Substrate for manufacturing capacitor element and manufacturing method for capacitor element

Abstract

A substrate 1 for manufacturing a capacitor element includes: a substrate layer 10 divided into a product region R1 constituting a capacitor element and a region R2 outside product surrounding at least a part of the product region R1; and a sealing layer 20 provided so as to cover at least one major surface of the substrate layer 10. The product region R1 includes an anode plate 11 having a porous part 11B on at least one major surface of the core part 11A, a dielectric layer 13 provided on a surface of the porous part 11B, and a cathode layer 12 provided on a surface of the dielectric layer 13. The region R2 outside product includes the core part 11A of the anode plate 11. A penetration part 30 penetrating the anode plate 11 in a thickness direction is provided in at least a part of a region located at an outer edge of the substrate layer 10 in the region R2 outside product. At least a part of the penetration part 30 is filled with a filling member 40.

Description

Substrate for manufacturing capacitor elements and method for manufacturing capacitor elements

[0001] The present invention relates to a substrate for producing a capacitor element and a method for producing a capacitor element.

[0002] Patent Document 1 discloses a module used in a semiconductor composite device that supplies a load with a DC voltage regulated by a voltage regulator including a semiconductor active element, the module comprising: a capacitor layer including at least one capacitor section that forms a capacitor; a connection terminal used for electrical connection to at least one of the voltage regulator and the load; and a through-hole conductor formed so as to penetrate the capacitor section in the thickness direction of the capacitor layer, wherein the capacitor is electrically connected to at least one of the load and the voltage regulator via the through-hole conductor.

[0003] 17 and 19 of Patent Document 1 disclose, as one embodiment of a module, a package substrate 200D including a capacitor layer 210, a first through-hole conductor 262A, and a second through-hole conductor 264A. The capacitor layer 210 includes a capacitor section 230, a conductive section 220 electrically connected to the first through-hole conductor 262A, a conductive section 240 electrically connected to the second through-hole conductor 264A, and an insulating section 225 laminated on the surface of the capacitor section 230.

[0004] According to Patent Document 1, the capacitor layer 210 is formed by the following method:

[0005] First, both sides of an aluminum foil that will become the anode plate 231 are processed to be porous, forming a porous portion 234 on the surface of the core portion 232. A dielectric layer is formed by applying an oxide film to the surface of the porous portion 234. Then, a cathode layer 236 is formed on the surface of the dielectric layer.

[0006] At this time, a part of the porous portion 234 may be removed by, for example, a dicing process or the like until the core portion 232 is exposed, and Cu paste may be baked onto the exposed core portion 232. In this way, the capacitor portion 230 is formed.

[0007] Thereafter, through holes are formed by drilling or laser processing in the areas where through-hole conductors are to be formed.

[0008] Next, a resin such as epoxy, polyimide, or phenol, or a mixed material of a resin such as epoxy, polyimide, or phenol with an inorganic filler such as silica or alumina, is laminated onto capacitor section 230 and then thermally cured to seal capacitor section 230 and form insulating section 225. After the sealing process, conductive layer 212 for forming conductive sections 220 and 240 for connecting the through-hole conductors to the respective electrodes of capacitor section 230 is formed on the surface of insulating section 225 by plating wiring or the like. Note that through holes may be formed after the sealing process.

[0009] Thereafter, the conductive layer 212 is processed by etching or the like to form the conductive portions 220 and 240. Then, holes are opened in the conductive portions 220 and 240 by laser processing or the like, reaching the core portion 232 of the anode plate 231 and the cathode layer 236, and a conductor such as Cu is filled therein to electrically connect the core portion 232 of the anode plate 231 to the conductive portion 220 and to electrically connect the cathode layer 236 to the conductive portion 240. This forms the capacitor layer 210. Note that the core portion 232 of the anode plate 231 may be directly connected to the through-hole conductor 262 at the end surface of the anode plate 231. In this case, it is not necessary to form the conductive portion 220.

[0010] International Publication No. 2021 / 241325

[0011] In a semi-finished product during the manufacturing process of a module such as the package substrate described in Patent Document 1, the adhesion between the insulating portion (hereinafter also referred to as a sealing layer) and the anode plate or between the insulating portion and the conductive portion (hereinafter also referred to as an external electrode layer) is weaker in the outer region of the product where the cathode layer is not formed, compared to the product region. Furthermore, if the insulating portion is composed of two or more layers, the adhesion between the insulating portions in the outer region of the product is also weaker than in the product region. Therefore, the outer region of the product is prone to bulging due to delamination, and in some cases, the bulging may extend to the product region.

[0012] The present invention has been made to solve the above problems, and aims to provide a substrate for manufacturing a capacitor element that can suppress swelling due to delamination. Another aim of the present invention is to provide a method for manufacturing a capacitor element using the substrate for manufacturing a capacitor element.

[0013] The substrate for producing a capacitor element of the present invention comprises a substrate layer divided into a product region constituting a capacitor element and an outside-product region surrounding at least a portion of the product region, and a sealing layer provided to cover at least one main surface of the substrate layer. The product region includes an anode plate having a porous portion on at least one main surface of a core portion, a dielectric layer provided on the surface of the porous portion, and a cathode layer provided on the surface of the dielectric layer. The outside-product region includes the core portion of the anode plate. At least a portion of the outside-product region located on the outer edge of the substrate layer has a through portion penetrating the anode plate in the thickness direction. At least a portion of the through portion is filled with a filling member.

[0014] The method for producing a capacitor element of the present invention includes a step of separating a product region from the substrate for producing a capacitor element of the present invention by removing at least a part of the non-product region.

[0015] According to the present invention, it is possible to provide a substrate for producing a capacitor element that can suppress swelling due to delamination. Furthermore, according to the present invention, it is possible to provide a method for producing a capacitor element using the substrate for producing a capacitor element.

[0016] FIG. 1 is an exploded perspective view schematically showing an example of a capacitor element manufacturing substrate according to a first embodiment of the present invention. FIG. 2 is a plan view of the capacitor element manufacturing substrate shown in FIG. 1. FIG. 3 is a cross-sectional view schematically showing an example of a capacitor element manufacturing substrate according to the first embodiment of the present invention. FIG. 4A is a plan view schematically showing an example of an arrangement of through-holes in an extra-product region. FIG. 4B is a cross-sectional view schematically showing an example of an arrangement of through-holes in an extra-product region. FIG. 5A is a plan view schematically showing another example of an arrangement of through-holes in an extra-product region. FIG. 5B is a cross-sectional view schematically showing another example of an arrangement of through-holes in an extra-product region. FIG. 6A is a cross-sectional view schematically showing an example of a step of separating a product region R1 from a capacitor element manufacturing substrate 1. FIG. 6B is a plan view schematically showing an example of a step of separating a product region R1 from a capacitor element manufacturing substrate 1. FIG. 7A is a cross-sectional view schematically showing an example of a capacitor element obtained from a capacitor element manufacturing substrate 1. FIG. 7B is a plan view schematically showing an example of a capacitor element obtained from the capacitor element production substrate 1. FIG. 8 is a cross-sectional view schematically showing a first modified example of the capacitor element production substrate 1 shown in FIG. 3. FIG. 9 is a cross-sectional view schematically showing a second modified example of the capacitor element production substrate 1 shown in FIG. 3. FIG. 10 is a cross-sectional view schematically showing an example of a capacitor element production substrate according to the second embodiment of the present invention. FIG. 11 is a cross-sectional view schematically showing another example of a capacitor element production substrate according to the second embodiment of the present invention. FIG. 12 is a cross-sectional view schematically showing a modified example of the capacitor element production substrate 2 shown in FIG. 10. FIG. 13 is a cross-sectional view schematically showing a modified example of the capacitor element production substrate 2′ shown in FIG. 11. FIG. 14 is a cross-sectional view schematically showing an example of a capacitor element production substrate according to the third embodiment of the present invention. FIG. 15 is a cross-sectional view schematically showing another example of a capacitor element production substrate according to the third embodiment of the present invention. FIG. 16 is a cross-sectional view schematically showing a modified example of the capacitor element production substrate 3 shown in FIG. 14. FIG. 17 is a cross-sectional view schematically showing a modified example of the capacitor element manufacturing substrate 3' shown in FIG.

[0017] The substrate for producing a capacitor element of the present invention will be described below. Note that the present invention is not limited to the following configurations and may be modified as appropriate within the scope of the present invention. In addition, a combination of multiple individual preferred configurations described below also constitutes the present invention.

[0018] The following embodiments are merely examples, and it goes without saying that partial substitution or combination of the configurations shown in different embodiments is possible. From the second embodiment onwards, descriptions of matters common to the first embodiment will be omitted, and differences will be mainly described. In particular, similar effects resulting from similar configurations will not be mentioned one after the other for each embodiment.

[0019] In the following description, when there is no need to particularly distinguish between the embodiments, they will simply be referred to as "substrates for producing capacitor elements of the present invention."

[0020] In this specification, terms indicating the relationship between elements (e.g., "perpendicular," "parallel," "orthogonal," etc.) and terms indicating the shape of elements are not expressions that only express a strict meaning, but are expressions that also include a range of substantial equivalence, for example, a difference of about a few percent.

[0021] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, and other scales may differ from those of the actual product. In the drawings, the same or equivalent parts will be designated by the same reference numerals. In addition, the same elements will be designated by the same reference numerals in each drawing, and duplicate explanations will be omitted.

[0022] [First embodiment] Fig. 1 is an exploded perspective view schematically showing an example of a substrate for producing capacitor elements according to a first embodiment of the present invention. Fig. 2 is a plan view of the substrate for producing capacitor elements shown in Fig. 1. For the sake of convenience of explanation, first external electrode layers 91 and second external electrode layers 92, which will be described later, are omitted from Figs. 1 and 2.

[0023] The capacitor element production substrate 1 shown in FIGS. 1 and 2 includes a substrate layer 10 and a sealing layer 20 provided so as to cover at least one main surface of the substrate layer 10 .

[0024] 1, the sealing layer 20 is provided so as to cover both opposing main surfaces in the thickness direction of the substrate layer 10. The sealing layer 20 protects the substrate layer 10.

[0025] The sealing layer 20 may be composed of only one layer or two or more layers on one main surface side of the substrate layer 10. When the sealing layer 20 is composed of two or more layers, the materials constituting each layer may be the same or different.

[0026] The sealing layer 20 is formed so as to seal the substrate layer 10 by, for example, a method of thermocompressing an insulating resin sheet, or a method of applying an insulating resin paste and then thermally curing it.

[0027] As shown in FIGS. 1 and 2, the substrate layer 10 is divided into a product region R1 and an outside-product region R2 that surrounds at least a portion of the product region R1.

[0028] The capacitor element manufacturing substrate 1 is a semi-finished product. As will be described later, a capacitor element (for example, the capacitor element 100 shown in FIGS. 7A and 7B ) is manufactured as a final product (finished product) by separating the product region R1 from the capacitor element manufacturing substrate 1.

[0029] The product region R1 is a region that constitutes a capacitor element, which is a final product (finished product). The number of product regions R1 included in the substrate layer 10 is not particularly limited, and may be one or more.

[0030] When the substrate layer 10 includes multiple product regions R1, the product regions R1 may be arranged regularly or irregularly. The sizes and planar shapes of the product regions R1 may be the same, or some or all of them may be different.

[0031] 1 and 2, one or more capacitor units are arranged in each product region R1. The number of capacitor units arranged in each product region R1 may be the same, or some or all of them may be different.

[0032] When multiple capacitor units are arranged in the product region R1, the capacitor units may be arranged regularly or irregularly. The size and planar shape of each capacitor unit may be the same, or some or all of them may be different. It is preferable that each capacitor unit has the same configuration, but capacitor units with different configurations may be included.

[0033] 1 and 2, the outside-product area R2 is provided to surround the entire product area R1. For example, if the planar shape of the product area R1 is rectangular (i.e., square or oblong), the outside-product area R2 may be provided to surround two opposing sides of the product area R1, may be provided in an L-shape to surround two adjacent sides of the product area R1, or may be provided in a frame shape to surround four sides of the product area R1.

[0034] 3 is a cross-sectional view schematically showing an example of a substrate for producing a capacitor element according to the first embodiment of the present invention, taken along line III-III of the substrate for producing a capacitor element shown in FIG.

[0035] The product region R1 includes an anode plate 11 having a porous portion 11B on at least one main surface of a core portion 11A, a dielectric layer 13 provided on the surface of the porous portion 11B, and a cathode layer 12 provided on the surface of the dielectric layer 13. This makes up an electrolytic capacitor. In the example shown in Fig. 3, the anode plate 11 has the porous portion 11B on both main surfaces of the core portion 11A, but the porous portion 11B may be provided on only one main surface of the core portion 11A.

[0036] In the product region R1, the anode plate 11, the dielectric layer 13, and the cathode layer 12 form a capacitor section.

[0037] The cathode layer 12 includes, for example, a solid electrolyte layer 12A provided on the surface of the dielectric layer 13. The cathode layer 12 preferably further includes a conductor layer 12B provided on the surface of the solid electrolyte layer 12A. When the cathode layer 12 includes the solid electrolyte layer 12A, the product region R1 constitutes a solid electrolytic capacitor.

[0038] The outside-product region R2 includes the core portion 11A of the anode plate 11. As shown in Fig. 3, the outside-product region R2 may include the anode plate 11 having a porous portion 11B on at least one main surface of the core portion 11A, and may further include a dielectric layer 13 provided on the surface of the porous portion 11B.

[0039] The outside-product region R2 is a region that does not function as a capacitor element that is a final product, or a region that is not used as a capacitor element that is a final product. In the capacitor element that is a final product, the outside-product region R2 may be completely removed, or a part of the outside-product region R2 may remain.

[0040] In order to function as a capacitor element, the anode must be connected to the core 11A of the anode plate 11, and the cathode must be connected to the cathode layer 12. Therefore, the region where the anode is not connected to the core 11A of the anode plate 11 or the region where the cathode is not connected to the cathode layer 12 corresponds to the outside-product region R2 that does not function as a capacitor element.

[0041] For example, even if a region has a through-hole conductor electrically connected to the anode plate 11, the region that does not function as a capacitor element in the final product corresponds to the outside-product region R2. Furthermore, even if the semi-finished capacitor element manufacturing substrate 1 has a region in which a through-hole conductor electrically connected to the anode plate 11 and a through-hole conductor electrically connected to the cathode layer 12 are provided, the region that will be removed before the final product corresponds to the outside-product region R2.

[0042] In at least a portion of the region of the outside-product region R2 located at the outer edge of the substrate layer 10, a through portion 30 is provided that penetrates the anode plate 11 in the thickness direction. The number of through portions 30 is not particularly limited and may be one or more. The outside-product region R2 in which the through portion 30 is provided only needs to include at least a portion of the region located at the outer edge of the substrate layer 10. Therefore, the through portion 30 may be provided in a portion of the region located at the outer edge of the substrate layer 10, or the through portion 30 may be provided in the entire region located at the outer edge of the substrate layer 10.

[0043] The through-holes 30 may be holes that penetrate the anode plate 11 in the thickness direction, or may be grooves that divide the anode plate 11 in the thickness direction. When a plurality of through-holes 30 are provided in the out-of-product region R2, the through-holes 30 may be a mixture of holes that penetrate the anode plate 11 in the thickness direction and grooves that divide the anode plate 11 in the thickness direction.

[0044] The width of the through portion 30 may be constant in the thickness direction, may decrease in the thickness direction, or may increase in the thickness direction. Furthermore, the width of the through portion 30 may be smaller at the center side of the anode plate 11 than at both main surface sides, or may be larger at the center side of the anode plate 11 than at both main surface sides.

[0045] At least a portion of the through-hole 30 is filled with the filling member 40. In the example shown in Fig. 3, the entire through-hole 30 is filled with the filling member 40, but only a portion of the through-hole 30 may be filled with the filling member 40. For example, there may be a gap in the space surrounded by the filling member 40 inside the through-hole 30, or there may be a gap between the through-hole 30 and the filling member.

[0046] 3 , the filling member 40 includes an insulating member. For example, the insulating member includes a sealing layer 20 that penetrates into the through portion 30. The sealing layer 20 only needs to penetrate into at least a portion of the through portion 30, and may penetrate into the entire through portion 30.

[0047] 3 , the filling member 40 is preferably in contact with the sealing layer 20 on at least one main surface of the substrate layer 10, and is preferably in contact with the sealing layer 20 on both main surfaces of the substrate layer 10. As described above, the filling member 40 may be integral with the sealing layer 20 on at least one main surface of the substrate layer 10, or may be integral with the sealing layer 20 on both main surfaces of the substrate layer 10.

[0048] By providing a through hole 30 in at least a portion of the region of the outside-product region R2 located at the outer edge of the substrate layer 10 and filling at least a portion of the through hole 30 with a filler 40, it is possible to improve the adhesion between the sealing layer 20 and the anode plate 11 in the outside-product region R2. This makes it possible to suppress swelling due to delamination in the outside-product region R2. This also makes it possible to suppress swelling in the product region R1.

[0049] Although not shown, a through-hole 30 may be provided in at least a part of the region of the outside-product region R2 that is located between adjacent product regions R1. In this case, it is preferable that at least a part of the through-hole 30 is filled with a filling member 40.

[0050] When a plurality of through-holes 30 are provided in the outside-product region R2, some of the through-holes 30 may not be filled with the filling member 40.

[0051] As shown in FIG. 3 , a dummy electrode layer 50 may be provided on the surface of the sealing layer 20 in the outside-product region R2. In this case, one dummy electrode layer 50 or multiple dummy electrode layers 50 may be provided in the outside-product region R2. The dummy electrode layer 50 may be provided on the surface of the sealing layer 20 on both main surface sides, or on the surface of the sealing layer 20 on either main surface side. The dummy electrode layer 50 may extend to the product region R1. Note that the dummy electrode layer 50 does not necessarily have to be provided on the surface of the sealing layer 20 in the outside-product region R2. The dummy electrode layer 50 is an example of a dummy layer. The dummy layer may be a conductive layer like an electrode layer, or an insulating layer like an insulating layer.

[0052] When a dummy layer such as the dummy electrode layer 50 is provided in the outside-product region R2, it is preferable that at least one end of the through-hole 30 is covered by the dummy layer. In the example shown in Fig. 3, both ends of the through-hole 30 are covered by the dummy electrode layer 50, but either one end of the through-hole 30 may be covered by the dummy electrode layer 50.

[0053] The dummy electrode layer 50 preferably has a common configuration with a first external electrode layer 91 and a second external electrode layer 92 described later.

[0054] An example of the configuration of the product area R1 will be described below with reference to FIG.

[0055] In the product region R1, an insulating layer 15 may be provided between the anode plate 11 and the sealing layer 20. In this case, the insulating layer 15 may be provided between the sealing layer 20 on one of the main surfaces and the anode plate 11, or the insulating layer 15 may be provided between the sealing layer 20 on both main surfaces and the anode plate 11.

[0056] The insulating layer 15 may be composed of only one layer or two or more layers. When the insulating layer 15 is composed of two or more layers, the materials constituting the layers may be the same or different.

[0057] 3, the insulating layer 15 includes a first insulating layer 15A provided on the surface of the dielectric layer 13 and a second insulating layer 15B provided on the surface of the first insulating layer 15A. The thickness of the first insulating layer 15A may be the same as the thickness of the second insulating layer 15B, or may be greater than or smaller than the thickness of the second insulating layer 15B.

[0058] The product region R1 may include a first through-hole conductor 61 that is provided to penetrate the anode plate 11 and the sealing layer 20 in the thickness direction and is electrically connected to the anode plate 11 .

[0059] The first through-hole conductor 61 may be provided on at least the inner wall surface of the first through hole 71 that penetrates the anode plate 11 and the sealing layer 20 in the thickness direction. The first through-hole conductor 61 may be provided only on the inner wall surface of the first through hole 71, or may be provided throughout the entire interior of the first through hole 71.

[0060] When viewed in a plane from the thickness direction, one first through-hole conductor 61 may be provided inside the cathode layer 12 included in each capacitor portion, or two or more first through-hole conductors 61 may be provided inside the cathode layer 12 included in each capacitor portion.

[0061] As shown in FIG. 3, it is preferable that the end face of the cathode layer 12 and the first through-hole conductor 61 are insulated from each other by an insulating material (insulating layer 15 in FIG. 3).

[0062] As shown in FIG. 3 , the first through-hole conductor 61 is preferably electrically connected to the anode plate 11 on the inner wall surface of the first through hole 71 .

[0063] 3 , when the first through-hole conductor 61 is provided only on the inner wall surface of the first through hole 71, a first resin filling portion 81 formed by filling a resin material may be provided inside the first through-hole conductor 61. The first resin filling portion 81 is provided in the space surrounded by the first through-hole conductor 61 inside the first through hole 71. When the space inside the first through hole 71 is eliminated by providing the first resin filling portion 81, delamination of the first through-hole conductor 61 is suppressed. Note that the first resin filling portion 81 may be a conductor or an insulator.

[0064] The product region R1 may include a second through-hole conductor 62 that is provided to penetrate the anode plate 11 and the sealing layer 20 in the thickness direction and is electrically connected to the cathode layer 12 .

[0065] The second through-hole conductor 62 may be provided on at least the inner wall surface of the second through hole 72 that penetrates the anode plate 11 and the sealing layer 20 in the thickness direction. The second through-hole conductor 62 may be provided only on the inner wall surface of the second through hole 72, or may be provided throughout the entire interior of the second through hole 72.

[0066] In plan view from the thickness direction, one second through-hole conductor 62 may be provided inside the cathode layer 12 included in each capacitor portion, or two or more second through-hole conductors 62. For one capacitor portion, the number of second through-hole conductors 62 may be the same as or different from the number of first through-hole conductors 61.

[0067] As shown in FIG. 3, the end face of the anode plate 11 and the second through-hole conductor 62 are preferably insulated from each other by an insulating material (part of the sealing layer 20 in FIG. 3).

[0068] 3 , when the second through-hole conductor 62 is provided only on the inner wall surface of the second through hole 72, a second resin filling portion 82 formed by filling a resin material may be provided inside the second through-hole conductor 62. The second resin filling portion 82 is provided in the space surrounded by the second through-hole conductor 62 inside the second through hole 72. When the space inside the second through hole 72 is eliminated by providing the second resin filling portion 82, the occurrence of delamination of the second through-hole conductor 62 is suppressed. Note that the second resin filling portion 82 may be a conductor or an insulator.

[0069] When a first through-hole conductor 61 or a second through-hole conductor 62 is provided inside the sealing layer 20, it is preferable that an insulating layer 15 is provided around the first through-hole conductor 61 or the second through-hole conductor 62 on at least one main surface of the anode plate 11.

[0070] Furthermore, an insulating layer 15 may be provided on at least one main surface of the anode plate 11 so as to surround the periphery of the cathode layer 12. By surrounding the periphery of the cathode layer 12 with the insulating layer 15, insulation between the anode plate 11 and the cathode layer 12 is ensured, and short-circuiting between them is prevented. The insulating layer 15 may be provided so as to surround a portion of the periphery of the cathode layer 12, but is preferably provided so as to surround the entire periphery of the cathode layer 12.

[0071] Although not shown in Figure 3, the product region R1 may include a third through-hole conductor that is arranged to penetrate the anode plate 11 and the sealing layer 20 in the thickness direction and is not electrically connected to the anode plate 11 and the cathode layer 12.

[0072] The product region R1 may include a first external electrode layer 91 provided on the surface of the sealing layer 20 and electrically connected to the anode plate 11 and the first through-hole conductor 61. The first external electrode layer 91 may extend to the outside-product region R2.

[0073] One first external electrode layer 91 may be provided for one capacitor portion, or a plurality of first external electrode layers 91 may be provided for one capacitor portion.

[0074] The planar shape of the first external electrode layer 91 when viewed from the thickness direction is not particularly limited, and examples thereof include a rectangle (square or oblong), a quadrangle other than a rectangle, a polygon such as a triangle, a pentagon, or a hexagon, a circle, an ellipse, a combination of these, etc. Furthermore, the planar shape of the first external electrode layer 91 may be an L-shape, a C-shape, a stepped shape, etc.

[0075] The product region R1 may include a second external electrode layer 92 provided on the surface of the sealing layer 20 and electrically connected to the cathode layer 12 and the second through-hole conductor 62. The second external electrode layer 92 may extend to the outside-product region R2.

[0076] One capacitor unit may be provided with one second external electrode layer 92, or may be provided with a plurality of second external electrode layers 92. The number of second external electrode layers 92 for one capacitor unit may be the same as or different from the number of first external electrode layers 91.

[0077] The planar shape of the second external electrode layer 92 when viewed from the thickness direction is not particularly limited, and examples thereof include a rectangle (square or oblong), a quadrangle other than a rectangle, a polygon such as a triangle, a pentagon, or a hexagon, a circle, an ellipse, or a combination of these. The planar shape of the second external electrode layer 92 may also be an L-shape, a C-shape, a stepped shape, or the like. The planar shape of the second external electrode layer 92 when viewed from the thickness direction may be the same as or different from the planar shape of the first external electrode layer 91 when viewed from the thickness direction.

[0078] Although not shown in FIG. 3, the product region R1 may include via conductors provided so as to penetrate the sealing layer 20 in the thickness direction.

[0079] For example, the product region R1 may include a via conductor electrically connected to the anode plate 11. In this case, the anode plate 11 is electrically led out to the outside of the sealing layer 20 through the via conductor, and can be electrically connected to the outside of the sealing layer 20. The number of via conductors electrically connected to the anode plate 11 may be one, or two or more.

[0080] Alternatively, the product region R1 may include a via conductor electrically connected to the cathode layer 12. In this case, the cathode layer 12 is electrically led out to the outside of the sealing layer 20 through the via conductor, and can be electrically connected to the outside of the sealing layer 20. The number of via conductors electrically connected to the cathode layer 12 may be one or two or more.

[0081] Fig. 4A is a plan view schematically showing an example of the arrangement of the through-holes in the outside-of-product area. Fig. 4B is a cross-sectional view schematically showing an example of the arrangement of the through-holes in the outside-of-product area. Fig. 4A is a plan view taken along line A-A in Fig. 4B.

[0082] 4A and 4B, it is preferable that at least three through-holes 30 are arranged at equal intervals in the outside-of-product region R2 (see FIG. 3, etc.). The term "equally spaced" here does not mean only the strict meaning, but also means a substantially equivalent range, for example, including a difference of about a few percent.

[0083] By arranging at least three through holes 30 at equal intervals, local stress concentration is prevented, thereby suppressing delamination. Note that as long as at least three through holes 30 are arranged at equal intervals, through holes 30 at different intervals may be included.

[0084] The distance between the equally spaced through-holes 30 (the length indicated by the arrows in FIG. 4A ) is not particularly limited, but is preferably 1 mm or less. On the other hand, the distance between the equally spaced through-holes 30 is, for example, 0.1 mm or more.

[0085] Fig. 5A is a plan view schematically showing another example of the arrangement of the through-holes in the outside-of-product area. Fig. 5B is a cross-sectional view schematically showing another example of the arrangement of the through-holes in the outside-of-product area. Fig. 5A is a plan view taken along line A-A in Fig. 5B.

[0086] 5A and 5B, at least three through-holes 30 are arranged at equal intervals in the outside-of-product region R2 (see FIG. 3, etc.), and it is preferable that at least two of the through-holes 30 arranged at equal intervals have the same planar shape when viewed from the thickness direction. In particular, it is preferable that all of the through-holes 30 arranged at equal intervals have the same planar shape. Here, the phrase "same planar shape" does not mean only the strict meaning, but also means that the planar shapes are substantially the same, for example, including a difference of about a few percent.

[0087] Hereinafter, there will be described an example of a method for manufacturing a capacitor element using the capacitor element manufacturing substrate 1. As described above, the method for manufacturing a capacitor element using the capacitor element manufacturing substrate of the present invention also constitutes one aspect of the present invention.

[0088] Fig. 6A is a cross-sectional view schematically showing an example of a step of separating the product region R1 from the capacitor element manufacturing substrate 1. Fig. 6B is a plan view schematically showing an example of a step of separating the product region R1 from the capacitor element manufacturing substrate 1.

[0089] 6A and 6B , the product region R1 is separated by removing the outside-product region R2 from the capacitor element manufacturing substrate 1. For example, the entire outside-product region R2 may be removed by cutting the capacitor element manufacturing substrate 1 at the position of the cutting line CL1. Alternatively, a portion of the outside-product region R2 may be removed by cutting the capacitor element manufacturing substrate 1 at the position of the cutting line CL1a.

[0090] Fig. 7A is a cross-sectional view schematically showing an example of a capacitor element obtained from the capacitor element production substrate 1. Fig. 7B is a plan view schematically showing an example of a capacitor element obtained from the capacitor element production substrate 1.

[0091] For example, when the capacitor element manufacturing substrate 1 is cut at the position of the cutting line CL1 in FIGS. 6A and 6B, the capacitor element 100 shown in FIGS. 7A and 7B is obtained.

[0092] FIG. 8 is a cross-sectional view schematically showing a first modified example of the capacitor element manufacturing substrate 1 shown in FIG.

[0093] In the capacitor element manufacturing substrate 1A shown in Figure 8, the sealing layer 20 includes a first sealing layer 21 arranged to cover at least one main surface of the substrate layer 10, and a second sealing layer 22 arranged on the surface of the first sealing layer 21.

[0094] 8 , the filling member 40 includes an insulating member. For example, the insulating member includes a second sealing layer 22 that penetrates into the through portion 30. The second sealing layer 22 only needs to penetrate into at least a portion of the through portion 30, and may penetrate into the entire through portion 30.

[0095] FIG. 9 is a cross-sectional view schematically showing a second modified example of the capacitor element manufacturing substrate 1 shown in FIG.

[0096] In the capacitor element manufacturing substrate 1B shown in Figure 9, the sealing layer 20 includes a first sealing layer 21 arranged to cover at least one main surface of the substrate layer 10, and a second sealing layer 22 arranged on the surface of the first sealing layer 21.

[0097] 9 , the filling member 40 includes an insulating member. For example, the insulating member includes a first sealing layer 21 that penetrates into the through portion 30. The first sealing layer 21 may penetrate into at least a portion of the through portion 30, or may penetrate into the entire through portion 30.

[0098] 8 or 9 , when the sealing layer 20 is composed of two or more layers, the adhesion between the first sealing layer 21 and the second sealing layer 22 in the outside-of-product region R2 can be improved by filling at least a portion of the through-hole 30 with the filler 40. This can suppress swelling due to delamination in the outside-of-product region R2. This can also suppress swelling in the product region R1.

[0099] Second Embodiment In a capacitor element production substrate according to a second embodiment of the present invention, the filling member includes a conductive member.

[0100] FIG. 10 is a cross-sectional view schematically showing an example of a substrate for producing a capacitor element according to the second embodiment of the present invention.

[0101] In the capacitor element production substrate 2 shown in FIG. 10, the filling member 40 includes a conductive member 41 .

[0102] 10 , the conductive member 41 may be provided on at least the inner wall surface of the through portion 30. The conductive member 41 may be provided only on the inner wall surface of the through portion 30, or may be provided throughout the entire interior of the through portion 30.

[0103] As shown in FIG. 10 , the conductive member 41 may be in contact with the anode plate 11 on the inner wall surface of the through portion 30 .

[0104] 10 , when the conductive member 41 is provided only on the inner wall surface of the through-hole 30, a resin-filled portion 45 filled with a resin material may be provided inside the conductive member 41. The resin-filled portion 45 is provided in the space surrounded by the conductive member 41 inside the through-hole 30. When the space inside the through-hole 30 is eliminated by providing the resin-filled portion 45, the occurrence of delamination of the conductive member 41 is suppressed. Note that the resin-filled portion 45 may be a conductor or an insulator.

[0105] The conductive member 41 preferably has a common configuration to the first through-hole conductor 61 and the second through-hole conductor 62 .

[0106] In the outside-product region R2, a dummy electrode layer 50 may be provided on the surface of the sealing layer 20.

[0107] When a dummy layer such as the dummy electrode layer 50 is provided in the outside-product region R2, it is preferable that at least one end of the through-hole 30 is covered by the dummy layer. In the example shown in Fig. 10, both ends of the through-hole 30 are covered by the dummy electrode layer 50, but either one end of the through-hole 30 may be covered by the dummy electrode layer 50.

[0108] 10, it is particularly preferable that the conductive member 41 included in the filling member 40 is connected to the dummy electrode layer 50. In this case, delamination is further suppressed.

[0109] FIG. 11 is a cross-sectional view schematically showing another example of a substrate for producing a capacitor element according to the second embodiment of the present invention.

[0110] 11 , the filling member 40 further includes an insulating member 42 located outside the conductive member 41. In this manner, the filling member 40 may be composed of two or more layers of members extending inward from the inner wall surface of the through portion 30.

[0111] 11 , the insulating member 42 includes a sealing layer 20 that penetrates into the through-hole 30. The sealing layer 20 may penetrate at least a portion of the space between the anode plate 11 and the conductive member 41, or may penetrate the entire space between the anode plate 11 and the conductive member 41.

[0112] 11 , the insulating member 42 is preferably in contact with the sealing layer 20 on at least one main surface side of the substrate layer 10, and is preferably in contact with the sealing layer 20 on both main surface sides of the substrate layer 10. As described above, the insulating member 42 may be integral with the sealing layer 20 on at least one main surface side of the substrate layer 10, or may be integral with the sealing layer 20 on both main surface sides of the substrate layer 10.

[0113] In the capacitor element production substrate 2' shown in FIG. 11, the filling member 40 includes the insulating member 42, and therefore delamination is further suppressed compared to the capacitor element production substrate 2 shown in FIG.

[0114] FIG. 12 is a cross-sectional view schematically showing a modified example of the capacitor element manufacturing substrate 2 shown in FIG.

[0115] As shown in the capacitor element manufacturing substrate 2A in FIG. 12, the sealing layer 20 may include a first sealing layer 21 provided to cover at least one main surface of the substrate layer 10, and a second sealing layer 22 provided on the surface of the first sealing layer 21.

[0116] FIG. 13 is a cross-sectional view schematically showing a modified example of the capacitor element manufacturing substrate 2' shown in FIG.

[0117] As in the capacitor element manufacturing substrate 2B shown in Figure 13, the sealing layer 20 may include a first sealing layer 21 arranged to cover at least one main surface of the substrate layer 10, and a second sealing layer 22 arranged on the surface of the first sealing layer 21.

[0118] 13 , the insulating member 42 includes a first sealing layer 21 that penetrates into the through-hole 30. The first sealing layer 21 may penetrate at least a portion of the space between the anode plate 11 and the conductive member 41, or may penetrate the entire space between the anode plate 11 and the conductive member 41.

[0119] [Third embodiment] In a substrate for manufacturing a capacitor element according to a third embodiment of the present invention, the outside area of ​​the product includes an anode plate having a porous portion on at least one main surface of a core portion, a dielectric layer provided on the surface of the porous portion, and a cathode layer provided on the surface of the dielectric layer.

[0120] FIG. 14 is a cross-sectional view schematically showing an example of a substrate for producing a capacitor element according to the third embodiment of the present invention.

[0121] In the capacitor element manufacturing substrate 3 shown in Figure 14, the outside region R2 of the product includes an anode plate 11 having a porous portion 11B on at least one main surface of a core portion 11A, a dielectric layer 13 provided on the surface of the porous portion 11B, and a cathode layer 12 provided on the surface of the dielectric layer 13.

[0122] The configuration of the cathode layer 12 provided in the outside-product region R2 is preferably the same as that of the cathode layer 12 provided in the product region R1.

[0123] In the outside-product region R2, an insulating layer 15 may be provided between the anode plate 11 and the sealing layer 20. In this case, it is preferable that the penetration portion 30 penetrates the anode plate 11 and the insulating layer 15 in the thickness direction. The insulating layer 15 may be provided between the sealing layer 20 on one of the main surfaces and the anode plate 11, or may be provided between the sealing layer 20 on both main surfaces and the anode plate 11.

[0124] The insulating layer 15 may be composed of only one layer or two or more layers. When the insulating layer 15 is composed of two or more layers, the materials constituting the layers may be the same or different.

[0125] 14, the insulating layer 15 includes a first insulating layer 15A provided on the surface of the dielectric layer 13 and a second insulating layer 15B provided on the surface of the first insulating layer 15A. The thickness of the first insulating layer 15A may be the same as the thickness of the second insulating layer 15B, or may be greater than or smaller than the thickness of the second insulating layer 15B.

[0126] The insulating layer 15 in the outside-product region R2 is preferably provided around the through-hole 30. In addition, the insulating layer 15 may be provided in the outside-product region R2 so as to surround the periphery of the cathode layer 12.

[0127] The configuration of the insulating layer 15 provided in the outside-product region R2 is preferably the same as that of the insulating layer 15 provided in the product region R1. Alternatively, the insulating layer 15 may not be provided in the product region R1, and may be provided only in the outside-product region R2. The configuration of the insulating layer 15 provided in the outside-product region R2 may be in contact with the insulating layer 15 provided in the product region R1, or may be separated from the insulating layer 15 provided in the product region R1.

[0128] The other configurations are the same as those of the capacitor element manufacturing substrate 2 shown in FIG.

[0129] 14, by making the outside-product region R2 have the same structure as the product region R1, the difference in thickness of the sealing layer 20 between the product region R1 and the outside-product region R2 is reduced. This reduces stress caused by undulations in the substrate. Furthermore, by filling at least a portion of the through-hole 30 with the filler 40, it is possible to reduce swelling caused by delamination in the outside-product region R2.

[0130] FIG. 15 is a cross-sectional view schematically showing another example of a substrate for producing a capacitor element according to the third embodiment of the present invention.

[0131] In the capacitor element manufacturing substrate 3' shown in Figure 15, similar to the capacitor element manufacturing substrate 3 shown in Figure 14, the out-of-product region R2 includes an anode plate 11 having a porous portion 11B on at least one main surface of the core portion 11A, a dielectric layer 13 provided on the surface of the porous portion 11B, and a cathode layer 12 provided on the surface of the dielectric layer 13.

[0132] In the outside-product region R2, an insulating layer 15 may be provided between the anode plate 11 and the sealing layer 20. In this case, it is preferable that the penetration portion 30 penetrates the anode plate 11 and the insulating layer 15 in the thickness direction. The insulating layer 15 may be provided between the sealing layer 20 on one of the main surfaces and the anode plate 11, or may be provided between the sealing layer 20 on both main surfaces and the anode plate 11.

[0133] The other configuration is the same as that of the capacitor element manufacturing substrate 2' shown in FIG.

[0134] FIG. 16 is a cross-sectional view schematically showing a modified example of the capacitor element manufacturing substrate 3 shown in FIG.

[0135] As in the capacitor element manufacturing substrate 3A shown in Figure 16, the sealing layer 20 may include a first sealing layer 21 arranged to cover at least one main surface of the substrate layer 10, and a second sealing layer 22 arranged on the surface of the first sealing layer 21.

[0136] FIG. 17 is a cross-sectional view schematically showing a modified example of the capacitor element manufacturing substrate 3' shown in FIG.

[0137] As in the capacitor element manufacturing substrate 3B shown in Figure 17, the sealing layer 20 may include a first sealing layer 21 arranged to cover at least one main surface of the substrate layer 10, and a second sealing layer 22 arranged on the surface of the first sealing layer 21.

[0138] 17 , the insulating member 42 includes a first sealing layer 21 that penetrates into the through-hole 30. The first sealing layer 21 may penetrate at least a portion of the space between the anode plate 11 and the conductive member 41, or may penetrate the entire space between the anode plate 11 and the conductive member 41.

[0139] [Other Embodiments] The substrate for manufacturing capacitor elements of the present invention is not limited to the above-described embodiments, and various applications and modifications can be made within the scope of the present invention with respect to the configuration of the product area and the non-product area, manufacturing conditions, etc.

[0140] For example, in the first or second embodiment of the present invention, an insulating layer may be provided between the anode plate and the sealing layer in the outside-of-product region, as in the third embodiment, in which case the penetration portion preferably penetrates the anode plate and the insulating layer in the thickness direction.

[0141] The insulating layer in the outside-of-product region is preferably provided around the through-hole. Also, the insulating layer may be provided in the outside-of-product region so as to surround the periphery of the cathode layer.

[0142] In the substrate for producing a capacitor element of the present invention, when a plurality of through holes are provided in the outside-product region, through holes filled with the filler members described in the different embodiments may be mixed.

[0143] The detailed configuration of the capacitor section included in the product area will be described below.

[0144] Examples of the planar shape of the capacitor portion when viewed from the thickness direction include a rectangle (square or oblong), a quadrangle other than a rectangle, a polygon such as a triangle, a pentagon, or a hexagon, a circle, an ellipse, a combination of these, etc. The planar shape of the capacitor portion may also be an L-shape, a C-shape, a stepped shape, etc.

[0145] The anode plate 11 is preferably made of a valve metal that exhibits so-called valve action. Examples of the valve metal include simple metals such as aluminum, tantalum, niobium, titanium, and zirconium, and alloys containing at least one of these metals. Among these, aluminum or an aluminum alloy is preferred.

[0146] The shape of the anode plate 11 is preferably a flat plate, and more preferably a foil. Thus, in this specification, the term "plate-like" includes "foil-like".

[0147] The anode plate 11 may have the porous portion 11B on at least one main surface of the core portion 11A. That is, the anode plate 11 may have the porous portion 11B on only one main surface of the core portion 11A, or may have the porous portion 11B on both main surfaces of the core portion 11A. The porous portion 11B is preferably a porous layer formed on the surface of the core portion 11A, and more preferably an etched layer.

[0148] The thickness of the anode plate 11 before etching is preferably 60 μm or more and 200 μm or less. The thickness of the unetched core portion 11A after etching is preferably 15 μm or more and 70 μm or less. The thickness of the porous portion 11B is designed according to the required withstand voltage and electrostatic capacitance, but the combined thickness of the porous portions 11B on both sides of the core portion 11A is preferably 10 μm or more and 180 μm or less.

[0149] The pore diameter of the porous portion 11B is preferably 10 nm or more and 600 nm or less. The pore diameter of the porous portion 11B refers to the median diameter D50 measured with a mercury porosimeter. The pore diameter of the porous portion 11B can be controlled, for example, by adjusting various etching conditions.

[0150] The dielectric layer 13 provided on the surface of the porous portion 11B is porous, reflecting the surface condition of the porous portion 11B, and has a finely uneven surface shape. The dielectric layer 13 is preferably made of an oxide film of the valve metal. For example, when aluminum foil is used as the anode plate 11, the dielectric layer 13 made of an oxide film can be formed by anodizing the surface of the aluminum foil in an aqueous solution containing ammonium adipate or the like (also called chemical conversion treatment).

[0151] The thickness of the dielectric layer 13 is designed according to the required withstand voltage and capacitance, but is preferably 10 nm or more and 100 nm or less.

[0152] When the cathode layer 12 includes a solid electrolyte layer 12A, examples of materials constituting the solid electrolyte layer 12A include conductive polymers such as polypyrroles, polythiophenes, and polyanilines. Among these, polythiophenes are preferred, and poly(3,4-ethylenedioxythiophene), also known as PEDOT, is particularly preferred. The conductive polymer may also contain a dopant such as polystyrene sulfonate (PSS). The solid electrolyte layer 12A preferably includes an inner layer that fills the pores (recesses) of the dielectric layer 13 and an outer layer that covers the dielectric layer 13.

[0153] The thickness of the solid electrolyte layer 12A from the surface of the porous portion 11B is preferably 2 μm or more and 20 μm or less.

[0154] The solid electrolyte layer 12A is formed, for example, by a method of forming a polymer film of poly(3,4-ethylenedioxythiophene) or the like on the surface of the dielectric layer 13 using a treatment liquid containing a monomer such as 3,4-ethylenedioxythiophene, or by a method of applying a dispersion liquid of a polymer such as poly(3,4-ethylenedioxythiophene) to the surface of the dielectric layer 13 and drying it.

[0155] The solid electrolyte layer 12A can be formed in a predetermined region by applying the above-mentioned treatment liquid or dispersion liquid to the surface of the dielectric layer 13 by a method such as sponge transfer, screen printing, dispenser application, or inkjet printing.

[0156] When the cathode layer 12 includes the conductor layer 12B, the conductor layer 12B includes at least one layer selected from a conductive resin layer and a metal layer. The conductor layer 12B may be composed of only a conductive resin layer or only a metal layer. The conductor layer 12B preferably covers the entire surface of the solid electrolyte layer 12A.

[0157] The conductive resin layer may be, for example, a conductive adhesive layer containing at least one conductive filler selected from the group consisting of silver filler, copper filler, nickel filler, and carbon filler.

[0158] Examples of the metal layer include a metal plating film and a metal foil. The metal layer is preferably made of at least one metal selected from the group consisting of nickel, copper, silver, and alloys containing these metals as the main component. The term "main component" refers to the elemental component with the largest weight ratio.

[0159] The conductor layer 12B includes, for example, a carbon layer provided on the surface of the solid electrolyte layer 12A and a copper layer provided on the surface of the carbon layer.

[0160] The carbon layer is provided to electrically and mechanically connect the solid electrolyte layer 12A and the copper layer. The carbon layer can be formed in a predetermined region by applying a carbon paste to the surface of the solid electrolyte layer 12A by sponge transfer, screen printing, dispenser application, inkjet printing, or other methods. The thickness of the carbon layer is preferably 2 μm or more and 20 μm or less.

[0161] The copper layer can be formed in a predetermined region by applying a copper paste to the surface of the carbon layer by sponge transfer, screen printing, spray coating, dispenser coating, inkjet printing, etc. The thickness of the copper layer is preferably 2 μm or more and 20 μm or less.

[0162] The sealing layer 20 is made of an insulating material. In this case, the sealing layer 20 preferably contains an insulating resin.

[0163] Examples of the insulating resin contained in the sealing layer 20 include epoxy resin and phenol resin.

[0164] Preferably, the sealing layer 20 further contains a filler.

[0165] Examples of the filler contained in the sealing layer 20 include inorganic fillers such as silica particles and alumina particles.

[0166] Between the anode plate 11 and the sealing layer 20, for example, a stress relaxation layer, a moisture-proof film, or the like may be provided.

[0167] The insulating layer 15 is made of an insulating material, and in this case, the insulating layer 15 is preferably made of an insulating resin.

[0168] Examples of insulating resins that constitute the insulating layer 15 include polyphenylsulfone resin, polyethersulfone resin, cyanate ester resin, fluororesin (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer, etc.), polyimide resin, polyamideimide resin, epoxy resin, and derivatives or precursors thereof.

[0169] The insulating layer 15 may be made of the same resin as the sealing layer 20. Unlike the sealing layer 20, if the insulating layer 15 contains an inorganic filler, it may adversely affect the effective capacitance portion of the capacitor portion, and therefore the insulating layer 15 is preferably made of a resin alone.

[0170] The insulating layer 15 can be formed in a predetermined area by applying a mask material, such as a composition containing an insulating resin, to the surface of the porous portion 11B by a method such as sponge transfer, screen printing, dispenser application, or inkjet printing.

[0171] The insulating layer 15 may be formed on the porous portion 11B either before or after the dielectric layer 13 is formed.

[0172] The first external electrode layer 91 is electrically connected to the anode plate 11. In the example shown in Fig. 3, the first external electrode layer 91 is provided on the surface of the first through-hole conductor 61 and functions as a connection terminal of the capacitor unit. In the example shown in Fig. 3, the first external electrode layer 91 is electrically connected to the anode plate 11 via the first through-hole conductor 61 and functions as a connection terminal for the anode plate 11.

[0173] Examples of materials constituting the first external electrode layer 91 include metal materials containing low-resistance metals such as silver, gold, copper, etc. In this case, the first external electrode layer 91 is formed by, for example, plating the surfaces of the first through-hole conductors 61.

[0174] In order to improve the adhesion between the first external electrode layer 91 and other components, in this case, the adhesion between the first external electrode layer 91 and the first through-hole conductor 61, a mixed material of at least one conductive filler selected from the group consisting of silver filler, copper filler, nickel filler, and carbon filler and resin may be used as the constituent material of the first external electrode layer 91.

[0175] The second external electrode layer 92 is electrically connected to the cathode layer 12. In the example shown in Fig. 3, the second external electrode layer 92 is provided on the surface of the second through-hole conductor 62, and functions as a connection terminal of the capacitor portion.

[0176] Examples of materials constituting the second external electrode layer 92 include metal materials containing low-resistance metals such as silver, gold, copper, etc. In this case, the second external electrode layer 92 is formed by, for example, plating the surfaces of the second through-hole conductors 62.

[0177] In order to improve the adhesion between the second external electrode layer 92 and other components, in this case, the adhesion between the second external electrode layer 92 and the second through-hole conductor 62, a mixed material of at least one conductive filler selected from the group consisting of silver filler, copper filler, nickel filler, and carbon filler and resin may be used as the constituent material of the second external electrode layer 92.

[0178] The constituent materials of the first external electrode layer 91 and the second external electrode layer 92 are preferably the same at least in terms of type, but may be different from each other.

[0179] When multiple capacitor sections are arranged in the surface direction, each of the capacitor sections may be provided with a first external electrode layer 91 electrically connected to the anode plate 11 and a second external electrode layer 92 electrically connected to the cathode layer 12, and at least one of the first external electrode layer 91 and the second external electrode layer 92 may be provided in common among the multiple capacitor sections.

[0180] The first external electrode layer 91 and the second external electrode layer 92 may be provided on both main surfaces of the sealing layer 20 , or may be provided on only one main surface of the sealing layer 20 .

[0181] When the first through-hole conductor 61 is electrically connected to the anode plate 11 on the inner wall surface of the first through hole 71, the first through-hole conductor 61 is preferably electrically connected to the end surface of the anode plate 11 that faces the inner wall surface of the first through hole 71 in the planar direction. This allows the anode plate 11 to be electrically led out to the outside via the first through-hole conductor 61.

[0182] It is preferable that the core portion 11A and the porous portion 11B are exposed on the end surface of the anode plate 11 that is electrically connected to the first through-hole conductor 61. In this case, the porous portion 11B as well as the core portion 11A are electrically connected to the first through-hole conductor 61.

[0183] When viewed in the thickness direction, it is preferable that the first through-hole conductor 61 is electrically connected to the anode plate 11 around the entire periphery of the first through hole 71. In this case, the connection resistance between the anode plate 11 and the first through-hole conductor 61 is likely to decrease, and therefore the equivalent series resistance (ESR) is likely to decrease.

[0184] The second through-hole conductor 62 is electrically connected to the cathode layer 12 via, for example, the second external electrode layer 92 and a via conductor.

[0185] The first through-hole conductors 61 are formed, for example, as follows. First, first through holes 71 are formed by drilling, laser processing, or the like, penetrating the anode plate 11 and the sealing layer 20 in the thickness direction. Then, the inner wall surfaces of the first through holes 71 are metallized with a metal material containing a low-resistance metal such as copper, gold, or silver, thereby forming the first through-hole conductors 61. When forming the first through-hole conductors 61, for example, metallizing the inner wall surfaces of the first through holes 71 with an electroless copper plating process, an electrolytic copper plating process, or the like facilitates processing. Regarding the method of forming the first through-hole conductors 61, in addition to the method of metallizing the inner wall surfaces of the first through holes 71, a method of filling the first through holes 71 with a metal material, a composite material of metal and resin, or the like may also be used.

[0186] An anode connection layer may be provided between the anode plate 11 and the first through-hole conductor 61 in the surface direction. That is, the anode plate 11 and the first through-hole conductor 61 may be electrically connected via the anode connection layer.

[0187] By providing the anode connection layer between the anode plate 11 and the first through-hole conductor 61 in the surface direction, the anode connection layer functions as a barrier layer for the anode plate 11, more specifically, as a barrier layer for the core portion 11A and the porous portion 11B. When the anode connection layer functions as a barrier layer for the anode plate 11, dissolution of the anode plate 11 that occurs during chemical treatment for forming external electrode layers such as the first external electrode layer 91 is suppressed, and therefore penetration of chemical solutions into the capacitor portion is suppressed, which tends to improve reliability.

[0188] The anode connecting layer preferably includes a layer containing nickel as a main component, which reduces damage to the metal (e.g., aluminum) constituting the anode plate 11, and therefore improves the barrier properties of the anode connecting layer against the anode plate 11.

[0189] In addition, in the surface direction, an anode connection layer does not have to be provided between the anode plate 11 and the first through-hole conductor 61. In this case, the first through-hole conductor 61 may be directly connected to the end surface of the anode plate 11.

[0190] The second through-hole conductor 62 is formed, for example, as follows. First, a through-hole penetrating the anode plate 11 and the cathode layer 12 in the thickness direction is formed by drilling, laser processing, or the like. Next, an insulating material is filled into the through-hole. The portion filled with the insulating material is then drilled, laser processing, or the like to form the second through-hole 72. At this time, the diameter of the second through-hole 72 is made smaller than the diameter of the through-hole filled with the insulating material, thereby creating a state in the planar direction where the insulating material is present between the inner wall surface of the previously formed through-hole and the inner wall surface of the second through-hole 72. Then, the inner wall surface of the second through-hole 72 is metallized with a metal material containing a low-resistance metal such as copper, gold, or silver, thereby forming the second through-hole conductor 62. When forming the second through-hole conductor 62, for example, metallizing the inner wall surface of the second through-hole 72 by electroless copper plating, electrolytic copper plating, or the like can facilitate processing. In addition, as a method for forming the second through-hole conductor 62, in addition to the method of metallizing the inner wall surface of the second through hole 72, a method of filling the second through hole 72 with a metal material, a composite material of metal and resin, etc. may also be used.

[0191] Examples of materials constituting the via conductor include metal materials containing low-resistance metals such as silver, gold, and copper.

[0192] The via conductor is formed, for example, by plating the inner wall surface of a via hole that penetrates the sealing layer 20 in the thickness direction with the above-mentioned metal material, or by filling it with a conductive paste and then performing a heat treatment.

[0193] The capacitor element obtained from the substrate for producing a capacitor element of the present invention can be suitably used as a constituent material of a composite electronic component. Such a composite electronic component includes, for example, a capacitor element, external electrode layers provided on the surface of the sealing layer of the capacitor element and electrically connected to the anode plate and cathode layer of the capacitor element, respectively, and an electronic component connected to the external electrode layers.

[0194] In a composite electronic component, the electronic component connected to the external electrode layer may be a passive element or an active element. Both a passive element and an active element may be connected to the external electrode layer, or either a passive element or an active element may be connected to the external electrode layer. Also, a composite of a passive element and an active element may be connected to the external electrode layer.

[0195] Examples of passive elements include inductors, etc. Examples of active elements include memories, GPUs (Graphical Processing Units), CPUs (Central Processing Units), MPUs (Micro Processing Units), and PMICs (Power Management ICs).

[0196] The capacitor element has a sheet-like shape as a whole. Therefore, in a composite electronic component, the capacitor element can be treated like a mounting substrate, and electronic components can be mounted on the capacitor element. Furthermore, by making the electronic components mounted on the capacitor element sheet-like, it is also possible to connect the capacitor element and the electronic components in the thickness direction via through-hole conductors that penetrate each electronic component in the thickness direction. As a result, the active and passive elements can be configured like a single module.

[0197] For example, a switching regulator can be formed by electrically connecting a capacitor element between a voltage regulator including a semiconductor active element and a load to which the converted DC voltage is supplied.

[0198] In the composite electronic component, a circuit layer may be formed on either side of a capacitor matrix sheet on which a plurality of capacitor elements are laid out, and the circuit layer may be connected to a passive element or an active element.

[0199] Alternatively, the capacitor element may be placed in a cavity provided in advance in the substrate, embedded in resin, and then a circuit layer may be formed on the resin. Another electronic component (a passive element or an active element) may be mounted in another cavity of the same substrate.

[0200] Alternatively, the capacitor element may be mounted on a smooth carrier such as a wafer or glass, an outer layer made of resin may be formed, and then a circuit layer may be formed and connected to a passive element or an active element.

[0201] The present specification discloses the following:

[0202] <1> A substrate for producing capacitor elements, comprising: a substrate layer divided into a product region constituting a capacitor element and an outside-product region surrounding at least a portion of the product region; and a sealing layer provided so as to cover at least one main surface of the substrate layer, wherein the product region includes an anode plate having a porous portion on at least one main surface of a core portion, a dielectric layer provided on a surface of the porous portion, and a cathode layer provided on a surface of the dielectric layer, the outside-product region including the core portion of the anode plate, and at least a portion of a region of the outside-product region located on an outer edge of the substrate layer is provided with a through portion that passes through the anode plate in a thickness direction, and at least a portion of the through portion is filled with a filling member.

[0203] <2> The substrate for producing a capacitor element according to <1>, wherein the filling member includes a conductive member.

[0204] <3> The substrate for producing a capacitor element according to <2>, wherein the filling member is composed of two or more layers of members extending inward from the inner wall surface of the through-hole.

[0205] <4> The substrate for producing a capacitor element according to <3>, wherein the filling member further includes an insulating member located outside the conductive member.

[0206] <5> The substrate for producing a capacitor element according to <1>, wherein the filling member includes an insulating member.

[0207] <6> The substrate for producing a capacitor element according to <4> or <5>, wherein the insulating member includes the sealing layer that penetrates into at least a part of the through-hole.

[0208] <7> The substrate for producing a capacitor element according to any one of <1> to <6>, wherein the outside-product region includes the anode plate having the porous portion on at least one main surface of the core portion, the dielectric layer provided on a surface of the porous portion, and the cathode layer provided on a surface of the dielectric layer.

[0209] <8> The substrate for producing a capacitor element according to any one of <1> to <7>, wherein an insulating layer is provided between the anode plate and the sealing layer in the outside-product region, and the through portion penetrates the anode plate and the insulating layer in the thickness direction.

[0210] <9> The substrate for producing a capacitor element according to any one of <1> to <8>, wherein at least three of the through holes are arranged at equal intervals in the outside-product area.

[0211] <10> The substrate for producing a capacitor element according to <9>, wherein at least two of the through holes arranged at equal intervals have the same planar shape when viewed from the thickness direction.

[0212] <11> The capacitor element manufacturing substrate according to any one of <1> to <10>, wherein a dummy layer is provided on a surface of the sealing layer in the outside-product region, and at least one end of the through portion is covered by the dummy layer.

[0213] <12> A method for manufacturing a capacitor element, comprising a step of separating a product region by removing at least a part of the non-product region from the substrate for manufacturing a capacitor element according to any one of <1> to <11>.

[0214] DESCRIPTION OF SYMBOLS 1, 1A, 1B, 2, 2', 2A, 2B, 3, 3', 3A, 3B Substrate for manufacturing capacitor element 10 Substrate layer 11 Anode plate 11A Core portion 11B Porous portion 12 Cathode layer 12A Solid electrolyte layer 12B Conductor layer 13 Dielectric layer 15 Insulating layer 15A First insulating layer 15B Second insulating layer 20 Sealing layer 21 First sealing layer 22 Second sealing layer 30 Penetration portion 40 Filling member 41 Conductive member 42 Insulating member 45 Resin filling portion 50 Dummy electrode layer (dummy layer) 61 First through-hole conductor 62 Second through-hole conductor 71 First through hole 72 Second through hole 81 First resin filling portion 82 Second resin filling portion 91 First external electrode layer 92 Second external electrode layer 100 Capacitor element CL1, CL1a Cutting line R1 Product area R2 Outside product area

Claims

1. A substrate for manufacturing capacitor elements, comprising: a substrate layer divided into a product region constituting a capacitor element and an outside-product region surrounding at least a portion of the product region; and a sealing layer provided to cover at least one main surface of the substrate layer, wherein the product region includes an anode plate having a porous portion on at least one main surface of a core portion, a dielectric layer provided on the surface of the porous portion, and a cathode layer provided on the surface of the dielectric layer, the outside-product region includes the core portion of the anode plate, and at least a portion of the outside-product region located on the outer edge of the substrate layer is provided with a through portion penetrating the anode plate in the thickness direction, and at least a portion of the through portion is filled with a filling material.

2. The substrate for producing a capacitor element according to claim 1, wherein the filling member includes a conductive member.

3. The substrate for producing capacitor elements according to claim 2, wherein the filling member is composed of two or more layers of material extending inward from the inner wall surface of the through portion.

4. The substrate for producing a capacitor element according to claim 3, wherein the filling member further includes an insulating member located outside the conductive member.

5. The substrate for producing a capacitor element according to claim 1, wherein the filling member includes an insulating member.

6. The substrate for producing a capacitor element according to claim 4 or 5, wherein the insulating member includes the sealing layer embedded in at least a portion of the through portion.

7. A substrate for producing capacitor elements as described in any one of claims 1 to 6, wherein the outside-product area includes the anode plate having the porous portion on at least one main surface of the core portion, the dielectric layer provided on the surface of the porous portion, and the cathode layer provided on the surface of the dielectric layer.

8. A substrate for manufacturing capacitor elements as described in any one of claims 1 to 7, wherein in the outside-product area, an insulating layer is provided between the anode plate and the sealing layer, and the penetration portion penetrates the anode plate and the insulating layer in the thickness direction.

9. The substrate for producing capacitor elements according to any one of claims 1 to 8, wherein at least three of the through holes are arranged at equal intervals in the outside-product area.

10. The substrate for producing capacitor elements as described in claim 9, wherein at least two of the through holes arranged at equal intervals have the same planar shape when viewed from the thickness direction.

11. A substrate for manufacturing a capacitor element as described in any one of claims 1 to 10, wherein in the outside-product area, a dummy layer is provided on the surface of the sealing layer, and at least one end of the through portion is covered by the dummy layer.

12. A method for producing a capacitor element, comprising a step of separating a product area from a substrate for producing a capacitor element according to any one of claims 1 to 11 by removing at least a part of the outside-product area.

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