Laser processing machine

Abstract

[Problem] A workpiece having a slug that has not fallen may cause damage to a secondary processing tool during secondary processing. [Solution] One aspect of the present invention provides a laser processing machine that subjects a workpiece to laser processing. The laser processing machine is provided with a table that has a plurality of protruding portions and that supports the workpiece using the protruding portions. The laser processing machine is provided with a laser head that subjects the workpiece supported by the table to laser processing by irradiating the workpiece with a laser beam. The laser processing machine is provided with a line laser that projects a linear laser beam onto the workpiece supported by the table. The laser processing machine is provided with an imaging unit that takes an image of the workpiece supported by the table. The line laser projects the linear laser beam, which extends in a second direction orthogonal to a first direction of the workpiece, with respect to a plurality of projection positions in the first direction of the workpiece. The imaging unit takes an image of a projection pattern of the linear laser beam projected by the line laser.

Description

laser processing machine

[0001] The present invention relates to a laser processing machine.

[0002] As described in Patent Document 1, a laser processing machine supports a workpiece on a table with multiple protrusions, and a laser head placed on the table irradiates the workpiece on the table with laser light to process it.

[0003] The laser processing machine of Patent Document 1 is equipped with a tool for secondary processing of a workpiece that has been processed with a laser. This laser processing machine may perform, for example, drilling, which irradiates a laser beam along a predetermined path to create holes in the workpiece as pilot holes for secondary processing. Usually, the unnecessary parts cut out from the workpiece by drilling are dropped from the workpiece and removed.

[0004] Patent No. 6582552

[0005] If the position of the protrusion overlaps with the position of the hole, the unnecessary part cut out from the workpiece by drilling may be obstructed by the protrusion and get stuck in the hole, preventing it from falling. Also, if a cutting defect occurs, the unnecessary part cut out from the workpiece may be welded to the workpiece and not fall out. A workpiece in which the unnecessary part cut out from the workpiece does not fall out can be a cause of damage to the secondary processing tool during secondary processing.

[0006] Furthermore, if chips generated by laser processing remain on the workpiece, the chips may cause dents during secondary processing.

[0007] One aspect of the present invention is a laser processing machine that laser processes a workpiece. The laser processing machine includes a table having a plurality of protrusions that support the workpiece using the protrusions. The laser processing machine includes a laser head that irradiates the workpiece supported on the table with laser light to laser process the workpiece. The laser processing machine includes a line laser that projects linear laser light onto the workpiece supported on the table. The laser processing machine includes an imaging unit that images the workpiece supported on the table. The line laser projects linear laser light that extends in a second direction perpendicular to the first direction of the workpiece to a plurality of projection positions in a first direction of the workpiece. The imaging unit images the projection pattern of the linear laser light projected by the line laser.

[0008] According to one aspect of the present invention, the laser processing machine allows the user to determine whether there is any abnormality in the workpiece based on the projection pattern that appears in the image captured by the imaging unit.

[0009] The laser processing machine may include a gantry that is movably provided above the workpiece. The line laser and the imaging unit may be provided on the gantry. The line laser may be capable of projecting linear laser light at a plurality of projection positions by moving the gantry. The imaging unit may be capable of capturing images of the projection pattern at the plurality of projection positions by moving the gantry. According to this aspect, the laser processing machine can align the line laser and the imaging unit to the projection positions by utilizing the operation of the gantry.

[0010] The laser processing machine may include a gantry movably provided above the workpiece. The laser head may be provided on the gantry. The line laser and the imaging unit may be provided on the laser head. The line laser may be capable of projecting linear laser light at multiple projection positions by moving the gantry. The imaging unit may be capable of capturing images of projection patterns at multiple projection positions by moving the gantry. According to this aspect, the laser processing machine can align the line laser and the imaging unit at the projection positions by utilizing the operation of the gantry on which the laser head is provided.

[0011] The laser processing machine may include a gantry movably provided above the workpiece. The laser processing machine may include a secondary processing tool provided on the gantry for secondary processing the laser-processed workpiece. The line laser and the imaging unit may be provided on the secondary processing tool. The line laser may be capable of projecting linear laser light at multiple projection positions by moving the gantry. The imaging unit may be capable of capturing images of projection patterns at multiple projection positions by moving the gantry. According to this aspect, the laser processing machine can align the line laser and the imaging unit at the projection positions by utilizing the operation of the gantry on which the secondary processing tool is provided.

[0012] The laser processing machine may include a transport device that transports a laser-machined workpiece in a first direction. The laser processing machine may include a secondary processing tool that performs secondary processing on the workpiece transported by the transport device. The line laser and the imaging unit may be provided on a transport path of the transport device. The line laser may be capable of projecting linear laser light at multiple projection positions as the workpiece is transported by the transport device. The imaging unit may be capable of capturing images of projection patterns at multiple projection positions as the workpiece is transported by the transport device. According to this aspect, the laser processing machine can align the line laser and the imaging unit at the projection positions by utilizing the operation of transporting the workpiece by the transport device.

[0013] The laser processing machine may include a transport device that transports a laser-machined workpiece in a first direction. The laser processing machine may include a secondary processing tool that performs secondary processing on the workpiece transported by the transport device. The line laser and the imaging unit may be provided on the secondary processing tool. The line laser may be capable of projecting linear laser light at multiple projection positions as the workpiece is transported by the transport device. The imaging unit may be capable of capturing images of projection patterns at multiple projection positions as the workpiece is transported by the transport device. According to this aspect, the laser processing machine can align the line laser and the imaging unit at the projection positions by utilizing the operation of transporting the workpiece by the transport device.

[0014] The imaging unit may image the workpiece at a position where the angle of the optical axis relative to the workpiece is a first angle and at a position where the angle is a second angle different from the first angle. According to this aspect, the laser processing machine can increase the possibility that, if there is an abnormality in the workpiece, the projection pattern will be captured in an abnormal state in the image.

[0015] The line laser may project linear laser light at a first position where the angle of the optical axis relative to the workpiece is a first angle and at a second position where the angle is a second angle different from the first angle. According to this aspect, the laser processing machine can increase the possibility that, when there is an abnormality in the workpiece, the projection pattern will appear abnormally in the image.

[0016] The laser processing machine may include an image analysis unit that analyzes the image captured by the imaging unit. The image analysis unit may determine whether the projection pattern shown in the image is normal. According to this aspect, the laser processing machine allows the user to determine whether there is an abnormality in the workpiece based on the analysis results by the image analysis unit.

[0017] The image analysis unit may determine that there is no abnormality in the laser-processed workpiece when the projection pattern shown in the image is normal. According to this aspect, the laser processing machine can make the user recognize whether there is an abnormality in the workpiece based on the analysis results by the image analysis unit.

[0018] The laser head may be capable of performing a drilling process to form a hole in a workpiece by irradiating the workpiece with laser light along a predetermined closed path. The image analysis unit may determine that the hole is through-hole when the projection pattern shown in the image is normal. According to this aspect, the laser processing machine can allow a user to recognize whether the hole is through-hole based on the analysis result by the image analysis unit.

[0019] The laser head may be capable of performing drilling to form a hole in the workpiece by irradiating the laser beam along a predetermined closed path. The image analysis unit may determine that no slug remains in the hole when the projection pattern shown in the image is normal. According to this aspect, the laser processing machine can allow the user to recognize whether or not slug remains in the hole based on the analysis results by the image analysis unit.

[0020] The image analysis unit may determine that there are no chips on the surface of the laser-processed workpiece when the projection pattern shown in the image is normal. According to this aspect, the laser processing machine can make the user recognize whether there are any chips on the surface of the workpiece based on the analysis results by the image analysis unit.

[0021] The line laser may project linear laser light at a first projection position in a first direction and at a second projection position different from the first projection position. The imaging unit may image the workpiece at the first projection position and the second projection position. The image analysis unit may analyze an image obtained by combining a first image captured at the first projection position and a second image captured at the second projection position. According to this aspect, the laser processing machine allows a user to determine whether there is any abnormality in the workpiece shown in the combined image based on the analysis results by the image analysis unit.

[0022] The line laser may project, as the linear laser beam, a first linear laser beam extending in a first direction and a second linear laser beam extending in a second direction. The image analysis unit may combine the first image and the second image based on a projection pattern of the first linear laser beam appearing in the image. According to this aspect, the image analysis unit can accurately combine the first image and the second image.

[0023] The laser processing machine may include, as the line laser, a first line laser and a second line laser arranged alongside the first line laser in the second direction. The laser processing machine may include, as the imaging unit, a first imaging unit that fits a projection pattern projected by the first line laser within an angle of view, and a second imaging unit that fits a projection pattern projected by the second line laser within an angle of view. The image analysis unit may analyze an image that is a composite of a first image captured by the first imaging unit and a second image captured by the second imaging unit. According to this aspect, the laser processing machine allows a user to determine whether there are any abnormalities over a wide area in the second direction based on the analysis results by the image analysis unit.

[0024] 12 is a diagram showing an example of a laser processing machine 100 according to the present embodiment. FIG. 13 is a diagram showing an example of a line laser unit 140 shown in FIG. 1. FIG. 14 is a diagram showing an example of a line laser unit 140 shown in FIG. 1. FIG. 15 is a diagram showing an example of a workpiece W1 that appears in an image captured by the imaging section 142 shown in FIGS. 2 and 3. FIG. 16 is a diagram showing an example of image analysis processing by the image analysis section 151. FIG. 17 is a diagram showing an example of a workpiece W1 that appears in an image after cutout processing. FIG. 18 is a diagram showing an example of a workpiece W1 that appears in an image after synthesis. FIG. 19 is a diagram showing an example of an image analysis processing by the image analysis section 151. FIG. 19 is a diagram showing an example of an image analysis processing by the image analysis section 151. FIG. 20 is a diagram showing an example of an image analysis processing by the image analysis section 151. FIG. 21 is a diagram showing an example of an image analysis processing by the image analysis section 151. FIG. 22 is a diagram showing an example of an image analysis processing by the image analysis section 151. 31 is a diagram showing an example of the line laser unit 140 shown in FIG. 17. FIG. 31 is a diagram showing an example of the line laser unit 140 shown in FIG. 17. FIG. 31 is a diagram showing an example of the line laser unit 140 shown in FIG. 17. FIG. 31 is a diagram showing an example of the workpiece W1 that appears in an image captured at a first position in the Y direction. FIG. 31 is a diagram showing an example of the workpiece W1 that appears in an image captured at a second position in the Y direction. FIG. 31 is a diagram showing an example of image analysis processing by the image analysis unit 151. FIG. 31 is a diagram showing an example of the workpiece W1 that appears in an image after cutout processing. FIG. 31 is a diagram showing an example of the workpiece W1 that appears in an image obtained by combining two images after cutout processing. FIG. 31 is a diagram showing an example of the workpiece W1 that appears in the image after combination. FIG. 31 is a diagram showing an example of the configuration of the line laser 141 and the imaging unit 142. FIG. 31 is a diagram showing an example of a laser processing machine 100 according to another embodiment. FIG. 31 is a diagram showing an example of a laser processing machine 100 according to another embodiment. FIG. 31 is a diagram showing an example of the laser processing machine 100 according to another embodiment.32 is a diagram showing an example of the line laser unit 140 shown in Fig. 31. FIG. ... workpiece W1 that appears in an image captured at a first position in the X direction. FIG. 32 is a diagram showing an example of the workpiece W1 that appears in an image captured at a second position in the X direction. FIG. 32 is a diagram showing an example of the workpiece W1 that appears in an image captured at a third position in the X direction. FIG. 32 is a diagram showing an example of image analysis processing by the image analysis unit 151. FIG. 32 is a diagram showing an example of the workpiece W1 that appears in an image after cutout processing. FIG. 32 is a diagram showing an example of the workpiece W1 that appears in an image obtained by combining three images after cutout processing. FIG. 32 is a diagram showing an example of the workpiece W1 that appears in the image after combination. FIG. 32 is a diagram showing an example of the laser processing machine 100 according to another embodiment.

[0025] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention according to the claims. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0026] Hereinafter, directions in the drawings will be explained using an XYZ coordinate system. In this XYZ coordinate system, the vertical direction is the Z direction, and the horizontal directions are the X and Y directions. In addition, the side of the X, Y, and Z directions indicated by the arrows will be referred to as the + side, and the opposite side as the - side.

[0027] 1 is a diagram showing an example of a laser processing machine 100 according to the present embodiment. The laser processing machine 100 is a device that performs laser processing on a plate-shaped workpiece W1. The laser processing machine 100 includes a table 110, a laser head 120, a secondary processing tool 130, a line laser unit 140, and a control device 150. The plate-shaped workpiece W1 is an example of a workpiece.

[0028] The table 110 is a member that supports the workpiece W1. The table 110 includes a base plate 111 and multiple support plates 112. The base plate 111 is a plate-shaped member. The support plate 112 is a plate-shaped member that has multiple protrusions 112P on its upper end. The support plates 112 are arranged side by side in the X direction, standing on the top surface of the base plate 111. The table 110 supports the workpiece W1 with the protrusions 112P.

[0029] The laser head 120 is a device that irradiates a laser beam onto the workpiece W1 supported on the table 110 to perform laser processing on the workpiece W1. The laser head 120 is provided on the first gantry 101. The laser head 120 shown in FIG. 1 is provided on the first gantry 101 via a first lifting unit 103 and a first slider 102. The laser head 120 is capable of performing drilling processing to form a hole by irradiating a laser beam along a predetermined closed path on the plate surface BF of the workpiece W1.

[0030] The first gantry 101 is a device that is provided so as to be movable in the X direction above the workpiece W1 supported on the table 110. The first gantry 101 shown in Fig. 1 is provided across the first frame F1 and the second frame F2 of the laser processing machine 100. The first gantry 101 shown in Fig. 1 moves in the X direction while being guided by X guides G1 provided on the upper surfaces of the first frame F1 and the second frame F2.

[0031] The first slider 102 is a device that is provided above the workpiece W1 so as to be movable in the Y direction. The first slider 102 shown in Fig. 1 is provided from the upper surface of the first gantry 101 to the surface on the -X side. The first slider 102 shown in Fig. 1 moves in the Y direction while being guided by a Y guide G2 provided on the upper surface of the first gantry 101.

[0032] The first lifting unit 103 is a device that is provided above the workpiece W1 and is movable in the Z direction. The first lifting unit 103 shown in Fig. 1 is provided on the side surface of the first slider 102. The first lifting unit 103 shown in Fig. 1 moves in the Z direction while being guided by a Z guide G3 provided on the side surface of the first slider 102.

[0033] The laser head 120 shown in Fig. 1 is attached to the first lifting unit 103. The laser head 120 shown in Fig. 1 moves in the X direction above the workpiece W1 supported on the table 110 as the first gantry 101 moves in the X direction. The laser head 120 shown in Fig. 1 moves in the Y direction above the workpiece W1 supported on the table 110 as the first slider 102 moves in the Y direction. The laser head 120 shown in Fig. 1 moves in the Z direction above the workpiece W1 supported on the table 110 as the first lifting unit 103 moves in the Z direction.

[0034] The secondary processing tool 130 is a tool that performs secondary processing on the laser-machined workpiece W1. The secondary processing tool 130 is provided on the second gantry 104. The secondary processing tool 130 shown in FIG. 1 is provided on the second gantry 104 via the second lifting unit 106 and the second slider 105.

[0035] The second gantry 104 is a device that is provided so as to be movable in the X direction above the workpiece W1 supported on the table 110. The second gantry 104 shown in Fig. 1 is provided across the first frame F1 and the second frame F2 of the laser processing machine 100. The second gantry 104 shown in Fig. 1 moves in the X direction while being guided by an X guide G1.

[0036] The second slider 105 is a device that is provided above the workpiece W1 and is movable in the Y direction. The second slider 105 shown in Fig. 1 is provided from the upper surface of the second gantry 104 to the surface on the -X side. The second slider 105 shown in Fig. 1 moves in the Y direction while being guided by a Y guide G2 provided on the upper surface of the second gantry 104.

[0037] The second lifting unit 106 is a device that is provided above the workpiece W1 and is movable in the Z direction. The second lifting unit 106 shown in Fig. 1 is provided on the side surface of the second slider 105. The second lifting unit 106 shown in Fig. 1 moves in the Z direction while being guided by a Z guide G3 provided on the side surface of the second slider 105.

[0038] The secondary processing tool 130 shown in Fig. 1 is attached to the second lifting unit 106. The secondary processing tool 130 shown in Fig. 1 moves in the X direction above the workpiece W1 supported on the table 110 as the second gantry 104 moves in the X direction. The secondary processing tool 130 shown in Fig. 1 moves in the Y direction above the workpiece W1 supported on the table 110 as the second slider 105 moves in the Y direction. The secondary processing tool 130 shown in Fig. 1 moves in the Z direction above the workpiece W1 supported on the table 110 as the second lifting unit 106 moves in the Z direction.

[0039] The line laser unit 140 is a device that projects a linear laser beam and captures an image of the projected linear laser beam pattern. The line laser unit 140 is provided at an arbitrary position above the workpiece W1. The line laser unit 140 shown in FIG. 1 is provided at a position on the support frame SF that allows it to capture an image of the entire workpiece W1.

[0040] 2 and 3 are diagrams showing an example of the line laser unit 140 shown in Fig. 1. The line laser unit 140 includes a line laser 141 and an imaging unit 142.

[0041] The line laser 141 is a device that projects a linear laser beam LL onto the plate surface BF of the workpiece W1 supported on the table 110. The line laser 141 shown in Figures 2 and 3 projects a linear laser beam LL that extends in the X direction of the plate surface BF of the workpiece W1. The line laser 141 is driven by a drive unit (not shown) and is provided so that its posture can be changed. The line laser 141 can project the linear laser beam LL onto a plurality of projection positions by changing its posture and changing the direction of its optical axis.

[0042] The imaging unit 142 is a device that images the plate surface BF of the workpiece W1 supported on the table 110. The imaging unit 142 images the plate surface BF of the workpiece W1 by fitting the pattern of the linear laser light LL projected by the line laser 141 within the angle of view AV. As described above, the line laser unit 140 shown in FIG. 1 is provided at a position on the support frame SF where the entire workpiece W1 can be imaged. Therefore, the imaging unit 142 shown in FIGS. 2 and 3 can image the entire plate surface BF of the workpiece W1.

[0043] Fig. 4 is a diagram showing an example of the workpiece W1 shown in an image captured by the imaging unit 142 shown in Fig. 2 and Fig. 3. The workpiece W1 shown in Fig. 4 has a first hole H1 and a second hole H2 formed by drilling. A projection pattern PP of linear laser light LL by the line laser 141 shown in Fig. 2 and Fig. 3 is projected onto the workpiece W1 shown in Fig. 4.

[0044] The second hole H2 has the slug S1 remaining and is not pierced. Normally, the slug S1 cut out of the workpiece W1 by drilling falls from the workpiece W1 and is removed. However, if the position of the protrusion 112P and the position of the hole overlap, the slug S1 may be obstructed by the protrusion 112P and get stuck in the hole, preventing it from falling. Also, if a cutting failure occurs, the slug S1 may be welded to the workpiece W1 and not fall. The second hole H2 has the slug S1 remaining and is pierced.

[0045] 2 and 3 projects linear laser light LL extending in the X direction of the plate surface BF of the workpiece W1 onto a plurality of projection positions in the Y direction of the plate surface BF of the workpiece W1. The Y direction in this embodiment is an example of a first direction. The X direction in this embodiment is an example of a second direction.

[0046] Returning to the explanation of Fig. 1, the control device 150 is a device that controls the laser processing machine 100. The control device 150 controls the first gantry 101, the first slider 102, the first lifting / lowering unit 103, and the laser head 120, thereby controlling the laser processing operation on the workpiece W1. The control device 150 controls the second gantry 104, the second slider 105, the second lifting / lowering unit 106, and the secondary processing tool 130, thereby controlling the secondary processing operation on the workpiece W1.

[0047] A CPU (Central Processing Unit) (not shown) of the control device 150 functions as an image analysis unit 151. The image analysis unit 151 is a software module that analyzes the image captured by the imaging unit 142.

[0048] Fig. 5 is a diagram showing an example of image analysis processing by the image analysis unit 151. After the linear laser light LL is projected and images are captured at all of the predetermined projection positions, the image analysis unit 151 executes the processing shown in Fig. 5.

[0049] First, the image analysis unit 151 cuts out and processes the area in which the projection pattern PP appears in each of the multiple images (S101).

[0050] 6 is a diagram showing an example of the workpiece W1 shown in the image after cutout processing. In S101, the image analysis unit 151 determines, for example, that a high-brightness linear portion extending in the X direction of the workpiece W1 in the image is the projection pattern PP. Then, the image analysis unit 151 cuts out a specific range of area in the Y direction of the workpiece W1, for example, based on the area in which the projection pattern PP appears. The specific range of area cut out in one image is set so as not to overlap with the specific range of area cut out in another image, for example.

[0051] Next, the image analysis unit 151 synthesizes the cut-out images (S102).

[0052] 7 is a diagram showing an example of the workpiece W1 shown in the combined image. In S102, the image analysis unit 151 combines the images so that the processed images are connected in the Y direction of the workpiece W1, for example, in the order in which they were captured by the imaging unit 142.

[0053] Next, the image analysis unit 151 determines whether there is an interrupted projection pattern PP in the workpiece W1 that appears in the combined image (S103). In S103, the image analysis unit 151 determines that the projection pattern PP is interrupted, for example, if the linear portion determined to be the projection pattern PP is not continuous.

[0054] Here, when the linear laser beam LL is projected so as to pass through a non-penetrating hole, the linear laser beam LL is also projected onto the surface of the slug S1 remaining in the hole. The position of the linear laser beam LL projected onto the surface of the slug S1 is different in the Y direction from the position of the linear laser beam LL projected onto the plate surface BF of the workpiece W1. Therefore, a projection pattern PP projected so as to pass through a non-penetrating hole is likely to have a pattern in which an interrupted line is visible in the hole area in the image captured by the imaging unit 142. The image analysis unit 151 determines that a projection pattern PP in which an interrupted line is visible in the hole area is interrupted. For example, even if the hole is not penetrating, as in the first hole H1 shown in FIG. 7, the image analysis unit 151 determines that a projection pattern PP passing through the first hole H1 is interrupted.

[0055] On the other hand, when the linear laser light LL is projected so as to pass through a through-hole, the linear laser light LL is not projected in the area of ​​the hole. Therefore, the projection pattern PP projected so as to pass through the through-hole is likely to become a pattern in which no lines are visible in the area of ​​the hole in the image captured by the imaging unit 142. The image analysis unit 151 determines that the projection pattern PP in which no lines are visible in the area of ​​the hole is interrupted. For example, in the case of a through-hole like the second hole H2 shown in FIG. 7, the image analysis unit 151 determines that the projection pattern PP passing through the second hole H2 is interrupted.

[0056] If there is an interrupted projection pattern PP in S103 (S103; NO), the image analysis unit 151 determines whether there is a discontinuous line at the interrupted portion (S104).

[0057] As described above, a projection pattern PP projected to pass through a non-through hole is likely to result in a pattern in which an interrupted line is visible in the hole region in the image captured by the imaging unit 142. For example, if a high-brightness linear pattern is present within a predetermined range in the Y direction of the workpiece W1, based on the position where the projection pattern PP is interrupted, the image analysis unit 151 determines that a discontinuous line exists at the interrupted point. For example, a projection pattern PP passing through the first hole H1 shown in FIG. 7 has a high-brightness linear pattern LP near the Y direction of the workpiece W1, based on the position where the projection pattern PP is interrupted. For a projection pattern PP in which a high-brightness linear pattern LP is visible in the hole region, the image analysis unit 151 determines that a discontinuous line exists at the interrupted point. For example, if the hole is not completely through, such as the first hole H1 shown in Figure 7, the image analysis unit 151 determines that there is a discontinuous line at the interrupted point in the projection pattern PP that passes through the first hole H1.

[0058] On the other hand, as described above, a projection pattern PP projected to pass through a through-hole is likely to result in a pattern in which no lines are visible in the hole area in the image captured by the imaging unit 142. For example, if there is no high-brightness linear pattern within a predetermined range in the Y direction of the workpiece W1, based on the position where the projection pattern PP ends, the image analysis unit 151 determines that there is no discontinuous line at the interruption. For example, in the projection pattern PP passing through the second hole H2 shown in FIG. 7, there is no high-brightness linear pattern LP near the Y direction of the workpiece W1, based on the position where the projection pattern PP ends. For a projection pattern PP in which no high-brightness linear pattern LP is visible in the hole area, the image analysis unit 151 determines that there is no discontinuous line at the interruption. For example, when a hole is through like the second hole H2 shown in Figure 7, the image analysis unit 151 determines that there are no discontinuous lines at the interrupted points in the projection pattern PP that passes through the second hole H2.

[0059] If there is no interrupted projection pattern PP in S103 (S103; NO), the image analysis unit 151 determines that the projection pattern PP is normal (S105), and ends the processing shown in FIG.

[0060] Even if the projection pattern PP is interrupted, if there are no discontinuous lines in S104 (S104; NO), the image analysis unit 151 determines that the projection pattern PP is normal (S105) and ends the processing shown in Figure 5.

[0061] In S105, the image analysis unit 151 may indicate that the projection pattern PP is normal by outputting the information to an output device (not shown). The output device receives data from the control device 150 and physically presents the information externally in a form that can be recognized by humans.

[0062] If there are discontinuous lines in S104 (S104; YES), the image analysis unit 151 determines that the projection pattern PP is abnormal (S106), and ends the processing shown in Fig. 5. In S106, the image analysis unit 151 may present the fact that the projection pattern PP is abnormal by causing an output device (not shown) to output the information.

[0063] As described above, the laser processing machine 100 of this embodiment is an apparatus for laser processing a workpiece W1. The laser processing machine 100 includes a table 110 having a plurality of protrusions 112P and supporting the workpiece W1 by the protrusions 112P. The laser processing machine 100 includes a laser head 120 that irradiates the workpiece W1 supported on the table 110 with laser light to laser process the workpiece W1. The laser processing machine 100 includes a line laser 141 that projects linear laser light LL onto the plate surface BF of the workpiece W1 supported on the table 110. The laser processing machine 100 includes an imaging unit 142 that images the plate surface BF of the workpiece W1 supported on the table 110. The line laser 141 projects linear laser light LL extending in the X direction of the plate surface BF of the workpiece W1 to a plurality of projection positions in the Y direction of the plate surface BF of the workpiece W1. The imaging unit 142 captures an image of the plate surface BF of the workpiece W1 by fitting the projection pattern PP of the linear laser light LL projected by the line laser 141 within the angle of view AV.

[0064] According to this embodiment, the laser processing machine 100 can allow the user to determine whether there is any abnormality in the workpiece W1 based on the projection pattern PP that appears in the image captured by the imaging unit 142.

[0065] The laser processing machine 100 of this embodiment also includes an image analysis unit 151 that analyzes the image captured by the imaging unit 142. The image analysis unit 151 determines whether the projection pattern PP shown in the image is normal.

[0066] According to this embodiment, the laser processing machine 100 can allow the user to determine whether there is any abnormality in the workpiece W1 based on the analysis results from the image analysis unit 151.

[0067] In addition, the line laser 141 in this embodiment projects linear laser light LL at a first projection position in the Y direction and a second projection position different from the first projection position. The imaging unit 142 images the plate surface BF of the workpiece W1 at the first projection position and the second projection position. The image analysis unit 151 analyzes an image obtained by combining the first image captured at the first projection position and the second image captured at the second projection position.

[0068] According to this embodiment, the laser processing machine 100 can allow the user to determine whether there is any abnormality in the workpiece W1 shown in the synthesized image based on the analysis results from the image analysis unit 151.

[0069] Fig. 8 is a diagram showing an example of image analysis processing by the image analysis unit 151. After the linear laser light LL is projected and images are captured at all of the predetermined projection positions, the image analysis unit 151 executes the processing shown in Fig. 8. The processing of S101 to S106 shown in Fig. 8 is the same as the processing of S101 to S106 shown in Fig. 5.

[0070] After executing the process of S105, the image analysis unit 151 determines that there is no abnormality in the laser-machined workpiece W1 (S201), and ends the process shown in Fig. 8. In S201, the image analysis unit 151 may indicate that there is no abnormality in the workpiece W1 by having an output device (not shown) output the result. If it indicates that there is no abnormality in the workpiece W1 in S201, the image analysis unit 151 does not need to indicate that the projection pattern PP is normal in S105.

[0071] After executing the process of S106, the image analysis unit 151 determines that there is an abnormality in the laser-machined workpiece W1 (S202), and ends the process shown in Fig. 8. In S202, the image analysis unit 151 may indicate that there is an abnormality in the workpiece W1 by outputting the information to an output device (not shown). When indicating that there is an abnormality in the workpiece W1 in S202, the image analysis unit 151 does not need to indicate that there is an abnormality in the projection pattern PP in S106.

[0072] As described above, the image analysis unit 151 in this example determines that there is no abnormality in the laser-machined workpiece W1 when the projection pattern PP shown in the image is normal.

[0073] According to this embodiment, the laser processing machine 100 can make the user recognize whether there is any abnormality in the workpiece W1 based on the analysis results from the image analysis unit 151.

[0074] Fig. 9 is a diagram showing an example of image analysis processing by the image analysis unit 151. After the linear laser light LL is projected and images are captured at all of the predetermined projection positions, the image analysis unit 151 executes the processing shown in Fig. 9. The processing of S101 to S106 shown in Fig. 9 is the same as the processing of S101 to S106 shown in Fig. 5.

[0075] After executing the process of S105, the image analysis unit 151 determines that the hole is a through hole (S301), and ends the process shown in Fig. 9. In S301, the image analysis unit 151 may indicate that the hole is a through hole by outputting the result to an output device (not shown). When indicating that the hole is a through hole in S301, the image analysis unit 151 does not need to indicate that the projection pattern PP is normal in S105.

[0076] After executing the process of S106, the image analysis unit 151 determines that the hole does not penetrate through (S302), and ends the process shown in Fig. 9. In S302, the image analysis unit 151 may indicate that the hole does not penetrate through by outputting the information to an output device (not shown). If the image analysis unit 151 indicates that the hole does not penetrate through in S302, it is not necessary for the image analysis unit 151 to indicate that the projection pattern PP is abnormal in S106.

[0077] As described above, the laser head 120 of this embodiment is capable of performing drilling to form a hole by irradiating the workpiece W1 with laser light along a predetermined closed path on the workpiece surface BF. The image analysis unit 151 of this example determines that the hole is through when the projection pattern PP shown in the image is normal.

[0078] According to this embodiment, the laser processing machine 100 can allow the user to recognize whether the hole is through or not based on the analysis result by the image analysis unit 151.

[0079] Fig. 10 is a diagram showing an example of image analysis processing by the image analysis unit 151. After the linear laser light LL is projected and images are captured at all of the predetermined projection positions, the image analysis unit 151 executes the processing shown in Fig. 10. The processing of S101 to S106 shown in Fig. 10 is the same as the processing of S101 to S106 shown in Fig. 5.

[0080] After executing the process of S105, the image analysis unit 151 determines that no slug S1 remains in the hole (S401), and ends the process shown in Fig. 10. In S401, the image analysis unit 151 may indicate that no slug S1 remains in the hole by outputting the information to an output device (not shown). When indicating that no slug S1 remains in the hole in S401, the image analysis unit 151 does not need to indicate that the projection pattern PP is normal in S105.

[0081] After executing the process of S106, the image analysis unit 151 determines that slug S1 remains in the hole (S402), and ends the process shown in Fig. 10. In S402, the image analysis unit 151 may indicate that slug S1 remains in the hole by outputting the information to an output device (not shown). When indicating that slug S1 remains in the hole in S402, the image analysis unit 151 does not need to indicate that the projection pattern PP is abnormal in S106.

[0082] As described above, the laser head 120 of this embodiment is capable of performing drilling to form a hole by irradiating the workpiece W1 with laser light along a predetermined closed path on the plate surface BF. The image analysis unit 151 of this example determines that no slag S1 remains in the hole when the projection pattern PP displayed in the image is normal.

[0083] According to this embodiment, the laser processing machine 100 can make the user recognize whether or not slag S1 remains in the hole based on the analysis results of the image analysis unit 151.

[0084] 11 and 12 are diagrams showing an example of the configuration of the line laser 141. The line laser 141 shown in Fig. 11 and 12 projects, as linear laser light LL, a first linear laser light LL1 extending in the X direction of the plate surface BF of the workpiece W1 and a second linear laser light LL2 extending in the Y direction. The line laser 141 is driven by a drive unit (not shown) and is provided so that its posture can be changed. The line laser 141 can project the first linear laser light LL1 to a plurality of projection positions by changing its posture and changing the direction of its optical axis.

[0085] Fig. 13 is a diagram showing an example of the workpiece W1 shown in an image captured by the imaging unit 142 shown in Fig. 11 and Fig. 12. The workpiece W1 shown in Fig. 13 has a first hole H1 and a second hole H2 formed by drilling, similar to the workpiece W1 shown in Fig. 4. A first projection pattern PP1 of the first linear laser beam LL1 and a second projection pattern PP2 of the second linear laser beam LL2 by the line laser 141 shown in Fig. 11 and Fig. 12 are projected onto the workpiece W1 shown in Fig. 13.

[0086] The line laser 141 shown in Figures 11 and 12 projects a first linear laser beam LL1 extending in the X direction of the plate surface BF of the workpiece W1 to multiple projection positions in the Y direction of the plate surface BF of the workpiece W1. The line laser 141 shown in Figures 11 and 12 also projects a second linear laser beam LL2 extending in the Y direction of the plate surface BF of the workpiece W1. The Y direction in this embodiment is an example of the first direction. The X direction in this embodiment is an example of the second direction.

[0087] Fig. 14 is a diagram showing an example of image analysis processing by the image analysis unit 151. After the linear laser light LL is projected and images are captured at all of the predetermined projection positions, the image analysis unit 151 executes the processing shown in Fig. 14. The processing of S103 to S106 shown in Fig. 14 is the same as the processing of S103 to S106 shown in Fig. 5.

[0088] First, the image analysis unit 151 cuts out the areas in each of the multiple images in which the first projection pattern PP1 and the second projection pattern PP2 appear (S501).

[0089] 15 is a diagram showing an example of the workpiece W1 shown in the image after cutout processing. In S501, the image analysis unit 151 determines, for example, that a high-brightness linear portion extending in the X direction of the workpiece W1 in the image is the first projection pattern PP1. Then, the image analysis unit 151 cuts out a specific range of area in the Y direction of the workpiece W1, for example, based on the area in which the first projection pattern PP1 appears. The specific range of area cut out in one image is set so as not to overlap with the specific range of area cut out in another image, for example.

[0090] Next, the image analysis unit 151 synthesizes the cut-out images using the second projection pattern PP2 as a mark (S502).

[0091] 16 is a diagram showing an example of the workpiece W1 shown in the combined image. In S502, the image analysis unit 151 combines the processed images so that they are connected in the Y direction of the workpiece W1, for example, in the order in which they were captured by the imaging unit 142. When combining the processed images, the image analysis unit 151 determines, for example, that a high-brightness linear portion extending in the Y direction of the workpiece W1 is the second projection pattern PP2. Then, the image analysis unit 151 combines the first image and the second image so that, for example, the second projection pattern PP2 shown in the first image and the second projection pattern PP2 shown in the second image are connected in a straight line.

[0092] As described above, the line laser 141 in this example emits the first linear laser beam LL1 extending in the X direction and the second linear laser beam LL2 extending in the Y direction. The image analysis unit 151 in this example combines the first image and the second image based on the projection pattern PP of the second linear laser beam LL2 that appears in the image.

[0093] According to this example, the image analysis unit 151 can accurately combine the first image and the second image.

[0094] Fig. 17 is a diagram showing an example of a laser processing machine 100 according to another embodiment. Similar to the laser processing machine 100 shown in Fig. 1, the laser processing machine 100 shown in Fig. 17 includes a table 110, a laser head 120, a secondary processing tool 130, a line laser unit 140, and a control device 150. The line laser unit 140 shown in Fig. 17 is provided in the laser head 120.

[0095] 18 to 20 are diagrams showing an example of the line laser unit 140 shown in Fig. 17. The line laser unit 140 includes a line laser 141 and an imaging unit 142.

[0096] As described above, the laser head 120 moves in the X direction above the workpiece W1 supported on the table 110 as the first gantry 101 moves in the X direction. The line laser 141 shown in FIGS. 18 to 20 can project linear laser light LL to multiple projection positions in the X direction on the plate surface BF of the workpiece W1 as the first gantry 101 moves. The line laser 141 shown in FIGS. 18 to 20 projects, as linear laser light LL, a first linear laser light LL1 extending in the Y direction on the plate surface BF of the workpiece W1 and a second linear laser light LL2 extending in the X direction. The X direction in this embodiment is an example of a first direction. The Y direction in this embodiment is an example of a second direction.

[0097] As described above, the laser head 120 moves in the Y direction above the workpiece W1 supported on the table 110 as the first slider 102 moves in the Y direction. The line laser 141 can project the linear laser beam LL at a first position and a second position in the Y direction of the projection position as a result of the movement of the first slider 102. As shown in FIG. 18 , the line laser 141 projects the first linear laser beam LL1 onto a left half region of the workpiece W1 when viewing the workpiece W1 from the −X side at the first position in the Y direction. As shown in FIG. 19 , the line laser 141 projects the first linear laser beam LL1 onto a right half region of the workpiece W1 when viewing the workpiece W1 from the −X side at the second position in the Y direction.

[0098] The imaging unit 142 can capture images of the projection pattern PP at a plurality of projection positions by moving the first gantry 101. Furthermore, the imaging unit 142 can capture images of the projection pattern PP at a first position and a second position in the Y direction of the projection position by moving the first slider 102 at the projection position.

[0099] 21 is a diagram showing an example of a workpiece W1 captured in an image taken at a first position in the Y direction. The first projection pattern PP1 projected at the first position extends in the Y direction from the end of the workpiece W1 on the +Y side. The second projection pattern PP2 extends in the X direction.

[0100] 22 is a diagram showing an example of a workpiece W1 captured in an image taken at a second position in the Y direction. The first projection pattern PP1 projected at the second position extends in the Y direction from the end of the workpiece W1 on the -Y side. The second projection pattern PP2 extends in the X direction.

[0101] Fig. 23 is a diagram showing an example of image analysis processing by the image analysis unit 151. After the linear laser light LL is projected and images are captured at all of the predetermined projection positions, the image analysis unit 151 executes the processing shown in Fig. 23. The processing of S103 to S106 shown in Fig. 23 is the same as the processing of S103 to S106 shown in Fig. 5.

[0102] First, the image analysis unit 151 cuts out the areas in each of the multiple images in which the first projection pattern PP1 and the second projection pattern PP2 appear (S601).

[0103] 24 is a diagram showing an example of the workpiece W1 shown in the image after cutout processing. In S601, the image analysis unit 151 determines, for example, that a high-brightness linear portion extending in the Y direction of the workpiece W1 in the image is the first projection pattern PP1. Then, the image analysis unit 151 cuts out a specific range of area in the X direction of the workpiece W1, for example, based on the area in which the first projection pattern PP1 appears. The specific range of area cut out in one image is set so as not to overlap with the specific range of area cut out in another image, for example.

[0104] Next, the image analysis unit 151 combines the two cut-out images using the first projection pattern PP1 as a landmark (S602).

[0105] 25 is a diagram showing an example of the workpiece W1 appearing in an image obtained by combining two images after cutout processing. In S602, the image analysis unit 151 combines, for example, an image captured at a first position and an image captured at a second position at the same projection position in the X direction so that they are connected. When combining the two images, the image analysis unit 151 determines, for example, that a high-brightness linear portion extending in the Y direction of the workpiece W1 is the first projection pattern PP1. Then, the image analysis unit 151 combines the images so that, for example, the first projection pattern PP1 appearing in one image and the first projection pattern PP1 appearing in the other image are linearly connected.

[0106] Next, the image analysis unit 151 synthesizes all the images using the second projection pattern PP2 as a landmark (S603).

[0107] 26 is a diagram showing an example of the workpiece W1 shown in the combined image. In S603, the image analysis unit 151 combines the images so that the combined image is connected in the X direction of the workpiece W1, for example, in the order in which they were captured by the imaging unit 142. When combining the images, the image analysis unit 151 determines, for example, that a high-brightness linear portion extending in the X direction of the workpiece W1 is the second projection pattern PP2. Then, the image analysis unit 151 combines the images so that the second projection pattern PP2 shown in the first image and the second projection pattern PP2 shown in the second image are connected in a straight line.

[0108] As described above, the laser processing machine 100 of this embodiment includes the first gantry 101 that is movably provided above the workpiece W1. The laser head 120 is provided on the first gantry 101. The line laser 141 and the image capturing unit 142 are provided on the laser head 120. The line laser 141 can project linear laser light LL at multiple projection positions by moving the first gantry 101. The image capturing unit 142 can capture images of the projection pattern PP at multiple projection positions by moving the first gantry 101.

[0109] According to this embodiment, the laser processing machine 100 can align the line laser 141 and the image capturing unit 142 with the projection position by utilizing the operation of the first gantry 101 on which the laser head 120 is provided.

[0110] FIG. 27 is a diagram showing an example of the configuration of the line laser 141 and the imaging unit 142.

[0111] The line laser 141 shown in Fig. 27 is driven by a drive unit (not shown) and is provided so that its posture can be changed. The line laser 141 shown in Fig. 27 is driven by a drive unit (not shown) and can be moved to a first position where the angle of the optical axis with respect to the plate surface BF of the workpiece W1 is θ1. The line laser 141 shown in Fig. 27 is also driven by a drive unit (not shown) and can be moved to a second position where the angle of the optical axis with respect to the plate surface BF of the workpiece W1 is θ2, which is different from θ1.

[0112] The imaging unit 142 shown in Fig. 27 is driven by a drive unit (not shown) and is configured to change its posture. The imaging unit 142 shown in Fig. 27 is driven by a drive unit (not shown) and can be moved to a first position where the angle of the optical axis with respect to the plate surface BF of the workpiece W1 is θ3. The imaging unit 142 shown in Fig. 27 is also driven by a drive unit (not shown) and can be moved to a second position where the angle of the optical axis with respect to the plate surface BF of the workpiece W1 is θ2, which is different from θ1.

[0113] Even if slug S1 remains in the hole, the projection pattern PP shown in the image captured by the imaging unit 142 may appear normal due to the relationship between the angle of the optical axis of the line laser 141 and the angle of the optical axis of the imaging unit 142.

[0114] Therefore, the line laser 141 shown in FIG. 27 projects linear laser light LL at a first position and a second position. The imaging unit 142 captures an image of the projection pattern PP of the linear laser light LL projected from the first position and the projection pattern PP of the linear laser light LL projected from the second position. When the line laser 141 projects the linear laser light LL at the first position and the second position, the imaging unit 142 may capture an image of the plate surface BF of the workpiece W1 at either the first position or the second position. The image analysis unit 151 analyzes an image of the projection pattern PP projected from the first position and an image of the projection pattern PP projected from the second position. The projection pattern PP captured in the image captured by the imaging unit 142 appears differently when the linear laser light LL is projected from the first position and when the linear laser light LL is projected from the second position.

[0115] 27 captures images of the plate surface BF of the workpiece W1 at a first position and a second position. When the imaging unit 142 captures images of the plate surface BF of the workpiece W1 at the first position and the second position, the line laser 141 may project the linear laser light LL from either the first position or the second position. The image analysis unit 151 analyzes an image of the projection pattern PP projected from the first position and an image of the projection pattern PP projected from the second position. The projection pattern PP captured in the image captured by the imaging unit 142 appears differently when captured from the first position and when captured from the second position.

[0116] As described above, the imaging unit 142 in this example images the plate surface BF of the workpiece W1 at a first position where the angle of the optical axis relative to the plate surface BF of the workpiece W1 is a first angle, and at a second position where the angle is θ2, which is different from θ1.

[0117] According to this example, when there is an abnormality in the workpiece W1, the laser processing machine 100 can increase the possibility that the projection pattern PP will appear abnormally in the image.

[0118] In addition, the line laser 141 in this example projects linear laser light LL at a first position where the angle of the optical axis relative to the plate surface BF of the workpiece W1 is θ1, and at a second position where the angle is θ2, which is different from θ1.

[0119] According to this example, when there is an abnormality in the workpiece W1, the laser processing machine 100 can increase the possibility that the projection pattern PP will appear abnormally in the image.

[0120] Fig. 28 is a diagram showing an example of a laser processing machine 100 according to another embodiment. Similar to the laser processing machine 100 shown in Fig. 1, the laser processing machine 100 shown in Fig. 28 includes a table 110, a laser head 120, a secondary processing tool 130, a line laser unit 140, and a control device 150. The line laser unit 140 shown in Fig. 28 is provided on the secondary processing tool 130.

[0121] The line laser unit 140 shown in FIG. 28 includes a line laser 141 and an imaging unit 142, similar to the line laser unit 140 shown in FIGS.

[0122] As described above, the secondary processing tool 130 moves in the X direction above the workpiece W1 supported on the table 110 as the second gantry 104 moves in the X direction. The line laser 141 can project linear laser light LL to multiple projection positions in the X direction on the plate surface BF of the workpiece W1 as the second gantry 104 moves. The line laser 141 projects, for example, a first linear laser light LL1 extending in the Y direction on the plate surface BF of the workpiece W1 and a second linear laser light LL2 extending in the X direction as the linear laser light LL. The X direction in this embodiment is an example of a first direction. The Y direction in this embodiment is an example of a second direction.

[0123] As described above, the secondary processing tool 130 moves in the Y direction above the workpiece W1 supported on the table 110 as the second slider 105 moves in the Y direction. The line laser 141 can project the linear laser beam LL at a first position and a second position in the Y direction of the projection position as a result of the movement of the second slider 105. For example, as shown in FIG. 18 , the line laser 141 projects the first linear laser beam LL1 onto a left half region of the workpiece W1 when viewing the workpiece W1 from the −X side at the first position in the Y direction. For example, as shown in FIG. 19 , the line laser 141 projects the first linear laser beam LL1 onto a right half region of the workpiece W1 when viewing the workpiece W1 from the −X side at the second position in the Y direction.

[0124] The imaging unit 142 can capture images of the first projection pattern PP1 and the second projection pattern PP2 at a plurality of projection positions by moving the second gantry 104. Furthermore, the imaging unit 142 can capture images of the first projection pattern PP1 and the second projection pattern PP2 at a first position and a second position in the Y direction of the projection position by moving the second slider 105 at the projection position.

[0125] After the linear laser light LL is projected and images are captured at all of the predetermined projection positions, the image analysis unit 151 executes the same processing as the processing shown in FIG.

[0126] As described above, the laser processing machine 100 of this embodiment includes the second gantry 104 that is movably provided above the workpiece W1. The laser processing machine 100 includes the secondary processing tool 130 that is provided on the second gantry 104 and performs secondary processing on the laser-processed workpiece W1. The line laser 141 and the imaging unit 142 are provided on the secondary processing tool 130. The line laser 141 can project linear laser light LL to multiple projection positions by moving the second gantry 104. The imaging unit 142 can capture images of the projection pattern PP at multiple projection positions by moving the second gantry 104.

[0127] According to this embodiment, the laser processing machine 100 can align the line laser 141 and the image capturing unit 142 with the projection position by utilizing the operation of the second gantry 104 on which the secondary processing tool 130 is provided.

[0128] Figure 29 is a diagram showing an example of a laser processing machine 100 according to another embodiment. The laser processing machine 100 shown in Figure 29 is equipped with a table 110, a laser head 120, a secondary processing tool 130, a line laser unit 140, and a control device 150, similar to the laser processing machine 100 shown in Figure 1. The laser processing machine 100 according to this embodiment is equipped with a plurality of line laser units 140. The laser processing machine 100 shown in Figure 29 is equipped with a first line laser unit 140A and a second line laser unit 140B as the line laser units 140.

[0129] The first line laser unit 140A and the second line laser unit 140B are provided on the first gantry 101. The first line laser unit 140A and the second line laser unit 140B are provided side by side in the Y direction.

[0130] The first line laser unit 140A and the second line laser unit 140B include a line laser 141 and an imaging unit 142, similar to the line laser unit 140 shown in FIGS.

[0131] The line laser 141 can project linear laser light LL to multiple projection positions in the X direction on the plate surface BF of the workpiece W1 by moving the first gantry 101. The line laser 141 projects, as the linear laser light LL, a first linear laser light LL1 extending in the Y direction on the plate surface BF of the workpiece W1 and a second linear laser light LL2 extending in the X direction. In this embodiment, the X direction is an example of the first direction. In this embodiment, the Y direction is an example of the second direction.

[0132] The line laser 141 of the first line laser unit 140A is capable of projecting a linear laser beam LL at a first position in the Y direction of the projection position. As shown in Fig. 18 , the line laser 141 of the first line laser unit 140A projects the first linear laser beam LL1 onto a left half area of ​​the workpiece W1 when viewing the workpiece W1 from the -X side at the first position in the Y direction. The line laser 141 of the first line laser unit 140A is an example of a first line laser.

[0133] The line laser 141 of the second line laser unit 140B is capable of projecting a linear laser beam LL at a second position in the Y direction of the projection position. As shown in Fig. 19 , the line laser 141 of the second line laser unit 140B projects a first linear laser beam LL1 onto a right half area of ​​the workpiece W1 when viewing the workpiece W1 from the -X side at the second position in the Y direction. The line laser 141 of the second line laser unit 140B is an example of a second line laser.

[0134] The image capturing unit 142 can capture images of the projection pattern PP at a plurality of projection positions by moving the first gantry 101 .

[0135] The imaging section 142 of the first line laser unit 140A accommodates the projection pattern PP projected by the line laser 141 of the first line laser unit 140A within an angle of view AV. The imaging section 142 of the first line laser unit 140A is an example of a first imaging section.

[0136] The imaging section 142 of the second line laser unit 140B accommodates the projection pattern PP projected by the line laser 141 of the second line laser unit 140B within the angle of view AV. The imaging section 142 of the second line laser unit 140B is an example of a second imaging section.

[0137] The image analysis section 151 analyzes an image obtained by combining the image captured by the imaging section 142 of the first line laser unit 140A and the image captured by the imaging section 142 of the second line laser unit 140B.

[0138] The image captured by the imaging section 142 of the first line laser unit 140A is an image that shows the first projection pattern PP1 extending from the end on the +Y side of the workpiece W1 to about the middle in the Y direction, similar to the example shown in Fig. 21. The image captured by the imaging section 142 of the first line laser unit 140A is an example of the first image.

[0139] The image captured by the imaging section 142 of the second line laser unit 140B is an image that shows the first projection pattern PP1 extending from the middle of the workpiece W1 in the Y direction to the end on the -Y side, similar to the example shown in Fig. 22. The image captured by the imaging section 142 of the second line laser unit 140B is an example of the second image.

[0140] After the linear laser light LL is projected and images are captured at all of the predetermined projection positions, the image analysis unit 151 executes the same processing as the processing shown in FIG.

[0141] As described above, the laser processing machine 100 of this embodiment includes the first gantry 101 that is movably provided above the workpiece W1. The line laser 141 and the image capturing unit 142 are provided on the first gantry 101. The line laser 141 can project linear laser light LL to multiple projection positions by moving the first gantry 101. The image capturing unit 142 can capture images of the projection pattern PP at multiple projection positions by moving the first gantry 101.

[0142] According to this embodiment, the laser processing machine 100 can align the line laser 141 and the image capturing unit 142 with the projection position by utilizing the operation of the first gantry 101 .

[0143] The laser processing machine 100 also includes, as line lasers 141, a line laser 141 of a first line laser unit 140A and a line laser 141 of a second line laser unit 140B. The line laser 141 of the first line laser unit 140A and the line laser 141 of the second line laser unit 140B are arranged side by side in the Y direction. The laser processing machine 100 also includes, as image capturing units 142, an image capturing unit 142 of a first line laser unit 140A and an image capturing unit 142 of a second line laser unit 140B. The image capturing unit 142 of the first line laser unit 140A fits the projection pattern PP projected by the line laser 141 of the first line laser unit 140A within an angle of view AV. The image capturing unit 142 of the second line laser unit 140B fits the projection pattern PP projected by the line laser 141 of the second line laser unit 140B within an angle of view AV. The image analysis section 151 analyzes an image obtained by combining the image captured by the imaging section 142 of the first line laser unit 140A and the image captured by the imaging section 142 of the second line laser unit 140B.

[0144] According to this embodiment, the laser processing machine 100 can allow the user to determine whether there are any abnormalities in a wide area in the Y direction based on the analysis results from the image analysis unit 151.

[0145] Figure 30 is a diagram showing an example of a laser processing machine 100 according to another embodiment. The laser processing machine 100 shown in Figure 30 is equipped with a table 110, a laser head 120, a secondary processing tool 130, a line laser unit 140, and a control device 150, similar to the laser processing machine 100 shown in Figure 1. The laser processing machine 100 according to this embodiment is equipped with a plurality of line laser units 140. The laser processing machine 100 shown in Figure 30 is equipped with a first line laser unit 140A and a second line laser unit 140B as the line laser units 140.

[0146] The first line laser unit 140A and the second line laser unit 140B are provided on the second gantry 104. The first line laser unit 140A and the second line laser unit 140B are provided side by side in the Y direction.

[0147] The first line laser unit 140A and the second line laser unit 140B include a line laser 141 and an imaging unit 142, similar to the line laser unit 140 shown in FIGS.

[0148] The line laser 141 can project linear laser light LL to multiple projection positions in the X direction on the plate surface BF of the workpiece W1 by moving the second gantry 104. The line laser 141 projects, as the linear laser light LL, a first linear laser light LL1 extending in the Y direction on the plate surface BF of the workpiece W1 and a second linear laser light LL2 extending in the X direction. The X direction in this embodiment is an example of the first direction. The Y direction in this embodiment is an example of the second direction.

[0149] The line laser 141 of the first line laser unit 140A is capable of projecting a linear laser beam LL at a first position in the Y direction of the projection position. As shown in Fig. 18 , the line laser 141 of the first line laser unit 140A projects the first linear laser beam LL1 onto a left half area of ​​the workpiece W1 when viewing the workpiece W1 from the -X side at the first position in the Y direction. The line laser 141 of the first line laser unit 140A is an example of a first line laser.

[0150] The line laser 141 of the second line laser unit 140B is capable of projecting a linear laser beam LL at a second position in the Y direction of the projection position. As shown in Fig. 19 , the line laser 141 of the second line laser unit 140B projects a first linear laser beam LL1 onto a right half area of ​​the workpiece W1 when viewing the workpiece W1 from the -X side at the second position in the Y direction. The line laser 141 of the second line laser unit 140B is an example of a second line laser.

[0151] The imaging unit 142 can capture images of the projection pattern PP at a plurality of projection positions by moving the second gantry 104 .

[0152] The imaging section 142 of the first line laser unit 140A accommodates the projection pattern PP projected by the line laser 141 of the first line laser unit 140A within an angle of view AV. The imaging section 142 of the first line laser unit 140A is an example of a first imaging section.

[0153] The imaging section 142 of the second line laser unit 140B accommodates the projection pattern PP projected by the line laser 141 of the second line laser unit 140B within the angle of view AV. The imaging section 142 of the second line laser unit 140B is an example of a second imaging section.

[0154] The image analysis section 151 analyzes an image obtained by combining the image captured by the imaging section 142 of the first line laser unit 140A and the image captured by the imaging section 142 of the second line laser unit 140B.

[0155] The image captured by the imaging section 142 of the first line laser unit 140A is an image that shows the first projection pattern PP1 extending from the end on the +Y side of the workpiece W1 to about the middle in the Y direction, similar to the example shown in Fig. 21. The image captured by the imaging section 142 of the first line laser unit 140A is an example of the first image.

[0156] The image captured by the imaging section 142 of the second line laser unit 140B is an image that shows the first projection pattern PP1 extending from the middle of the workpiece W1 in the Y direction to the end on the -Y side, similar to the example shown in Fig. 22. The image captured by the imaging section 142 of the second line laser unit 140B is an example of the second image.

[0157] After the linear laser light LL is projected and images are captured at all of the predetermined projection positions, the image analysis unit 151 executes the same processing as the processing shown in FIG.

[0158] As described above, the laser processing machine 100 of this embodiment includes the second gantry 104 that is movably provided above the workpiece W1. The line laser 141 and the image capturing unit 142 are provided on the second gantry 104. The line laser 141 can project linear laser light LL to multiple projection positions by moving the second gantry 104. The image capturing unit 142 can capture images of the projection pattern PP at multiple projection positions by moving the second gantry 104.

[0159] According to this embodiment, the laser processing machine 100 can align the line laser 141 and the image capturing unit 142 with the projection position by utilizing the operation of the second gantry 104 .

[0160] Fig. 31 is a diagram showing an example of a laser processing machine 100 according to another embodiment. Similar to the laser processing machine 100 shown in Fig. 1, the laser processing machine 100 shown in Fig. 31 includes a table 110, a laser head 120, a secondary processing tool 130, a line laser unit 140, and a control device 150. The laser processing machine 100 shown in Fig. 31 also includes a transport device 160.

[0161] The transport device 160 is a device that transports the laser-machined workpiece W1. The transport device 160 has a plurality of gripping units 161 that grip the workpiece W1. The transport device 160 is provided so as to be able to enter the position of the workpiece W1 supported on the table 110 through openings A1 provided in the second frame F2 and the third frame F3. Once the transport device 160 grips the workpiece W1 supported on the table 110 with the gripping units 161, it transports the workpiece W1 in the Y direction.

[0162] The secondary processing tool 130 shown in Fig. 31 is provided on a path for transporting the workpiece W1 by the transport device 160. The secondary processing tool 130 shown in Fig. 31 moves in the X direction while being guided by a tool guide G4 provided on the third frame F3. The secondary processing tool 130 shown in Fig. 31 performs secondary processing on the workpiece W1 transported by the transport device 160.

[0163] The line laser unit 140 shown in FIG. 31 is provided on the secondary processing tool 130 .

[0164] 32 to 35 are diagrams showing an example of the line laser unit 140 shown in Fig. 31. The line laser unit 140 includes a line laser 141 and an imaging unit 142.

[0165] As described above, the laser-machined workpiece W1 is transported in the Y direction by the transport device 160. The line laser 141 shown in FIGS. 32 to 35 is capable of projecting linear laser light LL onto multiple projection positions in the Y direction on the plate surface BF of the workpiece W1 as the workpiece W1 is transported in the Y direction. The line laser 141 shown in FIGS. 32 to 35 projects, as the linear laser light LL, a first linear laser light LL1 extending in the X direction on the plate surface BF of the workpiece W1 and a second linear laser light LL2 extending in the Y direction. The Y direction in this embodiment is an example of the first direction. The X direction in this embodiment is an example of the second direction.

[0166] As described above, the secondary processing tool 130 moves in the X direction. As the secondary processing tool 130 moves, the line laser 141 can project the linear laser beam LL at a first position, a second position, and a third position in the X direction of the projection position. As shown in FIG. 32 , the line laser 141 projects the first linear laser beam LL1 onto a region on the left side of the workpiece W1 when viewing the workpiece W1 from the −Y side at the first position in the X direction. As shown in FIG. 33 , the line laser 141 projects the first linear laser beam LL1 onto a region in the center of the workpiece W1 when viewing the workpiece W1 from the −Y side at the second position in the X direction. As shown in FIG. 34 , the line laser 141 projects the first linear laser beam LL1 onto a region on the right side of the workpiece W1 when viewing the workpiece W1 from the −Y side at the third position in the X direction.

[0167] The imaging unit 142 can capture images of the projection pattern PP at a plurality of projection positions by transporting the workpiece W1 in the Y direction. Also, the imaging unit 142 can capture images of the projection pattern PP at a first position, a second position, and a third position in the X direction of the projection position by moving the secondary processing tool 130 at the projection position.

[0168] 36 is a diagram showing an example of a workpiece W1 captured in an image taken at a first position in the X direction. The first projection pattern PP1 projected at the first position extends in the X direction from the end of the workpiece W1 on the -X side. The second projection pattern PP2 extends in the Y direction.

[0169] 37 is a diagram showing an example of a workpiece W1 captured in an image taken at a second position in the X direction. The first projection pattern PP1 projected at the second position extends in the X direction in the middle of the workpiece W1. The second projection pattern PP2 extends in the Y direction.

[0170] 38 is a diagram showing an example of a workpiece W1 captured in an image taken at a third position in the X direction. The first projection pattern PP1 projected at the third position extends in the X direction from the end of the workpiece W1 on the +X side. The second projection pattern PP2 extends in the Y direction.

[0171] Fig. 39 is a diagram showing an example of image analysis processing by the image analysis unit 151. After the linear laser light LL is projected and images are captured at all of the predetermined projection positions, the image analysis unit 151 executes the processing shown in Fig. 39. The processing of S103 to S106 shown in Fig. 39 is the same as the processing of S103 to S106 shown in Fig. 5.

[0172] First, the image analysis unit 151 cuts out the areas in each of the multiple images in which the first projection pattern PP1 and the second projection pattern PP2 appear (S701).

[0173] 40 is a diagram showing an example of the workpiece W1 shown in the image after cutout processing. In S701, the image analysis unit 151 determines, for example, that a high-brightness linear portion extending in the image in the X direction of the workpiece W1 is the first projection pattern PP1. Then, the image analysis unit 151 cuts out a specific range of area in the X direction of the workpiece W1, for example, based on the area in which the first projection pattern PP1 appears. The specific range of area cut out in one image is set so as not to overlap with the specific range of area cut out in another image, for example.

[0174] Next, the image analysis unit 151 combines the three cut-out images using the first projection pattern PP1 as a landmark (S702).

[0175] 41 is a diagram showing an example of a workpiece W1 appearing in an image obtained by combining three images after cutout processing. In S702, the image analysis unit 151 combines, for example, an image captured at a first position, an image captured at a second position, and an image captured at a third position, all of which are the same projection position in the Y direction, so that they are connected. When combining the three images, the image analysis unit 151 determines, for example, that a high-brightness linear portion extending in the X direction of the workpiece W1 is the first projection pattern PP1. Then, the image analysis unit 151 combines the images so that, for example, the first projection pattern PP1 appearing in one image and the first projection pattern PP1 appearing in the other image are linearly connected.

[0176] Next, the image analysis unit 151 synthesizes all the images using the second projection pattern PP2 as a landmark (S703).

[0177] 42 is a diagram showing an example of the workpiece W1 shown in the combined image. In S703, the image analysis unit 151 combines the images so that the combined image is connected in the Y direction of the workpiece W1, for example, in the order in which they were captured by the imaging unit 142. When combining the images, the image analysis unit 151 determines, for example, that a high-brightness linear portion extending in the Y direction of the workpiece W1 is the second projection pattern PP2. Then, the image analysis unit 151 combines the images so that the second projection pattern PP2 shown in the first image and the second projection pattern PP2 shown in the second image are connected in a straight line.

[0178] As described above, the laser processing machine 100 of this embodiment includes a transport device 160 that transports the laser-processed workpiece W1 in the Y direction. The laser processing machine 100 also includes a secondary processing tool 130 that performs secondary processing on the workpiece W1 transported by the transport device 160. The line laser 141 and the imaging unit 142 are provided on the secondary processing tool 130. As the workpiece W1 is transported by the transport device 160, the line laser 141 can project linear laser light LL at multiple projection positions. As the workpiece W1 is transported by the transport device 160, the imaging unit 142 can capture images of the projection pattern PP at multiple projection positions.

[0179] According to this embodiment, the laser processing machine 100 can align the line laser 141 and the imaging unit 142 with the projection position by utilizing the operation of the transport device 160 transporting the workpiece W1.

[0180] Figure 43 is a diagram showing an example of a laser processing machine 100 according to another embodiment. Similar to the laser processing machine 100 shown in Figure 31, the laser processing machine 100 shown in Figure 43 includes a table 110, a laser head 120, a secondary processing tool 130, a line laser unit 140, and a control device 150. The laser processing machine 100 according to this embodiment includes a plurality of line laser units 140. The laser processing machine 100 shown in Figure 43 includes a first line laser unit 140A, a second line laser unit 140B, and a third line laser unit 140C as the line laser units 140.

[0181] The first line laser unit 140A to the third line laser unit 140C are provided on a path along which the workpiece W1 is transported by the transport device 160. The first line laser unit 140A to the third line laser unit 140C shown in Fig. 43 are provided in positions in the third frame F3 facing the workpiece W1 being transported by the transport device 160. The first line laser unit 140A, the second line laser unit 140B, and the third line laser unit 140C are provided side by side in the X direction.

[0182] The first to third line laser units 140A to 140C each include a line laser 141 and an imaging unit 142, similar to the line laser unit 140 shown in FIGS.

[0183] As the workpiece W1 is transported in the Y direction, the line laser 141 can project linear laser light LL to multiple projection positions in the Y direction on the plate surface BF of the workpiece W1. The line laser 141 projects, as the linear laser light LL, a first linear laser light LL1 extending in the X direction on the plate surface BF of the workpiece W1 and a second linear laser light LL2 extending in the Y direction. The Y direction in this embodiment is an example of the first direction. The X direction in this embodiment is an example of the second direction.

[0184] The line laser 141 of the first line laser unit 140A can project the linear laser beam LL at a first position in the X direction of the projection position. As shown in Fig. 32 , the line laser 141 of the first line laser unit 140A projects the first linear laser beam LL1 onto a region on the left side of the workpiece W1 when viewing the workpiece W1 from the -Y side at the first position in the X direction.

[0185] The line laser 141 of the second line laser unit 140B can project the linear laser beam LL at a second position in the X direction of the projection position. As shown in Fig. 33 , the line laser 141 of the second line laser unit 140B projects the first linear laser beam LL1 onto a central region of the workpiece W1 when viewing the workpiece W1 from the -Y side at the second position in the X direction.

[0186] The line laser 141 of the third line laser unit 140C can project the linear laser beam LL at a third position in the X direction of the projection position. As shown in Fig. 34 , the line laser 141 of the third line laser unit 140C projects the first linear laser beam LL1 onto a region on the right side of the workpiece W1 when viewing the workpiece W1 from the -Y side at a first position in the X direction.

[0187] The image capturing unit 142 can capture images of the projection pattern PP at a plurality of projection positions as the workpiece W1 is transported in the Y direction.

[0188] The imaging section 142 of the first line laser unit 140A fits the projection pattern PP projected by the line laser 141 of the first line laser unit 140A within the angle of view AV. The imaging section 142 of the second line laser unit 140B fits the projection pattern PP projected by the line laser 141 of the second line laser unit 140B within the angle of view AV. The imaging section 142 of the third line laser unit 140C fits the projection pattern PP projected by the line laser 141 of the third line laser unit 140C within the angle of view AV.

[0189] The image analysis section 151 analyzes an image obtained by combining the images captured by the imaging sections 142 of the first line laser unit 140A to the third line laser unit 140C.

[0190] The image captured by the imaging section 142 of the first line laser unit 140A is an image that shows the first projection pattern PP1 extending in the X direction from the -X side end of the workpiece W1, similar to the example shown in FIG.

[0191] The image captured by the imaging section 142 of the second line laser unit 140B is an image that captures the first projection pattern PP1 extending in the X direction at the middle of the workpiece W1 in the X direction, similar to the example shown in FIG.

[0192] The image captured by the imaging section 142 of the third line laser unit 140C is an image that shows the first projection pattern PP1 extending in the X direction from the +X side end of the workpiece W1, similar to the example shown in Figure 38.

[0193] As described above, the laser processing machine 100 of this embodiment includes a transport device 160 that transports the laser-processed workpiece W1 in the Y direction. The laser processing machine 100 also includes a secondary processing tool 130 that performs secondary processing on the workpiece W1 transported by the transport device 160. The line laser 141 and the image capturing unit 142 are provided on a transport path of the transport device 160. As the workpiece W1 is transported by the transport device 160, the line laser 141 can project linear laser light LL at multiple projection positions. As the workpiece W1 is transported by the transport device 160, the image capturing unit 142 can capture images of the projection pattern PP at multiple projection positions.

[0194] According to this embodiment, the laser processing machine 100 can align the line laser 141 and the imaging unit 142 with the projection position by utilizing the operation of the transport device 160 transporting the workpiece W1.

[0195] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the embodiments. It will be apparent to those skilled in the art that various modifications and improvements can be made to the embodiments within the technical scope of the present invention. It is apparent from the claims that such modifications and improvements are included within the technical scope of the present invention.

[0196] If chips remain on the surface of the laser-machined workpiece W1, when the linear laser light LL is projected onto the chips, the projection pattern PP may not appear linear. Therefore, the image analysis unit 151 may determine that there are no chips on the surface of the laser-machined workpiece W1 when the projection pattern PP shown in the image is normal. According to this example, the laser processing machine 100 can allow the user to recognize whether there are any chips on the surface of the workpiece W1 based on the analysis results by the image analysis unit 151.

[0197] The CPU (not shown) of the control device 150 does not need to function as the image analysis unit 151. In that case, the laser processing machine 100 may be provided with a computer different from the control device 150. The CPU of the computer only needs to function as the image analysis unit 151.

[0198] The image analysis unit 151 can also execute the image analysis process shown in Figures 8 to 10 when the laser processing machine 100 is equipped with the line laser 141 shown in Figures 11 and 12. In that case, the image analysis unit 151 may execute the processes of S501 and S502 shown in Figure 14 instead of the processes of S101 and S102 in the image analysis process shown in Figures 8 to 10.

[0199] The laser processing machine 100 shown in FIGS. 17, 28 to 31, and 43 can apply a line laser 141 that projects only one linear laser beam LL.

[0200] The laser processing machine 100 shown in Figures 28 to 31 and 43 can be equipped with an imaging unit 142 that captures images at a first position where the angle of the optical axis relative to the plate surface BF is a first angle, and at a second position where the angle is a second angle.

[0201] The laser processing machine 100 shown in Figures 28 to 31 and 43 can apply a line laser 141 that projects linear laser light LL at a first position where the angle of the optical axis relative to the plate surface BF is a first angle, and at a second position where the angle is a second angle.

[0202] The laser processing machine 100 of the above embodiment laser processes a plate-shaped workpiece W1. The workpiece W1 laser processed by the laser processing machine 100 is not limited to a plate-shaped workpiece. The laser processing machine 100 can laser process, for example, a square pipe, a round pipe, or other workpiece W1. When laser processing a workpiece W1 such as a square pipe or a round pipe, the laser head 120 irradiates a laser beam onto the surface of the workpiece W1 supported on the table 110 to laser process the workpiece W1. The line laser 141 projects a linear laser beam onto the surface of the workpiece W1 supported on the table 110. The imaging unit 142 images the surface of the workpiece W1 indicated by the table 110.

[0203] The execution order of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings, is not specifically indicated as "before," "prior to," or the like. It should also be noted that each process can be performed in any order unless the output of a previous process is used in a subsequent process. For convenience, the use of "first," "next," or the like in the operational flow in the claims, specifications, and drawings does not imply that the process must be performed in that order. Furthermore, to the extent permitted by law, the disclosure of Japanese Patent Application No. 2023-107380 is incorporated herein by reference.

[0204] 100 Laser processing machine 101 First gantry 102 First slider 103 First lifting section 104 Second gantry 105 Second slider 106 Second lifting section 110 Table 111 Base plate 112 Support plate 112P Projection 120 Laser head 130 Secondary processing tool 140 Line laser unit 140A First line laser unit 140B Second line laser unit 140C Third line laser unit 141 Line laser 142 Imaging section 150 Control device 160 Conveying device 161 Gripper A1 Opening AV Angle of view BF Plate surface F1 First frame F2 Second frame F3 Third frame G1 X guide G2 Y guide G3 Z guide G4 Tool guide H1 First hole H2 Second hole LL Linear laser beam LL1 First linear laser beam LL2 Second linear laser beam LP Linear pattern PP Projected pattern PP1 First projection pattern PP2 Second projection pattern S1 Slug SF Support frame W1 Workpiece

Claims

1. A laser processing machine for laser processing a workpiece, comprising: a table having a plurality of protrusions and supporting the workpiece by the protrusions; a laser head for laser processing the workpiece by irradiating the workpiece supported on the table with laser light; a line laser for projecting linear laser light onto the workpiece supported on the table; and an imaging unit for imaging the workpiece supported on the table, wherein the line laser projects linear laser light extending in a second direction perpendicular to the first direction of the workpiece to a plurality of projection positions in the first direction of the workpiece, and the imaging unit images the projection pattern of the linear laser light projected by the line laser.

2. A laser processing machine as described in claim 1, comprising a gantry movably arranged above a workpiece, the line laser and the imaging unit being arranged on the gantry, the line laser being capable of projecting linear laser light to a plurality of projection positions as the gantry moves, and the imaging unit being capable of imaging the projection pattern at the plurality of projection positions as the gantry moves.

3. A laser processing machine as described in claim 1, comprising a gantry movably arranged above a workpiece, the laser head being arranged on the gantry, the line laser and the imaging unit being arranged on the laser head, the line laser being capable of projecting linear laser light to a plurality of projection positions as the gantry moves, and the imaging unit being capable of imaging projection patterns at a plurality of projection positions as the gantry moves.

4. A laser processing machine as described in claim 1, comprising: a gantry movably mounted above a workpiece; and a secondary processing tool mounted on the gantry for secondary processing of a laser-machined workpiece, wherein the line laser and the imaging unit are mounted on the secondary processing tool, the line laser is capable of projecting linear laser light to a plurality of projection positions as the gantry moves, and the imaging unit is capable of imaging projection patterns at a plurality of projection positions as the gantry moves.

5. A laser processing machine as described in claim 1, comprising: a conveying device that conveys a laser-machined workpiece in the first direction; and a secondary processing tool that performs secondary processing on the workpiece conveyed by the conveying device, wherein the line laser and the imaging unit are provided on a conveying path by the conveying device, the line laser is capable of projecting linear laser light to a plurality of projection positions as the workpiece is conveyed by the conveying device, and the imaging unit is capable of imaging projection patterns at a plurality of projection positions as the workpiece is conveyed by the conveying device.

6. A laser processing machine as described in claim 1, comprising: a conveying device that conveys a laser-machined workpiece in the first direction; and a secondary processing tool that performs secondary processing on the workpiece conveyed by the conveying device, wherein the line laser and the imaging unit are provided on the secondary processing tool, the line laser is capable of projecting linear laser light to a plurality of projection positions as the workpiece is conveyed by the conveying device, and the imaging unit is capable of imaging projection patterns at the plurality of projection positions as the workpiece is conveyed by the conveying device.

7. A laser processing machine as described in claim 1, wherein the imaging unit images the workpiece at a first position where the angle of the optical axis relative to the workpiece is a first angle, and at a second position where the angle is a second angle different from the first angle.

8. The laser processing machine according to claim 1, wherein the line laser projects linear laser light at a first position where the angle of the optical axis relative to the workpiece is a first angle, and at a second position where the angle is a second angle different from the first angle.

9. The laser processing machine according to claim 1, further comprising an image analysis unit that analyzes the image captured by the imaging unit, wherein the image analysis unit determines whether the projection pattern shown in the image is normal.

10. The laser processing machine according to claim 9, wherein the image analysis unit determines that there is no abnormality in the laser-processed workpiece when the projection pattern shown in the image is normal.

11. The laser processing machine according to claim 9, wherein the laser head is capable of performing a drilling process to form a hole in a workpiece by irradiating laser light along a predetermined closed path, and the image analysis unit determines that the hole is fully penetrated when the projection pattern shown in the image is normal.

12. The laser processing machine according to claim 9, wherein the laser head is capable of performing a drilling process to form a hole in a workpiece by irradiating laser light along a predetermined closed path, and the image analysis unit determines that no slag remains in the hole when the projection pattern shown in the image is normal.

13. The laser processing machine according to claim 9, wherein the image analysis unit determines that there are no chips on the surface of the laser-processed workpiece when the projection pattern shown in the image is normal.

14. The laser processing machine described in claim 9, wherein the line laser projects linear laser light at a first projection position in the first direction and at a second projection position different from the first projection position, the imaging unit images the workpiece at the first projection position and the second projection position, and the image analysis unit analyzes an image that is a composite of a first image captured at the first projection position and a second image captured at the second projection position.

15. The laser processing machine described in claim 14, wherein the line laser irradiates a first linear laser light extending in the second direction and a second linear laser light extending in the first direction as linear laser light, and the image analysis unit synthesizes the first image and the second image based on a projection pattern of the second linear laser light reflected in an image.

16. A laser processing machine as described in claim 9, comprising as the line laser a first line laser and a second line laser arranged alongside the first line laser in the second direction, as the imaging unit a first imaging unit that fits a projection pattern projected by the first line laser within an angle of view, and a second imaging unit that fits a projection pattern projected by the second line laser within an angle of view, and the image analysis unit analyzes an image that is a composite of a first image captured by the first imaging unit and a second image captured by the second imaging unit.

Images