitting device can be: electronic paper, mobile phones, tablet computers, televisions, monitors, laptops, digital photo frames, navigators, wearable display devices, and any other products or components with display functions.

[0091] The light-emitting substrate in the embodiment of the present disclosure can also be used as a light source in lighting products.

[0092] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present disclosure.

[0093] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0094] In this disclosure, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections, or communication; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on specific circumstances.

[0095] In the present disclosure, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0096] The disclosure above provides many different embodiments or examples for implementing different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, these are merely examples and are not intended to limit the present disclosure. In addition, the present disclosure may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0097] The above are only specific embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in this disclosure, and such modifications or substitutions should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A jumper resistor, characterized in that: include: A conductive body, comprising a bridge portion and two connecting portions, wherein the bridge portion is connected between the two connecting portions, the connecting portion comprises a welding surface, and a maximum distance between a surface of the bridge portion facing the welding surface and the welding surface is a first distance, and the first distance is greater than 0; A first insulating layer is coated on the surface of the conductive body, and the first insulating layer is provided with openings corresponding to each of the connecting parts respectively, at least a portion of the welding surface is exposed through the openings, and the portion of the welding surface exposed through the openings forms a first pad for electrical connection with the metal trace.

2. The jumper resistor according to claim 1, characterized in that: The thickness of the first insulating layer is smaller than the first distance.

3. The jumper resistor according to claim 1, characterized in that: The thickness of the first insulating layer is 0.05 mm to 0.15 mm; and / or, The first distance is 0.15 mm to 0.25 mm.

4. The jumper resistor according to claim 1, characterized in that: The surface color of the first insulating layer is white.

5. The jumper resistor according to claim 1, characterized in that: The maximum dimension of the jumper resistor in a direction perpendicular to the welding surface is 0.5 mm to 0.6 mm; and / or, The dimension of the jumper resistor in the extending direction of the bridge portion is 9 mm to 10.5 mm.

6. The jumper resistor according to claim 1, characterized in that: The conductive body includes a metal substrate and a metal layer located on the surface of the metal substrate. The material of the metal substrate includes copper, and the material of the metal layer includes nickel.

7. The jumper resistor according to any one of claims 1 to 6, characterized in that: The surface of the bridge portion facing the welding surface includes: a first surface parallel to the welding surface, and a second surface connected between the first surface and the welding surface; the distance between the first surface and the welding surface is the first distance, and the first insulating layer covers the second surface.

8. A light-emitting substrate, characterized in that: include: A wiring substrate, comprising a base and a metal layer located on one side of the base, wherein the metal layer comprises two first metal traces separated from each other; The jumper resistor according to any one of claims 1 to 7, wherein the two first pads of the jumper resistor are respectively in contact with and connected to the two first metal traces.

9. The light-emitting substrate according to claim 8, characterized in that: The metal layer further includes a second metal trace, and the second metal trace passes between two of the first metal traces.

10. The light emitting substrate according to claim 8, characterized in that: It also includes a packaging layer, which is arranged along the outer edge of the connecting part of the jumper resistor, and the surface of the packaging layer away from the wiring substrate is closer to the wiring substrate than the surface of the bridge part of the jumper resistor away from the wiring substrate.

11. The light emitting substrate according to claim 10, characterized in that: The maximum dimension of the encapsulation layer in a direction perpendicular to the substrate is 0.45 mm to 0.55 mm.

12. The light emitting substrate according to claim 10, characterized in that: The packaging layer includes a first packaging portion arranged along the outer edge of the connecting portion, the size of the first packaging portion in the extension direction of the jumper resistor is 3.5mm-4mm, and the size of the first packaging portion in the extension direction perpendicular to the jumper resistor is 3mm-3.5mm.

13. The light emitting substrate according to claim 8, characterized in that: The wiring substrate further comprises a second insulating layer with a white surface, the second insulating layer is located on a side of the metal layer away from the substrate, the second insulating layer is provided with a first window corresponding to the first metal trace, the first window at least partially overlaps with the corresponding orthographic projection of the first metal trace on the substrate, the first metal trace forms a second pad through a portion exposed by the first window, and the first pad of the jumper resistor is electrically connected to the second pad; The light-emitting substrate also includes a packaging layer, which includes a first packaging portion arranged along the outer edge of the connecting portion. In the area outside the jumper resistor, the orthographic projection of the first window on the substrate is located within the orthographic projection of the corresponding first packaging portion on the substrate.

14. The light-emitting substrate according to any one of claims 8 to 13, characterized in that: The light-emitting substrate includes a plurality of jumper resistors, the metal layer includes a plurality of first metal traces, different first metal traces are separated from each other, and the two first pads of each jumper resistor are respectively connected to two of the plurality of first metal traces.

15. A light emitting device, characterized in that: The invention comprises the jumper resistor according to any one of claims 1 to 7, or comprises the light-emitting substrate according to any one of claims 8 to 14.

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