Laser processing apparatus and laser processing device

Abstract

Provided in the present application are a laser processing apparatus and a laser processing device. The laser processing apparatus comprises a supporting frame, a first power supply, a laser and a main control circuit board; the supporting frame comprises a high-voltage area and a low-voltage area, the high-voltage area and the low-voltage area being spaced apart; the first power supply is arranged on the supporting frame and located in the high-voltage area; the laser is arranged on the supporting frame, the laser being electrically connected to the first power supply; the main control circuit board is arranged on the supporting frame and located in the low-voltage area, and the main control circuit board is electrically connected to the laser. The laser processing apparatus and the laser processing device provided by the present application can reduce interference of the first power supply with respect to the main control circuit board, thus reducing the probability of a system crash or halt caused when a chip in the main control circuit board malfunctions, thereby helping to improve the overall device performance.

Description

Laser processing device and laser processing equipment

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on June 29, 2023, with application number 2023216849499 and application name “Laser processing device and laser processing equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application belongs to the field of laser processing technology, and in particular relates to a laser processing device and laser processing equipment. Background Art

[0003] Laser processing equipment uses lasers as a processing medium to achieve its processing objectives. Because laser processing equipment does not directly contact the workpiece, it is unaffected by mechanical motion and the workpiece surface is less susceptible to deformation. Consequently, laser processing equipment is increasingly being used.

[0004] Currently, the laser processing equipment on the market lacks a separate layout for high and low voltage. This is primarily due to the main control PCB not being remotely separated from the laser's high-voltage power supply. This high-voltage power supply can interfere with the main control PCB, potentially causing the CPU control chip to lose control, leading to system freezes, glitches, and performance degradation.

[0005] Summary of the Invention

[0006] In response to the shortcomings of the existing technology, the present application provides a laser processing device and laser processing equipment that can reduce the interference of the first power supply on the main control circuit board, reduce the probability of the chip in the main control circuit board losing control and causing crashes and jams, and thereby improve the overall performance.

[0007] In one aspect, the present application provides a laser processing device, comprising:

[0008] The support frame includes a high-pressure area and a low-pressure area, wherein the high-pressure area and the low-pressure area are spaced apart from each other;

[0009] A first power supply is provided on the support frame and is located in the high voltage area;

[0010] a laser, disposed on the support frame, the laser being electrically connected to the first power supply; and

[0011] A main control circuit board is arranged on the support frame and located in the low-voltage area. The main control circuit board is electrically connected to the laser.

[0012] In a possible implementation, the laser processing device further includes a second power supply, which is disposed on the support frame; and the second power supply is electrically connected to the main control circuit board.

[0013] In a possible embodiment, the laser processing device includes a power interface, which is arranged on the support frame; one end of the power interface is used to be electrically connected to an external power supply, and the other end of the power interface is electrically connected to the first power supply and the second power supply.

[0014] In a possible implementation, the laser processing device further includes a filter, one end of the filter is electrically connected to the power interface, and the other end of the filter is electrically connected to the first power supply and the second power supply.

[0015] In a possible implementation, the laser processing device further includes a switch, which is disposed between the filter and the power interface, and is used to control power on and off of the laser processing device.

[0016] In a possible embodiment, the support frame includes a first support member, a second support member, a third support member and a fourth support member connected end to end in sequence, the first support member and the third support member are arranged opposite to each other, and the second support member and the fourth support member are arranged opposite to each other; the first power supply is arranged on the fourth support member, and the first power supply is located at an end of the fourth support member close to the third support member; the laser is arranged on the third support member; the main control circuit board is arranged on the second support member, and the main control circuit board is located at an end of the second support member close to the first support member; the second power supply is arranged on a side of the fourth support member away from the second support member, and the second power supply is located at an end of the fourth support member close to the first support member.

[0017] In a possible embodiment, the laser processing device also includes a first connecting line and a second connecting line, the first connecting line is arranged at the connection between the third support member and the fourth support member, and the first connecting line is electrically connected between the first power supply and the laser; the second connecting line is arranged on the first support member, and the second connecting line is electrically connected between the second power supply and the main control circuit board.

[0018] In a possible implementation, a wire groove is provided on the first support member, and the second connecting wire is received in the wire groove.

[0019] In a possible embodiment, the laser processing device also includes a cooling box and a cooling control board, wherein the cooling control board is used to control the cooling box to cool the laser; the cooling box is arranged on the support frame, and the cooling control board is arranged on the support frame and close to the main control circuit board, and the cooling control board is connected between the cooling box and the main control circuit board.

[0020] In one possible embodiment, the laser includes a positive terminal and a negative terminal, and the laser of the laser is emitted from the negative terminal; the positive terminal is arranged on the side of the laser close to the first power supply, and the positive terminal is electrically connected to the first power supply; the negative terminal is arranged on the side of the laser away from the first power supply, and the negative terminal is electrically connected to the main control circuit board.

[0021] In a possible implementation, the laser processing device further includes a shielding cover, which is disposed on the support frame, and the first power supply and the positive terminal of the laser are accommodated in the shielding cover.

[0022] On the other hand, the present application also provides a laser processing device, comprising

[0023] The laser processing device mentioned above;

[0024] a base, on which the laser processing device is disposed; and

[0025] The shell is covered on the base, and the laser processing device is accommodated in the shell.

[0026] The laser processing device and laser processing equipment provided herein feature a support frame comprising a high-voltage zone and a low-voltage zone, with the high-voltage zone and the low-voltage zone spaced apart. A first power supply is located in the high-voltage zone, while a main control circuit board is located in the low-voltage zone. This partitioned and spaced layout of the first power supply and the main control circuit board reduces interference from the first power supply on the main control circuit board, thereby reducing the probability of chips in the main circuit board losing control and causing system freezes and jams, thereby improving the overall performance of the laser processing device and laser processing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] To more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some implementation methods provided by the embodiments of the present application. For those skilled in the art, other drawings can be derived from these drawings without inventive effort.

[0028] FIG1 is a schematic diagram of an assembly of a laser processing device provided in one embodiment of the present application;

[0029] FIG2 is a structural schematic diagram 1 of a laser processing device provided in one embodiment of the present application;

[0030] FIG3 is a second structural diagram of a laser processing device provided in one embodiment of the present application;

[0031] FIG4 is a third structural diagram of a laser processing device provided in one embodiment of the present application;

[0032] FIG5 is a fourth structural diagram of a laser processing device provided in an embodiment of the present application.

[0033] The following are the descriptions of the accompanying figures:

[0034] Laser processing equipment 100, laser processing device 10, base 30, housing 50, support frame 11, first power supply 12, laser 13, main control circuit board 14, second power supply 15, filter 16, power interface 17, switch 18, high-voltage area 101, low-voltage area 102, cooling box 191, cooling control board 192, first connecting line 193, second connecting line 194, shielding cover 195, first support member 111, second support member 112, third support member 113, fourth support member 114, positive terminal 131, negative terminal 132, cover 51, wire trough 1110. DETAILED DESCRIPTION

[0035] The technical solution of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0036] Please refer to Figures 1 and 2. Figure 1 is an assembly diagram of a laser processing equipment provided in one embodiment of the present application, and Figure 2 is a structural diagram of a laser processing device provided in one embodiment of the present application.

[0037] The laser processing equipment 100 provided in one embodiment of the present application performs laser processing on a workpiece (not shown) by using laser as a processing medium. The laser processing processes include but are not limited to cutting, engraving and other processes.

[0038] In this embodiment, the laser processing device 100 is a desktop laser engraving and cutting machine. It is understood that in other embodiments, the laser processing device 100 includes but is not limited to other laser processing devices, and this application does not limit this.

[0039] Laser processing equipment 100 includes a laser processing device 10, a base 30, and a housing 50. The laser processing device 10 is used to emit laser light for laser processing of a workpiece. The laser processing device 10 is mounted on the base 30, which also supports the workpiece. The laser light emitted by the laser processing device 10 can move relative to the base 30 to laser process the workpiece on the base 30. The housing 50 is mounted on the base 30, and the housing 50 and the base 30 enclose a processing space within which the laser processing device 10 is located.

[0040] The housing 50 is provided with a cover plate 51, which is rotatably mounted thereon and can open or close the processing space within the housing 50 to facilitate the operator's insertion and removal of workpieces. The base 30 and the housing 50 can be fixedly connected. The blocking and / or filtering effects of the base 30 and the housing 50 prevent the laser generated by the laser processing device 10 from spilling out during operation and potentially injuring the operator.

[0041] Please refer to FIG. 2 and FIG. 3 . FIG. 3 is a second structural diagram of a laser processing device provided in one embodiment of the present application.

[0042] The laser processing device 10 includes a support frame 11, a first power supply 12, a laser 13, and a main control circuit board 14. The support frame 11 is fixed to the base 30, and the first power supply 12, laser 13, and main control circuit board 14 are all mounted on the support frame 11. The first power supply 12 is electrically connected to the laser 13 and is a high-voltage power supply. The voltage generated by the first power supply 12 is greater than or equal to 110 volts. When the voltage generated by the first power supply 12 reaches 30,000 volts, the laser 13 can emit laser light.

[0043] Specifically, the support frame 11 includes a low-voltage zone 102 and a high-voltage zone 101, and the low-voltage zone 102 and the high-voltage zone 101 are spaced apart. The first power supply 12 is arranged at the position of the high-voltage zone 101 of the support frame 11, and the main control circuit board 14 is arranged at the position of the low-voltage zone 102 of the support frame 11. In other words, the area where the first power supply 12 is located in the support frame 11 is the high-voltage zone 101. The area where the main control circuit board 14 is located in the support frame 11 is the low-voltage zone 102. In the laser processing device 10 provided in the present application, the layout is divided into the high-voltage zone 101 and the low-voltage zone 102 by the support frame 11, and the high-voltage zone 101 and the low-voltage zone 102 are spaced apart. The first power supply 12 is arranged in the high-voltage zone 101. The main control circuit board 14 is arranged in the low-voltage area 102, so that the first power supply 12 and the main control circuit board 14 are arranged in partitions and intervals, which can reduce the interference of the first power supply 12 on the main control circuit board 14, and thereby reduce the probability of the chip in the main circuit board 14 losing control and crashing or getting stuck, which is beneficial to improving the overall performance of the laser processing device 10.

[0044] Referring to Figures 2 and 3, in this embodiment, the support frame 11 includes a first support member 111, a second support member 112, a third support member 113 and a fourth support member 114. The first support member 111, the second support member 112, the third support member 113 and the fourth support member 114 are connected end to end in sequence, and the first support member 111 and the third support member 113 are arranged opposite to each other, and the second support member 112 and the fourth support member 114 are arranged opposite to each other.

[0045] The first support member 111 is arranged substantially parallel to the third support member 113, and the second support member 112 is arranged substantially parallel to the fourth support member 114. The first support member 111 is perpendicular to the second support member 112, and the third support member 113 is perpendicular to the fourth support member 114. It is understood that in other embodiments, the first support member 111 and the third support member 113 may not be parallel, the second support member 112 and the fourth support member 114 may not be parallel, the first support member 111 and the second support member 112 may not be perpendicular, and the third support member 113 and the fourth support member 114 may not be perpendicular, and this application does not impose any limitation on this.

[0046] The first power supply 12 is disposed on a side of the fourth support member 114 facing away from the second support member 112, and is located at an end of the fourth support member 114 that is proximal to the third support member 113. In other words, the first power supply 12 is disposed outside the fourth support member 114 and proximal to the third support member 113. The first power supply 12 is used to provide a high operating voltage to the laser 13, enabling the laser processing apparatus 10 to emit laser light and thereby process a workpiece.

[0047] The laser 13 is disposed on the third support member 113 and fixed to the side of the third support member 113 facing away from the base 30. The laser 13 is electrically connected to the first power supply 12, and the first power supply 12 enables the laser 13 to emit laser light, thereby processing the workpiece.

[0048] Specifically, the main control circuit board 14 is disposed on a side of the second support member 112 facing away from the fourth support member 114, and is located at the end of the second support member 112 that is closest to the first support member 111. In other words, the main control circuit board 14 is disposed outside the second support member 112 and adjacent to the first support member 111. The main control circuit board 14 is electrically connected to the laser 13 and can control the laser 13 to emit laser light, thereby controlling the laser processing apparatus 10's processing of the workpiece.

[0049] In the embodiment of the present application, the first support member 111, the second support member 112, the third support member 113 and the fourth support member 114 are connected end to end in sequence to form a rectangular frame, and the first power supply 12 and the main control circuit board 14 are located at the two end points of a diagonal line of the rectangular frame, so that the distance between the first power supply 12 and the main control circuit board 14 is larger, which can reduce the interference of the first power supply 12 on the main circuit board 14, thereby reducing the probability of the chip in the main circuit board 14 losing control and freezing or jamming, which is beneficial to improving the overall performance of the laser processing device 10.

[0050] Referring to Figures 2 and 3 , the laser processing apparatus 10 further includes a second power supply 15. The second power supply 15 is disposed on a side of the fourth support member 114 facing away from the second support member 112. The second power supply 15 is also located on a side of the fourth support member 114 that is closer to the first support member 111. In other words, the second power supply 15 is disposed outside the fourth support member 114 and closer to the first support member 111. The second power supply 15 is electrically connected to the main control circuit board 14 to supply power to the main control circuit board 14, enabling the main control circuit board 14 to operate normally.

[0051] In this embodiment, the filter 16 is disposed on the base 30. One end of the filter 16 is electrically connected to the first power supply 12 and the second power supply 15, and the other end of the filter 16 is connected to an external power supply to filter the power supply signal so that the first power supply 12 and the second power supply 15 can obtain a stable power supply signal. It is understood that in other embodiments, the filter 16 can be disposed on the side of the fourth support member 114 facing away from the second support member 112, and this application is not limited to this.

[0052] Please refer to Figures 2, 3, 4 and 5. Figure 4 is a third structural schematic diagram of a laser processing device provided in one embodiment of the present application. Figure 5 is a fourth structural schematic diagram of a laser processing device provided in one embodiment of the present application.

[0053] In this example, the laser processing device 10 further includes a power interface 17, which is disposed on a side of the third support member 113 facing away from the first support member 111. The power interface 17 is located at an end of the third support member 113 that is proximate to the fourth support member 114. In other words, the power interface 17 is disposed outside the third support member 113 and proximate to the fourth support member 114. One end of the power interface 17 is electrically connected to the filter 16, and the other end of the power interface 17 is electrically connected to an external power source, enabling the external power source to power the laser processing device 10 and the laser processing equipment 100, thereby enabling the laser 13 and the main control circuit board 14 to function properly.

[0054] Furthermore, the laser processing device 10 also includes a switch 18, which is arranged on the side of the fourth support member 114 away from the second support member 112, and the switch 18 is electrically connected between the first power supply 12 and the power interface 17. The switch 18 is used to control the power on and off between the first power supply 12 and the power interface 17 (or external power supply). In this embodiment, the switch 18 is an emergency stop switch. By setting the switch 18, the laser 13 can be powered off in an emergency, thereby stopping the laser from emitting, which is beneficial to improving the safety of the laser processing device 10 during the processing process. It can be understood that in an emergency, the emergency stop switch can automatically power off or manually power off. By setting the emergency stop switch, the safety of the process of processing the workpiece by the laser processing device 10 is improved.

[0055] Referring to Figures 2, 3, 4, and 5, the laser processing device 10 includes a first connecting line 193 and a second connecting line 194. The first connecting line 193 is a high-voltage connecting line, while the second connecting line 194 is a low-voltage connecting line. The first connecting line 193 is connected between the first power supply 12 and the laser 13, while the second connecting line 194 is connected between the second power supply 15 and the main control circuit board 14. Specifically, a wire groove 1110 is provided on the first support member 111. The wire groove 1110 extends through the first support member 111 from the second support member 112 to the fourth support member 114, and the second connecting line 194 is received within the wire groove 1110. The first connecting line 193 is provided at the junction of the third support member 113 and the fourth support member 114 to separate the first connecting line 193 and the second connecting line 194.

[0056] In this embodiment, since the first connecting line 193 and the second connecting line 194 are separated, the interference of the first connecting line 193 (high-voltage connecting line) on the second connecting line 194 (low-voltage connecting line) is reduced, which is beneficial to improving the routing stability of the first connecting line 193 and the second connecting line 194, thereby improving the overall performance of the laser processing device 10.

[0057] Referring to Figures 2 and 3 , the laser processing apparatus 10 further includes a cooling box 191 and a cooling control board 192. The cooling box 191 is disposed on the side of the second support member 112 facing away from the fourth support member 114, and is located at the end of the second support member 112 near the third support member 113. In other words, the cooling box 191 is disposed outside the second support member 112 and adjacent to the third support member 113. The cooling box 191 communicates with the laser 13 and forms a water circulation path, which is used to cool the laser 13 and prevent overheating and tube bursting during operation. The cooling control board 192 is disposed on the side of the second support member 112 facing away from the fourth support member 114. The cooling control board 192 is located between the cooling box 191 and the main control circuit board 14, and is electrically connected to the cooling box 191 and the main control circuit board 14, enabling the cooling box 191 to effectively cool the laser 13. In this embodiment, the cooling box 191 is a water tank, and liquid in the water tank can circulate in the laser 13 to cool the laser 13.

[0058] Referring to Figures 2 and 4 , the laser 13 includes a positive terminal 131 and a negative terminal 132. Laser light from the laser 13 is emitted from the negative terminal 132. The positive terminal 131 is located on a side of the laser 13 near the fourth support member 114. It is electrically connected to the first power source 12 to enable the laser 13 to emit laser light. The negative terminal 132 is located on a side of the laser 13 near the second support member 112. It is electrically connected to the main control circuit board 14. Laser light emitted from the negative terminal 132, after optical path conversion, can be converted into laser light for processing a workpiece.

[0059] It is understood that in some other embodiments, the laser processing apparatus 10 may further include a shielding cover 195 for shielding the high voltage generated by the first power supply 12 from interfering with other electronic components. The shielding cover 195 is disposed at the junction of the third support member 113 and the fourth support member 114. The first power supply 12 and the positive terminal 131 of the laser 13 are both housed within the shielding cover 195.

[0060] By setting the shielding cover 195, the first power supply 12 and the positive terminal 131 of the laser 13 are isolated from other electronic components, which can block the high voltage generated by the first power supply 12 from interfering with other electronic components such as the main control circuit board 14, thereby reducing the probability of the chip in the main control circuit board 14 losing control and causing a crash or jam, which is beneficial to improving the overall performance of the laser processing device 10.

[0061] In some other embodiments, the shielding cover 195 of the laser device 10 can be only installed on the outside of the first power supply 12, that is, only the first power supply 12 is housed in the shielding cover 195, which can also reduce the interference of the high voltage generated by the first power supply 12 on other electronic components such as the main control circuit board 14, thereby reducing the probability of the chip in the main control circuit board 14 losing control and causing a crash or jam, which is beneficial to improving the overall performance of the laser processing device 10.

[0062] It is understandable that the present application does not limit the structure of the support frame 11 , and the first power supply 12 and the main control circuit board 14 can be arranged in partitions.

[0063] The above are some implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A laser processing device, characterized in that: include: The support frame comprises a high-pressure area and a low-pressure area, wherein the high-pressure area and the low-pressure area are arranged at intervals; A first power source is disposed on the support frame and located in the high voltage area; A laser, disposed on the support frame, the laser being electrically connected to the first power supply; as well as A main control circuit board is arranged on the support frame and located in the low-voltage area. The main control circuit board is electrically connected to the laser.

2. The laser processing device according to claim 1, characterized in that: The laser processing device also includes a second power supply, which is arranged on the support frame; the second power supply is electrically connected to the main control circuit board.

3. The laser processing device according to claim 2, characterized in that: The laser processing device includes a power interface, which is arranged on the support frame; one end of the power interface is used to be electrically connected to an external power source, and the other end of the power interface is electrically connected to the first power source and the second power source.

4. The laser processing device according to claim 3, characterized in that: The laser processing device further includes a filter, one end of the filter is electrically connected to the power interface, and the other end of the filter is electrically connected to the first power supply and the second power supply.

5. The laser processing device according to claim 4, characterized in that: The laser processing device also includes a switch, which is arranged between the filter and the power interface, and is used to control the power on and off of the laser processing device.

6. The laser processing device according to claim 2, characterized in that: The support frame comprises a first support member, a second support member, a third support member and a fourth support member which are connected end to end in sequence, the first support member and the third support member are arranged opposite to each other, and the second support member and the fourth support member are arranged opposite to each other; The first power supply is arranged on the fourth support member, and the first power supply is located at an end of the fourth support member close to the third support member; the laser is arranged on the third support member; the main control circuit board is arranged on the second support member, and the main control circuit board is located at an end of the second support member close to the first support member; the second power supply is arranged on a side of the fourth support member away from the second support member, and the second power supply is located at an end of the fourth support member close to the first support member.

7. The laser processing device according to claim 6, characterized in that: The laser processing device also includes a first connecting line and a second connecting line, the first connecting line is arranged at the connection between the third support member and the fourth support member, and the first connecting line is electrically connected between the first power supply and the laser; the second connecting line is arranged on the first support member, and the second connecting line is electrically connected between the second power supply and the main control circuit board.

8. The laser processing device according to claim 7, characterized in that: The first support member is provided with a wire groove, and the second connecting wire is received in the wire groove.

9. The laser processing device according to claim 1, characterized in that: The laser processing device also includes a cooling box and a cooling control board, wherein the cooling control board is used to control the cooling box to cool the laser; the cooling box is arranged on the support frame, the cooling control board is arranged on the support frame and close to the main control circuit board, and the cooling control board is connected between the cooling box and the main control circuit board.

10. The laser processing device according to claim 1, wherein: The laser includes a positive terminal and a negative terminal, and the laser of the laser is emitted from the negative terminal; the positive terminal is arranged on a side of the laser close to the first power supply, and the positive terminal is electrically connected to the first power supply; the negative terminal is arranged on a side of the laser away from the first power supply, and the negative terminal is electrically connected to the main control circuit board.

11. The laser processing device according to claim 10, characterized in that: The laser processing device further comprises a shielding cover, which is arranged on the supporting frame, and the first power supply and the positive terminal of the laser are accommodated in the shielding cover.

12. A laser processing device, characterized in that: include The laser processing device according to any one of claims 1 to 11; a base, on which the laser processing device is disposed; and The shell is covered on the base, and the laser processing device is accommodated in the shell.

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