Display apparatus

Abstract

This display apparatus comprises a plurality of display modules and a frame configured to support the plurality of display modules in a matrix form. The frame comprises: a first module attachment layer to which some of the plurality of display modules are attached, the first module attachment layer having a first thermal expansion coefficient; a first frame panel coupled to the first module attachment layer and having a second thermal expansion coefficient different from the first thermal expansion coefficient; a second module attachment layer to which the remaining some of the plurality of display modules are attached, the second module attachment layer having the first thermal expansion coefficient and being disposed adjacent to the first module attachment layer; a second frame panel coupled to the second module attachment layer, the second frame panel having the second thermal expansion coefficient and being disposed adjacent to the first frame panel; a first retaining member provided to retain a first portion on the first module attachment layer and a first portion on the first frame panel such that the first portion on the first module attachment layer and the first portion on the first frame panel do not relatively move as the first module attachment layer and the first frame panel thermally expand; and a second retaining member provided to retain a first portion on the second module attachment layer and a first portion on the second frame panel such that the first portion on the second module attachment layer and the first portion on the second frame panel do not relatively move as the second module attachment layer and the second frame panel thermally expand.

Description

display device

[0001] The present disclosure relates to a display device that displays an image by combining modules in which self-luminous light-emitting elements are arranged on a substrate.

[0002] A display device is an output device that visually displays data information such as characters, shapes, and images.

[0003] Typically, display devices primarily use liquid crystal panels (LCDs), which require backlighting, or organic light-emitting diode (OLED) panels, which are made of a film of organic compounds that emit light on their own in response to current. However, LCDs have slow response times, consume significant power, and require a backlight rather than being self-luminous. As a result, display devices containing LCDs are generally not compact. OLED panels do not require a backlight because they are self-luminous, allowing them to be made thinner. However, if the same screen is displayed for a long time, they are susceptible to burn-in, a phenomenon in which a specific part of the previous screen remains even after the screen is changed. This phenomenon mainly occurs when the subpixels reach the end of their lifespan.

[0004] Accordingly, research is being conducted on micro light-emitting diode (microLED or μLED) display panels that mount inorganic light-emitting elements on a substrate and use the inorganic light-emitting elements themselves as pixels as new panels to replace them.

[0005] A micro light-emitting diode display panel (hereinafter, micro LED panel) is one type of flat panel display panel and is composed of a plurality of inorganic light-emitting diodes (inorganic LEDs), each of which is 100 micrometers or less in size.

[0006] These micro LED panels are also self-luminous devices, but they do not suffer from the burn-in phenomenon of OLEDs and have superior brightness, resolution, power consumption, and durability.

[0007] Compared to liquid crystal display (LCD) panels, which require backlighting, microLED display panels offer better contrast, response time, and energy efficiency. Both organic light-emitting diodes (OLEDs) and inorganic light-emitting diodes (MLEDs) are energy efficient, but MLEDs offer greater brightness, luminous efficacy, and a longer lifespan than OLEDs.

[0008] In addition, by arranging LEDs on a circuit board in pixel units, display modularization can be produced on a board-by-board basis, and it is easy to produce various resolutions and screen sizes to suit consumer orders.

[0009] One aspect of the present disclosure can provide a display device in which a gap between a plurality of display modules is maintained at a certain level due to thermal expansion, thereby preventing a seam that may occur between the plurality of display modules from being amplified.

[0010] One aspect of the present disclosure provides a display device that includes a plurality of frames and can prevent a seam between a plurality of display modules supported by the plurality of frames from being amplified due to thermal expansion.

[0011] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0012] A display device according to the invention includes a plurality of display modules and a frame supporting the plurality of display modules in a matrix form. The frame comprises a first module attachment layer to which some of the plurality of display modules are attached and has a first coefficient of thermal expansion, a first frame panel coupled with the first module attachment layer and having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, a second module attachment layer to which some of the remaining plurality of display modules are attached and has the first coefficient of thermal expansion and is disposed adjacent to the first module attachment layer, a second frame panel coupled with the second module attachment layer and has the second coefficient of thermal expansion and is disposed adjacent to the first frame panel, and a first fixing member provided to fix the first portion on the first module attachment layer and the first portion on the first frame panel so that the first portion on the first module attachment layer and the first portion on the first frame panel do not move relative to each other as the first module attachment layer and the first frame panel undergo thermal expansion, and the second module attachment layer and the A second fixing member is provided to fix the first portion on the second module attachment layer and the first portion on the second frame panel so that the first portion on the second module attachment layer and the first portion on the second frame panel do not move relative to each other as the second frame panel thermally expands.

[0013] A display device according to the invention includes a plurality of display modules and a frame that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form. The frame includes a plurality of module attachment layers to which the plurality of display modules are attached, the plurality of module attachment layers having a first coefficient of thermal expansion, and horizontally arranged in a 2*2 matrix form, a plurality of frame panels coupled to the plurality of module attachment layers, the plurality of frame panels having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, and horizontally arranged in a 2*2 matrix form, and a plurality of fixing members that fix the first portions of each of the plurality of module attachment layers and the first portions of each of the plurality of frame panels so that the first portions of each of the plurality of module attachment layers and the first portions of each of the plurality of frame panels corresponding to the first portions of each of the plurality of first portions do not move relative to each other in a horizontal direction.

[0014] A display device according to the invention comprises a plurality of display modules, each of the plurality of display modules including a substrate having a first coefficient of thermal expansion, and a frame provided to support the plurality of display modules in a matrix form. The frame comprises a module attachment layer attached to the plurality of display modules and having the first coefficient of thermal expansion, a frame panel bonded to the module attachment layer and having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, and an adhesive layer bonding the module attachment layer and the frame panel between the module attachment layer and the frame panel, wherein a ductility of the adhesive layer is greater than a ductility of the module attachment layer and a ductility of the frame panel.

[0015] FIG. 1 illustrates a display device according to one embodiment.

[0016] Figure 2 is an exploded view illustrating the main components of a display device according to one embodiment.

[0017] FIG. 3 illustrates an enlarged cross-section of a portion of a display module of a display device according to one embodiment.

[0018] FIG. 4 illustrates the rear side of one display module of a display device according to one embodiment.

[0019] FIG. 5 illustrates a frame in a display device according to one embodiment.

[0020] FIG. 6 illustrates a frame in an exploded manner in a display device according to one embodiment.

[0021] FIG. 7 is a front view of a frame in a display device according to one embodiment.

[0022] Figure 8 schematically illustrates the frame illustrated in Figure 7.

[0023] FIG. 9 schematically illustrates the appearance of a frame when thermally expanded in a display device according to one embodiment.

[0024] FIG. 10 illustrates an example of a fixing member in a display device according to one embodiment.

[0025] FIG. 11 illustrates an example of a fixing member in a display device according to one embodiment.

[0026] FIG. 12 schematically illustrates a frame in a display device according to one embodiment.

[0027] FIG. 13 schematically illustrates the appearance of a frame when thermally expanded in a display device according to one embodiment.

[0028] FIG. 14 schematically illustrates a frame in a display device according to one embodiment.

[0029] FIG. 15 schematically illustrates a frame in a display device according to one embodiment.

[0030] It should be understood that the various embodiments and terms used in this document are not intended to limit the technical features described in this document to specific embodiments, but rather to include various modifications, equivalents, or substitutes of the embodiments.

[0031] In connection with the description of the drawings, similar reference numerals may be used for similar or related components.

[0032] The singular form of a noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise.

[0033] In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof.

[0034] The term “and / or” includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0035] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0036] When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0037] The terms “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in this document, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0038] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0039] When we say that a component is “on” another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0040] Meanwhile, the terms “front”, “back”, “left”, “right”, “up”, “down”, etc. used in the description below are defined based on the drawing, and the shape and position of each component are not limited by these terms.

[0041] FIG. 1 illustrates a display device according to one embodiment. FIG. 2 illustrates an exploded view of the main components of the display device according to one embodiment. FIG. 3 illustrates an enlarged cross-section of a portion of a display module of the display device according to one embodiment. FIG. 4 illustrates the rear surface of a display module of the display device according to one embodiment.

[0042] Some components of the display device (1), including the plurality of inorganic light-emitting elements (50) illustrated in the drawing, are micro-unit components having a size of several μm to several hundred μm, and for convenience of explanation, the scale of some components (the plurality of inorganic light-emitting elements (50), the black matrix (48), etc.) is exaggerated.

[0043] A display device (1) is a device that displays information, data, and other information in the form of characters, shapes, graphs, images, etc., and a TV, PC, mobile, digital signage, etc. can be implemented as a display device (1).

[0044] According to an embodiment of the present disclosure, as shown in FIGS. 1 and 2, a display device (1) may include a display panel (20) for displaying an image, a board (25) for driving and / or controlling the display panel (20), a frame (100) for supporting the display panel (20), and a rear cover (10) for covering the rear of the frame (100).

[0045] The display panel (20) may include a plurality of display modules (30A-30P), a driving board for driving each of the display modules (30A-30P), and a TCON board (Timing controller board) for generating a timing signal required for controlling each of the display modules (30A-30P).

[0046] The board (25) may include a circuit board for driving and / or controlling the display device (1). For example, the board (25) may include at least one of a power board for supplying power to the display panel (20), a control board for controlling the overall operation of the display panel (20), and a communication board for communicating with an external device.

[0047] The rear cover (10) can support the display panel (20). The rear cover (10) can be installed on the floor via a stand, or installed on a wall via a hanger or the like.

[0048] A plurality of display modules (30A-30P) can be arranged vertically, horizontally, and horizontally so as to be adjacent to each other. A plurality of display modules (30A-30P) can be arranged in a matrix form of M * N. In the present embodiment, 16 display modules (30A-30P) are provided and arranged in a matrix form of 4 * 4, but there is no limitation on the number and arrangement method of the plurality of display modules (30A-30P).

[0049] A plurality of display modules (30A-30P) can be installed in a frame (100). The plurality of display modules (30A-30P) can be installed in the frame (100) through various known methods, such as magnetic force using a magnet, a mechanical fitting structure, or adhesion. A rear cover (10) is coupled to the rear of the frame (100), and the rear cover (10) can form the rear exterior of the display device (1). The frame (100) can include a plurality of module openings (100a) formed to correspond to the plurality of display modules (30A-30P).

[0050] The rear cover (10) may include a metal material. Accordingly, heat generated from the plurality of display modules (30A-30P) and the frame (100) can be easily conducted to the rear cover (10), thereby increasing the heat dissipation efficiency of the display device (1).

[0051] A display device (1) according to various embodiments can implement a large screen by tiling a plurality of display modules (30A-30P).

[0052] Unlike the embodiment of the present disclosure, each of the plurality of display modules (30A-30P) can be applied to a display device. The display module (30A-30P) can be installed and applied as a single unit in wearable devices, portable devices, handheld devices, and various electronic products or battlefields requiring displays, and can be applied to display devices such as monitors for personal computers (PCs), high-resolution TVs, signage, electronic displays, etc. through a plurality of assembly arrangements in a matrix type as in the embodiment of the present disclosure.

[0053] Multiple display modules (30A-30P) may have identical configurations. Therefore, the description of any one display module described below may be equally applied to all other display modules.

[0054] As an example, among the plurality of display modules (30A-30P), the first display module (30A) may be formed in a quadrangle type. The first display module (30A) may be provided in a rectangular (rectangle type) shape or a square (square type) shape.

[0055] The first display module (30A) may include edges (31, 32, 33, 34) formed in the up, down, left, and right directions based on the first direction (X) that is the front.

[0056] As illustrated in FIG. 3, each of the plurality of display modules (30A-30P) may include a substrate (40) and a plurality of inorganic light-emitting elements (50) mounted (arranged) on the substrate (40). The plurality of inorganic light-emitting elements (50) may be mounted on a mounting surface (41) of the substrate (40) facing in the first direction (X). In FIG. 3, the thickness of the substrate (40) in the first direction (X) is exaggeratedly illustrated for convenience of explanation.

[0057] The substrate (40) may be formed in a quadrangle type. As described above, each of the plurality of display modules (30A-30P) may be provided in a quadrangle shape, and the substrate (40) may be formed in a quadrangle type to correspond thereto.

[0058] The substrate (40) can be provided in a rectangular shape or a square shape.

[0059] As an example, the first display module (30A) may include four borders corresponding to the borders (31, 32, 33, 34) of the first display module (30A) formed in the up, down, left, and right directions based on the first direction (X) that is the front.

[0060] The substrate (40) may include a base substrate (42), a mounting surface (41) forming one side of the base substrate (42), a rear surface (43) forming the other side of the base substrate (42) and positioned opposite the mounting surface (41), and a side surface (45) positioned between the mounting surface (41) and the rear surface (43).

[0061] The substrate (40) may include a TFT layer (Thin Film Transistor, 44) formed on a base substrate (42) to drive inorganic light-emitting elements (50). The base substrate (42) may include a glass substrate. The substrate (40) may include a COG (Chip on Glass) type substrate. The substrate (40) may include first and second pad electrodes (44a, 44b) provided so that the inorganic light-emitting elements (50) are electrically connected to the TFT layer (44).

[0062] The TFT (Thin Film Transistor) constituting the TFT layer (44) is not limited to a specific structure or type and may be configured in various embodiments. The TFT of the TFT layer (44) according to one embodiment may be implemented not only as an LTPS (Low Temperature Poly Silicon) TFT, an oxide TFT, a Si (poly silicon, or a-silicon) TFT, but also as an organic TFT, a graphene TFT, etc.

[0063] The TFT layer (44) can be replaced with a CMOS (Complementary Metal-Oxide Semiconductor) type or n-type MOSFET or p-type MOSFET transistor when the base substrate (42) of the substrate (40) is made of a silicon wafer.

[0064] The plurality of inorganic light-emitting elements (50) are formed of an inorganic material and may include inorganic light-emitting elements having a size of several μm to several tens of μm in length, width, and height, respectively. The micro inorganic light-emitting elements may have a size in which the length of a short side among the length, width, and height is 100 μm or less. The inorganic light-emitting elements (50) may be picked up from a wafer formed of a sapphire or silicon material and directly transferred onto a substrate (40). The plurality of inorganic light-emitting elements (50) may be picked up and transferred by an electrostatic method using an electrostatic head or a stamp method using an elastic polymer material such as PDMS or silicon as a head.

[0065] The plurality of inorganic light-emitting elements (50) may be a light-emitting structure including an n-type semiconductor (58a), an active layer (58c), a p-type semiconductor (58b), a first contact electrode (57a), and a second contact electrode (57b).

[0066] One of the first contact electrode (57a) and the second contact electrode (57b) may be electrically connected to the n-type semiconductor (58a) and the other may be electrically connected to the p-type semiconductor (58b).

[0067] The first contact electrode (57a) and the second contact electrode (57b) may be horizontally arranged and may be in the form of a flip chip arranged in the same direction (opposite to the light-emitting direction).

[0068] The inorganic light-emitting element (50) has a light-emitting surface (54) arranged toward the first direction (X) when mounted on the mounting surface (41), a side surface (55), and a bottom surface (56) arranged on the opposite side of the light-emitting surface (54), and a first contact electrode (57a) and a second contact electrode (57b) can be formed on the bottom surface (56).

[0069] The contact electrodes (57a, 57b) of the inorganic light-emitting element (50) are arranged on the opposite side of the light-emitting surface (54), and thus can be arranged on the opposite side of the direction in which light is irradiated.

[0070] The contact electrodes (57a, 57b) are arranged to face the mounting surface (41) and are electrically connected to the TFT layer (44), and a light-emitting surface (54) that irradiates light in a direction opposite to the direction in which the contact electrodes (57a, 57b) are arranged can be arranged.

[0071] When light generated from the active layer (58c) is irradiated in the first direction (X) through the light-emitting surface (54), the light can be irradiated toward the first direction (X) without interference from the first contact electrode (57a) or the second contact electrode (57b).

[0072] The first direction (X) can be defined as the direction in which the light-emitting surface (54) that irradiates light faces. For example, the first direction (X) can point forward.

[0073] The first contact electrode (57a) and the second contact electrode (57b) can be electrically connected to the first pad electrode (44a) and the second pad electrode (44b), respectively, formed on the mounting surface (41) side of the substrate (40).

[0074] The inorganic light emitting element (50) can be directly connected to the pad electrodes (44a, 44b) through a bonding configuration such as an anisotropic conductive layer (47) or solder.

[0075] An anisotropic conductive layer (47) may be formed on the substrate (40) to mediate electrical connection between the contact electrodes (57a, 57b) and the pad electrodes (44a, 44b). The anisotropic conductive layer (47) may have a structure in which an anisotropic conductive adhesive is attached on a protective film and conductive balls (47a) are dispersed in an adhesive resin. The conductive balls (47a) are conductive spheres surrounded by a thin insulating film, and when the insulating film is broken by heat and pressure, the conductors can be electrically connected to each other.

[0076] The anisotropic conductive layer (47) may include an anisotropic conductive film (ACF) in the form of a film and an anisotropic conductive paste (ACP) in the form of a paste.

[0077] When a plurality of inorganic light-emitting elements (50) are mounted on a substrate (40), when heat and pressure are applied to the anisotropic conductive layer (47), the insulating film of the conductive ball (47a) is broken, so that the contact electrodes (57a, 57b) of the inorganic light-emitting elements (50) and the pad electrodes (44a, 44b) of the substrate (40) can be electrically connected.

[0078] However, a plurality of inorganic light-emitting elements (50) may be mounted on the substrate (40) via solder instead of the anisotropic conductive layer (47). After the inorganic light-emitting elements (50) are aligned on the substrate (40), the inorganic light-emitting elements (50) may be bonded to the substrate (40) through a reflow process.

[0079] A plurality of inorganic light-emitting elements (50) may include a red light-emitting element (51), a green light-emitting element (52), and a blue light-emitting element (53), and the light-emitting elements (50) may be mounted on a mounting surface (41) of a substrate (40) as a unit, with a series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53). A series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53) may form one pixel. At this time, the red light-emitting element (51), the green light-emitting element (52), and the blue light-emitting element (53) may each form a sub-pixel.

[0080] For example, the red light emitting element (51), the green light emitting element (52), and the blue light emitting element (53) may be arranged in a row at a predetermined interval, or may be arranged in a different shape, such as a triangular shape.

[0081] The substrate (40) may include a light absorbing layer (44c) to absorb external light and improve contrast. The light absorbing layer (44c) may be formed on the entire mounting surface (41) of the substrate (40). The light absorbing layer (44c) may be formed between the TFT layer (44) and the anisotropic conductive layer (47).

[0082] The plurality of display modules (30A-30P) may further include a black matrix (48) formed between the plurality of inorganic light-emitting elements (50).

[0083] The black matrix (48) can perform a function of complementing the light absorption layer (44c) formed entirely on the mounting surface (41) side of the substrate (40). The black matrix (48) can improve the contrast of the screen by absorbing external light and making the substrate (40) appear black. The black matrix (48) can preferably have a black color.

[0084] According to one embodiment, the black matrix (48) may be formed so as to be positioned between pixels formed by a series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53). Alternatively, the black matrix may be formed more finely to partition each of the light-emitting elements (51, 52, 53) which are sub-pixels.

[0085] The black matrix (48) can be formed in a grid shape with horizontal and vertical patterns to be placed between pixels.

[0086] The black matrix (48) can be formed by applying light-absorbing ink onto an anisotropic conductive layer (47) through an ink-jet process and then curing it, or by coating a light-absorbing film on the anisotropic conductive layer (47).

[0087] On the anisotropic conductive layer (47) formed entirely on the mounting surface (41), a black matrix (48) can be formed in an area where a plurality of inorganic light-emitting elements (50) are not mounted. The black matrix (48) can be formed between the plurality of inorganic light-emitting elements (50).

[0088] Each of the plurality of display modules (30A-30P) may include a front cover (49) disposed on the mounting surface (41) in the first direction (X) to cover the mounting surface (41) of each of the plurality of display modules (30A-30P).

[0089] A plurality of front covers (49) may be provided so as to be formed on each of the plurality of display modules (30A-30P) in the first direction (X).

[0090] The front cover (49) may include a film. The film of the front cover (49) may be provided as a functional film having optical performance.

[0091] The front cover (49) is provided to cover the substrate (40) and can protect the substrate (40) from external force.

[0092] The adhesive layer of the front cover (49) may be provided to have a height greater than a predetermined height in the first direction (X) toward the mounting surface (41) or the light-emitting surface (54). This is to sufficiently fill a gap that may be formed between the front cover (49) and the plurality of inorganic light-emitting elements (50) when the front cover (49) is placed on the substrate (40).

[0093] Each of the plurality of display modules (30A-30P) may include a heat dissipation member (60) provided on the rear surface (43) of the substrate (40). The heat dissipation member (60) may be provided to dissipate heat generated from the substrate (40).

[0094] The heat generated from the substrate (40) may include heat generated from various configurations. The heat that accounts for the largest proportion of the heat generated from the substrate (40) and transferred to the rear surface (43) is the heat generated when a plurality of inorganic light-emitting elements (50) emit light. However, in addition to this, heat may be generated from a plurality of configurations arranged on the mounting surface (41) of the substrate (40), such as the TFT layer (44), and the heat generated from the plurality of configurations may flow into the substrate (40).

[0095] Additionally, heat can be transferred from the outside of the substrate (40) to the substrate (40), and heat can be transferred to the substrate (40) through a configuration outside the substrate (40), thereby generating heat in the substrate (40).

[0096] The heat generated from the substrate (40) described below refers to heat generated from a plurality of components disposed on the substrate (40) including a plurality of inorganic light-emitting elements (50) and introduced into the substrate (40).

[0097] As described above, the heat generated from the plurality of inorganic light-emitting elements (50) is most significantly introduced into the substrate (40), and the largest proportion of the heat generated from the substrate (40) is the heat generated from the plurality of inorganic light-emitting elements (50). However, as described above, it can be said that heat is generated from the substrate (40) by various components and heat generated from the outside of the substrate (40).

[0098] Each of the plurality of display modules (30A-30P) may include an adhesive tape (70) disposed between the back surface (43) of the substrate (40) and the heat dissipation member (60) to adhere the back surface (43) and the heat dissipation member (60).

[0099] A plurality of inorganic light-emitting elements (50) can be electrically connected to a pixel driving wiring formed on a mounting surface (41) and an upper wiring layer formed by extending through a side surface (45) of a substrate (40) and the pixel driving wiring.

[0100] The upper wiring layer can be electrically connected to the side wiring formed on the side surface (45) of the substrate (40). The side wiring can be provided in the form of a thin film.

[0101] The upper wiring layer can be connected to the side wiring by means of an upper connection pad formed on the edge side of the substrate (41).

[0102] The side wiring can be extended along the side (45) of the substrate (40) and connected to a rear wiring layer (43b) formed on the rear surface (43).

[0103] An insulating layer (43c) covering the rear wiring layer (43b) can be formed on the rear wiring layer (43b) in the direction in which the rear surface of the substrate (40) faces.

[0104] That is, a plurality of inorganic light-emitting elements (50) can be electrically connected sequentially to the upper wiring layer, the side wiring layer, and the rear wiring layer (43b).

[0105] Referring to FIG. 4, the first display module (30A) may include a driving circuit board (80) provided to electrically control a plurality of inorganic light-emitting elements (50) mounted on a mounting surface (41). The driving circuit board (80) may be formed as a printed circuit board. The driving circuit board (80) may be disposed on the rear surface (43) of the substrate (40) in the first direction (X). Specifically, it may be disposed on a heat dissipation member (60) adhered to the rear surface (43) of the substrate (40).

[0106] The first display module (30A) may include a flexible film (81) that connects the driving circuit board (80) and the rear wiring layer (43b) so that the driving circuit board (80) is electrically connected to a plurality of inorganic light-emitting elements (50).

[0107] One end of the flexible film (81) can be connected to a rear connection pad (43d) that is placed on the rear surface (43) of the substrate (40) and is electrically connected to a plurality of inorganic light-emitting elements (50).

[0108] The rear connection pad (43d) can be electrically connected to the rear wiring layer (43b). Accordingly, the rear connection pad (43a) can electrically connect the rear wiring layer (43b) and the flexible film (81).

[0109] The flexible film (81) can transmit power and electrical signals from the driving circuit board (80) to a plurality of inorganic light-emitting elements (50) by being electrically connected to the rear connection pad (43d).

[0110] The flexible film (81) can be formed as an FFC (Flexible Flat Cable) or COF (Chip On Film).

[0111] The flexible film (81) may include a first flexible film (81a) and a second flexible film (81b) which are respectively arranged in the up-down direction with respect to the first forward direction (X).

[0112] In contrast, the first flexible film (81a) and the second flexible film (81b) may be arranged in the left and right directions with respect to the first direction (X), or may be arranged in at least two directions among the up, down, left, and right directions.

[0113] The second flexible film (81b) may be provided in multiple pieces. However, the present invention is not limited thereto, and the second flexible film (81b) may be provided in a single piece, and the first flexible film (81a) may also be provided in multiple pieces.

[0114] The first flexible film (81a) can transmit a data signal from the driving circuit board (80) to the substrate (40). The first flexible film (81a) can be formed as a COF (Chip On Film).

[0115] The second flexible film (81b) can transmit power from the driving circuit board (80) to the substrate (40). The second flexible film (81b) can be provided as an FFC (Flexible Flat Cable).

[0116] However, it is not limited to this, and the first flexible film (81a) and the second flexible film (81b) may be formed opposite to each other.

[0117] The driving circuit board (80) can be electrically connected to the main board (25, see FIG. 2). The board (25) can be placed on the rear side of the frame (100), and the board (25) can be connected to the driving circuit board (80) via a cable at the rear of the frame (100).

[0118] The heat dissipation member (60) may be arranged to be in contact with the substrate (40). The heat dissipation member (60) and the substrate (40) may be bonded by an adhesive tape (70) placed between the rear surface (43) of the substrate (40) and the heat dissipation member (60).

[0119] The heat dissipation member (60) may be formed of a material with high thermal conductivity or implemented with a structure with high thermal conductivity. For example, the heat dissipation member (60) may be formed of a graphite sheet. For example, the heat dissipation member (60) may be formed of an aluminum material.

[0120] Heat generated from a plurality of inorganic light-emitting elements (50) and TFT layers (44) mounted on a substrate (40) can be transferred to a heat dissipation member (60) through an adhesive tape (70) along the back surface (43) of the substrate (40).

[0121] Accordingly, heat generated from the substrate (40) can be easily transferred to the heat dissipation member (60), and the substrate (40) can be prevented from rising above a certain temperature.

[0122] A plurality of display modules (30A-30P) can be arranged in various positions in a matrix form of M * N, respectively. Each of the display modules (30A-30P) is provided to be individually movable. At this time, each of the display modules (30A-30P) can individually include a heat dissipation member (60) so that each of the display modules (30A-30P) can maintain a constant level of heat dissipation performance regardless of the position in which it is arranged.

[0123] A plurality of display modules (30A-30P) can form screens of various sizes of the display device (1) in a matrix form of various M * N. Accordingly, rather than heat dissipation through a single heat dissipation member provided for heat dissipation of the entire plurality of display modules (30A-30P), as in one embodiment of the present disclosure, each of the display modules (30A-30P) includes an independent heat dissipation member (60) so that each of the display modules (30A-30P) individually dissipates heat, which can improve the heat dissipation performance of the entire display device (1).

[0124] When a single heat dissipation member is placed inside a display device (1), some of the heat dissipation members may not be placed at positions corresponding to positions where some display modules are placed based on the front-back direction, and the heat dissipation member may be placed at positions where no display modules are placed, which may lower the heat dissipation efficiency of the display device (1).

[0125] That is, through the heat dissipation member (60) placed on each display module (30A-30P), all display modules (30A-30P) can dissipate heat independently through each heat dissipation member (60), regardless of where each display module (30A-30P) is placed, thereby improving the heat dissipation performance of the entire display device (1).

[0126] The heat dissipation member (60) can be provided in a rectangular shape that roughly corresponds to the shape of the substrate (40).

[0127] The area of ​​the substrate (40) may be provided to be at least equal to or larger than the area of ​​the heat dissipation member (60). When the substrate (40) and the heat dissipation member (60) are arranged in parallel in the first direction (X), the four edges of the rectangular substrate (40) based on the centers of the substrate (40) and the heat dissipation member (60) may be formed to correspond to the four edges of the heat dissipation member (60), or may be arranged to be arranged further outward than the four edges of the substrate (40) and the heat dissipation member (60) based on the centers of the substrate (40) and the heat dissipation member (60).

[0128] Preferably, the four edges of the substrate (40) may be arranged to be positioned outside the four edges of the heat dissipation member (60). That is, the area of ​​the substrate (40) may be arranged to be larger than the area of ​​the heat dissipation member (60).

[0129] This is because when heat is transferred to each display module (30A-30P), the substrate (40) and the heat dissipation member (60) may undergo thermal expansion. Since the heat dissipation member (60) has a higher coefficient of thermal expansion than the substrate (40), the expansion value of the heat dissipation member (60) may be higher than the expansion value of the substrate (40).

[0130] If the four edges of the substrate (40) are positioned corresponding to or further inward than the four edges of the heat dissipation member (60), the edges of the heat dissipation member (60) may protrude outward from the substrate (40) during thermal expansion. As a result, the gap length formed between each of the display modules (30A-30P) may become irregular due to the thermal expansion of the heat dissipation member (60) of each module (30A-30P). As the gap length becomes irregular, the recognizability of some seams of the display panel (20) may increase, thereby degrading the sense of unity of the screen of the display panel (20).

[0131] However, when the four edges of the substrate (40) are arranged to be placed outside the four edges of the heat dissipation member (60), even if the substrate (40) and the heat dissipation member (60) undergo thermal expansion, the heat dissipation member (60) does not protrude outside the four edges of the substrate (40), and accordingly, the gap length formed between each of the display modules (30A-30P) can be maintained constant.

[0132] According to one embodiment of the present disclosure, the area of ​​the substrate (40) and the area of ​​the heat dissipation member (60) may be arranged to roughly correspond. Accordingly, heat generated from the substrate (40) may be uniformly dissipated throughout the entire area of ​​the substrate (40) without being isolated in a certain area.

[0133] The heat dissipation member (60) may be provided to be adhered to the rear surface (43) of the substrate (40) by an adhesive tape (70).

[0134] The adhesive tape (70) may be provided in a size corresponding to that of the heat dissipation member (60). That is, the area of ​​the adhesive tape (70) may be provided to correspond to the area of ​​the heat dissipation member (60). The heat dissipation member (60) may be provided in an approximately square shape, and the adhesive tape (70) may be provided in a square shape corresponding thereto.

[0135] The edges of the rectangular heat dissipation member (60) and the adhesive tape (70) can be formed to correspond to each other based on the center of the heat dissipation member (60) and the adhesive tape (70).

[0136] Accordingly, the heat dissipation member (60) and the adhesive tape (70) can be easily manufactured as a single combined configuration, thereby increasing the manufacturing efficiency of the entire display device (1).

[0137] That is, when the heat dissipation member (60) is cut into units from one plate, the adhesive tape (70) is pre-adhered to one plate before the heat dissipation member (60) is cut, and the adhesive tape (70) and the heat dissipation member (60) are simultaneously cut into units, thereby reducing the process.

[0138] Heat generated from the substrate (40) can be transferred to the heat dissipation member (60) through the adhesive tape (70). Accordingly, the adhesive tape (70) can be arranged to simultaneously attach the heat dissipation member (60) to the substrate (40) and transfer the heat generated from the substrate (40) to the heat dissipation member (60).

[0139] The adhesive tape (70) may include a material with high heat dissipation performance. A material with high heat dissipation performance means a material with high thermal conductivity, high thermal conductivity, and low specific heat, which can effectively transfer heat.

[0140] The adhesive tape (70) may include a material having adhesive properties for bonding the substrate (40) and the heat dissipation member (60). The adhesive tape (70) may include a material having higher heat dissipation performance than a material having general adhesive properties. Accordingly, heat can be efficiently transferred to each component between the substrate (40) and the heat dissipation member (60).

[0141] For example, the adhesive tape (70) may include a graphite material. However, the adhesive tape (70) is not limited thereto, and may generally be made of a material with high heat dissipation performance.

[0142] The ductility of the adhesive tape (70) may be provided to be greater than the ductility of the substrate (40) and the ductility of the heat dissipation member (60). Therefore, the adhesive tape (70) may be provided with a material that has adhesiveness and heat dissipation properties while also having high ductility. The adhesive tape (70) may be formed as an inorganic double-sided tape. Since the adhesive tape (70) is formed as an inorganic double-sided tape, it may be formed as a single layer without a substrate supporting the one side and the other side between the one side that is adhered to the substrate (40) and the other side that is adhered to the heat dissipation member (60).

[0143] Since the adhesive tape (70) does not include a substrate, it does not include a material that interferes with heat conduction, and thus its heat dissipation performance can be improved. However, the adhesive tape (70) is not limited to a double-sided tape without a substrate, and may be prepared as a heat dissipation tape with better heat dissipation performance than a general double-sided tape.

[0144] For example, if the substrate (40) is configured to include a glass material and the heat dissipation member (60) is configured to include a metal material, the material properties of each component may be different, and thus the extent to which the materials are deformed by the same heat may differ. That is, when heat is generated in the substrate (40), the substrate (40) and the heat dissipation member (60) may each expand to different sizes due to the heat. As a result, the first display module (30A) may be damaged.

[0145] This is because, when the substrate (40) and the heat dissipation member (60) are fixed to each other, the expansion values ​​of the substrate (40) and the heat dissipation member (60) at the same temperature are different, and thus, the substrate (40) and the heat dissipation member (60) expand to different sizes, which may cause stress to be generated in each configuration.

[0146] Among the material properties, the coefficient of thermal expansion of each material is different, and the degree to which the material is physically deformed by heat varies. In particular, since the coefficient of thermal expansion of a metal material is generally greater than that of glass, when the same heat is transferred to the substrate (40) and the heat dissipation member (60), the heat dissipation member (60) may expand and deform more than the substrate (40).

[0147] Conversely, even when heat generation in the substrate (40) is terminated and the substrate (40) and the heat dissipation member (60) are each cooled, the heat dissipation member (60) may shrink and deform more than the substrate (40).

[0148] Since the substrate (40) and the heat dissipation member (60) are bonded to each other by an adhesive tape (70), when the heat dissipation member (60) is deformed more than the substrate (40), an external force can be transmitted to the substrate (40).

[0149] Conversely, external force can be transmitted to the heat dissipation member (60) through the substrate (40), but since the rigidity of the glass substrate (40) is less than the rigidity of the metal heat dissipation member (60), the substrate (40) may be damaged.

[0150] The adhesive tape (70) may be arranged to absorb external forces transmitted from different configurations between the substrate (40) and the heat dissipation member (60) as the substrate (40) and the heat dissipation member (60) expand to different sizes. Through this, external forces can be prevented from being transmitted to the substrate (40) and the heat dissipation member (60), and in particular, the substrate (40) can be prevented from being damaged.

[0151] The adhesive tape (70) may be made of a material with high ductility to absorb external force transmitted from the substrate (40) and the heat dissipation member (60). Specifically, the ductility of the adhesive tape (70) may be made greater than the ductility of the substrate (40) and the ductility of the heat dissipation member (60).

[0152] Accordingly, when an external force generated from a change in the size of the substrate (40) and the heat dissipation member (60) is transmitted to the adhesive tape (70), the adhesive tape (70) itself is deformed, thereby preventing the external force from being transmitted to different configurations.

[0153] The adhesive tape (70) may have a predetermined thickness in the first direction (X). When heat is transferred to the heat dissipation member (60) and it expands or contracts due to cooling, the heat dissipation member (60) may expand or contract not only in the first direction (X) but also in a direction orthogonal to the first direction (X), and thus an external force may be transferred to the substrate (40).

[0154] Even if the heat dissipation member (60) expands or contracts in a direction orthogonal to the first direction (X), the thickness of the adhesive tape (70) changes, thereby preventing external force from being transmitted to the substrate (40). The thermal expansion coefficient of the adhesive tape (70) may be set to be different from the thermal expansion coefficient of the substrate (40) and the thermal expansion coefficient of the heat dissipation member (60).

[0155] According to one embodiment, the thermal expansion coefficient of the adhesive tape (70) may be set to be larger than the thermal expansion coefficient of the substrate (40) and smaller than the thermal expansion coefficient of the heat dissipation member (60). Accordingly, the adhesive tape (70) does not deform in the same manner as either the substrate (40) or the heat dissipation member (60) at the same temperature, and can buffer deformation of each component between the substrate (40) and the heat dissipation member (60). The adhesive tape (70) can easily absorb external force generated according to the difference in thermal expansion rates between the substrate (40) and the heat dissipation member (60) by being disposed between the substrate (40) and the heat dissipation member (60) and being deformed.

[0156] FIG. 5 illustrates a frame in a display device according to one embodiment. FIG. 6 illustrates an exploded view of a frame in a display device according to one embodiment.

[0157] Referring to FIG. 5, a frame (100) according to one embodiment may include a plurality of frame openings (100A-100P) formed to correspond to a plurality of display modules (30A-30P).

[0158] Referring to FIG. 6, a frame (100) according to one embodiment may include a first frame (101) and a second frame (102). The first frame (101) and the second frame (102) may be arranged horizontally in parallel.

[0159] According to one embodiment, the first frame (101) may include a first module attachment layer (110) and a first frame panel (130). The second frame (102) may include a second module attachment layer (120) and a second frame panel (140).

[0160] Some of the display modules (30A-30H) among the plurality of display modules (30A-30P) may be attached to the first module attachment layer (110). The first module attachment layer (110) may have a first thermal expansion coefficient. The first thermal expansion coefficient of the first module attachment layer (110) may be similar to the thermal expansion coefficient of the substrate (40) of the plurality of display modules (30A-30H). To this end, the first module attachment layer (110) may include a material having a thermal expansion coefficient that is the same as or similar to the thermal expansion coefficient of the substrate (40). The first module attachment layer (110) may include carbon fiber reinforced plastics (CFRP).

[0161] Since the first module attachment layer (110) has a thermal expansion coefficient that is the same as or similar to the thermal expansion coefficient of the substrate (40) of the plurality of display modules (30A-30H), the display device (1) according to one embodiment can prevent the plurality of display modules (30A-30H) from being damaged while being deformed by heat. Since the first module attachment layer (110) can be deformed similarly to the plurality of display modules (30A-30H) while the plurality of display modules (30A-30H) are deformed by heat, the display device (1) according to one embodiment can prevent the plurality of display modules (30A-30H) from being damaged.

[0162] Some of the remaining display modules (30I-30P) among the plurality of display modules (30A-30P) may be attached to the second module attachment layer (120). The second module attachment layer (120) may have a first thermal expansion coefficient that is the same as the thermal expansion coefficient of the first module attachment layer (110). The first thermal expansion coefficient of the second module attachment layer (120) may be similar to the thermal expansion coefficient of the substrate (40) of the plurality of display modules (30I-30P). To this end, the second module attachment layer (120) may include a material that has a thermal expansion coefficient that is the same as or similar to the thermal expansion coefficient of the substrate (40). The second module attachment layer (120) may include carbon fiber reinforced plastics (CFRP).

[0163] Since the second module attachment layer (120) has a thermal expansion coefficient that is the same as or similar to the thermal expansion coefficient of the substrate (40) of the plurality of display modules (30I-30P), the display device (1) according to one embodiment can prevent the plurality of display modules (30I-30P) from being damaged while being deformed by heat. Since the second module attachment layer (120) can be deformed similarly to the plurality of display modules (30I-30P) while the plurality of display modules (30I-30P) are deformed by heat, the display device (1) according to one embodiment can prevent the plurality of display modules (30I-30P) from being damaged.

[0164] The display panel (20) can display a screen by a plurality of display modules (30A-30P). At this time, the integrity of the screen may be deteriorated by a seam formed by a gap formed between the plurality of display modules (30A-30P).

[0165] In order to minimize the perception of the deliberation of the display panel (20), a plurality of display modules (30A-30P) may be arranged on the frame (100) so as to form a constant gap. This is because when the gap formed by the plurality of display modules (30A-30P) is not constant, the perception of the deliberation due to some gaps may be amplified.

[0166] A plurality of display modules (30A-30P) may be tiled on a frame (100). As the display device (1) is driven, the substrate (40) forming the plurality of display modules (30A-30P) may be thermally expanded by heat generated from the display panel (20). Since the physical properties of the materials of the plurality of display modules (30A-30P) and the frame (100) are different, as the plurality of display modules (30A-30P) are thermally expanded to a size different from that of the frame (100), the width of some gaps between the plurality of display modules (30A-30P) may be formed irregularly, and the perception of the depth may be amplified.

[0167] According to one embodiment, a display device (1) can prevent gaps between the plurality of display modules (30A-30H) from being formed irregularly since the material properties of the first module attachment layer (110) of the first frame (101) are provided to be identical or similar to the material properties of the plurality of display modules (30A-30H). In addition, since the material properties of the second module attachment layer (120) of the second frame (101) are provided to be identical or similar to the material properties of the plurality of display modules (30I-30P), it is possible to prevent gaps between the plurality of display modules (30I-30P) from being formed irregularly.

[0168] The meaning that the material properties of the first module attachment layer (110) are formed similarly to the material properties of the plurality of display modules (30A-30H) may include the meaning that the thermal expansion coefficients, specific heats, and thermal conductivities of the plurality of display modules (30A-30H) are similar. The meaning that the material properties of the second module attachment layer (120) are formed similarly to the material properties of the plurality of display modules (30I-30P) may include the meaning that the thermal expansion coefficients, specific heats, and thermal conductivities of the plurality of display modules (30I-30P) are similar.

[0169] When the plurality of display modules (30A-30H) are adhered to the first module attachment layer (110) in the first direction (X), and the same heat is transferred to the plurality of display modules (30A-30H) and the first module attachment layer (110) in the second direction (Z) and / or the third direction (Y) orthogonal to the first direction (X), they may be arranged to expand to corresponding lengths. When the substrate (40) of the plurality of display modules (30A-30H) is thermally expanded due to heat generated while the display device (1) according to one embodiment is driven, the first module attachment layer (110) of the first frame (101) may be thermally expanded to the same or similar value as the substrate (40).

[0170] As the first module attachment layer (110) of the first frame (101), which is the base surface to which the plurality of display modules (30A-30H) are attached, is thermally expanded by a value equal to or similar to that of the substrate (40) of the plurality of display modules (30A-30H), the spacing of the gaps formed between the plurality of display modules (30A-30H) can be maintained equal.

[0171] Likewise, when the plurality of display modules (30I-30P) are adhered to the second module attachment layer (120) in the first direction (X), the plurality of display modules (30I-30P) and the second module attachment layer (120) may be arranged to expand to corresponding lengths when the same heat is transferred to the plurality of display modules (30I-30P) and the second module attachment layer (120) in the second direction (Z) and / or the third direction (Y) orthogonal to the first direction (X). When the substrate (40) of the plurality of display modules (30I-30P) is thermally expanded due to heat generated while the display device (1) according to one embodiment is driven, the second module attachment layer (120) of the second frame (102) may be thermally expanded to the same or similar value as the substrate (40).

[0172] As the first module attachment layer (120) of the second frame (102), which is the base surface to which the plurality of display modules (30I-30P) are attached, is thermally expanded by a value equal to or similar to that of the substrate (40) of the plurality of display modules (30I-30P), the spacing of the gaps formed between the plurality of display modules (30I-30P) can be maintained equal.

[0173] As described above, the gap distance formed between the plurality of display modules (30A-30H) attached to the first module attachment layer (110) of the first frame (101) can be maintained even if thermally expanded, and the gap distance formed between the plurality of display modules (30I-30P) attached to the second module attachment layer (120) of the second frame (102) can be maintained even if thermally expanded.

[0174] However, the gap formed between the plurality of display modules (30E, 30F, 30G, 30H) attached to the first frame (101) and the plurality of display modules (30I, 30J, 30J, 30L) attached to the second frame (102) may increase due to thermal expansion, and the perception of the deliberation may be amplified. This is because the first module attachment layer (110) expands based on the center of the first module attachment layer (110), and the second module attachment layer (120) expands based on the center of the second module attachment layer (120).

[0175] In cases where the frame (100) is not divided into a first frame (101) and a second frame (102), since one module attachment layer expands based on its center, the seam between multiple display modules attached to the module attachment layer can be maintained substantially the same before and after thermal expansion. However, when divided into a first frame (101) and a second frame (102), the first module attachment layer (110) of the first frame (101) expands based on the center of the first module attachment layer (110), and the second module attachment layer (120) of the second frame (102) expands based on the center of the second module attachment layer (120). Therefore, the gap between the plurality of display modules (30E, 30F, 30G, 30H) attached to the first module attachment layer (110) and the plurality of display modules (30I, 30J, 30J, 30L) attached to the second module attachment layer (120) may increase due to thermal expansion. That is, the recognition of the seam between the plurality of display modules (30E, 30F, 30G, 30H) attached to the first module attachment layer (110) and the plurality of display modules (30I, 30J, 30J, 30L) attached to the second module attachment layer (120) increases, and the sense of unity of the screen of the display panel (20) may be reduced.

[0176] According to one embodiment, the display device (1) can maintain a gap distance between a plurality of display modules (30A-30P) substantially the same as when the substrate (40) is not thermally expanded, thereby maintaining a certain level of seam and maintaining the integrity of the screen of the display panel (20). To this end, the display device (1) according to one embodiment can form an expansion reference point of the first module attachment layer (110) at an edge of the first module attachment layer (110) adjacent to the second module attachment layer (120), and can form an expansion reference point of the second module attachment layer (120) at an edge of the second module attachment layer (120) adjacent to the first module attachment layer (110). A detailed description thereof will be given later.

[0177] Referring to FIG. 6, the first module attachment layer (110) may include an opening (110A) corresponding to the frame opening (100A) of the first frame (101). The second module attachment layer (120) may include an opening (120I) corresponding to the frame opening (100I) of the second frame (102).

[0178] According to one embodiment, the first module attachment layer (110) may include a first hole (111), a third hole (112) spaced apart in a second direction (Z) with respect to the first hole (111), and a fifth hole (113) spaced apart in a third direction (Y) with respect to the first hole (111). The second module attachment layer (120) may include a second hole (121), a fourth hole (122) spaced apart in a second direction (Z) with respect to the second hole (121), and a sixth hole (123) spaced apart in a third direction (Y) with respect to the second hole (121).

[0179] According to one embodiment, a first frame (101) may include a first frame panel (130) disposed on one side of a first module attachment layer (110). The first frame panel (130) may be disposed on the rear side of the first module attachment layer (110). The first frame panel (130) may be positioned on the opposite side of the first module attachment layer (110) to which a plurality of display modules (30A-30H) are attached.

[0180] According to one embodiment, a second frame (102) may include a second frame panel (140) disposed on one side of a second module attachment layer (120). The second frame panel (140) may be disposed on the rear side of the second module attachment layer (120). The second frame panel (140) may be positioned on the opposite side of the first module attachment layer (120) to which a plurality of display modules (30I-30P) are attached.

[0181] The frame (100) is a structure provided to support the display panel (20) and may be provided to have a rigidity greater than a predetermined level. The first frame panel (130) and the second frame panel (140) may include a material having relatively high rigidity to ensure the strength of the frame (100). The first frame panel (130) may be provided to have a rigidity greater than that of the first module attachment layer (110), and the second frame panel (140) may be provided to have a rigidity greater than that of the second module attachment layer (120). For example, the first frame panel (130) and the second frame panel (140) may be formed of a metal material having a rigidity greater than a predetermined level. For example, the first frame panel (130) and the second frame panel (140) may be provided of a steel plate. For example, the first frame panel (130) and the second frame panel (140) may include stainless steel galvanized cold-rolled steel. For example, the first frame panel (130) and the second frame panel (140) may include electrogalvanized commercial cold-rolled steel (SECC, Steel Electrogalvanized Commercial Cold-rolled).

[0182] The surface of the first frame panel (130) facing the first module sub-layer (110) can be formed flat without any protruding portions. The first frame panel (130) can be formed flat so that a plurality of display modules (30A-30H) can be arranged horizontally. The first frame panel (130) can secure a flat surface for tiling a plurality of display modules (30A-30H).

[0183] The surface of the second frame panel (140) facing the second module sub-layer (120) can be formed flat without any protruding portions. The second frame panel (140) can be formed flat so that a plurality of display modules (30I-30P) can be arranged horizontally (adjacent to each other). The second frame panel (140) can secure a plane for tiling a plurality of display modules (30I-30P).

[0184] The first frame panel (130) and the second frame panel (140) may have a thermal expansion coefficient different from the thermal expansion coefficients of the first module attachment layer (110) and the second module attachment layer (120). That is, the first frame panel (130) and the second frame panel (140) may have a second thermal expansion coefficient different from the first thermal expansion coefficient. The first frame panel (130) and the second frame panel (140) may have a thermal expansion coefficient different from the thermal expansion coefficient of the substrate (40) of the plurality of display modules (30A-30P). The first frame panel (130) and the second frame panel (140) may have a thermal expansion coefficient greater than the thermal expansion coefficients of the first module attachment layer (110) and the second module attachment layer (120). That is, the second thermal expansion coefficient may be provided to be greater than the first thermal expansion coefficient. The thermal expansion coefficients of the first frame panel (130) and the second frame panel (140) may have a thermal expansion coefficient greater than the thermal expansion coefficient of the substrate (40) of the plurality of display modules (30A-30P).

[0185] The first frame panel (130) may include an opening (130A) corresponding to the frame opening (100A) of the first frame (101), and the second frame panel (140) may include an opening (140I) corresponding to the frame opening (100I) of the second frame (102).

[0186] According to one embodiment, the first frame panel (130) may include holes corresponding to the first hole (111), the third hole (112), and the fifth hole (113) of the first module attachment layer (110). The second frame panel (140) may include holes corresponding to the second hole (121), the fourth hole (122), and the sixth hole (123) of the second module attachment layer (120).

[0187] According to one embodiment, a first frame (101) may include a first adhesive layer (150) provided between a first module attachment layer (110) and a first frame panel (130). The first adhesive layer (150) may be provided to absorb a shock caused by a difference in the thermal strain of the first module attachment layer (110) and the thermal strain of the first frame panel (130) while both the first module attachment layer (110) and the first frame panel (130) are thermally deformed as heat is generated in the display device (1). The first adhesive layer (150) may be provided to compensate for a difference in the coefficient of thermal expansion between the first module attachment layer (110) and the first frame panel (130).

[0188] The first adhesive layer (150) may include a material having flexibility. The first adhesive layer (150) may be provided to have flexibility greater than the flexibility of the first module attachment layer (110) and / or the flexibility of the first frame panel (130). The first adhesive layer (150) may be configured to include a deformable material. According to one embodiment, the first adhesive layer (150) may include polyurethane foam (PU FOAM).

[0189] For example, while heat is generated in the display device (1), the strain caused by the heat of the first frame panel (130) may be greater than the strain caused by the heat of the first module attachment layer (110). While the first frame panel (130) and the first module attachment layer (110) are deformed due to heat generated in the display device (1), the first adhesive layer (150) may be deformed more at a portion in contact with the first frame panel (130) than at a portion in contact with the first module attachment layer (110).

[0190] According to one embodiment, the second frame (102) may include a second adhesive layer (160) provided between the second module attachment layer (120) and the second frame panel (140). The second adhesive layer (160) may be provided to absorb shock due to a difference in the thermal strain of the second module attachment layer (120) and the thermal strain of the second frame panel (140) while both the second module attachment layer (120) and the second frame panel (140) are thermally deformed as heat is generated in the display device (1). The second adhesive layer (160) may be provided to compensate for a difference in the coefficient of thermal expansion between the second module attachment layer (120) and the second frame panel (140).

[0191] The second adhesive layer (160) may include a material having flexibility. The second adhesive layer (160) may be provided to have flexibility greater than the flexibility of the second module attachment layer (120) and / or the flexibility of the second frame panel (140). The second adhesive layer (160) may be configured to include a deformable material. According to one embodiment, the second adhesive layer (160) may include polyurethane foam (PU FOAM).

[0192] For example, while heat is generated in the display device (1), the heat-induced strain of the second frame panel (140) may be greater than the heat-induced strain of the second module attachment layer (120). While the second frame panel (140) and the second module attachment layer (120) are deformed due to heat generated in the display device (1), the second adhesive layer (160) may be deformed more at a portion in contact with the second frame panel (140) than at a portion in contact with the second module attachment layer (120).

[0193] Since the first adhesive layer (150) is configured to include a material having flexibility, when an external force generated from a change in the size of the first module attachment layer (110) and the first frame panel (130) due to thermal expansion is transmitted to the first adhesive layer (150), the first adhesive layer (150) itself is deformed, thereby preventing the external force from being transmitted to the first module attachment layer (110) and the first frame panel (120). Similarly, since the second adhesive layer (160) is configured to include a material having flexibility, when the second adhesive layer (160) itself is deformed, the external force generated from a change in the size of the second module attachment layer (120) and the second frame panel (140) due to thermal expansion is prevented from being transmitted to the second module attachment layer (120) and the second frame panel (140), respectively.

[0194] The first adhesive layer (150) may include an opening (150A) corresponding to the frame opening (100A) of the first frame (101), and the second adhesive layer (160) may include an opening (160I) corresponding to the frame opening (100I) of the second frame (102).

[0195] According to one embodiment, the first adhesive layer (150) may include holes corresponding to the first hole (111), the third hole (112), and the fifth hole (113) of the first module attachment layer (110). The second adhesive layer (160) may include holes corresponding to the second hole (121), the fourth hole (122), and the sixth hole (123) of the second module attachment layer (120).

[0196] FIG. 7 is a front view of a frame in a display device according to one embodiment. FIG. 8 schematically illustrates the frame illustrated in FIG. 7. FIG. 9 schematically illustrates the appearance of a frame in a display device according to one embodiment when thermally expanded. FIG. 10 illustrates an example of a fixing member in a display device according to one embodiment. FIG. 11 illustrates an example of a fixing member in a display device according to one embodiment.

[0197] Referring to FIGS. 7 and 8, the first module attachment layer (110) may include a first hole (111), a third hole (112), and a fifth hole (113) formed at positions adjacent to the edge of the first module attachment layer (110). The second module attachment layer (120) may include a second hole (121), a fourth hole (122), and a sixth hole (123) formed at positions adjacent to the edge of the second module attachment layer (120). The third hole (112) may include an upper third hole (112a) spaced apart from the first hole (111) in a second direction (+Z), and a lower third hole (112b) spaced apart from the first hole (111) in a fourth direction (-Z) opposite to the second direction. The fourth hole (122) may include an upper fourth hole (122a) spaced apart from the second hole (121) in the second direction (+Z), and a lower fourth hole (122b) spaced apart from the second hole (121) in the fourth direction (-Z).

[0198] According to one embodiment, the first frame (101) may include a first fixing member (171) that fixes the first portion on the first module attachment layer (110) and the first portion on the first frame panel (130) so that the first portion on the first module attachment layer (110) and the first portion on the first frame panel (130) do not move relative to each other.

[0199] Likewise, the second frame (102) may include a second fixing member (172) that fixes the first portion on the second module attachment layer (120) and the first portion on the second frame panel (140) so that the first portion on the second module attachment layer (120) and the first portion on the second frame panel (140) do not move relative to each other.

[0200] The first part on the first module attachment layer (110) described above may refer to the first hole (111) of the first module attachment layer (110) or a portion of the area around the first hole (111). The first part on the first frame panel (130) described above may refer to the hole of the first frame panel (130) corresponding to the first hole (111) of the first module attachment layer (110) or a portion of the area around the hole.

[0201] The first part on the second module attachment layer (120) described above may refer to the second hole (121) of the second module attachment layer (120) or a portion of the area around the second hole (121). The first part on the second frame panel (140) described above may refer to the hole of the second frame panel (140) corresponding to the second hole (121) of the second module attachment layer (120) or a portion of the area around the hole.

[0202] The first fixing member (171) can fix the first part of the first module attachment layer (110) and the first part of the first frame panel (130) so that the first part of the first module attachment layer (110) and the first part of the first frame panel (130) corresponding to the first part of the first module attachment layer (110) in the first direction (X) do not move relative to each other in the horizontal direction. The first fixing member (171) can restrict the first part of the first module attachment layer (110) from moving relative to the first part of the first frame panel (130) in the second direction (Z) and the third direction (Y).

[0203] The second fixing member (172) can fix the first part of the second module attachment layer (120) and the first part of the second frame panel (140) so that the first part of the second module attachment layer (120) and the first part of the second frame panel (140) corresponding to the first part of the second module attachment layer (120) in the first direction (X) do not move relative to each other in the horizontal direction. The second fixing member (172) can restrict the first part of the second module attachment layer (120) from moving relative to the first part of the second frame panel (140) in the second direction (Z) and the third direction (Y).

[0204] The first fixing member (171) may be coupled to be fixed to the first frame panel (130) or the first module attachment layer (110). According to one embodiment, the first fixing member (171) may be coupled to be fixed to the first portion of the first frame panel (130). The first fixing member (171) may be inserted into the first hole (111) of the first module attachment layer (110), and may thereby be disposed inside the first hole (111). The first hole (111) may restrain the first fixing member (171) inserted into the first hole (111) so that the first fixing member (171) does not move in the second direction (Z) and the third direction (Y). Alternatively, the first fixing member may be coupled to be fixed to the first module attachment layer. In this case, the first frame panel may include a first hole into which the first fixing member is inserted. The first hole may be configured to restrain the first fixing member in the second direction (Z) and the third direction (Y).

[0205] The second fixing member (172) may be coupled to be fixed to the second frame panel (140) or the second module attachment layer (120). According to one embodiment, the second fixing member (172) may be coupled to be fixed to the first portion of the second frame panel (140). The second fixing member (172) may be inserted into the second hole (121) of the second module attachment layer (120), and may thereby be disposed inside the second hole (121). The second hole (121) may restrain the second fixing member (172) inserted into the second hole (121) so that the second fixing member (172) does not move in the second direction (Z) and the third direction (Y). Alternatively, the second fixing member may be coupled to be fixed to the second module attachment layer. In this case, the second frame panel may include a second hole into which the second fixing member is inserted. The second hole may be configured to constrain the second fixing member in the second direction (Z) and the third direction (Y).

[0206] As described above, due to the first hole (111) and the first fixing member (171) inserted into the first hole (111), the first part of the first module attachment layer (110) and the first part of the first frame panel (130) may not move relative to each other in the second direction (Z) and the third direction (Y). Since the first part of the first module attachment layer (110) and the first part of the second frame panel (130) do not move relative to each other in the second direction (Z) and the third direction (Y), the first module attachment layer (110) may thermally expand based on the first part of the first module attachment layer. In other words, the first part of the first module attachment layer (110) may become a thermal expansion reference point of the first module attachment layer (110).

[0207] Likewise, due to the second hole (121) and the second fixing member (172) inserted into the second hole (121), the first part of the second module attachment layer (120) and the first part of the second frame panel (140) may not move relative to each other in the second direction (Z) and the third direction (Y). Since the first part of the second module attachment layer (120) and the first part of the second frame panel (140) do not move relative to each other in the second direction (Z) and the third direction (Y), the second module attachment layer (120) may thermally expand based on the first part of the second module attachment layer (120). The first part of the second module attachment layer (120) may become a thermal expansion reference point of the second module attachment layer (120).

[0208] As described above, when the first module attachment layer (110) thermally expands based on the first portion of the first module attachment layer (110) and the second module attachment layer (120) thermally expands based on the first portion of the second module attachment layer (120), a seam formed in the third direction (Y) between the plurality of display modules (30E, 30F, 30G, 30H) attached to the first frame (101) and the plurality of display modules (30I, 30J, 30J, 30L) attached to the second frame (102) can be maintained substantially the same before and after thermal expansion. Accordingly, the integrity of the screen of the display panel (20) can be maintained.

[0209] According to one embodiment, the first frame (101) may include a third fixing member (181) that restricts the second portion on the first module attachment layer (110) from moving relative to the second portion on the first frame panel (130) in a third direction (Y), and a fifth fixing member (183) that restricts the third portion on the first module attachment layer (110) from moving relative to the third portion on the first frame panel (130) in a second direction (Z).

[0210] Likewise, the second frame (102) may include a fourth fixing member (182) that restricts the second portion on the second module attachment layer (120) from moving relative to the second portion on the second frame panel (140) in a third direction (Y), and a sixth fixing member (184) that restricts the third portion on the second module attachment layer (110) from moving relative to the third portion on the second frame panel (140) in a second direction (Z).

[0211] The second part on the first module attachment layer (110) described above may refer to a third hole (112) spaced apart from the first hole (111) of the first module attachment layer (110) in the second direction (Z) or a portion of the area around the third hole (112). The second part on the first frame panel (130) described above may refer to a hole of the first frame panel (130) corresponding to the third hole (112) of the first module attachment layer (110) or a portion of the area around the hole.

[0212] The third portion on the first module attachment layer (110) described above may refer to a fifth hole (113) spaced apart from the first hole (111) of the first module attachment layer (110) in the third direction (Y) or a portion of an area around the fifth hole (113). The third portion on the first frame panel (130) described above may refer to a hole of the first frame panel (130) corresponding to the fifth hole (113) of the first module attachment layer (110) or a portion of an area around the hole.

[0213] The second part on the second module attachment layer (120) described above may refer to a fourth hole (122) spaced apart from the second hole (121) of the second module attachment layer (120) in the second direction (Z) or a portion of an area around the fourth hole (122). The second part on the second frame panel (140) described above may refer to a hole of the second frame panel (140) corresponding to the fourth hole (122) of the second module attachment layer (120) or a portion of an area around the hole.

[0214] The third part on the second module attachment layer (120) described above may refer to a sixth hole (123) spaced apart from the second hole (121) of the second module attachment layer (120) in the third direction (Y) or a portion of the area around the sixth hole (123). The third part on the second frame panel (140) described above may refer to a hole of the second frame panel (140) corresponding to the sixth hole (123) of the second module attachment layer (120) or a portion of the area around the hole.

[0215] The third fixing member (181) may be coupled to be fixed to the first frame panel (130) or the first module attachment layer (110). According to one embodiment, the third fixing member (181) may be coupled to be fixed to the second portion of the first frame panel (130). The third fixing member (181) may be inserted into the third hole (112) of the first module attachment layer (110). The third hole (112) may include an upper third hole (112a) and a lower third hole (112b), and the third fixing member (181) may include an upper third fixing member (181a) inserted into the upper third hole (112a) and a lower third fixing member (181b) inserted into the lower third hole (112b). Alternatively, the third fixing member may be coupled to be fixed to the first module attachment layer. In this case, the first frame panel may include a third hole into which a third fixing member is inserted.

[0216] According to one embodiment, the third fixing member (181) inserted into the third hole (112) may be permitted to move in the second direction (Z) and may be restricted from moving in the third direction (Y). In other words, the third hole (112) may not restrict the third fixing member (181) inserted into the third hole (112) from moving in the second direction (Z) with respect to the third hole (112), but may restrict the third fixing member (181) from moving in the third direction (Y) with respect to the third hole (112). Accordingly, as illustrated in FIG. 9, the third fixing member (181) may move in the second direction (Z) with respect to the third hole (112) during thermal expansion.

[0217] If the third hole (112) does not limit the movement of the third fixing member (181) in the third direction (Y), the third fixing member (181) may move in the third direction (Y) upon thermal expansion, and as a result, the seam formed in the third direction between the first module attachment layer (110) and the second module attachment layer (120) may increase. To prevent this, the third hole (112) may limit the movement of the third fixing member (181) in the third direction (Y).

[0218] The fourth fixing member (182) may be coupled to be fixed to the second frame panel (140) or the second module attachment layer (120). According to one embodiment, the fourth fixing member (182) may be coupled to be fixed to the second portion of the second frame panel (140). The fourth fixing member (182) may be inserted into the fourth hole (122) of the second module attachment layer (120). The fourth hole (122) may include an upper fourth hole (122a) and a lower fourth hole (122b), and the fourth fixing member (182) may include an upper fourth fixing member (182a) inserted into the upper fourth hole (122a) and a lower fourth fixing member (182b) inserted into the lower fourth hole (122b). Alternatively, the fourth fixing member may be coupled to be fixed to the second module attachment layer. In this case, the second frame panel may include a fourth hole into which the fourth fixing member is inserted.

[0219] The fourth fixing member (182) inserted into the fourth hole (122) may be allowed to move in the second direction (Z) and may be restricted from moving in the third direction (Y). In other words, the fourth hole (122) may not restrict the fourth fixing member (182) inserted into the fourth hole (122) from moving in the second direction (Z) with respect to the fourth hole (122), but may restrict the fourth fixing member (182) from moving in the third direction (Y) with respect to the fourth hole (122). As a result, as illustrated in FIG. 9, the fourth fixing member (182) may move in the second direction (Z) with respect to the fourth hole (122) during thermal expansion.

[0220] If the fourth hole (122) does not limit the movement of the fourth fixing member (182) in the third direction (Y), the fourth fixing member (182) may move in the third direction (Y) upon thermal expansion, and as a result, the seam formed in the third direction between the first module attachment layer (110) and the second module attachment layer (120) may increase. To prevent this, the fourth hole (122) may limit the movement of the fourth fixing member (182) in the third direction (Y).

[0221] According to one embodiment, the fifth fixing member (183) inserted into the fifth hole (113) may be permitted to move in the third direction (Y) and restricted from moving in the second direction (Z). In other words, the fifth hole (113) may not restrict the movement of the fifth fixing member (183) inserted into the fifth hole (113) in the third direction (Y) with respect to the fifth hole (113), but may restrict the movement of the fifth fixing member (183) in the second direction (Z) with respect to the fifth hole (113). Accordingly, as illustrated in FIG. 9, the fifth fixing member (183) may move in the third direction (Y) with respect to the fifth hole (113) during thermal expansion.

[0222] The sixth fixing member (184) inserted into the sixth hole (123) is allowed to move in the third direction (Y) and may be restricted from moving in the second direction (Z). In other words, the sixth hole (123) does not restrict the movement of the sixth fixing member (184) inserted into the sixth hole (123) in the third direction (Y) with respect to the sixth hole (123), but may restrict the movement of the sixth fixing member (184) in the second direction (Z) with respect to the sixth hole (123). As a result, as illustrated in FIG. 9, the sixth fixing member (184) can move in the third direction (Y) with respect to the sixth hole (123) during thermal expansion.

[0223] Referring to Fig. 10, the structure of the first fixing member (171) inserted into the first hole (111) of the first module attachment layer (110) and the structure of the second fixing member (172) inserted into the second hole (121) of the second module attachment layer (120) will be described. Hereinafter, the fixing member (170) may refer to the first fixing member (171) and the second fixing member (172). The first fixing member (171) and the second fixing member (172) may be provided with the same structure.

[0224] The fixed member (170) may include a body portion (170a) and a head portion (170b). According to one embodiment, the body portion (170a) may be coupled to the first frame panel (130) or the second frame panel (140). The head portion (170b) may be provided in an approximately cylindrical shape. The cross-section of the head portion (170b) may be provided to correspond to the first hole (111) or the second hole (121).

[0225] According to one embodiment, the fixing member (170) may be provided in a pin structure as illustrated in FIG. 10. In this case, the body portion (170a) of the fixing member (170) may be fitted into a hole of the first frame panel (130) or a hole of the second frame panel (140). Alternatively, the body portion (170a) of the fixing member (170) may be fitted into a hole of the first module attachment layer (110) or a hole of the second attachment layer (120).

[0226] Alternatively, the fixing member (170) may be provided in a screw structure. In this case, the fixing member may be coupled to be fixed to the first frame panel (130) or the second frame (140), or may be coupled to be fixed to the first module attachment layer (110) or the second module attachment layer (120).

[0227] Additionally, the fixing member (170) may be provided in a stapler structure. Additionally, the fixing member (170) may be provided as an adhesive that chemically bonds the first module attachment layer (110) and the first frame panel (130) and bonds the second module attachment layer (120) and the second frame panel (140).

[0228] Referring to FIG. 11, the structure of the third fixing member (181) inserted into the third hole (112) of the first module attachment layer (110), the fifth fixing member (183) inserted into the fifth hole (113), the fourth fixing member (182) inserted into the fourth hole (122) of the second module attachment layer (120), and the sixth fixing member (184) inserted into the sixth hole (123) will be described. Hereinafter, the fixing member (180) may refer to the third fixing member (181), the fourth fixing member (182), the fifth fixing member (183), and the sixth fixing member (184). The third fixing member (181), the fourth fixing member (182), the fifth fixing member (183), and the sixth fixing member (184) can be provided with the same structure.

[0229] Referring to FIG. 11, the fixed member (180) may include a body portion (180a) formed in a roughly cylindrical shape, and a head portion (180b) protruding from the body portion (180a) and having at least one side flat.

[0230] According to one embodiment, the head portion (180b) may include a first portion having a width corresponding to the diameters of the third hole (112), the fourth hole (122), the fifth hole (113), and the sixth hole (123), and a second portion having a width smaller than the diameters of the third hole (112), the fourth hole (122), the fifth hole (113), and the sixth hole (123).

[0231] The fixing member (180) can be arranged so that the second part of the head portion (180b) faces the second direction (Z) or the third direction (Y) within the third hole (112), the fourth hole (122), the fifth hole (113), and the sixth hole (123). When the second part of the head portion (180b) faces the second direction (Z), the fixing member (180) can be allowed to move in the second direction (Z) within the third hole (112), the fourth hole (122), the fifth hole (113), and the sixth hole (123), and can be restricted from moving in the third direction (Y). When the second part of the head portion (180b) faces the third direction (Y), the fixed member (180) may be allowed to move in the third direction (Y) within the third hole (112), the fourth hole (122), the fifth hole (113), and the sixth hole (123), and movement in the second direction (Z) may be restricted.

[0232] Fig. 12 schematically illustrates a frame in a display device according to one embodiment. Fig. 13 schematically illustrates the appearance of a frame when thermally expanded in a display device according to one embodiment.

[0233] Referring to FIGS. 12 and 13, the first frame (101) may include a first fixing member (171), a third fixing member (173), and a fifth fixing member (175). In addition, the first frame (101) may include a first hole (111), a first guide hole (114), and a third guide hole (115). The second frame (102) may include a second fixing member (172), a fourth fixing member (174), and a sixth fixing member (176). In addition, the second frame (101) may include a second guide hole (124) and a fourth guide hole (125).

[0234] The first fixing member (171), the second fixing member (172), the third fixing member (173), the fourth fixing member (174), the fifth fixing member (175), and the sixth fixing member (176) can be provided with the same structure as the above-described fixing member (170).

[0235] According to one embodiment, the first module attachment layer (110) may include a first guide hole (114) into which a third fixing member (173) is inserted and extends in a second direction (Z), and a third guide hole (115) into which a fifth fixing member (175) is inserted and extends in a third direction (Y). The second module attachment layer (120) may include a second guide hole (124) into which a fourth fixing member (174) is inserted and extends in a second direction (Z), and a fourth guide hole (125) into which a sixth fixing member (176) is inserted and extends in a third direction (Y).

[0236] Referring to FIGS. 12 and 13, the first guide hole (114) can guide the third fixing member (173) to move in the second direction (Z) when the first frame (101) undergoes thermal expansion. The first guide hole (114) can limit the third direction (Y) movement of the third fixing member (173) when the first frame (101) undergoes thermal expansion. The second guide hole (115) can guide the fourth fixing member (174) to move in the second direction (Z) when the second frame (102) undergoes thermal expansion. The second guide hole (124) can limit the third direction (Y) movement of the fourth fixing member (174) when the second frame (102) undergoes thermal expansion. The third guide hole (115) can guide the fifth fixing member (175) to move in the third direction (Y) when the first frame (101) undergoes thermal expansion. The third guide hole (115) can limit the movement of the fifth fixing member (175) in the second direction (Z) when the first frame (101) undergoes thermal expansion. The fourth guide hole (125) can guide the sixth fixing member (176) to move in the third direction (Y) when the second frame (102) undergoes thermal expansion. The fourth guide hole (125) can limit the movement of the sixth fixing member (176) in the second direction (Z) when the second frame (102) undergoes thermal expansion.

[0237] FIG. 14 schematically illustrates a frame in a display device according to one embodiment.

[0238] Referring to FIG. 14, a display device (1) according to one embodiment may include frames (200) arranged horizontally in a 2*2 matrix form. The frames (200) may include a first frame (201), a second frame (202), a third frame (203), and a fourth frame (204).

[0239] The first frame (201) may include a first hole (201a) that restrains the first fixing member (170) in the second direction (Z) and the third direction (Y), a second hole (201b) that restrains the second fixing member (180) in the third direction (Y), and a third hole (201c) that restrains the second fixing member (180) in the second direction (Z).

[0240] The second frame (202) may include a first hole (202a) that restrains the first fixing member (170) in the second direction (Z) and the third direction (Y), a second hole (202b) that restrains the second fixing member (180) in the third direction (Y), and a third hole (202c) that restrains the second fixing member (180) in the second direction (Z).

[0241] The third frame (203) may include a first hole (203a) that restrains the first fixing member (170) in the second direction (Z) and the third direction (Y), a second hole (203b) that restrains the second fixing member (180) in the third direction (Y), and a third hole (203c) that restrains the second fixing member (180) in the second direction (Z).

[0242] The fourth frame (204) may include a first hole (204a) that restrains the first fixing member (170) in the second direction (Z) and the third direction (Y), a second hole (204b) that restrains the second fixing member (180) in the third direction (Y), and a third hole (204c) that restrains the second fixing member (180) in the second direction (Z).

[0243] FIG. 15 schematically illustrates a frame in a display device according to one embodiment.

[0244] Referring to FIG. 15, the first frame (201) may include a first hole (201a) that restrains the first fixing member (170) in the second direction (Z) and the third direction (Y), a first guide hole (201d) that guides the first fixing member (170) to move in the second direction (Z), and a second guide hole (201e) that guides the first fixing member (170) to move in the third direction (Y).

[0245] The second frame (202) may include a first hole (202a) that restrains the first fixing member (170) in the second direction (Z) and the third direction (Y), a first guide hole (202d) that guides the first fixing member (170) to move in the second direction (Z), and a second guide hole (202e) that guides the first fixing member (170) to move in the third direction (Y).

[0246] The third frame (203) may include a first hole (203a) that restrains the first fixing member (170) in the second direction (Z) and the third direction (Y), a first guide hole (203d) that guides the first fixing member (170) to move in the second direction (Z), and a second guide hole (203e) that guides the first fixing member (170) to move in the third direction (Y).

[0247] The fourth frame (204) may include a first hole (201a) that restrains the first fixing member (170) in the second direction (Z) and the third direction (Y), a first guide hole (204d) that guides the first fixing member (170) to move in the second direction (Z), and a second guide hole (204e) that guides the first fixing member (170) to move in the third direction (Y).

[0248] A display device (1) according to one embodiment includes a plurality of display modules (30A-30P) and a frame (100) that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form. The frame may include a first module attachment layer (110) to which some of the display modules (30A-30H) among the plurality of display modules are attached and which has a first coefficient of thermal expansion. The frame further includes a first frame panel (130) that is coupled to the first module attachment layer and has a second coefficient of thermal expansion different from the first coefficient of thermal expansion. The frame further includes a second module attachment layer (120) to which some of the remaining display modules (30I-30P) among the plurality of display modules are attached, which has the first coefficient of thermal expansion and is horizontally arranged with the first module attachment layer. The above frame further includes a second frame panel (140) that is combined with the second module attachment layer, has the second coefficient of thermal expansion, and is arranged horizontally with the first frame panel. The frame comprises a first fixing member (171) that fixes the first part on the first module attachment layer and the first part on the first frame panel so that the first part (near the first hole (111)) on the first module attachment layer and the first part (near the first hole (111)) on the first frame panel (130) do not move relative to each other as the first module attachment layer and the first frame panel undergo thermal expansion, and a first fixing member (171) that fixes the first part on the second module attachment layer (120) and the first part on the second frame panel (140) so that the first part (near the second hole (121)) on the second module attachment layer (120) and the first part on the second frame panel (140) do not move relative to each other as the second module attachment layer and the second frame panel undergo thermal expansion. It further includes a second fixing member (172).

[0249] The above first fixing member can restrict the first part on the first module attachment layer from moving relative to the first part on the first frame panel in a first direction (Z) and a second direction (Y) intersecting the first direction.

[0250] The second fixing member can limit the relative movement of the first portion on the second module attachment layer in the first direction and the second direction with respect to the first portion on the second frame panel.

[0251] The frame may further include a third fixing member (181) that restricts a second portion on the first module attachment layer, spaced apart from the first portion on the first module attachment layer in the first direction, from moving relative to a second portion on the first frame panel, spaced apart from the first portion on the first frame panel in the first direction, in the second direction.

[0252] The frame may further include a fourth fixing member (182) that restricts a second portion on the second module attachment layer, which is spaced apart from the first portion on the second module attachment layer in the first direction, from moving relative to a second portion on the second frame panel, which is spaced apart from the first portion on the second frame panel in the first direction, in the second direction.

[0253] The frame may further include a fifth fixing member (183) that restricts a third portion on the first module attachment layer spaced apart from the first portion on the first module attachment layer in the second direction from moving relative to a third portion on the first frame panel spaced apart from the first portion on the first frame panel in the second direction in the first direction.

[0254] The frame may further include a sixth fixing member (184) that restricts a third portion on the second module attachment layer, spaced apart from the first portion on the second module attachment layer in the second direction, from moving relative to a third portion on the second frame panel, spaced apart from the first portion on the second frame panel in the second direction, in the first direction.

[0255] The above first module attachment layer may include a first hole into which the first fixing member is inserted.

[0256] The second module attachment layer may include a second hole into which the second fixing member is inserted.

[0257] The above first hole can restrain the above first fixing member in the first direction and the second direction.

[0258] The above second hole can restrain the second fixing member in the first direction and the second direction.

[0259] The above first fixing member may include a first body part coupled to the first frame panel and a first head part having a circular cross-section corresponding to the first hole.

[0260] The second fixing member may include a second body part coupled to the second frame panel and a second head part having a circular cross-section corresponding to the second hole.

[0261] The above first module attachment layer may further include a third hole into which the third fixing member is inserted, and a fifth hole into which the fifth fixing member is inserted.

[0262] The second module attachment layer may further include a fourth hole into which the fourth fixing member is inserted, and a sixth hole into which the sixth fixing member is inserted.

[0263] The third fixing member may include a third body part coupled to the first frame panel, and a third head part having a width smaller than the diameter of the third hole in the first direction and a width corresponding to the diameter of the third hole in the second direction.

[0264] The fourth fixing member may include a fourth body part coupled to the second frame panel, and a fourth head part having a width smaller than the diameter of the fourth hole in the first direction and a width corresponding to the diameter of the fourth hole in the second direction.

[0265] The fifth fixing member may include a fifth body part coupled to the first frame panel, and a fifth head part having a width corresponding to the diameter of the fifth hole in the first direction and a width smaller than the diameter of the fifth hole in the second direction.

[0266] The sixth fixing member may include a sixth body part coupled to the second frame panel, and a sixth head part having a width corresponding to the diameter of the sixth hole in the first direction and a width smaller than the diameter of the sixth hole in the second direction.

[0267] The above first module attachment layer may further include a first guide hole into which the third fixing member is inserted and which extends in the first direction.

[0268] The second module attachment layer may further include a second guide hole into which the fourth fixing member is inserted and which extends in the first direction.

[0269] The above first guide hole can guide the third fixing member to move in the first direction when thermally expanded.

[0270] The above second guide hole can guide the fourth fixing member to move in the first direction when thermally expanded.

[0271] The above first module attachment layer may further include a third guide hole into which the fifth fixing member is inserted and which extends in the second direction.

[0272] The second module attachment layer may further include a fourth guide hole into which the sixth fixing member is inserted and which extends in the second direction.

[0273] The above third guide hole can guide the fifth fixing member to move in the second direction when thermally expanded.

[0274] The above fourth guide hole can guide the sixth fixing member to move in the second direction when thermally expanded.

[0275] Each of the plurality of display modules may include a substrate including a mounting surface on which a plurality of inorganic light-emitting elements are mounted and a rear surface disposed opposite the mounting surface.

[0276] The first module attachment layer and the second module attachment layer may be made of a material having material properties similar to those of the substrate.

[0277] The frame may further include a first adhesive layer disposed between the first module attachment layer and the first frame panel and configured to adhere the first module attachment layer and the first frame panel.

[0278] The frame may further include a second adhesive layer disposed between the second module attachment layer and the second frame panel and provided to adhere the second module attachment layer and the second frame panel.

[0279] The ductility of the first adhesive layer may be set to be greater than the ductility of the first module attachment layer and the ductility of the first frame panel.

[0280] The ductility of the second adhesive layer may be set to be greater than the ductility of the second module attachment layer and the ductility of the second frame panel.

[0281] The above first thermal expansion coefficient may be set to be smaller than the above second thermal expansion coefficient.

[0282] A display device (1) according to one embodiment includes a plurality of display modules (30A-30P) and a frame (200) that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form. The frame includes a plurality of module attachment layers to which the plurality of display modules are attached, the plurality of module attachment layers having a first coefficient of thermal expansion, and horizontally arranged in a 2*2 matrix form, a plurality of frame panels coupled to the plurality of module attachment layers, the plurality of frame panels having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, and horizontally arranged in a 2*2 matrix form, and a plurality of fixing members that fix the first portions of each of the plurality of module attachment layers and the first portions of each of the plurality of frame panels so that the first portions of each of the plurality of module attachment layers and the first portions of each of the plurality of frame panels corresponding to the first portions of each of the plurality of module attachment layers do not move relative to each other in a horizontal direction.

[0283] The above plurality of fixing members may include a plurality of first fixing members (170) that restrict relative movement of the first portion of each of the plurality of module attachment layers in a first direction (Z) and a second direction (Y) intersecting the first direction with respect to the first portion of each of the plurality of frame panels.

[0284] The plurality of fixing members may include a plurality of second fixing members that limit relative movement in the second direction of a second portion of each of the plurality of module attachment layers, which is spaced apart from the first portion of each of the plurality of module attachment layers in the first direction, with respect to a second portion of each of the plurality of frame panels, which is spaced apart from the first portion of each of the plurality of frame panels in the first direction.

[0285] The plurality of fixing members may include a plurality of third fixing members that restrict relative movement in the first direction of a third portion of each of the plurality of module attachment layers spaced apart from the first portion of each of the plurality of module attachment layers in the second direction with respect to a third portion of each of the plurality of frame panels spaced apart from the first portion of each of the plurality of frame panels in the second direction.

[0286] The above plurality of module attachment layers may include a plurality of first holes into which the plurality of first fixing members are respectively inserted, and a plurality of second holes into which the plurality of second fixing members are respectively inserted.

[0287] Each of the plurality of first holes can restrain each of the plurality of first fixing members in the first direction and the second direction.

[0288] Each of the plurality of second holes can restrain each of the plurality of second fixing members in the first direction or the second direction.

[0289] The above plurality of module attachment layers may include a plurality of first guide holes into which the plurality of second fixing members are respectively inserted, and a plurality of second guide holes into which the plurality of third fixing members are respectively inserted.

[0290] Each of the plurality of first guide holes can guide each of the plurality of second fixing members to move in the first direction when thermally expanded.

[0291] Each of the plurality of second guide holes can guide the plurality of third fixing members to move in the second direction when thermally expanded.

[0292] According to the invention, a display device can be provided in which a gap between a plurality of display modules is maintained at a certain level due to thermal expansion, thereby preventing a seam that may occur between the plurality of display modules from being amplified.

[0293] According to the invention, a display device can be provided that includes a plurality of frames and can prevent a seam between a plurality of display modules supported by the plurality of frames from being amplified due to thermal expansion.

[0294] The above illustrates and describes specific embodiments. However, the invention is not limited to the above-described embodiments, and those skilled in the art will readily appreciate that various modifications and implementations can be made without departing from the spirit and scope of the invention as set forth in the claims below.

Claims

1. Multiple display modules; and A frame supporting the plurality of display modules in a matrix form; The above frame is, Some of the display modules among the above plurality of display modules are attached, and a first module attachment layer having a first coefficient of thermal expansion, A first frame panel coupled with the first module attachment layer and having a second coefficient of thermal expansion different from the first coefficient of thermal expansion, A second module attachment layer, to which some of the remaining display modules among the plurality of display modules are attached, having the first coefficient of thermal expansion, and positioned adjacent to the first module attachment layer, A second frame panel, which is combined with the second module attachment layer, has the second coefficient of thermal expansion, and is positioned adjacent to the first frame panel; A first fixing member provided to fix the first portion on the first module attachment layer and the first portion on the first frame panel so that the first portion on the first module attachment layer and the first portion on the first frame panel do not move relative to each other as the first module attachment layer and the first frame panel thermally expand, and A display device including a second fixing member that is provided to fix the first portion on the second module attachment layer and the first portion on the second frame panel so that the first portion on the second module attachment layer and the first portion on the second frame panel do not move relative to each other as the second module attachment layer and the second frame panel thermally expand.

2. In paragraph 1, The above first fixing member is provided to limit relative movement of the first portion on the first module attachment layer in the first direction and in the second direction intersecting the first direction with respect to the first portion on the first frame panel. A display device in which the second fixing member is provided to limit relative movement of the first portion on the second module attachment layer in the first direction and the second direction with respect to the first portion on the second frame panel.

3. In paragraph 2, The above frame is, A third fixing member provided to limit the second part on the first module attachment layer from moving relative to the second part on the first frame panel in the second direction; and Further comprising a fourth fixing member that restricts the second part on the second module attachment layer from moving relative to the second part on the second frame panel in the second direction; The second portion on the first module attachment layer is spaced apart from the first portion on the first module attachment layer in the first direction, and the second portion on the first frame panel is spaced apart from the first portion on the first frame panel in the first direction. A display device wherein the second portion on the second module attachment layer is spaced apart from the first portion on the second module attachment layer in the first direction, and the second portion on the second frame panel is spaced apart from the first portion on the second frame panel in the first direction.

4. In paragraph 3, The above frame is, A fifth fixing member that restricts the third part on the first module attachment layer from moving relative to the third part on the first frame panel in the first direction, and The third portion on the second module attachment layer further includes a sixth fixing member that restricts relative movement in the first direction with respect to the third portion on the second frame panel. The third portion on the first module attachment layer is spaced apart from the first portion on the first module attachment layer in the second direction, and the third portion on the first frame panel is spaced apart from the first portion on the first frame panel in the second direction. A display device wherein the third portion on the second module attachment layer is spaced apart from the first portion on the second module attachment layer in the second direction, and the third portion on the second frame panel is spaced apart from the first portion on the second frame panel in the second direction.

5. In paragraph 4, The above first module attachment layer includes a first hole in which the first fixing member is placed, The above second module attachment layer includes a second hole in which the second fixing member is placed, The above first hole restrains the above first fixing member in the first direction and the second direction, A display device in which the second hole constrains the second fixing member in the first direction and the second direction.

6. In paragraph 5, The above first fixed member is, It includes a first body part coupled to the first frame panel, and a first head part having a circular cross-section corresponding to the first hole, The above second fixed member is, A display device including a second body part coupled to the second frame panel, and a second head part having a circular cross-section corresponding to the second hole.

7. In paragraph 5, The above first module attachment layer further includes a third hole in which the third fixing member is placed therein, and a fifth hole in which the fifth fixing member is placed therein. A display device wherein the second module attachment layer further includes a fourth hole in which the fourth fixing member is positioned, and a sixth hole in which the sixth fixing member is positioned.

8. In paragraph 7, The above third fixed member is, It includes a third body part coupled to the first frame panel, and a third head part having a width smaller than the diameter of the third hole in the first direction and a width corresponding to the diameter of the third hole in the second direction. The above 4th fixed member is, A display device including a fourth body part coupled to the second frame panel, and a fourth head part having a width smaller than the diameter of the fourth hole in the first direction and a width corresponding to the diameter of the fourth hole in the second direction.

9. In paragraph 7, The above-mentioned fifth fixed member is, It includes a fifth body part coupled to the first frame panel, and a fifth head part having a width corresponding to the diameter of the fifth hole in the first direction and a width smaller than the diameter of the fifth hole in the second direction. The above 6th fixed member is, A display device including a sixth body part coupled to the second frame panel, and a sixth head part having a width corresponding to the diameter of the sixth hole in the first direction and a width smaller than the diameter of the sixth hole in the second direction.

10. In paragraph 5, The above first module attachment layer further includes a first guide hole in which the third fixing member is placed and which extends in the first direction, The second module attachment layer further includes a second guide hole in which the fourth fixing member is positioned and extends in the first direction, The above first guide hole is provided to guide the third fixing member to move in the first direction when thermally expanded. A display device in which the second guide hole is provided to guide the fourth fixing member to move in the first direction when thermally expanded.

11. In paragraph 10, The above first module attachment layer further includes a third guide hole in which the fifth fixing member is placed and extends in the second direction, The above second module attachment layer further includes a fourth guide hole in which the sixth fixing member is placed and which extends in the second direction, The third guide hole is provided to guide the fifth fixing member to move in the second direction when thermally expanded. A display device in which the fourth guide hole is provided to guide the sixth fixing member to move in the second direction when thermally expanded.

12. In paragraph 1, Each of the above multiple display modules is A display device comprising a substrate including a mounting surface on which a plurality of inorganic light-emitting elements are arranged and a rear surface arranged opposite the mounting surface.

13. In paragraph 1, The above frame is, A first adhesive layer provided between the first module attachment layer and the first frame panel to adhere the first module attachment layer and the first frame panel, A display device further comprising a second adhesive layer provided between the second module attachment layer and the second frame panel to adhere the second module attachment layer and the second frame panel.

14. In paragraph 13, The ductility of the first adhesive layer is greater than the ductility of the first module adhesive layer and the ductility of the first frame panel, A display device wherein the ductility of the second adhesive layer is greater than the ductility of the second module attachment layer and the ductility of the second frame panel.

15. In paragraph 1, A display device wherein the first coefficient of thermal expansion is smaller than the second coefficient of thermal expansion.

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