Optical fiber array

The optical fiber array addresses interference issues by using a chamfered or stepped root portion to guide optical fibers at a predetermined curvature, ensuring stable bending and reduced interference with electronic components, thus enhancing component placement flexibility and optical performance.

WO2025004247A1PCT designated stage expired Publication Date: 2025-01-02NIPPON TELEGRAPH & TELEPHONE CORP
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Patent Information

Application Number
PCT/JP2023/024069
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-06-28
Publication Date
2025-01-02

AI Technical Summary

Technical Problem

Conventional optical fiber arrays face issues where optical fibers pulled out in the optical axis direction often interfere with electronic components on the electronic circuit board, leading to potential damage and limited height of electronic components due to bending constraints.

Method used

The optical fiber array incorporates a V-groove substrate with a chamfered or stepped root portion to guide optical fibers at a predetermined curvature, using a protective resin to fix them in place, allowing for stable bending and reduced interference with electronic components.

Benefits of technology

This design enables optical fibers to be pulled out at a predetermined bending radius, preventing interference with electronic components and enhancing the flexibility in mounting electronic components, while maintaining optical performance and durability.

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Abstract

The purpose of the present invention is to provide an optical fiber array in which an optical fiber drawn in an optical axis direction from the optical fiber array does not interfere with an electronic component on an electronic circuit board while being routed to the outside of a module case. An optical fiber array according to the present disclosure is provided with a V-groove substrate (301), a pressing plate (302), and a plurality of optical fibers (3031-303n), and is characterized in that the V-groove substrate includes a V-groove portion (304) that includes a connection end surface (305) and in which a V-groove is formed, and a root portion (306) that includes an end surface on the opposite side from the connection end surface, the plurality of optical fibers are fixed to the V-groove portion of the V-groove substrate by a pressing plate, and are fixed by a protective resin (309) at the root portion of the V-groove substrate, and the root portion of the V-groove substrate is provided with a level-difference-machined part or a chamfer-machined part (307) that guides an optical fiber at a prescribed curvature radius.
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Citation Information

Patent Citations

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    JP1999174274A

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    JP2004205589A

  • Optical fiber photonic integrated chip connector interfaces, photonic integrated chip assemblies, and methods of fabricating the same

    US20210157056A1