Ultrasonic imaging apparatus

Abstract

This ultrasonic imaging apparatus irradiates an object, which is a semiconductor obtained by lamination of multiple layers, with an ultrasonic wave to acquire a reflected wave thereof and images a lamination interface of the object. The apparatus comprises: a control device; a first three-axis scanner (10) and a second three-axis scanner (20) which are disposed on a stage (35); a first probe (15) which is held by a first probe holder (14) fitted to the first three-axis scanner (10) and which irradiates the object with an ultrasonic wave by a first irradiation method; and a second probe (25) which is held by a second probe holder (24) fitted to the second three-axis scanner (20) and which irradiates the object with an ultrasonic wave by a second irradiation method. The object is irradiated with an ultrasonic wave by the first probe (15) or the second probe (25).

Description

Ultrasound imaging device

[0001] The present invention relates to an ultrasound imaging device.

[0002] An ultrasound imaging device irradiates an object under test (test specimen) with ultrasound waves from a probe, receives the reflected waves, and images the target interface. Non-Patent Document 1 proposes an ultrasound imaging device equipped with a twin probe, which is simultaneously equipped with both a single probe using a single scan method for high-resolution measurements and an array probe using an electronic scan method for high-speed measurements. This eliminates the need for probe replacement, thereby improving work efficiency.

[0003] Ultrasound imaging device FineSAT Hybrid, [online], May 22, 2020, Internet <URL: https: / / www.hitachi-power-solutions.com / product-site / finesat / products / finesat-hybrid / index.html>

[0004] The technology disclosed in Non-Patent Document 1 has been widely used, but because a single probe and an array probe are attached to one triaxial scanner at the same time, there is a restriction that an array probe with a large mass cannot be attached due to the load-bearing capacity of the triaxial scanner. Therefore, there is a problem that it cannot meet the need to have multiple probes and scan an object at higher speeds using an array probe.

[0005] SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an ultrasonic imaging apparatus having a plurality of probes that overcomes the restrictions on the probes that can be attached.

[0006] In order to achieve the above object, the ultrasonic imaging device of the present invention is an ultrasonic imaging device that irradiates ultrasonic waves onto an object of semiconductors stacked in multiple layers, acquires the reflected waves, and images the layer interface of the object, and is equipped with a control device, a first triaxial scanner and a second triaxial scanner arranged on a stage, a first probe attached to the first triaxial scanner with a first probe holder, held by the first probe holder, and irradiating the ultrasonic waves onto the object by a first irradiation method, and a second probe attached to the second triaxial scanner with a second probe holder, held by the second probe holder, and irradiating the ultrasonic waves onto the object by a second irradiation method, and is characterized in that when the control device selects an array type probe having a plurality of transducers as the first probe, the control device selects a single type probe having a single transducer as the second probe, and when the control device selects the single type probe as the first probe, the control device selects the array type probe as the second probe, and irradiates the ultrasonic waves onto the object by either the first probe or the second probe. Other aspects of the present invention will be described in the following embodiments.

[0007] According to the present invention, it is possible to provide an ultrasound imaging apparatus having a plurality of probes, which alleviates the restrictions on the probes that can be attached.

[0008] It is a diagram showing the configuration of an ultrasonic imaging device according to the present embodiment. It is a diagram showing details of a scanning unit according to the present embodiment. It is a diagram showing an example of a combination of a first triaxial scanner and a second triaxial scanner. It is a flowchart showing an example of a scanning process of an ultrasonic imaging device.

[0009] An embodiment of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a diagram showing the configuration of an ultrasonic imaging device 100 according to this embodiment. The ultrasonic imaging device 100 includes a control device 50, a scanning unit 30 (mechanical unit), and ultrasonic probes (a first probe 15 and a second probe 25 (see FIG. 2 )). The ultrasonic imaging device 100 irradiates ultrasonic waves via the probes at irradiation points set at predetermined intervals within an inspection area of ​​an object, acquires the reflected waves, extracts interface echoes from the reflected waves that indicate the waveform of the bonded interface to be inspected, performs a process for generating pixelated information from the signal intensity of the interface echoes for all irradiation points or for specific irradiation points, and generates an image of the bonded interface based on the generated pixelated information for the irradiation points to identify defects.

[0010] The control device 50 has a processing unit 51 that controls the scanning position of the ultrasonic probe and controls the transmission and reception of ultrasonic waves, an image generation unit 52 that acquires reflected waves from the first probe 15 and the second probe 25 and generates an ultrasonic image, and an input / output unit 53.

[0011] The scanning unit 30 is configured to include a first triaxial scanner 10 and a second triaxial scanner 20 on a stage 35. A first probe holder 14 is attached to the first triaxial scanner 10, and a second probe holder 24 is attached to the second triaxial scanner 20. The first triaxial scanner 10 is controlled via a first control unit 19, and the second triaxial scanner 20 is controlled via a second control unit 29.

[0012] Fig. 2 is a diagram showing details of the scanning unit 30 according to this embodiment. Fig. 2 shows a combination of the first triaxial scanner 10 and the second triaxial scanner 20 as viewed from above. The scanning unit 30 has a first X-axis drive shaft 11 and a second X-axis drive shaft 21 arranged on a stage 35 so as to face each other at one end of the stage 35, and a first Y-axis drive shaft 12 and a second Y-axis drive shaft 22 arranged so as to face each other at the other end.

[0013] The first X-axis drive shaft 11 is supported by a first Y-axis drive shaft 12 and a first Y-axis guide 13. Similarly, the second X-axis drive shaft 21 is supported by a second Y-axis drive shaft 22 and a second Y-axis guide 23. Details will be described later with reference to FIG.

[0014] A first probe holder 14 is placed on the first X-axis drive shaft 11, and a first Z-axis drive shaft 18 is connected to the first probe holder 14. A first probe 15 is fixedly disposed on the first Z-axis drive shaft 18 via a probe fixing part that can adjust its position in the Z-axis direction. The first probe 15 irradiates an object such as a semiconductor with ultrasonic waves by a first irradiation method.

[0015] A second probe holder 24 is placed on the second X-axis drive shaft 21, and a second Z-axis drive shaft 28 is connected to the second probe holder 24. A second probe 25 is fixedly disposed on the second Z-axis drive shaft 28 via a probe fixing part that can adjust the position in the Z-axis direction. The second probe 25 irradiates an object such as a semiconductor with ultrasonic waves by a second irradiation method.

[0016] The first probe 15 operates within a range of a first XY plane having a first origin 17 as its origin, which is formed by the operating range in the X-axis direction in which the first X-axis drive shaft 11 operates and the operating range in the Y-axis direction in which the first Y-axis drive shaft 12 operates.

[0017] The second probe 25 operates within a range of a second XY plane formed by the X-axis operating range in which the second X-axis drive shaft 21 operates and the Y-axis operating range in which the second Y-axis drive shaft 22 operates, with the second origin 27 as the origin.

[0018] The first XY plane and the second XY plane are a common range (common scan range 37), and this range is the scan range in which the first probe 15 or the second probe 25 can operate when it is an active probe in an active state.

[0019] 2, the first triaxial scanner 10 (see FIG. 1) and the second triaxial scanner 20 (see FIG. 1) are arranged point-symmetrically in plan view with respect to the center of the common scan range 37. However, this is not a limitation.

[0020] When the control device 50 sets the first probe 15 as an operating probe, it issues an operation command signal to the first X-axis drive axis 11, the first Y-axis drive axis 12, and the first Z-axis drive axis 18 of the first triaxial scanner 10 via the first control unit 19, drives them by the required amount, moves the first probe 15 to the target position, issues a command to the first probe 15 to emit ultrasound waves, irradiates the object, and captures the reflected waves from the object received by the first probe 15 to generate an image of the ultrasound irradiated surface of the object.

[0021] Furthermore, when the control device 50 sets the second probe 25 as the operating probe, it issues an operation command signal to the second X-axis drive axis 21, the second Y-axis drive axis 22, and the second Z-axis drive axis 28 of the second three-axis scanner 20 via the second control unit 29, drives them by the required amount, moves the second probe 25 to the target position, issues a command to the second probe 25 to emit ultrasound waves, irradiates the object, and captures the reflected waves from the object received by the second probe 25 to generate an image of the ultrasound irradiated surface of the object.

[0022] 3 is a diagram showing an example of a combination of a first triaxial scanner 10 and a second triaxial scanner 20. The first triaxial scanner 10 includes a first X-axis drive shaft 11, a first Y-axis drive shaft 12, a first Y-axis guide 13, and a first Z-axis drive shaft 18. The first X-axis drive shaft 11 can be moved in the Y-axis direction by the first Y-axis drive shaft 12 and the first Y-axis guide 13 via first X-axis support portions 11a and 11b.

[0023] The second three-axis scanner 20 includes a second X-axis drive shaft 21, a second Y-axis drive shaft 22, a second Y-axis guide 23, and a second Z-axis drive shaft 28. The second X-axis drive shaft 21 can be moved in the Y-axis direction by the second Y-axis drive shaft 22 and the second Y-axis guide 23 via second X-axis support portions 21a and 21b.

[0024] A combination of the first triaxial scanner 10 and the second triaxial scanner 20 is shown in configuration example 38. In configuration example 38, it can be seen that the two sets of triaxial scanners can be combined without interfering with each other in their ranges of motion.

[0025] 4 is a flowchart showing an example of the scan process S60 of the ultrasound imaging device 100. Referring to FIG. 4, the selection of the first probe 15 and the second probe 25 will be described in detail. When the operator turns on the power of the ultrasound imaging device 100, the control device 50 issues a standby command signal to the first triaxial scanner 10 and the second triaxial scanner 20, causing the first probe holder 14 (including the first probe 15; the same applies hereinafter) and the second probe holder 24 (including the second probe 25; the same applies hereinafter) to wait at the first standby position 16 and the second standby position 26, respectively.

[0026] (Process S61) When the operator gives a first probe selection signal to the ultrasound imaging device 100, the control device 50 gives an operation command signal to the first triaxial scanner 10 to set the first probe holder 14 to the first origin 17. Thereafter, the operator scans the object with the first probe 15.

[0027] Specifically, the control device 50 receives the first probe selection signal, operates the first triaxial scanner 10, sets the array probe as the working probe at the first origin 17, and then scans the entire surface of the object with the array probe. When a defect or the like is confirmed, the X and Y coordinates are stored as the return position.

[0028] (Process S62) When the operator applies a second probe selection signal to the ultrasound imaging device, the control device 50 applies a standby command signal to the first triaxial scanner 10 to move the first probe holder 14 to the first standby position 16 and make it wait, and applies a return command signal to the second triaxial scanner 20 to set the second probe holder 24 to a predetermined return position.

[0029] Specifically, the control device 50 receives a second probe selection signal, issues a standby command signal to the first three-axis scanner 10, causes the array probe to wait in a standby position as a standby probe, operates the second three-axis scanner 20, sets the single probe as an operating probe in a return position, and then generates a high-resolution image using the single probe.

[0030] (Process S63) When a plurality of return positions are stored, the second triaxial scanner 20 is operated to set the single probe as the working probe at the return position, and then a high-definition image is generated by the single probe.

[0031] Note that the first probe holder 14 and the second probe holder 24 may move in the opposite direction. That is, when the operator provides a second probe selection signal to the ultrasound imaging device 100, the control device 50 provides an operation command signal to the second triaxial scanner 20 to set the second probe holder 24 to the second origin 27. The operator then scans the object with the second probe. When the operator provides a first probe selection signal to the ultrasound imaging device 100, the control device 50 provides a standby command signal to the second triaxial scanner 20 to move the second probe holder 24 to the second standby position 26 to hold the second probe holder 24 on standby, and provides a return command signal to the first triaxial scanner 10 to set the first probe holder 14 to a predetermined return position.

[0032] In addition, the first standby position 16 is set at a predetermined position on the first X-axis drive shaft 11 or the first Y-axis drive shaft 12, and the second standby position 26 is set at a predetermined position on the second X-axis drive shaft 21 or the second Y-axis drive shaft 22.

[0033] This ensures that when either the first probe 15 or the second probe 25 is in operation, the other probe will not come into contact with it, i.e., the axes are set outside the common scan range 37.

[0034] As an example of actual use, an array type probe having a plurality of transducers and irradiating an object with ultrasound in an array manner as a first irradiation method is selected as the first probe 15, and a single type probe having a single transducer and irradiating an object with a single ultrasound as a second irradiation method is selected as the second probe 25. Note that the first probe 15 and the second probe 25 may have the opposite configuration.

[0035] Compared to a single-type probe, an array-type probe has a faster scanning speed by electronically scanning the same number of transducers in the Y-axis direction as the number of transducers. Compared to an array-type probe, a single-type probe can use a higher frequency, making it possible to generate higher-resolution images.

[0036] Next, the scanning process will be described. The operator applies a first probe selection signal to the ultrasound imaging device, and the ultrasound imaging device 100 applies an operation command signal to the first triaxial scanner 10 to select the array probe as the operating probe and quickly scan the entire surface of the object. During this process, if a defect or the like is found in the object, the X- and Y-coordinates of that position are stored in the memory unit of the control device as the return position.

[0037] Next, the operator applies a second probe selection signal to the ultrasound imaging device. The ultrasound imaging device 100 applies a standby command signal to the first triaxial scanner 10, causing the array probe to be the standby probe and move to the first standby position 16 to wait. The ultrasound imaging device 100 applies an operation command signal to the second triaxial scanner 20, selecting the single probe as the active probe, setting it to the return position, and scanning the object to generate a high-definition image of the defect.

[0038] In this example of the scanning method, the return position, which is the position at which the second probe 25 is set as the operating probe when switching the operating probe from the first probe 15 to the second probe 25, is set to the position just before the first probe 15 waits as a standby probe, but the return position may also be set as follows.

[0039] When the first probe 15 is the working probe, the second origin 27 of the second XY plane is set, and when the second probe 25 is the working probe, the first origin 17 of the first XY plane or the center position of the object is set. These may be set according to the operating conditions when inspecting the object in a test operation prior to actual operation of the ultrasound imaging device.

[0040] The Z-axis direction of the first probe holder 14 and the second probe holder 24 is determined based on the inspection conditions during test operation so that the probe tips do not come into contact with the object.

[0041] As described above, the ultrasonic imaging device 100 of this embodiment has the following features: (1) The ultrasonic imaging device 100 irradiates ultrasonic waves onto an object made of semiconductors stacked in multiple layers, acquires the reflected waves, and images the layer interface of the object, and includes a control device 50, a first triaxial scanner 10 and a second triaxial scanner 20 arranged on a stage 35, a first probe 15 attached to the first triaxial scanner 10 with a first probe holder 14, a first probe 15 held by the first probe holder 14 and irradiating the object with ultrasonic waves by a first irradiation method, and a second probe 25 attached to the second triaxial scanner 20 with a second probe holder 24 and held by the second probe holder 24 and irradiating the object with ultrasonic waves by a second irradiation method, and irradiates the object with ultrasonic waves using either the first probe 15 or the second probe 25. This makes it possible to provide an ultrasonic imaging device having multiple probes that alleviates restrictions on the probes that can be attached.

[0042] (2) In the ultrasonic imaging device 100 of (1), when the ultrasonic imaging device 100 is powered on, the control device 50 issues a standby command signal to the first triaxial scanner 10 and the second triaxial scanner 20, causing the first probe holder 14 and the second probe holder 24 to wait at the first standby position 16 and the second standby position 26, respectively. When the control device 50 receives a first probe selection signal, it issues an operation command signal to the first triaxial scanner 10, causing the first probe holder 14 to be set at the first origin 17 and scan the object. When the control device 50 receives a second probe selection signal, it issues a standby command signal to the first triaxial scanner 10, causing the first probe holder 14 to move to the first standby position 16 and wait there. When the control device 50 receives a second probe selection signal, it issues a standby command signal to the first triaxial scanner 10, causing the first probe holder 14 to wait at the first standby position 16, and then issues an operation command signal to the second triaxial scanner 20, causing the second probe holder 24 to be set at a predetermined return position.

[0043] (3) The ultrasound imaging device 100 of (2) above includes a first X-axis drive shaft 11 and a first Y-axis drive shaft 12 for driving the first triaxial scanner 10, and a second X-axis drive shaft 21 and a second Y-axis drive shaft 22 for driving the second triaxial scanner 20, on a stage 35. A first XY plane is formed by the range in the X-axis direction in which the first X-axis drive shaft 11 operates and the range in the Y-axis direction in which the first Y-axis drive shaft 12 operates, and a second XY plane is formed by the range in the X-axis direction in which the second X-axis drive shaft 21 operates and the range in the Y-axis direction in which the second Y-axis drive shaft 22 operates, forming a scan range (common scan range 37) that is a common range in which the movable probes move.

[0044] (4) In the ultrasonic imaging device 100 of (3), the first X-axis drive shaft 11 and the second X-axis drive shaft 21 are arranged to face each other at one end of the stage 35, and the first Y-axis drive shaft 12 and the second Y-axis drive shaft 22 are arranged to face each other at the other end of the stage 35. The control device 50 sets the first standby position 16 to a predetermined position on the first X-axis drive shaft 11 or the first Y-axis drive shaft 12 outside the vicinity of the scan range, and sets the second standby position 26 to a predetermined position on the second X-axis drive shaft 21 or the second Y-axis drive shaft 22 outside the vicinity of the scan range.

[0045] (5) In the ultrasonic imaging device 100 of (3) above, in a test operation prior to actual operation of the ultrasonic imaging device 100, the return position is set based on the operating conditions of the ultrasonic imaging device 100 to a position just before the operating probe is switched to a standby probe and the operating probe waits at the standby position, or to the center position of the object, or to the second origin 27 of the second XY plane when the first probe 15 is the operating probe, or to the first origin 17 of the first XY plane when the second probe 25 is the operating probe.

[0046] (6) In the ultrasonic imaging device 100 of (1), when the first probe 15 is an array type probe having a plurality of transducers, the second probe 25 is a single type probe having a single transducer, and when the first probe 15 is a single type probe, the second probe 25 is an array type probe. This allows the operator of the ultrasonic imaging device 100 to quickly select between the array type probe and the single type probe without having to replace the probe. As a result, the array type probe can be used to image defects in the multilayer semiconductor, and the array type probe can be placed on standby without requiring replacement work, and the single type probe can be operated to acquire detailed images.

[0047] It should be noted that the present invention is not limited to the above-described embodiments and includes various modifications. Furthermore, the above-described embodiments have been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to those including all of the described configurations. Furthermore, it is possible to add, delete, or replace part of the configuration of each example with other configurations.

[0048] REFERENCE SIGNS LIST 10 First three-axis scanner 11 First X-axis drive axis 12 First Y-axis drive axis 13 First Y-axis guide 14 First probe holder 15 First probe 16 First standby position 17 First origin 18 First Z-axis drive axis 19 First control unit 20 Second three-axis scanner 21 Second X-axis drive axis 22 Second Y-axis drive axis 23 Second Y-axis guide 24 Second probe holder 25 Second probe 26 Second standby position 27 Second origin 28 Second Z-axis drive axis 29 Second control unit 30 Scanning unit 35 Stage 37 Common scan range 50 Control device 51 Processing unit 52 Image generation unit 53 Input / output unit 100 Ultrasonic imaging device

Claims

1. An ultrasonic imaging device which irradiates ultrasonic waves onto an object made of semiconductors stacked in multiple layers, acquires the reflected waves, and visualizes the interface of the stacked layers of the object, comprising: a control device; a first triaxial scanner and a second triaxial scanner arranged on a stage; a first probe having a first probe holder attached to the first triaxial scanner and held by the first probe holder to irradiate the ultrasonic waves onto the object by a first irradiation method; and a second probe having a second probe holder attached to the second triaxial scanner and held by the second probe holder to irradiate the ultrasonic waves onto the object by a second irradiation method, wherein the control device selects, when the first probe selects an array type probe having multiple transducers, the second probe selects a single type probe having a single transducer, and when the first probe selects the single type probe, the second probe selects the array type probe, and the ultrasonic imaging device irradiates the ultrasonic waves onto the object by either the first probe or the second probe.

2. An ultrasonic imaging device as described in claim 1, wherein the control device, when the power supply of the ultrasonic imaging device is turned ON, issues a standby command signal to the first triaxial scanner and the second triaxial scanner, causing the first probe holder and the second probe holder to wait at a first standby position and a second standby position, respectively; when a first probe selection signal is received, issues an operation command signal to the first triaxial scanner, setting the first probe holder to a first origin and scanning the object; when a second probe selection signal is received, issues a standby command signal to the first triaxial scanner, moving the first probe holder to the first standby position and causing it to wait, and issues an operation command signal to the second triaxial scanner, causing the second probe holder to set to a predetermined return position.

3. An ultrasonic imaging device as claimed in claim 2, characterized in that the stage is provided with a first X-axis drive axis and a first Y-axis drive axis for driving the first three-axis scanner, and a second X-axis drive axis and a second Y-axis drive axis for driving the second three-axis scanner, and a scan range, which is a common range within which movable probes move, is formed by a first XY plane formed by the X-axis range in which the first X-axis drive axis operates and the Y-axis range in which the first Y-axis drive axis operates, and a second XY plane formed by the X-axis range in which the second X-axis drive axis operates and the Y-axis range in which the second Y-axis drive axis operates.

4. An ultrasonic imaging device as claimed in claim 3, characterized in that the first X-axis drive shaft and the second X-axis drive shaft are arranged to face each other at one end of the stage, and the first Y-axis drive shaft and the second Y-axis drive shaft are arranged to face each other at the other end of the stage, and the control device sets the first standby position to a predetermined position on the first X-axis drive shaft or the first Y-axis drive shaft near the outside of the scanning range, and sets the second standby position to a predetermined position on the second X-axis drive shaft or the second Y-axis drive shaft near the outside of the scanning range.

5. An ultrasonic imaging device as described in claim 3, characterized in that, in a test operation prior to actual operation of the ultrasonic imaging device, the return position is set based on the operating conditions of the ultrasonic imaging device to a position immediately before the operating probe is switched to a standby probe and the operating probe waits at a standby position, or to the center position of the object, or to the second origin of the second XY plane when the first probe is the operating probe, and to the first origin of the first XY plane when the second probe is the operating probe.

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