Liquid compression molding material, electronic component, semiconductor device, and method for manufacturing electronic component

Abstract

The present invention suppresses the occurrence of a mold flash at the time of compression molding. Provided are: a liquid compression molding material comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a vinyl polymer; an electronic component and a semiconductor device manufactured using the same; and a method for manufacturing an electronic component using the same.

Description

Liquid compression molding material, electronic component, semiconductor device, and method for manufacturing electronic component

[0001] The present invention relates to a liquid compression molding material, an electronic component, a semiconductor device, and a method for manufacturing an electronic component.

[0002] Many semiconductor elements, such as integrated circuits, that constitute semiconductor devices are encapsulated with an encapsulant. While there are several molding methods for encapsulating semiconductor elements, in recent years, compression molding, which is more suitable for producing relatively large molded products, has been increasingly adopted for encapsulating semiconductor elements. This is due to the increasing popularity of wafer-level chip-size packaging technology (a technology for encapsulating wafers in their current state after circuit formation is complete but before they are separated into individual chips).

[0003] Conventional curable resin compositions used for encapsulating semiconductor elements by compression molding have mainly been solid resin compositions such as granular ones. However, recently, with the development of new compression molding techniques, liquid curable resin compositions (so-called liquid compression molding materials) have been increasingly used. For this reason, various LCM materials have been proposed (for example, Patent Document 1, etc.). Hereinafter, liquid compression molding materials may be abbreviated as "LCM (Liquid Compression Molding) materials."

[0004] JP 2016-108367 A

[0005] On the other hand, when compression molding is performed using conventional LCM material, a phenomenon known as mold flash can occur in which the LCM material leaks into the outer peripheral area of ​​a substrate such as a wafer placed on the lower mold of the compression molding machine (the surface of the lower mold that is not covered by the substrate).When mold flash occurs, the leaked LCM material infiltrates small parts of the machine, such as vacuum piping, requiring the compression molding machine to be shut down for repairs and maintenance, ultimately resulting in reduced productivity and increased manufacturing costs.

[0006] The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide an LCM material that can suppress the occurrence of mold flash during compression molding, electronic components and semiconductor devices manufactured using the same, and a method for manufacturing electronic components using the same.

[0007] The above object can be achieved by the present invention, which provides a liquid compression molding material comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a vinyl polymer.

[0008] In one embodiment of the liquid compression molding material of the present invention, it is preferable that the content of the vinyl polymer (D) is 0.004 parts by mass to 15 parts by mass relative to 100 parts by mass of the epoxy resin (A).

[0009] In another embodiment of the liquid compression molding material of the present invention, the content of the vinyl polymer (D) is preferably 0.5 parts by mass to 15 parts by mass per 100 parts by mass of the epoxy resin (A).

[0010] In another embodiment of the liquid compression molding material of the present invention, the blending ratio of the inorganic filler (C) to all components constituting the liquid compression molding material is preferably 60% by mass to 90% by mass.

[0011] In another embodiment of the liquid compression molding material of the present invention, the vinyl polymer (D) preferably includes at least one vinyl ether polymer.

[0012] In another embodiment of the liquid compression molding material of the present invention, the vinyl polymer (D) preferably has a number average molecular weight of 1,000 to 150,000.

[0013] Another embodiment of the liquid compression molding material of the present invention preferably further contains a solvent (E).

[0014] Another embodiment of the liquid compression molding material of the present invention is a molding method in which the pre-mixing and degassing is performed for 90 minutes, the clamping force is 10 kN, and the supply amount of the liquid compression molding material is 11.2 cm ３It is preferable that the maximum diameter of the cured liquid compression molding material obtained by a half-shot test performed under static degassing conditions of 200 hPa is less than 280 mm.

[0015] In another embodiment of the liquid compression molding material of the present invention, the (A) epoxy resin preferably contains one or more selected from the group consisting of aminophenol-type epoxy, bisphenol A-type epoxy, bisphenol F-type epoxy, glycidylamine-type epoxy, and polytetramethylene glycol diglycidyl ether.

[0016] In another embodiment of the liquid compression molding material of the present invention, the (B) curing agent is preferably an imidazole-based curing agent.

[0017] The liquid compression molding material of the present invention preferably has a viscosity at 120°C of 0.3 Pa·s to 30 Pa·s.

[0018] The electronic component of the present invention includes an encapsulant made of the cured liquid compression molding material of the present invention.

[0019] The semiconductor device of the present invention includes a substrate, a semiconductor element disposed on the substrate, and a cured product of the liquid compression molding material of the present invention that seals a gap between the semiconductor element and the substrate.

[0020] The method for manufacturing an electronic component of the present invention involves at least a compression molding step using the liquid compression molding material of the present invention to manufacture an electronic component that includes a substrate, an element placed on the substrate, and a sealing material made of a cured product of the liquid compression molding material that seals the gap between the element and the substrate.

[0021] According to the present invention, it is possible to provide an LCM material that can suppress the occurrence of mold flash during compression molding, electronic components and semiconductor devices manufactured using the same, and a method for manufacturing electronic components using the same.

[0022] FIG. 1 is a schematic diagram illustrating the occurrence of mold flash in a compression molding process using an LCM material.

[0023] <LCM Material> The LCM material of this embodiment includes (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler, and (D) a vinyl-based polymer. Because the LCM material of this embodiment uses (D) a vinyl-based polymer, it is possible to suppress the occurrence of mold flash during compression molding.

[0024] The inventors' background in discovering the LCM material of this embodiment is as follows. First, the occurrence of mold flash in a compression molding process using an LCM material will be explained using Figure 1. When manufacturing electronic components such as semiconductor devices by compression molding using an LCM material, various substrates such as wafers and various elements such as semiconductor elements to be sealed are used in addition to the LCM material, but the elements are not shown in Figure 1.

[0025] As shown in FIG. 1 , in the compression molding process, first, an LCM material 30 is supplied onto a substrate 10, such as a wafer, using an LCM material supply means 20 ( FIG. 1A , LCM material supply step). In the LCM material supply step, the LCM material 30 is supplied so as to cover the central portion of the substrate 10. Next, the substrate 10 with the LCM material 30 supplied thereto is placed on a lower mold 110 of a compression molding apparatus 100 ( FIG. 1B , substrate placement step). Note that, as shown in FIG. 1B , the substrate 10 used for compression molding has a horizontal size smaller than the size of the upper surface of the lower mold 110. Furthermore, before the substrate placement step is performed, the lower mold 110 and the upper mold 120 are heated to a mold temperature (e.g., 120° C.). Therefore, from the time the substrate placement step ( FIG. 1B ) is completed, the LCM material 30 continues to be heated by the lower mold 110 via the substrate 10.

[0026] Next, the molds are closed to form a sealed space S surrounded by the lower mold 110 and the upper mold 120, the surface of which is covered with a release film 122 ( FIG. 1(C) , mold closing step). The air inside the sealed space S formed by the mold closing is then evacuated using a pressure reducing means (not shown) ( FIG. 1(D) , degassing step). After the pressure inside the sealed space S has been sufficiently reduced, the lower mold 110 and the upper mold 120 are moved relative to each other so that the lower mold 110 approaches the upper mold 120. This pressurizes the LCM material 30 between the substrate 10 on the lower mold 110 and the upper mold 120, and simultaneously heats the thinly spread LCM material 30 from both the top and bottom surfaces to pre-cure it ( FIG. 1(E) , heating and pressurizing step).

[0027] In the compression molding process shown in FIG. 1 , the expansion of gas bubbles B contained in LCM material 30 during the degassing step ( FIG. 1(D) ) causes the volume of LCM material 30 to expand, causing LCM material 30 to spread horizontally. Furthermore, during the heating and pressurizing step ( FIG. 1(E) ), LCM material 30 further expands horizontally. If, at the end of the heating and pressurizing step, the outer edge of the cured LCM material 30, which has spread horizontally, is located on the outer periphery of substrate 10 (the surface of the lower mold 110 that is not covered by the substrate), as shown in FIG. 5(E) , mold flash has occurred. Here, assuming that the volume expansion of LCM material 30 during the degassing step ( FIG. 1(D) ) is zero, the degree of horizontal expansion of LCM material 30, which determines the occurrence of mold flash, can be very easily controlled by appropriately selecting (a) the amount of LCM material 30 supplied onto substrate 10 and (b) the size of the gap formed between lower mold 110 and upper mold 120 at the end of the heating and pressurizing step. Therefore, it is believed that the occurrence of mold flash can be easily suppressed if appropriate conditions are set for the above (a) and (b), and if the expansion of the bubbles B contained in the LCM material 30 in the (c) degassing step (Figure 1(D)) can also be suppressed.

[0028] Based on the above-mentioned new findings, the present inventors have considered that it is extremely important to prevent the generation of bubbles B or to defoam bubbles B in the degassing step (FIG. 1(D)) in order to suppress the volumetric expansion of LCM material 30 caused by the expansion of bubbles B contained in LCM material 30. Meanwhile, when a liquid composition is produced by mixing and stirring various raw materials, it is known to use an antifoaming agent to prevent the generation of bubbles in the liquid composition during the production process or to defoam bubbles that have formed in the liquid composition.

[0029] For this reason, the inventors believed that by blending an existing defoaming agent with the LCM material 30, mold flash caused by volume expansion during the degassing step (FIG. 1(D)) could be easily suppressed, regardless of the type of defoaming agent. However, through trial and error, the inventors discovered that none of the wide variety of defoaming agents are effective in suppressing mold flash, and that only defoaming agents containing a vinyl polymer as the main component dissolved in a solvent can suppress mold flash. From these results, the inventors believed that, of the various main components used as defoaming agents, only the vinyl polymer has some unique effect of suppressing the volume expansion of the LCM material 30 during the degassing step (FIG. 1(D)), and discovered the LCM material of this embodiment.

[0030] Next, the various components that make up the LCM material of this embodiment will be described in detail below.

[0031] (A) Epoxy Resin The epoxy resin used in the LCM material of this embodiment is not particularly limited as long as it is a variety of epoxy resins generally used for semiconductor encapsulation, but from the viewpoint of fluidity during molding, it is preferable to use a liquid epoxy resin. Furthermore, the epoxy resin blended into the LCM material may be a single type of epoxy resin, or two or more types of epoxy resins may be used in combination. Specific examples of epoxy resins include aromatic epoxy resins and aliphatic epoxy resins. Examples of aromatic epoxy resins include bisphenol A type epoxy resins such as p-glycidyloxyphenyldimethyltrisbisphenol A diglycidyl ether, bisphenol F type epoxy resins, novolac type epoxy resins, fluorene type epoxy resins, biphenyl aralkyl epoxy resins, diepoxy resins such as p-tert-butylphenyl glycidyl ether and 1,4-phenyldimethanol diglycidyl ether, biphenyl type epoxy resins such as 3,3',5,5'-tetramethyl-4,4'-diglycidyloxybiphenyl, aminophenol type epoxy resins such as diglycidylaniline, diglycidyltoluidine, triglycidyl-p-aminophenol and tetraglycidyl-m-xylylenediamine, naphthalene type epoxy resins, glycidylamine type epoxy resins, and epoxy resins having a plant-derived skeleton, but are not limited to these.

[0032] Examples of aliphatic epoxy resins include monofunctional aliphatic epoxy compounds having one epoxy group in the molecule, such as alkyl alcohol glycidyl ethers (butyl glycidyl ether, 2-ethylhexyl glycidyl ether, etc.) and alkenyl alcohol glycidyl ethers (vinyl glycidyl ether, allyl glycidyl ether, etc.); difunctional aliphatic epoxy compounds having two epoxy groups in the molecule, such as polyalkylene glycol diglycidyl ethers and polytetramethylene glycol diglycidyl ethers, and alkenylene glycol diglycidyl ethers; and polyfunctional aliphatic epoxy compounds having three or more epoxy groups in the molecule, such as polyglycidyl ethers of trifunctional or higher alcohols, such as trimethylolpropane, pentaerythritol, and dipentaerythritol (tri-, tetra-, penta-, or hexa-glycidyl ether, etc.).

[0033] Among the above, liquid aminophenol type epoxy, liquid bisphenol A type epoxy, liquid bisphenol F type epoxy, glycidylamine type epoxy, and polytetramethylene glycol diglycidyl ether are preferred from the viewpoint of workability. The content of the epoxy resin (A) relative to the entire LCM material is preferably 5% by mass to 40% by mass, more preferably 5% by mass to 35% by mass, and even more preferably 7% by mass to 30% by mass.

[0034] (B) Curing Agent The curing agent used in the LCM material of this embodiment can be any known curing agent for epoxy resins, such as imidazole-based curing agents, amine-based curing agents, phenol-based curing agents, and acid anhydride-based curing agents. Among these, the imidazole-based curing agent may be in the form of a latent curing agent activated by heat, or in the form of a microcapsule-type curing agent. It is preferable to use an imidazole-based curing agent in the LCM material of this embodiment. Furthermore, from the viewpoint of reducing warpage of the cured LCM material, it is preferable to use a phenol-based curing agent and an acid anhydride-based curing agent in combination.

[0035] Examples of the imidazole curing agent include 2-substituted imidazole compounds such as imidazole, 2-methylimidazole, 2-ethylimidazole, 1-isobutyl-2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, and 1-cyanoethyl-2-phenylimidazole; 1-cyanoethyl-2-undecylimidazole trimethylimidazole; Triazine ring-containing compounds such as 2,4-diamino-6-[(2-methyl-1-imidazolyl)ethyl]s-triazine, 2,4-diamino-6-[(2-undecyl-1-imidazolyl)ethyl]s-triazine, 2,4-diamino-6-[(2-ethyl-4-methyl-1-imidazolyl)ethyl]s-triazine, an isocyanuric acid adduct of 2,4-diamino-6-[(2-methyl-1-imidazolyl)ethyl]s-triazine, an isocyanuric acid adduct of 2-phenylimidazole, an isocyanuric acid adduct of 2-methylimidazole, an isocyanuric acid adduct of 2-phenyl-4,5-dihydroxymethylimidazole, and an isocyanuric acid adduct of 2-phenyl-4-methyl-5-hydroxymethylimidazole.

[0036] Examples of the amine curing agent include aliphatic amines such as diethylenetriamine, triethylenetetraamine, tetraethylenepentamine, trimethylhexamethylenediamine, m-xylenediamine, and 2-methylpentamethylenediamine; alicyclic polyamines such as isophoronediamine, 1,3-bisaminomethylcyclohexane, bis(4-aminocyclohexyl)methane, norbornenediamine, and 1,2-diaminocyclohexane; aliphatic amines such as piperazine-type polyamines such as N-aminoethylpiperazine and 1,4-bis(2-amino-2-methylpropyl)piperazine; and aromatic amines such as diaminodiphenylmethane, m-phenylenediamine, diaminodiphenylsulfone, diethyltoluenediamine, trimethylenebis(4-aminobenzoate), polytetramethyleneoxide-di-p-aminobenzoate, and 4,4'-diamino-3,3'-diethyldiphenylmethane.

[0037] As the phenol-based curing agent, a phenolic resin, particularly a novolak resin obtained by condensing a phenol or naphthol (e.g., phenol, cresol, naphthol, alkylphenol, bisphenol, terpene phenol, etc.) with formaldehyde, is preferably used. Examples of novolak resins include phenol novolak resin, o-cresol novolak resin, p-cresol novolak resin, α-naphthol novolak resin, β-naphthol novolak resin, t-butylphenol novolak resin, bisphenol A novolak resin, xylylene-modified novolak resin, and decalin-modified novolak resin. Other examples of phenolic resins include dicyclopentadiene cresol resin, polyparavinylphenol, poly(di-o-hydroxyphenyl)methane, poly(di-m-hydroxyphenyl)methane, and poly(di-p-hydroxyphenyl)methane.

[0038] Examples of the acid anhydride curing agent include phthalic anhydride, alkylhexahydrophthalic anhydrides such as hexahydrophthalic anhydride and methylhexahydrophthalic anhydride, alkyltetrahydrophthalic anhydrides such as tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride and 3-methyltetrahydrophthalic anhydride, himic anhydride, succinic anhydride, trimellitic anhydride, and pyromellitic anhydride.

[0039] Among the curing agents listed above, imidazole-based curing agents are preferred from the viewpoints of high-temperature reactivity and storage stability. Furthermore, in the LCM material of this embodiment, only one type of curing agent may be used as the (B) curing agent, or two or more types of curing agents may be used in combination. The blend amount of the (B) curing agent in the LCM material of this embodiment is preferably 1 to 100 parts by mass, more preferably 3 to 98 parts by mass, and particularly preferably 4 to 95 parts by mass, per 100 parts by mass of the (A) epoxy resin.

[0040] (C) Inorganic Filler The inorganic filler can be any known inorganic filler that has the effect of reducing the thermal expansion coefficient of the cured LCM material of this embodiment, without any particular limitation. Examples of inorganic filler materials include silica, alumina, aluminum, aluminum nitride, silicon carbide, and silicon nitride. Silica inorganic fillers are particularly suitable as inorganic fillers, as they can increase the amount (filling amount) of inorganic filler added to the LCM material. The inorganic filler may also be surface-treated with a surface treatment agent such as a silane coupling agent. The inorganic filler added to the LCM material may be a single type of inorganic filler, or two or more types of inorganic fillers may be used in combination.

[0041] The shape of the inorganic filler is not particularly limited and may be spherical, amorphous, scaly, or any other shape. The average particle size of the inorganic filler is preferably 0.005 μm to 10.0 μm, more preferably 0.01 μm to 5.0 μm, and even more preferably 0.03 μm to 3.0 μm. The average particle size refers to the volume average particle size D50 (the particle size at the 50% cumulative size from the small diameter side of the volume-based particle size distribution) measured using a laser diffraction particle size distribution analyzer. From the perspective of further reducing the viscosity of the LCM material while maintaining a high content of inorganic filler blended into the LCM material, it is preferable to use a combination of two inorganic fillers with different volume average particle sizes D50. The blending ratio of the inorganic filler (C) to all components constituting the LCM material is preferably 60% to 90% by mass, more preferably 65% ​​to 90% by mass. By setting the content within the above numerical range, the linear expansion coefficient of the cured LCM material can be reduced, making it easy to reduce warping of electronic components such as semiconductor devices manufactured using the LCM material.

[0042] (D) Vinyl Polymer Any known vinyl polymer can be used as the vinyl polymer. While a vinyl polymer can be used alone as a raw material for producing an LCM material, it is preferable to use a vinyl polymer defoamer in which a vinyl polymer is dissolved in a solvent, from the viewpoint of material availability. Commercially available vinyl polymer defoamers, such as SN-353 (manufactured by San Nopco Ltd.), BYK-1759 (manufactured by BYK Japan Co., Ltd.), and LHP-90 (manufactured by Kusumoto Chemical Co., Ltd.), can be used as appropriate.

[0043] In addition, vinyl polymer defoaming agents containing a vinyl polymer as an active ingredient, like other conventionally known defoaming agents such as silicone defoaming agents and acrylic defoaming agents, are additives usually used for the purpose of defoaming bubbles generated when various raw materials are mixed and stirred at room temperature (around 25°C) to prepare a liquid composition. As shown in the experimental data described below, when used as the above-mentioned normal defoaming agent, the performance of the vinyl polymer defoaming agent is comparable to or slightly inferior to other conventionally known defoaming agents, but when used for the purpose of suppressing the occurrence of mold flash, it shows significantly superior performance compared to other conventionally known defoaming agents. The reason why only vinyl polymer defoaming agents, among various conventionally known defoaming agents, exhibit significantly superior performance in terms of suppressing the occurrence of mold flash is not clear, but considering the facts shown in the following (1) and (2), it is presumed that this is because only vinyl polymer defoaming agents can exhibit superior defoaming action compared to other defoaming agents, even when heated to temperatures significantly higher than room temperature (around 25°C). (1) In the compression molding process, mold flash occurs due to the expansion of bubbles B contained in the LCM material 30 during the degassing step (FIG. 1(D)). (2) Prior to the degassing step (FIG. 1(D)), the lower mold 110 is already sufficiently heated to a temperature significantly higher than room temperature. Therefore, during the degassing step (FIG. 1(D)), the LCM material 30 is inevitably heated by the lower mold 110 through the substrate 10.

[0044] The vinyl polymer can be any polymer obtained by the polymerization reaction of a vinyl monomer without any particular limitation. Specific examples of the vinyl polymer include vinyl ether polymers such as polymethyl vinyl ether, polyethyl vinyl ether, poly-n-propyl vinyl ether, polyisopropyl vinyl ether, polybutyl vinyl ether, polyisobutyl vinyl ether, poly-t-butyl vinyl ether, polypentyl vinyl ether, polyhexyl vinyl ether, and poly-2-ethylhexyl vinyl ether. Among these, polyisobutyl vinyl ether is preferred because of its particularly excellent defoaming effect in the degassing step (FIG. 1(D)) in the compression molding process.

[0045] Furthermore, the vinyl polymer may be any of the following types of polymers: (a) homopolymers, (b) copolymers obtained by copolymerizing two or more types of vinyl monomers, and (c) copolymers obtained by copolymerizing a vinyl monomer with another monomer. Here, the (c) type "copolymer" refers to a copolymer in which the proportion of vinyl monomers in the total monomers used in the copolymerization is 10 mol% or more, preferably 15 mol% or more, and more preferably 20 mol% or more. An example of a commercially available type (c) copolymer is the aforementioned BYK-1759. Other monomers copolymerizable with vinyl monomers include acrylates such as butyl acrylate, allyl ethers such as allyl phenyl ether, allyl esters such as allyl acetate, maleimides such as N-phenylmaleimide and N-cyclohexylmaleimide, fumaric acid diesters such as diisopropyl fumarate and dicyclohexyl fumarate, maleic anhydride, itaconic anhydride, etc.

[0046] The content of the (D) vinyl polymer is not particularly limited as long as it can suppress the occurrence of mold flash, but is preferably 0.001 part by mass or more, more preferably 0.002 part by mass or more, even more preferably 0.09 part by mass or more, and particularly preferably 0.9 part by mass or more, per 100 parts by mass of the total content of the (A) epoxy resin, (B) curing agent, and (C) inorganic filler. By setting the content of the (D) vinyl polymer to 0.001 part by mass or more per 100 parts by mass of the total content of the (A) to (C) components, the occurrence of mold flash can be more reliably suppressed, and by setting the content to 0.09 part by mass or more, warpage of the sealed article (electronic component such as a semiconductor device) obtained through a compression molding process can also be suppressed.

[0047] From the viewpoint of suppressing mold flash and warpage, the greater the content of the vinyl polymer (D) per 100 parts by mass of the total content of the components (A) to (C), the better, but if the content is too high, peeling may occur at the interface between various elements, such as semiconductor elements, that constitute the sealed article and the sealing material (cured product of the LCM material) that seals the elements, potentially reducing the reliability of the sealed article. Therefore, the upper limit of the content of the vinyl polymer (D) per 100 parts by mass of the total content of the components (A) to (C) is preferably 3.0 parts by mass or less, more preferably 2.5 parts by mass or less, and even more preferably 2.0 parts by mass or less.

[0048] The content of the (D) vinyl polymer per 100 parts by mass of the (A) epoxy resin is not particularly limited as long as it can suppress mold flash, but the lower limit is preferably 0.004 parts by mass or more, more preferably 0.008 parts by mass or more, even more preferably 0.5 parts by mass or more, and particularly preferably 5 parts by mass or more. By setting the content of the (D) vinyl polymer to 0.004 parts by mass or more per 100 parts by mass of the (A) epoxy resin, mold flash can be more reliably suppressed, and by setting the content to 0.5 parts by mass or more, warpage of sealed articles (electronic components such as semiconductor devices) obtained through a compression molding process can also be suppressed. While the details of how warpage of sealed articles can be suppressed are unclear, the inventors speculate that warpage is suppressed for the reasons described below. That is, when the content of the (D) vinyl polymer per 100 parts by mass of the (A) epoxy resin is 0.5 parts by mass or more, a portion of the vinyl polymer dissolves in the LCM material, while the remainder disperses in the LCM material in an undissolved state. When the LCM material hardens, the vinyl polymer that was not dissolved in the LCM material contributes to alleviating the stress that occurs in the hardened material during hardening. The greater the vinyl polymer content, the greater the amount of vinyl polymer that remains undissolved in the LCM material (in other words, the greater the amount of vinyl polymer that contributes to alleviating the stress that occurs in the hardened material during hardening). It is believed that this is why warping of the sealed article is suppressed.

[0049] From the viewpoint of suppressing mold flash and warpage, the greater the content of the (D) vinyl polymer per 100 parts by mass of the (A) component, the better, but if the content is too large, peeling may occur at the interface between various elements, such as semiconductor elements, that constitute the sealed article and the sealing material (cured product of the LCM material) that seals the elements, potentially reducing the reliability of the sealed article. Therefore, the upper limit of the content of the (D) vinyl polymer per 100 parts by mass of the (A) component is preferably 15 parts by mass or less, more preferably 10 parts by mass or less, and even more preferably 8.0 parts by mass or less.

[0050] The number-average molecular weight of the vinyl polymer is not particularly limited, but is preferably 1,000 to 150,000, more preferably 1,500 to 100,000, and even more preferably 2,000 to 80,000. In this specification, "number-average molecular weight" refers to the number-average molecular weight in terms of polystyrene measured by GPC (gel permeation chromatography). By setting the number-average molecular weight of the vinyl polymer within the above range, it becomes easier to suppress mold flash and even warpage, even when the content of the vinyl polymer (D) contained in the LCM material of this embodiment is small. In addition, the effects of the vinyl polymer on the various physical properties of the LCM material and its cured product (e.g., viscosity, glass transition temperature Tg, etc.) can be further reduced.

[0051] Other Components The LCM material of this embodiment may further contain other components in addition to components (A) to (D) as needed. Examples of other components include, but are not limited to, curing accelerators, coupling agents, pigments, ion trapping agents, leveling agents, antioxidants, flame retardants, colorants, reactive diluents, elastomers, solvents, and defoamers containing components other than vinyl polymers as active ingredients. The amounts of the other components can be appropriately selected depending on their types. When a vinyl polymer defoamer prepared by dissolving a vinyl polymer in a solvent is used as a raw material for producing the LCM material, the LCM material of this embodiment will also contain the solvent derived from this vinyl polymer defoamer.

[0052] Furthermore, when a solvent is also blended into the LCM material, the boiling point of the blended solvent is preferably 160°C or lower. Because compression molding is generally performed at temperatures below 160°C, if the LCM material contains a solvent with a boiling point above 160°C, the solvent components in the LCM material may not volatilize during the compression molding process, potentially causing cracks and voids. In addition, the viscosity of the LCM material decreases (increasing fluidity), making it more susceptible to mold flash. This also increases the likelihood of reduced curing and reduced reliability due to peeling. Examples of solvents with a boiling point of 160°C or lower include ethyl acetate, butyl acetate, methyl isobutyl ketone, and methoxypropyl acetate. Therefore, when a vinyl-based polymer defoaming agent is used as a raw material in the production of the LCM material, the solvent contained in the vinyl-based polymer defoaming agent is preferably a solvent with a boiling point of 160°C or lower. Furthermore, the content of the (E) solvent in the LCM material is preferably 0% to 10% by mass, and more preferably 0% to 5% by mass, of the total amount of the LCM material.

[0053] Next, the preferred physical properties of the LCM material of this embodiment and its cured product are described below. The viscosity of the LCM material of this embodiment is not particularly limited as long as it is liquid at room temperature. However, the viscosity at 25°C is preferably 1000 Pa·s or less, more preferably 600 Pa·s or less, and even more preferably 300 Pa·s or less. A viscosity of 1000 Pa·s or less at 25°C facilitates increased productivity during compression molding. While the lower limit of the viscosity at 25°C is not particularly limited, if the viscosity is too low (the fluidity of the LCM material is too high), the LCM material tends to spread horizontally during compression molding, resulting in mold flash. Therefore, for practical purposes, the viscosity is preferably 40 Pa·s or more, and more preferably 80 Pa·s or more.

[0054] Furthermore, the viscosity at 120°C is preferably 30 Pa·s or less, more preferably 10 Pa·s or less, and even more preferably 2 Pa·s or less. By setting the viscosity at 120°C to 30 Pa·s or less, air bubbles B in the heated LCM material 30 can be easily released to the outside during the degassing step (FIG. 1(D)), which ultimately makes it easier to suppress mold flash. Note that there is no particular lower limit for the viscosity at 120°C, but if the viscosity is too low (the fluidity of the LCM material is too high), the LCM material will tend to spread horizontally during compression molding, which will ultimately lead to mold flash. Therefore, for practical purposes, the viscosity is preferably 0.3 Pa·s or more, and more preferably 0.5 Pa·s or more.

[0055] The gel time of the LCM material of this embodiment at 120°C is preferably 100 to 1000 seconds, more preferably 100 to 800 seconds, and even more preferably 100 to 650 seconds. By setting the gel time to 100 seconds or more, compression molding can be reliably carried out without the LCM material hardening during the period from when the LCM material is supplied onto the substrate until the start of pressurization and heating using a mold. By setting the gel time to 1000 seconds or less, high productivity can be easily ensured.

[0056] Furthermore, from the viewpoint of facilitating the production of various highly reliable electronic components (such as semiconductor devices), the glass transition temperature (Tg) of the cured product of the LCM material of this embodiment is preferably 50° C. to 230° C., more preferably 50° C. to 200° C., and even more preferably 80° C. to 200° C. Furthermore, from the viewpoint of minimizing warpage of electronic components produced using the LCM material, the elastic modulus of the cured product measured at 30° C. is preferably 5 GPa to 20 GPa.

[0057] The LCM material of this embodiment is prepared by mixing and stirring components (A) to (D), or components (A) to (D) and other components used as needed. A known mixing and stirring means such as a roll mill or planetary mixer can be used as appropriate for mixing and stirring. If the epoxy resin (A) used as a raw material is solid, it is preferably liquefied or fluidized by heating or the like before mixing with the remaining raw materials other than the epoxy resin (A).

[0058] When preparing an LCM material, the mixing procedure is not particularly limited, and for example, all of the components used as raw materials may be mixed at the same time, or some of the components may be mixed first to prepare a primary mixture, and the remaining components may then be added and mixed. For example, if it is difficult to uniformly disperse the inorganic filler (C) in the epoxy resin (A), the epoxy resin (A) and the inorganic filler (C) may be mixed first to prepare a primary mixture, and the remaining components may then be mixed into this primary mixture.

[0059] The LCM material obtained by mixing and stirring the raw materials can be used directly for compression molding, or the LCM material can be subjected to a degassing treatment before being used for compression molding. Any known method can be used for the degassing treatment without any particular limitations, and examples include stirring and degassing. Stirring and degassing can be performed using any device and under any conditions. For example, it is preferable to stir and degas 100 to 5,000 g of LCM material using a hard mixer (model number: UVR10L) manufactured by Nippon Sosei Kogyo Co., Ltd., at a stirring speed of 10 to 50 rpm, a degassing time of 60 to 120 minutes, and a vacuum of 200 Pa or less.

[0060] <Electronic Components, Semiconductor Devices, and Methods for Manufacturing Electronic Components> The LCM material of this embodiment can be used to manufacture various products manufactured using compression molding, specifically, to manufacture various electronic components equipped with an encapsulant. In these electronic components, a cured product of the LCM material of this embodiment is used as the encapsulant. The structure of the electronic component is not particularly limited as long as it includes an encapsulant, but a typical example is one having a structure including a substrate, an element disposed on the substrate, and an encapsulant that seals the gap between the substrate and the element. A specific example of an electronic component is a semiconductor device that uses a wafer as the substrate and a semiconductor element as the element.

[0061] The electronic component of this embodiment is manufactured through at least a compression molding process using the LCM material of this embodiment. After the compression molding process, various post-processing steps, such as post-cure (main hardening process), reflow, and dicing (single division), are typically performed as appropriate to obtain the electronic component. The compression molding process involves the following steps (1) to (5) in this order, with the LCM material heating step (6) performed before the degassing step (4). (1) A step of supplying the LCM material near the center of one side of a substrate selected from the group consisting of a substrate and a release film (LCM material supply step). (2) A step of placing the substrate with the LCM material supplied on the surface of a lower mold, with the surface with the LCM material supplied facing up (substrate placement step). (3) A step of bringing the upper mold and the lower mold closer together to form an enclosed space between the upper mold and the lower mold (mold closing step). (4) A step of reducing the pressure in the enclosed space to degas (degassing step). (5) A step of bringing the upper mold and the lower mold closer to each other and applying heat and pressure to the LCM material from both the top and bottom sides to harden it (heat and pressure step). (6) A step of heating the LCM material before starting the degassing step (LCM material heating step).

[0062] The method for heating the LCM material in the LCM material heating step (6) is not particularly limited. However, in practice, it is preferable to preheat the lower mold to a predetermined temperature before the start of the degassing step (4) (preferably before the start of the substrate placement step (2)), so that the LCM material is heated via the substrate that is in direct contact with the heated lower mold. In this case, the heating temperature of the lower mold is preferably set within a range of, for example, approximately 120°C ± 30°C. Furthermore, if the substrate to which the LCM material is supplied is a substrate, a release film is placed on the surface of the upper mold, and if the substrate to which the LCM material is supplied is a release film, the substrate is placed on the surface of the upper mold. Furthermore, the substrate used has a maximum diameter smaller than the size of the mold surface on which the substrate is placed.

[0063] Specific examples of the present invention will be described below with reference to examples, but the present invention is not limited to the examples described below.

[0064] 1. Preparation of LCM Materials Liquid resin compositions were obtained by mixing and stirring raw materials using a roll mill to obtain the blending amounts shown in Tables 1 to 4. Next, 500 g of this liquid resin composition was stirred and degassed for 90 minutes using a hard mixer (model number: UVR10L) at room temperature (25°C) at a stirring speed of 20 rpm and a vacuum of 200 Pa or less, thereby preparing the LCM materials of Examples 1 to 15 and Comparative Examples 1 to 17. However, for LCM materials prepared for the evaluation of defoaming time described below, the stirring and degassing treatment time was changed as appropriate. Details of each component used as a raw material are as follows. The blending amounts of each component shown in the tables are in parts by mass.

[0065] 2. Raw material components used in preparing LCM materials (A) Epoxy resins EP-3950L (aminophenol type epoxy resin: manufactured by ADEKA) SE-300P (aminophenol type epoxy resin: manufactured by Shin-A T&C) RE-410S (bisphenol A type epoxy resin: manufactured by Nippon Kayaku) YDF-870GS (bisphenol F type epoxy resin: manufactured by Nippon Steel Chemical & Material) YDF-8170 (bisphenol F type epoxy resin: manufactured by Nippon Steel Chemical & Material) EP-3980S (aminophenol type epoxy resin: manufactured by ADEKA) YX-7400N (polytetramethylene glycol diglycidyl ether: manufactured by Mitsubishi Chemical)

[0066] (B) Curing agent ・2MZA (imidazole curing accelerator: manufactured by Shikoku Chemical Industry Co., Ltd.) ・2P4MZ (imidazole curing accelerator: manufactured by Shikoku Chemical Industry Co., Ltd.) ・MEH-8005 (phenol novolac resin: manufactured by UBE) ・MEH-8000H (phenol novolac resin: manufactured by UBE) ・HN-5500 (methylhexahydrophthalic anhydride: manufactured by Resonac) ・MH-700 (mixture of 70% 4-methylhexahydrophthalic anhydride and 30% hexahydrophthalic anhydride: manufactured by New Japan Chemical Co., Ltd.)

[0067] (C) Inorganic fillers SE2200-SME (methacrylic surface-treated silica filler, average particle size 0.5 μm, manufactured by Admatechs) SE605H-SMG (methacrylic surface-treated silica filler, average particle size 2.0 μm, manufactured by Admatechs) KE-S-30-HG (silica filler, average particle size 0.3 μm, manufactured by Nippon Shokubai) YA050C-SM1 (methacrylic surface-treated silica filler, average particle size 0.05 μm: manufactured by Admatechs) AG2051-SXM (phenylamino surface-treated alumina filler, average particle size: 1 μm, manufactured by Admatechs)

[0068] (D) Vinyl Polymer The vinyl polymer defoamers listed below were used as the vinyl polymer raw material for preparing the LCM materials in the examples. The amount listed in the (D) vinyl polymer column in Tables 1 to 4 refers to the amount of the (D) vinyl polymer, which is the active ingredient (defoaming component) contained in the vinyl polymer defoamer. For example, if an LCM material is prepared using 3 parts by mass of LHP-90 as the raw material, the amount listed in the (D) vinyl polymer column in the tables would be 1.5 parts by mass (= 3 parts by mass × 0.5 (the content of the vinyl polymer, which is the active ingredient)). The same applies to the amount listed in the (D') other defoamer component column in the tables. Note that if the active ingredient content of the defoamers listed below is less than 100%, the remaining components other than the defoaming component contained in the defoamer are all solvents. SN-353 (mixture of vinyl polymer and butyl acetate (boiling point 126°C): vinyl polymer content: 32% by mass: manufactured by San Nopco), number average molecular weight 36,600; BYK-1759 (mixture of foam-breaking polymer and ethyl acetate (boiling point 77°C): vinyl copolymer content: 52% by mass: manufactured by BYK-Chemie), number average molecular weight 42,000; LHP-90 (mixture of vinyl polymer and aromatic hydrocarbon (boiling point 155°C): vinyl polymer content: 50% by mass: manufactured by Kusumoto Chemicals), number average molecular weight 2,060

[0069] (D') Other Antifoaming Components The antifoaming agents listed below were used as raw materials for the other antifoaming components (active components contained in antifoaming agents) used in preparing the LCM materials of the comparative examples. Note that when the content of the active component in any of the antifoaming agents listed below is less than 100%, the remaining components other than the antifoaming components contained in the antifoaming agent are all solvents.・AF98 (silicone-based defoaming agent: manufactured by Asahi Kasei Wacker Silicone, active ingredient content: 100%) ・L-1982N (acrylic-based defoaming agent: manufactured by Kusumoto Chemicals, active ingredient content: 100%) ・SEI-W01 (acrylic-based defoaming agent: manufactured by Kusumoto Chemicals, active ingredient content: 100%) ・BYK-392 (acrylic-based defoaming agent: manufactured by BYK-Chemie, active ingredient content: 52%) ・BYK-354 (acrylic-based defoaming agent: manufactured by BYK-Chemie, active ingredient content: 51%) ・UVX-36 (acrylic-based defoaming agent: manufactured by Kusumoto Chemicals, active ingredient content: 100%) ・L-1980N (acrylic-based defoaming agent: manufactured by Kusumoto Chemicals, active ingredient content: 100%)・L-1984N (acrylic defoamer: manufactured by Kusumoto Chemicals, active ingredient content: 100%) ・LF-1982 (acrylic defoamer: manufactured by Kusumoto Chemicals, active ingredient content: 50%) ・SN-348 (acrylic defoamer: manufactured by San Nopco, active ingredient content: 40%) ・BYK-057 (foam-breaking polymer-based defoamer: manufactured by BYK, active ingredient content: 44%) ・BYK-1794 (foam-breaking polymer-based defoamer: manufactured by BYK, active ingredient content: 100%) ・BYK-1795 (foam-breaking polymer-based defoamer: manufactured by BYK, active ingredient content: 99%) ・BYK-1799 (defoamer containing hydrophobic particles and defoaming polysiloxane: manufactured by BYK, active ingredient content: 98%) BYK-1788 (Antifoaming agent containing surfactants: BYK, active ingredient content: 98%) BYK-1790 (Polyolefin-based antifoaming agent: BYK, active ingredient content: 100%)

[0070] 3. Various Measurement and Evaluation Methods The LCM materials of each Example and Comparative Example were evaluated for half-shot testing, warpage, defoaming time, and reliability. The viscosity and gel time of the LCM materials, as well as the glass transition temperature (Tg) and modulus of elasticity of the cured LCM materials, were also measured. Details of these measurement and evaluation methods are described below.

[0071] (Half-Shot Test) A half-shot test was conducted using a compression molding machine to evaluate mold flash. The half-shot test involves compression molding under molding conditions in which the amount of LCM material supplied in the LCM material supply step ( FIG. 1(A) ) is reduced and the pressure load in the heating and pressurizing step ( FIG. 1(E) ) is reduced, compared to the actual molding conditions (molding conditions used to manufacture actual products such as semiconductor devices) that may cause mold flash. Therefore, compared to compression molding under actual molding conditions, the maximum diameter of the cured LCM material formed on the substrate after the heating and pressurizing step ( FIG. 1(E) ) can be made smaller, allowing the evaluation test to be conducted while reliably preventing mold flash, which could damage the compression molding machine. In addition, because there is an extremely strong correlation between the maximum diameter Dh of the cured LCM material after the heating and pressurizing step in the half-shot test (Figure 1(E)) and the maximum diameter Dr of the cured LCM material after compression molding under actual molding conditions, the value of the maximum diameter Dh measured in the half-shot test can be used to very accurately predict whether mold flash will occur when compression molding is performed under actual molding conditions. As explained above, the half-shot test is a test that can indirectly and simulate the occurrence of mold flash without damaging the compression molding equipment.

[0072] The half-shot test was performed using the following procedure. First, the upper and lower molds of the compression molding machine were preheated to 120°C. Next, a release film was supplied to the upper mold of the compression molding machine and attached to the upper mold. A predetermined amount of LCM material was supplied to the center of a silicon wafer with a diameter of 300 mm and a thickness of 780 μm, and then the silicon wafer was placed in the lower mold of the compression molding machine. Next, the lower mold was raised to a position of 124 mm, and the sealed space formed between the upper and lower molds was degassed for 10 seconds. After that, while continuing to degas the sealed space, mold clamping was initiated until the gap between the upper and lower molds was 500 μm. Degassing was then terminated simultaneously with the completion of mold clamping. Next, the clamping force was set to 10 kN and held for 800 seconds to cure the LCM material. The mold was then opened, and the maximum diameter of the cured LCM material formed on the removed silicon wafer was measured.

[0073] The test conditions for the half-shot test were as follows: Compression molding machine: Model: WCM-300, manufactured by Apic Yamada Vacuum pump (Model: NeoDry15E, manufactured by Kashiyama Kogyo) Mold temperature: 120°C (set value) Cure time: 800 seconds (set value) Clamping force: 10 kN (set value) Vacuum pressure: 200 hPa (set value) Vacuum setting: static degassing Release film: TBM (manufactured by TOWA Corporation) Mold thickness: 500 μm (set value) Amount of LCM material supplied: 11.2 cm ３

[0074] It has been confirmed that when the maximum diameter of the cured product is 280 mm or more, mold flash almost certainly occurs when compression molding is performed under the molding conditions used to manufacture actual products such as semiconductor devices using the compression molding apparatus used in the half-shot test described above. Therefore, it is considered that mold flash can be easily suppressed if the maximum diameter is less than 280 mm, and furthermore, the smaller the maximum diameter is below 280 mm, the more reliably mold flash can be suppressed.

[0075] (Amount of Warpage) A resin layer made of an LCM material having a diameter of 292 mm and a thickness of 500 μm was formed on a silicon wafer having a diameter of 300 mm and a thickness of 780 μm using a mold, and then this resin layer was heat-cured for 60 minutes at 150° C. to prepare a sample for warpage evaluation. Next, this sample was placed on a horizontal table with the surface on which the cured layer made of the LCM material was formed facing up, and the maximum distance from the surface of the table to the underside of the outer circumferential edge of the sample was measured using a ruler, and this value was taken as the amount of warpage.

[0076] (Defoaming Time) Liquid resin compositions were prepared by mixing and stirring the raw materials using a roll mill to obtain the blending amounts shown in Tables 1 to 4. Next, 500 g of this liquid resin composition was stirred and defoamed using a hard mixer (model number: UVR10L) at room temperature (25°C) at a stirring speed of 20 rpm under a vacuum of 200 Pa or less to prepare LCM materials. At this time, the stirring and defoaming process was stopped 60 minutes after the start of the stirring and defoaming process, and the LCM material was visually inspected for residual air bubbles. If sufficient air bubbles remained, the stirring and defoaming process was resumed, and then visually inspected again 10 minutes later for residual air bubbles. Visual inspection for air bubbles and the subsequent 10-minute stirring and defoaming process were alternately repeated until substantially no air bubbles remained in the LCM material. The cumulative stirring and defoaming process time until substantially no air bubbles remained in the LCM material was defined as the defoaming time.

[0077] (Reliability Evaluation) A specified amount of the prepared LCM material was supplied onto a silicon wafer with a diameter of 300 mm and a thickness of 780 μm on which a semiconductor element was arranged, and then compression-molded under specified conditions using a compression molding device to encapsulate the semiconductor element. Subsequently, the semi-finished product obtained by compression molding was heat-cured at 150° C. for 60 minutes to prepare a sample for reliability evaluation. The conditions used for compression molding were as follows: Compression molding equipment: Model: WCM-300, manufactured by Apic Yamada Vacuum pump (Model: NeoDry15E, manufactured by Kashiyama Kogyo) Mold temperature: 120°C (set value) Cure time: 800 seconds (set value) Clamping force: 250 kN (set value) Vacuum pressure: 200 hPa (set value) Vacuum setting: static degassing Release film: TBM (manufactured by TOWA Corporation) Mold thickness: 500 μm (set value) LCM material supply amount: 33.5 cm ３

[0078] Next, the reliability evaluation samples thus prepared were examined using a scanning ultrasonic microscope to observe the vicinity of the interface between the semiconductor element and the encapsulant (cured LCM material) that encapsulated it, to determine whether delamination had occurred at the interface between the semiconductor element and the encapsulant. The evaluation criteria were as follows: A: No delamination was observed at the interface between the semiconductor element and the encapsulant. B: Delamination was observed in at least a portion of the interface between the semiconductor element and the encapsulant. Note that for cases in which the maximum diameter of the cured product in the half-shot test was 280 mm or greater (Comparative Example 1-17 shown in Table 3-4), mold flash would almost certainly occur when compression molding was performed under the molding conditions listed above, which simulate the molding conditions used to manufacture actual products, so reliability evaluation was not performed.

[0079] (Viscosity at 25° C.) The viscosity of the LCM material at 25° C. was measured using a Brookfield HB type viscometer at 25° C. and 10 rpm.

[0080] (Viscosity at 120° C.) The viscosity of the LCM material at 120° C. was measured using a MARS rheometer manufactured by HAAKE in an oscillation strain control mode after applying vibrations at a frequency of 10 Hz to the LCM material at 120° C. for 40 seconds.

[0081] (Gel time) The gel time of the LCM material was measured using an automatic curing time measuring device "MADOKA" (model number: MDK023) manufactured by Cyber ​​Corporation and a stirring rod (model number: 5TC-72890) under the following conditions: sample volume 0.3 ml, rotation 120 rpm, revolution 50 rpm, gap 0.3 mm, and test temperature 120°C.

[0082] (Glass Transition Temperature (Tg)) The LCM material was heat-cured at 150°C for 60 minutes to obtain a cured product. Next, the loss tangent (tanδ) of this cured product was measured at different temperatures using a DMS6100 from Seiko Instruments (SII) Inc. using a DMA (Dynamic Mechanical Analysis) method. The temperature at which tanδ reached its maximum value was determined as the glass transition temperature of the cured product.

[0083] (Elastic Modulus) The LCM material was heat-cured at 150°C for 60 minutes to obtain a cured product. Next, the storage modulus of this cured product was measured at various temperatures by the DMA method using a DMS6100 manufactured by SII Corporation. The storage modulus at 30°C was used as the elastic modulus value shown in the table.

[0084] 4. Evaluation Results Tables 1 to 4 show the compounding compositions of the LCM materials of the examples and comparative examples, as well as the results of various measurements and evaluations of these LCM materials and their cured products.

[0085]

[0086]

[0087]

[0088]

[0089] REFERENCE SIGNS LIST 10 Substrate 20 LCM material supply means 30 LCM material 100 Compression molding device 110 Lower mold 120 Upper mold 122 Release film S Sealed space B Air bubble

Claims

1. A liquid compression molding material comprising: (A) an epoxy resin; (B) a curing agent; (C) an inorganic filler; and (D) a vinyl polymer.

2. The liquid compression molding material according to claim 1, wherein the content of the vinyl polymer (D) relative to 100 parts by mass of the epoxy resin (A) is 0.004 parts by mass to 15 parts by mass.

3. The liquid compression molding material according to claim 1 or 2, wherein the content of the vinyl polymer (D) relative to 100 parts by mass of the epoxy resin (A) is 0.5 parts by mass to 15 parts by mass.

4. A liquid compression molding material according to any one of claims 1 to 3, wherein the mixing ratio of the inorganic filler (C) to all components constituting the liquid compression molding material is 60% by mass to 90% by mass.

5. The liquid compression molding material according to any one of claims 1 to 4, wherein the vinyl polymer (D) comprises at least one vinyl ether polymer.

6. The liquid compression molding material according to any one of claims 1 to 5, wherein the vinyl polymer (D) has a number average molecular weight of 1,000 to 150,000.

7. The liquid compression molding material according to any one of claims 1 to 6, further comprising (E) a solvent.

8. Pre-mixing and degassing for 90 minutes, clamping force 10 kN, liquid compression molding material supply amount 11.2 cm ３ The liquid compression molding material according to any one of claims 1 to 7, wherein the maximum diameter of the cured product of the liquid compression molding material obtained by a half-shot test performed under static degassing conditions of 200 hPa is less than 280 mm.

9. The liquid compression molding material according to any one of claims 1 to 8, wherein the epoxy resin (A) includes one or more types selected from the group consisting of aminophenol type epoxy, bisphenol A type epoxy, bisphenol F type epoxy, glycidylamine type epoxy, and polytetramethylene glycol diglycidyl ether.

10. The liquid compression molding material according to any one of claims 1 to 9, wherein the (B) hardener is an imidazole-based hardener.

11. The liquid compression molding material according to any one of claims 1 to 10, having a viscosity at 120°C of 0.3 Pa·s to 30 Pa·s.

12. An electronic component comprising an encapsulant made of a cured product of the liquid compression molding material according to any one of claims 1 to 11.

13. A semiconductor device comprising: a substrate; a semiconductor element disposed on the substrate; and a cured product of the liquid compression molding material according to any one of claims 1 to 11, sealing a gap between the semiconductor element and the substrate.

14. A method for producing an electronic component, comprising at least a step of compression molding using the liquid compression molding material according to any one of claims 1 to 11, to produce an electronic component comprising a substrate, an element disposed on the substrate, and a sealant made of a hardened product of the liquid compression molding material that seals any gap between the element and the substrate.

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