Transport device, conveyance method for substrate, and processing system

Abstract

This transport device for transporting a substrate comprises an accommodation part, a conveyance mechanism, an exhaust pipe, and a movement mechanism. The accommodation part can accommodate a container that accommodates the substrate and has a first opening which is connected to a processing device for processing the substrate and a first gate valve which opens and closes the first opening. The conveyance mechanism is provided in the accommodation part. The conveyance mechanism unloads a substrate after processing from the processing device via the first opening and places the substrate in the container. The conveyance mechanism retrieves a substrate before processing from the container and loads the substrate into the processing device via the first opening. The exhaust pipe discharges gas that is in the accommodation part. The movement mechanism moves the transport device.

Description

TRANSPORT DEVICE, SUBSTRATE TRANSPORT METHOD, AND PROCESSING SYSTEM

[0001] Various aspects and embodiments of the present disclosure relate to a transport apparatus, a method for transporting a substrate, and a processing system.

[0002] The following Patent Document 1 discloses that "the substrate processing system 1 comprises a main body 10 and a control device 100 that controls the main body 10. The main body 10 comprises a vacuum transfer module 11, a plurality of substrate processing modules 12, a plurality of load lock modules 13, a plurality of storage modules 14, and a substrate aligner module 15. The main body 10 also comprises an ER (edge ​​ring) aligner module 16, an atmospheric transfer module 17, and a plurality of load ports 18."

[0003] Japanese Patent Application Laid-Open No. 2021-141136

[0004] The present disclosure provides a transport device, a substrate transport method, and a processing system that can reduce the footprint of a processing system having multiple processing devices.

[0005] One aspect of the present disclosure is a transport device for transporting substrates, comprising a storage unit, a transport mechanism, an exhaust pipe, and a moving mechanism. The storage unit has a first opening connected to a processing device for processing the substrates and a first gate valve for opening and closing the first opening, and is capable of housing a container for housing the substrates. The transport mechanism is provided within the storage unit and transports processed substrates from the processing device through the first opening and stores them in the container, and removes unprocessed substrates from the container and transports them into the processing device through the first opening. The exhaust pipe exhausts gas within the storage unit. The moving mechanism moves the transport device.

[0006] According to various aspects and embodiments of the present disclosure, the footprint of a processing system having multiple processing devices can be reduced.

[0007] FIG. 1 is a system configuration diagram showing an example of a processing system according to an embodiment of the present disclosure. FIG. 2 is a diagram showing an example of a processing device. FIG. 3 is a diagram showing an example of a transporting device. FIG. 4 is a system configuration diagram showing an example of a processing system according to a comparative example. FIG. 5 is a flowchart showing an example of a substrate transport method. FIG. 6 is a diagram showing an example of a substrate transport process using a transporting device. FIG. 7 is a diagram showing an example of a substrate transport process using a transporting device. FIG. 8 is a diagram showing an example of a substrate transport process using a transporting device. FIG. 9 is a diagram showing an example of a substrate transport process using a transporting device. FIG. 10 is a diagram showing an example of a substrate transport process using a transporting device. FIG. 11 is a diagram showing an example of a substrate transport process using a transporting device. FIG. 12 is a diagram showing an example of a substrate transport process using a transporting device. FIG. 13 is an enlarged cross-sectional view showing an example of a configuration of a connecting portion between a transporting device and a processing device. FIG. 14 is an enlarged cross-sectional view showing an example of a configuration of a connecting portion between a transporting device and a processing device. FIG. 15 is a diagram showing another example of a transporting device. FIG. 16 is a diagram showing another example of a method of evacuating an accommodation section of a transporting device. FIG. 17 is a diagram showing another example of a method of evacuating an accommodation section of a transporting device. FIG. 18 is a diagram showing another example of a transporting device. Fig. 19 is a diagram showing another example of a transport device. Fig. 20 is a diagram showing an example of cooperation between a plurality of transport devices. Fig. 21 is a diagram showing an example of an end effector. Fig. 22 is a diagram showing an example of an image captured by a camera. Fig. 23 is a diagram showing an example of an image captured by a camera. Fig. 24 is a diagram showing an example of an image captured by a camera.

[0008] Hereinafter, embodiments of a transporting device, a substrate transporting method, and a processing system will be described in detail with reference to the drawings. Note that the following embodiments do not limit the disclosed transporting device, substrate transporting method, and processing system.

[0009] Increasing the number of substrates that can be processed per unit time can be achieved by increasing the number of processing modules used to process the substrates. In the technology described in Patent Document 1, increasing the number of processing modules results in a larger substrate processing system, including multiple processing modules, a vacuum transfer module, a load lock module, and an atmospheric transfer module. The larger the substrate processing system, the larger the installation area (footprint) of the substrate processing system within a facility such as a clean room, making it difficult to arrange multiple substrate processing systems. Therefore, there is a demand for reducing the installation area of ​​the substrate processing system.

[0010] Therefore, the present disclosure provides a technique that can reduce the installation area of ​​a processing system having multiple processing devices.

[0011] 1 is a system configuration diagram showing an example of a processing system 10 according to an embodiment of the present disclosure. In one embodiment, the processing system 10 includes a control device 20, one or more transport devices 30, and a plurality of processing devices 40. The control device 20 communicates with each of the transport devices 30 and processing devices 40, and controls each of the transport devices 30 and processing devices 40.

[0012] Each processing device 40 performs processing such as etching or film formation on the substrate W. In this embodiment, each transport device 30 autonomously travels to the position of the processing device 40 and connects to the processing device 40 under the control of the control device 20. Then, the transport device 30 transports the substrate W between the connected processing device 40 and the processing device 40.

[0013] 1, the processing system 10 has four transport devices 30 and 12 processing devices 40 arranged within an area R1. That is, in the example of Fig. 1, the installation area of ​​the processing system 10 is, for example, area R1. In addition to the area where the processing devices 40 are arranged, area R1 also includes an area R10 for the movement of the transport devices 30 and an area R11 for the standby of the transport devices 30.

[0014] [Configuration of Processing Apparatus 40] FIG. 2 is a diagram illustrating an example of the processing apparatus 40. In this embodiment, the processing apparatus 40 is, for example, a capacitively coupled plasma processing apparatus. The processing apparatus 40 includes a plasma processing chamber 410, a gas supply unit 420, a power supply 430, and an exhaust system 440. The processing apparatus 40 also includes a substrate support 411 and a gas inlet. The gas inlet is configured to introduce at least one process gas into the plasma processing chamber 410. The gas inlet includes a showerhead 413. The substrate support 411 is disposed within the plasma processing chamber 410. The showerhead 413 is disposed above the substrate support 411. In one embodiment, the showerhead 413 forms at least a portion of the ceiling of the plasma processing chamber 410. The plasma processing chamber 410 has a plasma processing space 410s defined by the showerhead 413, a sidewall 410a of the plasma processing chamber 410, and the substrate support 411.

[0015] The plasma processing chamber 410 has at least one gas supply port for supplying at least one processing gas to the plasma processing space 410s and at least one gas exhaust port for exhausting gas from the plasma processing space. The plasma processing chamber 410 is made of a conductor such as aluminum and is grounded. The shower head 413 and the substrate support 411 are electrically insulated from the housing of the plasma processing chamber 410. An opening 410b is formed in the sidewall 410a of the plasma processing chamber 410, through which a substrate W is loaded into and unloaded from the plasma processing chamber 410. The opening 410b is opened and closed by a gate valve G1.

[0016] The substrate support portion 411 includes a main body portion 4111 and a ring assembly 4112. The main body portion 4111 has a central region 4111a for supporting a substrate W and an annular region 4111b for supporting the ring assembly 4112. A wafer is an example of a substrate W. The annular region 4111b of the main body portion 4111 surrounds the central region 4111a of the main body portion 4111 in a plan view. The substrate W is disposed on the central region 4111a of the main body portion 4111, and the ring assembly 4112 is disposed on the annular region 4111b of the main body portion 4111 so as to surround the substrate W on the central region 4111a of the main body portion 4111. Therefore, the central region 4111a is also called a substrate support surface for supporting the substrate W, and the annular region 4111b is also called a ring support surface for supporting the ring assembly 4112.

[0017] In one embodiment, the main body 4111 includes a base 41110 and an electrostatic chuck 41111. The base 41110 includes a conductive member. The conductive member of the base 41110 can function as a lower electrode. The electrostatic chuck 41111 is disposed on the base 41110. The electrostatic chuck 41111 includes a ceramic member 41111a and an electrostatic electrode 41111b disposed within the ceramic member 41111a. The ceramic member 41111a has a central region 4111a. In one embodiment, the ceramic member 41111a also has an annular region 4111b. Note that another member surrounding the electrostatic chuck 41111, such as an annular electrostatic chuck or an annular insulating member, may also have the annular region 4111b. In this case, the ring assembly 4112 may be disposed on the annular electrostatic chuck or the annular insulating member, or may be disposed on both the electrostatic chuck 41111 and the annular insulating member. Furthermore, at least one RF / DC electrode coupled to an RF (Radio Frequency) power supply 431 and / or a DC (Direct Current) power supply 432 (described later) may be disposed within the ceramic member 41111a. In this case, the at least one RF / DC electrode functions as a lower electrode. When a bias RF signal and / or a DC signal (described later) is supplied to the at least one RF / DC electrode, the RF / DC electrode is also called a bias electrode. Note that the conductive member of the base 41110 and the at least one RF / DC electrode may function as multiple lower electrodes. Furthermore, the electrostatic electrode 41111b may function as the lower electrode. Therefore, the substrate support 411 includes at least one lower electrode.

[0018] The ring assembly 4112 includes one or more annular members. In one embodiment, the one or more annular members include one or more edge rings and at least one cover ring. The edge rings are formed of a conductive or insulating material, and the cover rings are formed of an insulating material.

[0019] The substrate support 411 may also include a temperature adjustment module configured to adjust at least one of the electrostatic chuck 41111, the ring assembly 4112, and the substrate W to a target temperature. The temperature adjustment module may include a heater, a heat transfer medium, a flow path 41110a, or a combination thereof. A heat transfer fluid such as brine or a gas flows through the flow path 41110a. In one embodiment, the flow path 41110a is formed in the base 41110, and one or more heaters are disposed in the ceramic member 41111a of the electrostatic chuck 41111. The substrate support 411 may also include a heat transfer gas supply configured to supply a heat transfer gas to a gap between the back surface of the substrate W and the central region 4111a.

[0020] Through holes (not shown) are formed in the electrostatic chuck 41111 below the central region 4111a, and lift pins (not shown) are inserted into the through holes. The lift pins are raised and lowered by a lifting mechanism (not shown). The substrate W placed on the central region 4111a can be raised and lowered by the lift pins being raised and lowered. For example, after the gate valve G1 is opened, the substrate W is carried into the plasma processing chamber 410 through the opening 410b by a transfer robot (not shown) and placed on the lift pins whose tips protrude from the upper surface of the electrostatic chuck 41111. The lift pins are then lowered to place the substrate W on the electrostatic chuck 41111, the gate valve G1 is closed, and processing of the substrate W is performed in the plasma processing chamber 410. After processing, the lift pins are raised to lift the substrate W from the upper surface of the electrostatic chuck 41111. After the gate valve G1 is opened, the substrate W is transferred out of the plasma processing chamber 410 through the opening 410b by a transfer robot (not shown).

[0021] The shower head 413 is configured to introduce at least one process gas from the gas supply unit 420 into the plasma processing space 410s. The shower head 413 has at least one gas supply port 413a, at least one gas diffusion chamber 413b, and multiple gas inlets 413c. The process gas supplied to the gas supply port 413a passes through the gas diffusion chamber 413b and is introduced into the plasma processing space 410s from the multiple gas inlets 413c. The shower head 413 also includes at least one upper electrode. In addition to the shower head 413, the gas inlet may also include one or more side gas injectors (SGIs) attached to one or more openings formed in the sidewall 410a.

[0022] The gas supply 420 may include at least one gas source 421 and at least one flow controller 422. In one embodiment, the gas supply 420 is configured to supply at least one process gas from a corresponding gas source 421 through a corresponding flow controller 422 to the showerhead 413. Each flow controller 422 may include, for example, a mass flow controller or a pressure-controlled flow controller. Additionally, the gas supply 420 may include one or more flow modulation devices to modulate or pulse the flow rate of the at least one process gas.

[0023] The power source 430 includes an RF power source 431 coupled to the plasma processing chamber 410 via at least one impedance matching circuit. The RF power source 431 is configured to supply at least one RF signal (RF power) to at least one lower electrode and / or at least one upper electrode. This generates a plasma from at least one process gas supplied to the plasma processing space 410s. Therefore, the RF power source 431 can function as at least a part of a plasma generating unit configured to generate a plasma from one or more process gases in the plasma processing chamber 410s. In addition, by supplying a bias RF signal to the at least one lower electrode, a bias potential is generated on the substrate W, thereby attracting ion components in the formed plasma to the substrate W.

[0024] In one embodiment, the RF power supply 431 includes a first RF generator 431a and a second RF generator 431b. The first RF generator 431a is coupled to at least one lower electrode and / or at least one upper electrode via at least one impedance matching circuit and is configured to generate a source RF signal (source RF power) for plasma generation. In one embodiment, the source RF signal has a frequency in the range of 10 MHz to 150 MHz. In one embodiment, the first RF generator 431a may be configured to generate multiple source RF signals having different frequencies. The generated one or more source RF signals are supplied to at least one lower electrode and / or at least one upper electrode.

[0025] The second RF generator 431b is coupled to at least one lower electrode via at least one impedance matching circuit and is configured to generate a bias RF signal (bias RF power). The frequency of the bias RF signal may be the same as or different from the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency lower than the frequency of the source RF signal. In one embodiment, the bias RF signal has a frequency in the range of 100 kHz to 60 MHz. In one embodiment, the second RF generator 431b may be configured to generate multiple bias RF signals having different frequencies. The generated one or more bias RF signals are supplied to at least one lower electrode. In various embodiments, at least one of the source RF signal and the bias RF signal may be pulsed.

[0026] The power supply 430 may also include a DC power supply 432 coupled to the plasma processing chamber 410. The DC power supply 432 includes a first DC generator 432a and a second DC generator 432b. In one embodiment, the first DC generator 432a is connected to the at least one lower electrode and configured to generate a first DC signal. The generated first bias DC signal is applied to the at least one lower electrode. In one embodiment, the second DC generator 432b is connected to the at least one upper electrode and configured to generate a second DC signal. The generated second DC signal is applied to the at least one upper electrode.

[0027] In various embodiments, at least one of the first and second DC signals may be pulsed. In this case, a sequence of voltage pulses is applied to at least one lower electrode and / or at least one upper electrode. The voltage pulses may have a rectangular, trapezoidal, triangular, or combination thereof pulse waveform. In one embodiment, a waveform generator for generating the sequence of voltage pulses from the DC signal is connected between the first DC generator 432a and at least one lower electrode. Thus, the first DC generator 432a and the waveform generator constitute a voltage pulse generator. When the second DC generator 432b and the waveform generator constitute a voltage pulse generator, the voltage pulse generator is connected to at least one upper electrode. The voltage pulses may have either positive or negative polarity. Furthermore, the sequence of voltage pulses may include one or more positive voltage pulses and one or more negative voltage pulses within one period. The first and second DC generating units 432a and 432b may be provided in addition to the RF power supply 431, or the first DC generating unit 432a may be provided instead of the second RF generating unit 431b.

[0028] The exhaust system 440 may be connected to, for example, a gas exhaust port 410e provided at the bottom of the plasma processing chamber 410. The exhaust system 440 may include a pressure regulating valve and a vacuum pump. The pressure regulating valve regulates the pressure in the plasma processing space 410s. The vacuum pump may include a turbomolecular pump, a dry pump, or a combination thereof.

[0029] The control device 20 processes computer-executable instructions that cause each processing device 40 to perform the various steps described in this disclosure. The control device 20 may be configured to control each element of the processing device 40 to perform the various steps described herein. In one embodiment, part or all of the control device 20 may be included in the processing device 40. The control device 20 may include a processing unit, a storage unit, and a communication interface. The control device 20 may be implemented, for example, by a computer. The processing unit may be configured to perform various control operations by reading a program from the storage unit and executing the read program. This program may be stored in the storage unit in advance or may be acquired via a medium when needed. The acquired program is stored in the storage unit and read from the storage unit by the processing unit for execution. The medium may be various computer-readable storage media or a communication line connected to the communication interface. The processing unit may be a CPU (Central Processing Unit). The storage unit may include a RAM (Random Access Memory), a ROM (Read Only Memory), a HDD (Hard Disk Drive), a SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with each processing device 40 via a communication line such as a LAN (Local Area Network).

[0030] [Configuration of Transporting Device 30] FIG. 3 is a diagram showing an example of the transporting device 30. The transporting device 30 includes a storage unit 31, a robot arm 32, and a moving mechanism 38. The storage unit 31 has storage units 31a and 31b. The robot arm 32 is provided in the storage unit 31a. The robot arm 32 is an example of a transport mechanism. The storage unit 31a is formed with openings 310a, 310b, and 310c. The opening 310a is opened and closed by a door 30a, the opening 310b is opened and closed by a gate valve G2, and the opening 310c is opened and closed by the door 30b. The opening 310b is an example of a first opening, and the gate valve G2 is an example of a first gate valve. A container 50 that stores multiple substrates W can be accommodated in the storage unit 31a. A door 50a is detachably attached to the container 50. The container 50 is, for example, a front opening unified pod (FOUP).

[0031] The storage section 31b is provided with an opening / closing mechanism 33, an exhaust section 34, a control section 35, a communication section 36, and a sensor 37. The opening / closing mechanism 33 opens and closes the door 50a of the container 50 stored in the storage section 31a through an opening 310c. The exhaust section 34 exhausts gas from the storage section 31a through an exhaust pipe 34a. In this embodiment, an opening 340 of the exhaust pipe 34a is located between the position where the container 50 is stored and the opening 310b. The gas sucked in by the exhaust section 34 is discharged to the outside of the conveying device 30.

[0032] The control unit 35 controls each unit of the transport device 30. The communication unit 36 ​​performs wireless communication with the control device 20. The sensor 37 senses the surroundings of the transport device 30 and outputs the sensing results to the control unit 35.

[0033] The moving mechanism 38 has a main body 380 and a plurality of wheels 381. The main body 380 is provided with a power source such as a battery, a power source, a steering mechanism, and the like. The wheels 381 rotate using the power source in the main body 380 and move the transporting device 30 in a direction controlled by the steering mechanism in the main body 380. The control unit 35 controls the moving mechanism 38 using, for example, the sensing results of the sensor 37, thereby moving the transporting device 30 to the position of the processing device 40 instructed by the control device 20. Note that the moving mechanism 38 may move the transporting device 30 by a method other than the wheels 381, such as a walking or caterpillar type, as long as it can move the transporting device 30.

[0034] [Installation Area of ​​Processing System 10] Here, a processing system 10' in a comparative example will be described. Fig. 4 is a system configuration diagram showing an example of the processing system 10' in the comparative example. The processing system 10' in the comparative example has a control device 20, a vacuum transfer module 60, a load lock module 61, an EFEM (Equipment Front End Module) 62, and multiple load ports 63.

[0035] The vacuum transfer module 60 has a transfer robot and transfers substrates W between the load lock module 61 and the processing device 40 in a vacuum environment. The load lock module 61 switches between an atmospheric pressure environment and a vacuum environment. A container such as a FOUP that accommodates multiple substrates W is attached to the load port 63. The EFEM 62 has a transfer robot and transfers substrates W between the load lock module 61 and the container attached to the load port 63 in an atmospheric pressure environment.

[0036] The comparative example processing system 10' illustrated in Fig. 4 has 12 processing devices 40, two vacuum transfer modules 60, four load lock modules 61, two EFEMs 62, and eight load ports 63, and is arranged within region R2. That is, in the example of Fig. 4, the installation area of ​​the comparative example processing system 10' is, for example, region R2. Region R2 includes region R20 for maintenance of the vacuum transfer modules 60, region R21 for maintenance of each processing device 40, and region R22 in which the load lock modules 61, EFEMs 62, and load ports 63 are arranged.

[0037] 1 and 4 , the area R1 required for installation of the processing system 10 of this embodiment is smaller than the area R2 required for installation of the processing system 10′ of the comparative example. Specifically, the area R1 of the processing system 10 of this embodiment does not include the areas R20 and R21 included in the area R2 of the processing system 10′ of the comparative example. In the processing system 10 of this embodiment, maintenance of the processing device 40 can be performed when the transport device 30 is not connected, so the work area for maintenance of the processing device 40 can be shared with the area R10 for movement of the transport device 30. Furthermore, the area R1 of the processing system 10 of this embodiment requires an area R11 for waiting for the transport device 30, but this area R11 can be smaller than the area R22 of the processing system 10′ of the comparative example. Therefore, the processing system 10 of this embodiment can have a smaller installation area than the processing system 10′ of the comparative example.

[0038] 5 is a flowchart showing an example of a method for transporting a substrate W. The process illustrated in FIG. 5 is realized by the control device 20 controlling each device of the processing system 10.

[0039] First, under the control of the control device 20, the transport device 30 moves to the position of the processing device 40 (S100). Step S100 is an example of step a).

[0040] Next, the transporting device 30 is connected to the processing device 40 (S101). Step S101 is an example of process b). As a result, the transporting device 30 and the processing device 40 are connected, for example, as shown in FIG. 6. In the example of FIG. 6, the pressure inside the plasma processing chamber 410 of the processing device 40 is controlled to be lower than atmospheric pressure. Note that in the following figures, the space controlled to be lower than atmospheric pressure is hatched for distinction. Furthermore, after the transporting device 30 and the processing device 40 are connected, the battery in the moving mechanism 38 may be charged via the processing device 40 or a charging facility located near the processing device 40.

[0041] Next, the container 50 containing the substrates W is accommodated in the accommodation unit 31a of the transporting device 30 (S102). In step S102, the door 30a is opened, for example, as shown in Fig. 7 . Then, the container 50 transported by an OHT (Overhead Hoist Transport) or the like is accommodated in the accommodation unit 31a through the opening 310a. Then, the door 30a is closed. When the container 50 is accommodated in the accommodation unit 31a, particles adhering to the surface of the container 50 may be removed by blowing gas such as dry air onto the container 50.

[0042] Next, the door 50a of the container 50 is opened (S103). In step S103, as shown in Fig. 8, for example, the door 30b is opened, the arm of the opening / closing mechanism 33 enters the storage section 31a, and the door 50a is removed from the container 50 by the opening / closing mechanism 33. The arm of the opening / closing mechanism 33 retreats into the storage section 31b together with the door 50a removed from the container 50. Then, the door 30b is closed.

[0043] Next, the gas inside the storage unit 31a is exhausted (S104). In step S104, for example, as shown in Fig. 9, the gas inside the storage unit 31a is exhausted by the exhaust unit 34 through the exhaust pipe 34a. The gas sucked by the exhaust unit 34 is discharged to the outside of the conveying device 30.

[0044] Next, gate valves G1 and G2 are opened (S105). Step S105 is an example of step c). As a result, as shown in FIG. 10 , for example, accommodation unit 31a and plasma processing chamber 410 are connected via opening 310b of transport device 30 and opening 410b of processing device 40. In this embodiment, opening 340 of exhaust pipe 34a is located between the position where container 50 is accommodated and opening 310b. This prevents particles in accommodation unit 31a from entering plasma processing chamber 410 and prevents particles in plasma processing chamber 410 from entering container 50.

[0045] Next, the substrate W is transported (S106). Step S106 is an example of process d). In step S106, as shown in FIG. 11 , for example, the processed substrate W is unloaded from the plasma processing chamber 410 by the robot arm 32 through the opening 310b of the transport device 30 and the opening 410b of the processing device 40. Then, as shown in FIG. 12 , for example, the processed substrate W is placed in the container 50 by the robot arm 32. Furthermore, the unprocessed substrate W is unloaded from the container 50 by the robot arm 32 and loaded into the plasma processing chamber 410 through the opening 310b of the transport device 30 and the opening 410b of the processing device 40.

[0046] Next, gate valves G1 and G2 are closed (S107), and gas is supplied into storage section 31a (S108). In step S108, an inert gas such as nitrogen gas or dry air is supplied into storage section 31a, and the pressure inside storage section 31a is returned to atmospheric pressure. Air outside conveying device 30 may be supplied into storage section 31a.

[0047] Next, the door 50a is attached to the container 50 (S109). In step S109, the door 30b is opened, and the arm of the opening / closing mechanism 33 enters the storage section 31a together with the door 50a. The door 50a is then attached to the container 50 by the opening / closing mechanism 33. The arm of the opening / closing mechanism 33 then retreats to the storage section 31b, and the door 30b is closed.

[0048] Next, the container 50 is removed (S110). In step S110, the door 30a is opened, and the container 50 is removed from the storage section 31a by an OHT or the like. Then, the connection between the transporting device 30 and the processing device 40 is released (S111), and the transporting device 30 moves from the position of the processing device 40 (S112). Then, the processing shown in this flowchart ends.

[0049] In this embodiment, the gas inside the accommodation unit 31a is evacuated after the transport device 30 is connected to the processing device 40, but the disclosed technology is not limited to this. As another embodiment, while the transport device 30 is moving to the position of the processing device 40, the container 50 may be accommodated in the accommodation unit 31a, the door 50a of the container 50 may be removed, and the gas inside the accommodation unit 31a may be evacuated. This makes it possible to shorten the waiting time from when the transport device 30 and the processing device 40 are connected to each other until the transport of the substrate W starts.

[0050] Furthermore, before the door 50a of the container 50 is removed, the gas inside the container 31a may be slightly exhausted so that the pressure inside the container 31a becomes lower than the pressure inside the container 50. This makes it possible to prevent particles inside the container 31a from entering the container 50 when the door 50a of the container 50 is removed.

[0051] The above describes an embodiment. As described above, the transport device (transport device 30) in this embodiment is a transport device for transporting substrates and includes a storage unit (storage unit 31a), a transport mechanism (robot arm 32), an exhaust pipe (exhaust pipe 34a), and a moving mechanism (moving mechanism 38). The storage unit has a first opening (opening 310b) connected to a processing device (processing device 40) that processes the substrates and a first gate valve (gate valve G2) that opens and closes the first opening, and is capable of accommodating a container (container 50) that accommodates substrates. The transport mechanism is provided within the storage unit and transports processed substrates from the processing device through the first opening and stores them in the container, and removes unprocessed substrates from the container and transports them into the processing device through the first opening. The exhaust pipe exhausts gases within the storage unit. The moving mechanism moves the transport device. This reduces the installation area of ​​a processing system having multiple processing devices.

[0052] The transport device in the above embodiment also includes a first sensor (sensor 37) and a control unit (control unit 35). The first sensor senses the surroundings of the transport device. The control unit controls the movement mechanism using the sensing results from the first sensor, thereby moving the transport device to the position of the processing device. This allows the transport device 30 to be easily moved.

[0053] In the above embodiment, the opening of the exhaust pipe (opening 340) is located between the container and the first gate valve in the accommodation unit, thereby preventing particles in accommodation unit 31a from entering plasma processing chamber 410 and preventing particles in plasma processing chamber 410 from entering container 50.

[0054] Furthermore, the transfer method in this embodiment is a method for transferring a substrate in a transfer device (transfer device 30), and includes steps a), b), c), and d). In step a), the transfer device is moved to the position of the processing device by a moving mechanism. In step b), the first opening is connected to the processing device. In step c), the first gate valve is opened. In step d), the transfer device transfers the processed substrate from the processing device through the first opening and places it in a container, and the unprocessed substrate is removed from the container and transferred into the processing device through the first opening. This makes it possible to reduce the installation area of ​​a processing system having multiple processing devices.

[0055] In the above embodiment, in step a), the gas inside the accommodation unit is exhausted through the exhaust pipe while the transporting device is being moved to the position of the processing device, thereby shortening the waiting time from when the transporting device 30 and the processing device 40 are connected to each other until the transfer of the substrate W begins.

[0056] The processing system 10 of this embodiment also includes a plurality of processing devices (processing devices 40) for processing substrates and a transport device (transport device 30) for transporting the substrates. The transport device includes a storage unit (storage unit 31a), a transport mechanism (robot arm 32), an exhaust pipe (exhaust pipe 34a), and a moving mechanism (moving mechanism 38). The storage unit has a first opening (opening 310b) connected to the processing device (processing device 40) and a first gate valve (gate valve G2) for opening and closing the first opening, and is capable of accommodating a container (container 50) for accommodating substrates. The transport mechanism is provided within the storage unit and transports processed substrates from the processing device through the first opening and into the container, and removes unprocessed substrates from the container and transports them into the processing device through the first opening. The exhaust pipe exhausts gases within the storage unit. The moving mechanism moves the transport device. This reduces the installation area of ​​a processing system having multiple processing devices.

[0057] [Others] The technology disclosed in the present application is not limited to the above-described embodiment, and various modifications are possible within the scope of the gist thereof.

[0058] For example, in the above-described embodiment, the connection portion between the carrying device 30 and the processing device 40 may be configured as shown in FIG. 13 . FIG. 13 is an enlarged cross-sectional view showing an example of the configuration of the connection portion between the carrying device 30 and the processing device 40. A side surface 310d of the carrying device 30 connected to the processing device 40 has a plurality of convex portions 310e formed thereon. A side surface of the plasma processing chamber 410 connected to the carrying device 30 has a plurality of concave portions 410a1 shaped to correspond to the convex portions 310e formed thereon. A sealing member 410a2, such as an O-ring, is disposed around the opening 410b of the processing device 40. When the carrying device 30 and the processing device 40 are connected, the convex portions 310e and the concave portions 410a1 fit together, as shown in FIG. 14 . This allows the positions of the opening 310b of the carrying device 30 and the opening 410b of the plasma processing chamber 410 to be easily aligned when the carrying device 30 and the processing device 40 are connected.

[0059] 13, an exhaust pipe 310f connected to the exhaust unit 34 is provided outside the gate valve G2 of the transporting device 30. This allows gas remaining in the space 70 between the gate valve G1 and the gate valve G2 to be exhausted via the exhaust pipe 310f when the transporting device 30 and the processing device 40 are connected, as shown in FIG.

[0060] 15, a lifting mechanism 39 may be provided between the storage unit 31 and the moving mechanism 38. The lifting mechanism 39 raises and lowers the storage unit 31 relative to the moving mechanism 38. This allows the transport device 30 to be easily connected to processing devices 40 having openings 410b at different heights.

[0061] In the above-described embodiment, the gas inside the storage unit 31a is exhausted by the exhaust unit 34 provided in the transporting device 30, but the disclosed technology is not limited to this. In another embodiment, as shown in FIG. 16 , the transporting device 30 may be provided with a connector 34b instead of the exhaust unit 34, and the processing device 40 may be provided with a connector 410c, a pipe 410d, and a valve 410f. When the transporting device 30 and the processing device 40 are connected, the connector 34b and the connector 410c are connected, and the exhaust unit 34c and the pipe 410d are connected. Then, when the valve 410f is opened, the exhaust system 440 of the processing device 40 exhausts the gas inside the storage unit 31a via the pipe 410d and the exhaust pipe 34a.

[0062] 17, when the transporting device 30 and the processing device 40 are connected, the connector 34b and the external exhaust pipe 71 may be connected, and the gas inside the accommodation unit 31a may be exhausted via the exhaust pipe 34a and the external exhaust pipe 71. The external exhaust pipe 71 is an example of an exhaust mechanism.

[0063] Furthermore, in the transport device 30 in the above-described embodiment, as shown in FIG. 3, the gate valve G2 is provided on the side wall opposite the container 50 across the robot arm 32, but the disclosed technology is not limited to this. As another embodiment, as shown in FIG. 18, the gate valve G2 may be provided on a side wall other than the side wall opposite the container 50 across the robot arm 32. This shortens the distance ΔL between the processing devices 40 through which the transport device 30′ passes. This further reduces the installation area of ​​the processing system 10.

[0064] Furthermore, in the transport device 30 in the above-described embodiment, the container 50 and the robot arm 32 are arranged in one storage unit 31a, but the disclosed technology is not limited to this. For example, as shown in FIG. 19 , the transport device 30 may be composed of two units, a transport device 30-1 and a transport device 30-2. The transport device 30-1 includes a storage unit 31-1 and a moving mechanism 38a. The storage unit 31-1 includes a storage unit 31-1a and a storage unit 31-1b. The storage unit 31-1a is formed with openings 310a, 310c, and 310g. The opening 310a is opened and closed by the door 30a, the opening 310c is opened and closed by the door 30b, and the opening 310g is opened and closed by the gate valve G3a. The storage unit 31-1a can accommodate a container 50. The accommodation portion 31-1a is an example of a first accommodation portion, the opening 310g is an example of a second opening, and the gate valve G3a is an example of a second gate valve.

[0065] The accommodation unit 31-1b is provided with an opening / closing mechanism 33, an exhaust unit 34, a control unit 35a, a communication unit 36a, and a sensor 37a. The movement mechanism 38a has a main body 380a and multiple wheels 381a. The main body 380a is provided with a power source such as a battery, a power source, a steering mechanism, and the like. The wheels 381a rotate using the power source in the main body 380a and move the transport device 30-1 in a direction controlled by the steering mechanism in the main body 380a. The control unit 35a controls the movement mechanism 38a using, for example, the sensing results of the sensor 37a, thereby moving the transport device 30-1 to a position instructed by the control device 20. The movement mechanism 38a is an example of a first movement mechanism.

[0066] The transport device 30-2 includes a storage unit 31-2, a robot arm 32, and a moving mechanism 38b. The storage unit 31-2 has a storage unit 31-2a and a storage unit 31-2b. An opening 310b and an opening 310h are formed in the storage unit 31-2a. The opening 310b is opened and closed by a gate valve G2, and the opening 310h is opened and closed by a gate valve G3b. The robot arm 32 is provided inside the storage unit 31-1b. The storage unit 31-2a is an example of a second storage unit, the opening 310h is an example of a third opening, and the gate valve G3b is an example of a third gate valve.

[0067] The accommodation unit 31-2b is provided with a control unit 35b, a communication unit 36b, and a sensor 37b. The movement mechanism 38b has a main body 380b and a plurality of wheels 381b. The main body 380b is provided with a power source such as a battery, a power source, a steering mechanism, and the like. The wheels 381b rotate using the power source in the main body 380b and move the transport device 30-2 in a direction controlled by the steering mechanism in the main body 380b. The control unit 35b controls the movement mechanism 38b using, for example, the sensing results of the sensor 37b, thereby moving the transport device 30-2 to a position instructed by the control device 20. The movement mechanism 38b is an example of a second movement mechanism.

[0068] The exhaust unit 34 provided in the transporting device 30-1 exhausts gas from the inside of the accommodation units 31-1a and 31-2a through the exhaust pipe 34a after the transporting device 30-1 and the transporting device 30-2 are connected and the gate valves G3a and G3b are opened. The gas sucked by the exhaust unit 34 is exhausted to the outside of the transporting device 30.

[0069] 19, the transporting device 30 is configured to be separable into the transporting device 30-1 and the transporting device 30-2, so that only the transporting device 30-1 can be replaced with another transporting device 30-1 while the transporting device 30-2 remains connected to the processing device 40. This allows the substrates W to be transported more efficiently.

[0070] Furthermore, in the above-described embodiment, one transport device 30 transports substrates W between one processing device 40, but the disclosed technology is not limited to this. As another embodiment, for example, as shown in FIG. 20 , two transport devices 30 may be connected to two processing devices 40, and the two transport devices 30 may transport substrates W in cooperation with each other. In the example of FIG. 20 , the transport device 30-1 is connected to the processing device 40-1, the transport device 30-2 is connected to the processing device 40-2, and the transport devices 30-1 and 30-2 are connected to each other. Openings 310i for connecting to other transport devices 30 are formed in the transport devices 30-1 and 30-2, and the openings 310i are opened and closed by gate valves G4. The openings 310i are an example of a fourth opening, and the gate valve G4 is an example of a fourth gate valve.

[0071] For example, the transporting device 30-1 transports the substrate W processed in the processing device 40-1 to the transporting device 30-2, and the transporting device 30-2 transports the substrate W transported from the transporting device 30-1 to the processing device 40-2 that performs a different process from that performed in the processing device 40-1. This makes it possible to save time required for connecting and disconnecting between the transporting device 30 and the processing device 40 when transporting the substrate from the processing device 40-1 to the processing device 40-2.

[0072] In the above-described embodiment, the end effector 32a of the robot arm 32 may be provided with a distance sensor 320 and a camera 321, as shown in FIG. 21 . The distance sensor 320 and the camera 321 may be used to align the transport device 30 and the robot arm 32 with respect to the plasma processing chamber 410. Reference markers are attached to components within the plasma processing chamber 410 at predetermined positions. For example, when the distance between the end effector 32a and the marker is longer than the predetermined distance, the camera 321 captures an image 80, as shown in FIG. 22 . For example, as shown in FIG. 22 , the marker 81 in the image 80 captured by the camera 321 is displayed smaller than a predetermined area 82.

[0073] On the other hand, when the difference between the distance between the end effector 32a and the marker and the predetermined distance is within a predetermined range, an image 80 such as that shown in Fig. 23 is captured. In the example of Fig. 23, the marker 81 in the image 80 is captured with a size substantially the same as that of a predetermined area 82.

[0074] Thereafter, the end effector 32a is moved so that the marker 81 in the image 80 approaches the region 82. As a result, as shown in Fig. 24 for example, the marker 81 is displayed in the image 80 at substantially the same position and size as the predetermined region 82. This allows the transport device 30 and the robot arm 32 to be aligned with the plasma processing chamber 410.

[0075] Furthermore, although the processing system 10 in the above-described embodiment does not include a vacuum transfer module, the disclosed technology is not limited to this. In another embodiment, the processing system 10 may include a vacuum transfer module. In this case, the transport device 30 transports the substrate W between the vacuum transfer module and the processing system 10. Even with this configuration, the installation area for the atmospheric transfer module and the load port can be reduced, thereby reducing the installation area for the processing system 10 as a whole.

[0076] It should be noted that the disclosed embodiments are illustrative in all respects and should not be considered limiting. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims.

[0077] Furthermore, the following supplementary notes are disclosed regarding the above-described embodiment.

[0078] (Supplementary Note 1) A transport device for transporting substrates, comprising: a storage unit having a first opening connected to a processing device for processing the substrate and a first gate valve for opening and closing the first opening, capable of accommodating a container for accommodating a substrate; a transport mechanism provided in the storage unit for unloading processed substrates from the processing device through the first opening and accommodating them in the container, and for unloading unprocessed substrates from the container and loading them into the processing device through the first opening; an exhaust pipe for exhausting gas from the storage unit; and a movement mechanism for moving the transport device. (Supplementary Note 2) The transport device according to Supplementary Note 1, comprising: a first sensor for sensing the surroundings of the transport device; and a control unit for controlling the movement mechanism using a sensing result from the first sensor to move the transport device to the position of the processing device. (Supplementary Note 3) The transport device according to Supplementary Note 1 or 2, wherein the opening of the exhaust pipe is located between the container and the first gate valve in the storage unit. (Supplementary Note 4) The transporting device according to any one of Supplements 1 to 3, further comprising an elevating mechanism that elevates the storage unit. (Supplementary Note 5) The transporting device according to any one of Supplements 1 to 4, wherein the exhaust pipe is connected to an exhaust mechanism of the processing device when the transporting device is connected to the processing device, and exhausts gas via the exhaust mechanism. (Supplementary Note 6) The transporting device according to any one of Supplements 1 to 4, wherein the exhaust pipe is connected to an exhaust mechanism arranged near the processing device when the transporting device is connected to the processing device, and exhausts gas via the exhaust mechanism. (Supplementary Note 7) The transport device described in any one of Supplementary Notes 1 to 5, wherein the storage section has a first storage section capable of storing the container, and a second storage section that stores the transport mechanism; the first storage section has a second opening connected to the second storage section, and a second gate valve that opens and closes the second opening; the second storage section has the first opening, the first gate valve, a third opening connected to the first storage section, and a third gate valve that opens and closes the third opening; and the moving mechanism has a first moving mechanism that moves the first storage section, and a second moving mechanism that moves the second storage section.(Appendix 8) A transport device described in any one of Appendices 1 to 7, wherein the accommodation section further has a fourth opening connectable to another transport device and a fourth gate valve for opening and closing the fourth opening, and the transport mechanism further transports the substrate between the processing device connected to the first opening and another transport device connected to the second opening. (Supplementary Note 9) A method for transporting a substrate in a transport device comprising: a storage section having a first opening connected to a processing device for processing the substrate and a first gate valve for opening and closing the first opening, and capable of housing a container for accommodating a substrate, a transport mechanism provided in the storage section, an exhaust pipe for exhausting gas within the storage section, and a moving mechanism for moving the transport device, the method comprising: a) a step of moving the transport device to a position of the processing device via the moving mechanism, b) a step of connecting the first opening to the processing device, c) a step of opening the first gate valve, and d) a step of unloading a processed substrate from the processing device through the first opening and storing it in the container, and unloading an unprocessed substrate from the container and loading it into the processing device through the first opening, by the transport device. (Supplementary Note 10) The method for transporting a substrate according to Supplementary Note 9, wherein in step a), gas within the storage section is exhausted via the exhaust pipe while the transport device is being moved to the position of the processing device. (Supplementary Note 11) A processing system comprising: a plurality of processing devices for processing substrates; and a transport device for transporting the substrates, wherein the transport device has a storage section having a first opening connected to the processing device and a first gate valve for opening and closing the first opening, and capable of accommodating a container for accommodating the substrates; a transport mechanism provided in the storage section, for unloading processed substrates from the processing device through the first opening and accommodating them in the container, and for removing unprocessed substrates from the container and transporting them into the processing device through the first opening; an exhaust pipe for exhausting gas within the storage section; and a moving mechanism for moving the transport device.

[0079] G Gate valve R Region W Substrate 10 Processing system 20 Control device 30 Conveying device 30a Door 30b Door 31 Storage section 310a Opening 310b Opening 310c Opening 32 Robot arm 33 Opening / closing mechanism 34 Exhaust section 34a Exhaust pipe 340 Opening 35 Control unit 36 ​​Communication unit 37 Sensor 38 Moving mechanism 40 Processing device 410 Plasma processing chamber 410b Opening 410e Gas exhaust port 410s Plasma processing space 411 Substrate support 4111 Main body 4111a Central region 4111b Annular region 41110 Base 41110a Flow path 41111 Electrostatic chuck 41111a Ceramic member 41111b Electrostatic electrode 4112 Ring assembly 413 Shower head 413a Gas supply port 413b Gas diffusion chamber 413c Gas inlet 420 Gas supply unit 421 Gas source 422 Flow rate controller 430 Power supply 431 RF power supply 431a First RF generator 431b Second RF generator 432 DC power supply 432a First DC generator 432b Second DC generator 440 Exhaust system 50 Container 50a Door

Claims

1. A transport device for transporting substrates, comprising: a storage section having a first opening connected to a processing device for processing the substrate and a first gate valve for opening and closing the first opening, capable of accommodating a container for accommodating a substrate; a transport mechanism provided within the storage section for unloading processed substrates from the processing device through the first opening and accommodating them in the container, and for removing unprocessed substrates from the container and carrying them into the processing device through the first opening; an exhaust pipe for exhausting gas within the storage section; and a moving mechanism for moving the transport device.

2. The transport device as described in claim 1, comprising: a first sensor that senses the surroundings of the transport device; and a control unit that moves the transport device to the position of the processing device by controlling the movement mechanism using the sensing results of the first sensor.

3. A transport device according to claim 1 or 2, wherein, within said accommodation section, an opening of said exhaust pipe is disposed between said container and said first gate valve.

4. The conveying device according to claim 1, further comprising a lifting mechanism for raising and lowering said storage section.

5. The transport device according to claim 1, wherein the exhaust pipe is connected to an exhaust mechanism of the processing device when the transport device is connected to the processing device, and exhausts gas through the exhaust mechanism.

6. A transporting device as described in claim 1, wherein the exhaust pipe is connected to an exhaust mechanism arranged in the vicinity of the processing device when the transporting device is connected to the processing device, and exhausts gas through the exhaust mechanism.

7. The transport device according to claim 1, wherein the storage section has a first storage section capable of storing the container and a second storage section that stores the transport mechanism, the first storage section has a second opening connected to the second storage section and a second gate valve that opens and closes the second opening, the second storage section has the first opening, the first gate valve, a third opening connected to the first storage section and a third gate valve that opens and closes the third opening, and the moving mechanism has a first moving mechanism that moves the first storage section and a second moving mechanism that moves the second storage section.

8. A transport device as described in claim 1, wherein the accommodation section further has a fourth opening connectable to another of the transport devices and a fourth gate valve for opening and closing the fourth opening, and the transport mechanism further transports the substrate between the processing device connected to the first opening and the other of the transport devices connected to the fourth opening.

9. A method for transporting a substrate in a transport device comprising: a storage section having a first opening connected to a processing device for processing the substrate and a first gate valve for opening and closing the first opening, capable of accommodating a container for accommodating a substrate; a transport mechanism provided in the storage section; an exhaust pipe for exhausting gas within the storage section; and a moving mechanism, the method comprising: a) a step of moving the transport device to a position of the processing device by the moving mechanism; b) a step of connecting the first opening to the processing device; c) a step of opening the first gate valve; and d) a step of transporting a processed substrate from the processing device through the first opening and storing it in the container, and removing an unprocessed substrate from the container and transporting it into the processing device through the first opening, by the transport mechanism.

10. The method for transporting a substrate according to claim 9, wherein in step a), gas within the container is exhausted through the exhaust pipe while the transport device is being moved to the position of the processing device.

11. A processing system comprising a plurality of processing devices for processing substrates, and a transport device for transporting the substrates, wherein the transport device has a first opening connected to the processing devices and a first gate valve for opening and closing the first opening, a storage section capable of accommodating a container for accommodating the substrates, a transport mechanism provided within the storage section for unloading processed substrates from the processing devices through the first opening and accommodating them in the container, and for removing unprocessed substrates from the container and transporting them into the processing devices through the first opening, an exhaust pipe for exhausting gas within the storage section, and a moving mechanism for moving the transport device.

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